A multi-chip integrated module and a manufacturing method thereof, a multi-chip integrated system

Abstract

The application belongs to the technical field of electronic chip packaging, and provides a multi-chip integrated module and a manufacturing method thereof, and a multi-chip integrated system, and the technical scheme is as follows: a bottom plate, at least one chip, a needle sleeve, a pin needle, epoxy resin and a plastic sealing mold are included; a chip designated position area and a needle sleeve designated position area are arranged on the upper surface of the bottom plate; the chips to be attached are placed in the chip designated position area, and the chips are electrically connected with each other or with the bottom plate; the needle sleeve is welded in the needle sleeve designated position area; the plastic sealing mold includes an upper mold and a lower mold, the lower mold is arranged at the bottom of the bottom plate, the upper mold is concave to form a cavity, the cavity contains the bottom plate, the chips and the needle sleeve, after the plastic sealing mold is closed, the cavity is poured with the epoxy resin, and after the plastic sealing is completed, the plastic sealing mold is taken out; the pin needle and the needle sleeve after the plastic sealing are inserted and connected. Compared with the traditional glue pouring protection, the efficiency is higher, and the yield of the finished product is higher.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic chip packaging, and particularly relates to a multi-chip integrated module, a manufacturing method thereof, and a multi-chip integrated system. BACKGROUND

[0002] The statements in this section merely provide background information related to the present application and do not necessarily constitute the prior art.

[0003] There are mainly two types of packaging methods for the existing multi-chip integrated module: the first type is surface mounting packaging, and the second type is pin packaging. The surface mounting packaging has the following problems: the surface mounting component is small, especially on the passive component, which may cause problems due to equipment confusion;

[0004] During the potting application, the connection may be damaged, and once through the thermal cycle, the connection may be damaged, causing serious problems, and the yield of the finished product is low; when the multi-chip integrated module is pin packaged, the interior is filled with soft silicone, which has general airtightness and impact resistance, and is suitable for ordinary normal temperature and humidity environments, but cannot be applied to complex environments such as humidity.

[0005] In order to solve this problem, the prior art also proposes a packaging method, but the pin position in the existing packaging method is limited and cannot be adjusted at will. In the product design process, the arrangement position of the pin may need to be adjusted. The current packaging structure design is designed to avoid the pin position. If the pin position needs to be adjusted, the packaging components that have been processed and manufactured need to be reprocessed, which prolongs the verification delivery time, increases the cost, and occupies a large space. SUMMARY

[0006] In order to solve at least one technical problem in the background art, the first aspect of the present application provides a multi-chip integrated module, which has more reliable protection effect and higher efficiency. Since the entire operation is performed by using machine equipment, the yield of the finished product is also higher. The impact resistance is strong, and even if subjected to external force, it will not damage the internal components. At the same time, it can effectively prevent the invasion of external air and water, so that the module can work in a more complex environment.

[0007] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0008] A multi-chip integrated module, comprising a bottom plate, at least one chip, a needle sleeve and a pin, an epoxy resin, and a plastic sealing mold;

[0009] The upper surface of the bottom plate is provided with a chip designated position area and a needle sleeve designated position area;

[0010] The chip to be attached is placed in a designated position area of the chip, and the chip is electrically connected with the chip or the copper ceramic substrate;

[0011] The plastic package mold includes an upper mold and a lower mold, the lower mold is arranged at the bottom of the bottom plate, the upper mold is concave to form a cavity, the cavity contains the bottom plate, the chip and the needle sleeve, after the plastic package mold is closed, the cavity is poured with epoxy resin, and the plastic package mold is taken out after the plastic package is completed; the pin needle and the needle sleeve after the plastic package are inserted.

[0012] As an embodiment, a film is arranged between the top of the needle sleeve and the top of the cavity, and the top of the needle sleeve, the film and the top of the cavity of the upper mold are attached after the plastic package mold is closed.

[0013] As an embodiment, the height of the needle sleeve is consistent.

[0014] As an embodiment, the chip is welded with the chip or the copper ceramic substrate through a welding line to form a via for conducting an electrical signal.

[0015] As an embodiment, the pin needle and the needle sleeve are combined by vacuum reflow soldering.

[0016] As an embodiment, the pin needle is a copper needle.

[0017] In order to solve the above problems, the second aspect of the present application provides a manufacturing method of a multi-chip integrated module, which has more reliable protection effect and higher efficiency than the traditional glue pouring protection, and the yield of finished products is also higher because the whole process is operated by using machine equipment.

[0018] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0019] A manufacturing method of a multi-chip integrated module, comprising the following steps:

[0020] Divide the wafer into a plurality of bare chips;

[0021] Print a predetermined shape on the bottom plate chip designated position area, and attach the bare chip to the printed tin paste surface;

[0022] Electrically connect the chip with the chip or the chip with the bottom plate;

[0023] Weld the needle sleeve on the surface of the bottom plate;

[0024] Melt and pour the epoxy resin into the plastic package mold inside by using the plastic package mold to coat the bottom plate, the chip and the needle sleeve, and take out the plastic package mold after the plastic package is completed;

[0025] Insert the pin needle and the needle sleeve after the plastic package.

[0026] In order to solve the above problems, the third aspect of the present application provides a manufacturing method of a multi-chip integrated module, compared with the traditional glue pouring protection, the protection effect of the present application is more reliable, and the efficiency is also higher, and since the whole process is operated by using machine equipment, the yield of the finished product is also higher.

[0027] In order to achieve the above object, the present application adopts the following technical scheme:

[0028] A manufacturing method of a multi-chip integrated module, comprising the following steps:

[0029] Dividing a wafer into a plurality of bare chips;

[0030] Placing the soldering sheet on the specified position on the surface of the bottom plate, and adhering the bare chip on the soldering sheet;

[0031] Electrically connecting the chip and the chip or the chip and the bottom plate;

[0032] Welding the needle sleeve on the surface of the bottom plate;

[0033] Melting and pouring the epoxy resin into the plastic packaging mold to coat the bottom plate, the chip and the needle sleeve, and taking out the plastic packaging mold after the plastic packaging is completed;

[0034] Inserting the pin and the needle sleeve after the plastic packaging is completed.

[0035] As an embodiment, before melting and pouring the epoxy resin into the plastic packaging mold, the surface of the bottom plate is cleaned by using a plasma cleaning machine.

[0036] In order to solve the above problems, the fourth aspect of the present application provides a multi-chip integrated system, which can improve the reliability of the product, so that it can be used in a more severe environment, and improve the production efficiency of the product.

[0037] In order to achieve the above object, the present application adopts the following technical scheme:

[0038] A multi-chip integrated system, comprising at least one multi-chip integrated module of the first aspect.

[0039] Because the multi-chip integrated module provided by the first aspect of the present application is adopted, the structure adopted is the same as that of the first aspect, and details are not repeated here.

[0040] The beneficial effects of the present application are:

[0041] 1. The application innovatively designs a multi-chip integrated module, based on the designed plastic packaging mold including an upper mold and a lower mold, through the cooperation of the needle holder and the film, the overflow of glue is avoided, and normal function output can be realized, the pin position can be adjusted at will, not only suitable for one product, but also suitable for packaging of other products of the same size, and the universality is strong, the packaging of the module product can be completed quickly and efficiently, and batch production can be realized, compared with the traditional glue pouring protection, the protection effect of the application is more reliable, and the efficiency is higher, since the whole process is operated by using machine equipment, the yield of finished products is also higher.

[0042] 2. The multi-chip integrated module of the application uses epoxy resin as a filling material, and the epoxy resin as a thermosetting material will not melt again after melting-cooling-solidifying three states, even if subjected to external force, will not damage the internal components, and the impact resistance is much higher than that of soft silicone filling; secondly, after the epoxy resin is melted, it is extruded into the module, combined with the internal components and the substrate and solidified, which can effectively isolate the invasion of external air and water, so that the module can work in a more complex environment.

[0043] The advantages of the additional aspects of the application will be partially given in the following description, partially become obvious from the following description, or be known by the practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0044] The drawings accompanying the specification of the application form part of the application and serve to provide further understanding of the application, the illustrative embodiments of the application and their description serve to explain the application, and do not constitute an improper limitation of the application.

[0045] Figure 1 is the overall structure schematic diagram of the multi-chip integrated module provided by the embodiment of the application;

[0046] Figure 2 is a detailed structure diagram of the plastic packaging process of the multi-chip integrated module provided by the embodiment of the application;

[0047] Figure 3 is the schematic diagram of the chip mounting result provided by the embodiment of the application;

[0048] Figure 4 is the schematic diagram of the bonding result provided by the embodiment of the application;

[0049] Figure 5 is the schematic diagram of the pin sleeve welding provided by the embodiment of the application;

[0050] Figure 6 is the schematic diagram of the plastic packaging result provided by the embodiment of the application;

[0051] Figure 7 is the schematic diagram of the pin insertion result provided by the embodiment of the application;

[0052] Explanation of reference numerals: 1, bottom plate, 2, chip, 3, needle cover, 4, pin, 5, epoxy resin, 6, plastic encapsulation mold, 601, upper mold, 602, lower mold, 7, film, 8, soldering wire. DETAILED DESCRIPTION

[0053] The application will be further described below in conjunction with the drawings and examples.

[0054] It should be noted that the following detailed description is illustrative only and is intended to provide further description of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0055] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0056] In the present application, the terms such as "upper", "lower", "top", "bottom", etc. indicate the orientation or positional relationship shown in the drawings, which is only a relationship word determined for the purpose of describing the structural relationship of the components or elements of the present application, and cannot be understood as a limitation of the present application.

[0057] In the present application, the terms such as "connected", "connected" should be understood broadly, which means that it can be fixedly connected, integrally connected or detachably connected; it can be directly connected or indirectly connected through an intermediate medium. For relevant researchers or technicians in the art, the specific meaning of the above terms in the present application can be determined according to the specific circumstances, and cannot be understood as a limitation of the present application.

[0058] The multi-chip integrated module provided by the present application can be applied in a semiconductor circuit to realize the functions of AC-DC conversion, DC step-up / down voltage conversion, etc. The multi-chip integrated system can be applied in servo motors, frequency converters, inverters, etc.

[0059] As mentioned in the background art, the surface mount package and pin package of the existing multi-chip integrated module have the problem of low yield, the protection effect of the present application is more reliable, and the efficiency is higher, because the whole process is operated by machine equipment, the yield of the finished product is higher; In addition, the traditional multi-chip integrated module cannot work in a complex environment, the present application uses epoxy resin as a filling material inside the multi-chip integrated module, and the epoxy resin is a thermosetting material, which will not melt again after melting-cooling-solidification three states, even if it is subjected to external force, it will not damage the internal components, and the impact resistance is much higher than that of soft silicone filling; Secondly, after the epoxy resin is melted and extruded into the module, it is combined with the internal components and the substrate and solidified, which can effectively prevent the invasion of external air and moisture, so that the module can work in a more complex environment.

[0060] Embodiment one

[0061] As shown in Figure 1 and Figure 2 , the present embodiment provides a multi-chip integrated module, which comprises a bottom plate 1, at least one chip 2, a needle sleeve 3 and a pin 4, an epoxy resin 5 and a plastic sealing mold 6;

[0062] Among them, the bottom plate 1 can be a copper frame, a PCB board, a ceramic substrate, a BT substrate and other plate materials that can carry chips and connect circuits, and a copper-clad ceramic substrate (DBC) is used in the present embodiment to carry chips 2 and connect circuits;

[0063] Among them, the chip 2 includes power supply chips, communication chips, sensor chips, power devices or integrated circuits, etc. as the core devices of the power module;

[0064] The material for fixing the chip includes tin paste, solder sheet, glue, DAF, etc.

[0065] The welding line 8 includes alloy wire, copper wire, copper strip, aluminum wire, aluminum strip, gold wire, etc. which can connect the chip and the bottom plate to make the signal connected.

[0066] The epoxy resin 5 is used to wrap the chip 2, the circuit, etc., and the role is to protect the internal devices.

[0067] The pin 4 and the needle sleeve 3 are used to connect the outside world to realize signal transmission.

[0068] In addition to the above consumables, some molds, tool fixtures, jigs and a series of operation tools used during operation are also needed, which are not described in detail in the present embodiment.

[0069] The upper surface of the bottom plate 1 is provided with a chip designated position area and a needle sleeve designated position area;

[0070] The chip 2 to be attached is placed in a designated position area of the chip, and the chip 2 is electrically connected with the chip 2 or the chip 2 and the bottom plate 1; the needle sleeve 3 is welded in a designated position area of the needle sleeve;

[0071] The plastic packaging mold 6 includes an upper mold 601 and a lower mold 602, the lower mold 602 is arranged at the bottom of the bottom plate 1, the upper mold is concave to form a cavity, the cavity contains the bottom plate 1, the chip 2 and the needle sleeve 3, after the plastic packaging mold 6 is closed, the cavity is poured with epoxy resin 5, and after the plastic packaging is completed, the plastic packaging mold 6 is taken out; the pin needle 4 and the needle sleeve 3 after the plastic packaging are inserted.

[0072] Specifically, the upper mold 601 and the lower mold 602 adopt a flat mold;

[0073] As a specific embodiment, a film 7 is arranged between the top of the needle sleeve and the top of the cavity, and the top of the needle sleeve, the film 7 and the top of the cavity of the upper mold are attached after the plastic packaging mold 6 is closed. By cooperating the needle seat with the film, glue overflow is avoided.

[0074] Among them, the height of the needle sleeve 3 is consistent and kept flush.

[0075] Among them, the chip 2 and the chip 2 or the chip 2 and the bottom plate 1 are welded through the welding line 8 to form a via for conducting an electrical signal.

[0076] In the embodiment, the pin needle 4 and the needle sleeve 3 are combined by vacuum reflow soldering.

[0077] It can be understood that in the embodiment, the pin needle 4 adopts a copper needle, and in other embodiments, it can also be selected according to actual conditions.

[0078] Through the above scheme, the plastic packaging mold designed based on the application includes an upper mold and a lower mold, glue overflow is avoided by cooperating the needle seat with the film, normal function output can be realized, the pin needle position can be adjusted at will, not only one product is suitable, but also other products of the same size are suitable for packaging, the application has strong universality, the packaging of the module product can be completed quickly and efficiently, batch production can be realized, the protection effect of the application is more reliable compared with traditional glue pouring protection, the efficiency is also higher, and since the whole process is operated by using machine equipment, the yield of finished products is also higher.

[0079] Embodiment two

[0080] The embodiment provides a manufacturing method of a multi-chip integrated module, including the following steps:

[0081] Step 1: wafer dicing, using a wafer dicing machine to cut a wafer into single bare chips 2;

[0082] Step 2: mounting: using tin paste for mounting, first printing a predetermined shape on the bottom plate 1 at the position where mounting is required, then using a chip mounter to fix a single bare chip on the printed tin paste surface, placing the semi-finished product in a vacuum furnace for reflow soldering, so that the chip is tightly fixed on the bottom plate 1, and then cleaning, testing, etc. Figure 3

[0083] Step 3: bonding: using a bonding device to weld wires between the chip and the chip or the chip and the bottom plate 1, so that the circuit is conductive and the signal can be transmitted to each other; as shown in Figure 4

[0084] Step 4: needle sleeve welding: using a soldering tool to weld the needle sleeve 3 at the specified position of the bottom plate 1, as shown in Figure 5

[0085] Step 5: first, use a plasma cleaning machine to clean the semi-finished product, remove surface dirt, and make the epoxy resin 5 better combined with the semi-finished product, then use injection molding equipment and plastic sealing mold 6 to melt and pour the epoxy resin into the plastic sealing mold 6, take it out after solidification, and then put it into an oven for post-curing process to eliminate internal stress and make it more stable and reliable, as shown in Figure 6

[0086] Figure 2 The plastic sealing process detailed structure diagram is shown in

[0087] In this product, all the needle sleeves 3 are kept flush, the lower mold 602 of the mold is a flat mold without other structures, the upper mold 601 is concave to form a cavity, and there is a thin film 7 between the cavity and the needle sleeve. After the mold is closed, the needle sleeve 3, the thin film 7 and the mold cavity are tightly attached, the thin film can not only prevent overflow of injection molding, but also can play a certain buffering effect to prevent the mold and the needle sleeve from being damaged.

[0088] Step 6: pin insertion: using a pin insertion device to insert the pin 4 into the needle sleeve 3 which has been welded in advance and using a vacuum furnace for reflow soldering to make the pin 4 and the needle sleeve 3 tightly combined; as shown in Figure 7

[0089] Through the above scheme, the module product can be quickly and efficiently packaged and mass production can be realized. Compared with the traditional glue protection, the protection effect of the invention is more reliable and the efficiency is higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0090] Example three

[0091] The embodiment provides a manufacturing method of a multi-chip integrated module, including the following steps: ​​​​​

[0092] Step 1: scribing, using a scribe machine to cut the wafer into single bare chips 2;

[0093] Step 2: mounting: using soldering for mounting, first placing the soldering on the designated position of the upper surface of the substrate, then mounting the chip on the soldering, and finally placing the semi-finished product in a vacuum furnace for reflow soldering to fix the chip firmly, and finally cleaning and detecting, etc. Figure 3 as shown.

[0094] Step 3: bonding: using a bonding device to weld wires between the chip and the chip or the chip and the bottom plate 1, so that the circuit is conductive and the signal can be transmitted between them. Figure 4 as shown.

[0095] Step 4: needle sleeve welding: using soldering tools to weld the needle sleeve 3 at the designated position of the bottom plate 1. Figure 5 as shown.

[0096] Step 5: first, use a plasma cleaning machine to clean the semi-finished product, remove surface contaminants, and make the epoxy resin 5 better combined with the semi-finished product, then use injection molding equipment and plastic sealing mold 6 to melt and pour the epoxy resin into the plastic sealing mold 6, and after solidification, take it out, and then put it into an oven for post-curing process to eliminate internal stress and make it more stable and reliable. Figure 6 as shown.

[0097] The specific plastic sealing process is consistent with that of embodiment two, and in this product, all the needle sleeves 3 are kept flush, the lower mold 602 of the mold is a flat mold without other structures, the upper mold 601 is concave to form a cavity, and there is a thin film 7 between the cavity and the needle sleeve. After the mold is closed, the needle sleeve 3, the thin film 7 and the mold cavity are tightly combined, the thin film can not only prevent overflow of injection molding, but also can play a certain buffering effect to prevent the mold and the needle sleeve from being damaged.

[0098] Step 6: pin insertion: using a pin insertion device to insert the pin 4 into the needle sleeve 3 which has been welded in advance and using a vacuum furnace for reflow soldering to make the pin 4 and the needle sleeve 3 tightly combined. Figure 7 as shown.

[0099] Through the above scheme, the module product can be quickly and efficiently packaged and mass production can be realized. Compared with the traditional glue filling protection, the protection effect of this invention is more reliable and the efficiency is higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0100] Embodiment four

[0101] The embodiment provides a multi-chip integrated system comprising at least one multi-chip integrated module as described in embodiment one.

[0102] The same structure and embodiment one is adopted, and the same is not repeated in this embodiment.

[0103] The above only provides preferred embodiments of the present application and is not intended to limit the present application. The present application can be variously changed and altered for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a multi-chip integrated module, characterized in that, Includes the following steps: Divide the wafer into multiple bare chips (2); A predetermined shape is printed on the chip designated location area on the base plate (1), and the bare chip is attached to the printed solder paste surface; Connect chip (2) to chip (2) or chip (2) to base plate (1) electrically; The needle sleeve (3) is welded to the surface of the base plate (1); The epoxy resin (5) is melted and poured into the mold (6) to cover the base plate (1), chip (2) and needle sleeve (3). After the molding is completed, the mold (6) is removed. Connect the pin (4) to the encapsulated pin sleeve (3); A thin film (7) is placed between the top of the needle sleeve and the top of the cavity. After the molding die (6) is closed, the top of the needle sleeve, the thin film (7) and the top of the upper mold cavity are attached together.

2. A method for manufacturing a multi-chip integrated module, characterized in that, Includes the following steps: Divide the wafer into multiple bare chips (2); Place the solder pad at the designated position on the surface of the base plate (1) and attach the bare chip (2) to the solder pad; Connect chip (2) to chip (2) or chip (2) to base plate (1) electrically; The needle sleeve (3) is welded to the surface of the base plate (1); The epoxy resin (5) is melted and poured into the mold (6) to cover the base plate (1), chip (2) and needle sleeve (3). After the molding is completed, the mold (6) is removed. Connect the pin (4) to the encapsulated pin sleeve (3); A thin film (7) is placed between the top of the needle sleeve and the top of the cavity. After the molding die (6) is closed, the top of the needle sleeve, the thin film (7) and the top of the upper mold cavity are attached together.

3. A method for manufacturing a multi-chip integrated module as described in claim 1 or 2, characterized in that, Before melting and pouring the epoxy resin (5) into the encapsulation mold (6), the surface of the base plate (1) is cleaned with a plasma cleaner.

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