Camera module

Abstract

The invention provides a camera module. A camera module according to an embodiment of the present invention may include: a first printed circuit board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed on the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on an outer circumferential surface thereof, and including at least a lens therein; a second PCB combined with a bottom surface of the holder module; a third PCB (Printed Circuit Board) which is arranged on the holder module; and a plurality of wire springs, each of which is configured to have one end connected to the second PCB and the other end connected to the third PCB.

Description

[0001] This application is a divisional application of the patent application with the application date of October 8, 2012, application number 202310079562.9, and invention title "Camera Module". The patent application with application number 202310079562.9 is a divisional application of the patent application with the application date of October 8, 2012, application number 202110184121.6, and invention title "Camera Module". The patent application with application number 202110184121.6 is a divisional application of the patent application with the application date of October 8, 2012, application number 201710570614.7, and invention title "Camera Module". The patent application with application number 201710570614.7 is a divisional application of the patent application with the application date of October 8, 2012, application number 201210377843.4, and invention title "Camera Module".

[0002] Cross - reference to related applications

[0003] This application claims priority based on and claims priority to Korean Application Nos. 10 - 2011 - 0111005 filed on October 28, 2011, 10 - 2011 - 0112294 filed on October 31, 2011, 10 - 2011 - 0112306 filed on October 31, 2011, 10 - 2011 - 0125616 filed on November 29, 2011, and 10 - 2012 - 0013230 filed on February 9, 2012, the entire contents of which are incorporated herein by reference. Technical Field

[0004] The present invention relates to a camera module. Background Art

[0005] A camera module mounted on a small electronic product may be frequently subjected to vibrations during use. The camera module may vibrate slightly due to the hand shake of the user during photographing. In view of the above problems, a camera module having an anti - hand - shake device has recently been disclosed.

[0006] For example, Korean Registered Patent No. 10 - 0741823 (registered on July 16, 2007) discloses a method of installing a gyro sensor IC or an angular velocity sensor inside a device (such as a mobile phone) on which a camera module is mounted to correct the hand - shake phenomenon.

[0007] If an additional angular velocity sensor is provided as described above, additional sensors must be provided to achieve the anti - hand - shake function. Therefore, there is a problem in that the manufacturing cost increases and additional space must be provided in addition to the camera module to construct and install the anti - hand - shake device. Summary of the Invention

[0008] An object of the present invention is to provide a camera module having an optical image stabilizer function.

[0009] The camera module according to an embodiment of the present invention includes: a first printed circuit board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed on the first PCB; a holder module spaced apart from the bottom surface in the housing unit at a specific interval and configured to have a first coil wound around the outer circumferential surface of the holder module and at least including a lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed on the holder module; and a plurality of wire springs, each of the plurality of wire springs being configured to have one end connected to the second PCB and the other end connected to the third PCB.

[0010] The buffer unit may be formed by bending the wire spring in a zigzag shape or by bending the wire spring in the form of a coil spring.

[0011] Preferably, the housing unit includes a first housing disposed on the upper side of the first PCB; a second housing disposed on the upper side of the first housing and configured to have the third PCB disposed thereon; a first permanent magnet and a second permanent magnet inserted between the first housing and the second housing; and a yoke, each of the yokes being disposed between the first permanent magnet and the second permanent magnet and configured to transmit magnetic force to the holder module.

[0012] The housing unit includes a first housing disposed on the upper side of the first PCB; a second housing disposed on the upper side of the first housing and configured to have the third PCB disposed thereon; a first permanent magnet and a second permanent magnet arranged on the inner sides of the first housing and the second housing; and a yoke, each of the yokes being disposed between the first permanent magnet and the second permanent magnet and configured to transmit magnetic force to the holder module.

[0013] According to an exemplary embodiment of the present invention, the camera module may further include a shield can formed to have a through hole at a connection unit of the third PCB and the wire spring and at a position corresponding to the lens module.

[0014] Preferably, the holder module includes an outer blade that is formed to have a first coil wound around an outer circumferential surface of the outer blade; a bobbin that is elastically supported by an elastic member on an upper side of the outer blade, is disposed movably up and down within the outer blade, and is configured to have a second coil wound around an outer circumferential surface of the bobbin and to have at least one lens installed therein; and an upper elastic member and a lower elastic member that are disposed on corresponding upper and lower sides of the bobbin and are configured to elastically support the bobbin against the outer blade, wherein a space unit is formed at a center of the first coil such that a magnetic force is applied toward the second coil.

[0015] In addition, it is possible to project toward a central portion of the yoke of the holder module.

[0016] Preferably, the holder module includes an outer blade that is formed to have a first coil wound around an outer circumferential surface of the outer blade; a bobbin that is elastically supported by an elastic member on an upper side of the outer blade, is disposed movably up and down within the outer blade, and is configured to have a second coil wound around an outer circumferential surface of the bobbin and to have at least one lens installed therein; and an upper elastic member and a lower elastic member that are disposed on corresponding upper and lower sides of the bobbin and are configured to elastically support the bobbin against the outer blade.

[0017] The second PCB may be mounted at a bottom surface of the outer blade.

[0018] Preferably, the second PCB is fixed to the bottom surface of the outer blade by an adhesion member.

[0019] The wire spring may be made of a metallic material, and the wire spring conducts electricity to the second PCB and the third PCB.

[0020] In addition, preferably, the number of wire springs is at least six such that power supplies for two poles for autofocus control and power supplies for four poles for an optical image stabilizer are supplied to the holder module through connections between the wire springs and the second PCB and the third PCB.

[0021] In addition, preferably, four pairs of wire springs having the same length are disposed at corresponding corners of the holder module.

[0022] Here, preferably, the second coil is electrically connected to the lower spring, and the lower spring is electrically connected to the wire spring in the second PCB.

[0023] In addition, it is possible to directly connect the second coil to the second PCB such that the second coil conducts electricity to the second PCB.

[0024] In addition, a space unit may be formed at the center of the first coil such that a magnetic force is applied toward the second coil.

[0025] According to the present invention, since a buffer unit for absorbing the load repeatedly applied to the wire spring is provided, the wire spring can be firmly connected to the connection unit of the PCB.

[0026] In addition, even if an excessive force is applied to the wire spring during the process of assembling the lens module, the buffer unit can absorb the excessive force. Accordingly, the assembling property can be improved, and component loss due to improper assembly can be minimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Further objects and advantages of the present invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a schematic plan view of a camera module according to an embodiment of the present invention;

[0029] Figure 2 is a cross-sectional view of the camera module taken along line A-A according to the first and second embodiments of the present invention; Figure 1 is a cross-sectional view of the camera module taken along line A-A according to the first and second embodiments of the present invention;

[0030] Figure 3 is a side view of the camera module according to an embodiment of the present invention;

[0031] Figure 4 is a side view of the camera module from which a protective cover has been removed; Figure 3 is a side view of the camera module from which a protective cover has been removed;

[0032] Figure 5 is an enlarged view of part B according to the first embodiment of the present invention; Figure 2 is an enlarged view of part B according to the first embodiment of the present invention;

[0033] Figure 6 is an enlarged view of part B according to the second embodiment of the present invention; Figure 2 is an enlarged view of part B according to the second embodiment of the present invention;

[0034] Figure 7 is a schematic cross-sectional view of the camera module taken along line A-A according to the third embodiment of the present invention; Figure 1 is a schematic cross-sectional view of the camera module taken along line A-A according to the third embodiment of the present invention;

[0035] Figure 8 is an enlarged view of part C according to the third embodiment of the present invention; Figure 7 is an enlarged view of part C according to the third embodiment of the present invention;

[0036] Figure 9 is a schematic cross-sectional view of the camera module taken along line A-A according to the fourth embodiment of the present invention; Figure 1 is a schematic cross-sectional view of the camera module taken along line A-A according to the fourth embodiment of the present invention;

[0037] Figure 10 is an enlarged view of part D of Figure 9 according to the fourth embodiment of the present invention;

[0038] Figure 11 is a schematic cross-sectional view of a camera module taken along line A-A of Figure 1 according to the fifth embodiment of the present invention;

[0039] Figure 12 is a schematic cross-sectional view of a camera module taken along line A-A of Figure 1 according to the sixth embodiment of the present invention;

[0040] Figure 13 is a schematic cross-sectional view of a camera module taken along line A-A of Figure 1 according to the seventh embodiment of the present invention;

[0041] Figure 14 and Figure 15 is an enlarged view of part E of Figure 13 according to the seventh embodiment of the present invention and schematically shows the operating state of an impact absorption unit;

[0042] Figure 16 is a block diagram of a camera module according to an embodiment of the present invention;

[0043] Figure 17 is a schematic cross-sectional view showing an example of a camera module according to an embodiment of the present invention; and

[0044] Figure 18 is a schematic cross-sectional view showing another example of a camera module according to an embodiment of the present invention. Detailed Description of the Embodiments

[0045] Hereinafter, some exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0046] Figure 1 is a schematic plan view of a camera module according to an embodiment of the present invention; Figure 2 is a cross-sectional view of a camera module taken along line A-A of Figure 1 according to the first and second embodiments of the present invention; Figure 3 is a side view of a camera module according to an embodiment of the present invention;

[0047] Figure 4 is a side view of a camera module from which a protective cover of Figure 3 has been removed, Figure 5 is an enlarged view of part B of Figure 2 according to the first embodiment of the present invention, and Figure 6 is according to the second embodiment of the present inventionFigure 2 An enlarged view of part B.

[0048] As shown, FIG. 1 shows a schematic plan view and Figure 2 a schematic side view of line A-A in FIG. 1. The camera module according to the present invention includes a first printed circuit board (hereinafter referred to as PCB) 10, a housing unit 20, a holder module 30, a second PCB 40, a third PCB 50, a wire spring 60, and a buffer unit 100.

[0049] Preferably, the image sensor 11 is substantially mounted on the central portion of the first PCB 10. Elements for driving the image sensor 11 may be provided in the first PCB 10, or a plurality of terminal units for supplying power and outputting information from the image sensor 11 may be provided in the first PCB 10.

[0050] The housing unit 20 is disposed on top of the first PCB 10 and forms the frame of the camera module. According to an exemplary embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, a pair of first permanent magnets 23 and second permanent magnets 24, and a plurality of magnetic yokes 25.

[0051] The first housing 21 is a base and is disposed on top of the first PCB 10 and is spaced apart from the image sensor 11 at a specific distance. A filter member may also be included in the first housing 21 when necessary, and the filter member is configured to filter the image phase incident on the image sensor 11.

[0052] The second housing 22 is disposed on top of the first housing 21 and is configured to cover the first housing 21. An opening is generally formed at the center of the second housing 22 such that an image can be transmitted to the image sensor 11. The third PCB 50 is adhered and fixed to the upper lateral surface of the second housing 22 using a fixing member such as double-sided tape or an adhesive to be described later, but is not limited thereto. However, in some embodiments, an additional third housing, such as a case or a protective cover, may be provided, and the third PCB 50 may be fixed to the inside of the additional third housing using a fixing member according to the product design. If a third housing is provided, the third housing may press and support the third PCB 50 without an additional fixing member.

[0053] The first permanent magnets 23 and the second permanent magnets 24 are inserted between the first housing 21 and the second housing 22 and are configured to apply a magnetic force to the holder module 30. Preferably, the first permanent magnets 23 and the second permanent magnets 24 have the same size. In addition, if possible, within the design tolerance limits, the first permanent magnets 23, the second permanent magnets 24, and the magnetic yokes 25 may be disposed on the inner sides of the first housing 21 and the second housing 22.

[0054] Meanwhile, if the sizes of the first permanent magnet 23 and the second permanent magnet 24 are increased, the optical image stabilization (OIS) driving is increased even with a low current. If the first permanent magnet 23 and the second permanent magnet 24 are configured to have specific sizes, the OIS driving increases as the current flowing into the first coils 31a to 31d and the second coil 32a provided at positions corresponding to the first permanent magnet 23 and the second permanent magnet 24 increases. Therefore, the OIS driving becomes better according to the increase of the first permanent magnet 23 and the second permanent magnet 24, but preferably, the first permanent magnet 23 and the second permanent magnet 24 have optimal sizes within the design tolerance limits.

[0055] Each of the yokes 25 is inserted between each pair of the first permanent magnet 23 and the second permanent magnet 24. In addition, a central portion of the yoke 25 is configured to have a protruding shape such that the pair of the first permanent magnet 23 and the second permanent magnet 24 can apply a magnetic force to the inner space of the holder module 30. Preferably, the yoke 25 is configured to have the same width as the pair of the first permanent magnet 23 and the second permanent magnet 24, the center of the yoke 25 protrudes by a specific size, and the pair of the first permanent magnet 23 and the second permanent magnet 24 and the yoke 25 have a substantially "T" shape.

[0056] The holder module 30 is spaced apart from the bottom surface of the inner side of the housing unit 20 and is formed by the outer blades 31 and the bobbin 32. The holder module 30 can perform a pendulum motion in the front / back, left / right, and diagonal directions as it swings from the wire spring 60.

[0057] Spring members 35 and 36 are respectively provided at the upper and lower portions of the outer blade 31. The outer blade 31 is elastically supported by the spring member 35 such that the bobbin 32 moves up and down.

[0058] As Figure 1 shown, a total of four first coils 31a to 31d are respectively wound around four outer surfaces of the outer blade 31, and a central portion of each of the four outer surfaces of the outer blade 31 around which the first coils 31a to 31d are wound is perforated without a coil. Each of the yokes 25 is provided at a position corresponding to the perforated space unit, and thus the yoke 25 can be partially inserted into the space unit.

[0059] The second PCB 40 can be fixed to the bottom of the outer blade 31 using a fixing member 33 such as double-sided tape or an adhesive. The outer blade 31 is suspended from a plurality of wire springs 60 such that the outer blade 31 can move in the front / back and left / right directions or in the diagonal direction according to the interaction between the magnetic force of the first permanent magnet 23 and the second permanent magnet 24 and the first coil 31a, as indicated by the Figure 2 arrows. In addition, the outer blade 31 is spaced apart from the bottom surface of the first housing 21 at a specific interval.

[0060] In addition, a plurality of spring through-holes 37 may be provided in the outer vane 31 such that the wire spring 60 is connected to the second PCB 40 through the spring through-holes 37.

[0061] The bobbin 32 is disposed inside the outer vane 31 such that the bobbin 32 is movable up and down. At least one lens 34 is mounted inside the bobbin 32. The second coil 32a is wound around the outer peripheral surface of the bobbin 32. Through the interaction of magnetic forces, the second coil 32a performs an operation of raising and lowering the bobbin 32, and the magnetic force is applied through the perforated space by the yoke 25 in the absence of the first coils 31a to 31d of the outer vane 31. As the size of the yoke 25 increases, the AF drive can become better, but it can be changed according to the optimal design value. The focus of the image transmitted to the image sensor 11 can be automatically controlled by the upward movement of the bobbin 32.

[0062] The second PCB 40 is disposed at the bottom surface of the outer vane 31 as described above and is connected to the wire spring 60 such that it can supply power to the first coils 31a to 31d and the second coil 32a. If welding or other conductive materials can be used, the connection method can include any method. That is, the connection unit w' of the second PCB 40 is respectively connected to the first coils 31a to 31d and the second coil 32a, as Figure 2 shown. Therefore, the power supplied through the wire spring 60 is transmitted to the first coils 31a to 31d and the second coil 32a, thereby forming an electromagnetic force.

[0063] Here, the second coil 32a may be directly connected to the second PCB 40, or the second coil 32a may be connected to the lower spring 36 and then the lower spring 36 may be connected to the second PCB 40, as Figure 2 shown.

[0064] As described above, the third PCB 50 is fixed to the top of the second housing 22 using a fixing member such as double-sided tape or an adhesive member. The power transmitted through the terminal unit 52 of the third PCB 50 connected to the first PCB 10 is transmitted to the second PCB 40 through the wire spring 60 connected to the second PCB 40. If welding or other conductive materials can be used, the connection method can include any method.

[0065] As Figure 3 and 4 shown, the third PCB 50 may be disposed to cover the walls of the first housing 21 and the second housing 22 on one side. Here, a window 55 may be formed in the surface of the third PCB 50, where the third PCB 50 faces the first permanent magnet 23, the second permanent magnet 24, and the yoke 25 to avoid interference therebetween.

[0066] Since the first permanent magnet 23, the second permanent magnet 24, and the yoke 25 are directly adhered to the protective cover 70 (described later) by using a fixing device such as an epoxy resin, the window 55 serves to prevent the third PCB 50 from being affected by the coupling portion.

[0067] Meanwhile, a flexible PCB (FPCB), a PCB, or a rigid FPCB integrated type (R-FPCB) can be used for each of the second PCB 40 and the third PCB 50, but is not limited thereto. Any board can be used as the second PCB 40 and the third PCB 50 if the board can make an electrical connection.

[0068] Each of the wire springs 60 has two ends connected to the second PCB 40 and the third PCB 50. Here, one end of the wire spring 60 is connected to a pad 51 formed in the third PCB 50, as Figure 5 shown. A through hole 53 is formed at the center of the pad 51, and the wire spring 60 passes through the through hole 53. In this case, if soldering or other conductive materials can be used, the connection method can include any method. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third PCB 50. The area connecting the pad 51 can be made conductive by opening the area of the SR.

[0069] The wire spring 60 connected at the pad 51 as described above supplies power from the terminal unit 52 to the second PCB 40, so that the first coils 31a to 31d and the second coil 32a can interact with the first permanent magnet 23 and the second permanent magnet 24.

[0070] In addition, the other end of the wire spring 60 is connected to the second PCB 40 provided at the bottom surface of the outer blade 31 through a spring through hole 37 formed in the outer blade 31, as Figure 2As shown. Although (not shown), as in the third PCB 50, the other end of the wire spring 60 is connected to a pad (not shown) formed in the second PCB 40. A through hole (not shown) is formed at the center of the pad (not shown), and the wire spring 60 passes through the through hole. In such a case, if soldering or other conductive materials can be used, the connection method can include any method. In this configuration, the outer blade 31 can be suspended from the wire spring 60 and can be spaced apart from the bottom surface of the first housing 21. In such a case, the outer blade 31 performs a pendulum motion according to the interaction between the first coils 31a to 31d and the first permanent magnet 23 and the second permanent magnet 24. Therefore, it is possible to correct the vibration of the outer blade 31 caused by hand jitter through the interaction between the first coils 31a to 31d and the first permanent magnet 23 and the second permanent magnet 24. For this purpose, preferably, the wire spring 60 is made of a metal material having elasticity and conductivity sufficient to withstand vibrations.

[0071] Meanwhile, as the thickness of the wire spring 60 decreases, the mobility of the optical image stabilizer becomes better even at low currents, but it can vary according to the optimal design values. Preferably, the thickness of the wire spring 60 is several μm to several hundred μm, and more preferably, 1 to 100 μm.

[0072] In addition, preferably, the number of wire springs 60 is at least six. Through the connection between the wire spring 60 and the second PCB 40 and the third PCB 50, it is necessary to supply the bipolar power for autofocus control and the quadrupole power for the optical image stabilizer to the holder module 30.

[0073] According to an exemplary embodiment of the present invention, preferably, four pairs of wire springs 60 having the same length are provided at the corresponding corners of the holder module 30 to maintain balance, as Figure 1 and 2 shown.

[0074] Meanwhile, as Figure 2 shown, if a third housing such as a protective cover 70 is further included, a window 55 for covering the walls of the first housing 21 and the second housing 22 is formed in the third PCB 50 to avoid coupling components, because the first permanent magnet 23 and the second permanent magnet 24 and the yoke 25 are fixed to the protective cover 70 using epoxy resin, as described above.

[0075] If the protective cover 70 is omitted, the first permanent magnet 23, the second permanent magnet 24, and the yoke 25 can be attached and fixed within the third PCB 50. In some embodiments, a window 55 can be formed in the third PCB 50 as described above, and the first permanent magnet 23, the second permanent magnet 24, and the yoke 25 can be inserted into the window 55. Additional reinforcement can be achieved externally to the third PCB 50 using protective tape.

[0076] Preferably, the buffer unit 100 is integrally formed with some portions of each of the wire springs 60. The buffer unit 100 can be formed by bending the wire springs 60 in a zigzag shape, as Figure 5 shown, or can be formed by bending the wire springs 60 in the form of coil springs, as Figure 6 shown.

[0077] Here, the shape of the second housing 22 can be designed such that the buffer unit 100 is disposed at a position where the wire springs 60 are not interfered with by the second housing 22.

[0078] The buffer unit 100 has a downward tapered structure. Preferably, the buffer unit 100 has a downwardly tapered conical funnel shape, as Figure 5 and 6 shown. A support hole 122 is formed on the same axis as the through hole 53. Preferably, the support hole 122 has a diameter equal to or larger than that of the through hole 53.

[0079] The through hole 53 can have a diameter slightly larger than that of the wire spring 60. The diameter of the through hole 53 can be designed such that when the wire spring 60 is connected to the pad 51 formed in the third PCB 50, a connector such as a solder or other conductor flows out through the through hole 53, and then the connector is connected to the wire springs 60 on the top and bottom surfaces of the third PCB 50.

[0080] The diameter of the support hole 122 can be slightly larger than that of the wire spring 60. Alternatively, the diameter of the support hole 122 can be equal to or larger than that of the through hole 53. That is, the diameter of the support hole 122 can be designed to prevent interference because the wire spring 60 contacts the second holder 22 near the support hole 122.

[0081] The buffer unit 100 is configured to function as described above to absorb the load applied to the wire spring 60. Therefore, the load applied to the pad 51 provided in the third PCB 50 can be reduced, and thus the load directly applied to the connection unit w that fixes the wire spring 60 can be reduced.

[0082] Meanwhile, in the normal assembly process, after combining the winding bobbin 32 and the outer blade 31, the second housing 22, the second PCB 40, the third PCB 50, and the wire spring 60 are coupled. The winding bobbin 32 including the lens barrel is combined, the first housing 21 is connected, and then the first housing 21 is mounted on the first PCB 10 by using a jig. Alternatively, the permanent magnet and the yoke can be combined before connecting the first housing 21. The order of the above assembly can be changed when necessary. In other words, the assembly can be directly performed inside the device without a jig. During this process, although the force for inserting and combining the winding bobbin 32 including the lens barrel is very large and the connecting unit w is adversely affected by excessive force, the buffer unit 100 can absorb the excessive force.

[0083] In other words, the buffer unit 100 absorbs the load generated in the wire spring 60 around the connecting unit w of the wire spring 60 and the third PCB 50 and then pulled in the direction of gravity, and the load generated when the wire spring 60 is jiggled left and right in the form of converted energy, as shown in Figure 2 , Figure 5 , and Figure 6 .

[0084] Therefore, it is possible to avoid the problem that the connection work has to be performed again due to the damage of the connecting unit w during the assembly process or the problem that the damaged product cannot be used. Thus, a more reliable camera module can be manufactured.

[0085] According to a second exemplary embodiment of the present invention, the camera unit may further include a buffer member 1100 to replace the buffer unit 100 used in the first and second embodiments, as shown in Figure 7 and Figure 8 .

[0086] The buffer member 1100 is inserted between the second housing 22 and the third PCB 50, as shown in Figure 7 . The buffer member 1100 functions to distribute the load applied to the connecting unit w by absorbing the force generated in the wire spring 60 or the pad 51 provided in the third PCB 50 to facilitate the connection of the wire spring 60 and the third PCB 50.

[0087] The through hole 53 may have a diameter slightly larger than that of the wire spring 60. The diameter of the through hole 53 can be designed such that when the wire spring 60 is connected to the pad 51 formed in the third PCB 50, a connecting object such as welding or other conductive material flows out through the through hole 53, and then the connecting object is connected to the wire spring 60 on the top and bottom surfaces of the third PCB 50.

[0088] The diameter of the support hole 122 may be slightly larger than the diameter of the wire spring 60. That is, the diameter of the support hole 122 can be designed to be larger than the diameter of the through hole 53 to prevent interference caused by the contact of the wire spring 60 with the second holder 22 near the support hole 122.

[0089] According to a third exemplary embodiment of the present invention, preferably, the buffer member 1100 is disposed on the entire surface of the second housing 22 facing the third PCB 50. Although not shown, the buffer member 1100 may be disposed only near the connection unit w.

[0090] The buffer member 1100 may be formed of an impact-resistant member, such as microcellular polyurethane foam. For example, PORON can be used as the microcellular polyurethane foam, but is not limited thereto. Any material that can be elastically deformed by an external force can be used as the buffer member 1100.

[0091] To prevent the third PCB 50 from being torn, the buffer member 1100 can be spaced apart from the ends of the pads 51 and the through holes 53 at a specific interval. As shown in Figure 5 The buffer member 1100 can be disposed between the ends of the through holes 53 and the ends of the pads 51 and is configured to: fix the third PCB 50 and the second housing 22, and reduce the load directly added to the connection unit w that fixes the wire spring 60.

[0092] In addition, the buffer member 1100 can be disposed between the third PCB 50 and the second housing 22 at the end of the support hole 122 or at a position (not shown) spaced apart from the end of the support hole 122 at a specific interval to facilitate absorbing vibrations.

[0093] That is, as shown in Figure 7 and Figure 8 The buffer member 1100 is disposed such that it enters the surface in contact with the pad 51. Therefore, the load generated in the wire spring 60 and pulling in the direction of gravity or the load generated when the wire spring 60 is jiggled left and right is mainly applied to the pad 51. The force applied to the pad 51 is transmitted to the buffer member 1100. Therefore, the buffer member 1100 absorbs the load energy by elastically converting the force in the form of converting energy.

[0094] Therefore, it is possible to prevent problems such as the connection work having to be performed again due to the damage of the connection unit w during the assembly process or the problem that the damaged product cannot be used.

[0095] According to the fourth to sixth embodiments of the present invention, a buffer unit 2100 can be formed in the corresponding wire spring 60.

[0096] Preferably, the buffer unit 2100 is integrally formed with some regions of each wire spring 60. According to a fourth exemplary embodiment of the present invention, preferably, the buffer unit 2100 is formed near a connection unit w between the wire spring 60 and the third PCB 50 and a connection unit w' between the wire spring 60 and the second PCB 40, as Figure 9 and Figure 10 shown.

[0097] Preferably, each of the buffer units 2100 includes a first bending portion 2110 and a second bending portion 2120 at a position where it does not interfere with the second housing 22 of the wire spring 60, but is not limited thereto. For example, in order to absorb the load applied to the wire spring 60 at the bending point, the buffer unit 2100 may be bent twice or more times if necessary.

[0098] That is, as Figure 10 shown, according to the load applied to the wire spring 60, the first bending portion 2110 and the second bending portion 2120 may become the centers of the moment of the bent wire spring 60, such that they deform the bent wire spring 60 in a linear direction. Therefore, the deformation of each of the first bending portion 2110 and the second bending portion 2120 serves to absorb the load applied to the wire spring 60. Accordingly, the load applied to the pad 51 provided in the third PCB 50 can be reduced, and thus the load directly added to the connection unit w for fixing the wire spring 60 can be reduced.

[0099] According to a fifth exemplary embodiment of the present invention, the buffer unit 2100 may be formed near the connection unit w between the wire spring 60 and the third PCB 50, as in Figure 11 shown. That is, the connection unit w between the wire spring 60 and the third PCB 50 corresponds to the position where the load of the wire spring 60 of the suspension holder module 30 is concentrated. Therefore, a relatively large force is applied to the connection unit w between the wire spring 60 and the third PCB 50 as compared with the force applied to the connection unit w' of the second PCB 40 mounted on the bottom surface of the outer blade 31. For this reason, the buffer unit 2100 may be provided at a position near the connection unit w between the wire spring 60 and the third PCB 50.

[0100] According to a sixth exemplary embodiment of the present invention, the buffer unit 2100 may be formed at a position near the connection unit w' between the wire spring 60 and the second PCB 40, as in Figure 12As shown. As described above in connection with the second embodiment, the position where the load is concentrated is the connection unit w of the wire spring 60 and the third PCB 50. Although the buffer unit 2100 is installed near the connection unit w' of the wire spring 60 and the second PCB 40 on the extension line of the load, however, the load is absorbed at the same position as in the first and second embodiments. As a result, the load applied to the connection unit w of the wire spring 60 and the third PCB 50 can be reduced.

[0101] According to this configuration, the buffer unit 2100 absorbs the load generated by the wire spring 60 near the connection unit w of the wire spring 60 and the third PCB 50 and then pulled in the direction of gravity, or the load generated when the wire spring 60 is jittered left and right in the form of converted energy, as in Figures 9 to 12 shown.

[0102] Therefore, it is possible to prevent problems such as the connection work having to be performed again due to the connection units w and w' being damaged during the assembly process or the damaged product not being reusable. Therefore, a more reliable camera module can be manufactured.

[0103] According to the seventh exemplary embodiment of the present invention, instead of the buffer units 100 and 2100, a shock absorption unit 3100 can be formed in the second housing 22.

[0104] That is, the shock absorption unit 3100 can be formed in the side wall of the second housing 22 with a specific depth and can be provided in the form of one or more grooves as Figures 13 to 15 shown. The shock absorption unit 3100 formed in the form of a groove can have a depth smaller than the thickness of the second housing 22.

[0105] Preferably, the shock absorption unit 3100 is formed in the entire side wall of the second housing 22 in the form of one or more grooves with a specific depth. Here, the grooves have the same depth, and they can be spaced apart from each other at a specific interval. In addition, the shock absorption unit 3100 can be formed in the inner and outer surfaces of the second housing 22 in an interleaved manner as in Figures 13 to 15 shown.

[0106] When the shock absorption unit 3100 is formed as described above, the side wall of the second housing 22 has a serrated portion. Therefore, when an external shock is applied to the second housing 22, the two wall surfaces of the shock absorption unit 3100 formed in the form of a groove approach each other, as in Figure 15As shown. Thus, the second housing 22 can be elastically deformed and thus the external impact energy can be converted into the displacement energy of the second housing 22. Since the shock absorption unit 3100 can absorb the external shock through the elastic deformation of the second housing 22, the load transmitted to the connection unit w of the wire spring 60 and the third PCB 50 due to the movement of the holder module 30 can be reduced, thereby minimizing the damage to the connection unit w.

[0107] Similarly, if only the material used to form the side wall of the second housing 22 is replaced with the material for the elastic deformation of the shock absorption unit 3100, the same effect can be expected. However, if a material that is too soft, such as silicon or rubber, is used, the movement of the holder module 30 may be affected. For this reason, the material for elastic deformation needs to maintain a strength of a specific level or higher.

[0108] Meanwhile, the camera module of the present invention may further include a protective cover 70 configured to have through holes at corresponding positions corresponding to the lens module around the connection unit w of the third PCB 50 and the wire spring 60 and configured to surround the housing units 21 and 22. In such a case, the third PCB 50 may be attached to the inner circumferential surface of the protective cover 70 as described above. Meanwhile, depending on the configuration of the housing units 21 and 22, the protective cover 70 is not essential and may be omitted.

[0109] Meanwhile, as Figure 12 shown, the camera module of the present invention may further include hook units 80 provided on each of the four sides or on one or more sides to fix the protective cover 70 to the first housing 21. The position of the hook units 80 may be within the range where a center or corner design is allowed. The number of the hook units 80 may be one or more.

[0110] The hook unit 80 may include: a hook 81 protruding into the first housing 21; and a hook hole 82 formed to penetrate the protective cover 70 facing the hook 81, and may also have the opposite configuration as needed.

[0111] Meanwhile, in order to reduce the impact on the internal structure of the camera module caused by a drop, the camera module of the present invention may control an optical image stabilization (OIS) driver.

[0112] Figure 16 is a block diagram of a camera module according to an embodiment of the present invention.

[0113] The camera module according to the present invention includes: a position detection unit 4100 for detecting the position of the camera module; a controller 4110 for generating a control signal when the position of the camera module detected by the position detection unit 4100 corresponds to the condition of the camera module descending; and an OIS driver 4120 for reducing the impact applied to the internal structure of the camera module in response to the control signal of the controller 4110.

[0114] That is, when the camera module descends, the position detection unit 4100 detects the position of the camera module. The controller 4110 determines whether the data on the detected position of the camera module satisfies the condition of the camera module descending.

[0115] If, as a result of the determination, the data on the detected position of the camera module satisfies the condition of the camera module descending, then the controller 4110 outputs a control signal to the OIS driver 4120. The OIS driver 4120 reduces the impact applied to the internal structure of the camera module caused by the descent.

[0116] The position detection unit 4100 may include at least one of a gyro sensor, an acceleration sensor, and an angular velocity sensor.

[0117] Figure 17 FIG. is a schematic cross-sectional view showing an example of a camera module according to an embodiment of the present invention.

[0118] The camera module 4200 according to an embodiment of the present invention may be an OIS driver driven according to a lens barrel displacement method or a camera module tilting method.

[0119] As shown in Figure 17 , the camera module 4200 using the lens barrel displacement method includes a lens barrel 4250 and a housing 4210. The lens barrel 4250 includes at least one lens, and the housing 4210 has the lens barrel 4250 embedded therein.

[0120] In addition, the OIS driver of the camera module using the lens barrel displacement method moves the lens barrel 4250, and further includes a coil 4220 mounted in the lens barrel 4250 and a magnet 4230 provided in the housing 4210.

[0121] The positions where the coil 4220 and the magnet 4230 are respectively mounted on the lens barrel 4250 and the housing 4210 may be reversed.

[0122] In addition, the lens barrel 4250 may be suspended from the housing 4210 by a wire spring 4260.

[0123] The wire spring 4260 provides flexibility for the left - right operation of the lens barrel 4250. The wire spring 4260 is connected to the coil 4220 and is configured to supply current to the coil 4220.

[0124] That is, when current is supplied to the coil 4220 through the wire spring 4260, a magnetic force is generated between the coil 4220 and the magnet 4230, thereby restricting the movement of the lens barrel 4250 in the x - axis and y - axis directions. Therefore, even if a large stress is applied to the lens barrel 4250, the buffering effect can be used to prevent the lens barrel 4250 from being damaged.

[0125] Figure 18 FIG. is a schematic cross - sectional view of a camera module showing another example according to an embodiment of the present invention.

[0126] Figure 18 The camera module includes the above - described OIS driver driven according to the camera module tilting method. The camera module 4300 using the camera module tilting method includes a camera unit 4350 configured to capture an optical image of a subject; and a housing 4330 configured to have the camera unit 4350 embedded therein.

[0127] The OIS driver may include a magnet 4320 mounted in the camera module 4350 and a coil 4310 mounted in the housing 4330.

[0128] The positions where the magnet 4320 of the OIS driver and the coil 4310 are respectively mounted in the camera unit 4350 and the housing 4330 may be reversed.

[0129] In addition, the camera unit 4350 can be suspended from the housing 4330 by a wire spring 4360, and current can be supplied to the coil 4310 through the wire spring 4360.

[0130] In the camera module 4300 using the camera module tilting method, the movement of the camera unit 4350 in the x - axis and y - axis directions is restricted by the magnetic force generated between the coil 4310 and the magnet 4320. Therefore, damage to the internal structure of the camera unit 4350 can be prevented.

[0131] To prevent the center of the camera unit 4350 from moving, a groove 4351 can be formed at the center of the bottom of the camera unit 4350. A pivot 4370 that is inserted into the groove 4351 can be formed in the housing 4330.

[0132] Before and after optical image stabilization (OIS) driving, the groove 4351 and the pivot 4370 function to balance the camera unit 4350.

[0133] In addition, a groove 4351 may be formed at an additional support unit disposed under the camera unit 4350.

[0134] In addition, the wire spring 4360 may function to support the camera unit 4350 to the pivot 4370.

[0135] In addition, when the electromagnetic action of the OIS driver disappears, the wire spring 4360 functions to return the camera unit 4350 to the original position, or an additional elastic unit for performing a recovery function is further included in the camera unit 4350.

[0136] That is, the elastic unit may be connected to Figure 17 the lens barrel 4250 and the housing 4210, or Figure 18 the camera unit 4350 and the housing 4330. When there is no electromagnetic action due to stopping the power supply to the coil of the OIS driver, the elastic unit may be formed of a member having excellent restoring force, such as a wire spring or a leaf spring, but is not limited thereto.

[0137] As described above, the camera module according to the present invention detects the drop of the camera module based on the position data detected by the position detection unit and drives the OIS driver. Therefore, it is possible to reduce the impact on the internal structure of the camera module caused by the drop.

[0138] The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical spirit of the present invention. The scope of the present invention is limited only by the claims, and those skilled in the art can improve and modify the technical spirit of the present invention in various forms. Therefore, as long as the changes are obvious to those skilled in the art, the changes will fall within the scope of the present invention.

Claims

1. An optical image stabilization (OIS) unit, comprising: A second housing; A holder module spaced apart from the second housing; A magnet disposed on the second housing; A first coil configured to move the holder module through interaction with the magnet; A wire spring connected to the holder module; A first connection unit configured to fix the wire spring; And A buffer unit connected to the first connection unit, wherein the buffer unit includes a shape that bends at least twice.

2. The OIS unit according to claim 1, wherein The holder module includes a second printed circuit board coupled to the wire spring.

3. The OIS unit according to claim 2, wherein, The second printed circuit board is electrically connected to the first coil.

4. The OIS unit according to claim 2, including a second connection unit connecting one end of the wire spring and the second printed circuit board, Among them, The first connection unit is connected to the other end of the wire spring.

5. The OIS unit according to claim 1, wherein, The holder module is configured to move in a direction perpendicular to the wire spring through the interaction between the magnet and the first coil.

6. The OIS unit according to claim 1, wherein, The shape of the buffer unit that bends at least twice includes a curved shape.

7. The OIS unit according to claim 1, wherein, The buffer unit is formed such that the distance between both ends of the buffer unit is adjusted to absorb the load applied to the holder module.

8. The OIS unit according to claim 1, wherein, The wire spring includes four wire springs of the same length, and wherein the buffer unit includes four buffer units.

9. The OIS unit according to claim 1, including a third printed circuit board fixed to the second housing.

10. The OIS unit according to claim 9, wherein, The third printed circuit board includes a first portion disposed higher than the holder module.

11. The OIS unit according to claim 10, wherein, The third printed circuit board includes pads formed on the first portion of the third printed circuit board and including holes through which the wire spring passes; wherein the pads include a first surface and a second surface, the first surface facing the holder module and the second surface opposite to the first surface; and wherein the first connection unit connects the wire spring and the second surface of the pad.

12. The OIS unit according to claim 1, wherein, The holder module includes outer blades spaced apart from the second housing; A bobbin disposed in the outer blades; And a spring member connecting the outer blades and the bobbin; And wherein a second coil is disposed on the bobbin.

13. The OIS unit according to claim 12, wherein, The buffer unit includes: a first portion and a third portion extending in a first direction; and a second portion extending in a second direction different from the first direction and disposed between the first portion and the third portion; and wherein the first portion of the buffer unit is disposed between the first connection unit and the second portion of the buffer unit.

14. The OIS unit according to claim 13, including a base disposed below the second housing, Among them, The shortest distance between the third part of the buffer unit and the outer blade is less than the shortest distance between the third part of the buffer unit and the base.

15. An optical image stabilization (OIS) unit, comprising: A second housing; A holder module spaced apart from the second housing; A wire spring connected to the holder module; A magnet disposed on the second housing; A first coil configured to move the holder module in a direction perpendicular to the wire spring by interaction with the magnet; A first connection unit disposed at one end of the wire spring by welding; And A buffer unit connected to the first connection unit, wherein the buffer unit includes a bent shape or a shape bent at least twice.

16. The OIS unit according to claim 15, wherein, The holder module includes a second printed circuit board coupled to the wire spring, and wherein the second printed circuit board is electrically connected to the first coil.

17. The OIS unit according to claim 16, including a second connection unit connecting the other end of the wire spring and the second printed circuit board.

18. A camera module, comprising: A second printed circuit board; An image sensor disposed on the second printed circuit board; And The OIS unit according to any one of claims 1 to 17 disposed on the second printed circuit board; And A lens coupled to the bobbin of the OIS unit.

19. A mobile phone, including the camera module according to claim 18.

20. An optical image stabilization (OIS) unit, comprising: A second housing; A holder module spaced apart from the second housing; A magnet disposed on the second housing; A first coil configured to move the holder module by interaction with the magnet; And A wire spring connected to the holder module.

21. A camera module, comprising: A position detection portion for detecting the position of the camera module; A controller for: generating a control signal if the position of the camera module detected by the position detection portion corresponds to a condition of the camera module descending; An optical image stabilization (OIS) driver for reducing the internal structure of the camera module in response to the control signal received from the controller; A camera unit configured to capture an image of a subject; And A housing configured to have the camera unit embedded therein, wherein the OIS driver is driven according to any one of a lens barrel displacement method and a camera module tilting method, and wherein the OIS driver is configured to reduce the impact applied to the internal structure of the camera module caused by the descent.

Images