Display device repairing system and method

Abstract

The invention relates to a display device repairing system and method.The display device repairing system comprises a machine table and a feeding device arranged on the machine table, the feeding device comprises a feeding driving assembly and a feeding table, the feeding table is used for supporting a standby substrate, and the feeding driving assembly drives the feeding table to move; the repairing device comprises a repairing driving assembly and a repairing table, the repairing table is used for supporting the to-be-repaired substrate, and the repairing driving assembly drives the repairing table to move; the printing device is suitable for printing scaling powder at the defect point position of the substrate to be repaired; a welding device; and the transfer device comprises a transfer driving assembly and an adsorption assembly, and the transfer driving assembly drives the adsorption assembly to pick up the chip on the standby substrate and sends the chip to the defect point located at the welding device. The printing device is arranged to print the scaling powder on the defect points, the adsorption needle tube is adopted to press and adsorb the chip, it is guaranteed that the chip is stably picked up and transferred, it is guaranteed that the repairing consistency is better, and the repairing quality is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of display device repair, and particularly to a display device repair system and method. Background Art

[0002] MicroLED (micro light-emitting diode) display devices are widely used due to their advantages such as small size, low power consumption, high brightness, high color saturation, fast response, and long lifespan. In order to improve the yield of MicroLED display devices, during the preparation process of existing MicroLED display devices, after the LED chips are transferred, precise addressing detection and repair are performed on the LED chips to eliminate the non-displaying light-emitting chips and improve the yield of the display device.

[0003] The chips to be transferred are usually arranged in batches on a spare substrate. When it is necessary to repair the defective points on the panel to be repaired, after picking up the chips from the spare substrate, they are then transferred to the defective points on the substrate to be repaired. Generally, the chips are picked up by means of bonding, adsorption, magnetism, etc. After picking up the chips, the chips are placed at the defective points and fixed at the defective points.

[0004] In related technologies, a glass cavity is arranged, and adsorption holes are opened on the bottom surface of the glass cavity. Through the form of vacuum pumping, the chips are adsorbed on the bottom surface of the glass cavity. And by arranging a laser on the top of the glass cavity, the laser passes through the glass cavity and irradiates the surface of the chip, thereby heating the chip to weld and fix the chip.

[0005] However, first, the chips on the spare substrate and the substrate to be repaired are arranged closely, and the size of the chips is small. When the glass cavity presses down to adsorb the chips, the glass cavity will touch the chips around the chip to be picked up, which not only causes the glass cavity to be unable to press down the chip to be picked up, making it difficult to ensure the vacuum between the chip and the bottom surface of the glass cavity, but also easily causes damage to the surrounding chips. Due to the small size of the chips, it is also difficult to process the adsorption holes. Second, the laser passes through the glass cavity, and part of the laser passes through the adsorption holes and irradiates the chip, resulting in uneven energy intensity of the light spot formed on the chip surface, making it difficult to control the energy of the laser. And the laser needs to move synchronously with the glass cavity, and the reciprocating movement of the internal components of the laser easily causes the optical path of the laser to change, which has an adverse effect on the welding and fixing of the chip. Third, due to the lack of flux at some defective points. Flux needs to be arranged at the defective points before laser welding, and in the prior art, it is difficult or even impossible to arrange flux at the defective points efficiently. Summary of the Invention

[0006] Embodiments of this application provide a display device repair system and method to solve the technical problems in related technologies that it is difficult to pick up and press the chips, the laser energy uniformity is poor, it is difficult to arrange flux, and the repair quality and efficiency of the display device are affected.

[0007] In a first aspect, a display device repair system is provided, including a machine platform and components arranged on the machine platform:

[0008] A feeding device, the feeding device includes a feeding driving component and a feeding table, the feeding table is used to support a spare substrate, and the feeding driving component drives the feeding table to translate and rotate in a horizontal plane;

[0009] A repair device, the repair device includes a repair driving component and a repair table, the repair table is used to support a substrate to be repaired, and the repair driving component drives the repair table to translate and rotate in a horizontal plane;

[0010] A printing device, the repair table is adapted to carry the substrate to be repaired to the printing device, and the printing device is adapted to print flux at the defective positions of the substrate to be repaired;

[0011] A welding device, the repair table is adapted to sequentially place multiple defective positions of the substrate to be repaired at the welding position of the welding device;

[0012] A transfer device, the transfer device includes a transfer driving component and an adsorption component, the adsorption component includes adsorption needle tubes for adsorbing chips, and the transfer driving component drives the adsorption component to pick up the chips on the spare substrate and send the chips to the defective positions at the welding device.

[0013] In some embodiments, the printing device includes:

[0014] A printing frame, the printing frame is installed on the machine platform;

[0015] A printing driving component, the printing driving component is installed on the printing frame;

[0016] A print head, the print head is installed at the driving end of the printing driving component, the print head is adapted to print flux at the defective positions, and the printing driving component drives the print head to move in the vertical direction.

[0017] In some embodiments, the adsorption component further includes:

[0018] A sliding seat, the sliding seat is arranged to lift and slide at the driving end of the transfer driving component, and the adsorption needle tubes are installed on the sliding seat;

[0019] A pressure sensing member, the pressure sensing member is installed at the driving end of the transfer driving component, and the sliding seat is connected to the measuring end of the pressure sensing member.

[0020] In some embodiments, the adsorption assembly further includes a connecting rod, the adsorption needle tube is connected to the sliding seat through the connecting rod, and the sliding seat and the adsorption needle tube are respectively located at opposite ends of the connecting rod.

[0021] In some embodiments, the adsorption assembly further includes an elastic member, the elastic member connects the adsorption needle tube and the driving end of the transfer driving assembly, and the elastic force of the elastic member cancels part or all of the gravity of the elastic member load component.

[0022] In some embodiments, the welding device includes a laser, and the optical path of the emitted light of the laser is arranged obliquely to the plane where the substrate to be repaired is located, so that the emitted light irradiates the surface of the chip avoiding the adsorption needle tube.

[0023] In some embodiments, the welding device includes two lasers, and the two lasers respectively emit laser light to the chip from opposite sides of the adsorption needle tube, and the two light spots formed by the two lasers on the chip overlap.

[0024] In some embodiments, the welding device includes:

[0025] A laser, the laser light emitted by the laser is vertically incident on the chip at the defect position;

[0026] A light-transmitting pressing block, the light-transmitting pressing block is located below the laser;

[0027] A pressing block driving assembly, the pressing block driving assembly is installed on the laser, and the pressing block driving assembly drives the light-transmitting pressing block to extend to the optical path of the laser light emitted by the laser and press the light-transmitting pressing block against the chip.

[0028] In some embodiments, a plurality of positioning pins are arranged on the bearing surface of the feeding table, and the circumferential side surface of the spare substrate is adapted to abut against the positioning pins.

[0029] The beneficial effects brought by the technical solution provided by this application include:

[0030] An embodiment of the present application provides a display device repair system. First, a soldering flux is printed on the defective points by a printing device for subsequent soldering and fixing of the chips. The printing method enables better consistency in the arrangement of the soldering flux, and the arrangement is more precise and efficient. When transferring the chips, the adsorption component moves above the spare chips, presses down and adsorbs the chips to pick up the chips, and transfers the chips to the defective points of the substrate to be repaired. Since the chips are adsorbed and picked up by the adsorption needle tubes, the tip size of the adsorption needle tubes is small, and they can only be pressed against the surface of the chips to be picked up. Moreover, the adsorption needle tubes can be further lowered to press the chips tightly, which not only facilitates ensuring the vacuum degree between the chips and the adsorption needle tubes, but also ensures that during soldering, the chips are pressed tightly at the defective points by the adsorption needle tubes, so as to ensure that the chips are accurately installed at the defective points and ensure the repair quality.

[0031] Further, the defective points to be repaired move to the soldering position of the soldering device as the repair table moves, and the adsorption needle tubes transfer the chips to the defective points. After the chips are transferred to the defective points in this way, soldering can be immediately performed. It is convenient to directly press the chips tightly by the adsorption needle tubes. When the chips are soldered and fixed, they are not easily displaced, which ensures the fixing quality of the chips and improves the repair efficiency. In addition, since the position of the soldering device does not change, when the defective points are repaired in sequence, the relative positions of the soldering device and different defective points on the substrate to be repaired are consistent, which ensures better repair consistency and ensures the repair quality.

[0032] In a second aspect, a display device repair method is provided. Based on the above-mentioned display device repair system, the method includes the following steps:

[0033] Use a printing device to print soldering flux on multiple defective points of the substrate to be repaired on the repair table in sequence;

[0034] Use a transfer device to pick up the chips on the spare substrate and transfer the chips to the defective points of the substrate to be repaired;

[0035] Press the chips tightly at the defective points;

[0036] Use a soldering device to heat the chips and solder the chips at the defective positions.

[0037] Another embodiment of the present application provides a display device repair method. Since the display device repair method is based on the above-mentioned display device repair system, the beneficial effects of the display device repair method are the same as those of the above-mentioned display device repair system and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0039] Figure 1 Schematic diagram of the display device repair system provided by the embodiment of the present application;

[0040] Figure 2 Internal schematic diagram of the display device repair system provided by the embodiment of the present application;

[0041] Figure 3 Schematic diagram of the single-group transfer device provided by the embodiment of the present application;

[0042] Figure 4 Schematic diagram of chip transfer and placement provided by the embodiment of the present application;

[0043] Figure 5 Schematic diagram of the feeding device provided by the embodiment of the present application;

[0044] Figure 6 Schematic diagram of the repair device and the welding device provided by the embodiment of the present application;

[0045] Figure 7 Schematic diagram of the transfer device and the repair device provided by the embodiment of the present application;

[0046] Figure 8 Partial schematic diagram of the transfer device provided by the embodiment of the present application;

[0047] Figure 9 Schematic diagram of the adsorption component provided by the embodiment of the present application;

[0048] Figure 10 Schematic diagram of two sets of lasers provided by another embodiment of the present application;

[0049] Figure 11 Schematic diagram of the welding device provided by another embodiment of the present application.

[0050] In the figure: 1. Machine platform; 2. Outer shell; 3. Feeding device; 31. Feeding driving assembly; 32. Feeding table; 321. Positioning pin; 33. Feeding vision detection assembly; 331. Feeding vision positioning part; 332. Pick-up vision monitoring part; 4. Repair device; 41. Repair driving assembly; 42. Repair table; 43. Repair vision detection assembly; 431. Repair vision positioning part; 432. Placing vision monitoring part; 5. Printing device; 51. Printing frame; 52. Printing driving assembly; 53. Print head; 6. Welding device; 61. Laser; 62. Translucent pressing block; 63. Pressing block driving assembly; 7. Transfer device; 71. Transfer driving assembly; 72. Adsorption assembly; 721. Adsorption syringe; 722. Sliding seat; 723. Pressure sensing part; 724. Connecting rod; 725. Elastic part; 73. Transfer frame; 8. Spare substrate; 9. Substrate to be repaired; 9a. Defective point; a. Chip. Detailed implementation mode

[0051] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0052] The embodiment of the present application provides a display device repair system and method. The repair system arranges a printing device to print flux on defective points, improving the flux arrangement efficiency. The adsorption syringe is used to press and adsorb the chip, without interference with other chips, ensuring stable pick-up and transfer of the chip. The relative positions of the welding device and different defective points on the substrate to be repaired are consistent, ensuring better repair consistency and repair quality. The present application solves the problems in the related art that it is difficult to pick up and press the chip, the laser energy uniformity is poor, and it is difficult to arrange the flux, affecting the repair quality and efficiency of the display device.

[0053] Refer to Figures 1-4 , a display device repair system, including a machine platform 1 and a feeding device 3, a repair device 4, a printing device 5, a welding device 6 and a transfer device 7 arranged on the machine platform 1. In addition, an outer shell 2 is arranged on the top of the machine platform 1, and the feeding device 3, the repair device 4, the printing device 5, the welding device 6 and the transfer device 7 are all arranged in the processing chamber formed by the outer shell 2 and the machine platform 1.

[0054] Refer to Figure 3 and Figure 4, wherein, the feeding device 3 is used to carry the spare substrate 8, the repair device 4 is used to carry the substrate 9 to be repaired, the printing device 5 is used to print flux at the defect position 9a of the substrate 9 to be repaired, the transfer device 7 is used to pick up the chip a on the spare substrate 8 and transfer it to the defect position 9a of the substrate 9 to be repaired, and the welding device 6 is used to weld the chip a at the defect position 9a. Thus, the repair is completed.

[0055] With such an arrangement, by integrating the flux layout, chip transfer, and chip welding, the automatic full-process repair of the substrate 9 to be repaired is realized, improving the repair efficiency.

[0056] Referring to Figure 3 and Figure 5 , wherein, the feeding device 3 includes a feeding drive assembly 31 and a feeding table 32, and the feeding table 32 is used to support the spare substrate 8. The feeding drive assembly 31 includes a cross slide and a turntable. The turntable is used to carry the spare substrate 8 and drive the spare substrate 8 to rotate in the horizontal plane. The cross slide drives the turntable and the spare substrate 8 to translate in the horizontal plane together. In this embodiment, the cross slide drives the spare substrate 8 to move in the first direction and the second direction. Preferably, the first direction and the second direction are perpendicularly arranged. For the convenience of understanding, the X-axis direction in the figure is the first direction, that is, the left-right direction. The Y-axis direction is the second direction, that is, the front-back direction.

[0057] With such an arrangement, after the spare substrate 8 is loaded onto the feeding table 32, it is driven by the turntable and the cross slide to move to the transfer device 7 for the transfer device 7 to pick up.

[0058] Specifically, the cross slide is assembled by two linear modules. The linear module includes a linear motor or a lead screw mechanism. The turntable includes an electric turntable.

[0059] Referring to Figure 5 , further, a plurality of feeding tables 32 are arranged, and the plurality of feeding tables 32 are arranged in sequence in the first direction. Adaptively, the feeding drive assembly 31 includes a plurality of turntables, and the number of turntables corresponds to the number of feeding tables 32 one by one. In this way, a plurality of spare substrates 8 can be carried, and the individual movement positions of different spare substrates 8 can be satisfied. In this embodiment, three feeding tables 32 and three turntables are arranged, and the three feeding tables 32 are respectively used to carry the spare substrates 8 with chips a of red, green, and blue colors.

[0060] With such an arrangement, the spare chips a with different color chips a are carried simultaneously. According to the type of chip a required at the defect position 9a of the substrate 9 to be repaired, the transfer device 7 picks up the required color chip a to meet the repair requirements of different defect positions 9a.

[0061] Referring to Figure 5, wherein, a plurality of positioning pins 321 are arranged on the bearing surface of the feeding table 32, and the plurality of positioning pins 321 are all arranged close to the surface edge of the feeding table 32. The circumferential side surface of the spare substrate 8 is adapted to abut against the positioning pins 321.

[0062] With such an arrangement, after the spare substrate 8 is loaded onto the feeding table 32, the spare substrate 8 abuts against the positioning pins 321, and the positioning of the spare substrate 8 is realized by using the form of mechanical edge alignment, so as to quickly determine the position of the chip a on the spare substrate 8.

[0063] Furthermore, the feeding table 32 fixes the spare substrate 8 in an adsorption manner. Specifically, through holes are formed on the surface of the feeding table 32, and are communicated with an external negative pressure device through the through holes, so as to form a negative pressure state on the surface of the feeding table 32, and adsorb and fix the spare substrate 8.

[0064] Refer to Figure 5 , wherein, the feeding device 3 further includes a feeding vision detection component 33, and the feeding vision detection component 33 includes a feeding vision positioning member 331. The feeding vision positioning member 331 is installed on the inner wall of the housing 2 through a bracket. The imaging direction of the feeding vision positioning member 331 is arranged perpendicular to the surface of the feeding table 32.

[0065] With the movement of the feeding table 32, different positions of the spare substrate 8 are moved into the visual field range of the feeding vision positioning member 331. The feeding vision positioning member 331 determines the position of the spare substrate 8 by capturing the marking points on the surface of the spare substrate 8. In this embodiment, the feeding vision positioning member 331 determines the position of the spare substrate 8 and each chip a on the spare substrate 8 by capturing the positions of two chips a at the diagonal corners.

[0066] Furthermore, by imaging the chip a on the spare substrate 8 and synchronously adjusting the position of the spare substrate 8, the length direction and the width direction of the chip a on the spare substrate 8 are respectively arranged along the first direction and the second direction.

[0067] With such an arrangement, through the deviation correction of the position of the chip a, it is ensured that the relative position between the chip a and the picking end of the transfer device 7 is consistent each time the chip a is picked up. During the transfer process of the chip a, both the length direction and the width direction of the chip a are in a determined state. When the chip a is placed and fixed on the defect position 9a, the placement accuracy of the chip a is improved, and the repair quality is ensured. In addition, each time the chip a is picked up, the position of the chip a after each pick-up is the same, which improves the consistency of the transfer of the chip a.

[0068] In this embodiment, the feeding vision positioning member 331 includes a camera or a camera group, and the camera group includes at least one high-power camera and at least one wide-angle camera.

[0069] Refer to Figure 5, wherein the feeding vision detection component 33 further includes a picking vision monitoring member 332. The picking vision monitoring member 332 is fixed to the inner wall of the housing 2 by a bracket. The imaging direction of the picking vision monitoring member 332 is arranged obliquely to the surface of the spare substrate 8. When picking up the chip a, the spare substrate 8 is moved so that the chip a to be transferred is within the imaging field of view of the picking vision monitoring member 332. By monitoring the picking process, it is ensured that the chip a is picked up stably and accurately.

[0070] With such a setting, during the test of picking up the chip a, the picking process is monitored by the picking vision monitoring member 332 to judge the stability of picking up the chip a, and then the picking strategy can be conveniently and adaptively adjusted. During the actual picking process of repair, by monitoring the picking state, it is suitable to timely detect the chip a with poor picking stability and give an alarm prompt in time.

[0071] Specifically, the picking vision monitoring member 332 includes a camera.

[0072] Refer to Figure 3 and Figure 6 , wherein the repair device 4 and the feeding device 3 are arranged at intervals in the second direction. The repair device 4 includes a repair driving component 41 and a repair table 42. The repair table 42 is used to support the substrate 9 to be repaired. The repair driving component 41 includes a cross slide and a turntable. The turntable is used to carry the substrate 9 to be repaired and drive the substrate 9 to be repaired to rotate in the horizontal plane. The cross slide drives the turntable and the substrate 9 to be repaired to translate in the horizontal plane together. In this embodiment, the cross slide drives the substrate 9 to be repaired to move in the first direction and the second direction.

[0073] With such a setting, through the turntable and the cross slide, a plurality of defect points 9a on the substrate 9 to be repaired are driven to move to the printing end of the printing device 5 in sequence, so as to conveniently arrange flux at the defect points 9a in the form of printing. And after the flux is arranged at the defect points 9a of the substrate 9 to be repaired, the substrate 9 to be repaired is moved to the welding device 6, and a plurality of defect points 9a are sequentially placed at the welding positions of the welding device 6, and wait for the chip a to be sent to the defect points 9a at the welding positions of the welding device 6. Therefore, the substrate 9 to be repaired realizes the station switching of printing and welding through position movement, simplifies the overall repair structure, and optimizes the processing rhythm.

[0074] Furthermore, the repair table 42 fixes the substrate 9 to be repaired in an adsorption form. Specifically, through holes are formed on the surface of the repair table 42, and are communicated with an external negative pressure device to form a negative pressure state on the surface of the repair table 42, so as to adsorb and fix the substrate 9 to be repaired.

[0075] Refer to Figure 6, wherein, the repair device 4 further includes a repair vision detection component 43, and the repair vision detection component 43 includes a repair vision positioning member 431. The repair vision positioning member 431 is mounted on the inner wall of the housing 2 through a bracket. The imaging direction of the repair vision positioning member 431 is arranged perpendicular to the surface of the repair table 42.

[0076] As the repair table 42 moves, different positions of the substrate 9 to be repaired are moved within the field of view of the repair vision positioning member 431. The repair vision positioning member 431 determines the position of the substrate 9 to be repaired by capturing the marking points on the surface of the substrate 9 to be repaired. In this embodiment, the repair vision positioning member 431 determines the position of the substrate 9 to be repaired and each chip a on the substrate 9 to be repaired by capturing the positions of two chips a at the diagonal corners of the substrate 9 to be repaired. This facilitates determining the specific position of the defect point 9a and accurately moving the defect point 9a to the printing position of the printing device 5 and the welding position of the welding device 6.

[0077] Further, by imaging the chip a on the substrate 9 to be repaired and synchronously adjusting the position of the substrate 9 to be repaired, the length direction and width direction of the chip a on the substrate 9 to be repaired are respectively arranged along the first direction and the second direction.

[0078] With such a setting, through the correction of the position of the chip a on the substrate 9 to be repaired, the length direction and width direction of the chip a on the substrate 9 to be repaired are made consistent with the length direction and width direction of the chip a picked up by the transfer device 7. When the transfer device 7 places the chip a at the defect point 9a, the placement state of the chip a at the defect point 9a is consistent with the placement states of the other chips a on the substrate 9 to be repaired, thereby ensuring the accuracy of placing the chip a at the defect point 9a and improving the consistency of multiple repairs.

[0079] In this embodiment, the repair vision positioning member 431 includes a camera or a camera group, and the camera group includes at least one high-magnification camera and at least one wide-angle camera.

[0080] Refer to Figure 3 and 6 , wherein, the repair vision detection component 43 further includes a placement vision monitoring member 432. The placement vision monitoring member 432 is fixed on the inner wall of the housing 2 through a bracket. The imaging direction of the placement vision monitoring member 432 is arranged obliquely to the surface of the substrate 9 to be repaired. When placing the chip a, the imaging position of the placement vision monitoring member 432 is consistent with the welding position of the welding device 6. By moving the substrate 9 to be repaired so that the defect point 9a on the substrate 9 to be repaired is placed at the welding position, the transfer device 7 places the chip a at the defect point 9a. At this time, the placement vision monitoring member 432 images the placement process of the chip a.

[0081] With such a setting, during the transfer test of chip a, by monitoring the placement process of chip a, it is convenient to timely detect problems in placement and is suitable for adjusting the parameters of the transfer device 7 when placing chip a. During the actual repair process, by monitoring the placement of chip a, it is convenient to timely detect the placement deviation of chip a, and even the situation where chip a cannot be detached from the transfer device 7, and give a timely feedback alarm.

[0082] Specifically, the placement vision monitoring member 432 includes a camera.

[0083] Among them, the repair table 42 is suitable for carrying the substrate 9 to be repaired and moving in the second direction, so that the substrate 9 to be repaired is located below the printing end of the printing device 5, and by changing the position of the substrate 9 to be repaired in the first direction and the second direction, a plurality of defect points 9a of the substrate 9 to be repaired are sequentially located below the printing end of the printing device 5.

[0084] With such a setting, by changing the position of the substrate 9 to be repaired, the substrate 9 to be repaired is placed at the printing station, and at the printing station, the printing device 5 prints and arranges flux at the defect points 9a of the substrate 9 to be repaired for subsequent fixing of chip a.

[0085] Specifically, the printing device 5 includes a printing frame 51, a printing drive assembly 52 and a print head 53.

[0086] The printing frame 51 is installed on the machine table 1, and the printing device 5 is installed at the edge of the machine table 1. The printing drive assembly 52 is installed on the printing frame 51, the print head 53 is installed at the drive end of the printing drive assembly 52, and the printing drive assembly 52 drives the print head 53 to move in the vertical direction to adjust the printing height. The print head 53 is suitable for printing flux at the defect points 9a.

[0087] With such a setting, the repair drive assembly 41 drives the repair table 42 and the substrate 9 to be repaired to move, so that different defect points 9a on the substrate 9 to be repaired are below the print head 53, and then the print head 53 prints flux at the defect points 9a, thereby realizing the automatic arrangement of flux and improving the arrangement efficiency of flux.

[0088] Among them, the printing drive assembly 52 adjusts the distance between the print head 53 and the substrate 9 to be repaired to adjust the printing height, so as to ensure the printing quality.

[0089] In this embodiment, the print head 53 includes an electrohydrodynamic inkjet print head. Through the printing form of electrohydrodynamics, the printing accuracy is higher, the droplet volume of the flux droplets is more accurate, and it is not easy to overflow the pads of the defect points 9a.

[0090] Specifically, the printing drive assembly 52 includes a linear motor or a lead screw mechanism.

[0091] Refer toFigure 3 , Figures 7-9 , wherein the transfer device 7 includes a transfer rack 73, a transfer drive assembly 71 and a suction assembly 72. The transfer drive assembly 71 drives the suction assembly 72 to pick up the chip a on the spare substrate 8 and send the chip a to the defective position 9a at the soldering device 6.

[0092] Referring to Figure 3 , Figures 7-9 , specifically, the transfer rack 73 is fixed on the machine table 1, the transfer drive assembly 71 is installed on the transfer rack 73, and the transfer drive assembly 71 drives the suction assembly 72 to move in the second direction, so that the suction assembly 72 switches positions between the spare substrate 8 and the substrate to be repaired 9. Correspondingly, the spare substrate 8 and the substrate to be repaired 9 are driven to move, so that the chip a or the defective position 9a is placed directly below the suction assembly 72. The transfer drive assembly 71 drives the suction assembly 72 to descend to pick up the chip a or place the chip a at the defective position 9a. In addition, the transfer drive assembly 71 can drive the suction assembly 72 to move in the first direction, and cooperate with the movement of the spare substrate 8 and the substrate to be repaired 9 in the first direction to ensure that the movement range of the suction assembly 72 covers all the spare substrates 8 and the substrates to be repaired 9.

[0093] In this embodiment, the transfer drive assembly 71 includes two linear modules. The two linear modules are combined, one of which moves up and down, and the other moves in the first direction to drive the suction assembly 72 to move in the vertical direction and the first direction. Among them, the linear module includes a lead screw mechanism or a linear motor. The driving end of the transfer drive assembly 71 is a mounting bracket, and the suction needle tube 721 is installed on the mounting bracket.

[0094] In this embodiment, the suction assembly 72 includes a suction needle tube 721. The suction needle tube 721 picks up the chip a by means of negative pressure pumping, and breaks the vacuum between the chip a and the suction needle tube 721 by means of positive pressure ventilation.

[0095] With such a setting, since the chip a is adsorbed and picked up by the suction needle tube 721, the tip size of the suction needle tube 721 is small, and it can only be pressed on the surface of the chip a to be picked up. Moreover, the suction needle tube 721 can be further lowered to press the chip a tightly, which not only facilitates ensuring the vacuum degree between the chip a and the suction needle tube 721, but also ensures that during soldering, the chip a is pressed tightly at the defective position 9a by the suction needle tube 721, so as to ensure that the chip a is accurately installed at the defective position 9a and ensure the repair quality.

[0096] In this embodiment, the inner diameter of the tip of the suction needle tube 721 is 5-15 microns, and the orthographic projection of the tip of the suction needle tube 721 on the chip a all falls on the surface of the chip a.

[0097] Referring to Figures 7-9, Further, the adsorption assembly 72 further includes a sliding seat 722 and a pressure sensing member 723. The sliding seat 722 is vertically slidably disposed on the driving end of the transfer driving assembly 71 through a slide rail group.

[0098] With such an arrangement, as the adsorption needle tube 721 descends and touches the chip a, during the process of the adsorption needle tube 721 contacting the chip a, the adsorption needle tube 721 gradually rises relative to the transfer driving assembly 71 along with the sliding seat 722, thus avoiding a hard collision between the adsorption needle tube 721 and the chip a and preventing damage to the adsorption needle tube 721 and the chip a. Additionally, when placing the chip a at the defect position 9a, during the process of the adsorption needle tube 721 carrying the chip a to contact the pad at the defect position 9a, after the chip a contacts the pad, the chip a rises relative to the transfer driving assembly 71 along with the sliding seat 722, thus avoiding a hard collision between the chip a and the pad and preventing damage to the chip a.

[0099] The pressure sensing member 723 is installed at the driving end of the transfer driving assembly 71, and the sliding seat 722 is connected to the measuring end of the pressure sensing member 723. In this embodiment, the sliding seat 722 is rigidly connected to the measuring end of the pressure sensing member 723 through a rod member to measure the force generated during the relative movement of the sliding seat 722. In this embodiment, the pressure sensing member 723 includes a pressure sensor.

[0100] With such an arrangement, through the measurement of the pressure sensing member 723, the pressure exerted on the chip a when the adsorption needle tube 721 picks up the chip a can be known. On the one hand, it indicates that the adsorption needle tube 721 has contacted the chip a. On the other hand, by presetting the force for the adsorption needle tube 721 to press tightly on the chip a, it can be ensured that the adsorption needle tube 721 is closely attached to the chip a, ensuring the vacuum degree between the adsorption needle tube 721 and the chip a and ensuring the stable adsorption and picking up of the chip a.

[0101] By stably adsorbing the chip a, it can be ensured that during the transfer process of the chip a, the chip a does not have relative movement with the adsorption needle tube 721. Therefore, it can be ensured that the chip a is placed at the defect position 9a in a predetermined length and width direction. The placement accuracy of the chip a is ensured, and the repair quality is improved.

[0102] In addition, when the adsorption needle tube 721 places the chip a at the defect position 9a, the force with which the chip a is pressed against the defect position 9a can also be measured, thereby ensuring that the chip a is stably placed at the defect position 9a and is not prone to displacement of the chip a, thereby improving the installation accuracy of the chip a.

[0103] Refer to Figures 7-9, Further, the adsorption assembly 72 further includes a connecting rod 724, and the connecting rod 724 is horizontally placed. The adsorption syringe 721 is connected to the sliding seat 722 through the connecting rod 724, and the sliding seat 722 and the adsorption syringe 721 are respectively located at opposite ends of the connecting rod 724. The adsorption syringe 721 is inserted and fixed at one end of the connecting rod 724.

[0104] With such a setting, the adsorption syringe 721 is connected to the sliding seat 722 by the connecting rod 724. In the horizontal direction, the distance between the adsorption syringe 721, the sliding seat 722, and the transfer driving assembly 71 is lengthened. Therefore, when the chip a is transferred to the defect position 9a by the adsorption syringe 721, since the defect position 9a is located at the welding position of the welding device 6, the connecting rod 724 avoids the position interference between the transfer driving assembly 71 and the sliding seat 722 and the welding device 6, and avoids the shielding of the transfer driving assembly 71 and the sliding seat 722 to the welding device 6, ensuring the normal progress of welding.

[0105] Refer to Figures 7-9 , Further, the adsorption assembly 72 further includes an elastic member 725. The elastic member 725 connects the adsorption syringe 721 and the driving end of the transfer driving assembly 71, that is, the adsorption syringe 721 is elastically slidably arranged on the mounting frame. The elastic force of the elastic member 725 cancels part or all of the gravity of the load member of the elastic member 725. In this embodiment, the elastic member 725 is connected to the sliding seat 722 and the driving end of the transfer driving assembly 71. The load member of the elastic member 725 includes the adsorption syringe 721 and the sliding seat 722, and the elastic force of the elastic member 725 cancels part or all of the gravity of the adsorption syringe 721 and the sliding seat 722. Preferably, the elastic force of the elastic member 725 cancels all of the gravity of the adsorption syringe 721 and the sliding seat 722.

[0106] With such a setting, under the traction of the elastic member 725, the self-gravity of the sliding seat 722 and the adsorption syringe 721 is not likely to be overloaded on the pressure sensing member 723, and the pressure sensing member 723 is not likely to be damaged due to long-term loading, thereby protecting the pressure sensing member 723.

[0107] In addition, the elastic force of the elastic member 725 restricts the position of the sliding seat 722, avoiding the random lifting and lowering of the sliding seat 722, and ensuring the stability of the transfer of the chip a during the transfer of the chip a. And it is convenient to determine the height of the adsorption syringe 721, and accurately control the lifting height of the adsorption syringe 721.

[0108] In this embodiment, the elastic member 725 includes one or more of a spring, an elastic sheet, and an elastic pin.

[0109] In this embodiment, when the adsorption syringe 721 is connected to the sliding seat 722 through the connecting rod 724, the elastic force of the elastic member 725 cancels part or all of the gravity of the sliding seat 722, the adsorption syringe 721 and the connecting rod 724.

[0110] Preferably, there are two sets of transfer devices 7. The two sets of transfer devices 7 are arranged at intervals in the first direction and are respectively arranged close to the opposite two edges of the machine table 1. The transfer of the chip a by the two sets of transfer devices 7 improves the transfer efficiency of the chip a and the repair efficiency.

[0111] Specifically, when one transfer device 7 picks up the chip a, the other transfer device 7 is in the state of placing the chip a at the defect position 9a and fixing the chip a. The processing rhythm is optimized and the repair efficiency is improved.

[0112] Referring to Figure 3 and Figure 7 , wherein, the welding device 6 includes a laser 61, and the laser 61 is fixed on the housing 2 through a bracket. The optical path of the emitted light of the laser 61 is arranged obliquely to the plane where the substrate 9 to be repaired is located, so that the emitted light avoids the adsorption syringe 721 and irradiates onto the surface of the chip a.

[0113] Specifically, after the adsorption syringe 721 picks up and transfers the chip a to the defect position 9a, the adsorption syringe 721 presses down the chip a and maintains the chip a in a pressed state. At this time, the welding device 6 heats the chip a in the form of laser, so as to weld and fix the chip a.

[0114] With such a setting, on the one hand, the repair table 42 drives the substrate 9 to be repaired to bring the defect position 9a to the welding position of the welding device 6 in advance. When the chip a is placed at the defect position 9a, the welding and fixing operation can be carried out immediately, and the alignment process between the defect position 9a and the welding device 6 is completed in advance, saving processing time.

[0115] On the other hand, the adsorption syringe 721 presses the chip a tightly at the defect position 9a and maintains the pressed state. At the same time, the welding device 6 uses laser to heat the chip a to melt the soldering flux, so as to fix the chip a. Due to the pressing action of the adsorption syringe 721, the chip a is not easily displaced and has false soldering during the welding and fixing process, ensuring the installation accuracy and fixing quality of the chip a.

[0116] On the third hand, the welding device 6 is in a fixed position, and the light spot generated by the laser emitted by the welding device 6 on the substrate 9 to be repaired remains unchanged. Therefore, as different defect positions 9a move to the welding position of the welding device 6, the light spots generated by the welding device 6 at the defect positions 9a are all the same, ensuring that the energy for heating the chip a each time is the same, and improving the welding consistency. The welding device 6 does not need to move its position, ensuring that the light spot emitted by the welding device 6 onto the substrate 9 to be repaired remains unchanged.

[0117] In the fourth aspect, the optical path of the laser emitted by the welding device 6 is arranged obliquely to the adsorption needle tube 721, avoiding the shielding of the adsorption needle tube 721 and the connecting rod 724, improving the energy uniformity of the light spot irradiated on the chip a, improving the uniformity of heating the chip a, and improving the welding quality.

[0118] Refer to Figure 10 Further, the welding device 6 includes two lasers 61. The two lasers 61 respectively emit lasers to the chip a from opposite sides of the adsorption needle tube 721, and the two light spots formed by the two lasers 61 on the chip a overlap.

[0119] With this arrangement, since the light spot obliquely irradiated on the surface of the chip a is elliptical, and the energy of the part of the light spot close to the laser 61 is slightly stronger. Therefore, two lasers 61 are used to irradiate two overlapping light spots, and the region with stronger energy of one light spot overlaps with the region with weaker energy of the other light spot. Thus, the energy uniformity of the overlapping light spot is better, and the welding quality is ensured.

[0120] Further, the connecting rod 724 is a light-transmitting rod to reduce the shielding of the laser.

[0121] Refer to Figure 11 In other embodiments, the welding device 6 includes a laser 61, a light-transmitting pressing block 62, and a pressing block driving assembly 63. The laser emitted by the laser 61 is vertically directed at the chip a at the defect point 9a. The light-transmitting pressing block 62 is located below the laser 61, and the pressing block driving assembly 63 is installed on the laser 61. The pressing block driving assembly 63 drives the light-transmitting pressing block 62 to extend to the optical path of the laser emitted by the laser 61 and press the light-transmitting pressing block 62 against the chip a.

[0122] Specifically, after the chip a is placed at the defect point 9a by the adsorption needle tube 721, the pressing block driving assembly 63 drives the light-transmitting pressing block 62 to press against the chip a, so that the chip a is pressed against the defect point 9a. The laser emitted by the laser 61 passes through the light-transmitting pressing block 62 and irradiates the surface of the chip a, thereby heating the chip a to weld and fix the chip a.

[0123] With this arrangement, the light-transmitting pressing block 62 is used to press the chip a, and the laser emitted by the laser 61 is directly irradiated on the surface of the chip a, and the energy intensity of the light spot on the surface of the chip a is more uniform, thereby improving the welding quality.

[0124] In this embodiment, the pressing block driving assembly 63 includes two linear modules. One linear module drives the light-transmitting pressing block 62 to move up and down, and the other linear module drives the light-transmitting pressing block 62 to move horizontally, and the two linear modules are combined. In this embodiment, the linear module includes a linear motor or a lead screw mechanism.

[0125] Further, a part of the light-transmitting pressing block 62 is arranged to protrude downward to press the chip a by using the protruding part, so as to avoid interference with other chips a.

[0126] An embodiment of the present application provides a display device repair system. First, the printing device 5 prints flux on the defective point 9a for subsequent welding and fixing of the chip a. The printing method enables better consistency in the arrangement of the flux, and the arrangement is more accurate and efficient. When transferring the chip a, the adsorption component 72 moves above the spare chip a, the adsorption component 72 presses downward and adsorbs the chip a to pick up the chip a, and transfers the chip a to the defective point 9a of the substrate 9 to be repaired. Since the chip a is adsorbed and picked up by the adsorption needle tube 721, the tip size of the adsorption needle tube 721 is small, and it can only be pressed on the surface of the chip a to be picked up. Moreover, the adsorption needle tube 721 can be further lowered to press the chip a, which not only facilitates ensuring the vacuum degree between the chip a and the adsorption needle tube 721, but also ensures that when welding, the chip a is pressed against the defective point 9a by the adsorption needle tube 721, so as to ensure that the chip a is accurately installed at the defective point 9a and ensure the repair quality.

[0127] Further, the defective point 9a to be repaired moves to the welding position of the welding device 6 as the repair table 42 moves, and the adsorption needle tube 721 transfers the chip a to the defective point 9a. After the chip a is transferred to the defective point 9a in this way, welding can be immediately performed. It is convenient to directly press the chip a by the adsorption needle tube 721. When the chip a is welded and fixed, it is not easy to shift, which ensures the fixing quality of the chip a and improves the repair efficiency. In addition, since the position of the welding device 6 does not change, when the defective points 9a are repaired in sequence, the relative positions of the welding device 6 and different defective points 9a on the substrate 9 to be repaired are consistent, which ensures better repair consistency and ensures the repair quality.

[0128] In a second aspect, a display device repair method is provided. Based on the above-mentioned display device repair system, it includes the following steps:

[0129] Use the printing device 5 to print flux on multiple defective points 9a of the substrate 9 to be repaired on the repair table 42 in sequence;

[0130] Use the transfer device 7 to pick up the chip a on the spare substrate 8 and transfer the chip a to the defective point 9a of the substrate 9 to be repaired;

[0131] Press the chip a against the defective point 9a;

[0132] Use the welding device 6 to heat the chip a to weld the chip a at the defective position.

[0133] Another embodiment of the present application provides a method for repairing a display device. Since the method for repairing the display device is based on the display device repair system described above, the beneficial effects of the method for repairing the display device are the same as those of the above display device repair system and will not be elaborated herein.

[0134] In the description of the present application, it should be understood that the positive direction of "X" in the drawings represents the right side, and correspondingly, the reverse direction of "X" represents the left side; the positive direction of "Y" represents the front side, and correspondingly, the reverse direction of "Y" represents the rear side. The orientation or positional relationship indicated by the terms "X", "Y", etc. is based on the orientation or positional relationship shown in the drawings of the specification, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0135] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. Unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0136] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device including the said element.

[0137] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A display device repair system, characterized in that, It includes a machine and the following items arranged on the machine: A feeding device, the feeding device comprising a feeding drive assembly and a feeding table, the feeding table is used to support the spare substrate, and the feeding drive assembly drives the feeding table to translate and rotate in a horizontal plane; A repair device, the repair device comprising a repair drive assembly and a repair table, the repair table is used to support the substrate to be repaired, and the repair drive assembly drives the repair table to translate and rotate in a horizontal plane; A printing device, wherein the repair platform is suitable for carrying the substrate to be repaired to the printing device, and the printing device is suitable for printing soldering flux at defective points of the substrate to be repaired; A welding device, wherein the repair station is suitable for placing the plurality of defective points of the substrate to be repaired at the welding position of the welding device in sequence; The transfer device comprises a transfer drive component and an adsorption component, wherein the adsorption component comprises an adsorption needle tube for adsorbing the chip, and the transfer drive component drives the adsorption component to pick up the chip on the spare substrate and deliver the chip to the defective point at the welding device.

2. The display device repair system according to claim 1, wherein, The printing device comprises: A printing frame, the printing frame is installed on the machine platform; A printing drive assembly, the printing drive assembly is installed on the printing frame; A print head is installed at the driving end of the print drive component, the print head is suitable for printing solder flux at the defect point, and the print drive component drives the print head to move in a vertical direction.

3. The display device repair system according to claim 1, wherein The adsorption assembly also includes: A sliding seat, the sliding seat is lifted and slidably arranged at the driving end of the transfer driving component, and the adsorption needle tube is installed on the sliding seat; A pressure sensor is installed at the driving end of the transfer drive assembly, and the sliding seat is connected to the measuring end of the pressure sensor.

4. The display device repair system according to claim 3, wherein The adsorption assembly further comprises a connecting rod, through which the adsorption needle tube is connected to the sliding seat, and the sliding seat and the adsorption needle tube are respectively located at opposite ends of the connecting rod.

5. The display device repair system according to claim 3 or 4, characterized in that, The adsorption assembly further comprises an elastic member, which connects the adsorption needle tube and the driving end of the transfer driving assembly, and the elastic force of the elastic member offsets part or all of the gravity of the elastic member load component.

6. The display device repair system according to claim 1 or 4, characterized in that, The welding device comprises a laser, and the optical path of the emitted light of the laser is arranged obliquely to the plane where the substrate to be repaired is located, so that the emitted light avoids the adsorption needle tube and irradiates the chip surface.

7. The display device repair system according to claim 6, wherein, The welding device comprises two lasers, which respectively emit lasers from opposite sides of the adsorption needle tube to the chip, and two light spots formed by the two lasers on the chip overlap.

8. The display device repair system according to claim 1 or 4, characterized in that, The welding device comprises: A laser, wherein the laser emitted by the laser is vertically directed toward the chip at the defect point; A light-transmitting pressing block, the light-transmitting pressing block is located below the laser; A pressing block driving component is installed on the laser, and the pressing block driving component drives the light-transmitting pressing block to extend to the optical path of the laser emitted by the laser, and presses the light-transmitting pressing block against the chip.

9. The display device repair system according to claim 1, wherein A plurality of positioning pins are arranged on the bearing surface of the feeding table, and the circumferential side surface of the spare substrate is adapted to abut against the positioning pins.

10. A method for repairing a display device, characterized in that, Based on the display device repair system according to any one of claims 1 to 9, comprising the following steps: Using a printing device to sequentially print flux on a plurality of defective points of the substrate to be repaired on the repair table; Using a transfer device to pick up the chips on the spare substrate and transfer the chips to the defective points of the substrate to be repaired; Press the chip tightly against the defective point; Using a welding device to heat the chip to weld the chip at the defective position.

Images