Display panel and preparation method thereof, display device and tiled display device

Abstract

The embodiment of the invention provides a display panel and a preparation method thereof, a display device and a tiled display device, relates to the technical field of display, and is used for improving the product yield and reliability. The display panel comprises a display substrate, a plurality of binding electrodes, a bearing substrate, a plurality of wires, a partition structure and a connecting layer. The display panel is provided with a display surface, a non-display surface and a plurality of side surfaces; the display surface is provided with a first binding area; the plurality of binding electrodes are arranged in the first binding area at intervals; the bearing substrate is attached to the non-display surface, and a second binding area is arranged on the bearing substrate; the plurality of wires are arranged on the bearing surface at intervals; one end of each wire extends into the second binding area; the partition structure covers a part of the plurality of wires; the partition structure is provided with a plurality of partition grooves; the connection layer includes a redundant portion and a plurality of connection lines. The display panel is used for displaying.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the same, a display device, and a tiled display device. Background Art

[0002] Currently, in the application of LEDs (Light-Emitting Diodes), large-sized LED display panels are formed by tiling small screens. Summary of the Invention

[0003] On the one hand, a display panel is provided. The display panel includes a display substrate, a plurality of bonding electrodes, a carrier substrate, a plurality of wires, a partition structure, and a connection layer. The display substrate has an opposite display surface, a non-display surface, and a plurality of side surfaces connecting the display surface and the non-display surface, wherein at least one side surface is a selected side surface. The display surface has a first bonding area adjacent to the selected side surface. The plurality of bonding electrodes are arranged at intervals in sequence in the first bonding area along a first direction. The first direction is parallel to the selected side surface adjacent to the first bonding area. The carrier substrate is attached to the non-display surface. One side surface of the carrier substrate away from the display substrate is a carrier surface, and the carrier surface has a second bonding area adjacent to the selected side surface. The plurality of wires are arranged at intervals in sequence on the carrier surface along the first direction. One end of each of the plurality of wires extends into the second bonding area. The partition structure is located on the carrier surface and covers a part of the plurality of wires. A plurality of partition slots are formed in a part of the partition structure extending into the second bonding area, and the plurality of partition slots respectively expose one end of each of the plurality of wires extending into the second bonding area. The orthographic projection of the top end of each partition slot on the carrier surface is within the orthographic projection range of the bottom wall of the partition slot on the carrier surface. The connection layer includes a redundant portion and a plurality of connection lines. The redundant portion covers a part of the partition structure extending into the second bonding area. Each connection line includes a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence. The first sub-portion is located in the first bonding area and is in contact with one bonding electrode. The second sub-portion is located on the selected side surface. The third sub-portion is located in the partition slot and is in contact with the wire. The partition slot separates the redundant portion and the wire.

[0004] In some embodiments, the partition structure is integrally formed.

[0005] In some embodiments, the cross-sectional shape of the partition slot includes a regular trapezoid; the cross-section is parallel to the selected side surface.

[0006] In some embodiments, the material of the partition structure includes a negative photoresist.

[0007] In some embodiments, the bearing surface further has a third bonding region, which is spaced apart from the second bonding region. A plurality of first openings are formed in a portion of the partition structure located in the third bonding region, and the plurality of first openings respectively expose portions of the plurality of wires located in the third bonding region to serve as a plurality of bonding pins. The display panel further includes: a circuit board electrically connected to the plurality of bonding pins.

[0008] In some embodiments, the cross-sectional shape of the plurality of first openings is the same as the cross-sectional shape of the partition groove.

[0009] In some embodiments, the partition structure includes a support layer and a partition layer, and the partition layer is located on a side of the support layer away from the bearing surface. The orthographic projection of the portion of the support layer extending into the second bonding region on the bearing surface is within the orthographic projection range of the portion of the partition layer extending into the second bonding region on the bearing surface.

[0010] In some embodiments, the cross-sectional shape of the partition groove includes an inverted T shape. The cross-section is parallel to the selected side surface.

[0011] In some embodiments, the material of the support layer includes positive photoresist. And / or, the material of the partition layer includes an inorganic material.

[0012] In some embodiments, the bearing surface further has a third bonding region, which is spaced apart from the second bonding region. The support layer is located outside the third bonding region, and a plurality of second openings are formed in a portion of the partition layer located in the third bonding region, and the plurality of second openings respectively expose portions of the plurality of wires located in the third bonding region to serve as a plurality of bonding pins. The display panel further includes: a circuit board electrically connected to the plurality of bonding pins.

[0013] In some embodiments, a side surface of the bearing substrate covering the second sub-part is flush with the selected side surface.

[0014] On the other hand, a display device is provided, including the display panel provided in any one of the above embodiments.

[0015] On another aspect, a tiled display device is provided, including the display device provided in any one of the above embodiments.

[0016] In another aspect, a method for manufacturing a display panel is provided, including: providing a display substrate; the display substrate has opposite display surface, non-display surface, and a plurality of side surfaces connecting the display surface and the non-display surface, wherein at least one side surface is a selected side surface; the display surface has a first bonding region near the selected side surface. Forming a plurality of bonding electrodes in the first bonding region; the plurality of bonding electrodes are arranged at intervals in a first direction in sequence, and the first direction is parallel to the selected side surface near the first bonding region. Providing a carrier substrate; the carrier substrate has a carrier surface, and the carrier surface has a second bonding region. Forming a plurality of conducting wires on the carrier surface; the plurality of conducting wires are arranged at intervals in the first direction on the carrier surface in sequence, and one end of the plurality of conducting wires extends into the second bonding region. Forming a partition structure covering a part of the plurality of conducting wires on the carrier surface; a plurality of partition grooves are formed in the part of the partition structure extending into the second bonding region, and the plurality of partition grooves respectively expose one end of the plurality of conducting wires extending into the second bonding region; the positive projection of the top end of each partition groove on the carrier surface is located within the positive projection range of the bottom wall of the partition groove on the carrier surface. Attaching the carrier substrate to the non-display surface. Forming a connection layer; the connection layer includes a redundant portion and a plurality of connection lines; the redundant portion covers the part of the partition structure extending into the second bonding region; each connection line includes a first sub-portion, a second sub-portion, and a third sub-portion connected in sequence, the first sub-portion is located in the first bonding region and is in contact with a bonding electrode, the second sub-portion is located on the selected side surface, and the third sub-portion is located in the partition groove and is in contact with the conducting wire; the partition groove separates the redundant portion and the conducting wire.

[0017] In some embodiments, forming the partition structure covering a part of the plurality of conducting wires on the carrier surface includes: forming a first partition film on the carrier surface; the partition film covers a part of the plurality of conducting wires, and a part of the partition film extends into the second bonding region. Etching the part of the first partition film extending into the second bonding region to form the partition grooves.

[0018] In some embodiments, the material of the first partition film includes a negative photoresist. The etching of the part of the first partition film extending into the second bonding region includes: disposing a first mask plate on the first partition film; the first mask plate has a plurality of third openings located in the second bonding region, and the plurality of third openings at least expose the part of the partition film between adjacent two conducting wires. Based on the first mask plate, the part of the first partition film extending into the second bonding region and located between adjacent two conducting wires is exposed, developed, and removed to form the plurality of partition grooves.

[0019] In some embodiments, the bearing surface further has a third bonding region, which is spaced apart from the second bonding region; during the process of etching the portion of the first partition film extending into the second bonding region, the portion of the first partition film located in the third bonding region is also etched to form a plurality of first openings; the plurality of first openings respectively expose the portions of the plurality of wires located in the third bonding region to serve as a plurality of bonding pins.

[0020] In some embodiments, forming a partition structure on the bearing surface to cover a portion of the plurality of wires includes: forming a second partition film on the bearing surface; the second partition film covers a portion of the plurality of wires, and a portion of the second partition film extends into the second bonding region. Etch the portion of the second partition film extending into the second bonding region to expose one end of the plurality of wires extending into the second bonding region. Form a third partition film covering the second partition film and the plurality of wires. Etch the portion of the third partition film extending into the second bonding region to expose one end of the plurality of wires extending into the second bonding region. Based on the etched third partition film, etch the second partition film to form the partition groove.

[0021] In some embodiments, the bearing surface further has a third bonding region, which is spaced apart from the second bonding region; the second partition film is located outside the second bonding region. During the process of etching the portion of the third partition film extending into the second bonding region, the portion of the third partition film located in the third bonding region is also etched to form a plurality of second openings; the plurality of second openings respectively expose the portions of the plurality of wires located in the third bonding region to serve as a plurality of bonding pins.

[0022] In some embodiments, forming the connection layer includes: forming a connection film in the first bonding region, on the selected side surface, and in the second bonding region; the portion of the connection film located in the second bonding region is partitioned by the plurality of partition grooves to form the redundant portion and a plurality of the third sub-portions. Using a laser etching process, etch the portion of the connection film located on the selected side surface and in the first bonding region to form the second sub-portion and the first sub-portion that are sequentially connected to each of the third sub-portions, and obtain a plurality of the connection lines. Description of the Drawings

[0023] To more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products involved in the embodiments of the present disclosure, the actual processes of the methods, etc.

[0024] Figure 1 Is a top view of a display panel according to some embodiments;

[0025] Figure 2 Is Figure 1 A cross-sectional view of the display panel shown in along the second direction;

[0026] Figure 3 Is Figure 1 A bottom view of the display panel shown in;

[0027] Figure 4 Is a cross-sectional view of a display panel along the second direction according to some embodiments;

[0028] Figure 5 Is a side view of a display panel according to some embodiments;

[0029] Figure 6 Is a cross-sectional view of a display panel along the first direction according to some embodiments;

[0030] Figure 7 Is a bottom view of a display panel according to some embodiments;

[0031] Figure 8 Is a cross-sectional view of another display panel along the second direction according to some embodiments;

[0032] Figure 9 Is a side view of another display panel according to some embodiments;

[0033] Figure 10 Is a cross-sectional view of another display panel along the first direction according to some embodiments;

[0034] Figure 11 Is a bottom view of another display panel according to some embodiments;

[0035] Figure 12 Is a structural diagram of a display panel according to some embodiments;

[0036] Figure 13 Is a structural diagram of a tiled display device according to some embodiments;

[0037] Figure 14 Flow chart of a method for manufacturing a display panel according to some embodiments;

[0038] Figures 15a to 15l Structural diagrams corresponding to some steps of a method for manufacturing a display panel according to some embodiments;

[0039] Figures 16a to 16b Structural diagrams corresponding to some other steps of a method for manufacturing a display panel according to some embodiments;

[0040] Figures 17a to 17b Structural diagrams corresponding to some further steps of a method for manufacturing a display panel according to some embodiments;

[0041] Figures 18a to 18h Structural diagrams corresponding to some further steps of a method for manufacturing a display panel according to some embodiments. Detailed implementation manners

[0042] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art fall within the scope of protection of the present disclosure.

[0043] Unless otherwise required by the context, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example", or "some examples", etc. are intended to indicate that the specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0044] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more.

[0045] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components have direct physical contact or electrical contact. The term "coupled" or "communicatively coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0046] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0047] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B. The use of "suitable for" or "configured to" herein means open and inclusive language, which does not exclude devices suitable for or configured to perform additional tasks or steps.

[0048] In addition, the use of "based on" means open and inclusive because a process, step, calculation, or other action "based on" one or more of the said conditions or values may, in practice, be based on additional conditions or values beyond the said ones.

[0049] As used herein, "parallel", "perpendicular", and "equal" include the stated situations as well as situations similar to the stated situations, where the range of the similar situations is within an acceptable deviation range, and the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within a deviation of 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within a deviation of 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal values is less than or equal to 5% of either one of them.

[0050] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there can also be an intermediate layer between the layer or element and the other layer or substrate.

[0051] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of the regions are enlarged for clarity. Thus, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances can be envisioned. Therefore, the exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations caused by, for example, manufacturing. For example, an etched region shown as rectangular will typically have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0052] To improve product reliability, reduce transportation costs, and reduce maintenance costs, large-size display devices can be assembled by splicing multiple small-size display devices.

[0053] To avoid the sense of display screen fragmentation caused by splicing, it is necessary to reduce the border size of a single small-size display device and reduce the seam width. The small-size display device includes a display panel. For example, the wiring on one side of the display surface of the display panel can be connected to a circuit board (such as a flexible circuit board) provided on the non-display surface side of the display panel through side wiring. Thus, when multiple small-size display devices are spliced to form a larger-size large-size display device, the spacing between adjacent small-size display devices can be smaller, thereby improving the display quality of the large-size display device formed by splicing multiple small-size display devices.

[0054] Figure 1 The top view structure of a display panel 10 is schematically shown. Figure 2Schematically shows a cross-sectional structure of a display panel 10, Figure 3 Schematically shows a bottom view structure of a display panel 10.

[0055] As Figure 1 and Figure 2 shown, the display panel 10 includes a display substrate 1. The display substrate 1 has a display surface 1a, a non-display surface 1b, and a plurality of side surfaces 1c. The display surface 1a and the non-display surface 1b are oppositely arranged. The plurality of side surfaces 1c are sequentially connected end to end and are located between the display surface 1a and the non-display surface 1b, connecting the display surface 1a and the non-display surface 1b together. Among them, the display surface 1a refers to the side surface of the display substrate 1 for image display.

[0056] As Figure 1 and Figure 2 shown, the above-mentioned display substrate 1 has a display area AA. The display substrate 1 includes: a backplane 11 and a plurality of light-emitting devices 12 located on the backplane 11. Among them, the backplane 11 includes a driving circuit layer 111 located in the display area AA. The plurality of light-emitting devices 12 are located in the display area AA and on the driving circuit layer 111 and are electrically connected to the driving circuit layer 111. The driving circuit layer 111 is used to transmit electrical signals and generate driving signals to the plurality of light-emitting devices 12 to drive the plurality of light-emitting devices 12 to emit light, thereby realizing image display. For example, the light-emitting device 12 can be an LED, a Mini LED (Mini Light Emitting Diode Display), or a Micro LED (Micro Light Emitting Diode).

[0057] As Figure 1 shown, at least one of the plurality of side surfaces 1c is a selected side surface 1c1. Optionally, the number of the selected side surfaces 1c1 can be one, two, three, or even more. The display substrate 1 further has a first bonding area B1, and the first bonding area B1 is located on one side of the display area AA close to the selected side surface 1c1. Among them, the first bonding area B1 is arranged in one-to-one correspondence with the selected side surface 1c1, that is, the number of the first bonding area B1 is equal to the number of the selected side surfaces 1c1, and a first bonding area B1 is provided at each selected side surface 1c1. Figure 1 Taking the number of the selected side surface 1c1 and the first bonding area B1 both being one as an example for illustration.

[0058] As Figure 1 and Figure 2As shown, the above-mentioned display panel 10 further includes a plurality of bonding electrodes 2, which are arranged at intervals along the first direction X in the first bonding area B1. Each of the bonding electrodes 2 extends, for example, in a direction perpendicular to the first direction X (i.e., the second direction Y). Among them, the first direction X is parallel to the selected side surface 1c1 close to the first bonding area B1. For example, the plurality of bonding electrodes 2 are electrically connected to the corresponding signal lines in the above-mentioned driving circuit layer 111 to transmit electrical signals to the corresponding signal lines. Of course, the plurality of bonding electrodes 2 and the corresponding signal lines can be of an integral structure, that is, the signal lines in the above-mentioned driving circuit layer 111 can extend into the first bonding area B1, and the part extending into the first bonding area B1 can form the plurality of bonding electrodes 2.

[0059] As Figure 2 and Figure 3 shown, the above-mentioned display panel 10 further includes a plurality of conductive lines 3 located on the non-display surface 1b. The plurality of conductive lines 3 are arranged at intervals in sequence along the first direction X on the non-display surface 1b. Each of the conductive lines 3 extends, for example, in a direction perpendicular to the first direction X, and one end of each conductive line 3 extends to the position where the selected side surface 1c1 is located. The conductive lines 3 are used to bond the circuit board 7 to receive electrical signals from the circuit board 7.

[0060] As Figure 1 , Figure 2 and Figure 3 shown, the above-mentioned display panel 10 further includes a plurality of connection lines 4. The number of the plurality of connection lines 4, the number of the plurality of conductive lines 3, and the number of the plurality of bonding electrodes 2 are, for example, equal, and the connection lines 4, the conductive lines 3, and the bonding electrodes 2 are, for example, arranged in one-to-one correspondence. Each connection line 4 includes a first sub-part 41, a second sub-part 42, and a third sub-part 43 connected in sequence. The first sub-part 41 is located on the display surface 1a and within the first bonding area B1, and is in contact with a corresponding bonding electrode 2 to form an electrical connection; the second sub-part 42 is located on the selected side surface 1c1; the third sub-part 43 is located on the non-display surface 1b and is in contact with the corresponding conductive line 3 to form an electrical connection. In this way, the electrical signals of the circuit board can be transmitted to the corresponding signal lines in the driving circuit layer 111 through the conductive lines 3, the connection lines 4, and the bonding electrodes 2 in sequence.

[0061] In the related art, there are mainly two ways to prepare and form the above-mentioned conductive lines 3 and connection lines 4:

[0062] In a first possible implementation, after fabricating the above-mentioned driving circuit layer 111 and multiple conductive lines 3, a metal thin film is formed within the first bonding region B1, on the selected side surface 1c1, and on the multiple conductive lines 3. Then, the metal thin film is etched using a laser etching process to obtain multiple connection lines 4. However, this can easily scratch the patterns in the driving circuit layer 111; moreover, during the fabrication of the multiple conductive lines 3, the patterns in the driving circuit layer 111 can easily contaminate the related equipment, increasing the risk of maintenance or downtime of the related equipment and raising the cost.

[0063] In a second possible implementation, after fabricating the above-mentioned driving circuit layer 111, a metal thin film is formed within the first bonding region B1, on the selected side surface 1c1, and on the non-display surface 1b, as Figure 2 shown. Then, the metal thin film is etched through a laser etching process to obtain the multiple connection lines 4 and the multiple conductive lines 3. However, the area of the part of the metal thin film located on the non-display surface 1b is relatively large. Thus, during the process of laser etching the metal thin film to form the third sub-part 43 of the connection line 4 and the conductive line 3, the laser may penetrate the backplane 11 and enter the display area AA of the display surface 1a. As Figure 2 shown, the laser irradiates the display substrate 1 in the Laser direction shown in the figure. Since there is an overlap between the region corresponding to the third sub-part 43 of the connection line 4 and the conductive line 3 and the display area AA, part of the energy of the laser will pass through the backplane 11 to reach the display area AA and damage the driving circuit layer 111 and components in this area, reducing the yield and reliability of the display panel 10.

[0064] Based on this, the display panels provided by some embodiments of the present disclosure. Figure 4 Schematically shows a cross-sectional structure of a display panel 10, Figure 5 Schematically shows a side view structure of another display panel 10, Figure 6 Schematically shows a cross-sectional structure of a display panel 10, Figure 7 Schematically shows a bottom view structure of a display panel 10. Among them, Figure 7 For clearly schematically showing each structure, the redundant part 4aa is omitted.

[0065] As Figure 4 、 Figure 5 、 Figure 6 and Figure 7 shown, the display panel 10 further includes a carrier substrate 5, a partition structure 6, and a connection layer 4a.

[0066] The material of the above-mentioned carrier substrate 5 includes but is not limited to polyimide (PI for short), glass, etc. As Figures 4 to 7As shown, the carrier substrate 5 is attached to the non-display surface 1b of the display substrate 1. The carrier substrate 5 and the non-display surface 1b are bonded together by an adhesive, for example, an adhesive that is resistant to high temperatures, easily curable, and firmly adheres. The area of the carrier substrate 5 is smaller than the area of the display substrate 1 described above.

[0067] One side surface of the carrier substrate 5 away from the display substrate 1 is the carrier surface 51. The plurality of wires 3 are located on the carrier surface 51. For example, the carrier substrate 5 has a plate-like structure. Alternatively, the carrier substrate 5 includes a plurality of strip-shaped sub-parts arranged at intervals, and at least one wire is provided on each strip-shaped sub-part.

[0068] That is to say, in the embodiment of the present disclosure, the plurality of wires 3 are separately formed on the carrier surface 51 of the carrier substrate 5, rather than on the non-display surface 1b of the display substrate 1. In this way, during the process of forming the display panel 10, the plurality of wires 3 can be first formed on the carrier surface 51 of the carrier substrate 5, and then the carrier substrate 5 formed with the plurality of wires 3 is bonded to the non-display surface 1b of the display substrate 1.

[0069] Among them, as Figure 4 and Figure 7 shown, the carrier surface 51 has a second bonding region B2 close to the selected side surface 1c1. Among the plurality of wires 3 located on the carrier surface 51, one end of each wire 3 extends into the second bonding region B2, and the remaining part is located outside the second bonding region B2. Among them, one end of each wire 3 that extends into the second bonding region B2 can also be called the first bonding end.

[0070] Figure 7 Schematically shows an arrangement manner of the wires 3. For example, as Figure 7 shown, each wire 3 is linear. Of course, each wire 3 is in a zigzag shape; along the direction perpendicular to the first direction X and away from the selected side surface 1c1, the size of the region occupied by the plurality of wires 3 gradually decreases.

[0071] As Figures 4 to 7 shown, the partition structure 6 is located on the carrier surface 51 and covers a part of the plurality of wires 3. For example, a part of the partition structure 6 is located between any two adjacent wires 3 to achieve electrical insulation between the two adjacent wires 3; another part of the partition structure 6 is located on the side of each wire 3 away from the carrier substrate 5 to form a covering and protection for a part of each wire 3.

[0072] Exemplarily, as Figure 4 and Figure 7As shown, the partition structure 6 exposes the portions of the respective wires 3 extending into the second bonding region B2. Specifically, the portion of the partition structure 6 extending into the second bonding region B2 is provided with a plurality of partition grooves 61, and the plurality of partition grooves 61 respectively expose one end of each of the above-mentioned plurality of wires 3 extending into the second bonding region B2. For example, the plurality of partition grooves 61 all extend in a direction perpendicular to the first direction X, and are provided in one-to-one correspondence with the plurality of wires 3, and one partition groove 61 exposes one end of one wire 3 extending into the second bonding region B2. This facilitates the connection of the end of the wire 3 extending into the second bonding region B2 to the third sub-portion 43 of the connection line 4.

[0073] As Figure 4 , Figure 5 and Figure 6 shown, the orthographic projection of the top end of each partition groove 61 on the bearing surface 51 is located within the orthographic projection range of the bottom wall of the partition groove 61 on the bearing surface 51. That is to say, the area of the notch of each partition groove 61 is smaller than the area of the bottom wall of the partition groove 61.

[0074] In other words, as Figure 6 and Figure 7 shown, the portion of the partition structure 6 extending into the second bonding region B2 includes a plurality of partition portions 62 arranged at intervals, and the partial area between two adjacent partition portions 62 constitutes the above-mentioned partition groove 61. The area of the surface (which can also be called the top surface) of each partition portion 62 away from the bearing substrate 5 is larger than the area of the surface (which can also be called the bottom surface) of the partition portion 62 close to the bearing substrate 5. The top surface of the partition portion 62 protrudes from its bottom surface. As Figure 5 and Figure 6 shown, in the first direction X, the connection line between the top surface and the bottom surface of the partition portion 62 forms an acute angle with the bearing surface 51; as Figure 4 shown, in the second direction Y, the connection line between the top surface and the bottom surface of the partition portion 62 also forms an acute angle with the bearing surface 51. The second direction Y is perpendicular to the first direction X, for example.

[0075] As Figure 4 and Figure 5 shown, the above-mentioned connection layer 4a includes a redundant portion 4aa and a plurality of connection lines 4. The redundant portion 4aa covers the portion of the partition structure 6 extending into the second bonding region B2. Specifically, in combination with Figure 4 and Figure 7 , in the second bonding region B2, the redundant portion 4aa covers the top surfaces of the above-mentioned plurality of partition portions 62. The third sub-portion 43 of the connection line 4 is located within the partition groove 61 and is in contact with the wire 3 exposed by the partition groove 61. That is to say, the above-mentioned plurality of partition grooves 61 or the plurality of partition portions 62 can partition the portion of the connection layer 4a located within the second bonding region B2.

[0076] Furthermore, as Figure 4As shown, in the second direction Y, the partition portion 62 can also partition the third sub-portion 43 of the connection line 4 from the portion of the connection layer 4a located outside the second binding region B2.

[0077] In the process of manufacturing the above-mentioned multiple connection lines 4, the partial metal thin film within the second binding region B2 can be naturally partitioned by the above-mentioned multiple partition grooves 61 or multiple partition portions 62 into separated redundant portions 4aa and the third sub-portion 43 of the multiple connection lines 4, without the need to use a laser etching process to etch the partial metal thin film within the second binding region B2.

[0078] Thus, for the display panel 10 provided by some embodiments of the present disclosure, by attaching and disposing a carrier substrate 5 with multiple conductive lines 3 on the non-display surface 1b of the display substrate 1, and disposing a partition structure 6 with multiple partition grooves 61 on the carrier substrate 5, the partition function of the partition grooves 61 can be utilized to partition the portion of the connection layer 4a within the second binding region B2, such that the third sub-portion 43 of the multiple connection lines 4 in contact with the multiple conductive lines 3 in the connection layer 4a can naturally fall into the multiple partition grooves 61 respectively, make electrical contact with the corresponding conductive lines 3, and prevent adjacent two connection lines 4 from contacting each other to cause a short circuit, thereby ensuring that the multiple connection lines 4 can normally connect the multiple binding electrodes 2 and the multiple conductive lines 3.

[0079] Due to the partition function of the above-mentioned partition structure 6 on the connection layer 4a, in the process of manufacturing and forming the above-mentioned display panel, only the partial connection layer 4a on the selected side surface 1c1 needs to be laser-etched, avoiding laser etching of the portion of the connection layer 4a within the second binding region B2, and thus avoiding partial energy of the laser from passing through the non-display surface 1b of the display substrate 1 to damage or even destroy the driving circuit layer 111 and devices of the display substrate 1, improving the product yield and reliability.

[0080] In some embodiments, as Figure 8 shown, the side surface of the above-mentioned carrier substrate 5 covering the above-mentioned second sub-portion 42 is flush with the above-mentioned selected side surface 1c1. That is to say, along the direction perpendicular to the carrier surface 51, the side surface of the carrier substrate 5 covering the second sub-portion 42 and the selected side surface 1c1 are in the same plane and there is no misalignment between them.

[0081] Adopting such a setting method facilitates the formation of the connection layer 4a on the selected side surface 1c1 and the side surface of the carrier substrate 5, is beneficial to improving the continuity and structural stability of the second sub-portion 42 of the connection line 4, and avoids the disconnection of the second sub-portion 42 of the connection line 4.

[0082] The structure of the above partition structure 6 can include various types and can be selected and set according to actual needs, as long as it can play a role in partitioning the connection layer 4a. The following will schematically illustrate two structures of the partition structure 6 in conjunction with the accompanying drawings.

[0083] In a possible embodiment, as Figures 4 to 7 shown, the above partition structure 6 is integrally formed.

[0084] Exemplarily, the partition structure 6 is composed of a single-layer film. In the process of forming the partition structure 6, it can be etched and completed in one process step.

[0085] By setting the partition structure 6 as an integrally formed structure, the structure of the partition structure 6 can be simplified, the manufacturing process of the partition structure 6 can be simplified, and the cost of the display panel 10 can be reduced.

[0086] In some embodiments, the material of the above partition structure 6 includes negative photoresist. The characteristic of negative photoresist is that it will undergo a photocuring reaction after exposure.

[0087] In this way, in the process of manufacturing the partition structure 6, the partition structure 6 can be formed only by exposure and development, without the need for additional etching processes, which is convenient for operation, simplifies the process steps, and is beneficial to cost reduction.

[0088] In some embodiments, as Figure 6 shown, the cross-sectional shape of the above partition groove 61 includes a regular trapezoid, and this cross-section is parallel to the above selected side surface 1c1. Correspondingly, the interface shape of the above partition portion 62 includes an inverted trapezoid or a shape similar to an inverted trapezoid. Here, a shape similar to an inverted trapezoid means that its own vertex angle is a rounded corner or similar to a rounded corner, or its side is not a strictly straight line.

[0089] By setting the structure of the partition groove 61 in the above manner, it can be ensured that the partition groove 61 has a good partitioning effect on the connection layer 4a. In this way, in the process of forming the connection layer 4a, it can be avoided that the redundant portion 4aa of the connection layer 4a and the connection line 4 are connected to the side wall of the partition groove 61, and further, it can be avoided that the connection line 4 contacts the redundant portion 4aa and causes a short circuit, thereby improving the reliability of the display panel 10.

[0090] In some embodiments, as Figure 4 and Figure 7 shown, the above bearing surface 51 further has a third bonding area B3, and the third bonding area B3 is arranged at an interval from the above second bonding area B2. That is to say, compared with the second bonding area B2, the third bonding area B3 is farther away from the above selected side surface 1c1.

[0091] In the above partition structure 6, a plurality of first openings K1 are formed in the portion located in the third bonding region B3. The plurality of first openings K1 extend in a direction perpendicular to the first direction X (i.e., the second direction Y), and are spaced along the first direction X. The plurality of first openings K1 respectively expose the portions of the plurality of wires 3 located in the third bonding region B3 to serve as a plurality of bonding pins 31. That is to say, the plurality of first openings K1 are arranged in one-to-one correspondence with the portions of the plurality of wires 3 located in the third bonding region B3. The orthographic projection of the first opening K1 on the bearing surface 51 at least partially overlaps with the orthographic projection of the corresponding portion of the wire 3 located in the third bonding region B3 on the bearing surface 51.

[0092] Exemplarily, as Figure 4 and Figure 7 shown, the display panel 10 further includes: a circuit board 7 electrically connected to the plurality of bonding pins 31. The circuit board 7 is, for example, a flexible circuit board.

[0093] By providing a third bonding region B3 spaced from the second bonding region B2 on the bearing surface 51 and arranging the portion of the partition structure 6 located in the third bonding region B3 according to the above structure, the portions of the plurality of wires 3 located in the third bonding region B3 can be exposed to serve as bonding pins 31 for connecting the circuit board 7. In this way, the circuit board 7 can be connected to the plurality of wires 3 through the bonding pins 31. Since the portions of the plurality of wires 3 in the second bonding region B2 are connected to the plurality of bonding electrodes 2 in the first bonding region B1 through the connection layer 4a, the circuit board 7 is thus connected to the plurality of bonding electrodes 2 in the first bonding B1 through the plurality of wires 3, and further can transmit electrical signals to the driving circuit layer 111 of the display substrate 1, so that the above display panel 10 realizes image display.

[0094] In some embodiments, in combination with Figure 4 、 Figure 5 、 Figure 7 , the cross-sectional shape of the plurality of first openings K1 is the same as the cross-sectional shape of the partition groove 61, where the cross-section is parallel to the selected side surface 1c1. That is to say, when the cross-sectional shape of the partition groove 61 is a regular trapezoid, the cross-sectional shape of the plurality of first openings K1 is also a regular trapezoid.

[0095] In this way, during the process of preparing and forming the partition groove 61, the plurality of first openings K1 can be synchronously prepared and formed, which is beneficial to reducing process steps and improving production efficiency.

[0096] In another possible embodiment, the partition structure 6 is composed of multiple layers of thin films stacked.

[0097] Such as Figure 8 、 Figure 9 、 Figure 10 and Figure 11As shown, the partition structure 6 includes a support layer 63 and a partition layer 64. The partition layer 64 is located on the side of the support layer 63 away from the bearing surface 51. That is to say, the support layer 63 is located between the bearing surface 51 and the partition layer 64, and the partition layer 64 covers the support layer 63.

[0098] Exemplarily, the thickness of the support layer 63 is greater than the thickness of the wire 3. The partition layer 64 is arranged at an interval from the wire 3, and the two are not in direct contact.

[0099] Furthermore, in combination with Figure 8 , Figure 9 , Figure 11 , the orthographic projection of the part of the support layer 63 extending into the second bonding area B2 on the bearing surface 51 is within the range of the orthographic projection of the part of the partition layer 64 extending into the second bonding area B2 on the bearing surface 51. That is to say, the area of the orthographic projection of the part of the support layer 63 extending into the second bonding area B2 on the bearing surface 51 is smaller than the area of the orthographic projection of the part of the partition layer 64 extending into the second bonding area B2 on the bearing surface 51. The partition layer 64 protrudes from the side surface of the support layer 63 away from the bearing substrate 5.

[0100] By setting in the above manner, the partition layer 64 can be made more prominent than the support layer 63, which can improve the partitioning effect of the partition structure 6. During the formation of the connection layer 4a on the partition structure 6 in the second bonding area B2, it is possible to prevent the redundant part 4aa of the connection layer 4a and the multiple connection lines 4 from forming a connection on the side wall of the support layer 63, thereby avoiding a short circuit between the multiple connection lines 4.

[0101] In some embodiments, as Figure 10 shown, the cross-sectional shape of the partition groove 61 includes an inverted T shape. This cross-section is parallel to the selected side surface 1c1. Specifically, in the cross-sectional pattern of the partition groove 61, the distance between the partial partition layers 64 on both sides of the partition groove 61 is smaller than the distance between the partial support layers 63 on both sides of the partition groove 61. At this time, the cross-sectional shape of the partition groove 61 also resembles a "convex" shape. The cross-sectional shape of the partition portion 62 includes a T shape.

[0102] By setting the partition groove 61 according to the above structure, it is possible to further prevent the redundant part 4aa in the connection layer 4a and the connection lines 4 located in the partition groove 61 from being connected to the side wall of the partition groove 61, thereby avoiding a short circuit between multiple connection lines 4.

[0103] In some embodiments, the material of the support layer 63 includes a positive photoresist. The characteristic of the positive photoresist is that after exposure, the exposed positive photoresist will dissolve. Optionally, the material of the partition layer 64 is an inorganic material, such as silicon nitride for example.

[0104] By setting the material of the support layer 63 as a positive photoresist, when manufacturing the support layer 63, the required shape structure can be formed only through exposure and development, and the process steps are simple. By setting the material of the isolation layer 64 as an inorganic material, the material for manufacturing the isolation layer 64 is easily obtained, saving the manufacturing cost.

[0105] In the case where the above-mentioned partition structure 6 includes a support layer 63 and an isolation layer 64, as Figure 8 and Figure 11 shown, the above-mentioned bearing surface 51 further has a third bonding area B3. The third bonding area B3 here is also arranged at intervals from the above-mentioned second bonding area B2. Compared with the second bonding area B2, the third bonding area B3 is farther away from the above-mentioned selected side surface 1c1.

[0106] Furthermore, as Figure 8 and Figure 11 shown, the support layer 63 is located outside the third bonding area B3, that is to say, the support layer 63 is located within the second bonding area B2 and in a partial area between the second bonding area B2 and the third bonding area B3. A plurality of second openings K2 are provided in the part of the isolation layer 64 located within the third bonding area B3. The plurality of first openings K2 extend in a direction perpendicular to the above-mentioned first direction X (i.e., the second direction Y) and are arranged at intervals along the first direction X. The plurality of second openings K2 respectively expose the parts of the above-mentioned plurality of wires 3 located within the third bonding area B3 to serve as a plurality of bonding pins 31. That is to say, the plurality of second openings K2 are arranged in one-to-one correspondence with the parts of the plurality of wires 3 located in the third bonding area B3, and the orthographic projection of the plurality of second openings K2 on the bearing surface 51 at least partially overlaps with the orthographic projection of the parts of the plurality of wires 3 located in the third bonding area B3 on the bearing surface 51.

[0107] Exemplarily, in combination with Figure 8 , Figure 11 , the above-mentioned display panel 10 further includes: a circuit board 7 electrically connected to the above-mentioned plurality of bonding pins 31. The circuit board 7 is, for example, a flexible circuit board.

[0108] By providing a third bonding region B3 spaced apart from the second bonding region B2 on the bearing surface 51 and arranging the support layer 63 and the isolation layer 64 according to the above structure, a part of the plurality of wires 3 located within the third bonding region B3 can be exposed as bonding pins 31 for connecting the circuit board 7. In this way, the circuit board 7 can be connected to the plurality of wires 3 through the bonding pins 31. Since the part of the plurality of wires 3 within the second bonding region B2 is connected to the plurality of bonding electrodes 2 within the first bonding region B1 through the connection layer 4a, the circuit board 7 is thus connected to the plurality of bonding electrodes 2 within the first bonding B1 through the plurality of wires 3, and can further transmit electrical signals to the driving circuit layer 111 of the display substrate 1, enabling the above-mentioned display panel 10 to display images.

[0109] On the other hand, as Figure 12 shown, some embodiments of the present disclosure provide a display device 100, which includes the display panel 10 described in any of the above embodiments. Its beneficial effects are the same as those of the above display panel 10 and will not be elaborated here.

[0110] The above display device 100 can be any device that displays moving (e.g., video), stationary (e.g., still image), textual, or graphical content. More specifically, it is contemplated that the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays for camera views (e.g., displays for rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays for images of a piece of jewelry), etc.

[0111] Exemplarily, the above display device 100 may further include a frame and other electronic accessories, etc. Among them, the display panel 10 may be disposed within the frame, for example.

[0112] On the other hand, as Figure 13 shown, some embodiments of the present disclosure provide a tiled display device 1000, which includes a plurality of the above display devices 100. Its beneficial effects are the same as those of the above display device 100 and will not be elaborated here.

[0113] Exemplarily, the plurality of display devices 100 in the tiled display device 1000 are arranged in an array.

[0114] Exemplarily, as Figure 13 shown, the display device 100 is, for example, rectangular.

[0115] On the other hand, some embodiments of the present disclosure provide a method for manufacturing a display panel, which is used, for example, to manufacture the display panel 10 described in any one of the above embodiments. Among them, Figure 14 a flowchart of a method for manufacturing a display panel is schematically shown. It should be understood that Figure 14 the steps shown are not exclusive, and other steps may also be performed before, after, or between any of the steps Figure 14 shown. In addition, some of the steps may be performed simultaneously or may be performed in an order different from Figure 14 the order shown.

[0116] Exemplarily, as Figure 14 shown, the manufacturing method includes: S100 to S700.

[0117] S100, as Figure 15a shown, provide a display substrate 1. The display substrate 1 has opposite display surfaces 1a, non-display surfaces 1b, and a plurality of side surfaces 1c connecting the display surface 1a and the non-display surface 1b, wherein at least one side surface 1c is a selected side surface 1c1. The display surface 1a has a first bonding region B1 close to the selected side surface 1c1.

[0118] Here, the structure of the display substrate 1 may refer to the description of the structure of the display substrate 1 in some of the above embodiments, and will not be described in detail here.

[0119] S200, as Figure 15b shown, form a plurality of bonding electrodes 2 in the first bonding region B1. The plurality of bonding electrodes 2 are arranged at intervals in sequence along a first direction X, and the first direction X is parallel to the selected side surface 1c1 close to the first bonding region B1.

[0120] Here, the specific arrangement manner of the plurality of bonding electrodes 2 may refer to the description of the arrangement manner of the plurality of bonding electrodes 2 in some of the above embodiments, and will not be described in detail here.

[0121] S300, as Figure 15c shown, provide a carrier substrate 5. The carrier substrate 5 has a carrier surface 51. The carrier surface 51 has a second bonding region B2.

[0122] Here, the structure, material, etc. of the carrier substrate 5 may refer to the description of the structure, material, etc. of the carrier substrate 5 in some of the above embodiments, and will not be described in detail here.

[0123] S400, as Figures 15d to 15gAs shown, a plurality of conductive lines 3 are formed on the bearing surface 51. The plurality of conductive lines 3 are arranged at intervals in sequence along the first direction X on the bearing surface 51. One end of the plurality of conductive lines 3 extends into the second bonding region B2.

[0124] For example, the plurality of conductive lines 3 extend in a direction perpendicular to the first direction X.

[0125] Exemplarily, the method for forming the plurality of conductive lines 3 includes: as Figure 15d shown, depositing a metal material on the bearing surface 51 to form a metal thin film 3a; as Figure 15e shown, then forming a photoresist layer PR on the metal thin film 3a, and disposing a fourth mask plate M on the photoresist layer. The material of the photoresist layer PR is, for example, a positive photoresist; as Figure 15f shown, based on the fourth mask plate M, the photoresist PR is exposed and developed to obtain a patterned photoresist layer PR; as Figure 15g shown, based on the patterned photoresist layer PR, the metal thin film 3a is etched to obtain the plurality of conductive lines 3.

[0126] S500, as Figure 15h shown, a partition structure 6 covering a part of the plurality of conductive lines 3 is formed on the bearing surface 51. A plurality of partition slots 61 are formed in the part of the partition structure 6 extending into the second bonding region B2, and the plurality of partition slots 61 respectively expose one end of the plurality of conductive lines 3 extending into the second bonding region B2. The positive projection of the top end of each partition slot 61 on the bearing surface 51 is located within the positive projection range of the bottom wall of the partition slot 61 on the bearing surface 51.

[0127] Here, the specific structure of the partition structure 6 can refer to the description of the structure of the partition structure 6 in some of the above embodiments, and will not be described in detail here. Among them, Figure 15h the (b) in Figure 15h is a cross-sectional view of (a) in Figure 15h along the first direction X, Figure 15h and the (c) in

[0128] S600, as Figure 15i shown, attach the above-mentioned carrier substrate 5 to the non-display surface 1b.

[0129] Exemplarily, the method for attaching the carrier substrate 5 to the non-display surface 1b is, for example: coating an adhesive on the surface of the carrier substrate 5 opposite to the bearing surface 51 or on the non-display surface 1b, and then attaching the two together through the adhesive. The adhesive used here, for example, has the characteristics of high temperature resistance, easy curing, and strong firmness after bonding.

[0130] S700, in combination with Figure 15j 、Figure 15k and Figure 15l , to form a connection layer 4a. As Figure 15l shown, the connection layer 4a includes a redundant portion 4aa and a plurality of connection lines 4. The redundant portion 4aa covers a portion of the partition structure 6 extending into the second bonding region B2. Each connection line 4 includes a first sub-portion 41, a second sub-portion 42, and a third sub-portion 43 that are sequentially connected. The first sub-portion 41 is located within the first bonding region and is in contact with one bonding electrode 2; the second sub-portion 42 is located on the selected side surface 1c1; the third sub-portion 43 is located within the partition groove 61 and is in contact with the wire 3. The partition groove 61 separates the redundant portion 4aa and the wire 3.

[0131] Here, the specific structure of the connection layer 4a can refer to the description of the structure of the connection layer 4a in some of the above embodiments, and will not be described in detail here. Among them, Figure 15j (b) in Figure 15j is a cross-sectional view of (a) in Figure 15l along the first direction X, Figure 15l (b) in

[0132] Accordingly, in the method for manufacturing a display panel provided by the embodiments of the present disclosure, a plurality of bonding electrodes 2 are formed in the first bonding region B1 of the display substrate 1; then a carrier substrate 5 is additionally provided, and a plurality of conductive lines 3 are formed on the bearing surface 51 of the carrier substrate 5. After that, a partition structure 6 having a plurality of partition grooves 61 is formed on the bearing surface 51 of the carrier substrate 5, and the plurality of conductive lines 3 located in the second bonding region B2 of the carrier substrate 5 are exposed through the plurality of partition grooves 61. Subsequently, the carrier substrate 5 is attached to the non-display surface 1b of the display substrate 1, and finally a connection layer 4a is formed. Since the above-mentioned plurality of conductive lines 3 are formed on the bearing surface 51 of the carrier substrate 5 instead of on the non-display surface 1b, and moreover, due to the arrangement of the partition structure 6, during the formation of the connection layer 4a, the part of the connection layer 4a located in the second bonding region B2 can be naturally partitioned into a redundant part 4aa located on the partition structure 6 and a third sub-part 43 of the connection line 4 that falls into the partition groove 61 and contacts the conductive line 3 exposed by the partition groove 61 based on the partitioning effect of the partition structure 6. This means that during the process of manufacturing the connection layer 4a that connects the display surface 1a of the display substrate 1 and the bearing surface 51 of the carrier substrate 5, the part of the connection layer 4a located in the second bonding region B2 can form the redundant part 4aa and the plurality of connection lines 4 having intervals from each other without laser etching, only under the action of the partition structure 6, realizing the connection between the display surface 1a and the bearing surface 51. By adopting the above manufacturing method, it is possible to avoid using laser etching to process the part of the connection layer 4a in the second bonding region B2, thereby avoiding damage or even destruction of the driving circuit layer 111 and devices in the display substrate 1 caused by laser etching, and improving the yield and reliability of the manufactured display panel 10.

[0133] In some embodiments, in the above S700, forming the connection layer 4a includes: S710 to S720.

[0134] S710, as Figure 15j shown, a connection thin film 4b is formed in the first bonding region B1, on the selected side surface 1c1, and in the second bonding region B2. The part of the connection thin film 4b located in the second bonding region B2 is partitioned by a plurality of partition grooves 61, constituting a redundant part 4aa and a plurality of third sub-parts 43.

[0135] For example, as Figure 15j shown in (a) of, the embodiments of the present disclosure can form the connection thin film 4b by a metal sputtering process. The material of the connection thin film 4b includes a metal material. During the process of sputtering the metal material, as Figure 15jAs shown in (b) thereof, due to the partitioning effect of the partitioning structure 6, part of the metal material is splashed onto the surface of the partitioning structure 6 on the side away from the carrier substrate 5, forming the redundant part 4aa; part of the metal material is naturally splashed into the partitioning groove 61, forming the third sub-part 43. No metal material is sputtered on the side wall of the partitioning groove 61, so that the redundant part 4aa and the third sub-part 43 are naturally partitioned.

[0136] S720, in combination with Figure 15k and Figure 15l , a laser etching process (Laser) is used to etch the part of the connection film 4b located on the selected side surface 1c1 and within the first bonding area B1, forming the second sub-part 42 and the first sub-part 41 that are sequentially connected to each third sub-part 43, and obtaining a plurality of connection lines 4.

[0137] In the process of forming the above-mentioned plurality of connection lines 4, due to the setting of the partitioning structure 6, there is no need to use the laser etching process to etch and form the third sub-part 43 of the connection line 4, thereby reducing the influence of laser etching on the driving circuit layer 111 and devices in the display substrate 1, and avoiding damage or even destruction of the driving circuit layer 111 and devices in the display substrate 1 by laser etching.

[0138] The structure of the above-mentioned partitioning structure 6 includes various types. Correspondingly, in the above S500, the method of forming the partitioning structure 6 includes various types. The following combines the drawings to schematically illustrate two methods of forming the partitioning structure 6.

[0139] In a possible embodiment, the partitioning structure 6 is composed of a single-layer film.

[0140] Based on this, in some examples, in the above S500, forming the partitioning structure 6 on the bearing surface 51 to cover a part of the plurality of conductive lines 3 includes: S510a to S520a.

[0141] S510, as Figure 16a shown, a first partitioning film 6a is formed on the bearing surface 51. The first partitioning film 6a covers the above-mentioned plurality of conductive lines 3, and a part of the first partitioning film 6a extends into the above-mentioned second bonding area B2.

[0142] Exemplarily, in the embodiment of the present disclosure, the first partitioning film 6a can be formed on the bearing surface 51 through a coating process. The first partitioning film 6a is provided as a whole layer, and the first partitioning film 6a covers at least part of the bearing surface 51 and forms a relatively complete coverage of the plurality of conductive lines 3.

[0143] S520, as Figure 16b shown, the part of the first partitioning film 6a that extends into the second bonding area B2 is etched to form the above-mentioned partitioning groove 61.

[0144] Here, the cross-sectional shape of the partition groove 61 is, for example, an inverted trapezoid, and this cross-section is parallel to the selected side surface 1c1 described above.

[0145] Through the above S510 and S520, a first partition thin film 6a is formed on the bearing surface 51, and then the first partition thin film 6a is etched to form the partition groove 61. The process steps are simple, which is beneficial to improving the preparation efficiency of the display panel 10.

[0146] In some embodiments, the material of the first partition thin film 6a includes a negative photoresist. In this case, in the above S520, etching the part of the first partition thin film 6a extending into the second bonding region B2 includes: S521a to S522a.

[0147] S521a, as Figure 17a shown, a first mask plate 8 is provided on the first partition thin film 6a. The first mask plate 8 has a plurality of third openings K3 located in the second bonding region B2, and the plurality of third openings K3 at least expose the part of the first partition thin film 6a located between two adjacent wires 3.

[0148] The plurality of third openings K3 are, for example, in a strip shape. The plurality of openings K3 extend in a direction perpendicular to the first direction X and are arranged at intervals along the first direction X. The first mask plate 8 at least forms a coverage for the part of each wire 3 located in the second bonding region B2 to cover the part of the first partition thin film 6a above this part of the wire 3.

[0149] S522a, in combination with Figure 17b 、 Figure 16b and Figure 15h in (a), based on the first mask plate 8, the part of the first partition thin film 6a extending into the second bonding region B2 is exposed, developed, and removed to form the plurality of partition grooves 61.

[0150] Specifically, after the part of the first partition thin film 6a extending into the second bonding region B2 is exposed based on the first mask plate 8, since the material of the first partition thin film 6a is a negative photoresist, the part of the first partition thin film 6a exposed by the plurality of third openings K3 will undergo a photocuring reaction; while the part of the first partition thin film 6a covered by the first mask plate 8 will be removed by the developer, and the region occupied by the removed part of the first partition thin film 6a corresponds to the plurality of partition grooves 61.

[0151] Based on the characteristics of exposure, the cross-sectional pattern of the removed part of the first partition thin film 6a is a positive trapezoid.

[0152] Forming the first partition film 6a with a negative photoresist enables multiple partition grooves 61 to be formed after development, exposure, and removal of the first partition film 6a. The process steps are simple and it is convenient to control the shape and size of the partition grooves 61.

[0153] In some embodiments, as Figure 15h shown in (a) of Figure 15h and (c) of

[0154] shown, the above-mentioned bearing surface 51 further has a third bonding region B3, and the third bonding region B3 is arranged at an interval from the above-mentioned second bonding region B2. That is to say, compared with the second bonding region B2, the third bonding region B3 is farther away from the above-mentioned selected side surface 1c1.

[0155] Here, for the structure and arrangement of the multiple first openings K1, reference can be made to the description of the structure and arrangement of the multiple first openings K1 in the above-mentioned some embodiments, and no more description will be given here.

[0156] In the embodiment of the present application, multiple partition grooves 61 and multiple first openings K1 are synchronously formed in one etching process, which is beneficial to simplifying the manufacturing process of the display panel 10 and improving the manufacturing efficiency of the display panel 10.

[0157] In another possible embodiment, the partition structure 6 is composed of multiple thin film layers stacked.

[0158] Based on this, in some examples, in the above-mentioned S500, forming the partition structure 6 covering a part of the multiple wires 3 on the bearing surface 51 includes: S510b to S550b.

[0159] S510b, as Figure 18a shown, form a second partition film 6b on the above-mentioned bearing surface 51. The second partition film 6b covers the above-mentioned multiple wires 3, and a part of the second partition film 6b extends into the second bonding region B2.

[0160] Exemplarily, in the embodiment of the present disclosure, the second partition film 6b can be formed on the bearing surface 51 through a coating process. The second partition film 6b is provided as a whole layer, the second partition film 6b covers at least part of the bearing surface 51, and forms a relatively complete coverage of the multiple wires 3.

[0161] S520b, as Figure 18b and Figure 18cAs shown, the part of the second partition film 6b extending into the second bonding region B2 is etched to expose one ends of a plurality of wires 3 extending into the second bonding region B2.

[0162] Exemplarily, the material of the second partition film 6b includes positive photoresist. The method for etching the part of the second partition film 6b extending into the second bonding region B2 is, for example: as Figure 18b shown, a second mask plate 9 is disposed above the second partition film 6b. The second mask plate 9 has a plurality of fourth openings K4 located in the second bonding region B2, and the plurality of fourth openings K4 at least expose the part of the second partition film 6b corresponding to the plurality of wires 3; combining Figure 18b and Figure 18c , based on the second mask plate 9, the second partition film 6b is exposed, developed, and removed, so that the part of the second partition film 6b corresponding to the plurality of wires 3 is removed, and one ends of the plurality of wires 3 extending into the second bonding region B2 are exposed.

[0163] Of course, the material of the second partition film 6b can also be other insulating materials.

[0164] S530b, as Figure 18d shown, a third partition film 6c covering the second partition film 6b and the plurality of wires 3 is formed.

[0165] Exemplarily, the material of the third partition film 6c includes silicon nitride. In an embodiment of the present disclosure, the above third partition film 6c is formed by a deposition process.

[0166] S540b, as Figure 18e and Figure 18f shown, the part of the third partition film 6c extending into the second bonding region B2 is etched to expose one ends of the plurality of wires 3 extending into the second bonding region B2.

[0167] Exemplarily, the method for etching the third partition film 6c is, for example: as Figure 18e shown, a positive photoresist is coated above the third partition film 6c to form a photoresist layer; then a third mask plate is disposed on the photoresist layer. The third mask plate has a plurality of fifth openings K5 located in the second bonding region B2, and the plurality of fifth openings K5 at least expose the part of the photoresist layer corresponding to the plurality of wires 3; combining Figure 18e and Figure 18f , based on the third mask plate, the photoresist layer is exposed, developed, and removed to obtain a patterned photoresist layer; then, using the patterned photoresist layer as a mask, the part of the third partition film 6c corresponding to the plurality of wires 3 is etched, so that one ends of the plurality of wires 3 extending into the second bonding region B2 are exposed, and a partition layer 64 is obtained.

[0168] Optionally, the third mask plate 14 is the same mask plate as the second mask plate 9. This helps reduce the number of mask plates and lower costs.

[0169] S550b, as Figure 18g and Figure 18h shown, based on the etched third partition film (i.e., the partition layer 64), the second partition film 6b is etched to form a partition groove 61.

[0170] The etching method for the second partition film 6b here is, for example, plasma etching. The cross-sectional shape of the partition groove 61 is similar to a "convex" shape.

[0171] Through S510b to S550b, another structure of the partition structure 6 with the partition groove 61 can be formed in the second bonding region B2, enabling multiple wires 3 to respectively fall into multiple partition grooves 61, facilitating the connection of the subsequent connection wires 4.

[0172] In some embodiments, the bearing surface 51 further has a third bonding region B3, and the third bonding region B3 is spaced apart from the second bonding region B2. That is to say, compared with the second bonding region B2, the third bonding region B3 is farther away from the above-mentioned selected side surface 1c1. The second partition film 6b is located outside the second bonding region B2.

[0173] In this case, during the etching of the portion of the third partition film 6c extending into the second bonding region B2 in the above S550b, the portion of the third partition film 6c located in the third bonding region B3 is also etched to form a plurality of second openings K2. The plurality of second openings K2 respectively expose the portions of the multiple wires 3 located in the third bonding region B3 to serve as a plurality of bonding pins 31.

[0174] For the structure and arrangement of the plurality of second openings K2 here, reference can be made to the description of the structure and arrangement of the plurality of second openings K2 in the above-mentioned some embodiments, and no further description will be given here.

[0175] In the embodiments of the present application, a plurality of partition grooves 61 and a plurality of second openings K2 are synchronously formed in one etching process, which helps simplify the manufacturing process of the display panel 10 and improve the manufacturing efficiency of the display panel 10.

[0176] Optionally, during the etching of the portion of the second partition film 6b extending into the second bonding region B2 in the above S520b, the portion of the second partition film 6b extending into the third bonding region B3 can also be synchronously removed.

[0177] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure who thinks of changes or substitutions should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims described above.

Claims

1. A display panel, characterized in that, The display panel includes: A display substrate having opposite display and non-display surfaces and a plurality of side surfaces connecting the display and non-display surfaces, wherein at least one side surface is a selected side surface; the display surface has a first bonding region near the selected side surface; A plurality of bonding electrodes arranged at intervals in sequence in the first bonding region along a first direction; the first direction is parallel to the selected side surface close to the first bonding region; A carrier substrate attached to the non-display surface; a surface of the carrier substrate away from the display substrate is a carrier surface, and the carrier surface has a second bonding region near the selected side surface; A plurality of wires arranged at intervals in sequence on the carrier surface along the first direction; one ends of the plurality of wires extend into the second bonding region; A partition structure located on the carrier surface and covering a part of the plurality of wires; a plurality of partition slots are formed in a part of the partition structure extending into the second bonding region, and one ends of the plurality of wires extending into the second bonding region are respectively exposed by the plurality of partition slots; a positive projection of the top end of each partition slot on the carrier surface is within a positive projection range of the bottom wall of the partition slot on the carrier surface; A connection layer including a redundant portion and a plurality of connection lines; the redundant portion covers a part of the partition structure extending into the second bonding region; each connection line includes a first sub-portion, a second sub-portion and a third sub-portion connected in sequence, the first sub-portion is located in the first bonding region and contacts a bonding electrode, the second sub-portion is located on the selected side surface, and the third sub-portion is located in the partition slot and contacts the wire; the partition slot separates the redundant portion and the wire.

2. The display panel according to claim 1, characterized in that, The partition structure is integrally formed.

3. The display panel according to claim 2, wherein: The cross-sectional shape of the partition slot includes a regular trapezoid; the cross-section is parallel to the selected side surface.

4. The display panel according to claim 2, wherein The material of the partition structure includes negative photoresist.

5. The display panel according to any one of claims 2 to 4, wherein The carrier surface further has a third bonding region, and the third bonding region is spaced apart from the second bonding region; A plurality of first openings are formed in a part of the partition structure located in the third bonding region, and parts of the plurality of wires located in the third bonding region are respectively exposed by the plurality of first openings to serve as a plurality of bonding pins; The display panel further includes: a circuit board electrically connected to the plurality of bonding pins.

6. The display panel according to claim 5, characterized in that, The cross-sectional shape of the plurality of first openings is the same as the cross-sectional shape of the partition slot.

7. The display panel according to claim 1, wherein The partition structure includes a support layer and a partition layer, and the partition layer is located on a side of the support layer away from the carrier surface; A positive projection of a part of the support layer extending into the second bonding region on the carrier surface is within a positive projection range of a part of the partition layer extending into the second bonding region on the carrier surface.

8. The display panel according to claim 7, wherein: The cross-sectional shape of the partition slot includes an inverted T shape; the cross-section is parallel to the selected side surface.

9. The display panel according to claim 7, wherein The material of the support layer includes positive photoresist; and / or, the material of the partition layer includes an inorganic material.

10. The display panel according to any one of claims 7 to 9, characterized in that, The carrier surface further has a third bonding region, and the third bonding region is spaced apart from the second bonding region; The supporting layer is located outside the third binding area, and a portion of the isolation layer located within the third binding area is provided with a plurality of second openings, wherein the plurality of second openings respectively expose portions of the plurality of wires located within the third binding area to serve as a plurality of binding pins; The display panel further includes a circuit board electrically connected to the plurality of binding pins.

11. The display panel according to claim 1, wherein A surface of one side of the carrier substrate covered with the second sub-portion is flush with the selected side surface.

12. A display device, characterized in that, The display device includes the display panel according to any one of claims 1 to 11.

13. A splicing display device, characterized in that: The spliced display device includes a plurality of display devices according to claim 12.

14. A method for manufacturing a display panel, characterized in that, The preparation method comprises: A display substrate is provided; the display substrate has a display surface, a non-display surface, and a plurality of side surfaces connecting the display surface and the non-display surface, wherein at least one side surface is a selected side surface; the display surface has a first binding area adjacent to the selected side surface; forming a plurality of binding electrodes in the first binding region; the plurality of binding electrodes are sequentially spaced apart along a first direction, the first direction being parallel to the selected side surface to which the first binding region is close; Providing a carrier substrate; the carrier substrate has a carrier surface, and the carrier surface has a second binding area; A plurality of conductive wires are formed on the carrying surface; the plurality of conductive wires are sequentially spaced apart on the carrying surface along the first direction, and one end of the plurality of conductive wires extends into the second binding area; A partition structure covering a portion of the plurality of wires is formed on the bearing surface; a portion of the partition structure extending into the second binding area is provided with a plurality of partition grooves, each of the plurality of partition grooves exposing one end of the plurality of wires extending into the second binding area; an orthographic projection of a top end of each partition groove on the bearing surface is located within the orthographic projection of a bottom wall of the partition groove on the bearing surface; attaching the carrier substrate to the non-display surface; A connection layer is formed; the connection layer includes a redundant portion and a plurality of connection lines; the redundant portion covers the portion of the partition structure extending into the second binding area; each connection line includes a first sub-portion, a second sub-portion and a third sub-portion connected in sequence, the first sub-portion is located in the first binding area and in contact with a binding electrode, the second sub-portion is located on the selected side, and the third sub-portion is located in the partition groove and in contact with the wire; the partition groove separates the redundant portion and the wire.

15. The preparation method according to claim 14, characterized in that The partition structure formed on the bearing surface and covering a portion of the plurality of conductive lines includes: forming a first partition film on the carrying surface; the partition film covers the plurality of wires, and a portion of the partition film extends into the second binding area; A portion of the first partition film extending into the second binding area is etched to form the partition groove.

16. The preparation method according to claim 15, characterized in that, The material of the first partition film includes negative photoresist; The etching of the portion of the first partition film extending into the second binding region includes: A first mask plate is provided on the first partition film; the first mask plate has a plurality of third openings located in the second binding area, the plurality of third openings at least exposing a portion of the partition film located between two adjacent conductive lines; Based on the first mask plate, the portion of the first partition film extending into the second binding area is exposed, developed, and removed to form the plurality of partition grooves.

17. The preparation method according to claim 15 or 16, characterized in that, The bearing surface further has a third binding area, and the third binding area is spaced apart from the second binding area; In the process of etching the portion of the first partition film extending into the second binding area, the portion of the first partition film located in the third binding area is also etched to form a plurality of first openings; the plurality of first openings respectively expose the portions of the plurality of wires located in the third binding area to serve as a plurality of binding pins.

18. The preparation method according to claim 14, characterized in that The partition structure formed on the bearing surface and covering a portion of the plurality of conductive lines includes: forming a second partition film on the carrying surface; the second partition film covers the plurality of wires, and a portion of the second partition film extends into the second binding area; Etching a portion of the second partition film extending into the second binding area to expose ends of the plurality of wires extending into the second binding area; forming a third partition film covering the second partition film and the plurality of conductive lines; Etching a portion of the third partition film extending into the second binding area to expose ends of the plurality of wires extending into the second binding area; Based on the etched third partition film, the second partition film is etched to form the partition groove.

19. The preparation method according to claim 18, characterized in that, The bearing surface further has a third binding area, which is spaced apart from the second binding area; the second partition film is located outside the second binding area; In the process of etching the portion of the third partition film extending into the second binding area, the portion of the third partition film located in the third binding area is also etched to form a plurality of second openings; the plurality of second openings respectively expose the portions of the plurality of wires located in the third binding area to serve as a plurality of binding pins.

20. The preparation method according to claim 14, characterized in that The forming of the connecting layer comprises: forming a connecting film in the first binding area, on the selected side surface, and in the second binding area; a portion of the connecting film located in the second binding area is separated by the plurality of separating grooves to form the redundant portion and the plurality of third sub-portions; The portion of the connection film located on the selected side and in the first binding area is etched using a laser etching process to form the second sub-section and the first sub-section sequentially connected to each of the third sub-sections, thereby obtaining a plurality of connection lines.

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