Organic light emitting display device

Abstract

An organic light emitting display device includes a substrate, a light emitting structure, a first conductive pattern, and a functional module. The substrate has an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, and includes a first groove having an expanded lower portion formed in the peripheral region, and an opening formed in the opening region. The light emitting structure is in the display area and on the substrate. The first conductive pattern is in the peripheral region and overlaps the first recess on the substrate. The functional module is located in the opening of the substrate.

Description

[0001] This application is a divisional application of a patent application for an invention named "organic light-emitting display device" with an application date of December 3, 2019 and an application number of "201911220577.2". Technical Field

[0002] Example embodiments generally relate to an organic light-emitting display device. Background Art

[0003] Flat panel display ("FPD") devices are widely used as display devices for electronic devices because they are lighter and thinner than cathode ray tube ("CRT") display devices. Typical examples of FPD devices are liquid crystal display ("LCD") devices and organic light-emitting display ("OLED") devices. Summary of the Invention

[0004] Embodiments relate to an organic light-emitting display device including a substrate, a light-emitting structure, a first conductive pattern, and a functional module. The substrate has an opening region, a peripheral region surrounding the opening region, and a display region surrounding the peripheral region, and includes a first groove having an extended lower portion formed in the peripheral region and an opening formed in the opening region. The light-emitting structure is located on the substrate in the display region. The first conductive pattern is located in the peripheral region and is stacked on the first groove on the substrate. The functional module is located in the opening of the substrate.

[0005] In an example embodiment, the first conductive pattern may include a first sub-conductive pattern and a second sub-conductive pattern. The first sub-conductive pattern may be stacked on the first groove and may have a circular planar shape including a local opening having an opening portion. The second sub-conductive pattern may extend from the opening portion of the first sub-conductive pattern in an outward direction.

[0006] In an example embodiment, the OLED device may further include a pad electrode and signal wirings. The pad electrode may be located on the substrate and may be electrically connected to an external device. The signal wirings located on the substrate may be disposed along an outer side portion of the substrate and may electrically connect the second sub-conductive pattern and the pad electrode.

[0007] In an example embodiment, the first groove may surround the opening on the substrate.

[0008] In an example embodiment, the first groove may have a circular planar shape.

[0009] In an example embodiment, the first conductive pattern located on the first groove may be disposed along a contour of an outer side portion of the first groove.

[0010] In an exemplary embodiment, the substrate may include a first organic film layer, a first barrier layer, a second organic film layer, and a second barrier layer. The first barrier layer may be located on the first organic film layer. The second organic film layer may be located on the first barrier layer and may have trenches in the peripheral region. The second barrier layer may be located on the second organic film layer, and the second barrier layer positioned on the trenches may have a protruding portion protruding in the inner portion of the trenches. The second barrier layer may have an opening defined by the protruding portion.

[0011] In an exemplary embodiment, the first conductive pattern may be stacked on the protruding portion of the second barrier layer.

[0012] In an exemplary embodiment, the protruding portion of the second barrier layer may include a first protruding portion and a second protruding portion. The first protruding portion may be positioned adjacent to the opening of the substrate. The second protruding portion may face the first protruding portion and may be spaced apart from the first protruding portion in a direction from the opening region to the peripheral region.

[0013] In an exemplary embodiment, the OLED device may further include a second conductive pattern stacked on the first protruding portion, and the second conductive pattern is located on the first protruding portion. The first conductive pattern may be stacked on the second protruding portion.

[0014] In an exemplary embodiment, the first conductive pattern and the second conductive pattern may be connected to each other in the region of the peripheral region and may be integrally formed.

[0015] In an exemplary embodiment, the trench of the second organic film layer, the protruding portion of the second barrier layer, and the opening of the second barrier layer may be defined as a first groove having an extended lower portion of the substrate.

[0016] In an exemplary embodiment, the light-emitting structure may include: a lower electrode; a light-emitting layer located on the lower electrode; and an upper electrode located on the light-emitting layer.

[0017] In an exemplary embodiment, the light-emitting layer may extend on the substrate in a direction from the display region to the peripheral region and may be separated in a portion where the first groove is formed.

[0018] In an exemplary embodiment, the upper electrode may extend on the substrate in a direction from the display region to the peripheral region and may be separated in a portion where the first groove is formed.

[0019] In an exemplary embodiment, the light-emitting layer and the upper electrode may be located in at least a portion of the inner portion of the first groove.

[0020] In an exemplary embodiment, the OLED device may further include: a thin-film encapsulation structure located on the light-emitting structure; and a touchscreen structure located on the thin-film encapsulation structure in the display region.

[0021] In an example embodiment, the thin film encapsulation structure may include a first thin film encapsulation layer, a second thin film encapsulation layer, and a third thin film encapsulation layer. The first thin film encapsulation layer may be located on the upper electrode and may include a flexible inorganic material. The second thin film encapsulation layer may be located on the first thin film encapsulation layer and may include a flexible organic material. The third thin film encapsulation layer may be located on the second thin film encapsulation layer and may include a flexible inorganic material.

[0022] In example embodiments, each of the first thin film encapsulation layer and the third thin film encapsulation layer may extend on the upper electrode in a direction from the display region to the peripheral region, and may be continuously disposed in the portion where the first groove is formed.

[0023] In an example embodiment, the touch screen structure may include: a first insulating layer located on the third thin film encapsulation layer in the display area; a touch screen electrode located on the first insulating layer; a second insulating layer located on the touch screen electrode; a touch screen connection electrode located on the second insulating layer; and a protective insulating layer located on the touch screen connection electrode.

[0024] In example embodiments, the first insulating layer may extend on the third thin film encapsulation layer in a direction from the display region to the peripheral region, and may be continuously disposed in a portion where the first groove is formed.

[0025] In example embodiments, the OLED device may further include an organic insulation pattern on the first insulation layer in the peripheral region.

[0026] In example embodiments, the second insulating layer may be in contact with an upper surface of the first insulating layer in the display region and may be in contact with an upper surface of the organic insulating pattern in the peripheral region.

[0027] In example embodiments, the first conductive pattern may be located between the second insulating layer and the protective insulating layer.

[0028] In example embodiments, the functional module may contact a side surface of the substrate, a side surface of the light emitting layer, a side surface of the upper electrode, a side surface of the first thin film encapsulation layer, a side surface of the third thin film encapsulation layer, a side surface of the first insulating layer, a side surface of the organic insulating pattern, a side surface of the second insulating layer, and a side surface of the protective insulating layer in a boundary between the peripheral region and the opening region.

[0029] In example embodiments, the substrate may further include at least one second groove between the first groove and the functional module, the at least one second groove having an expanded lower portion. The first groove may surround the second groove.

[0030] In example embodiments, the substrate may further include at least one third groove surrounding the first groove.

[0031] In an exemplary embodiment, the OLED device may further include a barrier structure that is in the peripheral region and on the substrate between the first groove and the third groove. The barrier structure may surround the first groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The features will become apparent to those skilled in the art by describing the exemplary embodiments in detail with reference to the drawings, in which:

[0033] Figure 1 A perspective view of an organic light-emitting display (“OLED”) device according to an exemplary embodiment is shown;

[0034] Figure 2 Shows Figure 1 a plan view of the OLED device;

[0035] Figure 3 and Figure 4 Shows a perspective view for describing an opening formed in the Figure 1 OLED device;

[0036] Figure 5 Shows Figure 2 a partially enlarged plan view corresponding to region “A” of the

[0037] Figure 6 Shows a plan view for describing a conductive pattern included in the Figure 5 OLED device;

[0038] Figure 7 Shows a block diagram of an external device electrically connected to the Figure 6 OLED device;

[0039] Figure 8 Shows a cross-sectional view taken along line I-I' of the Figure 5 OLED device;

[0040] Figure 9 Shows a plan view for describing a touch screen structure included in the Figure 8 OLED device;

[0041] Figures 10 to 20 Shows a cross-sectional view of a method of manufacturing an OLED device according to an exemplary embodiment;

[0042] Figure 21 Shows a plan view of an OLED device according to an exemplary embodiment;

[0043] Figure 22 Shows Figure 21 a partially enlarged plan view corresponding to region “B” of the

[0044] Figure 23 shows a partially enlarged plan view of region “B” corresponding to Figure 21 ;

[0045] Figure 24 shows a cross-sectional view taken along line II-II' of Figure 22 ; and

[0046] Figure 25 shows a cross-sectional view of an OLED device according to an exemplary embodiment. DETAILED DESCRIPTION

[0047] Exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, the exemplary embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the exemplary embodiments to those skilled in the art. In the drawings, the dimensions of layers and regions are exaggerated for clarity of illustration. Like reference numerals always denote like elements.

[0048] Figure 1 is a perspective view showing an organic light-emitting display (“OLED”) device according to an exemplary embodiment, Figure 2 is a plan view showing the Figure 1 OLED device. Figure 3 and Figure 4 are perspective views for describing an opening formed in the Figure 1 OLED device.

[0049] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the OLED device 100 may include a functional module 700 and the like. The OLED device 100 may have a first surface S1 and a second surface S2. An image may be displayed on the first surface S1, and the second surface S2 may face away from the first surface S1. The functional module 700 may be located on one side of the OLED device 100.

[0050] As shown in Figure 2 , the OLED device 100 may have a display region 10, an opening region 20, a peripheral region 30, and a pad region 40. The peripheral region 30 may substantially surround the opening region 20, and the display region 10 may substantially surround the peripheral region 30. In another embodiment, the display region 10 may not completely surround the peripheral region 30. As shown in Figure 3 and Figure 4As shown, the OLED device 100 may have an opening 910 formed in the opening region 20. The pad region 40 may be located on one side of the display region 10. A plurality of pad electrodes may be located in the pad region 40, and the pad electrodes may be electrically connected to an external device. In an exemplary embodiment, the OLED device 100 may have a bending region located between the display region 10 and the pad region 40. For example, the bending region may be bent along an axis with respect to a first direction D1 parallel to the upper surface of the OLED device 100, and the pad region 40 may be located on the lower surface of the OLED device 100.

[0051] The display region 10 may include a plurality of sub-pixel regions, and the plurality of sub-pixel regions may be arranged in a matrix form as a whole in the display region 10. A sub-pixel circuit (e.g., Figure 8 semiconductor element 250) may be located in each sub-pixel region of the display region 10, and an OLED (e.g., Figure 8 light-emitting structure 200) may be located on the sub-pixel circuit. An image may be displayed in the display region 10 through the sub-pixel circuit and the OLED.

[0052] For example, a first sub-pixel circuit, a second sub-pixel circuit, and a third sub-pixel circuit may be located in the sub-pixel region, and a first OLED, a second OLED, and a third OLED may be located on the first sub-pixel circuit, the second sub-pixel circuit, and the third sub-pixel circuit. The first sub-pixel circuit may be combined with (or connected to) a first OLED capable of emitting red light, the second sub-pixel circuit may be combined with a second OLED capable of emitting green light. The third sub-pixel circuit may be combined with a third OLED capable of emitting blue light.

[0053] In an exemplary embodiment, the first OLED may be stacked with the first sub-pixel circuit, the second OLED may be stacked with the second sub-pixel circuit. The third OLED may be stacked with the third sub-pixel circuit. In another embodiment, the first OLED may be stacked with a part of the first sub-pixel circuit and a part of a sub-pixel circuit different from the first sub-pixel circuit, the second OLED may be stacked with a part of the second sub-pixel circuit and a part of a sub-pixel circuit different from the second sub-pixel circuit. The third OLED may be stacked with a part of the third sub-pixel circuit and a part of a sub-pixel circuit different from the third sub-pixel circuit.

[0054] Therefore, the first OLED, the second OLED, and the third OLED may be arranged using an RGB stripe method, an s-stripe method, a WRGB method, a pen-tile method, etc. In the RGB stripe method, quadrilaterals of the same size are arranged sequentially, the s-stripe method includes a blue OLED having a relatively large area, the WRGB method further includes a white OLED, and in the pen-tile method, sub-pixels are repeatedly arranged in an RG-GB pattern.

[0055] In addition, at least one driving transistor, at least one switching transistor, and at least one capacitor may be located in each sub-pixel region.

[0056] In an exemplary embodiment, for example, the shape of the display region 10 may be a quadrilateral planar shape. In an embodiment, the shape of the display region 10 may have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a circular planar shape, a runway planar shape, an elliptical planar shape, etc.

[0057] The functional module 700 may be located in the opening 910. For example, the functional module 700 may include a camera module for capturing (or recognizing) an image of an object, a face recognition sensor module for sensing a user's face, a pupil recognition sensor module for sensing a user's pupil, an acceleration and geomagnetic sensor module for determining the movement of the OLED device 100, a proximity and infrared sensor module for detecting proximity to the OLED device 100, and a light intensity sensor module for measuring the degree of brightness when placed in a pocket or bag (package), etc. In an exemplary embodiment, a vibration or tactile module for indicating an incoming alert, a speaker module for outputting sound, etc. may be located in the opening 910.

[0058] In an exemplary embodiment, for example, the shapes of both the opening region 20 and the peripheral region 30 have a circular planar shape. In an embodiment, the shapes of the opening region 20 and the peripheral region 30 may both have a triangular planar shape, a rhombus planar shape, a polygonal planar shape, a quadrilateral planar shape, a runway planar shape, an elliptical planar shape, etc.

[0059] Figure 5 is Figure 2 a partially enlarged plan view corresponding to the region “A” of Figure 6 is a plan view for describing a conductive pattern included in the Figure 5 OLED device of Figure 7 is a block diagram for describing an external device electrically connected to the Figure 6 OLED device of

[0060] Referring to Figure 5 , Figure 6 and Figure 7 , the OLED device 100 may include a conductive pattern 400, a functional module 700, a pad electrode 470, a connection wiring 370, etc.

[0061] In an exemplary embodiment, an opening 910 may be formed in the opening region 20, and a groove 930 may be formed in the peripheral region 30. The groove 930 may have a circular planar shape in the plan view of the OLED device 100 and may surround the opening region 20. Additionally, in the cross-sectional view of the OLED device 100, the groove 930 may have an extended (or expanded) lower portion. Thus, the lower portion of the groove 930 may be relatively larger than the upper portion of the groove 930.

[0062] The functional module 700 may be located in the opening 910, and the conductive pattern 400 may be superimposed on the groove 930. Thus, the conductive pattern 400 may be disposed on the groove 930 along the contour of the outer portion (outer part) of the groove 930. The conductive pattern 400 may substantially surround the functional module 700 (or the opening 910). As Figure 6 shown, the conductive pattern 400 may include a first sub-conductive pattern 401 and a second sub-conductive pattern 402. The first sub-conductive pattern 401 may have a circular planar shape including a locally opened opening portion, and the second sub-conductive pattern 402 may extend from the opening portion of the first sub-conductive pattern 401 in an outward direction (e.g., a direction from the opening region 20 to the peripheral region 30 or a second direction D2 perpendicular to the first direction D1). In an exemplary embodiment, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 may be integrally formed at the same layer. In another embodiment, the first sub-conductive pattern 401 may be located on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. In an embodiment, the second sub-conductive pattern 402 may be located on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. The first sub-conductive pattern 401 may be superimposed on the groove 930. For example, the first sub-conductive pattern 401 may be superimposed on the outermost portion of the groove 930. Thus, the first sub-conductive pattern 401 may be superimposed on the outer boundary of the groove 930. In another embodiment, the first sub-conductive pattern 401 may be superimposed on the innermost portion of the groove 930. Thus, the first sub-conductive pattern 401 may be superimposed on the inner boundary of the groove 930.

[0063] The conductive pattern 400 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. For example, the conductive pattern 400 may include gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an alloy of aluminum, aluminum nitride (AlN), an alloy of silver, tungsten nitride (WN), an alloy of copper, an alloy of molybdenum, titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SRO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, the conductive pattern 400 may have a multilayer structure including a plurality of layers.

[0064] The pad electrode 470 may be located in the pad region 40. The pad electrode 470 may include a first pad electrode 471 and a second pad electrode 472. For example, the first pad electrode 471 may be positioned in the left side of the pad region 40, and the second pad electrode 472 may be positioned in the right side of the pad region 40. In an exemplary embodiment, additional pad electrodes may also be located between the first pad electrode 471 and the second pad electrode 472. The pad electrode 470 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, the pad electrode 470 may have a multilayer structure including a plurality of layers.

[0065] The connection wiring 370 may be located in an outer portion of the display region 10 and the pad region 40. The connection wiring 370 may include a first connection wiring 371 and a second connection wiring 372. A first distal end of the first connection wiring 371 may be connected to a second sub-conductive pattern 402 located on the left side of the second sub-conductive pattern 402, and the first connection wiring 371 may extend along a contour of the outer portion of the display region 10 and the pad region 40 in a counterclockwise direction. A second distal end of the first connection wiring 371 opposite to the first distal end may be connected to a first pad electrode 471 in the pad region 40. Similarly, a first distal end of the second connection wiring 372 may be connected to the second sub-conductive pattern 402 located on the right side of the second sub-conductive pattern 402, and the second connection wiring 372 may extend along a contour of the outer portion of the display region 10 and the pad region 40 in a clockwise direction. A second distal end of the second connection wiring 372 opposite to the first distal end may be connected to a second pad electrode 472 in the pad region 40. Accordingly, the connection wiring 370 may electrically connect the conductive pattern 400 and the pad electrodes 470. The connection wiring 370 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, the connection wiring 370 may have a multi-layer structure including a plurality of layers.

[0066] As Figure 7 shown, the external device 101 may be electrically connected to the OLED device 100 through a flexible printed circuit board (“FPCB”). For example, one side of the FPCB may be in direct contact with the pad electrodes 470, and the other side of the FPCB may be in direct contact with the external device 101. Accordingly, the external device 101 may electrically connect the first pad electrode 471 and the second pad electrode 472, and may measure a resistance value between the first pad electrode 471 and the second pad electrode 472.

[0067] A common OLED device may include a substrate, and a groove having an extended lower portion may be formed in the substrate. The substrate may have a stacked structure in which a first organic film layer, a first barrier layer, a second organic film layer, and a second barrier layer are sequentially stacked. When the groove is formed in the substrate, the light-emitting layer and the upper electrode are separated (or cut, etc.) in the peripheral region. For example, the groove having an extended lower portion may have an undercut shape, and the second organic film layer and the second barrier layer may be formed in the peripheral region. The second organic film layer may have grooves with a second width, and the second barrier layer may have openings with a first width that overlap the grooves. The first width may be smaller than the second width. Additionally, a protruding portion of the second barrier layer positioned adjacent to the opening may be defined as a tip, and the light-emitting layer and the upper electrode may be separated in the peripheral region through the tip. However, the tip may be easily damaged under the action of external impact or stress during the manufacturing process (e.g., removing the top protective film and / or the bottom protective film, etc.). When the tip is damaged, the light-emitting layer and the upper electrode cannot be separated in the peripheral region, and moisture and / or water will penetrate through the light-emitting layer and the upper electrode. Therefore, defects may occur in the pixels included in the common OLED device due to moisture and / or water. Thus, since defects in the common OLED device may occur due to damage to the tip, such damage to the tip should be inspected during the manufacturing process of the common OLED device. However, the damage to the tip cannot be directly visually inspected.

[0068] In an exemplary embodiment, the OLED device 100 includes a conductive pattern 400, a pad electrode 470, and a connection wiring 370, and the OLED device 100 can inspect whether the tip is damaged. For example, the OLED device 100 can measure the resistance value between the first pad electrode 471 and the second pad electrode 472 by using an external device 101. Thus, the OLED device 100 can inspect whether the tip is damaged by using the resistance value. Here, when damage to the tip occurs, the resistance value will increase or the tip will be in an open circuit state due to the cut of the conductive pattern 400. Therefore, the defect rate of the OLED device 100 can be reduced by inspecting whether the tip is damaged by the OLED device 100.

[0069] In an exemplary embodiment, the external device 101 may generate a data signal, a gate signal, a light-emitting signal, a gate initialization signal, an initialization voltage, a power supply, and the like. As described above, an additional pad electrode may also be located between the first pad electrode 471 and the second pad electrode 472, and the external device 101 may be electrically connected to the additional pad electrode. In this case, the external device 101 may provide the OLED device 100 with a data signal, a gate signal, a light-emitting signal, a gate initialization signal, an initialization voltage, a power supply, and the like. In addition, a driver integrated circuit may be mounted on the FPCB. In another embodiment, the driver integrated circuit may be mounted on a portion of the OLED device 100 located adjacent to the pad electrode 470.

[0070] Figure 8 It is along Figure 5 A cross-sectional view taken along line II' of Figure 9 It is used to describe the Figure 8 A plan view of the touch screen structure in an OLED device.

[0071] Reference Figure 8 and Figure 9 The OLED device 100 may include a substrate 110, a semiconductor element 250, a planarization layer 270, a light emitting structure 200, a pixel defining layer 310, a thin film encapsulation ("TFE") structure 450, a touch screen structure 380, an organic insulation pattern 490, a conductive pattern 400, a functional module 700, and the like. The substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. In the OLED device 100 having a display area 10, an opening area 20, a peripheral area 30, and a pad area 40, the substrate 110 may be divided into the display area 10, the opening area 20, the peripheral area 30, and the pad area 40. In addition, the semiconductor element 250 may include an active layer 130, a gate insulating layer 150, a gate electrode 170, an insulating interlayer 190, a source electrode 210, and a drain electrode 230, and the light emitting structure 200 may include a lower electrode 290, a light emitting layer 330, and an upper electrode 340. In addition, the TFE structure 450 may include a first TFE layer 451, a second TFE layer 452 and a third TFE layer 453, and the touch screen structure 380 may include a first insulating layer 390, multiple first touch screen electrodes 382, multiple second touch screen electrodes 384, multiple touch screen connecting electrodes 386, a second insulating layer 395 and a protective insulating layer 410.

[0072] In example embodiments, the substrate 110 may further include a groove 930 formed in the peripheral region 30, and each of the light emitting layer 330 and the upper electrode 340 may be separated in an inner portion (or interior) of the groove 930. Therefore, each of the light emitting layer 330 and the upper electrode 340 may be separated in an inner portion (inner portion) of the groove 930. In the OLED device 100 having the light emitting layer 330 and the upper electrode 340 separated in the inner portion of the groove 930, the OLED device 100 may block moisture, water, and the like from penetrating into the semiconductor element 250 and the light emitting structure 200. In addition, the substrate 110 may have an opening 910 formed in the opening region 20, and the functional module 700 may be located in the opening 910 (refer to FIG. 1 ). Figure 20 )middle.

[0073] A first organic film layer 111 may be provided. The first organic film layer 111 may include a flexible organic material. For example, the first organic film layer 111 may include a random copolymer or a block copolymer. Furthermore, the first organic film layer 111 may have high transparency, a low coefficient of thermal expansion, and a high glass transition temperature. If the first organic film layer 111 includes imide radicals, the heat resistance, chemical resistance, wear resistance, and electrical properties may be excellent. In an exemplary embodiment, the first organic film layer 111 may include polyimide.

[0074] The first barrier layer 112 may be located on the entire first organic film layer 111. The first barrier layer 112 may block water and / or moisture from penetrating through the first organic film layer 111. The first barrier layer 112 may include an inorganic material having flexibility. In example embodiments, the first barrier layer 112 may include silicon oxide, silicon nitride, or the like. For example, the first barrier layer 112 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), silicon oxycarbide (SiO x C y ), silicon carbonitride (SiC x N y ), aluminum oxide (AlO x ), aluminum nitride (AlN x ), tantalum oxide (TaO x ), hafnium oxide (HfO x ), zirconium oxide (ZrO x ), titanium oxide (TiO x )wait.

[0075] The second organic film layer 113 may be located on the entire first barrier layer 112. In example embodiments, the second organic film layer 113 may have a groove in the peripheral region 30. Therefore, a portion of the second organic film layer 113 located in the peripheral region 30 may be partially removed. The width of the groove may be defined as a second width W2 (refer to FIG. Figure 13 In another embodiment, the portion of the second organic film layer 113 positioned in the peripheral region 30 may be completely removed so that the second organic film layer 113 may have an opening in the peripheral region 30. In this case, the upper surface of the first barrier layer 112 may be exposed through the opening.

[0076] The second organic film layer 113 may include an organic material having flexibility. For example, the second organic film layer 113 may include a random copolymer or a block copolymer. In example embodiments, the second organic film layer 113 may include polyimide.

[0077] The second barrier layer 114 may be located on the entire second organic film layer 113. In example embodiments, the second barrier layer 114 may have an opening in the peripheral region 30. Therefore, the second barrier layer 114 may have a first protruding portion 116 and a second protruding portion 117 protruding in the interior of the groove (or a tip protruding in the interior of the groove) on the groove, and may have an opening defined by the first protruding portion 116 and the second protruding portion 117. For example, the first protruding portion 116 may be positioned adjacent to a boundary of the peripheral region 30 and the opening region 20 (e.g., the opening 910 of the substrate 110). The second protruding portion 117 may face the first protruding portion 116 and may be spaced apart from the first protruding portion 116. The width of the opening of the second barrier layer 114 may have a first width W1 (refer to FIG. 1 ) that is smaller than a second width W2. Figure 13 ). In addition, a space positioned below each of the first protruding portion 116 and the second protruding portion 117 may be defined as a first space 118 and a second space 119 (refer to Figure 14 ). The groove of the second organic film layer 113, the first protruding portion 116 and the second protruding portion 117 of the second barrier layer 114, and the opening of the second barrier layer 114 can be defined as a groove 930, the groove 930 having an expanded lower portion, the groove 930 being formed in the OLED device 100 and positioned in the peripheral area 30. For example, the groove 930 having the expanded lower portion can have an undercut shape. The groove 930 can serve as a blocking pattern capable of blocking water and / or moisture that penetrates from the opening area 20 into the display area 10. In an example embodiment, a plurality of grooves can be formed between the groove 930 and the functional module 700, and can be formed between the light emitting structure 200 positioned adjacent to the boundary of the display area 10 and the peripheral area 30 and the groove 930.

[0078] The second barrier layer 114 may block water and / or moisture that permeates through the second organic film layer 113. The second barrier layer 114 may include an inorganic material having flexibility. In an exemplary embodiment, the second barrier layer 114 may include SiO x , SiN x , etc.

[0079] Accordingly, a substrate 110 including a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114 may be provided.

[0080] In an exemplary embodiment, the substrate 110 includes four layers, but the substrate 110 may include, for example, a single layer or at least two layers.

[0081] In an exemplary embodiment, the substrate 110 may include a transparent or opaque material. For example, the substrate 110 may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluoride-doped quartz substrate, a soda-lime glass substrate, a non-alkali glass substrate, etc.

[0082] A buffer layer may be disposed on the substrate 110 (e.g., the second barrier layer 114). For example, the buffer layer may be disposed on the entire substrate 110 except for the peripheral region 30. In another embodiment, the buffer layer may be disposed on the substrate 110 in the peripheral region 30. In this case, the buffer layer may have an opening that overlaps with the opening of the second barrier layer 114. The buffer layer may help prevent metal atoms and / or impurities from diffusing from the substrate 110 into the semiconductor element 250 and the light-emitting structure 200. In addition, the buffer layer may control the heat transfer rate in the crystallization process for forming the active layer 130, thereby obtaining a substantially uniform active layer 130. Furthermore, when the surface of the substrate 110 is relatively irregular, the buffer layer may improve the surface flatness of the substrate 110. Depending on the type of the substrate 110, at least two buffer layers may be provided on the substrate 110, or the buffer layer may not be provided. For example, the buffer layer may include an organic material or an inorganic material.

[0083] The active layer 130 may be disposed on the substrate 110 in the display region 10. The active layer 130 may include an oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, polycrystalline silicon, etc.), an organic semiconductor, etc. The active layer 130 may have a source region and a drain region.

[0084] The gate insulating layer 150 may be located on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the display area 10 and on the substrate 110, and may not be in the peripheral area 30. Thus, the gate insulating layer 150 may be located only in the display area 10 on the substrate 110. For example, the gate insulating layer 150 may sufficiently cover the active layer 130 on the substrate 110 and may have a substantially flat upper surface without steps around the active layer 130. In another embodiment, the gate insulating layer 150 may cover the active layer 130 on the substrate 110 and may be disposed with a substantially uniform thickness along the contour of the active layer 130. The gate insulating layer 150 may include a silicon compound, a metal oxide, etc. In an exemplary embodiment, the gate insulating layer 150 may have a multi-layer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses from each other or include different materials from each other.

[0085] The gate electrode 170 may be located on the gate insulating layer 150 in the display area 10. The gate electrode 170 may be located on a portion of the gate insulating layer 150 under which the active layer 130 is located. The gate electrode 170 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In another embodiment, the gate electrode 170 may have a multi-layer structure including a plurality of layers.

[0086] The insulating intermediate layer 190 may be located on the gate electrode 170. The insulating intermediate layer 190 may cover the gate electrode 170 in the display area 10 and on the gate insulating layer 150, and may not be in the peripheral area 30. Thus, the insulating intermediate layer 190 may be located only in the display area 10 on the gate insulating layer 150. For example, the insulating intermediate layer 190 may sufficiently cover the gate electrode 170 on the gate insulating layer 150 and may have a substantially flat upper surface without steps around the gate electrode 170. In another embodiment, the insulating intermediate layer 190 may cover the gate electrode 170 on the gate insulating layer 150 and may be disposed with a substantially uniform thickness along the contour of the gate electrode 170. The insulating intermediate layer 190 may include a silicon compound, a metal oxide, etc. In an exemplary embodiment, the insulating intermediate layer 190 may have a multi-layer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0087] The source electrode 210 and the drain electrode 230 may be located on the insulating intermediate layer 190 in the display region 10. The source electrode 210 may be connected to the source region of the active layer 130 via a contact hole formed by removing a first portion of the gate insulating layer 150 and the insulating intermediate layer 190. The drain electrode 230 may be connected to the drain region of the active layer 130 via a contact hole formed by removing a second portion of the gate insulating layer 150 and the insulating intermediate layer 190. Each of the source electrode 210 and the drain electrode 230 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, each of the source electrode 210 and the drain electrode 230 may have a multi-layer structure including a plurality of layers. Accordingly, a semiconductor element 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the insulating intermediate layer 190, the source electrode 210, and the drain electrode 230 may be provided.

[0088] In an exemplary embodiment, for example, the semiconductor element 250 may have a top-gate structure. In another embodiment, the semiconductor element 250 may have a bottom-gate structure, a double-gate structure, etc.

[0089] In addition, for example, the OLED device 100 may include one semiconductor element. In another embodiment, the OLED device 100 may include at least one semiconductor element and at least one capacitor.

[0090] The planarization layer 270 may be located on the insulating intermediate layer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 and on the insulating intermediate layer 190, and may not be in the peripheral region 30. Accordingly, the planarization layer 270 may be located only in the display region 10 on the insulating intermediate layer 190. For example, the planarization layer 270 may be provided with a relatively high thickness in the display region 10. In this case, the planarization layer 270 may have a substantially flat upper surface, and a planarization process may be further performed on the planarization layer 270 to achieve a flat upper surface of the planarization layer 270. In another embodiment, the planarization layer 270 may be provided with a substantially uniform thickness in the display region 10 along the contours of the source electrode 210 and the drain electrode 230 on the insulating intermediate layer 190. The planarization layer 270 may include an organic material or an inorganic material. In an exemplary embodiment, the planarization layer 270 may include an organic material.

[0091] The lower electrode 290 may be located on the planarization layer 270 in the display area 10. The lower electrode 290 may be connected to the drain electrode 230 via a contact hole formed by removing a portion of the planarization layer 270. In addition, the lower electrode 290 may be electrically connected to the semiconductor element 250. The lower electrode 290 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in suitable combination. In example embodiments, the lower electrode 290 may have a multilayer structure including a plurality of layers.

[0092] The pixel defining layer 310 may be located on the planarization layer 270 in the display area 10 and may not be located in the peripheral area 30. Therefore, the pixel defining layer 310 may be located only in the display area 10. For example, the pixel defining layer 310 may cover both lateral portions of the lower electrode 290 and may expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may include an organic material or an inorganic material. In example embodiments, the pixel defining layer 310 may include an organic material.

[0093] The light-emitting layer 330 may be located on the pixel-defining layer 310 and the lower electrode 290 in the display area 10 and may extend in the first direction D1, and may be located on the substrate 110 in the peripheral area 30. In an exemplary embodiment, the light-emitting layer 330 may be partially within the inner portion of the groove 930, and the light-emitting layer 330 in the portion where the groove 930 is located may be separated in the depth direction (e.g., the direction from the second barrier layer 114 to the first organic film layer 111). Therefore, the light-emitting layer 330 may be separated in the peripheral area 30. Therefore, the light-emitting layer 330 may be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0094] For example, when the groove 930 does not have the first protruding portion 116 and the second protruding portion 117, the light-emitting layer 330 can be continuously provided in the portion where the groove 930 is formed, and the light-emitting layer 330 can serve as a permeation path for water and / or moisture. Therefore, a portion of the light-emitting layer 330 (e.g., the distal end of the side of the light-emitting layer 330) can be exposed in the opening area 20, and water and / or moisture can penetrate into the exposed portion of the light-emitting layer 330. In this case, the semiconductor element 250 and the light-emitting structure 200 positioned adjacent to the peripheral area 30 in the display area 10 may be damaged by water and / or moisture. At the same time, according to example embodiments, the OLED device 100 includes a groove 930 having an expanded lower portion. Therefore, the light-emitting layer 330 can be separated in the inner portion of the groove 930, so that the permeation path of the light-emitting layer 330 can be blocked. Therefore, when the light-emitting layer 330 is in the peripheral area 30, defects of the pixels included in the OLED device 100 do not occur.

[0095] The light emitting layer 330 may have a multi-layer structure including an organic light emitting layer ("EML"), a hole injection layer ("HIL"), a hole transport layer ("HTL"), an electron transport layer ("ETL"), an electron injection layer ("EIL"), etc. In example embodiments, the EML, HIL, HTL, ETL, and EIL may be located in the peripheral region 30. In example embodiments, the HIL, HTL, ETL, and EIL except the EML may be located in the peripheral region 30.

[0096] The EML of the light-emitting layer 330 can be formed using at least one of the light-emitting materials that can generate light of different colors (e.g., red light, blue light, and green light, etc.) according to the sub-pixel. In another embodiment, the EML of the light-emitting layer 330 can generally generate white light by stacking multiple light-emitting materials that can generate light of different colors (such as red light, green light, blue light, etc.). In this case, a color filter can be located on the light-emitting layer 330 positioned on the lower electrode 290. The color filter may include at least one selected from a red color filter, a green color filter, and a blue color filter. In another embodiment, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may include a photosensitive resin, a color photoresist, etc.

[0097] The upper electrode 340 may be located on the light-emitting layer 330. The upper electrode 340 may overlap the light-emitting layer 330 in the display area 10 and may extend in the first direction D1. Furthermore, the upper electrode 340 may be located on the light-emitting layer 330 in the peripheral area 30. In an exemplary embodiment, the upper electrode 340 may be partially located within the inner portion of the groove 930, and the upper electrode 340 in the portion where the groove 930 is located may be separated in the depth direction. Therefore, the upper electrode 340 may be separated in the peripheral area 30. Therefore, the upper electrode 340 may be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0098] For example, when the groove 930 does not have the first protruding part 116 and the second protruding part 117, the upper electrode 340 can be continuously provided in the part where the groove 930 is formed, and the upper electrode 340 can serve as a permeation path for water and / or moisture. Accordingly, a part of the upper electrode 340 (e.g., the distal side of the upper electrode 340) can be exposed in the opening area 20, and water and / or moisture can permeate into the exposed part of the upper electrode 340. In this case, the semiconductor element 250 and the light-emitting structure 200 positioned adjacent to the peripheral area 30 in the display area 10 may be damaged by water and / or moisture. Meanwhile, according to the exemplary embodiment, the OLED device 100 may include the groove 930 having an extended lower part. Accordingly, the upper electrode 340 can be separated in the inner part of the groove 930. Accordingly, when the upper electrode 340 is separated in the inner part of the groove 930, the permeation path of the upper electrode 340 can be blocked. Accordingly, when the upper electrode 340 is in the peripheral area 30, defects of the pixels included in the OLED device 100 do not occur.

[0099] The upper electrode 340 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In the exemplary embodiment, the upper electrode 340 may have a multi-layer structure including a plurality of layers.

[0100] Accordingly, the light-emitting structure 200 including the lower electrode 290, the light-emitting layer 330, and the upper electrode 340 can be provided.

[0101] The cover layer may be located on the upper electrode 340. The cover layer may be stacked with the upper electrode 340 in the display area 10 and may extend in the first direction D1, and may be located on the upper electrode 340 in the peripheral area 30. In the exemplary embodiment, the cover layer may be partially in the inner part of the groove 930, and the cover layer in the part where the groove 930 is located may be separated in the depth direction. Accordingly, the cover layer can be separated in the peripheral area 30. Accordingly, the cover layer can be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0102] For example, when the groove 930 does not have the first protruding portion 116 and the second protruding portion 117, the cover layer may be continuously provided in the portion where the groove 930 is formed, and the cover layer may serve as a permeation path for water and / or moisture. Accordingly, a part of the cover layer (e.g., the distal side of the cover layer) may be exposed in the opening region 20, and water and / or moisture may permeate into the exposed portion of the cover layer. In this case, the semiconductor element 250 and the light emitting structure 200 positioned adjacent to the peripheral region 30 in the display region 10 may be damaged by water and / or moisture. Meanwhile, according to the exemplary embodiment, the OLED device 100 includes the groove 930 having an extended lower portion. Accordingly, the cover layer may be separated in the inner portion of the groove 930. Thus, when the cover layer is separated in the inner portion of the groove 930, the permeation path of the cover layer may be blocked. Therefore, when the cover layer is in the peripheral region 30, defects of the pixels included in the OLED device 100 do not occur.

[0103] The cover layer may protect the light emitting structure 200 and may include an organic material or an inorganic material. In the exemplary embodiment, the cover layer may include an organic material such as a triamine derivative, an arylenediamine derivative, 4,4'-N,N'-dicarbazole-biphenyl ("CBP"), tris(8-hydroxyquinoline)aluminum ("Alq3"), etc.

[0104] The first TFE layer 451 may be on the upper electrode 340 in the display region 10 and the peripheral region 30. The first TFE layer 451 may cover the upper electrode 340 in the display region 10, may be provided with a substantially uniform thickness along the contour of the upper electrode 340, and may extend in the peripheral region 30. The first TFE layer 451 may be provided along the contour of the upper electrode 340 in the peripheral region 30. Accordingly, the first TFE layer 451 may be continuously provided in the portion where the groove 930 is formed. In the exemplary embodiment, the first TFE layer 451 may completely cover the groove 930. Accordingly, the first TFE layer 451 may cover the first protruding portion 116 and the second protruding portion 117, and may be in the first space 118 and the second space 119 and completely cover the light emitting layer 330 and the upper electrode 340 provided inside the groove 930. Accordingly, the first TFE layer 451 may be in direct contact with the second organic film layer 113 in the first space 118 and the second space 119. The first TFE layer 451 may help prevent the light emitting structure 200 from deteriorating due to the permeation of moisture, water, oxygen, etc. In addition, the first TFE layer 451 may protect the light emitting structure 200 from the influence of external impact. The first TFE layer 451 may include a flexible inorganic material.

[0105] The second TFE layer 452 may be located on the first TFE layer 451 in the display area 10 and may not be located in the peripheral area 30. Therefore, the second TFE layer 452 may be located only in the display area 10. In another embodiment, the second TFE layer 452 may be located in a portion of the peripheral area 30. The second TFE layer 452 may improve the flatness of the OLED device 100 and may protect the light emitting structure 200. The second TFE layer 452 may include an organic material having flexibility.

[0106] The third TFE layer 453 may be located on the second TFE layer 452 in the display area 10 and on the first TFE layer 451 in the peripheral area 30. The third TFE layer 453 may cover the second TFE layer 452 in the display area 10 and may be provided with a substantially uniform thickness along the contour of the second TFE layer 452 and may extend into the peripheral area 30. The third TFE layer 453 may be provided with a substantially uniform thickness along the contour of the first TFE layer 451 in the peripheral area 30. Therefore, the third TFE layer 453 may be continuously formed in the portion where the groove 930 is formed. Together with the first TFE layer 451, the third TFE layer 453 may help prevent degradation of the light emitting structure 200 due to the penetration of moisture, water, oxygen, and the like. Furthermore, the third TFE layer 453, together with the first and second TFE layers 451 and 452, may protect the light emitting structure 200 from external impacts. The third TFE layer 453 may include a flexible inorganic material.

[0107] Thus, a TFE structure 450 including a first TFE layer 451, a second TFE layer 452, and a third TFE layer 453 may be provided. In another embodiment, the TFE structure 450 may have a five-layer structure having first to fifth TFE layers stacked or a seven-layer structure having first to seventh TFE layers stacked.

[0108] The first insulating layer 390 may be located on the third TFE layer 453 in the display area 10 and the peripheral area 30. The first insulating layer 390 may cover the third TFE layer 453 in the display area 10 and may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 and may extend in the peripheral area 30. The first insulating layer 390 may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral area 30. Therefore, the first insulating layer 390 may be provided continuously in the portion where the first insulating layer 390 is formed. The first insulating layer 390 may include an organic material or an inorganic material. In another embodiment, the first insulating layer 390 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials.

[0109] The organic insulating pattern 490 may be located on the first insulating layer 390 in the peripheral region 30. In an exemplary embodiment, the organic insulating pattern 490 may be only in the peripheral region 30. In another embodiment, the organic insulating pattern 490 may be in a part of the display region 10. The organic insulating pattern 490 may be disposed on the first insulating layer 390 in the peripheral region 30 with a relatively high thickness. In this case, the organic insulating pattern 490 may have a substantially flat upper surface, and a planarization process may be further performed on the organic insulating pattern 490 to achieve a flat upper surface of the organic insulating pattern 490. In another embodiment, the organic insulating pattern 490 may be disposed on the first insulating layer 390 in the display region 10 along the contour of the first insulating layer 390 with a substantially uniform thickness. In an exemplary embodiment, the organic insulating pattern 490 may include an organic material such as a photoresist, a polyacrylic resin, a polyimide resin, a polyamide resin, a silicone resin, an acrylic resin, an epoxy resin, etc.

[0110] The first touch screen electrode 382 and the second touch screen electrode 384 may be located on the first insulating layer 390 in the display region 10. As Figure 9 shown, each first touch screen electrode 382 may extend in the first direction D1 and may be spaced apart from each other in the second direction D2. The second touch screen electrode 384 may be spaced apart from each other in the first direction D1 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, each of the first touch screen electrode 382 and the second touch screen electrode 384 may include a carbon nanotube (CNT), a transparent conductive oxide (such as ITO, indium gallium zinc oxide (IGZO), ZnO), graphene, an Ag nanowire (AgNW), Cu, Cr, etc.

[0111] The second insulating layer 395 may be located on the first touch screen electrode 382 and the second touch screen electrode 384 in the display region 10. The second insulating layer 395 may cover the first touch screen electrode 382 and the second touch screen electrode 384 in the display region 10, and may be disposed with a substantially uniform thickness along the contours of the first touch screen electrode 382 and the second touch screen electrode 384 and may extend in the peripheral region 30. The second insulating layer 395 may be disposed along the contour of the organic insulating pattern 490 in the peripheral region 30. Accordingly, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display region 10 and may contact the upper surface of the organic insulating pattern 490 in the peripheral region 30. The second insulating layer 395 may include an organic material or an inorganic material. In another embodiment, the second insulating layer 395 may have a multilayer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0112] The touchscreen connection electrode 386 can be located on the second insulating layer 395 in the display area 10. As Figure 9 shown, the touchscreen connection electrode 386 can electrically connect two adjacent second touchscreen electrodes 384 among the second touchscreen electrodes 384 in the second direction D2 through a contact hole. For example, the touchscreen connection electrode 386, the first touchscreen electrode 382, and the second touchscreen electrode 384 can have the same material. In another embodiment, the touchscreen connection electrode 386 can include metals, alloys of metals, metal nitrides, conductive metal oxides, transparent conductive materials, etc. These can be used alone or in suitable combinations thereof.

[0113] The conductive pattern 400 can be located on the second insulating layer 395 in the peripheral area 30. In an exemplary embodiment, in order to detect damage to the second protruding portion 117 (or the first protruding portion 116), the conductive pattern 400 can be superimposed on the second protruding portion 117 of the groove 930. In another embodiment, the conductive pattern 400 can be superimposed on the first protruding portion 116.

[0114] For example, the conductive pattern 400 on the groove 930 can be arranged along the contour of the second protruding portion 117 of the groove 930. The conductive pattern 400 can substantially surround the functional module 700 (or the opening 910). The conductive pattern 400 can include a first sub-conductive pattern 401 and a second sub-conductive pattern 402 (refer to Figure 6 ). The first sub-conductive pattern 401 can have a circular planar shape including a local opening with an opening portion, and the second sub-conductive pattern 402 can extend from the opening portion of the first sub-conductive pattern 401 in the second direction D2. In an exemplary embodiment, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 can be integrally formed at the same layer.

[0115] In another embodiment, the first sub-conductive pattern 401 can be located on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 can be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. In another embodiment, the second sub-conductive pattern 402 can be located on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 can be connected to the distal end of the second sub-conductive pattern 402 through a contact hole.

[0116] The first sub-conductive pattern 401 can be superimposed on the groove 930. For example, the first sub-conductive pattern 401 can be superimposed on the outermost part of the groove 930. Therefore, the first sub-conductive pattern 401 can be superimposed on the outer boundary of the groove. In another embodiment, the first sub-conductive pattern 401 can be superimposed on the innermost part of the groove 930. Therefore, the first sub-conductive pattern 401 can be superimposed on the inner boundary of the groove 930.

[0117] The conductive pattern 400 and the touch screen connection electrode 386 may be formed simultaneously using the same material. In another embodiment, the conductive pattern 400 and the first touch screen electrode 382 and the second touch screen electrode 384 may be formed simultaneously using the same material.

[0118] The protective insulating layer 410 may be located on the second insulating layer 395, the touch screen connection electrodes 386, and the conductive pattern 400 in the display area 10 and the peripheral area 30. The protective insulating layer 410 may be provided on the second insulating layer 395 with a relatively high thickness. In this case, the protective insulating layer 410 may have a substantially flat upper surface. In another embodiment, the protective insulating layer 410 may cover the touch screen connection electrodes 386 and the conductive pattern 400 in the display area 10 and the peripheral area 30 and on the second insulating layer 395, and may be provided with a substantially uniform thickness along the contours of the touch screen connection electrodes 386 and the conductive pattern 400. The protective insulating layer 410 may include an organic material or an inorganic material. In an example embodiment, the protective insulating layer 410 may include an organic material.

[0119] As described above, the touch screen structure 380 including the first insulating layer 390 , the first touch screen electrodes 382 , the second touch screen electrodes 384 , the second insulating layer 395 , the touch screen connection electrodes 386 , and the protective insulating layer 410 may be arranged.

[0120] The functional module 700 may be located in the opening region 20. In example embodiments, the functional module 700 may contact side surfaces of the substrate 110, side surfaces of the light emitting layer 330, side surfaces of the upper electrode 340, side surfaces of the first TFE layer 451, side surfaces of the third TFE layer 453, side surfaces of the first insulating layer 390, side surfaces of the organic insulating pattern 490, side surfaces of the second insulating layer 395, and side surfaces of the protective insulating layer 410 in a boundary between the peripheral region 30 and the opening region 20.

[0121] For example, the functional module 700 may include a camera module, a facial recognition sensor module, a pupil recognition sensor module, an acceleration and geomagnetic sensor module, a proximity and infrared sensor module, and a light intensity sensor module, etc. In an exemplary embodiment, a vibration or haptic module for indicating an incoming alarm, a speaker module for outputting sound, etc. may be located in the opening 910.

[0122] The OLED device 100 according to the example embodiment includes the conductive pattern 400, the pad electrode 470, and the connection wiring 370. Therefore, the OLED device 100 can check whether the second protrusion 117 is damaged. Therefore, the defect rate of the OLED device 100 can be reduced by checking whether the second protrusion 117 is damaged.

[0123] Figures 10 to 20 It is a cross-sectional view showing a method of manufacturing an OLED device according to an exemplary embodiment.

[0124] Referring to Figure 10 , a rigid glass substrate 105 can be provided. A first organic film layer 111 can be formed on the rigid glass substrate 105. The first organic film layer 111 can be formed over the entire rigid glass substrate 105 and can be formed using a flexible organic material such as polyimide.

[0125] A first barrier layer 112 can be formed over the entire first organic film layer 111. The first barrier layer 112 can block water and / or moisture permeating through the first organic film layer 111. The first barrier layer 112 can be formed using a flexible inorganic material such as silicon oxide, silicon nitride, etc. For example, the first barrier layer 112 can include SiO x , SiN x , SiO x N y , SiO x C y , SiC x N y , AlO x , AlN x , TaO x , HfO x , ZrO x , TiO x , etc.

[0126] A second organic film layer 113 can be formed on the first barrier layer 112. The second organic film layer 113 can be formed over the entire first barrier layer 112 and can be formed using a flexible organic material such as polyimide.

[0127] A second barrier layer 114 can be formed over the entire second organic film layer 113. The second barrier layer 114 can block water and / or moisture permeating through the second organic film layer 113. The second barrier layer 114 can be formed using a flexible inorganic material such as SiO x , SiN x , etc.

[0128] Thus, a substrate 110 including the first organic film layer 111, the first barrier layer 112, the second organic film layer 113, and the second barrier layer 114 can be formed.

[0129] The substrate 110 can be relatively thin and flexible. Therefore, the substrate 110 can be formed on the rigid glass substrate 105 to help support the formation of the upper structure (for example, a semiconductor element and a light-emitting structure, etc.). For example, after the upper structure is formed on the substrate 110, the rigid glass substrate 105 can be removed. Because the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114 are relatively thin and flexible, it may not be easy to directly form the upper structure on the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114. Therefore, the upper structure can be formed on the substrate 110 and the rigid glass substrate 105, and then after removing the rigid glass substrate 105, the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114 can be used as the substrate 110.

[0130] A buffer layer may be formed on the substrate 110. The buffer layer may be formed over the entire substrate 110. The buffer layer may help prevent the diffusion of metal atoms and / or impurities from the substrate 110. Furthermore, the buffer layer may control the heat transfer rate during the crystallization process used to form the active layer, thereby obtaining a substantially uniform active layer. Furthermore, when the surface of the substrate 110 is relatively irregular, the buffer layer may improve the surface flatness of the substrate 110. Depending on the type of substrate 110, at least two buffer layers may be provided on the substrate 110, or no buffer layer may be formed. For example, the buffer layer may be formed using an organic material or an inorganic material.

[0131] Reference Figure 11 , an active layer 130 may be formed in the display region 10 and on the substrate 110. The active layer 130 may be formed using an oxide semiconductor, an inorganic semiconductor, an organic semiconductor, etc. The active layer 130 may have a source region and a drain region.

[0132] A gate insulating layer 150 may be formed on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the display area 10 and on the substrate 110, and may extend from the display area 10 to the opening area 20 in the first direction D1. Therefore, the gate insulating layer 150 may be formed on the entire substrate 110. For example, the gate insulating layer 150 may fully cover the active layer 130 on the substrate 110 and may have a substantially flat upper surface without steps around the active layer 130. In another embodiment, the gate insulating layer 150 may cover the active layer 130 on the substrate 110 and may be formed with a substantially uniform thickness along the contour of the active layer 130. The gate insulating layer 150 may be formed using a silicon compound, a metal oxide, or the like. In another embodiment, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses or include different materials from each other.

[0133] The gate electrode 170 may be formed over the gate insulating layer 150 in the display region 10. The gate electrode 170 may be formed over a portion of the gate insulating layer 150 under which the active layer 130 is positioned. The gate electrode 170 may be formed of metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In another embodiment, the gate electrode 170 may have a multi-layer structure including a plurality of layers.

[0134] The insulating intermediate layer 190 may be formed over the gate electrode 170. The insulating intermediate layer 190 may cover the gate electrode 170 over the gate insulating layer 150 in the display region 10 and may extend in a first direction D1. Accordingly, the insulating intermediate layer 190 may be formed over the entire gate insulating layer 150. For example, the insulating intermediate layer 190 may sufficiently cover the gate electrode 170 over the gate insulating layer 150 and may have a substantially flat upper surface without steps around the gate electrode 170. In another embodiment, the insulating intermediate layer 190 may cover the gate electrode 170 over the gate insulating layer 150 and may be formed with a substantially uniform thickness along the contour of the gate electrode 170. The insulating intermediate layer 190 may be formed of a silicon compound, metal oxide, etc. In an exemplary embodiment, the insulating intermediate layer 190 may have a multi-layer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0135] Referring Figure 12 , the source electrode 210 and the drain electrode 230 may be formed over the insulating intermediate layer 190 in the display region 10. The source electrode 210 may be connected to the source region of the active layer 130 via a contact hole formed by removing a first portion of the gate insulating layer 150 and the insulating intermediate layer 190. The drain electrode 230 may be connected to the drain region of the active layer 130 via a contact hole formed by removing a second portion of the gate insulating layer 150 and the insulating intermediate layer 190. Each of the source electrode 210 and the drain electrode 230 may include metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, each of the source electrode 210 and the drain electrode 230 may have a multi-layer structure including a plurality of layers. Accordingly, the semiconductor element 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the insulating intermediate layer 190, the source electrode 210, and the drain electrode 230 may be formed.

[0136] A planarization layer 270 may be formed on the insulating intermediate layer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 and on the insulating intermediate layer 190, and may not be formed in the peripheral region 30. Accordingly, the planarization layer 270 may be formed only in the display region 10 and on the insulating intermediate layer 190. For example, the planarization layer 270 may be formed with a relatively high thickness in the display region 10. In this case, the planarization layer 270 may have a substantially flat upper surface, and a planarization process may be further performed on the planarization layer 270 to achieve the flat upper surface of the planarization layer 270. In another embodiment, the planarization layer 270 may be formed in the display region 10 and on the insulating intermediate layer 190 along the contours of the source electrode 210 and the drain electrode 230 with a substantially uniform thickness. The planarization layer 270 may be formed of an organic material.

[0137] A lower electrode 290 may be formed in the display region 10 and on the planarization layer 270. The lower electrode 290 may be connected to the drain electrode 230 via a contact hole formed by removing a part of the planarization layer 270. In addition, the lower electrode 290 may be electrically connected to the semiconductor element 250. The lower electrode 290 may be formed of a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an exemplary embodiment, the lower electrode 290 may have a multi-layer structure including a plurality of layers.

[0138] Referring to Figure 13 , after forming the lower electrode 290, the gate insulating layer 150 and the insulating intermediate layer 190 positioned in the peripheral region 30 may be removed. After removing the gate insulating layer 150 and the insulating intermediate layer 190 positioned in the peripheral region 30, a groove 930 having an extended lower portion may be formed in the substrate 110 positioned in the peripheral region 30 by a laser or a dry etching process. The groove 930 may have an undercut shape. For example, a trench having a second width W2 formed in the second organic film layer 113 and an opening having a first width W1 smaller than the second width W2 formed in the second barrier layer 114 may be defined as an undercut shape. In another embodiment, an opening having a second width W2 formed in the second organic film layer 113 and an opening having a first width W1 smaller than the second width W2 formed in the second barrier layer 114 may be defined as an undercut shape. In this case, the upper surface of the first barrier layer 112 may be exposed through the opening of the second organic film layer 113.

[0139] The first protruding portion 116 and the second protruding portion 117 protruding in the inner side portion of the trench on the trench of the second organic film layer 113 may be defined by the opening of the second barrier layer 114. For example, the first protruding portion 116 may be positioned adjacent to the boundary between the peripheral region 30 and the opening region 20. The second protruding portion 117 may face the first protruding portion 116 and may be spaced apart from the first protruding portion 116. In addition, spaces positioned below each of the first protruding portion 116 and the second protruding portion 117 may be defined as a first space 118 and a second space 119 (refer to Figure 14 ). Accordingly, the trench of the second organic film layer 113, the first protruding portion 116 and the second protruding portion 117 of the second barrier layer 114, and the opening of the second barrier layer 114 may be defined as a recess 930 formed in the substrate 110 positioned in the peripheral region 30, the recess 930 having an expanded lower portion. In an exemplary embodiment, a plurality of recesses may be formed to be spaced apart from the recess 930 in a first direction D1 and may be formed to be spaced apart from the recess 930 in a direction opposite to the first direction D1.

[0140] Refer to Figure 14 , a pixel defining layer 310 may be formed in the display region 10 and on the planarization layer 270, and the pixel defining layer 310 may not be formed in the peripheral region 30. Accordingly, the pixel defining layer 310 may be formed only in the display region 10. For example, the pixel defining layer 310 may cover two lateral portions of the lower electrode 290 and may expose a part of the upper surface of the lower electrode 290. The pixel defining layer 310 may be formed of an organic material.

[0141] The light emitting layer 330 may be formed in the display region 10 on the lower electrode 290 and the pixel defining layer 310 and may extend in a first direction D1, and may be formed in the peripheral region 30. In an exemplary embodiment, the light emitting layer 330 may be partially formed in the inner side portion of the recess 930, and the light emitting layer 330 positioned in the portion where the recess 930 is positioned may be separated in a depth direction. Accordingly, the light emitting layer 330 may be separated in the peripheral region 30. Accordingly, the light emitting layer 330 may be separated by the first space 118 and the second space 119 in the peripheral region 30.

[0142] The light emitting layer 330 may have a multilayer structure including an EML, a HIL, a HTL, an ETL, an EIL, etc. In an exemplary embodiment, the EML, the HIL, the HTL, the ETL, and the EIL may be formed in the peripheral region 30. In an exemplary embodiment, the HIL, the HTL, the ETL, and the EIL except for the EML may be formed in the peripheral region 30.

[0143] The EML of the light-emitting layer 330 can be formed using at least one light-emitting material that can emit light of different colors (e.g., red light, blue light, green light, etc.) according to sub-pixels. In another embodiment, the EML of the light-emitting layer 330 can generally generate white light by stacking a plurality of light-emitting materials that can emit light of different colors (such as red light, green light, blue light, etc.). In this case, a color filter can be formed on the light-emitting layer 330 formed on the lower electrode 290. The color filter can include at least one selected from a red color filter, a green color filter, and a blue color filter. In another embodiment, the color filter can include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter can be formed using a photosensitive resin, a color photoresist, etc.

[0144] An upper electrode 340 can be formed on the light-emitting layer 330. The upper electrode 340 can be formed to overlap the light-emitting layer 330 in the display area 10 and can extend in the first direction D1, and can be formed on the light-emitting layer 330 in the peripheral area 30. In an exemplary embodiment, the upper electrode 340 can be partially formed in the inner portion of the groove 930, and the upper electrode 340 located in the portion where the groove 930 is located can be separated in the depth direction. Therefore, the upper electrode 340 can be separated in the peripheral area 30. Therefore, the upper electrode 340 can be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0145] The upper electrode 340 can be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These can be used alone or in a suitable combination. In an exemplary embodiment, the upper electrode 340 can have a multi-layer structure including a plurality of layers.

[0146] Therefore, a light-emitting structure 200 including the lower electrode 290, the light-emitting layer 330, and the upper electrode 340 can be formed.

[0147] Referring to Figure 15 , a cover layer can be formed on the upper electrode 340. The cover layer can be formed to overlap the upper electrode 340 in the display area 10 and can extend in the first direction D1, and can be formed on the upper electrode 340 in the peripheral area 30. In an exemplary embodiment, the cover layer can be partially formed in the inner portion of the groove 930, and the cover layer located in the portion where the groove 930 is located can be separated in the depth direction. Therefore, the cover layer can be separated in the peripheral area 30. Therefore, the cover layer can be separated by the first space 118 and the second space 119 in the peripheral area 30. The cover layer can protect the light-emitting structure 200 and can be formed using an organic material such as a triamine derivative, an arylenediamine derivative, CBP, Alq3, etc.

[0148] The first TFE layer 451 may be formed on the upper electrode 340 in the display region 10 and the peripheral region 30. The first TFE layer 451 may cover the upper electrode 340 in the display region 10, and may be formed along the contour of the upper electrode 340 with a substantially uniform thickness and may extend in the peripheral region 30. The first TFE layer 451 may be formed along the contour of the upper electrode 340 in the peripheral region 30. Accordingly, the first TFE layer 451 may be continuously formed in the portion where the groove 930 is formed. In an exemplary embodiment, the first TFE layer 451 may completely cover the groove 930. Accordingly, the first TFE layer 451 may cover the first protruding portion 116 and the second protruding portion 117, and may be formed in the first space 118 and the second space 119 and may completely cover the light-emitting layer 330 and the upper electrode 340 formed inside the groove 930. Accordingly, the first TFE layer 451 may be in direct contact with the second organic film layer 113 in the first space 118 and the second space 119. The first TFE layer 451 may help prevent the light-emitting structure 200 from deteriorating due to the penetration of moisture, water, oxygen, etc. In addition, the first TFE layer 451 may protect the light-emitting structure 200 from the influence of external impact. The first TFE layer 451 may be formed of a flexible inorganic material.

[0149] The second TFE layer 452 may be formed on the first TFE layer 451 in the display region 10, and may not be formed in the peripheral region 30. Accordingly, the second TFE layer 452 may be formed only in the display region 10. The second TFE layer 452 may improve the flatness of the OLED device 100, and may protect the light-emitting structure 200. The second TFE layer 452 may be formed of a flexible organic material.

[0150] Referring to Figure 16 , the third TFE layer 453 may be formed on the second TFE layer 452 in the display region 10 and on the first TFE layer 451 in the peripheral region 30. The third TFE layer 453 may cover the second TFE layer 452 in the display region 10, and may be formed along the contour of the second TFE layer 452 with a substantially uniform thickness, and may extend in the peripheral region 30. The third TFE layer 453 may be formed along the contour of the first TFE layer 451 with a substantially uniform thickness in the peripheral region 30. Accordingly, the third TFE layer 453 may be continuously formed in the portion where the groove 930 is formed. The third TFE layer 453 together with the first TFE layer 451 may help prevent the light-emitting structure 200 from deteriorating due to the penetration of moisture, water, oxygen, etc. In addition, the third TFE layer 453 together with the first TFE layer 451 and the second TFE layer 452 may protect the light-emitting structure 200 from the influence of external impact. The third TFE layer 453 may be formed of a flexible inorganic material.

[0151] Accordingly, a TFE structure 450 including a first TFE layer 451, a second TFE layer 452, and a third TFE layer 453 can be formed. In another embodiment, the TFE structure 450 can have a five-layer structure in which the first to fifth TFE layers are stacked or a seven-layer structure in which the first to seventh TFE layers are stacked.

[0152] A first insulating layer 390 can be formed over the third TFE layer 453 in the display area 10 and the peripheral area 30. The first insulating layer 390 can cover the third TFE layer 453 in the display area 10, and can be disposed with a substantially uniform thickness along the contour of the third TFE layer 453 and can extend in the peripheral area 30. The first insulating layer 390 can be formed with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral area 30. Accordingly, the first insulating layer 390 can be continuously formed in the portion where the first insulating layer 390 is formed. The first insulating layer 390 can be formed of an organic material or an inorganic material. In another embodiment, the first insulating layer 390 can have a multi-layer structure including a plurality of insulating layers. For example, the insulating layers can have different thicknesses from each other or include different materials from each other.

[0153] Referring to Figure 17 , an organic insulating pattern 490 can be formed over the first insulating layer 390 in the peripheral area 30. In an exemplary embodiment, the organic insulating pattern 490 can be formed only in the peripheral area 30. The organic insulating pattern 490 can be formed over the first insulating layer 390 with a relatively high thickness in the peripheral area 30. In this case, the organic insulating pattern 490 can have a substantially flat upper surface, and a planarization process can be further performed on the organic insulating pattern 490 to achieve a flat upper surface of the organic insulating pattern 490. In another embodiment, the organic insulating pattern 490 can be formed over the first insulating layer 390 with a substantially uniform thickness along the contour of the first insulating layer 390 in the display area 10. The organic insulating pattern 490 can be formed of an organic material (such as a photoresist, a polyacrylate resin, a polyimide resin, a polyamide resin, a silicone resin, an acrylic resin, an epoxy resin, etc.).

[0154] Referring to Figure 18 , a first touch screen electrode 382 and a second touch screen electrode 384 can be formed over the first insulating layer 390 in the display area 10 (refer to Figure 9)。Each first touch screen electrode 382 may extend in a first direction D1 and may be spaced apart from each other in a second direction D2. The second touch screen electrodes 384 may be spaced apart from each other in the first direction D1 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, carbon nanotubes (CNT), transparent conductive oxides (such as ITO, indium gallium zinc oxide (IGZO), ZnO), graphene, Ag nanowires (AgNW), Cu, Cr, etc. may be used to form each of the first touch screen electrodes 382 and the second touch screen electrodes 384.

[0155] A second insulating layer 395 may be formed on the first touch screen electrodes 382 and the second touch screen electrodes 384 in the display area 10. The second insulating layer 395 may cover the first touch screen electrodes 382 and the second touch screen electrodes 384 in the display area 10, and may be formed with a substantially uniform thickness along the contours of the first touch screen electrodes 382 and the second touch screen electrodes 384 and may extend in the peripheral area 30. The second insulating layer 395 may be formed along the contour of the organic insulating pattern 490 in the peripheral area 30. Accordingly, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display area 10, and may contact the upper surface of the organic insulating pattern 490 in the peripheral area 30. The second insulating layer 395 may be formed using an organic material or an inorganic material. In another embodiment, the second insulating layer 395 may have a multi-layer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0156] Referring to Figure 19 , a touch screen connection electrode 386 may be formed on the second insulating layer 395 in the display area 10 (refer to Figure 9 ). The touch screen connection electrode 386 may electrically connect two second touch screen electrodes 384 adjacent to each other in the second direction D2 among the second touch screen electrodes 384 through a contact hole. For example, the touch screen connection electrode 386, the first touch screen electrodes 382, and the second touch screen electrodes 384 may be formed using the same material. In another embodiment, the touch screen connection electrode 386 may be formed using a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof.

[0157] A conductive pattern 400 may be formed on the second insulating layer 395 in the peripheral area 30. In an exemplary embodiment, in order to detect damage to the second protruding portion 117, the conductive pattern 400 may be formed to overlap the second protruding portion 117 of the groove 930. In another embodiment, the conductive pattern 400 may be formed to overlap the first protruding portion 116 of the groove 930.

[0158] For example, the conductive pattern 400 on the groove 930 may be formed along the contour of the second protruding portion 117 of the groove 930. The conductive pattern 400 may substantially surround the opening region 20. The conductive pattern 400 may include a first sub-conductive pattern 401 and a second sub-conductive pattern 402 (refer to Figure 6 ). The first sub-conductive pattern 401 may have a circular planar shape including a local opening with an opening portion, and the second sub-conductive pattern 402 may extend from the opening portion of the first sub-conductive pattern 401 in the second direction D2. In an exemplary embodiment, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 may be integrally formed at the same layer.

[0159] In another embodiment, the first sub-conductive pattern 401 may be formed on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. Alternatively, the second sub-conductive pattern 402 may be formed on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole.

[0160] The first sub-conductive pattern 401 may be formed to overlap with the groove 930. For example, the first sub-conductive pattern 401 may be formed to overlap with the second protruding portion 117 of the groove 930. In another embodiment, the first sub-conductive pattern 401 may overlap with the first protruding portion 116 of the groove 930.

[0161] The conductive pattern 400 and the touch screen connection electrode 386 may be formed simultaneously using the same material. In another embodiment, the conductive pattern 400 and the first touch screen electrode 382 and the second touch screen electrode 384 may be formed simultaneously using the same material.

[0162] A protective insulating layer 410 may be formed in the display region 10 and the peripheral region 30 and on the second insulating layer 395, the touch screen connection electrode 386, and the conductive pattern 400. The protective insulating layer 410 may be formed with a relatively high thickness on the second insulating layer 395. In this case, the protective insulating layer 410 may have a substantially flat upper surface. In another embodiment, the protective insulating layer 410 may cover the touch screen connection electrode 386 and the conductive pattern 400 in the display region 10 and the peripheral region 30 and on the second insulating layer 395, and may be formed with a substantially uniform thickness along the contours of the touch screen connection electrode 386 and the conductive pattern 400. The protective insulating layer 410 may be formed using an organic material.

[0163] As described above, the touch screen structure 380 including the first insulating layer 390 , the first touch screen electrodes 382 , the second touch screen electrodes 384 , the second insulating layer 395 , the touch screen connection electrodes 386 , and the protective insulating layer 410 may be formed.

[0164] After forming the touch screen structure 380, a laser may be irradiated in the opening region 20 and on the protective insulating layer 410. In another embodiment, a different etching process may be performed to expose the opening region 20 on the protective insulating layer 410.

[0165] Reference Figure 20 and Figure 8 , an opening 910 may be formed in the opening region 20 by laser irradiation, and a functional module 700 may be formed in the opening 910. In an example embodiment, the functional module 700 may be in contact with the side surface of the substrate 110, the side surface of the light emitting layer 330, the side surface of the upper electrode 340, the side surface of the first TFE layer 451, the side surface of the third TFE layer 453, the side surface of the first insulating layer 390, the side surface of the organic insulating pattern 490, the side surface of the second insulating layer 395, and the side surface of the protective insulating layer 410 in the boundary between the peripheral region 30 and the opening region 20. For example, the functional module 700 may include a camera module, a facial recognition sensor module, a pupil recognition sensor module, an acceleration and geomagnetic sensor module, a proximity and infrared sensor module, and a light intensity sensor module, etc. After the functional module 700 is formed, the rigid glass substrate 105 may be removed from the substrate 110. Thus, it is possible to manufacture Figure 8 The OLED device 100 shown in FIG.

[0166] Figure 21 is a plan view showing an OLED device according to an example embodiment, Figure 22 corresponds to Figure 21 A partially enlarged plan view of area "B". Figure 23 corresponds to Figure 21 A partially enlarged plan view of area "B" Figure 24 It is along Figure 22 In addition to the conductive pattern 1400, Figure 21 、 Figure 22 and Figure 24 The OLED device 500 shown in FIG. 5 may have the same Figures 1 to 9 The configuration of the OLED device 100 described is substantially the same or similar. Figure 21 、 Figure 22 and Figure 24 In the example, you can avoid duplication of references Figures 1 to 9 Detailed description of elements that are substantially the same or similar to the elements described.

[0167] Reference Figure 21 、 Figure 22 and Figure 24 OLED device 500 may include substrate 110, semiconductor element 250, planarization layer 270, light emitting structure 200, pixel defining layer 310, TFE structure 450, touch screen structure 380, organic insulation pattern 490, conductive pattern 1400, functional module 700, etc. Substrate 110 may include first organic film layer 111, first barrier layer 112, second organic film layer 113, and second barrier layer 114. Since OLED device 500 has display area 10, opening area 20, peripheral area 30, and pad area 40, substrate 110 may be divided into display area 10, opening area 20, peripheral area 30, and pad area 40. In addition, touch screen structure 380 may include first insulating layer 390, multiple first touch screen electrodes 382, multiple second touch screen electrodes 384, multiple touch screen connection electrodes 386, second insulating layer 395, and protective insulating layer 410.

[0168] The conductive pattern 1400 may be located on the second insulating layer 395 in the peripheral region 30. In example embodiments, to detect damage of the first and second protruding portions 116 and 117, the conductive pattern 1400 may overlap the first and second protruding portions 116 and 117 of the groove 930.

[0169] For example, the conductive pattern 1400 on the groove 930 may be arranged along the contours of the first protruding portion 116 and the second protruding portion 117 of the groove 930. Figure 22 As shown in , the conductive pattern 1400 may include a first sub-conductive pattern, a second sub-conductive pattern, a third sub-conductive pattern, and a fourth sub-conductive pattern. The first sub-conductive pattern may have a circular planar shape including a top opening portion and a partially opened bottom opening portion, and may overlap with the second protruding portion 117 of the groove 930. The second sub-conductive pattern may have a circular planar shape including a partially opened bottom opening portion, and may overlap with the first protruding portion 116 of the groove 930. The third sub-conductive pattern may extend from the top opening portion of the first sub-conductive pattern in the second direction D2. The fourth sub-conductive pattern may connect the bottom opening portion of the first sub-conductive pattern and the bottom opening portion of the second sub-conductive pattern. In an example embodiment, the first sub-conductive pattern, the second sub-conductive pattern, the third sub-conductive pattern, and the fourth sub-conductive pattern may be integrally formed at the same layer.

[0170] In an example embodiment, Figure 23As shown in [the figure], the OLED device 500 may include a first conductive pattern 400 and a second conductive pattern 600. The first conductive pattern 400 on the groove 930 may be disposed along the contour of the second protruding portion 117 of the groove 930, and the second conductive pattern 600 on the groove 930 may be disposed along the contour of the first protruding portion 116 of the groove 930. Accordingly, the first conductive pattern 400 may substantially surround the second conductive pattern 600. The first conductive pattern 400 may include a first sub-conductive pattern and a second sub-conductive pattern. A part of the first sub-conductive pattern may have a planar shape of a circle with a partial opening including an opening portion, and the second sub-conductive pattern may extend from the opening portion of the first sub-conductive pattern in the second direction D2. In an exemplary embodiment, the first sub-conductive pattern and the second sub-conductive pattern may be integrally formed at the same layer. Additionally, the second conductive pattern 600 may include a third sub-conductive pattern and a fourth sub-conductive pattern. A part of the third sub-conductive pattern may have a planar shape of a circle with a partial opening including an opening portion, and the fourth sub-conductive pattern may extend from the opening portion of the third sub-conductive pattern in the second direction D2. In an exemplary embodiment, the third sub-conductive pattern and the fourth sub-conductive pattern may be integrally formed at the same layer.

[0171] The OLED device 500 according to an exemplary embodiment may include a conductive pattern 1400, a pad electrode 470, and a connection wiring 370. Accordingly, the OLED device 500 may check whether the first protruding portion 116 and the second protruding portion 117 are damaged. Thus, the defect rate of the OLED device 500 may be reduced by checking whether the first protruding portion 116 and the second protruding portion 117 are damaged through the OLED device 500.

[0172] Figure 25 is a cross-sectional view showing an OLED device according to an exemplary embodiment. Except for the second groove 950 and the third groove 970, Figure 25 the OLED device 800 shown in [the figure] may have a structure that is substantially the same as or similar to the structure of the OLED device 500 described with reference to Figures 21 to 24 [the relevant content]. In Figure 25 [this case], a detailed description of elements that are substantially the same as or similar to the elements described with reference to Figures 21 to 24 [the relevant content] may not be repeated.

[0173] Referring to Figure 25The OLED device 800 may include a substrate 110, a semiconductor element 250, a planarization layer 270, a light-emitting structure 200, a pixel-defining layer 310, a TFE structure 450, a touch screen structure 380, an organic insulation pattern 490, a conductive pattern 400, a functional module 700, a barrier structure 550, and the like. The substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. Since the OLED device 800 has a display area 10, an opening area 20, a peripheral area 30, and a pad area 40, the substrate 110 may be divided into the display area 10, the opening area 20, the peripheral area 30, and the pad area 40. In addition, the light-emitting structure 200 may include a lower electrode 290, a light-emitting layer 330, and an upper electrode 340, and the TFE structure 450 may include a first TFE layer 451, a second TFE layer 452, and a third TFE layer 453. In addition, the touch screen structure 380 may include a first insulating layer 390 , a plurality of first touch screen electrodes 382 , a plurality of second touch screen electrodes 384 , a plurality of touch screen connection electrodes 386 , a second insulating layer 395 , and a protective insulating layer 410 .

[0174] The first groove 930, the second groove 950, and the third groove 970 may be formed with an expanded lower portion. For example, in the substrate 110, the first groove 930 may be formed in the peripheral area 30, and the second groove 950 may be formed between the first groove 930 and the functional module 700. The third groove 970 may be formed in the display area 10. In addition, the second groove 950 may surround the functional module 700, and the first groove 930 may surround the second groove 950. The third groove 970 may surround the first groove 930. In another embodiment, at least one groove with an expanded lower portion may be formed between the second groove 950 and the functional module 700, and between the third groove 970 and the first groove 930.

[0175] The OLED device 800 according to the exemplary embodiment may include first to third grooves 930, 950, and 970. Therefore, due to the relatively large number of grooves having expanded lower portions, the light emitting layer 330 and the upper electrode 340 can be easily separated. Furthermore, since a relatively large number of grooves having expanded lower portions are located in the peripheral region 30, when external impact or stress during the manufacturing process is transmitted to the substrate 110 in the direction from the opening region 20 to the display region 10, the amount of impact can be reduced due to the relatively large number of grooves having expanded lower portions. Furthermore, since a relatively large number of grooves having expanded lower portions are located in the peripheral region 30, the contact area between the first TFE layer 451 and the substrate 110 can be relatively increased in the peripheral region 30. Therefore, the OLED device 800 can help prevent the first TFE layer 451 from separating from the substrate 110.

[0176] The barrier structure 550 may be located between the first groove 930 and the third groove 970 on the substrate 110 positioned in the peripheral region 30. In an exemplary embodiment, the barrier structure 550 may prevent leakage of the second TFE layer 452. The barrier structure 550 may include an organic material or an inorganic material. In an exemplary embodiment, the barrier structure 550 may include an organic material.

[0177] The light-emitting layer 330 may be located on the pixel defining layer 310 and the lower electrode 290 in the display region 10 and may extend in the first direction D1, and may be located on the substrate 110 and the barrier structure 550 in the peripheral region 30. In an exemplary embodiment, the light-emitting layer 330 may be partially located in the inner portions of each of the first to third grooves 930, 950, and 970, and the light-emitting layer 330 in the portion where each of the first to third grooves 930, 950, and 970 is positioned may be separated in the depth direction. Accordingly, the light-emitting layer 330 may be separated in the first to third grooves 930, 950, and 970. Accordingly, the light-emitting layer 330 may be separated by the first space 118 and the second space 119 in the peripheral region 30.

[0178] The upper electrode 340 may be located on the light-emitting layer 330. The upper electrode 340 may be stacked with the light-emitting layer 330 in the display region 10 and may extend in the first direction D1, and may be located on the light-emitting layer 330 in the peripheral region 30. In an exemplary embodiment, the upper electrode 340 may be partially located in the inner portions of each of the first to third grooves 930, 950, and 970, and the upper electrode 340 in the portion where each of the first to third grooves 930, 950, and 970 is positioned may be separated in the depth direction. Accordingly, the upper electrode 340 may be separated in each of the first to third grooves 930, 950, and 970.

[0179] The first TFE layer 451 may be located on the upper electrode 340 in the display area 10 and the peripheral area 30. The first TFE layer 451 may cover the upper electrode 340 in the display area 10, and may be provided with a substantially uniform thickness along the contour of the upper electrode 340 and may extend in the peripheral area 30. The first TFE layer 451 may be provided along the contour of the upper electrode 340 in the peripheral area 30. Therefore, the first TFE layer 451 may be continuously provided in each of the portions where the first groove to the third groove 930, 950, and 970 are formed. In an exemplary embodiment, the first TFE layer 451 may completely cover each of the first groove to the third groove 930, 950, and 970. Therefore, the first TFE layer 451 may completely cover the light-emitting layer 330 and the upper electrode 340 provided inside each of the first groove to the third groove 930, 950, and 970. Therefore, the first TFE layer 451 may be in direct contact with the second organic film layer 113 in the first space 118 and the second space 119.

[0180] The second TFE layer 452 may be located on the first TFE layer 451 in a part of the peripheral area 30 and the display area 10. In an exemplary embodiment, the second TFE layer 452 may fill the inner part of the third groove 970, and may not be provided inside the first groove 930 and the second groove 950.

[0181] The third TFE layer 453 may be located on the second TFE layer 452 in the display area 10 and on the first TFE layer 451 in the peripheral area 30. The third TFE layer 453 may cover the second TFE layer 452 in the display area 10, and may be provided with a substantially uniform thickness along the contour of the second TFE layer 452 and may extend in the peripheral area 30. The third TFE layer 453 may be provided with a substantially uniform thickness along the contour of the first TFE layer 451 in the peripheral area 30. Therefore, the third TFE layer 453 may be continuously formed in each of the portions where the second groove 950 and the third groove 970 are formed.

[0182] The first insulating layer 390 may be located on the third TFE layer 453 in the display area 10 and the peripheral area 30. The first insulating layer 390 may cover the third TFE layer 453 in the display area 10, and may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 and may extend in the peripheral area 30. The first insulating layer 390 may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral area 30. Therefore, the first insulating layer 390 may be continuously provided in each of the portions where the second groove 950 and the third groove 970 are formed.

[0183] The organic insulating pattern 490 may be located on the first insulating layer 390 in the peripheral region 30. The organic insulating pattern 490 may be disposed on the first insulating layer 390 with a relatively high thickness in a part of the display region 10 and the peripheral region 30. In this case, the organic insulating pattern 490 may have a substantially flat upper surface.

[0184] The conductive pattern 1400 may be located on the second insulating layer 395 in the peripheral region 30. In an exemplary embodiment, in order to detect damage to the first protruding portion 116 and the second protruding portion 117, the conductive pattern 1400 may be superimposed on the first protruding portion 116 and the second protruding portion 117 of the first groove 930. For example, the conductive pattern 1400 on the first groove 930 may be disposed along the contour of each of the first protruding portion 116 and the second protruding portion 117 of the first groove 930.

[0185] In an exemplary embodiment, a conductive pattern may also be disposed on the protruding portions of each of the second groove 950 and the third groove 970.

[0186] The exemplary embodiment may be applied to various display devices including an OLED device. For example, the exemplary embodiment may be applied to a vehicle display device, a marine display device, an aircraft display device, a portable communication device, a display device for display or for information transmission, a medical display device, and the like.

[0187] By way of summary and review, a display device such as an OLED device may have a display region for displaying an image and a non-display region in which a gate driver, a data driver, wirings, and functional modules (e.g., a camera module, a motion recognition sensor, etc.) are provided. A blocking pattern (for blocking water, moisture, etc. from penetrating into a part of the display region adjacent to the functional module) may be formed adjacent to the functional module. The blocking pattern may be vulnerable to damage from external impacts or stresses during the manufacturing process, and in this case, defects in display pixels may occur.

[0188] As described above, the exemplary embodiment relates to an organic light emitting display device that may include a functional module located in a part of the display region. The OLED device according to the exemplary embodiment may include a conductive pattern, a pad electrode, and a connection wiring, and the OLED device may check whether the second protruding portion is damaged. Therefore, since the OLED device checks whether the second protruding portion is damaged, the defect rate of the OLED device may be reduced.

[0189] Example embodiments have been disclosed herein. Although specific terms are employed, they are used and interpreted in a general and descriptive sense only and not for purposes of limitation. In some instances, as will be apparent to those of ordinary skill in the art from the present application, unless otherwise specifically stated, features, characteristics, and / or elements described with respect to a particular embodiment may be used alone or in combination with those described with respect to other embodiments. Accordingly, those of ordinary skill in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the example embodiments as set forth in the claims.

Claims

1. An organic light-emitting display device, the organic light-emitting display device comprising: A substrate having an opening; A groove surrounding the opening; A plurality of light-emitting devices disposed on the substrate and surrounding the groove; A plurality of wirings electrically connected to the plurality of light-emitting devices; A barrier structure surrounding the groove and the opening; A first insulating layer covering the barrier structure and the groove; And A conductive pattern configured to detect damage and disposed between the opening and the barrier structure above the first insulating layer.

2. The organic light-emitting display device according to claim 1, the organic light-emitting display device further comprising: A second insulating layer covering the first insulating layer; And A touch screen electrode on the second insulating layer.

3. The organic light emitting display device according to claim 2, wherein The conductive pattern is disposed on the second insulating layer.

4. The organic light-emitting display device according to claim 3, the organic light-emitting display device further comprising: An organic layer on the second insulating layer and below the conductive pattern.

5. The organic light-emitting display device according to claim 4, wherein, The first insulating layer has a protruding portion at the boundary of the groove such that the groove has an undercut shape.

6. The organic light emitting display device according to claim 5, wherein, The conductive pattern overlaps with the groove.

7. The organic light emitting display device according to claim 6, wherein, The conductive pattern overlaps with the protruding portion in a plan view.

8. The organic light-emitting display device according to claim 1, the organic light-emitting display device further comprising: A second insulating layer covering the first insulating layer.

9. The organic light emitting display device according to claim 8, wherein, The first insulating layer has a protruding portion of the first insulating layer at the boundary of the groove such that the groove has an undercut shape.

10. The organic light-emitting display device according to claim 9, the organic light-emitting display device further comprising: An organic layer on the second insulating layer and below the conductive pattern.

11. The organic light emitting display device according to claim 10, wherein, The conductive pattern overlaps with the groove.

12. The organic light emitting display device according to claim 11, wherein, The conductive pattern overlaps with the protruding portion in a plan view.

13. The organic light-emitting display device according to claim 12, the organic light-emitting display device further comprising: A touch screen electrode on the second insulating layer, wherein the touch screen electrode is formed of the same material as the material of the conductive pattern.

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