Display device

Abstract

A display device includes a substrate including a display area and a non-display area, the non-display area including a bent portion. The display device further includes a support member disposed in the display area below the substrate. The display device further includes a micro-coating layer disposed in the bending portion over the substrate. The display device further includes a reinforcing member disposed in the bent portion below the substrate. The reinforcing member includes a rigid portion.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2024 - 0012368, filed with the Korean Intellectual Property Office on January 6, 2024, the disclosure of which is incorporated herein by reference. Technical field

[0003] This specification relates to a display device. Background art

[0004] With the progress of technology in modern society, various display devices are being developed to provide information to users. There are various types of display devices for displaying images, such as liquid crystal display devices, organic light - emitting display devices, and inorganic light - emitting display devices.

[0005] The application range of display devices is diversified, and research is being conducted on display devices having a wide display area and reduced volume and weight. Summary of the invention

[0006] As display devices are miniaturized, continuous efforts are being made to reduce the bezel area (which is a non - display area, i.e., the outer peripheral part of the display area) to increase the size of the effective display screen while maintaining the area of the display device.

[0007] Regarding flexible light - emitting display devices, which apply a flexible substrate made of a flexible material (such as plastic) so that the display performance can be maintained even when the flexible light - emitting display device is bent, efforts are made to reduce the bezel area by bending the non - display area of the substrate while ensuring the area for lines and drive circuits. As the bezel area is reduced, the radius of curvature of the bent portion of the bent display panel decreases, and the stress on the lines applied to the bent portion increases, which may cause breakage. For this reason, the risk of operating defects in the display panel may increase in a room - temperature or high - temperature environment. Therefore, the inventors of this specification recognized the above problems and invented a new display device capable of suppressing the occurrence of breakage in the bent portion of the display device and improving the performance of the display device.

[0008] One object to be achieved by an embodiment of this specification is to provide a display device capable of improving the reliability of the display device by minimizing short - circuits of lines by strengthening the rigidity of the substrate.

[0009] The object of the present disclosure is not limited to the above object, and those skilled in the art can clearly understand other objects not mentioned above from the following description.

[0010] A display device according to an embodiment of the present specification may include: a substrate including a display area and a non-display area, the non-display area including a bent portion; a support member disposed below the substrate in the display area; and a reinforcing member disposed below the substrate in the bent portion, wherein the reinforcing member includes a rigid portion.

[0011] A display device according to another embodiment of the present specification may include: a substrate including a display area and a bent portion; a backplane disposed below the substrate in the display area; and a reinforcing member disposed below the substrate in the bent portion, wherein the reinforcing member includes at least two support layers.

[0012] Other details of the exemplary embodiments are included in the detailed description and the drawings.

[0013] According to an embodiment of the present specification, a reinforcing member may be applied to a display device to strengthen the rigidity of the display device, which may improve the performance and / or reliability of the display device. Therefore, according to the embodiment, the lifespan of the display device may be increased, and the power consumption may be reduced, thereby providing an environmentally friendly low-power display device.

[0014] According to an embodiment of the present specification, the rigid portion applied to the display device strengthens the rigidity of the bent portion, thereby providing a display device capable of minimizing damage to the bent portion.

[0015] According to an embodiment of the present specification, a support layer is disposed in the bent area of the display device, and a rigid portion having a modulus greater than that of the support layer is disposed in the bent area of the display device, so that the display device can ensure both flexibility and rigidity, suppress short circuits of signal lines, and minimize working defects.

[0016] The effects of the present disclosure are not limited to the foregoing effects, and those skilled in the art can clearly understand other effects not mentioned above from the following description.

[0017] The above-mentioned objects to be achieved by the present disclosure, the means for achieving the objects, and the effects of the present disclosure do not specifically define the essential features of the claims. Therefore, the scope of the claims is not limited to the disclosure of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features, and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the drawings, in which:

[0019] Figure 1 is a plan top view of a display device according to an embodiment of the present specification;

[0020] Figure 2 is a perspective view of a display device according to an embodiment of the present specification;

[0021] Figure 3 is a perspective view showing a bent state of a display device according to an embodiment of the present specification;

[0022] Figure 4 is along Figure 1 a cross-sectional view of a display panel according to an embodiment of the present specification taken along line A-A' in;

[0023] Figure 5 is along Figure 1 a cross-sectional view taken along line B-B' in;

[0024] Figure 6 is a view showing a front surface of a display device according to an embodiment of the present specification;

[0025] Figure 7 is a view showing a back surface of a display module of a display device according to an embodiment of the present specification;

[0026] Figure 8 is a view showing a back surface of a display device according to an embodiment of the present specification;

[0027] Figure 9 is a cross-sectional view taken along line C-C' in according to an embodiment of the present specification; Figure 6 ;

[0028] Figure 10 is an enlarged view of a back surface of a bent portion before the display device according to an embodiment of the present specification is bent;

[0029] Figure 11 is an enlarged view of a back surface of a bent portion after the display device according to an embodiment of the present specification is bent;

[0030] Figure 12 is a cross-sectional view showing a reinforcing member and a substrate of a display device according to an embodiment of the present specification;

[0031] Figure 13 is a cross-sectional view taken along line C-C' in according to another embodiment of the present specification; Figure 6 ;

[0032] Figures 14A to 14C is a view for explaining a method of manufacturing a reinforcing member according to an embodiment of the present specification; and

[0033] Figures 15A to 15D is a view for explaining a method of manufacturing a reinforcing member according to another embodiment of the present specification. Detailed Description

[0034] Advantages and features of the present disclosure, and methods for achieving these advantages and features, will be clear by referring to exemplary embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0035] In the drawings illustrating the exemplary embodiments for describing the present disclosure, shapes, sizes, ratios, angles, quantities, etc. are only examples, and the present disclosure is not limited thereto. The same reference numerals generally denote the same elements throughout the specification. Additionally, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", "consisting of" used herein generally intend to allow the addition of other components, unless the term is used together with the term "only". Any reference to the singular may include the plural, unless otherwise explicitly stated.

[0036] Even if not explicitly stated, components are interpreted to include a normal error range.

[0037] When using terms such as "above", "over", "below", "adjacent" to describe the positional relationship between two parts, one or more parts may be located between the two parts, unless the term is used together with the terms "immediately" or "directly".

[0038] When using terms such as "after", "subsequently", "next", "before" to describe the chronological relationship, the order may not be continuous, unless the term is used together with the terms "immediately" or "directly".

[0039] Although terms such as "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Thus, the first component to be mentioned below may be the second component in the technical concept of the present disclosure.

[0040] When describing the components of the exemplary embodiments of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are used to distinguish one component from another, but the nature, order, or quantity of the components is not limited by the terms. When one component is "linked", "coupled", or "connected" to another component, the component may be directly linked or connected to the other component. However, unless otherwise specifically stated, it should be understood that a third component may be interposed between the components that can be indirectly linked or connected.

[0041] It should be understood that "at least one" includes all combinations of one or more related components. For example, "at least one of the first component, the second component, and the third component" means not only including the first component, the second component, or the third component, but also including all combinations of two or more of the first component, the second component, and the third component.

[0042] In this specification, a "display device" may include: a display device in a narrow sense including a display panel and a driver for driving the display panel, such as a liquid crystal module (LCM), an organic light emitting module (OLED module), and a quantum dot module. Additionally, a "display device" may also include: a complete electronic device or a set of devices (or a set of equipment) as a complete product or a final product including an LCM, an OLED module, a QD module, etc., such as a notebook computer, a television, or a computer monitor, an automotive display device, or a device display device including another type of vehicle, and a mobile electronic device including a smart phone or an electronic board.

[0043] Therefore, the display device of the present disclosure may not only include the display device itself in a narrow sense, such as an LCM, an OLED module, a QD module, etc., but may also be an application product or a set of devices as a final consumer device including an LCM, an OLED module, a QD module, etc.

[0044] Furthermore, in some cases, an LCM, an OLED module, or a QD module composed of a display panel and a driver may be represented as a "display device" in a narrow sense, while an electronic device as a complete product including an LCM, an OLED module, and a QD module may be represented as a "set of devices". For example, a display device in a narrow sense includes a liquid crystal (LCD) display panel, an OLED display panel, or a quantum dot display panel, and a source PCB as a controller for driving the display panel. In contrast, a set of devices may be a concept further including a unit PCB (as a unit controller, which is electrically connected to the source PCB to control the entire set of devices).

[0045] As the display panel used in the exemplary embodiments of the present disclosure, any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel may be used. The display panel of this exemplary embodiment is not limited to a specific display panel with a bent bezel having a flexible substrate for an organic light emitting diode (OLED) display panel and a backplane support structure thereunder. Additionally, the display panel for the display device according to the exemplary embodiments of the present disclosure is not limited to the shape or size of the display panel.

[0046] For example, when the display panel is an OLED display panel, the display panel may include a plurality of gate lines, a plurality of data lines, and pixels formed at the intersection regions of the gate lines and / or the data lines. In addition, the display panel may be configured to include an array (the array includes thin film transistors as elements for selectively applying a voltage to each pixel), a light emitting diode layer on the array, and a packaging substrate or a packaging layer provided on the array to cover the light emitting diode layer, etc. The packaging layer may protect the thin film transistors and the light emitting diode layer, etc. from external influences, and may suppress moisture or oxygen from penetrating into the light emitting diode layer. Additionally, the layer formed on the array may include an inorganic light emitting layer, such as a material layer of nanoscale quantum dots, etc.

[0047] The features of the various exemplary embodiments of the present disclosure may be partially or entirely combined or combined with each other and may be associated and operated in various ways technically, and the exemplary embodiments may be implemented independently of each other or implemented in association with each other.

[0048] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings and exemplary embodiments as follows. The scales of the components illustrated in the drawings are different from the actual scales for the purpose of description, and thus the scales are not limited to the scales in the drawings.

[0049] Figure 1 is a plan view of a display device according to an embodiment of the present specification.

[0050] Referring to Figure 1 , the display device 1 may include a display area AA and a non-display area NA, and the non-display area NA is a border area configured to surround the edge of the display area AA. In the display area AA, pixels are provided on the substrate 110 and actually emit light through thin film transistors and light emitting elements.

[0051] The substrate 110 may be made of a flexible plastic material and have flexible characteristics. The substrate 110 may contain polyimide and be made of a glass material having flexibility and a small thickness. The embodiments of the present specification are not limited thereto.

[0052] A circuit for operating the display device 1 (such as a gate driving unit 154) and various signal lines (such as a scanning line SL) may be provided in the non-display area NA of the substrate 110.

[0053] The circuit for operating the display device 1 may be provided on the substrate 110 in an in-panel gate (GIP) manner, or connected to the substrate 110 in a tape carrier package (TCP) manner or a chip on film (COF) manner.

[0054] At least one pad 155 (which is a metal pattern) may be provided on one side of the substrate 110 in the non-display area NA and may be joined to an external module.

[0055] The bent portion BA can be formed by bending a part of the non-display area NA of the substrate 110 in the bending direction indicated by the arrow.

[0056] The non-display area NA of the substrate 110 is an area where lines and drive circuits for operating the screen are provided. Since the non-display area NA is not an area for displaying images, it is not necessary to visually recognize the non-display area NA from the top surface of the substrate 110. Therefore, by bending a partial area of the non-display area NA of the substrate 110, the bezel area can be reduced while ensuring the area for the lines and drive circuits.

[0057] Various lines can be formed on the substrate 110. The lines can also be formed in the display area AA of the substrate 110. The signal lines 14 formed in the non-display area NA can connect the drive circuits, the gate driver, and the data driver and transmit signals.

[0058] Each of the signal lines 14 can be made of a conductive material. Each of the signal lines 14 can be made of a conductive material having excellent flexibility to reduce the occurrence of breakage when the substrate 110 is bent. Each of the signal lines 14 can be made of a conductive material such as gold (Au), silver (Ag), or aluminum (Al) having excellent flexibility. Each of the signal lines 14 can be made of one of various conductive materials for the display area AA. The lines 14 can each be made of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg).

[0059] The signal lines 14 can have a multilayer structure including various conductive materials. For example, the signal lines 14 can have a three-layer structure including titanium (Ti) / aluminum (Al) / titanium (Ti). However, the present specification is not limited thereto.

[0060] The signal lines 14 formed on the bent portion BA can receive a tensile force when the bent portion BA is bent. The signal lines 14 extending in the same direction as the bending direction on the substrate 110 can receive the highest tensile force, which may cause breakage or disconnection of the lines. For example, the signal lines 14 are not formed to extend in the bending direction. At least a part of the signal lines 14 configured to include the bent portion BA can be formed to extend in an oblique direction different from the bending direction, which can minimize the tensile force.

[0061] The signal lines 14 configured to include the bent portion BA can each be formed into various shapes, such as a trapezoidal wave shape, a triangular wave shape, a sawtooth wave shape, a sine wave shape, an ω (Ω) shape, a rhombus shape, etc. The embodiments of the present specification are not limited thereto.

[0062] Figure 2is a perspective view of a display device according to an embodiment of the present specification.

[0063] Figure 3 is a perspective view illustrating a bent state of a display device according to an embodiment of the present specification.

[0064] Reference Figure 2 , the display device 1 according to an embodiment of this specification may include a substrate 110 and a circuit element 161 .

[0065] The substrate 110 may be divided into a display area AA and a non-display area NA which is a bezel area surrounding an edge of the display area AA.

[0066] The non-display area NA may include a pad portion PA defined outside the display area AA. A plurality of sub-pixels may be provided in the display area AA. The sub-pixels may be arranged in the display area AA in an R (red), G (green), B (blue) pattern or an R, G, B, W (white) pattern to achieve full color. The sub-pixels may be separated by intersecting gate and data lines.

[0067] The circuit element 161 may include bumps (or terminals). The bumps of the circuit element 161 may be bonded to the pads of the pad portion PA through an anisotropic conductive film (ACF). For example, the circuit element 161 may be a chip on film (COF) made by mounting a driver IC on a flexible film.

[0068] For example, the circuit element 161 may be configured as a chip-on-glass (COG) type that is directly bonded to pads on a substrate using a COG process. For example, the circuit element 161 may be a flexible circuit such as a flexible flat cable (FFC) or a flexible printed circuit (FPC). The embodiments of this specification are not limited thereto.

[0069] Driving signals (eg, gate signals and data signals received through the circuit elements 161 ) may be supplied to gate lines and data lines in the display area AA through signal lines 14 (eg, routing lines).

[0070] In the display device 1, in addition to realizing the display area AA for the input image, it is necessary to ensure sufficient space in which the pad portion PA, the circuit element 161, etc. can be arranged. This space corresponds to the bezel area. The bezel area is visible to the user in front of the front of the display device 1, which may lead to a deterioration in the aesthetic appearance.

[0071] Reference Figure 3 , in the display device according to the embodiment of the present specification, the lower edge of the substrate 110 may be bent to have a predetermined curvature in a direction toward the rear surface.

[0072] The lower edge of the substrate 110 may correspond to the outside of the display area AA and to the area where the pad portion PA is disposed. When the substrate 110 is bent, the pad portion PA may be disposed to overlap the display area AA in the direction of the back surface of the display area AA. Accordingly, it is possible to minimize the bezel area recognized from a position in front of the display device 1. Accordingly, the bezel width may be reduced, and the aesthetic appearance may be improved.

[0073] For example, the substrate 110 may be made of a flexible material that can be bent. For example, the substrate 110 may be made of a plastic material such as polyimide (PI). For example, the signal line 14 may be made of a flexible material. For example, the signal line 14 may be made of a material such as metal nanowires, metal mesh, or carbon nanotubes (CNT). The embodiments of the present specification are not limited thereto.

[0074] The signal line 14 may extend from the display area AA and be disposed on the bending portion BA. For example, the signal line 14 disposed on the bending portion BA may extend along the outer circumferential surface of the substrate 110.

[0075] Figure 4 is a cross-sectional view of a display panel according to an embodiment of the present specification taken along line A-A' in Figure 1 .

[0076] Hereinafter, an example in which the display device is an organic light emitting display device will be described. However, the display device may be other light emitting display devices, such as an inorganic light emitting display device or a quantum dot light emitting display device. The embodiments of the present specification are not limited thereto.

[0077] Figure 4 is a cross-sectional view taken along line A-A' in Figure 1 .

[0078] Referring to Figure 4 , the substrate 110 may include a first substrate 107, an interlayer insulating film 109, and a second substrate 108.

[0079] The first substrate 107 and the second substrate 108 may be substrates, that is, insulating substrates configured to support components disposed above the substrate 110. For example, the first substrate 107 and the second substrate 108 may be made of glass, resin, etc. For example, the first substrate 107 and the second substrate 108 may include polymers or plastics. In some embodiments, the first substrate 107 and the second substrate 108 may be made of a flexible plastic material.

[0080] The interlayer insulating film 109 may be disposed between the first substrate 107 and the second substrate 108. The interlayer insulating film 109 may include an inorganic material and protect the first substrate 107 and the second substrate 108 from moisture penetration. The embodiments of the present specification are not limited thereto.

[0081] Multiple pixels can be formed on the substrate 110, so that an image can be displayed. The substrate 110 may include a display area AA and a non-display area NA configured to surround the display area AA.

[0082] The display area AA is an area of the display panel 100 of the display device where an image is displayed. The display area AA may include a plurality of sub-pixels constituting a plurality of pixels, and a plurality of signal lines configured to operate the plurality of sub-pixels. The plurality of sub-pixels are the smallest units constituting the display area AA. n sub-pixels may constitute a single pixel. A light-emitting element, a thin-film transistor for operating the light-emitting element, etc. may be provided in each of the plurality of sub-pixels. The plurality of light-emitting elements may be defined differently according to the type of the display panel. For example, the light-emitting element may be an organic light-emitting diode (OLED). For example, the light-emitting element may be an inorganic light-emitting element (micro-LED). The embodiments of the present specification are not limited thereto.

[0083] The suppression structure 150 may be provided in the non-display area NA and surround a part or all of the display area AA. For example, the suppression structure 150 may be a dam DAM. The suppression structure 150 may be provided adjacent to the display area AA and outside the display area AA.

[0084] The crack suppression layer 160 (panel crack detector) may be further provided in a part of the non-display area NA of the substrate 110. In an embodiment, at least a part of the crack suppression layer 160 may be spaced apart from the suppression structure 150. However, the embodiments of the present specification are not limited thereto.

[0085] Referring to Figure 4 , the light-blocking layer BSM may be provided on the substrate 110. The light-blocking layer BSM may block light from entering the active layer ACT of the plurality of transistors, thereby minimizing the leakage current. For example, the light-blocking layer BSM may be provided under the active layer ACT of the transistor DT and block light from entering the active layer ACT. For example, when light is emitted to the active layer ACT, a leakage current is generated, which may reduce the reliability of the transistor DT. Therefore, the light-blocking layer BSM for blocking light may be provided on the substrate 110 to improve the reliability of the transistor DT. The light-blocking layer BSM may be made of an opaque conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present specification is not limited thereto.

[0086] The buffer layer 111 may be provided on the light-blocking layer BSM. The buffer layer 111 may reduce the penetration of moisture or impurities through the substrate 110. For example, the buffer layer 111 may be configured to be made of silicon oxide (SiO, x ) or silicon nitride (SiNx ) formed as a single layer or multiple layers. However, this specification is not limited thereto. However, depending on the type of the substrate 110 or the type of the transistor DT, the buffer layer 111 may not be included. However, this specification is not limited thereto.

[0087] The transistor DT including the active layer ACT, the gate GE, the source SE, and the drain DE may be disposed on the buffer layer 111.

[0088] For example, an additional buffer layer may be disposed between the substrate 110 and the light blocking layer BSM. For example, like the buffer layer 111, the additional buffer layer may be configured as a single layer or multiple layers made of silicon oxide (SiO x ) or silicon nitride (SiN x ) to reduce moisture or impurity penetration through the substrate 110. However, this disclosure is not limited thereto.

[0089] First, the active layer ACT of the transistor DT may be disposed on the buffer layer 111. The active layer ACT may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, or polysilicon. However, this specification is not limited thereto.

[0090] For example, in addition to the transistor DT, other transistors such as a switching transistor, a sensing transistor, and a light emission control transistor may be additionally disposed. The active layers of these transistors may be made of a semiconductor material such as an oxide semiconductor, amorphous silicon, or polysilicon. However, this specification is not limited thereto.

[0091] For example, the active layers of the transistors (such as the transistor DT, the switching transistor, the sensing transistor, and the light emission control transistor) included in the pixel circuit may be made of the same material or different materials.

[0092] The first insulating layer 112 may be disposed on the active layer ACT. For example, the first insulating layer 112 may be a gate insulating layer, that is, an insulating layer for electrically insulating the active layer ACT and the gate GE. The first insulating layer 112 may be configured as a single layer or multiple layers made of silicon oxide (SiO x ) or silicon nitride (SiN x ) However, this specification is not limited thereto.

[0093] The gate GE may be disposed on the first insulating layer 112. The gate GE may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, this specification is not limited thereto.

[0094] For example, the connection electrode CNT may be disposed on the first insulating layer 112. The connection electrode CNT may be made of the same material as the gate GE and electrically connected to the source SE and the light blocking layer BSM.

[0095] The first interlayer insulating layer 113 and the second interlayer insulating layer 114 may be provided on the gate GE. Contact holes are formed in the first interlayer insulating layer 113 and the second interlayer insulating layer 114, and the source SE and the drain DE are connected to the active layer ACT through the contact holes. The first interlayer insulating layer 113 and the second interlayer insulating layer 114 are insulating layers for protecting components provided thereunder. The first interlayer insulating layer 113 and the second interlayer insulating layer 114 may each be configured as a single layer or multiple layers made of silicon oxide (SiO x ) or silicon nitride (SiN x ). However, the present specification is not limited thereto.

[0096] The storage capacitor Cst may be provided on the first insulating layer 112. The storage capacitor Cst may be implemented by using the intermediate electrode TM and the gate GE as capacitor electrodes. However, the present specification is not limited thereto. The storage capacitor Cst may be implemented in various ways.

[0097] The intermediate electrode TM may be provided on the first interlayer insulating layer 113. The intermediate electrode TM may be provided to overlap with the gate GE, and the first interlayer insulating layer 113 is interposed therebetween.

[0098] The source SE and the drain DE are provided on the second interlayer insulating layer 114 and are electrically connected to the active layer ACT. The drain DE may be electrically connected to the intermediate electrode TM of the storage capacitor Cst, and the source SE may be connected to the first electrode 121 of the light-emitting element 120. The source SE and the drain DE may each be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof. However, the present specification is not limited thereto.

[0099] The planarization layer 115 may be provided on the source SE and the drain DE. The planarization layer 115 may planarize the upper part of the pixel circuit including the transistor DT. The planarization layer 115 may be configured as a single layer or multiple layers and may be made of, for example, benzocyclobutene or an acrylic organic material. However, the present specification is not limited thereto.

[0100] A plurality of light-emitting elements 120 are provided on the planarization layer 115 and are respectively provided in a plurality of sub-pixels SP. The light-emitting element 120 may be an element configured to emit light by current and includes a red light-emitting element configured to emit red light, a green light-emitting element configured to emit green light, and a blue light-emitting element configured to emit blue light. Combinations of the light-emitting elements 120 may achieve various colors including white. For example, the light-emitting element 120 may be an organic light-emitting diode. However, the present specification is not limited thereto.

[0101] The light-emitting element 120 may include a first electrode 121, a light-emitting layer 122, and a second electrode 123.

[0102] The first electrode 121 may be disposed on the planarization layer 115. The first electrode 121 may include a reflective layer 121a and a transparent conductive layer 121b. For example, the transparent conductive layer 121b may be disposed on the reflective layer 121a. The reflective layer 121a and the transparent conductive layer 121b are layers for supplying holes to the light-emitting layer 122. The reflective layer 121a and the transparent conductive layer 121b may each be made of a conductive material having a high work function. For example, the reflective layer 121a may have a layered structure made of an alloy of silver (Ag), palladium (Pd), and copper (Cu) as a metal material having a high reflectivity. However, the present specification is not limited thereto. For example, the transparent conductive layer 121b may be made of indium tin oxide (ITO) as a transparent conductive oxide (TCO). However, the present specification is not limited thereto.

[0103] The bank 116 may be disposed on the first electrode 121 and the planarization layer 115. The bank 116 may cover the edge of the first electrode 121 of the light-emitting element 120 and define a light-emitting region. For example, the bank 116 may separate the plurality of sub-pixels SP. The bank 116 may be made of an insulating material to insulate the first electrodes 121 of adjacent sub-pixels SP. For example, the bank 116 may be configured as a black bank containing a black material having a high optical absorption rate to suppress color mixing between adjacent sub-pixels SP. For example, the bank 116 may be configured as a black bank to which a black pigment is added to reduce light reflection. The embodiments of the present specification are not limited thereto.

[0104] For example, the bank 116 may be made of at least one of materials including an inorganic insulating material (e.g., silicon nitride (SiN x )) or silicon oxide (SiO x )) or an organic insulating material (e.g., benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin). The embodiments of the present specification are not limited thereto.

[0105] The spacer 117 may be disposed on the bank 116. The spacer 117 is a layer that maintains a predetermined distance between the deposition mask and the bank 116 to suppress damage caused by contact with the deposition mask. Like the bank 116, the spacer 117 may be made of a polyimide resin, an acrylic resin, or a benzocyclobutene (BCB) resin. However, the present specification is not limited thereto. The bank 116 and the spacer 117 are respectively illustrated in Figure 4 . However, in an embodiment, the spacer 117 may be made of the same material as the bank 116. The bank 116 and the spacer 117 may be integrally and simultaneously formed by a single process. The embodiments of the present specification are not limited thereto.

[0106] For example, the spacer 117 may compensate for the empty space between the upper substrate and the substrate 110 having the light-emitting element 120, thereby minimizing damage to the display device caused by an external impact.

[0107] The light-emitting layer 122 may be disposed on the first electrode 121. The light-emitting layer 122 is a layer that emits light by combining electrons and holes.

[0108] The second electrode 123 may be disposed on the light-emitting layer 122. The second electrode 123 may be made of a metal material having a low work function to smoothly supply electrons to the light-emitting layer 122. For example, the second electrode 123 may be made of a metal material selected from calcium (Ca), barium (Ba), aluminum (Al), silver (Ag), and an alloy containing one or more of the above elements. However, the present specification is not limited thereto.

[0109] The light-emitting element 120 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, etc. to improve the light-emitting efficiency of the light-emitting element 120. For example, the hole injection layer and the hole transport layer may be disposed between the first electrode 121 and the light-emitting layer 122, and the electron transport layer and the electron injection layer may be disposed between the light-emitting layer 122 and the second electrode 123. In addition, a hole blocking layer or an electron blocking layer may be disposed on the light-emitting layer 122 to further improve the recombination efficiency of holes and electrons.

[0110] The encapsulation part 130 may be disposed on the light-emitting element 120. The encapsulation part 130 may protect the light-emitting element 120 from external moisture, oxygen, impact, etc. The encapsulation part 130 may have a multi-layer structure in which an inorganic layer made of an inorganic insulating material and an organic layer made of an organic material are stacked. For example, the encapsulation part 130 may have a multi-layer structure including at least one organic layer and at least two inorganic layers and is made by alternately stacking the inorganic layer and the organic layer. However, the present specification is not limited thereto. For example, the encapsulation part 130 may have a three-layer structure including a first inorganic encapsulation layer 131, an organic encapsulation layer 132, and a second inorganic encapsulation layer 133. In this case, the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may each be independently made of one or more materials selected from the group consisting of silicon nitride (SiN x ), silicon oxide (SiO x ), aluminum oxide (AlO x ), and silicon oxynitride (SiON). However, the present specification is not limited thereto. For example, the organic encapsulation layer 132 may be made of one or more materials selected from the group consisting of epoxy resin, polyimide resin, polyethylene resin, and silicon oxycarbide (SiOC). However, the present specification is not limited thereto.

[0111] The touch detection unit 140 may be disposed on the encapsulation unit 130 to recognize a user's touch. The touch detection unit 140 may include a touch buffer layer 141, a touch bridge electrode 142, a touch insulation layer 143, a touch electrode 144, and a touch protection layer 145.

[0112] The touch buffer layer 141 may be disposed on the encapsulation unit 130. The touch buffer layer 141 may be a layer made of an inorganic material with excellent barrier properties for suppressing damage to the light-emitting element 120 and the encapsulation unit 130. Accordingly, the penetration of moisture or oxygen can be minimized. For example, the touch buffer layer 141 may be configured as a single layer or multiple layers made of silicon nitride (SiN x ) or silicon oxide (SiO x ). However, the present specification is not limited thereto.

[0113] The touch bridge electrode 142 may be disposed on the touch buffer layer 141. The touch bridge electrode 142 may connect the touch electrode 144.

[0114] The touch insulation layer 143 may be disposed on the touch buffer layer 141 and the touch bridge electrode 142. The touch insulation layer 143 may be a layer made of an inorganic material for insulating the touch bridge electrode 142 and the touch electrode 144. For example, the touch insulation layer 143 may be configured as a single layer or multiple layers made of silicon oxide (SiO x ) or silicon nitride (SiN x ). However, the present specification is not limited thereto.

[0115] The touch electrode 144 may be disposed on the touch insulation layer 143. The touch electrode 144 is an electrode configured to detect a touch input. The touch electrode 144 may include a sensing electrode and a driving electrode, and detects touch coordinates by sensing a change in capacitance between the sensing electrode and the driving electrode. For example, the touch electrode 144 may be made of a transparent metal material that can transmit light (e.g., indium tin oxide (ITO) or indium zinc oxide (IZO)). However, the present specification is not limited thereto.

[0116] For example, the touch electrode 144 may be disposed on the touch insulation layer 143. A touch line may electrically connect the touch electrode 144 and a touch circuit. The touch line may be disposed on the same layer as the touch electrode 144. However, the present specification is not limited thereto.

[0117] The touch protection layer 145 may be disposed on the touch electrode 144. The touch protection layer 145 is a layer that suppresses short-circuiting or damage of the touch electrode 144 and flattens the top surface of the touch electrode 144. For example, the touch protection layer 145 may be made of a transparent insulating resin (e.g., acrylic resin, polyester resin, or epoxy resin). However, the present specification is not limited thereto.

[0118] For example, the power supply line VSS can be disposed in the non-display area NA and connected to the second electrode 123. The power supply line VSS can be electrically connected to the second electrode 123 of the light-emitting element 120 and apply a power supply voltage to the light-emitting element 120.

[0119] The suppression structure 150 can be disposed on the power supply line VSS. The suppression structure 150 is arranged to control the overflow of the organic encapsulation layer 132 of the encapsulation part 130. The suppression structure 150 can include a lower layer made of the same material as the planarization layer 115 and an upper layer made of the same material as the dam 116. However, the present specification is not limited thereto. The suppression structure 150 can include three or more layers. In addition, Figure 4 Only a single suppression structure 150 is shown. However, a plurality of suppression structures 150, that is, two or more suppression structures 150, can be provided. However, the present specification is not limited thereto. The encapsulation part 130, the touch buffer layer 141, and the touch insulation layer 143 can be disposed above the suppression structure 150.

[0120] The crack suppression layer 160 can be disposed outside the suppression structure 150. The crack suppression layer 160 can reduce external impact and suppress the propagation of cracks to the display area AA. Therefore, the crack suppression layer 160 can be made of an organic insulating material having a high strain rate and impact resistance. For example, the crack suppression layer 160 can be made of the same material as the planarization layer 115 or the dam 116. However, the present specification is not limited thereto.

[0121] Figure 5 is a cross-sectional view taken along Figure 1 the line B-B' in

[0122] Because Figure 5 some of the component elements in Figure 4 are substantially the same as or similar to the component elements described with reference to

[0123] has been Figure 1 described, the description thereof will be omitted.

[0124] When the line disposed in the non-display area NA including the bent portion BA of the display device 1 has a single-layer structure, a large space is required to dispose the line. After depositing the conductive material, the shape of the line to be formed is patterned through the process of etching the conductive material. However, there are limitations in ensuring the fineness of the etching process. For this reason, due to the limitations in reducing the interval between lines, a large space is required, and the area of the non-display area NA increases, which makes it difficult to achieve a narrow border.

[0125] For example, in the case where a single line is used to transmit a single signal, when the corresponding line breaks, the signal may not be transmitted.

[0126] The line may break during the bending of the substrate 110, or a break that occurs on another layer may propagate to the line. In the case of a line break as described above, the signal to be transmitted may not be transmitted.

[0127] Therefore, referring to Figure 5 , the signal line 14 provided in the bending portion BA of the display device 1 according to an embodiment of the present specification may be provided as two lines, namely, the first line 171 and the second line 172.

[0128] The signal line 14 provided in the bending portion BA of the display device according to an embodiment of the present specification may be provided as a single line. The embodiments of the present specification are not limited thereto.

[0129] The first line 171 and the second line 172 may be made of a conductive material. The first line 171 and the second line 172 may be made of a conductive material with excellent flexibility to reduce the occurrence of breakage when the flexible substrate 110 is bent.

[0130] The first line 171 and the second line 172 may be made of a conductive material with excellent flexibility (e.g., gold (Au), silver (Ag), or aluminum (Al)). The first line 171 and the second line 172 may be made of one of various conductive materials used in the display area AA. The first line 171 and the second line 172 may also be made of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg). Additionally, the first line 171 and the second line 172 may each be configured as a multi-layer structure including various conductive materials. Alternatively, the first line 171 and the second line 172 may each be configured as a three-layer structure including titanium (Ti) / aluminum (Al) / titanium (Ti). However, the present specification is not limited thereto.

[0131] A buffer layer made of an inorganic insulating layer may be provided under the first line 171 and the second line 172 to protect the first line 171 and the second line 172. A passivation layer made of an inorganic insulating layer may be formed to surround the upper and side portions of the first line 171 and the second line 172. Accordingly, corrosion of the first line 171 and the second line 172 due to reaction with moisture or the like can be suppressed.

[0132] The first line 171 and / or the second line 172 formed in the bending portion BA bear a tensile force when the bending portion BA is bent. As referred to Figure 1As described above, the line extending in the same direction as the bending direction on the substrate 110 may be subjected to the highest tensile force, which may cause cracking. When the cracking is severe, disconnection of the line may occur. Therefore, the line is not formed to extend in the bending direction. At least a part of the line provided to include the bending portion BA may be formed to extend in an oblique direction different from the bending direction, which can minimize the tensile force and reduce the occurrence of cracking. The shape of the line may be a diamond shape, a triangular wave shape, a sine wave shape, a trapezoidal shape, etc. However, the present specification is not limited thereto.

[0133] In an embodiment, the first line 171 or the second line 172 may be made of the same material as Figure 4 the source SE and the drain DE in

[0134] For example, the first line 171 may be provided on the substrate 110, and the first planarization layer 115c may be provided on the first line 171. The second line 172 may be provided on the first planarization layer 115c, and the second planarization layer 115d may be provided on the second line 172. Each of the first planarization layer 115c and the second planarization layer 115d may be made of one or more materials selected from acrylic resin, epoxy resin, phenolic resin, polyamide-based resin, polyimide-based resin, unsaturated polyester-based resin, polyphenyl resin, polyphenylene sulfide-based resin, and benzocyclobutene, but is not limited thereto. However, the present specification is not limited thereto.

[0135] In an embodiment, the first planarization layer 115c or the second planarization layer 115d may be made of the same material as Figure 4 the planarization layer 115 in

[0136] The microcoating layer (MCL) 600 may be provided on the second planarization layer 115d.

[0137] During the bending process, tensile force may be applied to the signal line 14 provided above the substrate 110, which may cause cracking. Therefore, the signal line 14 is protected by coating the position to be bent with a resin having a small thickness to form the microcoating layer 600.

[0138] Figure 6 is a front view of a display device according to an embodiment of the present specification.

[0139] Figure 7 is a rear view of a display module in a state where the housing part is removed from the display device according to an embodiment of the present specification.

[0140] Figure 8 is a rear view of a display device according to an embodiment of the present specification.

[0141] In this specification, the directions of the front and upper sides are defined as the Z-axis direction, and the directions of the back and lower sides are defined as the -Z-axis direction.

[0142] Referring Figures 6 to 8 , the display device 1 may include a display module 10, and the display module 10 includes a cover member 20 and a display panel 100 attached to the lower portion of the cover member 20 in the downward direction (-Z axis).

[0143] The cover member 20 may be configured to cover the front side of the display device 1 and protect the display device 1 from external impacts.

[0144] The edge portion of the cover member 20 may have a curvature portion or a bent portion that is bent in the direction toward the back side of the display device 1.

[0145] The cover member 20 may be configured to cover the side surface area provided on the back side of the display device 1. Accordingly, even in the case of the side surface and the front side of the display device 10, the cover member 20 may protect the display panel 100 from external impacts.

[0146] The cover member 20 may overlap with the display area AA of the displayed image. For example, the cover member 20 may be made of a transparent plastic material capable of transmitting an image or configured as an encapsulation glass made of a transparent glass material. This specification is not limited thereto.

[0147] The housing portion 30 may be provided on the back side of the display module 10 and support the cover member 20.

[0148] The housing portion 30 may serve as a housing for protecting the back side of the display device 1 and serve as an outer shell that defines the outermost periphery of the display device 1.

[0149] The housing portion 30 may be made of various materials such as plastic, metal, or glass.

[0150] An intermediate frame portion may be additionally provided between the cover member 20 and the housing portion 30.

[0151] The intermediate frame portion may be provided on the back side of the display module 10 to accommodate the display module 10. The intermediate frame portion may be in contact with the cover member 20 to support the cover member 20.

[0152] The intermediate frame portion may serve as a housing for protecting the back side of the display module 10.

[0153] The display module 10 may be provided on one surface of the intermediate frame portion. Other constituent components (for example, a battery for applying power to operate the display device 1) may be provided on the other surface of the intermediate frame portion.

[0154] Figure 9is a cross-sectional view taken along line C-C’ in Figure 6 in accordance with an embodiment of the present specification.

[0155] Referring to Figure 9 , the front portion FP of the display panel 100 may be disposed below the cover member 20.

[0156] Pixels having a plurality of light-emitting elements and driving transistors may be disposed in the front portion FP, and a pixel array unit 125 including signal lines for transmitting driving signals to the pixels may be disposed in the front portion FP, so that an image can be displayed.

[0157] The front portion FP may include a display area AA (active area) for displaying an image and a non-display area NA (non-active area) as an area other than the display area AA. The non-display area NA may be formed in an edge area surrounding the display area AA.

[0158] The display area AA and the non-display area NA may also be similarly applied to the cover member 20.

[0159] The area of the cover member 20 for transmitting an image may be the display area AA.

[0160] The area surrounding the display area AA and not transmitting an image may be the non-display area NA.

[0161] The non-display area NA may be defined as a border area.

[0162] The display panel 100 disposed below the cover member 20 may include a bending portion BND extending from one side of the front portion FP and bent in a downward direction.

[0163] The bending portion BND may be located at the outermost periphery of the display panel 100 and is easily exposed to external impacts. When an impact is applied to the bending portion BND, the bending portion BND may be easily deformed or damaged. Therefore, a support layer or a reinforcing member for protecting the bending portion BND may be added to absorb the impact.

[0164] The display device 1 may include a display panel 100 and a cover member 20 disposed on the display panel 100.

[0165] The display module 10 of the display device 1 may include at least one of the following: a display panel 100 including a front portion FP, a bending portion BND, and a pad portion PAD bent from the bending portion BND and located on the back surface of the front portion FP; support members 210 and 220 configured to support the display panel 100; and a connection member 200 configured to fix the display panel 100 and the support members 210, 220.

[0166] The first support member 210, the connection member 200, the second support member 220, and the pad portion PAD may be sequentially disposed below the front portion FP of the display panel 100.

[0167] The first fixing member 190 may be disposed between the cover member 20 and the display panel 100.

[0168] The first fixing member 190 may connect or join the cover member 20 and the display panel 100.

[0169] For example, the first fixing member 190 may be a fixing member, a bonding layer, or an adhesive layer, but the present specification is not limited by the terms.

[0170] The first fixing member 190 may be disposed to overlap with the display area AA. Accordingly, the first fixing member 190 may be made of a material capable of transmitting an image from the display panel 100.

[0171] For example, the first fixing member 190 may include or be made of a material such as a pressure-sensitive adhesive (PSA), a transparent adhesive (optical clear adhesive (OCA)), or a resin (optical clear resin (OCR)). The present specification is not limited thereto.

[0172] The display panel 100 disposed below the cover member 20 may include a front portion FP, a bending portion BND, and a pad portion PAD based on the substrate 110.

[0173] The front portion FP of the display panel 100 may be disposed below the first fixing member 190. For example, the front portion FP may be a portion for displaying an image. The front portion FP may include the substrate 110, the pixel array portion 125, the encapsulation portion 130, and the optical film 180.

[0174] The bending portion BND of the display panel 100 may be a portion that extends from one side of the front portion FP, bends in the downward (-Z axis) direction, and then bends in the planar (Y axis) direction. The bending portion BND may include the display substrate 110 and the signal line 14.

[0175] The pad portion PAD of the display panel 100 may extend from the bending portion BND and be disposed below the front portion FP.

[0176] The pad portion PAD may include the substrate 110, the signal line 14, and pad electrodes connected to the signal line 14. The driving circuit portion 400 or the flexible circuit board 500 may be mounted on the pad electrodes and electrically connected to the pad electrodes to operate the pixels.

[0177] The optical film 180 can be disposed above the front portion FP of the display panel 100. For example, a functional layer can be further disposed between the first fixing member 190 and the optical film 180 to improve the display performance of the display device.

[0178] The optical film 180 can suppress the reflection of external light and improve outdoor visibility and the contrast related to the image displayed on the display panel 100. For example, the optical film 180 can be a polarizing plate including a polarizer and a protective film configured to protect the polarizer. The optical film 180 can be formed by coating a polarizing material to ensure flexibility.

[0179] The display panel 100 can include a substrate 110, a pixel array portion 125 disposed on the substrate 110, and a packaging portion 130 disposed to cover the pixel array portion 125.

[0180] The substrate 110 can be disposed at the lowermost portion of the display panel 100.

[0181] The substrate 110 can be formed in all of the front portion FP, the bending portion BND, and the pad portion PAD.

[0182] The substrate 110 can be made of a flexible plastic material and have flexible characteristics.

[0183] The substrate 110 can contain polyimide and be made of a glass material having flexibility and a small thickness.

[0184] The pixel array portion 125 can be disposed on the substrate 110. The pixel array portion 125 can display an image. The portion on which the pixel array portion 125 is disposed can be a display area AA.

[0185] Therefore, the area of the cover member 20 corresponding to the pixel array portion 125 can be the display area AA, and the area other than the display area AA can be a non-display area NA.

[0186] The pixel array portion 125 can include a light-emitting element, a thin-film transistor configured to operate the light-emitting element, and signal lines such as gate lines, data lines, and pixel driving power supply lines disposed on the substrate 110.

[0187] The pixel array portion 125 can include pixels that display an image according to signals supplied to the signal lines, and the pixels can include a light-emitting element and a thin-film transistor.

[0188] The light-emitting element can include an anode electrically connected to the thin-film transistor, a light-emitting layer formed on the anode, and a cathode configured to supply a common voltage.

[0189] The thin-film transistor can include a gate, a semiconductor layer, a source, a drain, and the like.

[0190] The semiconductor layer of the thin film transistor may include silicon, such as amorphous silicon, polycrystalline silicon, or low-temperature polycrystalline silicon, or may include an oxide, such as indium gallium zinc oxide (IGZO). This specification is not limited thereto.

[0191] In each pixel region, the anode may be disposed to correspond to an opening region provided according to the pattern shape of the pixel, and the anode may be electrically connected to the thin film transistor.

[0192] The light-emitting element may include a light-emitting layer formed between the anode and the cathode.

[0193] For each pixel, the light-emitting layer may be implemented to emit light of the same color, such as white light. Alternatively, for each pixel, the light-emitting layer may be implemented to emit light of different colors, such as red light, green light, or blue light.

[0194] The encapsulation part 130 may be disposed on the substrate 110 and cover the pixel array part 125.

[0195] The encapsulation part 130 may prevent oxygen, moisture, or foreign substances from penetrating into the light-emitting layer of the pixel array part 125.

[0196] The encapsulation part 130 may have a multilayer structure in which an organic material layer and an inorganic material layer are alternately stacked. This specification is not limited thereto.

[0197] The front part FP of the display panel 100 may include the substrate 110, the pixel array part 125, and the encapsulation part 130, and except for its edge part, the display panel 100 is formed in a flat state.

[0198] In order to maintain the flat state of the front part FP, the first support member 210 to be described below may be connected or joined to the lower part of the front part FP.

[0199] The bent part BND of the display panel 100 may be a part where the substrate 110 is provided without providing the pixel array part 125, the encapsulation part 130, and the first support member 210 to be described below. The bent part BND may be a part that can be easily bent by the user in a desired direction.

[0200] The pad part PAD of the display panel 100 may be a part where the pixel array part 125 and the encapsulation part 130 are not provided.

[0201] In order to maintain the flat state of the pad part PAD, the second support member 220 may be connected or joined to the lower part of the pad part PAD.

[0202] For example, the front portion FP of the display panel 100 may be provided in the direction of the screen display. The pad portion PAD may be bent from the bending portion BND in the downward direction of the front portion FP and arranged in the downward direction of the front portion FP, for example, arranged on the back surface of the front portion FP.

[0203] The support members 210 and 220 may be provided under the substrate 110 in the display area AA.

[0204] The support members 210 and 220 may include a first support member 210 and a second support member 220.

[0205] The first support member 210 provided under the front portion FP of the display panel 100 and the second support member 220 provided under the pad portion PAD may be provided under the substrate 110 and may maintain the flat state of the front portion FP when enhancing the rigidity of the substrate 110.

[0206] The first support member 210 and the second support member 220 may be formed to have a predetermined strength and thickness to enhance the rigidity of the substrate 110. The first support member 210 and the second support member 220 may not be formed in the bending portion BND area where the bending portion BND is arranged.

[0207] Based on the shape formed before the display panel 100 is bent, the first support member 210 and the second support member 220 may be provided under the substrate 110 and spaced apart from each other.

[0208] For example, based on the shape formed after the display panel 100 is bent, the first support member 210 may be provided under the front portion FP, and the second support member 220 may be provided above the pad portion PAD.

[0209] Each of the first support member 210 and the second support member 220 may be a backplane provided on the back surface of the substrate 110.

[0210] The first support member 210 and the second support member 220 may each be configured as a rigid thin plastic film.

[0211] For example, the first support member 210 and the second support member 220 may be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc. This specification is not limited thereto.

[0212] In an embodiment, the first support member 210 and the second support member 220 may be made of the same material and have the same thickness. This specification is not limited thereto.

[0213] Based on the shape formed after the display panel 100 is bent, the connection member 200 can be disposed between the first support member 210 and the second support member 220.

[0214] When the bending part BND is bent such that the pad part PAD of the display panel 100 is disposed below the front part FP of the display panel 100, a restoring force for returning the bending part BND to the state formed before the bending part BND is bent can be violently applied to the display panel 100.

[0215] When the restoring force is violently applied, the pad part PAD of the bent display panel 100 may be separated without being fixed.

[0216] The connection member 200 can be used as a fixing member to fix and maintain the bent shape of the bent display panel 100.

[0217] The connection member 200 can be formed to have a predetermined thickness in the thickness direction to maintain a predetermined curvature of the bending part BND.

[0218] The connection member 200 can be a double-sided tape having an adhesive force capable of fixing the first support member 210 and the second support member 220. This specification is not limited thereto.

[0219] For example, the connection member 200 can include a material such as a pressure-sensitive adhesive (PSA), a transparent adhesive (optical clear adhesive (OCA)), or a resin (optical clear resin (OCR)) or be made of the above materials. This specification is not limited thereto.

[0220] For example, the connection member 200 can be configured as a foam tape or a foam pad having an adhesive force and further reducing impact.

[0221] The second support member 220 can be disposed below the connection member 200.

[0222] In order to dispose the second support member 220, the second support member 220 can be attached to the bottom surface of the pad part PAD of the substrate 110, the bending part BND can be bent, and the second support member 220 can be attached and fixed to the bottom surface of the connection member 200.

[0223] In a state where the second support member 220 is fixed to the connection member 200, the second support member 220 can be configured to be disposed on the pad part PAD of the substrate 110.

[0224] In a state where the second support member 220 is fixed to the connection member 200, an outer part (i.e., the top surface) of the bending part BND can be exposed to the outside, and an inner part (i.e., the bottom surface) of the bending part BND can be disposed to face the side surface of the connection member 200.

[0225] The microcoating layer 600 may be disposed on the top surface (i.e., the outer portion) of the bending portion BND of the display panel 100. The microcoating layer 600 may include the bending portion BND and be disposed on the substrate 110.

[0226] The microcoating layer 600 may extend to cover at least a partial area of the front portion FP and at least a partial area of the pad portion PAD while covering the bending portion BND.

[0227] The microcoating layer 600 may contain a resin. For example, the microcoating layer 600 may contain an ultraviolet (UV) curable acrylic-based resin. This specification is not limited thereto.

[0228] The microcoating layer 600 may cover various types of signal lines 14 disposed between the pad portion PAD and the encapsulation portion 130 of the display panel 100, which may inhibit moisture from penetrating into the signal lines while protecting the signal lines from external influences.

[0229] The bending portion BND may not include other constituent elements except for the substrate 110 and the signal lines to improve the flexibility of the display panel 100, such that the microcoating layer 600 may enhance the rigidity of the bending portion BND from which other constituent elements are removed.

[0230] For example, the driving circuit unit 400 may be disposed on the other surface of the pad portion PAD of the display panel 100 on which the second support member 220 is disposed on one surface.

[0231] The driving circuit unit 400 may be disposed and mounted on the substrate 110 in a chip on plastic (COP) or chip on film (COF) manner. However, this specification is not limited thereto.

[0232] The driving circuit unit 400 may generate a data signal and a gate control signal based on the image data and the timing synchronization signal supplied from an external host driving system.

[0233] The driving circuit unit 400 may supply the data signal to the data lines of each pixel through the pad portion PAD of the display panel 100, and supply the gate control signal to the gate driving circuit unit.

[0234] The driving circuit unit 400 may be installed in a chip mounting area defined on the substrate 110. The driving circuit unit 400 may be electrically connected to the pad portion PAD of the display panel 100, and respectively connected to the gate driving circuit unit and the signal lines of the pixel array unit 125 disposed on the substrate 110.

[0235] The pad portion PAD may be disposed at the end of the substrate 110 on which the driving circuit unit 400 is installed.

[0236] The pad portion PAD can be provided on one surface of the substrate 110 and electrically connected to the flexible printed circuit board 500 on which the circuit board is mounted.

[0237] The flexible printed circuit board 500 can be electrically connected to the pad portion PAD provided at the end of the substrate 110 by a film attachment process using a conductive bonding layer, and is disposed on the back surface of the display panel 100.

[0238] For example, the conductive bonding layer can be a conductive film such as an anisotropic conductive film (ACF).

[0239] The circuit board can supply the image data and timing synchronization signals supplied from the host drive system to the drive circuit portion 400, and the circuit board can supply the voltages required for the pixel array portion 125, the gate drive circuit portion, and the drive circuit portion 400 to operate.

[0240] As an example, Figure 9 The cross-section of the display module of the display device according to an embodiment of the present specification taken along line C-C' is shown. This configuration can also be applied to the cross-sections of the left edge and the upper edge. The embodiments of the present specification are not limited thereto.

[0241] The display device according to an embodiment of the present specification can include a cover member 20 and a display panel 100 provided on one surface of the cover member 20.

[0242] For example, the display device can include a first fixing member 190 provided between the cover member 20 and the display panel 100. The end of the first fixing member 190 can be provided to be located outside the end of the display area AA of the display panel 100. For example, since the first fixing member 190 is used to bond the cover member 20 and the display panel 100, the first fixing member 190 can be provided so as not to protrude from the end of the cover member 20. For example, the end of the first fixing member 190 can be located between the end of the cover member 20 and the display area AA of the display panel 100. For example, the area of the display area AA of the display panel 100 can be smaller than the area of the first fixing member 190.

[0243] As Figure 9 shown, since the first fixing member 190 can be provided to overlap the display area AA, the first fixing member 190 can be made of a material that can transmit an image from the display panel 100. For example, the first fixing member 190 can contain or be made of materials such as optical clear adhesive (OCA), optical clear resin (OCR), or pressure sensitive adhesive (PSA). The present specification is not limited thereto.

[0244] The first support member 210 may be disposed under the substrate 110 to maintain the flat state of the display substrate 110 while enhancing the rigidity of the substrate 110. The second fixing member 205 may be disposed, fixed, or joined between the substrate 110 and the first support member 210.

[0245] For example, the third fixing member 225 may be disposed, fixed, or joined between the substrate 110 and the second support member 220.

[0246] The second fixing member 205 and / or the third fixing member 225 may be fixing members, and at least one surface of the second fixing member 205 and / or the third fixing member 225 may be an adhesive or a binder.

[0247] The second fixing member 205 and / or the third fixing member 225 may each include or be made of a material such as a pressure-sensitive adhesive (PSA), a transparent binder (optical clear adhesive (OCA)), or a resin (optical clear resin (OCR)). This specification is not limited thereto.

[0248] For example, the second fixing member 205 and / or the third fixing member 225 may each be a double-sided adhesive.

[0249] The light-blocking pattern 21 may be formed on four surfaces of the edge of the cover member 20. For example, the light-blocking pattern 21 may be formed on the edge of the back surface of the cover member 20. In an embodiment, the light-blocking pattern 21 may be formed to partially overlap with the first fixing member 190, the optical film 180, and the display panel 100 disposed under the light-blocking pattern 21. For example, the light-blocking pattern 21 may be formed to overlap with a part of the bending portion BND.

[0250] For example, the light-blocking pattern 21 may include a black material with low permeability, such as black ink or black pigment, to define the edge of the display area AA.

[0251] In an embodiment, the light-blocking pattern 21 may be made of chromium (Cr) or graphite.

[0252] According to an embodiment of this specification, the substrate 110 may include a display area AA and a non-display area NA, and the non-display area NA may include a bending portion BND.

[0253] According to an embodiment of the present specification, the reinforcing member 700 may be disposed in the bending portion BND and under the substrate 110. The reinforcing member 700 may include a rigid portion 710a. The modulus (or elastic modulus) of the rigid portion 710a may be different from that of the substrate 110. The reinforcing member 700 of the display device 1 according to an embodiment of the present specification may include a rigid portion 710a having a larger modulus than the substrate 110, which may enhance the rigidity of the substrate 110 in the bending portion BND. Therefore, it is possible to minimize the short - circuit and breakage of the signal line 14 in the bending portion BND, and minimize the operating defects of the display device 1.

[0254] Figure 10 is an enlarged view of the back surface of the bending portion before the display device is bent according to an embodiment of the present specification.

[0255] Refer to Figure 10 , according to an embodiment of the present specification, the reinforcing member 700 including the rigid portion 710a may be disposed under the substrate 110 and attached to the lower portion of the substrate 110 before the bending portion BND of the substrate 110 is bent. Before the bending process, the reinforcing member 700 may be disposed between the first support member 210 and the second support member 220.

[0256] Figure 11 is an enlarged view of the back surface of the bending portion after the display device is bent according to an embodiment of the present specification.

[0257] Refer to Figure 11 , the display device 1 according to an embodiment of the present specification may be pushed by applying an external force in the second direction 10b after the bending process. The display device 1 according to an embodiment of the present specification may include the reinforcing member 700 between the lower portion of the substrate 110 and the support members 210 and 220. Therefore, by enhancing the rigidity related to the axis in the first direction 10a of the bending portion BND to resist the external force in the second direction 10b, it is possible to minimize Figure 3 the line disconnection or breakage of the signal line 14 therein.

[0258] Figure 12 is a cross - sectional view showing the reinforcing member and the substrate of the display device according to an embodiment of the present specification.

[0259] Refer to Figure 12 , according to an embodiment of the present specification, at least one rigid portion 710a or a plurality of rigid portions 710a overlapping the bending portion BND may be provided. In the case where a plurality of rigid portions 710a are provided, the plurality of rigid portions 710a may be provided to be spaced apart from each other.

[0260] The reinforcing member 700 in the bending portion BND is required to be flexible to enable the bending of the bending portion BND, and the reinforcing member 700 is required to be rigid to suppress the short circuit of the signal line 14. Therefore, for example, a plurality of rigid portions 710a may be provided to be spaced apart from each other to ensure both flexibility and rigidity. For example, the rigid portions 710a may be provided at uniform (equal) intervals. For example, in the case where the rigid portions 710a are not uniformly provided, an imbalance may occur, which may increase the possibility of defects. Therefore, the rigid portions 710a may be uniform, which can minimize defects. The embodiments of the present specification are not limited thereto.

[0261] In an embodiment, the reinforcing member 700 may include an opening portion. The embodiments of the present specification are not limited thereto.

[0262] Referring to Figure 3 、 Figure 9 and Figure 12 ,the signal line 14 may be disposed in the display area AA on the substrate 110 and extend to the bending portion BND, and the signal line 14 and the rigid portion 710a may overlap each other. The rigid portion 710a may be provided to be spaced apart from the cover member 20 toward the pad portion PAD in the direction from the upper side to the lower side, which can ensure both flexibility and rigidity. For example, the signal line 14 and the rigid portion 710a may be disposed in different directions. The signal line 14 and the rigid portion 710a may be provided to cross in the vertical direction. Since the signal line 14 may be disposed in the bending direction and the rigid portions 710a are spaced apart from each other in a direction that is not the bending direction, this can support and protect the substrate 110 in the bending portion BND. Therefore, the short circuit and breakage of the signal line 14 can be minimized.

[0263] Referring to Figure 9 and Figure 12 ,a first surface 1S as one surface of the reinforcing member 700 may be an adhesive portion (attachment portion) attached to the substrate 110, and a second surface 2S as the other surface of the reinforcing member 700 may be a non-adhesive portion.

[0264] The rigid portion 710a may contain at least one of metal and plastic to have rigidity. For example, the rigid portion 710a may contain a metal such as steel, aluminum, or stainless steel (SUS) to have rigidity or include plastic in consideration of workability. The rigid portion 710a may be a core having a circular shape or a cylindrical shape. The embodiments of the present specification are not limited thereto.

[0265] Referring to Figure 12 ,the reinforcing member 700 may include a support layer 703.

[0266] The support layer 703 can be configured as a single layer or at least two layers. The support layer 703 can include a first support layer 701 and a second support layer 702. In an embodiment, the rigid portion 710a can be disposed between the first support layer 701 and the second support layer 702.

[0267] The first support layer 701 can be a base, and the second support layer 702 can be an adhesive portion. The second support layer 702 can be disposed on the first support layer 701, and the first surface 1S (which is at least one surface) can be attached or joined to the substrate 110.

[0268] The bent portion 705 can be disposed between the first support layer 701 and the second support layer 702 and includes a plurality of inclined portions and a plurality of recessed portions. The rigid portion 710a can be disposed in the recessed portions of the plurality of bent portions 705. For example, the rigid portion 710a can be disposed on the plurality of bent portions 705. The embodiments of the present specification are not limited thereto.

[0269] The materials of the first support layer 701 and the second support layer 702 can be different.

[0270] For example, the first support layer 701 can be a base and made of a flexible material. The first support layer 701 can be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc. The present specification is not limited thereto. For example, the first support layer 701 can be made of the same material as the support members 210 and 220. The embodiments of the present specification are not limited thereto.

[0271] For example, since the first support layer 701 needs to be bent in the bending portion BND, the first support layer 701 can have a smaller thickness than the support members 210 and 220.

[0272] For example, the second support layer 702 can be an adhesive portion and fix the rigid portion 710a and the substrate 110. The second support layer 702 can be an adhesive. The second support layer 702 can contain or be made of materials such as a pressure-sensitive adhesive (PSA), a transparent adhesive (optical clear adhesive (OCA)), or a resin (optical clear resin (OCR)). The present specification is not limited thereto.

[0273] Referring to Figure 9 and Figure 12 , according to the embodiments of the present specification, in the bending portion BND, the rigid portion 710a can be disposed on the first support layer 701, the second support layer 702 can be disposed on the rigid portion 710a, the substrate 110 can be disposed on the second support layer 702, the signal line 14 can be disposed on the substrate 110, and the microcoating layer 600 can be disposed on the signal line 14.

[0274] According to an embodiment of the present specification, in the bending portion BND, the substrate 110 may be disposed on the reinforcing member 700, the signal line 14 may be disposed on the substrate 110, and the microcoating layer 600 may be disposed on the signal line 14.

[0275] In an embodiment, the modulus of the rigid portion 710a and the modulus of the support layer 703 may be different from each other. The modulus of the rigid portion 710a may be greater than the modulus of the support layer 703. For example, the modulus of the rigid portion 710a and the modulus of the second support layer 702 may be different from each other. The modulus of the rigid portion 710a may be greater than the modulus of the second support layer 702.

[0276] For example, since the second support layer 702 uses an adhesive, the second support layer 702 may have flexibility and facilitate processing control. The rigid portion 710a may have a large modulus and high rigidity. Therefore, the flexibility of the bending portion BND can be ensured and the rigidity of the circuit line 14 can be strengthened, thereby suppressing short - circuit and breakage of the line.

[0277] In an embodiment, the second fixing member 205 and / or the third fixing member 225 disposed between the substrate 110 and the support members 210 and 220 may be an adhesive and contain the same material as or be made of the same material as the second support layer 701. The present specification is not limited thereto.

[0278] Figure 13 is a cross - sectional view taken along the line C - C' in Figure 6 according to another embodiment of the present specification.

[0279] Compared with the embodiment in Figure 9 , the embodiment in Figure 13 may have the same constituent elements except for the reinforcing member 800. The description of the repeated configuration will be omitted.

[0280] Referring to Figure 13 , the reinforcing member 800 according to another embodiment of the present specification may include a first support layer 801, a second support layer 802, and a rigid portion 710a.

[0281] For example, the first support layer 801 may be a base and made of a flexible material.

[0282] The first support layer 801 may be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc. The present specification is not limited thereto.

[0283] The second support layer 802 may be a fixing member, and at least one surface of the second support layer 802 may be an adhesive. The embodiments of the present specification are not limited thereto.

[0284] The second support layer 802 may include or be made of materials such as a pressure-sensitive adhesive (PSA), a transparent adhesive (optically clear adhesive (OCA)), or a resin (optically clear resin (OCR)). This specification is not limited thereto. For example, the second support layer 802 may be a double-sided adhesive.

[0285] In an embodiment, the second support layer 802 may extend from the lower portion of the substrate 110 overlapping the display area AA to the bending portion BND. For example, the second support layer 802 may extend to the pad portion PAD and overlap with the lower portion of the second support member 220.

[0286] For example, the second support layer 802 may be a fixing member. The fixing member may be disposed between the substrate 110 and the support members 210 and 220 and may extend to the bending portion BND.

[0287] Since the second support layer 802 extends to the bending portion BND in the display area AA, an additional process for the bending portion BND may be cancelled, and separation of the adhesive in the bending portion BND may be minimized.

[0288] Figures 14A to 14C is a view for explaining a method of manufacturing a reinforcing member according to an embodiment of the present specification.

[0289] Referring to Figure 14A , a mold MO having a bent portion including a recessed portion may push the first support layer 701 in a third direction (e.g., the Z-axis direction).

[0290] Referring to Figure 14B , the recessed bent portion 705 may be formed on the first support layer 701 by the mold MO.

[0291] Referring to Figure 14C , the first support layer 701 may be disposed on the base frame 77, and then the base frame 77 may be inclined at a predetermined angle. Thereafter, the rigid portion 710a may roll on the base frame 77 and the first support layer 701 from top to bottom so that the rigid portion 710a may be disposed on the first support layer 701. Referring to Figure 12 , the reinforcing member 700 may be attached to the lower portion of the substrate 110.

[0292] Figures 15A to 15C is a view for explaining a method of manufacturing a reinforcing member according to another embodiment of the present specification.

[0293] Referring to Figure 15A , according to an embodiment, the rigid portion 710a may be randomly disposed. For example, the rigid portion 710a may be made of a conductive material.

[0294] Referring to Figure 15B, a plurality of magnets MA may be disposed at uniform intervals below the first support layer 701, and then a plurality of rigid portions 710a may be arranged and disposed on the first support layer 701 at uniform intervals by magnetic force. Thereafter, a resin RE may be coated onto the first support layer 701 and the rigid portions 710a. The resin RE may be Figure 15C the second support layer 702 in

[0295] Referring to Figures 15C to 15D , a reinforcing member 700 including the rigid portions 710a disposed between the first support layer 701 and the second support layer 702 can be manufactured.

[0296] According to an embodiment, referring to Figure 11 and Figure 15D , the rigid portion 710a may have a cylindrical shape extending in the first direction 10a to strengthen the rigidity against an external force in the second direction 10b.

[0297] The display device according to an embodiment of the present specification can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved surface devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation systems, navigation systems for vehicles, display devices for vehicles, devices for vehicles, devices for cinemas, display devices for cinemas, televisions, wallpaper devices, sign devices, game devices, notebooks, monitors, cameras, video cameras, household appliances, etc. In addition, the display device of the present specification can be applied to an organic light-emitting lighting device or an inorganic light-emitting lighting device.

[0298] Exemplary embodiments of the present disclosure can also be described as follows:

[0299] According to an aspect of the present disclosure, a display device is provided. The display device includes a substrate including a display area and a non-display area, and the non-display area includes a curved portion. The display device further includes a support member disposed below the substrate in the display area. The display device further includes a microcoating layer disposed above the substrate in the curved portion. The display device further includes a reinforcing member disposed below the substrate in the curved portion. The reinforcing member includes a rigid portion.

[0300] One surface of the reinforcing member may be attached to the substrate, and the other surface of the reinforcing member may be a non-adhesive portion.

[0301] The rigid portions may be arranged as a plurality of rigid portions spaced apart from each other.

[0302] The display device may further include a signal line that extends from the display area to the bending portion on the substrate, and a microcoating layer is provided on the signal line. The signal line and the rigid portion overlap each other.

[0303] The signal line and the rigid portion may be arranged in different directions.

[0304] The modulus of the rigid portion may be different from the modulus of the substrate.

[0305] The rigid portions may be arranged at uniform intervals.

[0306] The rigid portion may include at least one of metal and plastic.

[0307] The reinforcing member may include a support layer, the support layer includes a first support layer and a second support layer, and the rigid portion is provided between the first support layer and the second support layer.

[0308] The first support layer may be a base, the second support layer may be provided on the first support layer, the second support layer may be an adhesive portion, and at least one surface of the second support layer may be joined to the substrate.

[0309] The display device may include a plurality of bending portions between the first support layer and the second support layer. The rigid portions may be provided on the plurality of bending portions.

[0310] The materials of the first support layer and the second support layer may be different.

[0311] The first support layer may include polyethylene terephthalate, and the second support layer may include at least one of a pressure-sensitive adhesive, a transparent adhesive, and a resin.

[0312] The material of the first support layer may be the same as the material of the support member.

[0313] The modulus of the rigid portion and the modulus of the second support layer may be different from each other.

[0314] The display device may further include a fixing member between the substrate and the support member. The fixing member may be made of the same material as the second support layer.

[0315] The display device may further include a fixing member between the substrate and the support member. The fixing member may extend from the lower portion of the substrate to the bending portion.

[0316] The rigid portion may be in a cylindrical shape.

[0317] The thickness of the first support layer may be less than the thickness of the support member.

[0318] The support member may include: a first support member; a second support member; and a connection member, wherein, in a bent state of the substrate, the connection member is disposed between the first support member and the second support member.

[0319] The substrate may include a front surface portion and a pad portion, wherein the front surface portion includes a display area and a portion of the non-display area other than the bent portion, wherein, in a bent state of the substrate, the pad portion extends from the bent portion to the back surface of the front surface portion, and wherein, in a bent state of the substrate, the second support member is joined to the pad portion.

[0320] According to another aspect of the present disclosure, there is provided a display device. The display device includes a substrate including a display area and a bent portion. The display device further includes a backplane disposed in the display area below the substrate. The display device further includes a reinforcing member disposed in the bent portion below the substrate. The reinforcing member includes at least two support layers.

[0321] The reinforcing member may include a plurality of rigid portions spaced apart from each other, and the plurality of rigid portions are disposed between the at least two support layers.

[0322] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto, and the present disclosure may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The protection scope of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope thereof should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: a substrate including a display area and a non-display area, the non-display area including a bent portion; a support member disposed in the display area below the substrate; a microcoating layer disposed in the bent portion above the substrate; and a reinforcing member disposed in the bent portion below the substrate, wherein the reinforcing member includes a rigid portion.

2. The display device according to claim 1, wherein, One surface of the reinforcing member is attached to the substrate, and the other surface of the reinforcing member is a non-adhesive portion.

3. The display device according to claim 1, wherein, The rigid portions are arranged as a plurality of rigid portions spaced apart from each other.

4. The display device according to claim 1, further comprising: a signal line extending from the display area to the bent portion on the substrate, and the microcoating layer is disposed on the signal line, wherein the signal line and the rigid portion overlap each other.

5. The display device according to claim 4, wherein, The signal line and the rigid portion are disposed in different directions.

6. The display device according to claim 1, wherein, The modulus of the rigid portion is different from the modulus of the substrate.

7. The display device according to claim 3, wherein, The plurality of rigid portions are disposed at uniform intervals.

8. The display device according to claim 1, wherein, The rigid portion includes at least one of metal and plastic.

9. The display device according to claim 1, wherein, The reinforcing member includes a support layer, the support layer includes a first support layer and a second support layer, and the rigid portion is disposed between the first support layer and the second support layer.

10. The display device according to claim 9, wherein, The first support layer is a base, the second support layer is disposed on the first support layer, the second support layer is an adhesive portion, and at least one surface of the second support layer is joined to the substrate.

11. The display device according to claim 9, further comprising: a plurality of bent portions between the first support layer and the second support layer, wherein the rigid portion is disposed on the plurality of bent portions.

12. The display device according to claim 9, wherein, The materials of the first support layer and the second support layer are different.

13. The display device according to claim 9, wherein, The first support layer includes polyethylene terephthalate, and the second support layer includes at least one of a pressure-sensitive adhesive, a transparent adhesive, and a resin.

14. The display device according to claim 9, wherein, The material of the first support layer is the same as the material of the support member.

15. The display device according to claim 9, wherein, The modulus of the rigid portion and the modulus of the second support layer are different from each other.

16. The display device according to claim 9, further comprising: a fixing member between the substrate and the support member, wherein the fixing member is made of the same material as the second support layer.

17. The display device according to claim 1, further comprising: a fixing member between the substrate and the support member, wherein the fixing member extends from the lower portion of the substrate to the bent portion.

18. The display device according to claim 1, wherein, The rigid portion has a cylindrical shape.

19. The display device according to claim 9, wherein, The thickness of the first support layer is less than the thickness of the support member.

20. The display device according to claim 1, wherein, The support member includes: a first support member; a second support member; and a connecting member, wherein, in the bent state of the substrate, the connecting member is disposed between the first support member and the second support member.

21. The display device according to claim 20, wherein, The substrate includes a front portion and a pad portion, Wherein, the front portion includes the display area and the portion of the non-display area other than the bent portion. Wherein, in the bent state of the substrate, the pad portion extends from the bent portion to the back surface of the front portion. Wherein, in the bent state of the substrate, the second support member is joined to the pad portion.

22. A display device, comprising: A substrate including a display area and a bent portion; A backplane disposed below the substrate in the display area; And A reinforcing member disposed below the substrate in the bent portion, Wherein, the reinforcing member includes at least two support layers.

23. The display device according to claim 22, wherein, The reinforcing member includes a plurality of rigid portions spaced apart from each other, and the plurality of rigid portions are disposed between the at least two support layers.

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