Chip 3D packaging equipment

Abstract

The chip 3D packaging equipment comprises a supporting frame, a PCB, a chip and a tin soldering mechanism, a rotating disc is installed on one side of the supporting frame, the chip is installed on the PCB, and a mechanical arm is movably installed above the rotating disc in an embedded mode. In the process that the chips are installed on the PCB through the packaging chucks, a plurality of straightening clamping plates are opened through driving operation of a connecting shaft, so that pins of the chips enter the straightening clamping plates through the packaging chucks and are inserted into a tin planting table of a tin pipe, at the moment, a second telescopic pipe exerts downward pressure on the chips through the packaging chucks, and the pins of the chips are inserted into the tin planting table of the tin pipe. In the process, the straightening clamping plate is extruded and closed by the PCB when the straightening clamping plate is pressed downwards to retreat from the hole groove, and then the pins of the chip are extruded and straightened, so that the situation that the pins of the chip are bent, so that the function of the chip is damaged, and the chip is scratched when being connected and packaged on the printed circuit board is avoided.

Description

Technical Field

[0001] The present invention relates to the field of chip 3D packaging equipment, and specifically to a chip 3D packaging equipment. Background Art

[0002] Chip packaging is a crucial step, which involves the process of installing and fixing a semiconductor chip onto a printed circuit board (PCB). Through meticulous operations, it ensures that the chip can be safely and firmly connected to the PCB. Dual in-line package (DIP) is an integrated circuit packaging form. In this packaging form, the pins of the chip are arranged in two columns, and each column is inserted into a socket or slot. DIP usually connects the chip to the circuit board by inserting it into the printed circuit board. DIP is widely used in electronic products, and it has good versatility and applicability, and is easy to install and maintain.

[0003] However, during transportation, the chip pins may bend due to pressure or collision. This situation can lead to damage to the chip's function, and even cause scratches on the printed circuit board when connecting and packaging with the printed circuit board, thus affecting its normal use. In addition, when welding and packaging the chip pins, if there is too much welding material, it may cause short circuits or connections between the pins, resulting in interference. On the contrary, if there is too little welding material, it will lead to insecure welding, thus affecting the performance and stability of the chip.

[0004] Therefore, a chip 3D packaging equipment is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip 3D packaging equipment to solve the problems raised in the above background art, that is, when the chip pins bend due to pressure or collision, it will lead to damage to the chip's function, and even cause scratches on the printed circuit board when connecting and packaging with the printed circuit board. At the same time, when welding and packaging the chip pins, if there is too much welding material, it may cause short circuits or connections between the pins, resulting in interference. On the contrary, if there is too little welding material, it will lead to insecure welding, affecting the performance and stability of the chip.

[0006] To achieve the above purpose, the present invention provides the following technical solutions: A 3D chip packaging device, comprising a support frame, a PCB board, a chip and a soldering mechanism. A rotating disk is installed on one side of the support frame. The chip is installed on the PCB board. Above the rotating disk, a robotic arm is fitted and movably installed, and a first driving member for driving is provided between the robotic arms. A packaging chuck is fixedly installed on one side of the rotating disk. An air pump is fixedly installed on one side of the packaging chuck, and a cavity for containing flux is provided on one side inside the packaging chuck. An air passage is provided inside the packaging chuck, and the air passage is connected to the air pump in an airtight manner. A supply pipe is fixedly installed on the other side inside the packaging chuck, and the supply pipe is connected to the cavity in a penetrating manner. An air suction clamping pipe is provided on one side of the supply pipe, and the air suction clamping pipe is fixedly connected to the packaging chuck. A telescopic pipe one is fitted and movably installed inside the air suction clamping pipe, and the telescopic pipe one is fitted and movably connected to the supply pipe. A spring member is nested on the outer side of the telescopic pipe one; Above the soldering mechanism, a solder supply pipe is provided. A solder planting head is fitted and installed above the solder supply pipe, and the solder planting head is connected to the solder supply pipe in a penetrating manner. A telescopic pipe two is fitted and movably installed on one side of the solder planting head. Above the telescopic pipe two, a connecting shaft is provided, and a straightening clamping plate is fixedly connected above the connecting shaft. A tin pipe is fitted and installed inside the telescopic pipe two, and a solder planting table that fits the pins on the chip is provided above the tin pipe. Spring members are installed inside the solder planting head at the front and back, and the spring members are fixedly connected to one side of the telescopic pipe two.

[0007] In the above solution, preferably: A console is fixedly installed on one side above the support frame. Above one side of the console, a display for displaying the operating parameters of the device is provided, and control keys for controlling the operation of the device are provided on the other side of the display.

[0008] In the above solution, preferably: Two conveying platforms are fixedly installed above the support frame. A servo motor is fixedly installed on one side of one conveying platform. A transmission shaft is connected to the servo motor on one side, and the transmission shaft is fitted and movably installed between the two conveying platforms.

[0009] In the above solution, preferably: A plurality of driving wheels are fitted and installed inside both of the two conveying platforms, and a transmission belt is nested on the outer side of the driving wheels. The transmission belt is in a fitting and driving connection with the transmission shaft. Above the inner side of the conveying platform, a packaging platform is provided, and the packaging platform is in a fitting connection with the transmission belt.

[0010] In the above solution, preferably: An installation frame and a fixing frame are fixedly installed on one side of the support frame. A horizontal sliding rod is fixedly installed on the installation frame. A sliding table is fitted and movably installed on the horizontal sliding rod, and a vertical sliding table is fitted and movably connected to one side of the sliding table. A feeding plate is fixedly connected to one side of the vertical sliding table, and feeding jigs for clamping the PCB board are provided at the four corners of the feeding plate.

[0011] In the above solution, preferably: a storage rack is provided below the loading plate, and the storage rack is fixedly installed on the support frame. The storage rack includes a rotator, and a rotating rod for rotating and lifting is fitted and installed in the middle of the rotator. Below the PCB board, there are two feeding platforms, and support rods are fixedly connected at the four corners between the feeding platforms. One of the feeding platforms is fitted and movably installed on the rotating rod.

[0012] In the above solution, preferably: a chip box for holding chips is fitted and installed on one side of the fixed frame, and a telescopic baffle is provided on one side of the soldering mechanism, and the telescopic baffle is fixedly installed inside the support frame.

[0013] In the above solution, preferably: a rotating shaft is fitted and movably installed above the soldering mechanism, and a second driving member is fixedly installed above the rotating shaft. An adjusting arm is fitted and movably installed in the middle of the second driving member, and a feeding tin pipe is installed on one side of the adjusting arm. A soldering pen is fitted and movably installed on one side of the feeding tin pipe.

[0014] The present invention provides a chip 3D packaging device, which has the following technical key points and beneficial effects:

[0015] 1. In the present invention, by designing devices such as a packaging chuck, a straightening clamping plate, and a tin pipe, during the process of installing the chip onto the PCB board via the packaging chuck, driven by the connecting shaft, the multiple straightening clamping plates are opened so that the pins of the chip can pass through the packaging chuck and enter the straightening clamping plates, and then be inserted onto the tin planting table of the tin pipe. At this time, the second telescopic tube applies a downward pressure to the chip through the packaging chuck, causing the tin pipe to drive the second telescopic tube to withdraw from the hole slot on the PCB board. During this process, when the straightening clamping plate withdraws from the hole slot under downward pressure, it is squeezed and closed by the PCB board, thereby squeezing and straightening the pins of the chip, thus avoiding the damage to the functions of the chip caused by the bending of the chip pins and preventing scratches when connecting and packaging with the printed circuit board.

[0016] 2. In the present invention, by designing devices such as a packaging chuck, a straightening clamping plate, and a tin planting table, the tin planting head is connected in through connection with the feeding tin pipe to provide the required solder for the soldering and packaging process. An appropriate amount of solder for soldering and packaging is filled into the tin planting table and adhered to the pins of the chip with flux. Subsequently, the straightening clamping plate is driven by the connecting shaft to open again, releasing the pins that have adhered to the solder. At the same time, the feeding tin pipe descends on the second driving member to provide sufficient welding space for the soldering pen. At this time, the soldering pen starts to adjust its position on the feeding tin pipe and operates, welding along the pins of the chip. Finally, the pins on the chip are firmly welded to the PCB board through the solder, thereby providing an appropriate amount of solder for the welding of the chip pins to prevent the excessive or insufficient welding material from affecting the use and stability of the chip.

[0017] 3. In the present invention, by designing devices such as a packaging chuck, an air-suction pipe clamp, and a telescopic pipe 1, during the process of the packaging chuck picking up the chip, the air pump starts to operate by pumping air, resulting in a negative pressure inside the air passage, prompting the telescopic pipe 1 to slide towards the flux supply pipe inside the air-suction pipe clamp. When the telescopic pipe 1 slides into the flux supply pipe, a certain amount of flux will enter the air-suction pipe clamp through the one-way valve on the telescopic pipe 1. At the same time, the negative pressure generated by the air pump not only drives the telescopic pipe 1 to slide but also forms a negative pressure at the orifice of the air-suction pipe clamp, thereby adsorbing the chip so that it can be successfully picked up by the air-suction pipe clamp on the packaging chuck. When the chip is packaged onto the PCB board, the air pump stops operating. At this time, under the elastic action of the spring member, the telescopic pipe 1 returns to its initial position, and at the same time, the flux inside the air-suction pipe clamp is extruded to facilitate welding and packaging the chip on the PCB board for use, thereby providing an appropriate amount of flux when the chip is welded and packaged on the PCB board. Brief Description of the Drawings

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the connection structure between the loading plate and the cross slide bar of the present invention.

[0020] Figure 3 It is a schematic diagram of the partial structure of the rotating disk of the present invention.

[0021] Figure 4 It is a schematic plan view of the partial structure of the storage rack of the present invention.

[0022] Figure 5 It is a schematic diagram of the connection structure between the loading plate and the storage rack of the present invention.

[0023] Figure 6 It is a schematic diagram of the partial structure of the conveying table board of the present invention.

[0024] Figure 7 It is a schematic diagram of the partial structure of the soldering mechanism of the present invention.

[0025] Figure 8 It is a schematic diagram of the partial structure of the solder paste head of the present invention.

[0026] Figure 9 It is a schematic sectional view of the partial structure of the packaging chuck of the present invention.

[0027] Figure 10 For the present invention Figure 2 A partial enlarged schematic view of the structure at A.

[0028] In the figure: 1, support frame; 2, control console; 3, display; 4, control keys; 5, conveying platen; 501, servo motor; 502, driving wheel; 503, transmission belt; 504, transmission shaft; 6, rotating disk; 601, robotic arm; 602, driving member 1; 603, encapsulation chuck; 604, air pump; 605, dosing tube; 606, air duct; 607, air suction clamping tube; 608, telescopic tube 1; 7, mounting bracket; 701, horizontal sliding rod; 702, fixing bracket; 8, encapsulation platen; 9, PCB board; 901, chip; 10, chip box; 11, loading board; 1101, sliding table; 1102, vertical sliding table; 1103, feeding fixture; 12, storage rack; 1201, rotator; 1202, rotating rod; 1203, feeding table; 1204, support rod; 13, telescopic baffle; 14, soldering mechanism; 1401, rotating shaft; 1402, driving member 2; 1403, adjusting arm; 1404, feeding solder tube; 1405, soldering pen; 15, solder paste head; 1501, straightening clamping plate; 1502, solder tube; 1503, solder paste table; 1504, telescopic tube 2; 16, spring member. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figures 1 to 10 , the present invention provides a technical solution for a chip 3D encapsulation device: A chip 3D encapsulation device includes a support frame 1, a PCB board 9, a chip 901, and a soldering mechanism 14. A rotating disk 6 is installed on one side of the support frame 1. The chip 901 is installed on the PCB board 9. One side above the support frame 1 is fixedly installed with a control console 2. Above one side of the control console 2 is provided with a display 3 for displaying the operating parameters of the device, and on the other side of the display 3 are provided control keys 4 for controlling the operation of the device. One side of the fixing bracket 702 is fitted with a chip box 10 for holding the chip 901. One side of the soldering mechanism 14 is provided with a telescopic baffle 13, and the telescopic baffle 13 is fixedly installed inside the support frame 1; During operation, the control instructions of the control key 4 are processed by the console 2 to control the use of other devices, and the chip box 10 is installed and used through the fixing bracket 702. Secondly, the chip 901 is placed in the chip box 10 for use when the encapsulation chuck 603 picks it up. During use, the parameters of the working states of each device are displayed through the display 3. When the encapsulation platen 8 gradually moves from the conveyor belt 503 to below the fixing bracket 702, the telescopic baffle 13 blocks the encapsulation platen 8. At this time, the servo motor 501 stops operating to ensure that the encapsulation platen 8 stays at the encapsulation position. After the chip 901 is encapsulated onto the PCB board 9, the telescopic baffle 13 descends at this time, and the servo motor 501 starts to operate, and then the PCB board 9 after encapsulation on the encapsulation platen 8 is conveyed out of the conveying platen 5.

[0031] As an embodiment of the present invention, as Figures 1 to 9 shown, a robotic arm 601 is fitted and movably installed above the rotating disk 6, and a driving member 602 for driving is provided between the robotic arms 601. A packaging chuck 603 is fixedly installed on one side of the rotating disk 6. An air pump 604 is fixedly installed on one side of the packaging chuck 603. A cavity for containing flux is provided on one side inside the packaging chuck 603. An air passage 606 is provided inside the packaging chuck 603, and the air passage 606 is connected to the air pump 604 in an airtight manner. A supply pipe 605 is fixedly installed on the other side inside the packaging chuck 603, and the supply pipe 605 is in through connection with the cavity. An air suction clamping pipe 607 is provided on one side of the supply pipe 605, and the air suction clamping pipe 607 is fixedly connected to the packaging chuck 603. A telescopic pipe 608 is fitted and movably installed inside the air suction clamping pipe 607, and the telescopic pipe 608 is fitted and movably connected to the supply pipe 605. A spring member 16 is nested on the outer side of the telescopic pipe 608; During operation, the position of the robotic arm 601 is adjusted through the operation of the rotating disk 6, and the robotic arm 601 is driven by the first driving member 602 to pick up the chip 901 in the chip box 10 by the encapsulation chuck 603. When the encapsulation chuck 603 picks up the chip 901, the air pump 604 operates to pump air. At this time, a negative pressure is generated in the air duct 606, and then the first telescopic tube 608 slides into the dosing tube 605 in the air suction clamping tube 607. Since the cavity on one side of the encapsulation chuck 603 is loaded with flux and the cavity is connected to the dosing tube 605 in a through manner, when the first telescopic tube 608 slides into the dosing tube 605, a certain amount of flux passes through the one-way valve on the first telescopic tube 608 from the dosing tube 605 into the air suction clamping tube 607. At the same time, when the negative pressure generated by the air pump 604 drives the first telescopic tube 608 to slide, the negative pressure generated at the opening of the air suction clamping tube 607 adsorbs the chip 901, so that the chip 901 can be picked up by the air suction clamping tube 607 on the encapsulation chuck 603. When the chip 901 is encapsulated onto the PCB board 9, the air pump 604 stops operating. At this time, the first telescopic tube 608 returns to its initial position under the elastic potential energy of the spring member 16, and at the same time, the flux in the air suction clamping tube 607 is extruded to facilitate soldering and encapsulating the chip 901 on the PCB board 9 for use.

[0032] As an embodiment of the present invention, as Figure 7 and Figure 8 shown, a feeding tin tube 1404 is provided above the soldering mechanism 14. A tin planting head 15 is fitted and installed above the feeding tin tube 1404, and the tin planting head 15 is connected to the feeding tin tube 1404 in a through manner. A second telescopic tube 1504 is fitted and movably installed on one side of the tin planting head 15. A connecting shaft is provided above the second telescopic tube 1504, and a straightening clamping plate 1501 is fixedly connected above the connecting shaft. A tin tube 1502 is fitted and installed inside the second telescopic tube 1504, and a tin planting table 1503 that fits the pins on the chip 901 is provided above the tin tube 1502. Springs 16 are installed inside the tin planting head 15 at the front and back, and the springs 16 are fixedly connected to one side of the second telescopic tube 1504; A rotating shaft 1401 is fitted and movably installed above the soldering mechanism 14, and a second driving member 1402 is fixedly installed above the rotating shaft 1401. An adjusting arm 1403 is fitted and movably installed in the middle of the second driving member 1402, and the feeding tin tube 1404 is installed on one side of the adjusting arm 1403. A soldering pen 1405 is fitted and movably installed on one side of the feeding tin tube 1404; During operation, before the chip 901 is mounted on the PCB board 9 through the packaging chuck 603, the rotation of the rotating shaft 1401 is adjusted to the packaging welding position of the driving part 1402. Through the operation of the driving part 1402, the adjusting arm 1403 is engaged and moved on the driving part 1402 to adjust the position of the tin head 15 on the feeding tin tube 1404 below the PCB board 9. Then, the angle of the feeding tin tube 1404 is adjusted by the adjusting rod on the side of the driving part 1402, and the tin head 15 on the feeding tin tube 1404 is driven to move upward. The pins of chip 901 enter the straightening plate 1501 through the packaging chuck 603, and then the pins of chip 901 are inserted into the tin-planting platform 1503 of the tin tube 1502, so that the telescopic tube 2 1504 passes through the packaging chuck 603. The clamp 603 presses the chip 901 on the tin-planting platform 1503, so that the tin tube 1502 drives the telescopic tube 2 1504 to exit the hole groove on the PCB board 9. At this time, the straightening clamp 1501 is squeezed and closed by the PCB board 9 when it is pressed down to exit the hole groove, thereby squeezing and straightening the pins of the chip 901 and retracting them into the tin-planting head 15. The tin-planting head 15 is connected to the feeding tin tube 1404 to provide tin material for soldering the package. The tin material required for soldering the package is loaded into the tin-planting platform 150. 3 is adhered to the pins with flux on the chip 901, and then the straightening clamp 1501 is driven to reopen by the connecting shaft, releasing the pins that have been adhered to the tin material, and at the same time the feeding tin tube 1404 descends on the driving part 2 1402 to provide a welding space for the welding pen 1405. At this time, the welding pen 1405 begins to adjust its position on the feeding tin tube 1404 and welds along the pins of the chip 901, and then welds the pins on the chip 901 to the PCB board 9 through the tin material for packaging.

[0033] As an embodiment of the present invention, Figures 1 to 6 As shown, two conveying platens 5 are fixedly installed above the support frame 1, and a servo motor 501 is fixedly installed on one side of one conveying platen 5, and a transmission shaft 504 is transmission-connected on one side of the servo motor 501, and the transmission shaft 504 is movably installed in an inlaid manner between the two conveying platens 5, and a plurality of transmission wheels 502 are inlaid on the inner sides of the two conveying platens 5, and a transmission belt 503 is nested and installed on the outer sides of the transmission wheels 502, and the transmission belt 503 is in affixed with the transmission shaft 504 for transmission connection, and a packaging platen 8 is provided on the upper inner side of the conveying platen 5, and the packaging platen 8 is in an inlaid connection with the transmission belt 503; During operation, the encapsulation platen 8 is placed on the conveyor belt 503. The operation of the servo motor 501 drives the transmission shaft 504 to rotate. Since the transmission shaft 504 is in frictional transmission connection with the conveyor belt 503, when the transmission shaft 504 rotates, it drives the conveyor belt 503 to reciprocate on the transmission pulley 502, thereby causing the encapsulation platen 8 to move along the direction of the conveying platen 5, so that the encapsulation platen 8 reaches below the fixed bracket 702 for placing the PCB board 9 for encapsulation with the chip 901.

[0034] As an embodiment of the present invention, as Figures 1 to 5 shown, one side of the support frame 1 is fixedly installed with a mounting frame 7 and a fixed bracket 702. The mounting frame 7 is fixedly installed with a horizontal sliding rod 701. A sliding table 1101 is fitted and movably installed on the horizontal sliding rod 701. One side of the sliding table 1101 is fitted and movably connected with a vertical sliding table 1102. One side of the vertical sliding table 1102 is fixedly connected with a loading plate 11. The four corners of the loading plate 11 are provided with feeding jigs 1103 for clamping the PCB board 9. Below the loading plate 11 is provided a storage rack 12, and the storage rack 12 is fixedly installed on the support frame 1. The storage rack 12 includes a rotator 1201, and a rotating rod 1202 for rotating and lifting is fitted and installed in the middle of the rotator 1201. Below the PCB board 9 are provided two feeding platforms 1203, and the four corners between the feeding platforms 1203 are fixedly connected with support rods 1204. One feeding platform 1203 is fitted and movably installed on the rotating rod 1202. During operation, the support frame 1 is used to install the mounting frame 7, the fixed bracket 702, the storage rack 12 and the soldering mechanism 14. When in use, the staff places the PCB board 9 on the feeding platform 1203. The operation of the rotator 1201 drives the rotating rod 1202 to rotate. Since the feeding platform 1203 is fitted and movably arranged on the rotating rod 1202, when the rotating rod 1202 rotates, one feeding platform 1203 moves up and down on the rotating rod 1202. Secondly, since the support rods 1204 are fixedly connected between the feeding platforms 1203, when one feeding platform 1203 moves up and down, the other feeding platform 1203 is lifted by the support rods 1204, thereby sending the PCB boards 9 stacked and stored on the feeding platform 1203 to below the loading plate 11. At this time, the vertical sliding table 1102 descends on the sliding table 1101 to facilitate the feeding jig 1103 to clamp the PCB board 9. After the feeding jig 1103 clamps the PCB board 9, the sliding table 1101 slides on the horizontal sliding rod 701, and then places the PCB board 9 on the encapsulation platen 8 below the fixed bracket 702 for the next encapsulation operation.

[0035] Working principle: The mounting bracket 1 is used to install and put into use the mounting frame 7, the fixing frame 702, the storage rack 12 and the soldering mechanism 14. During the use process, the staff needs to place the PCB board 9 on the feeding table 1203, and then start the rotator 1201, which drives the rotating rod 1202 to rotate. The rotation of the rotating rod 1202 will drive a feeding table 1203 to lift on the rod. At the same time, through the action of the support rod 1204, the other feeding table 1203 will rise accordingly. This process aims to convey the PCB boards 9 stacked on the feeding table 1203 to the lower part of the loading board 11. At this time, the vertical slide table 1102 will descend under the control of the slide table 1101 to facilitate the feeding fixture 1103 to clamp the PCB board 9. Once the feeding fixture 1103 successfully clamps the PCB board 9, the slide table 1101 will slide under the guidance of the horizontal slide rod 701 and finally place the PCB board 9 on the encapsulation table board 8 under the fixing frame 702 for subsequent encapsulation operations; The console 2 processes the operation instructions from the control keys 4 to realize the control of other devices. At the same time, the fixing frame 702 is used to firmly install the chip box 10, and the chip box 10 is used to store the chips 901 inside, which is convenient for the encapsulation chuck 603 to pick up when needed. During the use process, the display 3 will display the working state parameters of each device in real time. When the encapsulation table board 8 moves to the lower part of the fixing frame 702 along the conveyor belt 503, the telescopic baffle 13 will extend to block the encapsulation table board 8. At this time, the servo motor 501 stops working to ensure that the encapsulation table board 8 stays at the encapsulation position. After the chip 901 is successfully encapsulated on the PCB board 9, the telescopic baffle 13 descends, and the servo motor 501 restarts to drive the transmission shaft 504 to rotate. The rotation of the transmission shaft 504 drives the conveyor belt 503 to move in a cycle on the transmission wheel 502, thereby pushing the encapsulation table board 8 to move along the direction of the conveying table board 5 until it reaches the lower part of the fixing frame 702 again for the next round of encapsulation operation of the PCB board 9 and the chip 901; The position of the robotic arm 601 is adjusted by the operation of the rotating disk 6, and the robotic arm 601 is driven by the first driving member 602 to perform related operations, so that the encapsulation chuck 603 can pick up the chip 901 in the chip cassette 10. During the process of the encapsulation chuck 603 picking up the chip 901, the air pump 604 starts to pump air, resulting in a negative pressure inside the air duct 606. This negative pressure causes the first telescopic tube 608 to slide in the air suction clamping tube 607 towards the supply tube 605. When the first telescopic tube 608 slides into the supply tube 605, a certain amount of flux will enter the air suction clamping tube 607 through the one-way valve on the first telescopic tube 608. At the same time, the negative pressure generated by the air pump 604 not only drives the first telescopic tube 608 to slide but also forms a negative pressure at the opening of the air suction clamping tube 607, thereby adsorbing the chip 901 so that it can be successfully picked up by the air suction clamping tube 607 on the encapsulation chuck 603. When the chip 901 is encapsulated onto the PCB board 9, the air pump 604 stops operating. At this time, under the elastic action of the spring member 16, the first telescopic tube 608 returns to its initial position and at the same time extrudes the flux in the air suction clamping tube 607, so as to weld and encapsulate the chip 901 on the PCB board 9 for use; During the process of installing the chip 901 onto the PCB board 9 via the encapsulation chuck 603, first, the rotation of the rotating shaft 1401 needs to be adjusted to drive the second driving member 1402 to adjust the encapsulation welding orientation. The operation of the second driving member 1402 causes the adjusting arm 1403 to fit and move on it, thereby adjusting the position of the solder planting head 15 on the solder supply tube 1404 below the PCB board 9. Subsequently, the angle of the solder supply tube 1404 is adjusted by the adjusting rod on one side of the second driving member 1402 and it is driven to rise to ensure that the second telescopic tube 1504 on the solder planting head 15 can pass through the hole slots on the PCB board 9 that match the pins of the chip 901; Next, through the driving operation of the connecting shaft, the multiple sets of straightening clamping plates 1501 are opened so that the pins of the chip 901 can be successfully aligned and inserted into the straightening clamping plates 1501. The pins of the chip 901 enter the straightening clamping plates 1501 through the encapsulation chuck 603 and are inserted onto the solder planting table 1503 of the solder tube 1502. At this time, the second telescopic tube 1504 applies a downward pressure on the chip 901 through the encapsulation chuck 603, causing the solder tube 1502 to drive the second telescopic tube 1504 to withdraw from the hole slot on the PCB board 9. During this process, the straightening clamping plates 1501 are squeezed and closed by the PCB board 9 when pressing down and withdrawing from the hole slot, thereby squeezing and straightening the pins of the chip 901 and making them retract into the solder planting head 15. The solder planting head 15 is connected in a through manner with the feed solder tube 1404 to provide solder for the soldering and encapsulation process. The solder required for soldering and encapsulation is filled into the solder planting table 1503 and adheres to the pins with flux on the chip 901. Subsequently, the straightening clamping plates 1501 are reopened through the drive of the connecting shaft, releasing the pins that have adhered to the solder. At the same time, the feed solder tube 1404 descends on the second driving member 1402 to provide sufficient soldering space for the soldering pen 1405. At this time, the soldering pen 1405 starts to adjust its position and operate on the feed solder tube 1404, and solders along the pins of the chip 901. Finally, the pins on the chip 901 are firmly soldered to the PCB board 9 through the solder to complete the encapsulation operation.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A 3D chip packaging device, comprising a support frame, a PCB board, a chip and a soldering mechanism. A rotating disk is installed on one side of the support frame, and the chip is installed on the PCB board. It is characterized in that: Above the rotating disk, a robotic arm is fittingly and movably installed, and a first driving member for driving is provided between the robotic arms. On one side of the rotating disk, a packaging chuck is fixedly installed. On one side of the packaging chuck, an air pump is fixedly installed. Inside the packaging chuck, a cavity for containing flux is provided on one side. Inside the packaging chuck, an air passage is provided, and the air passage is connected to the air pump in an airtight manner. On the other side inside the packaging chuck, a supply pipe is fixedly installed, and the supply pipe is connected to the cavity in a through manner. On one side of the supply pipe, an air suction clamping pipe is provided, and the air suction clamping pipe is fixedly connected to the packaging chuck. Inside the air suction clamping pipe, a first telescopic pipe is fittingly and movably installed, and the first telescopic pipe is fittingly and movably connected to the supply pipe. A spring member is nested on the outer side of the first telescopic pipe; Above the soldering mechanism, a solder supply pipe is provided. Above the solder supply pipe, a solder planting head is fittingly installed, and the solder planting head is connected to the solder supply pipe in a through manner. On one side of the solder planting head, a second telescopic pipe is fittingly and movably installed. Above the second telescopic pipe, a connecting shaft is provided, and above the connecting shaft, a straightening clamping plate is fixedly connected. Inside the second telescopic pipe, a tin pipe is fittingly installed, and above the tin pipe, a solder planting table that fits with the pins on the chip is provided. Inside the solder planting head, spring members are installed at the front and back, and the spring members are fixedly connected to one side of the second telescopic pipe.

2. The chip 3D packaging device according to claim 1, characterized in that: On one side above the support frame, a control console is fixedly installed. Above the control console, a display for displaying the operating parameters of the device is provided on one side, and on the other side of the display, control keys for controlling the operation of the device are provided.

3. The chip 3D packaging device according to claim 1, characterized in that: Above the support frame, two conveying platforms are fixedly installed. On one side of one conveying platform, a servo motor is fixedly installed. On one side of the servo motor, a transmission shaft is connected in a driving manner, and the transmission shaft is fittingly and movably installed between the two conveying platforms.

4. The chip 3D packaging device according to claim 3, characterized in that: Inside both of the two conveying platforms, a plurality of driving wheels are fittingly installed, and a transmission belt is nested on the outer side of the driving wheels. The transmission belt is in fitting driving connection with the transmission shaft. Above the inside of the conveying platform, a packaging platform is provided, and the packaging platform is fittingly connected to the transmission belt.

5. The chip 3D packaging device according to claim 1, wherein: On one side of the support frame, an installation frame and a fixing frame are fixedly installed. On the installation frame, a horizontal sliding rod is fixedly installed. On the horizontal sliding rod, a sliding table is fittingly and movably installed. On one side of the sliding table, a vertical sliding table is fittingly and movably connected. On one side of the vertical sliding table, a loading plate is fixedly connected, and at the four corners of the loading plate, feeding jigs for clamping the PCB board are provided.

6. The chip 3D packaging device according to claim 5, characterized in that: Below the loading plate, a storage rack is provided, and the storage rack is fixedly installed on the support frame. The storage rack includes a rotator, and a rotating rod for rotating and lifting is fittingly installed in the middle of the rotator. Below the PCB board, two feeding platforms are provided, and support rods are fixedly connected at the four corners between the feeding platforms. One of the feeding platforms is fittingly and movably installed on the rotating rod.

7. The chip 3D packaging device according to claim 5, wherein: One side of the fixing frame (702) is fitted and installed with a chip box for holding chips. One side of the soldering mechanism is provided with a telescopic baffle, and the telescopic baffle is fixedly installed inside the support frame.

8. The chip 3D packaging device according to claim 7, wherein: A rotating shaft is fitted and movably installed above the soldering mechanism, and a second driving member is fixedly installed above the rotating shaft. An adjusting arm is fitted and movably installed in the middle of the second driving member, and a feeding tin tube is installed on one side of the adjusting arm. A soldering pen is fitted and movably installed on one side of the feeding tin tube.

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