Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board, a camera module, a conductive layer and a first device, the camera module and the first device are both arranged on the circuit board, a gap is formed between the camera module and the first device, and a patch piece is arranged in the gap; the conductive layer covers the surface of one side, deviating from the circuit board, of the camera module, and the conductive layer is electrically connected with the camera module; and the conductive layer also extends and covers the patch piece, and is grounded through the patch piece and the circuit board.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the development of shooting technology, the number of cameras on electronic devices such as mobile phones is increasing. For example, as Figure 1 shown, the mobile phone includes a front camera 101 and two rear cameras 102. Among them, the front camera 101 is usually arranged at the top of the mobile phone. The grounding and heat conduction of the front camera 101 are realized through the shielding cover 1031 on the main upper circuit board 103, that is, the front camera 101 is lapped to the shielding cover 1031 through the conductive cloth 104 and the heat sink. The shielding cover 1031 is located in the lower area of the main upper circuit board 103, and the shielding cover 1031 and the rear camera 102 are arranged at intervals. In this way, limited by the grounding and heat conduction requirements of the front camera 101, the front camera 101 and the rear camera 102 need to be spaced apart by a certain distance, and the front camera 101 needs to be arranged on the side close to the shielding cover 1031 of the rear camera 102.

[0003] As can be seen from the above, in the related art, in order to realize the grounding and heat conduction of the front camera 101, there are various limitations on the layout of the front camera 101 and the rear camera 102, the ID shape and appearance of the electronic device, the main upper circuit board structure, etc., making the layout of the internal structural components of the electronic device not flexible enough. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an electronic device, which can solve the problem that in the related art, the grounding scheme of the camera needs to lap the front camera to the shielding cover through the conductive cloth, resulting in insufficient flexibility in the layout of the internal structural components of the electronic device.

[0005] The embodiments of this application provide an electronic device, which includes: a circuit board, a camera module, a conductive layer, and a first device;

[0006] Both the camera module and the first device are arranged on the circuit board, and there is a gap between the camera module and the first device, and a patch component is arranged in the gap;

[0007] The conductive layer covers the surface of the camera module facing away from the circuit board, and the conductive layer is electrically connected to the camera module;

[0008] The conductive layer also extends and covers the patch component, and is grounded through the patch component and the circuit board.

[0009] In the embodiments of the present application, by arranging a patch component in the gap between the camera module and the first device on the circuit board, in this way, the conductive layer covering the camera module can extend from the camera module to the position where the patch component is located and achieve grounding by being attached to the patch component. It can utilize the patch component to increase the layout area of the conductive layer, and the structure of the patch component can be flexibly adjusted. Even for a narrow gap between the camera module and the first device on the circuit board, it can be suitable for arranging a patch component with a slender structure, or the components between the camera module and the first device on the circuit board can be modified to form a patch component. In this way, the camera module does not need to be arranged in the area of the circuit board close to the shielding cover, nor does it need to reserve space for arranging conductive cloth in the area between the camera module and the shielding cover on the circuit board, so that the camera can be arranged in any area of the circuit board, as long as there is a small space near the camera module for arranging a patch component with a slender structure or the structure near the camera module can be improved to form a patch component, which can make the layout of the internal structure components of the electronic device more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of the grounding and heat dissipation solution of the front camera in the related art;

[0011] Figure 2 is one of the schematic structural diagrams of the electronic device in some embodiments of the present application;

[0012] Figure 3 is a top view of the electronic device in some embodiments of the present application;

[0013] Figure 4 is a schematic structural diagram of the electronic device after removing the conductive layer in some embodiments of the present application;

[0014] Figure 5a is a schematic diagram of the relative position between the second camera and the second connector when the spacer plate is not provided;

[0015] Figure 5b is a schematic diagram of the relative position between the second camera and the second connector when the spacer plate is provided;

[0016] Figure 6a is along Figure 3 the cross-sectional view in the A-A direction in

[0017] Figure 6b is Figure 6a the partial enlarged view of the L area in

[0018] Figure 6c is along Figure 3 the cross-sectional view in the B-B direction in

[0019] Figure 6d isFigure 6c Partial enlarged view of the H region;

[0020] Figure 7a One of the schematic diagrams of the assembly process of the electronic device in some embodiments of the present application;

[0021] Figure 7b Another schematic diagram of the assembly process of the electronic device in some embodiments of the present application;

[0022] Figure 8a Front view of the first patch component in some embodiments of the present application;

[0023] Figure 8b is Figure 8a Front view of the first patch component shown;

[0024] Figure 9 Schematic diagram of the structure of the electronic device after removing the conductive layer in some embodiments of the present application;

[0025] Figure 10 Front view of the first patch component in some other embodiments of the present application;

[0026] Figure 11 Another schematic diagram of the structure of the electronic device in some embodiments of the present application;

[0027] Figure 12 Schematic diagram of the structure of the electronic device after removing the conductive layer and the camera module in some embodiments of the present application;

[0028] Figure 13a Front view of the second patch component in some other embodiments of the present application;

[0029] Figure 13b is Figure 13a Top view of the second patch component shown;

[0030] Figure 13c is Figure 13a Front view of the second patch component shown;

[0031] Figure 14 Schematic diagram of the structure of the electronic device after assembling the main board bracket in some embodiments of the present application;

[0032] Figure 15a is along Figure 14 Cross-sectional view in the C-C direction in;

[0033] Figure 15b is Figure 15a Enlarged view of the J region in;

[0034] Figure 16 is Figure 14 Schematic diagram of the structure of the electronic device shown after removing the main board bracket.

[0035] Description of the reference numerals:

[0036] Circuit board 1, copper exposed part 11, camera module K, first camera module 2, first camera 21, first connector 22, first side 23, second camera module 3, second camera 31, second connector 32, second side 33, FPC 34, conductive layer 4, patch component 5, first patch component 51, first receiving cavity 511, second patch component 52, first extension part 521, second extension part 522, second receiving cavity 523, first device P, third camera module 6, third camera 61, third connector 62, speaker 7, sound cavity 71, main board bracket 8, heat sink 9, shielding cover 10, sealing foam 20, spacer plate 30. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application belong to the scope of protection of the present application.

[0038] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data may be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object may be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0039] Next, the electronic device provided by the embodiments of the present application will be described in detail with reference to the accompanying drawings, through specific embodiments and their application scenarios.

[0040] Refer to Figure 2 、 Figure 3 and Figure 4 The electronic device provided by the embodiments of the present application includes: a circuit board 1, a camera module K, a conductive layer 4, and a first device P;

[0041] Both the camera module K and the first device P are disposed on the circuit board 1, and there is a gap between the camera module K and the first device P, and a patch component 5 is disposed in the gap;

[0042] The conductive layer 4 covers the surface of the camera module K facing away from the circuit board 1, and the conductive layer 4 is electrically connected to the camera module K;

[0043] The conductive layer 4 also extends and covers the patch member 5, and is grounded through the patch member 5 and the circuit board 1.

[0044] In some embodiments, the electronic device in the embodiments of the present application may be a terminal or other devices other than terminals. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a handheld computer, a vehicle-mounted electronic device, a Mobile Internet Device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a server, a Network Attached Storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations.

[0045] In some embodiments, the camera module K may include one or at least two camera modules. Among them, when the camera module K includes 1 camera module, the patch member 5 may be disposed on the periphery of the 1 camera module, and the conductive layer 4 attached to the bottom of the 1 camera module may be extended to the patch member 5 to be grounded through the patch member 5 and the circuit board 1. In this way, the area of the conductive layer 4 corresponding to the 1 camera module can be increased, and the function of grounding the 1 camera module can be realized.

[0046] For the convenience of description, in the embodiments of the present application, the first camera module 2 and the second camera module 3 in which the camera modules K can be adjacently disposed are taken as examples for illustration. At this time, the conductive layer 4 covers the surfaces of the first camera module 2 and the second camera module 3 facing away from the circuit board 1 at the same time, and the area of the conductive layer 4 corresponding to the first camera module 2 and the second camera module 3 is increased by providing the first patch member 51 on the periphery of the first camera module 2 and / or the second patch member 52 on the periphery of the second camera module 3, so as to realize the function of grounding the first camera module 2 and the second camera module 3.

[0047] Of course, the camera module K can also include at least 3 camera modules. At this time, the layout of the at least 3 camera modules on the circuit board can be adjusted so that the conductive layer 4 can simultaneously cover the surface of the side of at least 3 camera modules facing away from the circuit board 1, and grounding can be achieved through the patch part 5 on the side of at least one of the at least 3 camera modules.

[0048] In some embodiments, the conductive layer 4 may include conductive fabric, and the conductive fabric is attached to the surface of the camera module K facing away from the circuit board 1 via conductive adhesive. Of course, in other embodiments, the conductive layer 4 may also be conductive double-sided tape, etc., and the structure and type of the conductive layer 4 are not specifically limited herein.

[0049] In some embodiments, the first device P can be any device on the circuit board located near the camera module K, such as a speaker or other camera modules not included in the camera module K.

[0050] In some embodiments, the conductive layer 4 is grounded through the patch component 5 and the circuit board 1, and the patch component 5 can be electrically connected to any grounding structure such as a grounding terminal or grounding exposed copper on the circuit board 1. In this way, when the conductive layer 4 is attached to the patch component 5, it can be equivalently grounded through the patch component 5.

[0051] In other embodiments, the conductive layer 4 is grounded through the patch component 5 and the circuit board 1. The conductive layer 4 can be electrically connected to any grounding structure such as a grounding terminal or grounding exposed copper located on the side of the patch component 5 away from the camera module K on the circuit board 1 after passing over the patch component 5.

[0052] In some embodiments, as Figure 2 、 Figure 3 and Figure 4 As shown, the camera module K includes a first camera module 2 and a second camera module 3;

[0053] The first camera module 2 includes a first camera 21 and a first connector 22, and the first connector 22 is electrically connected to the first camera 21;

[0054] The second camera module 3 includes a second camera 31 and a second connector 32, and the second connector 32 is electrically connected to the second camera 31;

[0055] The first connector 22 and the second connector 32 are arranged opposite to each other along the width direction of the first connector 22 and the second connector 32, and the length extension direction of the first connector 22 is parallel to the length extension direction of the second connector 32. The first camera 21 and the second camera 31 are distributed on opposite sides of the area where the first connector 22 and the second connector 32 are located;

[0056] The conductive layer 4 covers at least the surfaces of the first camera 21, the first connector 22, and the second connector 32 facing away from the circuit board 1.

[0057] The patch component 5 includes a first patch component 51 located in the gap between the second connector 32 and the first device P, and / or the patch component 5 includes a second patch component 52 located in the gap between the first camera 21 and the first device P.

[0058] In some embodiments, as Figure 2 shown, the first device P includes a third camera module 6 and / or a speaker 7. For example: in the case where the patch component 5 includes a first patch component 51 located in the gap between the second connector 32 and the first device P, the first device P includes a third camera module 6; in the case where the patch component 5 includes a second patch component 52 located in the gap between the first camera 21 and the first device P, the first device P includes a speaker 7.

[0059] In the embodiments of the present application, generally, the case where the first device P includes a third camera module 6 and a speaker 7, and the patch component 5 includes a first patch component 51 and a second patch component 52 is taken as an example for illustration. Of course, in some other embodiments, the patch component 5 may only include the first patch component 51 and not include the second patch component 52. At this time, the first device P only includes the third camera module 6 and does not include the speaker 7; or, in some other embodiments, the patch component 5 may only include the second patch component 52 and not include the first patch component 51. At this time, the first device P only includes the speaker 7 and does not include the third camera module 6.

[0060] In addition, the type, structure, and position of the first device P can be flexibly adjusted. In addition to the above-mentioned third camera module 6 and speaker 7, it may also include other devices on the circuit board near the camera module K, such as coils, processors, screw pads, etc. The type, structure, and position of the first device P are not specifically limited herein.

[0061] In some embodiments, the length extension direction of the first connector 22 is parallel to the length extension direction of the second connector 32. It may be that the first connector 22 and the second connector 32 are distributed along the length direction of the first connector 22, that is, arranged vertically along the Y-axis direction as in Figure 3 ; in addition, the width direction of the first connector 22 and the second connector 32 is along the X-axis direction in Figure 3 .

[0062] In some embodiments, the first camera 21 is located on the side of the first connector 22 facing away from the second camera 31, and the second camera 31 is located on the side of the second connector 32 facing away from the first camera 21, as in Figure 3As shown, the long sides of the first connector 22 and the second connector 32 can be on the same straight line, with the first camera 21 disposed on the left side of this straight line and the second camera 31 disposed on the right side of this straight line.

[0063] It should be noted that the conductive layer 4 covers and is electrically connected to the first camera 21, the first connector 22, and the second connector 32, facilitating the extension of the conductive layer 4 from the area where the first connector 22 is located to the area where the second connector 32 is located. At this time, the electrical signals on the first imaging module 2 can be grounded through the second connector 32. In this way, on the one hand, the area of the conductive layer 4 can be increased so that the area of the conductive layer 4 can meet the grounding requirements of the first imaging module 2 and the second imaging module 3, and a grounding path can also be added to the first imaging module 2 by using the conductive layer 4 and the second connector 32, and a grounding path can be added to the second imaging module 3 by using the conductive layer 4 and the first connector 22.

[0064] In addition, a first patch component 51 is disposed in the gap between the second connector 32 and the first device P, and / or a second patch component 52 is disposed in the gap between the first camera 21 and the first device P, which can add a grounding path to the imaging module K by the first patch component 51 and / or the second patch component 52, thereby further enhancing the grounding performance of the imaging module K.

[0065] In some embodiments, the first imaging module 2 can be a front camera module, and the second imaging module 3 can be a rear camera module. By relatively disposing the first connector 22 and the second connector 32 along the width direction of the first connector 22 and the second connector 32, at this time, the length extension direction of the first connector 22 is parallel to the length extension direction of the second connector 32, and the first camera 21 and the second camera 31 are distributed on opposite sides of the area where the first connector 22 and the second connector 32 are located, the front camera module can be disposed in the middle of the top of the circuit board 1, that is, the front camera module is located at the top center on the display screen side of the electronic device, and the rear camera module can be located in the upper left corner or the upper right corner area of the back cover of the electronic device.

[0066] At this time, the light-gathering surfaces of the first camera 21 and the second camera 31 face away from each other, and the light-gathering surface of the second camera 31 and the patch component 5 are on the same side of the circuit board 1, and the light-gathering surface of the first camera 21 and the patch component 5 are on the opposite side of the circuit board 1. In this way, the conductive layer 4 attached to the backlight surface of the first camera 21 can extend to the patch component 5.

[0067] Of course, in some other embodiments, the second imaging module 3 can also be a front camera, such as an electronic device with dual front cameras. At this time, the bottom surfaces of the second imaging module 3 and the first imaging module 2 face the same side. Therefore, the conductive layer 4 can also be covered on the surface of the second camera 31 facing away from the circuit board 1.

[0068] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 shown in the embodiments, the second patch component 52 may be disposed at a position on the first side 23 of the circuit board 1 adjacent to the first camera 21. At this time, the long side of the second patch component 52 extends in the same direction as the first side 23.

[0069] In other embodiments, the patch component 5 may be disposed at a position on the second side 33 of the circuit board 1 adjacent to the second connector 32. At this time, the long side of the patch component 5 extends in the same direction as the second side 33.

[0070] In still other embodiments, such as Figures 11 to 16 shown in the embodiments, two patch components 5 may be provided, namely a first patch component 51 and a second patch component 52. Among them, the first patch component 51 is disposed at a position on the first side 23 of the circuit board 1 adjacent to the first camera 21, and the second patch component 52 is disposed at a position on the second side 33 of the circuit board 1 adjacent to the second connector 32. At this time, the long side of the first patch component 51 extends in the same direction as the first side 23, and the long side of the second patch component 52 extends in the same direction as the second side 33.

[0071] It is worth noting that the long side of the patch component 5 extends in the same direction as the side of the camera module adjacent to it. At this time, the patch component 5 may be in a strip-shaped structure, and this strip-shaped structure can be conveniently embedded into the small gap between the camera module and the first device P, or can facilitate the improvement of the narrow structure on the circuit board 1 to form a strip-shaped patch component 5.

[0072] In some embodiments, at least one of the connectors of the camera module in the embodiments of the present application, such as the first connector 22, the second connector 32, and the third connector 62, may be a board-to-board (BTB) connector of the camera module. Of course, in addition to the BTB connector, the connectors of the camera module in the embodiments of the present application may also be any other connectors that can implement the electrical signal transmission function of the camera.

[0073] For the convenience of description in the embodiments of the present application, it is usually exemplified by taking the connector in the camera module as a BTB connector. This does not constitute a specific limitation.

[0074] In some embodiments, the patch component 5 may be a metal structure, and the patch component 5 is grounded. For example: a grounding copper pad is provided on the circuit board 1, and the patch component 5 is in contact with the grounding copper pad, so as to realize the grounding of the patch component 5. Of course, in addition to the method of providing a grounding copper pad on the circuit board, the patch component 5 may also be grounded in any other way, which is not specifically limited herein.

[0075] In this embodiment, two adjacent camera modules are provided, and the connectors of the two camera modules are arranged opposite to each other in the width direction. In this way, a first patch element 51 in an elongated structure can be arranged in the gap between the long side position of the second connector 32 and the first device P, and a second patch element 52 in an elongated structure can be arranged in the gap between the side position of the first camera 21 and the first device P. In this way, on the one hand, by arranging the second connector 32 opposite to the first connector 22 in the width direction, the conductive layer 4 attached to the first camera 21 can extend to the second connector 32 through the first connector 22, thereby increasing the area of the conductive layer 4 and improving the grounding performance of the camera module K achieved through the conductive layer 4; on the other hand, the length extension direction of the first connector 22 is parallel to the length extension direction of the second connector 32, and the first camera 21 and the second camera 31 are distributed on opposite sides of the area where the first connector 22 and the second connector 32 are located. The first patch element 51 can be arranged at the long side position of the second connector 32, so that the first patch element 51 can be as long as the second connector 32. Thus, on the basis of the limited gap width between the second connector 32 and the first device P, the layout area of the conductive layer 4 is increased by lengthening the length of the first patch element 51, and the grounding performance of the conductive layer 4 achieved through the first patch element 51 is improved. Finally, the grounding performance of the camera module K meets the requirements.

[0076] As an alternative embodiment, as Figure 2 shown, the first device P includes a third camera module 6;

[0077] The third camera module 6 is arranged on the side of the second connector 32 away from the second camera 31, and the first patch element 51 is arranged in the gap between the second connector 32 and the third camera module 6.

[0078] In some embodiments, as Figure 2 shown, the third camera module 6 includes a third camera 61 and a third connector 62. The third camera 61 is electrically connected to the third connector 62, and the third connector 62 is arranged on the side of the third camera 61 away from the first camera 21. Of course, in some other embodiments, the third connector 62 can also be arranged on the side of the third camera 61 facing the first camera 21. For the convenience of description, in the embodiments of the present application, the case where the third connector 62 is arranged on the side of the third camera 61 away from the first camera 21 is taken as an example for illustration. Here, the specific structure of the third camera module 6 and its layout orientation on the circuit board 1 are not specifically limited.

[0079] In this embodiment, the first patch member 51 can be disposed in the gap between the second connector 32 and the third camera module 6, so that the electrical signals on the first camera module 2 and the second connector 32 can pass through the conductive layer 4 and the first patch member 51. The narrow gap between the second connector 32 and the third camera module 6 can be utilized to dispose the strip-shaped first patch member 51. By making the length direction of the first patch member 51 parallel to the length direction of the second connector 32, the length of the first patch member 51 can be increased, thereby increasing the layout area of the conductive layer 4 added by the first patch member 51.

[0080] In some embodiments, such as Figure 4 , Figure 5a , Figure 5b , Figure 6a and Figure 6b shown, the electronic device further includes: a spacer plate 30;

[0081] The spacer plate 30 is disposed between the circuit board 1 and the second connector 32.

[0082] It is worth noting that the second camera 31 and the second connector 32 are usually electrically connected through a flexible printed circuit (FPC) 34. The length of the FPC 34 is fixed, and one end of the FPC 34 is disposed on the backlight surface of the second camera 31, and the other end of the FPC 34 is electrically connected to the second connector 32.

[0083] In this embodiment, by raising the distance between the second connector 32 and the circuit board 1 through the spacer plate 30, the distance between the backlight surface of the second camera 31 and the second connector 32 in the direction perpendicular to the circuit board 1 can be increased, that is, Figure 5b the distance H2 between the backlight surface of the second camera 31 and the second connector 32 in the direction perpendicular to the circuit board 1 after adding the spacer plate 30 in Figure 5a is greater than the distance H1 between the backlight surface of the second camera 31 and the second connector 32 in the direction perpendicular to the circuit board 1 when the spacer plate 30 is not provided in Figure 5b Based on the fixed length of the FPC 34, the distance between the second camera 31 and the second connector 32 in the direction parallel to the circuit board 1 can be shortened, that is, Figure 5aWhen the heightening plate 30 is not provided in the [device], the distance L1 between the second camera 31 and the second connector 32 in a direction parallel to the circuit board 1. That is, by adding the heightening plate 30, the second connector 32 can be moved closer to the second camera 31, that is, away from the third camera module 6 by a certain distance, so as to increase the clearance width between the second connector 32 and the third camera module 6 for arranging the first patch element 51, and the dimension of the first patch element 51 in the direction of the clearance width can be increased, thereby improving the layout space for pasting the conductive layer 4 on the first patch element 51.

[0084] In some embodiments, as Figure 6c and Figure 6d shown, the heightening plate 30 can be only used to raise the second connector 32. At this time, the surface of the first connector 22 facing away from the circuit board 1 is closer to the circuit board 1 than the surface of the second connector 32 facing away from the circuit board 1. At this time, after the conductive layer 4 is pasted on the first connector 22, when passing through the transition area between the first connector 22 and the second connector 32, it can have a certain slope to climb and paste on the surface of the second connector 32 facing away from the circuit board 1.

[0085] In some embodiments, the first side surface 5A of the first patch element 51 is flush with the surface of the second connector 32 facing away from the circuit board 1.

[0086] In this embodiment, on the one hand, making the first side surface 5A of the first patch element 51 and the second connector 32 flush with the surface facing away from the circuit board 1 can make the conductive layer 4 pasted on the second connector 32 and the first side surface 5A of the first patch element 51 flatter.

[0087] In some embodiments, as Figure 6b 、 Figure 8a 、 Figure 8b or Figure 9 、 Figure 10 shown, the first patch element 51 includes: a first top plate 5A1 and a first side plate 5B1;

[0088] The first top plate 5A1 is spaced from the circuit board 1;

[0089] One side of the first side plate 5B1 is connected to the first top plate 5A1, and the other side is connected to the circuit board 1. A first receiving cavity 511 is formed between the first top plate 5A1 and the first side plate 5B1, and the opening of the first receiving cavity 511 faces the circuit board 1;

[0090] The conductive layer 4 covers the first top plate 5A1 and / or the first side plate 5B1.

[0091] It should be noted that the conductive layer 4 covers the first top plate 5A1 and / or the first side plate 5B1. It can be that the conductive layer 4 covers the outer surfaces of the first top plate 5A1 and the first side plate 5B1 facing away from the first receiving cavity 511, or the conductive layer 4 covers the outer surface of the first top plate 5A1 facing away from the first receiving cavity 511, or the conductive layer 4 covers the outer surface of the first side plate 5B1 facing away from the first receiving cavity 511.

[0092] In some embodiments, the cross-section of the first patch member 51 can be in a U-shaped structure or an L-shaped structure, so that the first patch member 51 has two adjacent panels for attaching the conductive layer 4.

[0093] For example: as Figure 8a and Figure 8b shown, the first patch member 51 is in a groove-like structure, the first patch member 51 has a hollow receiving groove, and the receiving groove covers the circuit board 1. At this time, the first top plate 5A1 is the top surface of the first patch member 51 facing away from the circuit board 1, and the first side plate 5B1 can be the side plate of the first patch member 51 facing away from the second connector 32.

[0094] For another example: as Figure 9 and Figure 10 shown first patch member 51, which, on the basis of the first patch member 51 shown in Figure 8a and Figure 8b shown first patch member 51, omits the side plate of the first patch member 51 on the side facing the second connector 32, and adds side plates at opposite ends along the length direction of the first patch member 51.

[0095] In this embodiment, the first patch member 51 can be set as an elongated strip structure, the area of the first top plate 5A1 of the first patch member 51 facing away from the circuit board 1 is small. On the basis of using the first top plate 5A1 of the first patch member 51 facing away from the circuit board 1 to attach the conductive layer 4, the first side plate 5B1 of the first patch member 51 facing away from the second connector 32 is also used to attach the conductive layer 4, which can increase the layout area of the conductive layer 4, so that the area of the conductive layer 4 can meet the grounding requirements of the first imaging module 2 and the second imaging module 3.

[0096] In some embodiments, the first top plate 5A1 is flush with the surface of the second connector 43 on the side facing away from the circuit board 1. Since the second connector 32 is lifted away from the circuit board 1 by a certain distance through the spacer plate 30, by making the surfaces of the first patch member 51 and the second connector 32 facing away from the circuit board 1 flush, the distance between the first top plate 5A1 of the first patch member 51 and the circuit board 1 can also be increased, that is, the size of the first side plate 5B1 is increased. Finally, the layout area for attaching the conductive layer 4 on the first patch member 51 can be improved.

[0097] It is worth noting that in some embodiments, when the area of the first top plate 5A1 of the first patch member 51 is limited, the distance between the first top plate 5A1 of the first patch member 51 and the circuit board 1 can be increased to increase the area of the first side plate 5B1 of the first patch member 51. Eventually, the first patch member 51 can ensure that the area of the conductive layer 4 is sufficient to meet the grounding requirements of the camera module.

[0098] For example, when the gap between the second connector 32 and the third camera module 6 is narrow, the distance between the first top plate 5A1 and the circuit board 1 can be greater than the distance between the surface of the second connector 32 facing away from the circuit board 1 and the circuit board 1.

[0099] In some embodiments, electronic devices are provided in the area of the circuit board 1 corresponding to the first receiving cavity 511.

[0100] In this embodiment, the first patch member 51 can be used as a shielding cover, and electronic devices are provided in the area of the circuit board 1 covered by the first patch member 51, improving the utilization rate of the layout area of the circuit board 1.

[0101] It should be noted that as Figure 9 and Figure 10 shown in the first patch member 51, compared with the patch members shown in Figure 8a and Figure 8b , since the side wall of the first patch member 51 facing the second connector 32 is omitted, the volume of the first receiving cavity 511 is larger, so that more devices can be accommodated.

[0102] In some embodiments, as Figure 7a shown, during the assembly process of the electronic device, after the devices on the circuit board 1 are pasted, the conductive layer 4 is first pasted on the surfaces of the first camera 21, the first connector 22, and the second connector 32 facing away from the circuit board 1 and the first top plate 5A1. At this time, the conductive layer 4 also extends beyond the side of the first top plate 5A1 facing away from the second connector 32; then, as Figure 7b shown, the part of the conductive layer 4 extending beyond the first top plate 5A1 is bent so that it adheres to the first side plate 5B1.

[0103] As an alternative embodiment, as Figure 11 and Figure 12 shown, the first device P includes: a speaker 7;

[0104] The speaker 7 is provided on the side of the first camera 21 facing away from the first connector 22;

[0105] The second patch member 52 is disposed in the gap between the speaker 7 and the first camera 21.

[0106] In this embodiment, a second patch member 52 can be disposed in the gap between the speaker 7 and the first camera 21, so that the electrical signal on the first camera 21 can pass through the conductive layer 4 and the second patch member 52 to the ground.

[0107] In some embodiments, the circuit board 1, the second patch member 52, and the main board bracket 8 enclose to form a sound cavity 71. The speaker 7 is received in the sound cavity 71, and the sound cavity 71 is disposed adjacent to the first camera module 2; the second patch member 52 is disposed on the edge of the sound cavity 71 facing the first camera module 2.

[0108] It should be noted that in the related art, a ring-shaped thick wall on the main board bracket 8 is required to cover the circuit board to form a sound cavity for the speaker. In this embodiment, a part of the ring-shaped thick wall on the main board bracket 8 is replaced with a thin wall, and a second patch member 52 is disposed at a position corresponding to the thin wall on the circuit board 1. In this way, the conductive layer 4 can be attached to at least one side of the second patch member 52, and finally the main board bracket 8 is covered on the circuit board 1 to form the sound cavity 71. At this time, the conductive layer 4 can pass through between the second patch member 52 and the main board bracket 8 from the side of the sound cavity 71 facing the first camera module 2 and extend into the sound cavity 71.

[0109] In this way, when there is no space to set an independent patch member between the first camera module 2 and the side wall of the sound cavity 71, the ring-shaped thick wall on the main board bracket 8 can be modified to implement the second patch member 52, and the second patch member 52 is used to increase the layout area of the conductive layer 4, so that the layout area of the conductive layer can meet the grounding requirements of the first camera module 2 or even the second camera module 3.

[0110] In some embodiments, as Figure 12 shown, the second patch member 52 includes:

[0111] A second top plate 5A2, a second side plate 5B2, and a third side plate 5B3;

[0112] The second top plate 5A2 is spaced apart from the circuit board 1;

[0113] The second side plate 5B2 is disposed on the side of the second top plate 5A2 facing away from the speaker 7 and is connected between the second top plate 5A2 and the circuit board 1;

[0114] The third side plate 5B3 is disposed on the side of the second top plate 5A2 facing the speaker 7, and there is a gap between the side of the third side plate 5B3 facing away from the second top plate 5A2 and the circuit board 1. There is a second receiving cavity 523 between the second top plate 5A2, the second side plate 5B2, and the third side plate 5B3;

[0115] The conductive layer 4 covers the second top plate 5A2 and the third side plate 5B3.

[0116] In one embodiment, as Figure 12 shown, the second receiving cavity 523 communicates with the sound cavity 71.

[0117] In this embodiment, the conductive layer 4 can be attached to the second top plate 5A2 of the second patch member 52 facing away from the circuit board 1 and the third side plate 5B3 of the second patch member 52 facing away from the first camera 21, which can increase the area for laying out the conductive layer 4 on the second patch member 52, thereby improving the grounding performance of the camera module K through the conductive layer 4 and the second patch member 52.

[0118] In some embodiments, the second receiving cavity 523 communicates with the sound cavity 71, and the second receiving cavity 523 of the second patch member 52 can be used to increase the volume of the sound cavity 71, thereby improving the sound effect of the speaker 7.

[0119] In some embodiments, as Figure 13a , Figure 13b and Figure 13c shown, the second patch member 52 includes a first extension portion 521 and a second extension portion 522;

[0120] The first extension portion 521 is perpendicular to the second extension portion 522;

[0121] Wherein, the first extension portion 521 is disposed on the periphery of the first camera 21 and is located between the first device P and the first camera 21, and the conductive layer 4 extends from the first camera 21 and covers the first extension portion 521.

[0122] In some embodiments, the first extension portion 521 and the second extension portion 522 are in an L-shaped structure and are disposed on two adjacent sides along the periphery of the sound cavity 71. At this time, the first extension portion 521 abuts against the first side 23 of the first camera 21, and the second extension portion 522 extends in a direction perpendicular to the first side 23.

[0123] In this embodiment, setting the second patch member 52 to include the first extension portion 521 and the second extension portion 522 that extend perpendicular to each other can improve the structural reliability of the second patch member 52.

[0124] In some embodiments, as Figure 14 , Figure 15a and Figure 15b shown, a copper exposed portion 11 is provided on the circuit board 1, and the copper exposed portion 11 is located on the side of the first extension portion 521 facing away from the first camera 21, and the conductive layer 4 also extends from the first extension portion 521 to be electrically connected to the copper exposed portion 11.

[0125] Wherein, the copper exposed portion 11 can be realized by a grounding copper exposed outside the surface of the circuit board 1.

[0126] In some embodiments, after the conductive layer 4 is attached to the second top plate 5A2 and the third side plate 5B3, it further extends beyond the conductive layer 4, that is, to the side of the third side plate 5B3 facing away from the first camera 21, and is in electrical contact with the copper exposed portion 11.

[0127] In this embodiment, the second patch member 52 and the copper exposed portion 11 can be used together to ground the first camera module 2 and the second camera module 3, which can improve the grounding performance of the first camera module 2 and the second camera module 3.

[0128] In some embodiments, as Figure 16 shown, after the conductive layer 4 is attached to the second patch member 52, a sealing foam 20 can be arranged in a circle along the sealing bone position of the sound cavity 71, and the main board bracket 8 is pressed on the sealing foam 20 to improve the sealing performance of the sound cavity 71.

[0129] In some embodiments, as Figure 2 , Figure 6b , Figure 6d , Figure 11 or Figure 16 shown, a heat sink 9 is covered on the side of the conductive layer facing away from the camera module K.

[0130] Among them, the heat sink 9 is used to absorb the heat of the camera module K and dissipate the heat.

[0131] As Figure 16 shown, the conductive layer 4 covers the first camera 21, the first connector 22, the second connector 32, the first patch member 51 and the second patch member 52. In this way, when the heat sink 9 is attached to the surface of the conductive layer 4 on the side facing away from the first camera module 2, the area of the heat sink 9 can be increased, and the heat dissipation effect of the heat sink 9 on the first camera module 2 and the second camera module 3 can be improved; or, when the second camera module 3 generates heat, the heat can be conducted to the area where the first camera module 2 is located and dissipated in a large area.

[0132] In some embodiments, the heat sink 9 can be a heat dissipation film (Panasonic Graphite Sheet, PGS).

[0133] In some embodiments, the area of the heat sink 9 and the conductive layer 4 can be equal.

[0134] In other embodiments, the area of the heat sink 9 can be smaller than the area of the conductive layer 4. For example: as Figure 16 shown, the conductive layer 4 covers the first camera 21, the first connector 22, the second connector 32, the first patch member 51 and the second patch member 52, and the heat sink 9 is only arranged on the surface of the conductive layer 4 facing away from the first camera 21, the first connector 22 and the second connector 32.

[0135] In this embodiment, the heat sink 9 can be attached to the side of the conductive layer 4 facing away from the camera module K, and the heat sink 9 can be used to achieve the heat dissipation function of the camera module K, without using the shielding cover 10 on the circuit board 1 to meet the heat dissipation requirements of the camera module K. In this way, the camera module K does not need to be arranged in the area of the circuit board 1 close to the shielding cover 10, nor does it need to reserve space for arranging the heat sink and conductive cloth in the area of the circuit board 1 between the camera module K and the shielding cover 10, so that the camera module K can be arranged in any area of the circuit board 1, making the layout of the internal structural components of the electronic device more flexible.

[0136] It is worth noting that in the embodiments of the present application, the conductive layer 4 and the patch component 5 can be used to ground the camera module K. According to the actual application situation, the camera module K can be arranged in the area of the circuit board 1 far from the shielding cover.

[0137] For example: as Figure 16 shown, when the first camera module 2 is a front camera module, which is at the top edge of the circuit board 1, and the areas of the circuit board 1 to the left, right, and below the front camera module can be used for closely deploying other components, such as the second camera module 3, the third camera module 6, and the sealing area of the sound cavity 71, etc. In this layout scenario, there is no area around the first camera module 2 for deploying the shielding cover 10. In the embodiments of the present application, the second connector 32 can be lifted to create a layout space for the first patch component 51 between the second connector 32 and the third camera 61. In this way, the front camera module can be grounded along the first path through the conductive layer 4, and the first path sequentially passes through the first camera 21, the first connector 22, the second connector 32, and the first patch component 51.

[0138] In addition, the motherboard bracket 8 located along the periphery of the sound cavity 71 facing the third camera 61 is also modified to create a layout space for the second patch component 52 along the periphery of the sound cavity 71. In this way, the front camera module can be grounded along the second path and the third path through the conductive layer 4. The second path sequentially passes through the first camera 21 and the second patch component 52, and the third path sequentially passes through the first camera 21, the second patch component 52, and the copper exposed part 11. In this way, by attaching the conductive layer 4 to the first camera 21, the first connector 22, the second connector 32, the first patch component 51, and the second patch component 52, at least three grounding paths can be used to jointly ground the first camera module 2 through the first patch component 51 and the second patch component 52, without using the shielding cover 10 on the circuit board 1 to meet the grounding requirements of the first camera module 2.

[0139] In addition, in some embodiments, the heat sink 9 is also attached to the side of the conductive layer 4 facing away from the first imaging module 2. The heat sink 9 can be used to dissipate heat from the first imaging module 2, and there is no need to use the shielding cover 10 on the circuit board 1 to meet the heat dissipation requirements of the first imaging module 2. In this way, the first imaging module 2 does not need to be arranged in the area of the circuit board 1 close to the shielding cover 10, nor is it necessary to reserve space for arranging the heat sink and conductive cloth in the area of the circuit board 1 between the first imaging module 2 and the shielding cover 10. Therefore, the first imaging module 2 can be arranged in any area of the circuit board 1, as long as there is a small space near the imaging module for laying out the slender structure patch components or the structure near the imaging module can be improved to form patch components, which can make the layout of the internal structure components of the electronic device more flexible.

[0140] In the electronic device provided by the embodiment of the present application, on the premise of meeting the grounding and heat dissipation design of the imaging module K, the imaging module K can still be closely arranged with the surrounding devices, which can improve the utilization rate of the circuit board in the electronic device and make the layout of the devices in the electronic device more flexible.

[0141] It should be noted that in this article, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0142] The embodiments of the present application have been described above with reference to the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the spirit and scope protected by the claims of the present application, and all of them fall within the protection scope of the present application.

Claims

1. An electronic device, characterized in that, Comprising: A circuit board, a camera module, a conductive layer, and a first device; Both the camera module and the first device are disposed on the circuit board, and there is a gap between the camera module and the first device, and a patch component is disposed in the gap; The conductive layer covers a surface of the camera module facing away from the circuit board, and the conductive layer is electrically connected to the camera module; The conductive layer further extends and covers the patch component, and is grounded through the patch component and the circuit board.

2. The electronic device according to claim 1, characterized in that, The camera module includes a first camera module and a second camera module; The first camera module includes a first camera and a first connector, and the first connector is electrically connected to the first camera; The second camera module includes a second camera and a second connector, and the second connector is electrically connected to the second camera; The first connector and the second connector are disposed opposite to each other along the width direction of the first connector and the second connector, and the length extension direction of the first connector is parallel to the length extension direction of the second connector, and the first camera and the second camera are distributed on opposite sides of the area where the first connector and the second connector are located; The conductive layer covers at least a surface of the first camera, the first connector, and the second connector facing away from the circuit board; The patch component includes a first patch component located in the gap between the second connector and the first device, and / or, the patch component includes a second patch component located in the gap between the first camera and the first device.

3. The electronic device according to claim 2, characterized in that, The first device includes: a third camera module; The third camera module is disposed on a side of the second connector facing away from the second camera, and the first patch component is disposed between the gap of the third camera module and the second connector.

4. The electronic device according to claim 2, characterized in that, The electronic device further includes: a spacer plate; The spacer plate is disposed between the circuit board and the second connector.

5. The electronic device according to claim 4, characterized in that, A surface of the first patch component facing away from the circuit board is flush with a surface of the second connector facing away from the circuit board.

6. The electronic device according to claim 2, wherein The first patch component includes: a first top plate and a first side plate; The first top plate is spaced apart from the circuit board; One side of the first side plate is connected to the first top plate, and the other side is connected to the circuit board. A first receiving cavity is formed between the first top plate and the first side plate, and an opening of the first receiving cavity faces the circuit board; The conductive layer covers the first top plate, and / or, the first side plate.

7. The electronic device according to claim 2, wherein The first device further includes: a speaker; The speaker is disposed on a side of the first camera facing away from the first connector; The second patch component is disposed between the gap of the first camera and the speaker.

8. The electronic device according to claim 2, characterized in that, The second patch component includes a first extension portion and a second extension portion; The first extension portion is perpendicular to the second extension portion; Wherein, the first extension portion is disposed on a periphery of the first camera, and the conductive layer extends from the first camera and covers the first extension portion.

9. The electronic device according to claim 8, wherein The circuit board is provided with an exposed copper part, the exposed copper part is located on the side of the first extension part facing away from the first camera, and the conductive layer further extends from the first extension part to be electrically connected to the exposed copper part.

10. The electronic device according to any one of claims 1 to 9, characterized in that, A heat sink is covered on the side of the conductive layer facing away from the camera module.

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