Camera module

Abstract

The invention discloses a camera module. The camera module comprises a photosensitive chip; the lens assembly is movably kept on the photosensitive path of the photosensitive chip; the driving assembly is suitable for driving the lens assembly to move relative to the photosensitive chip; the driving assembly comprises an electric driving part, a magnetic coupling part and a first molding part, and the first molding part is integrally combined with magnet yokes in the electric driving part and the magnetic coupling part; wherein the electric driving part comprises a circuit board, a first coil and a conductive carrier, the conductive carrier is used for electrically connecting the circuit board and the first coil, the photosensitive chip is conductively connected with the circuit board, the magnet yoke is arranged on the upper surface of the circuit board, and at least part of the lower surface of the first coil is in contact with the upper surface of the magnet yoke. The overall thickness of the camera module is reduced, and the integration degree of the camera module is improved.

Description

Technical Field

[0001] This application relates to the technical field of camera modules, and particularly to a camera module. Background Art

[0002] With the wide application of camera modules in various electronic devices, the demand for their miniaturization has become increasingly significant. Especially in mobile terminal devices, the size of the camera module has an important impact on the overall design and user experience of the device. The shoulder height of the camera module, that is, the vertical height from the mounting substrate (such as a PCB) to the highest point of the module (such as the motor protection cover), has become one of the key factors affecting the thickness and appearance design of the device.

[0003] In traditional camera module designs, the structures of the motor and the module are usually designed independently and installed separately. For example, the motor base and the base of the camera module are two different components. The motor base is mainly responsible for carrying the motor and its related functional devices, such as the motor circuit board and the movable frame, etc.; while the base of the camera module is mainly used to carry components such as the motor or the lens, and to attach an infrared filter (IR filter). In most cases, space also needs to be reserved for other components such as capacitor components. This design method makes the motor base and the base of the camera module each need to consider factors such as structural strength, the minimum thickness for injection molding, and flatness, resulting in an increase in the overall height of the module. To a certain extent, it limits the application of camera modules in ultra-thin devices.

[0004] Therefore, as electronic devices develop towards lower shoulder height and ultra-thinness, each sub-device that performs functions in the camera module, such as electromagnetic coils, guide rods, balls, or elastic pieces, etc., faces higher design requirements. These sub-devices need to optimize their structures and layouts as much as possible while ensuring their functions, so as to meet the dual requirements of the device for miniaturization and high performance. Summary of the Invention

[0005] An object of this application is to reduce the shoulder height of the camera module and improve the integration degree of the camera module.

[0006] To achieve the above object, the technical solution adopted in this application is: A camera module, comprising: A photosensitive chip; A lens assembly, which is movably held on the photosensitive path of the photosensitive chip; and A driving assembly is suitable for driving the lens assembly to move relative to the photosensitive chip; the driving assembly includes an electrical driving part, a magnetic coupling part and a first molded part, the first molded part integrally combines the electrical driving part and the magnetic yoke in the magnetic coupling part; wherein, the electrical driving part includes a circuit board, a first coil and a conductive carrier, the conductive carrier is used to electrically connect the circuit board and the first coil, the photosensitive chip is conductively connected to the circuit board, the magnetic yoke is arranged on the upper surface of the circuit board, and at least part of the lower surface of the first coil is in contact with the upper surface of the magnetic yoke.

[0007] Preferably, the magnetic coupling portion further comprises a first magnet disposed above the first molding portion, and at least a portion of the first coil is exposed on an upper surface of the first molding portion and is opposite to the first magnet.

[0008] As a preference, projections of the conductive carrier and the magnetic yoke along the optical axis do not overlap.

[0009] Preferably, the conductive carrier includes a flexible circuit board, the flexible circuit board and the yoke are in the same plane, and the flexible circuit board is arranged on the peripheral side of the yoke; or, the first coil, the flexible circuit board and the yoke are arranged in sequence from top to bottom, and the flexible circuit board has a hole area, and the hole area is opposite to the yoke.

[0010] Preferably, the circuit board has a light-through hole opposite to the photosensitive chip, and the photosensitive chip is arranged on the lower surface of the circuit board. The driving component also includes a second molding part, which covers at least a portion of the lower surface of the circuit board, and the bottom surface of the photosensitive chip is not lower than the bottom surface of the second molding part.

[0011] As a preference, the lower surface of the circuit board is electrically connected to electronic components, and the electronic components are molded in the second molding part.

[0012] Preferably, the first molding part and the second molding part are integrally cast, or the first molding part and the second molding part are separately cast.

[0013] As a preference, the driving assembly further includes a first carrier for carrying the lens assembly. A ball bearing structure is provided between the first carrier and the circuit board. The ball bearing structure includes at least three pairs of oppositely arranged upper ball bearing grooves, lower ball bearing grooves, and balls located between each pair of the upper ball bearing grooves and the lower ball bearing grooves. Among them, the upper ball bearing grooves are provided at the bottom of the first carrier, the lower ball bearing grooves are provided on the upper surface of the circuit board or integrally formed on the first molding part, and a first magnet opposite to the first coil is further provided at the bottom of the first carrier.

[0014] As a preference, at least three opening areas are provided on the first molding part. The opening areas are provided at the corners of the first molding part, or at the middle position of any side. Each opening area forms a lower ball bearing groove.

[0015] As a preference, the distance between the first coil and the first magnet is ≤ 0.2 mm.

[0016] Compared with the prior art, the beneficial effects of the present application are as follows: (1) The camera module of the present application further optimizes the internal space layout, reduces space waste, and can effectively reduce the shoulder height of the camera module.

[0017] (2) The camera module of the present application can provide a flatter bottom mounting platform, reduce the shaking or deviation caused by surface unevenness, and thus improve the overall assembly accuracy and stability of the camera module.

[0018] (3) The camera module of the present application can prevent components from shifting due to external forces during use through the molding process, and protect the components from damage.

[0019] (4) Compared with the traditional split assembly, the camera module of the present application has higher shock resistance and vibration resistance, and can better adapt to complex working environments. Brief Description of the Drawings

[0020] Figure 1 It is a three-dimensional schematic diagram of the camera module in an embodiment of the present application.

[0021] Figure 2 It is an exploded schematic diagram of the camera module in an embodiment of the present application.

[0022] Figure 3 It is a cross-sectional schematic diagram of the camera module in an embodiment of the present application.

[0023] Figure 4 It is a cross-sectional schematic diagram of the camera module in another embodiment of the present application.

[0024] Figure 5Schematic diagram of the conductive support of the camera module in an embodiment of the present application.

[0025] Figure 6 Top view schematic diagram of the first molding part of the camera module in an embodiment of the present application.

[0026] Figure 7 Top view schematic diagram of the first molding part of the camera module in another embodiment of the present application.

[0027] Figure 8 Internal structure schematic diagram of the camera module in an embodiment of the present application.

[0028] Figure 9 Schematic diagram of the gap between the first magnet and the first coil of the camera module in an embodiment of the present application.

[0029] Figure 10 Schematic diagram of the circuit board structure of the camera module in an embodiment of the present application.

[0030] Figure 11 Schematic diagram of the position of the photosensitive chip of the camera module in an embodiment of the present application.

[0031] Figure 12 Schematic diagram of the opening area of the first molding part of the camera module in an embodiment of the present application.

[0032] Figure 13 Schematic diagram of the first carrier structure of the camera module in an embodiment of the present application.

[0033] Figure 14 Cross-sectional schematic diagram of the ball bearing support structure of the camera module in an embodiment of the present application.

[0034] Figure 15 Cross-sectional schematic diagram of the ball bearing support structure of the camera module in another embodiment of the present application.

[0035] Figure 16 Cross-sectional schematic diagram of the ball bearing support structure of the camera module in yet another embodiment of the present application.

[0036] Figure 17 Combined structure schematic diagram of the first carrier and the second carrier of the camera module in an embodiment of the present application.

[0037] Figure 18 Internal structure schematic diagram of the second driving component of the camera module in an embodiment of the present application.

[0038] Figure 19 Schematic diagram of the conductive insert structure of the camera module in an embodiment of the present application.

[0039] Figure 20 Schematic diagram of the position of the conductive insert of the camera module in an embodiment of the present application.

[0040] In the figure: 1. Outer shell; 2. Lens assembly; 3. Driving assembly; 31. Electrical driving part; 311. Circuit board; 3111. Light passing hole; 312. First coil; 313. Conductive carrier; 32. Magnetic coupling part; 321. Yoke; 322. First magnet; 301. First molding part; 3011. Opening area; 302. Second molding part; 33. Conductive insert; 331. First contact part; 332. Second contact part; 34. Motor base; 35. Conductive support; 351. First support part; 352. Second support part; 353. Conductive part; 36. Ball support structure; 361. Upper ball support groove; 362. Ball; 363. Lower ball support groove; 37. First driving assembly; 38. Second driving assembly; 381. Second magnet; 382. Second coil; 39. Carrier; 391. First carrier; 3911. Guide; 3912. First reinforcing part; 3913. Second reinforcing part; 392. Second carrier; 4. Infrared filter; 5. Photosensitive chip; 6. Substrate. Specific embodiments

[0041] Next, in combination with specific embodiments, the present application will be further described. It should be noted that, on the premise of no conflict, the following described embodiments or technical features can be arbitrarily combined with each other to form new embodiments.

[0042] In the description of the present application, it should be noted that for orientation terms, if there are terms such as "center", "horizontal", "vertical", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation and position relationship is based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present application.

[0043] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0044] The terms "comprising" and "having" in the description and claims of this application, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0045] In the drawings of this application, the X, Y, and Z axes are the coordinate axes of a three-dimensional rectangular coordinate system, and the X, Y, and Z axes respectively correspond to the length direction, width direction, and height direction of the imaging module. Among them, the optical axis direction of the imaging module is the optical axis direction of the lens assembly 2, which is parallel to the Z axis.

[0046] As Figures 1-3 shown, according to an embodiment of this application, the imaging module includes a photosensitive chip 5, a lens assembly 2 movably held on the light-sensitive path of the photosensitive chip 5, and a driving assembly 3 adapted to drive the lens assembly 2 to displace relative to the photosensitive chip 5. Among them, the lens assembly 2 is used to converge light, and the light converged by the lens assembly 2 is adapted to be incident on the photosensitive chip 5 for imaging.

[0047] Furthermore, the first driving assembly 37 includes an electrical driving part 31 and a magnetic coupling part 32. After the electrical driving part 31 is powered on, it can generate a magnetic field that interacts with the magnetic coupling part 32, and at least a part of the magnetic coupling part 32 is adapted to be driven by magnetic force, thereby driving the lens assembly 2 to move.

[0048] Specifically, the electrical driving part 31 includes a circuit board 311, a first coil 312, and a conductive carrier 313 for electrically connecting the circuit board 311 and the first coil 312, wherein the circuit board 311 is electrically connected to the photosensitive chip 5.

[0049] The magnetic coupling part 32 includes a first magnet 322 and a magnetic yoke 321. The first magnet 322 is disposed opposite to the first coil 312, so that when the first coil 312 is powered on to generate a magnetic field, it is adapted to drive the first magnet �22 to move. The first magnet 322 is disposed on the lens assembly 2, so that when the first magnet 322 displaces relative to the first coil 312, it is adapted to drive the lens assembly 2 to move relative to the first coil 312. The magnetic yoke 321 is used to enhance the intensity and directivity of the magnetic field generated by the first coil 312, making the magnetic field more concentrated and uniform. The first magnet 322 and the magnetic yoke 321 are respectively disposed on the upper and lower sides of the first coil 312. That is, the magnetic yoke 321 is disposed below the first coil 312. By providing the magnetic yoke 321, on the one hand, the magnetic field intensity can be enhanced and the magnetic field distribution can be stabilized, and on the other hand, the height of the first coil 312 can be raised to avoid too large a distance between the first coil 312 and the first magnet 322, affecting the driving effect.

[0050] In some preferred embodiments, the yoke 321 is disposed on the upper surface of the circuit board 311, and at least a part of the lower surface of the first coil 312 is in contact with the upper surface of the yoke 321. Since the yoke 321 has a high flatness, by disposing the first coil 312 on the upper surface of the yoke 321, the flatness of the first coil 312 can be ensured by using the flatness of the yoke 321.

[0051] In some embodiments, the driving assembly 3 includes a first carrier 391 for carrying the lens assembly 2 and a first driving assembly 37 for driving the first carrier 391. Among them, the first driving assembly 37 includes the above-mentioned first magnet 322 and the first coil 312. The first coil 312 is disposed on the circuit board 311, and the first magnet 322 is disposed on the first carrier 391 opposite to the first coil 312. When the first coil 312 is energized, an electromagnetic force is formed by interacting with the first magnet 322 to drive the first carrier 391 and the lens assembly 2 to move relative to the circuit board 311 and the photosensitive chip 5.

[0052] In a possible implementation manner, the conductive carrier 313 is used to electrically connect the first coil 312 and the circuit board 311. The conductive carrier 313 can be disposed between the first coil 312 and the yoke 321, or can be disposed on the periphery of the yoke 321 to reduce the thickness, or can also be disposed on the periphery of the first coil 312. It is worth mentioning that when the projection of the conductive carrier 313 and the yoke 321 along the Z-axis overlaps, the current on the conductive carrier 313 may affect the action of the yoke 321 on the magnetic field. Therefore, in some preferred embodiments, the projection of the conductive carrier 313 and the yoke 321 along the Z-axis (or the optical axis) direction does not overlap. For example, in Figure 4In the illustrated embodiment, the conductive carrier 313 and the magnetic yoke 321 are disposed below the first coil 312. The conductive carrier 313 and the magnetic yoke 321 are in the same plane, and the conductive carrier 313 is disposed around the yoke 321, so that the magnetic yoke 321 is not interfered with by the low magnetic permeability of the conductive carrier 313. It will be understood that the magnetic yoke 321 is typically made of a material with high magnetic permeability, such as iron. When the first coil 312 is energized, a magnetic field is generated. The magnetic yoke 321 can effectively guide and concentrate this magnetic field, distributing it along a predetermined path, reducing magnetic field dispersion and energy loss, and enhancing the intensity of the magnetic field in a specific area. Specifically, the magnetic yoke 321 can more efficiently guide the magnetic field to the key areas that interact with the first magnet 322, improving the efficiency and precision of the electromagnetic drive system and ensuring that the generated electromagnetic force can accurately act on the target component, such as the lens assembly 2, to achieve fast and accurate focusing or optical image stabilization operations. Therefore, the projections of the conductive carrier 313 and the magnetic yoke 321 along the optical axis do not overlap, which can effectively prevent the magnetic field generated by the current flowing through the conductive carrier 313 from being superimposed on or offset by the magnetic field around the magnetic yoke 321 and the first coil 312, thereby preventing the distribution of the driving magnetic field originally formed by the first coil 312 and the magnetic yoke 321 from being disturbed.

[0053] In a specific embodiment, Figure 4 As shown, the yoke 321 is disposed on the upper surface of the circuit board 311, the first coil 312 is disposed on the upper surface of the yoke 321, and the conductive carrier 313 is disposed on the circumference of the yoke 321. One end of the conductive carrier 313 is conductively connected to the first coil 312, and the other end is conductively connected to the circuit board 311. In this embodiment, the first coil 312, the yoke 321, and the conductive carrier 313 are integrated into the upper surface of the circuit board 311, and the overall height of the drive assembly 3 can be further reduced. For example, the conductive carrier 313 is provided with a through-hole area. The shape of the hole area is adapted to the yoke 321, and the area of the hole area is slightly larger than the yoke 321. The yoke 321 is disposed in the hole area.

[0054] In other embodiments, the magnetic yoke 321, the conductive carrier 313 and the first coil 312 are arranged in sequence from bottom to top, the first coil 312 is arranged above the conductive carrier 313 and electrically connected to the first coil 312, the conductive carrier 313 is arranged above the magnetic yoke 321, and the conductive carrier 313 has a penetrating hole area, and the magnetic yoke 321 is placed below the hole area. The hole area makes it possible for there to be no obstruction of the conductive carrier 313 above the magnetic yoke 321, thereby ensuring that the magnetic circuit between the magnetic yoke 321 and the first magnet 322 is unobstructed, which can reduce magnetic resistance, improve the efficiency of the magnetic circuit, and thereby enhance the effect of electromagnetic drive.

[0055] Furthermore, the driving component 3 further includes a first molding part 301 which integrally combines the electrical driving part 31 and the yoke 321 of the magnetic coupling part 32. That is to say, the circuit board 311, the first coil 312, the conductive carrier 313 and the yoke 321 are integrally combined in the first molding part 301. By integrally combining the circuit board 311, the first coil 312, the conductive carrier 313 and the yoke 321 with the first molding part 301, the integration degree of the product is effectively improved, and it is beneficial to provide a flatter mounting platform for the installation of the lens assembly 2.

[0056] Using the first molding part 301 to encapsulate the first coil 312, the yoke 321 and the conductive carrier 313 is beneficial to further reduce the overall shoulder height of the camera module. Since there are usually many circuit components on the circuit board 311 occupying the space in the height direction, if the traditional lens holder method is adopted (that is, the lens holder is arranged on the circuit board 311, the lens assembly is arranged on the lens holder, and the magnet coil structure is arranged between the lens assembly and the lens holder), it will occupy the thickness or height space of the camera module, resulting in a higher shoulder height of the camera module. In this application, the lens holder is cancelled, and the first coil 312, the yoke 321 and the conductive carrier 313 are directly arranged on the circuit board 311, and the first molding part 301 is formed on the circuit board 311. The first molding part 301 can protect the circuit board 311, the first coil 312, the yoke 321 and the conductive carrier 313. At the same time, due to the advantages of the molding process, the upper surface height of the first molding part 301 can not exceed the upper surface height of the first coil 312. Therefore, the first molding part 301 basically does not introduce additional height space, thus reducing the shoulder height of the camera module.

[0057] In some embodiments, the conductive carrier 313 includes a flexible printed circuit board, which is convenient for bending, folding and forming according to the complex structure of the camera module to adapt to different space limitations.

[0058] In some embodiments, such as Figure 5As shown, the conductive carrier 313 includes a flexible printed circuit board and a conductive support 35. The conductive support 35 can also be integrally combined in the first molding part 301. The conductive support 35 includes a first support part 351, a second support part 352, and a conductive part 353. Among them, the first support part 351 can be used to support the yoke 321. Since the first coil 312 is disposed above the yoke 321, the first coil 312 faces the first magnet 322, and the distance therebetween cannot be too far to ensure that sufficient electromagnetic force can be generated between the first coil 312 and the first magnet 322 to drive the lens module 2 to move for anti-shake. Therefore, the conductive support 35 helps to increase the height of the yoke 321 and further increase the height of the first coil 312 located above the yoke 321 so that the distance between the first coil 312 and the first magnet 322 will not be too large. The second support part 352 is used to support the flexible printed circuit board and conduct the electrical signals between the flexible printed circuit board and the circuit board 311. The conductive part 353 is used to electrically connect the flexible printed circuit board and the circuit board 311 so that the first coil 312 electrically connected to the conductive carrier 313 can generate electromagnetic force after being powered on to drive the lens module 2 to move.

[0059] In some other embodiments, the conductive carrier 313 includes a wire, that is, the first coil 312 is electrically connected to the circuit board 311 through the wire. The wire is encapsulated in the first molding part 301, and the first molding part 301 can protect the wire to avoid wire breakage. In this implementation manner, the first coil 312 can be directly connected to the circuit board 311 through the wire, and the flexible circuit board corresponding to the first coil 312 can be omitted, further reducing the shoulder height of the camera module and saving costs at the same time.

[0060] In still some other embodiments, the conductive carrier 313 includes a conductive metal sheet, that is, the first coil 312 is electrically connected to the circuit board 311 through the conductive metal sheet. The upper surface of the conductive metal sheet and the upper surface of the yoke 321 are located on the same horizontal plane. At least a part of the lower surface of the first coil 312 is in contact with the upper surface of the yoke 321, and another part of the lower surface of the first coil 312 is in contact with the upper surface of the conductive metal sheet. In this way, the flatness of the first coil 312 can be ensured by using the flatness of the yoke 321 and the conductive metal sheet. Optionally, the conductive metal sheet can be an L-shaped conductive metal sheet or a Z-shaped conductive metal sheet.

[0061] In some embodiments, as Figure 6 shown, the first coil 312 integrally combined with the first molding part 301 can be completely encapsulated in the first molding part 301, that is, the first coil 312 is not exposed, and the first coil 312 can be completely isolated from the external environment to prevent the coil from being eroded by dust, moisture, chemical substances, etc.

[0062] In some other embodiments, as Figure 7As shown, the first molding part 301 covers at least a part of the upper surface of the circuit board 311, and the first magnet 322 is disposed above the first molding part 301. At least a part of the first coil 312 is exposed on the upper surface of the first molding part 301 and is opposite to the first magnet 322, ensuring the magnetic field alignment accuracy between the first coil 312 and the first magnet 322 and making the interaction of the magnetic field more efficient and stable. At the same time, the first coil 312 is exposed on the upper surface of the first molding part 301, which is beneficial to reducing the distance between the first coil 312 and the first magnet 322, thereby enhancing the electromagnetic induction effect, making the response speed of the camera module faster and the accuracy higher during focusing and optical image stabilization, and further improving the overall performance of the camera module.

[0063] In one embodiment, as Figure 8 shown, the driving assembly 3 further includes a carrier 39. The carrier 39 includes a first carrier 391 and a second carrier 392. The first carrier 391 is an OIS (Optical Image Stabilization) carrier, and the second carrier 392 is an AF (Auto Focus) carrier. The lens assembly 2 is mounted on the second carrier 392. The second carrier 392 is movably mounted on the first carrier 391 along the optical axis direction. Thus, when the second carrier 392 moves relative to the first carrier 391, the vertical distance between the lens assembly 2 and the photosensitive chip 5 can be adjusted to achieve the focusing function. Those skilled in the art can understand that a motor composed of a coil and a magnet can be disposed between the first carrier 391 and the second carrier 392 to drive the second carrier 392. The first carrier 391 is held above the circuit board 311 by a ball support structure 36, so that the first carrier 391 is adapted to displace in a direction perpendicular to the optical axis to adjust the horizontal position of the lens assembly 2 relative to the photosensitive chip 5 and achieve the anti-shake function. It is worth mentioning that the first magnet 322 is disposed on the first carrier 391, that is, the first driving assembly 37 is used to drive the first carrier 391 to displace.

[0064] In some embodiments, as Figure 9 shown, the distance between the first coil 312 and the first magnet 322 is L, and L ≤ 0.2 mm. It should be understood that if the distance between the first coil 312 and the first magnet 322 is too close, the driving point of the lens assembly 2 will be too low, resulting in unbalanced force and unstable movement of the lens assembly 2. Therefore, the distance between the first coil 312 and the first magnet 322 that is partially exposed on the surface of the first molding part 301 does not exceed 0.2 mm, which can keep the force balance of the lens assembly 2 while reducing the height of the camera module.

[0065] Furthermore, as Figure 10As shown, the circuit board 311 has a light passing hole 3111 opposite to the photosensitive chip 5. The size of the light passing hole 3111 corresponds to that of the photosensitive chip 5 to ensure that light can be converged onto the photosensitive chip 5. At the same time, as Figure 11 shown, the photosensitive chip 5 is arranged on the lower surface of the circuit board 311, so that the lower surface of the circuit board 311 can be fully utilized, enabling sufficient space on the upper surface of the circuit board 311 for placing components such as the yoke 321 and the first coil 312. It should be understood that compared with traditional camera modules, in the present application, the photosensitive chip 5 is located below the circuit board 311, which can sink the photosensitive chip 5 and raise the position of the circuit board 311. While reducing the shoulder height of the camera module in the Z-axis direction, it can ensure an appropriate distance between the photosensitive chip 5 and the lens assembly 2. Thus, it can not only avoid problems such as blurred or defocused images caused by improper distance between the photosensitive chip 5 and the lens assembly 2, resulting in inaccurate light convergence. It can also prevent the photosensitive chip 5 and the lens assembly 2 from colliding or rubbing against each other when subjected to vibration or impact due to direct contact or too close distance.

[0066] Further, the driving assembly 3 of the camera module in the present application further includes a second molding part 302. As Figure 11 shown, the second molding part 302 covers at least a part of the lower surface of the circuit board 311, thereby preventing the circuit board 311 and the electronic components mounted thereon from being damaged by external physical impacts, collisions or frictions, and improving the durability of the camera module.

[0067] Further, as Figure 11 shown, the bottom surface of the photosensitive chip 5 is not lower than the bottom surface of the second molding part 302. The second molding part 302 provides sufficient physical protection for the photosensitive chip 5, preventing the photosensitive chip 5 from being directly exposed and its lower surface from being scratched or damaged by the outside, so as to ensure the optical performance of the photosensitive chip 5 and extend the service life of the photosensitive chip 5.

[0068] In some embodiments, a number of electronic components such as capacitors and resistors are electrically connected to the lower surface of the circuit board 311. These electronic components are molded inside the second molding part 302, thereby improving the utilization rate of the internal space of the second molding part 302, ensuring that complete devices can be arranged within the limited area of the circuit board 311, realizing a more compact layout of the camera module, and helping to further reduce the volume of the camera module to meet the requirements of modern electronic devices for miniaturization.

[0069] In some embodiments, the first molding part 301 and the second molding part 302 are integrally cast, or the first molding part 301 and the second molding part 302 are cast separately. Compared with traditional camera modules, the integrally cast first molding part 301 and second molding part 302 of the present application do not have the welding points between the motor base and the camera module in the split design. The seamless connection method can ensure that no cracks or deformations occur at the joint between the molding parts during long-term use or under external force impact, thereby extending the service life of the camera module. The separately cast first molding part 301 and second molding part 302 can optimize the shape, size, and material properties of each molding part according to different functional requirements or application scenarios. For example, the first molding part 301 can be made of a high-strength material to provide better support, while the second molding part 302 can be made of a lighter or more easily processed material to meet specific performance requirements.

[0070] Further, a ball bearing support structure 36 is provided between the first carrier 391 and the circuit board 311. The ball bearing support structure 36 includes a plurality of pairs of oppositely arranged upper ball bearing support grooves 361 and lower ball bearing support grooves 363. At least one ball 362 is provided between each pair of upper ball bearing support grooves 361 and lower ball bearing support grooves 363. The upper ball bearing support grooves 361 are located at the bottom of the first carrier 391, and the lower ball bearing support grooves 363 are located on the upper surface of the circuit board 311 or are integrally formed on the first molding part 301.

[0071] In some embodiments, at least three opening areas 3011 are provided on the first molding part 301. The opening areas 3011 are provided at the corners of the first molding part 301, or at the middle position of any side. Each opening area 3011 forms a lower ball bearing support groove 363, and each lower ball bearing support groove 363 is adapted to receive a ball 362. It should be understood that the three opening areas 3011 are not on the same straight line and can form a stable triangular support plane. Therefore, the distances between the three vertices of the balls 362 received in the opening areas 3011 can form a stable triangular support plane, evenly dispersing stress, and thus having high stability in high-precision operations such as anti-shake and focusing of the camera module.

[0072] Such as Figures 12-14As shown, the first molding part 301 is respectively provided with an opening area 3011 at three corners. The ball support structure 36 includes three pairs of oppositely arranged upper ball support grooves 361, lower ball support grooves 363, and balls 362 located between each pair of upper ball support grooves 361 and lower ball support grooves 363. Among them, the upper ball support grooves 361 are arranged at the bottom of the first carrier 391, the lower ball support grooves 363 are arranged in the opening area 3011 of the first molding part 301, the balls 362 are arranged in the lower ball support grooves 363, and the top parts of the balls 362 leak out to correspond to the upper ball support grooves 361 located at the bottom of the first carrier 391 to movably support the first carrier 391. It should be understood that since the integrally formed lower ball support grooves 363 are formed simultaneously with the first molding part 301, their position and angle accuracy are higher, which can ensure that the movement of the balls 362 in the support grooves is smoother and reduce friction and wear caused by assembly errors.

[0073] In some embodiments, as Figure 15 shown, the lower ball support grooves 363 are located on the upper surface of the circuit board 311. The lower ball support grooves 363 are arranged on the side of the first molding part 301. Among them, the lower surface of the lower ball support grooves 363 is substantially on the same horizontal plane as the lower surface of the first molding part 301 to improve the overall stability of the ball support structure 36 and avoid uneven stress on the lower ball support grooves 363 due to height differences. The separate setting of the first molding part 301 and the lower ball support grooves 363 can adapt to different specifications of balls 362 to set different sizes of the lower ball support grooves 363. The lower ball support grooves 363 can be made of materials with better rigidity and flatness separately, so that the balls 362 can slide more smoothly.

[0074] In some embodiments, as Figure 16 shown, the camera module further includes a motor base 34 provided on the first molding part 301 or the circuit board 311. The motor base 34 includes at least three convex parts extending towards the bottom of the first carrier 391. The first molding part 301 forms a relief area at the position corresponding to each convex part, so that the bottom surface of the convex part is opposite to the upper surface of the circuit board 311, the top surface of the convex part is opposite to the bottom surface of the first carrier 391, and the top surface of the convex part forms the lower ball support grooves 363. The motor base 34 used solely for installing the balls 362 can not only be made of materials with better rigidity and flatness, making the ball support structure 36 have a more stable supporting force and be more capable of withstanding external pressure or impact.

[0075] In some embodiments, the photosensitive chip 5 is electrically connected to the lower surface of the circuit board 311 by means of welding pins or metal wires. The welding pins or metal wires can enhance the stability of the photosensitive chip 5 in the camera module, make it closely combined with the circuit board 311, reduce the risk of loosening or displacement of the photosensitive chip 5 caused by external force factors such as vibration and collision, and improve the reliability and durability of the camera module.

[0076] In some embodiments, along the optical axis direction, a yoke 321, a conductive carrier 313, and a first coil 312 are sequentially arranged from bottom to top in the first molding portion 301. The conductive carrier 313 may also not be provided with a dug-out area and is directly arranged above the yoke 321. By directly placing the conductive carrier 313 above the yoke 321, the dug-out area for accommodating the yoke 321 is omitted, thus simplifying the assembly process. However, this setting method may cause a certain interference to the magnetic field distribution. Therefore, in order to ensure the module performance while simplifying the process, a conductive carrier 313 material with a low magnetic permeability can be selected, or an appropriate insulating layer can be added to further reduce the interference of the conductive carrier 313 on the magnetic field, so as to ensure the performance of the camera module is not affected while simplifying the assembly process.

[0077] In some embodiments, as Figure 17 shown, along the Z-axis direction, at least a part of the first carrier 391 and the second carrier 392 overlap in height. Through partial overlap, the carriers 39 that might originally need to be stacked sequentially in the height direction can share part of the space, effectively utilizing the vertical space inside the camera module, avoiding waste of space, and thus further reducing the shoulder height of the camera module as a whole.

[0078] Furthermore, as Figure 18 shown, the driving assembly 3 further includes a second driving assembly 38. The second driving assembly 38 includes a second magnet 381 and a second coil 382. The second magnet 381 and the second coil 382 are relatively arranged between the second carrier 392 and the first carrier 391. When the second coil 382 is energized, the second coil 382 generates a magnetic field and interacts with the magnetic field generated by the second magnet 381 to generate an electromagnetic force to drive the second carrier 392 arranged above the first carrier 391 to move, realizing the focusing function of the camera module.

[0079] Furthermore, as Figure 17 and Figure 18As shown, the first carrier 391 further includes a guide member 3911. The guide member 3911 is clamped between the first carrier 391 and the second carrier 392. When the camera module needs to perform operations such as optical zoom and autofocus, the guide member 3911 can restrict the movement direction of the second carrier 392, preventing the second carrier 392 from shifting or shaking during movement. It should be understood that since the second carrier 392 is mainly used to carry the lens assembly 2, by guiding the movement of the second carrier 392 through the guide member 3911, the position of the lens assembly 2 can be changed, thereby changing the distance between the lens assembly 2 and the photosensitive chip 5 to achieve the focusing function of the camera module.

[0080] Further, as Figure 18 shown, the first carrier 391 is further provided with a first reinforcing member 3912 and a second reinforcing member 3913. The first reinforcing member 3912 covers the first magnet 322 and can provide physical support for the first magnet 322 to prevent it from shifting or deforming when subjected to external forces or vibrations. Further, the second reinforcing member 3913 is disposed between the second magnet 381 and the second carrier 392 to prevent the second magnet 381 from loosening or being damaged due to external forces or vibrations during use, ensuring the safe operation of the camera module. In addition, this structural reinforcement can ensure that the magnets and coils maintain stable positions and shapes inside the camera module, thus ensuring the normal operation of the electromagnetic drive system.

[0081] In some embodiments, as Figure 19 and Figure 20 shown, the drive assembly 3 further includes a conductive insert 33. The conductive insert 33 is disposed around at least three sides of the drive assembly 3. Specifically, the conductive insert 33 surrounds the first molding part 301, the first carrier 391, and the second carrier 392. The conductive insert 33 includes a first contact part 331 and a second contact part 332. The first contact part 331 is embedded inside the first molding part 301 and is electrically connected to the circuit board 311 and the first coil 312. The second contact part 332 is embedded inside the first carrier 391 and is electrically connected to the second coil 382, ensuring that current and control signals can be transmitted from the circuit board 311 to the second coil 382 to achieve the optical anti-autofocus function of the camera module.

[0082] Further, along the X-axis direction, the first contact portion 331 of the conductive insert 33 is sequentially provided with electrical interfaces AFSDA, AFVDD, AFGND, and AFSCL related to the autofocus (AF) function. Among them, AFSDA is the I2C data line of the autofocus module, which is used to transmit control commands and status information of the focus motor (such as the voice coil motor VCM); AFVDD is the power supply voltage of the autofocus motor, which provides power for the voice coil motor (VCM) and its driving circuit; AFGND is the ground wire of the autofocus module, which provides a reference ground potential for AFVDD; AFSCL is the I2C clock line of the autofocus module, which cooperates with AFSDA to synchronize data transmission. The second contact portion 332 of the conductive insert 33 includes a positive electrode interface and a negative electrode interface. The positive electrode interface and the negative electrode interface provide a stable current path for the components in the first carrier 391, form a complete current loop, control the movement of the lens assembly 2, and thus achieve precise focusing of the imaging module.

[0083] In some embodiments, the imaging module further includes a substrate 6, and the substrate 6 is fixed to the lower surface of the second molding portion 302 by glue to protect the photosensitive chip 5 attached to the lower surface of the circuit board 311.

[0084] In some embodiments, the imaging module further includes a housing 1, and the housing 1 is adapted to be engaged with the first molding portion 301 to form an accommodation cavity with the first molding portion 301 to protect the components in the lens assembly 2 and the driving assembly 3.

[0085] In some embodiments, the imaging module further includes an infrared filter 4, as Figure 3 shown, the infrared filter 4 is pasted above the first molding portion 301 by glue, so as to effectively block excess infrared light, prevent the infrared light from overexposing the photosensitive chip 5, enable the photosensitive chip 5 to only receive visible light, and ensure the clarity of the image and the accuracy of colors.

[0086] In a specific embodiment, as Figure 2 shown, along the Z-axis direction, from bottom to top of the imaging module of the present application, the thickness of the substrate 6 is 0.1 mm, the thickness of the adhesive between the substrate 6 and the second molding portion 302 is 0.04 mm, the thickness of the second molding portion 302 is 0.24 mm, the thickness of the circuit board 311 is 0.21 mm, the superimposed thickness of the first molding portion 301 and the first coil 312 exposed on the upper surface of the first molding portion 301 is 0.31 mm, the safety distance height maintained between the first magnet 322 and the first coil 312 is 0.1 mm, and the thickness from the first magnet 322 to the top surface of the imaging module is 2.75 mm. Compared with the shoulder height of the traditional imaging module being 4.6 mm, the shoulder height of the imaging module in the embodiment of the present application has decreased by 0.85 mm, and the overall shoulder height is only 3.75 mm.

[0087] Compared with the prior art, the motor base and the base of the camera module each require a certain thickness to meet the requirements of structural strength and injection molding process, which to a certain extent limits the trend of the camera module towards miniaturization. In this application, the first coil 312, the yoke 321, and the conductive carrier 313 are integrally combined in the first molding part 301, optimizing the position space of the photosensitive chip 5 and the circuit board 311, thereby reducing the mutual interference between components and the occupation of redundant space, realizing the highly integrated internal space of each component, enabling the first molding part 301 of this application to simultaneously possess the dual functions of the motor base and the base of the camera module in the existing camera module, significantly reducing the volume and thickness of the camera module, and meeting the dual requirements of the electronic device for a miniaturized and high-performance camera module.

[0088] The foregoing has described the basic principles, main features, and advantages of this application. Those skilled in the art of this industry should understand that this application is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of this application. Without departing from the spirit and scope of this application, this application will have various changes and improvements, and these changes and improvements all fall within the scope of this application claimed. The scope of protection required by this application is defined by the appended claims and their equivalents.

Claims

1. An imaging module, characterized in that, include: Photosensitive chip; A lens assembly is movably held on the light-sensing path of the light-sensing chip; as well as A driving assembly is suitable for driving the lens assembly to move relative to the photosensitive chip; the driving assembly includes an electrical driving part, a magnetic coupling part and a first molded part, the first molded part integrally combines the electrical driving part and the magnetic yoke in the magnetic coupling part; wherein, the electrical driving part includes a circuit board, a first coil and a conductive carrier, the conductive carrier is used to electrically connect the circuit board and the first coil, the photosensitive chip is conductively connected to the circuit board, the magnetic yoke is arranged on the upper surface of the circuit board, and at least part of the lower surface of the first coil is in contact with the upper surface of the magnetic yoke.

2. The camera module according to claim 1, wherein The magnetic coupling portion further includes a first magnet disposed above the first molding portion. At least a portion of the first coil is exposed on an upper surface of the first molding portion and faces the first magnet.

3. The camera module according to claim 1, wherein Projections of the conductive carrier and the magnetic yoke along the optical axis do not overlap.

4. The imaging module according to claim 3, wherein The conductive carrier includes a flexible circuit board, which is in the same plane as the yoke and is arranged on the circumferential side of the yoke; or, the first coil, the flexible circuit board and the yoke are arranged in sequence from top to bottom, and the flexible circuit board has a hole area, which is opposite to the yoke.

5. The camera module according to any one of claims 1-4, characterized in that, The circuit board has a light-through hole opposite to the photosensitive chip, and the photosensitive chip is arranged on the lower surface of the circuit board. The driving component also includes a second molding part, which covers at least a portion of the lower surface of the circuit board. The bottom surface of the photosensitive chip is not lower than the bottom surface of the second molding part.

6. The camera module according to claim 5, wherein, The lower surface of the circuit board is electrically connected to electronic components, and the electronic components are molded in the second molding part.

7. The camera module according to claim 5, wherein The first molding part and the second molding part are integrally cast, or the first molding part and the second molding part are separately cast.

8. The camera module according to any one of claims 1-4, characterized in that, The driving assembly also includes a first carrier for carrying the lens assembly, a ball support structure is arranged between the first carrier and the circuit board, and the ball support structure includes at least three pairs of relatively arranged upper ball support grooves, lower ball support grooves and balls located between each pair of the upper ball support grooves and the lower ball support grooves; wherein, the upper ball support grooves are arranged at the bottom of the first carrier, the lower ball support grooves are arranged on the upper surface of the circuit board or are integrally formed in the first molding part, and the bottom of the first carrier is also provided with a first magnet opposite to the first coil.

9. The camera module according to claim 8, wherein At least three opening areas are provided on the first molding part. The opening areas are provided at the corners of the first molding part, or at the middle position of any side. Each of the opening areas forms a lower ball support groove.

10. The imaging module according to claim 2, wherein The distance between the first coil and the first magnet is ≤0.2 mm.

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