Wafer automatic cleaning and drying integrated equipment and method

Abstract

This invention discloses an integrated automatic wafer cleaning and drying device and method, belonging to the technical field of wafer cleaning equipment. It includes a frame with a first pipe, a second pipe, and a third pipe arranged sequentially from left to right on the upper end of the frame. An ultrasonic cleaner is disposed in the middle of the frame, and a drive motor is fixed in the middle of the frame. A fixing rod is fixed to the drive end of the drive motor, and a placement frame is fixed to the upper end of the fixing rod. The placement frame has several through slots in its middle and sliding grooves on both sides. This application achieves the effect of cleaning, spin-drying, and drying in an integrated manner by manually pulling the closed cover, thereby improving the working efficiency of the integrated equipment. It also achieves a scraping and cleaning effect, improving the ease of use of the integrated equipment, and a flexible pressing effect, thereby improving the stability of the integrated equipment during use.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning equipment technology, specifically to an integrated automatic wafer cleaning and drying equipment and method. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. In semiconductor manufacturing, wafer cleaning and drying are crucial steps to ensure chip yield and performance. If water stains or particles remain on the wafer surface after cleaning, it will lead to problems such as corrosion of the metal interconnect layer and failure of photoresist stripping. Therefore, high-cleanliness drying equipment achieves "zero watermark" residue on the wafer surface through precise control of the drying process, providing a clean substrate for chip manufacturing.

[0003] In the traditional wafer cleaning process, wafers need to go through multiple cleaning stages, and each stage relies on manual handling of wafers one by one. This process is not only inefficient, but also prone to introducing contamination due to manual operation, reducing the cleanliness of the wafers. What's more cumbersome is that the spin-drying and drying stages need to be completed with specialized equipment, which increases the space occupied by the equipment in the entire production chain, extends the production cycle, raises labor costs, and greatly reduces the overall production efficiency, thus making the working efficiency of the cleaning equipment low.

[0004] Therefore, it is necessary to invent an integrated automatic wafer cleaning and drying equipment and method to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated automatic wafer cleaning and drying equipment and method to solve the problems mentioned in the background art.

[0006] In a first aspect, the integrated automatic wafer cleaning and drying equipment provided in this application adopts the following technical solution: it includes a frame, the upper end of which is provided with a first pipe, a second pipe and a third pipe from left to right, an ultrasonic cleaner is provided in the middle of the frame, a drive motor is fixed in the middle of the frame, a fixed rod is fixed at the drive end of the drive motor, a placement frame is fixed at the upper end of the fixed rod, a plurality of through slots are opened in the middle of the placement frame, sliding grooves are opened on both sides of the placement frame, sliding plates are slidably connected to the inner walls of the two sliding grooves, a first spring is fixed on both sides of each sliding plate, a support rod is fixed at the upper end of the two sliding plates, a tray is fixed at the upper end of the two support rods, a vibration motor is fixed in the middle of the tray, a sealing cover is slidably connected to the middle of the upper end of the frame, a plurality of filter holes are opened in the middle of the sealing cover, and a hot air blower is provided in the middle of the sealing cover;

[0007] The sealed cover is provided with connecting structures on both sides, and a cleaning rack is provided on the connecting structures. The connecting structures can slide along the height of the inner wall of the ultrasonic cleaner to scrape and clean the impurities attached to the inner wall of the ultrasonic cleaner.

[0008] Preferably, the connection structure includes two fixed blocks, one end of each fixed block is rotatably connected to a connecting frame, the other end of each connecting frame is rotatably connected to a driving block, and the other end of each driving block is fixed to a cleaning frame.

[0009] Preferably, the upper ends of the two fixing blocks are fixed to both sides of the closed cover, the lower ends of the two fixing blocks are rotatably connected to the upper ends of the two connecting frames, and the lower ends of the two connecting frames are rotatably connected to the upper ends of the two driving blocks.

[0010] Preferably, the lower ends of the two drive blocks are fixed to the upper sides of the cleaning frame, the middle part of the cleaning frame is hollowed out, and the outer surface of the cleaning frame is slidably connected to the inner wall of the ultrasonic cleaner.

[0011] Preferably, a drain pipe is provided on one side of the ultrasonic cleaner, and a control valve is provided on the side of the drain pipe away from the ultrasonic cleaner. The fixing rod passes through the middle of the ultrasonic cleaner, and the upper end of the fixing rod is fixed to the middle of the lower end of the placement frame. The placement frame is set inside the ultrasonic cleaner. The outer surfaces of the two sliding plates are slidably connected to the inner walls of the two sliding grooves. The near ends of each pair of adjacent first springs are fixed to both sides of one of the sliding plates, and the far ends of each pair of adjacent first springs are fixed to the inner walls of both ends of one of the sliding grooves. Each support rod passes through the middle of each sliding groove, and one end of each support rod is fixed to one side of the tray. The outer surface of the tray is slidably connected to the inner wall of the placement frame.

[0012] Preferably, the outer surface of the sealing cover is slidably connected to the inner wall of the frame in the middle, the outer surface of the sealing cover is slidably connected to the upper surface of the ultrasonic cleaner, a plurality of filter holes are penetrating the middle of the sealing cover, and the hot air blower is located in the middle of the upper side of the sealing cover.

[0013] Preferably, two stabilizing grooves are provided on the lower side of the closed cover, and stabilizing frames are slidably connected to the inner walls of the two stabilizing grooves. Second springs are fixed on both sides of the stabilizing frames, and a pressing frame is fixed at the lower end of the stabilizing frames.

[0014] Preferably, the outer surface of the stabilizer is slidably connected to the inner walls of the two stabilizer slots, the upper ends of the two second springs are fixed to the upper inner walls of the two stabilizer slots, and the lower ends of the two second springs are fixed to both sides of the stabilizer.

[0015] Preferably, the lower end of the stabilizing frame is fixed to the middle of the upper side of the pressing frame, the vertical section of the stabilizing frame is T-shaped, the vertical section of the pressing frame is arc-shaped, and the outer surface of the pressing frame is in contact with the outer surface of the frame body, the ultrasonic cleaner, and the placement frame.

[0016] Secondly, an automated wafer cleaning and drying method, implemented using the aforementioned integrated automated wafer cleaning and drying equipment, includes the following steps:

[0017] S1. Wafer Placement: Place the wafer cassette containing the wafers onto the tray of the placement rack inside the ultrasonic cleaner.

[0018] S2. Hydrofluoric acid immersion: Hydrofluoric acid is injected into the ultrasonic cleaner through the first pipe to immerse the wafer in it. After immersion, the control valve is opened to drain the hydrofluoric acid through the drain pipe, and then the control valve is closed.

[0019] S3, Cold water rinse: Cold water is injected into the ultrasonic cleaner through the second pipe to rinse the wafer. After rinsing, the control valve is opened to drain the cold water through the drain pipe, and then the control valve is closed.

[0020] S4. Hot water oscillation: Hot water is injected into the ultrasonic cleaner through the third pipe, and the vibration motor is started at the same time to drive the tray to oscillate and clean the wafer.

[0021] S5. Hot water ultrasonic treatment: Start the ultrasonic cleaner to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve to discharge the hot water through the drain pipe, and then close the control valve.

[0022] S6. Cold water ultrasonic: Inject cold water into the ultrasonic cleaner through the second pipe, start the ultrasonic cleaner, and perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve and discharge the cold water through the drain pipe.

[0023] S7. Secondary cold water rinse: Cold water is injected into the ultrasonic cleaner again through the second pipe to rinse the wafer. After rinsing, the control valve is opened and the cold water is discharged through the drain pipe.

[0024] S8. Closing the cover: By pulling the cover, it covers the ultrasonic cleaner. At this time, the cover drives the cleaning frame to slide on the inner wall of the ultrasonic cleaner and drives the pressing frame to flexibly press the wafer cassette containing the wafers.

[0025] S9. Spin-drying: Start the drive motor, drive the fixed rod, and drive the placement rack to rotate under the flexible limit of the smooth surface of the pressing rack, so that the wafer box containing the wafer rotates accordingly, thereby achieving the spin-drying of the wafer.

[0026] S10. Drying: Start the hot air blower. After the air passes through the filter holes, it is heated. Then, the heated air is delivered to the ultrasonic cleaner to dry the wafer.

[0027] S11. Remove the wafer: Open the sealed cover and remove the processed wafer cassette containing the wafer.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] (1) The present invention moves by manually pulling the closed cover, and in conjunction with the drive motor, vibration motor and ultrasonic cleaner, it achieves the effect of cleaning, spin drying and drying in one piece, without the need for manual transfer, shortening the processing time and thus improving the working efficiency of the integrated equipment.

[0030] (2) The present invention moves the closed cover by pulling it manually, so that the fixed block, connecting frame, driving block, cleaning frame and closed cover work together to achieve the scraping and cleaning effect. No manual cleaning is required, which reduces the complexity of operation and improves the convenience of use, thereby improving the ease of use of the integrated equipment.

[0031] (3) The present invention moves the closed cover by pulling it manually, so that the stabilizing groove, stabilizing frame, second spring, pressing frame and closed cover work together to achieve the effect of flexible pressing. This not only maintains the stability of the wafer box, but also provides a certain buffer when starting up, so as to avoid the wafer box from shifting position during spin drying, thereby improving the stability of the integrated equipment. Attached Figure Description

[0032] Figure 1 This is an overall structural diagram of the present invention;

[0033] Figure 2 This is a front sectional view of the frame of the present invention;

[0034] Figure 3 This is a side sectional view of the frame of the present invention;

[0035] Figure 4 For the present invention Figure 3 Enlarged view of the structure of section A in the middle;

[0036] Figure 5 For the present invention Figure 3 Enlarged view of the structure of section B in the middle;

[0037] Figure 6 This is a partial structural diagram of the present invention.

[0038] In the diagram: 1. Frame; 2. First pipe; 3. Second pipe; 4. Third pipe; 5. Ultrasonic cleaner; 6. Drive motor; 7. Fixing rod; 8. Placement rack; 9. Through groove; 10. Slide groove; 11. Slide plate; 12. First spring; 13. Support rod; 14. Tray; 15. Vibration motor; 16. Sealing cover; 17. Filter hole; 18. Hot air blower; 19. Fixing block; 20. Connecting frame; 21. Driving block; 22. Cleaning rack; 23. Stabilizing tank; 24. Stabilizing frame; 25. Second spring; 26. Pressing frame; 27. Drain pipe; 28. Control valve. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figure 1-6 As shown, this embodiment provides an integrated automatic wafer cleaning and drying equipment, including a frame 1. From left to right, the upper end of the frame 1 is provided with a first pipe 2, a second pipe 3, and a third pipe 4. An ultrasonic cleaner 5 is provided in the middle of the frame 1. A drive motor 6 is fixed in the middle of the frame 1. A fixing rod 7 is fixed to the drive end of the drive motor 6. A placement frame 8 is fixed to the upper end of the fixing rod 7. Several through grooves 9 are opened in the middle of the placement frame 8. Sliding grooves 10 are opened on both sides of the placement frame 8. Sliding discs 11 are slidably connected to the inner walls of the two sliding grooves 10. A first spring 12 is fixed to both sides of each sliding disc 11. A support rod 13 is fixed to the upper end of each sliding disc 11. A tray 14 is fixed to the upper end of the two support rods 13. A vibration motor 15 is fixed in the middle of the tray 14. A sealing cover 16 is slidably connected to the middle of the upper end of the frame 1. Several filter holes 17 are opened in the middle of the sealing cover 16. A hot air blower 18 is provided in the middle of the sealing cover 16.

[0041] In this embodiment, a drain pipe 27 is provided on one side of the ultrasonic cleaner 5, and a control valve 28 is provided on the side of the drain pipe 27 away from the ultrasonic cleaner 5. A fixing rod 7 passes through the middle of the ultrasonic cleaner 5, and the upper end of the fixing rod 7 is fixed to the middle of the lower end of the placement frame 8. The placement frame 8 is set inside the ultrasonic cleaner 5. The outer surfaces of two sliding plates 11 are slidably connected to the inner walls of two sliding grooves 10. The near ends of every two adjacent first springs 12 are fixed to both sides of one of the sliding plates 11, and the far ends of every two adjacent first springs 12 are fixed to the inner walls of both ends of one of the sliding grooves 10. Each support rod 13 passes through the middle of each sliding groove 10, and one end of each support rod 13 is fixed to one side of the tray 14. The outer surface of the tray 14 is slidably connected to the inner wall of the placement frame 8. The outer surface of the sealing cover 16 is slidably connected to the inner wall of the middle part of the frame 1. The outer surface of the sealing cover 16 is slidably connected to the upper surface of the ultrasonic cleaner 5. Several filter holes 17 pass through the middle of the sealing cover 16. A hot air blower 18 is set in the middle of the upper side of the sealing cover 16. Figure 1-6 As shown.

[0042] The specific implementation process is as follows: First, the wafer cassette containing the wafers is placed on the tray 14 of the rack 8 inside the ultrasonic cleaner 5. Next, hydrofluoric acid is injected into the ultrasonic cleaner 5 through the first pipe 2, immersing the wafers in it. After immersion, the control valve 28 is opened, and the hydrofluoric acid is discharged through the drain pipe 27, then the control valve 28 is closed. Then, cold water is injected into the ultrasonic cleaner 5 through the second pipe 3 to rinse the wafers. After rinsing, the control valve 28 is opened again, and the cold water is discharged through the drain pipe 27, then the control valve 28 is closed. Next, hot water is injected into the ultrasonic cleaner 5 through the third pipe 4, and the vibration motor 15 is started simultaneously to drive the tray 14 to vibrate. The vibrating tray 14 moves the two support rods 13 fixed to it, and the moving support rods 13 drive the sliding plate 11 fixed at the other end to slide in the slide groove 10, compressing or stretching the two connected first springs 12 to ensure the normal vibration operation of the tray 14 for cleaning the wafers. During this process, the ultrasonic cleaner 5 is started, and ultrasonic waves are transmitted to the cleaning fluid through the transducer, generating a cavitation effect. Cavitation bubbles in the cleaning fluid continuously grow and close, impacting the wafer surface, peeling off attached impurities, and performing ultrasonic treatment on the wafer. After treatment, control valve 28 is opened to discharge hot water through drain pipe 27, and control valve 28 is closed. Then, cold water is injected back into the ultrasonic cleaner 5 through the second pipe 3, and the ultrasonic cleaner 5 is started again to perform ultrasonic treatment on the wafer. After treatment, control valve 28 is opened to discharge cold water through drain pipe 27. Subsequently, cold water is injected back into the ultrasonic cleaner 5 through the second pipe 3 to rinse the wafer. After rinsing, control valve 28 is opened to discharge cold water through drain pipe 27.

[0043] Next, the sealing cover 16 is moved manually. Then, the drive motor 6 is started, driving the fixing rod 7, which in turn rotates the placement rack 8 under the flexible constraint of the smooth surface of the pressing frame 26, causing the wafer cassette containing the wafers to rotate accordingly, thus achieving wafer spin-drying. Finally, the hot air blower 18, located in the middle of the sealing cover 16, is started. The air, after being filtered through the filter holes 17, is heated and then delivered to the ultrasonic cleaner 5 to dry the wafers. Through this series of operations, the cleaning, spin-drying, and drying processes are integrated, eliminating the need for manual handling, shortening processing time, and thus improving the efficiency of the integrated equipment.

[0044] When using ultrasonic cleaning equipment to clean wafers, impurities on the wafer surface are washed off. However, these washed-off impurities tend to adhere to the inner wall of the ultrasonic cleaning equipment, requiring subsequent cleaning by staff. This not only causes inconvenience to staff but also reduces the ease of use of the integrated equipment.

[0045] Please see Figure 1-6 As shown, the closed cover 16 has connecting structures on both sides. The connecting structures include two fixing blocks 19. One end of each fixing block 19 is rotatably connected to a connecting frame 20. The other end of each connecting frame 20 is rotatably connected to a driving block 21. The other end of each driving block 21 is fixed to a cleaning frame 22. The upper ends of the two fixing blocks 19 are fixed to both sides of the closed cover 16. The lower ends of the two fixing blocks 19 are rotatably connected to the upper ends of the two connecting frames 20. The lower ends of the two connecting frames 20 are rotatably connected to the upper ends of the two driving blocks 21. The lower ends of the two driving blocks 21 are fixed to both sides of the upper end of the cleaning frame 22. The middle part of the cleaning frame 22 is hollowed out. The outer surface of the cleaning frame 22 is slidably connected to the inner wall of the ultrasonic cleaner 5.

[0046] The specific implementation process is as follows: The sealing cover 16 is moved manually, causing the two fixed blocks 19 on both sides of the sealing cover 16 to move synchronously. The two connecting frames 20, rotatably connected to the lower ends of the fixed blocks 19, move under the influence of the fixed blocks 19, which in turn drives the two driving blocks 21, rotatably connected to the lower ends of the connecting frames 20. Since a cleaning frame 22 is fixed to the lower end of the driving block 21, the movement of the driving block 21 causes the cleaning frame 22 to slide along the inner wall of the ultrasonic cleaner 5. When the sealing cover 16 slides to the middle of the ultrasonic cleaner 5, the cleaning frame 22 moves to the bottom of the inner wall of the ultrasonic cleaner 5 under the influence of the connecting frames 20. As the cleaning frame 22 continues to slide until it completely covers the inner wall of the ultrasonic cleaner 5, the cleaning frame 22 slides from the bottom to the top of the inner wall of the ultrasonic cleaner 5. During the sliding process, the cleaning frame 22 can scrape off impurities attached to the inner wall, achieving a scraping and cleaning effect. This eliminates the need for manual cleaning by staff, reducing operational complexity and improving ease of use, thereby enhancing the usability of the integrated equipment.

[0047] When mounting the wafer cassette onto the integrated equipment, a rigid connection is required using clamps. However, due to the lack of a buffer structure after the wafer cassette is connected, the clamps are prone to positional displacement due to stress concentration during the spin-drying process, causing the wafer cassette to wobble and thus affecting the stability of the integrated equipment.

[0048] Please see Figure 1-6 As shown, the outer surface of the sealing cover 16 is slidably connected to the inner wall of the middle part of the frame 1, and the outer surface of the sealing cover 16 is slidably connected to the upper surface of the ultrasonic cleaner 5. Several filter holes 17 pass through the middle of the sealing cover 16. The hot air fan 18 is set in the middle of the upper side of the sealing cover 16. Two stabilizing grooves 23 are opened on the lower side of the sealing cover 16. The inner walls of the two stabilizing grooves 23 are slidably connected to the stabilizing frame 24. The second springs 25 are fixed on both sides of the stabilizing frame 24. The lower end of the stabilizing frame 24 is fixed to the pressing frame 26. The outer surface of the stabilizing frame 24 is slidably connected to the inner wall of the two stabilizing grooves 23. The upper ends of the two second springs 25 are fixed to the upper inner walls of the two stabilizing grooves 23, and the lower ends of the two second springs 25 are fixed to both sides of the stabilizing frame 24.

[0049] The specific implementation process is as follows: The sealing cover 16 is moved by manual pulling. Since the sealing cover 16 has a stabilizing groove 23 on its lower side, and the stabilizing frame 24 is slidably connected to the inner wall of the stabilizing groove 23, the movement of the sealing cover 16 will drive the stabilizing frame 24 to move. A pressing frame 26 is fixed to the lower end of the stabilizing frame 24, so when the stabilizing frame 24 moves, the pressing frame 26 will also move accordingly. When the pressing frame 26 moves to the upper side of the ultrasonic cleaner 5, its arc-shaped surface will press the wafer cassette placed on the tray 14. Under the reaction force of the wafer cassette, the pressing frame 26 will drive the stabilizing frame 24 to move upward along the inner wall of the stabilizing groove 23. The two ends of the stabilizing frame 24 are fixed with second springs 25. The upward movement of the stabilizing frame 24 will compress the second springs 25, thereby generating elastic force. This elastic force will react on the pressing frame 26, pressing it tightly onto the wafer cassette. It is worth noting that the surface of the pressing frame 26 is extremely smooth. Although it can press the wafer cassette tightly, it can still rotate normally during the spin-drying process without any impact. Furthermore, the size of the placement rack 8 matches the size of the wafer cassette when placed, preventing wobbling during rotation. Together with the pressing rack 26, it can flexibly press the wafer cassette, achieving a flexible pressing effect that not only maintains the stability of the wafer cassette but also provides a certain buffer during startup, preventing the wafer cassette from shifting position during spin drying, thereby improving the stability of the integrated equipment.

[0050] An automated wafer cleaning and drying method includes the following steps:

[0051] S1. Wafer placement: Place the wafer cassette containing the wafers on the tray 14 of the placement rack 8 inside the ultrasonic cleaner 5.

[0052] S2, Hydrofluoric acid immersion: Hydrofluoric acid is injected into the ultrasonic cleaner 5 through the first pipe 2 to immerse the wafer in it. After immersion, the control valve 28 is opened to discharge the hydrofluoric acid through the drain pipe 27, and then the control valve 28 is closed.

[0053] S3, Cold water rinse: Cold water is injected into the ultrasonic cleaner 5 through the second pipe 3 to rinse the wafer. After rinsing, the control valve 28 is opened and the cold water is discharged through the drain pipe 27. Then the control valve 28 is closed.

[0054] S4. Hot water oscillation: Hot water is injected into the ultrasonic cleaner 5 through the third pipe 4, and the vibration motor 15 is started at the same time to drive the tray 14 to oscillate and clean the wafer.

[0055] S5. Hot water ultrasonic treatment: Start the ultrasonic cleaner 5 to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve 28 to discharge hot water through the drain pipe 27, and then close the control valve 28.

[0056] S6, Cold water ultrasonic: Cold water is injected into the ultrasonic cleaner 5 through the second pipe 3, the ultrasonic cleaner 5 is started, and the wafer is ultrasonically treated. After the treatment is completed, the control valve 28 is opened and the cold water is discharged through the drain pipe 27.

[0057] S7. Secondary cold water rinse: Cold water is injected into the ultrasonic cleaner 5 again through the second pipe 3 to rinse the wafer. After rinsing, the control valve 28 is opened and the cold water is discharged through the drain pipe 27.

[0058] S8. Closing cover 16: By pulling the closing cover 16, it covers the ultrasonic cleaner 5. At this time, the closing cover 16 drives the cleaning frame 22 to slide on the inner wall of the ultrasonic cleaner 5, and drives the pressing frame 26 to flexibly press the wafer cassette containing the wafers.

[0059] S9. Spin-drying: Start the drive motor 6, drive the fixing rod 7, and drive the placement rack 8 to rotate under the flexible limit of the smooth surface of the pressing rack 26, so that the wafer box containing the wafer rotates accordingly, and realizes the spin-drying of the wafer.

[0060] S10. Drying: Start the hot air blower 18. After the air is filtered through the filter hole 17, it is heated. Then, the heated hot air is delivered to the ultrasonic cleaner 5 to dry the wafer.

[0061] S11. Remove the wafer: Open the sealing cover 16 and remove the processed wafer cassette containing the wafer.

[0062] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer automatic cleaning and drying integrated equipment, comprising a frame (1), characterized in that: The upper part of the frame (1) is provided with a first pipe (2), a second pipe (3) and a third pipe (4) from left to right. An ultrasonic cleaner (5) is provided in the middle of the frame (1). A drive motor (6) is fixed in the middle of the frame (1). A fixing rod (7) is fixed at the drive end of the drive motor (6). A placement frame (8) is fixed at the upper end of the fixing rod (7). Several through slots (9) are opened in the middle of the placement frame (8). Sliding grooves (10) are opened on both sides of the placement frame (8). The two sliding grooves (10) are located inside the sliding grooves (10). The wall is slidably connected with a sliding plate (11), and a first spring (12) is fixed on both sides of each sliding plate (11). A support rod (13) is fixed at the upper end of each of the two sliding plates (11), and a tray (14) is fixed at the upper end of the two support rods (13). A vibration motor (15) is fixed in the middle of the tray (14). A closed cover (16) is slidably connected to the middle of the upper end of the frame (1). Several filter holes (17) are opened in the middle of the closed cover (16), and a hot air blower (18) is provided in the middle of the closed cover (16). The closed cover (16) has a connecting structure on both sides, and a cleaning rack (22) is provided on the connecting structure. The connecting structure can slide along the height of the inner wall of the ultrasonic cleaner (5) with the cleaning rack (22) to scrape and clean the impurities attached to the inner wall of the ultrasonic cleaner (5).

2. The integrated automatic wafer cleaning and drying equipment according to claim 1, characterized in that: The connection structure includes two fixed blocks (19), one end of each fixed block (19) is rotatably connected to a connecting frame (20), the other end of each connecting frame (20) is rotatably connected to a driving block (21), and the other end of each driving block (21) is fixed to a cleaning frame (22).

3. The integrated automatic wafer cleaning and drying equipment according to claim 2, characterized in that: The upper ends of the two fixing blocks (19) are fixed to both sides of the closed cover (16), the lower ends of the two fixing blocks (19) are rotatably connected to the upper ends of the two connecting frames (20), and the lower ends of the two connecting frames (20) are rotatably connected to the upper ends of the two driving blocks (21).

4. The integrated automatic wafer cleaning and drying equipment according to claim 3, characterized in that: The lower ends of the two drive blocks (21) are fixed on both sides of the upper end of the cleaning frame (22). The middle part of the cleaning frame (22) is hollowed out. The outer surface of the cleaning frame (22) is slidably connected to the inner wall of the ultrasonic cleaner (5).

5. The integrated automatic wafer cleaning and drying equipment according to claim 4, characterized in that: The ultrasonic cleaner (5) is provided with a drain pipe (27) on one side, and a control valve (28) is provided on the side of the drain pipe (27) away from the ultrasonic cleaner (5). The fixing rod (7) passes through the middle of the ultrasonic cleaner (5). The upper end of the fixing rod (7) is fixed to the middle of the lower end of the placement frame (8). The placement frame (8) is set inside the ultrasonic cleaner (5). The outer surfaces of the two sliding plates (11) are slidably connected to the inner walls of the two sliding grooves (10). The near ends of each pair of adjacent first springs (12) are fixed to both sides of one of the sliding plates (11). The far ends of each pair of adjacent first springs (12) are fixed to the inner walls of both ends of one of the sliding grooves (10). Each support rod (13) passes through the middle of each sliding groove (10). One end of each support rod (13) is fixed to one side of the tray (14). The outer surface of the tray (14) is slidably connected to the inner wall of the placement frame (8).

6. The integrated automatic wafer cleaning and drying equipment according to claim 5, characterized in that: The outer surface of the closed cover (16) is slidably connected to the inner wall of the middle part of the frame (1), and the outer surface of the closed cover (16) is slidably connected to the upper surface of the ultrasonic cleaner (5). Several filter holes (17) penetrate the middle part of the closed cover (16), and the hot air blower (18) is set in the middle of the upper side of the closed cover (16).

7. The integrated automatic wafer cleaning and drying equipment according to claim 6, characterized in that: Two stabilizing grooves (23) are provided on the lower side of the closed cover (16). A stabilizing frame (24) is slidably connected to the inner wall of the two stabilizing grooves (23). A second spring (25) is fixed on both sides of the stabilizing frame (24). A pressing frame (26) is fixed at the lower end of the stabilizing frame (24).

8. The integrated automatic wafer cleaning and drying equipment according to claim 7, characterized in that: The outer surface of the stabilizer (24) is slidably connected to the inner wall of the two stabilizer slots (23), the upper ends of the two second springs (25) are fixed to the upper inner wall of the two stabilizer slots (23), and the lower ends of the two second springs (25) are fixed to both sides of the stabilizer (24).

9. The integrated automatic wafer cleaning and drying equipment according to claim 8, characterized in that: The lower end of the stabilizer (24) is fixed to the middle of the upper side of the pressing frame (26). The vertical section of the stabilizer (24) is T-shaped, and the vertical section of the pressing frame (26) is arc-shaped. The outer surface of the pressing frame (26) is in contact with the outer surfaces of the frame (1), the ultrasonic cleaner (5), and the placement frame (8).

10. An automated wafer cleaning and drying method, employing the integrated automated wafer cleaning and drying equipment as described in claim 9, characterized in that, Includes the following steps: S1. Wafer placement: Place the wafer box containing the wafer on the tray (14) of the placement rack (8) inside the ultrasonic cleaner (5); S2, Hydrofluoric acid immersion: Hydrofluoric acid is injected into the ultrasonic cleaner (5) through the first pipe (2) to immerse the wafer in it. After immersion, the control valve (28) is opened and the hydrofluoric acid is discharged through the drain pipe (27). Then the control valve (28) is closed. S3, Cold water rinse: Cold water is injected into the ultrasonic cleaner (5) through the second pipe (3) to rinse the wafer. After rinsing, the control valve (28) is opened and the cold water is discharged through the drain pipe (27). Then the control valve (28) is closed. S4, Hot water oscillation: Hot water is injected into the ultrasonic cleaner (5) through the third pipe (4), and the vibration motor (15) is started at the same time to drive the tray (14) to oscillate and clean the wafer; S5. Hot water ultrasonic treatment: Start the ultrasonic cleaner (5) to perform ultrasonic treatment on the wafer. After the treatment is completed, open the control valve (28) to discharge hot water through the drain pipe (27), and then close the control valve (28). S6, Cold water ultrasound: Inject cold water into the ultrasonic cleaner (5) through the second pipe (3), start the ultrasonic cleaner (5), perform ultrasonic treatment on the wafer, and after the treatment is completed, open the control valve (28) and discharge the cold water through the drain pipe (27); S7. Secondary cold water rinse: Cold water is injected into the ultrasonic cleaner (5) again through the second pipe (3) to rinse the wafer. After rinsing, the control valve (28) is opened and the cold water is discharged through the drain pipe (27). S8. Closing the cover (16): By pulling the cover (16), it covers the ultrasonic cleaner (5). At this time, the cover (16) drives the cleaning frame (22) to slide on the inner wall of the ultrasonic cleaner (5) and drives the pressing frame (26) to flexibly press the wafer box containing the wafer. S9, Spin-drying: Start the drive motor (6), drive the fixing rod (7), and drive the placement rack (8) to rotate under the flexible limit of the smooth surface of the pressing rack (26), so that the wafer box containing the wafer rotates accordingly, and the wafer is spin-dried. S10. Drying: Start the hot air blower (18). After the air passes through the filter hole (17), it is heated. Then, the heated hot air is delivered to the ultrasonic cleaner (5) to dry the wafer. S11. Take out the wafer: Open the closed cover (16) and take out the wafer box containing the processed wafer.

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