Display panel and its manufacturing method, display device

Abstract

This disclosure provides a display panel and its fabrication method, as well as a display device. The display panel includes a substrate, an isolation structure located on the substrate, and a plurality of light-emitting devices. The isolation structure is located on the substrate and encloses a plurality of isolation openings. Each light-emitting device corresponds to one of the isolation openings, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located within the corresponding isolation opening. These light-emitting devices include first-type light-emitting devices and second-type light-emitting devices, which emit different colors of light. The first portion of the first electrode of the first-type light-emitting device and the first portion of the first electrode of the second-type light-emitting device have different thicknesses. This structure of the display panel can ensure the quality of the fabricated light-emitting devices.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as simple fabrication process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and the ability to realize flexible displays.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant aspects of fine metal mask-less technology and are provided for reference.

[0004] However, the display performance of current OLED display products needs to be improved. Summary of the Invention

[0005] The first aspect of this disclosure provides a method for fabricating a display panel, the method comprising: providing a substrate and forming a plurality of spaced-apart first electrodes on the substrate; forming an isolation structure having a plurality of isolation openings on the substrate having the first electrodes; depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation openings, wherein portions of the light-emitting material thin film and the conductive material thin film located in the isolation openings respectively form a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other form a light-emitting device; depositing an encapsulation material film layer to cover the isolation structure and the light-emitting device; forming a photoresist layer on the encapsulation material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, the photoresist pattern covering a portion of the isolation openings, the isolation openings covered by the photoresist pattern being target isolation openings; and dry etching the encapsulation material film layer based on the photoresist pattern, wherein portions of the encapsulation material film layer not covered by the photoresist pattern are removed. Except for the remaining portion of the encapsulation material film layer, which forms an encapsulation unit covering the target isolation opening; a stripping process is performed to remove etching residues, photoresist patterns, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the encapsulation unit from the encapsulation material film layer, in which the second electrode is retained in the isolation opening not covered by the encapsulation unit; wet etching is performed to remove the second electrode not covered by the encapsulation unit, wherein at least a portion of the surface of the first electrode facing away from the substrate is etched in the isolation opening not covered by the encapsulation unit, the etched portion of the first electrode is the first portion, and the first portion is located in the light-emitting area of ​​the light-emitting device; the above process is repeated to form a light-emitting device and an encapsulation unit at the isolation opening where no light-emitting device is formed, all encapsulation units forming a first encapsulation layer, wherein the light-emitting devices formed in different batches have different light-emitting colors, and the first electrode of the light-emitting devices with different light-emitting colors has at least a portion corresponding to the isolation opening wet-etched a different number of times to have different thicknesses.

[0006] In the process of batch fabricating light-emitting devices based on isolation structures, if a wet etching process is performed directly after the aforementioned dry etching process of the encapsulation material film layer, the etching residues present in the dry etching process may adversely affect the wet etching process, resulting in incomplete etching of the film structure in the isolation openings (other isolation openings besides the target isolation opening), thereby affecting the quality of the light-emitting devices subsequently formed ("formed by repeating the above process"). In the process disclosed herein, after the dry etching process of the encapsulation material film layer is performed, a stripping process is first performed to remove exposed organic materials and clean the residues from the dry etching process. The organic materials include residual photoresist patterns and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the encapsulation unit. In the process of fabricating light-emitting devices based on isolation structures, the second electrode of the light-emitting device does not completely cover the light-emitting functional layer in some areas, allowing the stripping solution of the stripping process to etch the light-emitting functional layer. Thus, because the surface of the display panel has been cleaned by the stripping process, the quality of the subsequent wet etching process can be improved. It should be noted that due to the adjustment of the above-mentioned process sequence, in the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. Thus, apart from the first batch of light-emitting devices, the later the light-emitting device is formed, the more wet etching processes the first electrode undergoes, resulting in a greater degree of etching. Consequently, at least a portion of the first electrode of light-emitting devices with different light-emitting colors, corresponding to the isolation opening, will have different thicknesses.

[0007] In one specific embodiment of the first aspect of this disclosure, a plurality of light-emitting devices include a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device emit different light colors, and are fabricated sequentially in batches. The surface of the first electrode of the second type of light-emitting device facing away from the substrate is wet-etched at least once, and the surface of the first electrode of the third type of light-emitting device facing away from the substrate is wet-etched at least twice, such that the thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device, and the thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device.

[0008] In the above scheme, after the first type of light-emitting device is fabricated, no impurities remain in the isolation opening corresponding to the second type of light-emitting device (at which time the second type of light-emitting device has not yet been formed), thereby ensuring the fabrication quality of the second type of light-emitting device. During this process, the surfaces of the first electrodes of the second type of light-emitting device and the third type of light-emitting device are partially etched. Similarly, after the second type of light-emitting device is fabricated, no impurities remain in the isolation opening corresponding to the third type of light-emitting device (at which time the third type of light-emitting device has not yet been formed), thereby ensuring the fabrication quality of the third type of light-emitting device. During this process, the surface of the first electrode of the third type of light-emitting device is partially etched again.

[0009] In one specific embodiment of the first aspect of this disclosure, the preparation method may further include: after forming the first electrode and before forming the isolation structure, forming a pixel defining material layer covering the first electrode on a substrate; after forming the isolation structure, patterning the pixel defining material layer to form a pixel defining layer, the pixel defining layer being located between the isolation structure and the substrate and having a plurality of pixel openings formed therein, the pixel openings corresponding to and communicating with the isolation openings, and the light-emitting functional layer and the second electrode of the light-emitting device being located in the corresponding isolation openings.

[0010] Optionally, the pixel defining layer is an inorganic film layer. In the process of fabricating light-emitting devices based on an isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, which is beneficial for the thinner design of the display panel. The thickness of the inorganic film layer is much smaller than that of the organic film layer, thus meeting the thickness requirements of the pixel defining layer for fabricating light-emitting devices based on an isolation structure. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure and the first electrode, reducing the risk of the isolation structure and the first electrode detaching. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0011] In one specific embodiment of the first aspect of this disclosure, the orthographic projection of the pixel opening onto the substrate lies within the orthographic projection of the first electrode onto the substrate. For the wet-etched first electrode, the area of ​​the first electrode facing away from the substrate that is exposed by the pixel opening is etched to make the thickness of the first portion corresponding to the pixel opening in the first electrode of the light-emitting device that produces different light colors different different. The edge portion of the first electrode is covered by the pixel defining layer and is therefore not affected by the wet etching, thus resulting in a difference in thickness between the middle portion (the first portion corresponding to the pixel opening) and the edge portion of the etched first electrode.

[0012] In one specific embodiment of the first aspect of this disclosure, in the first batch of light-emitting devices formed, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In light-emitting devices not formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For the light-emitting devices formed in the first batch, when subjected to wet etching, the light-emitting device is covered by the packaging unit and is therefore not affected by wet etching; thus, the thickness of each portion of the first electrode is the same.

[0013] In one specific embodiment of the first aspect of this disclosure, the isolation structure includes a support portion and a crown portion, with the support portion located between the crown portion and a substrate. The orthographic projection of the end of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate. The edge of the crown portion is the edge of the isolation opening. The support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion. Thus, the size of the crown portion is larger than the top size of the support portion to ensure the isolation effect of the isolation structure on the film layer of the light-emitting device. Furthermore, this arrangement can limit the evaporation angle of the film layer of the light-emitting device during evaporation, thereby reducing the overlap area between the light-emitting functional layer and the isolation structure or avoiding overlap between the light-emitting functional layer and the isolation structure while ensuring that the second electrode can overlap with the isolation structure, thereby reducing the occurrence of cross-current crosstalk problems.

[0014] In one specific embodiment of the first aspect of this disclosure, the isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction.

[0015] The steps for depositing luminescent and conductive thin films may include: moving a deposition source and a display panel relative to each other along a second direction to deposit the luminescent and conductive thin films, such that after forming the luminescent functional layer and the second electrode, at the first and / or second side edges, the edges of the luminescent functional layer are covered by the second electrode, and at the third and fourth side edges, at least a portion of the side surface of the edge of the luminescent functional layer is not covered by the second electrode. Thus, in the direction perpendicular to the movement direction of the deposition source (from the third to the fourth side) (from the first to the second side), the deposition range of the material radiated by the deposition source is larger (the deposition angle is larger), making it easier for the material to accumulate below the crown; that is, at the first and second side edges, the edges of the deposited film layer are more easily deposited on the side surface of the support. Conversely, in the movement direction of the deposition source (from the third to the fourth side), i.e., at the third and fourth side edges, the edges of the deposited film layer are difficult to deposit on the side surface of the support. Thus, during actual vapor deposition, the second electrode may not be able to cover the side surface of the light-emitting functional layer at the third and fourth sides, or the film quality of the covered portion may be poor. As a result, during the stripping process, the stripping solution may easily penetrate under the second electrode at this location to etch the light-emitting functional layer and remove at least a portion of it.

[0016] The steps of performing a stripping process to remove etching residues, photoresist patterns, and at least a portion of the light-emitting functional layer in a light-emitting device not covered by the package unit may include: in an isolation opening not covered by the package unit, a stripping solution used in the stripping process enters between the second electrode and the first electrode from at least a third and a fourth side to remove the light-emitting functional layer, wherein after at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode settles onto the first electrode. In the stripping process, the second electrode is difficult to etch, while the light-emitting functional layer beneath the second electrode is etched away. Therefore, the second electrode settles directly and contacts the first electrode. Consequently, in a subsequent wet etching process of the second electrode, to ensure complete etching of the second electrode, the surface of the first electrode will inevitably be etched.

[0017] Optionally, the distance between the orthographic projections of the first and second sides onto the substrate is smaller than the distance between the orthographic projections of the third and fourth sides onto the substrate. For example, the lengths of the first and second sides are greater than the lengths of the third and fourth sides. Thus, the first and second sides are actually the longer sides of the isolation opening. Furthermore, in conjunction with the aforementioned description, when fabricating the second electrode, the vapor-deposited material is more easily deposited at the first and second sides, resulting in a relatively low impedance between the second electrode and the isolation structure.

[0018] Optionally, the stripping solution used in the stripping process is alkaline, while the solution used in the wet etching process is acidic.

[0019] Optionally, prior to performing the stripping process, at least a portion of the etching residue of the encapsulation material film is attached to the sidewall of the isolation structure facing the isolation opening in the isolation openings other than the target isolation opening, and the etching residue of the encapsulation material film is acid-resistant.

[0020] Optionally, the etching residue of the encapsulation material film layer is more resistant to corrosion by the wet etching solution than the etching residue of the encapsulation material film layer is resistant to corrosion by the stripping solution used in the stripping process.

[0021] In one specific embodiment of the first aspect of this disclosure, the fabrication method may further include: after performing wet etching to remove the second electrode not covered by the packaging unit, performing a stripping process to remove etching residues located in the isolation opening. This further removes any residues that may be present in the isolation opening after the wet etching process, ensuring the quality of the light-emitting device formed in subsequent processes.

[0022] A second aspect of this disclosure provides a method for fabricating a display panel. The method includes: providing a substrate and forming a plurality of spaced-apart first electrodes on the substrate; forming an isolation structure with a plurality of isolation openings on the substrate where the first electrodes are formed, and depositing a light-emitting material thin film, a conductive material thin film, and an encapsulation material film layer, wherein the plurality of isolation openings include first isolation openings and second isolation openings, portions of the light-emitting material thin film and the conductive material thin film located in the first isolation openings respectively form a light-emitting functional layer and a second electrode, and the first electrodes, the light-emitting functional layer, and the second electrode stacked on top of each other form a first type of light-emitting device; forming a photoresist layer on the encapsulation material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern. A photoresist pattern covers a first isolation opening, and the photoresist pattern exposes a second isolation opening. Based on the photoresist pattern, a dry etching process is performed to remove the encapsulation material film at the second isolation opening, while retaining the encapsulation material film at the first isolation opening. A stripping process is then performed to remove the photoresist pattern, etching residues of the encapsulation material film at the second isolation opening, and at least a portion of the light-emitting material film at the second isolation opening, while the second electrode at the second isolation opening remains. A wet etching process is then performed to remove the conductive material film at the second isolation opening, wherein at least a portion of the surface of the first electrode at the second isolation opening facing away from the substrate is etched. At least a portion of the film layer for a second type of light-emitting device is formed at the second isolation opening.

[0023] This disclosure provides a display panel comprising a substrate, an isolation structure, and a plurality of light-emitting devices located on the substrate. The isolation structure is located on the substrate and encloses a plurality of isolation openings. Each light-emitting device corresponds to one of the isolation openings, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate in a direction away from the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located within the corresponding isolation opening. The first electrode includes a first portion located in the light-emitting region of the light-emitting device. The plurality of light-emitting devices include a first type of light-emitting device and a second type of light-emitting device, the first type of light-emitting device and the second type of light-emitting device emitting different colors of light. The first portion of the first electrode of the first type of light-emitting device and the first portion of the first electrode of the second type of light-emitting device have different thicknesses. In the fabrication process of this display panel, light-emitting devices emitting different colors of light (e.g., first type of light-emitting device and second type of light-emitting device) can be fabricated in batches based on the isolation structure. In the fabrication process of each batch of light-emitting devices, a portion of the film layer of the light-emitting device of the same color is formed integrally on the entire display panel. Then, a portion of these film layers is selectively removed by processes such as etching, thereby obtaining the light-emitting device that needs to be retained in the end. In the entire fabrication process of these light-emitting devices, dry etching is performed first, followed by a stripping process before the wet etching process (etching the film layer corresponding to the second electrode). This removes exposed organic materials and cleans the residue from the dry etching, including at least a portion of the light-emitting functional layer to be etched. This stripping process cleans the surface of the display panel, improving the quality of the subsequent wet etching process and ensuring the quality of light-emitting devices of other colors subsequently fabricated. It should be noted that due to the specific process sequence, in the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution etches the surface of the first electrode to a certain extent during the etching of the second electrode. Thus, except for the first batch of light-emitting devices (e.g., the first type of light-emitting device), the later the light-emitting device is formed (e.g., the second type of light-emitting device), the more wet etching processes are performed on the first electrode, resulting in a greater degree of etching. This leads to different thicknesses in the first electrode of light-emitting devices emitting different colors, corresponding to at least the portion with the isolation opening.

[0024] In one specific embodiment of the third aspect of this disclosure, the plurality of light-emitting devices further includes a third type of light-emitting device, and the first, second, and third types of light-emitting devices emit different colors of light. The thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device. The thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device. In the fabrication process corresponding to this display panel, after the first type of light-emitting device is fabricated, no impurities remain in the isolation opening corresponding to the second type of light-emitting device (at which point the second type of light-emitting device has not yet been formed), thereby ensuring the fabrication quality of the second type of light-emitting device. During this process, the surfaces of the first electrodes of the second and third types of light-emitting devices are partially etched; similarly, after the second type of light-emitting device is fabricated, no impurities remain in the isolation opening corresponding to the third type of light-emitting device (at which point the third type of light-emitting device has not yet been formed), thereby ensuring the fabrication quality of the third type of light-emitting device. During this process, the surface of the first electrode of the third type of light-emitting device is again partially etched.

[0025] In one specific embodiment of the third aspect of this disclosure, the display panel may further include a pixel defining layer, which is located between the isolation structure and the substrate and includes pixel openings corresponding to the isolation openings. The pixel openings are connected to the corresponding isolation openings, and at least a portion of the light-emitting functional layer and at least a portion of the second electrode of the light-emitting device are located in the corresponding pixel openings. The orthographic projection of the pixel openings on the substrate overlaps with the orthographic projection of the first portion on the substrate.

[0026] Optionally, the orthographic projection of the pixel opening on the substrate coincides with the orthographic projection of the first portion on the substrate.

[0027] Optionally, the pixel defining layer is an inorganic film layer. In the process of fabricating light-emitting devices based on an isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, which is beneficial for the thinner design of the display panel. The thickness of the inorganic film layer is much smaller than that of the organic film layer, thus meeting the thickness requirements of the pixel defining layer for fabricating light-emitting devices based on an isolation structure. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure and the first electrode, reducing the risk of the isolation structure and the first electrode detaching. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0028] In one specific embodiment of the third aspect of this disclosure, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and the thickness of the first electrode of the light-emitting device with different light-emitting colors is different from that of the first portion exposed by the pixel opening.

[0029] In one specific embodiment of the third aspect of this disclosure, for a second type of light-emitting device, the surface of the first electrode opposite to the substrate has a groove, and the orthographic projection of the groove on the substrate coincides with the orthographic projection of the pixel opening on the substrate. For a first type of light-emitting device, the surface of the first electrode opposite to the substrate is a plane in the light-emitting area of ​​the first type of light-emitting device, and the orthographic projection of the light-emitting area on the substrate coincides with the orthographic projection of the pixel opening on the substrate.

[0030] Optionally, for the third type of light-emitting device, the surface of the first electrode opposite to the substrate has a groove, and the orthographic projection of the groove on the substrate coincides with the orthographic projection of the pixel opening on the substrate.

[0031] Optionally, the depth of the groove in the first electrode of the second type of light-emitting device is less than the depth of the groove in the first electrode of the third type of light-emitting device. The first electrode includes a first film layer, a second film layer, and a third film layer sequentially stacked in a direction away from the substrate. The thickness of the third film layer in the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the third film layer in the first portion of the first electrode of the second type of light-emitting device. The thickness of the third film layer in the first portion of the first electrode of the second type of light-emitting device is also greater than the thickness of the third film layer in the first portion of the first electrode of the third type of light-emitting device.

[0032] Optionally, the first film layer includes an indium tin oxide film, the second film layer includes silver, and the third film layer includes an indium tin oxide film.

[0033] In one specific embodiment of the third aspect of this disclosure, the orthographic projection of the pixel opening onto the substrate lies within the orthographic projection of the first electrode onto the substrate. The edge portion (second portion) of the first electrode is covered by the pixel defining layer, thereby avoiding the effects of wet etching, resulting in a difference in thickness between the etched middle portion (the first portion corresponding to the pixel opening) and the edge portion of the first electrode.

[0034] In one specific embodiment of the third aspect of this disclosure, in a first type of light-emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In the second and third types of light-emitting devices, the thickness of the second portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For the light-emitting devices formed in the first batch, when faced with wet etching, the light-emitting device is covered by the packaging unit and is therefore not affected by wet etching. Thus, the thickness of each portion of the first electrode is the same.

[0035] In one specific embodiment of the third aspect of this disclosure, the isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate. The orthographic projection of the end of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate. The edge of the crown portion is the edge of the isolation opening. Optionally, the support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion. Thus, the size of the crown portion is larger than the top size of the support portion to ensure the isolation effect of the isolation structure on the film layer of the light-emitting device. In addition, this arrangement can limit the evaporation angle of the film layer of the light-emitting device during evaporation, so as to ensure that the second electrode can overlap with the isolation structure while reducing the overlap area between the light-emitting functional layer and the isolation structure or avoiding the overlap between the light-emitting functional layer and the isolation structure, thereby reducing the occurrence of cross-current crosstalk problems.

[0036] Optionally, the isolation structure includes a bottom located between the support and the substrate, wherein the orthographic projection of the substrate-facing end of the support onto the substrate lies within the orthographic projection of the bottom onto the substrate. The bottom is a conductive structure, and the edge of the second electrode is connected to a portion of the bottom surface away from the substrate that is not covered by the support. The second electrode is more easily deposited on the substrate-facing surface area of ​​the bottom than on the sidewalls of the support, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0037] In one specific embodiment of the third aspect of this disclosure, the isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction. The climbing height of the edge of the second electrode on the side surface of the support where the first side and / or the second side is located is greater than the climbing height of the edge of the second electrode on the side surface of the support where the third side and the fourth side are located; or, at the first side and / or the second side, the edge of the second electrode extends to the side surface of the support, and at the third side and the fourth side, there is a gap between the edge of the second electrode and the support. In the vapor deposition process of the light-emitting functional layer and the second electrode of the light-emitting device, in the direction perpendicular to the moving direction of the vapor deposition source (from the third side to the fourth side) (from the first side to the second side), the vapor deposition range of the material radiated by the vapor deposition source is larger (the vapor deposition angle is larger), making it easier for the vapor deposition material to accumulate below the crown. That is, at the first and second sides, the edges of the vapor deposition film layer are more likely to be deposited on the side surface of the support. Conversely, in the moving direction of the vapor deposition source (from the third side to the fourth side), that is, at the third and fourth sides, the edges of the vapor deposition film layer are difficult to deposit on the side surface of the support. Thus, in actual vapor deposition, at the third and fourth sides, the second electrode is difficult to cover the side surface of the light-emitting functional layer, or the film quality of the covered portion is poor. Therefore, during the stripping process, the stripping solution easily penetrates under the second electrode at this location to etch the light-emitting functional layer, thereby removing at least a portion of the light-emitting functional layer.

[0038] Optionally, the climbing height of the edge of the second electrode on the side surface of the support at the location of the first side is greater than the climbing height of the edge of the second electrode on the side surface of the support at the location of the second side; or, at the first side, the edge of the second electrode extends to the side surface of the support, and at the second side, there is a gap between the edge of the second electrode and the support. By controlling the tilt direction of the display panel and the vapor deposition source, the vapor deposition material can exhibit different degrees of vapor deposition at the first and second sides, thereby enabling the second electrode to achieve unilateral overlap with the isolation structure at one of the first and second sides. Correspondingly, the degree of overlap between the second electrode and the isolation structure at the other of the first and second sides is limited or there is a gap. This method can ensure that at least one area between the second electrode and the isolation structure is necessarily overlapped and has high overlap quality, so as to ensure that there is a small impedance between the second electrode and the isolation structure.

[0039] In one specific embodiment of the third aspect of this disclosure, at the first and / or second side edges, the edges of the light-emitting functional layer are covered by the second electrode, while at the third and fourth side edges, at least a portion of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode. During the stripping process, although the second electrode is difficult to etch, at the third and fourth side edges, because the second electrode cannot completely cover the underlying light-emitting functional layer, the stripping solution can enter from the third and fourth side edges to etch the light-emitting functional layer beneath the second electrode.

[0040] In one specific embodiment of the third aspect of this disclosure, the distance between the orthographic projections of the first side and the second side onto the substrate is smaller than the distance between the orthographic projections of the third side and the fourth side onto the substrate. Thus, the first and second sides are actually the longer sides of the isolation opening, and in conjunction with the foregoing description, when fabricating the second electrode, the vapor-deposited material is more easily deposited at the first and second sides, thereby resulting in a relatively small impedance between the second electrode and the isolation structure.

[0041] In one specific embodiment of the third aspect of this disclosure, the display panel may further include a first encapsulation layer located on the side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer includes encapsulation units corresponding to the light-emitting devices, and the encapsulation units cover the isolation openings corresponding to the light-emitting devices to encapsulate the light-emitting devices. During the batch fabrication of light-emitting devices based on the isolation structure, the encapsulation units are fabricated synchronously with the light-emitting devices in batches, so that in the process of fabricating the next batch of light-emitting devices (in which etching is involved), the light-emitting devices can protect the already fabricated light-emitting devices.

[0042] Optionally, the edge of the packaging unit extends to the side of the isolation structure away from the substrate to overlap with the isolation structure, and the portion of the edge of the packaging unit that overlaps with the isolation structure is spaced apart from the isolation structure to form a suspended portion.

[0043] Optionally, the first encapsulation layer is an inorganic film layer.

[0044] Optionally, the packaging units corresponding to adjacent light-emitting devices with different light-emitting colors are spaced apart from each other.

[0045] This disclosure provides a fourth aspect of a display panel, which includes a substrate, an isolation structure located on the substrate, and a plurality of light-emitting devices. The isolation structure is located on the substrate and encloses a plurality of isolation openings. Each light-emitting device corresponds to one of the isolation openings, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate in a direction away from the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located within the corresponding isolation opening. The plurality of light-emitting devices include a first type of light-emitting device and a second type of light-emitting device, the first type of light-emitting device and the second type of light-emitting device emitting different colors. The surface of the first electrode of the first type of light-emitting device facing away from the substrate is planar in the light-emitting area of ​​the first type of light-emitting device, and the surface of the first electrode of the second type of light-emitting device facing away from the substrate has a groove in the light-emitting area of ​​the second type of light-emitting device.

[0046] Alternatively, multiple light-emitting devices may include a second type of light-emitting device and a third type of light-emitting device, wherein the emitted light colors of the second type of light-emitting device and the third type of light-emitting device are different; the surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of ​​the second type of light-emitting device; the surface of the first electrode of the third type of light-emitting device opposite to the substrate has a groove in the light-emitting area of ​​the third type of light-emitting device; the depth of the groove of the first electrode of the second type of light-emitting device is less than the depth of the groove of the first electrode of the third type of light-emitting device.

[0047] The fifth aspect of this disclosure provides a display device, which includes a display panel obtained by the preparation method of the first or second aspect described above, or a display panel as described in the third or fourth aspect described above. Attached Figure Description

[0048] Figure 1 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0049] Figure 2 This is a schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0050] Figure 3 for Figure 2 The image shows an enlarged view of area S1 of the display panel in one design.

[0051] Figure 4A for Figure 3 The diagram shows a cross-sectional view of the display panel along M1-N1.

[0052] Figure 4B for Figure 4A An enlarged view of the portion of the display panel shown by the dashed frame.

[0053] Figure 4C for Figure 4B An enlarged view of a portion of the structure of the S2 region of the display panel shown.

[0054] Figure 5A for Figure 2 and Figure 3 The diagram shows a planar structural schematic of a sub-pixel of the display panel.

[0055] Figure 5B for Figure 3 The image shown is a cross-sectional view of the display panel along M2-N2. The sub-pixels captured in this cross-sectional view are... Figure 5A The sub-pixel correspondences are shown.

[0056] Figure 5C for Figure 3 The diagram shows a cross-sectional view of the display panel along M1-N1 under another design, where the sub-pixels captured in this cross-sectional view are... Figure 4A Compare with the structures shown.

[0057] Figure 6 for Figure 3 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0058] Figure 7 for Figure 3 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0059] Figure 8 for Figure 3 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0060] Figure 9A This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0061] Figure 9B This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0062] Figures 10A to 10J An embodiment of this disclosure provides a method for forming such Figure 7 The diagram shows a process diagram of one method for manufacturing a display panel.

[0063] 10-Display panel; 11-Display area; 12-Border area;

[0064] 100 - Substrate; 200 - Light-emitting device; 210 - First electrode; 210a - First portion; 210b - Second portion; 2101 - First film layer; 2102 - Second film layer; 2103 - Third film layer; 211 - Groove; 220 - Light-emitting functional layer; 221 - First functional layer; 222 - Light-emitting layer; 223 - Second functional layer; 230 - Second electrode; 300 - Isolation structure; 301 - Isolation opening; 302 - Pixel opening; 301a - First side; 301b - Second side; 301c - Third side; 301d - Fourth side; 310 - Support portion; 310a - First material layer; 320 - Crown portion; 320a - Second material layer; 330 - Pixel defining layer; 330a - Pixel defining material layer; 340 - Bottom;

[0065] 400 - Packaging structure; 410 - First packaging layer; 410a - Packaging material film layer; 411 - Packaging unit; 4111 - Suspension portion; 420 - Second packaging layer; 430 - Third packaging layer;

[0066] 500 - Photoresist pattern; 500a - Filler film. Detailed Implementation

[0067] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0068] In some scenarios, functional layers in light-emitting devices are formed by vapor deposition. Each light-emitting device has multiple functional layers, and the material composition of some functional layers (such as the light-emitting layer) in light-emitting devices that emit different light is different. Therefore, when vapor deposition of these functional layers through a mask (such as a fine mask), multiple alignments are required. In order to solve the positional offset problem caused by alignment accuracy error, sufficient space (safety margin related to alignment error) needs to be reserved between different light-emitting devices to ensure that the actual light-emitting area of ​​the light-emitting device can have a certain overlap with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting devices from being further increased, thus making it difficult to further improve the PPI (pixel density) of the display panel.

[0069] In the embodiments of this disclosure, by providing an isolation structure at the gap between the light-emitting devices, the functional film layers of adjacent light-emitting devices are separated. Thus, in the evaporation process of the functional film layers, only the entire display panel needs to be evaporated, without the need to individually prepare the functional film layer for each light-emitting device using a mask. This process does not require consideration of alignment accuracy during evaporation, thereby allowing for a smaller gap between the light-emitting devices to increase the PPI (the principle of which can be found in the following...). Figures 10A to 10J (Related descriptions in the relevant embodiments).

[0070] In the fabrication process of display panels with isolation structures, light-emitting devices of different colors can be fabricated in batches based on the isolation structure. In the fabrication process of each batch of light-emitting devices, a portion of the film layer of the same color light-emitting device is formed on the entire display panel. Then, a portion of these film layers is selectively removed through processes such as etching, thereby obtaining the light-emitting device that needs to be retained in the end. In the process of batch fabrication of light-emitting devices based on isolation structures, if a wet etching process is performed directly after a dry etching process, the etching residues present in the dry etching process may adversely affect the wet etching process, thereby affecting the quality of the subsequently formed light-emitting devices.

[0071] At least one embodiment of this disclosure provides a display panel, a method for manufacturing the same, and a display device, to at least solve the aforementioned technical problems, such as... Figure 1 As shown, the preparation method may include the following steps S100 to S900.

[0072] S100 provides a substrate and forms a plurality of first electrodes spaced apart from each other on the substrate.

[0073] S200, an isolation structure with multiple isolation openings is formed on a substrate on which the first electrode is formed.

[0074] S300, depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on each other form a light-emitting device.

[0075] S400 involves depositing a film of encapsulating material to cover the isolation structure and the light-emitting device.

[0076] S500 forms a photoresist layer on the packaging material film layer and performs a patterning process on the photoresist layer to form a photoresist pattern. The photoresist pattern covers part of the isolation opening, and the isolation opening covered by the photoresist pattern is the target isolation opening.

[0077] S600 is based on dry etching of packaging material film layers using photoresist patterns. The portion of the packaging material film layer not covered by the photoresist pattern is removed, and the remaining portion of the packaging material film layer forms a packaging unit that covers the target isolation opening.

[0078] S700, a stripping process is performed to remove etching residues, photoresist patterns, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the packaging unit. The second electrode is retained in the isolation opening not covered by the packaging unit.

[0079] S800, perform wet etching to remove the second electrode not covered by the packaging unit, wherein at least a portion of the surface of the first electrode facing away from the substrate is etched in the isolation opening not covered by the packaging unit. The etched portion of the first electrode is a first portion, and the first portion is located in the light-emitting area of ​​the light-emitting device.

[0080] S900, the above process is repeated to form a light-emitting device and a packaging unit at the isolation opening where no light-emitting device is formed, and all packaging units form a first packaging layer, wherein the light-emitting devices formed in different batches have different light-emitting colors, and at least a portion of the first electrode of the light-emitting devices with different light-emitting colors is wet-etched a different number of times to have different thicknesses.

[0081] If the steps of the above-described display panel fabrication method (S100 to S900) are not followed, and a wet etching process is performed directly after the dry etching process of the encapsulation material film layer, the etching residues present in the dry etching process may adversely affect the wet etching process, resulting in incomplete etching of the film structure in the isolation opening (other isolation openings besides the target isolation opening), thereby affecting the quality of the light-emitting device subsequently formed (formed by repeating the above process).

[0082] In steps S100 to S900 above, after the dry etching process of the encapsulation material film is completed, a stripping process is first performed to remove the exposed organic material and clean the residue from the dry etching. The organic material includes residual photoresist patterns and at least a portion of the light-emitting functional layer in the light-emitting device that is not covered by the encapsulation unit. In the process of fabricating the light-emitting device based on the isolation structure, the second electrode of the light-emitting device does not completely cover the light-emitting functional layer in some areas, so that the stripping solution of the stripping process can etch the light-emitting functional layer. Thus, since the surface of the display panel has been cleaned by the stripping process, the quality of the subsequent wet etching process can be improved.

[0083] It should be noted that due to the adjustment of the above-mentioned process sequence, in the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution will etch the surface of the first electrode to a certain extent during the etching of the second electrode. Thus, apart from the first batch of light-emitting devices, the later the light-emitting device is formed, the more wet etching processes the first electrode undergoes, resulting in a greater degree of etching. Consequently, at least a portion of the first electrode of light-emitting devices with different light-emitting colors, corresponding to the isolation opening, will have different thicknesses.

[0084] The display panel obtained by the above-described steps S100 to S900 includes at least a substrate, an isolation structure located on the substrate, and multiple light-emitting devices. The isolation structure is located on the substrate and encloses multiple isolation openings. Each light-emitting device corresponds to an isolation opening, and each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate. The light-emitting functional layer and the second electrode are located within their respective isolation openings. The multiple light-emitting devices are classified to emit multiple colors of light, and at least a portion of the first electrode of each light-emitting device emitting a different color has a different thickness corresponding to the isolation opening. In this display panel fabrication process, light-emitting devices emitting different colors of light can be fabricated in batches based on the isolation structure. In the fabrication process of each batch of light-emitting devices, a portion of the film layer of the same color light-emitting device is formed integrally on the entire display panel. Then, a portion of these film layers is selectively removed through processes such as etching, thereby obtaining the final light-emitting devices that need to be retained. In the entire fabrication process of these light-emitting devices, dry etching is performed first, followed by a stripping process before the wet etching process (etching the film layer corresponding to the second electrode). This removes exposed organic materials and cleans the residue from the dry etching, including at least a portion of the light-emitting functional layer to be etched. This stripping process cleans the surface of the display panel, improving the quality of the subsequent wet etching process and ensuring the quality of light-emitting devices of other colors subsequently fabricated. It should be noted that due to the specific process sequence, in the wet etching process, since the first electrode is no longer covered by the light-emitting functional layer, the etching solution etches the surface of the first electrode to a certain extent during the etching of the second electrode. Thus, except for the first batch of light-emitting devices, the later the light-emitting device is formed, the more wet etching processes the first electrode undergoes, resulting in a greater degree of etching. This leads to different thicknesses in the first electrode of light-emitting devices emitting different colors, corresponding to at least the isolation opening.

[0085] The display panel obtained by the preparation method in steps S100 to S900 above has at least a partial structure as shown in the figure. Figures 2 to 4BAs shown in the accompanying drawings, the specific process steps of the above preparation method and the specific structure of the corresponding display panel are described below with reference to the accompanying drawings. In these drawings, a spatial rectangular coordinate system is established with the substrate in the display panel as the reference to more intuitively present the positional relationship of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the plane where the substrate is located, and the Z-axis is perpendicular to the plane where the substrate is located.

[0086] like Figures 2 to 4B As shown, the planar area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (also called sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, P3 sub-pixels. The physical structure of the sub-pixel can be the light-emitting device in the following embodiment. Adjacent sub-pixels with different emitted light colors constitute a pixel (also called a pixel unit, large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI.

[0087] The physical structure of the display panel 10 may include a substrate 100, an isolation structure 300 located on the substrate 100, and a plurality of light-emitting devices 200. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings 301. The light-emitting devices 200 correspond to the isolation openings 301 respectively, and each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on the substrate 100 in a direction away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening 301. The first electrode 210 includes a first portion located in the light-emitting area of ​​the light-emitting device 200. These light-emitting devices 200 are classified as emitting multiple colors of light. At least a portion of the first electrode 210 of each light-emitting device 200, corresponding to the isolation opening 301, has a different thickness. For example, these light-emitting devices include a first type of light-emitting device P1 and a second type of light-emitting device P2. The first type of light-emitting device P1 and the second type of light-emitting device P2 emit different colors of light, and the first portion of the first electrode of the first type of light-emitting device P1 and the first portion of the first electrode 210 of the second type of light-emitting device P2 have different thicknesses. The principle behind this difference in the thickness of the first electrode 210 can be found in the following... Figures 10A to 10J The relevant descriptions in the related embodiments will not be repeated here.

[0088] For example, the light-emitting functional layer 220 may include at least one first functional layer 221, at least one light-emitting layer 222, and at least one second functional layer 223 sequentially stacked on the first electrode 210. The first functional layer 221 includes at least one hole-like film layer, such as at least one of a hole injection layer and a hole transport layer. The second functional layer 223 may include at least one electron-like film layer, such as an electron injection layer, an electron transport layer, etc. For example, the first functional layer 221 may also include an electron blocking layer, and the second functional layer 223 may also include a hole blocking layer, etc.

[0089] For example, the first electrode 210 can be an anode, and the second electrode 230 can be a cathode.

[0090] It should be noted that the positions of the first functional layer 221 and the second functional layer 223 can be interchanged. In this case, the first electrode 210 is the cathode and the second electrode 230 is the anode.

[0091] In the embodiments of this disclosure, there is no limitation on the number or variety of colors of light emitted by the light-emitting device, which can be selected according to actual design needs.

[0092] In at least one embodiment of this disclosure, such as Figures 2 to 4BAs shown, the light-emitting devices 200 are classified into emitting three colors of light. That is, the display panel includes a first type of light-emitting device P1, a second type of light-emitting device P2, and a third type of light-emitting device P3, and the emitted light colors of the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 are all different. For example, the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 are prepared sequentially. Thus, the thickness of the first portion 210a of the first electrode 210 of the first type of light-emitting device P1 corresponding to the isolation opening 301 is greater than the thickness of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 corresponding to the isolation opening 301, and the thickness of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 corresponding to the isolation opening 301 is greater than the thickness of the first portion 210a of the first electrode 210 of the third type of light-emitting device P3 corresponding to the isolation opening 301. In the fabrication process corresponding to this display panel, the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 are fabricated in batches sequentially. After the first type of light-emitting device P1 is fabricated, no impurities remain in the isolation opening 301 corresponding to the second type of light-emitting device P2 (at which time the second type of light-emitting device P2 has not yet been formed), thereby ensuring the fabrication quality of the second type of light-emitting device P2. During this process, the surfaces of the first electrodes 210 of the second type of light-emitting device P2 and the third type of light-emitting device P3 are partially etched. Similarly, after the second type of light-emitting device P2 is fabricated, no impurities remain in the isolation opening 301 corresponding to the third type of light-emitting device P3 (at which time the third type of light-emitting device P3 has not yet been formed), thereby ensuring the fabrication quality of the third type of light-emitting device P3. During this process, the surface of the first electrode 210 of the third type of light-emitting device P3 (the area where the first part 210a is located) is partially etched again.

[0093] In at least one embodiment of this disclosure, the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 can emit red light, green light, and blue light respectively (in no particular order).

[0094] It should be noted that, in the embodiments of this disclosure, for the first electrode whose surface is etched, only the portion of the surface region of the first electrode exposed during wet etching can be etched. If a portion of the first electrode, such as the edge portion, is covered by a protective film layer, that portion will not be etched and will retain its original thickness.

[0095] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4BAs shown, the display panel may further include a pixel defining layer 330, which is located between the isolation structure 300 and the substrate 100. Alternatively, the pixel defining layer 330 may have a clearance opening, with the isolation structure 300 located within the clearance opening. The pixel defining layer 330 may include pixel openings 302 corresponding to the isolation openings 301, with the pixel openings 302 communicating with their respective isolation openings 301. The light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200 are located within their respective isolation openings 301. When a pixel defining layer 330 is provided in the display panel, the first electrode 210 of the light-emitting device 200 can be designed to have a larger area to prevent positional misalignment (error caused by process precision) between the first electrode 210 and the isolation structure 300 during actual manufacturing, which would make it difficult to guarantee the actual light-emitting area of ​​the light-emitting device. This would improve the aperture ratio (related to the light-emitting area of ​​the light-emitting device) and brightness of the displayed image on the display panel. For example, without setting a pixel defining layer 330, in order to avoid the first electrode 210 from being connected to the isolation structure 300, the design area of ​​the first electrode 210 is limited. If the position of the first electrode 210 is offset, the light-emitting area of ​​the light-emitting device may be smaller than the design area (the light-emitting area expected during the design), thereby reducing the brightness of the light-emitting device.

[0096] In at least one embodiment of this disclosure, the pixel defining layer 330 is an inorganic film layer. In the process of fabricating the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 330 does not need to be thick enough to accommodate the light-emitting device 200, which is beneficial for the thinner design of the display panel. The thickness of the inorganic film layer is much smaller than that of the organic film layer, thus meeting the thickness requirements of the pixel defining layer 330 for fabricating the light-emitting device 200 based on the isolation structure 300. In addition, as an inorganic film layer, the pixel defining layer 330 can have a high bonding strength with the isolation structure 300 and the first electrode 210, thereby reducing the risk of the isolation structure 300 and the first electrode 210 detaching. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0097] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4BAs shown, the orthographic projection of the pixel opening 302 on the substrate 100 lies within the orthographic projection of the corresponding isolation opening 301 on the substrate 100. The thickness of the portion (first portion 210a) of the first electrode 210 of the light-emitting devices 200 with different emitting colors corresponding to the pixel opening 302 is different. When a pixel defining layer 330 is provided, the pixel opening 302 defines the area of ​​the first electrode 210 exposed during the wet etching process. Therefore, the thickness reduction area (the area where the first portion 210a is located) of the first electrode 210 of the light-emitting device 200 can be defined by the pixel opening 302. For example, for the same light-emitting device, the orthographic projection of the corresponding pixel opening 302 on the substrate 100 coincides with the orthographic projection of the corresponding light-emitting area on the substrate 100, meaning they are the same size and shape.

[0098] In at least one embodiment of this disclosure, such as Figures 4A to 4C As shown, the orthographic projection of the pixel opening 302 onto the substrate 100 lies within the orthographic projection of the first electrode 210 onto the substrate 100. The first electrode 210 includes a second portion 210b, which is covered by the pixel defining layer 330 and is therefore not affected by wet etching. As a result, the thickness H1 of the etched middle portion of the first electrode 210 (the first portion 210a corresponding to the pixel opening 302) is less than the thickness H2 of the edge portion (the second portion 210b). For example, for light-emitting devices 200 not prepared in the first batch (second-type light-emitting devices P2 and third-type light-emitting devices P3), the surface of the first electrode 210 opposite to the substrate 100 has a groove 211, and the orthographic projection of the groove 211 onto the substrate 100 coincides with the orthographic projection of the pixel opening 302 onto the substrate 100. For the first type of light-emitting device P1, the side surface of the first electrode 210 opposite to the substrate 100 is a plane in the light-emitting area of ​​the first type of light-emitting device P1, and the orthographic projection of the light-emitting area on the substrate 100 coincides with the orthographic projection of the pixel opening on the substrate 100.

[0099] In at least one embodiment of this disclosure, such as Figures 4A to 4CAs shown, the depth of the groove 211 of the first electrode 210 of the second type of light-emitting device P2 is less than the depth of the groove 211 of the first electrode 210 of the third type of light-emitting device P3. For example, the thickness of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 is greater than the thickness of the first portion 210a of the first electrode 210 of the third type of light-emitting device P3. The first electrode 210 includes a first film layer 2101, a second film layer 2102, and a third film layer 2103 sequentially stacked along a direction away from the substrate 100. The thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the first type of light-emitting device P1 is greater than the thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2. The thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the second type of light-emitting device P2 is greater than the thickness of the third film layer 2103 of the first portion 210a of the first electrode 210 of the third type of light-emitting device P3.

[0100] In at least one embodiment of this disclosure, when the first electrode 210 is an anode, the third film layer 2103 can be a high work function material, and the second film layer 2102 can be a high reflectance material to improve the light extraction efficiency of the light-emitting device 200. For example, the first film layer 2101 includes an indium tin oxide film, the second film layer 2102 includes silver, and the third film layer 2103 includes an indium tin oxide film. The second film layer 2102 is highly reactive and is easily activated by high temperatures during the entire manufacturing process of the display panel, leading to ion migration, oxidation, etc. Therefore, the second film layer 2102 can be protected by the first film layer 2101 and the third film layer 2103 on both sides.

[0101] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4B As shown, in the first type of light-emitting device P1, the thickness of the second portion 210b of the first electrode 210 covered by the pixel defining layer 330 is equal to the thickness of the first portion 210a of the first electrode 210 corresponding to the pixel opening 302. In the second type of light-emitting device P2 and the third type of light-emitting device P3, the thickness of the second portion 210b of the first electrode 210 covered by the pixel defining layer 330 is greater than the thickness of the first portion 210a of the first electrode 210 corresponding to the pixel opening 302. For the light-emitting device 200 formed in the first batch (the first type of light-emitting device P1), when faced with wet etching, the light-emitting device 200 will be covered by the packaging unit 411, thus avoiding the impact of wet etching. In this way, the thickness of each portion of the first electrode 210 is the same.

[0102] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4BAs shown, the first electrodes 210 of the first type of light-emitting device P1, the second type of light-emitting device P2, and the third type of light-emitting device P3 can be fabricated in the same layer and with the same material. Thus, in the second type of light-emitting device P2 and the third type of light-emitting device P3, the thickness of the second part 210b of the first electrode 210 covered by the pixel defining layer 330 can be equal to the thickness of the first electrode 210 of the first type of light-emitting device P1.

[0103] In the embodiments of this disclosure, provided that the isolation structure can be used to batch-produce the light-emitting devices and isolate the film layers of each light-emitting device, the specific design of the isolation structure is not limited and can be designed according to actual process requirements. The specific design of the isolation structure and the arrangement relationship between the isolation structure and the light-emitting devices are illustrated below through different embodiments.

[0104] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4B As shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100. The orthographic projection of the end of the support portion 310 away from the substrate 100 on the substrate 100 lies within the orthographic projection of the crown portion 320 on the substrate 100. The edge of the crown portion 320 is the edge of the isolation opening 301. For example, the orthographic projection of the support portion 310 on the substrate 100 lies within the orthographic projection of the crown portion 320 on the substrate 100. Thus, the isolation structure 300 will be wider at the top and narrower at the bottom to ensure the isolation effect of the isolation structure 300 on the film layer of the light-emitting device 200. In addition, this arrangement can limit the evaporation angle of the film layer of the light-emitting device 200 during evaporation, so as to ensure that the second electrode 230 can overlap with the isolation structure 300 while reducing the overlap area between the light-emitting functional layer 220 and the isolation structure 300 or avoiding the overlap between the light-emitting functional layer 220 and the isolation structure 300.

[0105] It should be noted that, for the isolation opening 301, the edge of the crown 320 is the edge of the opening of the isolation opening 301 away from the substrate 100, and the side wall of the isolation structure 300, such as the side surface of the support portion 310 and the side surface of the crown 320 together constitute the side surface of the isolation opening 301.

[0106] For example, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side surface of the support portion 310. In this way, the size of the crown portion 320 is larger than the top size of the support portion 310 to ensure the isolation effect of the isolation structure 300 on the film layer of the light-emitting device 200. In addition, the conductive support portion 310 can connect the second electrodes 230 of each light-emitting device 200 in series to form a common electrode. Moreover, the support portion 310 is located in the gap of the light-emitting device 200, so it does not need to transmit light and is not limited by thickness, thereby reducing the impedance of the common electrode and alleviating the voltage drop problem on each second electrode 230 when driving the light-emitting device 200.

[0107] In at least one embodiment of this disclosure, such as Figure 6 As shown, the isolation structure 300 includes a bottom 340 located between the support portion 310 and the substrate 100. The orthographic projection of the end of the support portion 310 facing the substrate 100 onto the substrate 100 lies within the orthographic projection of the bottom 340 onto the substrate 100. The bottom 340 is a conductive structure, and the edge of the second electrode 230 is connected to the portion of the bottom 340's surface away from the substrate 100 that is not covered by the support portion 310. The second electrode 230 is more easily deposited on the surface area of ​​the bottom 340 away from the substrate 100 than on the sidewall of the support portion 310, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0108] For example, the orthographic projection of the bottom 340 onto the substrate 100 lies within the orthographic projection of the crown 320 onto the substrate 100. In this way, the blocking effect of the isolation structure 300 on the light-emitting functional layer 220 can be increased.

[0109] For example, the materials for the bottom 340, the support 310, and the crown 320 can be molybdenum, aluminum, and titanium, respectively, with the corrosion resistance of aluminum, molybdenum, and titanium increasing in that order. During etching, the film formed by these materials can form a film such as... Figure 6 The isolation structure 300 is shown.

[0110] In at least one embodiment of this disclosure, such as Figures 3 to 5C As shown, the isolation opening 301 includes a first side 301a and a second side 301b opposite each other along a first direction (e.g., the X-axis direction), and a third side 301c and a fourth side 301d opposite each other along a second direction (e.g., the Y-axis direction). The climbing height of the edge of the second electrode 230 on the side surface of the support 310 at the location of the first side 301a and / or the second side 301b is greater than the climbing height of the edge of the second electrode 230 on the side surface of the support 310 at the location of the third side 301c and the fourth side 301d. Figure 5B (If no contact is shown, the climbing height is considered to be zero); or, as... Figure 5BAs shown, at the first side 301a and / or the second side 301b, the edge of the second electrode 230 extends to the side surface of the support portion 310, and at the third side 301c and the fourth side 301d, there is a gap between the edge of the second electrode 230 and the support portion 310. In the vapor deposition process of the light-emitting functional layer 220 and the second electrode 230 of the light-emitting device 200, in the direction perpendicular to the moving direction of the vapor deposition source (the direction from the third side 301c to the fourth side 301d, the Y-axis direction) (the direction from the first side 301a to the second side 301b, the X-axis direction), the vapor deposition range of the vapor deposition material radiated by the vapor deposition source is larger (the vapor deposition angle is larger), which makes it easier for the vapor deposition material to accumulate below the crown 320. That is, at the first side 301a and the second side 301b, the edge of the vapor deposition film layer is more likely to be deposited on the side surface of the support portion 310. Conversely, in the moving direction of the vapor deposition source (the direction from the third side 301c to the fourth side 301d), that is, at the third side 301c and the fourth side 301d, the edge of the vapor deposition film layer is difficult to be deposited on the side surface of the support portion 310. Thus, during actual vapor deposition, at the third side 301c and the fourth side 301d, the second electrode 230 is difficult to cover the side surface of the light-emitting functional layer 220, or the film quality of the covered part is poor. As a result, when performing the stripping process, the stripping liquid can easily penetrate under the second electrode 230 at this position to etch the light-emitting functional layer 220, thereby removing at least a part of the light-emitting functional layer 220.

[0111] In at least one embodiment of this disclosure, the climbing height of the edge of the second electrode 230 on the side surface of the support 310 at the location of the first side 301a is greater than the climbing height of the edge of the second electrode 230 on the side surface of the support 310 at the location of the second side 301b; or, at the first side 301a, the edge of the second electrode 230 extends to the side surface of the support 310, and at the second side 301b, there is a gap between the edge of the second electrode 230 and the support 310, such as... Figure 5C As shown. By controlling the tilt direction of the display panel and the vapor deposition source, the vapor deposition material can exhibit different degrees of vapor deposition at the first side 301a and the second side 301b. This allows the second electrode 230 to achieve unilateral overlap with the isolation structure 300 at one of the first side 301a and the second side 301b. Correspondingly, the overlap between the second electrode 230 and the isolation structure 300 at the other of the first side 301a and the second side 301b is limited or there is a gap. This method can ensure that there is at least one area between the second electrode 230 and the isolation structure 300 that is bound to overlap and has high overlap quality, so as to ensure that there is a small impedance between the second electrode 230 and the isolation structure 300.

[0112] In at least one embodiment of this disclosure, such as Figure 4A and Figure 5B As shown, at the first side 301a and / or the second side 301b, the edge of the light-emitting functional layer 220 is covered by the second electrode 230, while at the third side 301c and the fourth side 301d, at least a portion of the side surface of the edge of the light-emitting functional layer 220 is not covered by the second electrode 230. During the stripping process, although the second electrode 230 is difficult to etch, at the third side 301c and the fourth side 301d, because the second electrode 230 cannot completely cover the underlying light-emitting functional layer 220, the stripping solution can enter from the third side 301c and the fourth side 301d to etch the light-emitting functional layer 220 below the second electrode 230.

[0113] In at least one embodiment of this disclosure, such as Figure 5A As shown, the distance T1 between the orthographic projections of the first side 301a and the second side 301b on the substrate 100 is less than the distance T2 between the orthographic projections of the third side 301c and the fourth side 301d on the substrate 100. For example, the lengths of the first side 301a and the second side 301b are greater than the lengths at the third side 301c and the fourth side 301d. Thus, the first side 301a and the second side 301b are actually the long sides of the isolation opening 301. When depositing the light-emitting functional layer 220 of the light-emitting device 200, the length direction of the evaporation source (e.g., a line evaporation source) can be made parallel to the direction from the first side 302a to the second side 302b. That is, the scanning direction of the evaporation source is perpendicular to this direction. When fabricating the second electrode 230, the evaporation material is more easily deposited at the first side 301a and the second side 301b, thereby resulting in a relatively small impedance between the second electrode 230 and the isolation structure 300.

[0114] In at least one embodiment of this disclosure, such as Figure 7 As shown, the display panel may further include a first encapsulation layer 410, which is located on the side of the isolation structure 300 and the light-emitting device 200 away from the substrate 100. The first encapsulation layer 410 includes encapsulation units 411 corresponding to the light-emitting device 200, and the encapsulation units 411 cover the isolation openings 301 corresponding to the light-emitting device 200 to encapsulate the light-emitting device 200. During the batch fabrication of the light-emitting device 200 based on the isolation structure 300, the encapsulation units 411 are fabricated synchronously with the light-emitting device 200 in batches, so that in the process of fabricating the next batch of light-emitting devices 200 (in which etching occurs), the light-emitting device 200 can protect the already fabricated light-emitting device 200.

[0115] In cases where the light-emitting devices 200 are of various types emitting different colors of light, each light-emitting device 200 is manufactured independently. However, the film layers (evaporated film layers, such as light-emitting functional layers) in each light-emitting device 200 are deposited on the entire display panel during the evaporation process. For example, as shown in... Figure 3 Taking the sequential fabrication of light-emitting devices P1, P2, and P3 as an example, when fabricating light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. A first encapsulation layer 410 is fabricated on the display panel to cover the light-emitting device P2. Then, the first encapsulation layer 410, as well as the second electrode and light-emitting functional layer of the light-emitting device P1, are removed from some of the isolation openings 301 (used to form light-emitting devices P2 and P3 in the final product) to obtain an encapsulation unit 411. In this process, the encapsulation unit 411 is used to protect the light-emitting devices P1 in other isolation openings 301. Based on this method, light-emitting devices P2 and P3 are fabricated sequentially, finally forming the display panel as shown in the diagram. Figure 7 The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel, is obtained by multiple processes. This process can be found below. Figures 10A to 10J The relevant descriptions in the embodiments are not repeated here.

[0116] In at least one embodiment of this disclosure, the edge of the encapsulation unit 411 extends to the side of the isolation structure 300 away from the substrate 100 to overlap with the isolation structure 300. The portion of the edge of the encapsulation unit 411 that overlaps with the isolation structure 300 is spaced apart from the isolation structure 300 to form a suspended portion 4111. In the above-described light-emitting device formation process, since the film layers used to form the structure of the light-emitting device 200 are separated based on the isolation structure 300, these film layers are deposited entirely on the display panel, that is, these film layers cover the isolation structure 300. In the etching process of forming the encapsulation unit 411, the etching material etches the portion of the film layer covering the isolation structure 300, thereby making the edge portion of the encapsulation unit 411 suspended to form the suspended portion 4111.

[0117] In at least one embodiment of this disclosure, the first encapsulation layer 410 is an inorganic film layer.

[0118] In at least one embodiment of this disclosure, the packaging units 411 corresponding to adjacent light-emitting devices 200 with different light-emitting colors are spaced apart or overlapped (the spaced-apart situation is shown in the figure). This structure is related to the process of fabricating the light-emitting device 200 based on the isolation structure 300, and specific details can be found below. Figures 10A to 10J The relevant descriptions in the embodiments are not repeated here.

[0119] In at least one embodiment of this disclosure, such as Figure 8As shown, the display panel further includes a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410. The second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the third encapsulation layer 430 is located on the side of the second encapsulation layer 420 facing away from the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute an encapsulation structure 400. Optionally, the second encapsulation layer 420 is a planarization layer. For example, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. For example, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the placement of other components on the encapsulation layer. In addition, the second encapsulation layer 420 can have a certain degree of flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and making it more suitable for application in the field of flexible displays. Furthermore, the third encapsulation layer 430 has high density and a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the fabrication of other components (such as touch-related structures, optical films, etc.) on it.

[0120] At least one embodiment of this disclosure provides a display panel, which can be referred to again. Figures 1 to 3 , Figures 4A to 4C The display panel includes a substrate 100, an isolation structure 300 located on the substrate 100, and a plurality of light-emitting devices 200. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings. The light-emitting devices 200 correspond to the isolation openings respectively, and each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on the substrate 100 in a direction away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening. The plurality of light-emitting devices 200 includes a first type of light-emitting device P1 and a second type of light-emitting device P2. The first type of light-emitting device P1 and the second type of light-emitting device P2 emit different colors of light. The surface of the first electrode 210 of the first type of light-emitting device P1 facing away from the substrate 100 is planar in the light-emitting area of ​​the first type of light-emitting device P1, and the surface of the first electrode 210 of the second type of light-emitting device P2 facing away from the substrate 100 has a groove in the light-emitting area of ​​the second type of light-emitting device P2. The structure of the display panel, the technical problems it solves, and its potential for further improvement can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here. This embodiment can be combined with some or all of the features in the above embodiments, which will not be repeated here. For example, the first type of light-emitting device P1 is manufactured before the second type of light-emitting device P2. For example, the isolation opening corresponding to the first type of light-emitting device P1 and the isolation opening corresponding to the second type of light-emitting device P2 can be manufactured simultaneously.

[0121] At least one embodiment of this disclosure provides a display panel, which can be referred to again. Figures 1 to 3 , Figures 4A to 4C The display panel includes a substrate 100, an isolation structure 300 and a plurality of light-emitting devices 200 located on the substrate 100. The isolation structure 300 is located on the substrate 100 and encloses a plurality of isolation openings. The light-emitting devices 200 correspond to the isolation openings respectively, and each light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220 and a second electrode 230 stacked sequentially on the substrate 100 in a direction away from the substrate 100. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located in the corresponding isolation opening. The multiple light-emitting devices 200 include a second type of light-emitting device P2 and a third type of light-emitting device P3. The emitted light colors of the second type of light-emitting device P2 and the third type of light-emitting device P3 are different. The surface of the first electrode 210 of the third type of light-emitting device P3 opposite to the substrate 100 has a groove in the light-emitting area of ​​the third type of light-emitting device P3. The surface of the first electrode 210 of the second type of light-emitting device P2 opposite to the substrate 100 has a groove in the light-emitting area of ​​the second type of light-emitting device P2. The depth of the groove of the first electrode 210 of the second type of light-emitting device P2 is less than the depth of the groove of the first electrode 210 of the third type of light-emitting device P3. The structure of this display panel, the technical problems solved, and further improvements can be found in the relevant descriptions in the foregoing embodiments, which will not be repeated here. This embodiment can be combined with some or all of the features in the above embodiments, which will not be repeated here. For example, the second type of light-emitting device P2 is manufactured before the third type of light-emitting device P3. For example, the isolation opening corresponding to the second type of light-emitting device P2 and the isolation opening corresponding to the third type of light-emitting device P3 can be manufactured simultaneously.

[0122] For example, first make the isolation opening corresponding to the first type of light-emitting device P1 and the isolation opening corresponding to the second type of light-emitting device P2, then make the first type of light-emitting device P1, then make the second type of light-emitting device P2, and then make the third type of light-emitting device P3.

[0123] The foregoing embodiments have described the specific structural design of the display panel. Below, the manufacturing process of the display panel will be described for different design structures provided in the above embodiments, as detailed below.

[0124] In at least one embodiment of this disclosure, such as Figure 9A As shown, the method for manufacturing the display panel may further include the following steps S101 and S102.

[0125] S101, after the first electrode is formed and before the isolation structure is formed, a pixel defining material layer covering the first electrode is formed on the substrate.

[0126] S102, after forming the isolation structure, the pixel defining material layer is patterned to form a pixel defining layer. The pixel defining layer is located between the isolation structure and the substrate, and multiple pixel openings are formed in the pixel defining layer. The pixel openings correspond to and are connected to the isolation openings. After forming the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode of the light-emitting device are located in the corresponding isolation openings and pixel openings.

[0127] For details regarding the specific structure of the display panel with pixel delimitation layer formed in the above steps, please refer to the relevant descriptions in the foregoing embodiments, which will not be repeated here.

[0128] In at least one embodiment of this disclosure, in the first batch of light-emitting devices formed, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening. In light-emitting devices not formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening. For the light-emitting devices formed in the first batch, when faced with wet etching, the light-emitting device is covered by the encapsulation unit and is therefore not affected by wet etching; thus, the thickness of each portion of the first electrode is the same. Regarding the factors relating to the positions of the pixel defining layer and the portions of the first electrode with different thicknesses in the display panel, please refer to the relevant descriptions in the foregoing embodiments, which will not be repeated here.

[0129] In embodiments of this disclosure, step S300 may include: moving the evaporation source and the display panel relative to each other along a second direction to evaporate a light-emitting material film and a conductive material film, such that after forming the light-emitting functional layer and the second electrode, at the first side and / or the second side, the edge of the light-emitting functional layer is covered by the second electrode, and at the third side and the fourth side, at least a portion of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode. Thus, in the direction perpendicular to the movement direction of the evaporation source (the direction from the third side to the fourth side) (the direction from the first side to the second side), the evaporation range of the evaporation material radiated by the evaporation source is larger (the evaporation angle is larger), making it easier for the evaporation material to accumulate below the crown, i.e., at the first and second sides, the edge of the evaporation film layer is more easily deposited on the side surface of the support; conversely, in the movement direction of the evaporation source (the direction from the third side to the fourth side), i.e., at the third and fourth sides, the edge of the evaporation film layer is difficult to deposit on the side surface of the support. Thus, during actual vapor deposition, at the third and fourth sides, the second electrode may not cover the side surface of the light-emitting functional layer, or the film quality of the covered portion may be poor. Consequently, during the stripping process, the stripping solution can easily penetrate under the second electrode at these locations to etch the light-emitting functional layer, thereby removing at least a portion of it. The structure of the display panel corresponding to this fabrication method can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0130] In embodiments of this disclosure, step S700 may include: in the isolation opening not covered by the encapsulation unit, a stripping solution used in the stripping process enters between the second electrode and the first electrode from at least the third and fourth sides to remove the light-emitting functional layer. After at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode settles onto the first electrode. In the stripping process, the second electrode is difficult to etch, while the light-emitting functional layer beneath the second electrode is etched away. Therefore, the second electrode directly settles and contacts the first electrode. Consequently, in the subsequent wet etching process of the second electrode, to ensure complete etching of the second electrode, the surface of the first electrode will inevitably be etched. The structure of the display panel corresponding to this fabrication method can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0131] In at least some embodiments of this disclosure, step S300 can be continued after the second electrode is wet-etched to prepare a new light-emitting device.

[0132] In at least some embodiments of this disclosure, before performing step S900, the fabrication method may further include: after performing wet etching to remove the second electrode not covered by the packaging unit, performing a stripping process to remove etching residues located in the isolation opening. This further removes any residues that may be present in the isolation opening after the wet etching process, ensuring the quality of the light-emitting device formed in subsequent processes.

[0133] At least one embodiment of this disclosure provides a method for manufacturing a display panel, such as... Figure 9B As shown, the preparation method may include the following steps S100a to S900a.

[0134] S100a provides a substrate and forms a plurality of first electrodes spaced apart from each other on the substrate.

[0135] S200a, an isolation structure with multiple isolation openings is formed on a substrate on which the first electrode is formed.

[0136] S300a, multiple isolation openings include a first isolation opening and a second isolation opening.

[0137] S400a, depositing a light-emitting material thin film, a conductive material thin film, and an encapsulation material film layer, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the first isolation opening respectively form a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer, and the second electrode stacked on top of each other form a first type of light-emitting device.

[0138] S500a, a photoresist layer is formed on the packaging material film layer, and a patterning process is performed on the photoresist layer to form a photoresist pattern. The photoresist pattern covers the first isolation opening and exposes the second isolation opening.

[0139] S600a, based on dry etching of the encapsulation material film layer using photoresist pattern, removes the encapsulation material film layer at the second isolation opening, and retains the encapsulation material film layer at the first isolation opening.

[0140] S700a, a stripping process is performed to remove the photoresist pattern, the etching residue of the encapsulation material film at the second isolation opening, and at least part of the light-emitting material film at the second isolation opening, while the second electrode at the second isolation opening is retained.

[0141] S800a, wet etching is performed to remove the conductive material film at the second isolation opening, wherein at least a portion of the surface of the first electrode at the second isolation opening facing away from the substrate is etched.

[0142] S900a, at least a portion of the film layer of the second type of light-emitting device is formed at the second isolation opening.

[0143] The structure of the display panel obtained by the display panel manufacturing method shown in steps S100 to S900 above, the technical problems solved, and the potential for further improvement can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here. This embodiment can be combined with some or all of the features in the foregoing embodiments, and will not be repeated here.

[0144] Below, as Figures 10A to 10J As shown, in order to Figure 7 Taking the display panel shown as an example, the method for manufacturing the display panel will be explained by way of example.

[0145] like Figure 10A As shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100.

[0146] like Figure 10B As shown, a pixel defining material layer 330a is formed on a substrate 100 on which the first electrode 210 is formed.

[0147] like Figure 10C As shown, a first material layer 310a and a second material layer 320a are formed on the pixel defining material layer 330a.

[0148] For example, the material of the first material layer 310a can be aluminum, and the material of the second material layer 320a can be titanium.

[0149] like Figure 10D As shown, the first material layer 310a and the second material layer 320a are patterned such that the first material layer 310a is formed as a support portion 310 and the second material layer 320a is formed as a crown portion 320. The support portion 310 and the crown portion 320 define the isolation opening 301 and form at least a portion of the isolation structure 300.

[0150] In embodiments of this disclosure, the patterning process can be a photolithographic patterning process, which may include, for example, coating a structural layer to be patterned with photoresist, exposing the photoresist using a photomask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern described below) includes photoresist, the structural layer can be directly exposed using a photomask to form the desired pattern.

[0151] It should be noted that if the corrosion resistance of the second material layer 320a (e.g., titanium) is greater than that of the first material layer 310a (e.g., aluminum), the etching rate of the first material layer 310a will be greater than that of the second material layer 320a. This will result in the width of the crown 320 being greater than the width of the support portion 310, thus forming a structure as described above. Figure 10DThe structure shown.

[0152] like Figure 10E As shown, a patterning process is performed on the pixel defining material layer 330a based on the isolation structure 300 to form a pixel defining layer 330. The pixel defining layer 330 covers the gap between adjacent first electrodes 210. Thus, the pixel defining layer 330 forms a pixel opening corresponding to the isolation opening 301, and the planar shape of the pixel defining layer 330 is a grid.

[0153] like Figure 10F As shown, a light-emitting material thin film and a conductive material thin film are vapor-deposited on the substrate 100 to form a light-emitting functional layer 220 and a second electrode 230 in each isolation opening 301 of the isolation structure 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked on each other at the isolation opening 301 form a light-emitting device 200. No mask is used in the vapor deposition process, so the vapor-deposited material will also be deposited on the crown 320. It should be noted that in the actual process, the vapor-deposited material will be deposited on the upper surface of the crown 320 away from the substrate 100 and on the sidewalls (not shown in the figure) to form a filling film 500a. Then, an encapsulation material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0154] For example, the light-emitting layer in the vapor-deposited light-emitting functional layer 220 can be light of the color corresponding to the first type of light-emitting device P1. That is, in this stage, the first type of light-emitting device P1 is formed in each isolation opening 301 of the isolation structure 300.

[0155] like Figure 10G As shown, a photoresist is formed (e.g., coated) on a substrate 100 on which an encapsulation material film layer 410a is formed, and then a patterning process is performed on it to form a photoresist pattern 500. The photoresist pattern 500 only covers a portion of the isolation opening 301 of the isolation structure 300 (set as the target isolation opening).

[0156] like Figure 10H As shown, the surface of the display panel is dry etched using the photoresist pattern 500 as a mask to remove the portion of the encapsulation material film layer 410a that is not covered by the photoresist pattern 500. The remaining portion of the encapsulation material film layer 410a forms the encapsulation unit of the first encapsulation layer 410. During this process, the encapsulation unit of the target isolation opening is protected by the photoresist pattern 500 and will not be etched.

[0157] like Figure 10IAs shown, a stripping process is performed, in which the stripping solution removes the exposed organic material. Specifically, this process removes the residual photoresist pattern 500, the filler film 500a between the packaging unit and the isolation structure 300, and the light-emitting functional layer 220 in the isolation opening 301 that does not cover the packaging unit. The principle of the stripping solution etching the underlying light-emitting functional layer 220 by passing over the second electrode 230 in this process can be found in the relevant description in the foregoing embodiments, and will not be repeated here.

[0158] In such Figure 10I After the process shown is completed, in the isolation opening 301 that does not cover the packaging unit, because the light-emitting functional layer 220 is removed, the second electrode 230 falls on the first electrode 210.

[0159] like Figure 10J As shown, a wet etching process is performed to remove the second electrode 230 in the isolation opening 301 that does not cover the packaging unit. During this process, after the second electrode 230 is etched, the surface of the exposed portion of the first electrode 210 (the area where the pixel opening 302 is located) is etched.

[0160] In at least one embodiment of this disclosure, the stripping solution used in the stripping process is alkaline, and the solution used in the wet etching process is acidic.

[0161] In the embodiments of this disclosure, the material of the encapsulation material film layer 410a may include silicon oxide, silicon nitride, silicon oxynitride, etc. Thus, before performing the stripping process, at least a portion of the etching residue of the encapsulation material film layer 410a is attached to the sidewall of the isolation structure 300 facing the isolation opening 301 in other isolation openings 301 (i.e., non-target isolation openings) besides the target isolation opening. The etching residue of the encapsulation material film layer 410a is acid-resistant, so an alkaline stripping solution is required for removal to ensure the quality of the subsequent wet etching process.

[0162] Optionally, the etching residue of the encapsulation material film layer is more resistant to corrosion by the wet etching solution than to corrosion by the stripping solution used in the stripping process. If the stripping process occurs after the wet etching process for the second electrode and after the dry etching of the encapsulation material film layer, the sidewalls of the isolation structure facing the non-target isolation opening will have etching residue of the encapsulation material film layer adhering to them. This residue will not be removed by the wet etching solution used for the second electrode, leading to unevenness on the sidewalls of the isolation structure facing the non-target isolation opening. This will affect the bonding effect between the isolation structure and the second electrode, and / or the encapsulation effect. If the stripping process occurs before the wet etching process for the second electrode, the etching residue of the encapsulation material film layer adhering to the sidewalls of the isolation structure facing the non-target isolation opening will be removed by the stripping solution used in the stripping process. This will improve the smoothness of the sidewalls of the isolation structure facing the non-target isolation opening, thereby improving the bonding effect between the isolation structure and the second electrode, and / or the encapsulation effect.

[0163] Repeat the above Figures 10F to 10J The steps are as follows: to form a second type of light-emitting device P2 and a third type of light-emitting device P3 in other isolation openings 301 respectively, and to form as shown in the figure. Figure 7 The display panel shown. The process of forming the second type of light-emitting device P2 and the third type of light-emitting device P3 differs from that of forming the first type of light-emitting device P1 in that the isolation opening 301 covered by the photoresist pattern 500 is different.

[0164] At least one embodiment of this disclosure provides a display device, which may include the display panel in the above embodiments or a display panel obtained by the manufacturing method in the above embodiments. For example, the display device may include a touch structure, an optical film (e.g., a microlens, a polarizer), a cover plate, or other structures disposed on the light-emitting side of the display panel.

[0165] For example, the display device can be any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0166] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0167] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings; as well as Multiple light-emitting devices are provided, each corresponding to an isolation opening. Each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate in a direction away from the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening. The first electrode includes a first portion located in the light-emitting area of ​​the light-emitting device. The plurality of light-emitting devices include a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device emit different colors of light. The first part of the first electrode of the first type of light-emitting device and the first part of the first electrode of the second type of light-emitting device have different thicknesses. For the second type of light-emitting device, the surface of the first electrode opposite to the substrate has a groove in the light-emitting area of ​​the second type of light-emitting device that corresponds to the first portion. For the first type of light-emitting device, the side surface of the first electrode opposite to the substrate is a plane in the light-emitting area of ​​the first type of light-emitting device, and / or, for the third type of light-emitting device, the side surface of the first electrode opposite to the substrate has a groove in the light-emitting area of ​​the third type of light-emitting device corresponding to the first portion, and the depth of the groove of the first electrode of the second type of light-emitting device is less than the depth of the groove of the first electrode of the third type of light-emitting device.

2. The display panel according to claim 1, characterized in that, The thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device, and The thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device.

3. The display panel according to claim 2, characterized in that, It also includes a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate, and includes pixel openings corresponding to the isolation openings, and The pixel opening is connected to the corresponding isolation opening, at least a portion of the light-emitting functional layer and at least a portion of the second electrode of the light-emitting device are located in the corresponding pixel opening, and the orthographic projection of the pixel opening on the substrate overlaps with the orthographic projection of the first portion on the substrate.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the pixel opening on the substrate lies within the orthographic projection of the corresponding isolation opening on the substrate, and The first electrode of the light-emitting device with different emitted colors has a different thickness in the first portion exposed by the pixel opening.

5. The display panel according to claim 4, characterized in that, For the second type of light-emitting device, the surface of the first electrode opposite to the substrate has a groove, and the orthographic projection of the groove on the substrate coincides with the orthographic projection of the pixel opening on the substrate. For the first type of light-emitting device, the side surface of the first electrode opposite to the substrate is a plane in the light-emitting area of ​​the first type of light-emitting device, and the orthographic projection of the light-emitting area on the substrate coincides with the orthographic projection of the pixel opening on the substrate; For the third type of light-emitting device, the surface of the first electrode opposite to the substrate has a groove, and the orthographic projection of the groove on the substrate coincides with the orthographic projection of the pixel opening on the substrate.

6. The display panel according to claim 4, characterized in that, The orthographic projection of the pixel opening onto the substrate lies within the orthographic projection of the first electrode onto the substrate. The first electrode includes a second portion, which is covered by the pixel defining layer. In the first type of light-emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening, and In the second type of light-emitting device and the third type of light-emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening.

7. The display panel according to any one of claims 1 to 6, characterized in that, The isolation structure includes a support portion and a crown portion, with the support portion located between the crown portion and the substrate. The orthographic projection of the end of the support portion away from the substrate on the substrate is located within the orthographic projection of the crown portion on the substrate. The support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion.

8. The display panel according to claim 7, characterized in that, The isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction. The climbing height of the edge of the second electrode on the side surface of the support at the location of the first side and / or the second side is greater than the climbing height of the edge of the second electrode on the side surface of the support at the location of the third side and the fourth side. or At the first side and / or the second side, the edge of the second electrode extends to the side surface of the support, and at the third side and the fourth side, there is a gap between the edge of the second electrode and the support.

9. The display panel according to claim 8, characterized in that, At the first side and / or the second side, the edge of the light-emitting functional layer is covered by the second electrode, and At least a portion of the side surface of the edge of the light-emitting functional layer at the third and fourth sides is not covered by the second electrode, and the distance between the orthographic projections of the first and second sides on the substrate is less than the distance between the orthographic projections of the third and fourth sides on the substrate.

10. The display panel according to any one of claims 1 to 6, characterized in that, It also includes a first encapsulation layer, wherein the first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer includes encapsulation units corresponding to the light-emitting devices, and the encapsulation units cover the isolation openings corresponding to the light-emitting devices to encapsulate the light-emitting devices.

11. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings; as well as Multiple light-emitting devices are respectively corresponding to the isolation openings, and each light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked sequentially on the substrate in a direction away from the substrate, wherein at least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening; The plurality of light-emitting devices include a first type of light-emitting device and a second type of light-emitting device. The first type of light-emitting device and the second type of light-emitting device emit different colors of light. The surface of the first electrode of the first type of light-emitting device opposite to the substrate is a plane in the light-emitting area of ​​the first type of light-emitting device. The surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of ​​the second type of light-emitting device. Alternatively, the plurality of light-emitting devices may include a second type of light-emitting device and a third type of light-emitting device, wherein the second type of light-emitting device and the third type of light-emitting device emit different colors of light, wherein the surface of the first electrode of the second type of light-emitting device opposite to the substrate has a groove in the light-emitting area of ​​the second type of light-emitting device, and the surface of the first electrode of the third type of light-emitting device opposite to the substrate has a groove in the light-emitting area of ​​the third type of light-emitting device; wherein the depth of the groove of the first electrode of the second type of light-emitting device is less than the depth of the groove of the first electrode of the third type of light-emitting device.

12. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings; as well as Multiple light-emitting devices are provided, each corresponding to an isolation opening. Each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate in a direction away from the substrate. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the corresponding isolation opening. The first electrode includes a first portion located in the light-emitting area of ​​the light-emitting device. A pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate, and includes pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings. The plurality of light-emitting devices include a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device emit different colors of light. The first part of the first electrode of the first type of light-emitting device and the first part of the first electrode of the second type of light-emitting device have different thicknesses. The orthographic projection of the pixel opening onto the substrate lies within the orthographic projection of the first electrode onto the substrate. The first electrode further includes a second portion, which is covered by the pixel defining layer. In the first type of light-emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening, and In the second type of light-emitting device and the third type of light-emitting device, the thickness of the second portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening.

13. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, and a plurality of first electrodes spaced apart from each other are formed on the substrate; An isolation structure having multiple isolation openings is formed on the substrate on which the first electrode is formed; A light-emitting material thin film and a conductive material thin film are deposited, wherein the light-emitting material thin film and the conductive material thin film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode, and the first electrode, the light-emitting functional layer and the second electrode stacked on top of each other form a light-emitting device; A film of encapsulating material is deposited to cover the isolation structure and the light-emitting device; A photoresist layer is formed on the encapsulation material film layer, and the photoresist layer is patterned to form a photoresist pattern. The photoresist pattern covers a portion of the isolation opening, and the isolation opening covered by the photoresist pattern is the target isolation opening. The encapsulation material film layer is dry etched based on the photoresist pattern, and the portion of the encapsulation material film layer not covered by the photoresist pattern is removed, and the remaining portion of the encapsulation material film layer forms an encapsulation unit covering the target isolation opening; A stripping process is performed to remove etching residues from the encapsulation material film, the photoresist pattern, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the encapsulation unit. The second electrode is retained in the isolation opening not covered by the encapsulation unit. Wet etching is performed to remove the second electrode not covered by the packaging unit, wherein at least a portion of the surface of the first electrode facing away from the substrate is etched in the isolation opening not covered by the packaging unit, the etched portion of the first electrode being a first portion located in the light-emitting area of ​​the light-emitting device; and The above process is repeated to form the light-emitting device and the packaging unit at the isolation opening where the light-emitting device is not formed. All the packaging units form a first packaging layer. The light-emitting devices formed in different batches have different light-emitting colors, and at least a portion of the first electrode of the light-emitting devices with different light-emitting colors, corresponding to the isolation opening, is wet-etched a different number of times to have different thicknesses.

14. The preparation method according to claim 13, characterized in that, The plurality of light-emitting devices includes a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device emit different colors of light, and the first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are manufactured sequentially in batches. The surface of the first electrode of the second type of light-emitting device facing away from the substrate is wet-etched at least once, and the surface of the first electrode of the third type of light-emitting device facing away from the substrate is wet-etched at least twice, so that the thickness of the first portion of the first electrode of the first type of light-emitting device is greater than the thickness of the first portion of the first electrode of the second type of light-emitting device, and the thickness of the first portion of the first electrode of the second type of light-emitting device is greater than the thickness of the first portion of the first electrode of the third type of light-emitting device.

15. The preparation method according to claim 13 or 14, characterized in that, Also includes: After the first electrode is formed and before the isolation structure is formed, a pixel defining material layer covering the first electrode is formed on the substrate; After the isolation structure is formed, the pixel defining material layer is patterned to form a pixel defining layer. The pixel defining layer is located between the isolation structure and the substrate, and a plurality of pixel openings are formed in the pixel defining layer. The pixel openings correspond to and are connected to the isolation openings. The light-emitting functional layer of the light-emitting device and the second electrode are located in the corresponding isolation openings and pixel openings.

16. The preparation method according to claim 15, characterized in that, The orthographic projection of the pixel opening onto the substrate is located within the orthographic projection of the first electrode onto the substrate. For the first electrode that is wet-etched, the area of ​​the first electrode on the surface facing away from the substrate that is exposed by the pixel opening is etched so that the thickness of the portion of the first electrode corresponding to the pixel opening in the light-emitting device that produces different light colors is different. In the first batch of light-emitting devices formed, the thickness of the portion of the first electrode covered by the pixel defining layer is equal to the thickness of the first portion of the first electrode corresponding to the pixel opening, and In the light-emitting device not formed in the first batch, the thickness of the portion of the first electrode covered by the pixel defining layer is greater than the thickness of the first portion of the first electrode corresponding to the pixel opening.

17. The preparation method according to claim 13 or 14, characterized in that, The isolation structure includes a support portion and a crown portion, with the support portion located between the crown portion and the substrate. The orthographic projection of the end of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate, and the edge of the crown portion is the edge of the isolation opening. The support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion.

18. The preparation method according to claim 17, characterized in that, The isolation opening includes a first side and a second side opposite to each other along a first direction, and a third side and a fourth side opposite to each other along a second direction. The deposition of the light-emitting material film and the conductive material film includes: moving the evaporation source and the display panel relative to each other along the second direction to deposit the light-emitting material film and the conductive material film, such that after forming the light-emitting functional layer and the second electrode, at the first side and / or the second side, the edge of the light-emitting functional layer is covered by the second electrode, and at the third side and the fourth side, at least a portion of the side surface of the edge of the light-emitting functional layer is not covered by the second electrode; and The stripping process for removing etching residues from the encapsulation material film, the photoresist pattern, and at least a portion of the light-emitting functional layer in the light-emitting device not covered by the encapsulation unit includes: in the isolation opening not covering the encapsulation unit, the stripping liquid used in the stripping process enters between the second electrode and the first electrode from at least the third side and the fourth side to remove the light-emitting functional layer, wherein after at least a portion of the light-emitting functional layer is removed, at least a portion of the second electrode settles onto the first electrode.

19. The preparation method according to claim 13 or 14, characterized in that, Also includes: After performing the wet etching to remove the second electrode not covered by the packaging unit, a stripping process is performed to remove etching residues located in the isolation opening.

20. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, and a plurality of first electrodes spaced apart from each other are formed on the substrate; An isolation structure with multiple isolation openings is formed on the substrate on which the first electrode is formed, and a light-emitting material thin film, a conductive material thin film, and an encapsulation material film are deposited. The multiple isolation openings include a first isolation opening and a second isolation opening. The portions of the light-emitting material thin film and the conductive material thin film located in the first isolation opening respectively form a light-emitting functional layer and a second electrode. The first electrode, the light-emitting functional layer, and the second electrode stacked on top of each other form a first type of light-emitting device. A photoresist layer is formed on the encapsulation material film, and the photoresist layer is patterned to form a photoresist pattern, the photoresist pattern covering the first isolation opening and exposing the second isolation opening; The encapsulation material film layer is dry etched based on the photoresist pattern to remove the encapsulation material film layer at the second isolation opening, while retaining the encapsulation material film layer at the first isolation opening. A stripping process is performed to remove the photoresist pattern, etching residues of the encapsulation material film at the second isolation opening, and at least a portion of the light-emitting material film at the second isolation opening, while the second electrode at the second isolation opening is retained. Wet etching is performed to remove the conductive material film at the second isolation opening, wherein at least a portion of the surface of the first electrode at the second isolation opening facing away from the substrate is etched. At least a portion of the film layer of the second type of light-emitting device is formed at the second isolation opening.

21. A display device, characterized in that, The display panel includes any one of claims 1 to 12 or a display panel obtained by the preparation method of any one of claims 13 to 20.

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