Display panel and its manufacturing method, display device, vapor deposition device

Abstract

This application provides a display panel and its fabrication method, a display device, and a vapor deposition apparatus. The display panel includes an array substrate, an isolation structure, and a light-emitting layer. The isolation structure is composed of multiple isolation substructures, each including multiple first isolation substructures. The multiple first isolation substructures are spaced apart in a first direction and extend along a second direction. The light-emitting layer includes light-emitting devices formed between two adjacent first isolation substructures, with a second electrode in the light-emitting device overlapping with the adjacent first isolation substructure. The multiple light-emitting devices are arranged in multiple light-emitting columns, which are arranged in a first direction. At least one light-emitting column is distributed between any two adjacent first isolation substructures. The light-emitting devices included in at least one light-emitting column emit the same color. This application reduces the risk of leakage current caused by the overlap between the light-emitting functional layer of the light-emitting device and the adjacent first isolation substructure by spaced the first isolation substructures in the first direction.

Description

Technical Field

[0001] This application relates to the field of displays, and in particular to a display panel and its preparation method, display device, and vapor deposition apparatus. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal maskless technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A and CN116648095A describe relevant content of fine metal maskless technology for reference.

[0004] However, in related technologies, vapor deposition equipment is usually used to deposit vapor deposition materials onto the substrate of the display panel. However, existing vapor deposition equipment can generally only limit the vapor deposition angle in the scanning direction of the nozzle movement, and cannot effectively limit the vapor deposition angle in other vapor deposition directions (nozzle direction). This will cause the organic material of the light-emitting functional layer to be deposited onto the isolation structure of the substrate, resulting in the risk of leakage current in the display panel. Summary of the Invention

[0005] In view of this, this application provides a display panel and its preparation method, display device, and vapor deposition apparatus to solve the problem of leakage current in the display panel caused by the vapor deposition of the light-emitting functional layer material onto the isolation structure of the substrate.

[0006] To address the aforementioned technical problems, this application provides a first aspect of a display panel, comprising: an array substrate; an isolation structure disposed on one side of the array substrate, comprising a plurality of isolation substructures, the plurality of isolation substructures including a plurality of first isolation substructures, the plurality of first isolation substructures being spaced apart in a first direction, the first isolation substructures extending along a second direction intersecting the first direction, each first isolation substructure including an isolation layer and a barrier layer sequentially disposed in a direction away from the array substrate, the orthographic projection of the isolation layer on the array substrate being located within the orthographic projection of the barrier layer on the array substrate; a light-emitting layer including light-emitting devices formed between two adjacent first isolation substructures, the light-emitting device including a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked in a direction away from the array substrate, the second electrode overlapping with adjacent first isolation substructures; the plurality of light-emitting devices included in the light-emitting layer being arranged in a plurality of light-emitting columns, the plurality of light-emitting columns being arranged in a first direction, each light-emitting column including a plurality of light-emitting devices spaced apart in a second direction, wherein at least one light-emitting column is distributed between any two adjacent first isolation substructures; the plurality of light-emitting devices included in at least one light-emitting column have the same emission color.

[0007] According to one embodiment of this application, the second electrodes of a plurality of light-emitting devices distributed between two adjacent first isolation substructures are continuous and uninterrupted.

[0008] According to one embodiment of this application, the light-emitting devices included in at least one light-emitting column emit different colors.

[0009] According to one embodiment of this application, the plurality of isolation substructures further include a plurality of second isolation substructures. When the light emission colors of the plurality of light emission devices in the light emission column are different, a second isolation substructure is provided between two adjacent light emission devices with different colors, and the second isolation substructure extends along the first direction.

[0010] According to one embodiment of this application, the display panel further includes a first encapsulation layer, which includes a plurality of encapsulation portions. The encapsulation portions are located on the side of the second electrode away from the array substrate, and extend through the sidewall of the isolation structure to the side of the isolation structure away from the array substrate. The plurality of encapsulation portions are disposed in correspondence with light-emitting devices of different colors on the side of the light-emitting devices away from the array substrate.

[0011] According to one embodiment of this application, the display panel further includes: a second encapsulation layer covering the isolation structure and the encapsulation portion; and a third encapsulation layer covering the second encapsulation layer.

[0012] According to one embodiment of this application, the first isolation substructure further includes: a base layer located between the isolation layer and the array substrate, wherein the orthographic projection of the isolation layer on the array substrate is located within the orthographic projection of the base layer on the array substrate.

[0013] According to one embodiment of this application, the base layer is made of molybdenum, the insulating layer is made of aluminum, and the barrier layer is made of titanium.

[0014] According to one embodiment of this application, the display panel further includes: a pixel definition layer located between the array substrate and the isolation structure, the pixel definition layer having pixel openings, and a light-emitting device located in the pixel openings; and / or, the first electrode is an anode and the second electrode is a cathode.

[0015] According to one embodiment of this application, the light-emitting functional layer is spaced apart from the sidewall of the adjacent first isolation substructure.

[0016] According to one embodiment of this application, the first direction is perpendicular to the second direction.

[0017] A second aspect of this application also provides a display device, including the display panel described in any of the above claims.

[0018] A third aspect of this application also provides a vapor deposition apparatus for vapor deposition of the display panel described in any of the above claims. The vapor deposition apparatus includes: a vapor deposition chamber, which is hollow; and a vapor deposition mechanism located in the vapor deposition chamber, including a first vapor deposition source and a second vapor deposition source. The first vapor deposition source is used to vapor deposition a light-emitting functional layer, and the second vapor deposition source is used to vapor deposition a second electrode. When vapor deposition of the light-emitting functional layer, the first vapor deposition source scans along a first direction, and a plurality of first vapor deposition nozzles on the first vapor deposition source are arranged along a second direction. When vapor deposition of the second electrode, the second vapor deposition source scans along the second direction, and a plurality of second vapor deposition nozzles on the second vapor deposition source are arranged along the first direction.

[0019] According to one embodiment of this application, the first vapor deposition source and the second vapor deposition source have the same vapor deposition direction; the vapor deposition apparatus further includes: a support stage for supporting the array substrate; and a rotating mechanism connected to the support stage for driving the support stage to rotate around its own axis.

[0020] According to one embodiment of this application, the evaporation directions of the first evaporation source and the second evaporation source are perpendicular; the evaporation apparatus further includes: a support stage for supporting the array substrate; and a rotation mechanism connected to the support stage for driving the support stage to rotate around the evaporation mechanism.

[0021] According to one embodiment of this application, the vapor deposition chamber includes a first vapor deposition chamber and a second vapor deposition chamber. A first vapor deposition nozzle is provided on the first vapor deposition chamber, and a second vapor deposition nozzle is provided on the second vapor deposition chamber. The first vapor deposition chamber and the second vapor deposition chamber are arranged perpendicularly to each other in a third direction, and the third direction intersects with the first direction and the second direction.

[0022] According to one embodiment of this application, the vapor deposition apparatus further includes: a first angle limiting plate for adjusting the vapor deposition angle of the first vapor deposition nozzle in the scanning direction of the first vapor deposition source; and a second angle limiting plate for adjusting the vapor deposition angle of the second vapor deposition nozzle in the scanning direction of the second vapor deposition source.

[0023] A fourth aspect of this application also provides a method for fabricating a display panel, the method comprising: forming an isolation structure on one side of an array substrate, the isolation structure including a plurality of isolation substructures, the plurality of isolation substructures including a plurality of first isolation substructures, the plurality of first isolation substructures being spaced apart in a first direction, the first isolation substructures extending along a second direction, the second direction intersecting the first direction, each first isolation substructure including an isolation layer and a barrier layer sequentially disposed in a direction away from the array substrate, the orthographic projection of the isolation layer on the array substrate being located within the orthographic projection of the barrier layer on the array substrate; forming a light-emitting device between two adjacent first isolation substructures, the light-emitting device including a first electrode, a light-emitting functional layer and a second electrode sequentially stacked in a direction away from the array substrate, the second electrode overlapping with the adjacent first isolation substructure; wherein, when depositing the light-emitting functional layer, a first evaporation source scans along the first direction, and a plurality of first evaporation nozzles on the first evaporation source are arranged along the second direction; when depositing the second electrode, a second evaporation source scans along the second direction, and a plurality of second evaporation nozzles on the second evaporation source are arranged along the first direction.

[0024] According to one embodiment of this application, the first evaporation source and the second evaporation source have the same evaporation direction; after the first evaporation source evaporates to form the light-emitting functional layer and before the second evaporation source evaporates to form the second electrode, the method further includes: driving the support platform of the support array substrate to rotate 90° around its own axis.

[0025] According to one embodiment of this application, the evaporation directions of the first evaporation source and the second evaporation source are perpendicular; after the first evaporation source evaporates to form the light-emitting functional layer and before the second evaporation source evaporates to form the second electrode, the method further includes: driving the support stage of the support array substrate to rotate 90° relative to the first evaporation source so that the support stage is perpendicular to the evaporation direction of the second evaporation source.

[0026] The beneficial effects of this application are as follows: This application provides a display panel, which includes an array substrate, an isolation structure, and a light-emitting layer. The isolation structure includes multiple isolation substructures, each of which includes multiple first isolation substructures. The multiple first isolation substructures are spaced apart in a first direction and extend along a second direction, which intersects with the first direction. The light-emitting layer includes a light-emitting device formed between two adjacent first isolation substructures. The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked in a direction away from the array substrate. The second electrode overlaps with an adjacent first isolation substructure. During the deposition of the light-emitting functional layer, a first deposition source scans along the first direction, and multiple first deposition nozzles on the first deposition source are arranged along the second direction. During the deposition of the second electrode, a second deposition source scans along the second direction, and multiple second deposition nozzles on the second deposition source are arranged along the first direction. By arranging the first isolation substructures spaced apart in the first direction and extending them along the second direction, this application reduces the risk of leakage caused by the overlap between the light-emitting functional layer and the isolation structure when the first deposition source scans along the first direction to deposit the light-emitting functional layer. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0028] Figure 1 This is a top view of a display panel provided in one embodiment of this application;

[0029] Figure 2 yes Figure 1 A schematic diagram of the partial film layer cross-section structure in the BB direction of a local area of ​​the display panel;

[0030] Figure 3 This is a schematic diagram of the structure of an array substrate provided in an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the structure of the driving transistor T1 and the data transistor T2 provided in an embodiment of this application;

[0032] Figure 5 A top view of a portion of the film layer structure of a display panel provided in an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of a partial film layer cross-section structure of a display panel provided in another embodiment of this application;

[0034] Figure 7 This is a schematic diagram of a light-emitting functional layer provided in an embodiment of this application;

[0035] Figure 8 This is a schematic diagram of the vapor deposition of organic materials in the direction of the nozzle arrangement (nozzle) of a vapor deposition device in the prior art;

[0036] Figure 9 This is a schematic diagram of the vapor deposition of organic / cathode materials in the scanning direction of the nozzle movement in the vapor deposition apparatus of the prior art;

[0037] Figure 10 This is a schematic diagram of the vapor deposition of organic material / cathode material overlapping and isolating structure in the nozzle arrangement (nozzle) direction and the nozzle movement (scan) direction in the prior art;

[0038] Figure 11 This is a simplified schematic diagram of a portion of the film layer cross-sectional structure of a display panel in the prior art;

[0039] Figure 12 This is a top view schematic diagram of a portion of the film layer structure of a display panel provided in an embodiment of this application;

[0040] Figure 13 This is a schematic diagram of a portion of the film layer cross-sectional structure of a display panel in a first direction, according to an embodiment of this application.

[0041] Figure 14 This is a schematic diagram of a portion of the film layer cross-sectional structure of a display panel in the second direction according to an embodiment of this application;

[0042] Figure 15 This is a schematic diagram of the scanning direction of the first vapor deposition source and the arrangement of the first vapor deposition nozzle according to an embodiment of this application;

[0043] Figure 16 This is a schematic diagram of the scanning direction of the second vapor deposition source and the arrangement of the second vapor deposition nozzle provided in an embodiment of this application;

[0044] Figure 17 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0045] Figure 18 This is a schematic diagram of the vapor deposition apparatus provided in one embodiment of this application;

[0046] Figure 19 This is a schematic diagram of the vapor deposition apparatus provided in another embodiment of this application;

[0047] Figure 20 This is a schematic diagram of the vapor deposition apparatus provided in another embodiment of this application;

[0048] Figure 21 This is a top view schematic diagram of a portion of the film layer structure of a display panel provided in another embodiment of this application. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0050] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0051] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0052] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0053] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0054] Figure 1This is a schematic diagram of the structure of a display panel according to one embodiment of this application. The display panel 10 can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel 10 includes a display area AA with display function and a non-display area NA.

[0055] The display area AA of the display panel 10 can be rectangular, square, circular, oval, or other shapes.

[0056] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is blue, the second sub-pixel SPX2 is green, and the third sub-pixel SPX3 is red. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0057] A sub-pixel (SPX) includes a pixel circuit and a light-emitting device driven by the pixel circuit to emit light of the corresponding color. The first sub-pixel (SPX1) includes a first light-emitting device, the second sub-pixel (SPX2) includes a second light-emitting device, and the third sub-pixel (SPX3) includes a third light-emitting device. One pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set according to a corresponding sensor and has light-transmitting properties, while the normal display area is a display area not set according to a corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0058] In one implementation, Figure 2 It shows Figure 1 A schematic diagram of a partial cross-sectional structure of the film layer in the BB direction of a local area of ​​the display panel. (Reference) Figure 2 The display panel 10 includes an array substrate 11, an isolation structure 12, and multiple light-emitting layers 13.

[0059] refer to Figure 3 The array substrate 11 includes a pixel circuit layer and a planarization layer 111. The pixel circuit layer includes pixel circuits for driving the light-emitting layer 13 to emit light. Figure 3A transistor 112 in a pixel circuit is shown. A via is provided in the planarization layer 111, and a first electrode 1311 is electrically connected to the transistor 112 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the array substrate 11 includes scan lines providing a scan signal Scan and data lines providing a data signal Data for the pixel circuit.

[0060] refer to Figure 4 The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line providing the data signal "Data," and the gate of the data transistor T2 is connected to the scan line providing the scan signal "Scan." The drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are connected to the gate and source of the driving transistor T1, respectively. The drain of the driving transistor T1 is connected to the light-emitting layer 13. Here, VDD represents the positive power supply, providing a high-level voltage to the circuit; it is the power supply symbol for electronic circuits. VSS represents the negative power supply (or ground potential), providing a low-level reference and working with VDD to form a current loop in the circuit.

[0061] Figure 4 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 4 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0062] refer to Figure 2 and Figure 5An isolation structure 12 is located on one side of the array substrate 11 and encloses multiple isolation openings 12a, including multiple first isolation openings 12a1, multiple second isolation openings 12a2, and multiple third isolation openings 12a3. Multiple light-emitting layers 13 are located on one side of the array substrate 11 and include multiple first light-emitting devices 13a, multiple second light-emitting devices 13b, and multiple third light-emitting devices 13c. The first light-emitting devices 13a are disposed corresponding to the first isolation opening 12a1, the second light-emitting devices 13b are disposed corresponding to the second isolation opening 12a2, and the third light-emitting devices 13c are disposed corresponding to the third isolation opening 12a3. In one embodiment, one light-emitting layer 13 is disposed corresponding to one isolation opening 12a. For example, the first light-emitting devices 13a are disposed one-to-one with the first isolation opening 12a1, the second light-emitting devices 13b are disposed one-to-one with the second isolation opening 12a2, and the third light-emitting devices 13c are disposed one-to-one with the third isolation opening 12a3. At least a portion of the first light-emitting device 13a is disposed within a corresponding first isolation opening 12a1, at least a portion of the second light-emitting device 13b is disposed within a corresponding second isolation opening 12a2, and at least a portion of the third light-emitting device 13c is disposed within a corresponding third isolation opening 12a3. In another embodiment, multiple light-emitting layers 13 are correspondingly disposed with one isolation opening 12a; for example, multiple light-emitting devices with the same emission color are corresponding to one isolation opening 12a.

[0063] In one example, the isolation structure 12 includes an isolation layer 1212 and a barrier layer 1211 stacked along a direction away from the array substrate 11 (i.e., the Z direction), with the width of the barrier layer 1211 being greater than the width of the isolation layer 1212. Consequently, the two ends of the barrier layer 1211 protrude compared to the sides of the isolation layer 1212, and this shape of the isolation structure 12 is also referred to as a cantilever shape. The isolation layer 1212 and the barrier layer 1211 are made of different materials, and the etching rate of the barrier layer 1211 is lower than that of the isolation layer 1212. The isolation layer 1212 is made of a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The barrier layer 1211 can be a single-layer structure or a multi-layer structure. If the barrier layer 1211 is a single-layer structure, the material of the barrier layer 1211 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. When the barrier layer 1211 has a multilayer structure, one layer of the barrier layer 1211 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy, and the other layer of the barrier layer 1211 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0064] The first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c emit light of different colors. Each of the three devices includes a first electrode 1311, a light-emitting functional layer 1312, and a second electrode 1313 stacked together. The first electrode 1311 is disposed on the array substrate 11, and a pixel defining layer 17 covers the end of the first electrode 1311. A pixel opening is provided on the pixel defining layer 17, through which the first electrode 1311 is exposed. The light-emitting functional layer 1312 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c covers the sidewall of the pixel opening of the pixel defining layer 17 and the side of the pixel defining layer 17 facing away from the array substrate 11. Each light-emitting functional layer 1312 is located within the pixel opening and is in contact with the first electrode 1311.

[0065] The second electrodes 1313 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c respectively cover the corresponding light-emitting functional layers 1312. The second electrodes 1313 are electrically connected to the isolation structure 12. For example, the second electrodes 1313 are connected to the isolation layer 1212 of the isolation structure 12, and / or the second electrodes 1313 are connected to the base layer 1213 of the isolation structure 12.

[0066] The first electrode 1311 can be an anode, and the second electrode 1313 can be a cathode. The first electrode 1311 of each light-emitting layer 13 can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting layer 13 to emit light.

[0067] The first electrode 1311 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 1313 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0068] Figure 7This is a schematic diagram of a light-emitting functional layer according to one embodiment of this application. The light-emitting functional layer 1312 of at least one of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the array substrate 11 (i.e., the Z direction). The light-emitting functional layer 1312 may include a single light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0069] In order for the light-emitting functional layer 1312 to emit light, a pixel voltage is provided to the first electrode 1311 and a common voltage is provided to the second electrode 1313, respectively, forming a potential difference between the first electrode 1311 and the second electrode 1313, so that the light-emitting functional layer 1312 disposed between the first electrode 1311 and the second electrode 1313 emits light. In one embodiment, if a potential difference is formed between the first electrode 1311 and the second electrode 1313 of the first light-emitting device 13a, the light-emitting material layer EML of the light-emitting functional layer 1312 emits blue light; if a potential difference is formed between the first electrode 1311 and the second electrode 1313 of the second light-emitting device 13b, the light-emitting material layer EML of the light-emitting functional layer 1312 emits green light; and if a potential difference is formed between the first electrode 1311 and the second electrode 1313 of the third light-emitting device 13c, the light-emitting material layer EML of the light-emitting functional layer 1312 emits red light.

[0070] In this configuration, the pixel voltage of the first electrode 1311 is provided by the pixel circuit, and the common voltage of the second electrode 1313 is provided by the isolation structure 12. Specifically, the second electrode 1313 is electrically connected to the isolation structure 12, and the common voltage is supplied to the second electrode 1313 by providing the isolation structure 12. That is, the isolation structure 12 has the function of supplying a common voltage to the second electrode 1313.

[0071] The display panel 10 also includes a first encapsulation layer (not shown). The first encapsulation layer includes a plurality of encapsulation portions 14. The encapsulation portions 14 are located on the side of the second electrode 1313 facing away from the array substrate 11, and extend through the sidewall of the isolation structure 12 to the side of the isolation structure 12 facing away from the array substrate 11. The plurality of encapsulation portions 14 are correspondingly disposed on the side of the light-emitting device 131 facing away from the array substrate 11, corresponding to the plurality of first light-emitting devices 13a. The plurality of encapsulation portions 14 include a plurality of first encapsulation portions 14a corresponding to a plurality of first light-emitting devices 13a, a plurality of second encapsulation portions 14b corresponding to a plurality of second light-emitting devices 13b, and a plurality of third encapsulation portions 14c corresponding to a plurality of third light-emitting devices 13c. The first encapsulation portion 14a is disposed on the side of the corresponding first light-emitting device 13a facing away from the array substrate 11, the second encapsulation portion 14b is disposed on the side of the corresponding second light-emitting device 13b facing away from the array substrate 11, and the third encapsulation portion 14c is disposed on the side of the corresponding third light-emitting device 13c facing away from the array substrate 11.

[0072] like Figure 2 As shown, the display panel 10 further includes a second encapsulation layer 15 and a third encapsulation layer 16. The second encapsulation layer 15 covers the isolation structure 12 and the encapsulation portion 14, and the third encapsulation layer 16 covers the second encapsulation layer 15. Both the first encapsulation layer and the third encapsulation layer 16 are inorganic materials, and the materials of the first encapsulation layer and the third encapsulation layer 16 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 15 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 15 and the third encapsulation layer 16 are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the bezel area NA.

[0073] The display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate, and a protective cover. This film layer may also be bonded to the display panel via an adhesive layer such as OCA (Optical Clear Adhesive).

[0074] In the process of manufacturing the aforementioned display panel, a vapor deposition process is typically used to form the light-emitting functional layer 1312 and the second electrode 1313, as shown in the figure. Figure 8 and Figure 9The deposition source used is typically a line source. The deposition angle of the nozzle 61 on the crucible body 60 differs in the nozzle arrangement direction and the scanning direction of the nozzle movement. The nozzle arrangement direction is usually perpendicular to the scanning direction of the nozzle movement. Because of the angle limiting plate 63, the deposition angle in the scanning direction of the nozzle movement can be limited as needed, keeping it within a sufficiently small range. However, the line source cannot effectively limit the deposition angle in the nozzle direction. In the nozzle direction, due to the larger deposition angle, organic deposition materials may be deposited on the surface during the deposition of the light-emitting functional layer 52. Figure 10 and Figure 11 On the isolation structure 51 of the OLED device shown, the light-emitting effect of the light-emitting device is affected. Furthermore, due to hardware limitations, the difference in emission angle between the organic material during the deposition of the light-emitting functional layer 52 and the cathode material during the deposition of the second electrode 53 cannot be sufficiently large. This results in a small overlap area between the second electrode 53 and the sidewall of the isolation structure 51, leading to a large contact barrier for the second electrode 53 and affecting product performance. Therefore, this application makes further improvements based on the above solution, as follows:

[0075] See Figure 2 The display panel 10 includes an array substrate 11, an isolation structure 12, and a light-emitting layer 13. The structure of the array substrate 11 and the structure of the light-emitting devices included in the light-emitting layer 13 are the same as those in the above embodiments, and will not be described again here.

[0076] Unlike the above-described implementation method, in conjunction with reference to... Figure 12 , Figure 13 and Figure 14 In this embodiment, the isolation structure 12 is no longer Figure 5The mesh structure shown in this embodiment, the isolation structure 12 is composed of multiple isolation substructures, each including multiple first isolation substructures 121. These first isolation substructures 121 are spaced apart in a first direction X and extend along a second direction Y, which intersects with the first direction X. Each first isolation substructure 121 includes an isolation layer 1212 and a barrier layer 1211 sequentially disposed in a direction away from the array substrate 11. The orthographic projection of the isolation layer 1212 onto the array substrate 11 lies within the orthographic projection of the barrier layer 1211 onto the array substrate 11. The light-emitting layer 13 includes layers formed on adjacent... A light-emitting device 131 is located between two first isolation substructures 121. The light-emitting device 131 includes a first electrode 1311, a light-emitting functional layer 1312, and a second electrode 1313 sequentially stacked in the direction away from the array substrate 11. The second electrode 1313 overlaps with the adjacent first isolation substructure 121. The light-emitting layer 13 includes multiple light-emitting devices 131 arranged in multiple light-emitting columns 132. The multiple light-emitting columns 132 are arranged in a first direction X, and each light-emitting column 132 includes multiple light-emitting devices 131 spaced apart in a second direction Y. At least one light-emitting column 132 is distributed between any two adjacent first isolation substructures 121. The light-emitting devices 131 included in at least one light-emitting column 132 emit the same color. The isolation layer 1212 and the barrier layer 1211 correspond to the structures in the above embodiments; please refer to the relevant content above for details.

[0077] Specifically, unlike the above embodiments, in this embodiment, the isolation structure 12 extends along the second direction Y between the light-emitting columns 132 and is provided with a first isolation substructure 121.

[0078] When depositing the light-emitting functional layer 1312 of the light-emitting device 131 with the same light-emitting color, the first evaporation source 391 (the evaporation source for depositing the light-emitting functional layer 1312) scans along the first direction X, that is, the Scan direction of the first evaporation source 391 is the first direction X, and the Nozzle direction of the first evaporation source 391 is the second direction Y. At this time, since the evaporation angle of the first evaporation nozzle 31 can be adjusted by the first angle limiting plate 35 in the Scan direction (i.e. the first direction X), the evaporation angle is small, so the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructure 121 arranged at intervals in the first direction X, which can avoid the leakage problem caused by the side overlap of the light-emitting functional layer 1312 and the first isolation substructure 121. In the Nozzle direction (i.e., the second direction Y) of the first evaporation source 391, although there is no angle limiting plate to limit the evaporation angle, since there is no first isolation substructure 121 in the Nozzle direction of the first evaporation source 391, there will be no phenomenon of the organic material of the light-emitting functional layer 1312 overlapping with the first isolation substructure 121. Therefore, the design of this application can effectively avoid the organic material of the light-emitting functional layer 1312 of the light-emitting device 131 with the same light-emitting color overlapping with the first isolation substructure 121, thus avoiding lateral leakage.

[0079] When depositing the second electrode 1313, the second evaporation source 392 (used for depositing the second electrode 1313) scans along the second direction Y, that is, the scan direction of the second evaporation source 392 is the second direction Y, and the nozzle direction of the second evaporation source 392 is the first direction X. At this time, in the nozzle direction (i.e., the first direction X), since there is no angle limiting plate to limit the evaporation angle, the evaporation angle is larger, which can ensure sufficient overlap between the second electrode 1313 and the first isolation substructure 121, reducing the overlap impedance between the second electrode 1313 and the first isolation substructure 121. Meanwhile, in the scan direction (i.e., the second direction Y), referencing... Figure 14 Since the first isolation substructure 121 is not provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0080] Multiple light-emitting devices 131 are arranged into multiple light-emitting columns 132, which are arranged in an orderly manner in the first direction X. Each light-emitting column 132 contains multiple light-emitting devices 131 spaced apart in the second direction Y, making the pixel distribution more regular and dense. More pixels can be arranged in a unit area, making it possible to achieve high-resolution display and meeting users' needs for high-definition display.

[0081] At least one light-emitting column 132 is distributed between any two adjacent first isolation substructures 121, which can promote the uniformity of light emission, reduce the brightness difference of the displayed screen, avoid local overly bright or dark areas, improve the overall visual effect, and make the displayed content clearer and more natural.

[0082] This regular arrangement facilitates the manufacturing process. In processes such as vapor deposition and photolithography, the equipment can more easily operate according to the predetermined row and column pattern, reducing process difficulty and improving production efficiency. For example, during vapor deposition, the position and amount of material to be vaporized can be precisely controlled based on the row and column distribution.

[0083] At least one light-emitting column 132 includes multiple light-emitting devices 131 that emit the same color. When multiple light-emitting devices 131 within the same light-emitting column 132 emit the same color, color crosstalk between adjacent pixels can be avoided, ensuring the color purity of each pixel. When displaying solid color areas (such as background colors, charts, etc.), uniform and consistent colors can be presented, reducing color spots or color differences and improving the overall quality of the displayed image.

[0084] For display driving systems, controlling light-emitting devices of the same color uniformly by using light-emitting columns 132 can reduce the complexity of color data processing. For example, in an RGB three-color display system, each light-emitting column only needs to process data for a single color channel, reducing data transmission volume and the load on the driving circuit, and improving display response speed.

[0085] Light-emitting columns of the same color can share the driving circuit, reducing the number of chip pins and wiring complexity. Each light-emitting column 132 can be driven by transistors 112 in the same row, simplifying the backplane circuit design.

[0086] Furthermore, the light-emitting devices 131 included in the light-emitting column 132 emit the same color, which facilitates the setting of the corresponding packaging part 14. This allows multiple light-emitting devices 131 of the same color in the same light-emitting column 132 to be packaged simultaneously, thereby reducing costs and process difficulty.

[0087] According to one embodiment of this application, the second electrodes 1313 of a plurality of light-emitting devices 131 distributed between two adjacent first isolation substructures 121 are continuous and uninterrupted.

[0088] In this embodiment, the continuous and uninterrupted arrangement of the second electrodes 1313 reduces the contact resistance between the electrodes. If there are breaks or gaps in the electrodes, additional resistance will be formed at the connection, increasing the obstruction to current transmission. A continuous arrangement of the second electrodes 1313 allows for smoother current transmission, reduces power consumption, improves the efficiency of converting electrical energy into light energy, and enhances the luminous performance of the display panel.

[0089] The continuous and uninterrupted arrangement of the second electrode 1313 is conducive to achieving a uniform distribution of current among each light-emitting device 131, ensuring that each light-emitting device 131 receives a relatively consistent current, avoiding brightness differences caused by uneven current, improving the uniformity and consistency of the display screen, optimizing display quality, and reducing poor display phenomena such as "bright spots" and "dark areas".

[0090] In manufacturing processes such as vapor deposition, the continuous and uninterrupted second electrode 1313 does not require multiple interruptions and restarts of the deposition process, reducing process steps and complexity, improving production efficiency, and reducing the defect rate caused by multiple operations during the manufacturing process, such as electrode misalignment and uneven thickness.

[0091] The continuous second electrode 1313 forms a whole in structure, providing better mechanical stability and structural strength for the display panel 10. It can resist damage to the display panel to a certain extent from external pressure, bending and other physical actions, reduce the risk of electrical performance degradation caused by structural deformation and extend the service life of the display panel.

[0092] According to one embodiment of this application, referring to Figure 21 At least one light-emitting column 132 includes multiple light-emitting devices 131 that emit different colors. Light-emitting devices 131 of different colors can achieve a wider color gamut coverage through optical mixing, meeting the requirements of high-definition display for color reproduction.

[0093] It should be noted that for the multiple light-emitting devices 131 with different light-emitting colors in the light-emitting column 132, they need to be packaged separately to ensure the color consistency of the entire screen.

[0094] According to one embodiment of this application, continue to refer to Figure 21 The multiple isolation substructures also include multiple second isolation substructures 122. When the light emission colors of the multiple light emission devices 131 in the light emission column 132 are different, a second isolation substructure 122 is provided between two adjacent light emission devices 131 with different colors. The second isolation substructure 122 extends along the first direction X.

[0095] The second isolation substructure 122 can cause the film layer to be disconnected at the second isolation substructure 122 when the film layer in two adjacent light-emitting devices 131 is deposited, ensuring that the film layer of each light-emitting device 131 is in its corresponding pixel opening.

[0096] In some implementations, the second isolation substructure 122 may have the same structure as the first isolation substructure 121.

[0097] It should be noted that in some embodiments, the isolation structure 12 may consist of only a plurality of first isolation substructures 121, that is, the isolation structure 12 includes only a plurality of first isolation substructures 121 and does not include other structures.

[0098] In some embodiments, the light-emitting devices 131 included in at least one light-emitting column 132 emit different colors, and the light-emitting devices 131 included in at least one light-emitting column 132 emit the same color.

[0099] According to one embodiment of this application, referring to Figure 6 and Figure 13 The first isolation substructure 121 also includes a base layer 1213, which is located between the isolation layer 1212 and the array substrate 11. The orthographic projection of the isolation layer 1212 on the array substrate 11 is located within the orthographic projection of the base layer 1213 on the array substrate 11.

[0100] In this embodiment of the application, the first isolation substructure 121 may further include a base layer 1213 located on the side of the isolation layer 1212 close to the array substrate 11. The base layer 1213 protrudes from the isolation layer 1212 in the direction toward the isolation opening 12a. The orthographic projection of the isolation layer 1212 on the array substrate 11 is located within the orthographic projection of the base layer 1213 on the array substrate 11.

[0101] The base layer 1213 is located between the isolation layer 1212 and the array substrate 11, providing a more stable foundation support for the first isolation substructure 121. It can effectively disperse the pressure exerted by the upper structure (such as the isolation layer 1212, the barrier layer 1211, etc.) and the subsequently formed light-emitting layer 13, enhance the adhesion stability of the first isolation substructure 121 on the array substrate 11, prevent the first isolation substructure 121 from tilting or falling off, and improve the overall structural strength of the display panel 10.

[0102] The base layer 1213 can work in conjunction with the isolation layer 1212 to further enhance the electrical isolation effect on adjacent light-emitting devices 131. This prevents current leakage and crosstalk between adjacent light-emitting devices 131, ensures the independence of the electrical performance of each light-emitting device 131, improves the display quality and stability of the display panel 10, and reduces the occurrence of display abnormalities.

[0103] According to one embodiment of this application, the material of the base layer 1213 includes molybdenum, the material of the isolation layer 1212 includes aluminum, and the material of the barrier layer 1211 includes titanium.

[0104] The substrate 1213 can be made of molybdenum (Mo), which has good electrical conductivity and can serve as the first electrode 1311 or a signal transmission layer. This reduces the resistance between the driving circuit and the light-emitting device 131, decreases energy loss, and improves luminous efficiency. Molybdenum has good adhesion to the glass or silicon-based array substrate 11, enhancing the bonding strength between the first isolating substructure 121 and the array substrate 11, preventing delamination or detachment, and improving panel reliability. Molybdenum is easily etched into precise patterns using dry etching, making it suitable for fabricating fine first isolating substructure substrates to meet the requirements of high-resolution displays.

[0105] The insulating layer 1212 is made of aluminum (Al), which has high reflectivity (visible light reflectivity >90%). This reflects light emitted downwards from the light-emitting layer 13 back to the display surface, improving light extraction efficiency, enhancing display brightness, and reducing power consumption. Aluminum also has excellent conductivity, serving as a lateral conductive channel to evenly distribute current to each light-emitting device 131, reducing voltage drop and improving brightness uniformity. Furthermore, aluminum forms stable intermetallic compounds (such as MoAl) at the interface with molybdenum. 12 This inhibits atomic diffusion, prevents electromigration, and extends device lifespan.

[0106] The barrier layer 1211 is made of titanium, which (Ti) has excellent barrier properties, preventing aluminum atoms from diffusing into the light-emitting layer 13. Aluminum is prone to migration under high temperatures or electric fields, potentially leading to performance degradation or short circuits in the light-emitting functional layer 1312. The titanium barrier layer effectively isolates this risk. The dense oxide layer (TiO2) formed on the titanium surface has good chemical stability, protecting the underlying aluminum layer (isolation layer 1212) from oxidation or corrosion, especially improving device durability in humid environments. Titanium has good wettability to the light-emitting functional layer 1312, optimizing the interfacial contact between the second electrode 1313 and the light-emitting layer 13, reducing contact resistance, and improving carrier injection efficiency.

[0107] In some embodiments, the material of the base layer 1213 may also include at least one of titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0108] According to one embodiment of this application, referring to Figure 2 and Figure 3 The display panel 10 also includes a pixel definition layer 17, which is located between the array substrate 11 and the isolation structure 12. The pixel definition layer 17 has pixel openings, and the light-emitting device 131 is located in the pixel openings.

[0109] In this embodiment, the display panel 10 may further include a pixel definition layer 17, on which pixel openings communicating with isolation openings 12a are provided, and light-emitting devices 131 are disposed in the pixel openings. Specifically, the pixel definition layer 17 is provided with a first pixel opening communicating with a first isolation opening 12a1, a second pixel opening communicating with a second isolation opening 12a2, and a third pixel opening communicating with a third isolation opening 12a3. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the array substrate 11 may be the same or different. The shapes of the orthographic projections of the pixel openings and the corresponding isolation openings 12a on the array substrate 11 may be the same or different. Generally speaking, the area of ​​the orthographic projection of the isolation opening 12a on the array substrate 11 is larger than the area of ​​the orthographic projection of the pixel opening communicating with the isolation opening 12a on the array substrate 11. The orthographic projections of the pixel openings of the light-emitting layer 13 on the array substrate 11 overlap with the orthographic projections of the isolation openings 12a on the array substrate 11. The pixel definition layer 17 is made of an inorganic material, such as an inorganic insulating material formed by using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0110] According to one embodiment of this application, the first electrode 1311 is the anode and the second electrode 1313 is the cathode.

[0111] According to one embodiment of this application, the light-emitting functional layer 1312 is spaced apart from the sidewall of the adjacent first isolation substructure 121.

[0112] In this embodiment, the light-emitting functional layer 1312 does not contact the sidewall of the adjacent first isolation substructure 121, so as to avoid lateral leakage caused by the side overlap of the light-emitting functional layer 1312 and the first isolation substructure 121.

[0113] According to one embodiment of this application, the first direction X is perpendicular to the second direction Y. Of course, in other embodiments, the first direction X may not be perpendicular to the second direction Y.

[0114] Reference Figure 17 A second aspect of this application provides a display device 20, including the display panel 10 described in any of the preceding claims. The specific structure of the display panel 10 can be found in the aforementioned related content and will not be described in detail here. The display device 20 may include devices with image processing capabilities, such as mobile phones, desktop computers, laptops, tablets, in-vehicle displays, wearable devices, etc. Because this display device includes the display panel described in this application, the reliability of this electronic device is higher.

[0115] Reference Figure 15 , Figure 16 and Figure 18A third aspect of this application provides a vapor deposition apparatus 30 for vapor deposition of a display panel 10 as described above. The vapor deposition apparatus 30 includes a vapor deposition chamber 33 and a vapor deposition mechanism 39. The vapor deposition chamber 33 is hollow. The vapor deposition mechanism 39 is located in the vapor deposition chamber 33 and includes a first vapor deposition source 391 and a second vapor deposition source 392. The first vapor deposition source 391 is used to vapor deposit a light-emitting functional layer 1312, and the second vapor deposition source 392 is used to vapor deposit a second electrode 1313. When vapor depositing the light-emitting functional layer 1312, the first vapor deposition source 391 scans along a first direction X, and a plurality of first vapor deposition nozzles 31 on the first vapor deposition source 391 are arranged along a second direction Y. When vapor depositing the second electrode 1313, the second vapor deposition source 392 scans along the second direction Y, and a plurality of second vapor deposition nozzles 32 on the second vapor deposition source 392 are arranged along the first direction X.

[0116] In this embodiment of the application, the vapor deposition apparatus 30 is used to vapor deposit to form the display panel 10, and the vapor deposition mechanism 39 is located in the hollow vapor deposition cavity 33. The vapor deposition mechanism 39 includes a first vapor deposition source 391 and a second vapor deposition source 392. The first vapor deposition source 391 is used to vapor deposit the light-emitting functional layer 1312, and the second vapor deposition source 392 is used to vapor deposit the second electrode 1313.

[0117] In maskless evaporation technology, the evaporation source used is typically a linear source (i.e., the evaporation nozzles are arranged in a single row). The evaporation angle of the nozzles on the crucible body differs in the nozzle arrangement (nozzle) direction and the nozzle scanning direction. The nozzle arrangement (nozzle) direction is usually perpendicular to the nozzle scanning direction. The nozzle scanning direction can be used to limit the evaporation angle as needed using an angle limiting plate, controlling the evaporation angle within a sufficiently small range. However, the linear source cannot effectively limit the evaporation angle in the nozzle direction. In the nozzle direction, due to the larger evaporation angle, the organic material may be deposited onto the isolation structure during the evaporation of the light-emitting functional layer, affecting the light-emitting effect of the device. The organic materials in the light-emitting functional layer are highly conductive; if the light-emitting functional layer overlaps with the isolation structure, it will cause leakage in the final OLED device. Therefore, this embodiment improves the performance of the display panel 10 by changing the evaporation direction.

[0118] In this embodiment, the isolation structure 12 in the display panel 10 is configured as follows: (Refer to...) Figure 12The isolation structure 12 includes multiple isolation substructures, each including multiple first isolation substructures 121. The multiple first isolation substructures 121 are arranged at intervals along a first direction X. The first isolation substructures 121 extend along a second direction Y, which intersects with the first direction X. That is, the first isolation substructures 121 are provided extending along the second direction Y, but no first isolation substructures 121 are provided along the first direction X.

[0119] Reference Figure 15 Under the above-mentioned configuration of the first isolation substructure 121, the first vapor deposition source 391 vapor deposition method is as follows: multiple first vapor deposition nozzles 31 on the first vapor deposition source 391 are arranged along the second direction Y, and when vapor deposition of the light-emitting functional layer 1312, the first vapor deposition source 391 scans along the first direction X.

[0120] During the deposition of the light-emitting functional layer 1312, the first deposition source 391 scans along the first direction X. Since the deposition angle of the first deposition nozzle 31 can be adjusted in the scanning direction of the first deposition source 391 via the first angle limiting plate 35 in the first direction X, the deposition angle is kept small. This prevents the light-emitting functional layer 1312 from depositing onto the sides of the first isolation substructures 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the overlap between the light-emitting functional layer 1312 and the sides of the first isolation substructures 121. In the second direction Y, where multiple first deposition nozzles 31 are arranged, although the first angle limiting plate 35 does not restrict the deposition angle, there are no first isolation substructures 121 in the second direction Y. Therefore, there is no overlap between the organic material and the first isolation substructure 121. Thus, the design of this application effectively avoids the overlap between the light-emitting functional layer 1312 formed by the organic material and the first isolation substructure 121, preventing lateral leakage.

[0121] Reference Figure 16 Under the above-mentioned configuration of the first isolation substructure 121, the second evaporation source 392 evaporates in the following manner: multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X, and when evaporating the second electrode 1313, the second evaporation source 392 scans along the second direction Y.

[0122] When depositing the second electrode 1313, the second evaporation source 392 scans along the second direction Y, that is, the scan direction of the second evaporation source 392 is the second direction Y, and the nozzle direction of the second evaporation source 392 is the first direction X. At this time, in the nozzle direction (i.e., the first direction X), since there is no angle limiting plate to limit the evaporation angle, the evaporation angle is larger, which can ensure sufficient overlap between the second electrode 1313 and the first isolation substructure 121, reducing the overlap impedance between the second electrode 1313 and the first isolation substructure 121. Meanwhile, in the scan direction (i.e., the second direction Y), referencing... Figure 14 Since the first isolation substructure 121 is not provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0123] According to one embodiment of this application, referring to Figure 19 The first vapor deposition source 391 and the second vapor deposition source 392 have the same vapor deposition direction; the vapor deposition apparatus 30 also includes a support stage 34 and a rotating mechanism 38. The support stage 34 is used to support the array substrate 11; the rotating mechanism 38 is connected to the support stage 34 and is used to drive the support stage 34 to rotate around its own axis L1.

[0124] In this embodiment, the first evaporation source 391 and the second evaporation source 392 have the same evaporation direction. The evaporation direction refers to the emission direction of the first evaporation source 391 and the second evaporation source 392, that is, the evaporation material is emitted from the first evaporation source 391 and the second evaporation source 392 in the same direction. The evaporation direction of the first evaporation source 391 and the second evaporation source 392 can be both horizontal and both vertical. The same evaporation direction provides a unified spatial reference for different evaporation steps (evaporation of the light-emitting functional layer 1312, the second electrode 1313, etc.). Regardless of which film layer is evaporated, the material emission angle and the path to the array substrate 11 are consistent, which facilitates the unified setting and control of process parameters (such as evaporation distance, angle, etc.), reduces the complexity of process adjustment caused by differences in evaporation direction, and improves process stability and repeatability.

[0125] The rotating mechanism 38 is connected to the support stage 34, which supports the array substrate 11. The mask 37 covers the areas of the array substrate 11 that do not require vapor deposition. The rotating mechanism 38 drives the support stage 34 to rotate around its own axis L1. The vapor deposition apparatus 30 preferentially vapor deposits to form the light-emitting functional layer 1312. During the vapor deposition of the light-emitting functional layer 1312, the first vapor deposition source 391 scans along the first direction X. Multiple first vapor deposition nozzles 31 on the first vapor deposition source 391 are arranged along the second direction Y. Therefore, the vapor deposition angle of the first vapor deposition nozzles 31 in the scanning direction of the first vapor deposition source 391 can be adjusted by the first angle limiting plate 35 in the first direction X, so that the vapor deposition angle is small and the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructures 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the overlap between the side of the light-emitting functional layer 1312 and the first isolation substructures 121. In the second direction Y where the multiple first vapor deposition nozzles 31 are arranged, although there is no first angle limiting plate 35 to limit the vapor deposition angle, there is no first isolation substructure 121 in the second direction Y. Therefore, there will be no phenomenon of organic material overlapping with the first isolation substructure 121. Thus, the design of this application can effectively avoid organic material overlapping with the first isolation substructure 121 and avoid lateral leakage.

[0126] After the light-emitting functional layer 1312 is deposited, the deposition apparatus 30 deposits the second electrode 1313. The rotating mechanism 38 drives the support stage 34 to rotate around its own axis L1, so that the second deposition source 392 and the first deposition source 391 are on the same horizontal plane facing the array substrate 11 for deposition. Figure 19 The deposition process involves horizontal evaporation (or vertical evaporation of the array substrate 11 by the second evaporation source 392 and the first evaporation source 391 in the same vertical direction, not shown in the figure). After the support stage 34 rotates around its own axis L1, the second evaporation source 392 scans along the second direction Y to deposit the second electrode 1313, and the multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X. Since the multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X, the evaporation angle of the second evaporation nozzles 32 can be adjusted in the second direction Y by the second angle limiting plate 36 in the scanning direction (second direction Y) of the second evaporation source 392, so that the evaporation angle is larger and the evaporation efficiency is accelerated. Meanwhile, in the first direction X, since there is no second angle limiting plate 36 to limit the evaporation angle, the evaporation angle is larger, which can ensure sufficient overlap between the second electrode 1313 and the first isolation substructure 121, reducing the overlap impedance between the second electrode 1313 and the first isolation substructure 121. In the second direction Y, referring to... Figure 14 Since the first isolation substructure 121 is not provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0127] According to one embodiment of this application, referring to Figure 20 The evaporation directions of the first evaporation source 391 and the second evaporation source 392 are perpendicular. The evaporation apparatus 30 also includes a support stage 34 and a rotation mechanism 38. The support stage 34 is used to support the array substrate 11. The rotation mechanism 38 is connected to the support stage 34 and is used to drive the support stage 34 to rotate around the evaporation mechanism 39.

[0128] In this embodiment, the evaporation directions of the first evaporation source 391 and the second evaporation source 392 are perpendicular. The first evaporation source 391 is for horizontal evaporation, and the second evaporation source 392 is for vertical evaporation (or, the first evaporation source 391 is for vertical evaporation, and the second evaporation source 392 is for horizontal evaporation, but not shown in the figure). The evaporation direction refers to the emission direction of the first evaporation source 391 and the second evaporation source 392, that is, the direction in which the evaporation material is emitted from the first evaporation source 391 and the second evaporation source 392 is perpendicular.

[0129] The rotating mechanism 38 is connected to the support stage 34, which supports the array substrate 11. The rotating mechanism 38 drives the support stage 34 to rotate around the evaporation mechanism. The mask 37 covers areas of the array substrate 11 that do not require evaporation. The evaporation apparatus 30 preferentially evaporates to form the light-emitting functional layer 1312. During the evaporation of the light-emitting functional layer 1312, the first evaporation source 391 scans along the first direction X. Multiple first evaporation nozzles 31 on the first evaporation source 391 are arranged along the second direction Y. Therefore, the evaporation angle of the first evaporation nozzles 31 in the first direction X can be adjusted by the first angle limiting plate 35 in the scanning direction of the first evaporation source 391, so that the evaporation angle is small and the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructures 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the overlap of the side of the light-emitting functional layer 1312 and the first isolation substructures 121. In the second direction Y where the multiple first vapor deposition nozzles 31 are arranged, although there is no first angle limiting plate 35 to limit the vapor deposition angle, there is no first isolation substructure 121 in the second direction Y. Therefore, there will be no phenomenon of organic material overlapping with the first isolation substructure 121. Thus, the design of this application can effectively avoid organic material overlapping with the first isolation substructure 121 and avoid lateral leakage.

[0130] After the light-emitting functional layer 1312 is deposited, the deposition apparatus 30 deposits the second electrode 1313. The rotating mechanism 38 drives the support stage 34 to rotate around the deposition mechanism, so that the second deposition source 392 and the first deposition source 391 are not on the same horizontal plane. The first deposition source 391 performs horizontal deposition on the array substrate 11, and the second deposition source 392 performs vertical deposition on the array substrate 11 (or the first deposition source 391 performs vertical deposition on the array substrate 11, and the second deposition source 392 performs horizontal deposition on the array substrate 11). After the support stage 34 rotates around the deposition mechanism, the second deposition source 392 scans along the second direction Y to deposit the second electrode 1313, and the multiple second deposition nozzles 32 on the second deposition source 392 are arranged along the first direction X. Since the multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X, the evaporation angle of the second evaporation nozzles 32 can be adjusted in the second direction Y by the second angle limiting plate 36 in the scanning direction (second direction Y) of the second evaporation source 392, resulting in a larger evaporation angle and faster evaporation efficiency. Simultaneously, in the first direction X, since there is no second angle limiting plate 36 to restrict the evaporation angle, the evaporation angle is larger, ensuring sufficient overlap between the second electrode 1313 and the first isolating substructure 121, reducing the overlap resistance between the second electrode 1313 and the first isolating substructure 121. In the second direction Y, referencing... Figure 14 Since the first isolation substructure 121 is not provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0131] It should be noted that both the first direction X and the second direction Y are directions defined relative to the array substrate 11.

[0132] According to one embodiment of this application, the vapor deposition apparatus 30 further includes a first angle limiting plate 35 and a second angle limiting plate 36. The first angle limiting plate 35 is used to adjust the vapor deposition angle of the first vapor deposition nozzle 31 in the scanning direction of the first vapor deposition source 391; the second angle limiting plate 36 is used to adjust the vapor deposition angle of the second vapor deposition nozzle 32 in the scanning direction of the second vapor deposition source 392.

[0133] In this embodiment, the first isolation substructure 121 extends in the second direction Y, and no first isolation substructure 121 is provided in the first direction X. The plurality of first evaporation nozzles 31 on the first evaporation source 391 are arranged along the second direction Y. When evaporating the light-emitting functional layer 1312, the first evaporation source 391 scans along the first direction X. The evaporation angle of the first evaporation nozzles 31 is adjusted in the scanning direction of the first evaporation source 391 by the first angle limiting plate 35 in the first direction X, so that the evaporation angle is small and the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructure 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the side overlap of the light-emitting functional layer 1312 and the first isolation substructure 121. In the second direction Y where the multiple first vapor deposition nozzles 31 are arranged, although there is no first angle limiting plate 35 to limit the vapor deposition angle, there is no first isolation substructure 121 in the second direction Y. Therefore, there will be no phenomenon of organic material overlapping with the first isolation substructure 121. Thus, the design of this application can effectively avoid organic material overlapping with the isolation structure and avoid lateral leakage.

[0134] Multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X. When evaporating the second electrode 1313, the second evaporation source 392 scans along the second direction Y. The evaporation angle of the second evaporation nozzles 32 is adjusted along the scanning direction of the second evaporation source 392 by the second angle limiting plate 36 in the second direction Y.

[0135] It should be noted that the first angle limiting plate 35 and the second angle limiting plate 36 are two different limiting plates.

[0136] A fourth aspect of this application provides a method for manufacturing a display panel, the method comprising: forming an isolation structure 12 on one side of an array substrate 11, the isolation structure 12 including a plurality of isolation substructures, the plurality of isolation substructures including a plurality of first isolation substructures 121, the plurality of first isolation substructures 121 being spaced apart in a first direction X, the first isolation substructures 121 extending along a second direction Y, the second direction Y intersecting the first direction X, each first isolation substructure 121 including an isolation layer 1212 and a barrier layer 1211 sequentially disposed in a direction away from the array substrate 11, the orthographic projection of the isolation layer 1212 on the array substrate 11 being located within the orthographic projection of the barrier layer 1211 on the array substrate 11; in adjacent two A light-emitting device 131 is formed between the first isolation substructures 121. The light-emitting device 131 includes a first electrode 1311, a light-emitting functional layer 1312, and a second electrode 1313, which are sequentially stacked in the direction away from the array substrate 11. The second electrode 1313 overlaps with the adjacent first isolation substructure 121. When depositing the light-emitting functional layer 1312, the first evaporation source 391 scans along the first direction X, and a plurality of first evaporation nozzles 31 on the first evaporation source 391 are arranged along the second direction Y. When depositing the second electrode 1313, the second evaporation source 392 scans along the second direction Y, and a plurality of second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X.

[0137] In this application embodiment, the method for manufacturing the display panel includes:

[0138] Step S11: Provide an array substrate 11.

[0139] Step S12: An isolation structure 12 is formed on one side of the array substrate 11. The isolation structure 12 includes a plurality of isolation substructures, each of which includes a plurality of first isolation substructures 121. The plurality of first isolation substructures 121 are spaced apart in a first direction X. The first isolation substructures 121 extend along a second direction Y, which intersects with the first direction X. Each first isolation substructure 121 includes an isolation layer 1212 and a barrier layer 1211 sequentially disposed in a direction away from the array substrate 11. The orthographic projection of the isolation layer 1212 on the array substrate 11 is located within the orthographic projection of the barrier layer 1211 on the array substrate 11.

[0140] Step S13: A light-emitting device 131 is formed between two adjacent first isolation substructures 121. The light-emitting device 131 includes a first electrode 1311, a light-emitting functional layer 1312 and a second electrode 1313 stacked sequentially in the direction away from the array substrate 11. The second electrode 1313 overlaps with the adjacent first isolation substructure 121.

[0141] In step S13, during the deposition of the light-emitting functional layer 1312, the first deposition source 391 scans along the first direction X, and the plurality of first deposition nozzles 31 on the first deposition source 391 are arranged along the second direction Y. During the deposition of the second electrode 1313, the second deposition source 392 scans along the second direction Y, and the plurality of second deposition nozzles 32 on the second deposition source 392 are arranged along the first direction X.

[0142] According to one embodiment of this application, the first evaporation source 391 and the second evaporation source 392 have the same evaporation direction; after the first evaporation source 391 evaporates to form the light-emitting functional layer 1312 and before the second evaporation source 392 evaporates to form the second electrode 1313, the method further includes: driving the support platform 34 of the support array substrate 11 to rotate 90° around its own axis.

[0143] In this embodiment, the first evaporation source 391 and the second evaporation source 392 have the same evaporation direction. The evaporation direction refers to the emission direction of the first evaporation source 391 and the second evaporation source 392, that is, the evaporation material is emitted from the first evaporation source 391 and the second evaporation source 392 in the same direction. The evaporation directions of the first evaporation source 391 and the second evaporation source 392 can be both horizontal and both vertical. The evaporation apparatus 30 preferentially evaporates to form the light-emitting functional layer 1312. When evaporating the light-emitting functional layer 1312, the first evaporation source 391 scans along the first direction X. Multiple first evaporation nozzles 31 on the first evaporation source 391 are arranged along the second direction Y. Therefore, in the first direction X, the evaporation angle of the first evaporation nozzles 31 can be adjusted in the scanning direction of the first evaporation source 391 by the first angle limiting plate 35, so that the evaporation angle is small and the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructures 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the side of the light-emitting functional layer 1312 and the first isolation substructure 121 overlapping. In the second direction Y, where multiple first evaporation nozzles 31 are arranged, although there is no first angle limiting plate 35 to limit the evaporation angle, since there is no first isolation substructure 121 in the second direction Y, there will be no phenomenon of organic material overlapping with the first isolation substructure 121. Therefore, the design of this application can effectively avoid the organic material overlapping with the first isolation substructure 121 and avoid lateral leakage.

[0144] After the first evaporation source 391 deposits the light-emitting functional layer 1312, the evaporation apparatus 30 deposits the second electrode 1313. The rotation mechanism 38 drives the support stage 34 to rotate 90° around its own axis L1, so that the second evaporation source 392 and the first evaporation source 391 are on the same horizontal plane to deposit on the array substrate 11. After the support stage 34 rotates 90° around its own axis L1, the second evaporation source 392 scans along the second direction Y to deposit the second electrode 1313, and the multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X. When depositing the second electrode 1313, the second evaporation source 392 (used for depositing the second electrode 1313) scans along the second direction Y, that is, the scan direction of the second evaporation source 392 is the second direction Y, and the nozzle direction of the second evaporation source 392 is the first direction X. At this time, in the nozzle direction (i.e., the first direction X), since there is no angle limiting plate to limit the evaporation angle, the evaporation angle is larger, which can ensure sufficient overlap between the second electrode 1313 and the first isolation substructure 121, reducing the overlap impedance between the second electrode 1313 and the first isolation substructure 121. Meanwhile, in the scan direction (i.e., the second direction Y), referencing... Figure 14 Since no isolation structure 12 is provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0145] According to one embodiment of this application, the evaporation directions of the first evaporation source 391 and the second evaporation source 392 are perpendicular; after the first evaporation source 391 evaporates to form the light-emitting functional layer 1312, and before the second evaporation source 392 evaporates to form the second electrode 1313, the method further includes: driving the support stage 34 of the support array substrate 11 to rotate 90° relative to the first evaporation source 391, so that the support stage 34 is perpendicular to the evaporation direction of the second evaporation source 392.

[0146] In this embodiment, the evaporation directions of the first evaporation source 391 and the second evaporation source 392 are perpendicular. The evaporation direction refers to the emission direction of the first evaporation source 391 and the second evaporation source 392, that is, the direction in which the evaporation material is emitted from the first evaporation source 391 and the second evaporation source 392 is perpendicular. The first evaporation source 391 is for horizontal evaporation, and the second evaporation source 392 is for vertical evaporation (or, the first evaporation source 391 is for vertical evaporation, and the second evaporation source 392 is for horizontal evaporation, not shown in the figure).

[0147] The vapor deposition apparatus 30 preferentially vapor deposits to form the light-emitting functional layer 1312. During the vapor deposition of the light-emitting functional layer 1312, the first vapor deposition source 391 scans along the first direction X. The multiple first vapor deposition nozzles 31 on the first vapor deposition source 391 are arranged along the second direction Y. Therefore, the vapor deposition angle of the first vapor deposition nozzles 31 in the first direction X can be adjusted by the first angle limiting plate 35 in the scanning direction of the first vapor deposition source 391, so that the vapor deposition angle is small and the light-emitting functional layer 1312 will not be deposited on the side of the first isolation substructures 121 arranged at intervals in the first direction X, thus avoiding leakage problems caused by the side overlap of the light-emitting functional layer 1312 and the first isolation substructures 121. In the second direction Y where the multiple first vapor deposition nozzles 31 are arranged, although there is no first angle limiting plate 35 to limit the vapor deposition angle, there is no first isolation substructure 121 in the second direction Y. Therefore, there will be no phenomenon of organic material overlapping with the first isolation substructure 121. Thus, the design of this application can effectively avoid organic material overlapping with the first isolation substructure 121 and avoid lateral leakage.

[0148] After the first evaporation source 391 deposits the light-emitting functional layer 1312, the rotation mechanism 38 drives the support platform 34 carrying the array substrate 11 to rotate 90° relative to the first evaporation source 391, so that the second evaporation source 392 is not on the same horizontal plane as the first evaporation source 391. The first evaporation source 391 performs horizontal evaporation on the array substrate 11, and the second evaporation source 392 performs vertical evaporation on the array substrate 11 (or the first evaporation source 391 performs vertical evaporation on the array substrate 11, and the second evaporation source 392 performs horizontal evaporation on the array substrate 11). After the support platform 34 rotates around the evaporation mechanism, the second evaporation source 392 scans along the second direction Y to deposit the second electrode 1313, and the multiple second evaporation nozzles 32 on the second evaporation source 392 are arranged along the first direction X. When depositing the second electrode 1313, the second evaporation source 392 (used for depositing the second electrode 1313) scans along the second direction Y, that is, the scan direction of the second evaporation source 392 is the second direction Y, and the nozzle direction of the second evaporation source 392 is the first direction X. At this time, in the nozzle direction (i.e., the first direction X), since there is no angle limiting plate to limit the evaporation angle, the evaporation angle is larger, which can ensure sufficient overlap between the second electrode 1313 and the first isolation substructure 121, reducing the overlap impedance between the second electrode 1313 and the first isolation substructure 121. Meanwhile, in the scan direction (i.e., the second direction Y), referencing... Figure 14 Since no isolation structure 12 is provided, the multiple second electrodes 1313 in the second direction Y are continuous and uninterrupted, which can also reduce the transmission impedance.

[0149] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, The method includes: An isolation structure is formed on one side of the array substrate. The isolation structure includes multiple isolation substructures, each of which includes multiple first isolation substructures. The multiple first isolation substructures are spaced apart in a first direction. The first isolation substructures extend along a second direction, which intersects with the first direction. Each first isolation substructure includes an isolation layer and a barrier layer sequentially disposed in a direction away from the array substrate. The orthographic projection of the isolation layer on the array substrate is located within the orthographic projection of the barrier layer on the array substrate. A light-emitting device is formed between two adjacent first isolation substructures. The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are sequentially stacked in the direction away from the array substrate. The second electrode overlaps with the adjacent first isolation substructure. In the process of depositing the light-emitting functional layer, the first evaporation source scans along the first direction, and a plurality of first evaporation nozzles on the first evaporation source are arranged along the second direction; in the process of depositing the second electrode, the second evaporation source scans along the second direction, and a plurality of second evaporation nozzles on the second evaporation source are arranged along the first direction. The evaporation angle of the first evaporation nozzle is adjusted in the scanning direction of the first evaporation source by the first angle limiting plate in the first direction.

2. The preparation method according to claim 1, characterized in that, The first vapor deposition source and the second vapor deposition source have the same vapor deposition direction; After the first evaporation source deposits the light-emitting functional layer and before the second evaporation source deposits the second electrode, the process further includes: The support platform carrying the array substrate is driven to rotate 90° around its own axis.

3. The preparation method according to claim 2, characterized in that, The evaporation directions of the first evaporation source and the second evaporation source are perpendicular; After the first evaporation source deposits the light-emitting functional layer and before the second evaporation source deposits the second electrode, the process further includes: The support platform carrying the array substrate is driven to rotate 90° relative to the first evaporation source so that the support platform is perpendicular to the evaporation direction of the second evaporation source.

4. A display panel, characterized in that, The display panel is prepared by the preparation method according to any one of claims 1 to 3, and comprises: Array substrate; An isolation structure is disposed on one side of the array substrate. The isolation structure is composed of multiple isolation substructures, each of which includes multiple first isolation substructures. The multiple first isolation substructures are arranged at intervals in a first direction and extend along a second direction. The second direction intersects the first direction. Each first isolation substructure includes an isolation layer and a barrier layer arranged sequentially in a direction away from the array substrate. The orthographic projection of the isolation layer on the array substrate is located within the orthographic projection of the barrier layer on the array substrate. The light-emitting layer includes light-emitting devices formed between two adjacent first isolation substructures. Each light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially in a direction away from the array substrate. The second electrode overlaps with the adjacent first isolation substructure. The light-emitting layer includes a plurality of light-emitting devices arranged in a plurality of light-emitting columns. The plurality of light-emitting columns are arranged in a first direction. Each light-emitting column includes a plurality of light-emitting devices spaced apart in a second direction. At least one light-emitting column is distributed between any two adjacent first isolation substructures. The plurality of light-emitting devices included in at least one light-emitting column emit the same color.

5. The display panel according to claim 4, characterized in that, The second electrodes of the plurality of light-emitting devices distributed between two adjacent first isolation substructures are continuous and uninterrupted.

6. The display panel according to claim 4, characterized in that, At least one of the light-emitting columns includes multiple light-emitting devices that emit different colors.

7. The display panel according to claim 6, characterized in that, The plurality of isolation substructures further include a plurality of second isolation substructures. When the light emission colors of the plurality of light emission devices in the light emission column are different, a second isolation substructure is provided between two adjacent light emission devices with different colors, and the second isolation substructure extends along the first direction.

8. The display panel according to claim 6, characterized in that, The display panel also includes: The first encapsulation layer includes a plurality of encapsulation portions, each encapsulation portion being located on the side of the second electrode away from the array substrate, and extending through the sidewall of the isolation structure to the side of the isolation structure away from the array substrate; the plurality of encapsulation portions are respectively disposed on the side of the light-emitting device away from the array substrate, corresponding one-to-one with the light-emitting device of different colors.

9. The display panel according to claim 8, characterized in that, The display panel also includes: A second encapsulation layer covers the isolation structure and the encapsulation portion; A third encapsulation layer covers the second encapsulation layer.

10. The display panel according to claim 4, characterized in that, The first isolation substructure also includes: The base layer is located between the isolation layer and the array substrate, and the orthographic projection of the isolation layer on the array substrate is located within the orthographic projection of the base layer on the array substrate.

11. The display panel according to claim 10, characterized in that, The base layer is made of molybdenum, the insulating layer is made of aluminum, and the barrier layer is made of titanium.

12. The display panel according to claim 4, characterized in that, The display panel also includes: A pixel definition layer is located between the array substrate and the isolation structure. The pixel definition layer has pixel openings, and the light-emitting device is located in the pixel openings. And / or, the first electrode is the anode and the second electrode is the cathode.

13. The display panel according to claim 4, characterized in that, The light-emitting functional layer is spaced apart from the sidewall of the adjacent first isolation substructure.

14. The display panel according to claim 4, characterized in that, The first direction is perpendicular to the second direction.

15. A display device, characterized in that, This includes a display panel prepared by the preparation method according to any one of claims 1 to 3, or a display panel according to any one of claims 4 to 14.

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