Probe performance testing method

Abstract

The invention discloses a probe performance testing method, and relates to the technical field of semiconductor testing, and the probe performance testing method comprises the following steps: connecting an ox horn joint of a probe card testing mother board with a testing machine so as to conduct resources of the testing machine to the ox horn joint, then opening a cover plate of the probe card testing mother board, and connecting the ox horn joint with the testing machine so as to conduct the resources of the testing machine to the ox horn joint; a probe card to be tested is placed on the probe card fixing plate of the probe card test mother board, and the cover plate is pressed on the probe card fixing plate, so that the conductive connecting piece of the cover plate is electrically connected with the probe; and finally, testing the performance of the probe on the probe card through the probe testing device. According to the embodiment of the invention, the rapid connection between the probe and the test machine can be realized, so that the probe test can be smoothly and efficiently carried out, and the probe performance test efficiency is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a probe performance testing method. Background Art

[0002] In the core electronics industry, probe cards are the core consumables in the wafer testing process. Their main function is to achieve electrical connection between the chip on the wafer and the tester, transmit the test signal of the tester to the chip, and transmit the response signal of the chip back to the tester, thereby completing the electrical performance and functional testing of the chip.

[0003] In the related technical solution, when the probe card is connected to the test machine, each pin on the probe card needs to be connected to the interface socket or terminal block of the test machine using a cable. The connection efficiency is low and prone to errors, resulting in the probe test cannot be performed efficiently. Summary of the Invention

[0004] The present application provides a probe performance testing method that can achieve a fast and stable connection between the probe and the tester, so that the probe test can be carried out smoothly and efficiently.

[0005] To achieve the above objectives, this application proposes a probe performance testing method, comprising: Connect the probe card test motherboard's horn connector to the test machine; Opening the cover of the probe card test motherboard, and placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, wherein the probe card fixing plate is rotatably connected to the cover; Pressing the cover plate onto the probe card fixing plate so that the conductive connector of the cover plate is electrically connected to the probe card; A probe testing device is used to perform a performance test on the probes on the probe card.

[0006] In one embodiment, the step of opening the cover of the probe card testing motherboard includes: If the locking device of the probe card testing motherboard is in an unlocked state, the cover plate is opened, and the locking device is used to lock the cover plate and the probe card fixing plate.

[0007] In one embodiment, the method further comprises: If the locking device is in a locked state, the locking device is unlocked and the cover is opened.

[0008] In one embodiment, before placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, the method further includes: The probe card fixing plate is horizontally calibrated.

[0009] In one embodiment, the leveling of the probe card fixing plate includes: Placing a calibration jig on the probe card fixing plate, wherein the calibration jig comprises a glass plate, and a plurality of target points are designed on the glass plate; Tracking and measuring each target point using a laser ranging module to obtain a measurement value of each target point; If the difference between the measurement values of the target points exceeds a preset error range, the leveling mechanism is used to adjust the horizontal state of the probe card fixing plate until the difference between the measurement values of the target points is within the preset error range.

[0010] In one embodiment, pressing the cover plate onto the probe card fixing plate includes: The cover plate is closed, and a locking device of the probe card test motherboard is locked, wherein the locking device is used to lock the cover plate and the probe card fixing plate.

[0011] In one embodiment, the method further comprises: When the cover plate and the probe card fixing plate are pressed together, a vacuum adsorption operation is performed by a vacuum adsorption device provided on the probe card fixing plate.

[0012] In one embodiment, the performing connectivity test on the line between the tester and the probe card includes: Providing a test matrix, and connecting each test channel of the test matrix to the test machine and the horn connector respectively; Providing a source measurement unit, and connecting the source measurement unit to the test matrix; Applying a preset current value to each of the test channels through the source measurement unit; Whether the line between the test machine and the probe card is connected is determined according to the measurement value of each test channel measured by the source measurement unit.

[0013] In one embodiment, the method further comprises: After completing the performance test of the probe card, opening the cover plate and placing a new probe card on the probe card fixing plate; The cover plate is pressed onto the probe card fixing plate, and the performance test of the new probe card is performed by the probe testing device.

[0014] The probe performance testing method proposed in this application has at least the following technical effects: The horn connector of the probe card test motherboard is connected to the tester to transmit the resources of the tester to the horn connector. Then, the cover of the probe card test motherboard is opened, the probe card to be tested is placed on the probe card fixing plate of the probe card test motherboard, and the cover is pressed onto the probe card fixing plate so that the conductive connector of the cover and the probe are electrically connected. Finally, the performance test of the probe on the probe card is performed by the probe test device. The probe card test motherboard of this embodiment integrates the horn connector and the conductive connector. The resources of the tester are transmitted to the probe through the horn connector and the conductive connector. There is no need to connect each pin on the probe card to the corresponding resource port of the tester through a cable one by one. A fast and stable connection between the probe and the tester can be achieved, so that the probe test can be carried out smoothly and efficiently, greatly improving the efficiency of the probe performance test. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic diagram of the structure of a probe performance testing system to which the probe performance testing method of this application is applied; Figure 2 This is a schematic structural diagram of one embodiment of a probe card test motherboard to which the probe performance test method of the present application is applied; Figure 3 An exploded schematic diagram of a cover plate in a probe card test motherboard provided in this application; Figure 4 for Figure 3 A partial enlarged view of the middle A; Figure 5 This is a schematic structural diagram of a cover plate in a probe card test structure provided in the present application in one embodiment; Figure 6 A schematic diagram of the positional relationship between through holes and steps in the probe card test structure provided in this application; Figure 7 A schematic structural diagram of a probe card fixing plate in a probe card test structure provided by the present application in one embodiment; Figure 8 This is a flow chart of one embodiment of the probe performance testing method of the present application; Figure 9This is a structural block diagram of the line connectivity test system provided in this application. DETAILED DESCRIPTION

[0018] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0019] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0020] In the related technical solution, when connecting the probe card to the tester, each pin on the probe card needs to be connected to the corresponding interface or terminal of the tester through a cable. If the probe card needs to be replaced, the operator must strictly follow the pin definition and reconnect all cables, which is a cumbersome operation.

[0021] To solve the above problems, the present invention provides a probe card test motherboard. The probe card test motherboard of this embodiment can be applied to a probe test system. Figure 1 , Figure 1 The structure diagram of the probe test system is shown. The probe test system includes a probe card test motherboard M1 ( Figure 1 Only the probe card fixing plate on the probe card test motherboard is shown (for details on the probe card test motherboard, see the relevant content below), the leveling mechanism M2, the probe test device M3, and the test device positioning mechanism M4. The probe card test motherboard M1 is used to place and fix the probe card.

[0022] The leveling mechanism M2 is used to adjust and position the probe card fixing plate in the probe card test motherboard M1.

[0023] The probe testing device M3 is used to test the mechanical properties and electrical properties of the probe. The probe testing device M3 includes a testing platform and an electrical performance testing mechanism and a pressure testing mechanism arranged on the testing platform, as well as a visual inspection mechanism. The testing platform is used to contact the probe to be tested so that the electrical performance testing mechanism and the pressure testing mechanism can test the probe to be tested. The visual inspection mechanism is used to perform visual inspection on the probe to be tested.

[0024] Preferably, the leveling mechanism M2 includes a vertical slide rail M21, an extension arm M22, a fixed plate lifting mechanism M23, a fixed plate flipping mechanism M24 and multiple fixed plate positioning components. A movable part is provided on the vertical slide rail M21, the extension arm M22 is fixedly connected to the movable part, and the fixed plate lifting mechanism M23 drives the movable part to move up and down along the vertical slide rail M21; the fixed plate flipping mechanism M24 is provided at the end of the extension arm M22, and the extension arm M22 is connected to the probe card fixed plate through the fixed plate flipping mechanism M24, and the fixed plate flipping mechanism M24 drives the probe card fixed plate to flip up and down; each fixed plate positioning assembly includes a fixed plate vacuum suction cup M25 and a positioning tower vacuum lock. Multiple fixed plate vacuum suction cups M25 are evenly arranged at the edge of the probe card fixed plate. The positioning tower vacuum lock is fixed on the equipment bracket. During testing, the positioning tower vacuum lock locks the fixed plate vacuum suction cup M25 to fix the probe card fixed plate.

[0025] Specifically, the probe card is installed on the probe card test motherboard M1, and the fixed plate flipping mechanism M24 rotates the probe card fixed plate so that the probes on the probe card are facing downward, toward the probe testing device M3; the fixed plate lifting mechanism M23 is used to adjust the height of the probe card fixed plate, and multiple fixed plate positioning components are used to fix the probe card fixed plate.

[0026] Preferably, the probe testing device M3 is installed above the testing device positioning mechanism M4 and moves with the testing device positioning mechanism M4; the testing device positioning mechanism M4 includes a Y-axis module M41, an X-axis module M42 and a Z-axis module M43 arranged in sequence from bottom to top, wherein the X-axis module M42 and the Y-axis module M41 drive the probe testing module M43 to move in the horizontal direction, and the Z-axis module M43 drives the probe testing device M3 to move in the vertical direction.

[0027] Preferably, the Z-axis module M43 includes an upper sliding block, a lower sliding block and an L-shaped bracket, and the upper sliding block and the lower sliding block are in contact through an inclined surface with a predetermined inclination angle; the L-shaped bracket includes a vertical guide plate and a horizontal guide plate arranged perpendicular to each other, and the upper sliding block and the lower sliding block move along the guide rails on the vertical guide plate and the horizontal guide plate respectively. When the lower sliding block moves along the horizontal guide plate, it drives the upper sliding block to move up and down along the vertical guide plate. Specifically, the Z-axis module M43 uses two sliding components that contact each other on an inclined surface to convert the vertical lifting motion into horizontal motion, and increases the accuracy of the vertical motion of the probe test module.

[0028] The contact surface between the upper and lower sliders is an inclined surface. The angle and length of the inclined surface determine the ratio of the displacement distance between the upper and lower sliders. The width of the lower slider is smaller than that of the upper slider, allowing the lower slider to move under the upper slider. Specifically, the Z-axis module M43 also includes a Z-axis lift motor and a Z-axis lift screw. The Z-axis lift motor drives the lower slider to move horizontally via the Z-axis lift screw. The upper slider has an inclined bottom surface with a first end and a second end, wherein the distance between the first end and the horizontal guide plate is greater than the distance between the second end and the horizontal guide plate. When the lower slider moves from the first end to the second end of the upper slider, the lower slider pushes the upper slider upward. When the lower slider moves from the second end to the first end of the upper slider, the lower slider drives the upper slider downward. Preferably, the visual detection mechanism includes a camera and an optical element. The camera adopts a telecentric lens. The optical element and the telecentric lens are correspondingly arranged to change the light reflected by the needle tip of the probe card so that the telecentric lens obtains the needle tip image of the probe card. Preferably, a needle pressure sensor and an electrical performance test sensor are provided below the test platform for collecting needle pressure and electrical performance data of the probe.

[0029] The specific implementation of the probe card test motherboard according to the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0030] See Figures 2 to 5 The probe card test motherboard M1 of this embodiment includes a cover plate 1 and a probe card fixing plate 2 rotatably connected to the cover plate 1. The probe card fixing plate 2 is used to fix the probe card to be tested. The cover plate 1 is provided with a horn connector 11 and a conductive connector 15. The horn connector 11 is used to connect to the tester, and the horn connector 11 is electrically connected to the conductive connector 15. Specifically, there are multiple conductive connectors 15, and each conductive connector 15 is provided on the side of the cover plate 1 facing the probe card fixing plate 2. When the cover plate 1 is pressed onto the probe card fixing plate 2, the conductive connector 15 is electrically connected to the probes of the probe card.

[0031] In some embodiments, the cover plate 1 is rotatably connected to the probe card fixing plate 2 via a rotating base 4 .

[0032] Specifically, the header 11 is a connector used to crimp ribbon cables. In this embodiment, the wiring harness end of the header 11 is used to connect to the tester, and the plug end is used to electrically connect to the conductive connector 15. The plug end of the header 11 can be implemented as a metal terminal. In some embodiments, the plug end can include an array of pins (i.e., straight or curved pins with a gold-plated surface).

[0033] In this embodiment, the horn connector 11 serves as an interface unit on the tester side, and can access various resources of the tester (including test signals, control signals, etc.). The plug-in end of the horn connector 11 is electrically connected to the conductive connector 15, so that the signal output by the tester can be transmitted to the conductive connector 15, and through the pressing operation of the cover 1, the conductive connector 15 is electrically contacted with the tail connection end of the probe by mechanical pressure, thereby transmitting the signal of the tester to the probe. The tail connection end of the probe refers to the area where the tail of the probe contacts the pad on the probe card. The flow direction of the test signal in the whole process is: tester → horn connector → conductive connector → tail of the probe → probe tip.

[0034] Through the probe card test motherboard provided by this embodiment, the operator does not need to connect each pin on the probe card to each resource port of the tester one by one through cables, which solves the problem of cumbersome connection between the probe card and the tester in the traditional solution, reduces the difficulty of operation and the probability of error, and through the use of the horn connector and the conductive connector, the signal of the tester is transferred to the conductive connector. When the cover is pressed onto the probe card fixing plate, the conductive connector forms an electrical connection with the probe, thereby transmitting the resource or signal of the tester to the probe, and realizing the line connection between the probe and the tester. At the same time, when the operator replaces the probe card in advance, there is no need to reconnect the tester cable. It only needs to open the cover and place the new probe card on the probe card fixing plate, and then close the cover to realize the electrical connection between the new probe card and the tester, which can replace the probe card for testing more quickly, greatly shortening the test cycle and improving the test efficiency.

[0035] In some embodiments, positioning pins 25 are provided on the probe card fixing plate 2 , and the positioning pins 25 are used to position the probe card to be placed.

[0036] In some embodiments, the cover plate 1 adopts a composite multi-layer structure. Figures 2-4 The cover plate 1 includes a top layer 12, an intermediate interconnection layer 13, and a connector mounting layer 14. A bullhorn connector 11 is provided on the top layer 12. The wiring harness end of the bullhorn connector 11 is used to connect to the tester. The plug end of the bullhorn connector 11 passes through the top layer 12 and is welded to the intermediate interconnection layer 13. The connector mounting layer 14 is electrically connected to the intermediate interconnection layer 13. A conductive connector 15 is provided on the side of the connector mounting layer 14 facing the probe card fixing plate 2.

[0037] Specifically, an array of mounting slots is provided on the upper surface of the top layer 12, and each mounting slot is used to install a bullhorn connector 11. The intermediate interconnection layer 13 adopts a printed circuit board, and the plug-in end of the bullhorn connector 11 is soldered to the printed circuit board through a solder pad to achieve electrical connection between the plug-in end of the bullhorn connector 11 and the intermediate interconnection layer 13. The intermediate interconnection layer 13 is electrically connected to the connector mounting layer 14 through a routing structure and a via design. A pin plate 141 is provided on the connector mounting layer 14, and arranged and distributed through holes 16 are provided on the pin plate 141. The size of the through hole 16 matches the conductive connector 15. The conductive connector 15 is installed on the through hole 16, and the electrical connection part of the conductive connector 15 protrudes from the surface of the connector mounting layer 14. The surface of the electrical connection part of the conductive connector 15 is treated by gold plating or silver plating to improve the conductivity and corrosion resistance of the conductive connector 15, ensuring that a stable electrical connection can be maintained during long-term use.

[0038] In some embodiments, a plurality of conductive connectors 15 are provided, and the plurality of conductive connectors 15 match the arrangement of the probes on the probe card to ensure that during the process of pressing the cover plate 1 to the probe card fixing plate 2 in the vertical direction, each conductive connector 15 can achieve one-to-one contact with the tail connection end of the corresponding probe to form a stable electrical connection, thereby ensuring the complete transmission of the test signal between the probe and the test machine.

[0039] In some embodiments, the conductive connector 15 is an elastic conductive connector. During the pressing operation of the cover plate 1, the spring structure built into the elastic conductive connector will be compressed under the action of the pressing force. Through this compression deformation design, a continuous and uniform pressure can be generated from the cover plate 1 to the probe card fixing plate 2 from top to bottom. This pressure can make the elastic conductive connector fit tightly with the surface of the probe card, effectively eliminating the tiny gaps and mechanical vibrations on the contact surface. Through the synergistic effect of the mechanical positioning structure and the elastic compensation mechanism, each conductive connector 15 can contact the tail connection end of the probe, which not only ensures the formation of stable electrical contact between the conductive connector 15 and the probe, but also can dynamically adapt to the tiny displacements caused by mechanical vibrations, thereby ensuring the continuity and stability of signal transmission.

[0040] Preferably, the conductive connector 15 is a spring pin. A spring pin is a connection terminal that utilizes a built-in spring to achieve elastic, retractable contact. The spring pin consists of a needle tube, a needle tip, and a spring. The spring force ensures a reliable, low-resistance electrical connection between the needle tip and the probe's tail connector. When pressure is released, the spring pushes the needle tip back into place.

[0041] See Figure 7In some preferred embodiments, a boss 7 is provided at the location of each through-hole 16 of the needle plate 141. The boss 7 is generally truncated cone-shaped and is disposed around the through-hole 16, coaxially with the through-hole 16. The inner diameter of the upper surface of the boss 7 is slightly larger than the outer diameter of the conductive connector 15, thereby creating a certain guide gap. For example, if the conductive connector 15 is a spring pin, when the spring pin is inserted into the through-hole 16, the boss 7 can accurately guide the spring pin into the predetermined position, preventing the spring pin from tilting or shifting due to installation deviation. The boss 7 also serves as a limiter. During the pressing and closing of the cover plate 1, the spring pin is subjected to a certain amount of pressure, which may lead to excessive vertical movement. The design of the boss 7 limits the spring pin when it moves downward to a certain extent, preventing the spring pin from misaligning with the tail connection end of the probe due to angular deviation of the spring pin. This limiting effect ensures that the contact between the spring pin and the probe is always maintained at the correct position and angle, ensuring stable and reliable signal transmission.

[0042] See Figure 2 In some embodiments, the probe card test motherboard further includes a locking device 3 , which is used to lock the cover plate 1 and the probe card fixing plate 2 .

[0043] Specifically, see Figure 2 , the locking device 3 includes a handle assembly 31 provided on the cover plate 1 and an embedding hole 32 provided on the upper surface of the probe card fixing plate 2. In some embodiments, the handle assembly 31 includes a handle and a connecting rod, the handle is provided with an anti-slip texture, and the connecting rod passes through the upper cover plate 1 and extends downward. A protrusion is provided at the bottom of the connecting rod for cooperating with the corresponding embedding hole on the probe card fixing plate 2. The handle assembly 31 and the embedding hole 32 may include a plurality of handle assemblies 31 and the embedding hole 32, and the position of the protrusion of each handle assembly 31 corresponds to the position of the embedding hole 32, so that the protrusion can be snapped onto the embedding hole 32. Preferably, the number of the handle assemblies 31 and the embedding hole 32 is set to 2, and the two handle assemblies 31 are symmetrically provided at the edge of the upper surface of the cover plate 1, and the two embedding holes 32 are symmetrically provided at the edge of the probe card fixing plate 2.

[0044] In other embodiments, the handle assembly 31 includes a handle and a threaded connecting rod, the handle is provided with an anti-slip texture, and the threaded connecting rod passes through the cover plate 1 and extends downward. The threaded connecting rod is provided with threads for cooperating with corresponding screw holes on the probe card fixing plate 2. The specifications and pitch of the threads match the corresponding screw holes on the probe card fixing plate 2 to ensure that they can be smoothly screwed into the screw holes to achieve a reliable locking connection. When it is necessary to lock the cover plate 1 and the probe card fixing plate 2, the operator places the cover plate 1 on the probe card fixing plate 2 so that the threaded connecting rod is aligned with the corresponding screw hole. Then, the handle is rotated, and the threaded connecting rod is gradually screwed into the screw hole as the handle is rotated. As the screwing depth increases, the gap between the cover plate 1 and the probe card fixing plate 2 gradually decreases until the two are tightly fitted to achieve locking.

[0045] In some embodiments, a vacuum adsorption device is provided on the probe card fixing plate 2 , and the vacuum adsorption device is used to adsorb the cover plate 1 by vacuum adsorption when the cover plate 1 and the probe card fixing plate 2 are pressed together.

[0046] See Figure 7 The vacuum adsorption device includes a pipe interface 21, adsorption holes 22, a vacuum pipe (not shown), and a sealing ring (not shown). The pipe interface 21 is used to connect to a vacuum pump; the adsorption holes 22 are provided on the surface of the probe card mounting plate 2; the vacuum pipe is provided inside the probe card mounting plate 2 and communicates with the pipe interface 21 and the adsorption holes 22; and the sealing ring is provided around the adsorption holes 22.

[0047] Specifically, the pipeline interface 21 is arranged at the upper surface edge, side or bottom position of the probe card fixing plate 2, and its inner diameter size is adapted to the outer diameter of the vacuum pump output pipeline to ensure a tight connection without leakage and to ensure the stable operation of the vacuum adsorption device.

[0048] Adsorption holes 22 are provided in the contact area between the probe card mounting plate 2 and the cover plate 1. The number of adsorption holes 22 can be designed based on the specific size of the probe card mounting plate 2. For example, for a small probe card mounting plate 2, 2-4 adsorption holes 22 can be provided, while for a large probe card mounting plate, the number of adsorption holes 22 can be designed to be 6-10 or even more.

[0049] Furthermore, to ensure uniform force on the cover plate 1 during the pressing process and avoid poor sealing due to localized uneven force, every two adsorption holes 22 are symmetrically designed on the probe card fixing plate 2. This symmetrical layout evenly distributes the vacuum adsorption force on the contact surface between the cover plate 1 and the probe card fixing plate 2, improving the stability and reliability of adsorption. Preferably, the adsorption holes 22 can be designed symmetrically around the probe card placement area.

[0050] Preferably, the adsorption hole 22 is designed to be circular in shape to reduce airflow resistance.

[0051] The sealing rings correspond to the adsorption holes 22 one by one and are disposed on the surface of the probe card mounting plate 2 around the adsorption holes 22. By designing the sealing rings around the adsorption holes 22, the small gap between the cover plate 1 and the probe card mounting plate 2 can be filled, preventing vacuum leakage. The sealing rings can be made of rubber materials such as silicone rubber or fluororubber.

[0052] Furthermore, to optimize the performance of the sealing ring, reduce the friction coefficient between it and the cover plate 1, and reduce wear caused by friction, silicone oil or fluorine lubricant can be applied to the surface of the sealing ring. Silicone oil has good lubricity and chemical stability, while fluorine lubricant has higher temperature resistance and chemical corrosion resistance.

[0053] The symmetrical layout of the suction holes and the optimized design of the sealing ring ensure that the cover plate is evenly stressed and tightly attached to the probe card mounting plate during the cover plate pressing process. Simultaneously, a vacuum pump provides a stable vacuum source to the vacuum line through the pipe interface, creating negative pressure at the suction holes and firmly adsorbing the cover plate to the mounting plate. This design allows the contact surface of the cover plate to fit tightly against the probe card, ensuring that the signal from the conductive connector is reliably transmitted to the tail connection of the probe, and achieving a reliable electrical connection between the probe and the tester.

[0054] See Figure 8 , Figure 8 Flowchart of the probe performance test method provided in this embodiment. The probe performance test method of this embodiment includes steps S10 to S40: Step S10, connecting the horn connector of the probe card test motherboard to the test machine.

[0055] Specifically, the wiring harness end of the horn connector is connected to the port of the test machine through the test machine cable.

[0056] Step S20 , opening the cover of the probe card test motherboard, and placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard.

[0057] The probe card test motherboard in this embodiment includes a locking device that is used to lock the cover plate to the probe card fixing plate. Specifically, if the locking device of the probe card test motherboard is in the unlocked state, the cover plate is opened; if the locking device of the cover plate is in the locked state, the locking device is unlocked and the cover plate is opened.

[0058] Step S30 , pressing the cover plate onto the probe card fixing plate so that the conductive connectors of the cover plate are electrically connected to the probe card.

[0059] In this embodiment, a vacuum adsorption device is also provided on the probe card fixing plate. When the cover plate and the probe card fixing plate are pressed together, the vacuum adsorption operation is performed by the vacuum adsorption device provided on the probe card fixing plate. After the vacuum adsorption operation is performed, the cover plate and the probe card fixing plate are locked by the locking device.

[0060] Furthermore, the probe card mounting plate is provided with pressure sensors, with at least two pressure sensors being provided. Preferably, four pressure sensors are provided, and these four pressure sensors are symmetrically mounted at the four corners of the probe card mounting plate, with the center of the probe card mounting plate as a reference. When the cover plate is pressed together, the pressure values detected by the four pressure sensors distributed on the probe card mounting plate can intuitively reflect the pressure distribution in various areas of the probe card mounting plate.

[0061] In some embodiments, the pressing process of the cover plate and the probe card fixing plate may include: In step a1, the pipeline interface of the vacuum adsorption device is connected to the vacuum pump through a conduit, and zero-point calibration is performed on each pressure sensor provided on the probe card fixing plate.

[0062] Step a2: close the cover plate and insert the threaded connecting rods of the locking device into the corresponding screw holes on the probe card fixing plate.

[0063] In this embodiment, the locking device includes a handle and a threaded connecting rod. The threaded connecting rod extends downward through the cover plate. The threaded connecting rod is provided with threads for engaging with corresponding screw holes in the probe card mounting plate. When the cover plate is closed, the tail of the threaded connecting rod engages with the corresponding screw hole, thereby securing the cover plate to the probe card mounting plate.

[0064] Step a3, start the vacuum pump, perform vacuum adsorption, and monitor the pressure values detected by each pressure sensor. If the difference between the pressure values is within the preset pressure error range, stop the vacuum adsorption operation; if the difference between the pressure values is not within the preset pressure error range, rotate the handle to adjust the screwing depth between the threaded connecting rod and the screw hole until the difference between the pressure values is within the preset pressure error range, and stop the vacuum adsorption operation.

[0065] Specifically, if the difference between the various pressure values is within the preset pressure error range, it indicates that the pressure distribution between the cover plate and the probe card fixing plate is uniform, and the vacuum adsorption operation can be stopped at this time. If the difference between the various pressure values is not within the preset pressure error range, it indicates that the pressure distribution is uneven, and the handle of the handle assembly is rotated to adjust the screwing depth between the threaded connecting rod and the screw hole, thereby changing the contact pressure between the connecting rod and the screw hole, and then adjusting the pressure applied to the probe card fixing plate until the difference between the pressure values detected by each pressure sensor is relatively small, so as to ensure that the pressure between the cover plate and the probe card fixing plate is evenly distributed, and avoid affecting the electrical connection performance of the spring pin and the probe contact due to uneven pressure, thereby causing unstable signals transmitted from the test machine to the probe.

[0066] Step S40 , performing a performance test on the probes of the probe card using a probe testing device.

[0067] Specifically, the probe card test device includes a test platform and an electrical performance test mechanism, a pressure test mechanism, and a visual inspection mechanism installed on the test platform. During the test, the test platform is moved by the test device positioning device so that the test platform contacts the probe on the probe card. The visual inspection structure captures the probe card tip image and analyzes the tip image to obtain the probe position and tip diameter, thereby completing the probe position and tip diameter test. In addition, a certain pressure value can be applied to the probe by the test pressure test mechanism to complete the pressure test of the probe.

[0068] This embodiment transmits the resources of the test machine to the probe through the horn connector and the conductive connector. There is no need to connect each pin of the probe card to the corresponding resource port of the test machine through a cable one by one. It can realize the rapid connection between the probe and the test machine, so that the probe test can be carried out smoothly and efficiently, greatly improving the efficiency of the probe performance test.

[0069] In a preferred embodiment, the method further comprises placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard before: Perform horizontal calibration on the probe card mounting plate.

[0070] Specifically, before conducting the test, a calibration jig is placed on the probe card fixing plate. The calibration jig includes a glass plate with multiple target points designed on it. Each target point is tracked and measured by a laser ranging module to obtain the measurement value of each target point. If the difference between the measurement values of each target point exceeds the preset error range, the horizontal state of the probe card fixing plate is adjusted by a leveling mechanism until the difference between the measurement values of each target point is within the preset error range.

[0071] In an optional embodiment, before performing a performance test on the probe card by a probe testing device, the method further includes: Perform a connectivity test on the line between the tester and the probe card.

[0072] Exemplarily, the steps of performing the line connectivity test may include: Provide a test matrix, and connect each test channel of the test matrix to the test machine and the horn connector respectively; Providing a source measurement unit and connecting the source measurement unit to the test matrix; Applying a preset current value to each test channel through a source measurement unit; Whether the line between the test machine and the probe card is connected is determined according to the measurement value of each test channel measured by the source measurement unit.

[0073] See Figure 9 , Figure 9 The block diagram of the line continuity test system is shown. The line continuity test system includes a test matrix and a source measurement unit. The test matrix is connected to the tester and the probe card test motherboard's headers. The positive and negative terminals of the source measurement unit are both connected to the test matrix, which is then connected to the tester. The test matrix includes multiple test channels, each corresponding to a channel between each probe on the probe card and a corresponding resource port on the tester.

[0074] During specific implementation, the test machine sends a control instruction to the test matrix to control the channel switch of the corresponding test channel to open. Each test channel is equipped with an independent channel switch. After selecting the test channel, the test machine further controls the source measurement unit to output a preset current value. The source measurement unit outputs the preset current to the selected test channel according to the instruction of the test machine. The source measurement unit accurately measures the current flowing through the test channel and feeds back the measured value to the test machine. The test machine analyzes and judges based on the received measurement value: If the measurement value is within the preset range, it means that the line between the probe corresponding to the test channel and the corresponding resource port of the test machine is well connected, and the signal can be transmitted normally. If the measurement value exceeds the preset range, for example, the current value is too small or almost zero, it indicates that there is a line connectivity problem in the test channel.

[0075] Through the above solution, the line connectivity between the tester and the probe card can be comprehensively detected, and potential connection problems can be discovered and located in a timely manner.

[0076] In an optional embodiment, the probe performance testing method may further include: After completing the performance test of the probe card, the cover plate is opened and a new probe card is placed on the probe card fixing plate; The cover plate is pressed onto the probe card fixing plate, and the performance test of the new probe card is performed using a probe test device.

[0077] In an optional embodiment, the probe performance testing method may further include: When the probe card is subjected to performance testing by the probe test device, the test data of each probe on the probe card is synchronously collected and stored in the cloud server; Based on the test data stored in the cloud server, a performance test report of the probe card is generated. The performance test report includes the performance parameters of each probe, test result analysis, and comparison with historical test data. Evaluate the performance test report using a preset data analysis algorithm to determine whether the probe card has performance anomalies; If there is a performance anomaly, a corresponding anomaly diagnosis report is generated and sent to the designated terminal device. Specifically, during the performance test of the probe card by the probe test device, the performance parameter data of each probe, such as the probe's contact resistance, conduction time, signal transmission delay, etc., is obtained in real time with the help of the data acquisition module. The data acquisition module is connected to each test point of the probe card and can collect data with high frequency and high precision. The collected data will be transmitted to the cloud server in real time via an encrypted network transmission protocol, such as the SSL / TLS protocol. The cloud server adopts a distributed storage architecture, storing data on multiple physical nodes to ensure data security and reliability. At the same time, metadata information such as timestamps and probe identifiers will be added to each data during storage to facilitate subsequent query and analysis.

[0078] Based on the test data stored in the cloud server, the system will call the report generation module. This module first cleans and preprocesses the data to remove duplicate data and outliers. Then, according to the pre-set report template, the performance parameters of each probe are statistically analyzed, and statistical quantities such as the average value and standard deviation are calculated to intuitively demonstrate the stability of the probe performance. In terms of test result analysis, by comparing the standard performance indicators, it is determined whether each probe is qualified, and the results are presented in a combination of charts (such as bar charts, line charts) and text. At the same time, the current test data is compared with the historical test data to analyze the changing trend of the probe performance. For example, by comparing the changes in the contact resistance of the same probe in different batches of tests, it is determined whether its performance has declined. Finally, all analysis results are integrated to generate a complete performance test report that includes the performance parameters of each probe, test result analysis, and comparison with historical test data.

[0079] After generating a performance test report, the system activates a pre-set data analysis algorithm to evaluate the report. These algorithms are based on machine learning or statistical principles. For example, they use trained classification models (such as support vector machines and random forests) to determine whether the probe card has performance anomalies, or they use the calculated confidence interval of the data to identify abnormal data points. If the algorithm determines that a performance anomaly exists, the anomaly diagnosis module further analyzes the cause of the anomaly. For example, through correlation analysis, it identifies the relationship between the abnormal performance probe and other relevant factors (such as the test environment temperature and the number of probe uses). It then generates a detailed anomaly diagnosis report. This report includes a description of the anomaly, an analysis of possible causes, and recommended solutions. Finally, the system sends the anomaly diagnosis report to designated terminal devices, such as engineers' computers or mobile apps, via email or push notifications, so that relevant personnel can handle it in a timely manner.

[0080] The data acquisition module can include a signal acquisition front end, a signal conditioning circuit, a data processing unit, and a data transmission interface. The signal acquisition front end is connected to each probe of the probe card and is used to obtain the electrical signals during the probe performance test in real time. The collected signal is transmitted to the signal conditioning circuit, which amplifies and filters the signal to improve the signal quality. The processed signal enters the data processing unit, which performs preliminary analysis and processing on the signal and adds metadata information such as timestamps and probe identifiers. Finally, the processed data is transmitted to the cloud server in an encrypted manner through the data transmission interface to achieve real-time storage of test data. The data acquisition module adopts a modular design, and the various components work together to ensure the accurate collection and efficient transmission of test data.

[0081] Traditional solutions require tedious unplugging and reconnecting cables when replacing probe cards, which is not only complicated but also prone to connection errors or signal interference due to human error. The probe performance testing method provided in this embodiment does not require unplugging and reconnecting cables. The operator only needs to simply open the cover, re-place the new probe card, and then close the cover to quickly establish a signal connection between the new probe and the tester. This convenient operation method greatly shortens the probe card replacement time, improves test efficiency, and reduces the risk of test failures caused by cable connection problems, ensuring the stability and reliability of probe performance testing.

[0082] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A probe performance testing method, characterized in that: include: Connect the probe card test motherboard's horn connector to the test machine; Opening the cover of the probe card test motherboard, and placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, wherein the probe card fixing plate is rotatably connected to the cover; Pressing the cover plate onto the probe card fixing plate so that the conductive connector of the cover plate is electrically connected to the probe card; A probe testing device is used to perform a performance test on the probes on the probe card.

2. The probe performance testing method according to claim 1, wherein: The step of opening the cover of the probe card testing motherboard comprises: If the locking device of the probe card testing motherboard is in an unlocked state, the cover plate is opened, and the locking device is used to lock the cover plate and the probe card fixing plate.

3. The probe performance testing method according to claim 2, wherein: The method further comprises: If the locking device is in a locked state, the locking device is unlocked and the cover is opened.

4. The probe performance testing method according to claim 1, wherein: Before placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, the method further includes: The probe card fixing plate is horizontally calibrated.

5. The probe performance testing method according to claim 4, wherein: The horizontal calibration of the probe card fixing plate includes: Placing a calibration jig on the probe card fixing plate, wherein the calibration jig comprises a glass plate, and a plurality of target points are designed on the glass plate; Tracking and measuring each target point using a laser ranging module to obtain a measurement value of each target point; If the difference between the measurement values of the target points exceeds a preset error range, the leveling mechanism is used to adjust the horizontal state of the probe card fixing plate until the difference between the measurement values of the target points is within the preset error range.

6. The probe performance testing method according to any one of claims 1 to 5, characterized in that: Pressing the cover plate onto the probe card fixing plate includes: The cover plate is closed, and a locking device of the probe card test motherboard is locked, wherein the locking device is used to lock the cover plate and the probe card fixing plate.

7. The probe performance testing method according to claim 6, wherein: The method further comprises: When the cover plate and the probe card fixing plate are pressed together, a vacuum adsorption operation is performed by a vacuum adsorption device provided on the probe card fixing plate.

8. The probe performance testing method according to any one of claims 1 to 5, characterized in that: Before performing a performance test on the probe card by a probe testing device, the method further includes: A connectivity test is performed on the circuit between the tester and the probe card.

9. The probe performance testing method according to claim 8, wherein: The performing connectivity test on the line between the tester and the probe card includes: Providing a test matrix, and connecting each test channel of the test matrix to the test machine and the horn connector respectively; Providing a source measurement unit, and connecting the source measurement unit to the test matrix; Applying a preset current value to each of the test channels through the source measurement unit; Whether the line between the test machine and the probe card is connected is determined according to the measurement value of each test channel measured by the source measurement unit.

10. The probe performance testing method according to claim 1, wherein: The method further comprises: After completing the performance test of the probe card, opening the cover plate and placing a new probe card on the probe card fixing plate; The cover plate is pressed onto the probe card fixing plate, and the performance test of the new probe card is performed by the probe testing device.

Images