Timepiece component, timepiece, and method for manufacturing timepiece component

Abstract

The invention provides a timepiece component, a timepiece and a method for manufacturing the timepiece component, which are diversified and highly aesthetic. A dial, which is a timepiece component, has a conductive base material and a non-conductive base material bonded to the conductive base material. The non-conductive substrate has a through-hole penetrating from the back surface bonded to the conductive substrate to the front surface. In the through hole, a decorative layer is formed by electroplating. Therefore, the metal decoration realized by the decoration layer can be added on the non-conductive base material part exposed on the front surface of the dial plate which is used as the timepiece component, so that the timepiece component which is diversified and highly attractive can be provided.

Description

Technical Field

[0001] The present invention relates to a timepiece component, a timepiece, and a method for manufacturing the timepiece component. Background Art

[0002] Patent Document 1 discloses a timepiece dial comprising a support and a mother-of-pearl sheet. The mother-of-pearl sheet has a front surface and a rear surface facing the support and having a pattern printed thereon. The mother-of-pearl sheet is formed to a thickness such that the pattern printed on the rear surface of the mother-of-pearl sheet is visible through the mother-of-pearl under normal lighting conditions.

[0003] Patent Document 1: Japanese Patent Application No. 2021-510820

[0004] The dial of Patent Document 1 can realize a dial that effectively utilizes the pattern of the mother-of-pearl sheet, but the entire dial has the same design, and therefore more diverse and aesthetically pleasing timepiece components and timepieces are desired. Summary of the Invention

[0005] The timepiece component disclosed herein comprises: a conductive substrate; and a non-conductive substrate bonded to the conductive substrate, wherein the non-conductive substrate has a through-hole extending from the back surface bonded to the conductive substrate to the front surface, and a decorative layer is formed in the through-hole by electroplating.

[0006] The timepiece disclosed herein includes the timepiece component described above.

[0007] The manufacturing method of watch parts disclosed in the present invention includes: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a bonding step of bonding the conductive substrate and the non-conductive substrate; a hole forming step of forming a through hole that penetrates at least the non-conductive substrate from the front side of the bonded non-conductive substrate to reach the conductive substrate; and an electroplating step of immersing the conductive substrate and the non-conductive substrate in an electrolyte and passing current through the conductive substrate to electroplate the through hole of the non-conductive substrate.

[0008] The manufacturing method of the watch parts disclosed in the present invention includes: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a hole forming step of forming a through hole in the non-conductive substrate; a bonding step of bonding the conductive substrate and the non-conductive substrate with the through hole formed therein; and an electroplating step of immersing the conductive substrate and the non-conductive substrate in an electrolyte and passing a current through the conductive substrate to electroplate the through hole of the non-conductive substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a front view showing a timepiece including a dial as a timepiece component according to the first embodiment.

[0010] Figure 2 This is a cross-sectional view showing the dial of the first embodiment.

[0011] Figure 3A These are diagrams illustrating the bonding step in the method for manufacturing the watch dial according to the first embodiment.

[0012] Figure 3B These are diagrams illustrating the hole forming step in the dial manufacturing method according to the first embodiment.

[0013] Figure 4 These are diagrams illustrating the plating step in the method for manufacturing the watch dial according to the first embodiment.

[0014] Figure 5 This is a front view showing a dial as a timepiece component according to a second embodiment.

[0015] Figure 6 This is a cross-sectional view showing a dial according to the second embodiment.

[0016] Figure 7A It is a diagram illustrating the hole forming step in the dial manufacturing method according to the second embodiment.

[0017] Figure 7B It is a diagram illustrating the bonding step in the method for manufacturing a watch dial according to the second embodiment.

[0018] Figure 7C It is a diagram illustrating the bonding step in the method for manufacturing a watch dial according to the second embodiment.

[0019] Figure 8A It is a cross-sectional view showing a decorative layer according to a modified example.

[0020] Figure 8B It is a cross-sectional view showing a decorative layer according to a modified example.

[0021] Figure 8C It is a cross-sectional view showing a decorative layer according to a modified example.

[0022] Figure 9 It is a cross-sectional view showing a decorative layer according to a modified example.

[0023] Figure 10 It is a figure which shows the conditions and evaluation results of an Example and a comparative example.

[0024] Label Description

[0025] 1: Clock; 3: Dial; 3B: Dial; 5: Logo; 10: Conductive substrate; 11: Front; 20: Non-conductive substrate; 21: Front; 22: Back; 30: Center hole; 31: Through hole; 32: Through hole; 33: Through hole; 35: Through hole; 36: Through hole; 41: Decorative layer; 41A: Decorative layer; 41B: Decorative layer; 41C: Decorative layer; 41D: Decorative layer; 42: Decorative layer; 43: Decorative layer; 45: Decorative layer; 51: Pattern; 52: Pattern; 55: Pattern; 321: Large diameter portion; 322: Small diameter portion; 351: Opening; 351A: Opening; 351B: Opening; 352: Recessed portion. DETAILED DESCRIPTION

[0026] [First embodiment]

[0027] Figure 1 This is a front view of a timepiece 1 having a dial 3 as a timepiece component according to a first embodiment. The timepiece 1 is a wristwatch worn on a user's wrist and includes a cylindrical outer case 2, with the dial 3 disposed on the inner circumference of the outer case 2. Of the two openings in the outer case 2, the front opening is sealed by a glass cover, and the rear opening is sealed by a back cover.

[0028] The timepiece 1 includes a movement (not shown) housed within an outer case 2; an hour hand 4A, a minute hand 4B, and a second hand 4C, which indicate the time; an indicia 5 attached to a dial 3; and a crown 7. While the indicia 5 of the timepiece 1 of this embodiment uses Roman numerals, Arabic numerals may also be used, or bar-shaped indicia may be used. The indicia is not limited to Roman numerals.

[0029] In the following description, the front surface of each component refers to the surface on the cover glass side, and the back surface of each component refers to the surface on the back cover side.

[0030] like Figure 2 As shown, the dial 3 is formed by laminating a conductive substrate 10 and a non-conductive substrate 20. The conductive substrate 10 is arranged on the back side of the timepiece 1, i.e., the back cover side, relative to the non-conductive substrate 20, and the non-conductive substrate 20 is arranged on the front side of the timepiece 1, i.e., the glass cover side, relative to the conductive substrate 10.

[0031] The conductive base material 10 is a metal plate material, and is formed into a planar circular shape or the like according to the planar shape of the dial 3. In the present embodiment, the conductive base material 10 is made of brass.

[0032] The non-conductive substrate 20 is a plate made of a non-conductive material, and is formed into a flat circular shape or the like according to the planar shape of the dial 3. The material of the non-conductive substrate 20 is not particularly limited as long as it is non-conductive. In the present embodiment, it is made of mother-of-pearl. Mother-of-pearl is a plate-shaped component made by slicing the shells of mother-of-pearl oysters such as white mother-of-pearl used for pearl farming. In addition, the non-conductive substrate 20 can also be made of a synthetic resin such as polycarbonate. In addition, the non-conductive substrate 20 is not limited to a light-transmitting plate such as mother-of-pearl and polycarbonate, and can also be made of a non-light-transmitting material. Therefore, the non-conductive substrate 20 can also be made of an insulating material such as a coating or ceramic.

[0033] The surface of the conductive substrate 10 facing the non-conductive substrate 20, i.e., the front side of the timepiece 1, is designated as the front surface 11. The surface of the non-conductive substrate 20 facing the front side of the timepiece is designated as the front surface 21. The surface of the non-conductive substrate 20 facing the conductive substrate 10 is designated as the back surface 22. The front surface 11 of the conductive substrate 10 and the back surface 22 of the non-conductive substrate 20 are bonded together using double-sided tape or an adhesive.

[0034] The non-conductive substrate 20 is provided with three types of through holes 31, 32, and 33 that penetrate from the front surface 21 to the back surface 22. Figure 2 , the planar shapes of the through holes 31 , 32 , and 33 are also shown together with the cross section of the dial 3 .

[0035] The through hole 31 is a cylindrical through hole having a circular planar shape and has a smaller opening area than the other through holes 32 and 33 .

[0036] The through-hole 32 has a large-diameter portion 321 on the front side 21 and a small-diameter portion 322 on the back side 22. The inner circumference of the through-hole is formed in a stepped manner. The large-diameter portion 321 and the small-diameter portion 322 are each cylindrically shaped, with the large-diameter portion 321 having a larger opening area than the through-hole 31. The small-diameter portion 322 has a smaller opening area than the large-diameter portion 321 and, in this embodiment, is the same area as the through-hole 31. Therefore, the through-hole 32 has a larger opening area on the front side 21 than on the back side 22.

[0037] The through hole 33 is a through hole having a star-shaped planar shape. That is, the openings of the front surface 21 and the back surface 22 of the through hole 33 are both star-shaped, and the cross section in the middle of the through hole is also a star-shaped opening of the same shape.

[0038] Decorative layers 41, 42, and 43 are formed in through-holes 31, 32, and 33, respectively, by electroplating. Decorative layers 41, 42, and 43 can be made of any material capable of being laminated by electroplating, such as Ag, Ni, Au, or Cr. Depending on the material of conductive substrate 10, a film of Cu, Ni, or the like may be formed by base plating to serve as a base layer covering front surface 11 of conductive substrate 10.

[0039] In the dial 3 of this embodiment, as Figure 1 As shown, the stars of the constellation are represented by the decorative layers 41, 42, and 43. That is, within the range from 12 o'clock to 2 o'clock on the dial 3, the decorative layers 41, 42, and 43 represent seven stars, thereby representing the Big Dipper pattern 51. A line connecting the decorative layers 41, 42, and 43 is marked on the dial 3 to facilitate visualization of the Big Dipper pattern 51.

[0040] From 7 o'clock to 8 o'clock on the dial 3, five stars are represented by decorative layers 42 and 43, thereby representing the Cassiopeia pattern 52. A line connecting the decorative layers 42 and 43 is marked on the dial 3 to make it easier to imagine the Cassiopeia pattern 52.

[0041] In addition, in each pattern 51 and pattern 52, the lines connecting the decorative layers 41, 42, and 43 can also be formed on the front surface 21 of the non-conductive substrate 20 by inkjet printing, etc., but similarly to the through holes 31, 32, and 33, fine grooves can be formed from the front surface 21 to the back surface 22, and the decorative layer can be formed by electroplating in the fine grooves to express the lines.

[0042] Next, refer to Figure 3A 、 Figure 3B 、 Figure 4 , a method for manufacturing the dial 3 as a timepiece component will be described.

[0043] First, a preparation step of preparing the conductive substrate 10 and the non-conductive substrate 20 is performed.

[0044] Specifically, the conductive substrate 10 is prepared by forming a metal plate such as brass by punching. At this time, a center hole for the pointer shaft to be inserted is also punched out. Furthermore, if a date window is formed on the dial 3, this window is also punched out.

[0045] The non-conductive substrate 20 is prepared by cutting the mother-of-pearl sheet. In this embodiment, the non-conductive substrate 20 is prepared in the same planar shape and planar dimensions as the conductive substrate 10 and is processed with a center hole and the like in the conductive substrate 10.

[0046] Then, if Figure 3A As shown, a laminating step is performed in which the front surface 11 of the conductive substrate 10 and the back surface 22 of the non-conductive substrate 20 are laminated together using a double-sided tape or an adhesive.

[0047] Then, if Figure 3B As shown, a hole forming step is performed to form through-holes 31, 32, and 33 that penetrate at least the non-conductive substrate 20 from the front surface 21 of the laminated non-conductive substrate 20 and reach the conductive substrate 10. Through-holes 31, 32, and 33 can be formed using laser processing, machining, sandblasting, or the like. Specifically, an appropriate processing method can be employed depending on the material of the conductive substrate 10 and the shape and size of the through-holes 31, 32, and 33 to be formed.

[0048] Then, if Figure 4 As shown, the electroplating step is performed. In the electroplating step, after the conductive substrate 10 and non-conductive substrate 20 bonded in the bonding step undergo predetermined pretreatments such as cleaning, the bonded conductive substrates 10 and 20, along with a plating metal 62 such as Ni, are immersed in an electrolyte 61 within a plating tank 60. The anode of a DC power supply 63 is connected to the plating metal 62, while the cathode of the DC power supply 63 is connected to the conductive substrate 10, allowing current to flow. A reduction reaction occurs in the conductive substrate 10, acting as the cathode. Metal ions in the electrolyte 61 combine with electrons to precipitate metal, resulting in the growth of a plated film. In this process, the plated film grows only in the through-holes 31, 32, and 33 of the non-conductive substrate 20 where the conductive substrate 10 is exposed, forming decorative layers 41, 42, and 43. Furthermore, a plated film such as Ni also forms on the back and side surfaces of the conductive substrate 10, which are in contact with the electrolyte 61.

[0049] An oxidation reaction occurs in the plating metal 62 serving as the anode, dissolving the anode metal such as Ni in the electrolyte 61 , thereby replenishing the metal ions in the electrolyte 61 .

[0050] The thickness of the decorative layers 41, 42, and 43 formed in the through-holes 31, 32, and 33 can be adjusted by, for example, plating time. In this embodiment, the front surfaces of the decorative layers 41, 42, and 43 are adjusted to be located midway along the through-holes 31, 32, and 33, that is, closer to the back surface 22 than the front surface 21 of the non-conductive substrate 20. Therefore, the decorative layers 41, 42, and 43 are formed recessed relative to the front surface 21 of the non-conductive substrate 20.

[0051] After the plating time required to form the decorative layers 41, 42, and 43, the conductive substrate 10 and the non-conductive substrate 20 are lifted out of the electrolyte 61, and after the prescribed post-processing such as removing the attached electrolyte 61, the finishing process of the dial 3 such as pasting the logo 5 is carried out to complete the dial 3.

[0052] [Effects of the First Embodiment]

[0053] The dial 3 can be decorated with metallic decorations using decorative layers 41, 42, and 43 on the front surface 21 of the non-conductive substrate 20, thereby forming patterns 51 and 52 and providing a diverse and aesthetically pleasing dial 3. In particular, the decorative layers 41, 42, and 43 differ in the area and shape exposed on the front surface 21 of the non-conductive substrate 20, allowing for different uses depending on the star level of the constellation.

[0054] Since a plating film is also formed on the back surface and side surfaces of the conductive base material 10 by electroplating, the corrosion resistance of the conductive base material 10 made of brass can also be improved.

[0055] After the conductive substrate 10 and the non-conductive substrate 20 are bonded together and the through-holes 31 , 32 , 33 are formed in the non-conductive substrate 20 , the decorative layers 41 , 42 , 43 can be formed by electroplating. This allows for easy production while reducing costs.

[0056] Since the through holes 31 , 32 , and 33 are processed after the conductive substrate 10 and the non-conductive substrate 20 are bonded together, the processing can be performed while the non-conductive substrate 20 is reinforced by the conductive substrate 10 , thereby preventing the non-conductive substrate 20 from being damaged during hole processing.

[0057] [Second embodiment]

[0058] Figure 5 1 is a front view showing a dial 3B as a timepiece component according to the second embodiment. Components of the dial 3B according to the second embodiment that are identical or similar to those of the dial 3 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted or simplified.

[0059] The dial 3B of the second embodiment is formed with a pattern 55 that is different from the dial 3 of the first embodiment. The pattern 55 is a pattern that depicts flowers and is formed around the center hole 30 of the dial 3B.

[0060] like Figure 6 As shown, the dial 3B is formed by laminating a conductive substrate 10 and a non-conductive substrate 20. The conductive substrate 10 is a metal plate such as brass, similar to the first embodiment, and therefore its description is omitted.

[0061] The non-conductive substrate 20 is a mother-of-pearl sheet similar to the first embodiment, and has through holes 35 formed therein that penetrate from the front surface 21 to the back surface 22 .

[0062] The through hole 35 includes an opening portion 351 on the front surface 21 side and a recessed portion 352 on the back surface 22 side.

[0063] The opening 351 is a portion that opens toward the front surface 21 and includes a plurality of planar circular openings 351A formed at the center of the pattern 55 and five planar substantially triangular openings 351B radially arranged from the opening 351A.

[0064] The recessed portion 352 is a groove portion that opens toward the back surface 22 and has a planar shape that depicts a petal. Therefore, it is formed over a larger area than the planar area where the opening portion 351 is formed. Therefore, the through hole 35 has a larger opening area on the back surface 22 side than on the front surface 21 side.

[0065] A decorative layer 45 is formed in the through-hole 35 by electroplating. The decorative layer 45 can be made of any material capable of being laminated by electroplating, and as in the first embodiment, examples thereof include Ag, Ni, Au, Cr, etc. Depending on the material of the conductive substrate 10, a film of Cu, Ni, etc. may be formed by base plating to serve as a base layer covering the front surface 11 of the conductive substrate 10, as in the first embodiment.

[0066] The decorative layer 45 formed in the opening 351 is directly exposed on the front side of the dial 3B, and thus appears in the metallic color of the plated layer. Meanwhile, the non-conductive substrate 20 is disposed on the front side of the decorative layer 45 formed in the recess 352. Therefore, the metallic color is visible through the pattern of the translucent mother-of-pearl sheet of the non-conductive substrate 20, resulting in a softer appearance.

[0067] Next, refer to Figure 7A 、 Figure 7B 、 Figure 7C A method for manufacturing the dial 3B, which is a timepiece component, will be described.

[0068] First, a preparation step is performed to prepare the conductive substrate 10 and the non-conductive substrate 20. The details of the preparation step are the same as those of the first embodiment, and therefore, description thereof will be omitted.

[0069] Then, if Figure 7A As shown in FIG. 1 , a hole forming step is performed to form a through hole 35 in the non-conductive substrate 20 by laser processing or the like. At this time, the size of the recessed portion 352 opened toward the back surface 22 is larger than the opening portion 351 opened toward the front surface 21 of the non-conductive substrate 20, so as to Figure 7A As shown, the front side 21 is placed on the workbench of the processing machine, and the back side 22 is arranged on the processing machine side to perform hole forming processing. Thus, after processing the concave portion 352, the opening portion 351 is processed, and a large concave portion 352 can be formed on the back side 22 side.

[0070] Then, if Figure 7B and Figure 7CAs shown, a lamination process is performed using double-sided tape or an adhesive to laminate the front surface 11 of the conductive substrate 10 and the back surface 22 of the non-conductive substrate 20. Therefore, the recess 352 of the through hole 35 formed in the non-conductive substrate 20 is located on the conductive substrate 10 side, and the opening 351 is located on the front surface 21 side.

[0071] Next, the electroplating process is performed in the same manner as in the first embodiment. The electroplating process is the same as in the first embodiment, so the description thereof is omitted. Figure 6 As shown, a decorative layer 45 is formed in the through-hole 35. The thickness of the decorative layer 45 can be adjusted by, for example, the plating time. In this embodiment, the front surface of the decorative layer 45 is located midway in the through-hole 35 in the direction of the opening 351, that is, in the recessed portion 352. The front surface of the decorative layer 45 laminated in the opening 351 is aligned closer to the back surface 22 than the front surface 21 of the non-conductive substrate 20. Therefore, the decorative layer 45 is formed to the back surface of the non-conductive substrate 20 in the recessed portion 352 and is recessed relative to the front surface 21 in the opening 351.

[0072] Then, the conductive substrate 10 and the non-conductive substrate 20 are lifted out of the electrolyte 61 and subjected to predetermined post-processing such as removal of the attached electrolyte 61. Then, finishing steps such as attaching the logo 5 are performed to complete the dial 3B.

[0073] [Effects of the Second Embodiment]

[0074] The dial 3B of the second embodiment can achieve the same effects as those of the first embodiment.

[0075] Furthermore, the dial 3B is provided with a decorative layer 45 formed in the recess 352 on the back side of the non-conductive substrate 20, thereby enabling a novel design in which the metal decoration of the decorative layer 45 overlaps with the natural pattern of the mother-of-pearl piece, thereby providing a diverse and aesthetically pleasing dial 3B.

[0076] After forming the through hole 35 on the non-conductive substrate 20, the conductive substrate 10 and the non-conductive substrate 20 are bonded together, and then electroplating can be performed to form the decorative layer 45. This increases the degree of freedom in the shape of the through hole 35 and allows for easy production while suppressing costs.

[0077] [Modification]

[0078] The structure of the dial as a timepiece component is not limited to the above-described embodiments.

[0079] The height positions of the front surfaces of the decorative layers 41, 42, 43, and 45 formed in the through holes 31, 32, 33, and 35 are not limited to being in the middle of the through holes 31, 32, 33, and 35 as in the above embodiment. For example, if the decorative layer formed in the through hole 31 is used as an example, then Figure 8A As shown, flash plating may be used to form a thin decorative layer 41A on the front surface 11 of the conductive substrate 10 .

[0080] In addition, if Figure 8B As shown, plating may be performed so that the front surface of the decorative layer 41B and the front surface 21 of the non-conductive base material 20 are flush with each other.

[0081] And, as Figure 8C As shown, the front surface of the decorative layer 41C may be higher than the front surface 21 of the non-conductive substrate 20. In this case, since the decorative layer 41C is stacked highest at the center of the through hole 31, the front surface of the decorative layer 41C is formed to bulge in a spherical crown shape.

[0082] As shown in the decorative layer 41 , the decorative layer 41A, the decorative layer 41B, and the decorative layer 41C, various designs with different three-dimensional effects can be realized by adjusting the thickness (height dimension) of the decorative layer by using plating time or the like.

[0083] In addition, if Figure 9 As shown, a plurality of through-holes 36 may be formed in the non-conductive substrate 20, and a decorative layer 41D may be laminated so as to be raised relative to the front surface 21, and formed continuously with the decorative layer 41D formed in other through-holes 36. In this way, the decorative layers 41D formed by electroplating are connected, achieving a wavy design.

[0084] The non-conductive substrate 20 may also be formed by laminating two or more non-conductive plates. In particular, when the hole size varies in the through-hole direction, as in through-holes 32 and 35, laminating a plate having a large-diameter portion 321 and an opening 351 with a plate having a small-diameter portion 322 and a recess 352 can improve hole machining efficiency.

[0085] The shape of the through-hole is not limited to the above-mentioned embodiments. For example, the through-hole may be a through-hole with an inclined inner circumference, for example, a truncated cone whose diameter increases from the front side 21 to the back side 22 of the non-conductive substrate 20, or a truncated cone whose diameter decreases from the front side 21 to the back side 22. In addition, the planar shape of the through-hole is not limited to a circle or a star, and may be a polygon such as a triangle or a quadrilateral, or may be a shape based on a vehicle, a character, etc. Furthermore, when the front side of the non-conductive substrate 20 is viewed from above, the pattern of the through-hole, i.e., the decorative layer based on electroplating, may be in a grid shape, a concentric circle shape, a spiral shape, an island shape, etc. Furthermore, a recessed portion continuous with the through-hole of the non-conductive substrate 20 may be formed on the front side 11 of the conductive substrate 10. In this case, since the decorative layer can be formed by electroplating in the recessed portion of the front surface 11 of the conductive substrate 10, even if the recessed portion 352 with a large opening area is not formed on the back surface 22 side of the non-conductive substrate 20 as in the second embodiment, the decorative layer can be arranged in an overlapping manner on the back surface 22 side of the non-conductive substrate 20.

[0086] Alternatively, when the non-conductive substrate 20 is formed of a translucent material and a stepped or inclined portion is provided in the through-hole, as in the case of the through-hole 32, the flash plating and electroplating times can be shortened, and the decorative layer can be formed only in the small-diameter portion 322. In this case, the non-conductive substrate 20 that overlaps the large-diameter portion 321 in the thickness direction is thinner than the portion of the non-conductive substrate 20 where the through-hole is not formed. Therefore, the base color of the conductive substrate 10 or the metallic color of the base plating layer can be visually seen through the thin non-conductive substrate 20. This allows for the expression of three levels of design: the design based on the decorative layer in the small-diameter portion 322, the design based on the non-conductive substrate 20 and conductive substrate 10 in the large-diameter portion 321, and the design based on the non-conductive substrate 20 and conductive substrate 10 outside the through-hole 32, achieving a design that combines a three-dimensional effect with metallic decoration.

[0087] The watch component is not limited to the dial, and can be any component constituting the watch, and is particularly preferably a component visible from the outside of the watch. Therefore, the watch component may also be a dial, an outer case, a bezel, a dial ring, a back cover, a watch band, a hand, a train bridge, an oscillating weight, etc.

[0088] [Example]

[0089] Next, we will refer to Figure 10 Describe the embodiments of the present disclosure. Figure 10 As shown, Examples 1 to 12 and Comparative Examples 1 to 6 set the conditions of through-holes, plating, etc. respectively and evaluated them. Figure 10In the condition column, "○" means that the condition is met. In addition, "Through hole shape of non-conductive substrate" in the condition column represents the shape of the through hole formed in the non-conductive substrate 20. Here, "through hole" refers to a straight through hole such as through hole 31. "Non-through three-dimensional processing" refers to a three-dimensional processing that does not penetrate the non-conductive substrate 20 to form a groove, and therefore refers to a state in which a decorative layer cannot be formed by electroplating. "Through three-dimensional processing (front side)" refers to a through hole whose size changes in the middle of the through direction, such as through hole 32, and whose opening area on the front side 21 of the non-conductive substrate 20 is larger than the opening area on the back side 22. "Through three-dimensional processing (back side)" refers to a through hole whose size changes in the middle of the through direction, such as through hole 35, and whose opening area on the front side 21 of the non-conductive substrate 20 is smaller than the opening area on the back side 22.

[0090] The "thickness of the decorative layer" in the condition column is classified by the thickness of the decorative layer formed on the through hole by electroplating. Figure 8A The thin film decorative layer formed by flash plating like the decorative layer 41A of FIG. Figure 2 The decorative layer is formed to a height position midway through the through hole, as in the decorative layer 41 of FIG. Figure 8C In the case where the thickness of the decorative layer is thicker than the non-conductive substrate 20, as in the case of the decorative layer 41C, Figure 8B The front surface of the decorative layer is flush with the front surface 21 of the non-conductive substrate 20, as shown in the decorative layer 41B. Furthermore, "metal evaporation" is not electroplating, but rather forms a metal film on the front surface of the non-conductive substrate 20 by evaporation. This metal film is formed not only in the through-hole portion but also on the front surface 21 of the non-conductive substrate 20.

[0091] The evaluation columns are the results of evaluating the watch dials, which are timepiece components manufactured under various conditions. "Three-dimensional effect," "Metallic decoration," and "Originality" are sensory evaluations based on the evaluators' visual perception.

[0092] Regarding "three-dimensional effect," when visually inspecting the dial, a high three-dimensional effect was rated as "◎," a presence of three-dimensional effect was rated as "○," a low three-dimensional effect was rated as "△," and no three-dimensional effect was rated as "×." Regarding "metal decoration," when visually inspecting the dial, a metal decoration that could be well identified was rated as "○," a metal decoration that was difficult to identify was rated as "△," and no metal decoration was rated as "×." Regarding originality, when visually inspecting the dial, a high originality was rated as "◎," a presence of originality was rated as "○," and no originality was rated as "×." "Cost" was the result of a comparative evaluation of manufacturing costs, with costs decreasing in the order of "×," "△," "○," and "◎."

[0093] The product evaluation is an evaluation of the product value based on the four indicators in the evaluation column, and the evaluation is performed in the order of "×", "△", "○", and "◎" with the product value increasing.

[0094] Examples 1 to 3 vary the thickness of the decorative layer 41 formed in through-hole 31, and it can be evaluated that the thicker the decorative layer, the better the three-dimensional effect. Examples 4 to 6 vary the thickness of the decorative layer 42 formed in through-hole 32, and the thicker the decorative layer, the better the three-dimensional effect. Furthermore, due to the presence of large-diameter portion 321 and small-diameter portion 322, it can be evaluated that the three-dimensional effect is improved even when the decorative layer is thinner than the non-conductive substrate 20. Examples 7 to 9, in which the decorative layer is formed in both through-hole 31 and through-hole 32, yield similar evaluation results to Examples 4 to 6. Examples 10 to 12 vary the thickness of the decorative layer 45 formed in through-hole 35. This reduces the area of the opening 351 exposed on the front surface of the non-conductive substrate 20, thereby reducing the three-dimensional effect. However, this allows for a novel design in which the decorative layer 45 in the recessed portion 352 is visible through the non-conductive substrate 20, resulting in a highly original dial 3B. In addition, since the decorative layer is formed by electroplating in Examples 1 to 12, the cost is increased to some extent. However, Examples 1 to 12 can provide watch dials with high commercial value (○) or very high (◎).

[0095] On the other hand, in Comparative Examples 1 to 6, since the decorative layer is not formed by plating the through-holes, the product value cannot be improved.

[0096] Therefore, as disclosed herein, by laminating the conductive substrate 10 and the non-conductive substrate 20 , forming through holes in the non-conductive substrate 20 , and forming a decorative layer by electroplating, a watch face with high commercial value can be provided.

[0097] [Summary of the present disclosure]

[0098] The timepiece component disclosed herein is characterized in that it comprises: a conductive substrate; and a non-conductive substrate bonded to the conductive substrate, wherein the non-conductive substrate has a through hole extending from the back surface bonded to the conductive substrate to the front surface, and a decorative layer is formed in the through hole by electroplating.

[0099] According to the timepiece component disclosed herein, a conductive substrate and a non-conductive substrate are bonded together to form a through-hole extending from the back side of the non-conductive substrate to the front side. Therefore, by connecting the conductive substrate to the cathode of a DC power supply and immersing it in an electrolyte, a decorative layer can be formed using a plating film deposited on the through-hole by electroplating. Consequently, metallic decoration achieved by the decorative layer can be added to the non-conductive substrate portion of the timepiece component, thereby providing a diverse and aesthetically pleasing timepiece component.

[0100] In the timepiece component of the present disclosure, the decorative layer may be formed from the conductive base material side to midway through the through hole.

[0101] According to the watch component disclosed herein, since the decorative layer is formed in the through hole from the conductive substrate side to the middle of the through hole, that is, at a position lower than the front surface of the through hole, the thickness of the decorative layer is smaller than the thickness of the non-conductive substrate, and a three-dimensional effect of a partially recessed decorative layer can be obtained.

[0102] In the timepiece component of the present disclosure, the decorative layer may be formed from the conductive substrate side to above the front surface of the non-conductive substrate.

[0103] According to the timepiece component of the present disclosure, the height position of the front surface of the decorative layer is higher than the front surface of the non-conductive substrate, so that a three-dimensional effect of a raised decorative layer can be obtained.

[0104] In the timepiece component of the present disclosure, the inner peripheral surface of the through hole may be formed in a stepped or inclined shape, and the opening area of the through hole on the front side may be larger than the opening area of the through hole on the back side.

[0105] The timepiece component disclosed herein can increase the area of the decorative layer exposed on the front surface of the non-conductive substrate, thereby emphasizing the metallic decoration. Furthermore, compared to a case where the opening area of the through-hole is continuous from the front side to the back side, the volume of the through-hole can be reduced, thereby reducing the amount of plating film laminated as the decorative layer and further reducing costs.

[0106] In the timepiece component of the present disclosure, the inner peripheral surface of the through hole may be formed in a stepped or inclined shape, and the opening area on the back side of the through hole may be larger than the opening area on the front side of the through hole.

[0107] According to the timepiece component disclosed herein, since the area of the decorative layer exposed on the front side of the non-conductive substrate is smaller than the area exposed on the back side, a portion for configuring the decorative layer can be formed on the back side of the non-conductive substrate, thereby realizing a novel design in which the non-conductive substrate and the decorative layer overlap.

[0108] In the timepiece component of the present disclosure, a plurality of through holes having different opening areas on the front side may be formed in the non-conductive base material.

[0109] According to the timepiece component of the present disclosure, since a plurality of through-holes having different opening areas are formed, a plurality of decorative layers having different exposed areas can be formed, thereby achieving diverse and complex designs.

[0110] In the timepiece component of the present disclosure, the non-conductive substrate may be formed of a mother-of-pearl sheet.

[0111] According to the timepiece component of the present disclosure, if the non-conductive base material is formed of a mother-of-pearl sheet, a timepiece component having a high aesthetic appeal can be provided, in which a metallic decoration using a decorative layer is added to the natural pattern of the mother-of-pearl.

[0112] In the timepiece component of the present disclosure, it is preferable that the non-conductive substrate constitutes a dial in which the non-conductive substrate is arranged on the front side.

[0113] According to the timepiece component of the present disclosure, it is possible to provide a watch face that is diverse and highly aesthetic.

[0114] The timepiece disclosed in the present invention is characterized by including the timepiece component described above.

[0115] According to the timepiece of the present disclosure, the aesthetics of the timepiece component can be improved, and a timepiece with excellent design can be provided.

[0116] The manufacturing method of watch parts disclosed in the present invention includes: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a bonding step of bonding the conductive substrate and the non-conductive substrate; a hole forming step of forming a through hole that penetrates at least the non-conductive substrate from the front side of the bonded non-conductive substrate and reaches the conductive substrate; and an electroplating step of immersing the conductive substrate and the non-conductive substrate in an electrolyte and passing current through the conductive substrate to electroplate the through hole of the non-conductive substrate.

[0117] According to the present disclosure, a metal decoration by a decorative layer can be added to a non-conductive base portion of a timepiece component, thereby providing a timepiece component having a variety of features and a high aesthetic quality.

[0118] Furthermore, since the through-hole is formed after the conductive base material and the non-conductive base material are bonded together, the through-hole can be processed while the non-conductive base material is reinforced by the conductive base material.

[0119] The manufacturing method of the watch parts disclosed in the present invention includes: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a hole forming step of forming a through hole in the non-conductive substrate; a bonding step of bonding the conductive substrate and the non-conductive substrate with the through hole formed therein; and an electroplating step of immersing the conductive substrate and the non-conductive substrate in an electrolyte and passing a current through the conductive substrate to electroplate the through hole of the non-conductive substrate.

[0120] According to the present disclosure, a metal decoration by a decorative layer can be added to a non-conductive base portion of a timepiece component, thereby providing a timepiece component having a variety of features and a high aesthetic quality.

[0121] Furthermore, since the through-hole is formed in the non-conductive substrate before the conductive substrate and the non-conductive substrate are bonded together, the through-hole having a larger opening area on the back side than on the front side can be formed in the non-conductive substrate.

Claims

1. A timepiece component comprising: a conductive substrate; and a non-conductive substrate, which is bonded to the conductive substrate, The non-conductive substrate has a through hole extending from the back surface bonded to the conductive substrate to the front surface, and a decorative layer is formed in the through hole by electroplating.

2. The timepiece component according to claim 1, wherein The decorative layer is formed from the conductive base material side to the middle of the through hole.

3. The timepiece component according to claim 1, wherein The decorative layer is formed from the conductive substrate side to above the front surface of the non-conductive substrate.

4. The timepiece component according to claim 1, wherein The inner peripheral surface of the through hole is formed in a stepped or inclined shape. An opening area on the front side of the through hole is larger than an opening area on the back side of the through hole.

5. The timepiece component according to claim 1, wherein The inner peripheral surface of the through hole is formed in a stepped or inclined shape. An opening area on the rear side of the through hole is larger than an opening area on the front side of the through hole.

6. The timepiece component according to claim 1, wherein The non-conductive base material includes a plurality of through holes having different opening areas on the front side.

7. The timepiece component according to claim 1, wherein The non-conductive substrate is composed of mother-of-pearl sheets.

8. The timepiece component according to claim 1, wherein The timepiece component constitutes a dial in which the non-conductive substrate is arranged on the front side. 9 . A timepiece comprising the timepiece component according to claim 1 .

10. A method for manufacturing a watch component, The method for manufacturing a timepiece component comprises the following steps: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a laminating step of laminating the conductive substrate to the non-conductive substrate; a hole forming step of forming a through hole that penetrates at least the non-conductive substrate from the front side of the laminated non-conductive substrate to the conductive substrate; as well as In the electroplating step, the conductive substrate and the non-conductive substrate are immersed in an electrolyte solution and current is passed through the conductive substrate to electroplating the through-holes of the non-conductive substrate.

11. A method for manufacturing a watch component, The method for manufacturing a timepiece component comprises the following steps: a preparation step of preparing a conductive substrate and a non-conductive substrate respectively; a hole forming step of forming a through hole in the non-conductive substrate; a laminating step of laminating the conductive substrate to the non-conductive substrate having the through-hole formed therein; In the electroplating step, the conductive substrate and the non-conductive substrate are immersed in an electrolyte solution and current is passed through the conductive substrate to electroplating the through-holes of the non-conductive substrate.

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