The invention discloses a method for preparing a
silicon escapement wheel, and belongs to the technical field of micro-
nano machining. The method provided by the invention comprises the following steps: providing a thin
silicon wafer with a target thickness, and
etching one surface of the thin
silicon wafer to form a plurality of blind holes; preparing a soft
mask on the surface of one side, deviating from the
blind hole, of the thin silicon
wafer;
etching one side of the soft
mask on the thin silicon wafer so as to etch through the bottom of the
blind hole to form a
cantilever beam structure of the silicon
escapement wheel; and taking down the silicon
escapement wheel from the
blind hole to obtain the free silicon escapement wheel. According to the method, the
cantilever beam structure is formed, parts can be collected more easily, the problem of high-precision equipment needed by the bonding and glue filling process is solved, large-batch silicon escapement wheels can be simply prepared, meanwhile, the problem of side wall inclination angle caused by the fact that deep
etching is needed at a time is solved, high quality of the side wall of the silicon escapement wheel is achieved, and the production efficiency is improved. And a solution is provided for preparing large-batch and high-yield silicon escapement wheel devices.