Suspended microstrip high-power attenuator

Abstract

The invention discloses a suspended micro-strip high-power attenuator. The attenuator comprises a radiator, a radiating fin arranged on the bottom surface of the radiator, a mounting groove formed in the top surface of the radiator, at least two attenuation slices mounted in the mounting groove, and an elastic sheet arranged between the at least two attenuation slices and used for connecting the at least two attenuation slices in series, the first connector is arranged at the first end of the radiator and is electrically connected with the first ends of the at least two attenuation slices; and the second connector is arranged at the second end of the radiator and is electrically connected with the second ends of the at least two attenuation slices. According to the application, the attenuation slices with the attenuation circuit are connected in series through the connecting elastic sheets to obtain a required attenuation value, the radiator adopts a special structural design that the middle part is slotted, an attenuation network circuit formed by at least two attenuation slices is partially suspended, and the left side and the right side of the attenuation network circuit are clamped in the radiator mounting grooves; a part of heat of the attenuation piece is directly transmitted to the radiator for heat dissipation in a heat transmission mode, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of high-power attenuators, and more particularly to a suspended microstrip high-power attenuator. Background Art

[0002] Existing conventional attenuators primarily utilize flanged attenuators for step-by-step attenuation to achieve the most even power distribution possible. The absorbed power is then converted into heat that is transferred to an external heat sink through the attenuator's mounting flange. However, the presence of a mounting flange between the attenuator circuit and the external heat sink reduces thermal conductivity. Furthermore, the presence of voids in the mounting flange and heat sink during installation also reduces thermal conductivity. Consequently, heat from the attenuator circuit cannot be effectively and quickly transferred to the external heat sink, resulting in poor heat dissipation and impacting the normal operation of the attenuator. Summary of the Invention

[0003] In view of the above-mentioned defects in the prior art, the present invention provides a suspended microstrip high-power attenuator.

[0004] The technical solution adopted by the present invention to solve its technical problems is: constructing a suspended microstrip high-power attenuator, which includes a heat sink, a heat sink arranged on the bottom surface of the heat sink, a mounting groove arranged on the top surface of the heat sink, at least two attenuation plates installed in the mounting groove, a spring arranged between the at least two attenuation plates for connecting the at least two attenuation plates in series, a first connector arranged at the first end of the heat sink and electrically connected to the first ends of the at least two attenuation plates, and a second connector arranged at the second end of the heat sink and electrically connected to the second ends of the at least two attenuation plates.

[0005] In the suspended microstrip high-power attenuator described in the present invention, a first step is provided on the first side wall of the mounting groove, and a second step is provided on the second side wall of the mounting groove. The two sides of the at least two attenuation plates are respectively installed on the first step and the second step, and the lower middle part of the at least two attenuation plates is a hollow groove body.

[0006] In the suspended microstrip high power attenuator described in the present invention, the first connector includes a first connecting column for electrically connecting to the first ends of at least two attenuation plates, and the second connector includes a second connecting column for electrically connecting to the second ends of at least two attenuation plates.

[0007] In the suspended microstrip high-power attenuator described in the present invention, the connecting end of the first connecting column is provided with a first embedding groove for the first ends of the at least two attenuation plates to be embedded and connected, and the connecting end of the second connecting column is provided with a second embedding groove for the second ends of the at least two attenuation plates to be embedded and connected.

[0008] In the suspended microstrip high-power attenuator described in the present invention, each of the at least two attenuation plates includes a ceramic substrate, an attenuation circuit attached to the ceramic substrate, and a grounding circuit covering both sides of the ceramic substrate.

[0009] In the suspended microstrip high-power attenuator described in the present invention, the attenuation circuit is attached to the middle of the surface of the ceramic substrate by screen printing using resistor paste, and the grounding circuit is fully covered on both sides of the ceramic substrate using palladium silver through a thick film process.

[0010] In the suspended microstrip high-power attenuator described in the present invention, the spring piece includes a connecting piece clamped between two attenuation pieces, a first clamp and a second clamp vertically fixed to the first side of the connecting piece and used to clamp the upper and lower sides of the first attenuation piece, and a third clamp and a fourth clamp vertically fixed to the second side of the connecting piece and used to clamp the upper and lower sides of the second attenuation piece.

[0011] In the suspended microstrip high-power attenuator described in the present invention, the distance between the first clip and the second clip is equal to or slightly less than the thickness of the attenuation plate, and the distance between the third clip and the fourth clip is equal to or slightly less than the thickness of the attenuation plate.

[0012] The implementation of the suspended microstrip high-power attenuator of the present invention has the following beneficial effects: when using the suspended microstrip high-power attenuator of the present invention, at least two attenuation plates are connected in series through springs and installed in the installation slot, and then the first connector and the second connector are connected to the two ends of the attenuation plates to realize the assembly of the attenuator. In the present application, the attenuation plates with attenuation circuits are connected in series through connecting springs to obtain the required attenuation value. The heat sink adopts a special structural design with a slot in the middle, and the attenuation network circuit composed of at least two attenuation plates is partially suspended. The left and right sides are stuck in the heat sink installation slot, so that part of the heat of the attenuation plate is directly transferred to the heat sink for heat dissipation through heat transfer. At the same time, since the bottom of the attenuation plate is suspended, the heat at the bottom of the attenuation plate can also be directly dissipated to the outside world, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which: Figure 1 Schematic diagram of the structure of the suspended microstrip high power attenuator of the present invention; Figure 2 It is a schematic structural diagram of the attenuation plate in the suspended microstrip high power attenuator of the present invention; Figure 3 It is a structural schematic diagram of the spring in the suspended microstrip high-power attenuator of the present invention. DETAILED DESCRIPTION

[0014] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0015] like Figure 1-3 As shown, in the first embodiment of the suspended microstrip high-power attenuator of the present invention, the attenuator 10 includes a heat sink 11, a heat sink 12 arranged on the bottom surface of the heat sink 11, a mounting groove 13 arranged on the top surface of the heat sink 11, at least two attenuation plates 14 installed in the mounting groove 13, a spring 15 arranged between the at least two attenuation plates 14 for connecting the at least two attenuation plates 14 in series, a first connector 16 arranged at a first end of the heat sink 11 and electrically connected to the first ends of the at least two attenuation plates 14, and a second connector 17 arranged at a second end of the heat sink 11 and electrically connected to the second ends of the at least two attenuation plates 14.

[0016] It is understandable that the spring piece 15 is made of a metal material that is elastic and conductive. When the spring piece 15 is disposed between two attenuation pieces 14, the spring piece 15 is used to connect the two adjacent attenuation pieces 14 in series.

[0017] The heat sink 11 is formed of a heat dissipation metal material, such as aluminum, and the heat sink 12 is a plurality of heat sinks 12 that are parallel to each other.

[0018] When using the suspended microstrip high-power attenuator of the present invention, at least two attenuation sheets 14 are connected in series through the spring clips 15 and installed in the mounting groove 13, and then the first connector 16 and the second connector 17 are connected to the two ends of the attenuation sheets 14 to realize the assembly of the attenuator 10. In the present application, the attenuation sheets 14 with the attenuation circuit 26 are connected in series through the spring clips 15 to obtain the required attenuation value. The heat sink 11 adopts a special structural design with a slot in the middle, and the attenuation network circuit composed of at least two attenuation sheets 14 is partially suspended. The left and right sides are stuck in the mounting groove 13 of the heat sink 11, so that a part of the heat of the attenuation sheet 14 is directly transferred to the heat sink 11 through heat transfer for heat dissipation. At the same time, since the bottom of the attenuation sheet 14 is suspended, the heat at the bottom of the attenuation sheet 14 can also be directly dissipated to the outside, thereby improving the heat dissipation efficiency.

[0019] Preferably, a first step 18 is provided on the first side wall of the mounting groove 13, and a second step 19 is provided on the second side wall of the mounting groove 13. The two sides of the at least two attenuation plates 14 are respectively installed on the first step 18 and the second step 19. The lower middle part of the at least two attenuation plates 14 is a hollow groove body 20.

[0020] The hollow trough body 20 is located between the first step 18 and the second step 19 , and the bottom wall of the hollow trough body 20 is lower than the step surface of the first step 18 and the step surface of the second step 19 .

[0021] Specifically, the first connector 16 includes a first connecting post 21 for electrically connecting to the first ends of at least two attenuation plates 14 , and the second connector 17 includes a second connecting post 22 for electrically connecting to the second ends of at least two attenuation plates 14 .

[0022] Preferably, the connecting end of the first connecting column 21 is provided with a first embedding groove 23 for the first ends of the at least two attenuation plates 14 to be embedded and connected, and the connecting end of the second connecting column 22 is provided with a second embedding groove 24 for the second ends of the at least two attenuation plates 14 to be embedded and connected.

[0023] During assembly, the attenuation sheet 14 is directly inserted into the first embedding groove 23 or the second embedding groove 24 for connection, which is convenient for connection and assembly and can also prevent the attenuation sheet from falling off.

[0024] In this embodiment, if Figure 2 As shown, each of the at least two attenuation plates 14 includes a ceramic substrate 25 , an attenuation circuit 26 attached to the ceramic substrate 25 , and a grounding circuit 27 covering both sides of the ceramic substrate 25 .

[0025] Furthermore, the attenuation circuit 26 is attached to the middle of the surface of the ceramic substrate 25 by screen printing using resistor paste, and the grounding circuit 27 is fully covered on both sides of the ceramic substrate 25 using palladium silver through a thick film process.

[0026] Both sides of the ceramic substrate 25 are fully covered with palladium silver thick film technology to ensure that the front circuit forms a capacitor loop to the ground and to achieve good heat transfer from the ceramic substrate 25 to the heat sink 11.

[0027] like Figure 3 As shown, the spring piece 15 includes a connecting piece 28 clamped between the two attenuation pieces 14, a first clamping piece 29 and a second clamping piece 30 vertically fixed on the first side of the connecting piece 28 and used to clamp the upper and lower sides of the first attenuation piece 14, and a third clamping piece 31 and a fourth clamping piece 32 vertically fixed on the second side of the connecting piece 28 and used to clamp the upper and lower sides of the second attenuation piece 14.

[0028] Preferably, the distance between the first clip 29 and the second clip 30 is equal to or slightly smaller than the thickness of the attenuation sheet 14 , and the distance between the third clip 31 and the fourth clip 32 is equal to or slightly smaller than the thickness of the attenuation sheet 14 .

[0029] The first clamp 29 and the second clamp 30 rely on their own elastic restoring force and the friction force between them to clamp the attenuation plate 14. Similarly, the third clamp 31 and the fourth clamp 32 rely on their own elastic restoring force and the friction force between them to clamp the attenuation plate 14.

[0030] Furthermore, in the present invention, unless otherwise expressly specified or limited, terms such as "connected," "connected," and "stacked" should be interpreted broadly. For example, they may refer to fixed or detachable connections, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two elements or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0031] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A suspended microstrip high power attenuator, characterized in that: The attenuator includes a heat sink, a heat sink arranged on the bottom surface of the heat sink, a mounting groove arranged on the top surface of the heat sink, at least two attenuation plates installed in the mounting groove, a spring plate arranged between the at least two attenuation plates for connecting the at least two attenuation plates in series, a first connector arranged at the first end of the heat sink and electrically connected to the first ends of the at least two attenuation plates, and a second connector arranged at the second end of the heat sink and electrically connected to the second ends of the at least two attenuation plates.

2. The suspended microstrip high power attenuator according to claim 1, characterized in that: A first step is provided on the first side wall of the mounting groove, a second step is provided on the second side wall of the mounting groove, both sides of the at least two attenuation plates are respectively installed on the first step and the second step, and a hollow groove body is provided below the middle of the at least two attenuation plates.

3. The suspended microstrip high power attenuator according to claim 1, characterized in that: The first connector includes a first connecting post for electrically connecting to first ends of at least two attenuation sheets, and the second connector includes a second connecting post for electrically connecting to second ends of at least two attenuation sheets.

4. The suspended microstrip high power attenuator according to claim 3, characterized in that: A first embedding groove is provided on the connecting end of the first connecting post for the first ends of the at least two attenuation sheets to be embedded and connected, and a second embedding groove is provided on the connecting end of the second connecting post for the second ends of the at least two attenuation sheets to be embedded and connected.

5. The suspended microstrip high power attenuator according to claim 1, characterized in that: Each of the at least two attenuation plates includes a ceramic substrate, an attenuation circuit attached to the ceramic substrate, and a grounding circuit covering both sides of the ceramic substrate.

6. The suspended microstrip high power attenuator according to claim 5, characterized in that: The attenuation circuit is attached to the middle of the surface of the ceramic substrate by screen printing using resistor paste, and the grounding circuit is fully covered on both sides of the ceramic substrate using palladium silver through a thick film process.

7. The suspended microstrip high power attenuator according to claim 1, characterized in that: The spring piece includes a connecting piece clamped between two attenuation pieces, a first clamping piece and a second clamping piece vertically fixed to the first side surface of the connecting piece and used to clamp the upper and lower sides of the first attenuation piece, and a third clamping piece and a fourth clamping piece vertically fixed to the second side surface of the connecting piece and used to clamp the upper and lower sides of the second attenuation piece.

8. The suspended microstrip high power attenuator according to claim 7, characterized in that: The distance between the first clip and the second clip is equal to or slightly smaller than the thickness of the attenuation sheet, and the distance between the third clip and the fourth clip is equal to or slightly smaller than the thickness of the attenuation sheet.

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