Electronic device for processing wireless signals of plurality of communication systems and method of operating same

Abstract

An electronic device according to various embodiments may include: a first transmission mixer up-converting a transmission signal; a second transmission mixer that upconverts a signal output from the first transmission mixer (635); a distribution circuit that distributes a signal output from the second transmission mixer; a first plurality of antenna ports connected to a first antenna structure for first frequency band communication based on a signal output from the distribution circuit; a third transmission mixer for up-converting the signal output from the distribution circuit; and a second plurality of antenna ports connected to a second antenna structure for second frequency band communication based on a signal output from the third transmission mixer.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to an apparatus and method for processing radio signals of multiple communication systems. Background Art

[0002] In line with the development of information / communication technology and semiconductor technology, electronic devices can provide various functions. For example, electronic devices can provide not only voice communication functions but also wireless communication functions (such as Long Term Evolution (LTE), LTE-A (Advanced), or Fifth Generation New Radio (5G NR)).

[0003] Following the commercialization of 4G communication systems, 5G communication systems have been developed to meet the increasing demand for wireless data services from various electronic devices, and efforts are also underway to develop 6th-generation (6G) communication systems. 5G communication systems can be implemented in millimeter wave (mmWave) frequency bands of 6 GHz or higher (e.g., frequency bands between 20 GHz and 60 GHz). 6G communication systems can be implemented in terahertz (THz) high-frequency bands (e.g., frequency bands between 100 GHz and 10 THz) to achieve high data transmission rates.

[0004] Electronic devices can generate and / or recover radio frequency (RF) signals to perform wireless communication functions. To support multiple communication systems, such as 5G and 6G communication systems, electronic devices may require circuits (e.g., radio frequency front ends (RFFEs)) for processing RF signals, and the circuits for processing RF signals may occupy a large physical area in the electronic devices. Summary of the Invention

[0005] According to various embodiments, the electronic device may include: a first transmit mixer configured to up-convert a transmission signal, a second transmit mixer configured to up-convert a signal output by the first transmit mixer, a divider circuit configured to divide the signal output by the second transmit mixer, a first antenna port associated with a first antenna structure for performing first frequency band communication based on the signal output by the divider circuit, a third transmit mixer configured to up-convert an output signal from the divider circuit, and a second antenna port associated with a second antenna structure for performing second frequency band communication based on the signal output by the third transmit mixer.

[0006] According to various embodiments, an electronic device may include: a first antenna structure including an antenna element for performing communication in a first frequency band, a second antenna structure including an antenna element for performing communication in a second frequency band, and circuitry configured to transmit or receive radio frequency signals via the first antenna structure or the second antenna structure. The circuitry may include: a first transmit mixer configured to upconvert a transmission signal, a second transmit mixer configured to upconvert a signal output by the first transmit mixer, a divider circuit configured to divide the frequency of the signal output by the second transmit mixer, a first antenna port associated with the first antenna structure for performing communication in the first frequency band based on the signal output by the divider circuit, a third transmit mixer configured to upconvert an output signal from the divider circuit, and a second antenna port associated with the second antenna structure for performing communication in the second frequency band based on the signal output by the third transmit mixer. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] Figure 2 is a block diagram of an electronic device configured to process radio signals of multiple communication systems according to various embodiments.

[0009] FIG3 illustrates an example of an electronic device configured to process radio signals of multiple communication systems according to various embodiments.

[0010] Figure 4 An example of an electronic device configured to process radio signals of multiple communication systems according to various embodiments is shown.

[0011] Figure 5 An example of an electronic device configured to process radio signals of multiple communication systems according to various embodiments is shown.

[0012] Figure 6a An example of a circuit structure configured to process radio signals of a plurality of communication systems in an electronic device according to various embodiments is shown.

[0013] Figure 6b An example of a circuit structure configured to process radio signals of a plurality of communication systems in an electronic device according to various embodiments is shown.

[0014] Figure 7 An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0015] Figure 8An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0016] Figure 9 An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0017] Figure 10 An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0018] Figure 11 An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0019] Figure 12 shows an example of the structure of a divider circuit and / or a combiner circuit in an example electronic device according to various embodiments;

[0020] Figure 13 An example wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown.

[0021] Figure 14 An example of a wireless communication circuit structure configured to process radio signals of multiple communication systems in an electronic device according to various embodiments is shown. DETAILED DESCRIPTION

[0022] Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings.

[0023] Figure 1 Reference is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1In the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with at least one of the electronic device 104 and the server 108 via a second network 199 (e.g., a long-range wireless communication network). Depending on the embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. Depending on the embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connector 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the aforementioned components (e.g., the connector 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be implemented as a single integrated component (eg, display module 160 ) 11 .

[0024] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or integrated with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0025] When the main processor 121 is inactive (e.g., in a sleep state), the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states associated with at least one of the components of the electronic device 1011 (e.g., the display module 160, the sensor module 176, or the communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component functionally related to the auxiliary processor 123 (e.g., the camera module 180 or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0029] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by the touch.

[0031] The audio module 170 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., New Radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance in high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0041] Antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device) outside of electronic device 101. Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Depending on the embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for the communication scheme used in a communication network (e.g., first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0042] According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., array antennas). The RFIC is disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and is capable of supporting a designated high-frequency band (e.g., the millimeter wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., the top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0044] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 may provide the results as at least a partial response to the request, either with or without further processing. To this end, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used. The electronic device 101 may use distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server that utilizes machine learning and / or neural networks. Depending on the embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be used for intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0045] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to embodiments of the present disclosure, the electronic device is not limited to those described above.

[0046] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0047] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0048] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0049] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., the Play Store). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (e.g., a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0050] According to various embodiments, each of the aforementioned components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the aforementioned components may be omitted, or one or more additional components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more additional operations may be added.

[0051] Figure 2 is an electronic device 200 configured to process radio signals for multiple communication systems (e.g., Figure 1 The electronic device 200 is an example of a structure that processes signals transmitted and / or received in the electronic device 200 in order to perform wireless communication functions. Among the components shown, some components may be redundantly implemented as multiple entities, omitted, or integrated, and may additionally include Figure 1 Components of the electronic device 101 are shown in addition to those shown.

[0052] According to various embodiments, the electronic device 200 may include components for supporting multiple communication systems including a first communication system (eg, a 5G communication system) and a second communication system (eg, a 6G communication system).

[0053] The electronic device 200 according to various embodiments may include a first antenna structure 210, a second antenna structure 220, a wireless communication circuit 230, an application processor 240 (eg, Figure 1 processor 120 in the ) and the communication processor 250 (e.g., Figure 1 Auxiliary processor 123 in.

[0054] According to various embodiments, the application processor 240 may perform various types of data processing or calculation to control at least one other component (for example, the communication processor 250 ) included in the electronic device 200 .

[0055] According to an embodiment, the electronic device 200 may further include an intermediate frequency integrated circuit (IFIC) 260, separate from the communication processor 250, for signal processing. For example, the communication processor 250 may generate a baseband signal for direct communication or wireless communication and may transmit it to the IFIC 260. According to an embodiment, the communication processor 250 and the IFIC 260 may be implemented in a single chip or a single package.

[0056] According to an embodiment, the IFIC 260 may up-convert a baseband signal transmitted from the communication processor 250 into an IF signal and transmit the IF signal to the wireless communication circuit 230. For example, the IFIC 260 may down-convert an IF signal transmitted from the communication circuit 230 into a baseband signal and transmit it to the communication processor 250. The communication processor 250 may process the baseband signal transmitted from the IFIC 260.

[0057] According to various embodiments, the wireless communication circuit 230 may up-convert a baseband signal obtained from the communication processor 250 into an RF signal in a specified frequency band. The wireless communication circuit 230 may down-convert an RF signal received through the first antenna structure 210 and / or the second antenna structure 220 into a baseband signal and transmit it to the communication processor 250.

[0058] According to various embodiments, if the electronic device 200 includes the IFIC 260, the wireless communication circuit 230 may up-convert an IF signal received from the IFIC 260 into an RF signal in a specified frequency band. The wireless communication circuit 230 may down-convert an RF signal received through the first antenna structure 210 and / or the second antenna structure 220 into an IF signal and transmit it to the IFIC 260.

[0059] According to various embodiments, two antenna structures (first antenna structure 210 and second antenna structure 220 ) are shown connected to wireless communication circuit 230 , but the number of antenna structures is not limited to two and multiple antenna structures may be connected to wireless communication circuit 230 .

[0060] According to various embodiments, a pair of two different antenna structures (first antenna structure 210 and second antenna structure 220) are shown as being connected to the wireless communication circuit 230, but the number of antenna structures connected to the wireless communication circuit 230 is not limited thereto, and multiple antenna structures may be connected to the wireless communication circuit.

[0061] According to an embodiment, the communication processor 250 may support wireless communication for a first communication system or a second communication system. According to an embodiment, the first communication system may include a communication system to be used in a long-distance communication network defined by 3GPP (e.g., Figure 1The second communication system may include a 5G communication network (e.g., New Radio (NR)) implemented in a millimeter wave (mmWave) frequency band (e.g., approximately 20 GHz to approximately 60 GHz) (hereinafter referred to as a first frequency band) among frequency bands for wireless communication over a long-distance communication network (e.g., a second network 199 in the network). According to an embodiment, the second communication system may include a 6G communication network implemented in a terahertz (THz) high frequency band (e.g., approximately 100 GHz to approximately 10 THz) (hereinafter referred to as a second frequency band) among frequency bands to be used for wireless communication over a long-distance communication network.

[0062] According to various embodiments, during transmission, the IFIC 260 may convert a baseband signal generated by the communication processor 250 into a specified frequency band (e.g., a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz) (hereinafter, referred to as an intermediate frequency signal or IF signal), and may transmit it to the wireless communication circuit 230. According to various embodiments, during reception, the IFIC 260 may convert an RF signal (IF signal) in a specified frequency band pre-processed by the wireless communication circuit 230 into a baseband signal so that it can be processed by the communication processor 250. An example has been described above in which the IFIC 260 and the communication processor 250 are implemented as separate components, but embodiments are not limited thereto, and for example, the IFIC 260 may be implemented integrally with the communication processor 250.

[0063] According to various embodiments, the communication processor 250 may be connected to the processor 240 to transmit and / or receive control information and packet data information. For example, the communication processor 250 and the processor 240 may transmit and / or receive data via an HS-UART interface or a PCIe interface, but the type of interface is not limited. For example, the communication processor 250 and the processor 240 may use a shared memory to exchange control information and packet data information.

[0064] According to an embodiment, application processor 240, communication processor 250, and IFIC 260 may be formed in a single chip or a single package. For example, application processor 240, communication processor 250, and IFIC 260 may be provided on second printed circuit board 202 (e.g., a main PCB). For example, second printed circuit board 202 may be formed as a rigid-flexible printed circuit board.

[0065] According to an embodiment, the electronic device 200 may further include a power management integrated circuit (PMIC) 232 for supplying power to various components (eg, the wireless communication circuit 230 ).

[0066] According to an embodiment, during transmission, the wireless communication circuit 230 may convert a baseband signal generated by the communication processor 250 or an IF signal generated by the IFIC 260 into a first frequency band signal used in the first communication system and / or a second frequency band signal used in the second communication system.

[0067] According to an embodiment, during transmission, the wireless communication circuit 230 may convert a baseband signal generated by the communication processor 250 or an IF signal generated by the IFIC 260 into a first frequency band signal used in the first communication system, and may convert the first frequency band signal into a second frequency band signal used in the second communication system.

[0068] According to an embodiment, the wireless communication circuit 230 may include a first component and a second component, the first component being used to convert the baseband signal generated by the communication processor 250 or the IF signal generated by the IFIC 260 into a first frequency band signal used in the first communication system during transmission and transmit it to the first antenna structure 210 and / or the second antenna structure 220, and the second component being used to receive the first frequency band signal from the first component, convert it into a second frequency band used in the second communication system, and transmit it to the second antenna structure 220.

[0069] According to various embodiments, during reception, the wireless communication circuit 230 may convert a first frequency band signal used in the first communication system and / or a second frequency band signal used in the second communication system acquired through the first antenna structure 210 and / or the second antenna structure 220 into a baseband signal or an IF band signal, so that the baseband signal or the IF band signal may be processed by the IFIC 260 or the communication processor 250.

[0070] According to an embodiment, during reception, the wireless communication circuit 230 may convert an RF signal in the first frequency band used in the first communication system acquired through the first antenna structure 210 into a baseband signal or an IF band signal so that the baseband signal or the IF band signal may be processed by the IFIC 260 or the communication processor 250.

[0071] According to an embodiment, during reception, the wireless communication circuit 230 can convert the RF signal in the second frequency band used in the second communication system obtained through the second antenna structure 220 into an RF signal in the first frequency band used in the first communication system, and then can convert the RF signal in the first frequency band into a baseband signal or an IF band signal so that the baseband signal or the IF band signal can be processed by the IFIC 260 or the communication processor 250.

[0072] According to an embodiment, the wireless communication circuit 230 may include a third component for converting an RF signal in the first frequency band used in the first communication system obtained through the first antenna structure 210 into a baseband signal or an IF band signal, so that the baseband signal or the IF band signal can be processed by the IFIC 260 or the communication processor 250 during reception.

[0073] According to an embodiment, the wireless communication circuit 230 may include a fourth component for converting an RF signal in the second frequency band used in the second communication system, acquired by the second antenna structure 220, into an RF signal in the first frequency band used in the first communication system during reception. According to an embodiment, during reception, the wireless communication circuit 230 may convert the RF signal in the first frequency band, which has been acquired by the second antenna structure 220 and converted by the fourth component, into a baseband signal or an IF band signal through the third component, so that the baseband signal or the IF band signal can be processed by the IFIC 260 or the communication processor 250.

[0074] According to an embodiment, the first antenna structure 210 may support wireless communication for a first communication system. According to an embodiment, the first antenna structure 210 may be implemented to be used in a long-range communication network defined by 3GPP (e.g., Figure 1 The wireless communication network 190 may be a wireless communication network 191 configured to transmit and / or receive RF signals in a millimeter wave (mmWave) frequency band (eg, approximately 20 GHz to approximately 60 GHz) (hereinafter, referred to as a first frequency band) in which wireless communications are performed by the wireless communication network 191 in the second network 199 .

[0075] According to an embodiment, the second antenna structure 220 may support wireless communications via a second communication system. According to an embodiment, the second antenna structure 220 may be implemented to transmit and / or receive RF signals in a high-frequency terahertz (THz) band (e.g., approximately 100 GHz to approximately 10 THz) (hereinafter, referred to as a second frequency band) in a frequency band to be used for wireless communications via a long-distance communication network.

[0076] FIG. 3 shows an arrangement of a first antenna structure 210 and a second antenna structure 220 .

[0077] According to an embodiment, the first antenna structure 210 , the second antenna structure 220 , and the wireless communication circuit 230 may be provided on the first printed circuit board 201 .

[0078] According to an embodiment, the first antenna structure 210 may include a plurality of first antenna elements 212 arranged to form a directional beam as an array antenna.

[0079] According to an embodiment, multiple first antenna elements 212 may be disposed in the first region 211 of the first printed circuit board 201. According to an embodiment, the multiple first antenna elements 212 may be disposed within the first printed circuit board 201 adjacent to the first region 211. According to an embodiment, the multiple first antenna elements 212 may be arranged at predetermined intervals. As an example, the multiple first antenna elements 212 may have substantially the same configuration (e.g., size, shape, thickness, and / or material). As an example, the first antenna structure 210 may include four first antenna elements 212 as shown, but the number of first antenna elements 212 included in the first antenna structure 210 is not limited thereto, and the first antenna structure 210 may include multiple first antenna elements 212.

[0080] According to various embodiments, the second antenna structure 220 may include a plurality of second antenna elements 222 configured to form a directional beam, serving as an array antenna. Depending on the embodiment, the plurality of second antenna elements 222 may be disposed in one of the second regions 221 of the first printed circuit board 201, within the second printed circuit board 201, or adjacent to the second region 221. Depending on the embodiment, the plurality of second antenna elements 222 may be arranged at predetermined intervals. As an example, the plurality of second antenna elements 222 may have substantially the same configuration (e.g., size, shape, thickness, and / or material). As an example, the second antenna structure 220 may include, for example, 32 second antenna elements 222 as shown in the figure. However, the number of second antenna elements 222 included in the second antenna structure 220 is not limited to this, and the second antenna structure 220 may include a plurality of second antenna elements 222.

[0081] According to an embodiment, the first printed circuit board 201 may be formed to include a flexible printed circuit board (FPCB), a rigid flexible printed circuit board, or a flexible printed circuit board and a rigid flexible printed circuit board.

[0082] According to an embodiment, the first and second printed circuit boards 201 and 202 may be electrically connected by an electrical connection member 203. For example, the electrical connection member 203 may include a radio frequency (RF) coaxial cable or a flexible printed circuit board (FPCB) type RF cable (FRC).

[0083] According to the embodiment, Figure 3a and Figure 3b As shown, the positions and / or directions in which the first antenna structure 210 and the second antenna structure 220 are disposed on the first printed circuit board 201 may be variously modified based on the positions and / or directions in which the antenna structures are to be disposed in the electronic device 200 .

[0084] According to an embodiment, the first antenna structure 210 and the second antenna structure 220 may be arranged side by side along the long axis direction or the short axis direction. Figure 3a and Figure 3b shown.

[0085] Figure 4 A portion of a first printed circuit board 201 is shown having a first antenna structure 210, a second antenna structure 220, and wireless communication circuitry 230 disposed thereon.

[0086] According to an embodiment, on first surface 401 (eg, top surface) of first printed circuit board 201 , first antenna structure 210 and second antenna structure 220 may be disposed side by side in first region 211 and second region 221 , respectively.

[0087] According to various embodiments, the wireless communication circuit 230 may be provided on the second surface 402 (e.g., bottom surface) of the first printed circuit board 201 so as to face the first antenna structure 210 and / or the second antenna structure 220. For example, the wireless communication circuit 230 may be provided in a region 231 of the second surface 402 (e.g., bottom surface) of the first printed circuit board 201 and electrically connected to the first antenna structure 210 and the second antenna structure 220. For example, the PMIC 232 may be provided in a region 231 of the second surface 402 (e.g., bottom surface) of the first printed circuit board 201. The PMIC 232 may receive power supplied from the second printed circuit board 202 (e.g., main PCB) and supply power to the wireless communication circuit 230.

[0088] According to various embodiments, electrical connection members 203 for electrically connecting components disposed on the first printed circuit board 201 to the second printed circuit board 202 may be disposed on the second surface 402 (eg, bottom surface) of the first printed circuit board 201 .

[0089] Figure 5 An example is shown in which antenna structures (eg, first antenna structure 210 and second antenna structure 220 ) are provided on electronic device 200 .

[0090] According to an embodiment, the first printed circuit board 201 on which the first antenna structure 210 and the second antenna structure 220 are disposed may include a bendable material, for example, a flexible printed circuit board (FPCB).

[0091] According to the embodiment, Figure 3a 、 Figure 3b or Figure 4 As shown, the first antenna structure 210 and the second antenna structure 220 may be disposed on the same surface of the first printed circuit board 201, for example, on the first surface 401 (top surface) thereof. Figure 5As shown, the first printed circuit board 201 on which the first antenna structure 210 and the second antenna structure 220 are arranged can be bent so that the first antenna structure 210 and the second antenna structure 220 are arranged toward different surfaces of the electronic device 200, and the first antenna structure 210 and the second antenna structure 220 can therefore face different directions.

[0092] According to an embodiment, the first antenna structure 210 can be set to a first surface 501 (e.g., a rear surface) of a shell facing the electronic device 200, and the second antenna structure 220 can be set to a second surface 502 (e.g., a side surface) of the shell facing the electronic device 200, so that the first antenna structure 210 forms a beam pattern, for example, in the x-axis direction, and the second antenna structure 220 forms a beam pattern, for example, in the y-axis direction.

[0093] According to an embodiment, the first antenna structure 210 can be set to a third surface 503 (e.g., a side surface) of the shell of the electronic device 200, and the second antenna structure 220 can be set to a first surface 501 (e.g., a rear surface) of the shell of the electronic device 200, so that the first antenna structure 210 forms a beam pattern, for example, in the -y-axis direction, and the second antenna structure 220 forms a beam pattern, for example, in the x-axis direction.

[0094] Figure 6a In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0095] Reference Figure 6a , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0096] According to an embodiment, wireless communication circuit 230 may include a first circuit 630 as a common circuit for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of first antenna structure 210 and / or the plurality of second antenna elements 222 of second antenna structure 220 .

[0097] According to an embodiment, in addition to the first circuit 630 described above, the wireless communication circuit 230 may further include a second circuit 650, as a circuit dedicated to the second antenna structure 220, for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 650 may process RF signals in the first frequency band processed by the first circuit 630 into RF signals in the second frequency band, so that these signals can be transmitted via the plurality of second antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 650 may process RF signals in the second frequency band received via the plurality of second antenna elements 222 of the second antenna structure 220, so that these signals are converted into RF signals in the first frequency band and then processed by the first circuit 630.

[0098] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., a first RF chain 610-1, ..., an n1th RF chain 610-n1) for processing RF signals transmitted and / or received via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., a second RF chain 620-1, ..., an n2th RF chain 620-n2) for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to / greater than 2) antenna ports 611-1, ..., 611-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to / greater than 2) antenna ports 621-1, ..., 621-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 610-1, ..., and the n1th RF chain 610-n1 of the first chain array 610 can be substantially identical to each other. As an example, the first RF chains 620-1, ..., and the n2th RF chain 620-n2 of the second chain array 620 can be substantially identical to each other. The following details the configurations of the first RF chain 610-1 of the first RF chain array 610 and the first RF chain 620-1 of the second RF chain array 620 (hereinafter referred to as the second RF chain 620-1), while omitting the description of the configurations of the second RF chain 610-2, ..., and the n1th RF chain 610-n1 of the first RF chain array 610 and the second RF chain 620-2, ..., and the n2th RF chain 620-n2 of the second RF chain array 620.

[0099] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 637 and a combiner circuit 647. Although the frequency divider circuit 637 and the combiner circuit 639 are shown separately, the frequency divider circuit 637 and the combiner circuit 639 may be integrated into a single entity.

[0100] According to an embodiment, the wireless communication circuit 230 may include a transmit path 639 configured to transmit data from an IFIC (eg, Figure 2 The transmission signal (eg, IF signal) received by the IFIC 260 in the RF communication module is processed and transmitted to the first RF chain array 610 and / or the second RF chain array 620 .

[0101] According to an embodiment, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) received from the IFIC 260 and transmit it to the first RF chain array 610 and / or the second RF chain array 620 via the transmit path 639 via the divider circuit 637 .

[0102] According to an embodiment, during transmission, the frequency divider circuit 637 may divide the RF signal received from the transmit path 639 into a plurality of RF signals (e.g., n1, n2, or n1+n2 RF signals) and may provide the signals to the first RF chain array 610 and / or the second RF chain array 620. For example, the frequency divider circuit 637 may provide the divided RF signals to the first RF chain 610-1, ..., and / or the n1th RF chain 610-n1 of the first RF chain array 610, and / or the first RF chain 620-1, ..., and / or the n2th RF chain 620-n2 of the second RF chain array 620.

[0103] According to various embodiments, during reception, the combiner circuit 647 may combine a plurality of RF signals received from the first RF chain array 610 and / or the second RF chain array 620 into a single RF signal and may provide it to the receive path 649. For example, the combiner circuit 647 may combine a plurality of RF signals received from the first RF chain 610-1, ... and / or the n1th RF chain 610-n1 of the first RF chain array 610, and / or the first RF chain 620-1, ... and / or the n2th RF chain 620-n2 of the second RF chain array 620 into a single RF signal and may provide it to the receive path 649.

[0104] According to various embodiments, the first RF chain 610-1 may include phase shifters 615-1 and 616-1, a power amplifier (PA) 613-1, and / or a low noise amplifier (LNA) 614-1. According to an embodiment, the phase shifter 615-1 may adjust the phase of the RF signal transmitted from the frequency divider circuit 637 and input to the power amplifier 613-1, and may output the RF signal. For example, the phase value adjusted by the phase shifter 615-1 may be a phase value of a signal transmitted through the plurality of first antenna elements 212 of the first antenna structure 210, and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0105] According to an embodiment, the phase shifter 616-1 may adjust the phase of the RF signal transmitted from the LNA 614-1 and may output the RF signal. For example, the phase value adjusted by the phase shifter 616-1 may be a phase value that changes the phase of the signal received by the plurality of arrays of the first antenna structure 220 and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0106] According to various embodiments, the PA 613-1 may amplify the power of the RF signal received from the phase shifter 615-1. According to an embodiment, the PA 613-1 may amplify the power of the RF signal received from the phase shifter 615-1 and may output it to one of the plurality of antenna elements 212 of the first antenna structure 210 connected to the first antenna port 611-1 through the first switch 612-1.

[0107] According to various embodiments, the LNA 614-1 may low-noise amplify the RF signal received through the first switch 612-1 and may output the RF signal. According to an embodiment, the LNA 614-1 may low-noise amplify the RF signal received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 611-1 through the first switch 612-1 and may output the RF signal to the phase shifter 616-1.

[0108] According to various embodiments, the first switch 612-1 may selectively connect the first antenna port 611-1 to the PA 613-1 or the LNA 614-1. According to an embodiment, during signal transmission, the first switch 612-1 may be based on a processor (eg, Figure 2 The first antenna port 611-1 and the PA 613-1 are connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the first switch 612-1 may be based on the control of the processor (eg, Figure 2 The first antenna port 611 - 1 and the LNA 614 - 1 are connected under the control of the communication processor 250 or the application processor 240 .

[0109] According to various embodiments, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) input through the IFIC 260 and may output it to the first RF chain array 610 and / or the second RF chain array 620 through a transmit path 639 .

[0110] According to an embodiment, during transmission, the wireless communication circuit 230 may transmit an input from the IFIC 260 to the transmission path 639 through the third switch 631. The transmission mixer 635 may up-convert the IF signal amplified by the PA 633 into a first RF signal based on the local oscillation frequency provided by the second local oscillator 634. The RF signal in the first frequency band up-converted in the transmission mixer 635 may be transmitted to the first RF chain array 610 and / or the second RF chain array 620 through the frequency divider circuit 637. For example, the first frequency band may be a frequency band to be used for a long-distance communication network defined by 3GPP (e.g., Figure 1 A millimeter wave (mmWave) frequency band (eg, approximately 20 GHz to approximately 60 GHz) in a frequency band for wireless communication by the second network 199 in the 5G network is used in the first communication system of 5G.

[0111] According to various embodiments, the wireless communication circuit 230 may downconvert RF signals in the first frequency band received from the first RF chain array 610 and / or the second RF chain array 620, and may output them to the IFIC 260 via the receive path 649. According to an embodiment, during signal reception, the wireless communication circuit 230 may connect an output port to the IFIC 260 and the receive path 649 via the third switch 631. The receive mixer 645 may downconvert RF signals input from the first RF chain array 610 and / or the second RF chain array 620 via the combiner circuit 647 based on a local oscillation frequency provided by the second local oscillator 634. The signal (e.g., IF signal) downconverted by the receive mixer 645 may be low-noise amplified by the LNA 643 and transmitted to the IFIC 260 via the third switch 631.

[0112] According to various embodiments, the second RF chain 620 - 1 may include a power amplifier (PA) 623 - 1 and / or a low noise amplifier (LNA) 624 - 1 .

[0113] According to an embodiment, the second RF chain 620-1 may further include a second transmit mixer 655-1 and a second receive mixer 656-1. According to an embodiment, the second transmit mixer 655-1 may up-convert the RF signal in the first frequency band up-converted by the transmit mixer 635 into an RF signal in the second frequency band.

[0114] According to an embodiment, the PA 623-1 of the second RF chain 620-1 may amplify the power of the RF signal in the second frequency band received from the second transmit mixer 655-1. For example, the second frequency band may be a terahertz (THz) high frequency band (e.g., approximately 100 GHz to approximately 10 THz) (hereinafter, referred to as the second frequency band) among frequency bands to be used for wireless communication over a long-distance communication network used in the second communication system of 6G.

[0115] According to an embodiment, the second transmit mixer 655-1 can up-convert the RF signal in the first frequency band transmitted from the frequency divider circuit 637 into an RF signal in the second frequency band based on the local oscillation frequency provided from the first local oscillator 651, divided by the second frequency divider 652, and phase-adjusted by the second phase shifter 653-1. The RF signal in the second frequency band up-converted by the second transmit mixer 655-1 can be power-amplified by the PA 623-1, transmitted to the second antenna port 621-1 through the second switch 622-1, and output to one of the plurality of antenna elements 222 of the second antenna structure 220.

[0116] According to an embodiment, the LNA 624-1 can receive an RF signal in the second frequency band that has been received by one of the multiple antenna elements 222 of the second antenna structure 220 from the second antenna port 621-1 through the second switch 622-1, can low-noise amplify the RF signal, and can output the RF signal to the second reception mixer 656-1.

[0117] According to an embodiment, the second switch 622-1 may selectively connect the second antenna port 621-1 to the PA 623-1 or the LNA 624-1. According to an embodiment, during signal transmission, the second switch 622-1 may be based on a processor (eg, Figure 2 The second antenna port 621-1 and the PA 623-1 are connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the second switch 622-1 may be based on the control of the processor (eg, Figure 2 The second antenna port 621-1 and the LNA 624-1 are connected under the control of the communication processor 250 or the application processor 240 in the embodiment of the present invention.

[0118] According to an embodiment, the second receive mixer 656-1 may down-convert the received RF signal in the second frequency band into an RF signal in the first frequency band based on the local oscillation frequency provided from the first local oscillator 651, divided by the second frequency divider 652, and phase-adjusted by the second phase shifter 653-1. The RF signal in the first frequency band down-converted by the second receive mixer 656-1 may be transmitted to the combiner circuit 647, down-converted into an IF signal by the receive mixer 645 of the receive path 649, and transmitted to the IFIC 260.

[0119] According to various embodiments, in order to down-convert an RF signal in the second frequency band (THz high frequency band) of the second communication system received through the second antenna structure 220 into an IF signal, a two-step down-conversion process may be performed, for example, down-converting the RF signal into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the second reception mixer 655-1, and then down-converting the RF signal into an IF signal through the reception mixer 645 shared with the first antenna structure 210.

[0120] According to various embodiments, in order to generate an RF signal in the second frequency band (THz high band) of the second communication system transmitted through the second antenna structure 220, a two-step up-conversion process may be performed, for example, the IF signal is up-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the transmit mixer 635 shared with the first antenna structure 210, and then up-converted into an RF signal in the second frequency band (THz high band) of the second communication system through the second transmit mixer 655-1.

[0121] Figure 6a In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 IFIC 260). Figure 6a The structure described in IFIC 260 can be used not only in connection to Figure 6a The wireless communication circuit 230 in the embodiment of the present invention is operated simultaneously, and can be connected to the wireless communication circuit 230 for reference later. Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 The simultaneous operation of the wireless communication circuit 230 is described.

[0122] refer to Figure 6b , IFIC 260 may be connected to communication processor 250 (e.g., Figure 2The communication processor 250 in the communication circuit 250) converts the received digital I / Q baseband signal into an analog I / Q baseband signal through a digital-to-analog converter (DAC) 661, and can be applied to the third transmission mixer 665 via a low-pass filter (LPF) 663. The analog I / Q baseband signal applied to the third transmission mixer 665 can be multiplied by the I / Q local oscillation frequency signal applied from the third local oscillator 681 and thus up-converted into an IF band signal, and can be applied to the amplifier (e.g., a driving amplifier) 667. The signal applied to the amplifier 667 can be amplified and transmitted to the wireless communication circuit 230 via the switch 683. Figure 6b IFIC 260 can amplify the intermediate frequency band signal received from wireless communication circuit 230 via amplifier 677 via switch 683. The amplified signal can be applied to third receive mixer 675, multiplied by the I / Q local oscillation frequency signal applied from third local oscillator 681, and thus down-converted into an analog I / Q baseband signal. The analog I / Q baseband signal can be applied to analog-to-digital converter (ADC) 671 via LPF 673, converted into a digital I / Q baseband signal in ADC 671, and then transmitted to communication processor 250.

[0123] Figure 7 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0124] Reference Figure 7 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0125] According to an embodiment, wireless communication circuit 230 may include a first circuit 730 as a common circuit for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210 and / or the plurality of first antenna elements 222 of the second antenna structure 220 .

[0126] According to an embodiment, in addition to the first circuit 730 described above, the wireless communication circuit 230 may further include a second circuit 750, as a circuit dedicated to the second antenna structure 220, for processing RF signals transmitted and / or received via the plurality of first antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 750 may process RF signals in the first frequency band processed by the first circuit 730 into RF signals in the second frequency band, so that these signals can be transmitted via the plurality of first antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 750 may process RF signals in the second frequency band received via the plurality of second antenna elements 222 of the second antenna structure 220, so that these signals are converted into RF signals in the first frequency band and then processed by the first circuit 730.

[0127] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., a first RF chain 710-1, ..., an n1th RF chain 710-n1) for processing RF signals transmitted and / or received via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., a second RF chain 720-1, ..., an n2th RF chain 720-n2) for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to / greater than 2) antenna ports 711-1, ..., 711-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to / greater than 2) antenna ports 721-1, ..., 721-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 710-1, ..., and the n1th RF chain 710-n1 of the first chain array 710 can be substantially identical to each other. As an example, the first RF chains 720-1, ..., and the n2th RF chain 720-n2 of the second chain array can be substantially identical to each other. The following details the configurations of the first RF chain 710-1 of the first RF chain array 710 and the first RF chain 720-1 of the second RF chain array 720 (hereinafter referred to as the second RF chain 720-1), while omitting the description of the configurations of the second RF chain 710-2, ..., and the n1th RF chain 710-n1 of the first RF chain array 710 and the second RF chain 720-2, ..., and the n2th RF chain 720-n2 of the second RF chain array 720.

[0128] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 737 and a combiner circuit 747. Although the frequency divider circuit 737 and the combiner circuit 747 are shown separately, the frequency divider circuit 737 and the combiner circuit 747 may be integrated into a single entity.

[0129] According to an embodiment, the wireless communication circuit 230 may include a transmit path 739 configured to transmit data from an IFIC (eg, Figure 2 A transmission signal (eg, an IF signal) received by the IFIC 260 in the first RF chain array 710 is processed and transmitted to the first RF chain array 710 and / or the second RF chain array 720 .

[0130] According to an embodiment, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) received from the IFIC 260 and transmit it to the first RF chain array 710 and / or the second RF chain array 720 via the transmit path 739 via the divider circuit 737 .

[0131] According to an embodiment, during transmission, the frequency divider circuit 737 may divide the RF signal received from the transmit path 739 into a plurality of RF signals (e.g., n1, n2, or n1+n2 RF signals) and may provide the signals to the first RF chain array 710 and / or the second RF chain array 720. For example, the frequency divider circuit 737 may provide the divided RF signals to the first RF chain 710-1, ..., and / or the n1th RF chain 710-n1 of the first RF chain array 710, and / or the first RF chain 720-1, ..., and / or the n2th RF chain 720-n2 of the second RF chain array 720.

[0132] According to various embodiments, during reception, the combiner circuit 747 may combine a plurality of RF signals received from the first RF chain array 710 and / or the second RF chain array 720 into a single RF signal and may provide it to the receive path 749. For example, the combiner circuit 747 may combine a plurality of RF signals received from the first RF chain 710-1, ... and / or the n1th RF chain 710-n1 of the first RF chain array 710, and / or the first RF chain 720-1, ... and / or the n2th RF chain 720-n2 of the second RF chain array 720 into a single RF signal and may provide it to the receive path 749.

[0133] According to various embodiments, the first RF chain 710-1 may include phase shifters 715-1 and 716-1, a power amplifier (PA) 713-1, and / or a low noise amplifier (LNA) 714-1. According to an embodiment, the phase shifter 715-1 may adjust the phase of the RF signal transmitted from the frequency divider circuit 737 and input to the power amplifier 713-1, and may output the RF signal. For example, the phase value adjusted by the phase shifter 715-1 may be a phase value of a signal transmitted through the plurality of first antenna elements 212 of the first antenna structure 210, and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0134] According to an embodiment, the phase shifter 716-1 may adjust the phase of the RF signal transmitted from the LNA 714-1 and may output the RF signal. For example, the phase value adjusted by the phase shifter 716-1 may be a phase value that changes the phase of the RF signal received by the plurality of antenna elements of the first antenna structure 210 and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0135] According to various embodiments, the PA 713-1 may amplify the power of the RF signal received from the phase shifter 715-1. According to an embodiment, the PA 713-1 may amplify the power of the RF signal received from the phase shifter 715-1 and may output it to one of the plurality of antenna elements 212 of the first antenna structure 210 connected to the first antenna port 711-1 through the first switch 712-1.

[0136] According to various embodiments, the LNA 714-1 may perform low-noise amplification on the RF signal received through the first switch 712-1 and may output the RF signal. According to an embodiment, the LNA 714-1 may perform low-noise amplification on the RF signal received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 711-1 through the first switch 712-1 and may output the RF signal to the phase shifter 716-1.

[0137] According to various embodiments, the first switch 712-1 may selectively connect the first antenna port 711-1 to the PA 713-1 or the LNA 714-1. According to an embodiment, during signal transmission, the first switch 712-1 may be based on a processor (eg, Figure 2 The first antenna port 711-1 and the PA 713-1 are connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the first switch 712-1 may be based on the control of the processor (eg, Figure 2 The first antenna port 711 - 1 and the LNA 714 - 1 are connected under the control of the communication processor 250 or the application processor 240 .

[0138] According to various embodiments, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) input through the IFIC 260 and may output it to the first RF chain array 710 and / or the second RF chain array 720 through a transmit path 739 .

[0139] According to an embodiment, during transmission, the wireless communication circuit 230 may connect the input from the IFIC 260 to the transmission path 739 through the third switch 731. The transmission mixer 735 may up-convert the IF signal amplified by the PA 733 into a first RF signal based on the local oscillation frequency provided by the second local oscillator 734. The RF signal in the first frequency band up-converted in the transmission mixer 735 may be transmitted to the first RF chain array 710 and / or the second RF chain array 720 through the frequency divider circuit 737. For example, the first frequency band may be a frequency band to be used for a long-distance communication network defined by 3GPP (e.g., Figure 1 A millimeter wave (mmWave) frequency band (eg, approximately 20 GHz to approximately 60 GHz) in a frequency band for wireless communication by the second network 199 in the 5G network is used in the first communication system of 5G.

[0140] According to various embodiments, the wireless communication circuit 230 may downconvert RF signals in the first frequency band received from the first RF chain array 710 and / or the second RF chain array 720, and may output them to the IFIC 260 via the receive path 749. According to an embodiment, during signal reception, the wireless communication circuit 230 may connect an output port to the IFIC 260 and the receive path 749 via the third switch 731. The receive mixer 745 may downconvert RF signals input from the first RF chain array 710 and / or the second RF chain array 720 via the combiner circuit 747 based on a local oscillation frequency provided by the second local oscillator 734. The signal (e.g., IF signal) downconverted by the receive mixer 745 may be low-noise amplified by the LNA 743 and transmitted to the IFIC 260 via the third switch 731.

[0141] According to various embodiments, the second RF chain 720 - 1 may include a power amplifier (PA) 723 - 1 , a low noise amplifier (LNA) 724 - 1 , and phase shifters 753 - 1 and 754 - 1 .

[0142] According to an embodiment, the second RF chain 720-1 may further include a second transmit mixer 755-1 and a second receive mixer 756-1. According to an embodiment, the second transmit mixer 755-1 may up-convert the RF signal in the first frequency band up-converted by the transmit mixer 735 into an RF signal in the second frequency band.

[0143] According to an embodiment, the phase shifter 753-1 can adjust the phase of the RF signal transmitted from the second transmit mixer 755-1 and input to the PA 723-1, and can output the RF signal. For example, the phase value adjusted by the phase shifter 753-1 can be the phase value of the signal transmitted through the plurality of second antenna elements 222 of the second antenna structure 220, and can be determined by the control signal. As an example, it can be from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0144] According to an embodiment, the phase shifter 754-1 may adjust the phase of the RF signal transmitted from the LNA 724-1 and may output the RF signal. For example, the phase value adjusted by the phase shifter 754-1 may be a phase value that changes the phase of the signal received by the plurality of second antenna elements 222 of the second antenna structure 220 and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0145] According to an embodiment, the PA 723-1 of the second RF chain 720-1 may amplify the power of the RF signal in the second frequency band received from the second transmit mixer 755-1. For example, the second frequency band may be a terahertz (THz) high frequency band (e.g., approximately 100 GHz to approximately 10 THz) (hereinafter, referred to as the second frequency band) among frequency bands to be used for wireless communication over a long-distance communication network used in the second communication system of 6G.

[0146] According to an embodiment, the second transmit mixer 755-1 can up-convert the RF signal in the first frequency band transmitted from the frequency divider circuit 737 into an RF signal in the second frequency band based on the local oscillation frequency provided from the first local oscillator 751 and divided by the first frequency divider 752. The RF signal in the second frequency band up-converted by the second transmit mixer 755-1 can be phase-adjusted by the phase shifter 753-1, power-amplified by the PA 723-1, transmitted to the second antenna port 721-1 through the second switch 722-1, and output to one of the plurality of second antenna elements 222 of the second antenna structure 220.

[0147] According to an embodiment, the LNA 724-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 721-1 through the second switch 722-1, may perform low-noise amplification on it, and may output it to the second phase shifter 754-1.

[0148] According to an embodiment, the second switch 722-1 may selectively connect the second antenna port 721-1 to the PA 723-1 or the LNA 724-1. According to an embodiment, during signal transmission, the second switch 722-1 may be based on a processor (eg, Figure 2 The second antenna port 721-1 and the PA 723-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in the system. According to an embodiment, during signal reception, the second switch 722-1 may be based on the control of the processor (eg, Figure 2 The second antenna port 721-1 and the LNA 724-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in FIG.

[0149] According to an embodiment, the phase shifter 754 - 1 may adjust the phase of the RF signal in the second frequency band that has been low-noise amplified, and may output it to the second reception mixer 756 - 1 .

[0150] According to an embodiment, the second receive mixer 756-1 may down-convert the received RF signal in the second frequency band into an RF signal in the first frequency band based on the local oscillation frequency provided from the first local oscillator 751 and divided by the second frequency divider 752. The RF signal in the first frequency band down-converted by the second receive mixer 756-1 may be transmitted to the combiner circuit 747, down-converted into an IF signal by the receive mixer 745 of the receive path 749, and transmitted to the IFIC 260.

[0151] According to various embodiments, in order to down-convert an RF signal in the second frequency band (THz high frequency band) of the second communication system received through the second antenna structure 220 into an IF signal, a two-step down-conversion process may be performed, for example, down-converting the RF signal into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the second reception mixer 756-1, and then down-converting the RF signal into an IF signal through the reception mixer 745 shared with the first antenna structure 210.

[0152] According to various embodiments, in order to generate an RF signal in the second frequency band (THz high band) of the second communication system transmitted through the second antenna structure 220, a two-step up-conversion process may be performed, for example, the IF signal is up-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the transmit mixer 735 shared with the first antenna structure 210, and then up-converted into an RF signal in the second frequency band (THz high band) of the second communication system through the second transmit mixer 755-1.

[0153] Figure 8 In an example electronic device (eg, Figure 2The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0154] Reference Figure 8 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0155] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., a first RF chain 810-1, ..., an n1th RF chain 810-n1) for processing RF signals transmitted and / or received via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., a first RF chain 820-1, ..., an n2th RF chain 820-n2) for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to / greater than 2) antenna ports 811-1, ..., 811-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to / greater than 2) antenna ports 821-1, ..., 821-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 810-1, ..., and the n1th RF chain 810-n1 of the first chain array 810 may be substantially identical to each other. As an example, the first RF chains 820-1, ..., and the n2th RF chain 820-n2 of the second chain array may be substantially identical to each other. Hereinafter, the configurations of the first RF chain 810-1 of the first RF chain array 810 and the first RF chain 820-1 of the second RF chain array 820 (hereinafter referred to as the second RF chain 820-1) will be described in detail, and descriptions of the configurations of the second RF chains 810-2, ..., and the n1th RF chain 810-n1 of the first RF chain array 810 and the second RF chains 820-2, ..., and the n2th RF chain 820-n2 of the second RF chain array 820 will be omitted.

[0156] According to an embodiment, wireless communication circuit 230 may include a first circuit 830 as a common circuit for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of first antenna structure 210 and / or the plurality of first antenna elements 222 of second antenna structure 220 .

[0157] According to an embodiment, in addition to the first circuit 830 described above, the wireless communication circuit 230 may further include a second circuit 850, as a circuit dedicated to the second antenna structure 220, for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 850 may process the intermediate frequency signal divided by the first circuit 830 into an RF signal in a second frequency band, so that the RF signal can be transmitted via the plurality of second antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 850 may process the RF signal in the second frequency band received via the plurality of second antenna elements 222 of the second antenna structure 220, so that the RF signal is converted into a signal in the intermediate frequency band and transmitted to the IFIC 260 via the first circuit 830.

[0158] According to an embodiment, in addition to the first circuit 830 described above, the wireless communication circuit 230 may further include a third circuit 860, as a circuit dedicated to the first antenna structure 210, for processing RF signals transmitted and / or received via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the third circuit 860 may process the signals in the intermediate frequency band, which have been frequency-divided by the first circuit 830, into RF signals in the first frequency band, allowing the RF signals to be transmitted via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the third circuit 860 may process the RF signals in the first frequency band received via the plurality of first antenna elements 212 of the first antenna structure 210, converting the RF signals into signals in the intermediate frequency band and transmitting them to the IFIC 260 via the first circuit 830. According to an embodiment, the first circuit 830 may include a frequency divider circuit 837 and a combiner circuit 847. Although the frequency divider circuit 837 and the combiner circuit 847 are shown separately, the frequency divider circuit 837 and the combiner circuit 847 may be integrated into a single entity.

[0159] According to an embodiment, the first circuit 830 may include a power amplifier 833 configured to power a slave IFIC (eg, Figure 2 The IFIC 260 in the RF chain array 810 amplifies the power of the transmission signal (eg, IF signal) received by the IFIC 260 and transmits it to the first RF chain array 810 and / or the second RF chain array 820.

[0160] According to an embodiment, during transmission, the frequency divider circuit 837 may divide the IF signal received from the power amplifier 833 into a plurality of IF signals (e.g., n1, n2, or n1+n2 IF signals) and may provide the signals to the first RF chain array 810 and / or the second RF chain array 820. For example, the frequency divider circuit 837 may provide the divided IF signals to the first RF chain 810-1, ..., and / or the n1th RF chain 810-n1 of the first RF chain array 810, and / or the first RF chain 820-1, ..., and / or the n2th RF chain 820-n2 of the second RF chain array 820.

[0161] According to various embodiments, during reception, the combiner circuit 847 may combine a plurality of IF signals received from the first RF chain array 810 and / or the second RF chain array 820 into a single IF signal and may provide the signal to the low noise amplifier 843. For example, the combiner circuit 847 may combine a plurality of IF signals received from the first RF chain 810-1, ... and / or the n1th RF chain 810-n1 of the first RF chain array 810, and / or the first RF chain 820-1, ... and / or the n2th RF chain 820-n2 of the second RF chain array 820 into a single IF signal and may provide the signal to the low noise amplifier 843.

[0162] According to various embodiments, the first RF chain 810 - 1 may include a power amplifier (PA) 813 - 1 , a low noise amplifier (LNA) 814 - 1 , a first transmit mixer 865 - 1 , and / or a first receive mixer 866 - 1 .

[0163] According to various embodiments, the PA 813-1 may amplify the power of the RF signal received from the first transmit mixer 865-1. According to an embodiment, the PA 813-1 may amplify the power of the RF signal received from the first transmit mixer 865-1 and may output it to one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 811-1 through the first switch 812-1.

[0164] According to various embodiments, the LNA 814-1 may low-noise amplify the RF signal received through the first switch 812-1 and may output the RF signal. According to an embodiment, the LNA 814-1 may low-noise amplify the RF signal received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 811-1 through the first switch 812-1 and may output the RF signal to the first receive mixer 866-1.

[0165] According to various embodiments, the first switch 812 - 1 may selectively connect the first antenna port 811 - 1 to the PA 813 - 1 or the LNA 814 - 1 .

[0166] According to an embodiment, during transmission, the wireless communication circuit 230 can connect the IF signal input from the IFIC 260 to the PA 833 through the third switch 831. The power-amplified IF signal can be divided by the frequency divider 837 and provided to the first transmit mixer 865-1. The first transmit mixer 865-1 can up-convert the IF signal transmitted from the frequency divider circuit 837 into an RF signal in the first frequency band based on the local oscillation frequency provided by the second local oscillator 861, the local oscillation frequency being divided by the first frequency divider 862, and the phase being adjusted by the first phase shifter 863-1.

[0167] According to various embodiments, the first circuit 830 may amplify a signal in the intermediate frequency band received from the first RF chain array 810 and / or the second RF chain array 820, and may output it to the IFIC 260 through the reception path 849. According to an embodiment, during signal reception, the first circuit 830 may connect the output port to the IFIC 260 and the reception path through the third switch 831.

[0168] According to an embodiment, the first receive mixer 866-1 may down-convert the RF signal input from the LNA 814-1 based on the local oscillation frequency provided from the second local oscillator 861, divided by the first frequency divider 862, and phase-adjusted by the phase shifter 863-1. The signal down-converted in the first receive mixer 866-1 (e.g., the IF signal) may be provided to and combined in the combiner circuit 847, may be low-noise amplified by the LNA 843, and may be transmitted to the IFIC 260 through the third switch 831.

[0169] According to various embodiments, the second RF chain 820-1 may include a power amplifier (PA) 823-1, a low noise amplifier (LNA) 824-1, a second transmit mixer 855-1, and / or a second receive mixer 856-1. According to an embodiment, the second transmit mixer 855-1 may up-convert the RF signal in the first frequency band up-converted by the transmit mixer 833 into an RF signal in the second frequency band.

[0170] According to an embodiment, the PA 823-1 of the second RF chain 820-1 may amplify the power of the RF signal in the second frequency band received from the second transmit mixer 855-1. For example, the second frequency band may be a terahertz (THz) high frequency band (e.g., approximately 100 GHz to approximately 10 THz) (hereinafter, referred to as the second frequency band) among frequency bands to be used for wireless communication over a long-distance communication network used in a second communication system of 6G.

[0171] According to an embodiment, the second transmit mixer 855-1 can up-convert the IF signal transmitted from the divider circuit 837 into an IF signal in the second frequency band based on the local oscillation frequency provided from the first local oscillator 851, divided by the second frequency divider 852, and phase-adjusted by the second phase shifter 853-1. The RF signal in the second frequency band up-converted by the second transmit mixer 855-1 can be power-amplified by the PA 823-1, transmitted to the second antenna port 821-1 through the second switch 822-1, and output to one of the plurality of second antenna elements 222 of the second antenna structure 220.

[0172] According to an embodiment, the LNA 824-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 821-1 through the second switch 822-1, may perform low-noise amplification on the RF signal, and may output the RF signal to the second reception mixer 856-1.

[0173] According to an embodiment, the second switch 822-1 may selectively connect the second antenna port 821-1 to the PA 823-1 or the LNA 824-1. According to an embodiment, during signal transmission, the second switch 822-1 may be based on a processor (eg, Figure 2 The second antenna port 821-1 and the PA 823-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the second switch 822-1 can be based on the control of the processor (eg, Figure 2 The second antenna port 821-1 and the LNA 824-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in FIG.

[0174] According to an embodiment, the second receive mixer 856-1 may down-convert the received RF signal in the second frequency band into an IF signal based on the local oscillation frequency provided from the first local oscillator 851, divided by the second frequency divider 852, and phase-adjusted by the second phase shifter 853-1. The IF signal down-converted by the second receive mixer 856-1 may be transmitted to the combiner circuit 847, low-noise amplified by the LNA 843 of the receive path, and transmitted to the IFIC 260.

[0175] Figure 9 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0176] Reference Figure 9 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0177] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., a first RF chain 910-1, ..., an n1th RF chain 910-n1) for processing RF signals transmitted and / or received via the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., a first RF chain 920-1, ..., an n2th RF chain 920-n2) for processing RF signals transmitted and / or received via the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to / greater than 2) antenna ports 911-1, ..., 911-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to / greater than 2) antenna ports 921-1, ..., 921-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 910-1, ..., and the n1th RF chain 910-n1 of the first chain array 910 can be substantially identical to each other. As an example, the first RF chains 920-1, ..., and the n2th RF chain 920-n2 of the second chain array can be substantially identical to each other. The following details the configurations of the first RF chain 910-1 of the first RF chain array 910 and the first RF chain 920-1 of the second RF chain array 920 (hereinafter referred to as the second RF chain 920-1), while omitting the description of the configurations of the second RF chain 910-2, ..., and the n1th RF chain 910-n1 of the first RF chain array 910 and the second RF chain 920-2, ..., and the n2th RF chain 920-n2 of the second RF chain array 920.

[0178] According to an embodiment, wireless communication circuit 230 may include a first circuit 930 as a common circuit for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of first antenna structure 210 and / or the plurality of first antenna elements 222 of second antenna structure 220 .

[0179] According to an embodiment, in addition to the first circuit 930 described above, the wireless communication circuit 230 may further include a second circuit 950, as a circuit dedicated to the second antenna structure 220, for processing RF signals transmitted and / or received via the plurality of first antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 950 may process the intermediate frequency signal divided by the first circuit 930 into an RF signal in a second frequency band, so that the RF signal can be transmitted via the plurality of first antenna elements 222 of the second antenna structure 220. According to an embodiment, the second circuit 950 may process the RF signal in the second frequency band received via the plurality of second antenna elements 222 of the second antenna structure 220, so that the RF signal is converted into a signal in the intermediate frequency band and transmitted to the IFIC 260 via the first circuit 930.

[0180] According to an embodiment, in addition to the first circuit 930 described above, the wireless communication circuit 230 may further include a third circuit 960, as a circuit dedicated to the first antenna structure 210, for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the third circuit 960 may process the signals in the intermediate frequency band that have been frequency-divided by the first circuit 930 into RF signals in the first frequency band, so that the RF signals can be transmitted through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the third circuit 960 may process the RF signals in the first frequency band received through the plurality of first antenna elements 212 of the first antenna structure 210, so that the RF signals are converted into signals in the intermediate frequency band and transmitted to the IFIC 260 through the first circuit 930.

[0181] According to an embodiment, the first circuit 930 may include a frequency divider circuit 937 and a combiner circuit 947. Although the frequency divider circuit 937 and the combiner circuit 947 are shown separately, the frequency divider circuit 937 and the combiner circuit 947 may be integrated into a single entity.

[0182] According to an embodiment, the first circuit 930 may include a power amplifier 933 configured to power a slave IFIC (eg, Figure 2 The IFIC 260 in the RF chain array 910 amplifies the power of the transmission signal (eg, IF signal) received by the IFIC 260 and transmits it to the first RF chain array 910 and / or the second RF chain array 920.

[0183] According to an embodiment, during transmission, the frequency divider circuit 937 may divide the IF signal received from the power amplifier 933 into a plurality of IF signals (e.g., n1, n2, or n1+n2 IF signals) and may provide the signals to the first RF chain array 910 and / or the second RF chain array 920. For example, the frequency divider circuit 937 may provide the divided IF signals to the first RF chain 910-1, ..., and / or the n1th RF chain 910-n1 of the first RF chain array 910, and / or the first RF chain 920-1, ..., and / or the n2th RF chain 920-n2 of the second RF chain array 920.

[0184] According to various embodiments, during reception, the combiner circuit 947 may combine a plurality of IF signals received from the first RF chain array 910 and / or the second RF chain array 920 into a single IF signal, and may provide the signal to the low noise amplifier 943. For example, the combiner circuit 947 may combine a plurality of IF signals received from the first RF chain 910-1, ..., and / or the n1th RF chain 910-n1 of the first RF chain array 910, and / or the first RF chain 920-1, ..., and / or the n2th RF chain 920-n2 of the second RF chain array 920 into a single IF signal, and may provide the signal to the low noise amplifier 943.

[0185] According to various embodiments, the first RF chain 910 - 1 may include a power amplifier (PA) 913 - 1 , a low noise amplifier (LNA) 914 - 1 , a phase shifter 967 - 1 , and / or a phase shifter 968 - 1 .

[0186] According to an embodiment, the first transmit mixer 965 - 1 may up-convert an IF signal received through the frequency divider circuit 937 into an RF signal in the first frequency band.

[0187] According to various embodiments, the PA 913 - 1 of the first RF chain 910 - 1 may amplify the power of the RF signal in the first frequency band received from the first transmit mixer 965 - 1 .

[0188] According to an embodiment, the phase shifter 967-1 can adjust the phase of the RF signal transmitted from the first transmit mixer 965-1 and input to the PA 913-1, and can output the RF signal. For example, the phase value adjusted by the phase shifter 967-1 can be the phase value of the signal transmitted through the plurality of first antenna elements 212 of the first antenna structure 210, and can be determined by the control signal. As an example, it can be obtained from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0189] According to an embodiment, the phase shifter 968-1 may adjust the phase of the RF signal transmitted from the LNA 914-1 and may output the RF signal. For example, the phase value adjusted by the phase shifter 968-1 may be a phase value that changes the phase of the signal received by the plurality of antenna elements of the first antenna structure 210 and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0190] According to an embodiment, the first transmit mixer 965-1 may up-convert the IF signal transmitted from the frequency divider circuit 937 into an RF signal in the first frequency band based on the local oscillation frequency provided from the second local oscillator 961 and divided by the first frequency divider 962. The RF signal in the first frequency band up-converted by the first transmit mixer 965-1 may be phase-adjusted by the phase shifter 967-1, power-amplified by the PA 913-1, transmitted to the first antenna port 911-1 through the first switch 912-1, and output to one of the plurality of first antenna elements 212 of the first antenna structure 210.

[0191] According to an embodiment, the LNA 914-1 can receive the RF signal in the second frequency band that has been received by one of the multiple first antenna elements 212 of the first antenna structure 210 from the first antenna port 911-1 through the first switch 912-1, can perform low-noise amplification on it, and can output it to the phase shifter 968-1.

[0192] According to an embodiment, the first switch 912-1 may selectively connect the first antenna port 911-1 to the PA 913-1 or the LNA 914-1. According to an embodiment, during signal transmission, the first switch 912-1 may be based on a processor (eg, Figure 2 The first antenna port 911-1 and the PA 913-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the first switch 912-1 may be based on the control of the processor (eg, Figure 2 The first antenna port 911-1 and the LNA 914-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in FIG.

[0193] According to an embodiment, the phase shifter 968 - 1 may adjust the phase of the low-noise-amplified RF signal in the first frequency band and may output it to the first reception mixer 966 - 1 .

[0194] According to an embodiment, the first reception mixer 966-1 may down-convert an RF signal in the first frequency band into an IF signal based on a local oscillation frequency provided from the second local oscillator 961 and divided by the first frequency divider 962. The IF signal down-converted by the first reception mixer 966-1 may be transmitted to the combiner circuit 947, low-noise amplified by the LNA 943 of the reception path, and transmitted to the IFIC 260 through the third switch 931.

[0195] According to various embodiments, the second RF chain 920-1 may include a power amplifier (PA) 923-1, a low noise amplifier (LNA) 924-1, a phase shifter 953-1, and a phase shifter 954-1. According to an embodiment, the second transmit mixer 955-1 may up-convert the IF signal received through the divider circuit 937 into an RF signal in the second frequency band.

[0196] According to an embodiment, the PA 923 - 1 of the second RF chain 920 - 1 may amplify the power of the RF signal in the second frequency band received from the second transmit mixer 955 - 1 .

[0197] According to an embodiment, the phase shifter 953-1 can adjust the phase of the RF signal transmitted from the second transmit mixer 955-1 and input to the PA 923-1, and can output the RF signal. For example, the phase value adjusted by the phase shifter 953-1 can be a phase value that changes the phase of the signal received by the plurality of second antenna elements 222 of the second antenna structure 220, and can be determined by the control signal. As an example, it can be obtained from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0198] According to an embodiment, the phase shifter 954-1 may adjust the phase of the RF signal received from the LNA 924-1 and may output the RF signal. For example, the phase value adjusted by the phase shifter 954-1 may be a phase value that changes the phase of the RF signal received by the plurality of second antenna elements 222 of the second antenna structure 220 and may be determined by a control signal. As an example, a control signal may be generated from another component (e.g., Figure 1 The processor 120 or Figure 2 The application processor 240 in the processor inputs a control signal.

[0199] According to an embodiment, the second transmit mixer 955-1 can up-convert the IF signal transmitted from the frequency divider circuit 937 into an RF signal in the second frequency band based on the local oscillation frequency provided from the first local oscillator 951 and divided by the second frequency divider 952. The RF signal in the second frequency band up-converted by the second transmit mixer 955-1 can be phase-adjusted by the phase shifter 953-1, power-amplified by the PA 923-1, transmitted to the second antenna port 921-1 through the second switch 922-1, and output to one of the plurality of second antenna elements 222 of the second antenna structure 220.

[0200] According to an embodiment, the LNA 924-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 921-1 through the second switch 922-1, may low-noise amplify it, and may output it to the phase shifter 954-1.

[0201] According to an embodiment, the second switch 922-1 may selectively connect the second antenna port 921-1 to the PA 923-1 or the LNA 924-1. According to an embodiment, during signal transmission, the second switch 922-1 may be based on a processor (eg, Figure 2 The second antenna port 921-1 and the PA 923-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in the embodiment. According to an embodiment, during signal reception, the second switch 922-1 can be based on the control of the processor (eg, Figure 2 The second antenna port 921-1 and the LNA 924-1 are electrically connected under the control of the communication processor 250 or the application processor 240 in FIG.

[0202] According to an embodiment, the phase shifter 954 - 1 may adjust the phase of the low-noise-amplified RF signal in the second frequency band and may output it to the second reception mixer 956 - 1 .

[0203] According to an embodiment, the second reception mixer 956-1 may down-convert an RF signal in the second frequency band into an IF signal based on a local oscillation frequency provided from the first local oscillator 951 and divided by the second frequency divider 952. The IF signal down-converted by the second reception mixer 956-1 may be transmitted to the combiner circuit 947, low-noise-amplified by the LNA 943 of the reception path, and transmitted to the IFIC 260 through the third switch 931.

[0204] Figure 10 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0205] Reference Figure 10 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0206] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., first RF chain 1010-1, ..., n1th RF chain 1010-n1) for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., first RF chain 1020-1, ..., n2th RF chain 1020-n2) for processing RF signals transmitted and / or received through the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to or greater than 2) antenna ports 1011-1, ..., 1011-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to or greater than 2) antenna ports 1021-1, ..., 1021-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 1010-1, ..., and the n1th RF chain 1010-n1 of the first chain array 1010 may be substantially identical to each other. As an example, the first RF chains 1020-1, ..., and the n2th RF chain 1020-n2 of the second chain array may be substantially identical to each other. Below, the configuration of the first RF chain 1010-1 of the first RF chain array 1010 and the first RF chain 1020-1 (hereinafter referred to as the second RF chain 1020-1) of the second RF chain array 1020 is described in detail, and the description of the configuration of the second RF chain 1010-2, ..., n1th RF chain 1010-n1 of the first RF chain array 1010 and the second RF chain 1020-2, ..., n2th RF chain 1020-n2 of the second RF chain array 1020 is omitted.

[0207] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 1037 and a combiner circuit 1047. Although the frequency divider circuit 1037 and the combiner circuit 1047 are shown separately, the frequency divider circuit 1037 and the combiner circuit 1047 may be integrated into a single entity.

[0208] According to an embodiment, the wireless communication circuit 230 may include a transmit path 1039 configured to transmit data from an IFIC (eg, Figure 2 The transmission signal (eg, IF signal) received by the IFIC 260 in the first RF chain array 1010 is processed and transmitted to the first RF chain array 1010 and / or the second RF chain array 1020 .

[0209] According to an embodiment, the wireless communication circuit 230 may up-convert a transmission signal (eg, IF signal) received from the IFIC 260 and may transmit it to the first RF chain 1010 - 1 or the second RF chain 1020 - 1 via the transmit switch 1017 - 1 through the transmit path 1039 .

[0210] According to an embodiment, during transmission, the divider circuit 1037 may divide the RF signal received from the transmit mixer 1035 into a plurality of RF signals (eg, N RF signals) and may provide them to the first RF chain array 1010 or the second RF chain array 1020 .

[0211] According to an embodiment, the RF signal phase-adjusted by the phase shifter 1015 - 1 may be provided to the first RF chain 1010 - 1 or the second RF chain 1020 - 1 by the transmit switch 1017 - 1 .

[0212] According to various embodiments, during reception, the receive switch 1027 - 1 may transfer an RF signal received from the first RF chain 1010 - 1 or the second RF chain 1020 - 1 to the phase shifter 1025 - 1 so that its phase is adjusted. The phase-adjusted RF signal may be provided to the receive path 1049 .

[0213] According to various embodiments, during reception, the combiner circuit 1047 of the receive path 1049 may combine multiple RF signals received from the first RF chain array 1010 or the second RF chain array 1020 into a single RF signal and may provide it to the receive mixer 1045 .

[0214] According to various embodiments, the first RF chain 1010 - 1 may include a power amplifier (PA) 1013 - 1 and / or a low noise amplifier (LNA) 1014 - 1 .

[0215] According to an embodiment, the reception switch 1027-1 may transfer the RF signal in the first frequency band received from the LNA 1014-1 or the RF signal in the first frequency band received from the second reception mixer 1056-1 to the phase shifter 1025-1 so that the phase value thereof is adjusted.

[0216] According to various embodiments, the PA 1013-1 may amplify the power of the RF signal in the first frequency band received from the transmit switch 1017-1 and may output it to one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1011-1 through the first switch 1012-1.

[0217] According to various embodiments, the LNA 1014-1 can low-noise amplify the RF signal in the first frequency band received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1011-1 through the first switch 1012-1, and output it to the phase shifter 1025-1 through the reception switch 1027-1.

[0218] According to various embodiments, the first switch 1012 - 1 may selectively connect the first antenna port 1011 - 1 to the PA 1013 - 1 or the LNA 1014 - 1 .

[0219] According to various embodiments, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) input through the IFIC 260 and may output it to the first RF chain array 1010 and / or the second RF chain array 1020 through the transmit path 1039 .

[0220] According to an embodiment, during transmission, the wireless communication circuit 230 may transmit the input from the IFIC 260 to the transmit path 1039 through the third switch 1031. The transmit mixer 1035 may up-convert the IF signal amplified by the PA 1033 into an RF signal in the first frequency band based on the local oscillation frequency provided from the second local oscillator 1034.

[0221] According to various embodiments, the wireless communication circuit 230 may down-convert RF signals in the first frequency band received from the first RF chain array 1010 and / or the second RF chain array 1020 and may output them to the IFIC 260 through the receive path 1049 .

[0222] According to an embodiment, during signal reception, the wireless communication circuit 230 may connect the output port to the IFIC 260 and the reception path 1049 through the third switch 1031. The reception mixer 1045 may down-convert the RF signal in the first frequency band input through the combiner circuit 1047 into an IF signal based on the local oscillation frequency provided by the second local oscillator 1034. The signal (e.g., IF signal) down-converted in the reception mixer 1045 may be low-noise amplified by the LNA 1043 and transmitted to the IFIC 260 through the third switch 1031.

[0223] According to various embodiments, the second RF chain 1020-1 may include a power amplifier (PA) 1023-1, a low noise amplifier (LNA) 1024-1, a second transmit mixer 1055-1, and a second receive mixer 1056-1. According to an embodiment, the second transmit mixer 1055-1 may up-convert the RF signal in the first frequency band up-converted by the transmit mixer 1035 into an RF signal in the second frequency band.

[0224] According to an embodiment, the second transmit mixer 1055-1 may up-convert the RF signal in the first frequency band transmitted from the frequency divider circuit 1037 into an RF signal in the second frequency band based on the local oscillation frequency provided from the first local oscillator 1051 through the frequency divider 1052. The RF signal in the second frequency band up-converted by the second transmit mixer 1055-1 may be power amplified by the PA 1023-1, transmitted to the second antenna port 1021-1 through the second switch 1022-1, and output to one of the plurality of second antenna elements 222 of the second antenna structure 220.

[0225] According to an embodiment, the LNA 1024-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 1021-1 through the second switch 1022-1, may perform low-noise amplification on the RF signal, and may output the RF signal to the second reception mixer 1056-1.

[0226] According to an embodiment, the second switch 1022 - 1 may selectively connect the second antenna port 1021 - 1 to the PA 1023 - 1 or the LNA 1024 - 1 .

[0227] According to an embodiment, the second reception mixer 1056-1 may down-convert the reception RF signal in the second frequency band into an RF signal in the first frequency band based on the local oscillation frequency provided from the first local oscillator 1051 and divided by the frequency divider 1052. The RF signal in the first frequency band down-converted by the second reception mixer 1056-1 may be transmitted to the combiner circuit 1047, down-converted into an IF signal by the reception mixer 1045, and transmitted to the IFIC 260.

[0228] According to various embodiments, in order to down-convert an RF signal in the second frequency band (THz high frequency band) of the second communication system received through the second antenna structure 220 into an IF signal, a two-step down-conversion process may be performed, for example, the RF signal is down-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the second reception mixer 1056-1, and then the RF signal is down-converted into an IF signal through the reception mixer 1045 shared with the first antenna structure 210.

[0229] According to various embodiments, in order to generate an RF signal in the second frequency band (THz high band) of the second communication system transmitted through the second antenna structure 220, a two-step up-conversion process may be performed, for example, the IF signal is up-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the transmit mixer 1035 shared with the first antenna structure 210, and then up-converted into an RF signal in the second frequency band (THz high band) of the second communication system through the second transmit mixer 1055-1.

[0230] Figure 11 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0231] Reference Figure 11 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0232] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., first RF chain 1110-1, ..., n1th RF chain 1110-n1) for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., first RF chain 1120-1, ..., n2th RF chain 1120-n2) for processing RF signals transmitted and / or received through the plurality of second antenna elements 222 of the second antenna structure 220. Although the wireless communication circuit 230 in the illustrated example includes n1 (a natural number equal to or greater than 2) antenna ports 1111-1, ..., 1111-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to or greater than 2) antenna ports 1121-1, ..., 1121-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 1110-1, ..., and the n1th RF chain 1110-n1 of the first chain array 1110 may be substantially identical to each other. As an example, the first RF chains 1120-1, ..., and the n2th RF chain 1120-n2 of the second chain array may be substantially identical to each other. Below, the configuration of the first RF chain 1110-1 of the first RF chain array 1110 and the first RF chain 1120-1 (hereinafter referred to as the second RF chain 1120-1) of the second RF chain array 1120 is described in detail, and the description of the configuration of the second RF chain 1110-2, ..., n1th RF chain 1110-n1 of the first RF chain array 1110 and the second RF chain 1120-2, ..., n2th RF chain 1120-n2 of the second RF chain array 1120 is omitted.

[0233] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 1137 and a combiner circuit 1147. Although the frequency divider circuit 1137 and the combiner circuit 1147 are shown separately, the frequency divider circuit 1137 and the combiner circuit 1147 may be integrated into a single entity.

[0234] According to an embodiment, the wireless communication circuit 230 may include a transmit path 1139 configured to transmit data from an IFIC (eg, Figure 2 The transmission signal (eg, IF signal) received by the IFIC 260 in the first RF chain array 1110 is processed and transmitted to the first RF chain array 1110 and / or the second RF chain array 1120 .

[0235] According to an embodiment, the wireless communication circuit 230 may transfer a transmission signal (eg, IF signal) received from the IFIC 260 to the first RF chain 1110 - 1 or the second RF chain 1120 - 1 through the transmit switch 1117 - 1 through the transmit path 1139 .

[0236] According to an embodiment, during transmission, the divider circuit 1137 may divide the IF signal power-amplified by the PA 1133 into a plurality of IF signals (eg, n1 IF signals) and may provide them to a plurality of transmit mixers 1135 - 1 , . . . 1135 - n1 .

[0237] According to an embodiment, the transmit mixer 1135-1 may up-convert the IF signal transmitted from the frequency divider circuit 1137 into an RF signal in the first frequency band based on the local oscillation frequency generated by the second local oscillator 1161, divided by the frequency divider 1162, and phase-adjusted by the phase shifter 1163-1. According to an embodiment, the transmit switch 1117-1 may provide the RF signal in the first frequency band up-converted by the transmit mixer 1135-1 to the first RF chain 1110-1 or the second RF chain 1120-1.

[0238] According to various embodiments, during reception, the receive switch 1127 - 1 may transfer an RF signal, which has been received from the first RF chain 1110 - 1 or the second RF chain 1120 - 1 , to the receive mixer 1145 - 1 .

[0239] According to various embodiments, the receiving mixer 1145-1 can down-convert the RF signal in the first frequency band that has been received from the first RF chain 1110-1 or the second RF chain 1120-1 into an IF signal based on the local oscillation frequency generated by the second local oscillator 1161, transmitted through the divider 1162, and phase-adjusted by the phase shifter 1163-1, and can provide it to the receiving path 1149.

[0240] According to various embodiments, during reception, the combiner circuit 1147 of the receive path 1149 may combine multiple RF signals received from the first RF chain array 1110 or the second RF chain array 1120 into a single RF signal and may provide it to the LNA 1143. The low-noise amplified signal may be passed to the IFIC 260 via the switch 1131.

[0241] According to various embodiments, the first RF chain 1110 - 1 may include a power amplifier (PA) 1113 - 1 and / or a low noise amplifier (LNA) 1114 - 1 .

[0242] According to various embodiments, the first switch 1112 - 1 may selectively connect the first antenna port 1111 - 1 to the PA 1113 - 1 or the LNA 1114 - 1 .

[0243] According to an embodiment, the reception switch 1127-1 may transfer the RF signal in the first frequency band received from the LNA 1114-1 or the RF signal in the first frequency band received from the second reception mixer 1156-1 to the reception mixer 1145-1 so as to be down-converted into an IF signal.

[0244] According to various embodiments, the PA 1113-1 may amplify the power of the RF signal in the first frequency band received from the transmit switch 1117-1 and may output it to one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1111-1 through the first switch 1112-1.

[0245] According to various embodiments, the LNA 1114-1 may low-noise amplify an RF signal in the first frequency band received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1111-1 through the first switch 1112-1 and may output it to the receive switch 1127-1.

[0246] According to various embodiments, the wireless communication circuit 230 may up-convert a transmission signal (eg, IF signal) input through the IFIC 260 and may output it to the first RF chain array 1110 or the second RF chain array 1120 through the transmit path 1139 .

[0247] According to an embodiment, during transmission, the wireless communication circuit 230 may transmit the input from the IFIC 260 to the transmission path 1139 through the third switch 1131. The transmission mixer 1135-1 may up-convert the IF signal amplified by the PA 1133, divided by the frequency divider circuit 1137, and then provided into an RF signal in the first frequency band based on the local oscillation frequency provided from the second local oscillator 1161, divided by the frequency divider 1162, and phase-adjusted by the phase shifter 1163-1.

[0248] According to various embodiments, the wireless communication circuit 230 may down-convert RF signals in the first frequency band received from the first RF chain array 1110 and / or the second RF chain array 1120 and may output them to the IFIC 260 through the receive path 1149 .

[0249] According to an embodiment, during signal reception, the wireless communication circuit 230 can connect the output port to the IFIC 260 and the receive path 1149 via the third switch 1131. The receive mixer 1145-1 can down-convert the RF signal in the first frequency band input from the LNA 1114-1 or the second receive mixer 1156-1 into an IF signal based on the local oscillation frequency provided from the second local oscillator 1161, divided by the frequency divider 1162, and phase-adjusted by the phase shifter 1163-1. The signal down-converted in the receive mixer 1145-1 (e.g., the IF signal) can be low-noise amplified by the LNA 1143 and transmitted to the IFIC 260 via the third switch 1131.

[0250] According to various embodiments, the second RF chain 1120 - 1 may include a power amplifier (PA) 1123 - 1 , a low noise amplifier (LNA) 1124 - 1 , a second transmit mixer 1155 - 1 , and a second receive mixer 1156 - 1 .

[0251] According to an embodiment, the second transmit mixer 1155 - 1 may up-convert the RF signal in the first frequency band up-converted by the transmit mixer 1135 - 1 into an RF signal in the second frequency band.

[0252] According to an embodiment, the second transmit mixer 1155-1 can up-convert the RF signal in the first frequency band transmitted through the transmit switch 1117-1 into an RF signal in the second frequency band based on the local oscillation frequency provided by the first local oscillator 1151. For example, the transmit switch 1117-1 can be implemented as a frequency divider circuit. The RF signal in the second frequency band up-converted by the second transmit mixer 1155-1 can be power-amplified by the PA 1123-1, transmitted to the second antenna port 1121-1 through the second switch 1122-1, and output to one of the plurality of second antenna elements 222 of the second antenna structure 220.

[0253] According to an embodiment, the LNA 1124-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 1121-1 through the second switch 1122-1, may perform low-noise amplification on the RF signal, and may output the RF signal to the second reception mixer 1156-1.

[0254] According to an embodiment, the second switch 1122 - 1 may selectively connect the second antenna port 1121 - 1 to the PA 1123 - 1 or the LNA 1124 - 1 .

[0255] According to an embodiment, the second reception mixer 1156-1 may down-convert the received RF signal in the second frequency band into an RF signal in the first frequency band based on the local oscillation frequency provided from the first local oscillator 1151 through the frequency divider 1152. The RF signal in the first frequency band down-converted by the second reception mixer 1156-1 may be down-converted into an IF signal by the reception mixer 1145-1 via the reception switch 1127-1 and transmitted to the IFIC 260. For example, the reception switch 1127-1 may be implemented as a frequency divider circuit.

[0256] According to various embodiments, in order to down-convert an RF signal in the second frequency band (THz high frequency band) of the second communication system received through the second antenna structure 220 into an IF signal, a two-step down-conversion process may be performed, for example, down-converting the RF signal into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the second reception mixer 1156-1, and then down-converting the RF signal into an IF signal through the reception mixer 1145-1 shared with the first antenna structure 210.

[0257] According to various embodiments, in order to generate an RF signal in the second frequency band (THz high band) of the second communication system transmitted through the second antenna structure 220, a two-step up-conversion process may be performed, for example, the IF signal is up-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the transmit mixer 1135-1 shared with the first antenna structure 210, and then up-converted into an RF signal in the second frequency band (THz high band) of the second communication system through the second transmit mixer 1155-1.

[0258] Figure 12 6 , 7 and 8 illustrate a frequency divider circuit or a combiner circuit 1201, 1202 or 1203 in an example electronic device according to various embodiments (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 An example of the structure of the frequency divider circuit 637, 737, 837, 937, 1037 or 1137 and the combiner circuit 647, 747, 847, 947, 1047 or 1147 in FIG. Although the structure of the frequency divider circuit will be described below, the structure of the combiner circuit is similar thereto and its detailed description will be omitted. For example, Figure 12 The frequency divider circuit 1201 , 1202 , or 1203 may be implemented as a combiner circuit 1201 , 1202 , or 1203 .

[0259] refer to Figure 12(a) The frequency divider circuit 1201 may include a 1:n1 frequency divider 1211, a 1:n2 frequency divider 1221, and / or a 1:2 frequency divider 1231. As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. Here, the 1:n1 frequency divider 1211, the 1:n2 frequency divider 1221, and the 1:2 frequency divider 1231 may be implemented as a 1:n1 combiner 1211, a 1:n2 combiner 1221, and / or a 1:2 combiner 1231.

[0260] According to an embodiment, the 1:2 frequency divider 1231 may divide an input signal into two signals, so that the divided signals are input to the 1:n1 frequency divider 1211 and the 1:n2 frequency divider 1221 , respectively.

[0261] According to an embodiment, the 1:n1 frequency divider 1211 may divide the input signal into n1 signals, so that the divided signals are respectively input to, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , and an n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1.

[0262] According to an embodiment, the 1:n2 frequency divider 1221 may divide the input signal into n2 signals, so that the divided signals are respectively input to, for example, the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 and an n2 th RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2, or 1120-n2.

[0263] refer to Figure 12 (b), the frequency divider circuit 1202 may include a 1:n1 frequency divider 1212, a 1:n2 frequency divider 1222, and a 1:2 frequency divider 1232. As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. The frequency divider circuit 1202 may have Figure 12In addition to the structure of the frequency divider circuit 1201 in (a), a mixer 1242 is provided. Here, the 1:n1 frequency divider 1212, the 1:n2 frequency divider 1222, and the 1:2 frequency divider 1232 can be implemented as a 1:n1 combiner 1212, a 1:n2 combiner 1222, and / or a 1:2 combiner 1232. In addition, the mixer 1242 can be implemented as a mixer 1242 to down-convert an input signal, such as an RF signal in a specified frequency band (e.g., the second frequency band), and output the down-converted signal to the 1:2 combiner 1232.

[0264] According to an embodiment, the 1:2 frequency divider 1232 may divide the input signal into two signals, so that the divided signals are input to the 1:n1 frequency divider 1212 and the mixer 1242 , respectively.

[0265] According to an embodiment, the 1:n1 frequency divider 1212 may divide the input signal into n1 signals, so that the divided signals are respectively input to, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , and an n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1.

[0266] According to an embodiment, the mixer 1242 may up-convert the input signal so as to output an RF signal in a designated frequency band (eg, the second frequency band).

[0267] According to an embodiment, the 1:n2 frequency divider 1222 may divide the RF signal input from the mixer 1242 into n2 signals, so that the divided signals are respectively input to the second RF chain array (eg, FIG. 6 , FIG. 7 ). Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , for example, a first RF chain 620-1, 720-1, 820-1, 920-1, 1020-1, or 1120-1 ... and an n2-th RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2, or 1120-n2.

[0268] refer to Figure 12(c) The frequency divider circuit 1203 may include a 1:n1 frequency divider 1213, a 1:n2 frequency divider 1223, and a 1:2 frequency divider 1233. As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. Figure 12 In addition to the structure of the frequency divider circuit 1201 in (a), the frequency divider circuit 1203 may also be provided with two mixers 1243 and 1253. Here, the 1:n1 frequency divider 1213, the 1:n2 frequency divider 1223, and the 1:2 frequency divider 1233 may be implemented as a 1:n1 combiner 1213, a 1:n2 combiner 1223, and / or a 1:2 combiner 1233. Furthermore, the frequency mixer 1243 may be implemented as a mixer 1243, downconverting an input signal so that the RF signal is within a specified frequency band (e.g., the first frequency band) and outputting the downconverted signal to the 1:2 combiner 1233. Furthermore, the frequency mixer 1253 may be implemented as a mixer 1253, downconverting an input signal, such as an RF signal within a specified frequency band (e.g., the second frequency band), and outputting the downconverted signal to the 1:2 combiner 1233.

[0269] According to an embodiment, the 1:2 frequency divider 1233 may divide the input signal into two signals, so that the divided signals are input to the mixer 1253 and the mixer 1243 , respectively.

[0270] According to an embodiment, the mixer 1253 may up-convert the input signal so as to output an RF signal in a designated frequency band (eg, the first frequency band).

[0271] According to an embodiment, the mixer 1243 may up-convert the input signal so as to output an RF signal in a designated frequency band (eg, the second frequency band).

[0272] According to an embodiment, the 1:n1 frequency divider 1213 may divide the RF signal input from the mixer 1253 into n1 signals, so that the divided signals are respectively input to, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , and an n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1.

[0273] According to an embodiment, the 1:n2 frequency divider 1223 may divide the RF signal input from the mixer 1243 into n2 signals, so that the divided signals are respectively input to, for example, the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 and an n2 th RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2, or 1120-n2.

[0274] Figure 13 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0275] Reference Figure 13 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0276] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., first RF chain 1310-1, ..., n1th RF chain 1310-n1) for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., first RF chain 1320-1, ..., n2th RF chain 1320-n2) for processing RF signals transmitted and / or received through the plurality of second antenna elements 222 of the second antenna structure 220. Although in the illustrated example, the wireless communication circuit 230 includes n1 (a natural number equal to or greater than 2) antenna ports 1311-1, ..., 1311-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to or greater than 2) antenna ports 1321-1, ..., 1321-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 1310-1, ..., and the n1th RF chain 1310-n1 of the first chain array 1310 may be substantially identical to each other. As an example, the first RF chains 1320-1, ..., and the n2th RF chain 1320-n2 of the second chain array may be substantially identical to each other. Hereinafter, the configurations of the first RF chain 1310-1 of the first RF chain array 1310 and the first RF chain 1320-1 (hereinafter referred to as the second RF chain 1320-1) of the second RF chain array 1320 will be described in detail, and the descriptions of the configurations of the second RF chain 1310-2,…, the n2th RF chain 1310-n1 of the first RF chain array 1310 and the second RF chain 1320-2,…, the n2th RF chain 1320-n2 of the second RF chain array 1320 will be omitted.

[0277] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 1337 and a combiner circuit 1347. Although the frequency divider circuit 1337 and the combiner circuit 1347 are shown separately, the frequency divider circuit 1337 and the combiner circuit 1347 may be integrated into a single entity.

[0278] According to an embodiment, the wireless communication circuit 230 may up-convert a transmission signal (eg, an IF signal) received from the IFIC 260 and may transmit it to the first RF chain array 1310 or the second RF chain array 1320 via the frequency divider circuit 1337 .

[0279] According to an embodiment, during transmission, the frequency divider circuit 1337 may divide the RF signal received from the transmit mixer 1335 into a plurality of RF signals (e.g., n1, n2, or n1+n2 signals) and may provide the signals to the first RF chain array 1310 and / or the second RF chain array 1320. For example, the frequency divider circuit 1337 may provide the divided RF signals to the first RF chain 1310-1, ..., and / or the n1th RF chain 1310-n1 of the first RF chain array 1310, and / or the first RF chain 1320-1, ..., and / or the n2th RF chain 1320-n2 of the second RF chain array 1320.

[0280] According to an embodiment, the frequency divider circuit 1337 may have Figure 12 (b) is similar to the structure shown in FIG. According to an embodiment, the frequency divider circuit 1337 may include a 1:n1 frequency divider 1361 (e.g., Figure 12 (b) 1:n1 frequency divider 1212), 1:n2 frequency divider 1362 (e.g., Figure 12 (b) 1:n2 divider 1222) and 1:2 divider 1363 (e.g., Figure 12 (b) 1:2 frequency divider 1232). As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. The frequency divider circuit 1337 may have a second transmit mixer 1364 (e.g., Figure 12 (b) mixer 1242), similar to Figure 12 (b) shows the structure of the frequency divider circuit 1202.

[0281] According to an embodiment, the 1:2 frequency divider 1363 may divide the input signal into two signals, so that the divided signals are input to the 1:n1 frequency divider 1361 and the second mixer 1364 , respectively.

[0282] According to an embodiment, the 1:n1 frequency divider 1361 may divide the input signal into n1 signals, so that the divided signals are respectively input to, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 and an n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1 in a first RF chain array 610, 710, 810, 910, 1010, or 1110).

[0283] According to an embodiment, the second transmit mixer 1364 may up-convert an input signal based on the local oscillation frequency provided from the first local oscillator 1351 , so that an RF signal in a designated frequency band (eg, the second frequency band) is output.

[0284] According to an embodiment, the 1:n2 frequency divider 1362 may divide the RF signal input from the second transmit mixer 1364 into n2 signals, so that the divided signals are respectively input to the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 and an n2nd RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2, or 1120-n2, for example, of a second RF chain array 620, 720, 820, 920, 1020, or 1120 in the array.

[0285] According to various embodiments, during reception, the combiner circuit 1347 may combine a plurality of RF signals received from the first RF chain array 1310 and / or the second RF chain array 1320 into a single RF signal and may provide the signal to the receive mixer 1345. For example, the combiner circuit 1347 may combine a plurality of RF signals received from the first RF chain 1310-1, ..., and / or the n1th RF chain 1310-n2 of the first RF chain array 1310, and / or the first RF chain 1320-1, ..., and / or the n2th RF chain 1320-n2 of the second RF chain array 1320 into a single RF signal and may provide the signal to the receive mixer 1345.

[0286] According to an embodiment, the combiner circuit 1347 may have Figure 12 (b) is similar to the structure shown in FIG. According to an embodiment, the combiner circuit 1347 may include a 1:n1 combiner 1371 (e.g., corresponding to Figure 12 (b) 1:n1 divider 1212), 1:n2 combiner 1372 (e.g., corresponding to Figure 12 (b) 1:n2 divider 1222) and 1:2 combiner 1373 (e.g., corresponding to Figure 12 (b) 1:2 frequency divider 1232). As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. The combiner circuit 1347 may have a second receive mixer 1374 (e.g., corresponding to Figure 12 (b) mixer 1242), similar to Figure 12 (b) shows the structure of the frequency divider circuit 1202.

[0287] According to an embodiment, the 1:n1 combiner 1371 may combine the RF chains from, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 The first RF chain array 610, 710, 810, 910, 1010, or 1110) may receive n1 signals input by the first RF chain 610-1, 710-1, 810-1, 910-1, 1010-1, or 1110-1... and the n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1, and the combined RF signal may be provided to a 1:2 combiner 1373.

[0288] According to an embodiment, the 1:n2 combiner 1372 may combine the RF chains from, for example, the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 The n2 RF signals in the second frequency band input by the first RF chain 620-1, 720-1, 820-1, 920-1, 1020-1 or 1120-1, ... and the n2 RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2 or 1120-n2 in the second RF chain array 620, 720, 820, 920, 1020 or 1120) can be provided to the second receive mixer 1374.

[0289] According to an embodiment, the second reception mixer 1374 may down-convert an input signal based on the local oscillation frequency provided from the first local oscillator 1351 , so that an RF signal in a designated frequency band (eg, the first frequency band) is output.

[0290] According to an embodiment, the 1:2 combiner 1373 may combine the input signals and transmit the combined signal to the receive mixer 1345 .

[0291] According to various embodiments, the first RF chain 1310-1 may include phase shifters 1315-1 and 1316-1, a power amplifier (PA) 1313-1, and / or a low noise amplifier (LNA) 1314-1. According to an embodiment, the phase shifter 1315-1 may adjust the phase of the RF signal transmitted from the frequency divider circuit 1337 and input to the power amplifier 1313-1, and may output the RF signal.

[0292] According to an embodiment, the phase shifter 1316 - 1 may adjust the phase of the RF signal transmitted from the LNA 1314 - 1 and may output the RF signal.

[0293] According to various embodiments, the PA 1313-1 may amplify the power of the RF signal received from the phase shifter 1315-1. According to an embodiment, the PA 1313-1 may amplify the power of the RF signal received from the phase shifter 1315-1 and may output it to one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1311-1 through the first switch 1312-1.

[0294] According to various embodiments, the LNA 1314-1 may low-noise amplify the RF signal received through the first switch 1312-1 and may output the RF signal. According to an embodiment, the LNA 1314-1 may low-noise amplify the RF signal received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1311-1 through the first switch 1312-1 and may output the RF signal to the phase shifter 1316-1.

[0295] According to various embodiments, the first switch 1312 - 1 may selectively connect the first antenna port 1311 - 1 to the PA 1313 - 1 or the LNA 1314 - 1 .

[0296] According to an embodiment, during transmission, the wireless communication circuit 230 may connect the input from the IFIC 260 to the PA 1333 via the third switch 1331. The transmit mixer 1335 may up-convert the IF signal amplified by the PA 1333 into a first RF signal in the first frequency band based on the local oscillation frequency provided by the second local oscillator 1334. The RF signal in the first frequency band up-converted in the transmit mixer 1335 may be transmitted to the first RF chain array 1310 and / or the second RF chain array 1320 via the divider circuit 1337.

[0297] According to various embodiments, the wireless communication circuit 230 may down-convert RF signals in the first frequency band received from the first RF chain array 1310 and / or the second RF chain array 1320, and may output them to the IFIC 260. According to an embodiment, the reception mixer 1345 may down-convert RF signals input from the first RF chain array 1310 and / or the second RF chain array 1320 through the combiner circuit 1347 based on the local oscillation frequency provided from the second local oscillator 1334. The signal (e.g., IF signal) down-converted in the reception mixer 1345 may be low-noise amplified by the LNA 1343 and transmitted to the IFIC 260 through the third switch 1331.

[0298] According to various embodiments, the second RF chain 1320 - 1 may include a power amplifier (PA) 1323 - 1 , a low noise amplifier (LNA) 1324 - 1 , and / or phase shifters 1353 - 1 and 1354 - 1 .

[0299] According to an embodiment, the phase shifter 1353 - 1 may adjust the phase of the RF signal transmitted from the frequency divider circuit 1337 and input to the power amplifier 1323 - 1 , and may output the RF signal.

[0300] According to an embodiment, the phase shifter 1354 - 1 may adjust the phase of the RF signal transmitted from the LNA 1324 - 1 and may output the RF signal.

[0301] According to various embodiments, the PA 1323 - 1 of the second RF chain 1320 - 1 may amplify the power of the RF signal in the second frequency band received from the phase shifter 1353 - 1 .

[0302] According to an embodiment, the RF signal in the second frequency band power-amplified by the PA 1323 - 1 may be transmitted to the second antenna port 1321 - 1 through the second switch 1322 - 1 and may be output to one of the plurality of second antenna elements 222 of the second antenna structure 220 .

[0303] According to an embodiment, the LNA 1324-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 1321-1 through the second switch 1322-1, may perform low-noise amplification on the RF signal, and may output the RF signal to the phase shifter 1354-1.

[0304] According to an embodiment, the phase shifter 1354 - 1 may adjust the phase of the low-noise amplified RF signal in the second frequency band and may output it to the combiner circuit 1347 .

[0305] According to various embodiments, in order to down-convert the RF signal in the second frequency band (THz high frequency band) of the second communication system received through the second antenna structure 220 into an IF signal, a two-step down-conversion process can be performed. For example, the RF signal is down-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the second reception mixer 1374, and then the RF signal is down-converted into an IF signal through the reception mixer 1345 shared with the first antenna structure 210.

[0306] According to various embodiments, in order to generate an RF signal in the second frequency band (THz high frequency band) of the second communication system transmitted through the second antenna structure 220, a two-step up-conversion process may be performed, for example, the IF signal is up-converted into an RF signal in the first frequency band (millimeter wave band) of the first communication system through the transmit mixer 1335 shared with the first antenna structure 210, and then up-converted into an RF signal in the second frequency band (THz high frequency band) of the second communication system through the second transmit mixer 1364.

[0307] Figure 14 In an example electronic device (eg, Figure 2 The electronic device 200 in FIG. 2 includes a circuit configured to process radio signals of multiple communication systems (eg, Figure 2 An example structure of the wireless communication circuit 230 in FIG.

[0308] Reference Figure 14 , the wireless communication circuit 230 can process the wireless communication signal by providing a first antenna structure (eg, Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of first antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 ) and / or disposed in a second antenna structure (e.g., Figure 2 Figure 3 Figure 4 or Figure 5 A plurality of second antenna elements (eg, Figure 2 Figure 3 Figure 4 or Figure 5 The second antenna element 222 in the embodiment transmits and / or receives RF signals.

[0309] According to an embodiment, the wireless communication circuit 230 may include a first RF chain array (e.g., first RF chain 1410-1, ..., n1th RF chain 1410-n1) for processing RF signals transmitted and / or received through the plurality of first antenna elements 212 of the first antenna structure 210. According to an embodiment, the wireless communication circuit 230 may include a second RF chain array (e.g., first RF chain 1420-1, ..., n2th RF chain 1420-n2) for processing RF signals transmitted and / or received through the plurality of second antenna elements 222 of the second antenna structure 220. Although the wireless communication circuit 230 in the illustrated example includes n1 (a natural number equal to or greater than 2) antenna ports 1411-1, ..., 1411-n1 for connecting to the plurality of first antenna elements 212 of the first antenna structure 210, and includes n2 (a natural number equal to or greater than 2) antenna ports 1421-1, ..., 1421-n2 for connecting to the plurality of second antenna elements 222 of the second antenna structure 220, embodiments are not limited thereto, and various numbers of antenna ports and RF chains may be used. As an example, the first RF chains 1410-1, ..., and the n1th RF chain 1410-n1 of the first chain array 1410 may be substantially identical to each other. As an example, the first RF chains 1420-1, ..., and the n2th RF chain 1420-n2 of the second chain array may be substantially identical to each other. Below, the configuration of the first RF chain 1410-1 of the first RF chain array 1410 and the first RF chain 1420-1 (hereinafter referred to as the second RF chain 1420-1) of the second RF chain array 1420 is described in detail, and the description of the configuration of the second RF chain 1410-2, ..., n1th RF chain 1410-n1 of the first RF chain array 1410 and the second RF chain 1420-2, ..., n2th RF chain 1420-n2 of the second RF chain array 1420 is omitted.

[0310] According to an embodiment, the wireless communication circuit 230 may include a frequency divider circuit 1437 and a combiner circuit 1447. Although the frequency divider circuit 1437 and the combiner circuit 1447 are shown separately, the frequency divider circuit 1437 and the combiner circuit 1447 may be integrated into a single entity.

[0311] According to an embodiment, the wireless communication circuit 230 may communicate with the slave IFIC (e.g., Figure 2 The transmission signal (eg, IF signal) received by the IFIC 260 in the first RF chain array 1410 is power-amplified and may be transmitted to the first RF chain array 1410 and / or the second RF chain array 1420 .

[0312] According to an embodiment, during transmission, the frequency divider circuit 1437 may divide the RF signal received from the PA 1433 into a plurality of RF signals (e.g., n1, n2, or n1+n2 signals) and may provide the signals to the first RF chain array 1410 and / or the second RF chain array 1420. For example, the frequency divider circuit 1437 may provide the divided RF signals to the first RF chain 1410-1, ..., and / or the n1th RF chain 1410-n1 of the first RF chain array 1410, and / or the first RF chain 1420-1, ..., and / or the n2th RF chain 1420-n2 of the second RF chain array 1420.

[0313] According to an embodiment, the frequency divider circuit 1437 may have Figure 12 (c) is similar to the structure shown in FIG. According to an embodiment, the frequency divider circuit 1437 may include a 1:n1 frequency divider 1461 (e.g., Figure 12 (c) 1:n1 frequency divider 1213), 1:n2 frequency divider 1462 (e.g., Figure 12 (c) 1:n2 divider 1223) and 1:2 divider 1463 (e.g., Figure 12 (c) 1:2 frequency divider 1233). As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. The frequency divider circuit 1437 may have an additionally provided second transmit mixer 1464 (e.g., Figure 12 (c) mixer 1243) and a first transmit mixer 1465 (e.g., Figure 12 (c) mixer 1253), similar to Figure 12 (c) Structure of the frequency divider circuit 1202. For example, the first transmit mixer 1465 may be provided between the 1:2 frequency divider 1463 and the 1:n1 frequency divider 1461. For example, the second transmit mixer 1464 may be provided between the 1:2 frequency divider 1463 and the 1:n2 frequency divider 1462.

[0314] According to an embodiment, the 1:2 frequency divider 1463 may divide the input signal into two signals, so that the divided signals are input to the first transmit mixer 1465 and the second transmit mixer 1464 , respectively.

[0315] According to an embodiment, the first transmit mixer 1465 may up-convert an input signal based on the local oscillation frequency provided from the second local oscillator 1441 , so that an RF signal in a designated frequency band (eg, the first frequency band) is output.

[0316] According to an embodiment, the 1:n1 frequency divider 1461 may divide the signal input from the first transmit mixer 1465 into n1 signals, so that the divided signals are respectively input to, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , and an n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1.

[0317] According to an embodiment, the second transmit mixer 1464 may up-convert an input signal based on the local oscillation frequency provided from the first local oscillator 1451 , so that an RF signal in a designated frequency band (eg, the second frequency band) is output.

[0318] According to an embodiment, the 1:n2 frequency divider 1462 may divide the RF signal input from the second transmit mixer 1464 into n2 signals, so that the divided signals are respectively input to the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 , for example, a first RF chain 620-1, 720-1, 820-1, 920-1, 1020-1, or 1120-1 ... and an n2-th RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2, or 1120-n2.

[0319] According to various embodiments, the first RF chain 1410-1 may include phase shifters 1467-1 and 1468-1, a power amplifier (PA) 1413-1, and / or a low noise amplifier (LNA) 1414-1. According to embodiments, the phase shifter 1467-1 may adjust the phase of the RF signal transmitted from the frequency divider circuit 1461 and input to the PA 1413-1, and may output the RF signal.

[0320] According to an embodiment, the phase shifter 1468 - 1 may adjust the phase of the RF signal transmitted from the LNA 1414 - 1 and may output the RF signal.

[0321] According to various embodiments, the PA 1413-1 may amplify the power of the RF signal received from the phase shifter 1467-1. According to an embodiment, the PA 1413-1 may amplify the power of the RF signal received from the phase shifter 1467-1 and may output it to one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1411-1 through the first switch 1412-1.

[0322] According to various embodiments, the LNA 1414-1 may perform low-noise amplification on the RF signal received through the first switch 1412-1 and may output the RF signal. According to an embodiment, the LNA 1414-1 may perform low-noise amplification on the RF signal received from one of the plurality of first antenna elements 212 of the first antenna structure 210 connected to the first antenna port 1411-1 through the first switch 1412-1 and may output the RF signal to the phase shifter 1468-1.

[0323] According to various embodiments, the first switch 1412 - 1 may selectively connect the first antenna port 1411 - 1 to the PA 1413 - 1 or the LNA 1414 - 1 .

[0324] According to an embodiment, during transmission, the wireless communication circuit 230 may connect the input from the IFIC 260 to the PA 1433 via the third switch 1431. The first transmit mixer 1465 and / or the second transmit mixer 1464 may up-convert the IF signal amplified by the PA 1433 into an RF signal in a first frequency band and / or an RF signal in a second frequency band, respectively. The RF signal in the first frequency band up-converted by the first transmit mixer 1465 may be transmitted to the first RF chain array 1410 via a frequency divider (e.g., a 1:n1 frequency divider) 1461. The RF signal in the second frequency band up-converted by the second transmit mixer 1464 may be transmitted to the second RF chain array 1420 via a frequency divider (e.g., a 1:n2 frequency divider) 1462.

[0325] According to various embodiments, the second RF chain 1420 - 1 may include a power amplifier (PA) 1423 - 1 and / or a low noise amplifier (LNA) 1424 - 1 .

[0326] According to an embodiment, the second RF chain 1420 - 1 may further include a phase shifter 1453 - 1 configured to adjust a phase of an RF signal transmitted from the frequency divider circuit 1437 and input to the PA 1423 - 1 and output the RF signal.

[0327] According to an embodiment, the second RF chain 1420 - 1 may further include a phase shifter 1454 - 1 configured to adjust a phase of an RF signal received from the LNA 1424 - 1 and output the RF signal.

[0328] According to an embodiment, the RF signal in the second frequency band up-converted by the second transmit mixer 1464 can be phase-adjusted by the phase shifter 1453-1 via the 1:n2 divider 1462, power-amplified by the PA 1423-1, transmitted to the second antenna port 1421-1 through the second switch 1422-1, and output to one of the multiple antenna elements 222 of the second antenna structure 220.

[0329] According to an embodiment, the LNA 1424-1 may receive an RF signal in the second frequency band that has been received by one of the plurality of second antenna elements 222 of the second antenna structure 220 from the second antenna port 1421-1 through the second switch 1422-1, may perform low-noise amplification on the RF signal, and may output the RF signal to the phase shifter 1454-1.

[0330] According to an embodiment, the phase shifter 1454 - 1 may adjust the phase of the low-noise amplified RF signal in the second frequency band and may output it to the combiner circuit 1447 .

[0331] According to an embodiment, the combiner circuit 1447 may have Figure 12 (c) is similar to the structure shown in FIG. According to an embodiment, the combiner circuit 1447 may include a 1:n1 combiner 1471 (e.g., corresponding to Figure 12 (c) 1:n1 divider 1213), 1:n2 combiner 1472 (e.g., corresponding to Figure 12 (c) 1:n2 divider 1223) and 1:2 combiner 1473 (e.g., corresponding to Figure 12 (c) 1:2 frequency divider 1233). As used herein, n, n1, and n2 are natural numbers, and n=n1+n2. The combiner circuit 1447 may have an additionally provided first receive mixer 1475 (e.g., corresponding to Figure 12 (c)) and a second receive mixer 1474 (e.g., corresponding to Figure 12 (c) mixer 1243), similar to Figure 12 (c) Structure of the frequency divider circuit 1203. For example, the first receive mixer 1475 may be provided between the 1:2 combiner 1473 and the 1:n1 combiner 1471. For example, the second receive mixer 1474 may be located between the 1:2 combiner 1473 and the 1:n2 combiner 1472.

[0332] According to an embodiment, the 1:n1 combiner 1471 may combine the RF chains from, for example, the first RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 The first RF chain array 610, 710, 810, 910, 1010, or 1110) may be configured to receive n1 RF signals input by the first RF chain 610-1, 710-1, 810-1, 910-1, 1010-1, or 1110-1... and the n1th RF chain 610-n1, 710-n1, 810-n1, 910-n1, 1010-n1, or 1110-n1, and the combined RF signal may be provided to the first receive mixer 1475.

[0333] According to an embodiment, the 1:n2 combiner 1472 may combine the RF chains from, for example, the second RF chain array (eg, FIG. 6 , Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 or Figure 11 The n2 RF signals in the second frequency band input by the first RF chain 620-1, 720-1, 820-1, 920-1, 1020-1 or 1120-1, ... and the n2 RF chain 620-n2, 720-n2, 820-n2, 920-n2, 1020-n2 or 1120-n2 in the second RF chain array 620, 720, 820, 920, 1020 or 1120) can be provided to the second receive mixer 1474.

[0334] According to an embodiment, the first reception mixer 1475 may down-convert an input signal based on a local oscillation frequency provided from the second local oscillator 1441 so as to output an IF signal.

[0335] According to an embodiment, the second reception mixer 1474 may down-convert the input signal based on the local oscillation frequency provided from the first local oscillator 1451 so as to output an IF signal.

[0336] According to an embodiment, the 1:2 combiner 1473 may combine the input signals and transmit the combined signal to the low noise amplifier 1443 .

[0337] According to various example embodiments, an electronic device (e.g., Figure 2 The electronic device 200 may include: a first transmission mixer configured to up-convert the transmission signal (eg, Figure 6b a third transmit mixer 665 in the first transmit mixer), a second transmit mixer configured to up-convert the signal output by the first transmit mixer (eg, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a frequency divider circuit (eg, a frequency divider circuit configured to divide the frequency of a signal output by the second transmit mixer) and a frequency divider circuit configured to divide the frequency of a signal output by the second transmit mixer; Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a divider circuit 637, 737, 837, 937, 1037, 1137, 1337, or 1437 in the frequency divider circuit), a first antenna port (e.g., associated with a first antenna structure for performing first frequency band communication based on a signal output by the divider circuit) Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a first antenna port 611-1, ... 611-n1, 711-1, ... 711-n1, 811-1, ... 811-n1, 911-1, ... 911-n1, 1011-1, ... 1011-n1, 1111-1, ... 1111-n1, 1311-1, ... 1311-n1, or 1411-1, ... 1411-n1 in the frequency divider circuit); a third transmit mixer (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 , and a second antenna port (e.g., a second antenna port associated with a second antenna structure for performing second frequency band communication based on a signal output by the third transmit mixer) Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13or Figure 14 1-n2, or 1421-1, ...1421-n2).

[0338] According to various embodiments, the electronic device may further include a first local oscillator (eg, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 A first local oscillator 651, 751, 851, 951, 1051, 1151, 1351 or 1441 in the embodiment of the present invention is configured to generate a local oscillation frequency and provide the local oscillation frequency to the third transmit mixer.

[0339] According to various embodiments, the electronic device may further include a phase shifter (653) configured to adjust the phase of the local oscillation frequency generated by the first local oscillator and provide the phase-adjusted local oscillation frequency to the third transmission mixer.

[0340] According to various embodiments, the electronic device may further include: a 1:2 frequency divider (eg, Figure 12 1:2 frequency dividers 1231, 1232 in the embodiment of the present invention are configured to divide the frequency of the signal output by the second transmit mixer to be transmitted to the first antenna port or the third transmit mixer; 1:n1 frequency divider (for example, Figure 12 1:n1 frequency divider 1211, 1212), configured to divide the signal output by the 1:2 frequency divider to be transmitted to the first antenna port; and 1:n2 frequency divider (eg, Figure 12 The 1:n2 frequency divider 1222 in FIG. 1 is configured to divide the frequency of the signal output by the third transmit mixer to be transmitted to the second antenna port.

[0341] According to various embodiments, the first frequency band communication may correspond to a 5G (fifth generation) communication system using a frequency band between 20 GHz and 60 GHz, and the second frequency band communication may correspond to a 6G communication system using a frequency band between 100 GHz and 10 THz.

[0342] According to various embodiments, the electronic device may further include a first phase shifter (eg, Figure 6a or Figure 7, and a first amplifier (eg, a first phase shifter 615, 715) configured to amplify the power of a signal output by the first phase shifter to be transmitted to the first antenna port. Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 1, ..., 1313-n1 or 1413-1, ..., 1413-n1).

[0343] According to various embodiments, the electronic device may further include a second phase shifter (eg, Figure 7 ), and a second amplifier (eg, a second phase shifter 753 in FIG. 1 ), configured to amplify the power of the signal output by the second phase shifter to be transmitted to the second antenna port. Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 1, ..., 1323-n2, or 1423-1, ..., 1423-n2).

[0344] According to various embodiments, the electronic device may further include: a first reception mixer (eg, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14a second receive mixer 656-1, ... 656-n2, 756-1, ... 756-n2, 856-1, ... 856-n2, 956-1, ... 956-n2, 1056-1, ... 1056-n2, 1156-1, ... 1156-n2, 1374, or 1474 in the antenna port); a combiner circuit configured to combine signals received from the first antenna port or signals output by the first receive mixer (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a second receive mixer (e.g., a combiner circuit 647, 747, 847, 947, 1047, 1147, 1347, or 1447) configured to down-convert a signal output by the combiner circuit; Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 and a third receive mixer (eg, a receive mixer 645, 745, 845, 945, 1045, 1145, 1345, or 1445) configured to down-convert the signal output by the second receive mixer. Figure 6b The third transmit mixer 665 in FIG.

[0345] According to various embodiments, the electronic device may further include: a 1:n1 combiner (1212) configured to combine signals received from the first antenna port; and a 1:n2 combiner (1222) configured to combine signals output by the first reception mixer.

[0346] According to various embodiments, the electronic device may further include a 1:2 combiner ( 1232 ) configured to combine the signal output by the 1:n1 combiner or the signal output by the first reception mixer.

[0347] According to various embodiments, the second receive mixer may be configured to down-convert the signal output by the 1:2 combiner.

[0348] According to various embodiments, the electronic device may include: an antenna element (eg, Figure 2 The first antenna structure (eg, the plurality of first antenna elements 212) Figure 2 , including an antenna element for performing second frequency band communications (eg, Figure 2a second antenna structure (eg, a plurality of first antenna elements 222) in Figure 2 ), and a circuit configured to send or receive a radio frequency signal through the first antenna structure or the second antenna structure.

[0349] According to various embodiments, the circuit may include a first transmit mixer (eg, Figure 6b a third transmit mixer 665 in the first transmit mixer), a second transmit mixer configured to up-convert the signal output by the first transmit mixer (eg, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a frequency divider circuit (eg, a frequency divider circuit configured to divide the frequency of a signal output by the second transmit mixer) and a frequency divider circuit configured to divide the frequency of a signal output by the second transmit mixer; Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a divider circuit 637, 737, 837, 937, 1037, 1137, 1337, or 1437 in the frequency divider circuit), a first antenna port (e.g., associated with a first antenna structure for performing first frequency band communication based on a signal output by the divider circuit) Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a first antenna interface 611-1, ... 611-n1, 711-1, 711-1, ... 711-n1, 811-1, 911-1, 911-n1, 1011-1, ... 1011-1, 1111-1, ... 1111-n1, 1311-1, ... 1311-n1, or 1411-1, ... 1411-1n1 in the frequency divider circuit); a third transmit mixer (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14, and a second antenna port associated with a second antenna structure for performing second frequency band communication based on a signal output by the third transmit mixer. (For example, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 1-n2, or 1421-1, ...1421-n2).

[0350] According to various embodiments, the circuit may further include a first local oscillator (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 A first local oscillator 651, 751, 851, 951, 1051, 1151, 1351 or 1441 in the embodiment of the present invention is configured to generate a local oscillation frequency and provide the local oscillation frequency to the third transmit mixer.

[0351] According to various embodiments, the circuit may further include a phase shifter (653) configured to adjust the phase of the local oscillation frequency generated by the first local oscillator and provide the phase-adjusted local oscillation frequency to the third transmit mixer.

[0352] According to various embodiments, the circuit may further include: a 1:2 frequency divider (e.g., Figure 12 1:2 frequency dividers 1231, 1232 in the embodiment of the present invention are configured to divide the frequency of the signal output by the second transmit mixer to be transmitted to the first antenna port or the third transmit mixer; 1:n1 frequency divider (for example, Figure 12 1:n1 frequency divider 1211, 1212), configured to divide the signal output by the 1:2 frequency divider to be transmitted to the first antenna port; and 1:n2 frequency divider (eg, Figure 12The 1:n2 frequency divider 1222 in FIG. 1 is configured to divide the frequency of the signal output by the third transmit mixer to be transmitted to the second antenna port.

[0353] According to various embodiments, the first frequency band communication may correspond to a 5G (fifth generation) communication system using a frequency band between 20 GHz and 60 GHz, and the second frequency band communication may correspond to a 6G communication system using a frequency band between 100 GHz and 10 THz.

[0354] According to various embodiments, the electronic device may further include: a first reception mixer (eg, Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 a second receive mixer 656-1, ... 656-n2, 756-1, ... 756-n2, 856-1, ... 856-n2, 956-1, ... 956-n2, 1056-1, ... 1056-n2, 1156-1, ... 1156-n2, 1374, or 1474 in the antenna port), a combiner circuit configured to combine signals received from the first antenna port or signals output by the first receive mixer (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 , a combiner circuit 647, 747, 847, 947, 1047, 1147, 1347, or 1447 in the embodiment of the present invention), a second receive mixer (e.g., Figure 6a 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 13 or Figure 14 ), and a third receive mixer (eg, a receive mixer 645, 745, 845, 945, 1045, 1145, 1345, or 1445) configured to down-convert the signal output by the second receive mixer. Figure 6b The third transmit mixer 665 in FIG.

[0355] According to various example embodiments, the electronic device may further include at least one printed circuit board (eg, printed circuit boards 201 and / or 202 ), and the first antenna structure, the second antenna structure, and the circuit may be provided on the at least one printed circuit board.

[0356] According to various example embodiments, the first antenna structure and the second antenna structure may be disposed on a first surface (eg, Figure 4 The wireless communication circuit may be disposed on a second surface (eg, a first surface 401 in FIG. 4 ) facing the first surface of the at least one printed circuit board. Figure 4 On the second surface 402).

[0357] According to various example embodiments, the electronic device may further include a housing. The at least one printed circuit board may include a flexible printed circuit board (FPCB). The first antenna structure may be disposed on a first surface of the housing, and the second antenna structure may be disposed on a second surface different from the first surface of the housing.

[0358] The embodiments of the present disclosure provided in the specification and the drawings are merely specific examples presented to easily describe the technical content according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as covering not only the embodiments disclosed herein, but also all changes or modifications derived from the technical ideas of the various embodiments of the present disclosure.

Claims

1. An electronic device comprising: a first transmit mixer configured to up-convert a transmission signal; a second transmit mixer configured to up-convert the signal output by the first transmit mixer; A frequency divider circuit configured to divide the frequency of the signal output by the second transmit mixer; a first antenna port associated with a first antenna structure for performing communications in a first frequency band based on a signal output by the frequency divider circuit; a third transmit mixer configured to up-convert the output signal from the frequency divider circuit; as well as The second antenna port is associated with a second antenna structure for performing second frequency band communication based on a signal output by the third transmit mixer.

2. The electronic device according to claim 1, further comprising: The first local oscillator is configured to generate a local oscillation frequency and provide the local oscillation frequency to the third transmit mixer.

3. The electronic device according to claim 2, further comprising: The phase shifter is configured to adjust the phase of the local oscillation frequency generated by the first local oscillator and provide the phase-adjusted local oscillation frequency to the third transmit mixer.

4. The electronic device according to claim 1, further comprising: a 1:2 frequency divider configured to divide the frequency of a signal output by the second transmit mixer so as to be transmitted to the first antenna port or the third transmit mixer; a 1:n1 frequency divider configured to divide the signal output by the 1:2 frequency divider to be transmitted to the first antenna port; as well as The 1:n2 frequency divider is configured to divide the frequency of the signal output from the third transmit mixer so as to transmit the signal to the second antenna port.

5. The electronic device according to claim 1, wherein The first frequency band communication corresponds to a 5G (fifth generation) communication system using a frequency band between 20 GHz and 60 GHz, and the second frequency band communication corresponds to a 6G communication system using a frequency band between 100 GHz and 10 THz.

6. The electronic device according to claim 1, further comprising: a first phase shifter configured to adjust the phase of a signal output by the frequency divider circuit; as well as The first amplifier is configured to amplify the power of the signal output by the first phase shifter so as to transmit the signal to the first antenna port.

7. The electronic device according to claim 6, further comprising: a second phase shifter configured to adjust the phase of the signal output by the third transmit mixer; as well as The second amplifier is configured to amplify the power of the signal output by the second phase shifter so as to be transmitted to the second antenna port.

8. The electronic device according to claim 1, further comprising: a first receive mixer configured to downconvert a signal received from the second antenna port; a combiner circuit configured to combine signals received from the first antenna port or signals output by the first receive mixer; a second receive mixer configured to downconvert the signal output by the combiner circuit; as well as The third reception mixer is configured to down-convert the signal output by the second reception mixer.

9. The electronic device according to claim 8, further comprising: a 1:n1 combiner configured to combine signals received from the first antenna port; as well as A 1:n2 combiner is configured to combine the signals output by the first receive mixer.

10. The electronic device according to claim 9, further comprising: The 1:2 combiner is configured to combine the signal output by the 1:n1 combiner or the signal output by the first receive mixer. The electronic device according to claim 10 , wherein: The second receive mixer is configured to down-convert the signal output by the 1:2 combiner.

12. An electronic device comprising: a first antenna structure comprising an antenna element for performing communications in a first frequency band; a second antenna structure comprising an antenna element for performing communications in a second frequency band; as well as circuit, configured to transmit or receive a radio frequency signal via the first antenna structure or the second antenna structure, Wherein, the circuit includes: a first transmit mixer configured to up-convert a transmission signal; a second transmit mixer configured to up-convert the signal output by the first transmit mixer; A frequency divider circuit configured to divide the frequency of the signal output by the second transmit mixer; a first antenna port associated with a first antenna structure for performing communications in a first frequency band based on a signal output by the frequency divider circuit; a third transmit mixer configured to up-convert the output signal from the frequency divider circuit; and The second antenna port is associated with a second antenna structure for performing second frequency band communication based on a signal output by the third transmit mixer.

13. The electronic device according to claim 12, further comprising at least one printed circuit board, in, The first antenna structure, the second antenna structure, and the circuit are disposed on at least one printed circuit board.

14. The electronic device according to claim 13, wherein: The first antenna structure and the second antenna structure are disposed on a first surface of at least one printed circuit board, and the circuit is disposed on a second surface facing the first surface of the at least one printed circuit board.

15. The electronic device according to claim 13, further comprising a housing, in, The at least one printed circuit board includes a flexible printed circuit board (FPCB), and The first antenna structure is disposed on a first surface of the housing, and the second antenna structure is disposed on a second surface different from the first surface of the housing.

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