Glue point thickness detection method, controller, light source device and storage medium

Abstract

The invention discloses a glue point thickness detection method, a controller, a light source device and a storage medium, and is applied to the light source device which comprises a light source emitter, an optical fiber coupler, a first lens assembly, a second lens assembly and a holophote. The method comprises the steps that a light source emitter is controlled to emit a target light source, so that the target light source is split to a first lens assembly and a second lens assembly through an optical fiber coupler, and reference light and signal light are obtained; a plurality of reference points are set to move the first lens assembly to the reference points, interference signals sent by the optical fiber coupler are received at each reference point, and the interference signals are obtained by converging the reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured through the optical fiber coupler; and determining phase delays of all the interference signals, and determining the glue point thickness of the glue point to be measured according to all the phase delays. According to the embodiment of the invention, the accuracy of glue point thickness detection can be improved, and the detection efficiency of the glue point thickness is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of sample detection, and in particular to a glue dot thickness detection method, a controller, a light source device, and a storage medium. Background Art

[0002] In modern industrial production, automatic dispensing machines are widely used in electronics, microcircuits, LEDs, and other industries, primarily for connecting, coating, and sealing product components. They not only improve product quality but also increase production efficiency and enable complex dispensing processes.

[0003] Automatic dispensing machines are commonly used in industrial production. However, due to the limitations of the dispensing machine's process level, they often produce a large number of defective products, such as insufficient glue, broken glue, and no glue. If these defective products cannot be detected in time, the final application performance of the product will be seriously affected. Summary of the Invention

[0004] The embodiments of the present application provide a glue dot thickness detection method, a controller, a light source device, and a storage medium, which can improve the accuracy of glue dot thickness detection and further improve the efficiency of glue dot thickness detection.

[0005] In a first aspect, an embodiment of the present application provides a method for detecting glue dot thickness, which is applied to a light source device, wherein the light source device includes a light source transmitter, a fiber coupler, a first lens assembly, a second lens assembly, and a total reflector; the method includes:

[0006] Controlling the light source transmitter to emit a target light source so that the target light source is split by the optical fiber coupler to the first lens assembly and the second lens assembly to obtain a reference light and a signal light, wherein the reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the glue point to be measured;

[0007] Setting a plurality of reference points to move the first lens assembly to the reference points, and receiving an interference signal sent by the optical fiber coupler at each of the reference points, wherein the interference signal is obtained by combining the reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured through the optical fiber coupler;

[0008] The phase delays of all the interference signals are determined, and the glue dot thickness of the glue dot to be measured is determined according to all the phase delays.

[0009] In some embodiments, controlling the light source transmitter to emit a target light source so that the target light source is split through the optical fiber coupler to the first lens assembly and the second lens assembly to obtain reference light and signal light includes:

[0010] Controlling the light source transmitter to emit a target light source so that the target light source passes through the optical fiber coupler to obtain a first light beam and a second light beam;

[0011] The first light beam is controlled to pass through the first lens assembly and irradiate the total reflection mirror to obtain reference light, and the second light beam is controlled to pass through the second lens assembly and irradiate the glue point to be measured to obtain signal light.

[0012] In some embodiments, the reference points include a first reference point, a second reference point, and a third reference point, and the distances between the first reference point, the second reference point, and the third reference point and the optical fiber coupler are increased in sequence; setting a plurality of reference points to move the first lens assembly to the reference points and receiving the interference signal sent by the optical fiber coupler at each reference point comprises:

[0013] Moving the first lens assembly to the first reference point so that the optical fiber coupler combines the first reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a first interference signal;

[0014] Moving the first lens assembly to the second reference point so that the optical fiber coupler combines the second reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a second interference signal;

[0015] Moving the first lens assembly to the third reference point so that the optical fiber coupler combines the third reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a third interference signal;

[0016] A first interference signal generated by the optical fiber coupler at the first reference point, a second interference signal generated at the second reference point, and a third interference signal generated at the third reference point are received.

[0017] In some embodiments, determining the phase delays of all the interference signals comprises:

[0018] Obtaining the light source wavelength and light source bandwidth of the target light source;

[0019] For each of the interference signals, the phase difference of the interference signal is detected according to the wavelength of the light source and the bandwidth of the light source to obtain the phase delay of the interference signal.

[0020] In some embodiments, determining the thickness of the glue point to be measured based on all the phase delays includes:

[0021] determining a tomographic image corresponding to the interference signal according to the phase delay;

[0022] Acquire a transverse scanning image and a longitudinal scanning image of the glue point to be tested by a preset optical coherence tomography technique, and extract a transverse feature descriptor of the transverse scanning image and a longitudinal feature descriptor of the longitudinal scanning image according to a preset feature detection algorithm;

[0023] performing matching calculation on the horizontal feature descriptor and the vertical feature descriptor to obtain a fused image;

[0024] The glue point thickness of the glue point to be measured is determined according to the fused image and the tomographic image.

[0025] In some embodiments, determining the tomographic image corresponding to the interference signal according to the phase delay includes:

[0026] extracting depth information of the glue point to be measured from the interference signal according to the phase delay;

[0027] The depth information is subjected to phase analysis using a preset image processing algorithm to obtain a tomographic image.

[0028] In some embodiments, determining the glue point thickness of the glue point to be measured based on the fused image and the tomographic image includes:

[0029] Preprocessing the tomographic image and the fused image;

[0030] Performing structural analysis on the pre-processed fusion image to obtain the three-dimensional structure of the glue point to be tested;

[0031] The glue point thickness of the glue point to be measured is determined according to the preprocessed tomographic image and the three-dimensional structure.

[0032] In a second aspect, an embodiment of the present application further provides a controller comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method for detecting the glue dot thickness as described in the first aspect is implemented.

[0033] In a third aspect, an embodiment of the present application further provides a light source device, which includes a light source transmitter, a fiber optic coupler, a first lens assembly, a second lens assembly, a total reflection mirror and the controller described in the second aspect.

[0034] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the glue dot thickness detection method as described in the first aspect.

[0035] The glue dot thickness detection method provided in the embodiment of the present application has at least the following beneficial effects: the light source device includes a light source transmitter, a fiber optic coupler, a first lens assembly, a second lens assembly and a total reflection mirror. During the glue dot thickness detection process, the embodiment of the present application first controls the light source transmitter to emit the target light source, so that the target light source is split to the first lens assembly and the second lens assembly through the optical fiber coupler, thereby splitting the target light source and obtaining reference light and signal light, wherein the reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the glue point to be measured, so that the target light source can be split into a reference beam and a sample beam, and then multiple reference points are set to move the first lens assembly to the reference point to change the optical path of the reference arm in the path of the reference light, and receive the interference signal sent by the optical fiber coupler at each reference point, wherein the interference signal is obtained by merging the reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured through the optical fiber coupler, so that the interference signal of the optical fiber coupler at all reference points can be received, and then the phase delay of all interference signals is determined, and the glue dot thickness of the glue point to be measured is determined based on all phase delays, so as to achieve accurate measurement of the glue dot thickness and ensure the accuracy of the detection results. The embodiment of the present application directly determines the interference signal by the signal light returned by irradiating light on the surface of the glue point to be tested, and then obtains the thickness of the glue point to be tested by calculating the phase delay of the interference signal. There is no need to use multiple objects of different heights to constantly adjust the test, which is easy to operate, improves the detection efficiency, and ensures the accuracy of the detection results.

[0036] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are used to provide a further understanding of the technical solution of the present application and constitute a part of the specification. Together with the examples of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0038] Figure 1 Schematic diagram of the framework of the light source device provided in an embodiment of the present application;

[0039] Figure 2 This is a flow chart of a specific method of the glue dot thickness detection method provided in an embodiment of the present application;

[0040] Figure 3 This is a specific flow chart for obtaining reference light and signal light provided in an embodiment of the present application;

[0041] Figure 4is a specific flow chart of receiving an interference signal sent by a fiber coupler at each reference point provided by an embodiment of the present application;

[0042] Figure 5 This is a specific flow chart for determining the phase delay of all interference signals provided by an embodiment of the present application;

[0043] Figure 6 This is a specific flow chart for determining the thickness of a glue point to be measured based on all phase delays provided in one embodiment of the present application;

[0044] Figure 7 This is a specific flow chart of determining a tomographic image corresponding to an interference signal based on phase delay provided by an embodiment of the present application;

[0045] Figure 8 This is a specific flow chart for determining the thickness of a glue point to be measured based on a fused image and a tomographic image provided by an embodiment of the present application;

[0046] Figure 9 This is a schematic diagram of the hardware structure of the controller provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0048] It should be noted that although the device schematics illustrate functional module divisions and the flowcharts illustrate logical sequences, in certain circumstances, the steps shown or described may be performed in a sequence that differs from the module divisions in the device or the sequence in the flowcharts. The terms "first," "second," and so on, in the specification, claims, and drawings, are used to distinguish similar items and are not necessarily used to describe a specific sequence or precedence.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0050] The glue dot thickness detection method provided in the embodiments of the present application can be applied to a terminal, a server, or software running on a terminal or a server. In some embodiments, the terminal can be a smartphone, a tablet computer, a laptop computer, a desktop computer, or a smartwatch; the server can be configured as an independent physical server, or as a server cluster or distributed system consisting of multiple physical servers; or as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDNs), and big data and artificial intelligence platforms; the software can be an application that implements the above method, but is not limited to the above forms.

[0051] Embodiments of the present application can be used in numerous general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer computer devices, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, and the like. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, and the like that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected via a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0052] In modern industrial production, automatic dispensing machines are widely used in electronics, microcircuits, LEDs, and other industries, primarily for connecting, coating, and sealing product components. They not only improve product quality but also increase production efficiency and enable complex dispensing processes.

[0053] Automatic dispensing machines are commonly used in industrial production. However, due to the limitations of the dispensing machine's process level, they often produce a large number of defective products, such as insufficient glue, broken glue, and no glue. If these defective products cannot be detected in time, the final application performance of the product will be seriously affected.

[0054] In order to solve the above problems, an embodiment of the present application provides a glue dot thickness detection method, a controller, a light source device and a storage medium. The light source device includes a light source transmitter, a fiber optic coupler, a first lens assembly, a second lens assembly and a total reflection mirror. During the glue dot thickness detection process, the embodiment of the present application first controls the light source transmitter to emit the target light source, so that the target light source is split to the first lens assembly and the second lens assembly through the optical fiber coupler, thereby splitting the target light source and obtaining reference light and signal light, wherein the reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the glue point to be measured, so that the target light source can be split into a reference beam and a sample beam, and then multiple reference points are set to move the first lens assembly to the reference point to change the optical path of the reference arm in the path of the reference light, and receive the interference signal sent by the optical fiber coupler at each reference point, wherein the interference signal is obtained by merging the reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured through the optical fiber coupler, so that the interference signal of the optical fiber coupler at all reference points can be received, and then the phase delay of all interference signals is determined, and the glue dot thickness of the glue point to be measured is determined based on all phase delays, so as to achieve accurate measurement of the glue dot thickness and ensure the accuracy of the detection results. The embodiment of the present application directly determines the interference signal by the signal light returned by irradiating light on the surface of the glue point to be tested, and then obtains the thickness of the glue point to be tested by calculating the phase delay of the interference signal. There is no need to use multiple objects of different heights to constantly adjust the test, which is easy to operate, improves the detection efficiency, and ensures the accuracy of the detection results.

[0055] Reference Figure 1 , Figure 1 It is a schematic diagram of the framework of the light source device provided in an embodiment of the present application.

[0056] In some embodiments, the light source device includes a light source transmitter 100 , a fiber coupler 200 , a first lens assembly 300 , a second lens assembly 400 , a total reflection mirror 500 , and a controller 600 .

[0057] It should be noted that the first lens assembly 300 in the embodiment of the present application includes a first lens, and the second lens assembly 400 includes a second lens and a third lens.

[0058] Among them, the light source transmitter 100 of the embodiment of the present application is used to emit weak coherent light. The weak coherent light sent out by the light source transmitter 100 is split by the optical fiber coupler 200, and one path is projected onto the total reflection mirror 500 through the first lens assembly 300 to form a reference light, and the other path is projected onto the glue point to be tested through the second lens assembly 400, so that the light is focused on the glue point to be tested through the second lens and the third lens in the second lens assembly 400 to become signal light.

[0059] Since the scattered signals from different depths of the glue point to be tested have different phase delays, corresponding to a certain position of the reference arm, only the scattered signal from a specific depth of the sample can interfere with the reference light; because the phase length of the light source is very short, only when the signal light and the reference light are at approximately equal optical path lengths, that is, when the optical path difference is no greater than the coherence length of the light source, can an interference signal be generated, so that the system imaging can have high resolution.

[0060] The light source device described in the embodiment of the present invention is intended to more clearly illustrate the technical solution of the embodiment of the present invention, and does not constitute a limitation on the technical solution provided by the embodiment of the present invention. Those skilled in the art will know that with the evolution of the light source device and the emergence of new application scenarios, the technical solution provided by the embodiment of the present invention is also applicable to similar technical problems.

[0061] It will be understood by those skilled in the art that Figure 1 The light source device shown in the figure does not constitute a limitation on the embodiments of the present invention, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0062] Reference Figure 2 , Figure 2 This is a flowchart of a specific method of the glue point thickness detection method provided in the embodiment of the present application. In some embodiments, the glue point thickness detection method is applied but not limited to Figure 1 The light source device in the method includes but is not limited to steps S101 to S103.

[0063] In step S101, the light source transmitter 100 is controlled to emit a target light source, so that the target light source is split through the optical fiber coupler 200 to the first lens assembly 300 and the second lens assembly 400 to obtain reference light and signal light. The reference light is used to illuminate the total reflection mirror 500, and the signal light is used to illuminate the glue point to be measured.

[0064] In step S101 of some embodiments, the light source transmitter 100 is controlled to emit a target light source so that the target light source is split into the first lens assembly 300 and the second lens assembly 400 through the optical fiber coupler 200. The light passing through the first lens assembly 300 passes through the total reflection mirror 500 and then returns. The light passing through the second lens assembly 400 illuminates the glue point to be measured and then returns, thereby obtaining a reference light and a signal light.

[0065] In step S102, a plurality of reference points are set to move the first lens assembly 300 to the reference points, and the interference signal sent by the optical fiber coupler 200 is received at each reference point, wherein the interference signal is obtained by combining the reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured by the optical fiber coupler 200.

[0066] In step S102 of some embodiments, since the phase length of the light source is very short, an interference signal can only be generated when the signal light and the reference light are at approximately equal optical paths, that is, the optical path difference is not greater than the coherence length of the light source. Therefore, the embodiment of the present application sets multiple reference points to move the first lens assembly 300 to the reference point, and receives the interference signal sent by the fiber coupler 200 at each reference point. By changing the length of the reference arm, the optical path difference between the sample arm and the reference arm is adjusted to achieve scanning of the sample depth, which is convenient for subsequent tomographic imaging in the depth direction.

[0067] Step S103 , determining the phase delays of all interference signals, and determining the thickness of the glue dot to be measured according to all the phase delays.

[0068] In step S103 of some embodiments, the phase delay of all interference signals is determined, so that the depth information of the glue point to be tested can be determined through the phase delay, and the glue point thickness of the glue point to be tested can be determined based on all phase delays, thereby achieving non-destructive and high-precision detection of the glue point thickness. There is no need to use multiple objects of different heights to constantly adjust the test, which is easy to operate, improves detection efficiency, and ensures the accuracy of the detection results.

[0069] Reference Figure 3 , Figure 3 This is a specific flow chart of obtaining reference light and signal light provided by an embodiment of the present application. In some embodiments, the method includes but is not limited to steps S201 to S202.

[0070] Step S201 : controlling the light source transmitter 100 to emit a target light source, so that the target light source passes through the optical fiber coupler 200 to obtain a first light beam and a second light beam.

[0071] In step S202 , the first light beam is controlled to pass through the first lens assembly 300 and irradiate the total reflection mirror 500 to obtain reference light, and the second light beam is controlled to pass through the second lens assembly 400 and irradiate the glue point to be measured to obtain signal light.

[0072] In steps S201 to S202 of some embodiments, in the process of controlling the light source emitter 100 to emit the target light source so that the target light source is split into the first lens assembly 300 and the second lens assembly 400 through the optical fiber coupler 200, the embodiment of the present application controls the light source emitter 100 to emit the target light source so that the target light source forms two beams of light through the optical fiber coupler 200 to obtain a first light beam and a second light beam, and then controls the first light beam to pass through the first lens assembly 300 to irradiate the total reflection mirror 500 to obtain reference light, and controls the second light beam to pass through the second lens assembly 400 to irradiate the glue point to be tested to obtain signal light, thereby realizing irradiation of the first total reflection mirror 500 and the glue point to be tested.

[0073] Reference Figure 4, Figure 4 This is a specific flow chart of receiving the interference signal sent by the optical fiber coupler 200 at each reference point provided by an embodiment of the present application. In some embodiments, the method includes but is not limited to steps S401 to S404.

[0074] It should be noted that the reference points include a first reference point, a second reference point and a third reference point, and the distances between the first reference point, the second reference point and the third reference point and the optical fiber coupler 200 increase in sequence.

[0075] In step S401 , the first lens assembly 300 is moved to a first reference point, so that the fiber coupler 200 combines the first reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured, thereby generating a first interference signal.

[0076] In step S402 , the first lens assembly 300 is moved to the second reference point, so that the fiber coupler 200 combines the second reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured, thereby generating a second interference signal.

[0077] In step S403 , the first lens assembly 300 is moved to the third reference point, so that the fiber coupler 200 combines the third reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured, thereby generating a third interference signal.

[0078] Step S404 : receiving a first interference signal generated by the optical fiber coupler 200 at the first reference point, a second interference signal generated at the second reference point, and a third interference signal generated at the third reference point.

[0079] In some embodiments, in steps S401 to S404, the embodiments of the present application obtain interference signals under different reference arms by changing the optical path of the reference arm. Specifically, the embodiments of the present application first move the first lens assembly 300 to the first reference point so that the fiber coupler 200 combines the first reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured to generate a first interference signal. Then, the optical path of the reference arm is changed, and the first lens assembly 300 is moved to the second reference point so that the fiber coupler 200 combines the second reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured to generate a second interference signal. Then, the first lens assembly 300 is moved to the third reference point so that the fiber coupler 200 The third reference light reflected by the total reflection mirror 500 and the signal light reflected by the glue point to be measured are merged to generate a third interference signal, so that interference signals with different optical path differences can be received through the fiber optic coupler 200, and then the first interference signal generated by the fiber optic coupler 200 at the first reference point, the second interference signal generated at the second reference point, and the third interference signal generated at the third reference point are received. The embodiment of the present application adjusts the optical path difference between the sample arm and the reference arm by changing the length of the reference arm, thereby realizing scanning of the sample depth, which facilitates subsequent tomographic imaging in the depth direction.

[0080] Reference Figure 5 , Figure 5 5. In some embodiments, the method includes but is not limited to steps S501 to S502.

[0081] Step S501: Acquire the light source wavelength and light source bandwidth of the target light source.

[0082] Step S502 : For each interference signal, the phase difference of the interference signal is detected according to the wavelength and bandwidth of the light source to obtain the phase delay of the interference signal.

[0083] In steps S501 to S502 of some embodiments, in the process of determining the phase delay of all interference signals, since the light signal will be reflected back after being emitted and passing through the colloid, but the thickness of each colloid is different, the time of reflection will be different. The embodiment of the present application first obtains the light source wavelength and light source bandwidth of the target light source, and for each interference signal, detects the phase difference of the interference signal according to the light source wavelength and light source bandwidth, thereby obtaining the phase delay of the interference signal, so that the depth information of the glue point to be measured can be determined through the phase delay, and the thickness of the glue point to be measured can be further measured.

[0084] Reference Figure 6 , Figure 6This is a specific flow chart of determining the thickness of a glue point to be measured based on all phase delays provided by an embodiment of the present application. In some embodiments, the method includes but is not limited to steps S601 to S604.

[0085] Step S601: determining a tomographic image corresponding to the interference signal according to the phase delay.

[0086] Step S602 : obtaining a transverse scanning image and a longitudinal scanning image of the glue point to be tested by a preset optical coherence tomography technique, and extracting a transverse feature descriptor of the transverse scanning image and a longitudinal feature descriptor of the longitudinal scanning image according to a preset feature detection algorithm.

[0087] Step S603 : performing matching calculation on the horizontal feature descriptor and the vertical feature descriptor to obtain a fused image.

[0088] Step S604: determining the thickness of the glue point to be measured based on the fused image and the tomographic image.

[0089] In some embodiments, in steps S601 to S604, in the process of determining the thickness of the glue dot to be tested based on all phase delays, the embodiments of the present application first determine the tomographic image corresponding to the interference signal based on the phase delay, thereby achieving dynamic detection of the glue dot to be tested, improving the image resolution, and allowing more subtle structures to be revealed. Then, a preset optical coherence tomography technology is used to obtain a horizontal scanning image and a vertical scanning image of the glue dot to be tested, thereby quickly obtaining three-dimensional morphological information of the sample. Horizontal feature descriptors of the horizontal scanning image and vertical feature descriptors of the vertical scanning image are extracted based on a preset feature detection algorithm to achieve accurate feature extraction and avoid interference from redundant information. Thereafter, a matching calculation is performed on the horizontal feature descriptors and the vertical feature descriptors to obtain a fused image. By fusing images from different perspectives or under different imaging conditions, the image quality and information content can be improved, making the image clearer and more detailed. The glue dot thickness of the glue dot to be tested is then determined based on the fused image and the tomographic image, thereby achieving non-destructive and high-precision detection of the glue dot thickness. This eliminates the need to use multiple objects of different heights for constant adjustment of the test, facilitates operation, improves detection efficiency, and ensures the accuracy of the detection results.

[0090] It should be noted that the feature detection algorithm in the embodiment of the present application may be the ORB (Oriented FAST and Rotated BRIEF) algorithm. In the process of performing matching calculations on the horizontal feature descriptors and the vertical feature descriptors, the embodiment of the present application may use the BFMatcher (Brute-Force Matcher) for brute-force matching and employ K-nearest neighbor and ratio tests to filter the matches to improve matching accuracy.

[0091] Reference Figure 7 , Figure 7 This is a specific flow chart of determining a tomographic image corresponding to an interference signal according to a phase delay according to an embodiment of the present application. In some embodiments, the method includes but is not limited to steps S701 to S702.

[0092] Step S701 : extracting depth information of the glue point to be measured from the interference signal according to the phase delay.

[0093] Step S702 : performing phase calculation on the depth information using a preset image processing algorithm to obtain a tomographic image.

[0094] In steps S701 to S702 of some embodiments, in the process of determining the tomographic image corresponding to the interference signal based on the phase delay, the embodiment of the present application first extracts the depth information of the glue point to be tested from the interference signal based on the phase delay to obtain the fine structure of the glue point to be tested, and then performs phase solution on the depth information through a preset image processing algorithm. Specifically, the embodiment of the present application can perform phase solution on the depth information through an eight-step phase shifting method to reconstruct a better two-dimensional image and obtain a tomographic image, thereby realizing dynamic detection of the glue point to be tested and being able to detect real-time imaging of the glue point to be tested.

[0095] It should be noted that in the process of phase solving the depth information through the eight-step phase shifting method, the embodiment of the present application first uses the eight-step phase shifting method to solve the phase information of each pixel in the depth information, and then reconstructs the tomographic image of the sample based on the phase information, thereby improving the resolution of the image and allowing more subtle structures to be revealed.

[0096] Reference Figure 8 , Figure 8 This is a specific flow chart of determining the thickness of a glue point to be measured based on a fused image and a tomographic image provided by an embodiment of the present application. In some embodiments, the method includes but is not limited to steps S801 to S803.

[0097] Step S801: pre-processing the tomographic image and the fused image.

[0098] Step S802 : performing structural analysis on the pre-processed fused image to obtain the three-dimensional structure of the glue point to be tested.

[0099] Step S803 , determining the thickness of the glue point to be measured according to the pre-processed tomographic image and the three-dimensional structure.

[0100] In some embodiments, in steps S801 to S803, in the process of determining the thickness of the glue point to be measured based on the fused image and the tomographic image, the embodiment of the present application first pre-processes the tomographic image and the fused image. Specifically, the pre-processing operations of the tomographic image and the fused image in the embodiment of the present application include but are not limited to denoising, contrast enhancement, etc. to improve image quality. Then, the pre-processed fused image is subjected to structural analysis. Specifically, the fused image is scanned, multiple pixels in the fused image are analyzed, and a descriptor with rotation invariance is generated. Then, matching is performed through the Hamming distance to obtain the three-dimensional structure of the glue point to be measured, thereby achieving real-time tracking of the target. Thereafter, the glue point thickness of the glue point to be measured is determined based on the pre-processed tomographic image and the three-dimensional structure. Specifically, the light amplitude information in the tomographic image is used as a weight to locate the centroid of the sample defects and each boundary, and the system axial pixel resolution corresponding to the intensity centroid method is calibrated to achieve non-destructive and high-precision measurement of the optical thickness between defects and each boundary of the transparent medium sample. Finally, based on OCT (Optical Coherence Tomography (Optical Coherence Tomography) detects the light pattern and sample optical thickness to restore the physical thickness of the sample, achieving non-destructive and high-precision detection of glue point thickness. It does not require the use of multiple objects at different heights to constantly adjust the test. It is easy to operate, improves detection efficiency, and ensures the accuracy of the test results.

[0101] See also Figure 9 , Figure 9 The hardware structure of the controller 600 provided in the embodiment of the present application is illustrated. The controller includes:

[0102] The processor 901 may be implemented using a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is configured to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0103] The memory 902 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 902 can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program codes are stored in the memory 902 and are called by the processor 901 to execute the glue dot thickness detection method of the embodiments of this application.

[0104] Input / output interface 903, used to implement information input and output;

[0105] Communication interface 904, used to implement communication interaction between this device and other devices, which can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, Wi-Fi, Bluetooth, etc.);

[0106] Bus 905 , which transmits information between various components of the device (e.g., processor 901 , memory 902 , input / output interface 903 , and communication interface 904 );

[0107] The processor 901 , the memory 902 , the input / output interface 903 and the communication interface 904 are connected to each other in communication within the device via a bus 905 .

[0108] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the above-mentioned glue dot thickness detection method is implemented.

[0109] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0110] The embodiments described in the embodiments of this application are intended to more clearly illustrate the technical solutions of the embodiments of this application and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0111] It will be understood by those skilled in the art that Figure 1-9 The technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than those shown in the figures, or a combination of certain steps, or different steps.

[0112] The system embodiment described above is merely illustrative. The units described as separate components may or may not be physically separate, i.e., they may be located in one place or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of this embodiment.

[0113] Those skilled in the art will appreciate that all or some of the steps in the methods, systems, and functional modules / units in the devices disclosed above may be implemented as software, firmware, hardware, or appropriate combinations thereof.

[0114] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0115] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0116] In the several embodiments provided in this application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of the above units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of systems or units, which can be electrical, mechanical or other forms.

[0117] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0118] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0119] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, and other media that can store programs.

[0120] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A method for detecting glue point thickness, characterized in that: Applied to a light source device, the light source device includes a light source transmitter, a fiber coupler, a first lens assembly, a second lens assembly and a total reflection mirror; the method includes: Controlling the light source transmitter to emit a target light source so that the target light source is split by the optical fiber coupler to the first lens assembly and the second lens assembly to obtain a reference light and a signal light, wherein the reference light is used to illuminate the total reflection mirror, and the signal light is used to illuminate the glue point to be measured; Setting a plurality of reference points to move the first lens assembly to the reference points, and receiving an interference signal sent by the optical fiber coupler at each of the reference points, wherein the interference signal is obtained by combining the reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured through the optical fiber coupler; The phase delays of all the interference signals are determined, and the glue dot thickness of the glue dot to be measured is determined according to all the phase delays.

2. The method for detecting glue point thickness according to claim 1, wherein: The controlling the light source transmitter to emit a target light source so that the target light source is split through the optical fiber coupler to the first lens assembly and the second lens assembly to obtain reference light and signal light includes: Controlling the light source transmitter to emit a target light source so that the target light source passes through the optical fiber coupler to obtain a first light beam and a second light beam; The first light beam is controlled to pass through the first lens assembly and irradiate the total reflection mirror to obtain reference light, and the second light beam is controlled to pass through the second lens assembly and irradiate the glue point to be measured to obtain signal light.

3. The method for detecting glue point thickness according to claim 1, wherein: The reference points include a first reference point, a second reference point, and a third reference point, and the distances between the first reference point, the second reference point, and the third reference point and the optical fiber coupler are increased in sequence; setting a plurality of reference points to move the first lens assembly to the reference points, and receiving the interference signal sent by the optical fiber coupler at each reference point, comprises: Moving the first lens assembly to the first reference point so that the optical fiber coupler combines the first reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a first interference signal; Moving the first lens assembly to the second reference point so that the optical fiber coupler combines the second reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a second interference signal; Moving the first lens assembly to the third reference point so that the optical fiber coupler combines the third reference light reflected by the total reflection mirror and the signal light reflected by the glue point to be measured to generate a third interference signal; A first interference signal generated by the optical fiber coupler at the first reference point, a second interference signal generated at the second reference point, and a third interference signal generated at the third reference point are received.

4. The method for detecting glue point thickness according to claim 1, wherein: Determining the phase delays of all the interference signals comprises: Obtaining the light source wavelength and light source bandwidth of the target light source; For each of the interference signals, the phase difference of the interference signal is detected according to the wavelength of the light source and the bandwidth of the light source to obtain the phase delay of the interference signal.

5. The method for detecting glue point thickness according to claim 1, wherein: The step of determining the thickness of the glue point to be measured according to all the phase delays includes: determining a tomographic image corresponding to the interference signal according to the phase delay; Acquire a transverse scanning image and a longitudinal scanning image of the glue point to be tested by a preset optical coherence tomography technique, and extract a transverse feature descriptor of the transverse scanning image and a longitudinal feature descriptor of the longitudinal scanning image according to a preset feature detection algorithm; performing matching calculation on the horizontal feature descriptor and the vertical feature descriptor to obtain a fused image; The glue point thickness of the glue point to be measured is determined according to the fused image and the tomographic image.

6. The method for detecting glue point thickness according to claim 5, wherein: The determining of the tomographic image corresponding to the interference signal according to the phase delay includes: extracting depth information of the glue point to be measured from the interference signal according to the phase delay; The depth information is subjected to phase analysis using a preset image processing algorithm to obtain a tomographic image.

7. The method for detecting glue point thickness according to claim 5, characterized in that: The step of determining the thickness of the glue point to be measured according to the fused image and the tomographic image includes: Preprocessing the tomographic image and the fused image; Performing structural analysis on the pre-processed fusion image to obtain the three-dimensional structure of the glue point to be tested; The glue point thickness of the glue point to be measured is determined according to the preprocessed tomographic image and the three-dimensional structure.

8. A controller, characterized in that: The controller includes a memory and a processor, the memory stores a computer program, and the processor implements the glue dot thickness detection method according to any one of claims 1 to 7 when executing the computer program.

9. A light source device, characterized in that: The light source device includes a light source transmitter, a fiber coupler, a first lens assembly, a second lens assembly, a total reflection mirror and the controller as claimed in claim 8.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the glue dot thickness detection method according to any one of claims 1 to 7.

Images