Composition, film, optical filter, and solid-state imaging element

By using the composition of infrared absorbing pigment, specific compound B and resin C, a dense crosslinking structure is formed, which solves the problem of insufficient solvent resistance of infrared absorbing pigment film at low temperatures, and improves solvent resistance and adhesion.

CN120469154APending Publication Date: 2025-08-12FUJIFILM CORP
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Patent Information

Application Number
CN202510122480.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-02-09
Filing Date
2025-01-24
Publication Date
2025-08-12

AI Technical Summary

Technical Problem

In the prior art, the infrared-absorbing pigment film is insufficient in curing when filming at low temperatures, resulting in poor solvent resistance and difficulty in taking into account various resistances such as heat, light, free radicals and oxidation.

Method used

Using a composition containing infrared absorbing pigments, specific compound B and resin C, Compound B is heated at 170°C for 5 minutes to form an isocyanate group, forming a dense crosslinked structure, resin C has a hydroxyl group or a carboxy group, and is cured at low temperature using a solvent.

Benefits of technology

The film with excellent solvent resistance is formed at a low temperature, which improves the light resistance of the film and its adhesion to the support, and is suitable for photolithography of fine-grained patterns.

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Abstract

Provided are a composition capable of forming a film having excellent solvent resistance, a film, an optical filter, and a solid-state imaging element. The composition comprises: an infrared absorbing dye; a compound B having a molecular weight of 4000 or less, said compound containing two or more groups represented by formula (BI-1) in the molecule, and generating an isocyanate group by heating at 170 DEG C for 5 minutes; a resin C having at least one group selected from the group consisting of a hydroxyl group and a carboxyl group; and a solvent. # imgabs0 #
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Description

Technical Field

[0001] The present invention relates to a composition containing an infrared absorbing pigment, and also to a film, an optical filter, and a solid-state imaging element using the composition containing an infrared absorbing pigment. Background Art

[0002] Video cameras, digital cameras, mobile phones with camera functions, and the like use solid-state imaging elements (CCDs) or CMOSs (complementary metal oxide semiconductors) to capture color images. These solid-state imaging elements utilize silicon photodiodes, which are sensitive to infrared light, in their light-receiving sections. Therefore, infrared cutoff filters are sometimes used to correct for visibility.

[0003] The infrared cut filter is produced using a composition containing an infrared absorbing pigment and a resin.

[0004] Patent Document 1 describes a method for producing an infrared cutoff filter, etc. using a photosensitive composition, wherein the photosensitive composition comprises a near-infrared absorbing pigment (A), a resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), wherein the resin (B) comprises a resin (B1) having a monomer unit (b1) containing a blocked isocyanate group and a monomer unit (b2) containing an acidic group.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2023-050814

[0006] The longer the wavelength of a dye compound's absorption, the narrower its band gap becomes. This makes it difficult to achieve a HOMO (Highest Occupied Molecular Orbital)-LUMO (Lowest Unoccupied Molecular Orbital) energy level that balances various resistances (heat, light, free radicals, oxidation, reduction, etc.). Consequently, infrared-absorbing dyes are susceptible to decomposition due to heat and other factors. Consequently, research is underway to achieve film formation at lower temperatures when using compositions containing infrared-absorbing dyes and resins to form films.

[0007] However, when a film is formed by film deposition at a low temperature, the curability of the film may be insufficient, and the solvent resistance of the obtained film has room for further improvement.

[0008] According to the research of the present inventors, it was found that the solvent resistance of the film obtained from the composition disclosed in Patent Document 1 was also insufficient, and there was room for further improvement. Summary of the Invention

[0009] Therefore, an object of the present invention is to provide a composition capable of forming a film having excellent solvent resistance. Another object of the present invention is to provide a film, an optical filter, and a solid-state imaging element.

[0010] The present invention provides the following contents.

[0011] <1> A composition comprising:

[0012] infrared absorbing pigments;

[0013] Compound B, which is a compound containing two or more groups represented by formula (BI-1) in the molecule and generating an isocyanate group by heating at 170° C. for 5 minutes, and has a molecular weight of 4000 or less;

[0014] Resin C having at least one group selected from a hydroxyl group and a carboxyl group; and

[0015] solvents,

[0016] [Chemical Formula 1]

[0017]

[0018] In formula (BI-1), the wavy line represents a connecting bond, and R represents a residue derived from a compound selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, triazole compounds, and imide compounds.

[0019] <2> according to <1> The composition, wherein

[0020] R in the above formula (BI-1) is a group represented by any of the formulas (RB-1) to (RB-5),

[0021] [Chemical Formula 2]

[0022]

[0023] In the formula, * represents a connecting bond, R B-1 ~R B-11 Each independently represents a hydrogen atom or a substituent,

[0024] R B-1 With R B-2 can bond to each other to form a ring,

[0025] R B-10 With R B-11 They may be bonded to each other to form a ring.

[0026] <3> according to <1> or <2> The composition, wherein

[0027] The compound B is a compound represented by formula (b-1) or formula (b-2),

[0028] [Chemical Formula 3]

[0029]

[0030] In formula (b-1), R b1 and R b2 Each independently represents a group represented by the above formula (BI-1),

[0031] L b1 represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group,

[0032] In formula (b-2), R b11 represents a group represented by the above formula (BI-1),

[0033] R b12 represents a hydrogen atom or a substituent,

[0034] L b11 represents an m+n valence linking group,

[0035] L b21 and L b22 Each independently represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group,

[0036] m represents an integer greater than or equal to 2,

[0037] n represents an integer greater than or equal to 0,

[0038] m+n is an integer of 3 or greater.

[0039] <4> according to <3> The composition, wherein

[0040] L in the above formula (b-2) b11 is a group represented by any of formulae (L-1) to (L-5),

[0041] [Chemical Formula 4]

[0042]

[0043] The wavy lines in the formula represent connecting bonds.

[0044] <5> according to <1> to <4> The composition described in any one of the preceding claims, wherein

[0045] The molecular weight of the compound B is 2500 or less.

[0046] <6> according to <1> to <5> The composition described in any one of the preceding claims, wherein

[0047] The compound B is a compound that generates an isocyanate group by heating at 70 to 150° C. for 5 minutes.

[0048] <7> according to <1> to <6> The composition described in any one of the preceding claims, wherein

[0049] The infrared absorbing pigment is at least one selected from pyrrolopyrrole compounds, squaric acid compounds, crotonium compounds, polymethine compounds, indigo compounds, phthalocyanine compounds, naphthalocyanine compounds, imine compounds, quartacene compounds, ammonium compounds, azo compounds, anthraquinone compounds, porphyrin compounds, oxocyanine compounds and hexa-membered porphyrin compounds.

[0050] <8> according to <1> to <7> The composition described in any one of the preceding claims, wherein

[0051] The above composition satisfies the conditions of formula (1-1).

[0052] 0.2≤((B 1 ×M b1 ) / (C 1 ×M c1 ))≤2.0…(1-1)

[0053] In formula (1-1), B 1 is the content of the group represented by formula (BI-1) in compound B (mmol / g),

[0054] M b1 is the content of compound B in the composition (mass %),

[0055] C 1 is the total content of hydroxyl and carboxyl groups of resin C (mmol / g),

[0056] M c1 is the content (mass %) of resin C in the composition.

[0057] <9> according to <1> to <8> The composition described in any one of the preceding claims further comprises a polymerizable compound.

[0058] <10> A membrane which is used <1> to <9> The composition described in any one of the above is obtained.

[0059] <11> A filter having <10> The membrane.

[0060] <12> A solid-state imaging element having <10> The membrane.

[0061] Effects of the Invention

[0062] The present invention can provide a composition capable of forming a film having excellent solvent resistance, a film, an optical filter, and a solid-state imaging element. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 It is a schematic diagram showing one embodiment of an infrared sensor. DETAILED DESCRIPTION

[0064] Hereinafter, the contents of the present invention will be described in detail.

[0065] In this specification, “to” is used to mean that the numerical values described before and after it are inclusive as the lower limit and the upper limit.

[0066] In the description of groups (atomic groups), the term "unsubstituted" or "unsubstituted" includes both groups (atomic groups) without substitution and groups (atomic groups) with substitution. For example, "alkyl" includes not only alkyl groups without substitution (unsubstituted alkyl groups) but also alkyl groups with substitution (substituted alkyl groups).

[0067] In this specification, "exposure" includes not only exposure using light, but also drawing using a particle beam such as an electron beam or an ion beam, unless otherwise specified. Examples of light used for exposure include active light or radiation such as the bright line spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light (EUV light), X-rays, and electron beams.

[0068] In this specification, “(meth)acrylate” means both or either acrylate and methacrylate, “(meth)acrylic acid” means both or either acrylic acid and methacrylic acid, and “(meth)acryloyl” means both or either acryloyl and methacryloyl.

[0069] In this specification, the weight average molecular weight and the number average molecular weight are defined as polystyrene equivalent values measured by gel permeation chromatography (GPC).

[0070] In the present specification, Me in the chemical formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.

[0071] In this specification, infrared rays refer to light (electromagnetic waves) with a wavelength of 700 to 2500 nm.

[0072] In this specification, the total solid content refers to the total mass of all components of the composition excluding the solvent.

[0073] In this specification, the term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved.

[0074] <Composition>

[0075] The composition of the present invention is characterized by comprising:

[0076] infrared absorbing pigments;

[0077] Compound B, which is a compound containing two or more groups represented by formula (BI-1) in the molecule and generating an isocyanate group by heating at 170° C. for 5 minutes, and has a molecular weight of 4000 or less;

[0078] Resin C has at least one group selected from a hydroxyl group and a carboxyl group; and

[0079] solvent.

[0080] The composition of the present invention can form a film having excellent solvent resistance. In particular, even when the film is formed at a low temperature of 150° C. or lower (preferably 120° C. or lower), a film having excellent solvent resistance can be formed.

[0081] Although the detailed reasons for obtaining such an effect are unclear, they can be inferred as follows. The composition of the present invention includes an infrared absorbing pigment and further includes the above-mentioned compound B. Therefore, it is inferred as follows: when the composition is heated to cure, the heat is not easily dissipated, and by effectively utilizing heat, the group represented by the formula (BI-1) in the above-mentioned compound B is separated from the group R and an isocyanate group is easily generated, and the curing of the composition proceeds rapidly, and a fully cured film can be formed even when heated at a relatively low temperature. Furthermore, it is inferred that the above-mentioned compound B is a relatively low-molecular compound having two or more groups represented by the formula (BI-1), so the isocyanate group generated by the compound B can react with the hydroxyl group or carboxyl group of the resin C to form a dense cross-linked structure. For this reason, it can be inferred that by using the composition of the present invention, a film with excellent solvent resistance can be formed.

[0082] Infrared-absorbing dyes generally tend to have low light resistance. However, the composition of the present invention, even when containing an infrared-absorbing dye, can form a film with excellent light resistance, suppressing fluctuations in spectral characteristics caused by light irradiation. This effect is presumably achieved because a dense cross-linked structure is formed in the film by compound B and resin C.

[0083] Furthermore, the composition of the present invention can form a film with excellent adhesion to a support. In particular, when patterning by photolithography, even when the pattern size is further miniaturized, a film with excellent adhesion to a support can be formed. It is speculated that this effect is achieved because the dense cross-linked structure formed in the film by compound B and resin C is obtained.

[0084] The composition of the present invention preferably satisfies the conditions of formula (1-1), more preferably satisfies the conditions of formula (1-2), and further preferably satisfies the conditions of formula (1-3). According to this embodiment, a denser cross-linked structure can be formed in the film by compound B and resin C, and a film with better solvent resistance can be formed.

[0085] 0.2≤((B 1 ×M b1 ) / (C 1 ×M c1 ))≤2.0…(1-1)

[0086] 0.25≤((B 1 ×M b1 ) / (C 1 ×M c1 ))≤1.8…(1-2)

[0087] 0.3≤((B 1 ×M b1 ) / (C 1 ×M c1 ))≤1.5…(1-3)

[0088] In formulas (1-1) to (1-3), B 1 is the content of the group represented by formula (BI-1) in compound B (mmol / g),

[0089] M b1 is the content of compound B in the composition (mass %),

[0090] C 1 is the total content of hydroxyl and carboxyl groups of resin C (mmol / g),

[0091] M c1 is the content (mass %) of resin C in the composition.

[0092] The composition of the present invention can be used as a composition for an optical filter. Examples of optical filters include infrared cut filters and infrared transmission filters. The compound represented by formula (1) has excellent visible light transmittance and infrared shielding properties, and therefore the composition of the present invention is particularly preferably used as a composition for an infrared cut filter.

[0093] Hereinafter, each component used in the composition of the present invention will be described.

[0094] Infrared absorbing pigments

[0095] The composition of the present invention contains an infrared absorbing pigment. The infrared absorbing pigment is preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 2000 nm. The maximum absorption wavelength of the infrared absorbing pigment is preferably in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1600 nm, and even more preferably in the wavelength range of 700 to 1200 nm.

[0096] The infrared absorbing dye may be either a pigment or a dye. In the case of a dye, the solubility in 100 g of propylene glycol methyl ether acetate at 25° C. is preferably 1 g or more, more preferably 2 g or more, and even more preferably 5 g or more.

[0097] Examples of infrared absorbing pigments include pyrrolopyrrole compounds, squarylium compounds, crotonium compounds, polymethine compounds, indigo compounds, phthalocyanine compounds, naphthalocyanine compounds, imine compounds, quaterylene compounds, ammonium compounds, azo compounds, anthraquinone compounds, porphyrin compounds, oxocyanine compounds, and hexaphyrin compounds. Preferably, the pigment is at least one selected from the group consisting of pyrrolopyrrole compounds, squarylium compounds, polymethine compounds, indigo compounds, phthalocyanine compounds, and naphthalocyanine compounds.

[0098] Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614, compounds described in paragraphs 0037 to 0052 of JP-A-2011-068731, and compounds described in paragraphs 0010 to 0033 of WO 2015 / 166873. Examples of the squaric acid compound include the compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, the compounds described in paragraphs 0060 to 0061 of Japanese Patent Application Laid-Open No. 6065169, the compounds described in paragraph 0040 of International Publication No. 2016 / 181987, the compounds described in paragraph 0072 of International Publication No. 2016 / 190162, and the compounds described in paragraph 0074 of Japanese Patent Application Laid-Open No. 2016-074649. The compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Publication No. 2017-067963, the compounds described in paragraph 0124 of Japanese Patent Application Publication No. 2017-135359, the compounds described in Japanese Patent Application Publication No. 2017-114956, the compounds described in Japanese Patent Application No. 6197940, the compounds described in International Publication No. 2016 / 120166, and the compounds described in Table 1 of the specification of U.S. Patent No. 11261172. Examples of the polymethine compound include the compounds described in paragraphs 0044 to 0045 of Japanese Patent Application Laid-Open No. 2009-108267, the compounds described in paragraphs 0026 to 0030 of Japanese Patent Application Laid-Open No. 2002-194040, the compounds described in Japanese Patent Application Laid-Open No. 2015-172004, the compounds described in Japanese Patent Application Laid-Open No. 2015-172102, and the compounds described in Japanese Patent Application Laid-Open No. 2008-088426. The compounds described in the Gazette, the compounds described in paragraph 0090 of International Publication No. 2016 / 190162, the compounds described in Japanese Patent Application Laid-Open No. 2017-031394, the compounds described in Japanese Patent Application Laid-Open No. 2021-134350, the compounds described in International Publication No. 2021 / 085372, and the compounds described in paragraphs 0188 to 0192 of International Publication No. 2022 / 181422. Examples of the crotonium compound include the compounds described in Japanese Patent Application Laid-Open No. 2017-082029 and the compounds described in Japanese Patent Application Laid-Open No. 2016-079331.Examples of the imine compound include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, and compounds described in paragraphs 0048 to 0063 of International Publication No. 2018 / 043564. Examples of the phthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153, titanyl phthalocyanine described in JP-A-2006-343631, compounds described in paragraphs 0013 to 0029 of JP-A-2013-195480, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and compounds described in International Publication No. 2020 / 071470. Examples of the naphthalocyanine compound include the compounds described in paragraph 0093 of JP-A-2012-077153 and the compounds described in JP-A-2022-173080.

[0099] As the infrared absorbing pigment, the squarylium compounds described in Japanese Patent Application Laid-Open No. 2017-197437, the squarylium compounds described in Japanese Patent Application Laid-Open No. 2017-025311, the squarylium compounds described in International Publication No. 2016 / 154782, the squarylium compounds described in Japanese Patent No. 5884953, the squarylium compounds described in Japanese Patent No. 6036689, the squarylium compounds described in Japanese Patent No. 5810604, the squarylium compounds described in paragraphs 0090 to 0107 of International Publication No. 2017 / 213047, the squarylium compounds described in Japanese Patent No. 5810604, the squarylium compounds described in paragraphs 0090 to 0107 of ... The pyrrole ring-containing compound described in paragraphs 0019 to 0075 of Japanese Patent Application Laid-Open No. 2018-054760, the pyrrole ring-containing compound described in paragraphs 0078 to 0082 of Japanese Patent Application Laid-Open No. 2018-040955, the pyrrole ring-containing compound described in paragraphs 0043 to 0069 of Japanese Patent Application Laid-Open No. 2018-002773, the squarylium compound having an aromatic ring at the amide α position described in paragraphs 0024 to 0086 of Japanese Patent Application Laid-Open No. 2018-041047, the amide-linked squarylium compound described in Japanese Patent Application Laid-Open No. 2017-179131, the pyrrole ring-containing compound described in Japanese Patent Application Laid-Open No. 2017-1 Compounds having a pyrrole bis-type squarylium skeleton or a crotonium skeleton as described in Japanese Patent Application Laid-Open No. 41215, dihydrocarbazole bis-type squarylium compounds as described in Japanese Patent Application Laid-Open No. 2017-082029, asymmetric compounds as described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 2017-068120, pyrrole ring-containing compounds (carbazole type) as described in Japanese Patent Application Laid-Open No. 2017-067963, phthalocyanine compounds as described in Japanese Patent Application Laid-Open No. 6251530, compounds as described in Japanese Patent Application Laid-Open No. 2019-127549, compounds as described in International Publication No. 2022 / 059619 The compounds described in JP-A-2022-151682, the compounds described in JP-A-2022-188858, the compounds described in JP-A-2022-184710, the compounds described in JP-A-2022-189736, the compounds described in International Publication No. 2023 / 052770, the compounds described in JP-A-2022-189736, the compounds described in JP-A-2023-007400, the compounds described in JP-A-2023-109541, etc.

[0100] The content of the infrared absorbing pigment in the total solid content of the composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, further preferably 1% by mass or more, even more preferably 3% by mass or more, and even more preferably 5% by mass or more. The upper limit of the content of the infrared absorbing pigment is preferably 60% by mass or less, more preferably 50% by mass or less, and even more preferably 40% by mass or less. The composition of the present invention may contain only one infrared absorbing pigment or may contain two or more infrared absorbing pigments. When containing two or more, it is preferred that their total amount reaches the above range.

[0101] 《Specified Compound (Compound B)》

[0102] The composition of the present invention is a compound containing two or more groups represented by formula (BI-1) in the molecule and generating an isocyanate group by heating at 170°C for 5 minutes, and contains compound B (hereinafter also referred to as a specific compound) having a molecular weight of 4000 or less.

[0103] [Chemical Formula 5]

[0104]

[0105] In formula (BI-1), the wavy line represents a connecting bond, and R represents a residue derived from a compound selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, triazole compounds, and imide compounds.

[0106] In this specification, "the temperature at which an isocyanate group is generated by heating" means the temperature of the endothermic peak of the deprotection reaction of the group R in the group represented by (BI-1) when measured by DSC (Differential scanning calorimetry) analysis using a differential scanning calorimeter. As a differential scanning calorimeter, for example, a differential scanning calorimeter (model: DSC6200) manufactured by Seiko Instruments Inc. can be preferably used. However, the differential scanning calorimeter is not limited to the above-mentioned differential scanning calorimeter. As a method for confirming the generation of an isocyanate group, a measurement based on infrared absorption spectroscopy can be cited. The isocyanate group has an absorption peak at 2000 to 2280 cm -1 The range shows strong absorption.

[0107] The molecular weight of the specific compound is preferably 2500 or less, more preferably 1500 or less.

[0108] The specific compound preferably has 2 to 6 groups represented by the formula (BI-1) in the molecule, and more preferably has 2 to 4 groups represented by the formula (BI-1).

[0109] The group represented by formula (BI-1) is a group having a structure in which an isocyanate group is protected by a compound selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, triazole compounds and imide compounds (hereinafter, these compounds are collectively referred to as blocking agents), and is a group having a structure in which the group does not show reactivity as an isocyanate group at room temperature (for example, 10 to 30°C), but the group derived from the above-mentioned blocking agent (R in formula (BI-1)) is separated from the group represented by formula (BI-1) by heating or the like to generate an isocyanate group.

[0110] The group represented by formula (BI-1) possessed by the specific compound is more preferably a group capable of generating an isocyanate group by heating at 70 to 150° C. for 5 minutes. That is, the specific compound is preferably a compound that generates an isocyanate group by heating at 70 to 150° C. for 5 minutes. From the viewpoint of storage stability, the lower limit of the generation temperature of the isocyanate group is preferably 75° C. or higher, more preferably 80° C. or higher. From the viewpoint of curability, the upper limit of the generation temperature of the isocyanate group is preferably 130° C. or lower, more preferably 120° C. or lower.

[0111] R in formula (BI-1) represents a residue derived from a compound selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, triazole compounds, and imide compounds. From the viewpoint of easiness of protection and deprotection reactions, it is preferably a residue derived from a compound selected from oxime compounds, lactam compounds, active methylene compounds, and pyrazole compounds, more preferably a residue derived from a compound selected from oxime compounds, active methylene compounds, and pyrazole compounds, and even more preferably a residue derived from an active methylene compound.

[0112] Examples of the oxime compound include acetone oxime, formaldehyde oxime, cyclohexane oxime, methyl ethyl ketone oxime, cyclohexanone oxime, and benzophenone oxime.

[0113] Examples of the lactam compound include ε-caprolactam and γ-butyrolactam.

[0114] Examples of the phenol compound include phenol, naphthol, cresol, xylenol, and halogen-substituted phenol.

[0115] Examples of the alcohol compound include methanol, ethanol, propanol, butanol, cyclohexanol, ethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, and lactic acid alkyl esters.

[0116] Examples of the amine compound include primary amines and secondary amines. The amine compound may be any of aromatic amines, aliphatic amines, and alicyclic amines, and specific examples include aniline, diphenylamine, ethyleneimine, and polyethyleneimine.

[0117] Examples of the active methylene compound include diethyl malonate, dimethyl malonate, ethyl acetoacetate, di-n-butyl malonate, di-2-ethylhexyl malonate, and methyl acetoacetate.

[0118] Examples of the pyrazole compound include pyrazole, methylpyrazole, dimethylpyrazole, 4-bromo-3,5-dimethylpyrazole, and 4-nitro-3,5-dimethylpyrazole.

[0119] Examples of the thiol compound include alkylthiols and arylthiols.

[0120] Examples of the imidazole compound include imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-ethyl-4-methylimidazole.

[0121] Examples of the triazole compound include 1,2,4-triazole and the like.

[0122] Examples of the imide compound include maleimide, succinimide, phthalimide, and derivatives thereof.

[0123] The molecular weight of R in formula (BI-1) is preferably 40 to 500, more preferably 50 to 300, and even more preferably 50 to 260. When the molecular weight of R is 40 or more, the detachment of R at room temperature can be suppressed, and the storage stability of the composition can be improved. When the molecular weight of R is 500 or less, R is easily detached by heating at low temperatures (e.g., 150°C or less), a curing reaction proceeds, and a fully cured cured film is easily formed. Therefore, a film with better solvent resistance can be formed.

[0124] R in formula (BI-1) is preferably a group represented by any of formulae (RB-1) to (RB-5).

[0125] [Chemical Formula 6]

[0126]

[0127] In the formula, * represents a connecting bond, R B-1 ~R B-11 Each independently represents a hydrogen atom or a substituent,

[0128] R B-1 With R B-2 can bond to each other to form a ring,

[0129] R B-10 With R B-11 They may be bonded to each other to form a ring.

[0130] R B-1 ~R B-6 、R B-10 and R B-11 Preferably, it is a substituent.

[0131] R B-7 ~R B-9 Preferred is a hydrogen atom or a substituent.

[0132] As R B-1 ~R B-11 Examples of the substituent represented by include an alkyl group, an aryl group, a halogen atom, a nitro group, and the like, and an alkyl group is preferred.

[0133] R in formula (RB-1) B-1 and R B-2 They may be bonded to each other to form a ring.

[0134] R in formula (RB-5) B-10 and R B-11 They may be bonded to each other to form a ring.

[0135] The ring formed above is preferably a 5-membered ring or a 6-membered ring.

[0136] R in formula (BI-1) is preferably a residue derived from a compound selected from methyl ethyl ketoxime, dimethylpyrazole, diethyl malonate, dimethyl malonate, ethyl acetoacetate, and methyl acetoacetate, and more preferably a residue derived from a compound selected from dimethylpyrazole, diethyl malonate, and ethyl acetoacetate.

[0137] Specific examples of the group represented by R in formula (BI-1) include the following groups: * in the formula represents a connecting bond.

[0138] [Chemical Formula 7]

[0139]

[0140] Specific examples of the group represented by formula (BI-1) include the following groups: The wavy line in the formula represents a connecting bond.

[0141] [Chemical Formula 8]

[0142]

[0143] The specific compound is preferably a compound represented by formula (b-1) or formula (b-2).

[0144] [Chemical Formula 9]

[0145]

[0146] In formula (b-1), R b1 and R b2 Each independently represents a group represented by the above formula (BI-1),

[0147] L b1 represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group,

[0148] In formula (b-2), R b11 represents a group represented by the above formula (BI-1),

[0149] R b12 represents a hydrogen atom or a substituent,

[0150] L b11 represents an m+n valence linking group,

[0151] L b21 and L b22 Each independently represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group,

[0152] m represents an integer greater than or equal to 2,

[0153] n represents an integer greater than 0,

[0154] m+n is an integer greater than or equal to 3.

[0155] R in formula (b-1) b1 、R b2 And R in formula (b-2) b11 Each independently represents a group represented by the above formula (BI-1).

[0156] L in formula (b-1) b1 、L of formula (b-2) b21 and L b22 Each independently represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group.

[0157] The aromatic hydrocarbon group preferably has 6 to 20 carbon atoms, more preferably 6 to 15 carbon atoms.

[0158] The cyclic aliphatic hydrocarbon group is preferably a 5- to 7-membered aliphatic hydrocarbon group, more preferably a 5- or 6-membered aliphatic hydrocarbon group, and even more preferably a 6-membered aliphatic hydrocarbon group.

[0159] The aromatic hydrocarbon group preferably has 6 to 20 carbon atoms, more preferably 6 to 15. The branched aliphatic hydrocarbon group preferably has 3 to 20 carbon atoms, more preferably 3 to 15. The branched aliphatic hydrocarbon group preferably has 2 to 10 branches, more preferably 2 to 6.

[0160] As L in formula (b-1) b1 、L of formula (b-2) b21 and L b22 Examples of the divalent linking group represented by include:

[0161] Aromatic hydrocarbon groups;

[0162] Cyclic aliphatic hydrocarbon group;

[0163] branched aliphatic hydrocarbon groups; and

[0164] A group formed by combining a linear or branched aliphatic hydrocarbon group with at least one selected from an aromatic hydrocarbon group and a cyclic aliphatic hydrocarbon group, and the like.

[0165] As L in formula (b-1) b1 、L of formula (b-2) b21 and L b22 Specific examples of the divalent linking group represented by include the following groups: The wavy line in the formula represents a linking bond.

[0166] [Chemical Formula 10]

[0167]

[0168] L in formula (b-2) b11 The m+n valent linking group includes a hydrocarbon group, a heterocyclic group, a -NR L101 -, -N<, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR L101 CO- and -CONR L1 0 1 - and groups formed by combining two or more of them. L101 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.

[0169] Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be any of linear, branched, and cyclic. Furthermore, a cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Furthermore, a cyclic aliphatic hydrocarbon group may have a cross-linked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may also have a substituent.

[0170] The heterocyclic group may be a non-aromatic or aromatic group. It is preferably a 5-membered or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen, oxygen, and sulfur atoms. The number of heteroatoms in the heterocyclic group is preferably 1 to 3. It may be a monocyclic or condensed ring. It may optionally have a substituent.

[0171] L in formula (b-2) b11 It is preferably a group represented by any of formulae (L-1) to (L-5), and more preferably a group represented by any of formulae (L-1), (L-3) or (L-5).

[0172] [Chemical Formula 11]

[0173]

[0174] The wavy lines in the formula represent connecting bonds.

[0175] R in formula (b-2) b12 represents a hydrogen atom or a substituent. b12 Examples of the substituents include an alkyl group, an aryl group, and a group represented by the formula (R-101).

[0176] -NHC0-L b201 -R b201 …(R-101)

[0177] In formula (R-101), L b201 represents a single bond or a divalent linking group, R b201 represents a hydrogen atom or a substituent.

[0178] As L b201 Examples of the divalent linking group represented by include a hydrocarbon group, a heterocyclic group, -CO-, -O-, -NH-, -COO-, -OCO-, -S-, -, and a group formed by combining two or more of these.

[0179] As R b201Examples of the substituents include an alkyl group, an aryl group, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

[0180] In formula (b-2), m represents an integer of 2 or greater, and preferably an integer of 3 or greater. The upper limit of m is preferably 6 or less, more preferably 5 or less, and even more preferably 4 or less.

[0181] n in formula (b-2) represents an integer of 0 or greater, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.

[0182] In formula (b-2), m+n is an integer of 3 or greater, preferably an integer of 3 to 6, more preferably 3 or 4, and even more preferably 3.

[0183] The method for producing the specific compound is not particularly limited and can be produced by a known method or by reference to a known method. For example, it can be produced by reference to the method described in paragraph 0296 of International Publication No. 2021 / 241557.

[0184] Specific examples of the specific compounds include compounds A-1 to A-16 and B-1 to B-16 shown below. The molecular weight of each compound is recorded in the "Molecular Weight" column, the content (mmol / g) of the group represented by the above formula (BI-1) in each compound is recorded in the "BI Group Content" column, and the isocyanate group formation temperature (°C) of each compound is recorded in the "NCO Formation Temperature" column.

[0185] [Chemical Formula 12]

[0186] R 2 -L 1 -R 1

[0187] [Table 1]

[0188] <![CDATA[L 1 ]]> <![CDATA[R 1 ]]> <![CDATA[R 2 ]]> Molecular weight BI base content NCO generation temperature A-1 Lb-1 R-1 R-1 342 5.84 140℃ A-2 Lb-2 R-2 R-2 455 4.40 120℃ A-3 Lb-2 R-3 R-3 387 5.17 120℃ A-4 Lb-2 R-1 R-1 368 5.43 140℃ A-5 Lb-2 R-4 R-4 515 3.89 120℃ A-6 Lb-3 R-3 R-3 380 5.26 120℃ A-7 Lb-3 R-4 R-4 509 3.93 120℃ A-8 Lb-4 R-4 R-4 571 3.51 120℃ A-9 Lb-5 R-4 R-4 495 4.04 120℃ A-10 Lb-6 R-4 R-4 531 3.77 120℃ A-11 Lb-7 R-4 R-4 531 3.77 120℃ A-12 Lb-8 R-4 R-4 583 3.43 120℃ A-13 Lb-8 R-3 R-3 455 4.40 120℃ A-14 Lb-9 R-4 R-4 543 3.69 120℃ A-15 Lb-9 R-3 R-3 416 4.81 120℃

[0189] [Chemical Formula 13]

[0190]

[0191] [Table 2]

[0192] <![CDATA[L 11 ]]> <![CDATA[L 21 ]]> <![CDATA[L 22 ]]> <![CDATA[R 11 ]]> <![CDATA[R 12 ]]> m n Molecular weight BI base content NCO generation temperature A-16 L-1 Lb-11 Lb-11 R-4 R1-1 2 1 1033 1.94 120℃ B-1 L-1 Lb-12 - R-1 - 3 0 826 3.63 140℃ B-2 L-1 Lb-11 - R-4 - 3 0 1063 2.82 120℃ B-3 L-1 Lb-11 - R-2 - 3 0 973 3.08 120℃ B-4 L-1 Lb-12 - R-2 - 3 0 955 3.14 120℃ B-5 L-1 Lb-12 - R-4 - 3 0 1045 2.87 120℃ B-6 L-1 Lb-13 - R-4 - 3 0 1003 2.99 120℃ B-7 L-3 Lb-12 - R-4 - 3 0 1179 2.54 120℃ B-8 L-3 Lb-11 - R-4 - 3 0 1197 2.51 120℃ B-9 L-3 Lb-11 - R-3 - 3 0 1005 2.98 120℃ B-10 L-3 Lb-14 - R-4 - 3 0 1282 2.34 120℃ B-11 L-3 Lb-13 - R-4 - 3 0 1137 2-64 120℃ B-12 L-5 Lb-12 - R-4 - 3 0 1019 2.94 120℃ B-13 L-2 Lb-12 - R-4 - 4 0 1530 2.62 120℃ B-14 L-2 Lb-11 Lb-11 R-4 R1-1 3 1 1524 1.97 120℃ B-15 L-3 Lb-12 - R-4 - 6 0 2344 2.56 120℃ B-16 L-3 Lb-12 Lb-12 R-4 R1-1 4 2 2284 1.75 120℃

[0193] The groups described by the abbreviations in the above table are as follows: * and wavy lines in the following structural formulae represent connecting bonds.

[0194] [Chemical Formula 14]

[0195]

[0196] [Chemical Formula 15]

[0197]

[0198] [Chemical Formula 16]

[0199]

[0200] [Chemical Formula 17]

[0201]

[0202] [Chemical Formula 18]

[0203]

[0204] The content of the specific compound in the total solid content of the composition is preferably 0.1 to 80% by mass. The lower limit is preferably 0.3% by mass or more, more preferably 1% by mass or more. The upper limit is preferably 70% by mass or less, more preferably 60% by mass or less. The composition of the present invention may contain only one specific compound or may contain two or more specific compounds. When containing two or more, it is preferred that their total amount reaches the above range.

[0205] Resin

[0206] The composition of the present invention contains a resin. The resin is formulated, for example, to disperse pigments and the like in the composition or to act as a binder. A resin primarily used to disperse pigments and the like in the composition is also referred to as a dispersant. This application of the resin is merely an example, and the resin may also be used for purposes other than this.

[0207] The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4,000 or more, more preferably 5,000 or more.

[0208] As resin, can enumerate (methyl) acrylic resin, epoxy resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, vinyl acetate resin, polyvinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, polyurea resin etc..In these resins, can use 1 kind alone, can also mix and use 2 or more kinds.As cyclic olefin resin, from the viewpoint of improving heat resistance, preferably norbornene resin.As the commercial product of norbornene resin, for example, can enumerate ARTON series (for example, ARTON F4520) etc. manufactured by JSR Corporation etc. Furthermore, as the resin, the resins described in paragraphs 0091 to 0099 of International Publication No. 2022 / 065215, the resins described in Japanese Patent Application Laid-Open No. 2020-122052, the resins described in Japanese Patent Application Laid-Open No. 2020-111656, the resins described in Japanese Patent Application Laid-Open No. 2020-139021, the resins described in Japanese Patent Application Laid-Open No. 2017-138503 containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain, the resins described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, the resins described in Japanese Patent Application Laid-Open No. 2020-186325, Alkali-soluble resins described in the publication, resins represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339, copolymers containing epoxy groups and acid groups described in International Publication No. 2022 / 030445, resins described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, alkali-soluble resins described in Japanese Patent Application Laid-Open No. 2020-186325, resins represented by formula 1 described in Korean Patent Application No. 10-2020-0078339, resins described in Japanese Patent Application Laid-Open No. 2021-134350, and copolymers described in Japanese Patent Application Laid-Open No. 2020-041046. In addition, as the resin, a resin having a fluorene skeleton can also be preferably used. Examples of the resin having a fluorene skeleton include resins described in U.S. Patent Application Publication No. 2017 / 0102610.Furthermore, as the resin, the resins described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, the alkali-soluble resins described in Japanese Patent Application Laid-Open No. 2020-186325, the resin represented by Formula 1 described in Korean Patent Application Laid-Open No. 10-2020-0078339, the resins described in Japanese Patent Application Laid-Open No. 2021-134350, the resins described in Japanese Patent Application Laid-Open No. 2022-174597, the resins described in International Publication No. 2022 / The copolymer containing an epoxy group and an acid group described in JP-A-2018-135514, the resin described in JP-A-2023-033156, the resin described in JP-A-2023-030386, the resin described in JP-A-2023-027753, the resin described in JP-A-2023-074038, and the resin described in JP-A-2023-079666.

[0209] (Specific resin (resin C))

[0210] The composition of the present invention may include a resin C (hereinafter also referred to as a specific resin) having at least one group selected from a hydroxyl group and a carboxyl group. The specific resin may be a binder or a dispersant.

[0211] The weight average molecular weight of the specific resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4,000 or more, more preferably 5,000 or more.

[0212] The total content of hydroxyl groups and carboxyl groups in the specific resin is preferably 8 mmol / g or less, more preferably 4 mmol / g or less. The lower limit is preferably 0.2 mmol / g or more, more preferably 0.3 mmol / g or more.

[0213] The specific resin may be a resin having only one of a hydroxyl group and a carboxyl group, or may be a resin having both a hydroxyl group and a carboxyl group. The specific resin is preferably a resin having a carboxyl group.

[0214] When the specific resin is a resin having both a hydroxyl group and a carboxyl group, the molar ratio of the hydroxyl group to the carboxyl group in the specific resin is preferably 0.01 to 100 mol of carboxyl groups per 1 mol of hydroxyl groups. The upper limit is preferably 90 mol or less, more preferably 70 mol or less. The lower limit is preferably 0.05 mol or more, more preferably 0.1 mol or more.

[0215] The specific resin may further have an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group of the specific resin include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group.

[0216] When the specific resin has an ethylenically unsaturated bond-containing group, the content of the ethylenically unsaturated bond-containing group in the specific resin (hereinafter referred to as C=C valence) is preferably 0.1 to 2.5 mmol / g. The upper limit is preferably 2.0 mmol / g or less, more preferably 1.8 mmol / g or less. The lower limit is preferably 0.2 mmol / g or more, more preferably 0.3 mmol / g or more.

[0217] The specific resin is preferably a resin containing a repeating unit having at least one group selected from a hydroxyl group and a carboxyl group on a side chain. The repeating unit having at least one group selected from a hydroxyl group and a carboxyl group on a side chain is preferably a repeating unit represented by formula (C1-1).

[0218] [Chemical Formula 19]

[0219]

[0220] Where Y c11 represents a trivalent linking group, L c11 represents a single bond or a divalent linking group, A c11 It represents a group having at least one group selected from a hydroxyl group and a carboxyl group.

[0221] As Y c11 Examples of the trivalent linking group represented include poly(meth)acrylic acid linking groups, polyalkyleneimine linking groups, polyester linking groups, polyurethane linking groups, polyurea linking groups, polyamide linking groups, polyether linking groups, and polystyrene linking groups. Preferably, it is a poly(meth)acrylic acid linking group or a polyalkyleneimine linking group, and more preferably, it is a poly(meth)acrylic acid linking group.

[0222] As L c11 Examples of the divalent linking group represented include alkylene groups (preferably alkylene groups having 1 to 12 carbon atoms), arylene groups (preferably arylene groups having 6 to 20 carbon atoms), -NH-, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, and groups formed by combinations of two or more of these groups.

[0223] A c11 A represents a group having at least one group selected from a hydroxyl group and a carboxyl group. c11It may be a hydroxyl group or a carboxyl group, or it may be an organic group having at least one group selected from a hydroxyl group and a carboxyl group as a substituent. Examples of the organic group include hydrocarbon groups and heterocyclic groups. Examples of the hydrocarbon group include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, and groups formed by combining these groups.

[0224] The content of the repeating unit represented by formula (C1-1) is preferably 1 mol% or more, more preferably 1 to 95 mol% of all repeating units in the specific resin. The upper limit is preferably 90 mol% or less, more preferably 80 mol% or less. The lower limit is preferably 2 mol% or more, more preferably 5 mol% or more.

[0225] The specific resin may further include a repeating unit having a group containing an ethylenically unsaturated bond. When the specific resin contains a repeating unit having a group containing an ethylenically unsaturated bond, the content of the repeating unit having the group containing an ethylenically unsaturated bond is preferably 1 to 80 mol% of all repeating units of the specific resin. The upper limit is preferably 70 mol% or less, more preferably 60 mol% or less. The lower limit is preferably 2 mol% or more, more preferably 5 mol% or more.

[0226] The specific resin may contain repeating units having graft chains. In this specification, a graft chain refers to a polymer chain branching from the main chain of a repeating unit. The graft chain preferably has 40 to 10,000 atoms excluding hydrogen atoms, more preferably 50 to 2,000 atoms excluding hydrogen atoms, and even more preferably 60 to 500 atoms excluding hydrogen atoms.

[0227] The graft chain preferably comprises a repeating unit of at least one structure selected from a polyester structure, a polyether structure, a poly(meth)acrylic acid structure, a polystyrene structure, a polyurethane structure, a polyurea structure and a polyamide structure, more preferably comprises a repeating unit of at least one structure selected from a polyester structure, a polyether structure, a poly(meth)acrylic acid structure and a polystyrene structure, further preferably comprises a repeating unit of at least one structure selected from a polyester structure, a polyether structure and a poly(meth)acrylic acid structure, further preferably comprises a repeating unit of a polyester structure or a polyether structure, and particularly preferably comprises a repeating unit of a polyester structure. The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. As a substituent, an alkyl group, an alkoxy group, an alkyl thioether group and the like may be mentioned. Among them, from the viewpoint of improving the dispersibility of the pigment, a group having a steric repulsion effect is preferred, preferably an alkyl group or an alkoxy group having 5 to 30 carbon atoms. The alkyl group and the alkoxy group may be any of linear, branched and cyclic, preferably linear or branched.

[0228] The weight average molecular weight of the repeating unit having a graft chain is preferably 1,000 or more, more preferably 1,000 to 10,000, and even more preferably 1,000 to 7,500. In addition, in this specification, the weight average molecular weight of the repeating unit having a graft chain is a value calculated from the weight average molecular weight of the raw material monomers used for the polymerization of the same repeating unit. For example, the repeating unit having a graft chain can be formed by polymerizing a macromonomer. Here, the macromonomer refers to a polymer compound having a polymerizable group introduced at the end of the polymer. When a macromonomer is used to form a repeating unit having a graft chain, the weight average molecular weight of the macromonomer is equivalent to the repeating unit having a graft chain.

[0229] When the specific resin contains repeating units having graft chains, the content of the repeating units having graft chains is preferably 1 to 60 mol% of all repeating units in the specific resin. The upper limit is preferably 50 mol% or less, more preferably 40 mol% or less. The lower limit is preferably 2 mol% or more, more preferably 5 mol% or more.

[0230] (Other resins)

[0231] The composition of the present invention may further contain a resin other than the above-mentioned specific resin (hereinafter also referred to as other resin). The other resin may be a binder or a dispersant.

[0232] Other resins are also preferably graft resins. Examples of graft resins include resins having repeating units having graft chains. Examples of graft chains include the above-mentioned graft chains.

[0233] Other resins are also preferably polyimide dispersants containing nitrogen atoms in at least one of the main chain and side chains. Polyimide dispersants are preferably resins having a main chain and side chains, and at least one of the main chain and side chains has a basic nitrogen atom, the main chain containing a partial structure having a functional group with a pKa of 14 or less, and the number of atoms in the side chain is 40 to 10,000. There are no particular restrictions on the basic nitrogen atom as long as it is a basic nitrogen atom. For polyimide dispersants, reference can be made to paragraphs 0102 to 0166 of Japanese Patent Application Publication No. 2012-255128, which is incorporated herein by reference.

[0234] Other resins are also preferably resins having a structure in which multiple polymer chains are bonded to the core. Examples of such resins include dendrimers (including star polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.

[0235] Other resins are also preferably resins containing repeating units having a group containing an ethylenically unsaturated bond in a side chain. The content of repeating units having a group containing an ethylenically unsaturated bond in a side chain is preferably 10 mol% or more, more preferably 10 to 80 mol%, and even more preferably 20 to 70 mol% of all repeating units in the resin.

[0236] The resin content in the total solids content of the composition is preferably 1 to 85% by mass. The lower limit is preferably 2% by mass or more, more preferably 5% by mass or more, further preferably 7% by mass or more, and particularly preferably 10% by mass or more. The upper limit is preferably 80% by mass or less, more preferably 75% by mass or less, further preferably 70% by mass or less, and particularly preferably 40% by mass or less.

[0237] The content of the above-mentioned specific resin contained in the resin is preferably 50% by mass or more, more preferably 75% by mass or more, and even more preferably 90% by mass or more.

[0238] Solvent

[0239] The composition of the present invention contains a solvent. Examples of the solvent include water and organic solvents, with organic solvents being preferred. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For details on these, please refer to paragraph 0223 of International Publication No. 2015 / 166779, which is incorporated herein by reference. Furthermore, cyclic alkyl-substituted ester solvents and cyclic alkyl-substituted ketone solvents are also preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, Propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, 1,3-butanediol diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropyl alcohol, etc. Among these, for environmental reasons, it may be more advantageous to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents (for example, the amount can be set to 50 parts per million (ppm) or less, 10 ppm or less, or even 1 ppm or less, relative to the total amount of the organic solvent).

[0240] The metal content of the organic solvent is preferably low. For example, the metal content of the organic solvent is preferably 10 parts per billion (ppb) or less. If necessary, organic solvents with a metal content of ppt (parts per trillion) can be used. Such organic solvents are provided, for example, by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

[0241] Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) or filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene, or nylon.

[0242] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The isomers may contain only one type or multiple types.

[0243] The content of peroxide in the organic solvent is preferably 0.8 mmol / L or less, and more preferably substantially no peroxide is contained.

[0244] The content of the solvent in the composition is preferably 10 to 97% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, more preferably 95% by mass or less. The composition may contain only one solvent or only two or more solvents. When containing two or more solvents, their total amount is preferably within the above range.

[0245] Pigment Derivatives

[0246] The composition of the present invention may contain a pigment derivative. The pigment derivative may be used as a dispersing aid. A dispersing aid is a raw material used to improve the dispersibility of the pigment in the composition.

[0247] Examples of the pigment derivative include compounds having at least one structure selected from a pigment structure and a triazine structure and an acid group or a basic group.

[0248] Examples of the pigment structure include a squaric acid pigment structure, a pyrrolopyrrole pigment structure, a diketopyrrolopyrrole pigment structure, a quinacridone pigment structure, anthraquinone pigment structure, a dianthraquinone pigment structure, a benzisoindole pigment structure, a thiazine indigo pigment structure, an azo pigment structure, a quinophthalone pigment structure, a phthalocyanine pigment structure, a naphthalocyanine pigment structure, a dioxazine pigment structure, a perylene pigment structure, a perinone pigment structure, a benzimidazolone pigment structure, a benzothiazole pigment structure, a benzimidazole pigment structure, and a benzoxazole pigment structure. Preferred are the squaric acid pigment structure, the pyrrolopyrrole pigment structure, the diketopyrrolopyrrole pigment structure, the phthalocyanine pigment structure, the quinacridone pigment structure, and the benzimidazolone pigment structure, and more preferred are the squaric acid pigment structure and the pyrrolopyrrole pigment structure.

[0249] Examples of the acid group possessed by the pigment derivative include carboxyl, sulfonic, phosphoric, boric, carboxylic acid amide, sulfonic acid amide, imidic acid, and salts thereof. Examples of the atom or atomic group constituting the salt include alkali metal ions (Li + 、Na + , K + etc.), alkaline earth metal ions (Ca 2+ Mg 2+As the carboxylic acid amide group, preferably -NHCOR X1 As the sulfonic acid amide group, preferably -NHSO2R X2 As the imidic acid group, preferably -SO2NHSO2R X3 、-CONHSO2R X4 、-CONHCOR X5 or-SO2NHCOR X6 The group represented by -SO2NHSO2R is more preferably X3 . R X1 ~R X6 R and R are independently an alkyl group or an aryl group. X1 ~R X6 The alkyl group and aryl group represented may have a substituent. As the substituent, a halogen atom is preferred, and a fluorine atom is more preferred.

[0250] Examples of basic groups possessed by the pigment derivative include amino groups, pyridyl groups and their salts, ammonium groups, and phthalimidomethyl groups. Examples of atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylic acid ions, sulfonic acid ions, and phenoxide ions.

[0251] Specific examples of pigment derivatives include compounds described in paragraphs 0037 to 0054 of International Publication No. 2016 / 035695, compounds described in paragraphs 0061 to 0086 of International Publication No. 2017 / 146092, compounds described in paragraphs 0017 to 0068 of International Publication No. 2018 / 230387, compounds described in paragraphs 0085 to 0099 of International Publication No. 2020 / 054718, compounds described in paragraph 0099 of International Publication No. 2020 / 054718, compounds described in paragraph 0124 of International Publication No. 2022 / 085485, benzimidazolone compounds or salts thereof described in Japanese Patent Application Laid-Open No. 2018-168244, and compounds having an isoindoline skeleton described in general formula (1) of Japanese Patent No. 6996282.

[0252] The content of the pigment derivative is preferably 1 to 50 parts by mass per 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less. A single pigment derivative may be used, or two or more may be used. When two or more pigment derivatives are used, the total amount preferably falls within the above range.

[0253] Polymeric Compounds

[0254] The composition of the present invention preferably contains a polymerizable compound. Examples of the polymerizable compound include compounds having a group containing an ethylenically unsaturated bond. Examples of the group containing an ethylenically unsaturated bond include vinyl, (meth)allyl, (meth)acryloyl, etc. The polymerizable compound is preferably a free radical polymerizable compound.

[0255] The polymerizable compound is preferably a monomer. The molecular weight of the polymerizable compound is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0256] The polymerizable compound is preferably a compound containing three or more groups containing ethylenically unsaturated bonds, more preferably a compound containing 3 to 15 groups containing ethylenically unsaturated bonds, and further preferably a compound containing 3 to 6 groups containing ethylenically unsaturated bonds. In addition, the polymerizable compound is preferably a 3-15-functional (meth)acrylate compound, more preferably a 3-6-functional (meth)acrylate compound. As specific examples of polymerizable compounds, there can be mentioned the compounds described in paragraphs 0075 to 0083 of International Publication No. 2022 / 065215 and the compounds described in the gazette of Taiwan Patent Application No. 201832008.

[0257] Preferred polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available as KAYARAD D PHA; manufactured by Nippon Kayaku Co., Ltd., and NK ESTER A-DPH-12E; manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), and compounds having a structure in which these (meth)acryloyl groups are bonded via ethylene glycol and / or propylene glycol residues (for example, compounds manufactured by SARTOMER). Company, Inc., SR454 and SR499 are commercially available. In addition, as polymerizable compounds, diglycerol EO (ethylene oxide)-modified (meth)acrylate (commercially available as M-460; manufactured by Toagosei Company, Limited), pentaerythritol tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by Toagosei Company, Limited), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.) Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.), 8UH-1006, 8UH-1012 (manufactured by TaiseiFine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL CO., LTD.), ARONIX MT-3041, 3042 (manufactured by Toagosei Company, Limited, polymerizable compounds containing amines), ARONIX M-510, 520 (manufactured by Toagosei Company, Limited, polymerizable compounds having an acidic group), Etercure 6361-100 (manufactured by Eternal Materials, a polymerizable compound having a hyperbranched structure), EBECRYL 80 (a tetrafunctional monomer containing an amine, manufactured by DAICEL-ALLNEX LTD.), EBECRYL 7100 (a bifunctional monomer containing an amine, manufactured by DAICEL-ALLNEX LTD.), CN371NS (a bifunctional monomer containing an amine, manufactured by Arkema SA), HOA-MPL (2-acryloyloxyethyl phthalic acid: manufactured by KYOEISHA CHEMICAL CO., LTD.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl phthalic acid: manufactured by KYOEISHA CHEMICAL Co., Ltd.), a polymerizable compound having a dendrimer structure or a hyperbranched structure as described in Japanese Patent Application Laid-Open No. 2023-043479, a polymerizable compound as described in Japanese Translation of PCT International Publication No. 2023-529984, etc.

[0258] As a polymerizable compound, it is also preferred to use a compound having a group containing an ethylenically unsaturated bond and a carbamate bond. By using such a compound, the heat resistance of the obtained film can be further improved. It can be inferred that the reason for obtaining such an effect is that the carbamate bond portion forms a physical cross-linked structure based on intermolecular hydrogen bonds. The polymerizable compound having a group containing an ethylenically unsaturated bond and a carbamate bond can also use the compounds described in paragraphs 0308 to 0315 of Japanese Patent Application Publication No. 2022-173080.

[0259] As the polymerizable compound, a compound having a caprolactone structure can also be used. For polymerizable compounds having a caprolactone structure, reference can be made to paragraphs 0042 to 0045 of JP-A-2013-253224, the contents of which are incorporated herein. Examples of compounds having a caprolactone structure include DPCA-20, DPCA-30, DPCA-60, and DPCA-120, which are commercially available from Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series.

[0260] As polymerizable compounds, compounds having an ethylenically unsaturated bond-containing group and an alkyleneoxy group can also be used. Such compounds are preferably compounds having an ethylenically unsaturated bond-containing group and an ethyleneoxy group and / or a propyleneoxy group, more preferably compounds having an ethylenically unsaturated bond-containing group and an ethyleneoxy group, and even more preferably trifunctional to hexafunctional (meth)acrylate compounds having 4 to 20 ethyleneoxy groups. Commercially available products include, for example, SR-494, a tetrafunctional (meth)acrylate having 4 ethyleneoxy groups, manufactured by SARTOMER Company, Inc., and KAYARAD TPA-330, a trifunctional (meth)acrylate having 3 isobutyleneoxy groups, manufactured by Nippon Kayaku Co., Ltd.

[0261] As the polymerizable compound, a polymerizable compound having a fluorene skeleton can also be used, and commercially available products include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., a (meth)acrylate monomer having a fluorene skeleton).

[0262] As the polymerizable compound, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. Examples of commercially available products of such a compound include KAYARAD DPHA LT and KAYARAD DPEA-12LT (manufactured by Nippon Kayaku Co., Ltd.).

[0263] The content of the polymerizable compound in the total solids content of the composition is preferably 1 to 50% by mass. The lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less.

[0264] The composition of the present invention may contain only one polymerizable compound or two or more polymerizable compounds. When containing two or more polymerizable compounds, it is preferred that the total amount thereof falls within the above range.

[0265] Photopolymerization Initiator

[0266] When the composition of the present invention includes a polymerizable compound, the composition of the present invention preferably further includes a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound that is photosensitized to light in the ultraviolet to visible range is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0267] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyldimethylketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, and a 3-aryl-substituted coumarin compound. More preferred are compounds selected from the group consisting of oxime compounds, α-hydroxyketone compounds, α-aminoketone compounds, and acylphosphine compounds, and even more preferred are oxime compounds.In addition, examples of the photopolymerization initiator include compounds described in paragraphs 0065 to 0111 of Japanese Patent Application Publication No. 2014-130173, compounds described in Japanese Patent Application Publication No. 6301489, peroxide-based photopolymerization initiators described in MATERIAL STAGE 37 to 60p, vol. 19, No. 3, 2019, photopolymerization initiators described in International Publication No. 2018 / 221177, photopolymerization initiators described in International Publication No. 2018 / 110179, photopolymerization initiators described in Japanese Patent Application Publication No. 2019-043864, photopolymerization initiators described in Japanese Patent Application Publication No. 2019-044030, peroxide-based initiators described in Japanese Patent Application Publication No. 2019-167313, and aminophenylethylamines having an oxazolidinyl group described in Japanese Patent Application Publication No. 2020-055992. Ketone initiators, oxime photopolymerization initiators described in Japanese Patent Application Laid-Open No. 2013-190459, polymers described in Japanese Patent Application Laid-Open No. 2020-172619, compounds represented by formula 1 described in International Publication No. 2020 / 152120, compounds described in Japanese Patent Application Laid-Open No. 2021-181406, photopolymerization initiators described in Japanese Patent Application Laid-Open No. 2022-013379, compounds represented by formula (1) described in Japanese Patent Application Laid-Open No. 2022-015747, fluorine-containing fluorene oxime ester photoinitiators described in Japanese Patent Application Laid-Open No. 2021-507058, China Initiators described in Patent Application Publication No. 110764367, initiators described in Japanese Patent Application Publication No. 2022-518535, initiators described in International Publication No. 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in Japanese Patent Application Publication No. 2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in International Publication No. 2022 / 075452, and Chinese Patent Application Publication No. 110066225 Oxime ester compounds described in, compounds described in Korean Patent Publication No. 10-2022-0076157, compounds described in paragraphs 0042 to 0062 of International Publication No. 2019 / 013112 having a triarylamine or N-arylcarbazole skeleton, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in International Publication No. 2019 / 013112, photopolymerization initiators described in Japanese Patent Unexamined Publication No. 2023-033731, etc.

[0268] Specific examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole and the like.

[0269] Examples of commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins BV), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Examples of commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins BV), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Examples of commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins BV), Irgacure 819 and Irgacure TPO (both manufactured by BASF).

[0270] Examples of the oxime compound include the compound described in paragraph 0142 of International Publication No. 2022 / 085485, the compound described in Japanese Patent No. 5430746, the compound described in Japanese Patent No. 5647738, the compound represented by the general formula (1) or the compound described in paragraphs 0022 to 0024 of Japanese Patent Application Laid-Open No. 2021-173858, and the compound described in paragraphs 0022 to 0024 of Japanese Patent Application Laid-Open No. 2021-170089. The compound represented by the general formula (1) or the compound described in paragraphs 0117 to 0120, the oxime ester compound described in the specification of Chinese Patent Application Publication No. 110066225, the compound described in the Korean Patent Publication No. 10-2022-0076157, the compound described in paragraphs 0042 to 0062 of International Publication No. 2019 / 013112 having a triarylamine or N-arylcarbazole skeleton, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutane-2-one, 3-acetoxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropane-1-one, 2-benzoyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonyloxy)iminobutane-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyl oxime), and the like. Examples of commercially available products include IrgaCure OXE01, Irgacure OXE02, Irgacure OXE03, and Irgacure OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, and TR-PBG-327 (manufactured by TRONLY), and Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, a photopolymerization initiator 2 described in JP-A-2012-014052). Furthermore, it is also preferred to use a non-coloring compound or a compound that is highly transparent and resistant to discoloration as the oxime compound. Examples of commercially available products include ADEKA ARKLS NCI-730, NCI-831, and NCI-930 (all manufactured by ADEKA CORPORATION).

[0271] As photopolymerization initiators, oxime compounds having a fluorene ring, oxime compounds having a carbazole ring in which at least one benzene ring is a naphthalene ring skeleton, oxime compounds having a fluorine atom, oxime compounds having a nitro group, oxime compounds having a benzofuran skeleton, oxime compounds having a substituent having a hydroxyl group bonded to the carbazole skeleton, and compounds described in paragraphs 0143 to 0149 of International Publication No. 2022 / 085485 can also be used.

[0272] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0273] [Chemical Formula 20]

[0274]

[0275] In formula (OX-1), X 1a represents a divalent linking group containing at least one selected from an aromatic ring and a heterocyclic ring,

[0276] R 1a represents a hydrogen atom or an acyl group,

[0277] R 2a represents an alkyl group or an aryl group,

[0278] R 3a and R 4a Each independently represents a hydrogen atom or an alkyl group,

[0279] Alk 1 and Alk 2 Each independently represents an alkyl group,

[0280] R 3a With R 4a can bond to form a ring,

[0281] Alk 1 With Alk 2 can bond to form a ring,

[0282] n represents 0 or 1.

[0283] As X in formula (OX-1) 1a The divalent linking group represented by the above-mentioned group includes a divalent aromatic ring group, a divalent heterocyclic group, a divalent group formed by bonding two or more aromatic rings via a single bond or a linking group, a divalent group formed by bonding two or more heterocyclic rings via a single bond or a linking group, and a divalent group formed by bonding an aromatic ring and a heterocyclic ring via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings to heterocyclic rings include -CH2-, -O-, -CO-, -S-, -NR x - and groups formed by combining these. x represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heterocyclic group.

[0284] X in formula (OX-1) 1aIt is preferably a group represented by any of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and even more preferably a group represented by formula (X-2) or formula (X-6).

[0285] [Chemical Formula 21]

[0286]

[0287] Where R X1 ~R X9 Each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heterocyclic group.

[0288] R X1 ~R X9 The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0289] R X1 ~R X9 The number of carbon atoms in the alkenyl group represented is preferably 2 to 15, more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0290] R X1 ~R X9 The number of carbon atoms in the alkynyl group represented is preferably 2 to 15, more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0291] R X1 ~R X9 The number of carbon atoms in the aryl group represented is preferably 6 to 20, more preferably 6 to 12, further preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0292] R X1 ~R X9 The heterocyclic group represented is preferably a 5-membered ring or a 6-membered ring. The heteroatom contained in the heterocyclic group is preferably an oxygen atom, a nitrogen atom, or a sulfur atom. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0293] R of formula (OX-1) 1arepresents a hydrogen atom or an acyl group, and is preferably an acyl group.

[0294] R 1a The acyl group represented by is preferably -C(O)-R 101 The group represented by R 101 represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0295] R 101 The number of carbon atoms of the aryl group represented by is preferably 6 to 20, more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. 101 The aryl group represented is preferably a phenyl group, a methylphenyl group or a naphthyl group, and more preferably a methylphenyl group or a naphthyl group.

[0296] R 101 The heterocyclic group represented is preferably a 5-membered ring or a 6-membered ring. The heteroatom contained in the heterocyclic group is preferably an oxygen atom, a nitrogen atom, or a sulfur atom. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0297] Due to the high reactivity of the generated free radicals, R 2a represents an alkyl group or an aryl group, preferably an alkyl group.

[0298] R 2a The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, further preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably unsubstituted. 2a The alkyl group represented is preferably an unsubstituted linear or branched alkyl group, more preferably an unsubstituted linear alkyl group.

[0299] R 2a The number of carbon atoms in the aryl group represented is preferably 6 to 20, more preferably 6 to 12, further preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0300] R of formula (OX-1) 3a and R 4a Each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom.

[0301] R 3a and R 4aThe number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably unsubstituted.

[0302] R 3a With R 4a They may be bonded to form a ring, and the formed ring is preferably a 5-membered or 6-membered ring, more preferably a 5-membered or 6-membered aliphatic hydrocarbon ring.

[0303] Alk of formula (OX-1) 1 and Alk 2 Each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably unsubstituted.

[0304] Alk 1 With Alk 2 They may be bonded to form a ring, and preferably form a ring. The formed ring is preferably a 5-membered ring or a 6-membered ring, more preferably a 5-membered ring or a 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0305] In formula (OX-1), n represents 0 or 1, and is preferably 0.

[0306] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A-2012-113104 and the compound described in paragraph 0041 of JP-A-2012-189997.

[0307] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0308] [Chemical Formula 22]

[0309]

[0310] In formula (OX-2), R 1b and R 2b Each independently represents a substituent, R 3b ~R 7b Each independently represents a hydrogen atom or a substituent, Ar 1b represents an aromatic ring group or a heterocyclic group which may have a substituent, and n represents 0 or 1.

[0311] As R1b and R 2b The substituents represented by alkyl and aryl groups are preferably alkyl groups. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituents include halogen atoms, aryl groups, alkenyl groups, alkynyl groups, and heterocyclic groups. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, further preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heterocyclic groups.

[0312] As R 3b ~R 7b Examples of the substituents represented by include halogen atoms, alkyl groups, and aryl groups. Examples of the alkyl groups and aryl groups include the groups described above.

[0313] R 3b ~R 7b Preferred is a hydrogen atom.

[0314] Ar 1b represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar 1b An aromatic ring group which may have a substituent is preferred. The aromatic ring group is preferably a benzene ring group or a naphthyl ring group, more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, preferably an acyl group. Examples of the acyl group include the above-mentioned acyl groups.

[0315] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0316] [Chemical Formula 23]

[0317]

[0318] In formula (OX-3), Ar 1c represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group,

[0319] Ar 2c represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group,

[0320] R 1c ~R 3c Each independently represents a substituent,

[0321] L 1c Indicates a single key or CR 11c R 12c , R 11c and R 12cEach independently represents a hydrogen atom, an alkyl group or an aryl group,

[0322] X 1c Indicates -O- or -S-,

[0323] k represents 0 or 1, m represents an integer from 0 to 4, and n represents 0 or 1.

[0324] As R 1c and R 2c The substituents represented by alkyl and aryl groups are preferably alkyl groups. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituents include halogen atoms, aryl groups, alkenyl groups, alkynyl groups, and heterocyclic groups. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, further preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituents include halogen atoms, alkyl groups, alkenyl groups, alkynyl groups, and heterocyclic groups.

[0325] R 2c An alkyl group having a branched or cyclic structure is preferred.

[0326] As R 3c Examples of the substituents represented by include halogen atoms, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, and acyl groups, and acyl groups are preferred. Examples of the acyl groups include the acyl groups mentioned above.

[0327] Ar 1c represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, more preferably a benzene ring group.

[0328] Ar 2c represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, more preferably a benzene ring group.

[0329] k represents 0 or 1, preferably 0.

[0330] m represents an integer of 0 to 4, is preferably 0 or 1, and more preferably 1.

[0331] Specific examples of the oxime compound preferably used in the present invention are shown below, but the present invention is not limited to these.

[0332] [Chemical Formula 24]

[0333]

[0334] [Chemical Formula 25]

[0335]

[0336] [Chemical Formula 26]

[0337]

[0338] [Chemical Formula 27]

[0339]

[0340] The oxime compound is preferably a compound having a maximum absorption wavelength in the range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorptivity of the oxime compound at a wavelength of 365 nm or a wavelength of 405 nm is preferably high, more preferably 1000 to 300,000, further preferably 2000 to 300,000, and particularly preferably 5000 to 200,000. The molar absorptivity of the compound can be measured using a known method. For example, it is preferably measured using a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) using an ethyl acetate solvent at a concentration of 0.01 g / L.

[0341] As a photopolymerization initiator, a difunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such a photoradical polymerization initiator, two or more free radicals are generated by one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity decreases and the solubility in solvents etc. is improved, and it becomes difficult to precipitate over time, and the temporal stability of the composition can be improved. As specific examples of difunctional or trifunctional or higher photoradical polymerization initiators, the compounds described in paragraph 0148 of International Publication No. 2022 / 065215 can be cited.

[0342] The content of the photopolymerization initiator in the total solids content of the composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less. The composition may contain only one photopolymerization initiator or two or more. When containing two or more, their total amount preferably falls within the above range.

[0343] Compounds having cyclic ether groups

[0344] The composition of the present invention can contain a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group, an oxetane group, and the like. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group represents a monovalent functional group having a cyclic structure formed by condensation of an epoxy ring and a saturated hydrocarbon ring. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of the epoxy compound include compounds having one or more epoxy groups in one molecule, and preferably compounds having two or more epoxy groups. The epoxy compound is a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the epoxy group contained in the epoxy compound can be, for example, set to 10 or less, or can be set to 5 or less. The lower limit of the epoxy group contained in the epoxy compound is preferably 2 or more.

[0345] As the compound having a cyclic ether group, the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, paragraphs 0147 to 0156 of JP-A-2014-043556, paragraphs 0085 to 0092 of JP-A-2014-089408, the compounds described in JP-A-2017-179172, the xanthene-type epoxy resins described in JP-A-2021-195421, and the xanthene-type epoxy resins described in JP-A-2021-195422 can be used.

[0346] The compound having a cyclic ether group may be a low molecular weight compound (e.g., a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (e.g., a molecular weight of 1000 or greater, and in the case of a polymer, a weight average molecular weight of 1000 or greater). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0347] Examples of commercially available compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0348] The content of the compound having a cyclic ether group in the total solid content of the composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 10% by mass or less. The compound having a cyclic ether group may be used alone or in combination. When using two or more compounds, it is preferred that their total amount be within the above range.

[0349] Curing Agent

[0350] In the case where the composition of the present invention includes a compound with a cyclic ether group, the composition of the present invention preferably further includes a curing agent. As a curing agent, amine compounds, acid anhydride compounds, amide compounds, phenolic compounds, polycarboxylic acids, thiol compounds, etc. can be mentioned. As a specific example of a curing agent, succinic acid, trimellitic acid, pyromellitic acid, N, N-dimethyl-4-aminopyridine, pentaerythritol tetrakis (3-mercaptopropionic acid ester) can be mentioned. The curing agent can also use the compounds described in paragraphs 0072 to 0078 of Japanese Patent Application Laid-Open No. 2016-075720 and the compounds described in Japanese Patent Application Laid-Open No. 2017-036379. The content of the curing agent is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the compound with a cyclic ether group, more preferably 0.01 to 10 parts by mass, and further preferably 0.1 to 6.0 parts by mass.

[0351] Color Colorants

[0352] The composition of the present invention may contain a colorant. Examples of the colorant include red, green, blue, yellow, violet, and orange. The colorant may be a pigment or a dye. Both pigments and dyes may be used. The pigment may be either an inorganic pigment or an organic pigment. Furthermore, pigments in which a portion of an inorganic pigment or an organic-inorganic pigment is replaced with an organic chromophore may be used. By replacing an inorganic pigment or an organic-inorganic pigment with an organic chromophore, hue design can be facilitated.

[0353] The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and further preferably 100 nm or less. In addition, in this specification, the primary particle size of the pigment can be obtained by observing the primary particles of the pigment through a transmission electron microscope and based on the image photograph obtained. Specifically, the projected area of the primary particles of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle size of the pigment. In addition, the average primary particle size in this specification is set as the arithmetic mean of the primary particle sizes of 400 primary particles of the pigment. In addition, the primary particles of the pigment refer to independent particles that are not agglomerated.

[0354] The crystallite size of the pigment determined from the half-maximum width of a peak originating from any crystal plane in an X-ray diffraction spectrum using CuKα rays as an X-ray source is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, further preferably 1 to 30 nm, and particularly preferably 5 to 25 nm.

[0355] The specific surface area of the pigment is preferably 1 to 300 m 2 / g. The lower limit is preferably 10m 2 / g or more, more preferably 30m 2 / g or more. The upper limit is preferably 250m 2 / g or less, more preferably 200m 2 The specific surface area can be measured by the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: determination of the specific surface area of solids by gas adsorption.

[0356] The coloring agent preferably contains a pigment. The pigment content in the coloring agent is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. Examples of the pigment include the following.

[0357] Color Index (CI) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128 、129、137、138、139、147、148、150、151、152、153、154、155、156、161、162、164、166、167、168、169、170、171、172、173、174、175、176、177、179、180、181、182、185、187、188、193、194、199、213、214、215、228、231、232(methine), 233(quinoline), 234(aminoketone), 235(aminoketone), 236(aminoketone) etc. (above, yellow pigment),

[0358] CI Pigment Orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (above, orange pigments),

[0359] CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294 (xanthenes, Organo Ultramarine, Bluish Red), 295 (monoazo), 296 (diazo), 297 (aminoketone) (the above, red pigments),

[0360] CI Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65 (phthalocyanine), 66 (phthalocyanine), etc. (above, green pigments),

[0361] CI Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethanes), 61 (xanthenes), etc. (the above, purple pigments),

[0362] CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo type), 88 (methine type), etc. (above, blue pigments).

[0363] As a green colorant, a zinc phthalocyanine halogenide pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can also be used. As a specific example, the compounds described in International Publication No. 2015 / 118720 can be cited. In addition, as a green colorant, the compounds described in paragraph 0029 of International Publication No. 2022 / 085485, the aluminum phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 2020-070426, and the diarylmethane compounds described in Japanese Patent Application No. 2020-504758 can also be used.

[0364] As a blue colorant, an aluminum phthalocyanine compound having a phosphorus atom can also be used. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraph 0047 of JP-A-2011-157478.

[0365] As the yellow colorant, the compounds described in paragraphs 0031 to 0033 of International Publication No. 2022 / 085485, the methine dyes described in JP-A-2019-073695, and the methine dyes described in JP-A-2019-073696 can be used.

[0366] As the red colorant, the compounds described in paragraph 0034 of International Publication No. 2022 / 085485 and the brominated diketopyrrolopyrrole compounds described in Japanese Patent Application Laid-Open No. 2020-085947 can also be used.

[0367] Dyes can also be used in the coloring agent. As dyes, there is no particular limitation, and known dyes can be used. For example, pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, pyrromethene dyes etc. can be enumerated. In addition, the thiazole compounds described in Japanese Patent Application Laid-Open No. 2012-158649 Gazette, the azo compounds described in Japanese Patent Application Laid-Open No. 2011-184493 Gazette, and the azo compounds described in Japanese Patent Application Laid-Open No. 2011-145540 Gazette can also be used in the dyes.

[0368] As the color colorant, a triarylmethane dye polymer described in Korean Patent Publication No. 10-2020-0028160, a xanthene compound described in Japanese Patent Application Laid-Open No. 2020-117638, a phthalocyanine compound described in International Publication No. 2020 / 174991, an isoindoline compound described in Japanese Patent Application Laid-Open No. 2020-160279 or a salt thereof, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069442, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069730, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069070 The compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069067, the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069062, the zinc phthalocyanine halide pigment described in Japanese Patent No. 6809649, the isoindoline compound described in Japanese Patent Application Laid-Open No. 2020-180176, the phenothiazine compound described in Japanese Patent Application Laid-Open No. 2021-187913, the zinc phthalocyanine halide described in International Publication No. 2022 / 004261, the zinc phthalocyanine halide described in International Publication No. 2021 / 250883, the zinc phthalocyanine halide described in Korean Patent Publication No. A quinophthalone compound represented by Formula 1 described in the publication No. 10-2020-0030759, a polymer dye described in Korean Patent Publication No. 10-2020-0061793, a colorant described in Japanese Patent Application Laid-Open No. 2022-029701, an isoindoline compound described in International Publication No. 2022 / 014635, an aluminum phthalocyanine compound described in International Publication No. 2022 / 024926, a compound described in Japanese Patent Application Laid-Open No. 2022-045895, a compound described in International Publication No. 2022 / 050051, a compound described in Japanese Patent Application Laid-Open No. 2020-090676, a compound described in Japanese Patent Application Laid-Open No. 2020-05 Compounds described in the publication No. 5956, compounds described in Japanese Patent Application Laid-Open No. 2021-031681, compounds described in Japanese Patent Application Laid-Open No. 2022-056354, compounds described in the specification of U.S. Patent Application Publication No. 2021 / 0355327, compounds described in International Publication No. 2022 / 065357, compounds described in Japanese Patent Application Laid-Open No. 2020-045436, compounds described in Korean Patent Publication No. 10-2021-0146726, compounds described in Japanese Patent Application Laid-Open No. 2018-178039, compounds described in the specification of Chinese Patent Application Publication No. 113881244,Compounds described in the specification of Chinese Patent Application Publication No. 113881245, compounds described in the specification of Chinese Patent Application Publication No. 113881246, compounds described in Japanese Patent Application Publication No. 2022-104822, compounds described in Japanese Patent Application Publication No. 2022-096701, compounds described in Japanese Patent Application Publication No. 2020-023652, green pigments described on pages 80 to 84 of the Journal of Color Materials Association (published in 2022), compounds described in Japanese Patent Application Publication No. 2022-143135, compounds described in Japanese Patent Application Publication No. 2022-140287, compounds described in International Publication No. 2022 / 136308, compounds described in the specification of Chinese Patent Application Publication No. 113061349, Compounds, cyan pigments described in Korean Patent Publication No. 10-2017-0018993, isoindoline compounds described in Japanese Patent Publication No. 2020-180176, compounds described in Japanese Patent Publication No. 2023-013209, compounds described in Japanese Patent Publication No. 2023-013166, xanthene compounds described in International Publication No. 2023 / 286526, compounds described in Japanese Patent Publication No. 2021-155746, compounds described in Japanese Patent Publication No. 2023-013209, compounds described in Japanese Patent Publication No. 2023-013166, xanthene compounds described in International Publication No. 2023 / 286526, compounds described in Japanese Patent Publication No. 2021-155746, Compounds described in JP-A-2021-155747, JP-A-2021-155748, JP-A-2021-155749, International Publication No. 2018 / 051876, JP-A-2020-083981, JP-A-2023-056463, and JP-T-2023-515473. The colorant may be a rotaxane, and the pigment skeleton may be a cyclic structure of the rotaxane, a rod-shaped structure, or both.

[0369] When the composition of the present invention contains a colorant, the content of the colorant in the total solid content of the composition is preferably 1 to 50% by mass. When the composition of the present invention contains two or more colorants, the total amount thereof is preferably within the above range.

[0370] When the composition of the present invention is used as an infrared cut filter, the composition of the present invention preferably contains substantially no colorant. Furthermore, "substantially no colorant" in the composition of the present invention means that the content of the colorant in the total solids content of the composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably contains no colorant.

[0371] Pigments that transmit infrared rays and block visible light

[0372] The composition of the present invention may also contain a colorant that transmits infrared rays and blocks visible light (hereinafter also referred to as a visible light blocking colorant). A composition containing a visible light blocking colorant can be preferably used as a composition for forming an infrared transmission filter.

[0373] The visible light-blocking colorant preferably absorbs light in the violet to red wavelength range. Furthermore, the visible light-blocking colorant preferably blocks light in the 450-650 nm wavelength range. Furthermore, the visible light-blocking colorant preferably transmits light in the 900-1500 nm wavelength range. The visible light-blocking colorant preferably satisfies at least one of the following requirements (A) and (B).

[0374] (A): Contains two or more coloring agents, and the combination of the two or more coloring agents forms black.

[0375] (B): Contains an organic black colorant.

[0376] As the color colorant, the above-mentioned colorants can be mentioned. As the organic black colorant, for example, bisbenzofuranone compounds, azomethine compounds, Compounds, azo compounds, etc., preferably bisbenzofuranone compounds, Compounds. Examples of bisbenzofuranone compounds include compounds described in Japanese Patent Application Publication No. 2010-534726, Japanese Patent Application Publication No. 2012-515233, and Japanese Patent Application Publication No. 2012-515234. For example, they can be obtained as "Irgaphor Back" manufactured by BASF. Examples of the compound include the compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, and CI Pigment Black 31 and 32. Examples of the azomethine compound include the compounds described in JP-A-01-170601 and JP-A-02-034664, and are available, for example, as "CHROMOFINE BLACK A1103" manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd.

[0377] When two or more coloring agents are combined to form black, for example, the following embodiments (1) to (8) can be cited.

[0378] (1) A method containing a yellow colorant, a blue colorant, a purple colorant, and a red colorant.

[0379] (2) A method containing a yellow colorant, a blue colorant, and a red colorant.

[0380] (3) A method containing a yellow colorant, a purple colorant, and a red colorant.

[0381] (4) A method containing a yellow colorant and a purple colorant.

[0382] (5) A method containing a green colorant, a blue colorant, a purple colorant, and a red colorant.

[0383] (6) A form containing a purple colorant and an orange colorant.

[0384] (7) A method containing a green colorant, a purple colorant, and a red colorant.

[0385] (8) A method containing a green colorant and a red colorant.

[0386] When the composition of the present invention contains a colorant that blocks visible light, the content of the colorant that blocks visible light in the total solids content of the composition is preferably 1 to 50% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more.

[0387] When the composition of the present invention is used as an infrared cut filter, the composition of the present invention preferably contains substantially no visible light-blocking colorants. Furthermore, "substantially no visible light-blocking colorants" in the composition means that the content of the visible light-blocking colorant in the total solids content of the composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably contains no visible light-blocking colorants.

[0388] Surfactants

[0389] The composition of the present invention may contain a surfactant. Examples of surfactants include fluorochemical surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone surfactants. The surfactant is preferably a silicone surfactant or a fluorochemical surfactant. For surfactants, reference may be made to the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015 / 166779, which is incorporated herein by reference.

[0390] As the fluorine-based surfactant, the compounds described in paragraphs 0167 to 0173 of International Publication No. 2022 / 085485 can be used.

[0391] Examples of the nonionic surfactant include compounds described in paragraph 0174 of International Publication No. 2022 / 085485.

[0392] Examples of silicone surfactants include SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419 OIL (all manufactured by Dow Toray Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, and TSF-4452 (all manufactured by Momentive Performance Materials Inc.), and KP-341, KF-6000, KF-6001, KF-6002, and KF-6003 (all manufactured by Shin-Etsu Chemical). Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-3760, BYK-UV3510 (all manufactured by BYK Co., Ltd.), etc. As the silicone surfactant, compounds having the following structures can also be used.

[0393] [Chemical Formula 28]

[0394]

[0395] The content of the surfactant in the total solid content of the composition is preferably 0.001 to 5% by mass. The lower limit is preferably 0.005% by mass or more. The upper limit is preferably 3% by mass or less, more preferably 1% by mass or less, further preferably 0.5% by mass or less, and particularly preferably 0.2% by mass or less. The composition may contain only one surfactant or two or more. When containing two or more surfactants, it is preferred that their total amount reaches the above range.

[0396] Inhibitors

[0397] The composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and N-nitrosophenylhydroxylamine salts (ammonium salts, cerium salts, etc.), preferably p-methoxyphenol. The content of the polymerization inhibitor in the total solids content of the composition is preferably 0.0001 to 5% by mass. The composition may contain only one polymerization inhibitor or two or more. When containing two or more polymerization inhibitors, their total amount preferably falls within the above range.

[0398] Silane coupling agent

[0399] The composition of the present invention can contain a silane coupling agent. The silane coupling agent is preferably a silane compound having a hydrolyzable group, more preferably a silane compound having a hydrolyzable group and a functional group other than this. The hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can produce a siloxane bond by at least any one of a hydrolysis reaction and a condensation reaction. As the hydrolyzable group, for example, a halogen atom, an alkoxy group, an acyloxy group, etc. can be mentioned, preferably an alkoxy group. The silane coupling agent is preferably a compound having an alkoxysilyl group. And, as a functional group other than the hydrolyzable group, for example, a vinyl group, a styryl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetane group, an amino group, a urea group, a thioether group, an isocyanate group, a phenyl group, etc. can be mentioned, preferably a (meth)acryloyl group and an epoxy group. As the silane coupling agent, the compound described in paragraph 0177 of International Publication No. 2022 / 085485 and the compound described in Japanese Patent Application Publication No. 2019-183020 can be cited. The content of the silane coupling agent in the total solid content of the composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The composition may contain only one silane coupling agent or two or more silane coupling agents. When containing two or more, it is preferred that their total amount reaches the above range.

[0400] Ultraviolet absorbers

[0401] The composition of the present invention may contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. The ultraviolet absorber can also use the compounds described in paragraphs 0038 to 0052 of Japanese Patent Application Laid-Open No. 2009-217221, the compounds described in paragraphs 0052 to 0072 of Japanese Patent Application Laid-Open No. 2012-208374, the compounds described in paragraphs 0317 to 0334 of Japanese Patent Application Laid-Open No. 2013-068814, the compounds described in paragraphs 0061 to 0080 of Japanese Patent Application Laid-Open No. 2016-162946, the compounds described in paragraphs 0059 to 0076 of International Publication No. 2016 / 181987, and the compounds described in paragraphs 0052 and 0074 of International Publication No. 2021 / 131355. Compounds, compounds described in paragraphs 0022 to 0024 of International Publication No. 2021 / 132247, compounds described in paragraph 0179 of International Publication No. 2022 / 085485, reactive triazine ultraviolet absorbers described in Japanese Patent Application Laid-Open No. 2021-178918, ultraviolet absorbers described in Japanese Patent Application Laid-Open No. 2022-007884, compounds described in Korean Patent Application Laid-Open No. 10-2022-0014454, compounds described in Japanese Patent Application Laid-Open No. 2023-013321, and compounds described in paragraphs 0049 to 0059 of Japanese Patent Application No. 6268967. Commercially available ultraviolet absorbers include the Tinuvin series and Uvinul series manufactured by BASF. In addition, as benzotriazole compounds, the MYUA series manufactured by Miyoshi Oil & Fat Co., Ltd. can be cited (Chemical Industry Daily, February 1, 2016). The content of the ultraviolet absorber in the total solid content of the composition is preferably 0.01 to 30% by mass. The lower limit is preferably 0.05% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, further preferably 10% by mass or less, and particularly preferably 5% by mass or less. The composition may contain only one ultraviolet absorber or may contain two or more. When containing two or more, it is preferred that their total amount reaches the above range.

[0402] Antioxidants

[0403] The composition of the present invention may contain an antioxidant. Examples of the antioxidant include phenolic antioxidants, amine antioxidants, phosphorus antioxidants, and sulfur antioxidants. Examples of the phenolic antioxidant include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position). The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite group in the same molecule. Examples of the phosphorus antioxidant include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetrakis-tert-butyldibenzo[d,f][1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Examples of commercially available antioxidants include ADEKA STAB A0-20, ADEKA STAB A0-30, ADEKA STAB A0-40, ADEKA STAB A0-50, ADEKA STAB A0-50F, ADEKA STAB A0-60, ADEKA STAB AO-60G, ADEKA STAB A0-80, ADEKA STAB A0-330, ADEKA STAB AO-412S, ADEKA STAB 2112, ADEKA STAB PEP-36, and ADEKA STAB HP-10 (all manufactured by ADEKA CORPORATION), and JP-650 (manufactured by JOHOKU CHEMICAL CO., LTD.). Antioxidants can also use compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017 / 006600, compounds described in International Publication No. 2017 / 164024, and compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the composition is preferably 0.01 to 20% by mass. The lower limit is preferably 0.3% by mass or more, more preferably 0.5% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. The composition may contain only one antioxidant or only two or more. When comprising two or more, it is preferred that their total amount reaches the above range.

[0404] Other ingredients

[0405] The composition of the present invention can contain sensitizer, filler, thermosetting accelerator, plasticizer and other auxiliary agents (for example, conductive particles, defoamer, flame retardant, leveling agent, peeling accelerator, fragrance, surface tension modifier, chain transfer agent, potential antioxidant etc.) as needed. By suitably containing these ingredients, it is possible to adjust the properties such as film properties. These ingredients can use the compounds described in paragraph 0182 of International Publication No. 2022 / 085485. In addition, chain transfer agents can use the thiol compounds described in Japanese Patent Application Publication No. 2020-109068.

[0406] In the composition of the present invention, the free metal content is preferably 100 ppm or less, more preferably 50 ppm or less. Furthermore, the free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing free metals or halogens in the composition include washing with ion-exchanged water, filtration, ultrafiltration, purification using ion exchange resins, and purification using inorganic adsorbents such as hydrotalcite.

[0407] From the perspective of environmental regulation, the use of perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts is sometimes regulated. In the composition of the present invention, when the content of the above-mentioned compounds is reduced, the content of perfluoroalkylsulfonic acid (especially perfluoroalkylsulfonic acid having a perfluoroalkyl group with 6 to 8 carbon atoms) and its salts, and perfluoroalkylcarboxylic acid (especially perfluoroalkylcarboxylic acid having a perfluoroalkyl group with 6 to 8 carbon atoms) and its salts is preferably in the range of 0.01ppb to 1,000ppb relative to the total solid content of the composition, more preferably in the range of 0.05ppb to 500ppb, and even more preferably in the range of 0.1ppb to 300ppb. The composition of the present invention may also be substantially free of perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts. For example, by using a compound that can replace perfluoroalkylsulfonic acid and its salts, and a compound that can replace perfluoroalkylcarboxylic acid and its salts, a composition that substantially does not contain perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts can also be selected. Examples of compounds that can replace regulated compounds include compounds that are excluded from regulation due to differences in the number of carbon atoms in their perfluoroalkyl groups. However, the above does not preclude the use of perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts. The compositions of the present invention may also contain perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts within the maximum permissible range.

[0408] From the perspective of environmental regulation, the content of the fluorine-containing compound in the composition may be 5% by mass or less, 1% by mass or less, 100 ppm by mass or less, 1 ppm by mass or less, or may be substantially absent.

[0409] <Storage Container>

[0410] The container for storing the composition of the present invention is not particularly limited, and a known container can be used. In addition, the container described in paragraph 0187 of International Publication No. 2022 / 085485 can be used.

[0411] <Method for Preparing Composition>

[0412] The composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the composition, all the components can be dissolved or dispersed in a solvent to prepare the composition. Alternatively, two or more solutions or dispersions containing the respective components can be prepared in advance as needed and mixed at the time of use (during application) to prepare the composition.

[0413] When preparing the composition, a process for dispersing the pigment may be included. In the pigment dispersion process, as the mechanical force for dispersing the pigment, compression, extrusion, impact, shearing, cavitation, etc. may be enumerated. As the specific examples of these processes, bead milling, sand milling, roller milling, ball milling, paint stirring, micro jet, high-speed impeller, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, etc. may be enumerated. Furthermore, in the pulverization of the pigment in the sand mill (bead mill), it is preferably processed under conditions that improve pulverization efficiency by using microbeads with a small diameter, increasing the filling rate of microbeads, etc. Furthermore, preferably, after the pulverization process, coarse particles are removed by filtration, centrifugation, etc. Furthermore, with regard to the process and disperser for dispersing the pigment, it is preferred to use the process and disperser described in paragraph 0022 of "Complete Collection of Dispersion Technology, published by JIHO, Inc. on July 15, 2005" or "Comprehensive Data Collection of Dispersion Technology and Practical Industrial Applications Focusing on Suspensions (Solid / Liquid Dispersions), published by the Business Development Center Publishing Department on October 10, 1978", or Japanese Patent Application Publication No. 2015-157893. Furthermore, in the pigment dispersion process, the pigment can also be micronized by a salt milling process. For example, the raw materials, equipment, and processing conditions used in the salt milling process can be referred to the records in Japanese Patent Application Publication No. 2015-194521 and Japanese Patent Application Publication No. 2012-046629. As raw materials for microbeads used for dispersion, zirconium oxide, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, aluminum oxide, stainless steel, and glass can be cited. Furthermore, the microbeads may also contain inorganic compounds having a Mohs hardness of 2 or higher. The composition may contain 1 to 10,000 ppm of the microbeads.

[0414] When preparing a composition, it is preferred to filter the composition to remove foreign matter or reduce defects. Examples of the type of filter and the filtering method used for filtration include those described in paragraphs 0196 to 0199 of International Publication No. 2022 / 085485.

[0415] <Film>

[0416] Next, the film of the present invention is described. The film of the present invention is a film obtained from the composition of the present invention described above. The film of the present invention can be preferably used as an optical filter. The use of the optical filter is not particularly limited, and examples include infrared cutoff filters, infrared transmission filters, and the like. As infrared cutoff filters, for example, infrared cutoff filters on the light receiving side of a solid-state imaging element (for example, infrared cutoff filters for wafer-level lenses, etc.), infrared cutoff filters on the back side (the side opposite to the light receiving side) of a solid-state imaging element, infrared cutoff filters for ambient light sensors (for example, illuminance sensors that sense the illuminance or hue of the environment in which an information terminal device is placed and adjust the hue of the display, color correction sensors that adjust the hue), and the like can be cited. In particular, it can be preferably used as an infrared cutoff filter on the light receiving side of a solid-state imaging element. As infrared transmission filters, filters that block visible light and can selectively transmit infrared rays above a specific wavelength can be cited.

[0417] The film of the present invention may have a pattern or may be a film without a pattern (flat film). Furthermore, the film of the present invention may be laminated on a support or may be peeled off from the support. Examples of the support include semiconductor substrates such as silicon substrates or transparent substrates.

[0418] On the semiconductor substrate used as a support, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a photoelectric conversion layer, a transparent conductive film, etc. can be formed. In addition, sometimes a next door is formed on the semiconductor substrate to isolate each pixel. As the next door, metal, metal oxide, black matrix, etc. can be enumerated. In addition, a primer layer for improving the adhesion of the layer on the top, preventing the diffusion of the substance, or flattening the substrate surface can be provided on the semiconductor substrate as needed.

[0419] The transparent substrate that can be used as a support is not particularly limited as long as it is made of a material that can at least transmit visible light. For example, substrates made of materials such as glass and resin can be mentioned. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene vinyl acetate copolymer, acrylic resins such as norbornene resins, polyacrylates, and polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, and polyvinyl alcohol resins. Examples of glass include soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, and copper-containing glass. Examples of copper-containing glass include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercially available copper-containing glass can also be used. Commercially available copper-containing glass includes NF-50 (manufactured by AGC TECHNOGLASS CO., LTD.).

[0420] The thickness of the film of the present invention can be appropriately adjusted depending on the intended purpose. The film thickness can be set to 200 μm or less, 150 μm or less, 120 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more.

[0421] When the film of the present invention is used as an infrared cut filter, the film of the present invention preferably has a maximum absorption wavelength in the wavelength range of 650 to 1500 nm (preferably 660 to 1200 nm, more preferably 660 to 1000 nm).

[0422] Furthermore, the average transmittance in the wavelength range of 700 to 720 nm is preferably 10% or less, more preferably 7% or less, further preferably 4% or less, and particularly preferably 2% or less.

[0423] Furthermore, the average transmittance within the wavelength range of 400 to 550 nm is preferably 86% or higher, more preferably 89% or higher, further preferably 92% or higher, and particularly preferably 95% or higher. Furthermore, the transmittance over the entire wavelength range of 420 to 550 nm is preferably 50% or higher, more preferably 70% or higher, and even more preferably 80% or higher.

[0424] Furthermore, the transmittance at at least one point in the wavelength range of 650 to 1500 nm (preferably 660 to 1200 nm, more preferably 660 to 1000 nm) is preferably 10% or less, more preferably 7% or less, further preferably 4% or less, and particularly preferably 2% or less.

[0425] Furthermore, the film of the present invention preferably has an average absorbance within a wavelength range of 400 to 550 nm of less than 0.030, more preferably less than 0.025, when the absorbance at the maximum absorption wavelength is defined as 1.

[0426] When the film of the present invention is used as an infrared transmission filter, the film of the present invention preferably has any one of the following spectral characteristics (i1) to (i3), for example.

[0427] (i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) within the wavelength range of 400 to 850 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) within the wavelength range of 1000 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 850 nm while transmitting light exceeding a wavelength of 950 nm.

[0428] (i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) within the wavelength range of 400 to 950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) within the wavelength range of 1100 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm while transmitting light exceeding a wavelength of 1050 nm.

[0429] (i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) within the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) within the wavelength range of 1200 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm while transmitting light exceeding a wavelength of 1150 nm.

[0430] The film of the present invention can also be used in combination with a color filter comprising a color colorant. The color filter can be manufactured using a coloring composition comprising a color colorant. When the film of the present invention is used as an infrared cutoff filter and the film of the present invention and the color filter are used in combination, the color filter is preferably configured on the optical path of the film of the present invention. For example, it is preferred to stack the film of the present invention and the color filter to use as a laminate. In the laminate, the film of the present invention and the color filter may be adjacent to each other in the thickness direction or may not be adjacent to each other. When the film of the present invention and the color filter are not adjacent to each other in the thickness direction, the film of the present invention may be formed on a support different from the support on which the color filter is formed, or other components constituting a solid-state imaging element (for example, microlenses, a flattening layer, etc.) may be inserted between the film of the present invention and the color filter.

[0431] The film of the present invention can be used in various devices such as solid-state imaging elements such as CCD (charge coupled device), CMOS (complementary metal oxide semiconductor) (in addition to Si, the imaging part can also use compound semiconductors such as InGaAs, organic semiconductors, quantum dots, etc.), infrared sensors, light-emitting elements, optical communication elements (including transmission / reception), image display devices, etc.

[0432] <Method for producing film>

[0433] The film of the present invention can be produced through a step of applying the composition of the present invention.

[0434] As the support, the above-mentioned support can be mentioned. As the coating method of the composition, a known method such as a spin coating method can be used. For example, the coating method described in paragraph 0207 of International Publication No. 2022 / 085485 can be used.

[0435] The composition layer formed by the coating composition can be dried (prebaked). When prebaking is performed, the prebaking temperature is preferably 150°C or less, more preferably 120°C or less, and further preferably 110°C or less. The lower limit can be set to, for example, 50°C or more, or 80°C or more. The prebaking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and further preferably 80 to 220 seconds. Drying can be performed using a hot plate, an oven, or the like.

[0436] The film manufacturing method may further include a patterning step. Examples of patterning methods include those using photolithography and those using dry etching, with photolithography being preferred. Furthermore, when the film of the present invention is used as a flat film, the patterning step may not be performed. The patterning step will be described in detail below.

[0437] (When patterning by photolithography)

[0438] The pattern forming method by photolithography preferably includes a step of exposing the composition of the present invention in a patterned manner to form a composition layer (exposure step) and a step of developing and removing the unexposed portion of the composition layer to form a pattern (development step). A step of baking the developed pattern (post-baking step) may be provided as needed. Each step is described below.

[0439] In the exposure step, the composition layer is exposed in a pattern. For example, a stepper or scanner is used to expose the composition layer through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0440] Examples of radiation (light) that can be used for exposure include g-rays and i-rays. Furthermore, light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm), with KrF rays (wavelength 248 nm) being preferred. Furthermore, long-wavelength light sources of 300 nm or more can also be used.

[0441] Furthermore, during exposure, light can be irradiated continuously or pulsed (pulse exposure). Pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly in a short-time (e.g., milliseconds or less) cycle to perform exposure.

[0442] The irradiation dose (exposure dose) is preferably, for example, 0.03 to 2.5 J / cm 2 , more preferably 0.05 to 1.0 J / cm 2 The oxygen concentration during exposure can be appropriately selected. In addition to being performed under the atmosphere, exposure can be performed in a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen environment with an oxygen concentration exceeding 21% by volume (for example, 22% by volume, 30% by volume, or 50% by volume). Furthermore, the exposure illuminance can be appropriately set, typically from 1000 W / m 2 ~100000W / m 2 (For example, 5000W / m 2 、15000W / m 2 or 35000W / m 2 The oxygen concentration and exposure illuminance conditions can be appropriately combined, for example, the oxygen concentration can be set to 10% by volume and the illuminance can be set to 10000 W / m 2 , oxygen concentration is 35% by volume and illumination is 20000W / m 2 wait.

[0443] Next, the unexposed portions of the composition layer after exposure are removed by development to form a pattern. The unexposed portions of the composition layer can be removed by development using a developer. As a result, the unexposed portions of the composition layer during the exposure step are dissolved in the developer, leaving only the photocured portions on the support. For example, the temperature of the developer is preferably 20 to 30°C. The development time is preferably 20 to 180 seconds. Furthermore, to improve residue removability, the following process can be repeated multiple times: discarding the developer every 60 seconds and then supplying a new developer.

[0444] As the developer, organic solvents, alkaline developers, etc. can be mentioned, and alkaline developers can be preferably used. As the developer and the cleaning (rinsing) method after development, the developer or cleaning method described in paragraph 0214 of International Publication No. 2022 / 085485 can be used.

[0445] After development, it is preferred to perform additional exposure treatment or heat treatment (post-baking) after drying. Additional exposure treatment or post-baking is a post-development curing treatment for making a fully cured film. For example, the heating temperature in the post-baking is preferably 100 to 240°C, more preferably 200 to 240°C. The developed film can be post-baked in a continuous or batch manner using a heating mechanism such as a hot plate or a convection constant temperature oven (hot air circulation dryer), a high-frequency heater, etc. in such a manner as to achieve the above conditions. In the case of performing additional exposure treatment, the light used for exposure is preferably light with a wavelength of 400nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0446] (When patterning is performed by dry etching)

[0447] When forming a pattern by dry etching, it can be carried out by the following method: a composition layer formed by applying the composition of the present invention on a support is cured to form a cured product layer, then a patterned photoresist layer is formed on the cured product layer, then, using the patterned photoresist layer as a mask, the cured product layer is dry-etched using an etching gas. In the formation of the photoresist layer, a pre-bake treatment is preferably performed. Regarding the content of forming a pattern by dry etching, reference can be made to the description of paragraphs 0010 to 0067 of Japanese Patent Application Publication No. 2013-064993, which is incorporated into this specification.

[0448] <Optical filter>

[0449] The optical filter of the present invention includes the above-mentioned film of the present invention. Examples of the types of optical filters include infrared cut filters and infrared transmission filters.

[0450] In addition to the film of the present invention described above, the optical filter of the present invention may further include a copper-containing layer, a dielectric multilayer film, an ultraviolet absorption layer, and the like. As the ultraviolet absorption layer, for example, the absorption layer described in paragraphs 0040 to 0070 and 0119 to 0145 of International Publication No. 2015 / 099060 may be cited. As the dielectric multilayer film, the dielectric multilayer film described in paragraphs 0255 to 0259 of Japanese Patent Application Publication No. 2014-041318 may be cited. As the copper-containing layer, a glass substrate composed of copper-containing glass (copper-containing glass substrate) or a layer containing a copper complex (copper-containing complex layer) may also be used. As the copper-containing glass substrate, copper-containing phosphate glass, copper-containing fluorophosphate glass, and the like may be cited. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC Techno Glass Co., Ltd.), BG-60 and BG-61 (each manufactured by Schott AG), and CD5000 (manufactured by Hoya Corporation).

[0451] The optical filter of the present invention can be formed on a support. Examples of the support include the above-mentioned supports. Preferred substrates include transparent substrates made of materials such as glass and resin. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene vinyl acetate copolymer, acrylic resins such as norbornene resins, polyacrylates, and polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, and polyvinyl alcohol resins. Examples of glass include soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, and copper-containing glass. Furthermore, the optical filter can be formed directly onto various components.

[0452] <Solid-state imaging device>

[0453] The solid-state imaging element of the present invention comprises the film of the present invention described above. The structure of the solid-state imaging element is not particularly limited as long as it comprises the film of the present invention and functions as a solid-state imaging element. For example, the following structures can be cited.

[0454] The above structure is as follows: a transfer electrode composed of a plurality of photodiodes and polysilicon etc. constituting a light receiving area of a solid-state imaging element is provided on a support, a light shielding film composed of tungsten etc. which is opened only in the light receiving portion of the photodiode is provided on the photodiode and the transfer electrode, a device protection film composed of silicon nitride etc. formed in a manner covering the entire light shielding film and the light receiving portion of the photodiode is provided on the light shielding film, and the film of the present invention is provided on the device protection film. In addition, a structure may be provided in which a focusing mechanism (for example, a microlens etc., the same applies hereinafter) is provided on the device protection film and below the film of the present invention (on the side close to the support), or a structure may be provided in which a focusing mechanism is provided on the film of the present invention. Furthermore, the color filter may also have a structure in which a film forming each pixel is embedded in a space divided into, for example, a grid shape by partition walls. In this case, the partition walls preferably have a lower refractive index than that of each pixel. Examples of imaging devices having such a configuration include those described in Japanese Patent Application Laid-Open Nos. 2012-227478 and 2014-179577.

[0455] <Image Display Device>

[0456] The film of the present invention can also be used in an image display device. As the image display device, a liquid crystal display device, an organic electroluminescent (organic EL) display device, etc. can be cited. The definition or details of the image display device are, for example, recorded in "Electronic Display Device (written by Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)", "Display Device (written by Junsho Ibuki, Sangyo Tosho Publishing Co., Ltd., published in 1989)", etc. In addition, regarding the liquid crystal display device, for example, it is recorded in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., published in 1994)". There is no particular limitation on the liquid crystal display device to which the present invention can be applied. For example, it can be applied to liquid crystal display devices of various types recorded in the above-mentioned "Next Generation Liquid Crystal Display Technology". The image display device can have a white organic EL element. As the white organic EL element, a tandem structure is preferred. The series structure of organic EL elements is described in Japanese Patent Application Publication No. 2003-045676, edited by Akiyoshi Mikami, "The Cutting Edge of Organic EL Technology Development - High Brightness, High Precision, Long Life, Technology Collection", TECHNICAL INFORMATION INSTITUTE CO., LTD., pp. 326-328, 2008. The spectrum of white light emitted by the organic EL element preferably has strong maximum emission peaks in the blue region (430-485 nm), the green region (530-580 nm) and the yellow region (580-620 nm). More preferably, in addition to these emission peaks, it further has a maximum emission peak in the red region (650-700 nm). The film of the present invention can also be used as an infrared-transmitting film provided in an opening for infrared communication formed in a frame portion of a protective plate for a display device.

[0457] <Infrared sensor>

[0458] The film of the present invention can also be used in an infrared sensor. The structure of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. An embodiment of the infrared sensor will be described below using the accompanying drawings.

[0459] exist Figure 1 In the figure, reference numeral 110 denotes a solid-state imaging element. An infrared cut filter 111 and an infrared transmission filter 114 are disposed on the imaging area of the solid-state imaging element 110. Furthermore, a color filter 112 is disposed on the infrared cut filter 111. A microlens 115 is disposed on the incident light hv side of the color filter 112 and the infrared transmission filter 114. A planarization layer 116 is formed to cover the microlens 115.

[0460] The composition of the present invention can be used to form an infrared cutoff filter 111. The color filter 112 is a color filter formed with pixels that transmit and absorb light of a specific wavelength in the visible region. It is not particularly limited, and a color filter for pixel formation known in the past can be used. For example, a color filter formed with red (R), green (G), and blue (B) pixels can be used. For example, reference can be made to the records in paragraphs 0214 to 0263 of Japanese Patent Publication No. 2014-043556, which are incorporated into this specification. The characteristics of the infrared transmission filter 114 can be selected according to the emission wavelength of the infrared LED used. The infrared transmission filter 114 can be formed using the composition of the present invention.

[0461] exist Figure 1 In the infrared sensor shown, an infrared cutoff filter (another infrared cutoff filter) different from the infrared cutoff filter 111 may be further disposed on the planarization layer 116. Examples of other infrared cutoff filters include those having a copper-containing layer and / or a dielectric multilayer film. Details of these are as described above. Furthermore, a dual-bandpass filter may be used as the other infrared cutoff filter.

[0462] <Camera Module>

[0463] The film of the present invention can also be used in a camera module. The structure of the camera module is not particularly limited as long as it has the structure of the film of the present invention and functions as a camera module. For example, as a camera module, a structure having a solid-state imaging element, a lens, and a circuit for processing the image obtained from the solid-state imaging element can be cited. As the lens for the camera module and the circuit for processing the image obtained from the above-mentioned solid-state imaging element, a known circuit can be used. As examples of camera modules, reference can be made to the camera modules described in Japanese Patent Application Publication No. 2016-006476 and Japanese Patent Application Publication No. 2014-197190, and these contents are incorporated into this specification.

[0464] <Light-emitting element>

[0465] The film of the present invention can also be used in a light-emitting element. The structure of the light-emitting element is not particularly limited as long as it functions as a light-emitting element, and examples thereof include light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), quantum dot light-emitting diodes (QLEDs), and vertical cavity surface-emitting lasers (VCSELs). The film of the present invention can be formed directly on the light-emitting element or arranged on the light-emitting path.

[0466] <Optical Communication Components>

[0467] The film of the present invention can also be used in optical communication components. The structure of the optical communication component is not particularly limited as long as it functions as an optical communication component, and can be a transmitting component or a receiving component. Examples of optical communication components include infrared remote controls, infrared transceivers, optical inserters, and optical interconnects. The film of the present invention can be formed directly on a receiving component or a transmitting component, and can also be arranged on a transmitting and receiving path.

[0468] Example

[0469] The present invention is further described in detail below with reference to the following examples. The materials, amounts used, ratios, treatment contents, and treatment sequences shown in the following examples may be modified as appropriate without departing from the spirit of the present invention. Furthermore, in the structural formula shown below, Me represents a methyl group, i-Pr represents an isopropyl group, and Ph represents a phenyl group.

[0470] <Preparation of Pigment Solution>

[0471] 8 parts by mass of the pigment (dyes) listed in the following table and 92 parts by mass of the solvent listed in the following table were mixed to prepare a pigment solution.

[0472] [Table 3]

[0473] pigment solvent Pigment solvent 1 DSQ-3 S-1 Pigment solvent 2 DCY-1 S-1 Pigment solvent 3 DPP-1 S-1 Pigment solvent 4 DSQ-5 S-1 Pigment solvent 5 DSQ-8 S-1 Pigment solvent 6 DSQ-17 S-1 Pigment solvent 7 DCY-3 S-1 Pigment solvent 8 DCY-4 S-1 Pigment solvent 9 DCY-16 S-1 Pigment solvent 10 DSQ-1 S-1

[0474] The raw materials described in the above table are as follows.

[0475] (pigment)

[0476] DSQ-1: Compound with the following structure (infrared absorbing pigment, dye)

[0477] [Chemical Formula 29]

[0478]

[0479] DSQ-3: Compound with the following structure (infrared absorbing pigment, dye)

[0480] [Chemical formula 30]

[0481]

[0482] DSQ-5: Compound with the following structure (infrared absorbing pigment, dye)

[0483] [Chemical Formula 31]

[0484]

[0485] DSQ-8: Compound with the following structure (infrared absorbing pigment, dye)

[0486] [Chemical Formula 32]

[0487]

[0488] DSQ-17: Compound with the following structure (infrared absorbing pigment, dye)

[0489] [Chemical Formula 33]

[0490]

[0491] DCY-1: Compound with the following structure (infrared absorbing pigment, dye)

[0492] [Chemical Formula 34]

[0493]

[0494] DCY-3: Compound with the following structure (infrared absorbing pigment, dye)

[0495] [Chemical Formula 35]

[0496]

[0497] DCY-4: Compound with the following structure (infrared absorbing pigment, dye)

[0498] [Chemical Formula 36]

[0499]

[0500] DCY-16: Compound with the following structure (infrared absorbing pigment, dye)

[0501] [Chemical Formula 37]

[0502]

[0503] DPP-1: Compound with the following structure (infrared absorbing pigment, dye)

[0504] [Chemical Formula 38]

[0505]

[0506] (Solvent)

[0507] S-1: Propylene glycol monomethyl ether acetate

[0508] <Preparation of Dispersion>

[0509] 2 parts by mass of the coloring matter (pigment) listed in the following table, 0.4 parts by mass of the derivative listed in the following table, 9 parts by mass of the dispersant listed in the following table, 28.6 parts by mass of the solvent listed in the following table, and 40 parts by mass of zirconia beads having a diameter of 0.3 mm were mixed and dispersed for 5 hours using a paint shaker. The beads were then separated by filtration to prepare a dispersion.

[0510] [Table 4]

[0511] pigment derivative dispersants solvent Dispersion 1 PCY-1 PCYS-1 D-2 S-1 Dispersion 2 PIN-1 PAZS-1 D-1 S-1 Dispersion 3 PPC-1 PAZS-1 D-1 S-1 Dispersion 4 PPP-1 PAZS-1 D-1 S-1

[0512] The raw materials described in the above table are as follows.

[0513] (Color)

[0514] PCY-1: Compound with the following structure (infrared absorbing dye, pigment)

[0515] [Chemical Formula 39]

[0516]

[0517] PIN-1: A mixture of compounds of the following structures (mixing ratio: (PIN-1-a): (PIN-1-b): (PIN-1-c) = 81:17:2, infrared absorbing dye, pigment)

[0518] [Chemical Formula 40]

[0519]

[0520] PPC-1: A mixture of compounds of the following structures (mixing ratio: (PPC-1-a):{(PPC-1-b)+(PPC-1-c)}:(PPC-1-d):(PPC-1-e)=7:19:59:15, infrared absorbing dye, pigment)

[0521] [Chemical Formula 41]

[0522]

[0523] PPP-1: Compound with the following structure (infrared absorbing dye, pigment)

[0524] [Chemical Formula 42]

[0525]

[0526] (derivative)

[0527] PCYS-1: Compound with the following structure

[0528] PAZS-1: Compound with the following structure

[0529] [Chemical Formula 43]

[0530]

[0531] (Dispersant)

[0532] D-1: A solution prepared by adjusting the solid content concentration of the resin having the following structure (the numbers indicated on the main chain are molar ratios, and the numbers indicated on the side chains are the number of repeating units; weight average molecular weight: 38900, carboxyl group content: 1.770 mmol / g) to 20% by mass using a mixed solution of propylene glycol monomethyl ether acetate:propylene glycol monomethyl ether = 9:1 (mass ratio)

[0533] [Chemical Formula 44]

[0534]

[0535] D-2: A solution prepared by adjusting the solid content concentration of the resin having the following structure (the numbers indicated on the main chain are molar ratios, and the numbers indicated on the side chains are the number of repeating units: weight average molecular weight 21000, carboxyl group content 0.643 mmol / g, hydroxyl group content 0.027 mmol / g, amine value 47.0 mgKOH / g) to 20% by mass using a mixed solution of propylene glycol monomethyl ether acetate:propylene glycol monomethyl ether = 9:1 (mass ratio)

[0536] [Chemical Formula 45]

[0537]

[0538] (Solvent)

[0539] S-1: Propylene glycol monomethyl ether acetate

[0540] <Manufacturing of Composition>

[0541] Each raw material was mixed in any ratio of the following formulas 1 to 4, and then filtered through a nylon filter with a pore size of 0.45 μm (manufactured by Nihon Pall Ltd.) to produce each composition. In the following table, the value of the ratio of the product of the content (mmol / g) of the group represented by the formula (BI-1) of the specific compound and the content (mass %) of the specific compound in the composition to the content (mmol / g) of the hydroxyl and carboxyl groups in the resin having at least one group selected from hydroxyl and carboxyl groups and the content (mass %) of the resin having at least one group selected from hydroxyl and carboxyl groups in the composition is recorded in the "Ratio 1" column. In addition, dispersants D-1, D-2, and resins E-1 to E-4 are raw materials equivalent to "resins having at least one group selected from hydroxyl and carboxyl groups".

[0542] <Recipe 1>

[0543] Dispersion liquid described in the following table... 16 parts by mass

[0544] The resins listed in the table below... The blending amounts listed in the table below

[0545] The specific compounds listed in the table below…the amounts listed in the table below

[0546] 0.45 parts by mass of the polymerizable compound listed in the table below

[0547] 0.45 parts by mass of the photopolymerization initiator listed in the table below

[0548] Polymerization inhibitor (p-methoxyphenol) ... 0.001 parts by mass

[0549] Surfactants listed in the following table... 0.0075 parts by mass

[0550] Solvents listed in the following table... 23 parts by mass

[0551] <Recipe 2>

[0552] Dispersion liquid described in the following table... 16 parts by mass

[0553] The resins listed in the table below... The blending amounts listed in the table below

[0554] The specific compounds listed in the table below…the amounts listed in the table below

[0555] 0.40 parts by mass of the polymerizable compound listed in the table below

[0556] Photopolymerization initiator listed in the following table: 0.40 parts by mass

[0557] Polymerization inhibitor (p-methoxyphenol) ... 0.001 parts by mass

[0558] Surfactants listed in the following table... 0.0075 parts by mass

[0559] Other additives listed in the following table: 0.10 parts by mass

[0560] Solvents listed in the following table... 23 parts by mass

[0561] <Recipe 3>

[0562] Pigment solution listed in the following table...15 parts by mass

[0563] The resins listed in the table below... The blending amounts listed in the table below

[0564] The specific compounds listed in the table below…the amounts listed in the table below

[0565] 0.45 parts by mass of the polymerizable compound listed in the table below

[0566] 0.45 parts by mass of the photopolymerization initiator listed in the table below

[0567] Polymerization inhibitor (p-methoxyphenol) ... 0.001 parts by mass

[0568] Surfactants listed in the following table... 0.00075 parts by mass

[0569] Solvents listed in the following table... 23 parts by mass

[0570] <Recipe 4>

[0571] Pigment solution listed in the following table...15 parts by mass

[0572] The resins listed in the table below... The blending amounts listed in the table below

[0573] The specific compounds listed in the table below…the amounts listed in the table below

[0574] 0.40 parts by mass of the polymerizable compound listed in the table below

[0575] Photopolymerization initiator listed in the following table: 0.40 parts by mass

[0576] Polymerization inhibitor (p-methoxyphenol) ... 0.001 parts by mass

[0577] Surfactants listed in the following table... 0.00075 parts by mass

[0578] Other additives listed in the following table: 0.10 parts by mass

[0579] Solvents listed in the following table... 23 parts by mass

[0580] <Recipe 5>

[0581] Dispersion liquid described in the following table... 16 parts by mass

[0582] The resins listed in the table below... The blending amounts listed in the table below

[0583] The specific compounds listed in the table below…the amounts listed in the table below

[0584] Surfactants listed in the following table... 0.0075 parts by mass

[0585] Solvents listed in the following table... 24 parts by mass

[0586] <Recipe 6>

[0587] Pigment solution listed in the following table...15 parts by mass

[0588] The resins listed in the table below... The blending amounts listed in the table below

[0589] The specific compounds listed in the table below…the amounts listed in the table below

[0590] Surfactants listed in the following table... 0.0075 parts by mass

[0591] Solvents listed in the following table... 24 parts by mass

[0592] <Recipe 7>

[0593] Dispersion liquid described in the following table... 16 parts by mass

[0594] The resins listed in the table below... The blending amounts listed in the table below

[0595] The specific compounds listed in the table below…the amounts listed in the table below

[0596] Surfactants listed in the following table... 0.0075 parts by mass

[0597] Other additives listed in the following table: 0.10 parts by mass

[0598] Solvents listed in the following table... 24 parts by mass

[0599] <Recipe 8>

[0600] Pigment solution listed in the following table...15 parts by mass

[0601] The resins listed in the table below... The blending amounts listed in the table below

[0602] The specific compounds listed in the table below…the amounts listed in the table below

[0603] Surfactants listed in the following table... 0.0075 parts by mass

[0604] Other additives listed in the following table: 0.10 parts by mass

[0605] Solvents listed in the following table: 24 parts by mass [Table 5]

[0606]

[0607] [Table 6]

[0608]

[0609] [Table 7]

[0610]

[0611] [Table 8]

[0612]

[0613] The raw materials described in the above table are as follows.

[0614] (Dispersion)

[0615] Pigment solution 1-10: Pigment solution 1-10 as above

[0616] Dispersions 1 to 4: Dispersions 1 to 4 described above

[0617] (resin)

[0618] E-1: Resin with the following structure (weight average molecular weight 14,000, carboxyl group content 1.375 mmol / g, the numerical values attached to the main chain represent the mass ratio of the repeating units.)

[0619] [Chemical Formula 46]

[0620]

[0621] E-2: Resin with the following structure (weight average molecular weight 40,000, carboxyl group content 1.785 mmol / g, hydroxyl group content 0 mmol / g, the numerical values attached to the main chain represent the mass ratio of the repeating units.)

[0622] [Chemical Formula 47]

[0623]

[0624] E-3: Resin with the following structure (weight average molecular weight 14,000, carboxyl content 1.392 mmol / g, hydroxyl content 1.392 mmol / g, the numerical values attached to the main chain represent the mass ratio of the repeating units)

[0625] [Chemical Formula 48]

[0626]

[0627] E-4: 257.3 g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube. The mixture was stirred while replacing the atmosphere with nitrogen and the temperature was raised to 78° C. Subsequently, a mixture of 22.4 g of dicyclopentyl methacrylate, 17.2 g of methacrylic acid, 49.8 g of methyl methacrylate, and 63.0 g of 2-[[[2-methyl-1-oxo-2-propenyl]oxy]ethyl]amino]carbonyl]-1,3-diethyl malonate and 11.0 g of 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in 78.7 g of propylene glycol monomethyl ether acetate was added dropwise to the flask through an acryl dropping funnel. After completion of the dropwise addition, the mixture was stirred at 78° C. for 3 hours to synthesize a resin having the following structure (weight average molecular weight 9500, carboxyl content 1.339 mmol / g, hydroxyl content 0.730 mmol / g, resin having a group represented by formula (BI-1)).

[0628] [Chemical Formula 49]

[0629]

[0630] (Specific Compound)

[0631] A-1 to A-4, A-7 to A-10, A-12, A-14, A-16, B-2, B-7, B-8, B-10, B-12 to B-16: Compounds A-1 to A-4, A-7 to A-10, A-12, A-14, A-16, B-2, B-7, B-8, B-10, B-12 to B-16 shown as specific examples of the above-mentioned specific compounds (all of these compounds contain two or more groups represented by formula (BI-1) in the molecule, generate isocyanate groups by heating at 170° C. for 5 minutes, and have a molecular weight of 4000 or less)

[0632] (Polymerizable compound)

[0633] M-1: ARONIX M-305 (manufactured by Toagosei Company, Limited, a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. The content of pentaerythritol triacrylate is 55% to 63% by mass.)

[0634] M-2: KAYARAD DPHA (a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd.)

[0635] (Photopolymerization initiator)

[0636] C-1 to C-3: Compounds with the following structures

[0637] [Chemical Formula 50]

[0638]

[0639] (Surfactant)

[0640] H-1: MEGAFACE RS-72-K (manufactured by DIC Corporation, fluorine-based surfactant)

[0641] H-2: Compound with the following structure (silicone surfactant, number average molecular weight 1800)

[0642] [Chemical Formula 51]

[0643]

[0644] (additive)

[0645] Ad-1 to Ad-2: Compounds with the following structures (antioxidants)

[0646] Ad-3 to Ad-5: Compounds of the following structures (ultraviolet absorbers)

[0647] Ad-6: Compound with the following structure (silane coupling agent)

[0648] Ad-7: Compound with the following structure (epoxy resin)

[0649] [Chemical Formula 52]

[0650]

[0651] (Solvent)

[0652] S-1: Propylene glycol monomethyl ether acetate

[0653] <Film Production>

[0654] (Manufacturing Example 1) Method for manufacturing films using the compositions of Examples 101 to 148 and Comparative Example 101: Each composition was applied to a glass substrate by spin coating, and then heated at 70°C for 1 minute using a hot plate to obtain a composition layer. An i-ray stepper was used at 500 mJ / cm 2 The obtained composition layer was exposed to an exposure amount of .

[0655] The substrate was then spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% potassium hydroxide at 23°C, rinsed with ion-exchanged water, and air-dried. The exposed composition layer was then heated and cured at 120°C for 30 minutes using a hot plate, producing a 1.5 μm thick film.

[0656] (Manufacturing Example 2) Method for manufacturing a film using the composition of Examples 101 to 148 and Comparative Example 101

[0657] In Manufacturing Example 1, an i-ray stepper was used to generate 500 mJ / cm 2 When exposing to an exposure amount of 1 μm, exposure is performed through a photomask with a stripe pattern with a width of 1 μm to 5 μm and a scale of 1 μm in width. In addition, a film with a thickness of 1.5 μm and a pattern (thin line) with a width of 1 μm, 2 μm, 3 μm, 4 μm or 5 μm is manufactured in the same manner as in Manufacturing Example 1.

[0658] (Manufacturing Example 3) Method for manufacturing a film using the composition of Examples 201 to 248 and Comparative Example 201

[0659] Each composition was applied to a glass substrate by spin coating and then heated on a hot plate at 70°C for 1 minute to obtain a composition layer. The obtained composition layer was heated on a hot plate at 120°C for 30 minutes for curing, thereby producing a film with a thickness of 1.5 μm.

[0660] <Evaluation of Solvent Resistance>

[0661] The films obtained in Production Examples 1 and 3 were immersed in propylene glycol monomethyl ether acetate at 23°C for 30 minutes, then washed with ion-exchanged water and air-dried. The optical density (OD) of the films before and after immersion in propylene glycol monomethyl ether acetate was measured, and the OD change rate was calculated according to the following formula. Based on the OD change rate values, solvent resistance was evaluated according to the following criteria.

[0662] OD change rate = (|OD1-OD2| / OD1) × 100

[0663] OD1: Optical density of the film before immersion in propylene glycol monomethyl ether acetate

[0664] OD2: Optical density of the film after immersion in propylene glycol monomethyl ether acetate

[0665] -Evaluation Criteria-

[0666] A: OD change rate is less than 2%

[0667] B: OD change rate is 2% or more and less than 4%

[0668] C: OD change rate is 4% or more and less than 6%

[0669] D: OD change rate is more than 6%

[0670] <Evaluation of Adhesion>

[0671] The film obtained in Production Example 2 was observed with a scanning electron microscope (SEM) to confirm the minimum line width at which the thin lines remained without being damaged, and the adhesiveness was evaluated according to the following criteria.

[0672] -Evaluation Criteria-

[0673] A: Thin lines with a width of less than 2 μm remain without any defects.

[0674] B: There is a chip in the thin line with a width of less than 2 μm, but there is no chip and remains in the thin line with a width of 3 μm or more.

[0675] C: There is a defect in the thin line with a width of 5μm

[0676] <Evaluation of Light Resistance>

[0677] The films obtained in Production Examples 1 and 3 were irradiated with light at 100,000 Lux for 50 hours using a xenon arc lamp light resistance tester. The spectral transmittance of the films was measured before and after light irradiation, and the spectral fluctuation factor ΔT was calculated using the following formula. Light resistance was evaluated according to the following criteria.

[0678] Spectral fluctuation rate ΔT = (|T02-T12|÷T02)×100

[0679] T02: Transmittance of the film at the maximum absorption wavelength before light irradiation

[0680] T12: Transmittance of the film at the maximum absorption wavelength after light irradiation

[0681] -Evaluation Criteria-

[0682] A: Spectral fluctuation rate ΔT is less than 5%

[0683] B: Spectral fluctuation rate ΔT is 5% or more and less than 8%

[0684] C: Spectral fluctuation rate ΔT is 8% or more

[0685] [Table 9]

[0686]

[0687] [Table 10]

[0688]

[0689] As shown in the above table, the films obtained using the compositions of Examples were excellent in solvent resistance.

[0690] Explanation of symbols

[0691] 110 - solid-state imaging element, 111 - infrared cut filter, 112 - color filter, 114 - infrared transmission filter, 115 - microlens, 116 - planarization layer.

Claims

1. A composition comprising: infrared absorbing pigments; Compound B, which is a compound containing two or more groups represented by formula (BI-1) in the molecule and generating an isocyanate group by heating at 170° C. for 5 minutes, and has a molecular weight of 4000 or less; Resin C having at least one group selected from a hydroxyl group and a carboxyl group; and solvents, In formula (BI-1), the wavy line represents a connecting bond, and R represents a residue derived from a compound selected from oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, triazole compounds, and imide compounds.

2. The composition according to claim 1, wherein R in the formula (BI-1) is a group represented by any of the formulas (RB-1) to (RB-5), In the formula, * represents a connecting bond, R B-1 ~R B-11 Each independently represents a hydrogen atom or a substituent, R B-1 With R B-2 are optionally bonded to each other to form a ring, R B-10 With R B-11 They are optionally bonded to each other to form a ring.

3. The composition according to claim 1 or 2, wherein The compound B is a compound represented by formula (b-1) or formula (b-2), In formula (b-1), R b1 and R b2 Each independently represents a group represented by the formula (BI-1), L b1 represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group, In formula (b-2), R b11 represents a group represented by the formula (BI-1), R b12 represents a hydrogen atom or a substituent, L b11 represents an m+n valence linking group, L b21 and L b22 Each independently represents a divalent linking group having an aromatic hydrocarbon group, a cyclic aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group, m represents an integer greater than or equal to 2, n represents an integer greater than or equal to 0, m+n is an integer of 3 or greater.

4. The composition according to claim 3, wherein L of the formula (b-2) b11 is a group represented by any of formulae (L-1) to (L-5), The wavy lines in the formula represent connecting bonds.

5. The composition according to claim 1 or 2, wherein The molecular weight of the compound B is 2500 or less.

6. The composition according to claim 1 or 2, wherein The compound B is a compound that generates an isocyanate group by heating at 70° C. to 150° C. for 5 minutes.

7. The composition according to claim 1 or 2, wherein The infrared absorbing pigment is at least one selected from pyrrolopyrrole compounds, squaric acid compounds, crotonium compounds, polymethine compounds, indigo compounds, phthalocyanine compounds, naphthalocyanine compounds, imine compounds, quartacene compounds, ammonium compounds, azo compounds, anthraquinone compounds, porphyrin compounds, oxocyanine compounds and hexa-membered porphyrin compounds.

8. The composition according to claim 1 or 2, wherein The composition satisfies the conditions of formula (1-1), 0.2≤((B 1 ×M b1 ) / (C 1 ×M c1 ))≤2.0 (1-1) In formula (1-1), B 1 is the content of the group represented by formula (BI-1) in compound B, in mmol / g, M b1 is the content of compound B in the composition, expressed in mass %. C 1 is the total content of hydroxyl and carboxyl groups in resin C, in mmol / g, M c1 is the content of the resin C in the composition, and its unit is mass %.

9. The composition according to claim 1 or 2, further comprising a polymerizable compound.

10. A film obtained using the composition according to claim 1 or 2. An optical filter comprising the film according to claim 10 . 12 . A solid-state imaging element comprising the film according to claim 10 .

Citation Information

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