Infrared unfreezing method and device, electronic device, storage medium and refrigerator

Abstract

The invention relates to an infrared unfreezing method and device, an electronic device, a storage medium and a refrigerator, and the infrared unfreezing method comprises the following steps: obtaining the thickness of a to-be-unfrozen object, and determining a first infrared ray according to the thickness of the to-be-unfrozen object; obtaining the temperature of a partial freezing chamber in real time, and adjusting the wavelength of the first infrared ray according to the temperature of the partial freezing chamber to obtain a target unfreezing infrared ray; and heating and unfreezing the to-be-unfrozen object by adopting the target unfreezing infrared ray according to a preset heating control logic. Through the application, the problems of non-uniform thawing and low efficiency are solved, uniform thawing is realized, and the thawing efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of refrigerators, and in particular to an infrared thawing method, device, electronic device, storage medium and refrigerator. Background Art

[0002] In today's world, with the continuous improvement of people's living standards and the growing demand for food preservation and convenient handling, refrigerators, as indispensable kitchen appliances, are experiencing rapid development and transformation in their technology. Refrigerators are no longer limited to traditional refrigeration and freezing, but are gradually expanding in a variety of functions. The advent of food thawing functions has brought great convenience to consumers, allowing them to handle frozen food more efficiently, eliminating the long wait for food to thaw naturally, thus saving valuable time.

[0003] Refrigerators with food defrosting functions are now widely available on the market. The thawing technology used in these refrigerators is mainly based on the method of heating with a heat source. Currently, air heating, radio frequency heating, ultrasonic heating, and ohmic resistance heating are mainly used to transfer heat to the food for defrosting. Usually, thawing control is to determine the thawing time of the food by detecting the temperature of the food surface or the weight of the food. Although this judgment method can provide a reference for the thawing time to a certain extent, due to the differences in texture, composition, and initial freezing state of different foods, most of the energy is still concentrated on the surface of the food when relying solely on the two parameters of food surface temperature or weight. During the thawing process, the food surface is prone to over-thawing, resulting in uneven thawing and slow thawing speed. This in turn affects the quality and efficiency of food thawing and cannot meet consumers' demand for high-quality and precise thawing.

[0004] With regard to the problems of uneven thawing and low efficiency in related technologies, no effective solution has been proposed so far. Summary of the Invention

[0005] In this embodiment, an infrared thawing method, device, electronic device, storage medium and refrigerator are provided to solve the problems of uneven thawing and low efficiency in the related art.

[0006] In a first aspect, this embodiment provides an infrared thawing method, comprising:

[0007] obtaining the thickness of the object to be thawed, and determining the first infrared ray according to the thickness of the object to be thawed;

[0008] acquiring the temperature of the micro-freezing chamber in real time, and adjusting the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain target thawing infrared ray;

[0009] According to a preset heating control logic, the target thawing infrared ray is used to heat and thaw the object to be thawed.

[0010] In some embodiments, obtaining the thickness of the object to be thawed and determining the first infrared ray according to the thickness of the object to be thawed includes:

[0011] When the thickness of the object to be thawed reaches a preset first thickness, using far infrared rays as the first infrared rays;

[0012] When the thickness of the object to be thawed reaches a preset second thickness, using mid-infrared rays as the first infrared rays;

[0013] When the thickness of the object to be thawed reaches a preset third thickness, using near infrared rays as the first infrared rays;

[0014] Wherein, the first thickness is smaller than the second thickness and smaller than the third thickness.

[0015] In some embodiments, the step of acquiring the temperature of the micro-freezing chamber in real time and adjusting the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain the target thawing infrared ray includes:

[0016] acquiring the temperature of the micro-freezing chamber in real time, and when the temperature of the micro-freezing chamber is lower than a preset first temperature threshold, adjusting the wavelength of the first infrared ray to a non-atmospheric high transmittance wavelength;

[0017] When the temperature of the micro-freezing chamber is greater than a preset second temperature threshold, the wavelength of the first infrared ray is adjusted to a wavelength with high atmospheric transmittance, wherein the first temperature threshold is less than the second temperature threshold.

[0018] In some embodiments, the method of heating and thawing the object to be thawed using the target thawing infrared ray according to a preset heating control logic includes:

[0019] When the target thawing infrared ray is far infrared ray, heating and thawing the object to be thawed for a first time period;

[0020] When the target thawing infrared ray is a mid-infrared ray, heating and thawing the object to be thawed for a second time period;

[0021] When the target thawing infrared ray is near infrared ray, heating and thawing the object to be thawed for a third time period;

[0022] The first duration is smaller than the second duration and smaller than the third duration.

[0023] In some embodiments, the heating and thawing of the object to be thawed by the target thawing infrared light according to the preset heating control logic comprises:

[0024] The cycle heating and thawing process is performed until the heating and thawing time of the object to be thawed reaches the preset thawing time, wherein the preset thawing time is the first time, the second time or the third time, and the cycle heating and thawing process comprises:

[0025] In step S1, the current temperature of the object to be thawed is obtained.

[0026] In step S2, the target power of the target thawing infrared light is determined according to the temperature range in which the current temperature of the object to be thawed is located.

[0027] In step S3, the object to be thawed is heated and thawed by the target power of the target thawing infrared light for a preset fourth time, and then heating is stopped for a preset fifth time, and the current temperature of the object to be thawed is detected.

[0028] In step S4, it is judged whether the temperature of the object to be thawed is greater than a preset third temperature threshold, if yes, step S5 is executed, otherwise, step S2 is executed.

[0029] In step S5, the heating is stopped, and the temperature of the object to be thawed is continuously detected, and when the temperature of the object to be thawed is lower than a preset fourth temperature threshold, step S1 is returned to be executed.

[0030] In a second aspect, an infrared thawing device is provided in the embodiment, which applies the infrared thawing method of the first aspect, and comprises a micro-freezing chamber, an infrared emitting device, a first temperature sensor, a second temperature sensor and a position detector, wherein

[0031] The infrared emitting device is arranged on the top of the micro-freezing chamber and is used to provide target thawing infrared light of different wavelengths.

[0032] The first temperature sensor is arranged in the micro-freezing chamber and is used to detect the temperature of the micro-freezing chamber in real time.

[0033] The second temperature sensor is arranged in the micro-freezing chamber and is used to detect the temperature of the object to be thawed.

[0034] The position detector is used to detect the thickness of the object to be thawed.

[0035] In a third aspect, a refrigerator is provided in the embodiment, which applies the infrared thawing method of the first aspect and comprises the infrared thawing device of the second aspect.

[0036] In a fourth aspect, an infrared thawing device is provided in this embodiment, including: a determination module, an adjustment module, and a thawing module, wherein:

[0037] The determining module is used to obtain the thickness of the object to be thawed, and determine the first infrared ray according to the thickness of the object to be thawed;

[0038] The adjustment module is used to obtain the temperature of the micro-freezing chamber in real time, and adjust the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain the target thawing infrared ray;

[0039] The thawing module is used to heat and thaw the object to be thawed using the target thawing infrared rays according to a preset heating control logic.

[0040] In a fifth aspect, an electronic device is provided in this embodiment, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the infrared thawing method described in the first aspect when executing the computer program.

[0041] In a sixth aspect, a storage medium is provided in this embodiment, on which a computer program is stored. When the program is executed by a processor, the infrared thawing method described in the first aspect is implemented.

[0042] Compared with the related art, the infrared thawing method provided in this embodiment obtains the thickness of the object to be thawed, determines the first infrared ray according to the thickness of the object to be thawed; obtains the temperature of the micro-freezing chamber in real time, adjusts the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber, and obtains the target thawing infrared ray; according to the preset heating control logic, uses the target thawing infrared ray to heat and thaw the object to be thawed, solves the problems of uneven thawing and low efficiency, achieves uniform thawing, and improves thawing efficiency.

[0043] The details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0045] Figure 1 This is a hardware structure block diagram of the terminal of the infrared thawing method of this embodiment.

[0046] Figure 2 Flowchart of the infrared thawing method of this embodiment.

[0047] Figure 3 is a heating flowchart of the infrared thawing method of the present embodiment.

[0048] Figure 4 is a flowchart of another infrared thawing method of the present embodiment.

[0049] Figure 5 is a structural block diagram of the infrared thawing apparatus of the present embodiment.

[0050] Figure 6 is a structural block diagram of the infrared thawing apparatus of the present embodiment. DETAILED DESCRIPTION

[0051] For the purpose of more clearly understanding the present application, technical solutions and advantages, the present application is described and explained below in connection with the drawings and embodiments.

[0052] Unless otherwise defined, technical terms or scientific terms used in the present application shall have the general meaning understood by a person skilled in the art to which the present application belongs. In the present application, the terms "one", "a", "an", "the", "these", and similar words do not represent a quantitative limitation, but can be singular or plural. In the present application, the terms "include", "contain", "have", and any variants thereof, have the purpose of encompassing non-exclusive inclusion; for example, a process, method and system, product or device containing a series of steps or modules (units) are not limited to the listed steps or modules (units), but can include steps or modules (units) not listed, or can include other steps or modules (units) inherent to the process, method, product or device. In the present application, the terms "connected", "connected", "coupled" and similar words do not limit to physical or mechanical connection, but can include electrical connection, whether direct or indirect. In the present application, "multiple" means two or more. The association between the associated objects is described by the term "and / or", which means that there can be three relationships, for example, "A and / or B" can mean that A exists alone, A and B exist together, and B exists alone. In general, the character " / " represents an "or" relationship between the associated objects. In the present application, the terms "first", "second", "third", and the like, are only used to distinguish similar objects, and do not represent a specific order of the objects.

[0053] The method embodiments provided in the present embodiment can be executed in a terminal, a computer or a similar computing device. For example, the method embodiments are executed on a terminal, Figure 1 is a hardware structural block diagram of the terminal of the infrared thawing method of the present embodiment. As shown in Figure 1 , the terminal can include one or more (CPU) 1001, ROM 1002, and RAM 1003. Figure 1The terminal shown in FIG. 1 includes only one processor 102 and a memory 104 for storing data, wherein the processor 102 can include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA. The terminal can also include a transmission device 106 for communication function and an input / output device 108. Those skilled in the art can understand that Figure 1 The structure shown in FIG. 1 is only schematic and does not limit the structure of the terminal. For example, the terminal can include more or fewer components than those shown in FIG. 1, or have a different configuration from that shown in FIG. 1. Figure 1 The terminal shown in FIG. 1 includes only one processor 102 and a memory 104 for storing data, wherein the processor 102 can include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA. The terminal can also include a transmission device 106 for communication function and an input / output device 108. Those skilled in the art can understand that Figure 1 The structure shown in FIG. 1 is only schematic and does not limit the structure of the terminal. For example, the terminal can include more or fewer components than those shown in FIG. 1, or have a different configuration from that shown in FIG. 1.

[0054] The memory 104 can be used to store computer programs, such as software programs of application software and modules, such as the computer program corresponding to the infrared thawing method in the present embodiment. The processor 102 can execute various functional applications and data processing by running the computer programs stored in the memory 104, i.e., implement the method described above. The memory 104 can include a high-speed random access memory and can also include a non-volatile memory, such as one or more magnetic storage devices, flash memories, or other non-volatile solid-state memories. In some examples, the memory 104 can further include a memory remotely arranged with respect to the processor 102, and these remote memories can be connected to the terminal through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0055] The transmission device 106 is used to receive or send data via a network. The network includes a wireless network provided by a communication provider of the terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, NIC) which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (Radio Frequency, RF) module which is used to communicate with the Internet in a wireless manner.

[0056] In the present embodiment, an infrared thawing method is provided, Figure 2 The flowchart of the infrared thawing method of the present embodiment is shown in FIG. 2, which includes the following steps: Figure 2

[0057] In step S201, the thickness of the object to be thawed is obtained, and a first infrared ray is determined according to the thickness of the object to be thawed.

[0058] ​Specifically, the food thawing is taken as an example in the embodiment for illustration, but the infrared thawing method of the embodiment is not limited to thawing food, and other objects to be thawed are also applicable. In the food thawing process, the thawing speed of the food is often related to the size, shape and thickness of the food, among which the thickness of the food has the greatest impact on the thawing speed of the food. And the thickness of the food also affects the uniformity of the food thawing. At present, when thawing food by infrared, the absorption wavelength of food to infrared is more concentrated in the far infrared range. When the food is thin, the food surface can better absorb the infrared radiation energy using far infrared heating, and the thawing speed is fast. But when the food is thick, there is often a state that the surface of the food is over-thawed, while the inside of the food is not thawed, resulting in uneven thawing of the food and affecting the thawing effect of the food. To this end, in the embodiment, the thickness of the food is detected before thawing the food. For example, the thickness of the food is detected by using laser screen, photoelectric switch array, image recognition and other methods, and the specific detection method is not limited in the embodiment, which can be selected according to the actual situation. After the thickness of the food is detected, the corresponding infrared wavelength, i.e. the first infrared, is selected according to the strength of the penetration ability of the infrared. For example, when the detected thickness of the food is "thin food", the wavelength of the infrared can be adjusted to the wavelength range of far infrared, and the high radiation energy of far infrared is used to realize the rapid thawing of the food, thereby improving the thawing speed of the food. When the detected thickness of the food is "food with medium thickness", the wavelength of the infrared can be adjusted to the wavelength range of medium infrared, and the medium radiation energy and penetration of medium infrared are used to realize the uniform thawing of the surface and the inside of the food, thereby improving the thawing speed and uniformity of the food. When the detected thickness of the food is "thick food", the wavelength of the infrared can be adjusted to the wavelength range of near infrared, and the strong penetration of near infrared is used to realize the rapid and uniform thawing of the inside of the food, thereby improving the thawing speed and uniformity of the food. The thickness of the food can be divided according to the actual situation in advance, for example, the food with a thickness less than 3 cm is identified as "thin food", the food with a thickness between 3 cm and 7 cm is identified as "food with medium thickness", and the food with a thickness greater than 7 cm is identified as "thick food". By adjusting the wavelength of the infrared according to the thickness of the food and selecting the corresponding infrared for heating and thawing, the thawing speed and uniformity of the food can be improved, and the quality of the food thawing can be improved.

[0059] In step S202, the temperature of the micro-freezing chamber is acquired in real time, the wavelength of the first infrared is adjusted according to the temperature of the micro-freezing chamber, and the target thawing infrared is obtained.

[0060] Specifically, the temperature of the micro-freezing chamber also affects the thawing of the food during the thawing process of the food in the micro-freezing chamber. For example, when the food to be thawed is first placed in the micro-freezing chamber, the low temperature of the food to be thawed will lower the temperature of the micro-freezing chamber, and if the food to be thawed is large, it may even cause the micro-freezing chamber to be in a low temperature state for a long time, and the micro-freezing chamber cannot return to the set temperature range, thereby reducing the thawing speed. Or when heated by infrared rays, the air in the micro-freezing chamber will also absorb the radiant energy of the infrared rays, causing the temperature in the micro-freezing chamber to be too high. The high temperature of the micro-freezing chamber combined with the radiant energy of the infrared rays may cause the food to be over-thawed, thereby affecting the quality of the food. According to the different absorption abilities of air to infrared rays of different wavelengths, the first infrared rays are further subdivided. The absorption ability of air to infrared rays of high atmospheric transmittance wavelength is poor, and the absorption of infrared radiant heat is less. The absorption ability of air to infrared rays of non-high atmospheric transmittance wavelength is good, and the absorption of infrared radiant heat is more. Therefore, after determining the corresponding first infrared rays according to the thickness of the food to be thawed, the temperature of the micro-freezing chamber is detected in real time. When it is detected that the temperature of the micro-freezing chamber is low, the wavelength of the first infrared rays is adjusted to the non-high atmospheric transmittance wavelength to obtain the target infrared rays, so that the air in the micro-freezing chamber absorbs the radiant heat of the infrared rays of the non-high atmospheric transmittance wavelength, preventing the temperature of the micro-freezing chamber from being too low and affecting the thawing speed. When it is detected that the temperature of the micro-freezing chamber is high, the wavelength of the first infrared rays is adjusted to the high atmospheric transmittance wavelength to obtain the target infrared rays, reducing the absorption of the air in the micro-freezing chamber to the radiant heat of the infrared rays. Thus, the temperature in the micro-freezing chamber is regulated and controlled to control the micro-freezing chamber to be in the set temperature range, reduce the influence of the temperature change of the micro-freezing chamber on the thawing of the food, improve the thawing speed of the food, and improve the uniformity of the thawing. The setting of the high atmospheric transmittance wavelength and the non-high atmospheric transmittance wavelength can be set according to the actual detection environment, and the wavelength range is not limited in this embodiment. The judgment of the temperature of the micro-freezing chamber being too low and too high can be determined according to the actual set temperature range of the micro-freezing chamber, and the temperature range is not limited in this embodiment.

[0061] In step S203, the target thawing infrared rays are used to heat and thaw the object to be thawed according to the preset heating control logic.

[0062] Specifically, the food is heated and thawed by the target thawing infrared rays. During the heating process, the heating power of the target thawing infrared rays is adjusted according to the temperature of the food surface. The temperature of the food surface is detected by an infrared temperature detector. When the temperature of the food surface is low, the food is heated and thawed by the target thawing infrared rays at high power to improve the thawing speed. When the temperature of the food surface is high, the food is heated and thawed by the target thawing infrared rays at low power to prevent over-thawing and affect the quality of the food. Until the object to be thawed is thawed to the set thawing condition, wherein the thawing condition can be the set thawing time.

[0063] By the above steps S201 to S203, the thickness of the object to be thawed is obtained, the first infrared ray is determined according to the thickness of the object to be thawed, the temperature of the micro-freezing chamber is obtained in real time, the wavelength of the first infrared ray is adjusted according to the temperature of the micro-freezing chamber, and the target thawing infrared ray is obtained; and the object to be thawed is heated and thawed by using the target thawing infrared ray according to the preset heating control logic. Compared with the prior art which only relies on the surface temperature or weight of food for thawing, the embodiment adjusts the wavelength of the infrared ray according to the thickness of the object to be thawed, improves the uniformity of thawing, further adjusts the wavelength of the infrared ray in combination with the temperature of the micro-freezing chamber, controls the temperature of the micro-freezing chamber by using the adjusted infrared ray, reduces the influence of temperature fluctuation of the micro-freezing chamber on the object to be thawed, and finally controls the heating power of the target thawing infrared ray according to the preset heating control logic, thereby improving the thawing speed, preventing over-thawing, and improving the uniformity of thawing.

[0064] In some embodiments, obtaining the thickness of the object to be thawed and determining the first infrared ray according to the thickness of the object to be thawed comprises:

[0065] When the thickness of the object to be thawed reaches a preset first thickness, the far-infrared ray is used as the first infrared ray; when the thickness of the object to be thawed reaches a preset second thickness, the medium-infrared ray is used as the first infrared ray; and when the thickness of the object to be thawed reaches a preset third thickness, the near-infrared ray is used as the first infrared ray; wherein the first thickness is smaller than the second thickness, and the second thickness is smaller than the third thickness.

[0066] Specifically, in the detection of the thickness of the object to be thawed, the embodiment is implemented by installing two photoelectric switches in the micro-freezing chamber, i.e., photoelectric switch 1 and photoelectric switch 2. The photoelectric switch 1 and the photoelectric switch 2 are installed on the side wall of the micro-freezing chamber, and the installation position of the photoelectric switch 1 is lower than that of the photoelectric switch 2. The object to be thawed is placed at the bottom of the micro-freezing chamber, and the thickness of the object to be thawed which is lower than the height at which the photoelectric switch 1 is installed is used as the first thickness. At this time, it is indicated that the thickness of the object to be thawed is small, i.e., the object to be thawed is thin, and the far-infrared ray is used as the first infrared ray to realize fast thawing of food by using the high radiation energy of the far-infrared ray, thereby improving the thawing speed of food. The thickness of the object to be thawed which is higher than the height at which the photoelectric switch 1 is installed but lower than the height at which the photoelectric switch 2 is installed is used as the second thickness, i.e., the medium thickness, and the medium-infrared ray is used as the first infrared ray to realize uniform thawing of the surface and the interior of food by using the medium radiation energy and penetration of the medium-infrared ray, thereby improving the thawing speed and uniformity of food. The thickness of the object to be thawed which is higher than the height at which the photoelectric switch 2 is installed is used as the third thickness, i.e., the thickness, and the near-infrared ray is used as the first infrared ray to realize fast and uniform thawing of the interior of food by using the strong penetration of the near-infrared ray, thereby improving the thawing speed and uniformity of food.

[0067] In one embodiment, the temperature of the micro-freezing chamber is acquired in real time, and the wavelength of the first infrared light is adjusted according to the temperature of the micro-freezing chamber to obtain the target thawing infrared light, including:

[0068] The temperature of the micro-freezing chamber is acquired in real time, when the temperature of the micro-freezing chamber is less than a preset first temperature threshold, the wavelength of the first infrared light is adjusted to a non-atmospheric high transmittance wavelength; when the temperature of the micro-freezing chamber is greater than a preset second temperature threshold, the wavelength of the first infrared light is adjusted to an atmospheric high transmittance wavelength, wherein the first temperature threshold is less than the second temperature threshold.

[0069] Specifically, during the heating process, the wavelength of the first infrared light is dynamically adjusted according to the temperature of the micro-freezing chamber. A minimum temperature threshold, i.e., a first temperature threshold, is set in advance, and when it is detected that the temperature of the micro-freezing chamber is lower than the first temperature threshold, it is determined that the temperature of the micro-freezing chamber is low at this time, which will affect the thawing speed of the object to be thawed. The wavelength of the first infrared light at this time is adjusted to a non-atmospheric high transmittance wavelength, so that the air in the micro-freezing chamber absorbs more radiant heat of the infrared light, and the temperature of the micro-freezing chamber is increased. A maximum temperature threshold, i.e., a second temperature threshold, is set, and when it is detected that the temperature of the micro-freezing chamber is higher than the second temperature threshold, it is determined that the temperature of the micro-freezing chamber is high at this time, which may cause excessive thawing of the object to be thawed. The wavelength of the first infrared light at this time is adjusted to an atmospheric high transmittance wavelength, reducing the radiant heat of the infrared light absorbed by the air in the micro-freezing chamber, and reducing the temperature of the micro-freezing chamber. If the temperature of the micro-freezing chamber is between the first temperature threshold and the second temperature threshold, the wavelength of the first infrared light does not need to be adjusted, and the heating and thawing are carried out according to the current wavelength of the first infrared light, so as to prevent frequent adjustment from affecting the thawing quality of the object to be thawed. Illustratively, in this embodiment, the first infrared light is divided into different types according to the wavelength, and Table 1 is an infrared light type division table of the infrared light thawing method of this embodiment. The wavelength range of near, medium and far infrared light in different disciplines can be divided according to actual conditions, and this embodiment does not make specific limitations.

[0070] Table 1

[0071]

[0072] As shown in Table 1, when the first infrared ray is near-infrared ray, if the temperature of the micro-freezing chamber is detected to be lower than -3℃ at this time, the wavelength of the near-infrared ray is adjusted to the range of its corresponding non-atmospheric high transmittance wavelength, i.e. 1.2um-1.4um; if the temperature of the micro-freezing chamber is detected to be higher than 0℃, the wavelength of the near-infrared ray is adjusted to the range of its corresponding atmospheric high transmittance wavelength, i.e. 0.7um-1.1um; if the temperature of the micro-freezing chamber is within -3℃-0℃, the wavelength of the current near-infrared ray is not adjusted, and the current near-infrared ray with the current wavelength is continued to be used for heating thawing. Similarly, when the first infrared ray is mid-infrared ray and far-infrared ray, the adjustment mode is the same.

[0073] In another embodiment, according to the preset heating control logic, the target thawing infrared ray is used to heat thaw the object to be thawed, including: when the target thawing infrared ray is far-infrared ray, the object to be thawed is heated and thawed for a first time length; when the target thawing infrared ray is mid-infrared ray, the object to be thawed is heated and thawed for a second time length; when the target thawing infrared ray is near-infrared ray, the object to be thawed is heated and thawed for a third time length; wherein the first time length is less than the second time length, and the second time length is less than the third time length.

[0074] Specifically, after obtaining the target thawing infrared ray according to the thickness of the object to be thawed, the thawing time length of the object to be thawed is set according to the target thawing infrared ray. If the target thawing infrared ray is far-infrared ray, it indicates that the thickness of the current object to be thawed is "thin", the required thawing time is relatively short, and a relatively short first time length is set for thawing. For example, the thickness of the object to be thawed below 3cm is taken as "thin", and the thawing time length of 30-60min can be set. If the target thawing infrared ray is mid-infrared ray, it indicates that the thickness of the current object to be thawed is "medium thickness", the required thawing time is relatively longer, and a slightly longer second time length is set for thawing. For example, the thickness of the object to be thawed of 3-7cm is taken as "medium thickness", and the thawing time length of 60-120min can be set. If the target thawing infrared ray is near-infrared ray, it indicates that the thickness of the current object to be thawed is "thick", the required thawing time is longer, and a longer third time length is set for thawing. For example, the thickness of the object to be thawed above 7cm is taken as "thick", and the thawing time length of 120-240min can be set. The division of the thickness and the setting of the thawing time length can be set according to the actual situation, which is not limited in the embodiment.

[0075] In some embodiments, according to the preset heating control logic, the target thawing infrared ray is used to heat thaw the object to be thawed, including:

[0076] The cycle heating thawing process is performed until the heating thawing time length of the object to be thawed reaches the preset thawing time length, wherein the preset thawing time length is the first time length, the second time length or the third time length, and the cycle heating thawing process includes:

[0077] Step S1, obtaining the current temperature of the object to be thawed;

[0078] Step S2, determining the target power of the target thawing infrared ray according to the temperature range in which the current temperature of the object to be thawed is located;

[0079] Step S3, stopping heating for a preset fifth time length after heating the object to be thawed for a preset fourth time length using the target power of the target thawing infrared ray, and detecting the current temperature of the object to be thawed;

[0080] Step S4, judging whether the temperature of the object to be thawed is greater than a preset third temperature threshold, if yes, executing step S5, otherwise, executing step S2;

[0081] Step S5, stopping heating and continuously detecting the temperature of the object to be thawed, and returning to execute step S1 when the temperature of the object to be thawed is lower than a preset fourth temperature threshold.

[0082] Specifically, because the infrared ray cannot be completely absorbed by the object to be thawed, part of the reflected infrared ray will interfere with the infrared temperature measurement of the object to be thawed, and when the infrared heating is just turned off, the temperature of the lamp bead / tube is very high and still can produce infrared radiation, so stopping the infrared heating for a period of time before the infrared temperature measurement of the object to be thawed can improve the accuracy of the temperature detection of the object to be thawed. For example, Figure 3 is a heating flowchart of the infrared thawing method of the embodiment, the third temperature threshold is set to 0℃, the fourth temperature threshold is set to -2℃, the fourth time length is set to 54 seconds, and the fifth time length is set to 5 seconds, as shown in Figure 3 , the flowchart includes the following steps:

[0083] Step S301, judging whether the thawing time length reaches a preset thawing time length, if yes, executing step S310, otherwise, executing step S302;

[0084] Step S302, detecting the temperature of the object to be thawed by the infrared temperature sensor and continuously for 1s to obtain the average temperature of the object to be thawed in 1s;

[0085] Step S303, judging whether the average temperature of the object to be thawed is less than or equal to -7℃, if yes, executing step S304, otherwise, executing step 305;

[0086] Step S304, heating the object to be thawed using the target thawing infrared ray with high power for 54 seconds, stopping heating for 5 seconds, and returning to execute step S301;

[0087] Step S305, determine whether the average temperature of the object to be thawed is less than or equal to -3℃, if yes, execute step S306, otherwise, execute step 307;

[0088] Step S306, use the target thawing infrared ray of medium power to heat the object to be thawed for 54 seconds, then stop heating for 5 seconds, and return to execute step S301;

[0089] Step S307, determine whether the average temperature of the object to be thawed is less than or equal to 0℃, if yes, execute step S308, otherwise, execute step 309;

[0090] Step S308, use the target thawing infrared ray of low power to heat the object to be thawed for 54 seconds, then stop heating for 5 seconds, and return to execute step S301;

[0091] Step S309, stop heating, and continuously detect the temperature of the object to be thawed, when the temperature of the object to be thawed is less than -2℃, return to execute step S301;

[0092] Step S310, stop heating, and the thawing is completed.

[0093] Through the above steps S301 to S310, the appropriate target heating power is selected according to the current temperature of the object to be thawed, the thawing efficiency is improved while preventing over-thawing, the temperature detection accuracy is improved by stopping heating for a period of time after heating for a period of time and then detecting the temperature of the object to be thawed, and the thawing quality is improved by more meticulous control of the thawing process.

[0094] In this embodiment, an infrared thawing method is also provided. Figure 4 is a flowchart of another infrared thawing method of this embodiment, as shown in Figure 4 The flowchart includes the following steps:

[0095] Step S401, obtain the thickness of the object to be thawed, and determine the first infrared ray according to the thickness of the object to be thawed; wherein the first infrared ray includes far infrared, medium infrared and near infrared;

[0096] Step S402, obtain the temperature of the micro-freezing chamber in real time, when the temperature of the micro-freezing chamber is less than a preset first temperature threshold, adjust the wavelength of the first infrared ray to a non-atmospheric high transmittance wavelength; when the temperature of the micro-freezing chamber is greater than a preset second temperature threshold, adjust the wavelength of the first infrared ray to an atmospheric high transmittance wavelength, wherein the first temperature threshold is less than the second temperature threshold;

[0097] Step S403, determine the target thawing duration of the object to be thawed according to the type of the first infrared ray;

[0098] Step S404, obtaining the current temperature of the object to be thawed;

[0099] Step S405, determining the target power of the target thawing infrared light according to the temperature range in which the current temperature of the object to be thawed is located;

[0100] Step S406, after heating the object to be thawed for a preset fourth time length by using the target power of the target thawing infrared light, stopping heating for a preset fifth time length, and detecting the current temperature of the object to be thawed;

[0101] Step S407, determining whether the thawing time length is greater than the target thawing time length, if yes, executing step S410, otherwise executing step S408;

[0102] Step S408, determining whether the temperature of the object to be thawed is greater than a preset third temperature threshold, if yes, executing step S409, otherwise executing step S405;

[0103] Step S409, stopping heating, and continuously detecting the temperature of the object to be thawed, when the temperature of the object to be thawed is lower than a preset fourth temperature threshold, returning to execute step 405;

[0104] Step S410, stopping heating, and ending thawing.

[0105] Through the above steps S401 to S410, compared with the prior art which only relies on the surface temperature or weight of food for thawing control, the embodiment detects the thickness of the object to be thawed, adjusts the wavelength of the infrared light according to the thickness of the object to be thawed, obtains the first infrared light, wherein the first infrared light includes far infrared light, medium infrared light and near infrared light, selects different infrared light according to different thicknesses, accelerates thawing while preventing over-thawing and uneven thawing; further adjusts the wavelength of the first infrared light in combination with the temperature of the micro-freezing chamber, so as to control the temperature of the micro-freezing chamber to be within a preset temperature range, and reduce the influence on thawing; finally, selects the corresponding target power for heating thawing according to the temperature of the object to be thawed, and improves the efficiency of thawing.

[0106] In the embodiment, an infrared thawing device is also provided, which applies the infrared thawing method described in any one of the above embodiments, Figure 5 is a structural block diagram of the infrared thawing device of the embodiment, as Figure 5 shown, the infrared thawing device includes a micro-freezing chamber 51, an infrared emission device 52, a first temperature sensor 53, a second temperature sensor 54, and a position detector 55, wherein,

[0107] The infrared emission device 52 is arranged at the top of the micro-freezing chamber 51, and is used to provide target thawing infrared light of different wavelengths;

[0108] The first temperature sensor 53 is arranged in the micro-freezing chamber 51 to detect the temperature of the micro-freezing chamber 51 in real time.

[0109] The second temperature sensor 54 is arranged in the micro-freezing chamber 51 to detect the temperature of the object to be thawed 56.

[0110] The position detector 55 is arranged to detect the thickness of the object to be thawed 56.

[0111] In the embodiment, a refrigerator is also provided, which applies the infrared thawing method according to any one of the above embodiments, and the infrared thawing device according to the above embodiments.

[0112] In the embodiment, an infrared thawing device is also provided, which is used to implement the above embodiments and preferred embodiments, and will not be described in detail. The terms "module", "unit", "sub-unit" and the like used below can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware is also possible and is contemplated.

[0113] Figure 6 is a structural block diagram of the infrared thawing device of the embodiment, as Figure 6 shown, the device 60 comprises a determination module 61, an adjustment module 62 and a thawing module 63, wherein,

[0114] The determination module 61 is configured to obtain the thickness of the object to be thawed, and determine the first infrared light according to the thickness of the object to be thawed.

[0115] The adjustment module 62 is configured to obtain the temperature of the micro-freezing chamber in real time, and adjust the wavelength of the first infrared light according to the temperature of the micro-freezing chamber to obtain the target thawing infrared light.

[0116] The thawing module 63 is configured to heat and thaw the object to be thawed by using the target thawing infrared light according to a preset heating control logic.

[0117] It should be noted that each of the above modules can be a functional module or a program module, and can be implemented by software or hardware. For the modules implemented by hardware, each of the above modules can be located in the same processor; or each of the above modules can also be located in different processors in any combination.

[0118] In the embodiment, an electronic device is also provided, which comprises a memory and a processor, the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0119] Optionally, the electronic device described above can further comprise a transmission device connected with the processor and an input and output device connected with the processor.

[0120] Optionally, in the embodiment, the processor can be configured to execute the following steps by means of a computer program:

[0121] S1, obtaining the thickness of the object to be thawed, and determining the first infrared ray according to the thickness of the object to be thawed;

[0122] S2, obtaining the temperature of the micro-freezing chamber in real time, and adjusting the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain a target thawing infrared ray;

[0123] S3, according to the preset heating control logic, using the target thawing infrared ray to heat and thaw the object to be thawed.

[0124] It should be noted that the specific examples in the embodiment can refer to the examples described in the above embodiments and optional embodiments, which will not be described in detail in this embodiment.

[0125] In addition, in combination with the infrared thawing method provided in the above embodiments, a storage medium can also be provided in this embodiment to realize it. The storage medium has a computer program stored thereon; the computer program is executed by the processor to realize any one of the infrared thawing methods in the above embodiments.

[0126] It should be understood that the specific embodiments described herein are only used to explain this application, but not to limit it. According to the embodiments provided in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0127] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties.

[0128] Obviously, the drawings are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar situations according to the drawings without creative labor. In addition, it can be understood that although the work done in the development process may be complex and long, some design, manufacture or production changes according to the technical content disclosed in the present application are only routine technical means for those skilled in the art, and should not be regarded as insufficient disclosure of the present application.

[0129] The word "implementation" in this application refers to the specific features, structures, or characteristics described in connection with an implementation can be included in at least one implementation of the present application. The presence of this phrase in various locations in the specification does not necessarily mean the same implementation, nor does it mean independence or alternatives to other implementations. It is clear or implicitly understood by those of ordinary skill in the art that the implementations described in the present application can be combined without conflict.

[0130] It can be understood by those of ordinary skill in the art that all or part of the processes in the above-mentioned embodiments can be completed by instructing related hardware through a computer program, and the computer program can be stored in a non-volatile computer readable storage medium. When the computer program is executed, it can include the processes of the above-mentioned embodiments. Any reference to memory, database or other medium used in the embodiments provided by the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided by the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided by the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0131] The above embodiments only express several implementation ways of the present application, and the description is specific and detailed, but it should not be understood as a limitation to the patent protection scope. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An infrared thawing method, characterized in that: include: Acquiring the thickness of the object to be thawed, and determining the first infrared ray according to the thickness of the object to be thawed; acquiring the temperature of the micro-freezing chamber in real time, and adjusting the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain target thawing infrared ray; According to a preset heating control logic, the target thawing infrared ray is used to heat and thaw the object to be thawed.

2. The infrared thawing method according to claim 1, characterized in that: The obtaining of the thickness of the object to be thawed and determining the first infrared ray according to the thickness of the object to be thawed includes: When the thickness of the object to be thawed reaches a preset first thickness, using far infrared rays as the first infrared rays; When the thickness of the object to be thawed reaches a preset second thickness, using mid-infrared rays as the first infrared rays; When the thickness of the object to be thawed reaches a preset third thickness, using near infrared rays as the first infrared rays; Wherein, the first thickness is smaller than the second thickness and smaller than the third thickness.

3. The infrared thawing method according to claim 1, characterized in that: The method of acquiring the temperature of the micro-freezing chamber in real time and adjusting the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain the target thawing infrared ray comprises: acquiring the temperature of the micro-freezing chamber in real time, and when the temperature of the micro-freezing chamber is lower than a preset first temperature threshold, adjusting the wavelength of the first infrared ray to a non-atmospheric high transmittance wavelength; When the temperature of the micro-freezing chamber is greater than a preset second temperature threshold, the wavelength of the first infrared ray is adjusted to a wavelength with high atmospheric transmittance, wherein the first temperature threshold is less than the second temperature threshold.

4. The infrared thawing method according to claim 2, characterized in that: The method of heating and thawing the object to be thawed by using the target thawing infrared ray according to a preset heating control logic includes: When the target thawing infrared ray is far infrared ray, heating and thawing the object to be thawed for a first time period; When the target thawing infrared ray is a mid-infrared ray, heating and thawing the object to be thawed for a second time period; When the target thawing infrared ray is near infrared ray, heating and thawing the object to be thawed for a third time period; The first duration is smaller than the second duration and smaller than the third duration.

5. The infrared thawing method according to claim 4, characterized in that: The method of heating and thawing the object to be thawed by using the target thawing infrared ray according to a preset heating control logic includes: The cyclic heating and thawing process is performed until the heating and thawing time of the object to be thawed reaches a preset thawing time, wherein the preset thawing time is the first time, the second time, or the third time. The cyclic heating and thawing process includes: Step S1, obtaining the current temperature of the object to be thawed; Step S2, determining the target power of the target thawing infrared ray according to the temperature range of the current temperature of the object to be thawed; Step S3, after heating and thawing the object to be thawed with the target power of the target thawing infrared ray for a preset fourth time period, stopping the heating for a preset fifth time period, and detecting the current temperature of the object to be thawed; Step S4, determining whether the temperature of the object to be thawed is greater than a preset third temperature threshold, if so, executing step S5, otherwise executing step S2; Step S5: stop heating and continue to detect the temperature of the object to be thawed. When the temperature of the object to be thawed is lower than a preset fourth temperature threshold, return to step S1.

6. An infrared thawing device, using the infrared thawing method according to any one of claims 1 to 5, characterized in that: The infrared thawing device includes: a micro-freezing chamber, an infrared emitting device, a first temperature sensor, a second temperature sensor, and a position detector, wherein: The infrared emitting device is arranged on the top of the micro-freezing chamber and is used to provide target thawing infrared rays of different wavelengths; The first temperature sensor is arranged in the micro-freezing chamber and is used to detect the temperature of the micro-freezing chamber in real time; The second temperature sensor is arranged in the micro-freezing chamber and is used to detect the temperature of the object to be thawed; The position detector is used to detect the thickness of the object to be thawed.

7. A refrigerator, characterized in that: The infrared thawing method according to any one of claims 1 to 5 comprises the infrared thawing device according to claim 6.

8. An infrared thawing device, characterized in that: include: Determine module, adjust module and unfreeze module, among which, The determining module is used to obtain the thickness of the object to be thawed and determine the first infrared ray according to the thickness of the object to be thawed; The adjustment module is used to obtain the temperature of the micro-freezing chamber in real time, and adjust the wavelength of the first infrared ray according to the temperature of the micro-freezing chamber to obtain the target thawing infrared ray; The thawing module is used to heat and thaw the object to be thawed using the target thawing infrared rays according to a preset heating control logic.

9. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to run the computer program to perform the infrared thawing method according to any one of claims 1 to 5.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the infrared thawing method according to any one of claims 1 to 5 are implemented.

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