Ultrasonic transducer, ultrasonic probe and preparation process of ultrasonic transducer

By designing an ultrasonic transducer including a transducer bracket, a stacked layer and a rubber cured layer, combined with a deformable compensation cavity and a sealed rubber airbag, the problems of long detection time, increased weight and poor sealing performance of the rotating ultrasonic probe in the cavity are solved, achieving lightweight and improved electrical stability.

CN120479732APending Publication Date: 2025-08-15WUHAN UNITED IMAGING HEALTHCARE CO LTD
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Patent Information

Application Number
CN202510733395.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-03
Publication Date
2025-08-15

AI Technical Summary

Technical Problem

The existing intra-cavity rotating ultrasonic probe has a long detection time and low efficiency. The structural limitations lead to increased probe weight, poor sealing performance, poor electrical stability, and unable to meet clinical needs.

Method used

An ultrasonic transducer is designed, including a transducer bracket, stacking layer and glue-curing layer. It adopts a deformable compensation cavity and sealed rubber airbag. The transducer stacking layer is sealed through the glue-curing layer, reducing the overall weight and moment of inertia and improving electrical stability.

Benefits of technology

The ultrasonic transducer is miniaturized and lightweight, which improves rotation efficiency and electrical stability, reduces the impact of moisture invasion in the liquid environment, and meets the clinical needs of intra-cavity rotation imaging.

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Abstract

The invention relates to an ultrasonic transducer, an ultrasonic probe and a preparation process of the ultrasonic transducer. The ultrasonic transducer comprises a transducer support, a transducer stacking layer and a glue curing layer, a containing cavity is formed in the transducer support, the transducer stacking layer is arranged in the containing cavity, and the glue curing layer is arranged on the upper surface of the transducer stacking layer and extends downwards to the lower surface of the transducer stacking layer along the side wall of the transducer support. The ultrasonic transducer is simple in overall structure, small in size, convenient to assemble and good in sealing performance.
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Description

Technical Field

[0001] The present invention relates to the field of ultrasonic transducers, and in particular to an ultrasonic transducer, an ultrasonic probe and a preparation process of the ultrasonic transducer. Background Art

[0002] With the continuous development of medical imaging technology, ultrasound imaging, as a non-invasive, real-time, and convenient examination method, has been widely used in clinical diagnosis. As the core component of ultrasound imaging systems, the performance of the ultrasound transducer directly affects the quality of ultrasound images and diagnostic effectiveness. Intracavitary examinations, in particular, place higher demands on the miniaturization, lightweightness, and 360° rotational imaging capabilities of ultrasound transducers.

[0003] Existing intracavitary rotational ultrasound probes currently face several technical challenges. Their use of a small transducer combined with linear and rotational motion results in long detection times and low efficiency. Furthermore, structural limitations hinder the design of sufficient space for the compensation capsule, forcing the coupling fluid inlet and compensation capsule to be located in the handle. This increases the overall weight of the probe and makes it unsuitable for practical applications. Existing ultrasound transducers also have inadequate sealing structures, making them susceptible to moisture intrusion when used in liquid environments, impacting electrical stability and service life.

[0004] Therefore, there is an urgent need to provide an ultrasonic transducer with a simple structure, small size, easy assembly, good sealing performance and high electrical stability to meet the clinical needs of intracavitary rotational imaging of ultrasonic transducers. Summary of the Invention

[0005] Based on this, it is necessary to provide a lightweight ultrasonic transducer structure to address the defects of existing intracavitary ultrasonic transducers and ultrasonic probes, so that it has small size, simple assembly, high precision and good electrical stability.

[0006] In a first aspect, an ultrasonic transducer is provided, which includes a transducer bracket, a transducer stacking layer, and a glue-cured layer; a receiving cavity is provided on the transducer bracket, and the transducer stacking layer is arranged in the receiving cavity; the glue-cured layer is arranged on the outer surface of the transducer stacking layer and the transducer bracket, and the glue-cured layer is formed by curing the acoustic lens glue.

[0007] In some embodiments, the transducer stack layer includes a backing layer, a first flexible circuit board, a piezoelectric layer and a matching layer stacked in sequence from bottom to top; the backing layer is arranged in the accommodating cavity; the first flexible circuit board is bent downward along the outer surface of the side wall of the transducer bracket to the lower surface of the backing layer.

[0008] In some embodiments, the ultrasonic transducer further includes a deformable compensation cavity; the deformable compensation cavity is arranged corresponding to the lower surface of the transducer stack layer, and the glue-cured layer at least covers a portion of the deformable compensation cavity.

[0009] In some embodiments, the deformable compensation cavity comprises a sealed rubber airbag.

[0010] In some embodiments, the sealed rubber airbag includes an open rubber airbag and an airbag support member, one end of the airbag support member is sleeved in the open rubber airbag, and the other end is fixedly connected to the transducer bracket.

[0011] In some embodiments, at least one groove is provided on one end of the airbag support member that is sleeved in the open rubber airbag.

[0012] In some embodiments, a recess is provided at the end of the transducer bracket; the ultrasonic transducer further includes a second flexible circuit board, one end of the second flexible circuit board is electrically connected to the first flexible circuit board; and the other end passes through the transducer bracket along the recess.

[0013] In some embodiments, a liquid injection groove is further provided on the end portion, and the liquid injection groove is provided below the recessed portion.

[0014] In some embodiments, a sleeve is sleeved on the end of the transducer bracket, and the sleeve is fixedly connected to the end.

[0015] The second aspect provides an ultrasonic probe, which includes a shell, a drive assembly, a handle and the ultrasonic transducer described above; the ultrasonic transducer is arranged in the shell, and the drive assembly is arranged in the handle; the ultrasonic transducer is transmission-connected to the drive assembly; and the shell is fixedly connected to the handle.

[0016] In some embodiments, a sleeve is sleeved on the end of the transducer bracket, and the end is fixedly connected to the sleeve; a support tube is sleeved on the sleeve, and a dynamic sealing ring assembly is provided between the sleeve and the support tube.

[0017] In some embodiments, a sealing ring is sleeved on the support tube, and the sealing ring abuts against the inner wall of the shell.

[0018] In some embodiments, a transducer medium is provided between the housing and the ultrasonic transducer.

[0019] In some embodiments, a convex portion is provided on a side of the transducer bracket opposite to the end portion, a rotating member is sleeved on the convex portion, and the transducer is rotatably connected to the housing via the rotating member.

[0020] The third aspect provides a preparation process for an ultrasonic transducer, wherein a transducer stack layer is installed in a receiving cavity of a transducer bracket; the transducer bracket is placed in a mold, and acoustic lens glue is injected into the mold, and the acoustic lens glue is cured on the outer surfaces of the transducer stack layer and the transducer bracket to form a cured glue layer.

[0021] In some embodiments, the step of installing the transducer stack layer in the accommodating cavity of the transducer holder includes: stacking the piezoelectric layer and the matching layer; electrically connecting the first flexible circuit board to the side of the piezoelectric layer away from the matching layer; installing the first flexible circuit board on the accommodating cavity of the transducer holder; injecting a backing material into the accommodating cavity of the transducer holder to form a backing layer; and bending the first flexible circuit board downward along the outer surface of the side wall of the transducer holder to the lower surface of the backing layer.

[0022] In some embodiments, after the transducer stack layer is arranged in the accommodating cavity of the transducer holder, the following step is further included: electrically connecting one end of a second flexible circuit board to the first flexible circuit board and extending the other end outside the transducer holder.

[0023] In some embodiments, a deformable compensation cavity is provided on the lower surface of the second flexible circuit board, and the deformable compensation cavity is fixedly connected to the transducer bracket.

[0024] In some embodiments, before the transducer holder is placed in the mold, the following step is further included: a sleeve is placed on the end of the transducer holder.

[0025] The above-mentioned ultrasonic transducer is achieved by arranging the transducer stack layer in the accommodating cavity of the transducer bracket, and then arranging the glue curing layer on the upper surface of the transducer stack layer, and extending it downward along the side wall of the transducer bracket to the lower surface of the transducer stack layer, thereby sealing the transducer stack layer, making the ultrasonic transducer a whole, with a smaller overall volume and lighter weight, reducing the overall rotational inertia and rotational resistance, and improving the rotation efficiency; and it is not affected by the surrounding humidity and has high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 4 is a schematic structural diagram of an ultrasonic transducer in one embodiment.

[0027] Figure 2 Schematic diagram of the structure of an ultrasonic transducer in another embodiment.

[0028] Figure 3(a) is a schematic diagram of the structure of a deformable compensation cavity in one embodiment Figure 1 .

[0029] Figure 3(b) is a schematic diagram of the structure of a deformable compensation cavity in one embodiment Figure 2 .

[0030] FIG3( c ) is a third structural diagram of a deformable compensation cavity in one embodiment.

[0031] Figure 4 FIG. 4 is a cross-sectional view of a transducer support in one embodiment.

[0032] Figure 5 FIG. 1 is a schematic structural diagram of an ultrasonic probe in one embodiment.

[0033] Figure 6 Schematic diagram of the structure of the dynamic sealing ring assembly in an ultrasonic probe in one embodiment.

[0034] Figure numbers: 100, ultrasonic transducer; 110, transducer bracket; 111, accommodating cavity; 112, transducer bracket side wall; 113, end; 114, recessed portion; 115, liquid injection groove; 116, convex portion; 120, transducer stacking layer; 121, backing layer; 122, first flexible circuit board; 123, piezoelectric layer; 124, second flexible circuit board; 130, glue curing layer; 140, deformable compensation cavity; 141, open rubber airbag; 142, airbag support member; 1421, groove; 200, shell; 201, first shell; 202, second shell; 210, sleeve; 220, support tube; 230, dynamic sealing ring assembly; 231, dynamic sealing ring; 232, retaining ring; 233, bearing; 240, retaining spring; 250, sealing ring; 300, drive assembly. DETAILED DESCRIPTION

[0035] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0037] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0038] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0041] See Figure 1 , Figure 1The figure shows an exploded schematic diagram of an ultrasonic transducer 100 in one embodiment of the present application. The ultrasonic transducer 100 provided in one embodiment of the present application includes a transducer holder 110, a transducer stack layer 120, and a cured glue layer 130. The transducer holder 110 is provided with a receiving cavity 111, and the transducer stack layer 120 is provided in the receiving cavity 111. The cured glue layer 130 is provided on the outer surfaces of the transducer stack layer 120 and the transducer holder 110, and the cured glue layer 130 is formed by curing an acoustic lens glue. The cured glue layer 130 forms the acoustic lens layer of the transducer on the upper surface of the transducer stack layer 120, and forms a sealing layer along the side of the transducer holder 110 and the lower surface of the transducer stack layer 120.

[0042] In this embodiment, the accommodating cavity 111 can be rectangular, and its specific shape is determined by the shape of the transducer stack layer 120. The cured glue layer 130 is formed by curing the acoustic lens glue. The cured glue layer 130 provided on the transducer stack layer 120 can directly serve as the acoustic lens layer. The cured glue layer 130 provided on the transducer support side wall 112 and the lower surface of the transducer stack layer 120 can be used as a sealing layer due to the sealing effect of the acoustic lens glue. It can reduce the impact of ambient humidity on the transducer stack layer 120 and improve the reliability of the ultrasonic transducer 100. Furthermore, the cured glue layer 130 wraps the transducer stack layer 120 and the transducer support 110, making the overall volume and weight of the ultrasonic transducer 100 smaller and lighter, reducing the overall rotational inertia and rotational resistance of the ultrasonic transducer 100, and improving the rotation efficiency; the ultrasonic transducer 100 can be designed to be cylindrical or semi-cylindrical.

[0043] In some embodiments, the transducer stack layer 120 includes a backing layer 121, a first flexible circuit board 122, a piezoelectric layer 123 and a matching layer (not shown) stacked in sequence from bottom to top; the backing layer 121 is disposed in the accommodating cavity 111; the first flexible circuit board 122 is bent downward along the outer surface of the transducer bracket side wall 112 to the lower surface of the backing layer 121.

[0044] The backing layer 121 can fill the accommodating cavity 111 by injecting a backing material into the accommodating cavity 111 and then curing it. The accommodating cavity 111 of the transducer holder 110 can limit the position of the transducer stack 120. The first flexible circuit board 122 is bent downward along the outer surface of the transducer holder side wall 112 to the lower surface of the backing layer 121, thereby better securing the transducer stack 120 to the transducer holder 110.

[0045] The backing layer 121 can be made of a polymer material, such as polyurethane, epoxy resin, or other backing material, and is used to absorb sound waves from the back of the piezoelectric layer 123 to prevent sound wave reflection interference. The piezoelectric layer 123 can be made of a piezoelectric ceramic material, such as PZT (lead zirconium titanate), and is used to convert electrical signals into ultrasonic signals or vice versa. The matching layer can be made of a material with a specific acoustic impedance, such as a mixture of epoxy resin and metal powder, and is used to improve the transmission efficiency of ultrasonic waves between different media.

[0046] In some embodiments, see Figure 2 The ultrasonic transducer 100 further includes a deformable compensation cavity 140 ; the deformable compensation cavity 140 is arranged corresponding to the lower surface of the transducer stack layer 120 , and the adhesive curing layer 130 at least partially covers the deformable compensation cavity 140 .

[0047] The cured adhesive layer 130 extends to the lower surface of the transducer stack 120, wrapping the transducer stack 120 and the transducer holder 110, and filling the gap between the transducer stack 120 and the deformable compensation cavity 140, thereby sealing the transducer stack 120. Simultaneously, the cured adhesive layer 130 can also extend to the surface of the deformable compensation cavity 140 away from the end of the transducer stack 120, covering at least a portion of the deformable compensation cavity 140. The deformable compensation cavity 140 can be designed into a semi-cylindrical structure, for example, so that the entire ultrasonic transducer 100 is sealed into a cylindrical shape, thereby reducing the resistance to the ultrasonic transducer 100's rotation in the liquid.

[0048] The deformable compensation cavity 140 includes a sealed rubber airbag. The sealed rubber airbag includes an open rubber airbag 141 and an airbag support 142. One end of the airbag support 142 is sleeved in the open rubber airbag 141, and the other end is fixedly connected to the transducer bracket 110.

[0049] See Figures 3(a)-3(c) The open-type rubber airbag 141 can be made of a rubber material such as chloroprene rubber or nitrile rubber. The open-type rubber airbag 141 can be a single-opening rubber airbag, i.e., one end of the rubber airbag is open and the other end is sealed. The open end is sleeved onto one end of the airbag support member 142 to form a sealed airbag structure. The other end of the airbag support member 142 is fixed to the transducer bracket 110. The open-type rubber airbag 141 can also be a double-opening rubber airbag, i.e., both ends of the rubber airbag are open. In this case, at least one airbag support member 142 is required. If only one airbag support member 142 is provided, at least one groove 1421 is provided on the airbag support member 142. The double-opening rubber airbag 141 is completely sleeved onto the airbag support member 142 and covers the groove 1421. If two airbag support members 142 are provided, the two openings are sleeved onto the two airbag support members 142 respectively.

[0050] At least one groove 1421 is provided on one end of the airbag support member 142, which is inserted into the open rubber airbag 141. The open rubber airbag 141 covers the groove 1421. Multiple grooves 1421 can be arranged side by side or in multiple rows. The depth of the grooves 1421 can be adjusted as needed, typically between 2 mm and 5 mm, to ensure sufficient room for deformation of the open rubber airbag 141.

[0051] The deformable compensation cavity 140 has a large deformation area, which can effectively eliminate the volume change of the transducer medium. There is no need to set up an additional transducer medium compensation mechanism between the transducer and the handle or at the handle end, which ensures the lightweight of the transducer, reduces the overall rotational inertia, and improves the rotation efficiency.

[0052] In some embodiments, see Figure 4 The end 113 of the transducer bracket 110 is provided with a recessed portion 114 ; the ultrasonic transducer 100 further includes a second flexible circuit board 124 , one end of the second flexible circuit board 124 is electrically connected to the first flexible circuit board 122 , and the other end passes through the transducer bracket 110 along the recessed portion 114 .

[0053] The end 113 of the transducer holder 110 is located on one side of the transducer holder 110 along the length direction of the accommodating cavity 111. The end 113 can be a semi-cylindrical structure or a cylindrical structure, and the recessed portion 114 is provided at the upper end of the end 113. The end 113 of the transducer holder 110 includes an upper end and a lower end. The recessed portion 114 is provided on the upper end, or partially on the upper end and partially on the lower end. The upper end and the lower end can be integrally formed or can be fastened with adhesive in alignment. The adhesive curing layer 130 is wrapped along the transducer holder 110 to seal the transducer stack layer 120 and prevent liquid from entering the transducer stack layer 120 and damaging it.

[0054] The first and second flexible circuit boards 122, 124 can be made of polyimide (PI), a material with excellent flexibility and high-temperature resistance. The first flexible circuit board 122 is provided with conductive traces for connecting to the electrodes of the piezoelectric layer 123. The second flexible circuit board 124 is also provided with conductive traces for transmitting electrical signals from the first flexible circuit board 122 to an external control circuit. The connection between the first and second flexible circuit boards 122, 124 can be achieved through welding, conductive adhesive, or crimping.

[0055] In some embodiments, a sleeve 210 is sleeved over the end 113 of the transducer holder 110 . The sleeve 210 is fixedly connected to the end 113 by threaded connection, pin connection, etc. The second flexible circuit board 124 passes through the transducer holder 110 along the recess 114 and also through the sleeve 210 .

[0056] In some embodiments, the end portion 113 is further provided with a liquid injection groove 115, which is disposed below the recessed portion 114. The liquid injection groove 115 may be an L-shaped connecting cavity. The liquid injection groove 115 is used to inject transducer medium into the ultrasonic transducer 100 to improve the transmission effect of ultrasonic waves. After liquid injection is completed, the external opening of the liquid injection groove 115 can be sealed with a sealant or a sealing plug to prevent leakage of the transducer medium.

[0057] See Figure 5 , Figure 5 The following is a schematic diagram of the structure of an ultrasound probe according to an embodiment of the present application. The ultrasound probe provided in this embodiment includes a housing 200, a drive assembly 300, a handle (not shown), and an ultrasonic transducer 100 according to the embodiment. The ultrasonic transducer 100 is disposed within the housing 200, and the drive assembly 300 is disposed within the handle. The ultrasonic transducer 100 is in transmission connection with the drive assembly 300. The housing 200 is fixedly connected to the handle.

[0058] The ultrasonic transducer 100 is connected to the drive assembly 300 through a transmission shaft. The shell 200 includes a first shell 201 and a second shell 202. The ultrasonic transducer 100 is arranged in the first shell 201, and the transmission shaft is arranged in the second shell 202. The first shell 201 and the second shell 202 can be fixedly connected or integrally formed; the second shell 202 is fixedly connected to the handle; the fixed connection includes threaded connection, gluing, etc.

[0059] The driving assembly 300 may include a driving motor, which drives the transmission shaft to rotate through a coupling, thereby driving the transducer to rotate.

[0060] In some embodiments, see Figure 6 A sleeve 210 is sleeved on the end 113 of the transducer bracket 110 of the ultrasonic transducer 100, and the end 113 is fixedly connected to the sleeve 210; a support tube 220 is sleeved on the sleeve 210, and a dynamic sealing ring assembly 230 is provided between the sleeve 210 and the support tube 220.

[0061] The sleeve 210 can be fixed to the end portion 113 by a locating pin. The locating pin can be inserted into corresponding locating holes on the end portion 113 and the sleeve 210 to prevent the sleeve 210 from rotating relative to the end portion 113. At the same time, the drive shaft is fixedly connected to the sleeve 210 and / or the end portion 113 of the transducer bracket 110. When the drive assembly 300 drives the drive shaft to rotate, the drive shaft drives the ultrasonic transducer 100 to rotate.

[0062] A protrusion is provided on one end of the sleeve 210 near the transducer support 110 (or near the accommodating cavity 111). The protrusion extends outward along the circumference of the sleeve 210. The dynamic sealing ring assembly 230 is provided between the sleeve 210 and the support tube 220 to prevent the injected transducer medium from leaking out while allowing the ultrasonic transducer 100 to rotate within the support tube 220. Figure 5 As shown, the dynamic seal assembly 230 includes a bearing 233 , a retaining ring 232 , a dynamic seal 231 , a retaining ring 232 , and a bearing 233 , which are arranged in sequence from left to right.

[0063] Bearing 233 may be a ball bearing, used to support sleeve 210 and sleeve 210 and reduce friction when sleeve 210 rotates relative to support sleeve 210. Retaining ring 232 may be a metal or plastic annular member, used to define the position of dynamic seal ring 231 and separate dynamic seal ring 231 from bearing 233. Dynamic seal ring 231 may be an annular seal made of rubber or polytetrafluoroethylene with a compression spring, providing a seal between a rotating component (such as sleeve 210) and a stationary component (such as support tube 220), preventing liquid from leaking from the gap between sleeve 210 and support tube 220.

[0064] In addition to the dynamic seal ring assembly 230, the sleeve 210 is also provided with a retaining spring 240. One end of the dynamic seal ring assembly 230 abuts against the retaining spring 240, while the other end abuts against a protrusion on the sleeve 210, thereby defining the position of the dynamic seal ring assembly 230 on the sleeve 210. The sleeve 210 is provided with an annular groove into which the retaining spring 240 fits, preventing the dynamic seal ring assembly 230 from moving axially.

[0065] In some embodiments, a sealing ring 250 is sleeved on the support tube 220 and abuts against the inner wall of the housing 200. The sealing ring 250 is used to seal the support tube 220 from the housing 200 and secure the support tube 220 to the inner wall of the housing 200, and may be secured within the first housing 201. The sealing ring 250 may be an O-ring or other shaped rubber seal with good elasticity and sealing properties.

[0066] A transducer medium is provided between the housing 200 and the ultrasonic transducer 100. The transducer medium enters between the housing 200 and the ultrasonic transducer 100 through the liquid injection slot 115. The transducer medium includes water, saline solution, coupling agent, etc., and is used to improve the transmission efficiency of ultrasonic waves between different media.

[0067] In some embodiments, a protrusion 116 is provided on the side of the transducer bracket 110 opposite the end 113. A rotating member is sleeved on the protrusion 116, and the ultrasonic transducer 100 is rotatably connected to the housing 200 via the rotating member. The rotating member can be a bearing, the inner ring of the bearing is fixed to the protrusion 116, and the outer ring is fixedly connected to the inner wall of the housing 200, so that the ultrasonic transducer 100 can rotate relative to the housing 200.

[0068] The transducer bracket 110 is provided with an end portion 113 and a protrusion 116 on both sides, respectively. The end portion 113 and the protrusion 116 are respectively arranged on both sides of the accommodating cavity 111, for example, respectively arranged on both sides of the length direction of the accommodating cavity 111, to ensure that the ultrasonic transducer 100 has good support and rotational stability in the shell 200.

[0069] A manufacturing process of an ultrasonic transducer 100 according to an embodiment of the present application includes the following steps:

[0070] Installing the transducer stack layer 120 in the accommodating cavity 111 of the transducer holder 110;

[0071] The transducer support 110 is placed in a mold, and acoustic lens glue is injected into the mold. The acoustic lens glue is cured on the outer surfaces of the transducer stack layer 120 and the transducer support 110 to form a glue-cured layer 130 .

[0072] In some embodiments, the acoustic lens glue includes materials with specific acoustic properties such as silicone and polyurethane glue. After the transducer stack layer 120 is encapsulated with the help of a mold, a glue-cured layer 130 is formed on the outer surfaces of the transducer stack layer 120 and the transducer bracket 110; the upper surface of the transducer stack layer 120 is cured to form a glue-cured layer 130, which can be used as the acoustic lens layer of the transducer, and the glue-cured layer 130 along the side and lower surfaces of the transducer bracket 110 and the transducer stack layer 120 can be used as a sealing layer.

[0073] The mold can be designed based on the desired shape of the cured adhesive layer 130 and generally consists of an upper mold and a lower mold. The upper mold has a cavity corresponding to the desired shape of the upper surface of the cured adhesive layer 130. The lower mold accommodates the transducer holder 110 and the transducer stack 120 and provides a surrounding glue injection channel. The transducer holder 110 and the transducer stack 120 are placed in the lower mold, the upper mold is closed, and the cured adhesive layer material is injected through the injection channel. After the material solidifies, the finished product is removed.

[0074] In some embodiments, the specific steps of installing the transducer stack layer 120 in the accommodating cavity 111 of the transducer holder 110 may include:

[0075] stacking the piezoelectric layer 123 and the matching layer;

[0076] The first flexible circuit board 122 is electrically connected to the end of the piezoelectric layer 123 away from the matching layer;

[0077] The first flexible circuit board 122 is mounted on the accommodating cavity 111 of the transducer support 110;

[0078] Injecting a backing material into the accommodating cavity 111 of the transducer holder 110 to form a backing layer 121 ;

[0079] The first flexible circuit board 122 is bent downward along the outer surface of the transducer support side wall 112 to the lower surface of the backing layer 121 .

[0080] The piezoelectric layer 123 and the matching layer can be stacked using an adhesive, such as epoxy resin glue. The thickness of the piezoelectric layer 123 is generally 0.1 mm to 0.5 mm, and the thickness of the matching layer is generally 0.05 mm to 0.5 mm. The specific thickness can be adjusted according to the operating frequency. The electrical connection between the first flexible circuit board 122 and the piezoelectric layer 123 can be achieved using conductive adhesive or welding. The first flexible circuit board 122 is provided with conductive circuits that are connected to the corresponding electrodes of the piezoelectric layer 123. After the first flexible circuit board 122, the piezoelectric layer 123, and the matching layer are stacked in sequence, the first flexible circuit board 122 is attached to the transducer holder 110, covering the accommodating cavity 111. A backing material is injected into the accommodating cavity 111 to form the backing layer 121. The thickness of the backing layer 121 can be adjusted as needed, generally ranging from 2 mm to 5 mm to ensure sufficient sound wave absorption. The backing material can be a liquid polymer material, such as polyurethane or epoxy resin.

[0081] The first flexible circuit board 122 is bent downward along the outer surface of the transducer bracket side wall 112 so that it extends to the lower surface of the backing layer 121. This facilitates subsequent connection with the external circuit and further strengthens the installation of the transducer stack layer 120 on the transducer bracket 110.

[0082] In some embodiments, after the transducer stack 120 is disposed within the accommodating cavity 111 of the transducer holder 110, the steps for preparing the ultrasonic transducer 100 further include: electrically connecting one end of the second flexible printed circuit board 124 to the first flexible printed circuit board 122, and extending the other end outside the transducer holder 110. Specifically, the first flexible printed circuit board 122, which is bent to the lower surface of the backing layer 121, is electrically connected to one end of the second flexible printed circuit board 124; the electrical connection between the second flexible printed circuit board 124 and the first flexible printed circuit board 122 can be achieved by welding or conductive adhesive; and the other end of the second flexible printed circuit board 124 is passed through the recessed portion 114 and out of the transducer holder 110 for connection to an external control circuit.

[0083] In some embodiments, the preparation process of the ultrasonic transducer 100 further includes:

[0084] A deformable compensation cavity 140 is provided on the lower surface of the second flexible circuit board 124, and the deformable compensation cavity 140 is fixedly connected to the transducer support 110. The fixed connection may be a pin connection or the like.

[0085] The installation of the deformable compensation cavity 140 can be achieved through the following steps: first, prepare the open rubber airbag 141 and the airbag support 142; then, put the open rubber airbag 141 on the airbag support 142 so that the open rubber airbag 141 covers the groove 1421 on the airbag support 142 to form a sealed deformable compensation cavity 140; finally, fix the other end of the airbag support 142 on the transducer bracket 110.

[0086] After assembly, the transducer stack 120 and the deformable compensation cavity 140 are encapsulated with acoustic lens adhesive, using the same mold method as described above. The transducer holder 110 is placed in the mold, and the acoustic lens adhesive is injected. The acoustic lens adhesive is wrapped around the outer surfaces of the transducer stack 120, the transducer holder 110, and the deformable compensation cavity 140, and then cured to form a cured adhesive layer 130, forming a complete seal structure outside the transducer stack 120.

[0087] In some embodiments, before the transducer holder 110 is placed in the mold, the following step is further included: a sleeve is placed on the end 113 of the transducer holder 110 . The sleeve is fixedly connected to the end 113 of the transducer holder 110 .

[0088] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An ultrasonic transducer, characterized in that: The ultrasonic transducer (100) comprises a transducer support (110), a transducer stacking layer (120), and a glue curing layer (130); The transducer support (110) is provided with a receiving cavity (111), and the transducer stack layer (120) is arranged in the receiving cavity (111); The glue solidification layer (130) is arranged on the outer surfaces of the transducer stacking layer (120) and the transducer bracket (110), and the glue solidification layer (130) is formed by solidifying acoustic lens glue.

2. The ultrasonic transducer according to claim 1, characterized in that The transducer stack layer (120) comprises a backing layer (121), a first flexible circuit board (122), a piezoelectric layer (123), and a matching layer stacked in sequence from bottom to top; The backing layer (121) is arranged in the accommodating cavity (111); The first flexible circuit board (122) is bent downward along the outer surface of the transducer support side wall (112) to the lower surface of the backing layer (121).

3. The ultrasonic transducer according to claim 1, characterized in that The ultrasonic transducer (100) further includes a deformable compensation cavity (140); The deformable compensation cavity (140) is arranged corresponding to the lower surface of the transducer stack layer (120), and the adhesive curing layer (130) at least partially covers the deformable compensation cavity (140).

4. The ultrasonic transducer according to claim 3, characterized in that The deformable compensation cavity (140) comprises a sealed rubber airbag.

5. The ultrasonic transducer according to claim 4, characterized in that The sealed rubber airbag includes an open rubber airbag (141) and an airbag support member (142); One end of the airbag support (142) is sleeved in the open rubber airbag (141), and the other end is fixedly connected to the transducer bracket (110).

6. The ultrasonic transducer according to claim 5, characterized in that One end of the airbag support member (142) sleeved in the open rubber airbag (141) is provided with at least one groove (1421).

7. The ultrasonic transducer according to claim 2, characterized in that The end portion (113) of the transducer support (110) is provided with a recessed portion (114); The ultrasonic transducer (100) further includes a second flexible circuit board (124), one end of the second flexible circuit board (124) being electrically connected to the first flexible circuit board (122), and the other end of the second flexible circuit board (124) passing through the transducer bracket (110) along the recessed portion (114).

8. The ultrasonic transducer according to claim 7, characterized in that A liquid injection groove (115) is also provided on the end portion (113), and the liquid injection groove (115) is provided below the recessed portion (114).

9. The ultrasonic transducer according to claim 1, characterized in that A sleeve (210) is sleeved on the end portion (113) of the transducer bracket (110), and the sleeve (210) is fixedly connected to the end portion (113).

10. An ultrasonic probe, characterized in that: The ultrasonic probe comprises a housing (200), a driving assembly (300), a handle, and the ultrasonic transducer (100) according to any one of claims 1 to 9; The ultrasonic transducer (100) is disposed in the housing (200), and the drive assembly (300) is disposed in the handle; The ultrasonic transducer (100) is in transmission connection with the driving assembly (300); The housing (200) is fixedly connected to the handle.

11. The ultrasonic probe according to claim 10, characterized in that: A sleeve (210) is sleeved on the end portion (113) of the transducer bracket (110), and the end portion (113) is fixedly connected to the sleeve (210); A support cylinder (220) is sleeved on the pipe sleeve (210), and a dynamic sealing ring assembly (230) is provided between the pipe sleeve (210) and the support cylinder (220).

12. The ultrasonic probe according to claim 11, characterized in that: A sealing ring (250) is sleeved on the support tube (220), and the sealing ring (250) abuts against the inner wall of the shell (200).

13. The ultrasonic probe according to claim 12, characterized in that: A transducer medium is provided between the housing (200) and the ultrasonic transducer (100).

14. The ultrasonic probe according to claim 11, characterized in that A convex portion (116) is provided on a side of the transducer bracket (110) opposite to the end portion (113), and a rotating member is sleeved on the convex portion (116). The ultrasonic transducer (100) is rotatably connected to the housing (200) via the rotating member.

15. A process for preparing an ultrasonic transducer, characterized in that: Described preparation technology comprises the following steps: Installing the transducer stack layer (120) in the accommodating cavity (111) of the transducer support (110); The transducer support (110) is sleeved in a mold, and acoustic lens glue is injected into the mold, and the acoustic lens glue is cured on the outer surfaces of the transducer stacking layer (120) and the transducer support (110) to form a glue curing layer (130).

16. The preparation process according to claim 15, characterized in that: The step of installing the transducer stack layer (120) in the accommodating cavity (111) of the transducer support (110) comprises: The piezoelectric layer (123) and the matching layer are stacked, and the first flexible circuit board (122) is electrically connected to the side of the piezoelectric layer (123) away from the matching layer; Mounting the first flexible circuit board (122) on the accommodating cavity (111) of the transducer support (110); injecting a backing material into the accommodating cavity (111) of the transducer support (110) to form a backing layer (121); The first flexible circuit board (122) is bent downward along the outer surface of the side wall of the transducer support (110) to the lower surface of the backing layer (121).

17. The preparation process according to claim 16, characterized in that: After the transducer stack layer (120) is arranged in the accommodating cavity (111) of the transducer support (110), the following steps are further included: one end of a second flexible circuit board (124) is electrically connected to the first flexible circuit board (122), and the other end is extended outside the transducer support (110).

18. The preparation process according to claim 17, characterized in that: The following steps are also included: A deformable compensation cavity (140) is provided on the lower surface of the second flexible circuit board (124), and the deformable compensation cavity (140) is fixedly connected to the transducer bracket (110).

19. The preparation process according to claim 15, characterized in that: Before the transducer support (110) is sleeved in the mold, the following steps are also included: A sleeve is sleeved on the end (113) of the transducer bracket (110).