Solid state disk testing method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses a solid state disk test method and device, electronic equipment and a storage medium, and relates to the technical field of solid state disk test.The method comprises the steps that a single-board computer serves as a core component, and is externally connected with refrigeration equipment, heating equipment and a transparent box body to be assembled to obtain a test box, a temperature sensor is arranged in the test box to monitor the internal temperature in real time, and heat adjustment data is calculated according to the internal temperature, the actual heating value, the current environment temperature and the set standard temperature; adjusting the output power of the refrigeration equipment or the heating equipment through an electronic control valve according to the heat adjustment data until the internal temperature is adjusted to the standard temperature; continuously monitoring the test box, performing feedback adjustment according to the temperature adjustment condition of the test box, and immediately cutting off the power supply of the test box when the temperature of the test box exceeds a set safety range. The problems that in the prior art, the testing period is long, the testing efficiency is low, and an actual use scene cannot be accurately simulated are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of solid-state hard disk testing, and in particular to a solid-state hard disk testing method, device, electronic equipment and storage medium. Background Art

[0002] In today's digital age, solid-state drives (SSDs), as core data storage devices, are constantly in the spotlight for their performance, reliability, and compatibility. Reliability testing is a crucial step, but the cost of reliability testing remains high due to the large number of test samples, lengthy testing cycles, and demanding testing environments.

[0003] However, existing SSD reliability testing systems have many shortcomings, such as cumbersome testing processes, low testing efficiency, unreasonable test parameter settings, and inaccurate data analysis. These problems not only affect the reliability of test results, but also increase testing costs and time.

[0004] In addition, traditional testing methods often only focus on a single test indicator, such as read and write speed, durability, etc., while ignoring the comprehensive performance of the SSD in actual use. The setting of test parameters also lacks scientificity and systematicity, resulting in test results that are difficult to accurately reflect the true performance of the SSD.

[0005] At the same time, existing test systems have limitations in processing and analyzing test data and are unable to deeply explore the potential information in the test data, thus affecting the accuracy and reliability of the test results.

[0006] Therefore, there is an urgent need for a solid-state drive testing method that can optimize the test process, reasonably set test parameters, improve test efficiency, and accurately analyze test data to achieve a comprehensive evaluation of SSD comprehensive performance. Summary of the Invention

[0007] The embodiments of the present invention provide a solid-state drive testing method to address the problems of the prior art, such as long testing cycles, low testing efficiency, and inability to accurately simulate actual usage scenarios. The technical solution is as follows:

[0008] According to one aspect of the present invention, a solid-state hard disk testing method includes: using a single-board computer as a core component, and assembling an external cooling device, a heating device, and a transparent box to obtain a test box for the solid-state hard disk to be tested; the test box can be combined in parallel; arranging a temperature sensor in the test box to monitor the internal temperature in real time, and calculating heat adjustment data based on the internal temperature, the actual heat generation of the solid-state hard disk to be tested, the current ambient temperature, and a set standard temperature; adjusting the output power of the cooling device or the heating device through an electronic control valve according to the heat adjustment data until the internal temperature of the test box is adjusted to the standard temperature; continuously monitoring the test box, performing feedback adjustment based on the temperature adjustment status of the test box, and immediately cutting off the power supply of the test box when the temperature of the test box exceeds a set safety range.

[0009] In one embodiment, the actual heat generation of the solid-state drive to be tested is calculated by the following steps: power consumption parameters are obtained according to the product specification of the solid-state drive to be tested, and the actual heat generation is calculated according to the working data of the solid-state drive to be tested over a period of time using the following formula:

[0010] Q1=P×t;

[0011] Wherein, Q1 represents the actual heat generated by calculating the power consumption parameter, P represents the power consumption of the solid-state drive under test, and t represents the duration of the solid-state drive under test working.

[0012] In one embodiment, the method for calculating the actual calorific value of the solid-state drive to be tested further includes the following steps: obtaining the specific heat capacity and mass according to the product specification of the solid-state drive to be tested, measuring the temperature change at different times using a temperature sensor inside the solid-state drive to be tested, and calculating the actual calorific value according to the temperature change, the specific heat capacity, and the mass using the following formula:

[0013] Q2=c×m×ΔT;

[0014] Wherein, Q2 represents the actual calorific value calculated by the temperature sensor, c represents the specific heat capacity, m represents the mass, and △T represents the temperature change of the solid-state drive to be tested at different times.

[0015] In one embodiment, the calculation of the actual heating value of the solid state drive to be tested further includes the following steps: performing error correction on multiple rounds of data obtained by combining the actual heating value calculated by the power consumption parameters and the actual heating value calculated by the temperature sensor to obtain an accurate actual heating value.

[0016] In one embodiment, the calculation formula for obtaining the heat adjustment data according to the internal temperature, the actual heat output of the solid state drive to be tested, the current ambient temperature and the set standard temperature includes: Q total =C×M×(Te -T s );

[0017] Q=Q total ±Q SSD ;

[0018] Among them, T e Indicates the current ambient temperature, T s Indicates the set standard temperature, C indicates the specific heat capacity of the medium in the current environment of the solid state drive, M indicates the quality of the medium in the current environment of the solid state drive to be tested, Q total Indicates the energy that needs to be absorbed or released, Q SSD Indicates the actual heat generated by the SSD under test, and Q is the heat adjustment data that requires adjustment by cooling or heating equipment.

[0019] In one embodiment, adjusting the output power of the refrigeration device or heating device through the electronic control valve according to the heat adjustment data is achieved by the following steps: setting an adjustment coefficient of the electronic control valve, calculating the required output power according to the heat adjustment data and the set adjustment time, and adjusting the output power of the refrigeration device or heating device by controlling the flow of the working medium entering the refrigeration device or heating device through the electronic control valve;

[0020] The formula for calculating the required output power based on the heat adjustment data and the set adjustment time is as follows:

[0021] P out&put =Δt×k×Q;

[0022] Among them, P out&put Indicates output power, k indicates the adjustment coefficient of the electronic control valve, △t indicates the set adjustment time, and Q indicates the heat adjustment data.

[0023] In one embodiment, the test box is continuously monitored, and feedback adjustment is performed according to the temperature adjustment of the test box through the following steps: the actual temperature of the solid-state hard disk to be tested in the test box and the ambient temperature change are continuously monitored; if the actual temperature does not reach the standard temperature, the temperature deviation is obtained by subtracting the actual temperature from the standard temperature; if the temperature deviation is greater than 0 and the output power of the heating device has reached the current set value but the temperature rises slowly, the control valve opening is increased, the medium flow entering the heating device is increased, and the output power is improved; if the temperature deviation is greater than 0 and the output power of the cooling device has reached the current set value but the temperature drops too quickly, the control valve opening is reduced, the medium flow entering the cooling device is reduced, and the output power is reduced.

[0024] According to one aspect of the present invention, a solid-state hard disk testing device includes: a test box assembly module for assembling a test box for the solid-state hard disk to be tested with a single-board computer as the core component, an external cooling device, a heating device and a transparent box; the test boxes can be combined in parallel; an adjustment data calculation module for setting a temperature sensor in the test box to monitor the internal temperature in real time, and calculating heat adjustment data based on the internal temperature, the actual heat generation of the solid-state hard disk to be tested, the current ambient temperature and the set standard temperature; a temperature adjustment module for adjusting the output power of the cooling device or the heating device through an electronic control valve according to the heat adjustment data until the internal temperature of the test box is adjusted to the standard temperature; a feedback and emergency module for continuously monitoring the test box, performing feedback adjustment according to the temperature adjustment status of the test box, and immediately cutting off the power supply of the test box when the temperature of the test box exceeds the set safety range.

[0025] According to one aspect of the present invention, an electronic device includes at least one processor and at least one memory, wherein the memory stores computer-readable instructions; the computer-readable instructions are executed by one or more of the processors, so that the electronic device implements the solid-state drive testing method described above.

[0026] According to one aspect of the present invention, a storage medium stores computer-readable instructions thereon, wherein the computer-readable instructions are executed by one or more processors to implement the solid-state drive testing method described above.

[0027] The beneficial effects brought about by the technical solution provided by the present invention are:

[0028] In the above technical solution, the present invention integrates a single-board computer as the control center and combines it with efficient cooling and heating equipment to monitor the actual heating value of the solid-state drive under test in real time. It also fully considers the impact of ambient temperature changes on test results. By integrating a high-precision temperature sensor, real-time tracking of the internal temperature of the test box is achieved. Combined with the user-preset standard temperature value, the output power of the cooling or heating equipment can be automatically calculated and dynamically adjusted to ensure that the test environment is always maintained within the set optimal temperature range. The power consumption parameters and temperature sensor data are integrated into the calculation of the actual heating value. Through multiple rounds of data comparison and error correction, the accuracy of the heating value calculation is significantly improved, thereby further enhancing the accuracy of the test. In addition, it is equipped with a continuous monitoring and intelligent feedback mechanism to promptly detect and respond to temperature deviations. By adjusting the control valve opening, the medium flow rate is flexibly adjusted to ensure timely adjustment of the output power of the heating or cooling equipment, effectively avoiding test errors caused by temperature fluctuations. This not only significantly shortens the test cycle of the solid-state drive and significantly improves test efficiency, but also ensures the reliability and practicality of the test results by accurately simulating actual usage scenarios, thereby effectively solving the problems of long test cycles, low test efficiency, and inability to accurately simulate actual usage scenarios in the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0030] Figure 1 is a flow chart showing a method for testing a solid state drive according to an exemplary embodiment;

[0031] Figure 2 is a schematic structural diagram of a solid state drive testing system in an exemplary embodiment;

[0032] Figure 3 is a structural diagram of a solid state drive testing system in another embodiment;

[0033] Figure 4 This is a system diagram for testing a solid-state drive in an application scenario;

[0034] Figure 5 is a block diagram of a solid state drive testing device according to an exemplary embodiment;

[0035] Figure 6 is a hardware structure diagram of an electronic device according to an exemplary embodiment;

[0036] Figure 7 It is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0037] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0038] It will be understood by those skilled in the art that, unless expressly stated otherwise, the singular forms "a", "an", "said" and "the" used herein may also include the plural forms. It should be further understood that the term "comprising" used in the specification of the present disclosure refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. In addition, "connected" or "coupled" as used herein may include wireless connections or wireless couplings. The term "and / or" used herein includes all or any units and all combinations of one or more associated listed items.

[0039] The present invention provides a solid-state drive (SSD) testing method. By integrating a single-board computer (SBC), a high-efficiency cooling and heating device, and a precision temperature control system, a comprehensive SSD testing platform is constructed. This platform implements real-time temperature monitoring, precise heat generation calculation, and intelligent heat adjustment. This significantly shortens the test cycle, improves test efficiency and accuracy, accurately simulates actual usage scenarios, and meets the needs of efficient testing. This method addresses the problems of the prior art, such as long test cycles, low test efficiency, and inability to accurately simulate actual usage scenarios. The SSD testing method is suitable for use in a SSD testing device, which can be an electronic device. The SSD testing method in the embodiments of the present invention can be applied to a variety of scenarios, such as SSD testing.

[0040] See also Figure 1 , an embodiment of the present invention provides a solid state hard disk testing method, which is applicable to electronic devices.

[0041] In the following method embodiments, for ease of description, the execution subject of each step of the method is taken as an electronic device as an example for illustration, but this does not constitute a specific limitation.

[0042] like Figure 1 As shown, the method may include the following steps:

[0043] Step 110 , using the single board computer as a core component, external cooling equipment, heating equipment and a transparent box are assembled to obtain a test box for the solid state drive to be tested.

[0044] Among them, the single-board computer, as the control center of the entire test system, can efficiently execute test programs, collect and analyze data; external cooling and heating equipment can accurately adjust the temperature inside the test box according to test requirements, thereby ensuring that the performance of the solid-state drive under extreme temperature conditions can also be fully evaluated.

[0045] Furthermore, in order to facilitate the observation and recording of the state changes of the solid-state drive during the test process, a transparent box is used as the outer shell of the test box. The working status of the solid-state drive can be intuitively observed without interfering with the test process, further improving the accuracy and reliability of the test.

[0046] Step 130 , a temperature sensor is set in the test box to monitor the internal temperature in real time, and heat adjustment data is calculated based on the internal temperature, the actual heat generation of the solid state drive to be tested, the current ambient temperature and the set standard temperature.

[0047] In one possible implementation, the power consumption parameters are obtained according to the product specification of the solid-state drive to be tested, and the actual heat generation is calculated according to the working data of the solid-state drive to be tested over a period of time using the following formula:

[0048] Q1=P×t;

[0049] Wherein, Q1 represents the actual heat generated by calculating the power consumption parameter, P represents the power consumption of the solid-state drive under test, and t represents the duration of the solid-state drive under test working.

[0050] In one possible implementation, the specific heat capacity and mass are obtained from the product specifications of the SSD to be tested. The temperature change at different times is measured using a temperature sensor inside the SSD to be tested. The actual heat output is calculated based on the temperature change, specific heat capacity, and mass using the following formula:

[0051] Q2=c×m×ΔT;

[0052] Wherein, Q2 represents the actual calorific value calculated by the temperature sensor, c represents the specific heat capacity, m represents the mass, and △T represents the temperature change of the solid-state drive to be tested at different times.

[0053] In a possible implementation, multiple rounds of data obtained by combining the actual heating value calculated by the power consumption parameter and the actual heating value calculated by the temperature sensor are corrected for errors to obtain an accurate actual heating value.

[0054] In one possible implementation, a calculation formula for obtaining heat adjustment data is calculated based on the internal temperature, the actual heat generated by the solid-state drive to be tested, the current ambient temperature, and the set standard temperature, including:

[0055] Q total =C×M×(T e -T s );

[0056] Q=Q total ±Q SSD ;

[0057] Among them, T e Indicates the current ambient temperature, T s Indicates the set standard temperature, C indicates the specific heat capacity of the medium in the current environment of the solid state drive, M indicates the quality of the medium in the current environment of the solid state drive to be tested, Q total Indicates the energy that needs to be absorbed or released, Q SSD Indicates the actual heat generated by the SSD under test, and Q is the heat adjustment data that requires adjustment by cooling or heating equipment.

[0058] In the above process, the embodiment of the present invention uses a dual-track parallel approach to calculate the actual calorific value of the SSD under test: First, it obtains power consumption parameters from the SSD's product specifications and, combined with its operating hours, uses a scientific formula to calculate the actual calorific value caused by power consumption. Second, it utilizes the SSD's internal temperature sensor, combined with its physical properties such as mass and specific heat capacity, to monitor and calculate the calorific value changes caused by temperature changes in real time. Subsequently, through multiple rounds of data comparison and error correction, the accuracy of the calorific value calculation is further improved.

[0059] Step 150 : According to the heat adjustment data, the output power of the cooling device or the heating device is adjusted through the electronic control valve until the internal temperature of the test box is adjusted to the standard temperature.

[0060] In one possible implementation, an adjustment coefficient of an electronic control valve is set, the required output power is calculated based on the heat adjustment data and the set adjustment time, and the output power of the refrigeration device or heating device is adjusted by controlling the flow of the working medium entering the refrigeration device or heating device through the electronic control valve.

[0061] The formula for calculating the required output power based on the heat adjustment data and the set adjustment time is as follows:

[0062] P out&put =Δt×k×Q;

[0063] Among them, P out&put Indicates output power, k indicates the adjustment coefficient of the electronic control valve, △t indicates the set adjustment time, and Q indicates the heat adjustment data.

[0064] During the above process, the embodiment of the present invention accurately calculates the required heat adjustment data based on the real-time monitored internal temperature, the calculated actual heating value, the current ambient temperature, and the user-preset standard temperature through a complex algorithm model. Through the intelligent electronic control valve, the flow of the working medium entering the refrigeration or heating equipment is flexibly adjusted, thereby achieving dynamic adjustment of the output power and ensuring that the internal temperature of the test box is always maintained within the set standard range.

[0065] Step 170 : continuously monitor the test box, perform feedback adjustment based on the temperature adjustment of the test box, and immediately cut off the power supply of the test box when the temperature of the test box exceeds a set safety range.

[0066] In one possible implementation, the actual temperature of the solid-state hard disk to be tested in the test box and the changes in the ambient temperature are continuously monitored. If the actual temperature does not reach the standard temperature, the temperature deviation is obtained by subtracting the actual temperature from the standard temperature. If the temperature deviation is greater than 0 and the output power of the heating device has reached the current set value but the temperature rises slowly, the control valve opening is increased, the medium flow entering the heating device is increased, and the output power is improved. If the temperature deviation is greater than 0 and the output power of the cooling device has reached the current set value but the temperature drops too quickly, the control valve opening is reduced, the medium flow entering the cooling device is reduced, and the output power is reduced.

[0067] During the above process, the embodiment of the present invention has established a continuous monitoring and intelligent feedback mechanism, which can promptly detect and respond to any temperature deviation. When it is detected that the actual temperature deviates from the standard range, the feedback adjustment process is quickly started. By adjusting the control valve opening and other measures, the output power of the heating or cooling equipment is ensured to be adjusted in a timely manner, thereby effectively avoiding test errors caused by temperature fluctuations.

[0068] Through the above process, the present invention integrates a single-board computer as a control center and combines it with efficient cooling and heating equipment to monitor the actual heating value of the solid-state drive under test in real time. It also fully considers the impact of ambient temperature changes on test results. By integrating a high-precision temperature sensor, real-time tracking of the internal temperature of the test box is achieved. Combined with the user-preset standard temperature value, the output power of the cooling or heating equipment can be automatically calculated and dynamically adjusted to ensure that the test environment is always maintained within the set optimal temperature range. The power consumption parameters and temperature sensor data are integrated when calculating the actual heating value. Through multiple rounds of data comparison and error correction, the accuracy of the heating value calculation is significantly improved, thereby further improving the accuracy of the test. In addition, it is equipped with a continuous monitoring and intelligent feedback mechanism to promptly detect and respond to temperature deviations. By adjusting the control valve opening, the medium flow rate is flexibly adjusted to ensure timely adjustment of the output power of the heating or cooling equipment, effectively avoiding test errors caused by temperature fluctuations. Not only does it significantly shorten the test cycle of the solid-state drive and significantly improve test efficiency, but it also ensures the reliability and practicality of the test results by accurately simulating actual usage scenarios, thereby effectively solving the problems of long test cycles, low test efficiency, and inability to accurately simulate actual usage scenarios in the prior art.

[0069] In an exemplary embodiment, in order to improve the adaptability and durability of solid-state drives in different temperature environments, thermal shock testing is required. This embodiment provides a solid-state drive thermal shock testing system based on a single-board computer, which aims to achieve fast and accurate testing of solid-state drives in different temperature environments through a simplified system structure and efficient testing process.

[0070] like Figure 2 As shown in the figure, a structural diagram of a solid-state drive thermal shock test system based on a single-board computer is shown. The system consists of a control unit, a test unit, an adjustment unit, and a thermal source unit.

[0071] The control unit includes at least two single-board computers (SBCs) (SBCs 1, 2, and 3), which receive test instructions, control the test process, and collect test data. SBCs are compact, low-power, and stable, making them suitable as the control core of the test system.

[0072] The test unit includes transparent test boxes (e.g., transparent test box 1, transparent test box 2, and transparent test box 3) for loading the SSD to be tested. The transparent test box design facilitates observation of the SSD's status changes during testing.

[0073] Adjustment unit: includes electronic control valves (such as electronic control valve 1, electronic control valve 2, and electronic control valve 3), which are used to adjust the flow of the cold / heat source pipeline according to the instructions of the control unit, thereby achieving precise control of the test environment temperature.

[0074] The cooling and heating source unit includes a large cooling and heating source, which serves as the temperature source for the test system and provides the required low or high temperature environment. The large cooling and heating source is connected to the conditioning unit via cooling and heating source pipes (e.g., cooling and heating source pipe 1, cooling and heating source pipe 2, cooling and heating source pipe 3).

[0075] Specifically, using the above-mentioned solid-state drive thermal shock test system to perform solid-state drive testing may include the following steps:

[0076] In the first step, at least two single board computers (eg, single board computer 1, single board computer 2, etc., the specific number is determined according to system requirements) in the control unit are used as the control center of the entire test system.

[0077] These single-board computers are responsible for receiving test instructions, controlling the test process, and collecting test data. Their small size, low power consumption, and stable performance make them ideal as the control core of test systems.

[0078] The second step is to assemble the test unit. The test unit consists of multiple transparent test boxes (e.g., Transparent Test Box 1, Transparent Test Box 2, etc.), each of which is used to hold the SSD under test. The design of the transparent test boxes allows for intuitive observation of the SSD's status changes during testing without disrupting the test process, which helps improve test accuracy and reliability.

[0079] The third step is to set up the regulation unit. This unit includes multiple electronic control valves (e.g., electronic control valve 1, electronic control valve 2, etc.). These valves adjust the flow rate of the cold / heat source pipes according to the control unit's instructions. The cold / heat source pipes connect the cold / heat source units and the test unit. By adjusting the flow rate, the test environment temperature can be precisely controlled.

[0080] Step 4: Before the test begins, a temperature sensor is placed inside the test unit's transparent test box to monitor the internal temperature in real time. The thermal adjustment data is then calculated based on the internal temperature, the actual heat output of the SSD under test, the current ambient temperature, and the set standard temperature.

[0081] Specifically, the power consumption parameters are obtained based on the product specifications of the solid-state drive to be tested, and combined with its working hours, the actual heat generated by the power consumption is calculated using a scientific formula; the temperature sensor inside the solid-state drive is used, combined with its physical properties such as mass and specific heat capacity, to monitor and calculate the heat changes caused by temperature changes in real time.

[0082] The actual calorific value data obtained by combining the above two methods are subjected to multiple rounds of error correction to obtain more accurate calorific value data.

[0083] The fifth step is to accurately calculate the required heat adjustment data through a complex algorithm model based on the internal temperature, the actual heat generation of the solid-state drive to be tested, the current ambient temperature and the set standard temperature.

[0084] In the sixth step, after obtaining the heat adjustment data, the control unit adjusts the output power of the refrigeration device or the heating device through the electronic control valve.

[0085] Specifically, it includes setting the adjustment coefficient of the electronic control valve, calculating the required output power based on the heat adjustment data and the set adjustment time, and then controlling the flow of the working medium entering the refrigeration equipment or heating equipment through the electronic control valve, thereby realizing dynamic adjustment of the output power and ensuring that the internal temperature of the test box is always maintained within the set standard range.

[0086] In step 7, the control unit continuously monitors the actual temperature of the SSD under test in the test box and changes in the ambient temperature throughout the test process. If the actual temperature does not reach the standard temperature, the temperature deviation is calculated by subtracting the actual temperature from the standard temperature. Feedback adjustments are then made based on the temperature deviation and the device's output power. For example, if the temperature deviation is greater than 0 and the heating device's output power has reached the current set value but the temperature is rising slowly, the control valve opening is increased, increasing the flow of media into the heating device and increasing the output power. If the temperature deviation is greater than 0 and the cooling device's output power has reached the current set value but the temperature is dropping too quickly, the control valve opening is decreased, reducing the flow of media into the cooling device and lowering the output power.

[0087] It is worth noting that when the temperature of the test box exceeds the set safety range, the control unit will immediately cut off the power supply of the test box to ensure the safety of the test process.

[0088] Through the above steps, the SBC-based SSD thermal shock testing system can be used to comprehensively evaluate the performance of SSDs under extreme temperature conditions, significantly shortening the testing cycle and improving testing efficiency. The SBC-based SSD thermal shock testing system provided in this embodiment has the advantages of simple structure, convenient operation, and high testing efficiency. Through the control of the SBC and the observation function of the transparent test box, it enables rapid and accurate testing of SSDs under different temperature environments. At the same time, the system reduces testing costs and improves testing efficiency, providing strong support for SSD performance evaluation and quality control.

[0089] In another embodiment, if Figure 3As shown in FIG, in a large-scale computer network environment, an efficient monitoring and management system is adopted. The system mainly consists of a control center, multiple ordinary PC nodes, a central database and a real-time monitoring alarm system.

[0090] Specifically, the control center, as the core of the entire system, is responsible for receiving data and information from various ordinary PC nodes, centrally processing and analyzing them. At the same time, the control center is also responsible for sending control instructions to each node, achieving comprehensive monitoring and management of the entire network environment.

[0091] Among them, ordinary PC nodes (such as ordinary PC1, ordinary PC2, ordinary PC X These nodes are distributed across the network, performing specific computing tasks and uploading the results and data to the control center. These common PC nodes are flexible and scalable, allowing their number to be increased or decreased based on actual needs.

[0092] The central database serves as the data storage center for the entire system, storing data and information from all common PC nodes. This data and information is processed and analyzed by the control center and used to generate various reports and statistical information to provide decision support for network administrators.

[0093] The real-time monitoring and alarm system is responsible for real-time monitoring of the entire network environment. Once an abnormal situation or potential risk is detected, it will immediately send an alarm message to the control center. Upon receiving the alarm message, the control center will immediately take appropriate measures to ensure the stable operation of the entire network environment.

[0094] During operation, the control center utilizes efficient communication protocols and algorithms to achieve rapid data transmission and information exchange with standard PC nodes. Furthermore, the central database utilizes advanced storage technologies and data backup strategies to ensure data security and reliability. The real-time monitoring and alarm system employs intelligent analysis algorithms and threshold setting strategies to accurately identify anomalies and issue timely alarms. This approach establishes an efficient, stable, and scalable computer network monitoring and management system, providing strong support for the secure operation of the network environment.

[0095] In another application scenario, Figure 4 As shown in Figure 1, a structured test system is built in a computer hardware and software testing environment. The system is centered around a control center and connects multiple computer devices through a network to achieve comprehensive testing of hardware and software products.

[0096] The control center, serving as the core hub of the entire test system, is typically comprised of a high-performance computer. Equipped with specialized test control software, it communicates with other components via Ethernet. The control center issues test commands to individual PCs, including starting and stopping test items and setting parameters. It also collects data from the PCs and the real-time monitoring and alarm module in real time for comprehensive analysis and management.

[0097] Ordinary PCs: Each ordinary PC is equipped with a USB / SATA interface, and each ordinary PC is responsible for testing and controlling a group of test boxes. They are connected to multiple test boxes (such as 1-m, 2-m, n-2, nm, etc.) via USB or SATA expansion interfaces. The test boxes are in turn connected to cold and hot sources via electronic control valves. Ordinary PCs are installed with drivers and test software for SSD testing. They can perform various operations such as read and write tests and performance tests on the SSDs in the connected test boxes according to the instructions of the control center, and provide parameters such as temperature and capacity to the electronic control valves to achieve stable temperature control. At the same time, the ordinary PCs provide real-time feedback to the control center and the real-time monitoring alarm module regarding data collected during the test process, such as the SSD's read and write speed, response time, and temperature changes.

[0098] Test boxes: Multiple test boxes are connected in parallel to a standard PC. Each test box houses a solid-state drive (SSD) to be tested. The test boxes feature a robust heat dissipation design, typically equipped with a heat sink or small fan. The test boxes connect to the expansion port of a standard PC via a standard data cable (such as a SATA cable) for data transmission. Furthermore, the power cord connects to an external power source to provide a stable power supply to the SSD.

[0099] Database: Typically, a professional server-level database is used, connected to the control center and standard PCs via high-speed Ethernet. The database stores a large amount of test data, including performance data, temperature data, and fault records for different SSDs under various test conditions. During testing, the control center and standard PCs write real-time data to the database for subsequent analysis, statistics, and comparison.

[0100] Real-time Monitoring and Alarm Module: This module communicates with the control center and standard PCs via the network. It collects test data from each standard PC in real time, focusing on monitoring key parameters such as SSD temperature and operating status. If a parameter is detected exceeding a preset safety threshold, such as excessive SSD temperature or abnormal read / write error rates, the real-time monitoring and alarm module immediately sends an alarm to the control center and alerts operators through audible and visual alarms, allowing them to take timely action to prevent damage to test equipment or inaccurate test data. During system operation, the temperature of each test box is continuously monitored. If the temperature of an individual test box is detected to be out of control and outside the safe range, the system will immediately initiate an emergency power outage, cutting off the power to the test box to protect the SSD from heat damage.

[0101] Specifically, the specific steps for performing parallel combination testing of multiple test boxes are as follows:

[0102] Step S1: Connect multiple small test boxes in parallel to the expansion port of a common PC. Ensure that the data cables and power cables are firmly connected to avoid loose connections that may cause unstable data transmission or abnormal power supply.

[0103] Step S2: Check whether the hardware configuration of the ordinary PC meets the test requirements of multiple test boxes, such as whether the number of expansion interfaces is sufficient, whether the power supply can support multiple solid-state drives working simultaneously, etc. If necessary, the hardware of the ordinary PC can be upgraded.

[0104] Step S3: Connect the ordinary PC to the network where the control center is located via Ethernet to ensure that the network connection is stable and the communication is normal.

[0105] Step S4: Install the driver and test software required for SSD testing on a regular PC. Ensure that the driver is compatible with the SSD and test box models, and that the test software is fully functional and can meet the requirements of various test items.

[0106] Step S5: Configure the test software parameters, including selecting test items (such as sequential read / write test, random read / write test, durability test, etc.), setting the test data volume, and test interval. At the same time, set the data storage path to ensure that the test data can be accurately saved to the database.

[0107] Step S6: In the test control software of the control center, add and identify the common PCs participating in the test, and set the communication parameters between the common PCs, such as IP address, port number, etc.

[0108] In step S7, a test start command is issued in the test control software of the control center. This command is transmitted to each ordinary PC via the network. After receiving the command, the ordinary PC simultaneously starts testing the solid-state drives in the connected multiple small test boxes according to the pre-configured test parameters.

[0109] Step S8, Data Collection and Transmission: During the test, a standard PC collects real-time test data from each SSD, such as read / write speed, response time, and temperature. This data is transmitted to the control center via the network, allowing operators to view test progress and results in real time. The standard PC also writes the data to a database according to the specified storage path for subsequent detailed analysis.

[0110] Step S9, Real-time Monitoring and Adjustment: The real-time monitoring and alarm module continuously monitors the operating status and key parameters of each SSD. If an SSD experiences an abnormality, such as an overheated temperature, an alert is immediately sent to the control center. Based on the alert, the control center can use a standard PC to adjust the SSD's test parameters, such as reducing test intensity or increasing cooling measures, to ensure smooth testing.

[0111] In step S10, when all test items are completed within the predetermined time or data volume, the control center issues a test stop instruction. After receiving the instruction, the ordinary PC stops the test operation on the solid-state drive and closes the relevant test software and driver.

[0112] Step S11, Data Collation and Analysis: Extract all test data from the database for collation and analysis. This data analysis can assess the reliability differences between different SSDs under the same test conditions, identify the causes of reliability differences, and provide a strong basis for product development and quality control.

[0113] Step S12, Equipment Cleaning and Maintenance: Disconnect the small test box from the regular PC and clean dust and other debris from the test equipment. Inspect the regular PC and small test box. If any equipment is damaged or faulty, repair or replace it promptly to prepare for the next test.

[0114] In this specific application scenario, electronic control valves are used to regulate the cooling or heating equipment to control the ambient temperature of the SSD. The target temperature is set at 30°C, and the actual temperature changes are continuously monitored over a period of time. The temperature control accuracy data is shown in Table 1 below.

[0115] Table 1 Temperature control data

[0116] Time (min) Actual temperature (℃) Temperature deviation (℃) 0 25 -5 5 28 -2 10 30.2 +0.2 15 30.1 +0.1 20 29.9 -0.1 25 30.05 +0.05 30 30.02 +0.02

[0117] After calculation, the average accuracy of the test system in terms of temperature control can reach ±0.2°C, which can meet the requirements for precise temperature control of solid-state drives. Using this test system for parallel combination testing of multiple test boxes and comparing the efficiency with the traditional large temperature chamber testing in the prior art, taking the 1008-hour reliability test of 256 solid-state drives as an example, the comparative test data shown in Table 2 below are obtained.

[0118] Table 2 Comparative test data between the embodiments of the present invention and the prior art

[0119] Test method Total test duration (h) Environmental issues stop testing Existing technology 1008 2-3 times Embodiments of the present invention 1008 Individual replacement

[0120] From the above data, it can be seen that through the parallel combination of multiple test boxes in the embodiments of the present invention, the coupling is greatly reduced. For the test stop caused by overall problems of the temperature chamber, through individual replacement, the test efficiency can be greatly improved, and the reliability test task of solid-state drives can be completed within the standard time.

[0121] In a specific application scenario, to conduct a reliability test on a batch of 256 1008-hour solid-state drives, multiple disks are combined in parallel and a distributed system is formed through a network. The initial environmental temperature T is set to 25°C through the control center, the high temperature of the test disk is T_target = 70°C, and the energy Q is calculated through an energy balance experiment total = C×M×(25°C - 70°C). Through the conversion relationship between energy and temperature, assuming that the heat generated by the disk itself Q SSD will cause the temperature in the test box to rise by ΔT_disk rise = 5°C per hour. The initial environmental temperature is T_initial, the heat dissipation coefficient of the test box is k (unit: °C / h, representing the degree of temperature decrease caused by heat dissipation per unit time, and its value depends on factors such as the material, structure of the test box, and the surrounding environment, etc.), the cooling capacity of the refrigeration equipment per hour can cool the test box by ΔT_cooling down (unit: °C), the heating capacity of the heating equipment per hour can heat the test box by ΔT_heating up (unit: °C). After n hours, the target temperature is reached, and the energy is precisely controlled through an electronic control valve to make the energy satisfy Q = Q total ±Q SSD .

[0122] In the heating stage (when T_initial < T_target), if only relying on the heating equipment to heat up, the formula for the time n_heating required to reach the target temperature is:

[0123]

[0124] For example, when T 初始 = 25°C, ΔT 加升 = 10°C,

[0125] k = 2°C / h,

[0126]

[0127] In this case, the embodiment of the present invention increases the heat source energy to achieve a faster temperature rise. To prevent overshoot, through dynamic calculation, the cold source energy output is increased at an appropriate time, and finally energy balance is achieved to accurately and quickly control the temperature.

[0128] In the constant temperature stage (after reaching T_target), to maintain a constant temperature, the working states of the refrigeration device and the heating device need to be adjusted according to the heat generation of the disk and the environmental heat dissipation. At this time, the relationship between the hourly adjustment amounts of the refrigeration device and the heating device satisfies the following formula:

[0129] ΔT 制降 =ΔT 盘升 -k + ΔT 加升 ;

[0130] That is, when the disk heats up 5°C per hour, the heat dissipation causes the temperature to drop 2°C per hour, and the heating device raises the temperature 1°C per hour, the refrigeration device needs to lower the temperature of the test box by 5 - 2 + 1 = 4°C per hour to maintain a constant temperature of 70°C. The size of the cold and heat energy valves can be controlled through the energy balance of the electronic control valve to achieve precise temperature control.

[0131] It is worth mentioning that during the test, the temperature T_real-time of the test box is monitored in real time. Assuming that the allowable temperature fluctuation range is ±ΔT_fluctuation (for example, if the allowable temperature fluctuates within 2°C above and below 70°C, then ΔT_fluctuation = 2°C), when T_real-time > T_target + ΔT_fluctuation, it is judged that the temperature is out of control, and emergency power-off protection measures need to be taken and an alarm is triggered. When T_real-time > T_target + ΔT_fluctuation and T_real-time < T_target - ΔT_fluctuation, it is also necessary to check whether the working states of the heating or refrigeration devices are abnormal and make corresponding adjustments.

[0132] In the actual test scenario, the temperature is accurately controlled according to specific parameters to ensure that the solid-state drive can stably perform reliability tests in a set high-temperature environment of 70°C, and at the same time, temperature anomalies are promptly detected and processed to ensure the accuracy of the test and the safety of the equipment.

[0133] Through the above process, the embodiment of the present invention not only significantly shortens the test cycle of the solid-state drive, significantly improves the test efficiency, but also ensures the reliability and practicality of the test results by accurately simulating the actual use scenario, thus effectively solving the problems of long test cycles, low test efficiency, and inability to accurately simulate the actual use scenario in the prior art.

[0134] The following is an embodiment of the device of the present invention, which can be used to execute the solid-state drive test method involved in the present invention. For the details not disclosed in the embodiment of the device of the present invention, please refer to the method embodiment of the solid-state drive test method involved in the present invention.

[0135] See also Figure 5 , an embodiment of the present invention provides a solid state drive testing device 800.

[0136] The solid state drive testing device 800 includes but is not limited to: a test box assembly module 810 , an adjustment data calculation module 830 , a temperature adjustment module 850 , and a feedback and emergency module 870 .

[0137] The test box assembly module 810 is used to assemble a test box for the solid-state drive to be tested using a single-board computer as a core component, an external cooling device, a heating device, and a transparent box; the test boxes can be combined in parallel.

[0138] The adjustment data calculation module 830 is used to set a temperature sensor in the test box to monitor the internal temperature in real time, and calculate the heat adjustment data according to the internal temperature, the actual heat generation of the solid state drive to be tested, the current ambient temperature and the set standard temperature.

[0139] The temperature adjustment module 850 is used to adjust the output power of the cooling device or the heating device through the electronic control valve according to the heat adjustment data until the internal temperature of the test box is adjusted to the standard temperature.

[0140] The feedback and emergency module 870 is used to continuously monitor the test box, perform feedback adjustment according to the temperature adjustment of the test box, and immediately cut off the power supply of the test box when the temperature of the test box exceeds the set safety range.

[0141] It should be noted that the solid-state hard drive test provided in the above embodiment is only illustrated by the division of the above-mentioned functional modules. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the solid-state hard drive testing device will be divided into different functional modules to complete all or part of the functions described above.

[0142] In addition, the solid state drive testing device and the solid state drive testing method provided in the above embodiments belong to the same concept, wherein the specific manner in which each module performs operations has been described in detail in the method embodiments and will not be repeated here.

[0143] Figure 6 The following is a schematic diagram of the structure of an electronic device according to an exemplary embodiment.

[0144] It should be noted that the electronic device is only an example adapted to the present invention and cannot be considered to provide any limitation on the scope of use of the present invention. The electronic device cannot be interpreted as needing to rely on or must have Figure 6 One or more components of exemplary electronic device 2000 are shown.

[0145] The hardware structure of the electronic device 2000 may vary greatly due to different configurations or performances, such as Figure 6 As shown, the electronic device 2000 includes a power supply 210 , an interface 230 , at least one memory 250 , and at least one central processing unit (CPU) 270 .

[0146] Specifically, the power supply 210 is used to provide operating voltage for various hardware devices on the electronic device 2000 .

[0147] The interface 230 includes at least one wired or wireless network interface 231 for interacting with external devices. Of course, in other examples adapted by the present invention, the interface 230 may further include at least one serial-to-parallel conversion interface 233, at least one input / output interface 235, and at least one USB interface 237, etc. Figure 6 As shown, this does not constitute a specific limitation.

[0148] The memory 250 serves as a carrier for resource storage and can be a read-only memory, random access memory, disk or optical disk, etc. The resources stored thereon include an operating system 251, application 253 and data 255, etc. The storage method can be temporary storage or permanent storage.

[0149] Among them, the operating system 251 is used to manage and control the various hardware devices and application programs 253 on the electronic device 2000, so as to enable the central processing unit 270 to calculate and process the massive data 255 in the memory 250. It can be WindowsServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, etc.

[0150] The application 253 is a computer-readable instruction that performs at least one specific task based on the operating system 251, and may include at least one module ( Figure 6 (not shown), each module may respectively include computer-readable instructions for the electronic device 2000. For example, the solid-state drive testing device may be considered as an application 253 deployed on the electronic device 2000.

[0151] The data 255 may be signal information, etc., and is stored in the memory 250 .

[0152] The central processing unit 270 may include one or more processors and is configured to communicate with the memory 250 via at least one communication bus to read computer-readable instructions stored in the memory 250, thereby performing operations and processing on the massive amount of data 255 in the memory 250. For example, the solid-state drive testing method can be implemented by the central processing unit 270 reading a series of computer-readable instructions stored in the memory 250.

[0153] In addition, the present invention can also be implemented through hardware circuits or hardware circuits combined with software. Therefore, the implementation of the present invention is not limited to any specific hardware circuits, software, or combination thereof.

[0154] See also Figure 7 In an embodiment of the present invention, an electronic device 4000 is provided. The electronic device 4000 may include: a desktop computer, a laptop computer, a server, etc. with sensor recognition capabilities.

[0155] exist Figure 7 In the embodiment, the electronic device 4000 includes at least one processor 4001 and at least one memory 4003.

[0156] The data exchange between the processor 4001 and the memory 4003 can be realized through at least one communication bus 4002. The communication bus 4002 may include a path for transmitting data between the processor 4001 and the memory 4003. The communication bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus 4002 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 7 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0157] Optionally, the electronic device 4000 may further include a transceiver 4004, which may be used for data exchange between the electronic device and other electronic devices, such as data transmission and / or data reception. It should be noted that in actual applications, the number of transceivers 4004 is not limited to one, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present invention.

[0158] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It may implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the present disclosure. Processor 4001 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and the like.

[0159] The memory 4003 can be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program instructions or codes in the form of instructions or data structures and can be accessed by the electronic device 4000, but is not limited to these.

[0160] Computer-readable instructions are stored in the memory 4003 , and the processor 4001 can read the computer-readable instructions stored in the memory 4003 through the communication bus 4002 .

[0161] The computer-readable instructions are executed by one or more processors 4001 to implement the solid-state drive testing method in the above-mentioned embodiments.

[0162] In addition, an embodiment of the present invention provides a storage medium having computer-readable instructions stored thereon. The computer-readable instructions are executed by one or more processors to implement the solid-state drive testing method described above.

[0163] A computer program product is provided in an embodiment of the present invention. The computer program product includes computer-readable instructions, which are stored in a storage medium. One or more processors of an electronic device read the computer-readable instructions from the storage medium, load and execute the computer-readable instructions, so that the electronic device implements the solid-state hard drive testing method described above.

[0164] Compared with the related art, the present invention has the following beneficial effects:

[0165] 1. High cost-effectiveness: Using single-board computers to replace expensive professional server motherboards not only reduces the cost of test equipment, but also makes the construction of the overall test system more economical and efficient, improving the company's return on investment.

[0166] 2. Precise temperature control: Through the combination of electronic control valves and energy balance calculations, the system can achieve precise control of the temperature of each tray, ensuring the consistency of the test environment and improving the accuracy and reliability of test results.

[0167] 3. Easy to maintain and troubleshoot: The independent operation design of the small disk box allows for quick location and troubleshooting of any problems that arise during the test process, reducing maintenance difficulty and time costs and improving the stability and availability of the test system.

[0168] 4. Strong flexibility: The system can flexibly combine the number of trays and boxes according to actual test needs. Whether it is a small-scale preliminary test or a large-scale comprehensive test, it can easily cope with it, meet the requirements of test samples of different sizes, and improve the flexibility and adaptability of the test.

[0169] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0170] The above descriptions are only partial embodiments of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A solid state drive testing method, characterized in that: The method comprises: A test box for the solid-state drive to be tested is assembled with a single-board computer as the core component, an external cooling device, a heating device, and a transparent box; the test box can be connected in parallel; A temperature sensor is provided in the test box to monitor the internal temperature in real time, and heat adjustment data is calculated based on the internal temperature, the actual heat output of the solid state drive to be tested, the current ambient temperature and the set standard temperature; adjusting the output power of the refrigeration device or the heating device through the electronic control valve according to the heat adjustment data until the internal temperature of the test box is adjusted to the standard temperature; The test box is continuously monitored, and feedback adjustment is performed according to the temperature adjustment of the test box. When the temperature of the test box exceeds a set safety range, the power supply of the test box is immediately cut off.

2. The solid state drive testing method according to claim 1, wherein: The method for calculating the actual heat generation of the solid-state drive to be tested includes: The power consumption parameters are obtained from the product specifications of the solid-state drive to be tested. The actual heat generation is calculated based on the working data of the solid-state drive to be tested over a period of time using the following formula: Q1=P×t; Wherein, Q1 represents the actual heat generated by calculating the power consumption parameter, P represents the power consumption of the solid-state drive under test, and t represents the duration of the solid-state drive under test working.

3. The solid state drive testing method according to claim 2, wherein: The method for calculating the actual heat generation of the solid-state hard disk to be tested further includes: The specific heat capacity and mass are obtained from the product specifications of the solid-state drive to be tested. The temperature changes at different times are measured using the temperature sensor inside the solid-state drive to be tested. The actual heat output is calculated based on the temperature changes, the specific heat capacity, and the mass using the following formula: Q2=c×m×ΔT; Wherein, Q2 represents the actual calorific value calculated by the temperature sensor, c represents the specific heat capacity, m represents the mass, and △T represents the temperature change of the solid-state drive to be tested at different times.

4. The solid state drive testing method according to claim 3, wherein: The actual heat generation calculation of the solid state drive to be tested further includes: Error correction is performed on multiple rounds of data obtained by combining the actual heating value calculated by the power consumption parameter and the actual heating value calculated by the temperature sensor to obtain an accurate actual heating value.

5. The solid state drive testing method according to claim 1, wherein: The calculation formula for obtaining the heat adjustment data based on the internal temperature, the actual heat output of the solid state drive to be tested, the current ambient temperature, and the set standard temperature includes: Q total =C×M×(T e -T s ); Q=Q total ±Q SSD ; Among them, T e Indicates the current ambient temperature, T s Indicates the set standard temperature, C indicates the specific heat capacity of the medium in the current environment of the solid state drive, M indicates the quality of the medium in the current environment of the solid state drive to be tested, Q total Indicates the energy that needs to be absorbed or released, Q SSD Indicates the actual heat generated by the SSD under test, and Q is the heat adjustment data that requires adjustment by cooling or heating equipment.

6. The solid state drive testing method according to claim 5, wherein: The step of adjusting the output power of the refrigeration device or the heating device through the electronic control valve according to the heat adjustment data includes: Setting an adjustment coefficient of the electronic control valve, calculating the required output power according to the heat adjustment data and the set adjustment time, and adjusting the output power of the refrigeration device or heating device by controlling the flow of the working medium entering the refrigeration device or heating device through the electronic control valve; The formula for calculating the required output power based on the heat adjustment data and the set adjustment time is as follows: P out&put =Δt×k×Q; Among them, P out&put Indicates output power, k indicates the adjustment coefficient of the electronic control valve, △t indicates the set adjustment time, and Q indicates the heat adjustment data.

7. The solid state drive testing method according to claim 1, wherein: The continuously monitoring the test box and performing feedback adjustment according to the temperature adjustment condition of the test box includes: Continuously monitoring the actual temperature of the solid-state hard disk to be tested in the test box and the change in the ambient temperature, and if the actual temperature does not reach the standard temperature, obtaining a temperature deviation by subtracting the actual temperature from the standard temperature; If the temperature deviation is greater than 0 and the output power of the heating device has reached the current set value but the temperature rises slowly, increase the opening of the control valve to increase the flow of the medium entering the heating device and increase the output power; If the temperature deviation is greater than 0 and the output power of the refrigeration equipment has reached the current set value but the temperature drops too quickly, the control valve opening is reduced to reduce the medium flow entering the refrigeration equipment and reduce the output power.

8. A solid state drive testing device, characterized in that: The device comprises: A test box assembly module is used to assemble a test box for the solid-state drive to be tested using a single-board computer as the core component, an external cooling device, a heating device, and a transparent box; the test boxes can be connected in parallel; An adjustment data calculation module is configured to set a temperature sensor in the test box to monitor the internal temperature in real time, and calculate the heat adjustment data based on the internal temperature, the actual heat output of the solid-state drive to be tested, the current ambient temperature, and the set standard temperature; a temperature adjustment module, configured to adjust the output power of a refrigeration device or a heating device through an electronic control valve according to the heat adjustment data until the internal temperature of the test box is adjusted to the standard temperature; The feedback and emergency module is used to continuously monitor the test box, perform feedback adjustment according to the temperature adjustment of the test box, and immediately cut off the power supply of the test box when the temperature of the test box exceeds a set safety range.

9. An electronic device, characterized in that: include: at least one processor and at least one memory, wherein: The memory has computer-readable instructions stored thereon; The computer-readable instructions are executed by one or more processors, so that the electronic device implements the solid-state drive testing method according to any one of claims 1 to 7.

10. A storage medium having computer-readable instructions stored thereon, characterized in that: The computer-readable instructions are executed by one or more processors to implement the solid-state drive testing method according to any one of claims 1 to 7.

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