Manufacturing method of V-band packaged antenna

Abstract

The invention relates to the technical field of communication system electronic function component manufacturing, in particular to a V-band packaging antenna manufacturing method which comprises the steps that (1) a slotted metal core is manufactured; (2) manufacturing a V-band microstrip antenna plate with a stepped blind slot and a metal core by combining the metal core in the step (1) with a PCB (Printed Circuit Board) process; (3) interconnection between the transceiver chip and the microstrip antenna board is completed; and (4) installing a waveguide connector. The method effectively solves the problems of parasitic effect introduced by bonding, narrow bandwidth of a planar antenna, need of secondary assembly of a microstrip antenna and a metal structural member, low assembly precision, difficult operation, low reliability of an embedded air cavity, easy high-temperature layering and the like, provides a solution for miniaturization, high integration and low cost of a V-band communication antenna assembly, can realize the bandwidth of 57-65GHz, and has wide application prospects. The gain can be greater than or equal to 12dBi, and the loss is less than or equal to 0.5 dB. Compared with a traditional antenna, the size of the packaged antenna is reduced by more than 50%, 100 times of circulation at the temperature of-45 DEG C to 75 DEG C can be met, good machinability and reliability are achieved, and a key technical bottleneck is broken through for V-band communication.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing electronic functional components of communication systems, and in particular to a method for manufacturing a V-band packaged antenna. Background Art

[0002] With the increasing demand for higher-frequency, smaller, more integrated, and lower-power antenna systems in fields like communications and radar, traditional frequency bands and antenna design methods are struggling to adapt. V-band high-speed communications, with their strong anti-interference capabilities, high security, abundant spectrum resources, high transmission rates, and high integration, are suitable for short-range wireless communications and are a key research area for the development of next-generation communications. However, the V-band wavelength in a vacuum is only 5mm, requiring a more highly integrated antenna form. Compared to traditional microstrip antennas, packaged antennas integrate multiple functional chips and antennas into a single package to achieve optimized performance in a small footprint. This new solution has become a hot research area for V-band antennas.

[0003] Currently, V-band packaged antennas primarily utilize the LTCC process, which presents challenges such as brittleness, inability to manufacture large-area products, high costs, and low production efficiency. Printed circuit boards (PCBs) are widely used in antennas and transceiver components as a low-cost alternative to LTCC. However, the traditional PCB processing method for manufacturing V-band packaged antennas presents the following difficulties:

[0004] (1) The compact structure of the packaged antenna multilayer microstrip board has relatively high dielectric and conductor losses, large surface wave losses, and severe spatial radiation losses, which fundamentally limit the antenna performance. An air cavity must be introduced to improve the performance, but the air cavity is difficult to fabricate in a miniaturized microstrip board.

[0005] (2) Currently, packaged antennas are mostly fabricated using silicon-based CMOS or BiCMOS processes, integrating transceiver chips with microstrip antennas. However, the high dielectric constant (≈11.9) and low resistivity (≈10Ω·cm) of the silicon substrate further limit the gain and efficiency of the packaged antenna. CMOS chips generally require a bonding process, and the length and position of the bonding wires can generate parasitic parameters that can also affect antenna performance.

[0006] (3) Due to the small wavelength and high integration of the V-band, 2-channel or 4-channel packaged antenna designs are often used. Therefore, it is difficult to achieve vertical interconnection between the packaged antenna and the connector in the multi-channel array, which makes the integrated design of the packaged antenna difficult and hinders its use in the antenna system.

[0007] (4) The packaged antenna needs to be grounded, and the microwave ground layer on the back of the antenna needs to be in close contact with the metal structure. Grounding requires screwing, welding or conductive bonding. Screw connection reduces the integration level, while welding and conductive bonding must create a temperature gradient with the chip interconnection, otherwise it will affect the reliability of the chip.

[0008] In view of the above-mentioned defects, the inventors of the present invention finally obtained the present invention after a long period of research and practice. Summary of the Invention

[0009] The purpose of the present invention is to solve the problems of parasitic effects introduced by bonding, narrow bandwidth of planar antennas, complex assembly process and low reliability, and provide a method for manufacturing a V-band packaged antenna.

[0010] In order to achieve the above object, the present invention discloses a method for manufacturing a V-band packaged antenna, comprising the following steps:

[0011] S1, a metal plate containing a blind groove and a low-dielectric filling material, wherein the low-dielectric filling material is flush with the surface of the metal plate;

[0012] S2, using the metal plate in step S1 in combination with a PCB process to manufacture a V-band packaged antenna with a stepped blind groove and a metal base plate;

[0013] S3, complete the interconnection between the transceiver chip and the microstrip antenna board, making the top layer of the chip flush with the top layer of the antenna;

[0014] S4, install the connector and test the antenna performance.

[0015] In step S1, the material of the metal plate is any one of red copper, aluminum alloy, silicon / aluminum composite material, and Kovar alloy material; the air cavity blind groove is manufactured by mechanically controlling the depth milling of the metal plate, and to ensure the accuracy of the cavity, the burrs on the groove wall are polished and specially inspected, and at the same time, a through groove for installing the connector is manufactured, and the through groove is a stepped type with a smaller top and a larger bottom.

[0016] In the step S1, the air cavity is filled with a material with a low dielectric constant, and the thickness is flush with the top surface of the metal plate. The material is selected from any one of rigid polymethacrylimide (PMI) foam, polyurethane (PUR) foam, cross-linked rigid polyvinyl chloride (PVC) foam, phenolic (PF) foam, polymer aerogel, and silicon-based aerogel. The thickness of the filling material is exactly the same as the thickness and tolerance of the blind groove of the metal plate. During filling, an adhesive process is adopted to prepare the filling material into the size of the air cavity, and a structural adhesive film is used to embed it into the cavity through a vacuum bag pressing process. The adhesive film only bonds the filling material and the metal plate on the vertical groove wall of the blind groove, and there is no adhesive film at the bottom of the blind groove of the metal plate; the dielectric constant of the filling material is ≤1.2 and the density is ≤50kg / m 3 The film curing process temperature is 100-130°C and the thickness is ≤0.1mm. Through step S1, a special structure with a complete and smooth top surface and a low dielectric constant in the groove is obtained, which also meets the processing requirements of multi-layer microstrip boards.

[0017] In step S2, the V-band packaged antenna includes a microstrip antenna layer and a feed layer. A blind slot is defined in the center of the antenna layer for chip bonding. The height of the blind slot is the sum of the chip height and the interconnect material height. The microstrip antenna is a PTFE-based system. The antenna layer dielectric is selected from a PTFE / glass cloth, PTFE / microglass cloth, or PTFE / ceramic filler system with a dielectric constant ≤ 2.20. The feed network dielectric is a hydrocarbon resin / glass cloth / ceramic powder system. The feed network dielectric of the V-band microstrip antenna board is a hydrocarbon resin / glass cloth / ceramic powder system. The copper foil on the dielectric top layer is any one of rolled copper foil, electrolytic copper foil, reverse copper foil, and low-profile copper foil, with a copper foil thickness of 18μm or 35μm. The dielectric thickness is 0.254mm.

[0018] In step S2, the microstrip boards of the antenna layer and the feed layer in the V-band microstrip antenna board are prepared using a traditional microwave PCB manufacturing process. The traditional microwave PCB manufacturing process is divided into inner layer production and multi-layer production. The inner layer production includes drilling, electroplating, plugging, pattern production, and brown-blackening. The multi-layer production includes lamination, drilling, electroplating, plugging, and pattern production. The multi-layer production of the multi-layer microstrip board integrating the antenna layer and the feed layer in the V-band microstrip antenna board includes lamination, pattern production, electroplating, and surface coating. The adhesive material used for the composite of the multi-layer microstrip board of the feed layer is a microwave adhesive sheet. The adhesive material used for the composite between the antenna feed layer and the multi-layer microstrip board of the feed layer is a microwave adhesive sheet.

[0019] In step S2, the blind slots in the antenna layer are pre-fabricated before lamination using a CCD machine milling process, and the slot walls are deburred. The resulting blind slots have a positional accuracy of 0 to +0.06 mm. During multi-layer lamination, PTFE plugs are inserted into the blind slots to prevent adhesive from overflowing onto the bottom pattern. The PTFE plugs have a dimensional accuracy of -0.08 to 0 mm. During lamination, a three-in-one cushioning material, kraft paper, and copper foil are laminated.

[0020] In the step S2, the welding positions of the multi-layer microstrip boards in the V-band microstrip antenna board are surface-coated, and the coating material is any one of gold plating, chemical gold plating, and nickel-gold plating. The nickel thickness of the nickel-gold plating layer is 3 to 5 μm, and the gold thickness is 0.13 to 0.45 μm; the metal plate and the multi-layer microstrip board in the V-band microstrip antenna board are laminated and finally the appearance processing is completed; the adhesive material used for the composite between the metal core board and the multi-layer microstrip board is selected as a microwave adhesive sheet.

[0021] In step S3, the specific process is as follows: the transceiver chip is bonded to the feed layer in the blind groove of the packaged antenna microstrip board, and the height of the chip is controlled by dispensing glue or the thickness of the glue film is stacked to make the height of the chip flush with the height of the antenna feed layer after conductive glue bonding, and the chip and the adhesive material are cured in an oven, and the chip and the antenna feed layer are interconnected by bonding.

[0022] The conductive adhesive has a curing temperature lower than 150°C and a volume resistivity lower than 5*10 -4 Ω·cm, conductive adhesive film with a thickness of 0.05mm / 0.1mm, or a curing temperature below 150℃ and a volume resistivity below 5*10 -4 Ω·cm conductive adhesive; the bonding uses gold wire or aluminum wire, and the bonding process is selected from any one of hot pressing bonding, ultrasonic bonding, and thermosonic bonding.

[0023] In step S4, the specific process is as follows: screw the WR15 waveguide to SMA connector onto the bottom of the metal plate, complete the electrical interconnection between the inner conductor of the SMA connector and the top layer pattern of the multi-layer microstrip board by manual welding, and test the overall antenna indicators through the WR15 waveguide.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. The V-band packaged antenna prepared in this invention reduces parasitic effects by introducing an air cavity design and adjusting the thickness of the chip and antenna feed layer, so that the antenna gain can reach ≥12dBi and the loss ≤0.5dB, showing superior performance compared to existing packaged antennas.

[0026] 2. The V-band packaged antenna prepared in the present invention integrates the microstrip antenna and metal plate, which originally required secondary assembly, into one integrated whole through the PCB process. This improves the integration level and assembly precision, and solves the existing technical problems of microstrip antennas being prone to warping, having low alignment accuracy with metal structural parts, and having poor bonding and grounding effects with the chip.

[0027] 3. The V-band packaged antenna prepared in the present invention improves the antenna reliability without affecting the microwave performance due to the addition of low dielectric constant fillers in the air cavity. It can meet the typical environmental test requirements of 100 temperature cycles from -45°C to +75°C, and has passed the vibration and impact tests in the airborne environment, showing good reliability and environmental adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of the V-band packaged antenna of the existing process route in the comparative example;

[0029] Figures 2 to 4 This is a process flow chart of the existing V-band packaged antenna in the comparative example, wherein:

[0030] Figure 2 This is the process flow chart of the antenna feed microstrip board;

[0031] Figure 3 This is the process flow chart for feeding microstrip board;

[0032] Figure 4This is the process flow chart for packaged antenna assembly;

[0033] Figure 5 This is a schematic structural diagram of the V-band packaged antenna in Example 1;

[0034] Figures 6 and 7 This is a process flow chart of the V-band packaged antenna in Example 1, wherein:

[0035] Figure 6 This is the process flow chart of microstrip board with metal plate;

[0036] Figure 7 This is the process flow chart for packaged antenna assembly;

[0037] Figure 8 This is a schematic structural diagram of the V-band packaged antenna in Example 2;

[0038] Figures 9 and 10 This is a process flow chart of the V-band packaged antenna in Example 2, wherein:

[0039] Figure 9 This is the process flow chart of microstrip board with metal plate;

[0040] Figure 10 This is the process flow chart for the packaged antenna assembly.

[0041] The numbers in the figure represent:

[0042] 1-Short-circuit top layer pressing block; 2-Solder point; 3-Aluminum wire; 4-Transceiver chip; 5-H20E conductive adhesive; 6-Top layer pattern; 7-Patch pattern; 8-Dielectric; 9-Three-layer dielectric; 10-Aluminum alloy structural part; 11-Metalized hole wall; 12-Plugged hole; 13-Blind slot air cavity in the metal layer; 14-Air slot; 15-Two layers of RO4450F adhesive material; 16-Inner layer pattern; 17-Mounting screw; 18-Waveguide WR15; 19-Outer conductor; 20-Screw; 21-Side wall; 22-Through hole; 23-Inner conductor; 24-FastRise28 prepreg; 25-25N; 26-Screw; 27-Polyurethane aerogel; 28-Elastic probe; 29-Elastic coaxial connector. DETAILED DESCRIPTION

[0043] The above and other technical features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.

[0044] Comparative Example

[0045] Comparative Example V-band packaged antenna structure design see Figure 1 , the comparative example includes 5 groups of independent structures, namely:

[0046] (1) Antenna feed microstrip board (medium 8, patch pattern 7) based on RT5880 (thickness 0.254mm, copper foil 17μm), including blind slots;

[0047] (2) A six-layer feed microstrip board based on RO4350B (thickness 0.254 mm, copper foil 17 μm) (including three layers of dielectric 9, two layers of RO4450F adhesive material 15, top layer pattern 6, inner layer pattern 16, blind vias (metallized hole wall 11 and plug hole 12), and through hole 22);

[0048] (3) an aluminum alloy structural member 10 (including side walls 21 and a short-circuit top layer pressing block 1) containing an air groove 14;

[0049] (4) Waveguide WR15 18 with SMA coaxial connector (outer conductor 19, inner conductor 23) (including mounting screws 17);

[0050] (5) Silicon-based CMOS transceiver chip 4.

[0051] First, the metal plate is fabricated. The processing process involves mechanical drilling, mechanical deep milling, grinding, tapping, and CNC milling of the outer shape. This includes the through slot for the RF connector and the blind slot for the air cavity. The small ring above the through slot is used to mount the connector's outer conductor 19, while the large ring below the through slot is used to mount the connector's flange 18.

[0052] Then prepare the double-sided antenna feed microstrip board and the multi-layer feed microstrip board respectively.

[0053] The processing flow of double-sided antenna feed microstrip board is: pattern production, surface coating, and appearance processing.

[0054] The processing flow of the multilayer fed microstrip board is as follows: drilling, electroplating, plugging, pattern production, brown-blackening, pressing, drilling, electroplating, plugging, pattern production, surface coating, and appearance processing.

[0055] The final assembly process is as follows: first, the antenna microstrip board, feed microstrip board and aluminum alloy structural parts are screwed and pressed together by screws 20, and they fit tightly with the aluminum alloy structural part 10 and the side wall 21, and the patch pattern is located directly above the air slot 14. Use H20E conductive glue 5 to cure at 120°C for 30 minutes on the top pattern 6 of the feed layer, and bond the silicon-based transceiver chip 4 to the feed microstrip board. Then, the interconnection is completed by bonding between the transceiver chip 4 and the antenna feed layer through aluminum wire 3. Install the SMA-WR15 on the aluminum alloy structural part by screwing, and tighten the screws 17 to complete the fixation. The solder joint 2 is formed by manual welding, and then the short-circuit top layer pressure block 1 is tightly pressed to the antenna feed microstrip board by screws. The specific process flow is as follows Figure 2 shown.

[0056] The problem with Comparative Example 1 is that the close screw fastening between the antenna microstrip board, the feed microstrip board, and the aluminum alloy structural member inevitably results in ground discontinuity, limiting the overall packaged antenna's performance. Within a bandwidth of 57 to 65 GHz, the gain can reach ≥8 dBi and the loss ≤0.8 dB. Because the screw holes cannot be precisely positioned, the assembly accuracy between the feed layer and the connector is only ±0.08 mm. To ensure electrical continuity and structural reliability, the screw holes are evenly distributed, resulting in their larger size.

[0057] Example 1

[0058] The V-band packaged antenna structure design in Example 1 is shown in Figure 3 , except for the newly added numbers, other numbers are the same as Figure 1 The corresponding meanings are consistent. Example 1 includes 4 groups of independent structures, namely:

[0059] (1) Multi-layer microstrip board with metal plate: the antenna feed layer still uses RT5880 (thickness 0.254mm, copper foil 17μm) as the dielectric basis, and the feed layer still uses RO4350B (thickness 0.254mm, copper foil 17μm) as the dielectric basis. First, the six inner layers are pressed together with RO4450F, and the copper plate 10 containing the air cavity is completed;

[0060] (2) Short-circuit top layer compact;

[0061] (3) Waveguide WR15 with SMA coaxial connector;

[0062] (4) Silicon-based CMOS transceiver chip.

[0063] The process flow of the V-band packaged antenna in Example 1 is as follows: Figure 4 As shown, where:

[0064] The metal plate air cavity was fabricated identically to the comparative example, except that polyurethane aerogel 26, produced by the Institute of Petrochemicals of the Heilongjiang Academy of Sciences, with a dielectric constant of 1.05, was added to the cavity. The cavity walls and the polyurethane aerogel were bonded with J-333 adhesive film under vacuum at a temperature of 120°C. The resulting polyurethane aerogel exhibited a local flatness of ±0.05 mm.

[0065] The processing flow of the multi-layer microstrip board with metal plate is as follows: mechanical milling, drilling, electroplating, plugging, graphic production, brown-blackening, three-time lamination, surface coating, and appearance processing. Among them, except for the first lamination of the feed layer, the second lamination completes the lamination of the antenna feed layer and the feed layer through the CFB278F semi-cured sheet, and finally the third lamination of the 8-layer microstrip board and the metal plate is completed through the RLP30 adhesive material 25. The adhesive material is removed in advance at the position corresponding to the metal plate through groove, forming a hole 27 that is 0.1 to 0.25 mm larger than the outer edge of the through groove, and at the same time, the gap 24 between the multi-layer board and the metal plate is filled through the gap. Since the embodiment 1 adopts a 4-in-1 paneling mode, when the third lamination is performed, since the shape of the metal plate has been processed, a PTFE gasket must be placed in the metal-free area when the alignment is overlapped to ensure consistent pressure during the lamination process and meet the high flatness requirements of the finished multi-layer board.

[0066] The final assembly process is as follows: J-423 conductive adhesive (produced by the Petrochemical Research Institute of the Heilongjiang Academy of Sciences) is applied to the top pattern of the feed layer, adjusting the thickness so that the chip is flush with the antenna top layer. The adhesive is then cured at 120°C for 30 minutes. The silicon-based transceiver chip is bonded into the blind slot of the feed layer. Aluminum wire is then bonded between the transceiver chip and the antenna feed layer to create interconnections. An SMA-WR15 is screwed onto the copper plate and secured by tightening the screws. Solder joints are formed by hand soldering. Finally, the short-circuit top layer clamp is attached to the multilayer board through the sidewall using screws 28, completing the connection to the metal plate.

[0067] Compared to the comparative example, the assembly accuracy between the feed layer and the connector of this packaged antenna assembly has been improved from ±0.08mm to ±0.05mm, achieving a bandwidth of 57 to 65GHz, a gain of ≥12dBi, and a loss of ≤0.5dB. Compared to traditional antennas, this packaged antenna is over 50% smaller and can withstand 100 temperature cycles from -45°C to 75°C. It offers excellent electrical performance, convenient operation, and high reliability.

[0068] Example 2

[0069] The V-band packaged antenna structure design in Example 2 is shown in FIG. Figure 5 , except for the newly added numbers, other numbers are the same as Figure 1 The corresponding meanings are consistent. Example 2 includes 3 groups of independent structures, namely:

[0070] (1) Multi-layer microstrip board with metal plate, the antenna feed layer uses CF200 (thickness 0.254mm, copper foil 17μm) from the 46th Institute of Electronic Science and Technology as the dielectric base, and the feed layer uses CT-350 (thickness 0.254mm, copper foil 17μm) from Taizhou Wangling Company as the dielectric base. First, the 6-layer inner layer board is pressed together with CT-300P from Taizhou Wangling Company, as well as the copper plate (the boss 31 is embedded in the antenna feed layer and the feed layer);

[0071] (2) waveguide WR15 of elastic coaxial connector 29;

[0072] (3) Silicon-based CMOS transceiver chip.

[0073] The process flow of the V-band packaged antenna in Example 2 is as follows: Figure 6 As shown, where:

[0074] An additional hole 32 is drilled in the metal plate, and polyurethane aerogel 28 is added to the air cavity of the metal plate. The epoxy film is passed through a vacuum bag press at 120° C. and 0.1 MPa for 2.5 hours. The remaining steps are consistent with the first embodiment.

[0075] The manufacturing process for a multilayer microstrip board with metal plates includes milling, drilling, electroplating, plugging, patterning, browning, three-stage lamination, surface coating, and external shaping. After the third lamination, the holes 32 of the copper bosses 31 embedded in the microstrip board are first plugged with resin. After the plugging resin cures, drilling is performed on the resin, the hole walls are metallized 33, and the holes within the holes are plugged again 34 and cured. Electroplating is then performed at the hole openings, and the antenna feed layer patterning is then performed. The remaining steps are consistent with those in Example 1.

[0076] The final assembly process is as follows: A 0.1mm thick layer of CF3350 conductive adhesive is applied to the top pattern of the feed layer and cured at 130°C for 3 hours. The silicon-based transceiver chip is bonded into the blind slot of the feed layer. Aluminum wire is then bonded between the transceiver chip and the antenna feed layer to establish interconnection. A WR15 coaxial connector with elastic probes 29 is screwed onto the copper plate and tightened to secure the connection, completing the vertical interconnection of microwave signals.

[0077] Compared to the comparative example, this packaged antenna assembly has a 15% reduction in cross-section thickness, and the assembly accuracy between the feed layer and the connector has been improved from ±0.08mm to ±0.04mm. It achieves a bandwidth of 57 to 65GHz, a gain of ≥12dBi, and a loss of ≤0.5dB. Compared to traditional antennas, this packaged antenna is over 50% smaller and can withstand 300 temperature cycles from -45°C to 75°C. It offers excellent electrical performance, convenient operation, and high reliability.

[0078] The above description is merely a preferred embodiment of the present invention and is intended to be illustrative rather than restrictive of the present invention. Those skilled in the art will appreciate that many changes, modifications, and even equivalents may be made to the present invention within the spirit and scope of the claims, all of which fall within the scope of protection of the present invention.

Claims

1. A method for manufacturing a V-band packaged antenna, characterized in that: The following steps are involved: S1, a metal plate containing a blind groove and a low-dielectric filling material, wherein the low-dielectric filling material is flush with the surface of the metal plate; S2, using the metal plate in step S1 in combination with a PCB process to manufacture a V-band packaged antenna with a stepped blind groove and a metal base plate; S3, complete the interconnection between the transceiver chip and the microstrip antenna board, making the top layer of the chip flush with the top layer of the antenna; S4, install the connector and test the antenna performance.

2. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S1, the material of the metal plate is any one of red copper, aluminum alloy, silicon / aluminum composite material, and Kovar alloy material; the air cavity blind groove is manufactured by mechanically controlling the depth milling of the metal plate, and to ensure the accuracy of the cavity, the burrs on the groove wall are polished and specially inspected, and at the same time, a through groove for installing the connector is manufactured, and the through groove is a stepped type with a smaller top and a larger bottom.

3. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S1, the air cavity is filled with a material with a low dielectric constant, the thickness of which is flush with the top surface of the metal plate. The material is selected from any one of rigid polymethacrylimide foam, polyurethane foam, cross-linked rigid polyvinyl chloride foam, phenolic foam, polymer aerogel, and silicon-based aerogel. The thickness of the filling material is the same as the thickness and tolerance of the blind groove of the metal plate. During filling, an adhesive process is used to prepare the filling material into the size of the air cavity, and a structural adhesive film is used to embed it into the cavity through a vacuum bag pressing process. The adhesive film only bonds the filling material and the metal plate on the vertical groove wall of the blind groove, and there is no adhesive film at the bottom of the blind groove of the metal plate. The dielectric constant of the filling material is ≤1.2 and the density is ≤50kg / m 3 The film curing process temperature is 100-130℃ and the thickness is ≤0.1mm.

4. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S2, the V-band packaged antenna includes a microstrip antenna layer and a feed layer. A blind slot is provided in the middle of the antenna layer. The height of the blind slot is the sum of the chip height and the interconnect material height. The microstrip antenna is a PTFE-based system. The antenna layer dielectric is selected from a PTFE / glass fiber cloth, a PTFE / microglass fiber system, or a PTFE / ceramic filler with a dielectric constant ≤ 2.

20. The feed network dielectric is selected from a hydrocarbon resin / glass fiber cloth / ceramic powder system. The feed network dielectric of the V-band microstrip antenna board is a hydrocarbon resin / glass fiber cloth / ceramic powder system. The copper foil on the top layer of the dielectric is any one of rolled copper foil, electrolytic copper foil, reverse copper foil, and low-profile copper foil. The copper foil thickness is 18 μm or 35 μm. The dielectric thickness is 0.254 mm.

5. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S2, the microstrip boards of the antenna layer and the feed layer in the V-band microstrip antenna board are prepared using a traditional microwave PCB manufacturing process. The traditional microwave PCB manufacturing process is divided into inner layer production and multi-layer production. The inner layer production includes drilling, electroplating, plugging, pattern production, and brown-blackening. The multi-layer production includes lamination, drilling, electroplating, plugging, and pattern production. The multi-layer production of the multi-layer microstrip board integrating the antenna layer and the feed layer in the V-band microstrip antenna board includes lamination, pattern production, electroplating, and surface coating. The adhesive material used for the composite of the multi-layer microstrip board of the feed layer is a microwave adhesive sheet. The adhesive material used for the composite between the antenna feed layer and the multi-layer microstrip board of the feed layer is a microwave adhesive sheet.

6. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In the step S2, the blind groove is made in advance before lamination, and CCD mechanical milling is used to remove burrs on the groove wall. The position accuracy of the blind groove after manufacture is 0 to +0.06 mm. During multi-layer lamination, a PTFE plug is inserted into the blind groove to prevent the adhesive material from overflowing onto the pattern at the bottom of the blind groove. The external dimension accuracy of the PTFE plug is -0.08 to 0 mm. During lamination, a three-in-one cushioning material, kraft paper, and copper foil are laminated and composited.

7. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In the step S2, the welding positions of the multi-layer microstrip boards in the V-band microstrip antenna board are surface-coated, and the coating material is any one of gold plating, chemical gold plating, and nickel-gold plating. The nickel thickness of the nickel-gold plating layer is 3 to 5 μm, and the gold thickness is 0.13 to 0.45 μm; the metal plate and the multi-layer microstrip board in the V-band microstrip antenna board are laminated and finally the appearance processing is completed; the adhesive material used for the composite between the metal core board and the multi-layer microstrip board is selected as a microwave adhesive sheet.

8. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S3, the specific process is as follows: the transceiver chip is bonded to the feed layer of the packaged antenna microstrip board, and the height of the chip is controlled by dispensing glue or the thickness of the glue film is stacked to make the height of the chip flush with the height of the antenna feed layer after conductive adhesive bonding, and the chip and the adhesive material are cured in an oven, and the chip and the antenna feed layer are interconnected by bonding.

9. The method for manufacturing a V-band packaged antenna according to claim 8, wherein: The conductive adhesive has a curing temperature lower than 150°C and a volume resistivity lower than 5*10 -4 Ω·cm, conductive adhesive film with a thickness of 0.05mm / 0.1mm, or a curing temperature below 150℃ and a volume resistivity below 5*10 -4 Ω·cm conductive adhesive; gold wire or aluminum wire is used for bonding, and the bonding process is selected from any one of hot compression bonding, ultrasonic bonding, and thermosonic bonding.

10. The method for manufacturing a V-band packaged antenna according to claim 1, wherein: In step S4, the specific process is as follows: screw the WR15 waveguide to SMA connector onto the bottom of the metal plate, complete the electrical interconnection between the inner conductor of the SMA connector and the top layer pattern of the multi-layer microstrip board by manual welding, and test the overall antenna indicators through the WR15 waveguide.

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