Housing components and electronic devices

Abstract

This application provides an electronic device that uses a joint portion on the side of the mid-frame facing the back cover. This joint portion avoids the bottleneck area of ​​the mid-frame and is recessed away from the back cover. This joint portion serves as the support base for the adhesive layer, allowing the adhesive layer between the mid-frame and the back cover to pass through the area where the joint portion is located. In this way, while avoiding the bottleneck area of ​​the mid-frame and ensuring its structural strength, the recessed joint portion on the mid-frame supports the adhesive layer. This means the adhesive layer no longer occupies a separate portion of the electronic device's thickness; instead, it can be accommodated within at least a portion of the mid-frame's wall thickness. This reduces the gap between the back cover and the mid-frame, ensuring the waterproof effect of the electronic device while reducing the overall thickness, thus contributing to the development of thinner and lighter electronic devices.

Description

[0001] This application is a divisional application of the invention patent application filed with the Chinese Patent Office with application number 202310431629.0, filing date April 11, 2023, entitled "Housing Assembly and Electronic Device". Technical Field

[0002] This application relates to the field of electronic devices, and in particular to a housing assembly and an electronic device. Background Technology

[0003] With the development of science and technology, electronic devices such as mobile phones and tablets are becoming increasingly thinner and lighter to meet consumer needs.

[0004] Taking mobile phones as an example, the battery cover of electronic devices is bonded to the mid-frame with adhesive. The mid-frame, adhesive, and battery cover together limit the thickness of the phone. As electronic devices become thinner, certain structures on the mid-frame have become bottlenecks in reducing overall thickness, especially in the case of foldable phones. Because the adhesive covers the areas on the mid-frame corresponding to these structures, it occupies a significant amount of space between the mid-frame and the battery cover due to the size limitations of these structures. This prevents further reduction in the gap between the battery cover and the mid-frame, thus hindering the reduction of the overall thickness of the electronic device. Summary of the Invention

[0005] This application provides a housing assembly and an electronic device. The adhesive layer of the housing assembly avoids the bottleneck part of the middle frame, which can reduce the overall thickness while ensuring waterproof effect, thus contributing to the thinning of electronic devices.

[0006] On one hand, this application provides a housing assembly, including:

[0007] Back cover;

[0008] The middle frame has a joint on the side facing the back cover. The joint avoids the bottleneck part of the middle frame and is recessed away from the bottleneck part on the side opposite to the back cover.

[0009] An adhesive layer is provided between the back cover and the middle frame, and passes through the area where the joint is located.

[0010] The housing assembly provided in this application features a joint portion on the side of the mid-frame facing the rear cover. This joint portion avoids the bottleneck area of ​​the mid-frame and is recessed away from the rear cover. This joint portion serves as the support base for the adhesive layer, allowing the adhesive layer between the mid-frame and the rear cover to pass through the area where the joint portion is located. In this way, while avoiding the bottleneck area of ​​the mid-frame and ensuring its structural strength, the recessed joint portion on the mid-frame supports the adhesive layer. This means the adhesive layer no longer occupies a separate portion of the electronic device's thickness; instead, it can be accommodated within at least a portion of the mid-frame's wall thickness. This reduces the gap between the rear cover and the mid-frame, ensuring the waterproof effect of the electronic device while reducing the overall thickness, thus contributing to the trend towards thinner and lighter electronic devices.

[0011] In one possible implementation, the bottleneck portion is located in the edge region of the middle frame, and the joint is adjacent to the side of the bottleneck portion away from the edge of the middle frame.

[0012] The bottleneck of the mid-frame is usually located in the edge area of ​​the mid-frame. By setting the joint on the side of the bottleneck away from the edge of the mid-frame, the joint avoids the bottleneck. Furthermore, by making the joint adjacent to the bottleneck, the joint is still kept in the area close to the edge of the mid-frame. This allows the adhesive layer attached to the joint to firmly connect the back cover to the mid-frame, ensuring the connection strength between the back cover and the mid-frame and the waterproof effect of the entire electronic device.

[0013] In one possible implementation, the surface of the bottleneck portion facing the back cover is the first positioning surface, and the surface of the joint portion facing the back cover is the second positioning surface. The distance between the second positioning surface and the first positioning surface is greater than or equal to 1 / 2 of the thickness of the adhesive layer.

[0014] By ensuring that the distance between the first positioning surface of the joint and the second positioning surface of the bottleneck portion is greater than or equal to half the thickness of the adhesive layer, and that at least half the thickness of the adhesive layer is located within the thickness space of the frame portion of the middle frame, and that the portion of the adhesive layer protruding on the frame portion is less than half its thickness, the distance between the back cover and the frame portion of the middle frame can be reduced by at least half the thickness of the adhesive layer.

[0015] In one possible implementation, the middle frame includes a middle plate portion and a side frame portion, with the side frame portion surrounding the periphery of the middle plate portion, and the middle plate portion, the side frame portion, and the rear cover together forming a receiving cavity.

[0016] The joint and bottleneck parts are both located in the frame.

[0017] The back cover is bonded to the frame of the middle frame by an adhesive layer. By setting a joint in an area on the frame that avoids its bottleneck, the joint is recessed into the bottleneck and the adhesive layer is connected to the joint. This allows the adhesive layer to reuse the space of the frame in the thickness direction of the electronic device. The adhesive layer occupies at least part of the wall thickness of the frame, reducing the thickness space of the electronic device occupied by the adhesive layer, narrowing the gap between the back cover and the frame, and thus reducing the overall thickness of the electronic device.

[0018] In one possible implementation, along the thickness direction of the middle frame, the wall thickness of the bottleneck portion is greater than or equal to a preset thickness. That is, the area where the bottleneck portion is located has a thickness requirement; the wall thickness of the bottleneck portion must not be less than a preset thickness. This preset thickness can be the minimum thickness required by the design to ensure that the area where the bottleneck portion is located has sufficient strength and to guarantee the reliability of the frame portion.

[0019] In one possible implementation, the housing assembly includes a first housing and a second housing, both of which include a rear cover, a middle frame, and an adhesive layer;

[0020] The housing assembly also includes:

[0021] The pivot is connected between the middle frame of the first housing and the middle frame of the second housing. The joint and bottleneck are both located in the area of ​​the side frame corresponding to the pivot.

[0022] In one possible implementation, the frame portion includes a sidewall and an extension wall sequentially connected to the middle plate portion, the sidewall extending toward the rear cover, and the extension wall extending toward the edge of the rear cover along the plane direction of the rear cover.

[0023] The extended wall has joints and bottlenecks.

[0024] In one possible implementation, the frame portion has a plug hole, and an interface device is installed in the plug hole. The interface device is configured to connect to an external device.

[0025] The side wall of the insertion hole facing the rear cover has a bottleneck section and a joint.

[0026] In one possible implementation, the interface device includes a device body extending from the receiving cavity to the plug hole. The device body includes a power terminal and a plug terminal connected in sequence. The power terminal is connected to a circuit board disposed within the receiving cavity, and the plug terminal is used to connect to an external device.

[0027] Among them, the bottleneck part corresponds to the area where the plug-in end is located; the joint part corresponds to the area where the connection between the plug-in end and the power-connecting end is located, or the joint part corresponds to the area where the power-connecting end is located.

[0028] In the side wall of the insertion hole facing the rear cover, the area corresponding to the insertion end of the device body is the bottleneck area. By setting the joint in the area of ​​the connection between the insertion end and the power terminal of the device body, or by setting the joint in the area of ​​the power terminal of the device body, the joint can avoid the bottleneck area.

[0029] In one possible implementation, the outer wall of the plug end and the wall of the plug hole form a plug cavity, which is used for plugging in external devices.

[0030] By directly inserting the device body into the socket, the outer frame surrounding the device body is eliminated. The outer wall of the device body's plug-in end and the wall of the socket directly form a plug-in cavity. There is no need to enlarge the opening size of the socket, and consequently, there is no need to increase the thickness of the frame, which helps to reduce the overall thickness of the electronic device.

[0031] In one possible implementation, the outer wall surface of the device body is provided with a seal, which is in close contact with the wall of the insertion hole.

[0032] By setting a seal on the outer wall of the device body, the seal is made to make tight contact with the wall of the plug hole. The seal seals the gap between the device body and the plug hole, preventing external moisture, dust and other foreign objects from entering the containment cavity through the gap between the plug hole and the device body, thus ensuring the waterproof effect of the entire electronic device.

[0033] In one possible implementation, the wall of the insertion hole has an inwardly extending positioning boss, and the seal is in close contact with the positioning boss.

[0034] By setting an inwardly protruding positioning boss on the wall of the insertion hole, the gap between the insertion hole and the device body at this part is reduced, ensuring that the positioning boss can contact and squeeze the seal, thereby ensuring the sealing effect of the seal.

[0035] In one possible implementation, the positioning boss is located in the area where the joint is located.

[0036] By placing the positioning boss in the area where the joint is located, it can be ensured that the positioning boss avoids the bottleneck part of the insertion hole, and the thickness of the area where the joint is located can be increased to enhance the structural strength of the area where the joint is located.

[0037] In one possible implementation, the interface device further includes a mounting bracket, which is sleeved on the device body and connected to the circuit board.

[0038] By installing a mounting bracket on the outer casing of the device body, which is connected to the circuit board, the device body is positioned to ensure a secure connection between the power terminals of the device body and the circuit board.

[0039] In one possible implementation, the adhesive layer has a concave section protruding into the receiving cavity at the location of the insertion hole.

[0040] Since the bottleneck of the insertion hole extends inward from the outer edge of the frame portion, and the joint portion is located on the side of the frame portion close to the receiving cavity, the adhesive layer forms a concave section at the location of the insertion hole. The concave section is recessed inward from the outer edge of the frame portion, that is, the concave section protrudes into the receiving cavity.

[0041] In one possible implementation, the adhesive layer is a solid film layer or a liquid-cured layer.

[0042] On the other hand, this application provides an electronic device including a display screen and a housing assembly as described above, wherein the display screen is connected to the housing assembly.

[0043] The electronic device provided in this application includes a display screen and a housing assembly. The display screen is supported and fixed on the housing assembly. The housing assembly has a joint portion on the side of the middle frame facing the back cover, which avoids the bottleneck part of the middle frame. The joint portion is recessed on the side away from the back cover, using this joint portion as the support base for the adhesive layer, so that the adhesive layer between the middle frame and the back cover passes through the area where the joint portion is located. In this way, while avoiding the bottleneck part of the middle frame and ensuring the structural strength of the middle frame, the inwardly recessed joint portion on the middle frame supports the adhesive layer. This means that the adhesive layer no longer occupies the thickness space of the electronic device alone, but can be accommodated in at least part of the wall thickness space of the middle frame itself. This reduces the gap between the back cover and the middle frame, and while ensuring the waterproof effect of the electronic device, it also reduces the overall thickness, which is conducive to the development of thinner and lighter electronic devices. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0045] Figure 2 for Figure 1 The exploded structure diagram of the electronic device shown;

[0046] Figure 3 A schematic diagram of another electronic device provided in the present application in its unfolded state;

[0047] Figure 4 for Figure 3 A schematic diagram of the structure of the electronic device in the folded state;

[0048] Figure 5 for Figure 3 A schematic diagram of the electronic devices in the device when they are in a semi-deployed state;

[0049] Figure 6 for Figure 3Exploded view of electronic devices in the system;

[0050] Figure 7 This is a partial structural diagram of the housing assembly in the related technology;

[0051] Figure 8 for Figure 7 A cross-sectional view of the housing assembly at point AA;

[0052] Figure 9 A partial structural diagram of a housing assembly provided in an embodiment of this application;

[0053] Figure 10 for Figure 9 A cross-sectional view of the housing assembly at BB;

[0054] Figure 11 for Figure 10 A magnified view of point A on the housing assembly;

[0055] Figure 12 for Figure 9 A schematic diagram of the housing assembly after removing the back cover;

[0056] Figure 13 for Figure 12 Exploded view of the housing components;

[0057] Figure 14 A partial structural diagram of another housing assembly provided in an embodiment of this application;

[0058] Figure 15 for Figure 14 A cross-sectional view of the housing assembly at CC. Detailed Implementation

[0059] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0060] This application provides an electronic device, which can be a consumer electronics product. Examples include, but are not limited to, mobile phones, portable Android devices (PADs), notebook computers (Notebooks), ultra-mobile personal computers (UMPCs), walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, virtual reality (VR) devices, and augmented reality (AR) devices.

[0061] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. (Refer to...) Figure 1 As shown, taking a candybar-style electronic device 1 as an example, such as a candybar mobile phone, the electronic device 1 may include a housing assembly 10 and a display screen 20. One side surface of the display screen 20 is used to display image information, and this side surface of the display screen 20 is generally defined as its front, and the other side surface opposite to its front is its back. The housing assembly 10 surrounds the periphery and back of the display screen 20 to support and fix the display screen 20 and provide protection. The front of the display screen 20 is exposed outside the housing assembly 10 so that the user can view the content displayed on the display screen 20 or perform input operations on the electronic device 1.

[0062] Taking the straight-board electronic device shown in the figure as an example, the display screen 20 of the electronic device 1 can be a rigid screen, and the display screen 20 can be an LCD (Liquid Crystal Display) display screen 20 or an OLED (Organic Light-Emitting Diode) display screen 20.

[0063] Figure 2 for Figure 1 The diagram shows the exploded structure of the electronic device. (Refer to...) Figure 2As shown, taking a candybar electronic device as an example, the housing assembly 10 of the electronic device 1 includes a middle frame 100 and a back cover 200. The middle frame 100 is connected between the display screen 20 and the back cover 200. The display screen 20 is supported on one side surface of the middle frame 100, and the back cover 200 is connected to the other side surface of the middle frame 100. The display screen 20 is typically supported entirely on the middle frame 100 to ensure the strength and stability of the display screen 20 and meet its usage requirements. The back cover 200 is typically connected to the middle frame 100 by an overlapping method. The middle frame 100 and the back cover 200 together form a receiving cavity, which is used to install circuit boards (not shown in the figure), batteries (not shown in the figure), interface devices (not shown in the figure), camera modules (not shown in the figure), microphones (not shown in the figure), and other devices.

[0064] The mid-frame 100 may include a mid-plate portion 110 and a frame portion 120. The mid-plate portion 110 is located between the display screen 20 and the back cover 200, and is generally arranged parallel to the display screen 20 and the back cover 200. The frame portion 120 surrounds the periphery of the mid-plate portion 110, and the frame portion 120 may extend to both sides of the mid-plate portion 110 perpendicular to its surface. For example, the frame portion 120 and the mid-plate portion 110 may be an integrally formed structure.

[0065] The display screen 20 is typically mounted onto the middle plate 110 of the middle frame 100 using an integral bonding method. For example, the display screen 20 is entirely bonded to the middle plate 110. The middle plate 110 supports the display screen 20, ensuring it is stably and securely supported, giving it sufficient strength to meet the requirements of frequent pressing. The bezel 120 surrounds the display screen 20, protecting its edges and helping it withstand risks such as collisions and drops, preventing damage.

[0066] The edge of the back cover 200 is connected to the edge portion 120 of the middle frame 100, for example, the edge of the back cover 200 is bonded to the edge portion 120. A gap exists between the middle plate portion 110 of the middle frame 100 and the back cover 200, forming a receiving cavity as described above, for mounting a device within the receiving cavity between the middle plate portion 110 of the middle frame 100 and the back cover 200. Exemplarily, the back cover 200 may be generally flat, with its edge overlapping the edge portion 120 of the middle frame 100, the entire back cover 200 situated within the area enclosed by the edge portion 120; alternatively, the back cover 200 may have a flange bent towards the middle frame 100, the flange surrounding the outer side of the edge portion 120 of the middle frame 100, enclosing the middle frame 100 within it.

[0067] Figure 3 A schematic diagram of another electronic device provided in the present application in its unfolded state; Figure 4 for Figure 3 A schematic diagram of the structure of the electronic device in the folded state; Figure 5 for Figure 3 A schematic diagram of the structure of the electronic device in a semi-deployed state.

[0068] Reference Figures 3 to 5 As shown, taking electronic device 1 as an example, such as a foldable electronic device (e.g., a foldable phone), electronic device 1 can have different usage states in different usage scenarios. Among them, Figure 3 The electronic device 1 is shown in its unfolded state. The unfolding angle α of the electronic device 1 is, for example, 180°. At this time, the electronic device 1 can realize large-screen display. Figure 4 The electronic device 1 is shown in a folded state, at which time the electronic device 1 is small in size and easy to carry; Figure 5 An electronic device 1 is shown in a semi-expanded state. At this time, the electronic device 1 is hovering at an angle between the unfolded state and the folded state. For example, the hovering angle β of the electronic device 1 can be 120°, 130°, 140° or 150°, etc.

[0069] It should be noted that the angles illustrated in this embodiment are allowed to have slight deviations. For example, the unfolding angle α of electronic device 1 being 180° means that the unfolding angle α can be 180°, or it can be approximately 180°, such as 170°, 175°, 185°, or 190°, etc. The angles illustrated in the following text can be understood in the same way.

[0070] In addition, it should be understood that, Figures 3 to 5 The electronic device 1 shown is capable of folding once. The electronic device 1 includes two parts that can rotate relative to each other. When the two parts rotate to be coplanar, the electronic device 1 is in an unfolded state (e.g., ...). Figure 3 As shown), when the two parts are rotated to overlap, the electronic device 1 is in a folded state (as shown). Figure 4 As shown), when the two parts are rotated to a certain angle between the unfolded and folded states, the electronic device 1 is in a semi-unfolded state (as shown). Figure 5 (As shown). In other embodiments, the electronic device 1 may also be an electronic device 1 capable of multiple (more than two) folds. In this case, the electronic device 1 may include multiple parts that are rotatably connected in sequence. Two adjacent parts may be relatively far apart to be unfolded into an unfolded state, and two adjacent parts may be relatively close to be folded into a folded state.

[0071] Figure 6 for Figure 3 An exploded view of the electronic devices in the diagram. (Refer to...) Figure 6As shown, for a foldable electronic device, the electronic device 1 may also include a display screen 20 and a housing assembly 10. The front of the display screen 20 is used to display image information, and the housing assembly 10 surrounds the periphery and back of the display screen 20 to support and fix the display screen 20 and provide protection. Further details will not be provided here.

[0072] The display screen 20 of the foldable electronic device may include a first area 21, a second area 22, and a bendable area 23, with the bendable area 23 located between the first area 21 and the second area 22. During use, the first area 21 and the second area 22 remain in a flat state, while the bendable area 23 can be bent to change the angle between the first area 21 and the second area 22, so that the foldable screen can fold or unfold with the movement of the housing assembly 10, thereby enabling the electronic device 1 to switch between a folded state and an unfolded state.

[0073] For example, in the display screen 20 of the foldable electronic device, at least the bendable area 23 is made of a flexible material so that the bendable area 23 can be bent. The first area 21 and the second area 22 can be made of flexible materials, or they can be made of rigid materials, or they can be made of partially rigid materials and partially flexible materials. This embodiment does not limit this.

[0074] The display screen 20 of the foldable electronic device may be, but is not limited to, an organic light-emitting diode (OLED) display screen 20, an active-matrix organic light-emitting diode (AMOLED) display screen 20, a mini organic light-emitting diode display screen 20, a micro organic light-emitting diode display screen 20, a micro organic light-emitting diode display screen 20, or a quantum dot light-emitting diode (QLED) display screen 20, etc.

[0075] Among them, combined Figure 3 and Figure 6As shown, when the display screen 20 is in the unfolded state, the first area 21 and the second area 22 are unfolded in a relatively far apart position, while the bendable area 23 is in a flattened state without bending. The first area 21, the second area 22, and the bendable area 23 all face the same direction and are coplanar. At this time, the angle between the first area 21 and the second area 22 is 180°. The display screen 20 can achieve a large-screen display, providing users with richer information and a better user experience. Combined with... Figure 4 and Figure 6 As shown, when the display screen 20 is in the folded state, the first area 21 and the second area 22 are stacked relative to each other, and the bendable area 23 is in a bent state. The bending angle of the bendable area 23 is, for example, 180°. At this time, the foldable electronic device 1 is small in size, making it easy to carry and store.

[0076] It should be noted that, taking the foldable electronic device as an example with an inward-folding structure, when the electronic device 1 is in the folded state, the first area 21 and the second area 22 of the display screen 20 are relatively close together, and the housing assembly 10 surrounds the display screen 20 to prevent the display screen 20 from being scratched by hard objects. See also Figure 4 If the inward-folding electronic device needs to display a function in the folded state, a display screen 20 can be added to the back of the housing assembly 10. The foldable electronic device 1 relies on this display screen 20 to display a function in the folded state. In other words, the display screen 20 of the inward-folding electronic device can include a first display screen 20a and a second display screen 20b. The first display screen 20a can be a foldable screen installed on the front of the housing assembly 10, and the first display screen 20a can switch between an unfolded state and a folded state. The second display screen 20b can be a single screen installed on the back of the housing assembly 10, and the second display screen 20b displays information when the electronic device 1 is in the folded state.

[0077] In other examples, the foldable electronic device can also be an outward-folding architecture. When the electronic device 1 is in the folded state, the first area 21 and the second area 22 of the display screen 20 face away from each other, and the housing assembly 10 is located between the first area 21 and the second area 22. The display screen 20 surrounds the housing assembly 10 and is exposed to the outside, making it visible to the user. The display screen 20 can be used to perform display functions, thus eliminating the need to add an additional display screen 20 to the back of the housing assembly 10. In other words, the outward-folding electronic device may only include the display screen 20 mounted on the front of the housing assembly 10.

[0078] In addition, combined Figure 5 and Figure 6As shown, in some embodiments, the foldable electronic device, especially the inward-folding electronic device, can rely on the damping force provided by the housing assembly 10 to suspend the electronic device 1 at a certain angle between the unfolded state and the folded state. For example, the suspension angle of the electronic device 1 can be 120°, 130°, 140°, or 150°, etc. At this time, the bendable area 23 of the display screen 20 is also in a bent state, and the first area 21 and the second area 22 of the display screen 20 are tilted relative to each other. The included angle between the first area 21 and the second area 22 is, for example, 120°, 130°, 140°, or 150°, etc.

[0079] For foldable electronic devices, in addition to supporting and fixing the display screen 20, the housing assembly 10 also needs to drive the display screen 20 to switch between a folded and unfolded state. For this, refer to... Figure 6 As shown, the housing assembly 10 of the foldable electronic device may include a first housing 10a, a second housing 10b and a rotating shaft 10c. The rotating shaft 10c connects the first housing 10a and the second housing 10b. The first housing 10a and the second housing 10b are rotatably connected through the rotating shaft 10c, thereby realizing relative rotation between the first housing 10a and the second housing 10b.

[0080] The first housing 10a supports and fixes the first area 21 of the display screen 20, and the second housing 10b supports and fixes the second area 22 of the display screen 20. In other words, the first area 21 of the display screen 20 is fixedly connected to the first housing 10a, and the second area 22 of the display screen 20 is fixedly connected to the second housing 10b. The bendable area 23 of the display screen 20 is set corresponding to the rotating shaft 10c. When the rotating shaft 10c drives the first housing 10a and the second housing 10b to rotate relative to each other, the first area 21 and the second area 22 of the display screen 20 change their orientation accordingly, and the bendable area 23 of the display screen 20 bends or flattens as the orientation of the first area 21 and the second area 22 changes.

[0081] The pivot 10c drives the first housing 10a and the second housing 10b to rotate relative to each other, causing the electronic device 1 to switch between a folded state and an unfolded state. Specifically, the first housing 10a and the second housing 10b can rotate in a direction away from each other until they are coplanar. At this time, the housing assembly 10 is in the unfolded state, and the display screen 20 is also unfolded along with the housing assembly 10. Figure 3 As shown; the first housing 10a and the second housing 10b can also rotate towards each other until they are stacked relative to each other. At this time, the housing assembly 10 is in a folded state, and the display screen 20 is also in a folded state as the housing assembly 10 is folded, as shown. Figure 4As shown; the first housing 10a and the second housing 10b can also rotate relative to each other until they are in a folded state and an unfolded state. At this time, the housing assembly 10 is in a semi-unfolded state (hovered state). The included angle between the first housing 10a and the second housing 10b 200 is, for example, 120°, 130°, 140° or 150°, etc. The display screen 20 is in a semi-unfolded state along with the housing assembly 10, such as... Figure 5 As shown.

[0082] Continue to refer to Figure 6 As shown, in the housing assembly 10 of the foldable electronic device, both the first housing 10a and the second housing 10b may include a middle frame 100, and the first area 21 and the second area 22 of the display screen 20 may be supported on the front of the middle frame 100. Specifically, for outward-folding electronic devices or inward-folding electronic devices without an additional second display screen 20b, both the first housing 10a and the second housing 10b of the electronic device 1 may also include a back cover 200, which is connected to the side of the middle frame 100 facing away from the display screen 20. For inward-folding electronic devices with an additional second display screen 20b, one of the first housing 10a and the second housing 10b may not include the back cover 200, but instead, the second display screen 20b may be mounted on the back of the middle frame 100.

[0083] In the first housing 10a and the second housing 10b, the middle frame 100 and the rear cover 200 (second display screen 20b) together form a receiving cavity, which is used to install circuit boards (not shown in the figure), batteries (not shown in the figure), interface devices (not shown in the figure), camera modules (not shown in the figure), microphones (not shown in the figure), and other devices. The middle frame 100 may include a middle plate portion 110 and a frame portion 120. The display screen 20 is integrally mounted on the middle plate portion 110, and the frame portion 120 surrounds the periphery of the middle plate portion 110. The rear cover 200 (second display screen 20b) is bonded to the frame portion 120.

[0084] Whether it is a candybar electronic device or a foldable electronic device, with the trend of making electronic devices 1 thinner and lighter, some structural designs of the housing component 10 of electronic devices 1 have become a bottleneck for reducing the overall thickness. Especially in the application of foldable electronic devices, the overall thickness (especially in the folded state) is relatively large because the housing component 10 cannot be further thinned.

[0085] Figure 7 This is a partial structural diagram of the housing assembly in the related technology; Figure 8 for Figure 7 A cross-sectional view of the housing assembly at point AA. (Refer to...) Figure 7 and Figure 8As shown, the middle plate portion 110a of the middle frame 100a is located on the side of the side frame portion 120a away from the rear cover 200a. The gap between the middle plate portion 110a and the rear cover 200a forms a receiving cavity 11a. The figure shows a partial structure of the part where the insertion hole 121a is opened on the middle frame 100a. The insertion hole 121a is opened on the side frame portion 120a of the middle frame 100a and extends inward to communicate with the receiving cavity 11a.

[0086] The interface device 400a is installed in the plug hole 121a. The interface device 400a can be a USB (Universal Serial Bus) interface. The interface device 400a is connected to the circuit board 500a disposed in the receiving cavity 11a. The interface device 400a is used to connect with external devices. For example, by inserting a data cable into the plug hole 121a, the interface device 400a can be connected to external devices such as external power supplies, headphones, and storage devices to charge electronic devices or enable interaction between electronic devices and external devices.

[0087] The back cover 200a is bonded to the edge portion 120a of the middle frame 100a via an adhesive layer 300a. The adhesive layer 300a is arranged around the edge portion, passing through the area where the insertion hole 121a is located. For standard devices such as interface devices 400a, there are also requirements for the size of the insertion hole 121a, which limits the size of the middle frame 100a. That is, the edge portion 120a of the middle frame 100a is in the thickness direction of the electronic device ( Figure 8 The dimensions in the Z direction shown are limited, and the wall thickness of the frame portion 120a of the middle frame 100a at the location of the insertion hole 121a (towards the rear cover 200a) should meet the structural strength requirements of the middle frame 100a.

[0088] Due to the wall thickness limitation of the frame portion 120a where the insertion hole 121a is located, in related technologies, the adhesive layer 300a laminated on the frame portion 120a is relatively far from the interface device 400a. Specifically, the frame portion 120a (on the side facing the rear cover 200a) has a bottleneck portion 122a in the area where the insertion hole 121a is located. The bottleneck portion 122a is located within the standard size segment of the insertion hole 121a, which is the insertion hole 121a (in...). Figure 8 The width of the hole in the Z direction must meet the design requirements and cannot be reduced. The adhesive layer 300a covers the bottleneck area of ​​the frame 120a, making the distance between the device and the interface device 400a larger.

[0089] On this basis, the back cover 200a is also stacked on the adhesive layer 300a. For the adhesive layer 300a covering the bottleneck area of ​​the frame portion 120a, the adhesive layer 300a occupies the space between the frame portion 120a of the middle frame 100a and the back cover 200a. In the thickness direction of the electronic device 1, the position of the back cover 200a is set further outward (closer to the back of the electronic device 1) than the frame portion 120a of the middle frame 100a. The gap between the back cover 200a and the middle frame 100a cannot be further reduced, resulting in the overall thickness of the electronic device not being reduced.

[0090] Continue to refer to Figure 8 As shown, in related technologies, the interface device 400a, in addition to the device body 410a, typically includes an outer frame 420a. The outer frame 420a surrounds the outer periphery of the device body 410a and is attached to the inner wall of the insertion hole 121a. The space between the outer frame 420a and the device body 410a should meet design requirements to achieve the connection between the interface device 400a and external devices. Therefore, regardless of whether the wall of the insertion hole 121a is a smooth wall and the wall thickness of the outer frame 420a is entirely within the area enclosed by the insertion hole 121a (the outer frame 420a occupies the space within the insertion hole 121a), or whether a shallow groove is formed on the wall of the insertion hole 121a and the outer frame 420a is partially embedded in the wall of the insertion hole 121a (part of the wall thickness of the outer frame 420a occupies the space where the wall of the insertion hole 121a is located), the insertion hole 121a in the thickness direction of the electronic device ( Figure 8 The dimensions in the Z direction have been increased to a certain extent, which makes the gap between the side wall of the frame portion 120a facing the rear cover 200a and the middle plate portion 110a larger, which is not conducive to reducing the overall thickness of the electronic device.

[0091] Since the outer frame 420a is provided around the device body 410a, when sealing the insertion hole 121a on the frame portion 120a, the sealing ring 600a is usually fitted onto the outer wall surface of the outer frame 420a. For example, the sealing ring 600a is bonded to the outer wall surface of the outer frame 420a, and the sealing ring 600a is in close contact with the frame portion 120a. The sealing ring 600a is squeezed to seal the insertion hole 121a, preventing external moisture, dust and other foreign objects from entering the receiving cavity 11a from the gap between the interface device 400a and the insertion hole 121a.

[0092] In the case where the outer frame 420a is attached to the inner wall of the insertion hole 121a, a clearance groove 123a can be opened on the frame portion 120a corresponding to the outer frame 420a. The sealing ring 600a is located in the clearance groove 123a. One side of the sealing ring 600a is fixed by the bracket 700a fixed to the outer wall of the outer frame 420, and the other side of the sealing ring 600a is in close contact with the groove wall of the clearance groove 123a. The sealing ring 600a is squeezed between the bracket 700a and the groove wall of the clearance groove 123a to seal the gap between the outer frame 420 and the insertion hole 121a.

[0093] In view of this, this embodiment improves the connection structure between the back cover and the middle frame by providing a joint portion on the side of the middle frame facing the back cover. This joint portion avoids the bottleneck area of ​​the middle frame, and is recessed towards the side away from the back cover. This joint portion serves as the support base for the adhesive layer, allowing the adhesive layer between the middle frame and the back cover to pass through the area where the joint portion is located. In this way, while avoiding the bottleneck area of ​​the middle frame and ensuring the structural strength of the middle frame, the recessed joint portion on the middle frame supports the adhesive layer. This means that the adhesive layer no longer occupies the thickness space of the electronic device alone, but can be accommodated using at least part of the wall thickness space of the middle frame itself. This reduces the gap between the back cover and the middle frame, ensuring the waterproof effect of the electronic device while reducing the overall thickness, which is beneficial to the development of thinner and lighter electronic devices.

[0094] The housing assembly 10 of the electronic device 1 of this embodiment will be described in detail below with reference to the accompanying drawings.

[0095] Figure 9 A partial structural diagram of a housing assembly provided in an embodiment of this application; Figure 10 for Figure 9 A cross-sectional view of the housing assembly at BB. (Refer to...) Figure 9 and Figure 10 As shown in the figure, a partial structure of the housing assembly 10 at the location of the insertion hole 123 on the middle frame 100 is shown. Regardless of whether the electronic device 1 is a candybar electronic device or a foldable electronic device, in this embodiment, the housing assembly 10 of the electronic device 1 includes a middle frame 100 and a back cover 200. The middle plate portion 110 of the middle frame 100 is connected to the side of the side frame portion 120 away from the back cover 200. The side frame portion 120 of the middle frame 100 and the back cover 200 are bonded together by an adhesive layer 300. The middle plate portion 110, the side frame portion 120 and the back cover 200 together form a receiving cavity 11.

[0096] The adhesive layer 300 can be a solid film layer. Initially, the adhesive layer 300 can be a solid film. Before connecting the middle frame 100 and the back cover 200, the adhesive layer 300 is first adhered to the middle frame 100 or the back cover 200. Then, the middle frame 100 and the back cover 200 are placed together, and pressure is applied to bond the adhesive layer 300 between them. Alternatively, the adhesive layer 300 can also be a liquid curing layer. Before curing, the adhesive layer 300 can be in the initial state of liquid adhesive. Liquid adhesive can be sprayed onto the middle frame 100 or the back cover 200 using a dispensing process. Then, the middle frame 100 and the back cover 200 are placed together, and the liquid adhesive cures to form a solid adhesive layer 300, providing a stable and reliable connection between the middle frame 100 and the back cover 200.

[0097] The figure shows a circuit board 500 disposed within the receiving cavity 11. This circuit board 500 is located near the insertion hole 123, that is, near the edge portion 120 of the middle frame 100. For example, the circuit board 500 disposed within the receiving cavity 11 of the electronic device 1 may include a main circuit board (hereinafter referred to as the motherboard) and a secondary circuit board (hereinafter referred to as the sub-board). The main circuit board and the sub-board are electrically connected to each other. The motherboard may house system-on-a-chip (SOC), memory, radio frequency devices, power chips, and other devices. The sub-board is disposed near the edge portion 120 of the middle frame 100 and is used to house devices that need to be disposed near the edge portion 120 or devices that cannot be integrated onto the motherboard. For example, the sub-board may house microphones, speakers, interface devices 400, and spring contacts. Therefore, the circuit board 500 shown in the figure can be a sub-board.

[0098] An interface device 400 is installed in a socket 123 on the edge portion 120 of the mid-frame 100. The interface device 400 can be a USB interface, such as a Type-C interface or a Micro USB interface. The interface device 400 is connected to a circuit board 500 (e.g., a sub-board) near the edge portion 120 within the receiving cavity 11. For example, the interface device 400 can be connected to pads on the circuit board 500 via pins. In practical applications, the interface device 400 can be connected to external devices such as external power supplies, headphones, and storage devices by inserting a data cable that matches the interface device 400 into the socket 123.

[0099] As mentioned earlier, for standard devices such as interface device 400, there are corresponding fixed requirements for the size of the plug hole 123. The part of the frame 120 of the middle frame 100 where the plug hole 123 is located, the wall of the side of the plug hole 123 facing the rear cover 200 forms the wall thickness of the frame 120 at that part. With the size of the plug hole 123 fixed, the wall thickness of the side of the plug hole 123 facing the rear cover 200 should be guaranteed to meet the structural strength requirements of the frame 120 of the middle frame 100.

[0100] In this regard, the side wall of the insertion hole 123 facing the rear cover 200 typically has a bottleneck portion 121. The existence of the bottleneck portion 121 is due to the fact that this portion needs to meet the requirements of the insertion hole 123 in the thickness direction of the electronic device 1. Figure 10 The dimensions in the Z direction shown in the figure, and this part also needs to meet the structural strength requirements of the frame portion 120 of the middle frame 100. Therefore, the distance between the bottleneck portion 121 of the side hole wall of the insertion hole 123 and the interface device 400 cannot be reduced, and the wall thickness of the bottleneck portion 121 cannot be reduced excessively.

[0101] In other words, in this example, the inner wall surface of the bottleneck portion 121 of the plug hole 123 and the corresponding surface of the interface device 400 must maintain a required gap to meet the usage requirements of the plug hole 123. Furthermore, the wall thickness of the bottleneck portion 121 should be greater than or equal to a preset thickness, which is the minimum thickness required by the design, to ensure that the portion where the plug hole 123 is located has sufficient wall thickness to guarantee the structural strength of the frame portion 120 at the location of the plug hole 123.

[0102] Reference Figure 10 As shown, in order to reduce the gap between the back cover 200 and the side frame portion 120 of the middle frame 100, in this embodiment, a joint portion 122 is designed on the side wall of the insertion hole 123 facing the back cover 200, avoiding the bottleneck portion 121. As the name suggests, the joint portion 122 is the part on the side frame portion 120 of the middle frame 100 where the adhesive layer 300 is provided. That is, the section of the adhesive layer 300 passing through the insertion hole 123 on the side frame portion 120 is located on the joint portion 122. Among them, compared with the bottleneck portion 121, the joint portion 122 is recessed to the side away from the back cover 200. In the thickness direction of the housing assembly 10 (Z direction shown in the figure), the surface of the joint portion 122 facing the back cover 200 is located between the inner wall surface of the insertion hole 123 and the surface of the bottleneck portion 121 facing the back cover 200.

[0103] In this embodiment, a joint portion 122 is provided on the side wall of the insertion hole 123 facing the rear cover 200, so that the joint portion 122 is recessed into the bottleneck portion 121 of the side wall of the insertion hole 123, so that the adhesive layer 300 is connected to the joint portion 122 corresponding to the section of the insertion hole 123. In this way, the adhesive layer 300 avoids the bottleneck portion 121 of the insertion hole 123, and the recessed joint portion 122 provides more space for the adhesive layer 300. The adhesive layer 300 at least partially occupies the wall thickness of the edge portion 120 of the middle frame 100, that is, the adhesive layer 300 can reuse the edge portion 120 in the thickness direction of the electronic device 1. Figure 10 The space in the Z direction shown is used to reduce the thickness space of the electronic device 1 occupied by the adhesive layer 300, reduce the gap between the back cover 200 and the frame portion 120, and thus reduce the overall thickness of the electronic device 1.

[0104] Furthermore, since the joint 122 avoids the area where the bottleneck portion 121 is located, the joint 122 will not affect the section of the insertion hole 123 that needs to maintain the required dimensions, thus ensuring the connection requirements between the insertion hole 123 and external devices. In addition, since the structural strength of the frame portion 120 at the location of the hole wall on the side of the insertion hole 123 facing the rear cover 200 is mainly determined by the bottleneck portion 121, the recessed joint 122 will not affect the structural strength of the frame portion 120.

[0105] In summary, this embodiment designs a recessed joint portion 122 on the side wall of the middle frame 100 corresponding to the insertion hole 123, avoiding the bottleneck portion 121, on the side wall of the insertion hole 123 facing the rear cover 200. By using the joint portion 122 as the bearing portion of the adhesive layer 300, the thickness of the whole device can be reduced while ensuring a secure connection between the middle frame 100 and the rear cover 200 and ensuring the waterproof effect of the whole device. For example, the thickness of the whole device can be reduced by 0.2-0.3mm, which helps to make the electronic device 1 thinner and lighter.

[0106] Figure 11 for Figure 10 A magnified view of point A on the housing assembly. (Refer to...) Figure 11As shown, for ease of explanation, in this embodiment, the side wall of the insertion hole 123 facing the rear cover 200, the side surface of the bottleneck portion 121 facing the rear cover 200 is defined as the first positioning surface 1211, and the side surface of the joint portion 122 facing the rear cover 200 is defined as the second positioning surface 1221. The second positioning surface 1221 is recessed in the first positioning surface 1211 and is away from the rear cover 200 relative to the first positioning surface 1211. There is a space for setting the adhesive layer 300 between the planes where the second positioning surface 1221 and the first positioning surface 1211 are located. Thus, the adhesive layer 300 can reuse the space of the frame portion 120 in the thickness direction of the electronic device 1. The adhesive layer 300 occupies at least part of the wall thickness of the frame portion 120, reducing the thickness of the adhesive layer 300 protruding on the first positioning surface 1211. In some cases, the adhesive layer 300 is completely located within the wall thickness space of the frame portion 120. The adhesive layer 300 is flush with or recessed in the first positioning surface 1211.

[0107] In some embodiments, the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 can be ≥ 1 / 2 the thickness of the adhesive layer 300. That is, at least 1 / 2 the thickness of the adhesive layer 300 is located within the thickness space of the edge portion 120 of the middle frame 100, and the portion of the adhesive layer 300 protruding on the edge portion 120 is less than 1 / 2 its thickness. Thus, compared to the adhesive layer 300 occupying the thickness space of the electronic device 1 alone in the related art, this embodiment, by designing the joint 122 to carry the adhesive layer 300, can reduce the distance between the back cover 200 and the edge portion 120 of the middle frame 100 by at least 1 / 2 the thickness of the adhesive layer 300.

[0108] For example, the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 can be ≥ 2 / 3, 3 / 4 or 4 / 5 of the thickness of the adhesive layer 300, etc.

[0109] It should be noted that the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 should be less than or equal to the thickness of the adhesive layer 300. In other words, the maximum limit of the distance between the second positioning surface 1221 and the first positioning surface 1211 is the thickness of the adhesive layer 300. When the distance between the second positioning surface 1221 and the first positioning surface 1211 is equal to the thickness of the adhesive layer 300, when the back cover 200 is bonded to the side frame portion 120 of the middle frame 100, the back cover 200 abuts against the bottleneck portion 121 of the side frame portion 120.

[0110] Continue to refer to Figure 10As shown, continuing with the example of the portion of the middle frame 100 where the insertion hole 123 is located, for the insertion hole 123 used to insert devices such as data cables, the hole segment of the insertion hole 123 with dimensional requirements usually extends from the outer wall surface of the frame portion 120 toward the middle plate portion 110. Therefore, in the hole wall of the insertion hole 123 facing the rear cover 200, the bottleneck portion 121 can be located in the edge region of the middle frame 100, while the joint portion 122 is located on the side of the bottleneck portion 121 away from the edge of the middle frame 100. That is to say, the bottleneck portion 121 extends inward from the outer wall surface of the frame portion 120, and the joint portion 122 can be located on the side of the bottleneck portion 121 away from the outer wall surface of the frame portion 120.

[0111] Based on this, the joint 122 can be adjacent to the bottleneck portion 121. In this way, even when the space of the frame portion 120 is limited, there is enough space in the area adjacent to the bottleneck portion 121 to provide the joint 122. Furthermore, the joint 122 is still located in the area close to the edge of the middle frame 100, so that the adhesive layer 300 connected to the joint 122 can securely connect the back cover 200 to the middle frame 100, ensuring the connection strength between the back cover 200 and the middle frame 100 and guaranteeing the waterproof effect of the electronic device 1.

[0112] For example, the joint 122 is located in the edge region of the insertion hole 123 facing the side wall of the rear cover 200. In other words, the joint 122 can be located in the edge region of the frame portion 120 extending into the receiving cavity 11. The joint 122 extends into the receiving cavity 11, and the side of the joint 122 facing the receiving cavity 11 can communicate with the receiving cavity 11. For the joint 122 used to carry the adhesive layer 300, the area where the joint 122 is located can be processed into a flat plate structure to facilitate the bonding of the adhesive layer 300 between the joint 122 and the rear cover 200. By setting the joint 122 at the edge of the frame portion 120 and extending it to communicate with the receiving cavity 11, it is convenient to process the frame portion 120. The joint 122 can be formed by processing a plane recessed in the top surface of the edge of the frame portion 120 extending into the receiving cavity 11.

[0113] Continue to refer to Figure 10As shown, the interface device 400 includes a device body 410 extending from the receiving cavity 11 to the insertion hole 123 (the opposite direction of the Y direction shown in the figure). The device body 410 may include a power-on terminal 411 and a insertion terminal 412 connected in sequence. The power-on terminal 411 of the device body 410 extends into the receiving cavity 11 and connects to the circuit board 500 (e.g., a sub-board). For example, the pins of the device body 410 extend from the power-on terminal 411 and connect to the pads on the circuit board 500 to achieve the connection between the device body 410 and the circuit board 500. The insertion terminal 412 of the device body 410 is located in the insertion hole 123 and extends outward from the electronic device 1. The device body 410 connects to external devices through the insertion terminal 412. For example, a data cable extends into the insertion hole 123 and plugs into the insertion terminal 412 of the device body 410 to achieve the connection between the device body 410 and external devices through the data cable.

[0114] Since the area within the insertion hole 123 corresponding to the insertion end 412 of the device body 410 needs to be connected to an external device, this area of ​​the insertion hole 123 has dimensional requirements. The portion of the insertion end 412 of the device body 410 located within the side wall of the insertion hole 123 facing the rear cover 200 is the bottleneck portion 121. Therefore, when designing the joint portion 122 on this side wall of the insertion hole 123, the joint portion 122 can correspond to the area where the connection between the insertion end 412 and the electrical terminal 411 of the device body 410 is located, or the joint portion 122 can correspond to the area where the electrical terminal 411 is located, so that the joint portion 122 avoids the bottleneck portion 121.

[0115] For example, when the width (the dimension in the Y direction in the figure) of the frame portion 120 of the middle frame 100 is limited, the power receiving terminal 411 of the device body 410 can be entirely located within the receiving cavity 11, and the insertion hole 123 is mainly used to accommodate the insertion terminal 412 of the device body 410. In this case, the connection portion between the power receiving terminal 411 and the insertion terminal 412 of the device body 410 is located at the edge of the frame portion 120 facing the receiving cavity 11. That is, the joint portion 122 can be located in the edge region of the frame portion 120 facing the receiving cavity 11, and the joint portion 122 can correspond to the connection portion between the insertion terminal 412 and the power receiving terminal 411 of the device body 410.

[0116] In addition, continue to refer to Figure 10 Compared to the interface device 400a in related technologies (see...), Figure 8In this embodiment, the interface device 400 eliminates the outer frame 420a. In other words, the device body 410 of the interface device 400 is directly inserted into the plug hole 123. There is no outer frame 420a surrounding the device body 410. The outer wall of the plug end 412 of the device body 410 and the hole wall of the plug hole 123 form a plug cavity. The device body 410 is connected to an external device through this plug cavity. For example, a data cable is inserted into the plug cavity and connected to the device body 410.

[0117] Since there is no outer frame, the outer wall of the device body 410 and the wall of the insertion hole 123 directly form the insertion cavity. The opening size of the insertion hole 123 only needs to meet the connection requirements with external devices. There is no need to expand the size of the insertion hole 123 to set up an outer frame. Consequently, there is no need to increase the side frame portion 120 of the middle frame 100 in the thickness direction of the electronic device 1. Figure 10 The dimensions of the middle frame 100 (in the Z direction) allow it to maintain a smaller thickness, which is beneficial for reducing the overall thickness of the electronic device 1.

[0118] Furthermore, since there is no outer frame surrounding the device body 410, a gap is formed between the outer wall of the device body 410 and the wall of the insertion hole 123, which communicates with the receiving cavity 11. Therefore, when sealing the insertion hole 123, a sealing element 600 can be provided on the outer wall of the device body 410. The sealing element 600 is in close contact with the wall of the insertion hole 123, thereby sealing the insertion hole 123 and preventing external moisture, dust, and other foreign objects from entering the receiving cavity 11 through the gap between the insertion hole 123 and the device body 410, thus ensuring the waterproof effect of the entire electronic device 1.

[0119] It should be understood that the seal 600 should avoid the insertion end 412 of the device body 410 to avoid affecting the connection between the insertion end 412 and the external device. For example, if all the electrical terminals 411 of the device body 410 are located within the receiving cavity 11, the seal 600 can be fitted onto the connection portion between the electrical terminals 411 and the insertion end 412 on the device body 410. Taking the connection portion 122 corresponding to the connection portion between the electrical terminals 411 and the insertion end 412 of the device body 410 as an example, the seal 600 can be provided corresponding to the connection portion 122.

[0120] For example, the seal 600 can be a separately molded sealing ring, such as a silicone ring or a rubber ring. Alternatively, the seal 600 can also be a sealing layer integrally molded on the surface of the device body 410, and a sealing layer can be formed on the surface of the device body 410 by injection molding process, such as a silicone layer or a rubber layer.

[0121] To ensure tight contact between the seal 600 and the wall of the insertion hole 123, continue referring to... Figure 10As shown, in some embodiments, a positioning boss 1231 extends inwardly from the wall of the insertion hole 123. The positioning boss 1231 can be an annular boss protruding from the wall of the insertion hole 123, and the positioning boss 1231 corresponds to the seal 600. By using the positioning boss 1231, the gap between the insertion hole 123 and the device body 410 at this location is reduced, ensuring that the positioning boss 1231 can contact and compress the seal 600, thereby ensuring the sealing effect of the seal 600.

[0122] The positioning boss 1231 should avoid the bottleneck portion 121 of the insertion hole 123. For example, the positioning boss 1231 can be provided corresponding to the joint portion 122. In other words, the positioning boss 1231 is located in the area where the joint portion 122 is located. On the one hand, this ensures that the positioning boss 1231 avoids the bottleneck portion 121 of the insertion hole 123 and will not affect the connection between the interface device 400 and the external device. On the other hand, since the positioning boss 1231 protrudes from the inner wall of the insertion hole 123, it can increase the thickness of the area where the inwardly recessed joint portion 122 is located, thereby enhancing the structural strength of the area where the joint portion 122 is located.

[0123] For example, the joint 122 may be located in the area of ​​the connection between the plug end 412 and the power connection end 411 of the device body 410, the seal 600 is sleeved on the part between the plug end 412 and the power connection end 411 of the device body 410, the positioning boss 1231 is provided corresponding to the seal 600, and the positioning boss 1231 protrudes on the side of the joint 122 facing the plug hole 123.

[0124] Figure 12 for Figure 9 A schematic diagram of the housing assembly after removing the back cover. (Refer to...) Figure 12 As shown in the figure, the adhesive layer 300 between the frame portion 120 of the middle frame 100 and the back cover 200 has a structural shape at the location of the insertion hole 123. Since the bottleneck portion 121 of the frame portion 120 extends inward from the outer edge of the frame portion 120 in the area where the insertion hole 123 is located, and the joint portion 122 is located on the side of the frame portion 120 near the receiving cavity 11, the adhesive layer 300 protrudes from the edge of the frame portion 120 toward the receiving cavity 11 at the location of the insertion hole 123. The adhesive layer 300 forms a concave section 310 in this area. The concave section 310 is recessed inward from the outer edge of the frame portion 120. In other words, the concave section 310 protrudes toward the receiving cavity 11.

[0125] As for the shape of the concave segment 310, the figure shows that the concave segment 310 is roughly "U" shaped. In other examples, the shape of the concave segment 310 can also be arc, semi-circle, trapezoid, etc. This embodiment does not impose specific restrictions on this.

[0126] Figure 13 for Figure 12 An exploded structural diagram of the housing assembly 10. (Combined with...) Figure 12 and Figure 13 As shown, in this embodiment, the interface device 400, in addition to the device body 410, also includes a fixing bracket 420. The fixing bracket 420 is sleeved on the device body 410, specifically on the power receiving end 411 of the device body 410. For example, the fixing bracket 420 can be bonded to the outer wall surface of the power receiving end 411. The fixing bracket 420 is connected to the circuit board 500 to position the device body 410, fix the power receiving end 411 of the device body 410 to the board surface of the circuit board 500, ensure that the power receiving end 411 of the device body 410 and the circuit board 500 are firmly connected, and also position the plug-in end 412 of the device body 410.

[0127] Reference Figure 12 or Figure 13 As shown, in addition to the interface device 400, other devices are also provided on the circuit board 500 (e.g., a sub-board) near the frame portion 120 within the receiving cavity 11. For example, the circuit board 500 also includes a BTB (Board-to-board) connector, a coaxial cable 800, and a spring clip 900. The BTB connector 700 is used to connect the circuit board 500 to other components within the receiving cavity 11; for example, the circuit board 500 is connected to other circuit boards (e.g., the main board) via the BTB connector 700. The coaxial cable 800 can, for example, connect the circuit board 500 (e.g., the sub-board) to other circuit boards (e.g., the main board) to transmit signals between them. The spring clip 900 is used to clamp and secure some devices on the circuit board 500.

[0128] Figure 14 A partial structural diagram of another housing assembly provided in an embodiment of this application; Figure 15 for Figure 14 A cross-sectional view of the housing assembly at CC. (Refer to...) Figure 14 and Figure 15 As shown in the figure, a partial structure of the housing assembly 10 of the foldable electronic device near the pivot 10c is illustrated. The figure takes the first housing 10a or the second housing 10b on one side of the pivot 10c as an example. It should be understood that the structures of the first housing 10a and the second housing 10b can be symmetrical to each other, and the structures of the connection parts of the first housing 10a and the second housing 10b with the pivot 10c can be consistent.

[0129] Both the first housing 10a and the second housing 10b may include a middle frame 100 and a rear cover 200 (see...). Figure 6In the case of an inward-folding electronic device, the rear cover 200 of the first housing 10a or the second housing 10b can also be replaced by the second display screen 20b. The rear cover 200 will be used as an example here. The middle frame 100 may include a middle plate portion 110 and a frame portion 120. The middle plate portion 110 is connected to the side of the frame portion 120 facing away from the rear cover 200. The frame portion 120 and the rear cover 200 are bonded together by an adhesive layer 300. The middle plate portion 110, the frame portion 120, and the rear cover 200 together form a receiving cavity 11. The adhesive layer 300 can be the aforementioned solid film layer or liquid-cured layer.

[0130] Reference Figure 14 As shown, the side of the frame portion 120 of the middle frame 100 connected to the pivot 10c typically includes a side wall 124 and an extension wall 125 sequentially connected to the middle plate portion 110. The side wall 124 extends from the middle plate portion 110 toward the rear cover 200, for example, extending toward the rear cover 200 in a direction perpendicular to the middle plate portion 110. The extension wall 125 extends along the plane of the rear cover 200 and extends toward the edge of the rear cover 200. The edge region of the rear cover 200 is supported on the extension wall 125 of the frame portion 120. The side wall 124 of the frame portion 120, the middle plate portion 110, and the rear cover 200 together form a receiving cavity 11.

[0131] The middle frame 100 is connected to the pivot 10c via the extension wall 125 of its side frame 120. Since it needs to be connected to the pivot 10c, the extension wall 125 of the side frame 120 usually also has a bottleneck portion 121. The bottleneck portion 121 exists because this portion needs to be connected to the pivot 10c. The distance between the bottleneck portion 121 and the front of the middle plate 110 (the side surface of the middle plate 110 facing away from the back cover 200) needs to meet the connection space requirements of the pivot 10c, and the wall thickness of the bottleneck portion 121 also needs to meet the structural strength requirements to ensure that the middle frame 100 and the pivot 10c are firmly connected.

[0132] Therefore, sufficient clearance should be maintained between the bottleneck portion 121 and the front surface of the middle plate portion 110 to meet the installation space requirements of the pivot 10c. Furthermore, the bottleneck portion 121 should have sufficient wall thickness, which should be greater than or equal to a preset thickness. The preset thickness is the minimum thickness required by the design, to ensure that the extension wall 125 has sufficient strength and to guarantee the stability and reliability of the connection between the middle frame 100 and the pivot 10c.

[0133] Similar to the joint 122 provided on the side wall of the insertion hole 123 facing the rear cover 200, see reference Figure 14 or Figure 15As shown, in order to reduce the gap between the back cover 200 and the frame portion 120 of the middle frame 100, in this embodiment, a joint portion 122 is designed on the extension wall 125 of the frame portion 120, avoiding the bottleneck portion 121. The adhesive layer 300 is carried by the joint portion 122. That is, the section of the adhesive layer 300 passing through the frame portion 120 (towards the pivot 10c) is located on the joint portion 122. Among them, compared with the bottleneck portion 121, the joint portion 122 is recessed towards the side away from the back cover 200, and the surface of the joint portion 122 facing the back cover 200 is lower than the surface of the bottleneck portion 121 facing the back cover 200.

[0134] By providing a joint 122 recessed in the bottleneck portion 121, the adhesive layer 300 is connected to the joint 122. The adhesive layer 300 at least partially occupies the wall thickness of the extension wall 125 of the frame portion 120. That is, the adhesive layer 300 can reuse the extension wall 125 in the thickness direction of the electronic device 1. Figure 15 The space in the Z direction (as shown) reduces the thickness space occupied by the adhesive layer 300, reduces the gap between the back cover 200 and the frame portion 120, and thus reduces the overall thickness of the electronic device 1.

[0135] Furthermore, since the joint 122 avoids the bottleneck portion 121 on the extension wall 125 of the frame portion 120, the joint 122 will not affect the connection between the frame portion 120 and the pivot 10c. This allows the bottleneck portion 121 to maintain its proper wall thickness and does not affect the structural strength of the extension wall 125, ensuring a stable and reliable connection between the frame portion 120 and the pivot 10c. Therefore, by providing the joint 122 on the extension wall 125 of the frame portion 120 as a support portion for the adhesive layer 300, the overall thickness of the device can be reduced while ensuring a reliable connection between the adhesive layer 300 and the middle frame 100 and the back cover 200 and maintaining the overall waterproof effect. For example, the overall thickness can be reduced by 0.2-0.3 mm, contributing to the thinner and lighter development of the electronic device 1.

[0136] Reference Figure 15As shown, similar to the location of the insertion hole 123 on the aforementioned frame portion 120, for foldable electronic devices, in this embodiment, the surface of the bottleneck portion 121 facing the rear cover 200 on the extension wall 125 of the frame portion 120 is defined as the first positioning surface 1211, and the surface of the joint portion 122 facing the rear cover 200 is defined as the second positioning surface 1221. The second positioning surface 1221 is recessed in the first positioning surface 1211, and the second positioning surface 1221 is compared to the first positioning surface 1211. The first positioning surface 1211 is away from the back cover 200 so that the adhesive layer 300 can reuse the space of the extension wall 125 in the thickness direction of the electronic device 1. The adhesive layer 300 occupies at least part of the wall thickness of the extension wall 125, reducing the thickness of the adhesive layer 300 protruding on the first positioning surface 1211. In some cases, the adhesive layer 300 is completely located within the wall thickness space of the extension wall 125. The adhesive layer 300 is flush with or recessed in the first positioning surface 1211.

[0137] The distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 should be less than or equal to the thickness of the adhesive layer 300. For example, the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 can be greater than or equal to half the thickness of the adhesive layer 300. For instance, the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 can be greater than or equal to two-thirds, three-quarters, or four-fifths of the thickness of the adhesive layer 300, etc., which will not be elaborated further here.

[0138] Since the pivot 10c connects the middle frame 100 of the first housing 10a and the middle frame 100 of the second housing 10b, the bottleneck portion 121 on the extension wall 125 of the side frame portion 120 is usually located in the edge region, while the joint portion 122 is located on the side of the bottleneck portion 121 away from the edge of the extension wall 125. Based on this, the joint portion 122 can be adjacent to the bottleneck portion 121, and the side of the joint portion 122 facing the receiving cavity 11 can communicate with the receiving cavity 11. For example, the area where the joint portion 122 is located can be processed into a flat plate structure, and the plane where the joint portion 122 is located extends to the side of the side frame portion 120 that communicates with the receiving cavity 11; further details are omitted here.

[0139] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0140] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. An electronic device, characterized in that, include: Display screen, back cover, mid-frame, and adhesive layer; The middle frame includes a middle plate portion and a frame portion. The middle plate portion is disposed between the display screen and the back cover. The frame portion surrounds the periphery of the middle plate portion. The adhesive layer is used to bond the back cover and the frame portion. The frame portion has a plug hole, and an interface device is installed in the plug hole. The interface device is a Type-C interface. The side wall of the insertion hole of the frame portion facing the rear cover is provided with a first part and a second part. The first part extends inward from the outer wall of the frame portion, and the second part is provided on the side of the first part away from the outer wall of the frame portion. No adhesive layer is provided between the back cover and the first part, but an adhesive layer is provided between the back cover and the second part; The adhesive layer includes a concave section, which is located in the area where the insertion hole is located.

2. The electronic device according to claim 1, characterized in that, Compared to the first part, the second part is recessed to the side opposite to the back cover to provide the adhesive layer.

3. The electronic device according to claim 1, characterized in that, The surface of the first part facing the back cover is a first positioning surface, and the surface of the second part facing the back cover is a second positioning surface, wherein the second positioning surface is away from the back cover compared to the first positioning surface, so as to provide the adhesive layer.

4. The electronic device according to claim 3, characterized in that, The distance between the second positioning surface and the first positioning surface is greater than or equal to 1 / 2 of the thickness of the adhesive layer.

5. The electronic device according to any one of claims 1-4, characterized in that, The concave section is U-shaped, trapezoidal, arc-shaped, or semi-circular.

6. The electronic device according to any one of claims 1-4, characterized in that, The concave section is recessed inward from the outer edge of the frame portion.

7. The electronic device according to any one of claims 1-4, characterized in that, The middle plate, the frame, and the rear cover form a receiving cavity, and the concave section protrudes into the receiving cavity.

8. The electronic device according to claim 7, characterized in that, The interface device includes a device body, which includes a power terminal and a plug terminal, and the plug terminal can be connected to an external device.

9. The electronic device according to claim 8, characterized in that, The first part corresponds to the area where the plug-in end is located.

10. The electronic device according to claim 9, characterized in that, The second part corresponds to the area where the connection between the plug-in terminal and the power-connecting terminal is located, or the second part corresponds to the area where the power-connecting terminal is located.

11. The electronic device according to claim 10, characterized in that, The electronic device also includes a circuit board disposed on the side of the receiving cavity near the insertion hole.

12. The electronic device according to claim 11, characterized in that, The circuit board is equipped with a BTB connector, a coaxial cable, and / or a spring.

13. The electronic device according to claim 8, characterized in that, The outer wall of the plug end and the wall of the plug hole form a plug cavity, which is used for plugging in the external device.

14. The electronic device according to claim 8, characterized in that, A positioning boss is provided on the wall of the insertion hole, and the positioning boss is located on the side of the second part facing the insertion hole.

15. The electronic device according to claim 14, characterized in that, A sealing element is provided on the outer wall surface of the device body, and the sealing element contacts the wall of the insertion hole.

16. The electronic device according to claim 15, characterized in that, The seal contacts the positioning boss.

17. The electronic device according to claim 8, characterized in that, The interface device also includes a mounting bracket, which is sleeved on the device body.

18. The electronic device according to claim 1, characterized in that, The frame portion further includes a side wall and an extension wall, the extension wall comprising the first portion and the second portion; The sidewall is connected to the middle plate and the extension wall. The sidewall extends toward the rear cover, and the extension wall extends toward the edge of the rear cover along the plane of the rear cover.

19. The electronic device according to claim 1, characterized in that, The adhesive layer is a solid film layer or a liquid curing layer.

20. The electronic device according to any one of claims 1-19, characterized in that, The electronic device is a foldable phone.

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