Perovskite solar cell packaging method and perovskite solar cell

Abstract

The invention discloses a packaging method of a perovskite solar cell and the perovskite solar cell. The packaging method of the perovskite solar cell comprises the following steps of coating the surface of a back electrode layer with insulating slurry to form an insulating barrier layer, performing ultrasonic cleaning and surface treatment on back plate glass, coating a to-be-bonded surface of the back plate glass with an adhesive, bonding the back plate glass and the insulating barrier layer, and performing lamination and curing treatment to obtain the perovskite solar cell. And packaging is completed. The perovskite solar cell can be packaged at the temperature lower than 100 DEG C, and the problems that in the prior art, due to the fact that a packaging adhesive film needs to be subjected to hot-pressing packaging at the high temperature, the photoelectric conversion efficiency is reduced, and the internal structure and connection of the cell are prone to damage are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of perovskite solar cells, and in particular to a packaging method for a perovskite solar cell and a perovskite solar cell. Background Art

[0002] Perovskite solar cells have attracted much attention because their conversion efficiency has improved much faster than that of crystalline silicon cells. In just over ten years, the conversion efficiency of single-junction perovskite solar cells has increased from 3.8% to 26.1%, and their application range is becoming increasingly wide.

[0003] Currently, the most common method for encapsulating perovskite solar cells is to use a vacuum laminator to heat-press the glass, encapsulation film, and perovskite solar cell. The optimal process temperature for existing encapsulation films such as EVA, POE, and PVB is 120-150°C. However, the photosensitive materials in perovskite solar cells are susceptible to high temperatures, causing them to decompose or oxidize, thereby affecting their photoelectric conversion efficiency. Furthermore, high temperatures can damage the internal structure and connections of the cell, ultimately affecting its overall performance. Summary of the Invention

[0004] The main purpose of the present invention is to propose a packaging method for perovskite solar cells and a perovskite solar cell, aiming to solve the problem in the prior art that the packaging method affects the photoelectric conversion efficiency of perovskite solar cells, destroys the internal structure and connections of the cell, and ultimately affects its overall performance.

[0005] To achieve the above object, the present invention provides a method for packaging a perovskite solar cell, comprising the following steps:

[0006] S1, coating an insulating paste on the surface of the back electrode layer of the perovskite solar cell to form an insulating barrier layer;

[0007] S2. Ultrasonic cleaning and surface treatment are performed on the surface to be bonded of the back glass in sequence;

[0008] S3, applying adhesive to the surface to be bonded of the back glass after surface treatment in step S2;

[0009] S4, laminating the surface to be bonded of the backplane glass to the insulating barrier layer of the perovskite solar cell, and sequentially performing lamination and curing treatment to obtain a packaged perovskite solar cell;

[0010] During the packaging process of the perovskite solar cell, the temperature of the back electrode is lower than 100°C.

[0011] In one embodiment, in step S1, the step of forming an insulating barrier layer on the surface of the back electrode layer of the perovskite solar cell includes: arranging a drain bar and a bus bar on the surface of the back electrode layer; applying the insulating barrier layer to the surface of the back electrode layer by scraping or screen printing, and leaving the surfaces of the drain bar and the bus bar free of the insulating barrier layer.

[0012] In one embodiment, in step S1, the insulating paste includes the following raw materials in parts by weight:

[0013] The first monomer is 12 to 25 parts; the second monomer is 6 to 10 parts; the epoxy resin is 20 to 30 parts; the boron nitride nanosheets are 5 to 12 parts; the thickener is 2 to 8 parts; the curing agent is 8 to 16 parts; wherein the first monomer is selected from any one of tetrafluorohydroquinone diglycidyl ether and hexafluorobisphenol A diglycidyl ether, and the second monomer is selected from any one of polypropylene glycol diglycidyl ether, polytetrahydrofuran diglycidyl ether, 1,6-hexanediol diglycidyl ether, and 1,8-octanediol diglycidyl ether.

[0014] In one embodiment, in step S1 , the coating thickness of the insulating barrier layer is 0.1 mm to 1 mm.

[0015] In one embodiment, in step S2, the frequency of the ultrasonic cleaning is 120 kHz to 200 kHz, and the time is 2 minutes to 5 minutes.

[0016] In one embodiment, in step S2, the surface treatment includes the following steps: placing the surface to be bonded of the back panel glass after ultrasonic cleaning in a strong alkaline solution for liquid polishing, and then cleaning and drying with deionized water; during the liquid polishing process, the concentration of the strong alkaline solution is controlled to be 30wt% to 40wt%, and the temperature is 40°C to 65°C; and the liquid polishing time is controlled to be 40min to 80min.

[0017] In one embodiment, in step S3, the adhesive comprises the following raw materials in parts by weight:

[0018] Epoxy acrylate resin: 25 parts to 45 parts; cationic epoxy resin: 10 parts to 15 parts; fluorine-containing acrylate monomer: 8 parts to 14 parts; sodium lignin sulfonate-maleic anhydride graft copolymer: 9 parts to 18 parts; epoxy silane coupling agent: 1 part to 2 parts; nano-silica sol: 4 parts to 8 parts; photoinitiator: 1 part to 2 parts.

[0019] In one embodiment, the fluorine-containing acrylate monomer is at least one selected from hexafluorobutyl methacrylate, trifluoroethyl acrylate, perfluorooctyl ethyl acrylate, and trimethylolpropane tris(trifluoropropionic acid)acrylate.

[0020] In one embodiment, the photoinitiator includes a free radical photoinitiator and a cationic photoinitiator.

[0021] In one embodiment, in step S3, the adhesive is applied to the surface to be bonded of the back glass by doctor blade coating, roller coating or screen printing.

[0022] In one embodiment, in step S3, the adhesive is applied to a thickness of 0.1 mm to 2 mm.

[0023] In one embodiment, in step S4, the perovskite solar cell is cured by ultraviolet curing with a radiation dose of 30 mW / cm 2 ~80mW / cm 2 .

[0024] The present invention also provides a perovskite solar cell, which is encapsulated by the above encapsulation method.

[0025] In the technical solution of the present invention, a liquid adhesive is applied to the surface of the back electrode layer of a perovskite solar cell, and then laminated and cured to obtain a perovskite solar cell. The present invention can complete the encapsulation of the perovskite solar cell at a temperature below 100°C, and the back electrode surface of the encapsulated perovskite cell has good adhesion to the backplane glass. The water, oxygen, and heat resistance of the back electrode are further enhanced, which can not only better protect the perovskite crystals, but also solve the problem in the prior art that the encapsulation film needs to be hot-pressed and encapsulated at high temperatures (120-150°C), resulting in reduced photoelectric conversion efficiency and easy damage to the internal structure and connections of the cell. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or the conditions recommended by the manufacturer. Where the reagents or instruments used are not specified by the manufacturer, they are all conventional products that can be purchased commercially. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or schemes that A and B meet at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the ability of ordinary technicians in this field to achieve. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions does not exist and is not within the scope of protection required by the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] Perovskite solar cells have attracted much attention because their conversion efficiency has improved much faster than that of crystalline silicon cells. In just over ten years, the conversion efficiency of single-junction perovskite solar cells has increased from 3.8% to 26.1%, and their application range is becoming increasingly wide.

[0028] Currently, the most common method for encapsulating perovskite solar cells is to use a vacuum laminator to heat-press the glass, encapsulation film, and perovskite solar cell. The optimal process temperature for existing encapsulation films such as EVA, POE, and PVB is 120-150°C. However, the photosensitive materials in perovskite solar cells are susceptible to high temperatures, causing them to decompose or oxidize, thereby affecting their photoelectric conversion efficiency. Furthermore, high temperatures can damage the internal structure and connections of the cell, ultimately affecting its overall performance.

[0029] In view of this, the present invention provides a packaging method and a battery for a perovskite solar cell.

[0030] An embodiment of the present invention provides a method for packaging a perovskite solar cell, comprising the following steps:

[0031] S1, coating an insulating paste on the surface of the back electrode layer of the perovskite solar cell to form an insulating barrier layer;

[0032] S2. Ultrasonic cleaning and surface treatment are performed on the surface to be bonded of the back glass in sequence;

[0033] S3, applying adhesive to the surface to be bonded of the back glass after surface treatment in step S2;

[0034] S4, laminating the surface to be bonded of the backplane glass to the insulating barrier layer of the perovskite solar cell, and sequentially performing lamination and curing treatment to obtain a packaged perovskite solar cell;

[0035] During the packaging process of the perovskite solar cell, the temperature of the back electrode is lower than 100°C.

[0036] It should be noted that in the technical solution of the present invention, a liquid adhesive is applied to the surface of the back electrode layer of the perovskite solar cell, and then vacuum lamination and curing treatment are performed to obtain the perovskite solar cell. The temperatures of the vacuum lamination and curing treatment are both below 100°C. As a result, the present invention can complete the encapsulation of the perovskite solar cell at a temperature below 100°C, solving the problem in the prior art that the encapsulation film needs to be hot-pressed at high temperatures (120-150°C) for encapsulation, resulting in reduced photoelectric conversion efficiency and easy damage to the internal structure and connections of the cell.

[0037] It should also be noted that due to the strong fluidity of the liquid adhesive before curing, it may penetrate into the perovskite solar cell and react with the perovskite layer. By first forming an insulating barrier layer on the surface of the back electrode layer of the perovskite solar cell and then laminating the insulating barrier layer with the glass back panel coated with liquid adhesive, a protective layer can be formed between the liquid adhesive and the back electrode layer to prevent the liquid adhesive from penetrating into the perovskite solar cell and reacting with the perovskite layer. In addition, due to the use of specific components, the insulating barrier layer has strong heat insulation, insulation and water and oxygen barrier effects, which is further beneficial to the protection of the perovskite crystals and the improvement of the service life of the perovskite solar cell.

[0038] In one embodiment, the back panel glass may be float glass, and the float glass may be tempered or semi-tempered.

[0039] In one embodiment, in step S1, the step of forming an insulating barrier layer on the surface of the back electrode layer of the perovskite solar cell includes: arranging a drain bar and a bus bar on the surface of the back electrode layer; applying the insulating barrier layer to the surface of the back electrode layer by scraping or screen printing, and leaving the surfaces of the drain bar and the bus bar free of the insulating barrier layer.

[0040] It should be noted that in this embodiment, the drain bars and bus bars can be welded or applied to the surface of the solar cell's back electrode layer. The drain bars can be made of conductive tape, aluminum tape, copper tape, etc.; conductive tape can be directly bonded to the back electrode layer; aluminum tape, copper tape, etc. can be welded to the back electrode layer using equipment such as ultrasonic welding. The drain bars function to smoothly conduct the positive and negative currents from the perovskite cell chip. The bus bars can be made of tin-coated copper tape, tin-coated aluminum tape, etc.; double-sided insulating tape can be used to adhere the bus bars and drain bars to the back electrode film layer. Their function is to conduct the current from the bus bars and drain bars to the junction box. Because the bus bars and drain bars are relatively thick, with a thickness of 0.05mm-0.3mm, they will appear raised on the back electrode layer, where stress is typically high. In this embodiment, the bus bar surface is not coated when applying the insulating barrier layer to avoid cracking of the insulating barrier layer on the bus bar surface, which could cause subsequent leakage of liquid adhesive through the cracks.

[0041] In one embodiment, the insulating paste includes the following raw materials in parts by weight: a first monomer: 12 to 25 parts; a second monomer: 6 to 10 parts; an epoxy resin: 20 to 30 parts; boron nitride nanosheets: 5 to 12 parts; a thickener: 2 to 8 parts; and a curing agent: 8 to 16 parts. The first monomer is selected from any one of tetrafluorohydroquinone diglycidyl ether and hexafluorobisphenol A diglycidyl ether, and the second monomer is selected from any one of polypropylene glycol diglycidyl ether, polytetrahydrofuran diglycidyl ether, 1,6-hexanediol diglycidyl ether, and 1,8-octanediol diglycidyl ether.

[0042] In a specific embodiment, the curing agent is a curing agent compounded with an aliphatic polyamine and a polyetheramine; wherein the aliphatic polyamine includes any one of triethylenetetramine, diethylenetriamine, and tetraethylenepentamine; the polyetheramine includes any one of polyetheramine D-230, polyetheramine D-2000, and polyetheramine ED-600; in a preferred embodiment, the curing agent includes triethylenetetramine and polyetheramine ED-600 in a weight ratio of 2:1.

[0043] It should be noted that the present invention introduces boron nitride nanosheets as fillers in the insulating paste, enhancing thermal insulation through phonon scattering and acting as two-dimensional nanofillers to block water and oxygen penetration, providing enhanced protection for the perovskite crystals. The first monomer, a fluorinated monomer with a rigid structure, exhibits good barrier properties. To enhance the processability and compactness of the insulating protective layer, the present invention introduces a second monomer with a flexible molecular chain. The combination of these two monomers balances barrier and processability. Furthermore, traditional epoxy systems require temperatures above 120°C to fully cure due to the inherently low reactivity of the epoxy resin. However, the present invention replaces the curing agent with a combination of aliphatic polyamines and polyetheramines, introducing a flexible chain that lowers the glass transition temperature to -50°C. This allows the mixed amine to undergo a ring-opening reaction at 60-70°C. While this longer cure time is achieved, the curing temperature is lower, preserving the perovskite crystals. Adding an accelerator to the reaction catalyzes the attack of the amino group on the epoxy group, further reducing the peak curing temperature.

[0044] In one embodiment, in step S1, the coating thickness of the insulating barrier layer is 0.1 mm to 1 mm.

[0045] In one embodiment, in step S2, the frequency of the ultrasonic cleaning is 120 kHz to 200 kHz, and the time is 2 minutes to 5 minutes.

[0046] In one embodiment, in step S2, the surface treatment includes the following steps: placing the surface to be bonded of the back panel glass after ultrasonic cleaning in a strong alkaline solution for liquid polishing, and then cleaning and drying with deionized water; during the liquid polishing process, controlling the concentration of the strong alkaline solution to 30wt% to 40wt% and the temperature to 40°C to 65°C; and controlling the liquid polishing time to 40min to 80min.

[0047] It should be noted that by using alkaline solution to liquid-polish the surface to be bonded of the back glass, the alkaline solution can remove these structurally unstable "weak boundary layers" through slight etching. The etching reaction can also expose a large number of silicon hydroxyl groups on the glass surface, which have high reactivity and can form hydrogen bonds or covalent bonds with polar groups (-OH, -NCO, epoxy groups) in adhesives (such as epoxy resins, polyurethanes), and can also significantly improve the wetting and spreading properties of the adhesive.

[0048] In some embodiments, the liquid adhesive includes a light-curable liquid silicone or liquid resin. Specifically, the liquid adhesive includes a wet-process laminated glass glue, a light-curable epoxy resin adhesive, an acrylate adhesive containing a photoinitiator, or a light-curable silicone liquid optical adhesive. Selecting a suitable light-curable liquid adhesive allows direct curing using UV light or outdoor sunlight, thus avoiding the problem of reduced photoelectric conversion efficiency due to high temperature and the easy damage to the internal structure and connections of the battery.

[0049] In some embodiments, the step of applying a liquid adhesive to the surface of the back electrode layer of the perovskite solar cell includes applying the liquid adhesive to the surface of the back electrode layer of the perovskite solar cell by blade coating, roller coating, or screen printing. Selecting an appropriate coating method facilitates a simple and efficient manufacturing process.

[0050] In one embodiment, in step S3, the adhesive includes the following raw materials in parts by weight: epoxy acrylate resin: 25 parts to 45 parts; cationic epoxy resin: 10 parts to 15 parts; fluorine-containing acrylate monomer: 8 parts to 14 parts; sodium lignin sulfonate-maleic anhydride graft copolymer: 9 parts to 18 parts; epoxy silane coupling agent: 1 part to 2 parts; nano silica sol: 4 parts to 8 parts; photoinitiator: 1 part to 2 parts.

[0051] In a specific embodiment, the fluorine-containing acrylate monomer is at least one selected from hexafluorobutyl methacrylate, trifluoroethyl acrylate, perfluorooctyl ethyl acrylate, and trimethylolpropane tris(trifluoropropionic acid)acrylate.

[0052] In a specific embodiment, the photoinitiator includes a free radical photoinitiator and a cationic photoinitiator; in a specific embodiment, the free radical photoinitiator may be TPO-L, and the cationic photoinitiator may be CPI-6976.

[0053] It should be noted that the present invention, by adding a sodium lignin sulfonate-maleic anhydride graft copolymer made from biomass materials to the adhesive, can bridge the hydroxyl groups on the glass surface and the epoxy groups at the interface of the insulating protective layer, and further enhance the bonding performance based on the fluorine-containing monomer's enhanced hydrophobic stability; the fluorine-containing acrylate monomer can effectively reduce the surface tension and improve the wettability at the interface between the glass and the adhesive, making it easier for the adhesive to spread on the glass surface; nano-silica sol can effectively fill the gap between the adhesive and the glass surface, and its combination with the sodium lignin sulfonate-maleic anhydride graft copolymer and the fluorine-containing acrylate monomer is beneficial for improving the adhesion between the backplane glass and the adhesive layer. The fluorine atoms in the fluorine-containing acrylate monomer in the adhesive can also undergo fluorine-fluorine hydrophobic association with the fluorine atoms in the fluorine-containing monomer in the insulating protective layer, further strengthening the adhesion between the adhesive layer and the insulating protective layer through intermolecular forces. In addition, cationic epoxy resin is a special resin in adhesives that initiates epoxy group ring-opening polymerization through photoacid generation. On the one hand, it participates in photocuring as a cationic curing component, and as an epoxy system during the curing process, it can further enhance the adhesion between the adhesive layer and the insulating protective layer; on the other hand, it forms covalent bonds with the residual epoxy groups of the insulating protective layer through the ring-opening reaction, which can also further enhance the adhesion between the adhesive layer and the insulating protective layer.

[0054] In a preferred embodiment, the cationic modified resin may be FX-532.

[0055] In one embodiment, in step S3, the adhesive is applied to the surface to be bonded of the back panel glass by means of doctor blade coating, roller coating or screen printing.

[0056] In one embodiment, in step S3, the adhesive is coated to a thickness of 0.1 mm to 2 mm.

[0057] Furthermore, in one embodiment, before the step of coating the liquid adhesive on the surface of the back electrode layer of the perovskite solar cell, the packaging method further comprises: vacuum degassing the liquid adhesive to avoid the generation of bubbles.

[0058] In one embodiment, in step S4, the perovskite solar cell is cured by ultraviolet light with a radiation dose of 30 mW / cm 2 ~80mW / cm 2 .

[0059] The present invention also provides a perovskite solar cell, which is encapsulated by the encapsulation method.

[0060] The technical solutions of the present invention are further described in detail below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to explain the present invention and are not used to limit the present invention.

[0061] Example 1

[0062] The insulating paste used in Example 1 includes the following raw materials in parts by weight:

[0063] Tetrafluorohydroquinone diglycidyl ether: 18 parts; polypropylene glycol diglycidyl ether: 10 parts; bisphenol F type epoxy resin: 30 parts; boron nitride nanosheets (D50 is about 50nm): 9 parts; thickener (bentonite): 5 parts; curing agent includes: triethylenetetramine: 9 parts; polyetheramine ED-600: 3 parts.

[0064] The preparation of the insulating paste used in Example 1 includes the following steps:

[0065] Tetrafluorohydroquinone diglycidyl ether, polypropylene glycol diglycidyl ether, bisphenol F epoxy resin, boron nitride nanosheets and thickener were added to a reactor and stirred at 80°C for 1 hour to disperse them; the temperature was lowered to 30°C, triethylenetetramine and polyetheramine ED-600 were added, and the mixture was stirred for 1 hour to prepare an insulating slurry.

[0066] The adhesive used in Example 1 includes the following raw materials in parts by weight:

[0067] Epoxy acrylate resin (CN111 (Sartomer)): 35 parts; cationic epoxy resin (FX-532): 12 parts; hexafluorobutyl methacrylate: 12 parts; sodium lignin sulfonate-maleic anhydride graft copolymer: 15 parts; epoxy silane coupling agent (kh-560): 2 parts; nano-silica sol: 6 parts; photoinitiators include: free radical photoinitiator TPO-L: 0.5 parts, cationic photoinitiator CPI-6976: 0.8 parts.

[0068] The sodium lignin sulfonate-maleic anhydride graft copolymer was purchased from Borregaard, and the maleic anhydride graft rate was controlled at 15% to 30%.

[0069] The parameters of the perovskite solar cell in Example 1 include:

[0070] 1. Manufacturing perovskite solar cells using a glass-based perovskite thin-film cell production line. This perovskite solar cell consists, from bottom to top, of a glass substrate, a transparent conductive film, a first charge transport layer, a perovskite absorption layer, a second charge transport layer, a back electrode layer, and a series-parallel circuit consisting of three laser scribes. The glass substrate is made of ultra-white glass with a thickness of 3.2 mm, the transparent conductive film is made of FTO (fluorinated tin oxide) with a thickness of 700 nm, the first charge transport layer is made of SnO2 with a thickness of 30 nm, the perovskite absorption layer is made of FAPbI3 (FA stands for CH(NH2)2) with a thickness of 650 nm, the second charge transport layer is made of spiro-OMeTAD with a thickness of 180 nm, and the back electrode layer is made of gold with a thickness of 80 nm.

[0071] 2. Conduct wiring on the perovskite battery. Use 5mm wide and 0.06mm thick conductive tape to stick to the positive and negative areas of the battery edge. Use 9mm wide and 0.08mm insulating tape and 4mm wide and 0.1mm tinned copper tape as busbars. Place the busbars at the side edges for wiring.

[0072] The packaging method of the perovskite solar cell in Example 1 comprises the following steps:

[0073] S1. Apply an insulating slurry on the surface of the back electrode layer of the perovskite solar cell to form an insulating barrier layer with a thickness of about 1 mm, and then bake it in an oven at 60°C for 30 minutes;

[0074] S2. Ultrasonic cleaning is performed on the surface of the back glass to be bonded at a frequency of 120 kHz for 3 minutes. The surface of the back glass to be bonded is then placed in a 30 wt% KOH solution for liquid polishing at 50° C. for 50 minutes.

[0075] S3, mixing the raw materials for preparing the adhesive and uniformly dispersing them, and applying the adhesive to the surface to be bonded of the back glass that has been surface-treated in step S2, to form an adhesive layer with a thickness of about 1 mm;

[0076] S4: Laminating the surface to be bonded of the backplane glass to the insulating barrier layer of the perovskite solar cell, performing vacuum lamination and light curing treatment on the backplane glass in sequence, wherein the radiation amount during the light curing treatment is controlled to be about 60 mW / cm 2 , then keep warm at 70℃ for 60min to complete the packaging.

[0077] Example 2

[0078] Example 2 is based on Example 1, except that the raw materials of the insulating paste in Example 2 are changed to:

[0079] Hexafluorobisphenol A diglycidyl ether: 22 parts; 1,6-hexanediol diglycidyl ether: 6 parts; bisphenol F type epoxy resin: 30 parts; boron nitride nanosheets: 9 parts; thickener (bentonite): 5 parts; curing agent includes: triethylenetetramine: 9 parts; polyetheramine ED-600: 3 parts.

[0080] Example 3

[0081] Example 3 is based on Example 1, except that the raw materials of the adhesive in Example 3 are changed to:

[0082] Epoxy acrylate resin (EBECRYL 3720): 40 parts; cationic epoxy resin (ERL-4221): 15 parts; perfluorooctyl ethyl acrylate: 8 parts; sodium lignin sulfonate-maleic anhydride graft copolymer: 9 parts; epoxy silane coupling agent (KH-560): 2 parts; nano-silica sol: 6 parts; photoinitiators include: free radical photoinitiator TPO-L: 0.5 parts, cationic photoinitiator CPI-6976: 0.8 parts.

[0083] Comparative Example 1

[0084] Comparative Example 1 is based on Example 1, except that: the first monomer, ie, tetrafluorohydroquinone diglycidyl ether, is not added to the insulating paste in Comparative Example 1.

[0085] Comparative Example 2

[0086] Comparative Example 2 is based on Example 1, with the difference being that the boron nitride nanosheets in the insulating paste in Comparative Example 2 are replaced with fumed silica having a similar particle size.

[0087] Comparative Example 3

[0088] Comparative Example 3 is based on Example 1, except that the sodium lignin sulfonate-maleic anhydride graft copolymer is replaced with an equal amount of carboxymethyl cellulose in the adhesive in Comparative Example 3.

[0089] Comparative Example 4

[0090] Comparative Example 4 is based on Example 1, except that the cationic epoxy resin in the adhesive in Comparative Example 4 is replaced by an equal amount of bisphenol F epoxy resin.

[0091] Comparative Example 5

[0092] The packaging method of the perovskite solar cell in Comparative Example 5 includes the following steps:

[0093] Cover the back electrode surface of the perovskite cell with a layer of thermoplastic POE encapsulation film, then cover it with a 3.2mm back glass, place it in a vacuum laminator, heat it at 120°C and evacuate it for 10 minutes, then continue to keep the heating state and apply pressure. It can be laminated in two stages. The first stage has a pressure of 0.2 atmospheres and a time of 2 minutes. The second stage has a pressure of 0.7 atmospheres and a time of 5 minutes to complete the encapsulation.

[0094] Comparative Example 6

[0095] Comparative Example 6 is based on Example 1, with the difference that the adhesive in Comparative Example 6 is replaced with Schnais CV2001 epoxy resin glue, and the curing temperature of Schnais CV2001 epoxy resin glue is 120° C., and the curing time is 5 minutes.

[0096] Comparative Example 7

[0097] Comparative Example 7 is based on Example 1, with the difference that the adhesive in Comparative Example 7 is replaced with Schnais CV2001 epoxy resin glue, and no insulating barrier layer is provided.

[0098] The packaging method of the perovskite solar cell in Comparative Example 7 includes the following steps:

[0099] The surface of the back panel glass to be bonded is ultrasonically cleaned at a cleaning frequency of 120 kHz and a cleaning time of 3 minutes; the surface of the back panel glass to be bonded is then placed in a KOH solution with a concentration of 30 wt% for liquid polishing at 50°C for 50 minutes; the surface of the back panel glass to be bonded after the surface treatment in step S2 is coated with adhesive to form an adhesive layer with a thickness of about 1 mm; the surface of the back panel glass to be bonded is bonded to the insulating barrier layer of the perovskite solar cell, and vacuum lamination and heat curing treatment are performed in sequence at a curing temperature of 120°C and a curing time of 5 minutes to complete the packaging.

[0100] Performance Testing

[0101] (1) The test method for photoelectric conversion efficiency is: use a solar simulator to test under standard conditions. The standard conditions are: the simulator light intensity is 1000W / m 2 The spectral distribution conforms to AM1.5G, and the sample temperature during testing is 25°C. During testing, the light intensity is first calibrated using a silicon standard cell, and then the positive and negative electrodes of the sample are connected to the positive and negative electrodes of the solar simulator before testing.

[0102] (2) The perovskite solar cells prepared in Examples 1-3 and Comparative Examples 1-7 were subjected to a 500-hour continuous humidity stability test, with the humidity RH controlled at 85%. The test results are entered in Table 1.

[0103] The measurement results are shown in Table 1.

[0104] Table 1

[0105]

[0106] As shown in Table 1, compared to Comparative Examples 1-7, Examples 1-3 of the present application employed a method of coating the back electrode layer of the perovskite solar cell with a liquid adhesive, vacuum laminating, and then curing to produce the perovskite solar cell. The temperatures for both the vacuum lamination and curing treatments were below 100°C, and the photoelectric conversion efficiencies of Examples 1-3 were higher than those of Comparative Examples 1-7. However, the use of encapsulating film in the Comparative Examples required hot pressing at a high temperature of 120°C, resulting in lower photoelectric conversion efficiency.

[0107] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of the present invention.

Claims

1. A method for packaging a perovskite solar cell, characterized in that: The packaging method of the perovskite solar cell comprises the following steps: S1, coating an insulating paste on the surface of the back electrode layer of the perovskite solar cell to form an insulating barrier layer; S2. Ultrasonic cleaning and surface treatment are performed on the surface to be bonded of the back glass in sequence; S3, applying adhesive to the surface to be bonded of the back glass after surface treatment in step S2; S4, laminating the surface to be bonded of the backplane glass to the insulating barrier layer of the perovskite solar cell, and sequentially performing lamination and curing treatment to obtain a packaged perovskite solar cell; During the packaging process of the perovskite solar cell, the temperature of the back electrode is lower than 100°C.

2. The packaging method according to claim 1, wherein: In step S1, the step of forming an insulating barrier layer on the surface of the back electrode layer of the perovskite solar cell includes: Arranging the drain bars and bus bars on the surface of the back electrode layer; The insulating barrier layer is coated on the surface of the back electrode layer by scraping or screen printing, and the surfaces of the drain bars and the bus bars are free of the insulating barrier layer.

3. The packaging method according to claim 1, wherein: In step S1, the insulating paste includes the following raw materials in parts by weight: First monomer: 12 to 25 parts; Second monomer: 6 to 10 parts; Epoxy resin: 20 to 30 parts; Boron nitride nanosheets: 5 to 12 parts; Thickener: 2 to 8 parts; Curing agent: 8 to 16 parts; The first monomer is selected from any one of tetrafluorohydroquinone diglycidyl ether and hexafluorobisphenol A diglycidyl ether, and the second monomer is selected from any one of polypropylene glycol diglycidyl ether, polytetrahydrofuran diglycidyl ether, 1,6-hexanediol diglycidyl ether and 1,8-octanediol diglycidyl ether.

4. The packaging method according to claim 1, wherein: In the step S1, the coating thickness of the insulating barrier layer is 0.1 mm to 1 mm.

5. The packaging method according to claim 1, wherein: In step S2, the frequency of the ultrasonic cleaning is 120kHz to 200kHz, and the time is 2min to 5min; And / or, in step S2, the surface treatment includes the following steps: placing the surface to be bonded of the back panel glass after ultrasonic cleaning into a strong alkaline solution for liquid polishing, and then cleaning and drying with deionized water; during the liquid polishing process, controlling the concentration of the strong alkaline solution to 30wt% to 40wt% and the temperature to 40°C to 65°C; and controlling the liquid polishing time to 40min to 80min.

6. The packaging method according to claim 1, wherein: In step S3, the adhesive comprises the following raw materials in parts by weight: Epoxy acrylate resin: 25 to 45 parts; Cationic epoxy resin: 10 to 15 parts; Fluorinated acrylate monomer: 8 to 14 parts; Sodium lignin sulfonate-maleic anhydride graft copolymer: 9 to 18 parts; Epoxy silane coupling agent: 1 to 2 parts; Nano-silica sol: 4 to 8 parts; Photoinitiator: 1 to 2 parts.

7. The packaging method according to claim 6, wherein: The fluorine-containing acrylate monomer is selected from at least one of hexafluorobutyl methacrylate, trifluoroethyl acrylate, perfluorooctyl ethyl acrylate, and trimethylolpropane tris(trifluoropropionic acid) acrylate; And / or, the photoinitiator includes a free radical photoinitiator and a cationic photoinitiator.

8. The packaging method according to claim 1, wherein: In step S3, the adhesive is applied to the surface to be bonded of the back glass by doctor blade coating, roller coating or screen printing; And / or, in step S3, the coating thickness of the adhesive is 0.1 mm to 2 mm.

9. The packaging method according to claim 1, wherein: In step S4, the perovskite solar cell is cured by ultraviolet light, with a radiation dose of 30 mW / cm 2 ~80mW / cm 2 .

10. A perovskite solar cell, characterized in that: The perovskite solar cell is encapsulated by the encapsulation method according to any one of claims 1 to 9.

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