A substrate, preparation method, base, separation method and 3D printer

Abstract

The present application discloses a substrate, a preparation method, a base, a workpiece separation method and a 3D printer, and relates to the technical field of additive manufacturing. The substrate is applied to a 3D printer, and includes: a base layer, the material of which is a brittle material; a metal coating, which is located on the base layer and connected to the base layer, and the metal coating is used to contact the workpiece printed by the 3D printer. The substrate is in direct contact with the 3D printed workpiece using a metal coating. The metal coating can provide good metallurgical bonding properties. During the printing process, the workpiece can be stably attached to the substrate, effectively reducing the displacement and warping of the workpiece, and improving the printing accuracy and workpiece quality. In addition, since the base layer is made of a brittle material, when it is necessary to separate the workpiece and the substrate, the base layer can be knocked apart by external force to separate the workpiece and the substrate. Compared with traditional mechanical cutting or manual peeling methods, this method has the characteristics of simple operation and fast separation speed.

Description

Technical Field

[0001] The present application relates to the technical field of additive manufacturing, and in particular to a substrate, a preparation method, a base, a workpiece separation method, and a 3D printer. Background Art

[0002] Laser 3D (three-dimensional) metal printing is an advanced additive manufacturing technology that uses lasers as an energy source to create three-dimensional metal workpieces by gradually depositing metal powder layer by layer. This technology overcomes the limitations of traditional subtractive manufacturing (such as cutting) and uniform material manufacturing (such as casting and forging), enabling the rapid and precise manufacture of complex workpieces. Currently, laser 3D metal printing technologies primarily include selective laser melting (SLM) and direct energy deposition (DED).

[0003] In laser 3D metal printing, the base is the foundational platform that supports and secures the printed workpiece. It provides an initial attachment point for the printed part and prevents deformation caused by thermal stress or gravity during printing. Specifically, the base includes a baseplate, which supports and secures the printed workpiece.

[0004] In the related art, it is difficult to separate the substrate and the workpiece. Summary of the Invention

[0005] Based on this, the present application provides a substrate, a preparation method, a base, a workpiece separation method and a 3D printer to solve the problem of difficulty in separating the substrate and the workpiece in the related art.

[0006] In a first aspect, an embodiment of the present application provides a substrate for use in a 3D printer, comprising:

[0007] A substrate layer, wherein the substrate layer is made of a brittle material, and the brittle material is one of glass and ceramic;

[0008] A metal coating is located on and connected to the base layer, and is used to contact a workpiece printed by the 3D printer; the thickness of the metal coating is 20 μm to 100 μm; the material of the metal coating is a mixture of one or more of Fe, Cu, Cr, Ni, Ti, Ag, W, or Al; or the material of the metal coating is a metal nitride.

[0009] In some embodiments, the base layer has a thickness of 2 mm to 5 mm.

[0010] In some embodiments, the roughness Ra of the upper surface of the metal coating is 10 μm to 50 μm.

[0011] In some embodiments, the substrate further comprises:

[0012] The gradient layer is located between the base layer and the metal coating layer and is connected to the base layer and the metal coating layer.

[0013] In some embodiments, the gradient layer is a Ti-Cu-Ni gradient layer.

[0014] In a second aspect, an embodiment of the present application provides a method for preparing a substrate as described in the first aspect, the method comprising:

[0015] The metal plating layer is prepared on the upper surface of the prepared base layer to obtain the substrate.

[0016] In a third aspect, an embodiment of the present application provides a method for preparing a substrate as described in the first aspect, the method comprising:

[0017] preparing the gradient layer on the upper surface of the prepared base layer;

[0018] The metal plating layer is prepared on the upper surface of the gradient layer to obtain the substrate.

[0019] In a fourth aspect, an embodiment of the present application provides a base, including:

[0020] The substrate according to the first aspect;

[0021] A temperature regulating member is provided on which the substrate is disposed, and the temperature regulating member is used for heating or cooling the substrate.

[0022] In some embodiments, the base further comprises:

[0023] The first thermally conductive pad is arranged between the substrate and the temperature regulating component. Both the substrate and the temperature regulating component are in thermal contact with the first thermally conductive pad.

[0024] In some embodiments, the temperature regulating member has a first avoidance through hole, which is arranged opposite to the base layer of the substrate and is used to avoid the knocking device.

[0025] In some embodiments, a plurality of the first avoidance through holes are arranged at intervals, the diameter of the first avoidance through holes is 10 mm to 20 mm, and the center distance between two adjacent first avoidance through holes is 15 mm to 30 mm.

[0026] In some embodiments, the base further comprises:

[0027] The temperature regulating member has a plurality of first avoidance through holes, and the supporting member has a plurality of second avoidance through holes. The number of the first avoidance through holes and the second avoidance through holes are the same. The first avoidance through holes and the second avoidance through holes are arranged relative to each other and in a one-to-one correspondence. The first avoidance through holes are arranged relative to the base layer of the substrate. The first avoidance through holes and the second avoidance through holes are both used to avoid the knocking device.

[0028] In some embodiments, the base further comprises:

[0029] A knocking device is movably arranged below the support member and is used to knock the base layer of the substrate through the first avoidance through hole and the second avoidance through hole.

[0030] In a fifth aspect, an embodiment of the present application provides a method for separating a substrate from a workpiece, which is implemented by the base described in the fourth aspect, and the method includes:

[0031] preheating the substrate by the temperature regulating member;

[0032] printing the workpiece on the metal coating of the substrate;

[0033] Cooling the substrate by the temperature regulating member to generate cracks at the interface between the workpiece and the metal coating;

[0034] A knocking device is used to break the base layer of the substrate to complete the separation of the substrate and the workpiece.

[0035] In some embodiments, the knocking device knocks the base layer of the substrate along the outer contour of the contact surface between the workpiece and the metal coating.

[0036] In some embodiments, cooling the substrate by the temperature adjustment member includes cooling the substrate to below -20°C.

[0037] In a sixth aspect, an embodiment of the present application provides a 3D printer, comprising: the substrate described in the first aspect or the base described in the fourth aspect.

[0038] This application has at least the following beneficial effects:

[0039] 1. The metal coating is in direct contact with the 3D printed workpiece. Compared with printing directly on the ceramic layer, the metal coating can provide good metallurgical bonding properties. During the printing process, it can make the workpiece stably attached to the substrate, effectively reducing the workpiece displacement, warping and other phenomena, and improving the printing accuracy and workpiece quality.

[0040] 2. Because the base layer is made of brittle material, when the workpiece and substrate need to be separated, the base layer can be broken by external force to separate the workpiece and substrate. Compared with traditional mechanical cutting or manual peeling methods, this method is simple to operate and has a faster separation speed. At the same time, the noise generated during the breaking process is relatively low, which helps improve the working environment and reduce noise pollution.

[0041] 3. Using brittle materials as the base layer and covering it with a metal coating to form a composite substrate. Compared with traditional metal substrates, this has the advantages of lower cost, lighter weight, and better thermal conductivity, which can meet the needs of 3D printers while reducing production costs.

[0042] 4. The structure of the substrate is simple. During manufacturing, it is only necessary to prepare a metal coating on the base layer, eliminating the complex steps of applying ceramic slurry and placing micro-substrate units in related technologies, reducing the manufacturing links and the difficulty of process control. There is no need for high-precision positioning and complex temperature control and other expensive equipment, which helps to reduce manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0044] Figure 1 Schematic diagram of the structure of the substrate in one or more embodiments of the present application.

[0045] Figure 2 This is a schematic structural diagram of the base in one or more embodiments of the present application.

[0046] Figure 3 This is a top view of a temperature adjustment component in some embodiments of the present application.

[0047] Figure 4 This is a top view of the temperature regulating component in some other embodiments of the present application.

[0048] Description of reference numerals:

[0049] 1000-base, 100-substrate, 110-base layer, 120-gradient layer, 130-metal plating layer, 200-temperature adjustment member, 200a-first avoidance through hole, 300-first thermal conductive gasket, 400-support member, 400a-second avoidance through hole, 500-second thermal conductive gasket, 600-tapping device. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0052] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0053] The terms "first", "second" and "third" (if any) in the description and claims of this application and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0054] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or display that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, product or display.

[0055] One of the key factors restricting the large-scale civilian use of laser 3D metal printing is how to conveniently separate the substrate from the printed workpiece.

[0056] Currently, the main methods used to separate substrates and workpieces in the field of metal 3D printing are: using wire-cut electric discharge equipment to cut off the substrate; mechanical cutting using a band saw or milling machine; manual peeling using tweezers, diagonal pliers or chisels; and pulsed laser separation to irradiate the "separation layer" (such as polyimide resin) between the substrate and the workpiece through pulsed laser, causing it to lose its adhesion due to the photothermal effect, thereby achieving contactless peeling.

[0057] All of the above technologies have drawbacks. For example, wire EDM offers high precision and low stress, but the equipment is expensive and slow. Saw cutting is suitable for simple structures or thick workpieces with support joints, but it can easily cause deformation in thin-walled parts. Manual stripping and chiseling separation are low-cost and flexible, but inefficient, labor-intensive, and prone to surface damage, making them suitable only for low-bonding applications. Pulsed laser separation offers high precision, no mechanical damage, and can process large, thin layers, but the process is complex, the equipment is expensive, and strict control of laser parameters is required to avoid ablation or heat-affected zones. These existing separation methods all have limitations. In terms of ease of use, some methods lack the convenience and speed of the separation process due to high equipment cost, complex operation, or manual labor. In terms of efficiency, some methods are slow and time-consuming, failing to meet the market demand for rapid production. In terms of equipment compatibility, many methods require bulky equipment, making them difficult to flexibly deploy in consumer-grade applications. These shortcomings make them difficult to meet the core requirements of consumer-grade metal 3D printing in terms of ease of use, efficiency, and equipment compatibility, making them unsuitable for consumer-grade metal 3D printing.

[0058] The related art provides a substrate for SLM 3D printing, which includes a metal base and a ceramic layer directly sintered onto the metal base via discharge plasma. It is also proposed that during 3D printing, the workpiece is printed starting from the ceramic layer. After printing is complete, the ceramic is directly broken to quickly separate the workpiece from the substrate. The substrate can also be reused by re-sintering the ceramic layer after quickly removing the ceramic. This is convenient and quick, and the removal of residual ceramic and re-sintering are relatively simple, time-consuming, and relatively low-cost. This solution proposes printing the workpiece directly onto the ceramic layer, and proposes that since the density of ceramics is generally less than that of metal substrates, this can improve the adhesion of printed parts and avoid deformation of the substrate due to rapid heating.

[0059] However, after extensive research and practice by the applicant, it has been proved that the use of ceramics as the substrate interface material that directly contacts the 3D printed parts lacks good metallurgical bonding properties compared to traditional metal substrates. The workpiece cannot be well attached to the ceramic surface. During the printing process, due to the lack of metallurgical bonding properties, the bonding force between the workpiece and the ceramic layer is not stable enough, and the workpiece is prone to displacement, warping and other problems during the printing process, which seriously affects the printing accuracy and workpiece quality.

[0060] The applicant also found that in the process of sintering ceramics on a metal substrate, the high temperature of ceramic sintering can easily cause the metal substrate used for support to deform after cooling. Ceramic sintering usually needs to be carried out at a relatively high temperature. The high temperature will cause the metal substrate to expand thermally, and the metal substrate will shrink during the cooling process. Due to the difference in thermal expansion coefficients between ceramics and metals, this process of thermal expansion and contraction will cause large thermal stresses to be generated inside the metal substrate, thereby causing the metal substrate to deform. Once the metal substrate is deformed, the ceramic sintered thereon will also crack or deform. Ceramic cracking or deformation will destroy the flatness and uniformity of the ceramic layer surface, making it difficult for the workpiece to be stably formed on the ceramic layer during subsequent printing, further affecting the printing effect and workpiece quality. Moreover, damage to the ceramic layer may also cause irregular ceramic fragments when the ceramic is broken during the subsequent workpiece separation process, increasing the difficulty of cleaning ceramic residues and even damaging the workpiece that has already been printed.

[0061] Related technologies also provide a micro-discrete modular metal additive manufacturing substrate based on the principle of movable type printing, proposing to connect multiple micro-substrate units to a support layer via a ceramic connecting layer to form a discrete micro-substrate layer with a thickness of 1mm to 5mm. It is also proposed to apply ceramic slurry to the upper surface of the support layer to form a thin blank, thereby obtaining a metal additive manufacturing substrate precursor formed by combining the support layer and the ceramic blank; placing multiple micro-substrate units on the ceramic blank in a specific arrangement, and connecting the multiple micro-substrate units to the support layer by means of the adhesive force of the ceramic blank, thereby obtaining a metal additive manufacturing substrate intermediate; and sintering the metal additive manufacturing substrate intermediate to solidify the ceramic blank to form a ceramic connecting layer, thereby obtaining a metal additive manufacturing substrate. It is also proposed that after additive manufacturing of a metal workpiece on the upper surface of a metal additive manufacturing substrate, the printed workpiece is removed and the metal additive manufacturing substrate is struck to break the ceramic connecting layer and peel off the supporting layer and the ceramic connecting layer. Only a thin layer of discrete micro-substrate layer remains on the lower surface of the additively manufactured metal workpiece. Compared with traditional additive manufacturing metal substrates, the volume of the metal substrate combined with the additive manufacturing workpiece is greatly reduced, which can greatly improve the efficiency of removing the substrate in post-additive manufacturing processing and reduce the difficulty of removing the substrate.

[0062] However, the material of the support layer and the discrete micro-substrate layer is not clearly defined. Therefore, those skilled in the art cannot produce the micro-discrete combined metal additive manufacturing substrate based on the movable type printing principle and achieve the described effect according to the description in the article. The applicant also found that:

[0063] First, similar to the substrate used for SLM 3D printing, a ceramic slurry is applied to the upper surface of the support layer, and then the micro-substrate units are placed on the ceramic blank in a certain arrangement. Finally, the ceramic blank is sintered to solidify it to form a ceramic connecting layer to obtain a metal additive manufacturing substrate. In the process of sintering the ceramic on the support layer, the high temperature of the ceramic sintering can easily cause the support layer to deform or deform after cooling. Once the support layer is deformed, the ceramic sintered on it will also crack or deform, and the micro-substrate units on the ceramic will also shift or deform. In addition, the material of the micro-substrate units is unknown, and the micro-substrate units may also be damaged during the sintering of the ceramic. Ceramic cracking or deformation will destroy the flatness and uniformity of the surface of the ceramic layer, affect the flatness and uniformity of the micro-substrate units, and make it difficult for the workpiece to be stably formed on the micro-substrate units during subsequent printing, further affecting the printing effect and workpiece quality.

[0064] Secondly, there are a large number of micro-substrate units. In order to achieve the ideal printing effect, it is necessary to ensure that the gaps between the units are uniform and accurately positioned, and that there is no displacement or deformation during the sintering process. This places extremely high demands on both the manufacturing process and the equipment. On the one hand, in the manufacturing process, it is necessary to precisely control the thickness and uniformity of the ceramic slurry to ensure the stable quality of the ceramic connection layer formed by subsequent sintering; at the same time, the placement process of the micro-substrate units also requires high-precision operations to ensure that their positions are accurate. On the other hand, the requirements for the equipment are also extremely demanding, requiring a high-precision positioning system and temperature control system to achieve precise placement of the micro-substrate units and precise control of the ceramic sintering process.

[0065] Finally, any problem with any micro-substrate unit may affect the performance of the entire substrate. Once the micro-substrate unit gap is uneven, positioning deviation occurs, or displacement and deformation occur during the sintering process, it will cause uneven spreading of metal powder and poor melting effect during the printing process, which in turn affects the molding accuracy and quality of the workpiece. Moreover, such high-demand manufacturing processes and equipment have greatly increased the production cost of the substrate. The high cost is not only reflected in the purchase and maintenance of equipment, but also includes the strict screening of raw materials, quality control in the manufacturing process, and subsequent testing and debugging. These factors combined make it difficult for the micro-discrete modular metal additive manufacturing substrate based on the movable type printing principle to be widely used, limiting its promotion and application in the field of metal additive manufacturing.

[0066] In view of this, the inventors designed a substrate 100, a preparation method, a base 1000, a workpiece separation method and a 3D printer. The substrate 100 is in direct contact with the 3D printed workpiece through the metal plating layer 130, which can make the workpiece stably attached to the substrate 100, effectively reduce displacement, warping and other phenomena, and improve printing accuracy and workpiece quality. The base layer 110 is made of brittle material. When it is necessary to separate the workpiece and the substrate 100, the base layer 110 can be broken by hitting it with external force, so that the substrate 100 and the workpiece are separated. It has the characteristics of simple operation and fast separation speed.

[0067] The following describes in detail the substrate 100, preparation method, base 1000, workpiece separation method and 3D printer provided in the embodiments of the present application in conjunction with the accompanying drawings.

[0068] Figure 1 This is a schematic diagram of the structure of the substrate in one or more embodiments of the present application, such as Figure 1 As shown, the substrate 100 is used in a 3D printer and includes a base layer 110 and a metal coating 130. The base layer 110 is made of a brittle material; the metal coating 130 is located on the base layer 110 and connected to the base layer 110. The metal coating 130 is used to contact the workpiece printed by the 3D printer.

[0069] The metal coating 130 is disposed on the upper surface of the base layer 110 , and the base layer 110 supports the metal coating 130 . During 3D printing, the workpiece is printed on the upper surface of the metal coating 130 .

[0070] The base layer 110 is made of a brittle material. A brittle material is a material that, when subjected to an external force, suddenly breaks when the stress reaches a certain limit, without undergoing significant plastic deformation before breaking. When the base layer 110 is struck by an external force, the base layer 110 can be broken.

[0071] The metal coating 130 and the base layer 110 may be directly or indirectly connected, which is not limited in this application. For example, the metal coating 130 may be formed on the surface of the substrate 100 through thin-film metallization (magnetron sputtering, vapor deposition, ion plating, arc plating, etc.), electroplating, chemical plating, or direct copper cladding metallization, so that the metal coating 130 and the base layer 110 are directly connected. For example, a gradient layer 120 may be provided between the metal coating 130 and the base layer 110. The gradient layer 120 is connected to both the metal coating 130 and the base layer 110, thereby indirectly connecting the metal coating 130 and the base layer 110.

[0072] The substrate 100 provided in this application has the following advantages:

[0073] 1. The metal coating 130 is in direct contact with the 3D printed workpiece. Compared with printing directly on the ceramic layer, the metal coating 130 can provide good metallurgical bonding properties. During the printing process, it can make the workpiece stably attached to the substrate 100, effectively reducing the workpiece displacement, warping and other phenomena, and improving the printing accuracy and workpiece quality.

[0074] 2. Because the base layer 110 is made of a brittle material, when the workpiece and substrate 100 need to be separated, the base layer 110 can be broken by external force, thereby separating the workpiece and substrate 100. Compared with traditional mechanical cutting or manual peeling methods, this method is simple to operate and has a faster separation speed. Furthermore, the noise generated during the breaking process is relatively low, which helps improve the working environment and reduce noise pollution.

[0075] 3. A brittle material is used as the base layer 110 and covered with a metal coating 130 to form a composite substrate 100. Compared with traditional metal substrates, this composite substrate has advantages such as lower cost, lighter weight, and better thermal conductivity, which can meet the requirements of 3D printers while reducing production costs.

[0076] 4. The structure of the substrate 100 is simple. During manufacturing, it is only necessary to prepare a metal coating 130 on the base layer 110, eliminating the complicated steps of applying ceramic slurry and placing micro-substrate units in related technologies, reducing the number of manufacturing links and the difficulty of process control. There is no need for expensive equipment such as high-precision positioning and complex temperature control.

[0077] In some embodiments, the base layer 110 is made of glass or ceramic.

[0078] The glass may be silicate glass, borate glass, phosphate glass, halide glass, chalcogenide glass, etc. The ceramic may be one or more mixtures of oxide ceramics, nitride ceramics, boride ceramics, fluoride ceramics, or metal ceramics. Oxide ceramics may include Al2O3, ZrO2, MgO, SiO2, TiO2, or HfO2; carbide ceramics may include SiC, B4C, TaC, WC, ZrC, or VC; nitride ceramics may include Si3N4, TaN, TiN, AlN, ZrN, or VN; boride ceramics may include TiB2, HfB2, LaB6, ZrB2, or VB2; fluoride ceramics may include LiF, CaF2, or MgF2; and metal ceramics may include Si3N4+Ni, Al2O3+Ni, ZrO2+Ni, Al2O3+TiC, BN+Fe, or WC+Co+Fe.

[0079] In some embodiments, the thickness of the base layer 110 is 2 mm to 5 mm, and may be 2 mm, 5 mm, 3 mm, 4 mm, 2.5 mm, 4.5 mm, or 3.55 mm, etc., which is not limited in this application.

[0080] The inventors found that when the thickness of the base layer 110 is less than 2 mm, a series of problems will arise. First, a base layer 110 that is too thin is prone to damage when subjected to external forces. During the 3D printing process, the printing equipment may generate certain vibrations, and the workpiece will also exert a certain amount of pressure on the substrate 100 during the molding process. If the base layer 110 is less than 2 mm thick, it will be difficult to effectively resist these external forces, which may cause cracks or even breakage in the base layer 110, thereby affecting the stability of the printing process and the quality of the workpiece. Secondly, a base layer 110 that is too thin cannot evenly disperse the heat generated during the printing process. During the metal 3D printing process, laser irradiation will increase the temperature of the base layer 110. If the base layer 110 is too thin, it will cause local overheating of the base layer 110, which will not only affect the molding accuracy of the workpiece, but may also cause defects such as deformation and cracking in the workpiece. Furthermore, a base layer 110 that is too thin is easily broken into irregular fragments when it is broken and separated. These irregular fragments are not only difficult to clean, but may also scratch or damage the surface of the printed workpiece during the cleaning process, increasing the difficulty and workload of subsequent processing.

[0081] When the thickness of the base layer 110 is greater than 5 mm, there are also many disadvantages. On the one hand, an overly thick base layer 110 will increase the weight of the entire substrate 100. For a 3D printer, an overly heavy substrate 100 will increase the load on the equipment, affect the operating speed and accuracy of the equipment, and shorten the service life of the equipment. On the other hand, an overly thick base layer 110 requires more raw materials, resulting in an increase in the production cost of the substrate 100. At the same time, during the manufacturing process, a thicker base layer 110 requires a longer processing time, further increasing the manufacturing cost. In addition, in the crushing and separation process, an overly thick base layer 110 requires a greater knocking force to break it, which increases the labor intensity of the operator. It may also cause the workpiece to be subjected to excessive impact force due to excessive knocking force, resulting in damage or deformation of the workpiece.

[0082] The thickness of the base layer 110 is 2mm~5mm, which can take into account many aspects of the needs. First, this thickness range can provide sufficient structural strength to ensure that the base layer 110 will not be easily damaged during the 3D printing process, thereby ensuring the stability of the printing process and the quality of the workpiece. Secondly, the base layer 110 of 2mm~5mm can effectively disperse the heat generated during the printing process, avoid local overheating, and is conducive to the uniform molding of the workpiece. Furthermore, when breaking and separating, the base layer 110 in this thickness range can be relatively easily broken into more regular fragments, which is convenient for cleaning and will not cause obvious damage to the surface of the workpiece, reducing the difficulty and workload of subsequent processing. At the same time, this thickness range will not make the substrate 100 too heavy, will not cause too much burden on the operation of the 3D printer, and can control the cost of raw materials and manufacturing costs to a certain extent, thereby improving the cost performance of the product.

[0083] In some embodiments, the metal coating layer 130 is made of a mixture of one or more of Fe, Cu, Cr, Ni, Ti, Ag, W, or Al.

[0084] Iron, with its high chemical activity, can diffuse and penetrate atoms from various metal powders during 3D printing, forming strong chemical bonds and enhancing bonding strength. Its thermal expansion coefficient is compatible with the printed metal, reducing thermal stress and further strengthening the bond. Copper has excellent thermal conductivity, evenly transferring heat, facilitating the melting and flow of metal powders and promoting atomic bonding. Furthermore, copper has excellent wettability with various metals, allowing the molten metal to spread evenly, forming a tight interface and enhancing bonding strength. Chromium easily forms a dense oxide film on its surface, which prevents oxidation and protects the bonding interface. It also acts as a "binder" to enhance bonding strength. Chromium also reacts with some metals to form high-hardness, high-strength intermetallic compounds, strengthening the bonding interface. Nickel is highly corrosion-resistant, protecting the bonding interface from corrosion and ensuring long-term stable bonding strength. Its high ductility can alleviate thermal stress during printing, preventing cracking at the bonding interface and maintaining high bonding strength. Titanium has strong interatomic bonding and forms strong metallic bonds with the printed metal. Titanium is also compatible with various metals, forming a stable bonding interface and suitable for 3D printing with various metals. Silver has high conductivity, allowing electrons to freely exchange during 3D printing, helping metal atoms combine and form strong chemical bonds. Silver also exhibits excellent solderability, and when metal powder is melted and deposited, it behaves similarly to welding, quickly forming a high-quality interface. The aluminum oxide film applied to the aluminum surface increases the surface roughness, improving friction, enhancing bonding, and protecting the interface. Tungsten has a high melting point and strong thermal stability, allowing it to withstand high-temperature melting environments during 3D printing, reducing the risk of coating deformation and ensuring initial contact accuracy at the interface. Its coefficient of thermal expansion is similar to that of most metals, reducing internal stresses generated by differential thermal expansion during the cooling phase and minimizing the possibility of cracking at the interface. Furthermore, tungsten's high hardness and excellent wear resistance allow its surface to form a tighter mechanical bond with the printed metal, enhancing interfacial bonding strength. When mixed with other metals (such as iron and nickel), tungsten can form high-strength intermetallic compounds (such as Fe-W and Ni-W phases) through atomic diffusion, further strengthening the bond between the printed workpiece and the coating. When multiple metals are mixed to form the metal coating 130, the properties of the different metals complement and synergize with each other. On the one hand, the advantages of each metal in promoting atomic bonding can be comprehensively utilized to strengthen the bonding interface; on the other hand, the thermal expansion coefficient of the metal coating 130 can be adjusted to make it closer to the printed metal material, reducing the impact of thermal stress on the bonding strength. It can also form complex and stable intermetallic compounds at high temperatures, further enhancing the bonding strength between the printed workpiece and the metal coating 130.

[0085] In some embodiments, the metal coating layer 130 is made of metal nitride, such as CrN or TiN.

[0086] Metal nitrides have high surface hardness and excellent wear resistance. Their overall performance is good and they can withstand the repeated impact of metal powder during the printing process, which helps to improve the printing quality of the workpiece. In addition, metal nitrides have a high melting point and thermal stability, which can maintain structural stability in the high-temperature environment of metal 3D printing, effectively reducing the risk of deformation or cracking of the substrate due to thermal stress, and improving the accuracy and reliability of the printing process.

[0087] In some embodiments, the thickness of the metal plating layer 130 is 20 μm to 100 μm, and may be 20 μm, 25 μm, 50 μm, 65 μm, 71 μm, 100 μm, etc., which is not limited in this application.

[0088] The inventors discovered that when the thickness of the metal coating 130 is less than 20 μm, it is difficult for the coating to provide sufficient space for atomic diffusion and reaction, making it difficult to form a sufficient number and strength of chemical bonds with the printed metal material. In addition, it is easy to suffer local damage due to external forces or thermal stress during the printing process, resulting in failure of the bonding interface and a significant decrease in bonding strength. When the thickness exceeds 100 μm, the internal stress of the coating increases, and cracks are easily generated when the temperature changes. These cracks will extend to the bonding interface between the coating and the workpiece, destroying the integrity of the bonding. At the same time, an overly thick coating will also increase thermal resistance, affecting the uniform transfer of heat at the bonding interface, and is not conducive to the full bonding between metal atoms. A thickness range of 20 μm to 100 μm can not only ensure that the metal coating 130 has sufficient space for sufficient atomic interaction with the printed metal material to form a strong chemical bond, but also effectively control internal stress and thermal resistance, reduce the problems of crack generation and uneven heat transfer, thereby ensuring a stable and high bonding strength between the printed workpiece and the substrate 100.

[0089] In the 3D metal printing process, if the surface of the metal coating 130 is too smooth, the powder material may have difficulty in evenly adhering to its surface, resulting in problems such as uneven powder accumulation and poor interlayer bonding during the printing process.

[0090] In some embodiments, the roughness Ra of the upper surface of the metal plating layer 130 is 10 μm to 50 μm, and may be 10 μm, 20 μm, 30 μm, 35 μm, 50 μm, etc., which is not limited in this application.

[0091] The roughness of the upper surface of the metal coating is set at 10μm~50μm, which can provide more attachment points for the powder, so that the powder can stay more stably on the surface of the metal coating 130, so that there is a stable and high bonding force between the printed workpiece and the substrate 100, which is beneficial to the subsequent 3D printing process and improves the quality and precision of the printed parts.

[0092] In some embodiments, the substrate 100 further includes a gradient layer 120 . The gradient layer 120 is located between the base layer 110 and the metal coating layer 130 and is connected to the base layer 110 and the metal coating layer 130 .

[0093] Specifically, the gradient layer 120 is disposed on the upper surface of the base layer 110, and the metal coating 130 is disposed on the upper surface of the gradient layer 120. The brittle base layer 110 and the metal coating 130 may have weak bonding strength. In this embodiment, the gradient layer 120 is disposed between the base layer 110 and the metal coating 130 to optimize interface performance. Specifically, the gradient layer 120 is designed with a gradual composition change to form a gradient transition zone between the base layer 110 and the metal coating 130. This transition zone can alleviate the interfacial stress caused by the difference in thermal expansion coefficients between the brittle base layer 110 and the metal coating 130, helping to reduce the risk of delamination of the metal coating 130 during the printing cooling process, thereby improving the quality and precision of the printed workpiece.

[0094] The types of the gradient layer 120 are various, and may be a Cr-Ni gradient layer, a Nb-Mo gradient layer, etc., which is not limited in this application.

[0095] In some implementations, the gradient layer 120 is a Ti-Cu-Ni gradient layer.

[0096] The Ti layer contacts the upper surface of the base layer 110, chemically reacting with the upper surface of the base layer 110 to form a strong chemical bond, providing a strong chemical anchoring effect for the interface bonding. The Cu layer, with its excellent ductility and thermal conductivity, serves as a relay for the gradient layer 120. On the one hand, it buffers the physical property differences between the Ti layer and the subsequent Ni layer, and on the other hand, it optimizes the heat conduction path, helping to ensure uniform heat distribution during the printing process and reduce stress concentration caused by local overheating. The Ni layer forms a good metallurgical bond with the lower surface of the metal coating 130. Its stable crystal structure and corrosion resistance enhance the mechanical strength and durability of the interface. Through multiple mechanisms such as chemical bonding, physical buffering, thermal conductivity optimization, and metallurgical bonding, the Ti-Cu-Ni gradient layer 120 reduces the stress concentration and deformation risk between the base layer 110 and the metal coating 130 during the printing process, thereby improving the bonding strength between the base layer 110 and the metal coating 130.

[0097] Based on the same inventive concept, an embodiment of the present application further provides a method for preparing a substrate 100 , which is used to prepare the substrate 100 including the base layer 110 and the metal plating layer 130 . The method includes:

[0098] S1 , preparing a metal coating layer 130 on the upper surface of the prepared base layer 110 .

[0099] The metal coating 130 can be formed on the upper surface of the base layer 110 by thin film metallization (magnetron sputtering, vapor deposition, ion plating, arc plating, etc.), electroplating, chemical plating or direct copper coating metallization.

[0100] In this method, the base layer 110 is prepared and formed in advance. After the prepared base layer 110 has a stable structure and size, the metal coating 130 is prepared on its upper surface. This can effectively avoid the problem of deformation of the metal coating 130 that may be caused by the high-temperature sintering process of the base layer 110, ensure the dimensional accuracy and shape stability of the substrate 100, so that during subsequent printing, the workpiece can be stably formed on the metal coating 130, ensuring the printing effect and helping to improve the quality of the workpiece.

[0101] Based on the same inventive concept, an embodiment of the present application further provides a method for preparing a substrate 100 , which is used to prepare the substrate 100 including the base layer 110 , the gradient layer 120 , and the metal plating layer 130 . The method includes:

[0102] S10 , preparing a gradient layer 120 on the upper surface of the prepared base layer 110 .

[0103] S20 , preparing a metal coating layer 130 on the upper surface of the gradient layer 120 .

[0104] The gradient layer 120 can be formed on the upper surface of the base layer 110 by magnetron sputtering, electroplating, chemical deposition, etc. The metal coating layer 130 can be formed on the upper surface of the gradient layer 120 by thin film metallization (magnetron sputtering, vapor deposition, ion plating, arc plating, etc.), electroplating, chemical plating, or direct copper cladding metallization.

[0105] In this method, the base layer 110 is prepared and formed in advance. After the prepared base layer 110 has a stable structure and size, the gradient layer 120 is prepared on its upper surface, and then the metal coating 130 is prepared on the upper surface of the prepared gradient layer 120. This can effectively avoid the problem of deformation of the gradient layer 120 and the metal coating 130 that may be caused by the high-temperature process of sintering the base layer 110, ensure the dimensional accuracy and shape stability of the substrate 100, so that during subsequent printing, the workpiece can be stably formed on the metal coating 130, ensuring the printing effect and helping to improve the quality of the workpiece.

[0106] Figure 2 This is a schematic diagram of the structure of the base in one or more embodiments of the present application, such as Figure 2 As shown, based on the same inventive concept, the embodiment of the present application further provides a base 1000, comprising: the above-mentioned substrate 100 and a temperature adjustment member 200. The substrate 100 is disposed on the temperature adjustment member 200, and the temperature adjustment member 200 is used to heat the substrate 100 or cool the substrate 100.

[0107] Since the base 1000 includes the above-mentioned substrate 100 , it naturally has all the beneficial effects of the substrate 100 , which will not be described in detail here.

[0108] Temperature control element 200 may include a cooling element and a heating element. The cooling element operates when cooling is required, and the heating element operates when heating is required. The cooling element may be a semiconductor cooling plate, for example, while the heating element may be a ceramic heater plate, a PTC heater, or the like. Temperature control element 200 may also be a single element capable of both heating and cooling. For example, a thermoelectric cooler (TEC) utilizes the thermoelectric effect of semiconductors to generate cooling, also known as a thermoelectric cooler. TECs can generate both cooling and heating. They consist of a thermocouple pair composed of P-type and N-type semiconductor materials. When current flows from the N-type semiconductor to the P-type semiconductor, heat is absorbed at the junction, achieving a cooling effect. Conversely, when the current changes direction, from the P-type semiconductor to the N-type semiconductor, heat is released at the junction, achieving a heating effect.

[0109] The substrate 100 is placed on the temperature regulating member 200. The substrate 100 and the temperature regulating member 200 can be clamped together by a clamp, or can be connected together by snap connection or bolt connection, etc., which is not limited in this application.

[0110] It should be noted that the base layer 110 of the substrate 100 is in thermal contact with the temperature regulating member 200, so that the temperature regulating member 200 can heat or cool the substrate 100. Specifically, before 3D printing, the temperature regulating member 200 preheats the substrate 100 and also heats the substrate 100 during the 3D printing process, thereby reducing the thermal stress between the workpiece and the metal coating 130 during the 3D printing process. After the 3D printing is completed, the temperature regulating member 200 cools the substrate 100 and, by utilizing the difference in thermal expansion coefficients between the workpiece and the metal coating 130, causes cracks to form at the interface connecting the printed workpiece and the metal coating 130, thereby facilitating the separation of the workpiece and the substrate 100.

[0111] In some embodiments, the temperature regulating element 200 is a semiconductor cooler in a plate-like structure, and the thickness of the semiconductor cooler is 3 mm to 5 mm, and can be 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm.

[0112] In some embodiments, the base 1000 further includes a first thermally conductive gasket 300 , which is disposed between the substrate 100 and the temperature adjustment member 200 . Both the substrate 100 and the temperature adjustment member 200 are in thermal contact with the first thermally conductive gasket 300 .

[0113] If the substrate 100 and the temperature regulating member 200 were in direct contact to conduct heat, air gaps, etc., might exist between them due to microscopic surface irregularities during actual contact. These gaps would hinder the effective transfer of heat. The first thermally conductive pad 300 has excellent flexibility and filling properties, and can fit tightly against the surfaces of the substrate 100 and the temperature regulating member 200, filling the gap between them. This allows the heat generated by the temperature regulating member 200 to be transferred to the substrate 100 more quickly and efficiently. Alternatively, when the substrate 100 needs to be cooled, the heat from the substrate 100 can be more quickly absorbed by the temperature regulating member 200, thereby improving the response speed and efficiency of temperature regulation.

[0114] The material of the first thermally conductive gasket 300 is diverse, and may be a graphene gasket, a silicone-based thermally conductive gasket, a polyimide-based thermally conductive gasket, an acrylic-based thermally conductive gasket, an indium film, etc., which is not limited in this application.

[0115] In some embodiments, the temperature regulating member 200 has a first avoidance through hole 200 a . The first avoidance through hole 200 a is disposed opposite to the base layer 110 of the substrate 100 and is used to avoid the striking device 600 .

[0116] After the substrate 100 is placed on the temperature regulating member 200, the lower surface of the substrate 100, i.e., the lower surface of the base layer 110, is blocked by the temperature regulating member 200. In these embodiments, by providing the first avoidance through-hole 200a, at least a portion of the lower surface of the base layer 110 is exposed through the first avoidance through-hole 200a, making it easier for the striking device 600 to extend into the first avoidance through-hole 200a and strike the lower surface of the base layer 110, thereby breaking the base layer 110 and achieving separation of the substrate 100 from the workpiece.

[0117] The number of the first avoiding through holes 200 a may be one or more, which is not limited in the present application.

[0118] In some embodiments, a plurality of first avoidance through holes 200 a are provided at intervals.

[0119] Compared with a single first avoidance through hole 200a, a plurality of first avoidance through holes 200a arranged at intervals provide a plurality of operating points for the knocking device 600. When knocking the lower surface of the base layer 110, the knocking can be performed simultaneously in the plurality of first avoidance through holes 200a, so that the substrate 100 can be subjected to force more evenly, thus avoiding local stress concentration to a certain extent, improving the success rate and efficiency of the substrate 100 being broken, and enabling the substrate 100 and the workpiece to be separated smoothly. The provision of a plurality of first avoidance through holes 200a also enables the base 1000 to better adapt to workpieces of different sizes and shapes. During the 3D printing process, different workpieces may be printed at different positions on the substrate 100. The provision of a plurality of first avoidance through holes 200a allows the operator to select the appropriate first avoidance through hole 200a for knocking and separation according to the actual position and shape of the workpiece, thereby improving the applicability and flexibility of the base 1000.

[0120] The plurality of first avoidance through holes 200a may be arranged in multiple rows and columns. Figure 3 This is a top view of the temperature regulating member in some embodiments of the present application, such as Figure 3 As shown, each row can be staggered. Figure 4 This is a top view of the temperature regulating member in some other embodiments of the present application, such as Figure 4 As shown, they can also be arranged in alignment in each row. The plurality of first avoidance through holes 200a can also be arranged in a circular pattern, which is not limited in this application.

[0121] like Figure 3 As shown, in some embodiments, multiple first avoidance through holes 200a are spaced apart, and the diameter of the first avoidance through holes 200a is 10 mm to 20 mm, and the center distance between two adjacent first avoidance through holes 200a is 15 mm to 30 mm. The diameter of the first avoidance through holes 200a can be 10 mm, 15 mm, 17 mm, 18.5 mm, or 20 mm, and the center distance between two adjacent first avoidance through holes 200a can be 15 mm, 17 mm, 18 mm, 20 mm, 25 mm, or 30 mm, etc., which are not limited in this application.

[0122] The diameter of the first avoidance through-hole 200a is 10 mm to 20 mm, allowing the knocking device 600 to easily extend into the first avoidance through-hole 200a and accurately knock on the lower surface of the base layer 110. The knocking device 600 will not be difficult to operate due to the first avoidance through-hole 200a being too small, nor will the structural strength and thermal conductivity of the temperature regulating member 200 be affected due to the first avoidance through-hole 200a being too large. The center distance between two adjacent first avoidance through-holes 200a is set at 15 mm to 30 mm, so that when the temperature regulating member 200 is subjected to normal operating loads and knocking impact forces, the structure will not be damaged or deformed due to the excessive density of holes, which helps to ensure the long-term and stable operation of the temperature regulating member 200.

[0123] In some embodiments, the base 1000 further includes a support member 400 , and the temperature adjustment member 200 is disposed on the support member 400 .

[0124] The temperature regulating member 200 is disposed on the support member 400, and the substrate 100 is disposed on the temperature regulating member 200. The support member 400 supports the temperature regulating member 200, the temperature regulating member 200 supports the substrate 100, and the substrate 100 supports the workpiece 3D printed thereon. The support member 400 and the temperature regulating member 200 can be connected together by clamping, bolting, clamping, bonding, etc., which are not limited in this application. When in use, the support member 400 is fixedly connected to the printing platform of the 3D printer.

[0125] The structure and material of the support member 400 are various, and the material can be metal, plastic, etc., which is not limited in this application.

[0126] In some embodiments, the support member 400 is made of stainless steel and has a plate-shaped structure.

[0127] In some embodiments, the thickness of the support member 400 is 3 mm to 5 mm, and may be 3 mm, 3.2 mm, 4 mm, 4.7 mm, or 5 mm.

[0128] In some embodiments, a second thermally conductive gasket 500 is disposed between the support member 400 and the temperature regulating member 200. The second thermally conductive gasket 500 is in thermal contact with the support member 400 and the temperature regulating member 200. The second thermally conductive gasket 500 has good flexibility and filling properties, and can closely fit the surfaces of the support member 400 and the temperature regulating member 200, filling the gap between the two, reducing the presence of air, and allowing heat to be transferred more directly and efficiently from the temperature regulating member 200 to the support member 400, thereby improving the overall thermal conductivity of the base 1000, allowing the temperature regulating member 200 to quickly and evenly transfer heat, and helping to quickly dissipate heat from the workpiece.

[0129] The material of the second thermally conductive gasket 500 is diverse, and may be a graphene gasket, a silicone-based thermally conductive gasket, a polyimide-based thermally conductive gasket, an acrylic-based thermally conductive gasket, an indium film, etc., which is not limited in this application.

[0130] In some embodiments, the temperature regulating member 200 has a plurality of first avoidance through holes 200a, and the supporting member 400 has a plurality of second avoidance through holes 400a. The number of the first avoidance through holes 200a and the second avoidance through holes 400a is the same. The first avoidance through holes 200a and the second avoidance through holes 400a are arranged relative to each other and in a one-to-one correspondence. The first avoidance through hole 200a is arranged relative to the base layer 110 of the substrate 100. The first avoidance through hole 200a and the second avoidance through hole 400a are both used to avoid the knocking device 600.

[0131] After the substrate 100 is placed on the temperature regulating member 200, the lower surface of the substrate 100, i.e., the lower surface of the base layer 110, is blocked by the temperature regulating member 200. In these embodiments, by providing the first avoidance through-hole 200a and the second avoidance through-hole 400a, at least a portion of the lower surface of the base layer 110 is exposed through the first avoidance through-hole 200a and the second avoidance through-hole 400a, so that the striking device 600 can be easily inserted into the first avoidance through-hole 200a and the second avoidance through-hole 400a to strike the lower surface of the base layer 110, thereby breaking the substrate 100 and achieving separation of the substrate 100 from the workpiece.

[0132] In some embodiments, the base 1000 further includes a knocking device 600 , which is movably disposed below the support member 400 and is used to knock the base layer 110 of the substrate 100 through the first avoidance through-hole 200 a and the second avoidance through-hole 400 a .

[0133] The striking device 600 can be a claw hammer, a ball-peen hammer, or the like. The striking device 600 can be driven by a hydraulic cylinder, a linear motor, a pneumatic cylinder, or the like, allowing the striking device 600 to move beneath the support member 400. The movable striking device 600 allows the operator to adjust the position of the striking device 600 based on the actual position and shape of the workpiece, allowing the striking device 600 to align with different second avoidance through-holes 400a for striking and separating, thereby improving the applicability and flexibility of the base 1000.

[0134] In some embodiments, the striking device 600 is a pneumatic hammer. Pneumatic hammers have various structures known to those skilled in the art and are not limited in this application. A pneumatic hammer is connected to a compressed air source via an air pipe. When compressed air enters the air chamber, it pushes a piston, one end of which is connected to a striking head, thereby extending the striking head to strike. When the air supply is stopped, the piston can be retracted by a spring or other reset member.

[0135] Based on the same inventive concept, an embodiment of the present application further provides a method for separating a substrate 100 from a workpiece, which is implemented using the aforementioned base 1000. The method includes:

[0136] S100 , preheating the substrate 100 through the temperature adjustment member 200 .

[0137] Before 3D printing, the temperature regulating member 200 preheats the substrate 100 and continues to heat the substrate 100 during the 3D printing process, thereby reducing thermal stress between the workpiece and the metal coating 130 during the 3D printing process.

[0138] S200 , printing a workpiece on the metal coating 130 of the substrate 100 .

[0139] Specifically, the workpiece is printed on the upper surface of the metal plating layer 130 .

[0140] S300 , cooling the substrate 100 through the temperature adjustment member 200 so as to generate cracks at the interface between the workpiece and the metal coating 130 .

[0141] After 3D printing is completed, the temperature regulating member 200 cools the substrate 100 and utilizes the difference in thermal expansion coefficients between the workpiece and the metal coating 130 to induce cracks at the interface connecting the workpiece and the metal coating 130, thereby achieving pre-separation of the workpiece and the metal coating 130 and reducing the difficulty of subsequent tapping separation.

[0142] In some embodiments, the substrate 100 is cooled to below -20°C.

[0143] Different materials have different thermal expansion coefficients. Cooling the substrate 100 to below -20°C can greatly amplify the difference in thermal expansion coefficients between the metal coating 130 and the workpiece. In a low-temperature environment, the metal coating 130 shrinks more than the workpiece, causing greater stress at the interface between the workpiece and the metal coating 130, which makes it easier to induce the generation and expansion of interface cracks, achieve more thorough and efficient pre-separation, and reduce the difficulty of subsequent knocking separation. In addition, cooling to below -20°C helps the cracks to extend deeper at the interface. At conventional cooling temperatures, cracks may only stay on the surface of the interface, while low temperatures below -20°C can allow cracks to penetrate into the junction of the metal coating 130 and the base layer 110, and even penetrate the entire interface, creating more favorable conditions for subsequently breaking the substrate 100 and the base layer 110, ensuring a smooth separation process.

[0144] S400 , using the knocking device 600 to break the base layer 110 of the substrate 100 , thereby completing the separation of the substrate 100 and the workpiece.

[0145] After cooling is complete, the base layer 110 of the substrate 100 is broken by the knocking device 600, thereby completing the separation of the substrate 100 and the workpiece, and the workpiece can be removed from the substrate 100. After the workpiece is removed from the substrate 100, if a new workpiece is to be printed, the broken substrate 100 must be removed and replaced with a new substrate 100, and then printing can be performed on the new substrate 100.

[0146] In some embodiments, the striking device 600 breaks the base layer 110 of the substrate 100 along the outer contour of the contact surface between the workpiece and the metal coating 130 .

[0147] Tapping along the outer contour of the contact surface helps to make the base layer 110 of the substrate 100 easier to break, reduces the number and time of unnecessary tapping, speeds up the separation of the substrate 100 and the workpiece, and improves production efficiency.

[0148] Based on the same inventive concept, an embodiment of the present application further provides a 3D printer, comprising: the above-mentioned substrate 100 or base 1000 .

[0149] Since the 3D printer includes the aforementioned substrate 100 or base 1000, it naturally has all the beneficial effects of the substrate 100 or base 1000, which will not be described in detail here. The 3D printer may be a laser 3D metal printer.

[0150] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A substrate, characterized in that Applications in 3D printers include: A base layer (110), wherein the base layer (110) is made of a brittle material, wherein the brittle material is one of glass and ceramic; A metal plating layer (130) is located on the base layer (110) and connected to the base layer (110), and the metal plating layer (130) is used to contact a workpiece printed by the 3D printer; the thickness of the metal plating layer (130) is 20 μm to 100 μm; the material of the metal plating layer (130) is a mixture of one or more of Fe, Cu, Cr, Ni, Ti, Ag, W or Al; or the material of the metal plating layer (130) is metal nitride.

2. The substrate according to claim 1, wherein The thickness of the base layer (110) is 2 mm to 5 mm.

3. The substrate according to claim 1, wherein The roughness Ra of the upper surface of the metal plating layer (130) is 10 μm to 50 μm.

4. The substrate according to any one of claims 1 to 3, characterized in that The substrate (100) further includes: The gradient layer (120) is located between the base layer (110) and the metal coating (130), and is connected to the base layer (110) and the metal coating (130).

5. The substrate according to claim 4, wherein The gradient layer (120) is a Ti-Cu-Ni gradient layer.

6. The method for preparing a substrate according to any one of claims 1 to 3, wherein: The method comprises: The metal plating layer (130) is prepared on the upper surface of the prepared base layer (110) to obtain the substrate (100).

7. The method for preparing a substrate according to claim 4 or 5, wherein: The method comprises: preparing the gradient layer (120) on the upper surface of the prepared base layer (110); The metal plating layer (130) is prepared on the upper surface of the gradient layer (120) to obtain the substrate (100).

8. A base, characterized in that: include: The substrate (100) according to any one of claims 1 to 5; A temperature regulating member (200) is provided on which the substrate (100) is disposed, and the temperature regulating member (200) is used to heat the substrate (100) or cool the substrate (100).

9. The base according to claim 8, characterized in that The base (1000) further comprises: A first heat-conducting gasket (300) is provided between the substrate (100) and the temperature regulating member (200); the substrate (100) and the temperature regulating member (200) are both in heat-conducting contact with the first heat-conducting gasket (300).

10. The base according to claim 8, wherein: The temperature regulating member (200) has a first avoidance through hole (200a), and the first avoidance through hole (200a) is arranged opposite to the base layer (110) of the substrate (100) and is used to avoid the knocking device (600).

11. The base according to claim 10, characterized in that A plurality of the first avoidance through holes (200a) are arranged at intervals, the diameter of the first avoidance through holes (200a) is 10 mm to 20 mm, and the center distance between two adjacent first avoidance through holes (200a) is 15 mm to 30 mm.

12. The base according to claim 8, wherein The base (1000) further comprises: A support member (400), wherein the temperature regulating member (200) is arranged on the support member (400).

13. The base according to claim 12, characterized in that The temperature regulating member (200) has a plurality of first avoidance through holes (200a), and the supporting member (400) has a plurality of second avoidance through holes (400a). The number of the first avoidance through holes (200a) and the second avoidance through holes (400a) are the same. The first avoidance through holes (200a) and the second avoidance through holes (400a) are arranged relative to each other and in a one-to-one correspondence. The first avoidance through holes (200a) are arranged relative to the base layer (110) of the substrate (100). The first avoidance through holes (200a) and the second avoidance through holes (400a) are both used to avoid the knocking device (600).

14. The base according to claim 13, characterized in that The base (1000) further comprises: A knocking device (600) is movably provided below the support member (400) and is used to knock the base layer (110) of the substrate (100) through the first avoidance through-hole (200a) and the second avoidance through-hole (400a).

15. A method for separating a substrate from a workpiece, characterized in that: The method is implemented by the base (1000) according to any one of claims 8 to 14, comprising: preheating the substrate (100) via the temperature regulating member (200); Printing the workpiece on the metal coating (130) of the substrate (100); Cooling the substrate (100) through the temperature regulating member (200) to generate cracks at the interface between the workpiece and the metal coating (130); The base layer (110) of the substrate (100) is broken by using a knocking device (600), thereby completing the separation of the substrate (100) and the workpiece.

16. The method for separating a substrate from a workpiece according to claim 15, wherein: The knocking device (600) knocks the base layer (110) of the substrate (100) along the outer contour of the contact surface between the workpiece and the metal plating layer (130).

17. The method for separating a substrate from a workpiece according to claim 15, wherein: Cooling the substrate (100) through the temperature regulating member (200) comprises: cooling the substrate (100) to below -20°C.

18. A 3D printer, characterized in that: include: The substrate (100) according to any one of claims 1 to 5 or the susceptor (1000) according to any one of claims 8 to 14.

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