Server case and composite material thereof, forming method, equipment and medium

Abstract

The invention provides a server case, a composite material of the server case, a forming method, equipment and a medium, and an aluminum-based composite material comprises the following components in percentage by mass: 3-5% of ceramic nanoparticles, 2-4% of a hexagonal crystal system flaky material, 0.5-1% of rare earth oxide and the balance of an aluminum matrix. The ceramic nanoparticles, the hexagonal system flaky material and the rare earth oxide are reasonably proportioned, so that the comprehensive performance of the aluminum-based composite material is improved, the ceramic nanoparticles enhance the mechanical strength, the hexagonal system flaky material optimizes a heat conduction path, and the rare earth oxide improves the interface bonding strength of a reinforced phase and an aluminum matrix; according to the method, a collaborative strategy of three-dimensional modeling, thermal field simulation, truss structure design and partition printing is adopted, partition and customization of truss lattice parameters are carried out according to the internal heat flux density of the case, corresponding printing process parameters are matched, and performance optimization of a bearing area and a heat dissipation area is achieved; through collaborative innovation of materials and the process, the mechanical property, the heat dissipation performance and the overall light weight level of the case are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of aluminum alloy additive manufacturing, and in particular to a server chassis and its composite material, forming method, equipment and medium. Background Art

[0002] With the rapid development of communications, artificial intelligence, and virtual reality technologies, global computing power demand continues to surge, and data centers face an increasingly severe "power density crisis." Server chassis materials need to cope with the increasing power density demands and must meet multiple performance requirements: they must not only withstand the mechanical stress generated by high-density components, but also achieve excellent heat dissipation capabilities within a thin-wall design.

[0003] Furthermore, server chassis materials must also meet requirements for lightweighting and thermal fatigue resistance for extended use, posing unprecedented challenges to the material's overall performance. Existing materials and design methods often have limitations in meeting these requirements, particularly in achieving a comprehensive balance between strength, thermal conductivity, weight, and durability.

[0004] Selective Laser Melting (SLM) technology in additive manufacturing offers a new solution for overcoming the performance bottlenecks of traditional chassis materials and structural designs. However, a common problem with current server chassis manufactured using SLM is that they typically use the same material and molding process throughout the entire chassis structure, making it impossible to optimize the performance requirements of the load-bearing and heat-dissipating areas.

[0005] Specifically, in the heat dissipation area, since higher thermal conductivity is required for effective heat dissipation, using materials with excessively high strength will result in insufficient thermal conductivity, resulting in poor heat dissipation and increasing the overall weight of the chassis. In the load-bearing area, however, since it must withstand greater mechanical loads, using lower-strength materials may not meet the requirements. Therefore, to increase the strength of the load-bearing area, higher-strength materials are required. However, such materials typically have a higher density, making the chassis heavier. Furthermore, higher-strength materials have poorer heat dissipation performance, further reducing the heat dissipation effect of the heat dissipation area.

[0006] In summary, the current server chassis cannot find an effective balance in terms of heat dissipation, strength and lightweight, which affects its overall performance. Summary of the Invention

[0007] The present invention provides an aluminum-based composite material for a server chassis, so as to solve the problems in the prior art of preparing aluminum-based composite materials for server chassis, such as difficulty in balancing strengthening performance and thermal conductivity, insufficient interface bonding strength, and poor porosity control.

[0008] In a first aspect, the present invention provides an aluminum-based composite material for a server chassis, comprising, by mass fraction, 3-5wt% ceramic nanoparticles, 2-4wt% hexagonal flaky materials, 0.5-1wt% rare earth oxides, and the remainder being an aluminum matrix.

[0009] Among them, the aluminum matrix refers to the base material composed of aluminum and its alloys. In aluminum-based composite materials, the aluminum matrix is ​​usually used as the main structural material to provide overall mechanical strength and thermal conductivity. Among them, AlSi10Mg matrix powder is a common aluminum matrix material, which is an alloy composed of aluminum (Al), silicon (Si) and magnesium (Mg).

[0010] Ceramic nanoparticles refer to ceramic material particles with a particle size at the nanometer level. Adding ceramic nanoparticles to aluminum-based composite materials can significantly improve their mechanical strength and thermal conductivity, while improving their thermal stability and wear resistance.

[0011] Hexagonal sheet materials refer to sheet or layered materials with a hexagonal symmetrical crystal structure. Hexagonal materials generally have high mechanical strength and thermal conductivity. When used as a reinforcing phase in composite materials, they can effectively improve the thermal conductivity of the matrix material.

[0012] Rare earth oxides act as interface modifiers to optimize the bonding strength between the reinforcement phase and the aluminum matrix, thereby improving the thermal stability and thermal fatigue resistance of the material.

[0013] In an optional embodiment, the ceramic nanoparticles are selected from one or two of SiC and TiB2;

[0014] And / or, the hexagonal sheet material is selected from one or more of AlN sheet, BN sheet, and graphene;

[0015] And / or, the rare earth oxide is selected from one or more of Y2O3, La2O3, and CeO2.

[0016] The present invention selects ceramic nanoparticles silicon carbide (SiC) and titanium diboride (TiB2) to enhance the strength and stability of the material, and selects hexagonal flaky materials aluminum nitride (AlN) sheets, boron nitride (BN) sheets, and graphene to effectively improve the thermal conductivity path and enhance the heat dissipation performance. Rare earth oxides yttrium oxide (Y2O3), lanthanum oxide (La2O3), and cerium oxide (CeO2) are used as interface modifiers to enhance the bonding strength between the ceramic nanoparticle reinforcement phase and the hexagonal flaky material reinforcement phase and the aluminum matrix, reduce the interface thermal resistance, optimize the thermal management performance and overall mechanical properties of the material, and extend the service life of the chassis under high power density and wide temperature range conditions.

[0017] In a second aspect, a method for preparing an aluminum-based composite material as described in the first aspect or any corresponding embodiment thereof comprises: mixing ceramic nanoparticles, hexagonal flaky materials, rare earth oxides and an aluminum matrix and then ball milling the mixture to obtain an aluminum-based composite material.

[0018] In an optional embodiment, the aluminum-based composite material is prepared as follows:

[0019] A hexagonal sheet material, such as aluminum nitride (AlN) sheet, is placed in ethanol and subjected to ultrasonic dispersion treatment for 2 hours, and the dispersed hexagonal sheet material is dried;

[0020] Aluminum matrix powder, ceramic nanoparticles, dried hexagonal flake material and rare earth oxide interface modifier powder were ball milled by planetary ball milling. The main disk speed of the ball mill was 100 rpm, the tank speed was 900 rpm, the ball-to-material ratio was 5:1, 0.8 wt% zinc stearate was added as a lubricant during the ball milling process, and the ball milling treatment was carried out for 12 hours to obtain an aluminum-based composite material.

[0021] After ball milling, the powder undergoes metallurgical bonding, with the aluminum matrix powder as the matrix, generating some reinforcing phases such as Al4SiC4. The effect of powder mixing is good, with no obvious agglomeration. The powder after ball milling is severely deformed, and the powder particle size and grain size decrease.

[0022] The aluminum-based composite material is dried under vacuum conditions at 60-80° C. for 4-6 hours, with a moisture content of less than or equal to 0.1%, and is used for laser selective melting to prepare a server chassis.

[0023] In a third aspect, the present invention provides a method for selective laser melting of a server chassis, comprising:

[0024] Build a server chassis model, which includes a surface structure and an internal truss structure;

[0025] Perform finite element analysis based on the chassis model to simulate the temperature field distribution of the server under working conditions;

[0026] Determine the heat flux density based on the temperature field distribution, and divide the chassis into several sub-areas according to the size of the heat flux density;

[0027] According to the heat flux density of each sub-region, the lattice parameters of the truss structure are matched and the printing parameters are associated;

[0028] The aluminum-based composite material described in the first aspect or the second aspect or any corresponding embodiment thereof is used as a raw material, the associated printing parameters are adopted to print the truss structure, and the high-density printing parameters are adopted to print the surface structure.

[0029] The server chassis laser selective melting forming method provided by the present invention, through the collaborative approach of three-dimensional modeling, thermal field simulation, truss structure design and partition printing, customizes the truss lattice parameters and matches the corresponding printing parameters according to the heat flux density requirements of different areas inside the server chassis, thereby achieving partitioned optimization of the performance of the load-bearing area and the heat dissipation area. Compared with the problem in the prior art that the unified materials and processes lead to the inability to take into account heat dissipation, strength and lightweight, the present invention effectively reduces the overall weight of the chassis through internal truss structure design and differentiated printing, improves the local heat dissipation efficiency, and ensures the overall mechanical performance and reliability. In addition, the present invention has good structural design flexibility and process adjustability, and can be adaptively optimized according to the configuration requirements of different servers, thereby improving the thermal management level and comprehensive performance of the chassis.

[0030] In an optional embodiment, matching the lattice parameters of the truss structure according to the heat flux density of each sub-region includes:

[0031] The lattice parameters include lattice porosity. According to the heat flux density of each sub-region, topology optimization is performed based on the objective function of heat transfer efficiency and the set mechanical constraints to match the corresponding lattice porosity.

[0032] This invention achieves effective weight reduction for server chassis while maintaining mechanical properties through parameter optimization based on thermal field simulation and artificial intelligence-generated truss structure lattice porosity optimization. The application of automated parameter mapping technology enables single-step forming for different functional areas, eliminating the traditional trial-and-error debugging process, significantly shortening the development cycle and significantly reducing manual debugging workload. Debugging time is reduced by approximately 70%, and the pass rate for laser selective melting molding exceeds 95%.

[0033] In an optional embodiment, the aluminum-based composite material according to the first aspect or the second aspect or any corresponding embodiment thereof is used for printing and forming; after printing, stress relief annealing treatment is performed by keeping the temperature within the range of 300-350°C for 2-3 hours, and then the temperature is lowered for low-temperature aging treatment.

[0034] Stress relief annealing effectively releases residual internal stresses formed during the selective laser melting process, preventing cracking or structural deformation caused by stress concentration during subsequent use. It also promotes microstructural homogenization and improves the overall toughness of the material. Low-temperature aging promotes the uniform precipitation and dispersion of fine precipitates, further strengthening the matrix structure and improving tensile strength and thermal fatigue resistance.

[0035] After the server chassis has been treated by this heat treatment process, the tensile strength retention rate can reach more than 92% after the hot and cold cycle test (300 cycles from 40℃ to 125℃, with a heating and cooling rate of 10℃ / min), and the strength attenuation is controlled within 8%. That is, the residual stress release and uniform precipitation phase distribution help to reduce the anisotropy of the molded parts, ensuring that the chassis maintains excellent mechanical stability and dimensional accuracy for a long time in complex service environments, extending the service life of the product and improving overall reliability.

[0036] In a fourth aspect, the present invention provides a server chassis, which is manufactured using the molding method of the third aspect or any corresponding embodiment thereof.

[0037] The chassis of this invention utilizes a heterogeneous integrated design, achieving the synergistic integration of load-bearing and heat dissipation functions. The surface structure utilizes a densified structure with a thickness of 0.5 to 1 mm and a porosity of no more than 1%, effectively ensuring the chassis's airtightness, dust and moisture resistance, and overall mechanical strength. The truss structure forms a lightweight support framework and integrates efficient heat dissipation channels, eliminating the need for a separate independent heat dissipation module. This simplifies the structural design, reduces the number of components and assembly steps, and reduces overall manufacturing costs by approximately 25%.

[0038] The overall compressive strength of the chassis is significantly improved compared to traditional homogeneous structures. It can effectively resist deformation under high load conditions, thereby improving the structural stability of the chassis. In terms of heat dissipation performance, a continuous three-dimensional heat conduction path is constructed by aluminum nitride flake reinforcement phase, and combined with yttrium oxide interface modification technology, the overall thermal conductivity of the composite material is significantly improved. Compared with the AlSi10Mg alloy material formed by traditional laser selective melting, the improvement is more than 30%. The chassis prepared by this invention has a heat dissipation power per unit volume exceeding 200W / cm 3 It can meet the heat dissipation requirements of the new generation of high heat flux density chips under extreme working conditions, significantly improving the thermal management capabilities and long-term service reliability of the chassis.

[0039] This invention overcomes the performance limitations of traditional aluminum alloys and homogeneous laser selective melting (SLM) through collaborative innovation in materials, processes, and structures. It provides an integrated solution for server chassis applications, combining lightweight, high strength, high thermal conductivity, and long life. This chassis achieves an excellent balance between structural strength, heat dissipation, and weight control, demonstrating strong industrial feasibility and application potential, making it suitable for the next generation of high-density, high-performance electronic equipment systems.

[0040] In a fifth aspect, the present invention provides a computer device comprising: a memory and a processor, wherein the memory and the processor are communicatively connected to each other, computer instructions are stored in the memory, and the processor executes the molding method of the third aspect or any corresponding embodiment thereof by executing the computer instructions.

[0041] In a sixth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, wherein the computer instructions are used to enable a computer to execute the molding method of the third aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0043] Figure 1 1 is a scanning electron microscope (SEM) image of the powder material before and after ball milling in Example 1 of the present invention (the left side a shows the powder morphology before ball milling, and the right side b shows the powder morphology after ball milling);

[0044] Figure 2 This is a flow chart of the server chassis forming method of the present invention;

[0045] Figure 3 This is a schematic diagram of the partial assembly structure of the server chassis of the present invention;

[0046] Figure 4 It is a schematic diagram of a lattice structure of the truss structure of the present invention;

[0047] Figure 5 is a graph showing the relationship between density and volume energy density in Example 9 of the present invention;

[0048] Figure 6 Schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention.

[0049] In the picture:

[0050] 1. Surface structure; 2. Truss structure; 10. Processor; 20. Memory; 30. Communication interface. DETAILED DESCRIPTION

[0051] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0052] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0053] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0054] It should be noted that if specific experimental steps or conditions are not specified in the examples, the conventional experimental steps or conditions described in the literature in this field can be used. If the manufacturer of the reagents or instruments is not specified, they are all commercially available conventional reagents.

[0055] All material performance tests in this invention were evaluated using standardized testing methods: tensile strength was tested using ASTM E8M, with the results averaged over the transverse and longitudinal directions; thermal conductivity was measured using the laser flash method according to ASTM E1461; and porosity was statistically analyzed using metallographic sectioning and ImageJ image analysis software. This testing method ensures the scientific and accurate assessment of the material's mechanical properties, thermal properties, and internal density, providing reliable support for the comprehensive performance data of the chassis.

[0056] Example 1

[0057] In order to overcome the defects of the related art in preparing aluminum-based composite materials for server chassis, such as the difficulty in balancing reinforcement and thermal conductivity, insufficient interface bonding strength, and poor porosity control, an aluminum-based composite material for server chassis is provided to simultaneously meet the requirements of high mechanical strength, excellent thermal conductivity and lightweight, and to extend the service life of the chassis under wide temperature range and high power density conditions.

[0058] Specifically, the aluminum-based composite material for the server chassis of this embodiment includes, by mass fraction, 92wt% AlSi10Mg matrix powder, 4wt% silicon carbide (SiC) nanoparticles, 3wt% aluminum nitride (AlN) flake material, and 1wt% yttrium oxide (Y2O3); wherein the AlSi10Mg matrix powder has a particle size distribution of 15-45μm and an oxygen content of less than or equal to 0.15wt%; the particle size of the silicon carbide (SiC) nanoparticles is 30-70nm;

[0059] The preparation process of aluminum matrix composite materials is as follows:

[0060] (1) placing aluminum nitride (AlN) flake material in ethanol and performing ultrasonic dispersion treatment for 2 hours, and drying the dispersed aluminum nitride (AlN) flake material;

[0061] (2) AlSi10Mg matrix powder, silicon carbide (SiC) nanoparticles, dried aluminum nitride (AlN) flake material, and yttrium oxide (Y2O3) interfacial modifier powder were ball milled by planetary ball milling. The main disc speed of the ball mill was 100 rpm, the tank speed was 900 rpm, and the ball-to-material ratio was 5:1. 0.8 wt% zinc stearate was added as a lubricant during the ball milling process. The ball milling treatment was continued for 12 hours to obtain an aluminum-based composite material.

[0062] The scanning electron microscope was used to observe the powder morphology and structure before and after ball milling. Figure 1 As shown in the figure (Figure a on the left shows the powder morphology before ball milling, and Figure b on the right shows the powder morphology after ball milling); it can be seen that the powder undergoes metallurgical bonding after ball milling, and some reinforcing phases such as Al4SiC4 are generated with AlSi10Mg powder as the matrix. The effect of powder mixing is good, and there is no obvious agglomeration. The powder after ball milling is severely deformed, and the powder particle size and grain size decrease.

[0063] (3) The aluminum-based composite material can be dried under vacuum conditions at 60-80°C for 4-6 hours, with a moisture content of less than or equal to 0.1%, to meet the process requirements for laser selective melting to prepare a server chassis; specifically, in this embodiment, the aluminum-based composite material is vacuum-dried at 80°C for 6 hours, and after drying, the moisture content of the aluminum-based composite material is ≤0.1%;

[0064] (4) The dried aluminum-based composite material is processed into a tensile rod by laser selective melting technology; the process parameters of laser selective melting molding are: laser power 200W, scanning speed 1200mm / s.

[0065] Example 2

[0066] The difference between this embodiment and embodiment 1 is only the ratio of silicon carbide (SiC) nanoparticles to aluminum nitride (AlN) flake materials. Specifically, the mass fraction of silicon carbide (SiC) particles is 3 wt %, and the mass fraction of aluminum nitride (AlN) flake materials is 4 wt %.

[0067] Example 3

[0068] The difference between this embodiment and embodiment 1 is only the different ratios of silicon carbide (SiC) and aluminum nitride (AlN) sheet materials. Specifically, the mass fraction of silicon carbide (SiC) nanoparticles is 5 wt %, and the mass fraction of aluminum nitride (AlN) sheet materials is 2 wt %.

[0069] Example 4

[0070] The difference between this embodiment and embodiment 1 is only the amount of rare earth oxide used, specifically, including: 4wt% silicon carbide (SiC) nanoparticles, 3wt% aluminum nitride (AlN) flake material and 0.5wt% Y2O3, and the balance is AlSi10Mg matrix powder.

[0071] Example 5

[0072] This embodiment provides an aluminum-based composite material for a server chassis, which includes, by mass fraction, 92.2wt% AlSi10Mg matrix powder, 4wt% titanium diboride (TiB2) particles, 3wt% aluminum nitride (AlN) flake material and 0.8wt% La2O3.

[0073] Example 6

[0074] This embodiment provides an aluminum-based composite material for a server chassis, which comprises, by mass fraction, 92 wt% AlSi10Mg matrix powder, 4 wt% titanium diboride (TiB2) particles, 3 wt% graphene, and 1 wt% CeO2.

[0075] Example 7

[0076] This embodiment provides an aluminum-based composite material for a server chassis, which comprises, by mass fraction, 92wt% AlSi10Mg matrix powder, 4wt% titanium diboride (TiB2) particles, 3wt% boron nitride (BN) sheets, and 1wt% CeO2.

[0077] Example 8

[0078] In order to overcome the defects of the server chassis preparation process in related technologies, such as insufficient coordinated optimization of material properties and process parameters, which leads to limited improvement in thermal conductivity, unstable molding quality, and difficulty in effectively balancing thermal conductivity, structural strength and lightweight, thereby affecting the overall performance of the chassis, a laser selective melting molding method for a server chassis is provided to achieve coordinated optimization of comprehensive material properties, structural design and molding process parameters, thereby improving the thermal management capability, mechanical properties and overall lightweight level of the chassis.

[0079] According to an embodiment of the present invention, an embodiment of a method for selective laser melting of a server chassis is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0080] In this embodiment, a laser selective melting forming method for a server chassis is provided, which can be used in a laser selective melting forming system. Figure 2 FIG. 1 is a flow chart of a laser selective melting method according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0081] Step S101, constructing a server chassis model;

[0082] Specifically, the overall structural model of the server chassis is established through 3D modeling software. Taking the traditional 1U server chassis as an example, Figure 3 As shown, the chassis includes an external surface structure 1 and an internal supporting truss structure 2, wherein the surface structure 1 serves as the main component for protection and bearing. The surface structure 1 can be provided with various types of hollow areas to further ensure the heat dissipation requirements; the internal truss structure 2 undertakes the auxiliary support and heat dissipation functions. The truss structure 2 is arranged in a mesh-like manner in the horizontal and vertical directions and is periodically repeated to fill the entire surface structure 1. The height is 1-2mm, and the motherboard and other components are installed on the truss structure 2.

[0083] Step S102, performing finite element analysis based on the chassis model to simulate the temperature field distribution of the server under working conditions; including:

[0084] Receive parameters of server power consumption and / or server component layout and / or server liquid cooling pipeline, perform steady-state thermal simulation, and output a temperature field distribution cloud map.

[0085] Specifically, the data input module receives parameters of the server power consumption, server component layout, and server liquid cooling pipeline, wherein the server power consumption includes but is not limited to CPU power consumption and GPU power consumption (such as: CPU power consumption 200W, GPU power consumption 300W); server component layout includes but is not limited to PCB board layout; parameters of the server liquid cooling pipeline include but are not limited to liquid cooling flow rate (such as liquid cooling flow rate of 2-5L / min); finite element analysis software (such as: ANSYS) is used to perform steady-state thermal simulation analysis to obtain a temperature field distribution cloud map of the chassis under working conditions, and the resolution of the temperature field distribution cloud map is less than or equal to 1mm.

[0086] Step S103, determining the heat flux density based on the temperature field distribution, and dividing the chassis into several sub-areas according to the magnitude of the heat flux density;

[0087] Specifically, based on the temperature distribution cloud map, the chassis was divided into multiple sub-regions according to the heat flux density. This detailed zoning of the heat flux density within the server chassis provided a scientific basis for the subsequent truss structure 2 design and printing parameter setting, effectively avoiding the problems of low heat dissipation efficiency and excess weight caused by the single material and structure in traditional chassis design.

[0088] Step S104, matching the lattice parameters of the truss structure and associating the printing parameters according to the heat flux density of each sub-region;

[0089] Specifically, the internal truss structure 2 of the server chassis is designed by the topology optimization method. The truss structure 2 is a gradient porosity structure. Locally optimized truss parameters are generated according to the heat flux density requirements of different regions. According to the heat flux density level of each sub-region, different types of truss structures 2 are automatically matched. The truss types include but are not limited to octahedral lattice structure, honeycomb structure, Voronoi random lattice structure and bridge lattice structure, such as Figure 4 As shown, a truss lattice structure of the present invention is shown. The porosity of the truss structure 2 of the present invention is negatively correlated with the local heat dissipation demand.

[0090] This invention utilizes a truss lattice design, integrating efficient heat dissipation channels within the chassis. This increases the overall heat dissipation surface area by approximately 300% compared to traditional solid structures, significantly reducing local hotspot temperatures. Through the collaborative design of the truss structure and composite materials, the chassis of this invention achieves overall lightweighting. Compared to traditional 6061 aluminum alloy chassis, while reducing weight by over 35%, it maintains a load-bearing capacity comparable to chassis made of traditional materials. This makes it suitable for applications such as mobile servers that require high mobility and structural strength.

[0091] Step S105 , printing the truss structure 2 using the associated printing parameters, and printing the surface structure 1 using the high-density printing parameters;

[0092] Specifically, for surface structure 1, a high power of 350W and a low scanning speed of 1000mm / s were used to increase surface density, forming a high-strength protective layer with a porosity of less than or equal to 1%, ensuring the chassis's overall airtightness, dust and moisture resistance, and mechanical support. Truss structure 2 was printed using printing parameters associated with the truss structure's lattice parameters.

[0093] The server chassis laser selective melting forming process provided by the present invention, through the collaborative approach of three-dimensional modeling, thermal field simulation, truss structure design and partition printing, customizes the truss lattice parameters and matches the corresponding printing parameters according to the heat flux density requirements of different areas inside the server chassis, thereby achieving partitioned optimization of the performance of the load-bearing area and the heat dissipation area. Compared with the problem in the prior art that unified materials and processes lead to the inability to take into account heat dissipation, strength and lightweight, the present invention effectively reduces the overall weight of the chassis through internal truss structure design and differentiated printing, improves local heat dissipation efficiency, and ensures overall mechanical performance and reliability. In addition, the present invention has good structural design flexibility and process adjustability, and can be adaptively optimized according to different server configuration requirements, thereby improving the thermal management level and comprehensive performance of the chassis.

[0094] Example 9

[0095] In this embodiment, the aluminum-based composite material selected can be a variety of aluminum-based composite materials for server chassis with different proportions, including but not limited to any one of the aluminum-based composite materials described in Examples 1 to 7. Preferably, the aluminum-based composite material described in Example 1 is selected as the raw material and processed by a laser selective melting molding method. The molding method includes the following steps:

[0096] Step S001, raw material preparation:

[0097] An aluminum-based composite material for forming a server chassis is selected. In this embodiment, the aluminum-based composite material for a server chassis of Example 1 is selected, that is, the composite material comprises, by mass fraction, 92 wt% of AlSi10Mg matrix powder, 4 wt% of silicon carbide (SiC) nanoparticles, 3 wt% of aluminum nitride (AlN) sheet material, and 1 wt% of Y2O3;

[0098] Step S002, powder pretreatment:

[0099] In order to improve the dispersibility of aluminum nitride (AlN) flakes in the aluminum matrix, the aluminum nitride (AlN) flakes were placed in ethanol and subjected to ultrasonic dispersion treatment for 2 hours, and the dispersed aluminum nitride (AlN) flakes were dried;

[0100] AlSi10Mg matrix powder, silicon carbide (SiC) nanoparticles, dried aluminum nitride (AlN) flake material, and Y2O3 interface modifier powder were planetarily ball milled at a main milling speed of 100 rpm, a tank speed of 900 rpm, and a ball-to-material ratio of 5:1. 0.8 wt% zinc stearate was added as a lubricant during the ball milling process. The milling process was continued for 12 hours to obtain a milled aluminum-based composite material.

[0101] After the ball milling process, the aluminum-based composite material can be dried under vacuum conditions at 60-80° C. for 4-6 hours, with a moisture content of less than or equal to 0.1%, so as to meet the process requirements for laser selective melting to prepare a server chassis. Specifically, in this embodiment, the aluminum-based composite material is vacuum dried at 80° C. for 6 hours, and after drying, the moisture content of the aluminum-based composite material is ≤0.1%.

[0102] Step S003: Printing parameter exploration and performance testing:

[0103] An orthogonal matrix of different printing parameters was established using a computer system. The laser power was set to vary from 100 W to 450 W, the scanning speed was set to vary from 400 mm / s to 3000 mm / s, and the layer thickness was fixed at 40 μm and the line spacing was 0.07 mm. Tensile specimens were printed. The energy density of the laser printed volume was calculated using the following formula:

[0104] ω=P / (s×l×v);

[0105] Where: ω—volume energy density (J / mm 3 ); P—laser power (W); s—powder layer thickness (μm); v—scanning speed (mm / s); l—line spacing (mm);

[0106] Taking the scanning speed and laser power as orthogonal variables, the corresponding values ​​of volume energy density are shown in Table 1 below;

[0107] Table 1:

[0108]

[0109] By setting a larger range of printing parameters, printing transverse and longitudinal stretch sheets, and testing the mechanical properties of the transverse and longitudinal stretch sheets, the optimal process parameters for printing the chassis were selected. Through orthogonal parameter experiments, it can be seen that the volume energy density that the laser can achieve is from the lowest 9.52J / mm 3 Increased to 321.43J / mm 3The high laser energy density ensures the selection of optimal laser printing parameters. By testing the tensile strength, thermal conductivity, and porosity of the tensile parts, the performance of each parameter combination is determined. Based on the test results, a parameter combination suitable for high-density printing of surface structures and a parameter combination suitable for printing truss structures are selected.

[0110] The curve of sample density changing with laser energy density is shown in the following figure: Figure 5 As shown by Figure 5 It can be seen that the mixed powder of the aluminum-based composite material of the present invention after ball milling can achieve a high density, and the density gradually decreases with the increase of laser energy density, which indicates that with the increase of laser body energy density, the effect of 1wt% Y2O3 on interface bonding becomes lower, resulting in increased porosity of the sample and decreased density of the sample; at the same time, when the laser power is 350W and the laser scanning speed is 1000mm / s, the sample density is the highest at 99.84%; after testing, the tensile strength of the sample under these parameters is 420MPa and the thermal conductivity is 185W / m·K.

[0111] Step S101, constructing a server chassis model;

[0112] The overall structural model of the server chassis is established through 3D modeling software. Taking the traditional 1U server chassis as an example, Figure 3 As shown, the chassis includes an external surface structure 1 and an internal supporting truss structure 2, wherein the surface structure 1 serves as the main component for protection and bearing, and the internal truss structure 2 undertakes auxiliary support and heat dissipation functions. The truss structure 2 is arranged in a grid-like manner in the horizontal and vertical directions and is periodically repeated to fill the entire surface structure 1, with a height of 1-2mm. The motherboard and other components are installed on the truss structure 2. The surface structure 1 has various types of hollow areas to further ensure the heat dissipation requirements.

[0113] Step S102, performing finite element analysis based on the chassis model to simulate the temperature field distribution of the server under working conditions;

[0114] Specifically, the data input module receives parameters of the server power consumption, server component layout, and server liquid cooling pipeline, wherein the server power consumption includes but is not limited to CPU power consumption and GPU power consumption (e.g., CPU power consumption is 200W, GPU power consumption is 300W); the server component layout includes but is not limited to PCB board layout; the parameters of the server liquid cooling pipeline include but are not limited to liquid cooling flow rate (e.g., liquid cooling flow rate is 2-5L / min);

[0115] Use finite element analysis software (such as ANSYS) to perform steady-state thermal simulation analysis to obtain the temperature field distribution cloud map of the chassis under working conditions. The resolution of the temperature field distribution cloud map is less than or equal to 1mm.

[0116] Step S103, determining the heat flux density based on the temperature field distribution, and dividing the chassis into several sub-areas according to the magnitude of the heat flux density;

[0117] According to the temperature field distribution cloud map, the chassis is divided into multiple sub-areas according to the heat flux density, and high heat areas and low heat areas are marked. The high heat areas and low heat areas are connected by transition areas. Specifically, the chassis is divided into 5mm×5mm grid units in the slicing software, and the heat flux density level of each unit is marked. The heat flux density is greater than or equal to 150W / cm 2 It is a high-heat area with a heat flux density of less than or equal to 50W / cm 2 It is a low heat area, and the heat flux density in the transition area is 50-150W / cm 2 .

[0118] Through the above-mentioned thermal field simulation and sub-region division, the present invention achieves a fine partitioning of the internal heat flux density of the server chassis, providing a scientific basis for the subsequent design of the truss structure 2 and the setting of printing parameters, and effectively avoiding the problems of low heat dissipation efficiency and weight redundancy caused by the single material and structure in traditional chassis design. The present invention accurately identifies high-heat and low-heat areas and optimizes the structural layout in a targeted manner, so that the high-heat areas can focus on strengthening the heat dissipation channel design and improving local thermal management capabilities; at the same time, the low-heat areas reduce material redundancy by increasing the porosity, realizing the lightweight design of the entire chassis. This significantly improves the chassis's heat dissipation efficiency, reduces its own weight, and extends the chassis's service life while ensuring mechanical strength and reliability.

[0119] Step S104: Match the lattice parameters of the truss structure and associate the printing parameters according to the heat flux density of each sub-region; and design the surface structure 1 and the internal truss structure 2 of the server chassis using a topology optimization method, wherein:

[0120] The surface structure 1 is a dense layer with a thickness of 0.5mm to 1mm and a porosity of less than or equal to 1%, which is used to provide the overall mechanical strength, air tightness, dust and moisture resistance of the chassis;

[0121] Truss structure 2 features a gradient porosity structure, with locally optimized truss parameters generated based on the heat flux requirements of different regions. Specifically, the topology optimization process maximizes heat transfer efficiency, i.e., the ratio of heat dissipation surface area to volume, while also applying mechanical constraints to ensure the generated structure has a minimum yield strength of at least 300 MPa.

[0122] According to the thermal field simulation results, the chassis is divided into several sub-areas. According to the heat flux density level of each sub-area, different types of truss structures 2 are automatically matched. The truss types include but are not limited to octahedral lattice structure, honeycomb structure, Voronoi random lattice structure and bridge lattice structure, such as Figure 4The figure shows a truss lattice structure of the present invention. The truss type and unit parameters of each sub-area are adaptively adjusted according to the heat flux density and mechanical load requirements, achieving a coordinated optimization of lightweight and efficient heat dissipation functions inside the chassis.

[0123] The porosity of the truss structure 2 described in the present invention is negatively correlated with the local heat dissipation requirement. Furthermore, the lattice porosity corresponding to the high-heat region is 25%-40%, the lattice porosity corresponding to the low-heat region is 50%-80%, and the lattice porosity corresponding to the transition region is 40%-50%. The truss unit size of the present invention is positively correlated with the local heat flux density. Specifically, the truss unit size in the high-heat region is less than or equal to 1 mm, and the truss unit size in the low-heat region is greater than or equal to 2 mm.

[0124] Specifically, in the high-heat area, an octahedral lattice structure is adopted, the porosity is controlled at about 30%, and the truss unit size is set to 0.8mm. At the same time, microchannels are integrated in the truss structure 2, and the width of the microchannels is set to 0.5mm to enhance the local convection heat dissipation effect and improve the heat conduction and release capacity of the high-heat area.

[0125] The transition zone, also considered a medium-heat zone, utilizes a honeycomb structure with a porosity of approximately 50%, a truss unit size of 1.5mm, and a wall thickness of 80μm. This honeycomb structure ensures mechanical support while providing an excellent heat diffusion path, adapting to the heat dissipation requirements of medium-heat flux conditions.

[0126] In low-heat areas, a Voronoi random lattice structure is employed, with a porosity controlled at approximately 70% and a truss element size set to 2.5mm. The Voronoi random lattice structure, through its large porosity and naturally distributed spatial network, effectively reduces overall weight while maintaining essential support and heat dissipation properties, making it suitable for lightweight optimization in areas with low heat flux density.

[0127] Step S105 , printing the truss structure 2 using the associated printing parameters, and printing the surface structure 1 using the high-density printing parameters;

[0128] The present invention sets corresponding laser selective melting (SLM) printing process parameters based on the truss lattice parameters of each sub-area inside the server chassis, and completes the partitioned printing and molding of the internal truss structure 2 and the surface structure 1 respectively. Among them, the printing parameters of each sub-area of ​​the internal truss structure 2 specifically include:

[0129] The laser power associated with the high-heat area is 350W to 400W, and the scanning speed is 1000mm / s to 1500mm / s, ensuring that the truss structure 2 forms a dense and continuous support and heat dissipation channel in the high heat flux density area;

[0130] The low-heat area is associated with a laser power of 200W to 250W and a scanning speed of 1800mm / s to 2200mm / s to form a lightweight lattice structure with high porosity, taking into account both lightweight and basic heat dissipation requirements;

[0131] The laser power and scanning speed in the transition area are set by linear interpolation through the parameters of the high-heat area and the low-heat area. The laser power setting range is 250W to 350W, the scanning speed setting range is 1500mm / s to 1800mm / s, and the corresponding volume energy density is 50J / mm 3 Up to 80J / mm 3 , in order to achieve continuous transition of regional interfaces and stability of structural bonding performance.

[0132] For example, the high-heat area uses a printing parameter combination of a laser power of 380W and a scanning speed of 1200mm / s, corresponding to a volume energy density of 80J / mm 3 , ensuring the formation of a dense and continuous truss structure 2 in the high heat flux density area to meet the needs of rapid heat dissipation and high mechanical load-bearing;

[0133] The low-heat area uses a printing parameter combination of laser power 220W and scanning speed 2000mm / s, corresponding to a volume energy density of 30J / mm 3 , forming a lightweight lattice structure with high porosity to achieve a balance between structural weight reduction and basic heat dissipation function;

[0134] The laser power and scanning speed in the transition area are set by linear interpolation according to the parameter range of the high-heat area and the low-heat area. The laser power is between 250W and 350W, and the scanning speed is adjusted between 1500mm / s and 1800mm / s to ensure that the interface bonding strength of the truss structure 2 in the transition area is not less than 90% of the matrix strength, thereby achieving a continuous transition of mechanical and thermal properties between different heat flux density areas.

[0135] For surface structure 1, a printing parameter combination of high power 350W and low scanning speed 1000mm / s is used to improve the surface density and form a high-strength protective layer with a porosity less than or equal to 1%, ensuring the overall airtightness, dust and moisture resistance, and mechanical support performance of the chassis.

[0136] In an argon protective atmosphere (oxygen content less than 0.05%), the server chassis is integrally printed and formed according to the printing parameters set for the surface structure and the internal truss structure 2 respectively.

[0137] Step S106, post-processing:

[0138] After printing is completed, the server chassis is heat treated, including:

[0139] Stress relief annealing treatment is performed at a temperature range of 300°C to 350°C, with a holding time of 2h to 3h;

[0140] After annealing, it is naturally cooled to 160℃ for low-temperature aging treatment, and the holding time is 8h to 10h.

[0141] Stress relief annealing effectively releases residual internal stresses formed during the selective laser melting process, preventing cracking or structural deformation caused by stress concentration during subsequent use. It also promotes microstructural homogenization and improves the overall toughness of the material. Low-temperature aging promotes the uniform precipitation and dispersion of fine precipitates, further strengthening the matrix structure and improving tensile strength and thermal fatigue resistance.

[0142] After the server chassis has been treated by this heat treatment process, the tensile strength retention rate can reach more than 92% after the hot and cold cycle test (300 cycles from 40℃ to 125℃, with a heating and cooling rate of 10℃ / min), and the strength attenuation is controlled within 8%. That is, the residual stress release and uniform precipitation phase distribution help to reduce the anisotropy of the molded parts, ensuring that the chassis maintains excellent mechanical stability and dimensional accuracy for a long time in complex service environments, extending the service life of the product and improving overall reliability.

[0143] Example 10

[0144] The present invention also provides a computer device. Figure 6 , Figure 6 is a structural diagram of a computer device provided by an optional embodiment of the present invention, such as Figure 6 As shown, the computer device includes: one or more processors 10, memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components utilize different buses to communicate with each other and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in the memory or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Equally, multiple computer devices can be connected, and each device provides part of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 6 A processor 10 is taken as an example.

[0145] The processor 10 may be a central processing unit, a network processor, or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic, or any combination thereof.

[0146] The memory 20 stores instructions that can be executed by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0147] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created based on the use of a computer device for displaying a small program landing page, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0148] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0149] The computer device further includes a communication interface 30 for the computer device to communicate with other devices or a communication network.

[0150] The embodiment of the present invention also provides a computer-readable storage medium. The above-mentioned method according to the embodiment of the present invention can be implemented in hardware, firmware, or implemented as a computer code that can be recorded in a storage medium, or implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and downloaded through a network and will be stored in a local storage medium, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state drive, etc.; further, the storage medium can also include a combination of the above-mentioned types of memory. It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor or hardware, the method shown in the above embodiment is implemented.

[0151] Comparative Example 1

[0152] The only difference between this embodiment and embodiment 2 is that no rare earth oxide is added. Specifically, this embodiment includes: 3 wt % silicon carbide (SiC) nanoparticles, 4 wt % aluminum nitride (AlN) flake material, and the remainder is AlSi10Mg matrix powder.

[0153] Comparative Example 2

[0154] The only difference between this embodiment and embodiment 2 is that a larger amount of rare earth oxide is added, specifically, including: 3wt% silicon carbide (SiC) nanoparticles, 4wt% aluminum nitride (AlN) flake material, 2wt% Y2O3, and the remainder is AlSi10Mg matrix powder.

[0155] Comparative Example 3

[0156] The only difference between this comparative example and Example 1 is that silicon carbide (SiC) nanoparticles are not added, and the mass fraction of the aluminum nitride (AlN) flake material is 7 wt %.

[0157] Comparative Example 4

[0158] The only difference between this comparative example and Example 1 is that no aluminum nitride (AlN) flake material is added, and the mass fraction of silicon carbide (SiC) nanoparticles is 7 wt %.

[0159] Comparative Example 5

[0160] The only difference between this comparative example and Example 1 is that silicon carbide (SiC) nanoparticles, aluminum nitride (AlN) flake materials, and Y2O3 are not added, and the aluminum-based composite material is formed only from AlSi10Mg matrix powder.

[0161] Experimental Example 1

[0162] This experimental example verifies the effects of ceramic nanoparticles, hexagonal flaky materials, and rare earth oxides on the performance of aluminum-based composite materials. Specifically, this experimental example tests the tensile strength, thermal conductivity, and porosity of the tensile rods of Examples 1 to 4 and Comparative Examples 1 to 5.

[0163] The tensile strength test was conducted using the ASTM E8M standard, with the results taking the average values ​​of the transverse and longitudinal directions. The thermal conductivity was tested using the ASTM E1461 standard. The porosity was statistically analyzed using metallographic sectioning and ImageJ software. The tensile strength, thermal conductivity, and porosity in this experimental example were the average values ​​of several groups of test data, as shown in Table 2 below.

[0164] Table 2:

[0165]

[0166] As can be seen from the table above, Examples 1 to 4 all exhibit good overall performance under different reinforcement ratios, with tensile strength ranging from 365 to 402 MPa, thermal conductivity ranging from 145 to 180 W / m·K, and porosity controlled between 0.4% and 2.1%. This performance range demonstrates that by rationally regulating the mass fractions of SiC, AlN, and Y2O3, it is possible to effectively improve mechanical strength and thermal conductivity while maintaining material density. This achieves a good balance and coordinated optimization between mechanical strength, thermal conductivity, and lightweight requirements for aluminum-based composites, providing a viable engineering solution for high-heat-load electronic structural components.

[0167] In Example 2, due to the low SiC content (3wt%), the grain boundary pinning effect is insufficient, making it difficult to effectively suppress dislocation slip, resulting in the tensile strength dropping to 365MPa. Although the slightly higher AlN content improves some thermal conductivity paths, the overall strengthening effect is limited. Although Example 3 adds more SiC (5wt%), which improves the strength (375MPa), the AlN content is only 2wt%, which limits the construction of the thermal conductivity network and reduces the thermal conductivity to 145W / m·K. Example 4 maintains a ratio of 4wt% SiC and 3wt% AlN, but the Y2O3 interface modifier is only 0.5wt%, resulting in insufficient bonding between the reinforcement phase and the matrix interface, an increase in interface micropores, and an increase in porosity to 1.6%. As a result, although the thermal conductivity and strength are better than Examples 2 and 3, they are still lower than the optimal level.

[0168] In Comparative Example 1, no interfacial modifier (Y2O3) was added, and the reinforcement was easily debonded from the aluminum matrix, resulting in increased interfacial thermal resistance and formation of micropores. The porosity increased to 3.5%, and the tensile strength decreased to 352 MPa.

[0169] In Comparative Example 2, excessive addition of Y2O3 to 2wt% resulted in severe particle agglomeration, affecting the uniformity of the molten pool flow and forming local unfused areas. Although the ratio of AlN to SiC was moderate, the thermal conductivity was not further improved, and the porosity was as high as 2.8%.

[0170] In Comparative Example 3, the addition of 7wt% AlN alone creates a lamellar heat conduction path, increasing thermal conductivity to 188 W / m·K. However, the stacking of the AlN lamellar layers weakens the mechanical integrity of the overall structure, significantly reducing strength to 298 MPa. In contrast, in Comparative Example 4, the SiC content is as high as 7wt%, causing turbulent melt pool flow and reinforcing phase segregation, forming large pores with a porosity as high as 5.2%. This also carries the risk of printhead wear and poor forming stability.

[0171] Comparative Example 5, a pure AlSi10Mg sample without any reinforcement or modifiers, maintains a high tensile strength of 370 MPa, but its thermal conductivity is only 130 W / m·K. Due to the lack of reinforcement channels and interface strengthening, its thermal management performance is significantly insufficient. Despite its high density (porosity of 0.3%), it lacks the thermal conductivity and thermal fatigue stability required for high-heat-flux applications.

[0172] Furthermore, when SiC, AlN and Y2O3 are controlled at a combination of 4wt%, 3wt% and 1wt% respectively, the composite material can achieve the synergistic optimization of tensile strength ≥400MPa and thermal conductivity ≥180W / m·K while ensuring density, meeting the comprehensive performance requirements of server chassis for high strength, thermal conductivity and lightweight.

[0173] The above describes in detail a server chassis and its composite material, molding method, equipment, and medium provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. It should be noted that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. An aluminum-based composite material for a server chassis, characterized by: Calculated by mass fraction, the composition comprises: 3-5 wt% of ceramic nanoparticles, 2-4 wt% of hexagonal flake materials, 0.5-1 wt% of rare earth oxides, and the balance being an aluminum matrix; The ceramic nanoparticles are selected from one or two of SiC and TiB2; And / or, the hexagonal sheet material is selected from one or more of AlN sheet, BN sheet, and graphene; And / or, the rare earth oxide is selected from one or more of Y2O3, La2O3, and CeO2.

2. A method for preparing the aluminum-based composite material according to claim 1, characterized in that: include: The ceramic nanoparticles, hexagonal flaky materials, rare earth oxides and an aluminum matrix are mixed and then ball-milled to obtain an aluminum-based composite material.

3. A laser selective melting forming method for a server chassis, characterized by: include: Build a server chassis model, which includes a surface structure and an internal truss structure; Perform finite element analysis based on the chassis model to simulate the temperature field distribution of the server under working conditions; Determine the heat flux density based on the temperature field distribution, and divide the chassis into several sub-areas according to the size of the heat flux density; According to the heat flux density of each sub-region, the lattice parameters of the truss structure are matched and the printing parameters are associated; The aluminum-based composite material according to claim 1 is used as raw material, the associated printing parameters are adopted to print the truss structure, and the high-density printing parameters are adopted to print the surface structure.

4. The selective laser melting method according to claim 3, wherein: The lattice parameters of the truss structure are matched according to the heat flux density of each sub-region: The lattice parameters include lattice porosity. According to the heat flux density of each sub-region, topology optimization is performed based on the objective function of heat transfer efficiency and the set mechanical constraints to match the corresponding lattice porosity.

5. The selective laser melting method according to claim 4, characterized in that: According to the heat flux density of each sub-region, the corresponding lattice porosity is matched as follows: The heat flux density of each sub-region is divided into high heat region and low heat region from large to small, and a transition region is set between the high heat region and the low heat region; the lattice porosity corresponding to the high heat region is 25%-40%, and the lattice porosity corresponding to the low heat region is 50%-80%; the lattice porosity corresponding to the transition region is 40%-50%.

6. The selective laser melting method according to claim 5, characterized in that: According to the heat flux density of each sub-area, the associated printing parameters include: The printing parameters include laser power and scanning speed; the laser power associated with the high-heat area is 350-400W, and the scanning speed is 1000-1500mm / s; the laser power associated with the low-heat area is 200-250W, and the scanning speed is 1800-2200mm / s; the laser power and scanning speed of the transition area are determined by linear interpolation between the printing parameters associated with the high-heat area and the low-heat area.

7. The selective laser melting method according to any one of claims 3 to 6, characterized in that: After printing is completed, stress relief annealing treatment is performed by keeping the temperature within the range of 300-350℃ for 2-3 hours, and then the temperature is lowered for low-temperature aging treatment.

8. A server chassis, characterized in that: The method is prepared by the molding method described in any one of claims 3 to 7.

9. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the molding method according to any one of claims 3 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the forming method according to any one of claims 3 to 7.

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