Automatic chip testing and sorting system
By designing an automatic chip test and sorting system, and using the test arm to directly test the chip in the high and low temperature box, the problems of inaccurate test results and low efficiency are solved, and efficient and accurate chip testing and sorting are achieved to meet the national standard requirements.
Patent Information
- Application Number
- CN202510722642.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2025-08-22
AI Technical Summary
In the prior art, the chip's high and low temperature test results are inaccurate and low efficiency, the manual operation cost is high, and it is difficult to meet the national standard requirements, and the test temperature changes affect the actual performance of the chip.
Design a chip automatic test sorting system, including automatic feeding module, automatic discharge module, high and low temperature box, test arm module and test system, and complete the test directly in the high and low temperature box through the test arm to achieve the accuracy of temperature control and improve efficiency through mechanization instead of manual operation.
It significantly improves the reliability and efficiency of test results, reduces the testing cost, and can accurately sort chips in high and low temperature environments, meeting the national standard requirements.
Smart Images
Figure CN120527271A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of integrated circuit testing and relates to an automatic chip testing and sorting system. Background Art
[0002] Chips used in aerospace environments must undergo high-temperature, low-temperature, and room-temperature testing in accordance with national standards to ensure chip performance and reliability. These tests can assess chip performance at different ambient temperatures and predict chip lifespan and reliability. High- and low-temperature testing also improves chip manufacturing and production quality, reduces chip failure rates during actual use, and enhances customer satisfaction.
[0003] Generally speaking, high and low temperature chip testing is an important quality control step that can ensure chip performance and reliability and improve product competitiveness. Therefore, high and low temperature testing is required during chip design, manufacturing, and use to ensure chip stability and reliability.
[0004] The national standard requires that the chip's various performance indicators be tested after being heated or cooled thoroughly in a high or low temperature environment (the heating and cooling time varies depending on the chip size). Currently, three-temperature testing is performed manually. The high and low temperature chamber generally has a drawer-like cavity. After the chip is placed in the drawer of the high and low temperature chamber, the temperature is raised or lowered according to the national standard. After the temperature is maintained for the specified time, the operator quickly removes a chip and places it on a dedicated test socket connected to the test system. The test system automatically determines whether the chip's various performance indicators meet the requirements.
[0005] Defects and shortcomings of existing technology:
[0006] 1. The test results cannot guarantee the reliability of the chip. The test temperature generally requires a low temperature of -50°C and a high temperature of +150°C. After the chip leaves the high and low temperature chamber, it is affected by the ambient temperature and experiences a rapid temperature change. During the test, the temperature is already far from the specified temperature, and the process does not meet the national standard requirements. The test system will judge the test as passed, but there will be problems in actual use.
[0007] 2. Manual testing is costly and inefficient. Summary of the Invention
[0008] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a chip automatic testing and sorting system with high testing accuracy and testing efficiency.
[0009] According to a first aspect of an embodiment of the present invention, there is provided a chip automatic testing and sorting system, which includes an automatic feeding module, an automatic discharging module, a high and low temperature box, a testing arm module and a testing system;
[0010] The automatic feeding module and the automatic discharging module are respectively arranged on both sides of the high and low temperature box, the testing system is arranged below the high and low temperature box, and the testing arm module is arranged above the high and low temperature box;
[0011] The automatic feeding module and the automatic discharging module are both provided with a pallet basket, a first automatic lifting platform and a pallet module dragging mechanism; the automatic lifting platform is connected to the pallet basket to drive the pallet basket to move up and down, and a plurality of pallet modules are placed in the pallet basket. The pallet module dragging mechanism can drag the pallet module to move left and right.
[0012] In one embodiment, a preheating waiting module is provided on one side of the high and low temperature box close to the automatic feeding module;
[0013] The preheating waiting module is provided with an upper tray track, a lower tray track, a second automatic lifting platform and a tray track opening and closing mechanism, and the tray track opening and closing mechanism can adjust the distance between the two tracks of the upper tray track;
[0014] When the target pallet module in the automatic feeding module is transported to the upper pallet track, the second automatic lifting platform rises to support the target pallet module, the upper pallet track opens, the second lifting platform descends, the target pallet module falls into the lower pallet track, and the upper pallet track closes, waiting for the next pallet module.
[0015] In one embodiment, a tray dragging module is provided between the high and low temperature chamber and the testing system;
[0016] The pallet dragging module can drag the target pallet module from the lower pallet track to the pallet track in the test area of the high and low temperature box, and after the test is completed, drag the target pallet module to the side of the high and low temperature box close to the automatic discharge module.
[0017] In one embodiment, a first opening is provided on the top of the high and low temperature box, and the test arm module extends into the interior of the high and low temperature box through the first opening;
[0018] A suction nozzle is provided on one end of the test arm module close to the high and low temperature box. The suction nozzle sucks the chips in the target tray module in the test area of the high and low temperature box to the test system, and sucks the chips after the test is completed to the target tray module.
[0019] In one embodiment, a second opening is provided at the bottom of the high and low temperature box, and the test socket on the test system extends into the high and low temperature box through the second opening.
[0020] In one embodiment, a feed door is provided on one side of the high and low temperature box, and a discharge door is provided on the other side. The automatic feed module is connected to the high and low temperature box through the feed door, and the automatic discharge module is connected to the high and low temperature box through the discharge door.
[0021] The high and low temperature box and the test arm module are sealed by providing a soft connector.
[0022] In one embodiment, the tray module includes a tray chassis, on which a material tray, a sorting area, and a test window area are provided. The material tray is used to place chips to be tested, and the sorting area is used to place unqualified chips.
[0023] In one embodiment, the test window area is arranged at the center of the tray chassis, the sorting areas are arranged on both sides of the test window area, and the material tray modules are arranged on the other two sides of the test window area.
[0024] In one embodiment, the sorting area includes a high-temperature unqualified area, a normal-temperature unqualified area, and a low-temperature unqualified area. The high-temperature unqualified area is used to place high-temperature test unqualified chips, the normal-temperature unqualified area is used to place normal-temperature test unqualified chips, and the low-temperature unqualified area is used to place low-temperature test unqualified chips.
[0025] In one embodiment, cylinders are provided at both the feed door and the discharge door.
[0026] The implementation of the present invention includes the following technical effects:
[0027] In the chip automatic testing and sorting system provided by the embodiment of the present invention, the test arm and the test system are directly extended into the high and low temperature box, and the chip is sucked by the test arm to complete the test inside the high and low temperature box, so that the test temperature is more in line with the requirements, thereby significantly improving the reliability of the test results.
[0028] Furthermore, in the chip automatic testing and sorting system provided by the embodiment of the present invention, the test arm picks up the chip and places it in the test seat of the test system for testing, which can improve the test efficiency and save the test cost.
[0029] Furthermore, the chip automatic testing and sorting system provided by the embodiment of the present invention can provide chip working data status in high temperature environment and low temperature environment, and can sort the chips according to the chip data status to further improve chip testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a structural diagram of the chip automatic testing and sorting system of the present invention.
[0031] Figure 2This is a structural diagram of the tray structure and preheating waiting module in the chip automatic testing and sorting system of the present invention.
[0032] In the figure, 1-automatic feeding module, 2-preheating waiting module, 3-test arm module, 4-high and low temperature box, 5-automatic discharging module, 6-testing system, 7-pallet module, 8-pallet dragging module, 9-air conditioning unit, 21-upper pallet track, 22-lower pallet track, 23-second automatic lifting platform, 24-pallet track opening and closing mechanism, 71-pallet chassis, 72-material tray, 73-sorting area, 74-test window area. DETAILED DESCRIPTION
[0033] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.
[0034] like Figure 1 As shown, the chip automatic testing and sorting system of the present invention includes an automatic feeding module 1, an automatic discharging module 5, a high and low temperature box 4, a test arm module 3 and a test system 6; the automatic feeding module 1 and the automatic discharging module 5 are respectively arranged on both sides of the high and low temperature box 4, the test system 6 is arranged below the high and low temperature box 4, and the test arm module 3 is arranged above the high and low temperature box 4; the automatic feeding module 1 and the automatic discharging module 5 are both provided with a tray basket, a first automatic lifting platform and a tray module dragging mechanism; the automatic lifting platform is connected to the tray basket to drive the tray basket to move up and down, and a number of tray modules 7 are placed in the tray basket, and the tray module dragging mechanism can drag the tray module 7 to move left and right.
[0035] The chip automatic test and sorting system provided by the embodiment of the present invention directly extends the test arm module 3 and the test system 6 into the interior of the high and low temperature box 4, and absorbs the chip through the test arm module 3 to complete the test inside the high and low temperature box 4, so that the test temperature is more in line with the requirements, thereby significantly improving the reliability of the test results. In addition, in the chip automatic test and sorting system provided by the embodiment of the present invention, the chip is absorbed by the test arm module 3 and placed in the test seat of the test system 6 for testing, which can improve the test efficiency and save the test cost; furthermore, the chip automatic test and sorting system provided by the embodiment of the present invention can provide the working data status of the chip in high temperature environment and low temperature environment, and can be sorted according to the chip data status to further improve the chip test efficiency.
[0036] like Figure 2 As shown, a preheating waiting module 2 is provided on one side of the high and low temperature box 4 close to the automatic feeding module 1; an upper pallet rail 21, a lower pallet rail 22, a second automatic lifting platform 23 and a pallet rail opening and closing mechanism are provided in the preheating waiting module 2, and the pallet rail opening and closing mechanism can adjust the distance between the two rails of the upper pallet rail 21; when the target pallet module 7 in the automatic feeding module 1 is transported to the upper pallet rail 21, the second automatic lifting platform 23 rises to support the target pallet module 7, the upper pallet rail 21 opens, the second lifting platform descends, the target pallet module 7 falls into the lower pallet rail 22, and the upper pallet rail 21 closes, waiting for the next pallet module 7.
[0037] In this embodiment, the preheating waiting module 2 is placed on one side of the high and low temperature box 4 close to the automatic feeding module 5, and it includes an upper tray track 21, a lower tray track 22, a second automatic lifting platform 23 and a tray track opening and closing mechanism 24, and the tray module 7 can move freely in the tray track; specifically, when the tray module 7 is dragged from the tray basket of the automatic feeding module 1 through the feeding door of the high and low temperature box 4 to the upper tray track 21 of the preheating waiting module 2, the second automatic lifting platform 23 rises to the tray module 7 position of the upper tray track 21 to hold the tray module 7, and the upper tray track 21 opens , the second automatic lifting platform 23 descends, the tray module 7 falls into the lower tray track 22, the upper tray track 21 closes, and waits for the next tray module 7 to be dragged in. The tray module 7 that falls into the lower tray track 22 is placed for a predetermined time after the high and low temperatures reach the preset temperatures, so that when the test system 6 has finished testing the tray module 7 currently being tested, the tray dragging module 8 will quickly transport the tray module 7 placed on the lower tray track 22 in the preheating waiting area 2 to the test position for testing, thereby avoiding the waste of test time due to the test system 6 waiting for the tray module 7 to be dragged, thereby improving the test efficiency. In addition, in the embodiment of the present invention, during the test process, mechanical automation completely replaces the manual operation of opening the high and low temperature box drawer in the prior art, taking out a circuit, closing the drawer, testing a circuit, and then opening the drawer again after the test is completed, and taking out another circuit, and repeating the operation, thereby significantly improving the test efficiency.
[0038] like Figure 1 As shown, a pallet dragging module 8 is provided between the high and low temperature box 4 and the test system 6; the pallet dragging module 8 can drag the target pallet module 7 from the lower pallet track 22 to the pallet track in the test area of the high and low temperature box 4, and after the test is completed, drag the target pallet module 7 to the side of the high and low temperature box 4 close to the automatic discharge module 5.
[0039] In an embodiment of the present invention, the pallet dragging module 8 is placed under the high and low temperature box 4 to drag the pallet module 7 from the lower pallet track 22 in the preheating waiting module to the pallet track in the test area in the high and low temperature box 4. After the test is completed, the pallet dragging module 8 is dragged to the side of the pallet track in the test area in the high and low temperature box 4 close to the automatic unloading module 5, and finally dragged to the unloading module basket by the dragging mechanism of the automatic unloading module 5.
[0040] Specifically, a first opening is provided on the top of the high and low temperature box 4, and the test arm module 3 extends into the interior of the high and low temperature box 4 through the first opening; a suction nozzle is provided on one end of the test arm module 3 close to the high and low temperature box 4, and the suction nozzle sucks the chips in the target tray module 7 in the test area in the high and low temperature box 4 to the test system 6, and sucks the chips after the test is completed to the target tray module 7.
[0041] In this embodiment, a first opening is provided at the top of the high and low temperature box 4 so that the test arm module 3 can extend into the interior of the high and low temperature box 4 through the first opening, and a suction nozzle is provided on one end of the test arm module 3 close to the high and low temperature box 4, so that the chips in the tray module 7 can be sucked into the test socket of the test system 6 in a certain order through the suction nozzle for testing. After the test is completed, the test arm module 3 places the chips into the designated area of the tray module 7 according to whether the test results are qualified.
[0042] It should be noted that, after all the chips on a tray module 7 in this embodiment have been tested and placed according to the test results, the test arm module 3 is lifted, and the tray dragging module 8 drags the tray module 7 to the side of the tray track in the test area close to the automatic unloading module 5. The unloading door of the high and low temperature box 4 is opened, and the lifting platform of the automatic unloading module 5 moves up and down so that the empty space in the tray basket of the automatic unloading module 5 is aligned with the test track in the test area. The tray module dragging mechanism of the automatic unloading module 5 drags the tray module 7 to the empty space in the basket of the automatic unloading module 5, and the unloading door of the high and low temperature box 4 is closed.
[0043] It is understandable that a second opening is provided at the bottom of the high and low temperature box 4 , and the test socket on the test system 6 extends into the high and low temperature box 4 through the second opening.
[0044] like Figure 1 As shown, a feed door is provided on one side of the high and low temperature box 4, and a discharge door is provided on the other side. The automatic feeding module 1 is connected to the high and low temperature box 4 through the feed door, and the automatic discharge module 5 is connected to the high and low temperature box 4 through the discharge door; the high and low temperature box 4 and the test arm module 3 are sealed by setting a soft connector.
[0045] like Figure 2As shown, the tray module 7 includes a tray chassis 71, on which a material tray 72, a sorting area 73 and a test window area 74 are provided. The material tray 72 is used to place chips to be tested, and the sorting area 73 is used to place unqualified chips.
[0046] Preferably, the test window area 74 is arranged at the center of the tray bottom plate 71 , the sorting area 73 is arranged on both sides of the test window area 74 , and the material tray 72 is arranged on the other two sides of the test window area 74 .
[0047] In this embodiment, the test window area 74 is set at the center of the tray chassis 71, the sorting area 73 is set on both sides of the test window area 74, and the material tray 72 is set on the other two sides of the test window area 74, so that the suction nozzle of the test arm can quickly place the tested chips in the corresponding position according to the test results.
[0048] More preferably, the sorting area 73 includes a high-temperature unqualified area, a normal-temperature unqualified area and a low-temperature unqualified area, the high-temperature unqualified area is used to place high-temperature test unqualified chips, the normal-temperature unqualified area is used to place normal-temperature test unqualified chips, and the low-temperature unqualified area is used to place low-temperature test unqualified chips.
[0049] In this embodiment, by setting the sorting area 73 to include a high-temperature unqualified area, a normal temperature unqualified area and a low-temperature unqualified area, and setting the high-temperature unqualified area to place high-temperature test unqualified chips, the normal temperature unqualified area is set to place normal temperature test unqualified chips, and the low-temperature unqualified area is set to place low-temperature test unqualified chips, after the chip test on the entire tray module 7 is completed, when the tray module 7 is dragged to the outside of the high and low temperature box 4, the staff can quickly pick out the qualified chips, high-temperature test unqualified chips, normal temperature test unqualified chips and low-temperature test unqualified chips, thereby further improving work efficiency.
[0050] Preferably, the feed door and the discharge door are both provided with a cylinder, so as to drive the feed door and the discharge door to open or close automatically through the cylinder.
[0051] It is understandable that the cold and hot air inside the high and low temperature boxes of the chip automatic testing and sorting system in the embodiment of the present invention are both provided by the externally connected air conditioning unit 9 .
[0052] The working process of the chip automatic testing and sorting system provided in this embodiment is as follows:
[0053] The operator loads the two trays 72 loaded with chips into the tray module 7, opens the door of the automatic feeding module 1, and places the tray module 7 into the empty tray basket in the automatic feeding module 1; the lifting platform of the automatic feeding module 1 moves up and down, so that the tray module 7 to be loaded is aligned with the upper tray track 21 of the preheating waiting module 2, and then the feeding door of the high and low temperature box 4 is opened. The tray module dragging mechanism of the automatic feeding module 1 pulls the tray module 7 from the tray basket of the automatic feeding module through the feeding door of the high and low temperature box 4 and into the upper tray track 21 of the preheating waiting module 2. The material door is closed; the second automatic lifting platform 23 of the preheating waiting module 2 rises to the position of the tray module 7 on the upper tray track 21. When supporting the tray module 7, the upper tray track 21 opens, the second automatic lifting platform 23 descends, and the tray module 7 falls into the lower tray track 22. The upper tray track 21 closes, waiting for the next tray module 7 to be dragged in. The tray module 7 that falls into the lower tray track 22 is placed for a specified time after the high and low temperatures reach the specified temperatures, and then dragged to the test area by the tray dragging module 8. The test arm module 3 starts to move, and the test arm suction nozzle sucks the chips in the tray module 7 in a certain order and puts them into the test socket of the test system 6 for testing. After the test is completed, the test arm module 3 places the chips into the designated area of the tray module 7 according to whether the test results are qualified. After all the chips on the tray module 7 have been tested and placed according to the test results, the test arm module 3 is lifted, and the tray dragging module 8 drags the tray module 7 to the tray track of the test area close to the side of the automatic unloading module 5. The unloading door of the high and low temperature box 4 is opened, and the lifting platform of the automatic unloading module 5 moves up and down to align the empty space in the tray basket of the automatic unloading module 5 with the test track of the test area. The tray module dragging mechanism of the automatic unloading module 5 drags the tray module 7 to the empty space in the basket of the automatic unloading module 5, and the unloading door of the high and low temperature box 4 is closed.
[0054] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.
[0055] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims
1. A chip automatic testing and sorting system, characterized in that: The chip automatic testing and sorting system includes an automatic feeding module, an automatic discharging module, a high and low temperature box, a testing arm module and a testing system; The automatic feeding module and the automatic discharging module are respectively arranged on both sides of the high and low temperature box, the testing system is arranged below the high and low temperature box, and the testing arm module is arranged above the high and low temperature box; The automatic feeding module and the automatic discharging module are both provided with a pallet basket, a first automatic lifting platform and a pallet module dragging mechanism; the automatic lifting platform is connected to the pallet basket to drive the pallet basket to move up and down, and a plurality of pallet modules are placed in the pallet basket. The pallet module dragging mechanism can drag the pallet module to move left and right.
2. The chip automatic testing and sorting system according to claim 1, characterized in that: A preheating waiting module is provided on one side of the high and low temperature box close to the automatic feeding module; The preheating waiting module is provided with an upper tray track, a lower tray track, a second automatic lifting platform and a tray track opening and closing mechanism, and the tray track opening and closing mechanism can adjust the distance between the two tracks of the upper tray track; When the target pallet module in the automatic feeding module is transported to the upper pallet track, the second automatic lifting platform rises to support the target pallet module, the upper pallet track opens, the second lifting platform descends, the target pallet module falls into the lower pallet track, and the upper pallet track closes, waiting for the next pallet module.
3. The chip automatic testing and sorting system as claimed in claim 2, characterized in that: A tray dragging module is provided between the high and low temperature box and the testing system; The pallet dragging module can drag the target pallet module from the lower pallet track to the pallet track in the test area of the high and low temperature box, and after the test is completed, drag the target pallet module to the side of the high and low temperature box close to the automatic discharge module.
4. The chip automatic testing and sorting system according to claim 3, characterized in that: A first opening is provided on the top of the high and low temperature box, and the test arm module extends into the interior of the high and low temperature box through the first opening; A suction nozzle is provided on one end of the test arm module close to the high and low temperature box. The suction nozzle sucks the chips in the target tray module in the test area of the high and low temperature box to the test system, and sucks the chips after the test is completed to the target tray module.
5. The chip automatic testing and sorting system according to claim 3, characterized in that: A second opening is provided at the bottom of the high and low temperature box, and the test socket on the test system extends into the high and low temperature box through the second opening.
6. The chip automatic testing and sorting system according to claim 3, characterized in that: A feed door is provided on one side of the high and low temperature box, and a discharge door is provided on the other side. The automatic feed module is connected to the high and low temperature box through the feed door, and the automatic discharge module is connected to the high and low temperature box through the discharge door; The high and low temperature box and the test arm module are sealed by providing a soft connector.
7. The chip automatic testing and sorting system according to any one of claims 1 to 6, characterized in that: The tray module includes a tray chassis, on which a material tray, a sorting area and a test window area are provided. The material tray is used to place chips to be tested, and the sorting area is used to place unqualified chips.
8. The chip automatic testing and sorting system according to claim 7, characterized in that: The test window area is arranged at the center of the tray bottom plate, the sorting areas are arranged on both sides of the test window area, and the material trays are arranged on the other two sides of the test window area.
9. The chip automatic testing and sorting system according to claim 8, characterized in that: The sorting area includes a high-temperature unqualified area, a normal-temperature unqualified area and a low-temperature unqualified area. The high-temperature unqualified area is used to place chips that fail the high-temperature test, the normal-temperature unqualified area is used to place chips that fail the normal-temperature test, and the low-temperature unqualified area is used to place chips that fail the low-temperature test.
10. The chip automatic testing and sorting system according to claim 6, characterized in that: The feed door and the discharge door are both provided with cylinders.