Laser processing method, device and equipment and readable storage medium

Abstract

The invention provides a laser machining method, device and equipment and a readable storage medium. The laser machining method comprises the steps that a light emitting module is controlled to conduct machining on a workpiece to be machined along a preset machining track; a plurality of preset focus positions are arranged on the preset processing track; in the processing process of the light emitting module, at a preset time before the light emitting module moves to a preset focus position, obtaining target measurement data of the to-be-processed workpiece at the preset focus position; and according to the target measurement data, the focus of the light emitting module at the preset focus position is adjusted, so that the processed thickness of the to-be-processed part at the preset focus position is the target thickness. According to the invention, the machining precision is improved while the machining efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the field of laser processing technology, and in particular relates to a laser processing method, device, equipment and readable storage medium. Background Art

[0002] With the continuous development of laser processing technology and the increasing demand for laser processing, the requirements for laser processing precision are becoming increasingly higher. However, in existing technologies, because the workpiece may not be consistent with the reference value, such as due to workpiece placement deviation or temperature fluctuation, it is often necessary to manually adjust the laser focus based on the actual workpiece state to improve processing accuracy. However, this solution has the problem of low processing efficiency and still cannot guarantee processing accuracy. Summary of the Invention

[0003] The present invention addresses the technical problems in the prior art such as low laser processing efficiency and inability to ensure processing accuracy, and provides a laser processing method, device, equipment and readable storage medium.

[0004] In view of the above technical problems, an embodiment of the present invention provides a laser processing method, comprising: Controlling the light emitting module to process the workpiece along a preset processing trajectory; the preset processing trajectory is provided with a plurality of preset focus positions; During the processing of the light emitting module, the target measurement data of the workpiece at the preset focus position is obtained at a preset time before the light emitting module moves to the preset focus position; The focus of the light output module at the preset focus position is adjusted according to the target measurement data, so that the thickness of the workpiece to be processed at the preset focus position after processing is the target thickness.

[0005] A laser processing device, comprising: An execution module is used to control the light output module to process the workpiece along a preset processing trajectory; the preset processing trajectory is provided with a plurality of preset focus positions; An acquisition module, configured to acquire target measurement data of the workpiece at the preset focal position during a processing of the light emitting module, when the light emitting module moves to the preset focal position at a preset time; The adjustment module is used to adjust the focus of the light output module at the preset focus position according to the target measurement data, so that the thickness of the workpiece to be processed at the preset focus position after processing is the target thickness.

[0006] A laser processing device includes a controller, the controller includes a memory and a processor, the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the laser processing method.

[0007] A computer-readable storage medium stores a computer program, which implements the laser processing method when executed by a processor.

[0008] The laser processing method provided by the present invention includes: controlling a light emitting module to process a workpiece along a preset processing trajectory; providing a plurality of preset focal positions on the preset processing trajectory; obtaining target measurement data of the workpiece at the preset focal position at a preset time before the light emitting module moves to the preset focal position; and adjusting the focus of the light emitting module at the preset focal position according to the target measurement data so that the thickness of the workpiece after processing at the preset focal position is the target thickness.

[0009] The laser processing method provided by the present invention sets multiple preset focal positions on a preset processing trajectory, and in the process of the light emitting module performing processing along the preset processing trajectory, at a preset time before the light emitting module moves to the preset focal position, the target measurement data corresponding to the workpiece to be processed at the preset focal position is obtained in advance, and then before arriving at the preset focal position, the focus of the light emitting module is adjusted according to the target measurement data, so that the focus of the light emitting module is adjusted to the focus corresponding to the target measurement data when arriving at the preset focal position, and then laser processing is performed at the preset focal position using the light emitting module after focusing, so that the thickness of the workpiece to be processed after being processed at the preset focal position is the target thickness. In this way, the above-mentioned laser processing method of the present invention can realize automatic real-time focusing in laser processing to keep the thickness of the workpiece to be processed constant at the target thickness after processing, thereby improving processing efficiency and processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The present invention will be further described below with reference to the accompanying drawings and examples.

[0011] Figure 1 It is a flow chart of a laser processing method provided by one embodiment of the present invention.

[0012] Figure 2 It is a flowchart of step S300 provided by an embodiment of the present invention.

[0013] Figure 3 It is a schematic diagram of a preset processing trajectory provided by another embodiment of the present invention.

[0014] The reference numerals in the specification are as follows: 10. Preset processing trajectory; 11. Processing starting point; 12. Preset focus position. DETAILED DESCRIPTION

[0015] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0016] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0017] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0019] like Figure 1 and Figure 3 As shown, an embodiment of the present invention provides a laser processing method, including steps S100-S300: S100: Controlling a light output module to process a workpiece along a preset processing trajectory 10; the preset processing trajectory 10 is provided with a plurality of preset focal positions 12. The light output module may be a laser head. The preset focal positions 12 are positions at which a focus follower module adjusts the focus of the light output module.

[0020] It is understood that the preset focus position 12 can be set by the user according to actual circumstances. For example, the preset focus position 12 can be set on the preset processing trajectory 10 at intervals, or at intervals based on the speed of the light output module on the preset processing trajectory 10. In one embodiment, the preset focus position 12 can be set on the preset processing trajectory 10 every 1 ms based on the speed of the light output module on the preset processing trajectory 10, thereby improving adjustment accuracy.

[0021] S200 , during the processing of the light emitting module, when the light emitting module moves to the preset focus position 12 a preset time before, obtaining target measurement data of the workpiece to be processed at the preset focus position 12 .

[0022] It can be understood that in this embodiment, if Figure 3 As shown, since the light output module has started laser processing the workpiece along the preset processing trajectory 10 in step S100, the light output module will continue to move along the preset processing trajectory 10 during the processing process, and pass through multiple preset focal positions 12 in sequence during the movement. Moreover, in the present embodiment, it is necessary to perform laser processing with a target focus at each preset focus position 12. Therefore, it is necessary to complete focus adjustment when the light output module moves to the preset focus position 12. At this time, since it is necessary to consider the distance measurement module measurement, data transmission processing, and focus adjustment of the light output module (in the present invention, the focus of the light output module can be adjusted by the focus follower module), etc., all require a certain amount of time to execute. If the target measurement data is acquired and the focusing is started after the light output module arrives at the preset focus position 12, then after the focus adjustment is completed, the focus position will inevitably deviate from the preset focus position 12 (behind the preset focus position 12), thereby affecting the focusing accuracy. Therefore, in the present embodiment, it is set to acquire the target measurement data of the workpiece at the preset focus position 12 in advance of the preset time, and then compensate for the execution time of the above-mentioned distance measurement module measurement, data transmission processing, and adjustment of the focus of the light output module within the preset time, thereby ensuring that the focus position is at the preset focus position 12 after the focus adjustment of the light output module is completed, thereby further improving the adjustment accuracy. It is understandable that the duration of the preset time can be set according to actual needs, such as the movement speed of the light output module for laser processing.

[0023] In one embodiment, in step S200, obtaining target measurement data of the workpiece at the preset focus position 12 includes: The target measurement data of the workpiece at the preset focal position 12 is measured by a distance measuring module installed on the light output module. The target measurement data can be sent to the controller after being measured by the distance measuring module. In this embodiment, the distance measuring module is installed on the light output module and operates simultaneously with the light output module. Therefore, through the angle tilt setting of the distance measuring module, the target measurement data corresponding to the preset focusing position 12 at a certain distance from the light output module can be measured in real time when the light output module has not reached the preset focusing position 12, and then the target focus is determined based on the target measurement data, thereby achieving the focus adjustment to the target focus at the preset focusing position 12.

[0024] In one embodiment, the target measurement data includes an actual thickness of the workpiece at the preset focal position 12, a first flatness state of the upper surface of the workpiece at the preset focal position 12, and a second flatness state of the lower surface of the workpiece at the preset focal position 12. The actual thickness, the first flatness state, and the second flatness state are all measured by the distance measurement module.

[0025] It is understandable that the distance measuring module may be an optical distance measuring instrument, and the workpiece may be made of a transparent material, so that the distance measuring module mounted on the light output module can measure the actual thickness between the upper and lower surfaces of the workpiece on one side of the workpiece, the first flatness of the upper surface of the workpiece at the preset focal position 12, and the second flatness of the lower surface of the workpiece at the preset focal position 12. The first flatness and the second flatness may refer to the corresponding concave and convex states of the upper and lower surfaces at the preset focal position 12. The difference between the first flatness and the second flatness, as well as the difference between the actual thickness and the reference thickness of the workpiece, will affect the focus adjustment direction and adjustment distance.

[0026] S300: Adjust the focus of the light output module at the preset focal position 12 based on the target measurement data so that the thickness of the workpiece after processing at the preset focal position 12 reaches a target thickness. The target thickness is the thickness of the workpiece required to be retained at the corresponding processed position on the preset processing trajectory 10 after laser processing by the light output module. The target thickness can be set as needed.

[0027] In the present invention, by setting a plurality of preset focal positions 12 on a preset processing trajectory 10, and in the process of the light emitting module performing processing along the preset processing trajectory 10, at a preset time before the light emitting module moves to the preset focal position 12, the target measurement data corresponding to the workpiece to be processed at the preset focal position 12 is obtained in advance, and then before arriving at the preset focal position 12, the focus of the light emitting module is adjusted according to the target measurement data, so that the focus of the light emitting module is adjusted to the focus corresponding to the target measurement data when arriving at the preset focal position 12, and then laser processing is performed at the preset focal position 12 using the light emitting module after focusing, so that the thickness of the workpiece to be processed after processing at the preset focal position 12 is the target thickness. In this way, the above-mentioned laser processing method of the present invention can realize automatic real-time focusing in laser processing to keep the thickness of the workpiece to be processed after processing constant at the target thickness, thereby improving processing efficiency and processing accuracy.

[0028] like Figure 2 and Figure 3As shown, in one embodiment, in step S300, adjusting the focus of the light output module at the preset focus position 12 according to the target measurement data includes: S310: Obtain a reference thickness of the workpiece to be processed, and obtain a thickness difference between the actual thickness and the reference thickness.

[0029] It is understandable that since the processing of the light output module has already begun, and the processing parameters and focal position for each preset focal position 12 have been pre-set for the reference thickness of the workpiece at different positions (that is, the theoretical thickness value corresponding to the workpiece at the preset reference position 12), that is, when the workpiece at the preset focal position 12 is of the reference thickness, the light output module will process the workpiece using the preset processing parameters and focal position, so that the thickness after processing at the preset focal position will be the target thickness. However, since the workpiece may have a processing error, the thickness difference is the error between the actual thickness of the workpiece (that is, the actual thickness value of the workpiece at the preset reference position 12) and the reference thickness. If this error is not zero, then at this time, if the light output module processes the workpiece using the preset processing parameters and focal position, the thickness after processing at the preset focal position will deviate from the target thickness, thereby reducing the processing accuracy. Therefore, in this embodiment, it is necessary to adjust the parameters and focal position to eliminate the above-mentioned error to ensure that the thickness after processing is the target thickness.

[0030] S320 , determining a target focus according to the thickness difference, the first flat state, and the second flat state, and adjusting the focus of the light output module at the preset focus position 12 to the target focus.

[0031] It can be understood that if only the influence of the thickness difference, the first flat state, and the second flat state is considered, then if the actual thickness is greater than the reference thickness, the focus of the light output module needs to be adjusted toward the workpiece to be processed, increasing the cutting depth of the light output module so that the cutting depth of the light output module in the workpiece at the preset focus position 12 reaches the target depth, eliminating the thickness difference, and ensuring that the thickness after processing is the target thickness; if the actual thickness is less than the reference thickness, the focus of the light output module needs to be adjusted away from the workpiece to be processed, reducing the cutting depth of the light output module so that the cutting depth of the light output module in the workpiece at the preset focus position 12 reaches the target depth, eliminating the thickness difference, and ensuring that the thickness after processing is the target thickness; if the actual thickness is equal to the reference thickness, no adjustment is required. The difference between the actual thickness and the target depth is equal to the target thickness.

[0032] Furthermore, since the first flat state and the second flat state can indicate whether the workpiece to be processed has a convexity or concaveness at the preset focal position 12 compared with the reference upper surface and the reference lower surface, or whether the placement angle of the workpiece to be processed on the laser stage is offset, therefore, based on the above consideration of the thickness difference, the adjustment direction and height of the target focus can be further corrected according to the first flat state and the second flat state. Due to the different actual conditions of the flat state, the adjustment direction and height will be different. The specific correction method can be set according to the actual situation. For example, when the preset focal position is located on the reference upper surface When the first flat state is convex (the convexity of the first flat state means that the upper surface is convex upward compared to the reference upper surface), it means that the previously preset focus position will be below the actual upper surface, and the focus position is relatively low. At this time, the focus position needs to be corrected upward so that the cutting depth can smoothly reach the target depth; on the contrary, when the first flat state is concave (the concaveness of the first flat state means that the upper surface is concave downward compared to the reference upper surface), it means that the previously preset focus position will be above the actual upper surface, and the focus position is relatively high. At this time, the focus position needs to be corrected downward so that the cutting depth can smoothly reach the target depth. The above correction amount needs to be specifically set according to the actual processing parameters. Similarly, for a workpiece to be processed with a reference thickness, a reference upper surface and a reference lower surface, after the workpiece to be processed is processed according to the preset processing parameters and focus position, the distance between its upper surface after cutting and the reference lower surface is the target thickness. However, if the second flattening state is convex (convex in the second flattening state means the lower surface is convex compared to the reference lower surface), since the lower surface is shifted downward relative to the reference lower surface, the focus position must be corrected downward so that the upper surface after cutting also shifts downward to ensure the target thickness after cutting remains unchanged. Conversely, if the second flattening state is concave (concave in the second flattening state means the lower surface is concave upward), since the lower surface is shifted upward relative to the reference lower surface, the focus position must be corrected upward so that the upper surface after cutting also shifts upward to ensure the target thickness after cutting remains unchanged. The above correction amount also needs to be specifically set according to the actual processing parameters.

[0033] In one embodiment, in step S320, adjusting the focus of the light output module at the preset focus position 12 to the target focus includes: S321: Obtain a current focal height of the light output module at a current position, and determine a height difference between the current focal height and the target focal height.

[0034] It can be understood that after adjusting the focus of the light output module to the target focus height, the cutting depth of the light output module on the workpiece to be processed at the preset focus position 12 can reach the target depth, eliminating the thickness difference to ensure that the thickness after processing is the target thickness.

[0035] S322, determining an adjustment speed according to the height difference and the preset time, and controlling the focus follower assembly to start focusing at the adjustment speed at the current position, so as to adjust the focus to the target focus height when the light output module moves to the preset focus position 12.

[0036] It is understandable that after the preset time, the light emitting module just moves to the preset focus position 12. In a specific embodiment, the height difference can be determined according to the preset time and the adjustment speed. When the light emitting module moves to the preset focus position 12 in the height direction according to the adjustment speed, the focus of the light emitting module is just adjusted to the target focus height. It is understandable that the preset time minus the specific time used for ranging module measurement and data transmission processing (the specific time is set according to demand. If the specific time is extremely small and the impact on the accuracy of focus adjustment can be ignored, the specific time can also be set to 0) to obtain the target time, and the adjustment speed can be determined to be equal to the height difference divided by the target time.

[0037] In one embodiment, in the step S100, before controlling the light output module to process the workpiece along the preset processing trajectory 10, the step further includes: S400, generating the preset processing trajectory 10 according to the preset reference data and preset processing requirements of the workpiece to be processed; the preset reference data includes the reference thickness of the workpiece to be processed and the preset processing area; the preset processing requirements include the target thickness that needs to be retained after the preset processing area is processed.

[0038] It can be understood that the target thickness can be a constant thickness, or different thicknesses can be set at different preset focal positions 12 according to the processing requirements of the workpiece to be processed, as long as the focus of the light output module at the preset focal position 12 can be adjusted according to the target measurement data so that the thickness of the workpiece to be processed at the preset focal position 12 after processing is the target thickness.

[0039] In one embodiment, the preset processing trajectory 10 includes a processing starting point 11; In the step S100, controlling the light emitting module to process the workpiece along a preset processing track 10 includes: S110 , controlling the light emitting module to move to the processing starting point 11 of the preset processing trajectory 10 , and measuring the initial measurement data of the workpiece to be processed at the processing starting point 11 in real time through a distance measurement module installed on the light emitting module.

[0040] S120 , determining an initial focus of the light output module at the processing starting point 11 according to the initial measurement data.

[0041] S130 , adjusting the focus of the light emitting module to the initial focus, and controlling the light emitting module to perform processing along a preset processing trajectory 10 starting from the processing starting point 11 .

[0042] It is understandable that at the processing starting point 11, the light emitting module has not yet moved along the preset processing trajectory 10. Therefore, the initial measurement parameters corresponding to the processing starting point 11 can be measured directly before processing, and the initial measurement parameters can also be measured by the ranging module installed on the light emitting module. It is only necessary to adjust the measurement angle of the ranging module, and its specific measurement process can refer to the measurement of the target measurement data in step S200. It is understandable that since in this embodiment, the ranging module and the light emitting module are located at the processing starting point 11 at the same time, the ranging module needs to measure the initial measurement data of the processing starting point 11 when the light emitting module is also located at the processing starting point. In the above embodiment, the ranging module needs to start measuring the target measurement data of the preset focus position 12 when the light emitting module has not yet moved to the preset focus position 12. Therefore, the measurement angles of the ranging module corresponding to the processing starting point 11 and the preset focus position 12 should be different. After the ranging module measures the initial measurement data of the processing starting point 11, if the initial focus of the light emitting module at the processing starting point 11 is determined according to the initial measurement data, and the focus of the light emitting module is adjusted to the initial focus, the light emitting module is controlled to perform processing along the preset processing trajectory 10 from the processing starting point 11, and then the measurement angle of the ranging module should be adjusted to facilitate the next step of measuring the target measurement data at the subsequent preset focus position 12.

[0043] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0044] An embodiment of the present invention further provides a laser processing device, comprising: An execution module is used to control the light output module to process the workpiece along a preset processing trajectory 10; the preset processing trajectory 10 is provided with a plurality of preset focus positions 12; An acquisition module, configured to acquire target measurement data of the workpiece at the preset focus position 12 during a processing of the light emitting module, when the light emitting module moves to the preset focus position 12 at a preset time; The adjustment module is used to adjust the focus of the light output module at the preset focus position 12 according to the target measurement data, so that the thickness of the workpiece after processing at the preset focus position 12 is the target thickness.

[0045] It can be understood that the laser processing device of the present invention corresponds to the above-mentioned laser processing method, which will not be described in detail here.

[0046] One embodiment of the present invention further provides a laser processing device, including a controller, the controller including a memory and a processor, the memory storing a computer program, and when the computer program is executed by the processor, the processor executes the various steps of the laser processing method. The various modules in the above-mentioned controller can be implemented in whole or in part by software, hardware, and a combination thereof. The above-mentioned modules can be embedded in or independent of the controller in the form of hardware, or can be stored in the controller in the form of software, so that the controller can call and execute the operations corresponding to the above modules. Among them, the memory, as a computer-readable storage medium, can be used to store software programs, computer executable programs and modules, such as program instructions corresponding to the laser processing method in the embodiment of the present invention. The processor implements the various steps of the laser processing method by running the software programs, instructions and modules stored in the memory.

[0047] The memory may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal. Furthermore, the memory may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. Examples of the aforementioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0048] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the laser processing method are implemented.

[0049] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing related hardware through computer-readable instructions. The computer-readable instructions can be stored in a non-volatile readable storage medium or a volatile readable storage medium. When the computer-readable instructions are executed, they can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0050] Those skilled in the art will clearly understand that for the sake of convenience and brevity in description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above.

[0051] The above are merely embodiments of the laser processing method, device, equipment and readable storage medium of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser processing method, characterized in that: include: Control the light output module to process along the preset processing trajectory on the workpiece to be processed; The preset processing trajectory is provided with a plurality of preset focus positions; During the processing of the light emitting module, the target measurement data of the workpiece at the preset focus position is obtained at a preset time before the light emitting module moves to the preset focus position; The focus of the light output module at the preset focus position is adjusted according to the target measurement data, so that the thickness of the workpiece to be processed at the preset focus position after processing is the target thickness.

2. The laser processing method according to claim 1, wherein: The obtaining of target measurement data of the workpiece at the preset focus position includes: The target measurement data of the workpiece to be processed at the preset focus position is measured by a distance measurement module installed on the light output module.

3. The laser processing method according to claim 1 or 2, characterized in that: The target measurement data includes an actual thickness of the workpiece at the preset focus position, a first flatness of the upper surface of the workpiece at the preset focus position, and a second flatness of the lower surface of the workpiece at the preset focus position.

4. The laser processing method according to claim 3, characterized in that: The adjusting the focus of the light output module at the preset focus position according to the target measurement data includes: Obtaining a reference thickness of the workpiece to be processed, and obtaining a thickness difference between the actual thickness and the reference thickness; A target focus is determined according to the thickness difference, the first flat state, and the second flat state, and the focus of the light output module at the preset focus position is adjusted to the target focus.

5. The laser processing method according to claim 4, characterized in that: The step of adjusting the focus of the light output module at the preset focus position to the target focus includes: Obtaining a current focal height of the light output module at a current position, and determining a height difference between the current focal height and the target focal height; An adjustment speed is determined according to the height difference and the preset time, and the focus follower assembly is controlled to start focusing at the adjustment speed at the current position, so as to adjust the focus to the target focus height when the light output module moves to the preset focus position.

6. The laser processing method according to claim 1, wherein: Before the light emitting module is controlled to process the workpiece along the preset processing trajectory, the method further includes: The preset processing trajectory is generated according to the preset reference data of the workpiece to be processed and the preset processing requirements; the preset reference data includes the reference thickness of the workpiece to be processed and the preset processing area; the preset processing requirements include the target thickness that needs to be retained after the preset processing area is processed.

7. The laser processing method according to claim 1, wherein: The preset processing trajectory includes a processing starting point; The controlling the light emitting module to process the workpiece along a preset processing trajectory includes: Controlling the light output module to move to the processing starting point of the preset processing trajectory, and measuring the initial measurement data of the workpiece to be processed at the processing starting point in real time through a distance measurement module installed on the light output module; Determining the initial focus of the light output module at the processing starting point according to the initial measurement data; The focus of the light emitting module is adjusted to the initial focus, and the light emitting module is controlled to perform processing along a preset processing trajectory starting from the processing starting point.

8. A laser processing device, characterized in that: include: The execution module is used to control the light output module to process the workpiece along a preset processing trajectory; The preset processing trajectory is provided with a plurality of preset focus positions; An acquisition module, configured to acquire target measurement data of the workpiece at the preset focal position during a processing of the light emitting module, when the light emitting module moves to the preset focal position at a preset time; The adjustment module is used to adjust the focus of the light output module at the preset focus position according to the target measurement data, so that the thickness of the workpiece to be processed at the preset focus position after processing is the target thickness.

9. A laser processing device, characterized in that: The laser processing method comprises a controller, wherein the controller comprises a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the laser processing method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the laser processing method according to any one of claims 1 to 7 is implemented.

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