Cooling system comprising a stack with fins

Abstract

The invention relates to a cooling system including a stack having fins. A cooling system includes a stack having shark fin surface features. An example computing device includes: a heat generating component; a stack thermally coupled with the heat generating component, the stack including: a first plate; a channel is defined between the first plate and the second plate; and a fin extending from the surface of the first plate into the channel, the fin comprising: a first end adjacent the surface; a second end distal from the surface; and a ridge extending between the first end and the second end, the ridge being inclined at an angle relative to the surface; and a fan for guiding air through the passage.

Description

Technical Field

[0001] The present disclosure relates generally to convection cooling systems and, more particularly, to cooling systems including stacks having fins. Background Art

[0002] Convection-based cooling systems often include a baseplate that transfers heat from heat-generating components (e.g., integrated circuits). Some such convection cooling systems include heat pipes that transfer heat from the baseplate to the fin structure. Convection-based cooling systems typically include fans that drive air through the fin structure and transfer heat from the fin structure to the surrounding environment. Summary of the Invention

[0003] According to one embodiment of the present disclosure, a computing device is provided, comprising: a heat-generating component; a stack thermally coupled to the heat-generating component, the stack comprising: a first plate; a second plate, a channel defined between the first plate and the second plate; a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent to the surface; a second end away from the surface; a ridge extending between the first end and the second end, the ridge being inclined at an angle relative to the surface; and a fan for guiding air through the channel.

[0004] According to one embodiment of the present disclosure, a heat conductive stack is provided, comprising: a first plate; a second plate, the first plate and the second plate defining a channel; and a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent to the surface; a second end away from the surface; and a ridge extending between the first end and the second end, the ridge being arranged at an inclined angle relative to the surface.

[0005] According to one embodiment of the present disclosure, a heat conducting plate for a cooling system is provided, the heat conducting plate comprising: a first fin extending from a surface of the heat conducting plate, the first fin comprising: a first end flush with the surface; a second end displaced from the surface; and a ridge extending between the first end and the second end; and a second fin extending from the surface and having the same shape as the first fin. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a top view of an example cooling system including a stack implemented according to the teachings of the present disclosure.

[0007] Figure 2 yes Figure 1 A perspective view of the stack.

[0008] Figure 3 yes Figure 2 A perspective view of the fins of a fin array.

[0009] Figure 4A is a schematic diagram of the flow through the existing fin structure.

[0010] Figure 4B is through Figure 2 Schematic diagram of an example flow of a stack.

[0011] Figure 5 is implemented according to the teachings of this disclosure and can be used with Figure 2 A perspective view of another fin used in conjunction with the stack.

[0012] Figure 6 is implemented according to the teachings of this disclosure and can be used with Figure 2 A perspective view of another fin used in conjunction with the stack.

[0013] Generally, the same reference numerals will be used throughout the drawings and accompanying written description to refer to the same or like parts.The drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0014] Many computing devices include cooling systems for cooling the heat-generating components of the computing devices. Most of these existing cooling systems are based on convection and include a base plate that is adjacent to the heat-generating components of the computing system and absorbs heat from the heat-generating components via conduction. Some existing convection-based cooling systems include a stack of heat-conducting plates that are thermally coupled to the base plate via heat pipes. Air can be driven through the stack via a fan that draws air from the surrounding environment. As the air is driven through the stack, heat is absorbed from the stack into the air via convection. The heat exchange efficiency of the stack is a parameter that affects the thermal capacity of a convection cooling system. The heat exchange efficiency of the stack in existing convection systems is based on the following: the number of plates in the stack, the size of the gap(s) between the plates, and / or the thickness(s) of the plates. However, the adjustment of these parameters in existing cooling systems may be limited by the following: the packaging space available for the stack, the material(s) of the plates, and the impedance of the flow through the stack.

[0015] Existing stacks are susceptible to backflow and / or other turbulence effects in the portion of the stack away from the fan outlet. Air backflow and turbulence within the stack can significantly reduce the stack's heat exchange efficiency and reduce the thermal design power (TDP) of the computing device. Another challenge posed by existing stacks is the surface resistance associated with the plates. Specifically, in each channel of the stack, the friction between the air and the plates causes the air near the plates to be relatively hotter and slower, and the air in the middle of the channel to be relatively faster and cooler. This temperature gradient reduces the stack's heat exchange efficiency.

[0016] The examples disclosed herein address one or more of the above-mentioned deficiencies and include a convection-based cooling system with a stack that includes fins based on the bionics of shark fins. The example fins disclosed herein include holes that enable the flow in the stack to move between adjacent channels of the stack. In some such examples disclosed herein, the holes in the fins balance the pressure between adjacent channels. The example fins disclosed herein disrupt the flow of air over the surface of the fins and cause mixing between relatively slow hot air near the surface of the plate and relatively fast cold air in the middle of the stacked channels. In some such examples disclosed herein, the mixing of air within the channels improves the heat exchange efficiency of the stack. The example fins disclosed herein reduce the backflow effect (e.g., vortexes, eddies, vortices, etc.) at the inlet of the fin stack, which increases the flow rate of air through the stack. Compared to existing fin stacks, the example stacks disclosed herein do not significantly increase manufacturing costs and / or material costs. Compared to existing convection cooling systems, the example fin stacks disclosed herein improve the TDP of convection-based cooling systems.

[0017] Figure 1 is a top view of an example cooling system 100 including an example stack 102 implemented in accordance with the teachings of the present disclosure. Figure 1 In the example shown, the cooling system 100 is provided within an example computing device 101. Figure 1 In the example shown, the cooling system 100 includes an example base plate 104, an example heat pipe 106, and an example fan 108. Figure 1 In the example shown, the fan 108 includes an example fan outlet 112. Figure 1 In the example shown, the stack 102 includes an example first region 114 adjacent to the fan outlet 112 and an example second region 116 distal to the fan outlet 112 .

[0018] exist Figure 1In the example shown, cooling system 100 is integrated into computing device 101. Cooling system 100 cools computing device 101 and dissipates heat generated by the operation of components of computing device 101 (e.g., processor circuits, electronic components, motors, etc.). In some examples, computing device 101 can be a laptop, a personal computer (e.g., a tower computer, etc.), a workstation, a notebook, a tablet computer, a server, and / or any other suitable type of computing device. In other examples, cooling system 100 can be integrated into any other suitable device (e.g., a refrigerator unit, an air conditioner, etc.) that includes (one or more) heat-generating devices and / or heat-generating parts. Although the example cooling system 100 described herein is an air cooling system, in other examples, cooling system 100 can be a liquid cooling system (e.g., an immersion cooling system, etc.). In some such examples, a liquid (e.g., a refrigerant, distilled water, etc.) can be directed through stack 102 via fan 108 and / or a pump.

[0019] The stack 102 in this example is a mechanical structure that includes a plurality of plates arranged in parallel. The stack 102 absorbs heat from the heat pipe 106 and dissipates the heat into the air flowing through the stack 102 and then into the surrounding environment. The heat is transferred from the stack 102 to the air flowing through the stack 102, cooling one or more example heat-generating components 118 of the computing device 101 (e.g., processor circuits, etc.). The stack 102 includes a plurality of fins (e.g., a bionic shark fin shape, etc.) that increase the heat exchange rate between the air flowing through the stack 102 and the plates of the stack 102. For example, Figure 1 Some or all of the plates of stack 102 may include fins extending between the plates of stack 102. In some examples, stack 102 includes (e.g., consists of) a thermally conductive material (e.g., copper, aluminum, silver, etc.). Example implementations of stack 102 are described below in conjunction with Figure 2 Describe in more detail.

[0020] The base plate 104 is a structural component that absorbs heat from the heat generating component(s) 118. Figure 1In the example shown, substrate 104 contacts (e.g., abuts, engages, etc.) and thermally contacts (one or more) heat-generating components 118. In some examples, a thermally conductive paste is disposed between (one or more) heat-generating components 118 and substrate 104 to increase the rate of conduction between substrate 104 and (one or more) heat-generating components 118. In some examples, substrate 104 includes (e.g., is composed of) a thermally conductive material (e.g., copper, aluminum, etc.). In some examples, (one or more) heat-generating components 118 are computing units that perform operations of computing device 101. In some such examples, (one or more) heat-generating components 118 may be one or more central processing units (CPUs), one or more graphics processing units (GPUs), one or more digital signal processors (DSPs), one or more data processing units (DPUs), one or more tensor processing units (TPUs), and / or any other suitable integrated circuits. Additionally or alternatively, (one or more) heat-generating components 118 may include (one or more) other components, such as motors, fans, compressors, bearings, heat exchangers, etc.

[0021] Heat pipe 106 is a thermally conductive structure that transfers (e.g., conducts, etc.) heat between substrate 104 and stack 102. In some examples, heat pipe 106 includes an internal channel containing a fluid (e.g., ammonia, methanol, ethanol, water, mercury, etc.) that evaporates as it absorbs heat from substrate 104. The vapor can travel to a portion of heat pipe 106 adjacent to stack 102, dissipate heat (e.g., conduct, transfer, etc.) into stack 102, condense into liquid, and return to a portion of heat pipe 106 adjacent to substrate 104 (e.g., via gravity, via capillary action, etc.). In some examples, the body of heat pipe 106 can include a highly conductive material, such as copper, aluminum, silver, etc. In some examples, the internal region(s) of heat pipe 106 have a wick / capillary design (e.g., a grooved wick design, a sintered wick design, a mesh-braided wick design, etc.). In some examples, heat pipe 106 is absent. In some examples, substrate 104 is directly coupled to stack 102 .

[0022] The fan 108 is a mechanical device that draws air from the surrounding environment of the computing device 101 and directs the air through the stack 102. Figure 1 In the example shown, fan 108 is a centrifugal fan. In other examples, fan 108 is an axial fan. In some examples, computing device 101 may include additional fans (e.g., fans associated with a power supply of computing device 101, etc.).

[0023] exist Figure 1In the example shown, fan outlet 112 of fan 108 is adjacent to a first region 114 of stack 102 and away from a second region 116 of stack 102. In some examples, the location of fan outlet 112 can increase the relative flow velocity of air through first region 114 and decrease the relative flow velocity of air through second region 116. In some such examples, the fins of stack 102 can normalize (e.g., partially normalize, fully normalize, etc.) the pressure and flow velocity of air between region 114 and region 116. Figure 1 In the example shown, air exhausted by fan outlet 112 defines an example first flow vector 120 in first region 114 and an example second flow vector 122 in second region 116. In some examples, first flow vector 120 forms an example first angle 123 with example stacking flow vector 124. Figure 1 In the example shown, the second flow vector 122 forms an example second angle 126 with the stacking flow vector 124. Figure 1 In the example shown, first angle 123 is approximately 180 degrees (eg, first flow vector 120 is substantially collinear with stacking flow vector 124, etc.). Figure 1 In the example shown, the second angle 126 is an obtuse angle. The obtuse angle formed between the second flow vector 122 and the stack flow vector 124 causes a backflow effect in the second region 116 within the stack 102, which is mitigated by the presence of the fins of the stack 102. Figure 4A The existing stack including the backflow effect is described. Figure 4B to describe example mitigations of such backflow effects by example fins disclosed herein.

[0024] Figure 2 yes Figure 1 A perspective view of a stack 102 comprising a plurality of plates 200 implemented in accordance with the teachings of the present disclosure. Figure 2 In the example shown, the plurality of plates 200 includes a plurality of plates, for example, an example first plate 202A, an example second plate 202B, an example third plate 202C, etc. Figure 2 In the example shown, an example first channel 204A is defined between the first plate 202A and the second plate 202B. Figure 2 In the example shown, an example second channel 204B is defined between the first plate 202A and the third plate 202C. Figure 2 In the example shown, the second plate 202B is depicted by dashed lines and is depicted as transparent for visual clarity only. Figure 2 In the example shown, the first plate 202A includes an example plurality of fins 206. Figure 2 In the example shown, the stack 102 includes an example stack flow vector 124 that represents air flow through the stack 102 (e.g., according to Figure 1While this description focuses on three boards of the stack 102 (e.g., boards 202A, 202B, 202C, etc.), it should be understood that it can be extended to similar features of the other boards 200 of the stack 102.

[0025] The plurality of plates 200 are walls of the stack 102 that direct the flow of air through the stack 102. As used herein, the terms "sheet" and "plate" are used interchangeably to refer to the plates of the stack described herein. The plates 200 may comprise (e.g., be composed of) any suitable conductive material, including copper, aluminum, silver, steel, etc. Figure 2 In the example shown, the plates 200 are evenly spaced. In other examples, some or all of the plates 200 are unevenly spaced. Figure 2 In the example shown, the plates 200 have a uniform thickness. In other examples, some or all of the plates 200 have different thicknesses. In some examples, the spacing between the plates 200 (e.g., the width of the first channel 204A, etc.), the number of plates 200, and the thickness of the plates 200 can be selected based on the design parameters of the cooling system 100.

[0026] exist Figure 2 In the example shown, the plate 200 includes an example first locking mechanism 208A and an example second locking mechanism 208B. The locking mechanisms 208A and 208B couple the plurality of plates 200 into the stack 102. For example, the locking mechanisms 208A and 208B may include one or more end features of the stack 102 (e.g., a plurality of bosses and corresponding openings, etc.) that are connected together via a plurality of interference fits. In some such examples, the stack 102 may be formed via stamping and / or other sheet metal forming manufacturing methods. For example, the plates 200 of the stack 102 may be manufactured as a series of metal sheets (e.g., copper sheets, aluminum sheets, etc.) that are coupled together via the locking mechanisms 208A and 208B. In some such examples, the plurality of fins 206 may be formed during the stamping of the plate 200. In some such examples, the material cost and / or manufacturing complexity of the plate 200 including the plurality of fins 206 is not increased compared to a sheet without the plurality of fins 206. Additionally or alternatively, the locking mechanisms 208A, 208B may include one or more fasteners (e.g., screws, rivets, bolts, etc.), one or more welded surfaces connected via welding, one or more chemical adhesives, etc. In some examples, the locking mechanisms 208A, 208B are not present. In some such examples, the stack 102 is a unitary assembly manufactured via machining and / or additive manufacturing.

[0027] The fins 206 are surface features (e.g., ridges, etc.) of the first plate 202A that extend into the channels 204A. The fins 206 disrupt the flow of air through the channels 204A to increase mixing of the air within the first channels 204A and mitigate (e.g., reduce, prevent, etc.) backflow effects (e.g., eddies, vortices, vortices, etc.) within the first channels 204A. In some examples, the fins 206 include through-holes that fluidly couple the channels 204A, 204B. While the fins 206 are depicted as features of the first plate 202A, it should be understood that other plates in the plurality of plates 200 may include fins similar to the fins 206 (e.g., the second plate 202B, the third plate 202C, some or all of the other plates 200, a majority of the plates 200, and the plurality of plates 200). Figure 1 For example, the third plate 202C may include another plurality of fins extending into the second channel 204B.

[0028] exist Figure 2 In the example shown, the array of fins 206 includes 28 fins. In other examples, the first board 202A can include a different number of fins (e.g., 1 fin, 10 fins, 20 fins, 40 fins, 100 fins, etc.). In some examples, the number of fins in the array of fins 206 can be selected based on the size of the board 200. Figure 2 In the example shown, each fin in the array of fins 206 has the same size and / or the same shape. Figure 3 In the example shown, the fins 206 are generally V-shaped ridges formed in the first plate 202A. For example, the fins 206 are generally shark fin-shaped (e.g., similar to the biomimetic shape of a shark's first dorsal fin, the portion of the shark that can be seen above the water surface when the shark swims close to the surface, etc.). In other examples, some or all of the fins 206 can have (one or more) different sizes and / or different shapes. Figure 3 An example fin among fins 206 is depicted.

[0029] exist Figure 2 In the example shown, the fins 206 include an example first fin 209A, an example second fin 209B, and an example third fin 209C. Figure 2 In the example shown, the first fin 209A is aligned with the second fin 209B along an example first axis 210A that is parallel to the stack flow vector 124. Figure 2 In the example shown, the first fin 209A is aligned with the third fin 209C along an example second axis 210B that is perpendicular to the first axis 210A and the stack flow vector 124. Figure 2In the example shown, the fins 206 have a grid pattern (e.g., a uniform grid distribution, etc.). That is, the fins 206 are uniformly distributed along the first axis 210A, and the fins 206 are uniformly distributed along the second axis 210B. In other examples, the fins 206 can have another uniform distribution (e.g., fins 206 in adjacent rows are offset, fins 206 in adjacent columns are offset, etc.). In other examples, the fins 206 can have a non-uniform distribution (e.g., a random distribution, uneven spacing, etc.). In some such examples, the first fin 209A and the second fin 209B are misaligned along the first axis 210A, and the first fin 209A and the third fin 209C are misaligned along the second axis 210B.

[0030] Figure 3 yes Figure 2 A perspective view of an example implementation of a fin 300 in an array of fins 206. Figure 3 In the example shown, the fin 300 is Figure 2 The example surface 301 of the first plate 202A extends into the channel 204A. Figure 3 In the example shown, the fin 300 includes an example first end 302, an example second end 304, and an example ridge 306. As used herein, the ridge 306 is interchangeably referred to as the "peak" of the fin 300 and the "ridge" of the fin 300. Figure 3 In the example shown, the spine 306 has an example length 308, and the second end 304 has an example height 310 and an example width 312. Figure 3 In the example shown, the fin 300 has an example thickness 314. Figure 3 In the example shown, the second end 304 includes an example hole 316. Figure 5 and Figure 6 Other fins implemented according to the teachings of the present disclosure are described.

[0031] exist Figure 3 In the example shown, the first end 302 is adjacent to the surface 301 and the second end 304 is distal to the surface 301. Figure 3 In the example shown, the first end 302 is substantially flush with the first surface 301 (e.g., the ridge 306 is flush with the surface 301 at the first end 302), and the second end 304 is spaced apart from the surface 301 (e.g., the ridge 306 is spaced apart from the first surface 301 at the second end 304 by a height 310, etc.). In this example, the ridge 306 of the fin 300 extending from the first end 302 to the second end 304 is inclined relative to the surface 301 (e.g., the ridge 306 is disposed at an inclined angle relative to the surface 301, etc.). In this example, the ridge 306 terminates at the first end 302 and / or is flush with the surface 301 of the board 202A and slopes upward to the second end 304. Figure 3In the example shown, ridge 306 defines an acute angle relative to surface 301 of plate 202A (e.g., an angle defined between ridge 306 and a projection of ridge 306 on surface 301, etc.). In other examples, first end 302 is spaced apart from first surface 301. In some such examples, first end 302 may include an aperture similar to aperture 316.

[0032] exist Figure 3 In the example shown, the displacement of the fin 300 increases linearly along the ridge 306 between the first end 302 and the second end 304 (e.g., the slope of the ridge 306 is linear between the first end 302 and the second end 304, etc.). In other examples, the ridge 306 of the fin 300 may include a curve (e.g., a logistic curve, a logarithmic curve, a quadratic curve, an exponential curve, an irregular curve, etc.) between the first end 302 and the second end 304. Figure 3 In the example shown, the displacement of the fin 300 relative to the surface 301 increases monotonically from the first end 302 to the second end 304. In other examples, the displacement of the fin 300 relative to the surface 301 increases non-monotonically from the first end 302 to the second end 304 (eg, the ridge 306 includes ripples, etc.).

[0033] The holes 316 allow air to pass through the fins 300 and the first plate 202A. The holes 316 are located at the second end 304 and extend below the ridge 306 to the plate 202A. As used herein, the terms "holes" and "openings" are used interchangeably to refer to openings in the second end 304. That is, the holes 316 allow air to pass through the first plate 202A and on both sides of the first plate 202A (e.g., Figure 3 Fluid flows between the channels 204A, 204B, etc. Figure 3 In the example shown, the holes 316 are generally triangular in shape (e.g., the holes 316 are triangular, the holes 316 are V-shaped, etc.). In other examples, the holes 316 may have any other suitable shape (e.g., polygonal, circular, oval, C-shaped, D-shaped, etc.), depending on the shape of the second end 304. In some examples, the holes 316 may extend onto the surface 301 of the first plate 202A. In other examples, the holes 316 are not present. In some such examples, the second end 304 may be solid and / or otherwise impermeable to flow on the surface 301. In some such examples, adjacent channels of the stack 102 are not in fluid communication.

[0034] exist Figure 3 In the example shown, the second end 304 includes an example edge 318. Figure 3 In the example shown, edge 318 includes an example first edge end 320A and an example second edge end 320B. Figure 3In the example shown, the edge ends 320A, 320B are disposed at the surface 301. Figure 3 In the example shown, the edge 318 is generally V-shaped. That is, the edge ends 320A, 320B at the second end 304 and the ridge 306 form a V. Figure 3 In the example shown, the edge 318 and the aperture 316 of the second end 304 are generally symmetrical about the ridge 306. For example, the portion of the edge 318 extending between the ridge 306 and the first edge end 320A is symmetrical to the portion of the edge 318 extending between the ridge 306 and the second edge end 320B. In other examples, the edge 318 and the aperture 316 are asymmetrical about the ridge 306.

[0035] exist Figure 3 In the example shown, the ridge 306 has a length 308 between the first end 302 and the second end 304. In some examples, the length 308 of the fin 300 can be based on the length of the stack 102 (e.g., Figure 2 The length of the stack 102 along the first axis 210A, etc. Figure 3 In the example shown, the fin 300 has a consistent thickness (e.g., thickness 314, etc.). For example, the thickness 314 of the fin 300 can be based on the thickness of the first plate 202A. For example, if the fin 300 is formed in the plate 202A via stamping, the fin 300 and the first plate 202A have approximately the same thickness. In other examples, the plate 202A and the fin 300 can have any other suitable thickness. Figure 3 In the example shown, at the second end 304, the ridge 306 is spaced apart from the surface 301 by a height 310. In some examples, the width of the channel of the stack 102 is about 1 millimeter (mm) wide. In some such examples, the height 310 can be less than or equal to 0.2 millimeters (mm). Additionally or alternatively, the height 310 can be less than or equal to one-tenth of the length 308 (e.g., the length 308 is ten times the height 310, etc.). The width 312 is the distance between the edge ends 320A, 320B. In some examples, the width 312 is approximately equal to twice the height 310. In other examples, the width 312 can have any other suitable dimensions. In some examples, the length 308, height 310, width 312, and / or thickness 314 can be based on the computing device associated with the stack 102 (e.g., Figure 1 The selection may be made based on the computing device 101, etc.), the size of the stack 102, the cooling fluid (e.g., air, immersion cooling fluid, etc.), and / or the velocity of the fluid within the stack 102.

[0036] Figure 4A 4 is a schematic cross-sectional view of a channel 402 of a conventional fin stack 404. Figure 4AIn FIG, the channel 402 is defined between a first plate 406A and a second plate 406B. Figure 4A In the example shown, the channel 402 includes a channel inlet 408 and a channel outlet 410. Flow 412 exits a fan outlet 414 (e.g., an outlet similar to the fan outlet 112, etc.) and enters the channel inlet 408. Figure 4A , flow 412 is depicted as a series of discrete air particles with corresponding velocity vectors. The depiction of flow 412 as discrete particles is not to scale and is for visual clarity and explanation purposes only. Figure 4A In FIG. 4 , the channel 402 is not aligned with the fan outlet, so that the flow 412 forms an angle 416 with the plate 406A (e.g., with Figure 1 That is, the channel 402 is located in the existing fin stack 404 at a position away from the fan outlet 414 (eg, the channel 402 is located in a region similar to the second region 116 , etc.).

[0037] As the flow 412 enters the channel inlet 408, the flow 412 encounters the second plate 406B (e.g., a downstream plate, a plate further away from the fan outlet 414, etc.), which increases the pressure of the flow near the second plate 406B (compared to the first plate 406A). The pressure differential forms a vortex 418 near the first plate 406A (e.g., an upstream plate, a plate closer to the fan outlet 414, etc.). The vortex 418 reduces the pressure recovery of the channel 402 and the overall flow rate of the flow 412 through the channel 402. This reduced pressure recovery and flow rate through the existing channel 402 reduce the heat exchange efficiency of the existing stack 404. In addition, the formation of vortices in the channels of the existing stack 404 away from the fan outlet 414 produces uneven discharge flow rate and discharge pressure along the length of the existing stack 404. Because the resistance is proportional to the square of the flow rate, compared to a stack with a uniform pressure and flow rate distribution (e.g., Figure 1 The uneven pressure distribution of the existing stack 404 may disproportionately increase the resistance within the existing stack 404 compared to the stack 102, etc.

[0038] exist Figure 4A4. Flow velocity profile 420 is shown in FIG. Downstream of channel 402, flow 412 exhibits a velocity profile 420. This velocity profile 420 is caused by surface friction (e.g., drag, viscous forces, etc.) between flow 412 and plates 406A, 406B. In velocity profile 420, the velocity of flow 412 near the center of channel 402 is significantly faster than the velocity of flow 412 near plates 406A, 406B. Because flow 412 absorbs heat from plates 406A, 406B via convection, the portion of flow 412 near plates 406A, 406B is significantly hotter than the portion of flow 412 located in the center of channel 402. Although some heat is transferred between air molecules within channel 402, when flow 412 exits channel outlet 410, flow 412 located in the center of channel 402 can be significantly cooler than the air near plates 406A, 406B. Because the rate of heat exchange is proportional to the temperature difference between the media exchanging heat, the relatively higher temperature of the stream 412 near the plates 406A, 406B reduces the rate of heat exchange between the existing stack 404 and the stream 412 .

[0039] Figure 4B is through Figure 2 A schematic cross-sectional view of an example flow 422 of channel 204A. Figure 4B In the example shown, channel 204A is away from Figure 1 The fan outlet 112 of the fan 108. That is, the channel 204A is located Figure 1 In the second region 116. Figure 4B In the example shown, the first channel 204A includes Figure 2 The first plate 202A, Figure 2 The second plate 202B, Figure 2 The first fin 209A and the second fin 209B. Figure 4B In the example shown, the second plate 202B includes an example third fin 424A and an example fourth fin 424B. Figure 4B In the example shown, flow 422 enters channel 204A and forms a Figure 1 The second angle 126. Figure 4B In the example shown, the channel 204A has an example channel inlet 428 and an example channel outlet 430 .

[0040] exist Figure 4B In the example shown, fins 209A, 209B extend from the first plate 202A into the channel 204A. Figure 4B In the example shown, the first plate 202A is located upstream of the second plate 202B relative to the fan outlet 112. That is, the fins 209A, 209B extend from the upstream plate (e.g., the plate near the fan outlet 112 of the fan 108, etc.) into the channel 204A. Figure 4BIn the example shown, the ends of the fins 209A, 209B extending from the surface 301 of the first plate 202A (eg, Figure 3 202A) are positioned closer to the channel inlet 428 than to the channel outlet 430. Similarly, the ends of the fins 209A, 209B that are displaced from the surface 301 of the first plate 202A (e.g., Figure 3 432 ) is positioned closer to the channel outlet 430 than the channel inlet 428 . In some such examples, the orientation of the fins 209A, 209B causes a portion of the flow 422 proximate the surface 301 within the first channel 204A to move along the surfaces of the fins 209A, 209B and to mix with a portion of the flow proximate the center of the first channel 204A. The mixing of the flow 422 results in a more uniform temperature distribution of the flow 422 within the first channel 204A. That is, the fins 209A, 209B promote mixing of the relatively slow, hot portion of the flow 422 proximate the surface 301 of the first plate 202A and the example surface 432 of the second plate 202B with the relatively fast, cold portion of the flow 422 located in the center of the first channel 204A. The mixing of the flow 422 increases the temperature difference between the portion of the flow 422 proximate the surfaces 301, 432 and the plates 202A, 202B, which increases the rate of heat transfer (e.g., convection rate, etc.) between the two.

[0041] exist Figure 4B In the example shown, the fins 209A, 209B, 424A, 424B include an example first hole 434A, an example second hole 434B, an example third hole 434C, and an example fourth hole 434D, respectively. The holes 434A, 434B, 434C, 434D are similar to Figure 3 Hole 316. Figure 4B In the example shown, the holes 434A, 434B allow fluid communication between the first channel 204A and the second channel 204B. Figure 4B In the example shown, holes 434C, 434D enable fluid communication between the first channel 204A and an example third channel 436 formed between the second plate 202B and an adjacent plate of the stack 102. That is, holes 434A, 434B, 434C, 434D enable a portion of the flow 422 to move from the first channel 204A into the second channel 204B and / or the third channel 436. The movement of the flow 422 between the channels 204A, 204B, 436 normalizes (e.g., equalizes, etc.) the pressure between the channels 204A, 204B, 436. Normalizing the pressure between the channels 204A, 204B, 436 normalizes the flow rates in the channels 204A, 204B, 436, which is consistent with the flow through the channels 204A. Figure 4AThis reduces the overall drag associated with air flow through the stack 102 compared to the flow through the prior art stack 404. In some examples, due to the Bernoulli effect, the holes 434A, 434B, 434C, 434D create a negative pressure region near the holes 434A, 434B, 434C, 434D, which accelerates the flow 422 away from the surfaces 301, 432 and further promotes mixing of the flow 422 within the first channel 204A.

[0042] The reduced drag associated with stack 102 reduces the power requirements of fan 108 and / or reduces the energy of stream 422 lost due to surface friction, drag, and / or viscous effects. In some such examples, the reduction in energy loss of stream 422 increases the overall flow velocity of stream 422 within stack 102, which increases the rate of heat transfer (e.g., convection rate, etc.) between stack 102 and stream 422. Additionally or alternatively, the reduction in energy loss of stream 422 enables the use of smaller and / or lower-power fans (compared to those including stack 102) in cooling system 100. Figure 4A of the existing stack 404).

[0043] In some examples, the shape of the fins 209A, 209B, 424A, 424B increases the area of ​​the plates 202A, 202B exposed to the flow 422. For example, Figure 4A The presence of fins 209A, 209B, 424A, 424B may increase the area of ​​plates 202A, 202B exposed to flow 422 by 5% compared to existing plates 406A, 406B. Figure 4A Compared to the prior art stack 404, the increased area of ​​the fins 209A, 209B increases the rate of heat exchange between the stack 102 and the flow 422. Furthermore, the fins 209A, 209B disrupt the flow 422 near the channel inlet 428, which disrupts the formation of vortices within the channel 204A. In some examples, the normalization of pressure and / or flow velocity between the channels 204A, 204B, 436 associated with the holes 434A, 434B, 434C, 434D further reduces (e.g., slows, prevents, mitigates, etc.) backflow and other turbulent effects (e.g., eddies, vortices, vortices, etc.) within the channel 204A. Thus, the fins 209A, 209B, 424A, 424B and the holes 434A, 434B, 434C, 434D mitigate (e.g., reduces, prevents, etc.) the formation of vortices within the channel 204A and the associated pressure and velocity reduction.

[0044] Figure 5 is implemented according to the teachings of this disclosure and can be used with Figure 2 A perspective view of another example fin 500 for use with the stack 102 of FIG. 5 is similar to FIG. Figure 3 In some examples, the fin 500 may be implemented as Figure 2 One or more fins in the array of fins 206 (eg, one or more fins 209A, 209B, 209C, etc.). Figure 5 In the example shown, fin 500 includes an example first end 502, an example second end 504, and an example peak 506, similar to first end 302, second end 304, and ridge 306, respectively. Figure 5 In the example shown, the second end 504 includes an example edge 508 including an example first edge end 510A and an example second edge end 510B, similar to the first edge end 320A and the second edge end 320B, respectively, unless otherwise noted. Figure 5 In the example shown, edge 508 includes example peak edge 512. Figure 5 In the example shown, the fin 500 includes an example aperture 514 , similar to the aperture 316 .

[0045] exist Figure 5 In the example shown, the peak edge 512 is positioned closer to the first end 502 than the edge ends 510A, 510B. In other words, the peak edge 512 is recessed toward the first end 502. Figure 5 In the example shown, the concavity of the peak edge 512 increases the relative size of the hole 514. In other examples, the peak edge 512 can be shifted away from the first end 502. That is, the peak edge 512 can be shifted before the second end 504 so that the peak edge 512 is upstream of the edge ends 510A, 510B. Figure 3 The fin 300 and the fin 500 are substantially V-shaped. Figure 3 Compared to fin 300, the V-shape of fin 500 is deeper (eg, stronger, etc.). Figure 3 The relatively larger size of the holes 514 in the holes 316 of the fin 300 increases the flow rate between adjacent channels of the stack 102 .

[0046] Figure 6 is implemented according to the teachings of this disclosure and can be used with Figure 2 A perspective view of another example fin 600 for use with the stack 102 of FIG. Figure 3 In some examples, the fin 600 may be implemented as Figure 2 One or more fins in the array of fins 206 (eg, one or more fins 209A, 209B, 209C, etc.). Figure 6 In the example shown, the fin 600 includes an example first end 602, an example second end 604, and an example peak 606, which are similar to the first end 302, the second end 304, and the ridge 306, respectively, unless otherwise noted. Figure 6 In the example shown, the second end 604 includes an example edge 608. Figure 6 In the example shown, the fin 600 includes an example hole 612, similar to Figure 3 Hole 316. Figure 6 In the example shown, the hole 612 includes an example first hole portion 614A located in the second end 604 and an example second hole portion 614B located on the surface 301. As used herein, the hole portions 614A, 614B are interchangeably referred to as "holes" (e.g., the first hole portion 614A is a first hole, the second hole portion 614B is a second hole, etc.), openings (e.g., the first hole portion 614A is a first opening, the second hole portion 614B is a second opening, etc.), and opening portions (e.g., the first hole portion 614A is a first opening portion, the second hole portion 614B is a second opening portion, etc.). Figure 6 In the example shown, the first hole portion 614A and the second hole portion 614B are a single hole (e.g., the hole portions 614A, 614B are continuous, etc.). In other examples, the hole portions 614A, 614B are discrete holes (e.g., a portion of the plate 202A separates the hole portions 614A, 614B, etc.). Figure 6 In the example shown, the edge 608 extends around both hole portions 614A, 614B. Figure 6 In the example shown, the hole portions 614A, 614B are separated by an example first junction 616A and an example second junction 616B. Figure 6 In the example shown, the junctions 616A, 616B are provided at the interface between the second end 604 and the surface 301. Figure 6 In the example shown, the junctions 616A, 616B define an obtuse angle between the surface 301 and the second end 604. In other examples, the junctions 616A, 616B may define a right angle and / or an acute angle.

[0047] "Include" and "comprising" (and all forms and tenses thereof) are used as opening terms in this document. Thus, whenever a claim adopts any form of "include" or "comprising" (e.g., includes, contains, has, etc.) as a preamble or is used in any type of claim recitation, it is to be understood that additional elements, terms, etc. may be present without falling outside the scope of the corresponding claim or recitation. As used herein, when the phrase "at least" is used as a transition term, such as in the preamble of a claim, it is opening in the same way that the terms "include" and "comprising" are opening. The term "and / or" when used, for example, in the form of A, B, and / or C, refers to any combination or subset of A, B, and C, such as (1) A alone, (2) B alone, (3) C alone, (4) A and B, (5) A and C, (6) B and C, or (7) A and B and C. As used herein in the context of describing structures, components, items, objects, and / or things, the phrase "at least one of A and B" is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, items, objects, and / or things, the phrase "at least one of A or B" is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. As used herein in the context of describing the execution or operation of a process, instruction, act, activity, etc., the phrase "at least one of A and B" is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing the execution or operation of a process, instruction, action, activity, etc., the phrase "at least one of A or B" is intended to refer to an implementation that includes any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B.

[0048] As used herein, singular references (e.g., "a," "an," "first," "second," etc.) do not exclude a plurality. As used herein, the term "a" or "an" object refers to one or more of that object. The terms "a" (or "an"), "one or more," and "at least one" are used interchangeably herein. Furthermore, although listed separately, multiple means, elements, or actions may be implemented by, for example, the same entity or object. Furthermore, although individual features may be included in different examples or claims, they may potentially be combined, and inclusion in different examples or claims does not imply that a combination of features is not feasible and / or advantageous.

[0049] As used herein, unless otherwise specified, the term "above" refers to the relationship of two parts relative to the earth. A first part is above a second part if the second part has at least a portion between the earth and the first part. Similarly, as used herein, a first part is "below" a second part when the first part is closer to the earth than the second part. As described above, a first part can be above or below a second part and have one or more of the following conditions: there are other parts between them, there are no other parts between them, the first part is in contact with the second part, or the first part and the second part are not in direct contact with each other.

[0050] As used in this patent, the statement that any part (e.g., a layer, film, region, area, or plate) is located on another part in any manner (e.g., positioned on another part, located on another part, disposed on another part, or formed on another part, etc.) indicates that the mentioned part is in contact with the other part, or that the mentioned part is located above the other part with one or more intermediate parts in between.

[0051] As used herein, unless otherwise specified, connection references (e.g., attachment, coupling, connection, and engagement) may include intermediate members between the elements to which the connection reference is made and / or relative movement between such elements. Thus, a connection reference does not necessarily infer that two elements are directly connected and / or fixed to each other. As used herein, the statement that any part is "in contact with" another part is defined to mean that there are no intermediate parts between the two parts.

[0052] Unless otherwise specifically stated, descriptors used herein, such as "first," "second," "third," etc., do not imply or otherwise indicate any meaning of priority, physical order, arrangement in a list, and / or ordering in any manner, but are merely used as labels and / or arbitrary names to distinguish elements to facilitate understanding of the disclosed examples. In some examples, the descriptor "first" may be used to refer to an element in a specific embodiment, while the same element may be referred to by different descriptors (such as "second" or "third") in the claims. In such cases, it should be understood that such descriptors are only used to clearly identify these elements in the context of the discussion (e.g., in the claims), and in other cases, these elements may, for example, share the same name.

[0053] As used herein, "approximately" and "about" modify their subject / value to recognize possible variations that occur in real-world applications. For example, "approximately" and "approximately" may modify a dimension that may not be exact due to manufacturing tolerances and / or other real-world imperfections that would be understood by one of ordinary skill in the art. For example, unless otherwise specified herein, "approximately" and "about" may indicate that such dimension may be within a tolerance range of + / - 10%.

[0054] As used herein, "substantially real time" means occurring in a nearly instantaneous manner, recognizing that there may be real-world delays in computing time, transmission, etc. Thus, unless otherwise indicated, "substantially real time" means real time + / - 1 second.

[0055] As used herein, the phrase "communicating with..." (including variations thereof) encompasses direct communication and / or indirect communication through one or more intermediate components, and does not require direct physical (e.g., wired) communication and / or constant communication, but also includes selective communication at periodic intervals, scheduled intervals, non-periodic intervals and / or one-time events.

[0056] As used herein, “programmable circuitry” is defined to include (i) one or more special-purpose circuits (e.g., application-specific circuits (ASICs)) that are constructed to perform specific operation(s) and include one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors), and / or (ii) one or more general-purpose semiconductor-based circuits that are programmed with instructions to perform specific functions and / or operations and include one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors). Examples of programmable circuits include a programmable microprocessor, such as a central processor unit (CPU), which can execute a first instruction to perform one or more operations and / or functions; a field programmable gate array (FPGA), which can be programmed with a second instruction so that the FPGA is configured and / or constructed to instantiate one or more operations and / or functions corresponding to the first instruction; a graphics processor unit (GPU), which can execute a first instruction to perform one or more operations and / or functions; a digital signal processor (DSP), which can execute a first instruction to perform one or more operations and / or functions; an XPU; a network processing unit (NPU); one or more microcontrollers, which can execute a first instruction to perform one or more operations and / or functions; and / or an integrated circuit, such as an application specific integrated circuit (ASIC). For example, an XPU may be implemented by a heterogeneous computing system that includes multiple types of programmable circuits (e.g., one or more FPGAs, one or more CPUs, one or more GPUs, one or more NPUs, one or more DSPs, etc., and / or any combination(s) of these), and orchestration technology (e.g., one or more application programming interfaces (APIs)) that can assign(one or more) computing tasks to any one(or more) of the multiple types of programmable circuits that is best suited and available to perform the(one or more) computing tasks.

[0057] As used herein, an integrated circuit is defined as one or more semiconductor packages containing one or more circuit elements, such as transistors, capacitors, inductors, resistors, current paths, diodes, etc. For example, an integrated circuit may be implemented as one or more of an ASIC, an FPGA, a chip, a microchip, a programmable circuit, a semiconductor substrate coupling multiple circuit elements, a system on chip (SoC), etc.

[0058] The examples disclosed herein include stacks with 3D shark fin perforations that can be used with existing fin designs. The examples disclosed herein can be used with any cooling system that includes a fin structure (e.g., any device including a fan and a stack, etc.). For example, the fin structure disclosed herein can be used with notebook computers, desktops, and workstations. The examples disclosed herein improve the performance (e.g., efficiency, cooling capacity, etc.) of air-cooled computing systems. The examples disclosed herein improve the thermal capacity and thermal design power of cooling systems that include such stacks. Some example stacks disclosed herein increase the thermal design power (TDP) of computing devices by approximately 7%. Compared to existing fin designs, the examples disclosed herein do not increase the material cost or manufacturing time of the stack.

[0059] Disclosed herein is a cooling system comprising a stack having fins. Further examples and combinations include the following:

[0060] Example 1 includes a computing device comprising: a heat generating component; a stack thermally coupled to the heat generating component, the stack comprising: a first plate; a second plate, the first plate and the second plate defining a channel therebetween; and a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent to the surface; a second end remote from the surface; and a ridge extending between the first end and the second end, the ridge being inclined at an angle relative to the surface; and a fan for directing air through the channel.

[0061] Example 2 includes the computing device of any preceding example, wherein the channel includes an inlet adjacent to the fan and an outlet distal to the fan, the first end being closer to the inlet than to the outlet.

[0062] Example 3 includes the computing device of any preceding example, wherein the first plate is adjacent to the fan and the second plate is distal to the fan.

[0063] Example 4 includes the computing device of any preceding example, wherein the fin further includes an opening at the second end.

[0064] Example 5 includes the computing device of any preceding example, wherein the opening is triangular.

[0065] Example 6 includes the computing device of any preceding example, wherein the opening comprises: a first opening portion in the fin; and a second opening portion on the surface.

[0066] Example 7 includes the computing device of any preceding example, wherein the first end is flush with the surface and the second end is displaced from the surface.

[0067] Example 8 includes the computing device of any preceding example, wherein the fin is a first fin, and the stack further comprises: a second fin extending from the first plate into the channel, the second fin aligned with the first fin along a first axis; and a third fin extending from the first plate into the channel, the third fin aligned with the first fin along a second axis perpendicular to the first axis.

[0068] Example 9 includes the computing device of any preceding example, wherein the fin is a first fin, the channel is a first channel, and the stack further comprises: a third plate, the first plate being between the second plate and the third plate, the third plate and the first plate defining a second channel; and a second fin extending from the third plate into the second channel.

[0069] Example 10 includes the computing device of any preceding example, wherein the ridge extends monotonically between the first end and the second end.

[0070] Example 11 includes the computing device of any preceding example, wherein the ridge extends linearly between the first end and the second end.

[0071] Example 12 includes a thermally conductive stack comprising: a first plate; a second plate, the first plate and the second plate defining a channel; and a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent to the surface; a second end distal to the surface; and a ridge extending between the first end and the second end, the ridge being arranged at an oblique angle relative to the surface.

[0072] Example 13 includes the thermally conductive stack of any preceding example, wherein the second end includes a V-shaped opening.

[0073] Example 14 includes the thermally conductive stack of any preceding example, wherein the V-shaped opening extends through the first plate.

[0074] Example 15 includes the thermally conductive stack of any preceding example, wherein the V-shaped opening comprises: a first opening in the second end; and a second opening in the surface.

[0075] Example 16 includes the thermally conductive stack of any preceding example, wherein the first plate further comprises a plurality of fins, the plurality of fins including the fin.

[0076] Example 17 includes the thermally conductive stack of any preceding example, wherein the plurality of fins has a grid pattern on the first plate.

[0077] Example 18 includes the thermally conductive stack of any preceding example, wherein the fin is a first fin, the channel is a first channel, and the thermally conductive stack further comprises: a third plate, the first plate being between the second plate and the third plate, the third plate and the second plate defining a second channel; and a second fin extending into the second channel.

[0078] Example 19 includes the thermally conductive stack of any preceding example, wherein the fin increases mixing of flow in the channel.

[0079] Example 20 includes the thermally conductive stack of any preceding example, wherein the ridge extends monotonically between the first end and the second end.

[0080] Example 21 includes the thermally conductive stack of any preceding example, wherein the ridge extends linearly between the first end and the second end.

[0081] Example 22 includes the thermally conductive stack of any preceding example, wherein the ridge defines an acute angle with the surface of the first plate.

[0082] Example 23 includes a thermally conductive sheet for a cooling system, the thermally conductive sheet comprising: a first fin extending from a surface of the thermally conductive sheet, the first fin comprising: a first end flush with the surface; a second end displaced from the surface; and a ridge extending between the first end and the second end; and a second fin extending from the surface and having the same shape as the first fin.

[0083] Example 24 includes the thermal pad of any preceding example, wherein the first fin includes an edge at the second end, the edge including: a third end at the surface; and a fourth end at the surface, the ridge being recessed toward the first end relative to the third end and the fourth end.

[0084] Example 25 includes the thermally conductive sheet of any preceding example, wherein the second end is spaced apart from the thermally conductive sheet by a height, the ridge has a length, and the length is at least ten times the height.

[0085] Example 26 includes the thermally conductive sheet of any preceding example, wherein the second end includes an opening extending through the thermally conductive sheet.

[0086] Example 27 includes the thermally conductive sheet of any preceding example, wherein the opening includes an edge including a junction having an obtuse angle.

[0087] Example 28 includes the thermally conductive sheet of any preceding example, wherein the thermally conductive sheet has a first thickness, and the first fin has a second thickness substantially equal to the first thickness.

[0088] Example 29 includes the thermally conductive sheet of any preceding example, wherein the first fin is in the shape of a shark fin.

[0089] Example 30 includes the thermally conductive sheet of any preceding example, wherein the ridge extends monotonically between the first end and the second end.

[0090] Example 31 includes the thermally conductive sheet of any preceding example, wherein the ridge defines an acute angle with the surface.

[0091] The following claims are incorporated into this detailed description by reference. Although some example systems, devices, articles of manufacture, and methods are disclosed herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers all systems, devices, articles of manufacture, and methods that fully fall within the scope of the claims of this patent.

Claims

1. A computing device comprising: Heating components; A stack, thermally coupled to the heat generating component, the stack comprising: First board; a second plate, wherein the first plate and the second plate define a channel therebetween; a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent the surface; a second end, distal from the surface; a ridge extending between the first end and the second end, the ridge being inclined at an angle relative to the surface; and A fan is configured to direct air through the passage.

2. The computing device of claim 1, wherein: The channel includes: an inlet adjacent the fan; and The outlet is away from the fan, and the first end is closer to the inlet than the outlet.

3. The computing device of claim 2, wherein: The first plate is adjacent to the fan, and the second plate is distal to the fan. The computing device according to claim 1 , wherein: The fin also includes an opening at the second end.

5. The computing device of claim 4, wherein: The opening comprises: a first opening portion in the fin; and The second opening portion is on the surface.

6. The computing device according to any one of claims 1 to 5, wherein: The first end is flush with the surface and the second end is displaced from the surface.

7. The computing device according to any one of claims 1 to 5, wherein: The fin is a first fin, the channel is a first channel, and the stack further comprises: a third plate, the first plate being between the second plate and the third plate, the third plate and the first plate defining a second channel; and A second fin extends from the third plate into the second channel.

8. The computing device according to any one of claims 1 to 5, wherein: The ridge extends linearly between the first end and the second end.

9. A thermally conductive stack comprising: First board; a second plate, the first plate and the second plate defining a channel; as well as a fin extending from a surface of the first plate into the channel, the fin comprising: a first end adjacent the surface; a second end, distal from the surface; and A ridge extends between the first end and the second end, the ridge being disposed at an oblique angle relative to the surface.

10. The thermally conductive stack according to claim 9, wherein: The second end includes a V-shaped opening.

11. The thermally conductive stack according to claim 10, wherein: The V-shaped opening extends through the first plate.

12. The thermally conductive stack according to claim 11, wherein: The V-shaped opening comprises: a first opening in the second end; and A second opening is in the surface.

13. The thermally conductive stack according to any one of claims 9 to 12, wherein: The first plate further includes a plurality of fins including the fin.

14. The thermally conductive stack according to any one of claims 9 to 12, wherein: The fin is a first fin, the channel is a first channel, and the thermally conductive stack further comprises: a third plate, the first plate being between the second plate and the third plate, the third plate and the second plate defining a second channel; and A second fin extends into the second channel.

15. The thermally conductive stack according to any one of claims 9 to 12, wherein: The fins increase mixing of the flow in the channel.

16. The thermally conductive stack according to any one of claims 9 to 12, wherein: The ridge extends monotonically between the first end and the second end.

17. A heat conducting sheet for a cooling system, the heat conducting sheet comprising: A first fin extends from a surface of the heat conducting sheet, the first fin comprising: a first end, flush with the surface; a second end displaced from the surface; and a ridge extending between the first end and the second end; and A second fin extends from the surface and has the same shape as the first fin.

18. The thermally conductive sheet according to claim 17, wherein: The first fin includes an edge at the second end, the edge including: a third end at the surface; and At the fourth end, at the surface, the ridge is recessed toward the first end relative to the third end and the fourth end.

19. The thermally conductive sheet according to claim 17, wherein: The second end includes an opening extending through the thermally conductive sheet.

20. The thermally conductive sheet according to claim 19, wherein The opening includes an edge including a junction having an obtuse angle.

21. The thermally conductive sheet according to claim 17, wherein The ridge extends monotonically between the first end and the second end.

22. The thermally conductive sheet according to claim 17, wherein The second end is spaced apart from the thermally conductive sheet by a height, the ridge has a length, and the length is at least ten times the height.

23. The thermally conductive sheet according to any one of claims 17 to 22, wherein: The first fin is in the shape of a shark fin.

24. The thermally conductive sheet according to any one of claims 17 to 22, wherein: The thermally conductive sheet has a first thickness, and the first fin has a second thickness substantially equal to the first thickness.

25. The thermally conductive sheet according to any one of claims 17 to 22, wherein: The ridge defines an acute angle with the surface.

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