An integrated packaging device for chip production

Abstract

This invention discloses an integrated packaging device for chip production, relating to the field of chip packaging technology. It includes: a chassis with a slide rail fixedly installed on the bottom of the chassis's inner wall; a sliding plate slidably installed on top of the slide rail for moving back and forth on the slide rail; a packaging device disposed on the top of the chassis's inner wall for packaging the chip and its casing; and a mechanical gripper disposed on the bottom of the chassis's inner wall for placing the casing. An L-shaped rod is fixedly installed on the surface of the packaging device, a pulley frame is slidably installed on the top of the slide rail, and a positioning frame is fixedly installed on the top of the sliding plate. The upward movement of the sliding plate drives the packaged chip upward, preventing the chip from getting stuck inside the positioning frame after packaging, thus avoiding difficulties in removal and improving processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to an integrated packaging device for chip production. Background Technology

[0002] Chip packaging is a casing used to house circuit chips. During the assembly process that requires chip packaging, a pressure device is used to apply pressure and fasten the casing and some components.

[0003] Patent publication number CN220474571U relates to a chip packaging device, including an assembly frame and a chip shell positioning frame. The chip shell positioning frame is mounted on the top surface of the bottom end of the assembly frame, and a connecting block is mounted above the chip shell positioning frame. A pressing rod is provided on the bottom surface of the connecting block. A mounting plate is mounted on the top surface of the connecting block, and an operating lever is provided on the top surface of the end of the mounting plate. The operating lever passes through the top frame of the assembly frame, and a pressure spring is sleeved on the outer side of the operating lever, located between the mounting plate and the assembly frame. This chip packaging device allows the operating lever to pull the mounting plate and the connecting block, and subsequently, the chip and shell are placed stably by the chip shell positioning frame, facilitating center alignment and maintaining stability during the pressure packaging process. The pressing spring then pushes the chip and shell for compression.

[0004] In the aforementioned patent, the chip and casing are placed stably by a chip casing positioning frame to facilitate center alignment and maintain stability during the pressure packaging process. The chip and casing are then squeezed by the elastic force of a pressure spring. However, after packaging, the chip may get stuck in the positioning frame, making it difficult to remove and affecting processing efficiency. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an integrated packaging device for chip manufacturing, solving the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an integrated packaging device for chip production, comprising: a chassis; a slide rail, the slide rail being fixedly installed at the bottom of the inner wall of the chassis; a translation slide plate, the translation slide plate being slidably installed at the top of the slide rail, the translation slide plate being used to move back and forth on the slide rail; a packaging device, the packaging device being disposed at the top of the inner wall of the chassis, the packaging device being used to package the chip and the casing; a mechanical gripper, the mechanical gripper being disposed at the bottom of the inner wall of the chassis, the mechanical gripper being used to place the casing; an L-shaped rod being fixedly installed on the surface of the packaging device; a pulley frame being slidably installed at the top of the slide rail; a positioning frame being fixedly installed at the top of the translation slide plate; a sliding plate being slidably installed on the inner wall of the translation slide plate; a limiting block being fixedly installed on the inner wall of the translation slide plate; a connecting frame being fixedly installed at the bottom of the translation slide plate; an arc-shaped rotating plate being rotatably installed on the inner wall of the connecting frame; a limiting plate being fixedly installed on the inner wall of the connecting frame; the upward movement of the arc-shaped rotating plate pushes the connecting frame and the sliding plate upward, and the upward movement of the sliding plate drives the packaged chip upward.

[0007] According to the above technical solution, a torsion spring is provided between the connecting frame and the arc-shaped rotating plate. When the arc-shaped rotating plate is separated from the pulley frame, the elastic force of the torsion spring will drive the arc-shaped rotating plate to reset, and the limiting plate will contact the surface of the arc-shaped rotating plate.

[0008] According to the above technical solution, the positioning frame is provided with a correction device for correcting the chip and a limiting device for limiting the translation slide. The correction device includes a slide rod, a sliding seat, a hinge rod, a connecting plate, a push plate, and an elastic telescopic plate. During the downward movement of the packaging equipment, the L-shaped rod will move downward, the downward movement of the L-shaped rod will push the connecting plate downward, the downward movement of the connecting plate will drive the slide rod downward, and the downward movement of the slide rod will drive the hinge rod downward. The slide rod slides through the surface of the translation slide. The sliding seat is slidably installed on the top of the translation slide. One end of the hinge rod is rotatably installed on the inner wall of the slide rod, and the other end of the hinge rod is rotatably installed on the inner wall of the sliding seat. The connecting plate is fixedly installed on the top of the slide rod, the push plate is fixedly installed on the surface of the sliding seat, and the elastic telescopic plate is fixedly installed on the bottom of the push plate.

[0009] According to the above technical solution, a short plate is fixedly installed on the surface of the push plate, a correction plate is slidably installed on the inner wall of the positioning frame, a trapezoidal block is fixedly installed on the surface of the correction plate, and a fixing block is fixedly installed on the top of the translation slide plate. When the short plate moves towards the chip, it will push the trapezoidal block to move away from the positioning frame. When the trapezoidal block moves away from the positioning frame, it will drive the correction plate to move away from the positioning frame.

[0010] According to the above technical solution, a first spring is provided between the sliding rod and the translation slide plate. When the connecting plate is separated from the L-shaped rod, the elastic force of the first spring will drive the sliding rod to reset. A second spring is provided between the sliding seat and the translation slide plate. When the sliding rod is reset, the sliding seat will reset under the elastic force of the second spring after losing the compression. A third spring is provided between the positioning frame and the correction plate. When the trapezoidal block is separated from the short plate, the elastic force of the third spring will drive the correction plate to reset.

[0011] According to the above technical solution, the limiting device includes a fixed block, a slot, a sliding block, and a locking plate. The locking plate moves downward by the downward movement of the connecting plate, and the locking plate moves downward and locks into the slot. The slot limits the locking plate. The fixed block is fixedly installed on the top of the sliding slide plate, the slot is fixedly installed on the surface of the slide rail, the sliding block is slidably installed on the inner wall of the slot, and the locking plate is fixedly installed on the surface of the connecting plate.

[0012] According to the above technical solution, an L-shaped plate is fixedly installed at the bottom of the sliding block, an air blower is fixedly installed on the inner wall of the chassis, a sliding plate is slidably installed on the surface of the air blower, the end of the L-shaped plate away from the sliding block is fixedly installed at the bottom of the sliding plate, and a perforated plate is fixedly installed on the inner wall of the air blower. When the sliding block moves downward, it will push the L-shaped plate downward, and the downward movement of the L-shaped plate will drive the sliding plate downward. When the sliding plate moves downward, it will overlap with the perforated plate. After overlapping, the air blower will blow air onto the chip surface to cool it down.

[0013] According to the above technical solution, a No. 4 spring is provided between the sliding block and the slot. When the sliding block is separated from the slot, the elastic force of the No. 4 spring will drive the sliding block to reset. A No. 5 spring is provided between the air blower and the slide plate. When the sliding block resets, the slide plate will reset under the elastic force of the No. 5 spring after losing the compression.

[0014] This invention provides an integrated packaging apparatus for chip manufacturing. It has the following advantages:

[0015] (1) In this invention, the chip after packaging is moved upward by the upward movement of the sliding plate, which prevents the chip from being stuck inside the positioning frame after packaging and difficult to remove, thus affecting the processing efficiency. At the same time, when the sliding plate moves the connecting frame and the arc-shaped rotating plate to reset, the arc-shaped rotating plate will rotate upward when it contacts the pulley frame, so that the arc-shaped rotating plate will not move upward during the reset process, thus preventing the arc-shaped rotating plate from moving upward back and forth during the process, which would lead to increased wear and reduced service life.

[0016] (2) In this invention, the pusher moves towards the chip to clamp the two sides of the chip, preventing the chip from moving during the packaging process, which would cause the packaging to shift and affect the processing results. At the same time, the pusher moves towards the chip, which will cause the short plate to move towards the chip. The short plate moves towards the chip, which will push the trapezoidal block to move away from the positioning frame. The trapezoidal block moves away from the positioning frame, which will cause the correction plate to move away from the positioning frame. The position of the chip is corrected by the correction plate moving away from the positioning frame, ensuring that the chip and the shell are directly below the packaging equipment, thereby improving the processing efficiency.

[0017] (3) In this invention, the fixing block limits the descent height of the connecting plate during the downward movement of the connecting plate, so as to prevent excessive mechanical stress from damaging the chip surface or internal circuit when the packaging equipment moves downward, thereby improving the protection effect of chip packaging. The card slot limits the card plate to prevent the translation slide from moving during the packaging process, which would cause misalignment of the packaging position and affect the packaging effect. The slide moves downward and overlaps with the cutout plate. After overlap, the air blower blows air onto the chip surface to cool it down, preventing the local temperature of the packaging area from being too high during packaging, which would affect the packaging quality and chip performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0020] Figure 3 This is a schematic diagram of the translational sliding plate structure of the present invention;

[0021] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of section A in the middle;

[0022] Figure 5 This is a schematic diagram of the cross-sectional structure of the positioning frame of the present invention;

[0023] Figure 6 For the present invention Figure 5 Enlarged schematic diagram of section B;

[0024] Figure 7 This is a schematic cross-sectional view of the air blowing machine of the present invention.

[0025] In the diagram: 1. Chassis; 2. Slide rail; 3. Translation slide plate; 4. Packaging equipment; 41. L-shaped rod; 5. Mechanical claw; 6. Pulley frame; 7. Positioning frame; 8. Sliding plate; 9. Limiting block; 10. Connecting frame; 11. Arc-shaped rotating plate; 12. Limiting plate; 13. Slide rod; 131. Sliding seat; 132. Hinge rod; 133. Connecting plate; 134. Push plate; 135. Short plate; 136. Elastic telescopic plate; 137. Trapezoidal block; 138. Correction plate; 14. Fixing block; 141. Slot; 142. Sliding block; 143. Card plate; 144. L-shaped plate; 145. Air blower; 146. Slide plate; 147. Hollow plate. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1-4 One embodiment of the present invention is: an integrated packaging device for chip production, comprising: a chassis 1; a slide rail 2, the slide rail 2 being fixedly installed on the bottom of the inner wall of the chassis 1; a translation slide plate 3, the translation slide plate 3 being slidably installed on the top of the slide rail 2, the translation slide plate 3 being used to move back and forth on the slide rail 2; a packaging device 4, the packaging device 4 being disposed on the top of the inner wall of the chassis 1, the packaging device 4 being used to package the chip and the casing; a mechanical gripper 5, the mechanical gripper 5 being disposed on the bottom of the inner wall of the chassis 1, the mechanical gripper 5 being used to place the casing; an L-shaped rod 41 being fixedly installed on the surface of the packaging device 4; a pulley frame 6 being slidably installed on the top of the slide rail 2; a positioning frame 7 being fixedly installed on the top of the translation slide plate 3; a sliding plate 8 being slidably installed on the inner wall of the translation slide plate 3; a limiting block 9 being fixedly installed on the inner wall of the translation slide plate 3; a connecting frame 10 being fixedly installed at the bottom of the translation slide plate 3; an arc-shaped rotating plate 11 being rotatably installed on the inner wall of the connecting frame 10; and a limiting plate 12 being fixedly installed on the inner wall of the connecting frame 10 to prevent the chip from getting stuck inside the positioning frame 7 after packaging, which would be difficult to remove and affect processing efficiency.

[0028] A torsion spring is provided between the connecting frame 10 and the arc-shaped rotating plate 11. When the arc-shaped rotating plate 11 is separated from the pulley frame 6, the elastic force of the torsion spring will drive the arc-shaped rotating plate 11 to reset, and the limiting plate 12 will contact the surface of the arc-shaped rotating plate 11.

[0029] In this embodiment, the chip is first placed in the positioning frame 7. Then, the translation slide 3 is activated, moving to the bottom of the packaging device 4. The mechanical gripper 5 then places the outer casing above the chip, aligning it with the casing. The packaging device 4 then moves downwards to package the chip, eliminating the need for manual packaging and making the operation convenient. After packaging, the translation slide 3 moves away from the packaging device 4. This movement causes the sliding plate 8 to move away from the packaging device 4, which in turn causes the connecting frame 10 to move away from the packaging device 4. The connecting frame 10 then moves away from the packaging device 4, which in turn causes the arc-shaped rotating plate 11 to move away from the packaging device 4. As the rotating plate 11 moves away from the packaging equipment 4, it comes into contact with the pulley frame 6. The curved rotating plate 11 is limited by the limiting plate 12, causing the pulley frame 6 to push the curved rotating plate 11 upward as it moves away from the packaging equipment 4. The upward movement of the curved rotating plate 11 pushes the connecting frame 10 and the sliding plate 8 upward. The upward movement of the sliding plate 8 drives the packaged chip upward, preventing the chip from getting stuck inside the positioning frame 7 after packaging and being difficult to remove, which would affect processing efficiency. At the same time, when the sliding plate 3 moves the connecting frame 10 and the curved rotating plate 11 to reset, the curved rotating plate 11 will rotate upward when it comes into contact with the pulley frame 6, preventing the curved rotating plate 11 from moving upward during the reset process. This prevents the curved rotating plate 11 from moving upward back and forth during the process, which would increase wear and reduce service life.

[0030] Please see Figures 1-7 Based on the above embodiments, in another embodiment of the present invention, the positioning frame 7 is provided with a correction device for correcting the chip and a limiting device for limiting the translation slide plate 3. The correction device includes a slide rod 13, a sliding seat 131, a hinge rod 132, a connecting plate 133, a push plate 134, and an elastic telescopic plate 136. The slide rod 13 slides through the surface of the translation slide plate 3, the sliding seat 131 is slidably mounted on the top of the translation slide plate 3, one end of the hinge rod 132 is rotatably mounted on the inner wall of the slide rod 13, and the other end of the hinge rod 132 is rotatably mounted on the inner wall of the sliding seat 131. The connecting plate 133 is fixedly mounted on the top of the slide rod 13, the push plate 134 is fixedly mounted on the surface of the sliding seat 131, and the elastic telescopic plate 136 is fixedly mounted on the bottom of the push plate 134. The push plate 134 moves towards the chip to clamp both sides of the chip, preventing the chip from moving during the packaging process, which would cause the packaging to shift and affect the processing results.

[0031] A short plate 135 is fixedly installed on the surface of the push plate 134, a correction plate 138 is slidably installed on the inner wall of the positioning frame 7, a trapezoidal block 137 is fixedly installed on the surface of the correction plate 138, and a fixing block 14 is fixedly installed on the top of the translation slide plate 3. The position of the chip is corrected by moving the correction plate 138 away from the positioning frame 7, ensuring that the chip and the shell are directly below the packaging equipment 4, thereby improving processing efficiency.

[0032] A first spring is installed between the slide rod 13 and the translation slide plate 3. When the connecting plate 133 is disengaged from the L-shaped rod 41, the elastic force of the first spring will cause the slide rod 13 to return to its original position. A second spring is installed between the sliding seat 131 and the translation slide plate 3. When the slide rod 13 returns to its original position, the sliding seat 131 will return to its original position under the elastic force of the second spring after it loses its compression. A third spring is installed between the positioning frame 7 and the correction plate 138. When the trapezoidal block 137 is disengaged from the short plate 135, the elastic force of the third spring will cause the correction plate 138 to return to its original position.

[0033] The limiting device includes a fixed block 14, a slot 141, a sliding block 142, and a locking plate 143. The fixed block 14 is fixedly installed on the top of the translation slide plate 3, the slot 141 is fixedly installed on the surface of the slide rail 2, the sliding block 142 is slidably installed on the inner wall of the slot 141, and the locking plate 143 is fixedly installed on the surface of the connecting plate 133 to prevent the translation slide plate 3 from moving during the packaging process, which would cause misalignment of the packaging position and affect the packaging effect.

[0034] An L-shaped plate 144 is fixedly installed at the bottom of the sliding block 142. An air blower 145 is fixedly installed on the inner wall of the chassis 1. A sliding plate 146 is slidably installed on the surface of the air blower 145. The end of the L-shaped plate 144 away from the sliding block 142 is fixedly installed at the bottom of the sliding plate 146. A perforated plate 147 is fixedly installed on the inner wall of the air blower 145 to prevent the local temperature of the packaging area from becoming too high during packaging, which would affect the packaging quality and chip performance.

[0035] A fourth spring is provided between the sliding block 142 and the slot 141. When the sliding block 142 is disengaged from the card plate 143, the elastic force of the fourth spring will cause the sliding block 142 to reset. A fifth spring is provided between the air blower 145 and the slide plate 146. When the sliding block 142 is reset, the slide plate 146 will reset under the elastic force of the fifth spring after the pressure is lost.

[0036] In this embodiment, during operation: the packaging device 4 moves downward, causing the L-shaped rod 41 to move downward. The downward movement of the L-shaped rod 41 pushes the connecting plate 133 downward, which in turn causes the sliding rod 13 to move downward. The sliding rod 13 then causes the hinge rod 132 to move downward, which in turn pushes the sliding seat 131 towards the chip. This movement of the sliding seat 131 towards the chip causes the push plate 134 to move towards the chip. The push plate 134's movement towards the chip clamps both sides of the chip, preventing... During the packaging process, chip movement causes packaging misalignment, affecting processing results. Simultaneously, the movement of the pusher plate 134 towards the chip causes the short plate 135 to move towards the chip. The movement of the short plate 135 towards the chip pushes the trapezoidal block 137 away from the positioning frame 7. The movement of the trapezoidal block 137 away from the positioning frame 7 causes the straightening plate 138 to move away from the positioning frame 7. By moving the straightening plate 138 away from the positioning frame 7, the position of the chip is corrected, ensuring that the chip and the casing are directly below the packaging equipment 4, thus improving processing efficiency.

[0037] During the downward movement of the connecting plate 133, the fixing block 14 limits the descent height of the connecting plate 133 to prevent excessive mechanical stress from damaging the chip surface or internal circuitry when the packaging equipment 4 moves downward, thus improving the protection effect of the chip packaging. At the same time, the downward movement of the connecting plate 133 drives the card plate 143 to move downward. The card plate 143 moves downward and gets stuck between the card slots 141. The card slots 141 limit the card plate 143 to prevent the translation slide plate 3 from moving during the packaging process, which would cause misalignment of the packaging position and affect the packaging effect. At the same time, the downward movement of the card plate 143 pushes the sliding block 142 to move downward. The downward movement of the sliding block 142 pushes the L-shaped plate 144 to move downward. The downward movement of the L-shaped plate 144 drives the slide plate 146 to move downward. The slide plate 146 moves downward and overlaps with the cutout plate 147. After overlap, the air blower 145 blows air onto the chip surface to cool it down, preventing the local temperature of the packaging area from becoming too high during packaging, which would affect the packaging quality and chip performance.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated packaging apparatus for chip manufacturing, comprising: Chassis (1), characterized in that: Slide rail (2), the slide rail (2) is fixedly installed on the bottom of the inner wall of the chassis (1); A translation slide plate (3) is slidably mounted on top of a slide rail (2) and is used to move back and forth on the slide rail (2); Packaging equipment (4), which is located on the top of the inner wall of the chassis (1), is used to package the chip and the casing; Mechanical claw (5), the mechanical claw (5) is set at the bottom of the inner wall of the chassis (1), the mechanical claw (5) is used to place the outer shell; The packaging device (4) is fixedly mounted with an L-shaped rod (41), the slide rail (2) is slidably mounted with a pulley frame (6), the top of the translation slide plate (3) is fixedly mounted with a positioning frame (7), the inner wall of the translation slide plate (3) is slidably mounted with a sliding plate (8), the inner wall of the translation slide plate (3) is fixedly mounted with a limiting block (9), the bottom of the translation slide plate (3) is fixedly mounted with a connecting frame (10), the inner wall of the connecting frame (10) is rotatably mounted with an arc-shaped rotating plate (11), the inner wall of the connecting frame (10) is fixedly mounted with a limiting plate (12), and the positioning frame (7) is provided with a correction device for correcting the chip and a limiting device for limiting the translation slide plate (3); The correction device includes a slide rod (13), a sliding seat (131), a hinge rod (132), a connecting plate (133), a push plate (134), and an elastic telescopic plate (136). The slide rod (13) slides through the surface of the translation slide plate (3). The sliding seat (131) is slidably mounted on the top of the translation slide plate (3). One end of the hinge rod (132) is rotatably mounted on the inner wall of the slide rod (13), and the other end of the hinge rod (132) is rotatably mounted on the inner wall of the sliding seat (131). The connecting plate (133) is fixedly mounted on the top of the slide rod (13). The push plate (134) is fixedly mounted on the surface of the sliding seat (131), and the elastic telescopic plate (136) is fixedly mounted on the bottom of the push plate (134). A short plate (135) is fixedly installed on the surface of the push plate (134), a correction plate (138) is slidably installed on the inner wall of the positioning frame (7), a trapezoidal block (137) is fixedly installed on the surface of the correction plate (138), and a fixing block (14) is fixedly installed on the top of the translation slide plate (3). A first spring is provided between the slide bar (13) and the translation slide plate (3), a second spring is provided between the sliding seat (131) and the translation slide plate (3), and a third spring is provided between the positioning frame (7) and the correction plate (138). The limiting device includes a fixed block (14), a slot (141), a sliding block (142), and a locking plate (143). The fixed block (14) is fixedly installed on the top of the translation slide plate (3), the slot (141) is fixedly installed on the surface of the slide rail (2), the sliding block (142) is slidably installed on the inner wall of the slot (141), and the locking plate (143) is fixedly installed on the surface of the connecting plate (133). An L-shaped plate (144) is fixedly installed at the bottom of the sliding block (142), an air blower (145) is fixedly installed on the inner wall of the housing (1), a sliding plate (146) is slidably installed on the surface of the air blower (145), one end of the L-shaped plate (144) away from the sliding block (142) is fixedly installed at the bottom of the sliding plate (146), and a perforated plate (147) is fixedly installed on the inner wall of the air blower (145). A No. 4 spring is provided between the sliding block (142) and the slot (141), and a No. 5 spring is provided between the air blower (145) and the slide plate (146).

2. The integrated packaging apparatus for chip manufacturing according to claim 1, characterized in that: A torsion spring is provided between the connecting frame (10) and the arc-shaped rotating plate (11), and the limiting plate (12) is in contact with the surface of the arc-shaped rotating plate (11).

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