Periscopic camera module shell and manufacturing method thereof

Abstract

The invention discloses a periscopic camera module shell and a manufacturing method thereof, and relates to the technical field of camera module shell manufacturing, and the method comprises the steps: providing a sheet-shaped substrate, carrying out the stamping of the sheet-shaped substrate according to the design requirements of the periscopic camera module shell, and forming a light through hole in the sheet-shaped substrate; carrying out electroplating treatment on the sheet-shaped substrate subjected to the stamping treatment; carrying out bending treatment on the sheet-shaped substrate subjected to the electroplating treatment to obtain a formed primary shell; the first electroplated layer and the second electroplated layer of the primary shell are subjected to laser etching treatment; and performing blackening treatment on the preliminary shell after laser etching treatment to obtain the periscopic camera module shell. According to the periscopic camera module shell prepared by the invention, the light reflection phenomenon is reduced, the generation of stray light is inhibited, and the image quality and definition of the camera module are improved. Therefore, the technical problem that the extinction effect of the periscopic camera module shell in the prior art is poor is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of camera module housing manufacturing, and in particular to a periscope camera module housing and a manufacturing method thereof. Background Art

[0002] As portable electronic devices such as smartphones continue to evolve towards thinner, lighter, and higher-quality imaging, periscope camera modules are gaining widespread adoption due to their ability to achieve long-range optical zoom within a limited thickness. Periscope camera modules typically use prisms or mirrors to redirect the optical path, allowing the optical components to be arranged horizontally, effectively reducing the overall thickness of the module.

[0003] In the prior art, the outer shell of a periscope camera module plays a crucial role. It not only secures and protects the precision optical components (such as prisms, lenses, and image sensors) within the module, but its structural design also directly impacts the stability and quality of the imaging optical path. To prevent unnecessary reflection of light from the inner wall of the light hole, which can reduce image contrast and clarity and produce glare or ghosting, the inner wall of the light hole is typically sprayed with black ink, paint, or light-absorbing velvet. However, when using this spraying method to treat the periscope camera module outer shell, the coating thickness is difficult to precisely control and is typically relatively thick, resulting in partial obstruction of the effective optical path and making it difficult to achieve an optimal extinction effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a periscope camera module housing and a manufacturing method thereof, which solves the technical problem of poor matting effect of the periscope camera module housing in the prior art.

[0005] To achieve this object, the present invention adopts the following technical solutions: According to a first aspect, the present invention provides a method for manufacturing a periscope camera module housing, comprising: Step S1, providing a sheet substrate made of stainless steel or phosphor bronze, and performing a stamping process on the sheet substrate according to the design requirements of the periscope camera module housing to form a light hole on the sheet substrate; Step S2, performing electroplating on the sheet substrate after the stamping process, forming a first electroplating layer on the first surface of the sheet substrate, and forming a second electroplating layer on the second surface of the sheet substrate, wherein the first electroplating layer and the second electroplating layer cover the edge of the light through hole; Step S3, bending the electroplated sheet substrate to obtain a preliminary shell; Step S4, performing laser engraving processing on the first electroplating layer and the second electroplating layer of the preliminary shell to roughen the surfaces of the first electroplating layer and the second electroplating layer; Step S5, performing blackening treatment on the preliminary shell after laser engraving to obtain a periscope camera module shell.

[0006] Optionally, step S1 includes: Step S11, providing a sheet substrate with a thickness of 0.1 mm to 0.3 mm, wherein the sheet substrate is made of stainless steel or phosphor bronze; Step S12, positioning the sheet substrate in a die cavity of a stamping die, wherein the stamping die includes a punch that matches the shape of the light-through hole; In step S13 , a press machine drives the punch to punch out the sheet substrate to form a light-through hole that passes through both sides of the sheet substrate.

[0007] Optionally, step S2 includes: Step S21, immersing the stamped sheet substrate in an electrolytic cleaning solution for ultrasonic cleaning, and then drying it; Step S22, fixing the dried sheet substrate to an electroplating fixture so that the first surface and the second surface of the sheet substrate face the corresponding anode plate respectively; wherein the electroplating fixture shields the non-electroplating area; Step S23: Immerse the electroplating fixture in a black nickel or black chromium electroplating solution at a current density of 0.5 to 2.0 A / dm 2 Electroplating at a temperature of 20-40°C for 10-30 minutes; In step S24 , a first electroplating layer with a thickness of 1 to 3 μm is formed on the first surface of the sheet substrate, and a second electroplating layer with a thickness of 1 to 3 μm is formed on the second surface of the sheet substrate, wherein the first electroplating layer and the second electroplating layer are spaced apart.

[0008] Optionally, step S3 includes: Step S31, fixing the plated sheet substrate to a bending tool, wherein the bending tool includes a positioning post matching the light through hole, and the positioning post passes through the light through hole to restrict deformation of the light through hole; Step S32: using a multi-station progressive bending process, bending the steel sheet three times at a bending speed of 0.3 mm / s and a bending angle tolerance of ±0.5°; Step S33, after each bending, heat treatment is performed on the bending area at 120°C for 5 to 10 seconds; Step S34: After the bending is completed, the preliminary shell is formed.

[0009] Optionally, step S4 includes: Step S41, fixing the preliminary shell to a three-dimensional rotating fixture so that the incident angle between the surface to be laser engraved and the laser beam is 90°; Step S42, laser engraving is performed using a fiber laser with a wavelength of 1064 nm, at a power of 30 to 50 W, a frequency of 50 to 100 kHz, and a scanning speed of 500 to 800 mm / s; Step S43, performing laser engraving on the surfaces of the first electroplating layer and the second electroplating layer by a spiral path scanning method, with a scanning interval of 0.01-0.03 mm; In step S44 , a dense micro-pit array with a depth of 0.5-1.2 μm and a diameter of 1-2 μm is formed on the surfaces of the first electroplating layer and the second electroplating layer, and the diameter-to-depth ratio of the micro-pits is 1:1.5.

[0010] Optionally, step S5 includes: Step S51, performing a five-stage cleaning process on the preliminary shell after laser engraving; Step S52, placing the preliminary shell after the five-stage cleaning process in a black dye solution for immersion treatment; Step S53, performing a two-stage cleaning process on the preliminary shell after the immersion process; In step S54, the preliminary shell after the two-stage cleaning treatment is dried by a centrifuge to obtain a dry periscope camera module shell, and the drying time is set to 6 to 10 minutes.

[0011] Optionally, step S51 includes: Step S511, immersing the preliminary shell after laser engraving treatment in an alkaline silicate composite cleaning solution and performing ultrasonic cleaning for 4 to 7 minutes to obtain the preliminary shell after primary cleaning treatment; Step S512, placing the primary cleaning treatment of the preliminary shell in an ultrapure water tank, and rinsing at a temperature of 45-75° C. for 2-4 minutes to obtain the secondary cleaning treatment of the preliminary shell; Step S513, immersing the preliminary shell after the secondary cleaning treatment in an organic solvent chelating cleaning solution and performing a secondary ultrasonic cleaning for 5 to 7 minutes to obtain the preliminary shell after the tertiary cleaning treatment; Step S514, cleaning the preliminary shell after the third-stage cleaning treatment with an activator solution, wherein the temperature of the activator solution is 80-95° C., the specific gravity is 15-23 degrees Baume, and the cleaning time is 1-3 minutes, thereby obtaining the preliminary shell after the fourth-stage cleaning treatment; Step S515 , using pure water to clean the preliminary shell after the four-stage cleaning treatment for 3 minutes, to obtain the preliminary shell after the five-stage cleaning treatment.

[0012] Optionally, in step S52, the immersion temperature of the black dye solution is 80-95°C, the specific gravity is 15-23 degrees Baume, and the immersion time is 7-10 minutes.

[0013] Optionally, step S53 includes: Step S531, moving the soaked preliminary shell into an overflow ultrapure water tank for overflow cleaning for 2 minutes at a water flow rate of ≥5 L / min, to obtain the preliminary shell after one ultrapure water cleaning; Step S532 , transferring the preliminary shell after the one-time ultrapure water cleaning to a constant temperature ultrapure water tank, and immersing and cleaning it at a temperature of 45-65° C. for 1 minute; wherein the ultrapure water has a resistivity of ≥18 MΩ·cm and a total organic carbon content of ≤5 ppb.

[0014] According to the second aspect, the present invention provides a periscope camera module housing, which is manufactured using the manufacturing method of the periscope camera module housing as described in the first aspect. The periscope camera module housing includes a housing body, the housing body is provided with a light through hole, the first surface of the housing body is provided with a first electroplating layer, and the second surface of the housing body is provided with a second electroplating layer.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a periscope camera module housing and its manufacturing method. By punching a light-through hole on a stainless steel or phosphor bronze sheet substrate, the module precisely defines the imaging path for the periscope camera module, ensuring efficient light transmission and improving module imaging quality. A first electroplated layer and a second electroplated layer are formed on the front and back surfaces of the stamped sheet substrate, respectively. The electroplated layers cover the edges of the light-through hole and enhance the corrosion resistance and mechanical strength of the overall structure. The electroplated sheet substrate is then bent to form a preliminary housing. This method ensures the shape stability of the finished product while avoiding the structural deviations and stress concentration issues associated with traditional welding or splicing methods. Laser engraving is performed on the electroplated layer of the preliminary housing to microscopically roughen its surface, effectively improving the adhesion of subsequent surface treatments such as blackening and ensuring that the coating resists peeling and discoloration. The blackening treatment forms a uniform, dense black coating on the surface of the preliminary housing, effectively shielding it from external stray light and improving the imaging contrast of the periscope camera module. It also provides excellent decorative properties, enhancing the overall aesthetics and premium feel of the device. Therefore, the present invention solves the technical problem in the prior art that the extinction effect of the periscope camera module housing is poor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0018] Figure 1 A schematic flow chart of a method for manufacturing a periscope camera module housing provided in the first embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a periscope camera module housing provided in the second embodiment of the present invention; Figure 3 This is a second structural schematic diagram of a periscope camera module housing provided in Example 2 of the present invention.

[0019] 100. Periscope camera module housing; 101. Light hole; 102. First electroplating layer; 103. Second electroplating layer. DETAILED DESCRIPTION

[0020] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods. Example

[0023] The embodiment of the present invention provides a method for manufacturing a periscope camera module housing, such as Figure 1 As shown, including: In step S1 , a sheet substrate made of stainless steel or phosphor bronze is provided. According to the design requirements of the periscope camera module housing 100 , the sheet substrate is punched to form a light-through hole 101 on the sheet substrate.

[0024] In one embodiment, step S1 includes: In step S11, a sheet substrate with a thickness of 0.1 mm to 0.3 mm is provided. The sheet substrate is made of stainless steel or phosphor bronze. In this embodiment, a metal sheet with a thickness of 0.1 mm to 0.3 mm is used for rapid punching, which effectively improves manufacturing efficiency, reduces the defective rate caused by mechanical errors, and improves product yield.

[0025] In step S12, the sheet substrate is positioned in the cavity of a stamping die, and the stamping die includes a punch that matches the shape of the light-through hole 101. In this embodiment, compared with other hole-forming methods such as laser cutting or mechanical drilling, stamping can achieve smoother hole edges, reduce burrs and microcracks, and help subsequent electroplating treatment to form uniform coverage on the hole edges, thereby improving the consistency and reliability of the overall product.

[0026] In step S13, the sheet substrate is punched by a press to form a light hole 101 that passes through both sides of the sheet substrate. The thin metal sheet and precision stamping process used in the embodiment of the present invention can adapt to the miniaturization and small-scale structural layout of the module and meet the development trend of lightweight and thin products.

[0027] It should be noted that by positioning the sheet substrate in a high-precision stamping die that matches the shape of light hole 101 and using a press to drive the punch for punching, the position, size, and shape of light hole 101 on the sheet substrate are ensured to be highly consistent and accurate. This helps ensure the collimation of light in subsequent modules and avoids degradation of imaging quality due to optical path deviation. This punching process has mature equipment, long die life, and low unit processing cost, making it suitable for large-scale industrial production, significantly reducing housing manufacturing costs and improving market competitiveness.

[0028] In step S2 , the stamped sheet substrate is electroplated to form a first electroplating layer 102 on the first surface of the sheet substrate and a second electroplating layer 103 on the second surface of the sheet substrate. The first electroplating layer 102 and the second electroplating layer 103 cover the edge of the light hole 101 .

[0029] In one embodiment, step S2 includes: In step S21, the stamped sheet substrate is immersed in an electrolytic cleaning solution for ultrasonic cleaning, followed by drying. In this embodiment, ultrasonic cleaning thoroughly removes oil, oxide layers, dust, and other impurities from the surface of the sheet substrate, ensuring uniform adhesion of the electroplated layer and avoiding uneven electroplating or insufficient adhesion due to residual dirt. The cleaned sheet substrate is then dried to remove surface moisture, further ensuring a smooth surface and good adhesion during the electroplating process.

[0030] In step S22, the dried sheet substrate is secured to a plating fixture, with the first and second surfaces of the sheet substrate facing their corresponding anode plates. The plating fixture shields the non-plated areas. In this embodiment, the dried sheet substrate is secured to the plating fixture, ensuring that the first and second surfaces of the sheet substrate face their corresponding anode plates. This securing method allows for precise control of the plating area, preventing the plating solution from contacting areas not requiring plating, improving plating efficiency and ensuring that surrounding structures are not affected. Furthermore, by shielding the non-plated areas, the plating fixture effectively ensures the precise distribution and appearance quality of the plating layer.

[0031] Step S23: Immerse the electroplating fixture in a black nickel or black chromium electroplating solution at a current density of 0.5 to 2.0 A / dm 2 and electroplating for 10 to 30 minutes at a temperature of 20 to 40°C. In this embodiment, the electroplating fixture is immersed in a black nickel or black chromium electroplating solution at an appropriate current density (0.5 to 2.0 A / dm 2 Electroplating is performed under the following conditions: () and temperature (20-40°C). By controlling the current density and temperature range, the electroplating reaction speed and the quality of the plated layer can be effectively optimized. Under these conditions, the electroplating process is stable, and a uniform and highly adherent black nickel or black chrome layer can be obtained in a relatively short time (10-30 minutes), meeting the light-shielding and corrosion-resistant requirements of the periscope camera module housing 100.

[0032] In step S24, a first electroplating layer 102 having a thickness of 1 to 3 μm is formed on the first surface of the sheet substrate, and a second electroplating layer 103 having a thickness of 1 to 3 μm is formed on the second surface of the sheet substrate, wherein the first electroplating layer 102 and the second electroplating layer 103 are spaced apart. In this embodiment, a first electroplating layer 102 and a second electroplating layer 103 having a thickness of 1 to 3 μm are formed on the first surface and the second surface of the sheet substrate, respectively. This thickness range ensures that the electroplating layer has good protective performance and light-shielding properties without affecting the overall thickness and dimensional accuracy of the product. By precisely controlling the thickness of the electroplating layer, the first electroplating layer 102 and the second electroplating layer 103 are uniformly formed on different surfaces, avoiding local excessive thickness or excessive thinness, thereby improving the appearance consistency, quality stability, and service life of the product.

[0033] It should be noted that the double-sided electroplating enhances the housing's corrosion resistance, wear resistance, and oxidation resistance, significantly improving the environmental adaptability of the periscope camera module housing 100, making it particularly suitable for use in high-humidity, high-temperature, and harsh environments. The black nickel or black chrome electroplating layer has excellent light absorption, effectively preventing stray light reflections, improving the contrast and image quality of the imaging system, and meeting the strict optical performance requirements of the camera module. The precisely controlled electroplating process ensures uniform coverage of the electroplated layer on the surface of the sheet substrate and excellent adhesion between the electroplated layer and the substrate, ensuring that the electroplated layer will not peel or fall off during long-term use. By rationally controlling the current density, temperature, and time during the electroplating process, the thickness of the electroplated layer can be precisely controlled (1-3μm), preventing the electroplated layer from being too thick or too thin, thereby ensuring product performance and assembly accuracy.

[0034] Step S3, bending the electroplated sheet substrate to obtain a preliminary shell.

[0035] In one embodiment, step S3 includes: In step S31, the plated sheet substrate is secured to a bending fixture. The bending fixture includes positioning posts that match the light hole 101 and extend through the light hole 101 to constrain deformation of the light hole 101. In this embodiment, securing the plated sheet substrate to the bending fixture ensures its stability and positioning accuracy. The positioning posts in the bending fixture, by extending through the light hole 101, precisely constrain the position and shape of the light hole 101, preventing unnecessary displacement or deformation of the light hole 101 due to material deformation during the bending process. This ensures that the optical performance of the light hole 101 after the housing is formed is not affected.

[0036] In step S32, a multi-station progressive bending process is used to bend the shell in three steps at a bending speed of 0.3 mm / s and a bending angle tolerance of ±0.5°. In this embodiment, a multi-station progressive bending process is used to gradually form the shell into the desired shape by gradually applying force. The bending speed is controlled within the range of 0.3 mm / s and the bending angle tolerance is controlled within the range of ±0.5° to ensure a stable bending process and avoid excessive deformation or surface damage caused by excessive bending speed. Bending the shell in three steps not only helps to improve bending accuracy, but also avoids material fatigue or cracks that may be caused by a single bending, thereby improving the overall strength and structural integrity of the shell.

[0037] In step S33, after each bend, the bent area is heat treated at 120°C for 5-10 seconds. In this embodiment, this heat treatment effectively eliminates internal stress generated during the bending process, avoiding stress concentration or deformation caused by uneven material deformation. Heat treatment not only helps improve the material's plasticity but also enhances its durability, making the final preliminary shell more stable and ensuring its dimensional accuracy and structural strength.

[0038] Step S34, after the bending is completed, a preliminary shell is formed. In this embodiment, through the above bending process and heat treatment process, the final preliminary shell has high structural stability and precise size control. The shell shape meets the design requirements, laying the foundation for subsequent surface treatment, assembly and function verification. At the same time, the deformation generated during the bending process is small, ensuring the integrity and surface quality of the electroplating layer, avoiding the problem of It should be noted that precise positioning and a multi-station progressive bending process ensure that the initial housing does not deform excessively during the bending process, avoiding displacement of the light aperture 101 or irregularity in the housing shape due to deformation, thereby ensuring the optical and physical stability of the housing. Heat treatment technology used during the bending process effectively reduces internal stress and surface microcracks, safeguarding the integrity and appearance of the electroplating layer, and improving the durability and long-term stability of the housing. Precise control of bending speed, angular tolerance, and heat treatment ensures that the housing dimensions meet design requirements, adapting to precision machining needs, and can be widely used in the production of camera module housings of various sizes and structures.

[0039] Step S4 , performing laser engraving on the first electroplating layer 102 and the second electroplating layer 103 of the preliminary shell to roughen the surfaces of the first electroplating layer 102 and the second electroplating layer 103 .

[0040] In one embodiment, step S4 includes: In step S41, the preliminary shell is secured to a three-dimensional rotating fixture, ensuring a 90° angle of incidence between the laser beam and the surface to be laser engraved. In this embodiment, maintaining a 90° angle ensures uniform, vertical laser beam exposure to the surface, avoiding surface damage or uneven treatment caused by inconsistent laser irradiation angles. Furthermore, the rotating fixture ensures that the shell remains stable during the laser engraving process, further improving machining accuracy.

[0041] In step S42, laser engraving is performed using a fiber laser with a wavelength of 1064 nm, operating at a power of 30 to 50 W, a frequency of 50 to 100 kHz, and a scanning speed of 500 to 800 mm / s. These process parameters ensure high laser energy concentration, creating a microscopic heat-affected zone on the surface of the electroplated layer, promoting surface roughening without excessive ablation. By properly adjusting the power, frequency, and scanning speed, precise surface microstructuring can be achieved, ensuring a more uniform and stable surface treatment.

[0042] In step S43, the surfaces of the first and second electroplated layers 102 and 103 are laser-engraved using a spiral scanning method with a scanning pitch of 0.01 to 0.03 mm. This path and scanning pitch effectively improve the uniformity of the surface treatment and ensure the continuity and consistency of the microstructure of the electroplated layers. The spiral scanning method helps reduce focus shift caused by repeated laser beam irradiation, thereby achieving a more uniform roughening effect.

[0043] In step S44, a dense array of micro-pits with a depth of 0.5 to 1.2 μm and a diameter of 1 to 2 μm is formed on the surfaces of both the first electroplating layer 102 and the second electroplating layer 103, with a diameter-to-depth ratio of 1:1.5. The formation of this micro-pit array significantly increases surface roughness and enhances surface energy, thereby strengthening the adhesion between the coating or adhesive material and the electroplating layer. The uniform distribution and reasonable size of the micro-pits strengthen the bond between the coating and the substrate, preventing subsequent peeling, shedding, or blistering of the coating and ensuring the reliability of subsequent processing.

[0044] It should be noted that laser engraving creates a uniform array of micro-pits on the surface of the electroplated layer, significantly improving surface roughness and significantly enhancing the adhesion of the coating, thereby avoiding problems such as coating peeling and cracking. Micro-roughening the surface of the electroplated layer significantly improves the adhesion of subsequent coatings or adhesives (such as blackening layers and protective coatings), thereby increasing the durability and long-term stability of the finished housing. Surface roughening reduces interference from reflected light, improves the housing's light absorption, further enhances the imaging quality of the periscope camera module, and optimizes imaging contrast. By controlling the laser parameters, scanning path, and scanning spacing of the laser engraving process, consistent surface roughening and high-precision processing are ensured, thereby ensuring high product quality and consistency. Laser engraving is a non-contact processing method that avoids material deformation, surface damage, or structural damage that can occur in traditional mechanical processing, maintaining the integrity and appearance quality of the housing.

[0045] In summary, the laser engraving process in step S4 effectively enhances the surface roughness and adhesion of the electroplating layer, provides a solid foundation for subsequent coating and protective layers, and improves the optical performance, reliability and durability of the housing.

[0046] Step S5 , performing a blackening treatment on the preliminary shell after the laser engraving treatment to obtain a periscope camera module shell 100 .

[0047] In one embodiment, step S5 includes: Step S51: The initial shell undergoes a five-stage cleaning process after laser engraving. This five-stage cleaning gradually removes residual surface dirt, chemicals, and impurities from the processing process, ensuring a clean and contaminant-free surface and providing an optimal adhesion foundation for the subsequent blackening process. This five-stage cleaning step is particularly important in high-precision manufacturing, helping to improve the uniformity and adhesion of the subsequent blackening layer and prevent impurities from affecting the coating or causing uneven coating.

[0048] In step S52, the primary housing, after the five-stage cleaning process, is immersed in a blackening solution. In step S52, the blackening solution is immersed at a temperature of 80-95°C, with a specific gravity of 15-23 degrees Baume, for 7-10 minutes. By controlling the temperature and specific gravity of the blackening solution, uniform and stable dyeing is ensured, preventing overly light or dark dyeing and ensuring the formation of a dense black passivation film on the housing surface. This passivation film effectively improves the housing's light-shielding properties, oxidation resistance, and aesthetics, preventing reflections from affecting camera performance and enhancing the module's performance in high-precision video capture.

[0049] In step S53, the pre-immersion housing undergoes a two-stage cleaning process. After the blackening process, the housing undergoes a two-stage cleaning process to further remove residual blackening agent and other chemicals from the surface, ensuring that no contaminants remain on the housing surface. This two-stage cleaning process ensures a smooth and uniform blackening surface and removes excess chemicals and reactants that could affect the final optical quality of the housing. After cleaning, the housing surface is cleaner, providing a better foundation for drying and subsequent assembly.

[0050] Step S54: The preliminary housing after the two-stage cleaning process is dried using a centrifuge to obtain a dry periscope camera module housing 100. The drying time is set to 6 to 10 minutes. The preliminary housing after the two-stage cleaning process is dried using a centrifuge for 6 to 10 minutes. Centrifugal drying can quickly and evenly remove moisture from the surface of the housing, preventing residual water droplets, ensuring that the housing surface is dry and free of water stains, and helping to accelerate the production process. The drying process, through the action of centrifugal force, can effectively prevent deformation or damage to the housing while maintaining its structural integrity, avoiding deformation or stress concentration in the housing during the drying process.

[0051] It should be noted that the five-stage and two-stage cleaning processes effectively remove all residual impurities from the outer shell surface, creating ideal surface conditions for the subsequent uniform adhesion of the black coating, thereby ensuring coating quality and consistency. By controlling the temperature, specific gravity, and immersion time of the blackening agent, a high-quality, uniform black passivation film is formed on the outer shell surface. This not only improves the outer shell's optical properties (such as light-blocking and reflectivity), but also enhances its corrosion resistance, wear resistance, and aesthetics. Centrifugal drying technology effectively removes moisture, preventing water stains and excess moisture from affecting the outer shell's surface quality. It also avoids stress concentration or deformation caused by uneven drying. The rational coordination of multiple processes, including cleaning, dyeing, washing, and drying, not only ensures high product quality standards, but also improves production efficiency, reduces the uncertainty caused by manual operation, and adapts to the needs of large-scale production.

[0052] Specifically, step S51 includes: In step S511, the laser-etched preliminary shell is immersed in an alkaline silicate composite cleaning solution for ultrasonic cleaning for 4-7 minutes, resulting in a primary-cleaned preliminary shell. This step effectively removes most oil, dust, oxide layers, and other soluble contaminants from the shell surface. Ultrasonic cleaning uses high-frequency vibrations to cause tiny bubbles to burst, generating strong shock waves that thoroughly clean the shell surface at a microscopic level, ensuring no residual contamination and laying the foundation for subsequent treatment.

[0053] In step S512, the primary cleaning shell is placed in an ultrapure water tank and rinsed at 45-75°C for 2-4 minutes to obtain the secondary cleaning shell. Ultrapure water effectively removes residual cleaning fluid, salt, and other dissolved substances from the shell surface, preventing these substances from interfering with dyeing or other chemical reactions in subsequent steps. Temperature control during the rinsing process improves cleaning efficiency and reduces the deposition of scale and other undesirable substances.

[0054] In step S513, the secondary cleaned preliminary shell is immersed in an organic solvent chelate cleaning solution for a second ultrasonic cleaning for 5-7 minutes, resulting in a tertiary cleaned preliminary shell. The organic solvent used in this process effectively removes difficult-to-clean organic matter, residual contaminants such as grease, and other residual contaminants. The chelating agent effectively dissolves and removes any metal ions that may be present on the metal surface, providing a clean surface for subsequent dyeing.

[0055] In step S514, the primary shell after the third-stage cleaning treatment is cleaned with an activator solution at a temperature of 80-95°C, a specific gravity of 15-23°Bé, and a cleaning time of 1-3 minutes, resulting in a primary shell after the fourth-stage cleaning treatment. The activator solution chemically activates the shell surface, removing any tiny oxide layer and surface contaminants, providing higher surface activity for the subsequent dyeing process. This step significantly enhances the adhesion of the black dye layer, ensuring the stability and durability of the coating.

[0056] In step S515, the shell, after the fourth-stage cleaning, is rinsed with pure water for 3 minutes, resulting in a fifth-stage cleaned shell. This step further removes any remaining activators and chemicals, ensuring the shell surface is clean and free of harmful substances. This step ensures the final cleanliness of the shell and prevents contamination or uneven adhesion during subsequent dyeing or coating processes.

[0057] It should be noted that the five-stage cleaning process effectively removes dirt, grease, oxides, and other contaminants from the initial shell surface, ensuring a clean, impurity-free surface and providing an ideal foundation for the dyeing process. The activator solution cleaning removes the tiny surface oxide layer and impurities, effectively improving the adhesion of the blackened layer, allowing subsequent coatings to adhere evenly and firmly to the shell surface, preventing detachment or peeling. Ultrasonic cleaning, solvent chelation cleaning, and pure water rinsing during the cleaning process ensure a smooth, impurity-free shell surface, providing an optimal base for blackening and other surface treatments, and reducing defects and unevenness during the process.

[0058] In one embodiment, step S53 specifically includes: In step S531, the pre-immersion shell is transferred to an overflow ultrapure water tank for overflow cleaning for 2 minutes at a flow rate of ≥5 L / min, resulting in a pre-cleaned shell. Overflow cleaning removes residual impurities and chemicals from the shell surface through a continuous water flow, preventing secondary contamination from wastewater and pollutants. The high water flow ensures rapid and uniform cleaning, ensuring that all surfaces are evenly cleaned of excess chemicals, providing a clean, contamination-free shell for subsequent cleaning steps.

[0059] In step S532, the pre-cleaned shell, after the first ultrapure water rinse, is transferred to a constant-temperature ultrapure water tank and immersed in it for cleaning at a temperature between 45°C and 65°C for one minute. The ultrapure water must have a resistivity of 18 MΩ·cm or higher and a total organic carbon content of 5 ppb or less. This temperature-controlled immersion cleaning effectively removes trace organic contaminants and residues from the surface. Ultrapure water with high resistivity can better dissolve and remove tiny contaminants, while its low organic carbon content ensures water purity and prevents organic residues from interfering with subsequent processes. A moderately elevated temperature improves cleaning efficiency and ensures a thorough cleanliness of the shell surface.

[0060] It's important to note that overflow ultrapure water cleaning and constant temperature immersion cleaning effectively remove all residual chemicals, dyes, and other contaminants from the housing surface, ensuring it's spotless. Overflow cleaning uses a fast-flowing stream of water to efficiently and evenly flush away surface impurities, ensuring no dead corners or missed areas. Constant temperature immersion cleaning further removes residual contamination at an appropriate temperature, ensuring every component is thoroughly cleaned.

[0061] Working principle: The present invention provides a periscope camera module housing and a manufacturing method thereof. By performing a stamping process on the provided stainless steel or phosphor bronze sheet substrate to form a light hole 101, it is possible to achieve precise opening of the imaging path of the periscope camera module, ensure the effective transmission of light, and improve the imaging quality of the module. By forming a first electroplating layer 102 and a second electroplating layer 103 on the front and back sides of the stamped sheet substrate, the electroplating layer covers the edge of the light hole 101 and improves the corrosion resistance and mechanical strength of the overall structure. The electroplated sheet substrate is then bent and formed into a preliminary housing. This method not only ensures the shape stability of the finished product, but also avoids the structural deviation and stress concentration problems caused by traditional welding or splicing methods. By performing a laser engraving process on the electroplating layer of the preliminary housing, its surface is microscopically roughened, which effectively improves the adhesion of subsequent surface treatments such as blackening treatment, ensuring that the coating is not easy to peel off or fade. The blackening treatment creates a uniform, dense black coating on the surface of the primary housing. This not only effectively blocks external stray light interference and improves the imaging contrast of the periscope camera module, but also provides excellent decorative effects, enhancing the overall aesthetics and premium feel of the device. Therefore, the present invention solves the technical problem of poor matte finish in the prior art periscope camera module housing 100. Example

[0062] The embodiment of the present invention provides a periscope camera module housing, which is manufactured by the manufacturing method of the periscope camera module housing as in the first embodiment. Figures 2 to 3 As shown, the periscope camera module housing 100 includes a housing body, a light-through hole 101 is provided on the housing body, a first electroplating layer 102 is provided on the first surface of the housing body, and a second electroplating layer 103 is provided on the second surface of the housing body.

[0063] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a periscope camera module housing, characterized in that: include: Step S1, providing a sheet substrate made of stainless steel or phosphor bronze, and performing a stamping process on the sheet substrate according to the design requirements of the periscope camera module housing to form a light hole on the sheet substrate; Step S2, performing electroplating on the sheet substrate after the stamping process, forming a first electroplating layer on the first surface of the sheet substrate, and forming a second electroplating layer on the second surface of the sheet substrate, wherein the first electroplating layer and the second electroplating layer cover the edge of the light through hole; Step S3, bending the electroplated sheet substrate to obtain a preliminary shell; Step S4, performing laser engraving processing on the first electroplating layer and the second electroplating layer of the preliminary shell to roughen the surfaces of the first electroplating layer and the second electroplating layer; Step S5, performing blackening treatment on the preliminary shell after laser engraving to obtain a periscope camera module shell.

2. The method for manufacturing a periscope camera module housing according to claim 1, wherein: The step S1 comprises: Step S11, providing a sheet substrate with a thickness of 0.1 mm to 0.3 mm, wherein the sheet substrate is made of stainless steel or phosphor bronze; Step S12, positioning the sheet substrate in a die cavity of a stamping die, wherein the stamping die includes a punch that matches the shape of the light-through hole; In step S13 , a press machine drives the punch to punch out the sheet substrate to form a light-through hole that passes through both sides of the sheet substrate.

3. The method for manufacturing a periscope camera module housing according to claim 1, wherein: The step S2 comprises: Step S21, immersing the stamped sheet substrate in an electrolytic cleaning solution for ultrasonic cleaning, and then drying it; Step S22, fixing the dried sheet substrate to an electroplating fixture so that the first surface and the second surface of the sheet substrate face the corresponding anode plate respectively; wherein the electroplating fixture shields the non-electroplating area; Step S23: Immerse the electroplating fixture in a black nickel or black chromium electroplating solution at a current density of 0.5 to 2.0 A / dm 2 Electroplating at a temperature of 20-40°C for 10-30 minutes; In step S24 , a first electroplating layer with a thickness of 1 to 3 μm is formed on the first surface of the sheet substrate, and a second electroplating layer with a thickness of 1 to 3 μm is formed on the second surface of the sheet substrate, wherein the first electroplating layer and the second electroplating layer are spaced apart.

4. The method for manufacturing a periscope camera module housing according to claim 1, wherein: The step S3 comprises: Step S31, fixing the plated sheet substrate to a bending tool, wherein the bending tool includes a positioning post matching the light through hole, and the positioning post passes through the light through hole to restrict deformation of the light through hole; Step S32: using a multi-station progressive bending process, bending the steel sheet three times at a bending speed of 0.3 mm / s and a bending angle tolerance of ±0.5°; Step S33, after each bending, heat treatment is performed on the bending area at 120°C for 5 to 10 seconds; Step S34: After the bending is completed, the preliminary shell is formed.

5. The method for manufacturing a periscope camera module housing according to claim 1, wherein: The step S4 comprises: Step S41, fixing the preliminary shell to a three-dimensional rotating fixture so that the incident angle between the surface to be laser engraved and the laser beam is 90°; Step S42, laser engraving is performed using a fiber laser with a wavelength of 1064 nm, at a power of 30 to 50 W, a frequency of 50 to 100 kHz, and a scanning speed of 500 to 800 mm / s; Step S43, performing laser engraving on the surfaces of the first electroplating layer and the second electroplating layer by a spiral path scanning method, with a scanning interval of 0.01-0.03 mm; In step S44 , a dense micro-pit array with a depth of 0.5 to 1.2 μm and a diameter of 1 to 2 μm is formed on the surfaces of the first electroplating layer and the second electroplating layer, and the diameter-to-depth ratio of the micro-pits is 1:1.

5.

6. The method for manufacturing a periscope camera module housing according to claim 1, wherein: The step S5 comprises: Step S51, performing a five-stage cleaning process on the preliminary shell after laser engraving; Step S52, placing the preliminary shell after the five-stage cleaning process in a black dye solution for immersion treatment; Step S53, performing a two-stage cleaning process on the preliminary shell after the immersion process; In step S54, the preliminary shell after the two-stage cleaning treatment is dried by a centrifuge to obtain a dry periscope camera module shell, and the drying time is set to 6 to 10 minutes.

7. The method for manufacturing a periscope camera module housing according to claim 6, wherein: The step S51 includes: Step S511, immersing the preliminary shell after laser engraving treatment in an alkaline silicate composite cleaning solution and performing ultrasonic cleaning for 4 to 7 minutes to obtain the preliminary shell after primary cleaning treatment; Step S512, placing the primary cleaning treatment of the preliminary shell in an ultrapure water tank, and rinsing at a temperature of 45-75° C. for 2-4 minutes to obtain the secondary cleaning treatment of the preliminary shell; Step S513, immersing the preliminary shell after the secondary cleaning treatment in an organic solvent chelating cleaning solution and performing a secondary ultrasonic cleaning for 5 to 7 minutes to obtain the preliminary shell after the tertiary cleaning treatment; Step S514, cleaning the preliminary shell after the third-stage cleaning treatment with an activator solution, wherein the temperature of the activator solution is 80-95° C., the specific gravity is 15-23 degrees Baume, and the cleaning time is 1-3 minutes, thereby obtaining the preliminary shell after the fourth-stage cleaning treatment; Step S515 , using pure water to clean the preliminary shell after the four-stage cleaning treatment for 3 minutes, to obtain the preliminary shell after the five-stage cleaning treatment.

8. The method for manufacturing a periscope camera module housing according to claim 6, wherein: In step S52 , the black dye solution has an immersion temperature of 80-95° C., a specific gravity of 15-23 degrees Baume, and an immersion time of 7-10 minutes.

9. The method for manufacturing a periscope camera module housing according to claim 6, wherein: The step S53 includes: Step S531, moving the soaked preliminary shell into an overflow ultrapure water tank for overflow cleaning for 2 minutes at a water flow rate of ≥5 L / min, to obtain the preliminary shell after one ultrapure water cleaning; Step S532 , transferring the preliminary shell after the one-time ultrapure water cleaning to a constant temperature ultrapure water tank, and immersing and cleaning it at a temperature of 45-65° C. for 1 minute; wherein the ultrapure water has a resistivity of ≥18 MΩ·cm and a total organic carbon content of ≤5 ppb.

10. A periscope camera module housing, manufactured by the manufacturing method of a periscope camera module housing according to any one of claims 1 to 9, characterized in that: The periscope camera module housing includes a housing body, a light-through hole is provided on the housing body, a first electroplating layer is provided on the first surface of the housing body, and a second electroplating layer is provided on the second surface of the housing body.

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