Glasses leg, intelligent glasses and intelligent glasses assembly

Abstract

The invention discloses a glasses leg, intelligent glasses and an intelligent glasses assembly. The glasses leg comprises a glasses leg main body, the glasses leg main body comprises a plurality of stacked circuit boards, and at least one functional module is arranged on one side of the circuit board corresponding to the outer side of the glasses leg main body; at least one device circuit board group exists in the plurality of circuit boards, the device circuit board group comprises a plurality of circuit boards which are adjacently arranged, at least one device accommodating cavity is arranged among the plurality of circuit boards which are adjacently arranged in the device circuit board group, and at least one functional module is arranged in the device accommodating cavity; any one functional module is electrically connected with at least one other functional module through the electrical network on the glasses leg main body; the function module comprises any one of a battery, an electrical function module or an electrical connecting piece. According to the invention, the glasses legs are formed based on the circuit board, so that the convenience and efficiency of assembling production of the glasses legs and the intelligent glasses are improved.

Description

Technical Field

[0001] The present application relates to the technical field of smart wearable devices, and in particular to a pair of temples, smart glasses, and smart glasses components. Background Art

[0002] The mainstream temple design for current smart glasses, such as AR glasses, utilizes PCBs and flexible circuit boards to carry electronic components, with the PCBs / FPCs, batteries, speakers, and other components secured within a housing. Because this structure requires a housing to encase and secure these components, multiple fixing structures are required. Furthermore, during assembly, various fixing structures can lead to various assembly issues, such as screw stripping and collision with components, and adhesive debonding leading to the FPC falling off. This significantly impacts the convenience and efficiency of temple and smart glasses assembly. Summary of the Invention

[0003] The main purpose of this application is to provide a method for forming temples based on a circuit board, thereby improving the convenience and efficiency of the assembly and production of temples and smart glasses.

[0004] The present application proposes a temple, comprising:

[0005] A temple body, the temple body comprising a plurality of stacked circuit boards, at least one functional module being provided on a side of the circuit boards corresponding to an outer side of the temple body;

[0006] There is at least one device circuit board group among the multiple circuit boards, the device circuit board group includes multiple adjacent circuit boards, at least one device accommodating cavity is provided between the multiple adjacent circuit boards in the device circuit board group, and at least one functional module is provided in the device accommodating cavity;

[0007] Wherein, any of the functional modules is electrically connected to at least one other functional module via the electrical network on the temple body; the functional module includes any one of a battery, an electrical functional module or an electrical connector.

[0008] Optionally, among the multiple stacked circuit boards, any adjacent circuit boards are connected by welding.

[0009] Optionally, a first soldering pad is provided on one of the two adjacent circuit boards, and a second soldering pad is provided on the other circuit board corresponding to the first soldering pad, and the first soldering pad and the second soldering pad are soldered to each other so that the two adjacent circuit boards are connected by soldering;

[0010] The first pad and the second pad are both electrical signal pads in the electrical network; or the electrical state of the first pad is suspended, and the electrical state of the second pad is suspended.

[0011] Optionally, the device circuit board group includes two adjacently arranged circuit boards, at least one of the two adjacently arranged circuit boards in the device circuit board group is provided with a groove to form the device accommodating cavity, and a functional module arranged in the device accommodating cavity is fixed on at least one of the two circuit boards; or,

[0012] The device circuit board group includes a first circuit board, a second circuit board and at least one third circuit board arranged between the first circuit board and the second circuit board;

[0013] All the third circuit boards are provided with a through area, and the first circuit board, the second circuit board and at least one of the through areas form the device accommodating cavity.

[0014] Optionally, the functional module provided on a side of the circuit board corresponding to the outer side of the temple body includes at least one of a touch detection area, a button and a digital microphone.

[0015] Optionally, the electrical connector includes an extended electrical connector for accessing an external device.

[0016] Optionally, at least one heat dissipation through hole is provided on the temple body, extending from the outside of the temple body to any of the device accommodating cavities.

[0017] The present application also proposes a pair of smart glasses, comprising a frame and temples as described in any one of the above items, wherein the temples are arranged on one side of the frame.

[0018] Optionally, the temples are detachably connected to the frame; the electrical connectors of the temples include frame electrical connectors;

[0019] Wherein, when the temple is connected to the frame, at least one functional module exists in the temple body and is electrically connected to the frame via the electrical network and the frame electrical connector.

[0020] The present application also proposes a smart glasses assembly, comprising a frame and a plurality of temples as described in any one of the above items, wherein the temples are arranged on one side of the frame;

[0021] The temples are detachably connected to the frame; the electrical connectors of the temples include electrical connectors of the frame;

[0022] Among them, when the temple is connected to the frame, there is at least one functional module in the temple body that establishes an electrical connection with the frame via the electrical network and the frame electrical connector; among the multiple temples, the types and / or quantities of the functional modules in at least two of the temples are not completely consistent.

[0023] The temple of the present application comprises: a temple body, the temple body comprising a plurality of stacked circuit boards, at least one functional module being disposed on one side of the circuit board corresponding to the outer side of the temple body; at least one device circuit board group being present among the plurality of circuit boards, the device circuit board group comprising a plurality of adjacently arranged circuit boards, at least one device accommodating cavity being disposed between the plurality of adjacently arranged circuit boards in the device circuit board group, at least one functional module being disposed within the device accommodating cavity; wherein any functional module is electrically connected to at least one other functional module via an electrical network on the temple body; and the functional module comprises any one of a battery, an electrical functional module, or an electrical connector. Due to the above configuration, since the temple of the present application is composed of multiple circuit boards, no housing is required. Compared to the prior art, there is no need to consider the impact of housing assembly on the temple function, which also saves housing-related processes and reduces the cost of housing design. This improves the convenience and efficiency of temple and smart glasses assembly and production while also reducing the size of the temple. Furthermore, since there is no need to consider the circuit board design based on the structure of the housing, the design cycle for multiple circuit boards can be significantly shortened, improving the efficiency of product optimization. In addition, since there is no outer shell and most functional modules are directly buried inside multiple stacked circuit boards, it is easier for the temples formed by multiple stacked circuit boards to achieve a higher level of waterproof and dustproof than the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0025] Figure 1 This is a schematic cross-sectional view of an embodiment of the temple of the present application;

[0026] Figure 2 This is a schematic diagram of the front-view structure of an embodiment of the temple of the present application;

[0027] Figure 3 This is a schematic diagram of the stacking structure of adjacent circuit boards of another embodiment of the temple of the present application;

[0028] Figure 4 This is a schematic diagram of the device accommodating cavity structure of an embodiment of the temple of the present application;

[0029] Figure 5 This is a schematic diagram of the device accommodating cavity structure of another embodiment of the temple of the present application;

[0030] Figure 6 This is a schematic diagram of the heat dissipation through-hole structure of another embodiment of the temple of the present application;

[0031] Figure 7 This is a schematic diagram of the device accommodating cavity structure of another embodiment of the temple of the present application;

[0032] Figure 8 This is a schematic diagram of the device accommodating cavity structure of another embodiment of the temple of the present application;

[0033] Figure 9 This is a schematic diagram of the device accommodating cavity structure of another embodiment of the temple of the present application;

[0034] Figure 10 This is a schematic diagram of the device accommodating cavity structure of another embodiment of the temple of the present application.

[0035] Description of Figure Numbers:

[0036] 10 Temple body 20 circuit board 30 Functional modules 40 Device accommodating cavity 31 Touch detection area 32 button 33 digital microphone 51 First pad 52 Second pad 60 Thermal vias 70 Through area 21 First circuit board 22 Second circuit board 23 The third circuit board 80 Device circuit board assembly

[0037] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0039] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0041] The mainstream temple design for current smart glasses, such as AR glasses, utilizes PCBs and flexible circuit boards to carry electronic components, with the PCBs / FPCs, batteries, speakers, and other components secured within a housing. Because this structure requires a housing to encase and secure these components, multiple fixing structures are required. Furthermore, during assembly, various fixing structures can lead to various assembly issues, such as screw stripping and collision with components, and adhesive debonding leading to the FPC falling off. This significantly impacts the convenience and efficiency of temple and smart glasses assembly.

[0042] To this end, the present application proposes a pair of temples, referring to Figure 1 and Figure 4 In one embodiment of the present application, the temples include:

[0043] A temple body 10, wherein the temple body 10 includes a plurality of stacked circuit boards 20, and at least one functional module 30 is provided on a side of the circuit boards 20 corresponding to the outside of the temple body 10;

[0044] There is at least one device circuit board group 80 among the multiple circuit boards 20. The device circuit board group 80 includes multiple adjacent circuit boards 20. At least one device accommodating cavity 40 is provided between the multiple adjacent circuit boards 20 in the device circuit board group 80. At least one functional module 30 is provided in the device accommodating cavity 40.

[0045] Among them, any of the functional modules 30 is electrically connected to at least one other functional module 30 via the electrical network on the temple body 10; the functional module 30 includes any one of a battery, an electrical functional module or an electrical connector.

[0046] In this embodiment, the circuit board 20 can be implemented using an epoxy resin glass fiber cloth substrate, a ceramic substrate, a polytetrafluoroethylene substrate, a composite substrate substrate, etc. Optionally, multiple circuit boards 20 can be stacked together by bonding, welding, or other methods to form the temple body 10. The multiple circuit boards 20 can be directly designed to the desired temple shape.

[0047] Optionally, the electrical connector includes standard interfaces, cable interfaces, metal probes, copper busbars, conductive posts, and other devices for achieving electrical connection and electrical signal transmission functions. The electrical function module includes electronic components or integrated circuit modules for achieving electrical functions, such as processor modules, touch IC modules, power amplifier modules, audio processing modules, etc.

[0048] Optionally, in order to realize the functional interaction between the user and the temple, or to realize the function of the temple itself. Figure 2At least one functional module 30 is provided on one side of the circuit board 20 corresponding to the outside of the temple body 10. In this embodiment, the circuit board 20 on the outside of the temple body 10 includes a circuit board 20 that is close to the user and a circuit board 20 that is away from the user when the user wears the smart glasses with the temples of the present application. The at least one functional module 30 provided on the side of the circuit board 20 on the outside of the temple body 10 that is exposed to the outside will be electrically connected to the corresponding functional module 30 through the electrical network on the temple body 10 to achieve the corresponding function. For example, the touch detection area 31 will be electrically connected to the touch IC, the button 32 will be electrically connected to the corresponding control unit, and the digital microphone 33 will be electrically connected to the corresponding audio processing module. The functional modules 30 provided on the circuit board 20 on the outside of the temple body 10 can be provided on the circuit board 20 close to the user or on the circuit board 20 away from the user, or both, based on functional requirements. For example, a wear detection area for identifying the wearing status is located on the side of the circuit board 20 closest to the user; a touch detection area 31 (e.g., a touch pad) and a button 32 for triggering can be located on the side of the circuit board 20 farther from the user for easier triggering. A digital microphone 33, a speaker, etc. can be located on both or only one of them. With this arrangement, since the temples of the present application are directly formed from multiple circuit boards 20, the functional modules 30 located on the circuit boards 20 outside the temple body 10 are also directly exposed. In other words, since the temples do not have a housing, the functional modules 30 exposed on the outer surfaces of the multiple circuit boards 20 can directly contact and interact with the user. Compared to the prior art approach of placing the functional modules 30 on the surface of the circuit board 20 and / or the flexible circuit board 20, and then attaching them to the housing via structural components or adhesives, this effectively reduces functional malfunctions, triggering delays, and insensitive interactions caused by mating with the housing or assembly of the housing. For example, for the touch function implementation, the principle is that when the user approaches or touches the touch detection area 31, the touch IC electrically connected thereto recognizes the capacitance change of the touch detection area 31 and thus realizes the judgment of the user's touch.In the prior art, a touch detection area 31 is typically provided on the flexible printed circuit board (FPC) 20 in the temple housing, which is then glued to the inner wall of the housing. This allows the user to detect the user's touch by touching the corresponding location on the housing corresponding to the touch detection area 31. However, due to the loose attachment of the flexible printed circuit board 20, it is easy for the flexible printed circuit board 20 to become detached or partially detached from the inner wall of the housing, thereby rendering the touch function ineffective. In contrast, in the present application, since the temple body 10 is directly composed of multiple stacked circuit boards 20 without a housing, the user can directly touch the touch detection area 31 on the outward side of the outermost circuit board 20, effectively ensuring the reliability and stability of touch detection. Furthermore, since the button 32 is directly located on the outermost side of the outermost circuit board 20, compared to the prior art, no transmission mechanism is required. Furthermore, the button 32 will not become stuck, fail to rebound, or become untriggerable due to gaps in the housing assembly. This effectively ensures the stability of the button 32 function and improves the yield rate of temple assembly production. In addition, for the digital microphone 33, since there is no shell, there is no need to set up a pickup hole on the shell corresponding to the position of the digital microphone 33 on the circuit board 20 when producing the temples, which saves production processes and improves production efficiency. There will also be no distortion of the sound picked up by the digital microphone 33 due to the crooked pickup hole, effectively ensuring the sound pickup quality of the temples when working.

[0049] In order to realize the different functions of the temple and protect the functional modules 30 that realize the functions, at least one device accommodating cavity 40 is further provided inside the temple body 10 composed of multiple circuit boards 20. It is understood that within the temple body 10, all circuit boards 20 can belong to the device circuit board group 80, that is, a device accommodating cavity 40 is provided between any multiple adjacently stacked circuit boards 20. Alternatively, some circuit boards 20 can belong to the device circuit board group 80, while some adjacently stacked circuit boards 20 may not have a device accommodating cavity 40 provided between them.

[0050] Optionally, at least one of the two adjacent circuit boards 20 in the device circuit board group 80 is provided with a groove to form the device accommodating cavity 40, and the functional module 30 disposed in the device accommodating cavity 40 is fixed on at least one of the two circuit boards 20. In this embodiment, optionally, in one embodiment, referring to Figure 4 , in the device circuit board assembly 80, one of them may be provided with a recessed groove, and the other may be directly pressed and covered on the former to form the device accommodating cavity 40. Optionally, referring to Figure 5In another embodiment, grooves can be provided at corresponding positions on two adjacent circuit boards 20 in the device circuit board group 80, so that when the two are stacked together, the two grooves can be combined to form a device accommodating cavity 40, thereby meeting the placement of functional modules 30 with higher heights.

[0051] Optionally, the device circuit board group 80 includes a first circuit board 21, a second circuit board 22 and at least one third circuit board 23 arranged between the first circuit board 21 and the second circuit board 22; a through-area 70 is provided on all the third circuit boards 23, and the first circuit board 21, the second circuit board 22 and the at least one through-area 70 constitute the device accommodating cavity 40. In this embodiment, the through-area 70 can be directly formed by the R&D personnel by hollowing out the mechanical layer during the design of the third circuit board 23 drawing board, or the corresponding position on the third circuit board 23 can be hollowed out during the stacking and assembly of multiple circuit boards to form the required through-area 70. In the device accommodating cavity 40, the functional module can be placed on the first circuit board 21 or the second circuit board 22, and pass through the through-area 70 on at least one third circuit board 23. The number of third circuit boards 23 can be multiple or one. Optionally, in one embodiment, when the number of third circuit boards 23 is multiple, refer to Figure 7 The size and shape of the through area 70 of each third circuit board 23 can be completely consistent, or, refer to Figure 8 , the size and / or shape of the through-area 70 of at least two of the plurality of third circuit boards 23 are inconsistent. Figure 7 and Figure 8 As shown, the area corresponding to the device accommodating cavity 40 on the first circuit board 21 and the second circuit board 22 can be highly consistent with other areas, that is, there is no groove set in the area corresponding to the device accommodating cavity 40 on the first circuit board 21 and the second circuit board 22. Optionally, in another embodiment, a groove is set in the area corresponding to the device accommodating cavity 40 on at least one of the first circuit board 21 and the second circuit board 22. For example, referring to Figure 9 In the embodiment, a groove is provided on the first circuit board 21 in the region corresponding to the device accommodating cavity 40, and a reference Figure 10 In the embodiment, grooves are provided on both the first circuit board 21 and the second circuit board 22 in the areas corresponding to the device accommodating cavity 40. Thus, through the above arrangement, the temples formed by multiple circuit boards of the present application can accommodate devices of different sizes, thereby effectively improving the diversity and compatibility of the temple functions.

[0052] It is understandable that the multiple device accommodating cavities 40 inside the temple body 10 can include the above-mentioned multiple device accommodating cavity 40 settings at the same time. Among them, the functional module 30 in the device accommodating cavity 40 can be set on any circuit board 20 that constitutes the device accommodating cavity 40. For example, the functional module 30 includes an electrical functional module, and the electrical functional module includes a processor IC. The processor IC can be affixed to the processor IC installation area connected to the electrical network on any circuit board 20 in the form of an SMT patch. Alternatively, in addition to the processor IC set on any circuit board 20, the functional module 30 also has conductive columns with two ends electrically connected to the two circuit boards 20 respectively for realizing signal interaction between the two stacked circuit boards 20. Through the above-mentioned settings, not only can the different functions of the temples be realized, but also the components related to the functions can be protected in the case where no additional shell is set on the temples.

[0053] In this embodiment, the multiple circuit boards 20 can all be multi-layer boards (there are multiple dielectric layers in the board to form more than two wiring layers, such as a four-layer board with four wiring layers, a six-layer board with six wiring layers, etc.), or they can all be single / double-layer boards (a board formed by only a single dielectric layer, with wiring layers on both sides of the board). The electrical network is composed of signal traces, copper cladding, conductive vias / blind holes, device mounting areas (composed of at least one pad for accessing devices), wire bonding, etc. on a single circuit board 20, and conductive parts for transmitting electrical signals between different circuit boards 20 (for example, between two adjacent stacked circuit boards 20, an electrical connection path is established through at least one conductive column arranged in the device accommodating cavity 40, or an electrical connection path is established by pads welded together when stacked). Through the electrical network, any functional module 30 can establish an electrical connection path with at least one other corresponding functional module 30 based on its working requirements and functional requirements, thereby realizing a certain function.

[0054] Optionally, in another embodiment, the electrical connector may further include an extended electrical connector for connecting to external devices. In this embodiment, the extended electrical connector may be implemented using a standard interface, such as a Type-C interface, a Micro-USB interface, or a flat cable interface. Among the multiple functional modules 30 on the temple body 10 that are electrical connectors, at least one may be an extended electrical connector. The extended electrical connector may be directly disposed on the outward-facing surface of the circuit board 20 outside the temple body 10, or it may be disposed within any device accommodating cavity 40 of the multiple circuit boards 20. The extended electrical connector disposed within the device accommodating cavity 40 may extend outward from the cavity, or the temple body 10 may be provided with an opening corresponding to the device accommodating cavity 40 for connecting to an external device. External devices include external batteries, external sensors, external memory devices, external functional modules 30, and so on. When a user needs to attach an external device to the temple, they can connect the external device to the corresponding extended electrical connector, establishing an electrical connection between the external device and the corresponding functional module 30 through the extended electrical connector and the corresponding electrical network within the temple body 10. For example, the temple body 10 includes an extended electrical connector for connecting to an external battery. The extended electrical connector is electrically connected to an electrical function module in the temple body 10, which is a power module, through an electrical network in the temple body 10. When a user wants to increase the actual battery life of the smart glasses, the external battery can be connected to the corresponding extended electrical connector to establish an electrical connection with the power module through the extended electrical connector, thereby providing electrical energy together with the battery in the temple body 10 to extend the battery life. In this way, the above-mentioned configuration effectively improves the functional expansion capability of the temple of the present application. When using smart glasses equipped with the temple of the present application, the user can connect to an external device through at least one extended electrical connector on the temple body 10 to meet the needs based on current personal needs or usage scenario requirements, thereby effectively improving the convenience of the user in using the smart glasses equipped with the temple of the present application.

[0055] In summary, the temple of the present application comprises: a temple body 10, the temple body 10 including a plurality of stacked circuit boards 20, at least one functional module 30 being disposed on one side of the circuit board 20 corresponding to the outer side of the temple body 10; at least one device circuit board group 80 being present among the plurality of circuit boards 20, the device circuit board group 80 including a plurality of adjacently arranged circuit boards 20, at least one device accommodating cavity 40 being disposed between the plurality of adjacently arranged circuit boards 20 in the device circuit board group 80, at least one functional module 30 being disposed within the device accommodating cavity 40; wherein any functional module 30 is electrically connected to at least one other functional module 30 via an electrical network on the temple body 10; and the functional module 30 includes any one of a battery, an electrical functional module, or an electrical connector. Due to the above configuration, since the temple of the present application is composed of a plurality of circuit boards 20, no housing is required. Compared to the prior art, there is no need to consider the impact of housing assembly on the temple function, which also saves housing-related processes and reduces the cost of housing design. This improves the convenience and efficiency of temple and smart glasses assembly and production while also reducing the size of the temple. At the same time, since there is no longer a need to consider the structure of the outer shell when designing the circuit boards 20, the design cycle for multiple circuit boards 20 can be greatly shortened, improving the efficiency of product optimization. In addition, since there is no outer shell, and most functional modules 30 are directly embedded within the multiple stacked circuit boards 20, it is easier for the temples formed by the multiple stacked circuit boards 20 to achieve a higher level of waterproof and dustproofing than the existing technology.

[0056] refer to Figure 3 Based on the above embodiment in which any adjacent circuit boards 20 are connected by welding to form a stack, in one embodiment of the present application, a first soldering pad 51 is provided on one of the two adjacent circuit boards 20, and a second soldering pad 52 is provided on the other circuit board corresponding to the first soldering pad 51. The first soldering pad 51 and the second soldering pad 52 are soldered to each other to connect the two adjacent circuit boards 20 by welding.

[0057] The first pad 51 and the second pad 52 are both electrical signal pads in the electrical network; or the electrical state of the first pad 51 is suspended, and the electrical state of the second pad 52 is suspended.

[0058] In this embodiment, a first soldering pad 51 and a second soldering pad 52 are respectively provided on one side of the two adjacently stacked circuit boards 20 that overlap each other. The number of the first soldering pad 51 and the second soldering pad 52 can be multiple to improve the firmness of the welding.

[0059] Optionally, in one embodiment, the electrical state of the first soldering pad 51 is suspended, and the electrical state of the second soldering pad 52 is suspended. With this arrangement, since the soldering pads can be directly laid out when the circuit board 20 is designed and directly laid out on the circuit board 20 when the board factory designs the circuit board 20, there is no need for the smart glasses manufacturer to set up additional welding parts during subsequent assembly. Instead, the manufacturer only needs to directly add solder to the first soldering pad 51 and / or the second soldering pad 52, heat them, and stack them accordingly so that the first soldering pad 51 and the second soldering pad 52 are soldered together, thereby effectively improving the production efficiency of the temples of the present application.

[0060] Alternatively, in one embodiment, the first pad 51 and the second pad 52 may be two electrical signal pads for transmitting signals, thereby becoming part of the electrical network on the temple body 10. For example, in adjacent circuit boards 20, the functional module 30 on one is connected to the first pad 51 via a signal trace on the circuit board 20 on which it is located, and then establishes an electrical connection path with the functional module 30 on the other circuit board 20 via the second pad 52 welded to the first pad 51 and the signal trace on the other circuit board 20. Alternatively, the first pad 51 and the second pad 52 may both be part of the power trace in the electrical network, such as both being positive power pads or both being ground pads, thereby expanding the area of ​​the power trace and reducing power loss. It is understood that when there are multiple first solder pads 51 and second solder pads 52, the categories of the multiple groups of first solder pads 51 and second solder pads 52 in the electrical network can include at least two. For example, in the case of adjacent circuit boards 20A and 20B, on the side where the two circuit boards overlap, three first solder pads 51 are provided on circuit board 20A, and three corresponding second solder pads 52 are provided on circuit board 20B. Two groups of first solder pads 51 and second solder pads 52 are used to transmit power signals, while the remaining group of first solder pads 51 and second solder pads 52 is used to transmit data signals between the functional modules 30 of circuit board 20A and the functional modules 30 of circuit board 20B. This arrangement not only allows signal transmission between adjacent circuit boards 20 via the solder pads, but also simultaneously serves to solder adjacent circuit boards 20 together. Furthermore, the solder pads can be directly fabricated on multiple circuit boards 20 during board production, eliminating the need for smart glasses manufacturers to install additional soldering parts during subsequent assembly, effectively improving the production efficiency of the temples of the present application.

[0061] It can be understood that when there are multiple first solder pads 51 and second solder pads 52 on adjacent circuit boards 20, all of the first solder pads 51 and second solder pads 52 can be suspended solder pads, or all of them can be electrical signal solder pads, or some of them can be suspended solder pads and some can be electrical signal solder pads.

[0062] refer to Figure 6 In one embodiment of the present application, at least one heat dissipation through hole 60 is provided on the temple body 10 and extends from the outside of the temple body 10 to any of the device accommodating cavities 40 .

[0063] In this embodiment, the number of heat dissipation vias 60 can be multiple; optionally, the heat dissipation vias 60 can be formed by drilling additional holes after the multiple circuit boards 20 are stacked on each other. Alternatively, the heat dissipation vias 60 on the temple body 10 are formed by combining the vias (including through holes or blind holes) on all the circuit boards 20 from the outer circuit board 20 to the circuit board 20 corresponding to the component accommodating cavity 40. In this way, during the design process of the multiple circuit boards 20, the corresponding vias can be opened when the circuit boards 20 are manufactured by adding vias in advance. Then, after stacking, the vias on the multiple circuit boards 20 are directly combined to form the heat dissipation vias 60, thereby eliminating the need for an additional hole opening and assembly process.

[0064] Alternatively, the heat dissipation vias 60 can be mechanical vias without a conductive medium on their inner walls to reduce process complexity and cost. Alternatively, the heat dissipation vias 60 can be implemented as vias with a conductive medium on their inner walls, such as metallized vias, to improve heat dissipation efficiency. Furthermore, in one embodiment, the heat dissipation vias 60 can be filled with another thermally conductive medium, such as thermal grease, to further improve heat dissipation efficiency.

[0065] Optionally, when selecting a circuit board 20 with heat dissipation holes 60 on the outside of the temple body 10, the circuit board 20 can be selected to be facing away from the user when the user wears the smart glasses provided with the temples of the present application. In this way, the heat generated by the device in the device accommodating cavity 40 when working will be transferred toward the side of the user along the heat dissipation holes 60, rather than directly toward the user's skin, thereby effectively improving the user experience.

[0066] Through the above-mentioned configuration, the temples of the present application can improve the heat dissipation efficiency of the components therein, especially the high-power components, when they are in operation. Furthermore, because the temples of the present application are formed by directly stacking multiple circuit boards 20 and are not provided with an external housing, the heat dissipation efficiency is significantly improved compared to temples with housings in the prior art, thereby providing a basis for miniaturization and simplification of the heat dissipation structure design.

[0067] The present application also proposes a pair of smart glasses, comprising a frame and temples as described in any one of the above items, wherein the temples are arranged on one side of the frame.

[0068] It is worth noting that since the smart glasses of the present application include the above-mentioned temples, they also include all embodiments of the above-mentioned temples and the technical effects produced by all embodiments, which will not be repeated here.

[0069] Optionally, in one embodiment, the temples and the frame can be fixedly connected, for example, by welding, gluing or structural snap connection, and an electrical connection path is established through electrical connectors, such as cables, plug interfaces, etc.

[0070] Optionally, in another embodiment, the temples and the frame may be detachably connected, for example, by snap fasteners, magnetic attraction, etc. Furthermore, in one embodiment, the temples and the frame are detachably connected; the temple electrical connectors include frame electrical connectors; and when the temples are connected to the frame, at least one functional module in the temple body is electrically connected to the frame via the electrical network and the frame electrical connector.

[0071] In this embodiment, the frame electrical connector is arranged on the temple body near the end where the temple is connected to the frame. The frame electrical connector can be directly arranged on the outward side of the circuit board on the outside of the temple body; it can also be arranged in any device accommodating cavity of multiple circuit boards. The frame electrical connector arranged in the device accommodating cavity can extend out of the cavity or an opening can be provided on the temple body near the end where the temple is connected to the frame corresponding to the device accommodating cavity for the connector on the frame to be connected to the frame electrical connector on the temple.

[0072] The frame's electrical connectors can use standard interfaces, such as a Type-C interface, a Micro-USB interface, or a cable interface; or conductive elements, such as metal spring pins, DuPont pins, or the like. The frame can be provided with corresponding connectors for accessing the frame's electrical connectors. The connectors are electrically connected to circuit modules within the frame, such as an optical-mechanical module, a sensor module, and a processor module within the frame. This allows, when the temples and frame are connected together using the aforementioned detachable connection, at least one functional module on the temples can establish an electrical connection pathway with the corresponding circuit module within the frame via the electrical network within the temple body and the frame's electrical connectors. For example, the battery in the temple body establishes an electrical connection path with the power network and the power module in the electrical network of the frame through the electrical network and the frame electrical connector to provide power to the circuit module in the frame; and / or, the control module in the temple body establishes an electrical connection path with the processor module in the frame to realize data exchange between the two sides; and / or, the sensor module in the temple body outputs the detection result to the processor module in the frame through the electrical network and the frame electrical connector; and / or, the processor module in the frame body outputs the audio signal to the audio processing module in the temple body through the frame electrical connector and the electrical network, etc. In this way, through the above-mentioned setting, for users, the detachable connection between the temple and the frame is not only convenient for storing and carrying smart glasses, but also because the temple can establish an electrical connection with the frame through the frame electrical connector, so in the subsequent temple version update or optimization or maintenance process, the user does not need to buy a new frame, but only needs to remove the original temple and replace it with a new temple to realize new functions, which effectively improves the convenience of users in using smart glasses.

[0073] The present application also proposes a smart glasses assembly, comprising a frame and a plurality of temples as described above, wherein the temples are arranged on one side of the frame;

[0074] The temples are detachably connected to the frame; the electrical connectors of the temples include electrical connectors of the frame;

[0075] Among them, when the temple is connected to the frame, there is at least one functional module in the temple body that establishes an electrical connection with the frame via the electrical network and the frame electrical connector; among the multiple temples, the types and / or quantities of the functional modules in at least two of the temples are not completely consistent.

[0076] In this embodiment, the smart glasses include AR glasses, XR glasses or MR glasses.

[0077] The detachable connection between the temples and the frame, as well as the form of the frame's electrical connectors, can be referenced in the various embodiments described above and will not be further elaborated here. Among the multiple temples, at least two may have different types and / or quantities of functional modules. For example, temple A may be equipped with multiple batteries, temple B may be equipped with a single battery, and temple C may be equipped with an external power interface and a high-power audio amplifier module. When users are out and about, they can choose temple A or temple B based on their current battery life needs. Alternatively, when using the temple at home or in a fixed location, they can choose temple C, which is externally powered and offers lightweight wear and high-quality audio.

[0078] In this way, through the above settings, users can independently select the corresponding temples according to current usage needs, thereby effectively improving the convenience of using smart glasses and improving the functional compatibility and adaptability of smart glasses.

[0079] The above description is merely an exemplary embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural transformation made using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A temple, characterized in that: The temples include: A temple body, the temple body comprising a plurality of stacked circuit boards, at least one functional module being provided on a side of the circuit boards corresponding to an outer side of the temple body; There is at least one device circuit board group among the multiple circuit boards, the device circuit board group includes multiple adjacent circuit boards, at least one device accommodating cavity is provided between the multiple adjacent circuit boards in the device circuit board group, and at least one functional module is provided in the device accommodating cavity; Wherein, any of the functional modules is electrically connected to at least one other functional module via the electrical network on the temple body; the functional module includes any one of a battery, an electrical functional module or an electrical connector.

2. The temple according to claim 1, wherein: Among the multiple stacked circuit boards, any adjacent circuit boards are connected by welding.

3. The temple according to claim 2, wherein: A first soldering pad is provided on one of two adjacent circuit boards, and a second soldering pad is provided on the other circuit board corresponding to the first soldering pad, and the first soldering pad and the second soldering pad are soldered to each other so that the two adjacent circuit boards are connected by soldering; The first pad and the second pad are both electrical signal pads in the electrical network; or the electrical state of the first pad is suspended, and the electrical state of the second pad is suspended.

4. The temple according to claim 1, wherein: The device circuit board group includes two adjacently arranged circuit boards, at least one of the two adjacently arranged circuit boards in the device circuit board group is provided with a groove to form the device accommodating cavity, and the functional module arranged in the device accommodating cavity is fixed on at least one of the two circuit boards; or, The device circuit board group includes a first circuit board, a second circuit board and at least one third circuit board arranged between the first circuit board and the second circuit board; All the third circuit boards are provided with a through area, and the first circuit board, the second circuit board and at least one of the through areas form the device accommodating cavity.

5. The temple according to claim 1, wherein: The functional module provided on one side of the circuit board corresponding to the outer side of the temple body includes at least one of a touch detection area, a button and a digital microphone.

6. The temple according to any one of claims 1 to 5, characterized in that: The electrical connector includes an extended electrical connector for connecting to an external device.

7. The temple according to any one of claims 1 to 5, characterized in that: The temple body is provided with at least one heat dissipation through hole extending from the outside of the temple body to any of the device accommodating cavities.

8. A pair of smart glasses, characterized in that: The invention comprises a glasses frame and the glasses leg according to any one of claims 1 to 7, wherein the glasses leg is arranged on one side of the glasses frame.

9. The smart glasses according to claim 8, wherein: The temples are detachably connected to the frame; the electrical connectors of the temples include electrical connectors of the frame; Wherein, when the temple is connected to the frame, at least one functional module exists in the temple body and is electrically connected to the frame via the electrical network and the frame electrical connector.

10. A smart glasses assembly, comprising a frame and a plurality of temples according to any one of claims 1 to 7, wherein the temples are arranged on one side of the frame; The temples are detachably connected to the frame; the electrical connectors of the temples include electrical connectors of the frame; in, When the temple is connected to the frame, at least one functional module in the temple body establishes an electrical connection with the frame via the electrical network and the frame electrical connector; among the multiple temples, the types and / or quantities of the functional modules in at least two of the temples are not completely consistent.

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