Electronic equipment

Abstract

The invention provides electronic equipment, and relates to the technical field of terminal equipment. The problem that the radiation efficiency of an antenna is affected and the communication effect of the electronic equipment is further affected due to unreasonable antenna distribution of the existing electronic equipment is solved. The electronic equipment comprises a rear cover, an outer decorative cover, an inner decorative cover, a first radiator and a circuit board, and a mounting hole is formed in the rear cover. The outer decorative cover is arranged in the mounting hole and is arranged on the outer side of the rear cover. And the inner decorative cover is arranged at the mounting hole and is arranged on the inner side of the rear cover. The first radiator is arranged on the surface, away from the outer decorative cover, of the inner decorative cover. The circuit board is arranged on the inner side of the rear cover, and the first radiator is electrically connected with the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to an electronic device. Background Art

[0002] Electronic devices, such as mobile phones and tablets, are indispensable in our daily lives. With the increasing number of communication frequency bands available, electronic devices require multiple antennas to communicate across these bands. However, existing motherboard bracket antennas and frame antennas are no longer suitable for optimal distribution of multiple antennas, impacting antenna radiation efficiency and, in turn, the communication performance of electronic devices. Summary of the Invention

[0003] An embodiment of the present application provides an electronic device for solving the problem that the antenna distribution of existing electronic devices is unreasonable, which affects the antenna radiation efficiency and further affects the communication effect of the electronic device.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] An embodiment of the present application provides an electronic device comprising a back cover, an outer decorative cover, an inner decorative cover, a first radiator, and a circuit board. The back cover has a mounting hole. The outer decorative cover is disposed in the mounting hole and is disposed on the outer side of the back cover. The inner decorative cover is disposed at the mounting hole and is disposed on the inner side of the back cover. The first radiator is disposed on a surface of the inner decorative cover that is distal from the outer decorative cover. The circuit board is disposed on the inner side of the back cover, and the first radiator is electrically connected to the circuit board.

[0006] The electronic device provided herein has a first radiator disposed on a surface of the inner decorative cover that is distal from the outer decorative cover. This ensures a clear area around the first radiator, namely, a clear area between the first radiator and the circuit board, and between the first radiator and the outer decorative cover. Furthermore, since the first radiator is disposed on the inner decorative cover, it does not occupy space on the circuit board, thus conserving available space and facilitating the placement of other electronic components on the circuit board.

[0007] In one possible implementation of the present application, the outer decorative cover includes a metal portion and a plastic portion, the metal portion being fixedly connected to the plastic portion, and the vertical projection of the metal portion on the circuit board at least partially overlapping with the vertical projection of the first radiator on the circuit board. This allows the first radiator to spatially communicate with the metal portion, transferring electromagnetic wave energy to the metal portion, which then radiates to the surrounding area. In other words, the metal portion forms a new radiator, thereby improving the antenna's radiation efficiency.

[0008] In a possible implementation of the present application, along the thickness direction of the electronic device, the distance between the first radiator and the outer decorative cover is a first distance, and the first distance is greater than 0 and less than or equal to 0.15λ. r ; Among them, λ r In this structure, the first distance is within this range, which enables the first radiator to be spatially coupled with the metal portion of the outer decorative cover, thereby improving the reliability of the overall structure.

[0009] In a possible implementation of the present application, the first distance is greater than or equal to 0.02λ r , and less than or equal to 0.15λ r .

[0010] In a possible implementation of the present application, the surface of the inner decorative cover facing the circuit board is the first surface, and the first radiator is disposed on the first surface and is located on a side close to the outer edge of the outer decorative cover. For example, the first distance can be 2 mm, which is approximately 0.06λ. r .

[0011] In a possible implementation of the present application, the electronic device further includes an electrical connector, which is connected between the first radiator and the circuit board. For example, the electrical connector can be a spring, a wire, or other electrical connection structure.

[0012] In one possible implementation of the present application, the electronic device further includes a metal block, the metal block being fixed to a surface of the first radiator facing the circuit board, and the electrical connector abutting between the metal block and the circuit board. With this structure, the distance between the first radiator and the circuit board can be reduced. When the electrical connector abuts between the metal block and the circuit board, the volume of the electrical connector is reduced, thereby reducing the area occupied by the electrical connector on the circuit board.

[0013] In one possible implementation of the present application, the electronic device further includes a heightened plate disposed on a surface of the circuit board facing the inner decorative cover. The heightened plate is electrically connected to the circuit board, and the electrical connector abuts between the heightened plate and the first radiator. In this structure, the heightened plate increases the local thickness of the circuit board, thereby reducing the distance between the circuit board and the first radiator, thereby facilitating a reduction in the size of the electrical connector.

[0014] In a possible implementation of the present application, the first radiator includes an FPC board, which is fixed to a surface of the inner decorative cover away from the outer decorative cover. For example, the FPC board can be fixed to the inner decorative cover by bonding.

[0015] In a possible implementation of the present application, the first radiator further includes a reinforcing plate, which is disposed between the FPC board and the inner decorative cover. In this structure, the FPC board can be supported to improve the overall strength.

[0016] In one possible implementation of this application, the inner decorative cover is provided with multiple limiting protrusions, and the FPC board and the reinforcement plate are each provided with multiple limiting holes. The multiple limiting holes are provided in a one-to-one correspondence with the multiple limiting protrusions, and the limiting protrusions extend into the corresponding limiting holes. In this way, by aligning the limiting protrusions with the limiting holes, the FPC board can be precisely positioned, which helps to improve installation accuracy.

[0017] In a possible implementation of the present application, the first radiator includes a steel sheet, which is disposed on the inner decorative cover. For example, the steel sheet may be embedded in the inner decorative cover.

[0018] In one possible implementation of the present application, the first radiator includes a metal layer, which is disposed on a surface of the inner decorative cover away from the outer decorative cover. For example, the metal layer can be formed on the inner surface of the inner decorative cover by an LDS (Laser Direct Structuring) process.

[0019] In a possible implementation of the present application, a plurality of first radiators are provided, and the plurality of first radiators are distributed at intervals along the circumference of the mounting hole. In this structure, multiple antennas can be provided on the inner decorative cover to make the antenna distribution more reasonable.

[0020] In one possible implementation of the present application, the electronic device further includes a second radiator, which is disposed on the inner surface of the back cover, and wherein a vertical projection of the second radiator on the circuit board at least partially overlaps with a vertical projection of the first radiator on the circuit board. In this manner, the first radiator can also be spatially coupled with the second radiator, so that electromagnetic wave energy is coupled from the first radiator to the second radiator and radiated toward the exterior of the back cover, thereby increasing the radiation area of ​​the antenna and thereby improving the antenna's radiation efficiency.

[0021] In one possible implementation of the present application, the back cover includes a first region, a second region, and a bent region. The bent region is connected between the first and second regions, the second region protrudes from the outer surface of the first region, the mounting holes are provided in the second region, both the outer decorative cover and the inner decorative cover are fixedly connected to the second region, and the second radiator is provided on the inner surface of the second region. In this structure, the second region and the inner decorative cover are stacked so that the vertical projections of the second radiator and the first radiator on the circuit board overlap.

[0022] In a possible implementation of the present application, the second radiator extends to the bending area in a direction away from the mounting hole. In this structure, the radiation area of ​​the antenna is further increased, thereby further improving the radiation efficiency of the antenna.

[0023] In a possible implementation of the present application, the second radiator extends to the first area in a direction away from the mounting hole. In this structure, the radiation area of ​​the antenna is further increased, thereby further improving the radiation efficiency of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A structural diagram of an electronic device provided in an embodiment of the present application;

[0025] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0026] Figure 3 A structural diagram of a circuit board bracket provided in an embodiment of the present application;

[0027] Figure 4 An exploded view of a partial structure of another electronic device provided in an embodiment of the present application;

[0028] Figure 5 for Figure 4 A partial structural cross-sectional view of the provided electronic equipment;

[0029] Figure 6 A schematic diagram of S-parameters and efficiency simulation of the first radiator provided in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of current distribution when the first radiator provided by an embodiment of the present application is coupled to the metal portion of the outer decorative cover;

[0031] Figure 8 A structural diagram of a first radiator provided in an embodiment of the present application;

[0032] Figure 9 A structural diagram of another first radiator provided in an embodiment of the present application;

[0033] Figure 10 A structural diagram of another first radiator provided in an embodiment of the present application;

[0034] Figure 11 for Figure 10 A cross-sectional view of a first radiator is provided;

[0035] Figure 12 A structural diagram showing the connection between a first FPC board and a circuit board provided in an embodiment of the present application via an electrical connector;

[0036] Figure 13 A structural diagram showing a first FPC board and a circuit board connected via a spring clip according to an embodiment of the present application;

[0037] Figure 14 A structural diagram showing the connection between the first FPC board and the circuit board provided in an embodiment of the present application via a spring and a metal block;

[0038] Figure 15 for Figure 14 A cross-sectional view of the connection between the first FPC board and the circuit board via the spring and the metal block is provided;

[0039] Figure 16 A structural diagram showing the connection between the first FPC board and the circuit board provided in an embodiment of the present application via a spring and a heightening plate;

[0040] Figure 17 A partial structural diagram of another electronic device provided in an embodiment of the present application;

[0041] Figure 18 A cross-sectional structural diagram of a second radiator provided in an embodiment of the present application;

[0042] Figure 19 A cross-sectional structural diagram of another second radiator provided in an embodiment of the present application;

[0043] Figure 20 This is a cross-sectional structural diagram of another second radiator provided in an embodiment of the present application.

[0044] Reference numerals: 10 - electronic device; 100 - display module; 110 - light-transmitting cover; 120 - display screen; 200 - housing; 210 - back cover; 211 - mounting hole; 212 - first area; 213 - second area; 214 - bending area; 220 - frame; 230 - middle plate; 300 - circuit board; 400 - circuit board bracket; 500 - outer decorative cover; 510 - metal part; 520 - plastic Part; 600-inner decorative cover; 610-first surface; 620-limiting protrusion; 630-fixing boss; 700-first radiator; 710-first FPC board; 711-limiting hole; 712-first part; 713-second part; 714-connecting part; 720-reinforcement plate; 800-electrical connector; 810-spring; 820-metal block; 830-heightening plate; 900-second radiator. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0046] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.

[0047] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0048] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0049] An embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other type of electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For ease of description, the following examples are all based on the example of a mobile phone as the electronic device.

[0050] See also Figure 1 and Figure 2 , Figure 1 This is a structural diagram of an electronic device 10 provided in an embodiment of the present application. Figure 2 This is an exploded view of an electronic device 10 provided in an embodiment of the present application. As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone and can have a substantially rectangular plate-like structure. The electronic device 10 can include a display module 100, a housing 200, a circuit board 300, and a circuit board bracket 400.

[0051] To facilitate the following description, an XYZ coordinate system is established, defining the width direction of the electronic device 10 as the X-axis direction, the length direction of the electronic device 10 as the Y-axis direction, and the thickness direction of the electronic device 10 as the Z-axis direction. It is understood that the coordinate system of the electronic device 10 can be flexibly set according to actual needs. This application only provides an example and is not to be considered as a special limitation of this application. Figure 1 and Figure 2Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 1 and Figure 2 restrictions.

[0052] The above-mentioned display module 100 is used to display images, videos, etc. The display module 100 may include a translucent cover plate 110 and a display screen 120 (English name: panel, also called a display panel), and the translucent cover plate 110 and the display screen 120 are stacked. The material of the translucent cover plate 110 includes but is not limited to glass. For example, the translucent cover plate 110 can adopt an ordinary translucent cover plate 110 to protect the display screen 120 to prevent the display screen 120 from being damaged by external force, and can play a dust-proof role. Alternatively, the translucent cover plate 110 can also adopt a translucent cover plate 110 with a touch function, so that the electronic device 10 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the translucent cover plate 110.

[0053] Furthermore, the display screen 120 may be a flexible display screen or a rigid display screen. For example, the display screen 120 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (LED) display screen, a micro light-emitting diode (LED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0054] The housing 200 is used to protect the electronic components within the electronic device 10. The housing 200 may include a back cover 210 and a frame 220. The back cover 210 is located on the side of the display screen 120 away from the transparent cover plate 110 and is stacked with the transparent cover plate 110 and the display screen 120. The frame 220 is located between the transparent cover plate 110 and the back cover 210. The frame 220 is fixed to the back cover 210. For example, the frame 220 may be fixed to the back cover 210 by bonding, threading, welding, or snapping. Alternatively, the frame 220 may be integrally formed with the back cover 210, i.e., the frame 220 and the back cover 210 form a single structural unit. The transparent cover plate 110 may be fixed to the frame 220 by gluing, so that the transparent cover plate 110, the back cover 210, and the frame 220 define a housing cavity within the electronic device 10. The circuit board 300 assembly and the electronic components are disposed within this housing cavity.

[0055] In some embodiments, the housing 200 may further include a middle plate 230, which is disposed in the accommodating cavity and is located on the side of the display screen 120 away from the light-transmitting cover plate 110. The middle plate 230 is fixedly connected to the frame 220 to form the middle frame of the electronic device 10. For example, the middle plate 230 and the frame 220 may be fixedly connected by gluing, threading, welding, snapping, etc. Alternatively, the middle plate 230 and the frame 220 may be an integrally molded structure, that is, the middle plate 230 and the frame 220 form a single structural component. The middle plate 230 divides the accommodating cavity into two independent spaces, one of which is located between the light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located in this space. The other space is located between the middle plate 230 and the back cover 210, and the circuit board 300 assembly is located in this space.

[0056] The circuit board 300 is used to house the electronic components within the electronic device 10 and to provide electrical connections between the components. The circuit board 300 can be secured to the midboard 230 by gluing, threading, welding, or snapping. Therefore, this application does not impose any particular restrictions on the securing method for the circuit board 300.

[0057] Exemplarily, the electronic devices may include a control chip (such as a system on chip, SOC), a graphics processing unit (GPU), a universal flash storage (UFS), an earpiece, a camera module, and a flash module.

[0058] The circuit board support 400 is disposed within the housing 200. Specifically, the circuit board support 400 can be disposed between the circuit board 300 and the back cover 210. In some embodiments, the circuit board support 400 is fixed to the mid-plate 230. The circuit board support 400 can cover the surface of the circuit board 300 facing the back cover 210 to protect the circuit board 300 and the electronic components thereon, thereby preventing damage to the electronic device 10 due to movement of some electronic components when the back cover 210 is opened for maintenance.

[0059] On this basis, in order to enable the electronic device 10 to communicate with other devices, an antenna needs to be provided in the electronic device 10 so that the electronic device 10 can communicate with other devices. Figure 3 As shown, Figure 3 This is a structural diagram of a circuit board bracket 400 provided in an embodiment of the present application. An LDS antenna can be formed on the plastic area of ​​the circuit board bracket 400 (the circuit board bracket 400 may also include a metal area to increase overall support strength) using an LDS process. Alternatively, a frame 220 antenna can be formed on the upper frame 220.

[0060] As electronic devices 10 become increasingly lightweight and thinner, their thickness along the Z-axis becomes increasingly smaller. Consequently, the circuit board bracket 400 essentially eliminates the plastic area and consists solely of a thin metal plate, making it unsuitable for LDS antennas. Furthermore, the aforementioned frame 220 cannot support antennas covering all communication frequency bands.

[0061] To resolve the above issues, please refer to Figure 4 and Figure 5 , Figure 4 This is an exploded view of a partial structure of another electronic device 10 provided in an embodiment of the present application. Figure 5 for Figure 4 A partial structural cross-sectional view of an electronic device 10 is provided, and the electronic device 10 includes the above-mentioned display module 100, a housing 200, and a circuit board 300. A mounting hole 211 is provided on the back cover 210 of the housing 200, and the mounting hole 211 is used to install some electronic components. For example, the mounting hole 211 can be used to install a camera module and a flash module. In some embodiments, the mounting hole 211 can be set to different shapes according to actual needs. For example, the mounting hole 211 can be a rectangular through hole, or a circular through hole. Therefore, this application does not make any special restrictions on this. In the embodiments below, the mounting hole 211 is a circular hole, and the mounting hole 211 is used to install a camera module as an example for explanation.

[0062] The electronic device 10 further includes an outer decorative cover 500 and an inner decorative cover 600 . Both the outer decorative cover 500 and the inner decorative cover 600 are disposed at the mounting hole 211 . The outer decorative cover 500 is fixed to the outer side of the rear cover 210 , and the inner decorative cover 600 is fixed to the inner side of the rear cover 210 .

[0063] Exemplarily, the outer decorative cover 500 can be adhesively fixed to the outer wall of the back cover 210, and the outer decorative cover 500 gradually extends from the outer wall of the back cover 210 toward the end of the camera module away from the back cover 210, so as to form a gradually inclined and extending structure between the protruding part of the camera module and the back cover 210, that is, the part of the camera module protruding from the back cover 210 can form a gradually diffused structure, which is conducive to forming an integrated structure in appearance between the protruding part of the camera module and the outer decorative cover 500, thereby improving the overall aesthetics.

[0064] Furthermore, when a user holds the electronic device 10 , the outer decorative cover 500 can support the user's palm, and the user will not feel uncomfortable due to the protruding portion of the camera module, which is conducive to improving the user experience.

[0065] The inner decorative cover 600 can be bonded to the inner wall of the rear cover 210. The inner decorative cover 600 can further limit the position of the camera module, which helps to further improve the reliability of the overall structure. The inner decorative cover 600 has a first surface 610, which is the surface of the inner decorative cover 600 facing the circuit board 300.

[0066] For example, the outer decorative cover 500 may include a metal portion 510 and a plastic portion 520 , and the inner decorative cover 600 may be made entirely of plastic.

[0067] On this basis, the electronic device 10 further includes a first radiator 700, which is disposed on a surface of the inner decorative cover 600 away from the outer decorative cover 500. That is, the first radiator 700 is disposed on the first surface 610 of the inner decorative cover 600, and the first radiator 700 is electrically connected to the circuit board 300. In other words, the first radiator 700 is the radiator of the antenna, thereby enabling communication through the antenna.

[0068] In this way, because there is space between the inner decorative cover 600 and the circuit board 300, placing the first radiator 700 on the inner surface of the inner decorative cover 600 ensures a clear area for the antenna, thereby improving the antenna's radiation efficiency. Furthermore, placing the first radiator 700 on the inner surface of the inner decorative cover 600 eliminates the need to occupy space on the circuit board 300, thereby improving the integration of electronic components on the circuit board 300.

[0069] Moreover, the first radiator 700 is arranged on the inner decorative cover 600 , which will not affect the overall appearance of the electronic device 10 , that is, it will not affect the flatness of the outer surface of the back cover 210 and the outer decorative cover 500 , and will not form any imprint on the outer wall of the back cover 210 , thereby helping to improve the overall aesthetics of the electronic device 10 .

[0070] Furthermore, the vertical projection of the first radiator 700 on the circuit board 300 at least partially overlaps with the vertical projection of the metal portion 510 of the outer decorative cover 500 on the circuit board 300. Therefore, the first radiator 700 can also achieve spatial coupling with the metal portion 510 of the outer decorative cover 500, so that electromagnetic wave energy is coupled from the first radiator 700 to the metal portion 510 of the outer decorative cover 500, exciting higher-order modes of the metal portion 510 of the outer decorative cover 500. This makes the metal portion 510 of the outer decorative cover 500 a new radiator and achieves higher antenna efficiency. In some examples, the first radiator 700 can be disposed on a side of the first surface 610 near the outer edge of the inner decorative cover 600. Since the middle part of the inner decorative cover 600 is used to accommodate the above-mentioned camera module, the inner decorative cover 600 is a ring structure, and the first radiator 700 is arranged on the side of the first surface 610 close to the outer edge. This can reduce the probability of structural conflict between the first radiator 700 and the camera module or other electronic devices accommodated in the middle, thereby helping to improve the reliability of the overall structure.

[0071] For other examples, see Figure 4 and Figure 5 The distance between the first radiator 700 and the outer decorative cover 500 is a first distance D, which may be greater than 0 and less than or equal to 0.15λ. r According to the calculation formula of medium wavelength The first distance can be calculated.

[0072] Among them, λ r is the wavelength in the medium, λ0 is the wavelength in vacuum, ε r The dielectric constant of the medium is the material between the first radiator 700 and the metal portion 510 of the outer decorative cover 500 .

[0073] Furthermore, in order to further improve the distance between the first radiator 700 and the metal portion 510 of the outer decorative cover 500, the first distance D may be greater than or equal to 0.02λ. r , and less than or equal to 0.15λ r For example, the first distance D may be 2 mm, which is approximately 0.06λ. r .

[0074] Based on this, see Figure 6 and Figure 7 , Figure 6 Schematic diagram of S parameters and efficiency simulation of the first radiator 700 provided in an embodiment of the present application, Figure 7 This is a schematic diagram of current distribution when the first radiator 700 provided in an embodiment of the present application is coupled to the metal portion 510 of the outer decorative cover 500 .

[0075] The above simulation test was conducted with the N79 antenna. Figure 6 Curve A represents the S parameter curve of the antenna, curve B represents the system radiation efficiency curve, and curve C represents the system total efficiency curve. It can be seen that the system efficiency of the antenna is -5.5dB, and Figure 7 It can be seen from the current distribution that the energy of the first radiator 700 has been coupled to the metal part of the outer decorative cover 500, which is beneficial to improving the antenna performance.

[0076] In some embodiments, the first radiator 700 can be a flexible printed circuit (FPC) 300, which is fixed to the first surface 610 of the inner decorative cover 600. Alternatively, the first radiator 700 can be a steel sheet, which is embedded in the inner decorative cover 600 through an injection molding process. Alternatively, the first radiator 700 can be a metal layer, which is formed on the inner surface of the inner decorative cover 600 through an LDS process. A metal layer, such as silver paste, is then formed on the inner surface of the inner decorative cover 600. The first radiator 700 is then electrically connected to the circuit board 300 to form the antenna radiator, enabling normal communication of the electronic device 10.

[0077] For example, taking the first radiator 700 as an example, see Figure 8 , Figure 8 This is a structural diagram of a first radiator 700 provided in an embodiment of the present application. The first radiator 700 includes a first FPC board 710, which can be fixedly connected to the first surface 610 of the inner decorative cover 600 by bonding. The overall structure of this solution is simple, the process difficulty is low, and it is beneficial to saving space on the circuit board 300.

[0078] Also, please continue reading Figure 8 The first radiator 700 may further include a reinforcing plate 720, which is disposed between the first FPC board 710 and the inner decorative cover 600 to enhance the overall strength of the first FPC board 710 and improve the reliability of the overall structure. For example, when reinforcing plate 720 is provided, reinforcing plate 720 may be secured to the first surface 610 by adhesive bonding, and the first FPC board 710 and reinforcing plate 720 may also be secured to each other by adhesive bonding.

[0079] Also, see Figure 9 In conjunction with Figure 8 , Figure 9 This is a structural diagram of another first radiator 700 provided in an embodiment of the present application. To ensure accurate positioning of the first radiator 700 (i.e., the first FPC board 710 and the reinforcing plate 720), a plurality of positioning protrusions 620 can be provided on the inner decorative cover 600. The first FPC board 710 and the reinforcing plate 720 can also have a plurality of corresponding positioning holes 711. The positioning holes 711 correspond to the positioning protrusions 620, and the positioning protrusions 620 extend into the corresponding positioning holes 711. This allows the first radiator 700 to be accurately positioned during installation, facilitating electrical connection between the first radiator 700 and the circuit board 300 in subsequent processes.

[0080] It can be understood that the above-mentioned multiple limiting holes 711 are correspondingly opened on the first FPC board 710 and the reinforcement plate 720, which means that limiting holes 711 are opened on both the first FPC board 710 and the reinforcement plate 720, and the limiting holes 711 on the first FPC board 710 are arranged in a one-to-one correspondence with the limiting holes 711 on the reinforcement plate 720, that is, the limiting holes 711 on the first FPC board 710, the limiting holes 711 on the reinforcement plate 720 and the limiting protrusions 620 are the same in number and in corresponding positions, so that the limiting protrusions 620 can extend into the corresponding limiting holes 711 on the reinforcement plate 720 and the corresponding limiting holes 711 on the first FPC board 710.

[0081] In other embodiments, see Figure 10 and Figure 11 , Figure 10 This is a structural diagram of another first radiator 700 provided in an embodiment of the present application. Figure 11 for Figure 10 A cross-sectional view of the first radiator 700 is provided. A fixing boss 630 may be formed on the first surface 610 of the inner decorative cover 600. The fixing boss 630 is located at the outer edge of the first surface 610 and extends toward the circuit board 300. The first FPC board 710 may include a first portion 712, a second portion 713, and a connecting portion 714 connecting the first portion 712 and the second portion 713. The first portion 712 is attached to and fixed to the surface of the fixing boss 630 facing the circuit board 300, the second portion 713 is attached to and fixed to the first surface 610, and the connecting portion 714 is attached to the sidewall of the fixing boss 630.

[0082] In this way, the fixing boss 630 can reduce the distance between the first portion 712 of the first FPC board 710 and the circuit board 300, thereby facilitating electrical connection between the PFC board and the circuit board 300 via the first portion 712. Simultaneously, the second portion 713 can extend around the first surface 610 of the interior decorative cover 600 in a direction parallel to the first surface 610, thereby increasing the area of ​​the first FPC board 710. Specifically, the first portion 712 is used to electrically connect the first FPC board 710 to the circuit board 300, while the second portion 713 is used to radiate signals from the antenna radiator. This not only improves the radiation intensity of the antenna radiator, but also reduces the distance between the first portion 712 and the circuit board 300, thereby simplifying the process of electrically connecting the two.

[0083] Furthermore, the limiting hole 711 may be provided on the first portion 712 , or on the second portion 713 , or on both the first portion 712 and the second portion 713 .

[0084] In addition, the reinforcing plate 720 can adopt the same structure as the first FPC board 710, that is, it can support the first part 712, the connecting part 714 and the second part 713 of the first FPC board 710 respectively. Alternatively, the reinforcing plate 720 can be set only corresponding to the second part 713, that is, the reinforcing plate 720 is set between the second part 713 of the first FPC board 710 and the first surface 610, thereby supporting the second part 713 of the first FPC board 710 with a larger area. Alternatively, the reinforcing plate 720 can be set respectively corresponding to the first part 712 and the second part 713 of the first FPC board 710, thereby supporting both the first part 712 and the second part 713, as shown in FIG. Figure 11 Therefore, this application does not make any special limitation to this.

[0085] It should be noted that when the reinforcing plate 720 is only provided corresponding to the second portion 713 of the first FPC board 710, and the limiting hole 711 is also provided in the first portion 712 of the first FPC board 710, the limiting protrusion 620 provided on the fixing boss 630 extends into the limiting hole 711 in the first portion 712 of the first FPC board 710. Simultaneously, the limiting protrusion 620 on the first surface 610 extends into the corresponding limiting hole 711 in the reinforcing plate 720 and the corresponding limiting hole 711 in the second portion 713 of the first FPC board 710.

[0086] Based on this, see Figure 12 , Figure 12This is a structural diagram of the connection between the first FPC board 710 and the circuit board 300 provided in an embodiment of the present application via an electrical connector 800. To achieve electrical connection between the first FPC board 710 and the circuit board 300, the electronic device 10 may further include an electrical connector 800. The electrical connector 800 abuts between the first FPC board 710 and the circuit board 300, that is, the electrical connector 800 abuts between the first FPC board 710 and the circuit board 300, thereby achieving electrical connection between the first FPC board 710 and the circuit board 300 through the electrical connector 800. Exemplarily, the electrical connector 800 may be a wire, a spring 810, or other form of electrical connection structure.

[0087] Specifically, taking the electrical connector 800 as the spring 810 as an example, refer to Figure 13 , Figure 13 The structural diagram provided in the embodiment of the present application shows that the first FPC board 710 and the circuit board 300 are connected through the spring clip 810. The spring clip 810 can be welded and fixed on the circuit board 300. The end of the spring clip 810 away from the circuit board 300 abuts against the first FPC board 710. Since the spring clip 810 is elastic, the spring clip 810 can undergo elastic deformation after abutting against the first FPC board 710. The elastic force can make the spring clip 810 stably abut against the first FPC board 710, thereby realizing a stable electrical connection between the first FPC board 710 and the circuit board 300.

[0088] Alternatively, the spring clip 810 may be welded and fixed to the first FPC board 710, with its other end abutting the circuit board 300, thereby achieving a stable electrical connection between the first FPC board 710 and the circuit board 300. This embodiment of the present application is not particularly limited to this. Furthermore, in the following embodiments, the spring clip 810 is welded and fixed to the circuit board 300, with its other end abutting the first FPC board 710.

[0089] To ensure that the spring clip 810 forms a stable connection structure between the first FPC board 710 and the circuit board 300, the spring clip 810 needs to have stable supporting strength, that is, the greater the distance between the first FPC board 710 and the circuit board 300, the larger the overall volume of the spring clip 810, so as to ensure that the spring clip 810 forms a stable support between the two, thereby ensuring a stable electrical connection between the first FPC board 710 and the circuit board 300.

[0090] Based on this, please continue to see Figure 13The spring clip 810 can abut between the first portion 712 of the first FPC board 710 and the circuit board 300. Because the first portion 712 is fixed to the fixing boss 630, the distance H1 between the first portion 712 and the circuit board 300 is smaller than the distance H2 between the second portion 713 and the circuit board 300. Therefore, the spring clip 810 abutting between the first portion 712 of the first FPC board 710 and the circuit board 300 can reduce the volume of the spring clip 810, thereby reducing the area occupied by the spring clip 810 on the circuit board 300 and saving space on the circuit board 300.

[0091] On this basis, see Figure 14 and Figure 15 , Figure 14 This is a structural diagram of the first FPC board 710 and the circuit board 300 provided in an embodiment of the present application being connected via a spring 810 and a metal block 820. Figure 15 for Figure 14 A cross-sectional view of the connection between the first FPC board 710 and the circuit board 300 via the spring clip 810 and the metal block 820 is provided. To further reduce the volume of the spring clip 810, the electronic device 10 provided in this embodiment of the application may further include a metal block 820. The metal block 820 is disposed on the surface of the first FPC board 710 facing the circuit board 300, with the spring clip 810 abutting between the metal block 820 and the circuit board 300. For example, the metal block 820 may be welded to the first portion 712 of the first FPC board 710, with the spring clip 810 abutting against the metal block 820.

[0092] In this way, the metal block 820 is welded on the first part 712 of the first FPC board 710 to electrically connect the metal block 820 to the first FPC board 710, and the distance between the metal block 820 and the circuit board 300 is smaller than the distance between the first part 712 of the first FPC board 710 and the circuit board 300, that is, the distance between the first FPC board 710 and the circuit board 300 is further reduced by the metal block 820. Therefore, the volume of the spring 810 abutting between the metal block 820 and the circuit board 300 can be further reduced, thereby further reducing the area occupied by the spring 810 on the circuit board 300.

[0093] In another possible embodiment, the electronic device 10 may include a heightened plate 830, see Figure 16 , Figure 16This embodiment of the present application shows a structure in which the first FPC board 710 and the circuit board 300 are connected via a spring clip 810 and a heightened plate 830. The heightened plate 830 is disposed on the surface of the circuit board 300 facing the inner decorative cover 600, and the spring clip 810 abuts between the heightened plate 830 and the first portion 712 of the first FPC board 710. Specifically, by providing the heightened plate 830 on the circuit board 300, the distance between the circuit board 300 and the first FPC board 710 is reduced. The spring clip 810 is then welded to the heightened plate 830, thereby reducing its volume.

[0094] For example, the raised plate 830 can be integrally formed with the circuit board 300. Specifically, when processing the circuit board 300, a locally raised area is formed on the surface of the circuit board 300 to form the raised plate 830. Alternatively, the raised plate 830 can be fixed to the surface of the circuit board 300 by welding. Therefore, this application does not impose any particular limitation on this aspect.

[0095] In other embodiments, see Figure 17 , Figure 17 This is a partial structural diagram of another electronic device 10 provided in an embodiment of the present application. Multiple first radiators 700 may be provided, each of which is disposed on the inner decorative cover 600 and spaced apart circumferentially around the mounting hole 211. In this manner, multiple first radiators 700 may be provided on the inner decorative cover 600, thereby forming multiple antennas to accommodate different communication frequency bands of the electronic device 10.

[0096] Furthermore, the multiple first radiators 700 disposed on the inner decorative cover 600 may have the same structure. For example, the multiple first radiators 700 may all utilize the aforementioned adhesively secured FPC board. Alternatively, the multiple first radiators 700 may utilize different structures. For example, some of the first radiators 700 may utilize the adhesively secured FPC board, some may utilize the aforementioned steel sheet embedded in the inner decorative cover 600, and some may utilize the aforementioned metal layer formed using the LDS process.

[0097] Furthermore, the connection between different first radiators 700 and the circuit board 300 can employ the same connection structure, for example, all being electrically connected via the aforementioned spring clip 810. Alternatively, different connection structures can be employed, for example, one first radiator 700 being connected to the circuit board 300 using the spring clip 810, while another first radiator 700 being connected to the circuit board 300 using the spring clip 810 and the metal block 820. Therefore, this application does not impose any particular limitation on this.

[0098] On the basis of the above embodiment, the electronic device 10 provided in the embodiment of the present application may further include a second radiator 900, see Figure 18 , Figure 18 This is a cross-sectional structural diagram of a second radiator 900 provided in an embodiment of the present application. The second radiator 900 is arranged on the inner surface of the back cover 210, and the vertical projection of the second radiator 900 on the circuit board 300 at least partially overlaps with the vertical projection of the first radiator 700 on the circuit board 300.

[0099] In this way, the first radiator 700 can be spatially coupled with the second radiator 900, so that the electromagnetic wave energy is coupled from the first radiator 700 to the second radiator 900 and radiated to the outside of the back cover 210. That is, the radiation area of ​​the antenna is increased by the second radiator 900, which is conducive to further improving the radiation efficiency.

[0100] Specifically, the above-mentioned back cover 210 may include a first area 212, a second area 213 and a bending area 214, the bending area 214 is connected between the first area 212 and the second area 213, the second area 213 protrudes from the outer surface of the first area 212, the mounting hole 211 is set in the second area 213, the above-mentioned outer decorative cover 500 is fixed on the outer surface of the second area 213, and the inner decorative cover 600 is fixed on the inner surface of the second area 213.

[0101] The above-mentioned second radiator 900 can be arranged on the inner surface of the second area 213 so that the vertical projections of the first radiator 700 and the second radiator 900 arranged on the inner decoration cover 600 on the circuit board 300 can have an overlapping area, thereby enabling spatial coupling between the first radiator 700 and the second radiator 900.

[0102] In addition, the first area 212 and the second area 213 of the back cover 210 are connected by the bending area 214, which can enable the bending area 214 and the outer decorative cover 500 to form a continuous inclined extended surface, and the inclined extended surface can form a smaller inclination angle, which is conducive to making the protruding structure formed on the back cover 210 of the electronic device 10 closer to an integrated structure, thereby further improving the overall aesthetics of the electronic device 10.

[0103] In some embodiments, to further increase the radiation area of ​​the antenna, see Figure 19 , Figure 19 This is a cross-sectional structural diagram of another second radiator 900 provided in an embodiment of the present application. The above-mentioned second radiator 900 can extend to the bending area 214 in a direction away from the mounting hole 211, thereby further increasing the radiation area of ​​the antenna to further improve the radiation efficiency and thereby improve the communication effect of the antenna.

[0104] In some other possible embodiments, see Figure 20 , Figure 20 This is a cross-sectional structural diagram of another second radiator 900 provided in an embodiment of the present application. The second radiator 900 can be further extended to the first area 212 in a direction away from the mounting hole 211, thereby further increasing the radiation area of ​​the antenna.

[0105] For example, the second radiator 900 may be formed by using an LDS process to form a metal layer, such as a silver paste layer, on the inner surface of the back cover 210. The metal layer forms the second radiator 900 and is spatially coupled with the first radiator 700.

[0106] In other possible examples, the second radiator 900 may also be made of the aforementioned FPC board, which is adhesively fixed to the inner surface of the back cover 210. Alternatively, the second radiator 900 may be made of a steel sheet embedded in the back cover 210. Therefore, this application does not impose any particular limitation on this.

[0107] On this basis, the first radiators 700 and the second radiators 900 can be provided in the same number and arranged in a one-to-one correspondence, that is, each first radiator 700 is provided with a corresponding second radiator 900. Alternatively, the number of first radiators 700 and second radiators 900 can also be different, that is, some first radiators 700 are provided with corresponding second radiators 900, and some first radiators 700 are only coupled with the metal portion 510 of the outer decorative cover 500.

[0108] Furthermore, the corresponding first radiator 700 and second radiator 900 may adopt the same structure. For example, the first radiator 700 and second radiator 900 may both adopt the above-mentioned FPC board; or, both adopt the above-mentioned metal layer formed by the LDS process.

[0109] The corresponding first radiator 700 and second radiator 900 may also adopt different structures. For example, the first radiator 700 may adopt the above-mentioned FPC board bonded and fixed to the inner decorative cover 600, and the second radiator 900 may adopt a metal layer formed on the inner surface of the back cover 210 through the LDS process.

[0110] Furthermore, when multiple groups of first radiators 700 and second radiators 900 are provided, the multiple groups of first radiators 700 and second radiators 900 can employ identical structures. For example, each group of first radiators 700 and second radiators 900 employs the aforementioned FPC board. Alternatively, the multiple groups of first radiators 700 and second radiators 900 can employ different structures. For example, one group of first radiators 700 and second radiators 900 may both employ FPC boards; another group of first radiators 700 and second radiators 900 may both employ metal layers; and yet another group of first radiators 700 and second radiators 900 may employ steel sheets and second radiators 900 may employ metal layers. Therefore, this application does not impose any specific restrictions on the specific number or structure of the first radiators 700 and second radiators 900.

[0111] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0112] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: The rear cover is provided with a mounting hole; An outer decorative cover is arranged at the mounting hole and on the outer side of the rear cover; an inner decorative cover, disposed at the mounting hole and on the inner side of the rear cover; a first radiator, disposed on a surface of the inner decorative cover away from the outer decorative cover; A circuit board is arranged on the inner side of the back cover, and the first radiator is electrically connected to the circuit board.

2. The electronic device according to claim 1, wherein The outer decorative cover includes a metal part and a plastic part, the metal part and the plastic part are fixedly connected, and a vertical projection of the metal part on the circuit board at least partially overlaps with a vertical projection of the first radiator on the circuit board.

3. The electronic device according to claim 2, wherein: Along the thickness direction of the electronic device, the distance between the first radiator and the metal part is a first distance, and the first distance is greater than 0 and less than or equal to 0.15λ r ; Among them, λ r is the wavelength in the medium.

4. The electronic device according to claim 3, wherein: The first distance is greater than or equal to 0.02λ r , and less than or equal to 0.15λ r .

5. The electronic device according to any one of claims 1 to 4, characterized in that: The surface of the inner decoration cover facing the circuit board is a first surface. The first radiator is arranged on the first surface and is located on a side close to the outer edge of the outer decoration cover.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further includes an electrical connector, which is abutted between the first radiator and the circuit board.

7. The electronic device according to claim 6, wherein: The electronic device further includes a metal block fixed on a surface of the first radiator facing the circuit board, and the electrical connector abuts between the metal block and the circuit board.

8. The electronic device according to claim 6, wherein: The electronic device further includes a heightened plate, which is disposed on a surface of the circuit board facing the inner decorative cover. The heightened plate is electrically connected to the circuit board, and the electrical connector is abutted between the heightened plate and the first radiator.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The first radiator includes an FPC board, and the FPC board is fixed on a surface of the inner decoration cover away from the outer decoration cover.

10. The electronic device according to claim 9, characterized in that The first radiator further includes a reinforcing plate, and the reinforcing plate is arranged between the FPC board and the inner decoration cover.

11. The electronic device according to claim 10, characterized in that The inner decorative cover is provided with a plurality of limiting protrusions, and the FPC board and the reinforcing plate are both provided with a plurality of limiting holes. The plurality of limiting holes are provided in a one-to-one correspondence with the plurality of limiting protrusions, and the limiting protrusions extend into the corresponding limiting holes.

12. The electronic device according to any one of claims 1 to 8, characterized in that: The first radiator includes a steel sheet, and the steel sheet is arranged on the inner decoration cover.

13. The electronic device according to any one of claims 1 to 8, characterized in that: The first radiator includes a metal layer, and the metal layer is arranged on a surface of the inner decoration cover away from the outer decoration cover.

14. The electronic device according to any one of claims 1 to 13, characterized in that: A plurality of the first radiators are provided, and the plurality of the first radiators are distributed at intervals along the circumference of the mounting hole.

15. The electronic device according to any one of claims 1 to 14, characterized in that: The electronic device further includes a second radiator, which is disposed on the inner surface of the back cover, and a vertical projection of the second radiator on the circuit board at least partially overlaps with a vertical projection of the first radiator on the circuit board.

16. The electronic device according to claim 15, characterized in that The back cover includes a first area, a second area and a bending area, the bending area is connected between the first area and the second area, the second area protrudes from the outer surface of the first area, the mounting hole is set in the second area, the outer decorative cover and the inner decorative cover are both fixedly connected to the second area, and the second radiator is set on the inner surface of the second area.

17. The electronic device according to claim 16, wherein: The second radiator extends to the bending area along a direction away from the mounting hole.

18. The electronic device according to claim 16, wherein: The second radiator extends to the first area along a direction away from the mounting hole.

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