Silicon controlled rectifier chip normal temperature and high temperature test all-in-one machine

Abstract

The invention discloses a silicon controlled rectifier chip normal-temperature and high-temperature testing all-in-one machine which comprises a normal-temperature testing module, a second portal frame testing and carrying mechanism, a copper disc heating and carrying mechanism and a first copper disc backflow conveying line. The discharging mechanism, the normal-temperature Kelvin testing mechanism, the first chip classifying and sorting mechanism and the copper disc heating and carrying mechanism are arranged in the circumferential direction of the rotary classifying platform. The high-temperature testing module comprises a second rack, a second portal frame testing and carrying mechanism, a copper disc cooling and carrying mechanism and a second copper disc backflow conveying line, the copper disc cooling and carrying mechanism corresponds to the copper disc heating and carrying mechanism in position, and a second chip classifying and sorting mechanism is arranged at the end of the copper disc cooling and carrying mechanism; the second copper disc backflow conveying line corresponds to the first copper disc backflow conveying line in position. Compared with the prior art, the problem of low normal temperature test and high temperature test efficiency of the existing silicon controlled rectifier chip is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of thyristor chip testing, and in particular to a thyristor chip normal-temperature and high-temperature testing all-in-one machine. Background Art

[0002] A thyristor chip is a power switching device based on a four-layer semiconductor structure. It is triggered to turn on by a control electrode signal and to turn off under specific conditions. It has important applications in the field of power control.

[0003] After processing, thyristor chips require room temperature voltage drop (VTM / VFM) testing and high temperature leakage current (IDRM / IRRM) testing. Conventional thyristor chip testing requires separate equipment for these two tests, resulting in inefficient testing. Summary of the Invention

[0004] The purpose of the present invention is to provide a thyristor chip normal temperature and high temperature test all-in-one machine to solve the problem of low efficiency of the existing thyristor chip normal temperature test and high temperature test.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: A thyristor chip normal temperature and high temperature test all-in-one machine, comprising:

[0006] The room temperature test module includes a first frame, a first gantry test and transport mechanism, a copper tray heating and transport mechanism, and a first copper tray reflow conveyor line. The first frame is provided with a rotary classification platform. The discharge mechanism, the room temperature Kelvin test mechanism, the first chip sorting and picking mechanism, and the copper tray heating and transport mechanism are arranged along the circumference of the rotary classification platform. A chip transport mechanism is provided on one side of the discharge mechanism.

[0007] The high-temperature test module includes a second rack, a second gantry testing and transporting mechanism, a copper tray cooling and transporting mechanism and a second copper tray reflow conveyor line. The second rack is arranged on one side of the first rack. The position of the copper tray cooling and transporting mechanism corresponds to the copper tray heating and transporting mechanism. A second chip sorting and picking mechanism is arranged at the end of the copper tray cooling and transporting mechanism. The position of the second copper tray reflow conveyor line corresponds to the first copper tray reflow conveyor line.

[0008] As a further description of the above technical solution:

[0009] The copper plate heating and transporting mechanism includes a first copper plate placement channel, a first sliding support seat, a first lifting seat and a fourth linear motor module. The first copper plate placement channel is provided with four heating seats arranged along a straight line, and the four heating seats are arranged equidistantly. An array of heating plates is provided under the heating seats. The first sliding support seat is slidably connected to the fourth slide rail, and a first lifting cylinder is provided on the first sliding support seat. The first lifting seat is slidably connected to the first sliding support seat. The first lifting seat is fixedly mounted on the piston rod of the first lifting cylinder. A first linkage rod is provided between two adjacent first lifting seats, and the cross support rod of the first sliding support seat is fixedly mounted on the slide of the fourth linear motor module.

[0010] As a further description of the above technical solution:

[0011] The copper plate cooling and transporting mechanism includes a second copper plate placement flow channel, which includes a heat preservation seat and several cooling seats. A symmetrically arranged contact electrode is provided on one opposite side of the heat preservation seat, and the mounting plate of the contact electrode is fixedly installed on the output end of the driving cylinder.

[0012] As a further description of the above technical solution:

[0013] The unloading mechanism includes a first linear motor module, a support frame, a material tray placement platform, a first slide rail and a pressing piece. The support frame is fixedly mounted on the mover of the first linear motor module. The support frame is provided with a first slide rail. The material tray placement platform is slidably connected to the support frame. One end of the material tray placement platform is connected to the slider on the first slide rail. The material tray is placed on the material tray placement platform. The pressing piece is fixedly mounted on the output end of the pressing cylinder, and the pressing piece extends above the material tray.

[0014] As a further description of the above technical solution:

[0015] The chip transport mechanism includes a first X-axis module, a first Z-axis cylinder and a first suction cup. The first Z-axis cylinder is fixedly mounted on a slider of the first X-axis module, and the first suction cup is fixedly mounted on an output end of the first Z-axis cylinder.

[0016] As a further description of the above technical solution:

[0017] The first chip sorting and picking mechanism includes a first pallet handling robot, a pallet positioning frame and an electric cylinder. A lifting support plate is provided at the bottom of the pallet positioning frame. The pallet positioning frame is fixedly mounted on the piston rod of the electric cylinder, and the first pallet is placed on the lifting support plate.

[0018] As a further description of the above technical solution:

[0019] The first gantry testing and handling mechanism includes a first X-axis linear module, a first Y-axis linear module and a second Y-axis linear module. The first X-axis linear module is a double-moving sub-linear module. The first Y-axis linear module is fixedly mounted on the first mover of the first X-axis linear module. The first Y-axis linear module is provided with a first copper disk clamping assembly and a first material picking module. The first Y-axis linear module is a double-moving sub-linear module. The first copper disk clamping assembly is fixedly mounted on the third mover of the first Y-axis linear module. The first material picking module is fixedly mounted on the fourth mover of the first Y-axis linear module. The second Y-axis linear module is fixedly mounted on the second mover of the first X-axis linear module. The second Y-axis linear module is provided with a second material picking module.

[0020] As a further description of the above technical solution:

[0021] The second gantry testing and handling mechanism includes a third material picking module, a second X-axis linear module, a third Y-axis linear module, a second copper disk clamping assembly and a fourth material picking module. The third material picking module includes a high-temperature test probe.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0023] 1. The present invention integrates the functions of normal-temperature and high-temperature testing, Kelvin testing, high-temperature testing, and chip sorting in a single machine. The copper trays carrying the chips can be recycled through a first copper tray reflow conveyor line and a second copper tray reflow conveyor line, achieving a cyclical operation. The normal-temperature and high-temperature testing machine only requires manual placement and removal of materials from the trays. The testing and sorting of thyristor chips is automated and efficient, saving labor costs and improving production efficiency.

[0024] 2. In the present invention, the normal temperature test module and the high temperature test module are effectively integrated in the normal temperature and high temperature test all-in-one machine, which improves the efficiency of thyristor chip testing and classification. At the same time, the normal temperature test module and the high temperature test module also have a certain degree of independence and can be separated, which is convenient for disassembly and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 This is a schematic diagram of the structure of a thyristor chip normal temperature and high temperature test all-in-one machine Figure 1 .

[0027] Figure 2This is a schematic diagram of the structure of a thyristor chip normal temperature and high temperature test all-in-one machine Figure 2 .

[0028] Figure 3 This is a schematic diagram of the structure of a thyristor chip normal temperature and high temperature test all-in-one machine Figure 3 .

[0029] Figure 4 This is a schematic diagram of the structure of a thyristor chip room temperature and high temperature test all-in-one machine from a top view.

[0030] Figure 5 This is a schematic diagram of the structural breakdown of a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0031] Figure 6 for Figure 5 A partial enlarged view of point A in the middle.

[0032] Figure 7 This is a structural diagram of the first gantry testing and handling mechanism in a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0033] Figure 8 This is a structural diagram of the second gantry testing and handling mechanism in a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0034] Figure 9 This is a structural diagram of a rotating classification platform in a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0035] Figure 10 This is a structural diagram of the material discharge mechanism in a thyristor chip normal temperature and high temperature test all-in-one machine.

[0036] Figure 11 The figure is a schematic diagram of the structure of the chip handling mechanism in a thyristor chip normal temperature and high temperature test all-in-one machine.

[0037] Figure 12 This is a structural diagram of the first chip sorting and picking mechanism in a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0038] Figure 13 This is a schematic diagram of the conveying mechanism of the copper plate heating and transporting mechanism in a thyristor chip normal temperature and high temperature testing all-in-one machine.

[0039] Figure 14 for Figure 13 A partial enlarged view of point B in the middle.

[0040] Figure 15 This is a schematic diagram of the structure of the copper plate heating and transport mechanism in a thyristor chip room temperature and high temperature test all-in-one machine. Figure 1 .

[0041] Figure 16This is a schematic diagram of the structure of the copper plate heating and transport mechanism in a thyristor chip room temperature and high temperature test all-in-one machine. Figure 2 .

[0042] Legend:

[0043] 1. First frame; 11. Rotating sorting platform; 12. Material discharge mechanism; 121. First linear motor module; 122. Support frame; 123. Material tray placement platform; 124. First slide rail; 125. Tablet press; 1251. Material pressing cylinder; 13. Normal temperature Kelvin test mechanism; 14. First chip sorting and picking mechanism; 141. First pallet handling robot; 142. Pallet positioning frame; 143. Electric cylinder; 15. Chip handling mechanism; 151. First X-axis module; 152. First Z-axis cylinder; 153. First suction cup; 18. Locking block; 19. Machine cover; 191. Cover plate;

[0044] 2. First gantry testing and handling mechanism; 21. First X-axis linear module; 22. First Y-axis linear module; 221. First copper plate clamping assembly; 222. First retrieving module; 23. Second Y-axis linear module; 231. Second retrieving module;

[0045] 3. Copper plate heating and transport mechanism; 31. First copper plate placement channel; 311. Heating seat; 312. Heating plate; 32. First sliding support seat; 321. First lifting cylinder; 33. First lifting seat; 34. Fourth linear motor module; 35. Fourth slide rail; 36. First linkage rod;

[0046] 4. The first copper plate reflux conveyor line;

[0047] 5. Second rack;

[0048] 6. Second gantry testing and handling mechanism; 61. Third retrieving module; 62. Second X-axis linear module; 63. Third Y-axis linear module; 64. Second copper disc clamping assembly;

[0049] 7. Copper tray cooling and transport mechanism; 71. Second chip sorting and picking mechanism; 72. Second copper tray placement flow channel; 721. Insulation seat; 722. Contact electrode; 723. Driving cylinder; 724. Cooling seat;

[0050] 8. The second copper plate reflux conveyor line;

[0051] 9. Material tray; 91. First tray; 92. Copper tray. DETAILED DESCRIPTION

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0053] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0054] Example 1

[0055] See also Figure 1-16 The present invention provides a technical solution: a thyristor chip normal temperature and high temperature test all-in-one machine, comprising:

[0056] The room temperature test module includes a first rack 1, a first gantry test and transport mechanism 2, a copper tray heating and transport mechanism 3, and a first copper tray reflow conveyor line 4. The first rack 1 is provided with a rotary classification platform 11. The discharge mechanism 12, the room temperature Kelvin test mechanism 13, the first chip classification and sorting mechanism 14, and the copper tray heating and transport mechanism 3 are arranged along the circumference of the rotary classification platform 11. A chip transport mechanism 15 is provided on one side of the discharge mechanism 12.

[0057] The high-temperature testing module includes a second frame 5, a second gantry testing and conveying mechanism 6, a copper tray cooling and conveying mechanism 7 and a second copper tray reflow conveying line 8. The second frame 5 is arranged on one side of the first frame 1. The position of the copper tray cooling and conveying mechanism 7 corresponds to the copper tray heating and conveying mechanism 3. A second chip sorting and picking mechanism 71 is arranged at the end of the copper tray cooling and conveying mechanism 7. The position of the second copper tray reflow conveying line 8 corresponds to the first copper tray reflow conveying line 4. The structure and function of the second chip sorting and picking mechanism 71 are the same as those of the first chip sorting and picking mechanism 14, and a double-station design can be achieved by arranging two second chip sorting and picking mechanisms 71 at the end of the copper tray cooling and conveying mechanism 7 to improve the chip sorting and unloading efficiency.

[0058] The copper plate heating and transporting mechanism 3 includes a first copper plate placement channel 31, a first sliding support seat 32, a first lifting seat 33 and a fourth linear motor module 34. The first copper plate placement channel 31 is provided with four heating seats 311 arranged along a straight line. The four heating seats 311 are arranged equidistantly. A heating plate 312 arranged in an array is provided under the heating seat 311. The first sliding support seat 32 is slidably connected to the fourth slide rail 35. The first sliding support seat 32 is provided with a first lifting cylinder 321. The first lifting seat 33 is slidably connected to the first sliding support seat 32. The first lifting seat 33 is fixedly installed on the piston rod of the first lifting cylinder 321. A first linkage rod 36 is provided between two adjacent first lifting seats 33. The cross support rod of the first sliding support seat 32 is fixedly installed on the slide of the fourth linear motor module 34.

[0059] The copper plate heating and transporting mechanism 3 is used to heat the chip products on the copper plate 92 and transport the copper plate. The four-station heating effectively ensures that the chip can be tested quickly and stably at the required temperature.

[0060] An array of heating plates 312 is provided under each heating seat 311. The thermal conductivity of copper ensures rapid and stable heating. Each heating plate 312 is equipped with a temperature control switch, which can fine-tune the temperature of different areas of each copper plate to ensure that the temperature difference between different chip products on the copper plate does not exceed the required limit value.

[0061] When the copper plate 92 is transported, the first lifting seat 33 is first lifted by the first lifting cylinder 321. The positioning pin at the end of the first lifting seat 33 is inserted into the through hole at the inner corner of the copper plate 92 and the copper plate 92 is lifted up and separated from the heating seat 311. Then, the fourth linear motor module 34 drives several first sliding support seats 32 to slide forward synchronously, so that the copper plate 92 moves to the next heating seat 311 or above the next workstation. After that, the first lifting seat 33 descends and replaces the copper plate 92 on the first copper plate placement flow channel 31. After the first lifting seat 33 is separated from the copper plate 92, the fourth linear motor module 34 drives the first sliding support seat 32 to reset. The servo motor controls the transportation of the copper plate, ensuring the accuracy of the copper plate position and the equidistant placement of each chip.

[0062] The copper plate cooling and transporting mechanism 7 includes a second copper plate placement channel 72, which includes a heat preservation seat 721 and several cooling seats 724. A symmetrically arranged contact electrode 722 is provided on the opposite side of the heat preservation seat 721, and the mounting plate of the contact electrode 722 is fixedly installed on the output end of the driving cylinder 723.

[0063] The copper plate cooling and transporting mechanism 7 is otherwise the same as the copper plate heating and transporting mechanism 3 , except that the second copper plate placement flow channel 72 is different from the first copper plate placement flow channel 31 .

[0064] The copper plate cooling and transporting mechanism 7 is similarly provided with a second sliding support seat and a second lifting seat. The second sliding support seat is slidably connected to the fourth slide rail 35, and the second lifting seat is connected to the first lifting seat 33 through a second linkage rod. The second lifting seats are connected by a third linkage rod to achieve synchronous transport of the second lifting seat and the first lifting seat 33.

[0065] The copper plate cooling and transport mechanism 7 performs high-temperature testing on the heat preservation seat 721 of the second copper plate placement flow channel 72. A heating plate is installed below the heat preservation seat 721, and the third material removal module 61 is correspondingly installed above the heat preservation seat 721. The second lifting seats on both sides of the copper plate use positioning pins to achieve four-point positioning of the copper plate during high-temperature testing, ensuring the consistency of test values ​​of different chips on the copper plate at high temperatures.

[0066] The insulation seat 721 of the copper plate high temperature insulation test area is combined with the first copper plate to place the flow channel 31 to achieve five-station heating, ensuring the rapid heating of the copper plate and the accuracy of temperature control;

[0067] When performing high-temperature leakage current (IDRM / IRRM) testing, a high-temperature test probe 611 is used to test each chip point from above. The contact electrode 722 below contacts the copper disk 92 under the push of the driving cylinder 723, realizing a simultaneous contact test of four points on both sides (the copper disk is used as an electrode).

[0068] A water cooler is provided under the cooling seat 724. The copper plate after the high temperature test is moved to the cooling seat 724 for cooling. The three-station water cooling can effectively and quickly reduce the temperature of the copper plate to a controllable temperature.

[0069] The first chip sorting and picking mechanism 14 includes a first pallet handling robot 141, a pallet positioning frame 142 and an electric cylinder 143. A lifting pallet is provided at the bottom of the pallet positioning frame 142. The pallet positioning frame 142 is fixedly mounted on the piston rod of the electric cylinder 143. The first pallet 91 is placed on the lifting pallet.

[0070] Two pallet positioning racks 142 are located beneath the first pallet handling robot 141: one for empty pallets and the other for full pallets. Once the empty first pallet 91 at the top of the empty pallet handling area is filled with 1800V products, it is moved by the first pallet handling robot 141 to the full pallet handling area. The electric cylinder 143 in the full pallet handling area lowers the lifting plate via a piston rod to facilitate placement of the next pallet, effectively reducing manual loading and unloading time. The first pallet handling robot 141 utilizes a four-position suction method, which is fast, stable, and precise, improving efficiency.

[0071] The first gantry testing and handling mechanism 2 includes a first X-axis linear module 21, a first Y-axis linear module 22 and a second Y-axis linear module 23. The first X-axis linear module 21 is a double-moving sub-linear module. The first Y-axis linear module 22 is fixedly mounted on the first mover of the first X-axis linear module 21. The first Y-axis linear module 22 is provided with a first copper disk clamping assembly 221 and a first material picking module 222. The first Y-axis linear module 22 is a double-moving sub-linear module. The first copper disk clamping assembly 221 is fixedly mounted on the third mover of the first Y-axis linear module 22. The first material picking module 222 is fixedly mounted on the fourth mover of the first Y-axis linear module 22. The second Y-axis linear module 23 is fixedly mounted on the second mover of the first X-axis linear module 21. The second Y-axis linear module 23 is provided with a second material picking module 231.

[0072] The first copper plate clamping assembly 221 realizes Z-axis movement through the cylinder, clamps the copper plate 92 through the pneumatic clamping claw, and realizes XY-axis movement through the first X-axis linear module 21 and the first Y-axis linear module 22, placing the empty copper plate 92 on the first copper plate reflow conveyor line 4 on the copper plate heating and transporting mechanism 3;

[0073] The first picking module 222 realizes Z-axis movement through the cylinder, and absorbs the 1800V products and NG products after the room temperature Kelvin test on the rotating classification platform 11 through the suction cup, and realizes XY-axis movement through the first X-axis linear module 21 and the first Y-axis linear module 22 to realize the classification of 1800V products and the elimination of NG products.

[0074] The second material picking module 231 realizes Z-axis movement through the cylinder, and absorbs the 1600V product after the room temperature Kelvin test on the rotating classification platform 11 through the suction cup, and realizes XY-axis movement through the first X-axis linear module 21 and the first Y-axis linear module 22, and places the 1600V product on the empty copper plate 92 of the copper plate heating and conveying mechanism 3 for subsequent high-temperature testing.

[0075] The second gantry testing and handling mechanism 6 includes a third retrieving module 61, a second X-axis linear module 62, a third Y-axis linear module 63, a second copper disk clamping assembly 64, and a fourth retrieving module. The third retrieving module 61 includes a high-temperature test probe 611. The third Y-axis linear module 63 is fixedly mounted on the actuator of the second X-axis linear module 62. The third Y-axis linear module 63 is a dual-actuator linear module, with the two actuators respectively driving the second copper disk clamping assembly 64 and the fourth retrieving module.

[0076] The fourth retrieving module has the same structure as the first retrieving module 222 and is used to place the chips that have passed the high temperature test on the copper tray 92 into the second chip sorting and selecting mechanism 71 to achieve chip sorting and packaging.

[0077] The second copper plate clamping assembly 64 has the same structure as the first copper plate clamping assembly 221 and is used to transport the copper plate 92 above the copper plate cooling and transporting mechanism 7 and place it on the second copper plate reflux conveying line 8;

[0078] The structure and operating principle of the third retrieving module 61 are essentially the same as those of the second retrieving module 231 , differing in that the third retrieving module 61 utilizes a high-temperature test probe 611 to perform spot testing on the chips on the copper tray cooling and transport mechanism 7 . Furthermore, the third retrieving module 61 can absorb the chips and perform Z-axis movement, while utilizing X-axis and Y-axis linear modules for XY-axis movement. Products that fail the high-temperature test are removed to a collection box on the side of the second rack 5 .

[0079] Working Principle: The all-in-one ambient and high-temperature tester integrates ambient Kelvin testing, high-temperature testing, and chip sorting. The copper trays carrying the chips are recycled through the first and second copper tray reflow conveyor lines 4 and 8, enabling a continuous cycle. The all-in-one ambient and high-temperature tester requires only manual placement and removal of materials from the trays. This automated and efficient testing and sorting of thyristor chips reduces labor costs and improves production efficiency.

[0080] Example 2

[0081] On the basis of the above embodiments, this embodiment further makes the following improved technical solutions: the discharge mechanism 12 includes a first linear motor module 121, a support frame 122, a material tray placement platform 123, a first slide rail 124 and a pressing plate 125. The support frame 122 is fixedly mounted on the mover of the first linear motor module 121. The support frame 122 is provided with a first slide rail 124. The material tray placement platform 123 is slidably connected to the support frame 122. One end of the material tray placement platform 123 is connected to the slider on the first slide rail 124. The material tray 9 is placed on the material tray placement platform 123. The pressing plate 125 is fixedly mounted on the output end of the pressing cylinder 1251. The pressing plate 125 extends above the material tray 9.

[0082] Thyristor chips are placed in tray 9 for loading. Tray 9 is manually placed on tray placement platform 123. Tray placement platform 123 uses first linear motor module 121 and first slide rail 124 to move tray 9 in the X and Y directions, aligning each chip position with the reference position. This allows chip transport mechanism 15 to absorb and transport the chips to rotary sorting platform 11. A photoelectric sensor can be provided on tray placement platform 123 to detect whether tray 9 is out of material.

[0083] The pressing sheet 125 is in an "L" shape. On the one hand, the pressing sheet 125 frames the reference position. On the other hand, when the chip is sucked, the pressing sheet 125 is driven downward by the pressing cylinder 1251 to press the adjacent chips to prevent the entire tray from being sucked away. The pressing sheet 125 is a plastic sheet with elastic deformation ability and elastic pressing ability.

[0084] Example 3

[0085] Based on the above embodiment, this embodiment further makes the following improved technical solutions: the chip transport mechanism 15 includes a first X-axis module 151, a first Z-axis cylinder 152 and a first suction cup 153, the first Z-axis cylinder 152 is fixedly mounted on the slider of the first X-axis module 151, and the first suction cup 153 is fixedly mounted on the output end of the first Z-axis cylinder 152.

[0086] The chip transport mechanism 15 absorbs the reference position chip through the first suction cup 153 and places the chip on the work station of the rotating classification platform 11 through the upward movement of the first Z-axis cylinder 152 and the horizontal movement of the first X-axis module 151.

[0087] The chips on the rotary sorting platform (station 11) are rotated to the room-temperature Kelvin tester (station 13) for room-temperature testing. The room-temperature and voltage drop (VTM / VFM) tests are performed using the Kelvin tester, which uses three probes on the top and two on the bottom. The two lower probes contact the small copper block supporting the chip, while the three upper probes contain the G terminal.

[0088] After the sucked chip products are subjected to room temperature Kelvin test, the tested products are classified, and the 1600V products tested enter the next station, and the separated 1800V and NG products are picked out. The 1800V products are placed in the first tray 91 for retesting, and the NG products are placed in the defective box.

[0089] Example 4

[0090] This embodiment further improves upon the above embodiment by providing the following technical solutions: a locking block 18 is provided on the first frame 1, and a plug-in block corresponding in position to the locking block 18 is provided on the second frame 5. The combination of the normal-temperature test module and the high-temperature test module achieves alignment through the plug-in connection of the locking block 18 on the first frame 1 and the plug-in block on the second frame 5, ensuring coordination between the first and second copper tray reflow conveyor lines 4, 8, and the copper tray cooling and transport mechanisms 7 and 3.

[0091] The normal temperature and high temperature test modules in the all-in-one normal temperature and high temperature test machine are effectively integrated together to improve the efficiency of thyristor chip testing and classification. At the same time, the normal temperature test module and the high temperature test module also have a certain degree of independence and can be separated for easy disassembly and maintenance.

[0092] Example 5

[0093] This embodiment further provides the following improved technical solutions based on the above embodiment: a hood 19 is provided on the first frame 1, and a rotatable cover 191 is provided on the hood 19. The copper plate heating and transporting mechanism 3 requires high-temperature heating, and the provision of the hood 19 can improve the safety of equipment operation.

[0094] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A thyristor chip normal temperature and high temperature test all-in-one machine, characterized in that: include: A room temperature testing module includes a first rack, a first gantry testing and handling mechanism, a copper tray heating and handling mechanism, and a first copper tray reflow conveyor line. The first rack is provided with a rotary sorting platform. A discharge mechanism, a room temperature Kelvin testing mechanism, a first chip sorting and picking mechanism, and the copper tray heating and handling mechanism are arranged circumferentially along the rotary sorting platform. A chip handling mechanism is provided on one side of the discharge mechanism. The high-temperature test module includes a second rack, a second gantry testing and transporting mechanism, a copper tray cooling and transporting mechanism and a second copper tray reflow conveying line. The second rack is arranged on one side of the first rack. The position of the copper tray cooling and transporting mechanism corresponds to the copper tray heating and transporting mechanism. A second chip sorting and picking mechanism is provided at the end of the copper tray cooling and transporting mechanism. The position of the second copper tray reflow conveying line corresponds to the first copper tray reflow conveying line.

2. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The copper plate heating and transporting mechanism includes a first copper plate placement channel, a first sliding support seat, a first lifting seat and a fourth linear motor module. The first copper plate placement channel is provided with four heating seats arranged along a straight line, and the four heating seats are arranged equidistantly. A heating plate arranged in an array is provided under the heating seat. The first sliding support seat is slidably connected to the fourth slide rail, and a first lifting cylinder is provided on the first sliding support seat. The first lifting seat is slidably connected to the first sliding support seat. The first lifting seat is fixedly installed on the piston rod of the first lifting cylinder. A first linkage rod is provided between two adjacent first lifting seats, and the cross support rod of the first sliding support seat is fixedly installed on the slide of the fourth linear motor module.

3. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The copper pan cooling and transporting mechanism includes a second copper pan placement flow channel, which includes a heat preservation seat and several cooling seats. A symmetrically arranged contact electrode is provided on one opposite side of the heat preservation seat, and the mounting plate of the contact electrode is fixedly installed on the output end of the driving cylinder.

4. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The material discharge mechanism includes a first linear motor module, a support frame, a material tray placement platform, a first slide rail and a pressing piece. The support frame is fixedly mounted on the mover of the first linear motor module. The support frame is provided with the first slide rail. The material tray placement platform is slidably connected to the support frame. One end of the material tray placement platform is connected to the slider on the first slide rail. The material tray is placed on the material tray placement platform. The pressing piece is fixedly mounted on the output end of the pressing cylinder. The pressing piece extends above the material tray.

5. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The chip transport mechanism includes a first X-axis module, a first Z-axis cylinder and a first suction cup. The first Z-axis cylinder is fixedly mounted on a slider of the first X-axis module, and the first suction cup is fixedly mounted on an output end of the first Z-axis cylinder.

6. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The first chip sorting and picking mechanism includes a first pallet handling robot, a pallet positioning frame and an electric cylinder. A lifting support plate is provided at the bottom of the pallet positioning frame. The pallet positioning frame is fixedly mounted on the piston rod of the electric cylinder, and the first pallet is placed on the lifting support plate.

7. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The first gantry testing and handling mechanism includes a first X-axis linear module, a first Y-axis linear module, and a second Y-axis linear module. The first X-axis linear module is a double-moving sub-linear module. The first Y-axis linear module is fixedly mounted on the first mover of the first X-axis linear module. The first Y-axis linear module is provided with a first copper disk clamping assembly and a first material-retrieving module. The first Y-axis linear module is a double-moving sub-linear module. The first copper disk clamping assembly is fixedly mounted on the third mover of the first Y-axis linear module. The first material-retrieving module is fixedly mounted on the fourth mover of the first Y-axis linear module. The second Y-axis linear module is fixedly mounted on the second mover of the first X-axis linear module. The second Y-axis linear module is provided with a second material-retrieving module.

8. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The second gantry testing and handling mechanism includes a third material picking module, a second X-axis linear module, a third Y-axis linear module, a second copper disk clamping assembly and a fourth material picking module, and the third material picking module includes a high-temperature test probe.

9. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The first frame is provided with a locking block, and the second frame is provided with a plug-in block whose position corresponds to the locking block.

10. The all-in-one machine for testing thyristor chips at room temperature and high temperature according to claim 1, characterized in that: The first frame is provided with a cover, and the cover is provided with a cover that can be rotatably opened.

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