A double head calender and calendering method

Abstract

The application provides a double-pressure-head bonding device and a bonding method, relates to the technical field of bonding, and through flexible configuration of the first pressure head unit and the second pressure head unit, the device is suitable for diversified production requirements, significantly improves productivity, and cooperates with the first product platform mechanism and the second product platform mechanism to quickly complete a multi-section bonding process; through rotation of the glass platform by the glass platform driving unit, the device cooperates with the lifting part to realize one-time completion of a multi-section bonding process; through cooperation of the test area, the first adjusting part and the second adjusting part are quickly and conveniently adjusted, and the levelness of the pressure head is improved; through connection of the oil injection port of the pressure head connecting part and the oil inlet of the sliding block, the sliding block is conveniently maintained at any time, and the pressing precision of the pressure head is maintained; through the air path layout of the first heat insulation plate, the second heat insulation plate and the third heat insulation plate, perfect high-temperature heat insulation is realized, and the service life of surrounding components is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of bonding technology, and particularly relates to a double-press-head bonding device and a bonding method. BACKGROUND

[0002] In the field of electronic manufacturing, with the development of consumer electronic products towards large size and high integration, the bonding process technology faces major upgrading challenges. In the traditional display panel manufacturing, simple hot-press bonding has evolved into a multi-level interconnection process, which needs to complete the hot-press bonding of the substrate and the COF in turn, form the second product, and then realize the secondary bonding of the second product and the first product. For large-size glass substrates, four or more segments of partitioned hot-press bonding need to be realized, and the process mode has developed from single-side bonding to complex multi-side and multi-segment bonding.

[0003] Hot-press bonding is one of the key processes of display screen module assembly. The traditional hot-press equipment usually adopts a single-press-head structure, which has low production efficiency and is difficult to adapt to the composite bonding needs of different sizes or materials. In addition, the horizontal adjustment precision of the press head of the existing equipment is insufficient, which easily leads to uneven bonding and affects the product yield. Therefore, a new generation of hot-press equipment with the capabilities of multi-press-head independent control, compatible multi-side and multi-segment glass, second product and first product coordinated bonding, high-precision leveling and high-efficiency synchronous operation is urgently needed. SUMMARY

[0004] The present application provides a double-press-head bonding device and a bonding method to solve the technical problems of low bonding efficiency, inability to compatible multi-side and multi-segment bonding process, difficulty in adjusting the horizontal degree of the press head, inconvenience in maintaining the sliding block and poor heat insulation effect in the prior art.

[0005] To solve the above problems, the technical scheme adopted by the present application is:

[0006] The application provides a double-head hot-pressing device for hot-pressing bonding between single or multiple first products and second products, comprising a support, at least two head units, a tape winding mechanism, a first product platform mechanism corresponding to the head units and a second product platform mechanism arranged on the support; the tape winding mechanism moves synchronously with the head units; the first product platform mechanism comprises a pressing table and a first product bearing area, the first product is borne on the first product bearing area and the bonding area of the first product is located on the pressing table, the first product platform mechanism moves to a hot-pressing station so that the pressing table is located directly below the head units; the second product platform mechanism bears the second product and switches it to the hot-pressing station to move the bonding area of the second product to the pressing table; the tape winding mechanism releases the buffer material which passes through the area between the lower part of the head units and the upper part of the first product and the second product; the multiple head units and the first product platform mechanism can alternatively cooperate with the second product platform mechanism to perform a bonding action, or alternatively switch, the second product platform mechanism moves the second product to the corresponding hot-pressing station to switch to perform a bonding action, or simultaneously cooperates with the second product platform mechanism to perform a bonding action.

[0007] Further, the head unit comprises a head assembly, a head driving part for driving the head assembly to move vertically, and a head connecting part for connecting the head assembly and the head driving part; the head assembly is slidably connected to the guide rail on the support through a head sliding block; the head connecting part comprises a sliding block connecting plate fixedly connected to the head sliding block, and an oil inlet is arranged on the sliding block connecting plate towards the side of the operation area of the double-head hot-pressing device, the oil inlet is fully exposed to the operation area, and the oil inlet and the oil inlet of the head sliding block are connected through an oil pipe.

[0008] Further, the head assembly comprises a head and a horizontal adjusting part for adjusting the levelness of the lower pressing surface of the head; the horizontal adjusting part comprises a first heat insulation plate, a plurality of first air paths are horizontally arranged in the first heat insulation plate, and a first gas inlet and a first gas outlet are respectively connected to the first ends and the last ends of the first air paths; a second heat insulation plate is arranged below the first heat insulation plate, and a plurality of evenly distributed cushion blocks are embedded in the second heat insulation plate; a horizontal adjusting block is fixed below the second heat insulation plate, a plurality of second air paths are horizontally arranged in the horizontal adjusting block, and a second gas inlet and a second gas outlet are arranged at the back of the horizontal adjusting block and are respectively connected to the first ends and the last ends of the second air paths.

[0009] Further, the horizontal adjusting part comprises a plurality of first adjusting members and second adjusting members, the first adjusting members and the second adjusting members simultaneously pass through the first heat insulation plate, the second heat insulation plate and the horizontal adjusting block, the first adjusting members partially penetrate into the heating block below the horizontal adjusting block, and the lower end of the second adjusting members abuts against the end face of the heating block towards the horizontal adjusting block.

[0010] Further, the heating blocks are arranged on the front section, the interruption and the rear section of the pressure head, each of which is internally provided with a plurality of heating pipes arranged side by side along the length direction of the heating block and perpendicularly to the length direction of the heating block, and the temperature of the front section, the interruption and the rear section of the pressure head is independently controllable.

[0011] Further, the second product platform mechanism comprises a glass platform and a glass platform driving unit for driving the glass platform to move in the horizontal, vertical, longitudinal and rotational directions; the glass platform is divided into a glass support area, a plurality of first product support assemblies and a plurality of second product support assemblies, each first product support assembly comprises a main support assembly and an auxiliary support assembly, the main support assembly is connected with the second product support assembly, and the glass support area, the first product support assembly and the second product support assembly are provided with a plurality of suction parts; the auxiliary support assemblies are symmetrically arranged on both sides of the glass support area.

[0012] Further, the main support assembly comprises a longitudinal adjusting sliding block and a bracket, the second product support assembly comprises a second product support block fixedly arranged on the bracket, and the auxiliary support assembly comprises a support plate connected to the glass platform through a horizontal adjusting sliding block.

[0013] Further, the first product platform mechanism comprises a first product platform support plate, a first product platform driving unit is arranged below the first product platform support plate, a test area is arranged on the first product platform support plate, and the test area is located in front of the pressing table; the test area comprises a fixed column fixedly arranged on the first product platform support plate, and the fixed column is fixed with the pressure sensing platform; a lifting part is arranged behind the pressing table; the lifting part comprises a lifting sliding block and a lifting rod fixedly arranged on the lifting sliding block.

[0014] Further, the upper surface of the pressure sensing platform is at the same horizontal level as the upper surface of the pressing table and the upper surface of the glass platform.

[0015] The pressing method based on the double-pressure-head pressing device comprises the following steps:

[0016] S1, adjusting the levelness of the pressure head;

[0017] S2, pressing correction: moving the first product platform mechanism and the second product platform mechanism to the hot pressing station; aligning and correcting the first product on the pressing table of the first product platform mechanism with the second product on the glass platform of the first product platform mechanism;

[0018] S3, product alignment: moving the second product platform mechanism to the pressing table so that the hot pressing areas of the first product and the second product are both located on the pressing table;

[0019] S4, pressing: moving the tape winding mechanism downward to the pressing table, pressing the pressure head downward to the pressing table, keeping the pressure head pressed for a set time, then lifting the pressure head, and moving the tape winding mechanism upward.

[0020] S5, after the press, the longitudinal adjustment slider drives the bracket to stretch out to the direction of the pressing table, supporting the first product; the lifting rod of the first product platform mechanism drives the lifting slider to lift the first product on the pressing table upward, at the same time, the glass platform driving unit drives the longitudinal adjustment slider and the adjustment mounting plate to move upward synchronously by the same height;

[0021] S6, after the transfer, the lifting rod drives the lifting slider to move downward, and the adjustment mounting plate supports the first product; the second product platform mechanism is moved out of the hot pressing station, and the first product and the second product are bonded to obtain the first finished product synchronously;

[0022] S7, the bonded first finished product is transferred from the second product platform mechanism to the next process, and the longitudinal adjustment slider drives the adjustment mounting plate to reset.

[0023] Further, the step S6 further comprises the following step: S6A, the first product platform mechanism drives the first finished product to switch to the next pressing head unit, and after the first product platform mechanism corresponding to the hot pressing station, the steps S2-S6 are executed.

[0024] Further, in the step S6A, the second product platform mechanism drives the glass platform to rotate by a set angle, so that the to-be-bonded edge of the second product is opposite to the pressing table.

[0025] Further, the step S6A is repeated at least once.

[0026] Compared with the prior art, the present application has the following beneficial effects:

[0027] The present application provides a double-pressing-head pressing device and a pressing method, which can adapt to diversified production demands, significantly improve production capacity, and quickly complete multi-segment bonding process through the flexible configuration of the first pressing head unit and the second pressing head unit in cooperation with the first product platform mechanism and the second product platform mechanism; the glass platform is rotated by the glass platform driving unit, and the lifting part is cooperated to complete the multi-edge bonding process at one time; the first adjusting part and the second adjusting part are adjusted quickly and conveniently through the cooperation of the test area, so as to improve the levelness of the pressing head; the oil inlet of the pressing head connecting part is connected with the oil inlet of the slider, so that the slider can be maintained at any time, and the pressing precision of the pressing head is maintained; the gas path layout of the first heat insulation plate, the second heat insulation plate and the third heat insulation plate are perfectly heat-insulated at high temperature, so as to prolong the service life of the surrounding parts. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the present application, the following will be described in detail in combination with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the present application, and those skilled in the art can make changes to the drawings under the concept of the present application.

[0029] Figure 1 An assembly perspective view of an embodiment of the double-head pressing device provided by the present application;

[0030] Figure 2 An assembly perspective view of an embodiment of the first head unit provided by the present application;

[0031] Figure 3 A rear view of an embodiment of the first head unit provided by the present application;

[0032] Figure 4 An assembly perspective view of an embodiment of the first product platform mechanism provided by the present application;

[0033] Figure 5 An assembly perspective view of an embodiment of the first product platform mechanism provided by the present application.

[0034] 1, first head unit; 11, head driving part; 111, head sliding block; 112, oil inlet; 12, sliding block connecting plate; 121, oil injection port; 13, first heat insulation plate; 131, first air inlet; 132, first air outlet; 14, second heat insulation plate; 15, horizontal adjusting block; 151, second air inlet; 152, second air outlet; 153, first adjusting member; 154, second adjusting member; 16, heating block; 161, heating pipe; 17, third heat insulation plate; 18, head; 2, second head unit; 3, second product platform mechanism; 31, glass platform; 311, glass support area; 312, adsorption part; 313, first support assembly; 3131, adjusting mounting plate; 3132, adjusting hole; 3133, adjusting mounting block; 3134, longitudinal adjusting sliding block; 314, second support assembly; 3141, first product support assembly; 315, second product support assembly; 32, glass platform driving unit; 4, first product platform mechanism; 41, first product platform support plate; 42, pressing table; 43, lifting rod; 44, lifting sliding block; 45, fixed column; 46, pressure sensing platform; 47, first product platform driving unit; 5, tape winding mechanism; 6, bracket. DETAILED DESCRIPTION

[0035] Embodiment 1

[0036] For details Figures 1-5As shown, the present application discloses a double-press head bonding device for hot bonding between single or multiple first products and second products, comprising a support 6, a press head unit is arranged on the support 6, the press head unit comprises a first press head unit 1 and a second press head unit 2 arranged adjacent to each other, a tape winding mechanism 5 arranged below the first press head unit 1 and the second press head unit 2, the tape winding mechanism 5 is in one-to-one correspondence with the first press head unit 1 and the second press head unit 2 and moves synchronously, a movable second product platform mechanism 3 is arranged below the tape winding mechanism 5, two groups of movable first product platform mechanisms 4 are arranged side by side at the rear of the second product platform mechanism 3, and the first press head unit 1 and the second press head unit 2 can synchronously or independently perform a pressing action. It should be noted that in the present embodiment, in order to facilitate description and understanding, PCB is collectively referred to as the first product, of course, it is not limited to PCB, but also can be other parts that need to be bonded, in the case of the first product being PCB, the PCB here is not limited to the same type, the same specification, can be a single type of PCB, or multiple types of PCBs with different specifications and sizes; the second product in the present embodiment can be understood as a simple COF, or other products such as a glass panel bonded with a COF, here the second product is defined as a glass panel bonded with a COF.

[0037] When the glass panel is bonded with the COF by the upstream device, when the PCB to be bonded on the second product is only one segment, only the first pressing head unit 1 or the second pressing head unit 2 and one of the two sets of first product platform mechanisms 4 are started to complete the processing by one-time pressing and bonding; when the first product to be bonded on the second product is two segments, the first pressing head unit 1 and the second pressing head unit 2 are started, and the two sets of first product platform mechanisms 4 are all opened, and the first pressing head unit 1 and the second pressing head unit 2 can also be controlled to press and bond alternately and separately to complete the processing; when the PCB to be bonded on the second product is three segments, the first pressing head unit 1 and the second pressing head unit 2 are started, and the two sets of first product platform mechanisms 4 are all opened, wherein the first pressing head unit 1 or the second pressing head unit 2 needs to press twice; when the PCB to be bonded on the second product is four segments, the first pressing head unit 1 and the second pressing head unit 2 are started, and the two sets of first product platform mechanisms 4 are all opened, and the first pressing head unit 1 and the second pressing head unit 2 both need to press twice. Of course, it needs to be explained that the above-mentioned PCB to be bonded on the second product is one segment, two segments, three segments or four segments, which can be multiple bonding positions on one side of the second product or multiple bonding positions on multiple sides of the second product. Of course, in the bonding process of the above-mentioned situation, the first product platform mechanism 4 needs to be coordinated to switch positions or make corresponding adjustment actions on the glass platform 31 to ensure that the COF position to be bonded can be accurately positioned. And then the two sets of first product platform mechanisms 4 only need to match the PCB to be bonded on the corresponding position of the second product to determine which first product platform mechanism 4 participates in the bonding. Since the two sets of first product platform mechanisms 4 correspond to the first pressing head unit 1 and the second pressing head unit 2 one by one, the specific action is determined by this, that is, the first pressing head unit 1 and the second pressing head unit 2 act simultaneously (the bonding position exactly satisfies the simultaneous bonding of the first pressing head unit 1 and the second pressing head unit 2), or the first pressing head unit 1 and the second pressing head unit 2 act alternately (the bonding position can only satisfy the single bonding of the first pressing head unit 1 or the second pressing head unit 2, at which time the first product platform mechanism 4 needs to move positions to switch the hot pressing station of the first pressing head unit 1 or the second pressing head unit 2), or one of the pressing head units continuously acts (the multiple bonding points on the second product use the same PCB, so that the corresponding first product platform mechanism 4 and the pressing head unit continuously load the PCB, cooperate with the switching of the bonding position by the first product platform mechanism 4, and then the pressing head unit continuously bonds without switching).

[0038] The first pressing head unit 1 comprises a pressing head, a pressing head driving part 11 driving the pressing head to move vertically, a level adjusting part adjusting the levelness of the lower pressing surface of the pressing head, and a pressing head connecting part connecting the level adjusting part and the pressing head driving part 11; the pressing head driving part 11 comprises a pressing head sliding block 111, the pressing head connecting part comprises a sliding block connecting plate 12, the sliding block connecting plate 12 is fixed on the pressing head sliding block 111, an oil injection port 121 is arranged on the sliding block connecting plate 12, an oil inlet 112 is arranged on the pressing head sliding block 111, and the oil injection port 121 and the oil inlet 112 are connected through an oil pipe. The oil injection port 121 in this embodiment can be an oil injection nozzle in the prior art, which is fixedly installed on the sliding block connecting plate 12 with the oil nozzle facing outward, and the oil outlet can be communicated with the oil inlet 112 through an oil pipe in the form of a conversion seat. During the operation of the equipment, the pressing head often needs to be pressed at a high frequency, so the pressing head sliding block 111 will inevitably move up and down on the guide rail, and if the lubrication is poor, the pressing head sliding block 111 will inevitably be accelerated to wear. Therefore, the routine maintenance of the pressing head sliding block 111 is very important, and in the prior art, the maintenance operation is complex, the equipment needs to be completely stopped, and the operator can only lubricate and maintain the operation at the back of the equipment. The whole production line is often linked, so the maintenance of the local pressing head sliding block 111 will cause the whole production line to stop, and it will become more complicated to start again after the maintenance is completed. Therefore, in this embodiment, the oil injection port 121 is arranged on the sliding block connecting plate 12, that is, the oil injection port 121 is front-mounted, and the oil inlet 112 of the pressing head sliding block 111 is connected through an oil pipe. The operator only needs to easily and conveniently connect the oil gun to the oil injection port 121 in front of the equipment, then inject high-temperature lubricating grease, observe the oil overflow amount of the oil inlet 112, and ensure that the grease covers the surface of the pressing head sliding block 111, thereby solving the problem of low maintenance efficiency caused by the structure.

[0039] When bonding, the pressing head 18 needs to reach a set high temperature, and the high temperature can easily affect the surrounding core components. Therefore, four-stage heat insulation is performed in this application.

[0040] First step: the level adjusting part comprises a first heat insulation plate 13, a plurality of first air channels are horizontally arranged in the first heat insulation plate 13, the first air channels are respectively connected with a first air inlet 131 and a first air outlet 132, by arranging the first air channels in the first heat insulation plate 13, air is introduced from the first air inlet 131 and discharged from the first air outlet 132, the heat of the first heat insulation plate 13 is taken away by the flowing air, and at the same time, the hot air is prevented from flowing back, thereby effectively reducing the temperature of the first heat insulation plate 13 and solving the problem of levelness deviation of the pressing head 18 caused by indirect thermal expansion. Of course, an extension pipe can be connected to the first air outlet 132, and the airflow blown out of the first air outlet 132 is guided to a position away from the level adjusting part, thereby further avoiding the problem of thermal expansion of the level adjusting part caused by the hot air directly discharged near the first heat insulation plate 13, thereby causing the temperature of the surrounding air to rise.

[0041] The second step is that the second heat insulation plate 14 is arranged below the first heat insulation plate 13, the second heat insulation plate 14 is embedded with uniformly distributed cushion blocks, the second heat insulation plate 14 is made of ceramic material, the cushion blocks are made of stainless steel material, the second heat insulation plate 14 made of ceramic material has good heat insulation effect, good hardness and good thermal stability, but has high brittleness, if the second heat insulation plate 14 directly bears the impact under the high-frequency pressing action, the second heat insulation plate 14 is easy to be broken, thereby affecting the structural stability, therefore, the cushion blocks are embedded on the second heat insulation plate 14 to buffer the impact on the second heat insulation plate 14, thereby avoiding the above problems.

[0042] The third step is that the horizontal adjusting block 15 is fixed below the second heat insulation plate 14, a plurality of second air channels are transversely arranged in the horizontal adjusting block 15, the second air inlet 151 and the second air outlet 152 are arranged at the rear of the horizontal adjusting block 15 and are connected with the first end and the last end of the second air channel respectively, the second air channel is arranged in the horizontal adjusting block 15 to form the air inlet from the second air inlet 151, the gas is blown out from the second air outlet 152 after absorbing heat through the second air channel, thereby reducing the temperature of the horizontal adjusting block 15. Preferably, each second air channel is arranged in parallel along the length direction of the horizontal adjusting block 15, then the two end faces of the length direction of the second adjusting block are penetrated, the two end openings of the second air channel are blocked by blocking, the second air inlet 151 and the second air outlet 152 are arranged vertically to the second air channel and are aligned and extended, so that the second air inlet 151 and the second air outlet 152 are respectively communicated with the second air channel near the first end and the last end of the second air channel, thereby forming a plurality of air channels in the transverse and longitudinal directions, thereby effectively taking away the heat on the horizontal adjusting block 15 and making the temperature on the horizontal adjusting block 15 more uniform and consistent.

[0043] The fourth step is that the third heat insulation plate 17 is connected around the heating block 16, the temperature of the heating block 16 is the highest, the third heat insulation plate 17 is arranged to block the heat of the heating pipe 161, thereby preventing the temperature of the heating block 16 from being dissipated to the surrounding, heating the air near the unit, thereby causing the temperature of the horizontal adjusting part to rise, thereby causing the components of the horizontal adjusting part to be expanded due to the temperature rise, thereby indirectly causing the horizontal degree of the pressure head 18 to deviate.

[0044] The traditional heating mode is to laterally embed a heating tube 161 on the heating block 16, but for a pressure head 18 with a relatively long length, the temperature of the lower pressing surface of the pressure head 18 is uneven, which directly affects the bonding accuracy, and the temperature control of different zones cannot be realized, and the temperature adjustment is difficult. In order to facilitate the adjustment of the horizontal of the pressure head 18, the horizontal adjustment part preferably comprises a plurality of first adjusting members 153 and second adjusting members 154, which simultaneously pass through the first heat insulation plate 13, the second heat insulation plate 14 and the horizontal adjustment block 15, wherein the first adjusting member 153 partially penetrates into the heating block 16 located below the horizontal adjustment block 15, and the lower end of the second adjusting member 154 abuts against the end face of the heating block 16 towards the horizontal adjustment block 15. It is further preferred that the heating block 16 internally has a plurality of heating tubes 161 arranged side by side in the longitudinal direction, which divides the heating block 16 into a plurality of temperature zones, and each temperature zone is independently controllable, such as: front temperature, middle temperature and rear temperature of the heating block 16; thereby facilitating real-time monitoring of the temperature of different regions of the pressure head 18. Of course, while monitoring the temperature of the above-mentioned regions, because the heating tubes 161 are controlled in multiple regions, if it is found that the temperature of a certain region is relatively low, the temperature of the corresponding region of the heating tube 161 can be adjusted to maintain balance.

[0045] The first product platform mechanism 4 comprises a glass platform 31 and a glass platform driving unit 32 for driving the glass platform 31 to move laterally, longitudinally, vertically and rotationally; the glass platform 31 is divided into a glass support area 311, a plurality of first product support assemblies 3141 and a second product support assembly 315, wherein each first product support assembly 3141 comprises a first support assembly 313 and a second support assembly 314, the glass support area 311 is connected with the first support assembly 313 and the second support assembly 314, the first support assembly 313 is connected with the second product support assembly 315, and the glass support area 311, the first support assembly 313, the second support assembly 314 and the second product support assembly 315 are all distributed with a plurality of adsorption parts 312. Preferably, the first product support assembly 3141 is two or more, which are distributed on one side or multiple sides of the glass support area 311; as shown, the second support assembly 314 is symmetrically arranged on both sides of the glass support area 311. A semi-finished product is placed on the glass platform 31, which has been bonded with a COF and a glass substrate by an upstream device.

[0046] The first support assembly 313 comprises a longitudinal adjustment slider 3134 and a bracket; the bracket comprises an adjustment mounting plate 3131 and an adjustment mounting block 3133 fixedly mounted on the adjustment mounting plate 3131. A plurality of adjustment holes 3132 are arranged on the adjustment mounting plate 3131, the adjustment mounting block 3133 is fixed on the adjustment hole 3132, the longitudinal adjustment slider 3134 is connected below the adjustment mounting plate 3131, the position of the adjustment mounting block 3133 is adjusted by changing the adjustment hole 3132 in which the adjustment mounting block 3133 is mounted on the adjustment mounting plate 3131; and the longitudinal position of the adjustment mounting plate 3131 can be adjusted by sliding the longitudinal adjustment slider 3134, so as to expand the support range and adaptation range of the first support assembly 313. The second product support assembly 315 comprises a COF support block, the other end of the adjustment mounting block 3133 is fixed on the COF support block, in the use process, the COF is supported by the COF support block, so that the COF maintains sufficient position and extends outward; the second support assembly 314 comprises a first product support assembly 3141, the first product support assembly 3141 is connected with a transverse adjustment slider, so as to adjust the transverse support point of the PCB, so as to achieve the best support position and support stability.

[0047] The first product platform mechanism 4 comprises a first product platform support plate 41, a first product platform driving unit 47 is arranged below the first product platform support plate 41, a test area is arranged on the first product platform support plate 41, the test area comprises a fixed column 45 fixedly arranged on the first product platform support plate 41, and a pressure sensing platform 46 is detachably fixed on the fixed column 45. A pressing table 42 is arranged behind the test area, and a lifting part is arranged behind the pressing table 42; the lifting part comprises a lifting slider 44 and a lifting rod 43 fixedly arranged on the lifting slider 44, the lifting slider 44 is driven to realize lifting action by a power source such as a cylinder, and the lifting part is located on a side of the pressing table 42 away from the first product platform mechanism 4; in the initial state, the upper end surface of the lifting rod 43 is lower than the upper end surface of the pressing table 42, the lifting rod 43 is driven by the lifting slider 44 to move upward, so that the upper end surface of the lifting rod 43 is higher than the upper end surface of the pressing table 42, thereby lifting the first product on the pressing table 42 upward and separating the first product from the pressing table 42, which is beneficial to the smooth transfer of the first product in the later stage.

[0048] Embodiment 2

[0049] A calendering method based on a double-calendering device is disclosed in the embodiment, comprising the following steps:

[0050] S1, adjust the levelness of the pressure head 18: place the pressure paper on the pressure platform 46, and adjust the tightness of the first adjusting member 153 and the downward pressing force of the second adjusting member 154 according to the depth of the impression; specifically, regarding step S1: each time the product batch is replaced or the current pressing precision is different, the step S1 is adjusted; in the embodiment, the pressure platform 46 is preferably designed as a quick release. When adjusting, first place the pressure paper on the pressure platform 46; it should be noted that before the test starts, the following preparations need to be made, including installing the pressure platform 46 on the fixed column 45, and keeping the upper surface of the pressure platform 46 at the same level as the upper surface of the pressing table 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the height of the upper surface of the fixed column 45 and the height of the pressure platform 46, the pressure platform 46 can be installed on the fixed column 45, and then the upper surface of the pressure platform 46 can be kept at the same level as the upper surface of the pressing table 42 and the upper surface of the adsorption part 312 of the glass platform 31); then place the pressure paper on the upper end surface of the pressure platform 46; then, the pressure head 18 is pressed down, and the pressure paper is tightly pressed between the pressure head 18 and the pressure platform 46; if the left side of the pressure paper after being pressed down is lighter in color and the right side is darker in color, it means that the left side of the pressure head 18 is lower than the right side; by loosening the first adjusting member 153 or by pressing the heating block 16 with the second adjusting member 154, or by adjusting the first adjusting member 153 and the second adjusting member 154 in coordination, the pressure head 18 is adjusted until the impression color of the pressure paper is uniform and the pressing surface of the pressure head 18 is consistent with the impression of the pressure paper.

[0051] S2, pressing correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 is aligned and corrected with the second product on the glass platform 31 of the second product platform mechanism 3; specifically, regarding step S2: a plurality of image systems can be used to correct the alignment of the mark points of the COF and the PCB; if a camera is used to collect the images of the COF and the PCB, the mark points are captured, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to make position compensation, so as to correct the alignment of the COF and the PCB.

[0052] S3, product alignment; the second product platform mechanism 3 moves towards the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0053] S4, the pressing: the tape winding mechanism 5 moves downward to the pressing table 42, the pressing head 18 presses downward to the pressing table 42, and keeps for a set time, then rises, and the tape winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released by the tape winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB at high temperature, thereby preventing the PCB from being scalded, and the buffer material of the tape winding mechanism 5 can protect the PCB, and the pressing head 18 and the tape winding mechanism 5 move up and down at the same frequency, which can prevent interference with other mechanisms while protecting the PCB.

[0054] S5, after the pressing, the transfer: the longitudinal adjusting slide block 3134 drives the bracket to extend to the direction of the pressing table 42, and supports the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slide block 44 to lift the first product on the pressing table 42 upward, at the same time, the second product platform mechanism 3 drives the longitudinal adjusting slide block 3134 and the adjusting mounting plate 3131 to move upward synchronously by the same height; specifically, the adjusting mounting plate 3131 drives the adjusting mounting block 3133 to extend to the direction of the pressing table 42 through the longitudinal adjusting slide block 3134, at the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing table 42 upward through the lifting slide block 44, and the adjusting mounting plate 3131 is reset through the longitudinal adjusting slide block 3134; specifically, regarding step S5: after the bonding of the single-sided PCB and the COF is completed, the part of the PCB on the pressing table 42 needs to be transferred to the glass platform 31, so as to facilitate the next step or the unloading, and when the glass platform 31 transfers the finished product, all the suction cups of the suction part 312 are opened to prevent the finished product from falling.

[0055] S6, after the transfer, the moving out: the lifting rod 43 drives the lifting slide block 44 to move downward, and the adjusting mounting plate 3131 supports the first product; the second product platform mechanism 3 moves out of the hot pressing station, and the first finished product obtained after the bonding of the first product and the second product is moved out synchronously.

[0056] S7, the bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjusting slide block 3134 drives the adjusting mounting plate 3131 to reset.

[0057] Embodiment 3

[0058] When the single-sided PCB of the second product needs to be bonded for more than two sections, the pressing method based on the double-pressing-head pressing device in the embodiment includes the following steps:

[0059] S1, adjust the levelness of the pressure head 18: place the pressure paper on the pressure platform 46, and adjust the tightness of the first adjusting member 153 and the downward pressing force of the second adjusting member 154 according to the depth of the impression; specifically, about step S1: when the product batch is replaced or the impression precision is different after high-frequency impression, the adjustment is performed through step S1; in the present embodiment, the pressure platform 46 is preferably designed as a quick-release design. When adjusting, first place the pressure paper on the pressure platform 46; it should be noted that before starting the test, the following preparations need to be made, including installing the pressure platform 46 on the fixed column 45, and keeping the upper surface of the pressure platform 46 at the same level height as the upper surface of the pressing table 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the height of the upper surface of the fixed column 45 and the height of the pressure platform 46, after the pressure platform 46 is installed on the fixed column 45, the upper surface of the pressure platform 46 can be kept at the same level height as the upper surface of the pressing table 42 and the upper surface of the glass platform 31); then place the pressure paper on the upper end surface of the pressure platform 46; then, the pressure head 18 is pressed down, and the pressure paper is tightly pressed between the pressure head 18 and the pressure platform 46; if the left side of the pressure paper after being pressed down is lighter in color and the right side is darker in color, it indicates that the left side of the pressure head 18 is lower than the right side; by loosening the first adjusting member 153 or by pressing the heating block 16 with the second adjusting member 154, or by adjusting the first adjusting member 153 and the second adjusting member 154 in coordination, the impression color of the pressure paper is adjusted to be uniform, and the pressing surface of the pressure head 18 is consistent with the impression of the pressure paper.

[0060] S2, impression correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 is aligned and corrected with the second product on the glass platform 31 of the first product platform mechanism 4; specifically, about step S2: the mark points of the COF and the PCB can be aligned and corrected by a plurality of image systems; if a camera is used to collect the images of the COF and the PCB, the mark points are captured, so that the compensation displacement parameters of the second product platform mechanism 3 and the first product platform mechanism 4 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the first product platform mechanism 4 are controlled to make position compensation, so as to align and correct the COF and the PCB.

[0061] S3, product alignment; the first product platform mechanism 4 moves towards the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0062] S4, the pressing: the tape winding mechanism 5 moves downward to the pressing table 42, the pressing head 18 presses downward to the pressing table 42, and then rises after keeping for a set time, and the tape winding mechanism 5 moves upward; specifically, during the hot pressing process, the buffer material released by the tape winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB when pressing at high temperature, thereby preventing the PCB from being scalded, and the buffer material of the tape winding mechanism 5 can protect the PCB and move up and down synchronously with the pressing head 18, thereby preventing interference with other mechanisms while protecting the PCB.

[0063] S5, after the pressing, the transfer: the longitudinal adjusting slide block 3134 drives the bracket to extend to the direction of the pressing table 42 to support the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slide block 44 to lift the first product on the pressing table 42 upward, at the same time, the second product platform mechanism 3 drives the longitudinal adjusting slide block 3134 and the adjusting mounting plate 3131 to move upward synchronously by the same height; specifically, the adjusting mounting plate 3131 drives the adjusting mounting block 3133 to extend to the direction of the pressing table 42 through the longitudinal adjusting slide block 3134, at the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing table 42 upward through the lifting slide block 44, and the adjusting mounting plate 3131 is reset through the longitudinal adjusting slide block 3134; specifically, regarding step S5: after the bonding of the single-side PCB and the COF is completed, the part of the PCB on the pressing table 42 needs to be transferred to the glass platform 31, so as to facilitate the next step or the unloading, and when the glass platform 31 transfers the finished product, all the suction cups of the suction part 312 are opened to prevent the finished product from falling.

[0064] S6, after the transfer, the moving out: the lifting rod 43 drives the lifting slide block 44 to move downward, and the adjusting mounting plate 3131 supports the first product; the second product platform mechanism 3 moves out of the hot pressing station, and the first product and the second product bonded as a whole are synchronously moved out to obtain the first finished product.

[0065] S7, after the second product platform mechanism 3 drives the first finished product to switch to the next pressing head unit and the corresponding hot pressing station of the first product platform mechanism 4, the steps S2-S6 are repeatedly executed at least once. It should be noted that the number of times of repeating the steps S2-S6 is determined according to the number of PCBs of the same specification that need to be bonded on the second product.

[0066] S8, the bonded finished product is transferred from the second product platform mechanism 3 to the subsequent process, and the longitudinal adjusting slide block 3134 drives the adjusting mounting plate 3131 to reset.

[0067] Embodiment 4

[0068] For the second product, when the PCBs that need to be bonded are located on at least two edges of the second product, the pressing method based on the double-pressing-head pressing device disclosed in the embodiment includes the following steps:

[0069] S1, adjust the levelness of the pressure head 18: place the pressure paper on the pressure platform 46, and adjust the tightness of the first adjusting member 153 and the downward pressing force of the second adjusting member 154 according to the depth of the impression; specifically, regarding step S1: each time the product batch is replaced or the current pressing precision is different after high-frequency pressing, the adjustment is performed through step S1; in the present embodiment, the pressure platform 46 is preferably designed as a quick-release design. When adjusting, first place the pressure paper on the pressure platform 46; it should be noted that before starting the test, the following preparations need to be made, including installing the pressure platform 46 on the fixed column 45, and keeping the upper surface of the pressure platform 46 at the same level as the upper surface of the pressing table 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the height of the upper surface of the fixed column 45 and the height of the pressure platform 46, the pressure platform 46 can be installed on the fixed column 45, and then the upper surface of the pressure platform 46 can be kept at the same level as the upper surface of the pressing table 42 and the upper surface of the glass platform 31); then place the pressure paper on the upper end surface of the pressure platform 46; then, the pressure head 18 is pressed down, and the pressure paper is tightly pressed between the pressure head 18 and the pressure platform 46; if the left side of the pressure paper after being pressed down is lighter in color and the right side is darker in color, it indicates that the left side of the pressure head 18 is lower than the right side; by loosening the first adjusting member 153 or by pressing the heating block 16 with the second adjusting member 154, or by adjusting the first adjusting member 153 and the second adjusting member 154 in coordination, the pressure head 18 is adjusted until the impression color of the pressure paper is uniform and the pressing surface of the pressure head 18 is consistent with the impression of the pressure paper.

[0070] S2, pressing correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 is aligned and corrected with the second product on the glass platform 31 of the second product platform mechanism 3; specifically, regarding step S2: the mark points of the COF and the PCB can be aligned and corrected by a plurality of image systems; if a camera is used to collect the images of the COF and the PCB, the mark points are captured, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to make position compensation, so as to align and correct the COF and the PCB.

[0071] S3, product alignment; the second product platform mechanism 3 moves towards the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0072] S4, the pressing: the tape winding mechanism 5 moves down to the pressing table 42, the pressing head 18 presses down to the pressing table 42, and keeps for a set time, then rises, and the tape winding mechanism 5 moves up; specifically, during the hot pressing process, the buffer material released by the tape winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB when pressing at high temperature, thereby preventing the PCB from being scalded, and the buffer material of the tape winding mechanism 5 is protected, and the pressing head 18 and other mechanisms move up and down at the same frequency, which can prevent interference with other mechanisms while protecting the PCB.

[0073] S5, after pressing, the longitudinal adjusting slide block 3134 drives the bracket to extend to the pressing table 42, supporting the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slide block 44 to lift the first product on the pressing table 42, at the same time, the second product platform mechanism 3 drives the longitudinal adjusting slide block 3134 and the adjusting mounting plate 3131 to move upward synchronously by the same height; specifically, the adjusting mounting plate 3131 drives the adjusting mounting block 3133 to extend to the direction of the pressing table 42 through the longitudinal adjusting slide block 3134, at the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing table 42 upward through the lifting slide block 44, and the adjusting mounting plate 3131 is reset through the longitudinal adjusting slide block 3134; specifically, regarding step S5: after the bonding of the single-sided PCB and COF is completed, the part of the PCB on the pressing table 42 needs to be transferred to the glass platform 31, so as to facilitate the next step or unloading, when the glass platform 31 transfers the finished product, the suction cups of the suction part 312 are all opened to prevent the finished product from falling.

[0074] S6, after the transfer, move out; the lifting rod 43 drives the lifting slide block 44 to move down, and the adjusting mounting plate 3131 supports the first product; the second product platform mechanism 3 moves out of the hot pressing station, and the first finished product obtained after the first product and the second product are bonded is synchronously moved out.

[0075] S7, the second product platform mechanism 3 drives the first finished product to switch to the next pressing head unit and the corresponding hot pressing station of the first product platform mechanism 4.

[0076] S8, the glass platform driving unit 32 drives the glass platform 31 to rotate by a set angle, so that the next to be bonded side of the second product is opposite to the pressing table 42 of the first product platform mechanism 4 where the PCB to be bonded is located; then step S2-S6 is repeated once.

[0077] S9, the bonded finished product is transferred from the second product platform mechanism 3 to the next process, and the longitudinal adjusting slide block 3134 drives the adjusting mounting plate 3131 to reset.

[0078] Example 5

[0079] For the second product, when the bonded PCB needs to be located on at least two edges of the second product, and at least two bonded PCBs are needed on each edge, the pressing method based on the double-head pressing equipment in the embodiment comprises the following steps:

[0080] S1, adjusting the levelness of the pressing head 18: placing the pressure-sensitive paper on the pressure-sensitive platform 46, and adjusting the tightness of the first adjusting member 153 and the downward pressing force of the second adjusting member 154 according to the depth of the impression; specifically, regarding step S1: each time the product batch is replaced or the pressing precision is different after high-frequency pressing, step S1 is performed for adjustment; in the embodiment, the pressure-sensitive platform 46 is preferably designed as a quick-release design. When adjusting, the pressure-sensitive paper is first placed on the pressure-sensitive platform 46; it should be noted that before the test starts, the following preparations need to be made, including installing the pressure-sensitive platform 46 on the fixed column 45, and keeping the upper surface of the pressure-sensitive platform 46 at the same level as the upper surface of the pressing table 42 and the upper surface of the glass platform 31 (here, by reasonably setting and selecting the height of the upper surface of the fixed column 45 and the height of the pressure-sensitive platform 46, the pressure-sensitive platform 46 can be installed on the fixed column 45, and the upper surface of the pressure-sensitive platform 46 can be kept at the same level as the upper surface of the pressing table 42 and the upper surface of the glass platform 31 after that); then, the pressing head 18 is pressed down, and the pressure-sensitive paper is pressed tightly between the pressing head 18 and the pressure-sensitive platform 46; if the left side of the pressure-sensitive paper after being pressed down is lighter in color and the right side is darker in color, it indicates that the left side of the pressing head 18 is lower than the right side; by loosening the first adjusting member 153 or by pressing the heating block 16 with the second adjusting member 154, or by adjusting the first adjusting member 153 and the second adjusting member 154 in coordination, the pressing head 18 is adjusted until the impression color of the pressure-sensitive paper is uniform and the lower pressing surface of the pressing head 18 is consistent with the impression of the pressure-sensitive paper.

[0081] S2, pressing correction; the first product platform mechanism 4 and the second product platform mechanism 3 are moved to the hot pressing station; the first product on the pressing table 42 of the first product platform mechanism 4 is aligned and corrected with the second product on the glass platform 31 of the second product platform mechanism 3; specifically, regarding step S2: a plurality of image systems can be used to align and correct the mark points of the COF and the PCB; if a camera is used to collect the images of the COF and the PCB, the mark points are captured, so that the compensation displacement parameters of the first product platform mechanism 4 and the second product platform mechanism 3 are analyzed and processed by the processor, and then the first product platform mechanism 4 and the second product platform mechanism 3 are controlled to make position compensation, so as to align and correct the COF and the PCB.

[0082] S3, product alignment; the second product platform mechanism 3 moves towards the pressing table 42, so that the hot pressing areas of the first product and the second product are both located on the pressing table 42.

[0083] S4, the pressing: the tape winding mechanism 5 moves down to the pressing table 42, the pressing head 18 presses down to the pressing table 42, and keeps for a set time, then rises, and the tape winding mechanism 5 moves up; specifically, during the hot pressing process, the buffer material released by the tape winding mechanism 5 is located between the pressing head 18 and the PCB, which can prevent the pressing head 18 from directly contacting the PCB when pressing at high temperature, and can prevent the PCB from being scalded, and can prevent interference with other mechanisms by the buffer material of the tape winding mechanism 5 and the up-down action of the pressing head 18.

[0084] S5, after the pressing, the transfer: the longitudinal adjusting slider 3134 drives the bracket to extend to the direction of the pressing table 42, and supports the first product; the lifting rod 43 of the first product platform mechanism 4 drives the lifting slider 44 to lift the first product on the pressing table 42 upward, at the same time, the second product platform mechanism 3 drives the longitudinal adjusting slider 3134 and the adjusting mounting plate 3131 to move upward synchronously by the same height; specifically, the adjusting mounting plate 3131 drives the adjusting mounting block 3133 to extend to the direction of the pressing table 42 through the longitudinal adjusting slider 3134, at the same time, the lifting rod 43 of the first product platform structure lifts the PCB on the pressing table 42 upward through the lifting slider 44, and the adjusting mounting plate 3131 is reset through the longitudinal adjusting slider 3134; specifically, about step S5: after the bonding of the single-sided PCB and COF is completed, the part of the PCB on the pressing table 42 needs to be transferred to the glass platform 31, so as to facilitate the next step or unloading, when the glass platform 31 transfers the finished product, all the suction cups of the suction part 312 are opened to prevent the finished product from falling.

[0085] S6, after the transfer, move out; the lifting rod 43 drives the lifting slider 44 to move down, and the adjusting mounting plate 3131 supports the first product; the second product platform mechanism 3 moves out of the hot pressing station, and the first finished product obtained after the first product and the second product are bonded is synchronously moved out.

[0086] S7, the second product platform mechanism 3 drives the first finished product to switch to the next pressing head unit and the corresponding hot pressing station of the first product platform mechanism 4.

[0087] S8, the glass platform driving unit 32 drives the glass platform 31 to rotate by a set angle, so that the next to be bonded edge of the second product is opposite to the pressing table 42 of the first product platform mechanism 4 where the PCB to be bonded is located; then step S2-S6 is repeated once.

[0088] S9, repeat steps S7-S8 at least once; the number of repeated cycles is the same as the number of edges provided with PCBs on the second product, so that all the PCBs to be bonded on the second product are bonded.

[0089] S10, the bonded finished product is transferred from the second product platform mechanism 3 to the next process, and the longitudinal adjusting slider 3134 drives the adjusting mounting plate 3131 to reset. In the above embodiments, each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0090] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0091] The above is a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A dual head calendering apparatus for thermally bonding between a single or multiple first product and a second product, characterized by: The device comprises a support (6) provided with at least two pressing head units, a tape winding mechanism (5), a first product platform mechanism (4) corresponding to the pressing head units, and a second product platform mechanism (3); the tape winding mechanism (5) moves synchronously with the pressing head units; the first product platform mechanism (4) comprises a pressing table (42) and a first product bearing area, the first product is borne on the first product bearing area and the bonding area of the first product is located on the pressing table (42), the first product platform mechanism (4) moves to a hot pressing station so that the pressing table (42) is located directly below the pressing head units; the second product platform mechanism (3) bears the second product and switches it to the hot pressing station, and moves the bonding area of the second product to the pressing table (42); the tape winding mechanism (5) releases a buffer material which passes through the area between the lower part of the pressing head units and the upper part of the first product and the second product; the pressing head units, the first product platform mechanism (4) and the second product platform mechanism (3) can alternatively cooperate to perform a bonding action, or alternatively switch, the second product platform mechanism (3) moves the second product to the corresponding hot pressing station to switch and perform a bonding action, or simultaneously cooperates with the second product platform mechanism (3) to perform a bonding action.

2. The dual head press apparatus of claim 1, wherein, The pressing head unit comprises a pressing head assembly, a pressing head driving part (11) for driving the pressing head assembly to move vertically, and a pressing head connecting part connecting the pressing head assembly and the pressing head driving part (11); the pressing head assembly is slidably connected to a guide rail on the support (6) through a pressing head slider (111); the pressing head connecting part comprises a slider connecting plate (12) fixedly connected to the pressing head slider (111), an oil injection port (121) is arranged on the slider connecting plate (12) to the side of the operation area of the double-pressing head device, the oil injection port (121) is fully exposed to the operation area, and the oil injection port (121) is connected to an oil inlet (112) of the pressing head slider (111) through an oil pipe.

3. The dual head press apparatus of claim 2, wherein, The pressing head assembly comprises a pressing head (18) and a horizontal adjusting part for adjusting the levelness of the lower pressing surface of the pressing head (18); the horizontal adjusting part comprises a first heat insulation plate (13), a plurality of groups of first air channels are horizontally arranged in the first heat insulation plate (13), and a first air inlet (131) and a first air outlet (132) are respectively connected to the first ends and the last ends of the first air channels; a second heat insulation plate (14) is arranged below the first heat insulation plate (13), and the second heat insulation plate (14) is embedded with evenly distributed cushion blocks; a horizontal adjusting block (15) is fixed below the second heat insulation plate (14), a plurality of rows of second air channels are horizontally arranged in the horizontal adjusting block (15), and a second air inlet (151) and a second air outlet (152) are arranged at the rear of the horizontal adjusting block (15) and connected to the first ends and the last ends of the second air channels, respectively.

4. The dual head press apparatus of claim 3, wherein, The horizontal adjusting part comprises a plurality of first adjusting members (153) and second adjusting members (154), the first adjusting members (153) and the second adjusting members (154) pass through the first heat insulation plate (13), the second heat insulation plate (14) and the horizontal adjusting block (15) simultaneously, the first adjusting members (153) partially penetrate into the heat generating block (16) below the horizontal adjusting block (15), and the lower end of the second adjusting member (154) abuts on the end face of the heat generating block (16) toward the horizontal adjusting block (15).

5. The dual head press apparatus of claim 4, wherein, The heat generating block (16) is provided with a plurality of heat generating blocks (16) at least on the front section, the interruption and the rear section of the pressure head (18), each of the heat generating blocks (16) is internally provided with a plurality of heat generating pipes (161) arranged side by side along the length direction of the heat generating block (16) and perpendicularly arranged with the length direction of the heat generating block (16), and the temperatures of the front section, the interruption and the rear section of the pressure head (18) are independently controllable.

6. The dual head press apparatus of claim 5, wherein, The second product platform mechanism (3) comprises a glass platform (31) and a glass platform driving unit (32) for driving the glass platform (31) to move horizontally, longitudinally, vertically and rotationally; the glass platform (31) is divided into a glass support area (311), a plurality of first product support assemblies (3141) and a second product support assembly (315), each of the first product support assemblies (3141) comprises a main support assembly and an auxiliary support assembly, the main support assembly is connected with the second product support assembly (315), and the glass support area (311), the first product support assembly (3141) and the second product support assembly (315) are all provided with a plurality of adsorption parts (312); the auxiliary support assemblies are symmetrically arranged on both sides of the glass support area (311).

7. The dual head press apparatus of claim 6, wherein, The main support assembly comprises a longitudinal adjusting sliding block (3134) and a bracket, the second product support assembly (315) comprises a second product support block, the second product support block is fixedly arranged on the bracket, and the auxiliary support assembly comprises a support plate, the support plate is connected to the glass platform (31) through a transverse adjusting sliding block.

8. The dual head press apparatus of claim 7, wherein, The first product platform mechanism (4) comprises a first product platform support plate (41), a first product platform driving unit (47) is arranged below the first product platform support plate (41), a test area is arranged on the first product platform support plate (41), and the test area is located in front of the pressing table (42); the test area comprises a fixed column (45) fixed on the first product platform support plate (41), and the fixed column (45) is fixed with a pressure sensing platform (46); a lifting part is arranged behind the pressing table (42); the lifting part comprises a lifting sliding block (44) and a lifting rod (43) fixed on the lifting sliding block (44).

9. The dual head press apparatus of claim 8, wherein, The upper surface of the pressure sensing platform (46) is at the same horizontal height as the upper surface of the pressing table (42) and the upper surface of the glass platform (31).

10. A double head pressure process, characterized by, The double-pressure-head pressing device according to any one of claims 3-9 is used, and the following steps are included: S1, adjust the level of the pressing head (18); S2, alignment correction: the first product platform mechanism (4) and the second product platform mechanism (3) are moved to the hot pressing station; the first product on the pressing table (42) of the first product platform mechanism (4) is aligned and corrected with the second product on the glass platform (31) of the second product platform mechanism (3); S3, product alignment: the second product platform mechanism (3) moves towards the pressing table (42), so that the hot pressing areas of the first product and the second product are both located on the pressing table (42); S4, pressing: the tape winding mechanism (5) moves downwards towards the pressing table (42), the pressing head (18) presses downwards towards the pressing table (42), and after maintaining for a set time, it rises, and the tape winding mechanism (5) moves upwards; S5, after pressing, hand over: the longitudinal adjustment slider (3134) drives the bracket to extend towards the pressing table (42) to support the first product; the lifting rod (43) of the first product platform mechanism (4) drives the lifting slider (44) to lift the first product on the pressing table (42) upwards, at the same time, the glass platform driving unit (32) drives the longitudinal adjustment slider (3134) and the adjustment mounting plate (3131) to move upwards synchronously by the same height; S6, after handing over, move out: the lifting rod (43) drives the lifting slider (44) to move downwards, the adjustment mounting plate (3131) supports the first product; the second product platform mechanism (3) is moved out of the hot pressing station, and the first product obtained after bonding the first product and the second product is moved out synchronously; S7, the bonded first product is transferred from the second product platform mechanism (3) to the next process, and the longitudinal adjustment slider (3134) drives the adjustment mounting plate (3131) to reset.

11. The dual head in press process of claim 10, wherein, The step S6 includes the following steps: S6A, the first product platform mechanism (4) drives the first product to switch to the next pressing head unit, and after the first product platform mechanism (4) corresponding to the hot pressing station, steps S2-S6 are executed.

12. The dual head in press process of claim 11 wherein, In the step S6A, the second product platform mechanism (3) drives the glass platform (31) to rotate by a set angle, so that the to-be-bonded edge of the second product is directly opposite the pressing table (42).

13. The dual head in press process of claim 12, wherein, The step S6A is repeated at least once.

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