Cryopump for fusion device and fusion device

Abstract

The invention discloses a low-temperature pump for a fusion device and the fusion device, and relates to the field of fusion devices.The low-temperature pump comprises a low-temperature pump body, an adsorption space is defined by the low-temperature pump body, and a first medium inlet communicating with the adsorption space is formed in the low-temperature pump body; the valve assembly is arranged on the cryogenic pump main body, and the valve assembly is used for opening or closing the first medium inlet; and at least part of the adsorption assembly is arranged in the adsorption space, the adsorption assembly is used for adsorbing gas in the adsorption space, and the adsorption assembly is detachably arranged on the cryogenic pump body. Therefore, the adsorption assembly is detachably arranged on the cryopump main body, the adsorption assembly can be independently replaced, the maintenance cost of the cryopump can be reduced, the production cost of fusion energy can be reduced, the economic benefit is further improved, and the adsorption assembly can be replaced without shutdown under the condition that a certain adsorption assembly is replaced.

Description

Technical Field

[0001] The present invention relates to the field of fusion devices, and in particular to a cryogenic pump for a fusion device and a fusion device having the cryogenic pump. Background Art

[0002] Fusion devices are among the most complex scientific and engineering systems ever constructed, encompassing dozens of subsystems, including vacuum systems and cryogenic systems. These systems provide an insulating environment for the low-temperature superconductors in the fusion reactor, a clean environment for the high-temperature plasma fusion reaction, and efficient fuel circulation, fundamental to the sustained operation of the fusion reaction.

[0003] The vacuum system includes a cryopump, a low-temperature condensing adsorption pump. Used in fusion devices, cryopumps primarily remove impurities during plasma operation. The cryopump includes an adsorption assembly, a consumable part. After prolonged use, the adsorption assembly is subject to the risk of deteriorating adsorption performance and falling apart. The adsorption assembly cannot be replaced individually; the entire cryopump must be replaced, increasing the production cost of fusion energy and reducing its economic viability. Furthermore, replacing the cryopump requires shutting down the reactor. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a cryopump that can replace the adsorption component separately, thereby reducing the maintenance cost of the cryopump and allowing the adsorption component to be replaced without stopping the stack.

[0005] The present invention further proposes a fusion device.

[0006] A cryogenic pump for a fusion device according to an embodiment of the present invention includes: a cryopump body, the cryopump body defining an adsorption space, and the cryopump body forming a first medium inlet communicating with the adsorption space; A valve assembly is provided on the cryopump body and is used to open or close the first medium inlet; At least one adsorption component, at least part of which is arranged in the adsorption space, is used to adsorb the gas in the adsorption space, and is detachably arranged on the cryopump body.

[0007] According to an embodiment of the present invention, a cryopump for a fusion device is detachably provided on a cryopump body through an adsorption component, and the adsorption component can be replaced separately, which is beneficial to reducing the maintenance cost of the cryopump, thereby reducing the production cost of fusion energy, and further improving economic benefits. Moreover, when a certain adsorption component is replaced, the adsorption component can be replaced without stopping the stack.

[0008] In some examples of the present invention, the cryogenic pump body includes: a shell, the shell defines an adsorption space, the shell forms a first medium inlet, and the shell also forms a mounting hole connected to the adsorption space, and the adsorption assembly is inserted into or removed from the adsorption space through the mounting hole.

[0009] In some examples of the present invention, the adsorption components and the mounting holes are arranged in a one-to-one correspondence.

[0010] In some examples of the present invention, the housing has a first end wall and a second end wall, the first end wall and the second end wall are opposite and spaced apart, the adsorption space is located between the first end wall and the second end wall, the first end wall is formed with a first medium inlet, and the second end wall is formed with a mounting hole.

[0011] In some examples of the present invention, there are multiple adsorption components, and the multiple adsorption components are arranged in sequence along the circumference of the second end wall.

[0012] In some examples of the present invention, the adsorption assembly includes: an adsorption structure, a cooling medium loop pipe and a cooling medium inlet pipe. The adsorption structure is arranged in the adsorption space and forms a cooling medium flow channel. The cooling medium flow channel penetrates the adsorption structure along the axial direction of the cooling medium loop pipe. The adsorption structure is fixed to the cooling medium loop pipe, and the cooling medium flow channel connects the cooling medium loop pipe and the cooling medium inlet pipe.

[0013] In some examples of the present invention, the adsorption structure includes a plurality of adsorption plates, which are arranged around the cooling medium loop pipe along a circumference of the cooling medium loop pipe, and each adsorption plate is formed with a cooling medium flow channel.

[0014] In some examples of the present invention, the adsorption assembly also includes: a connecting pipe, the connecting pipe, the adsorption structure and the cooling medium inlet pipe are arranged axially along the cooling medium loop pipe, the adsorption structure is located between the connecting pipe and the cooling medium inlet pipe, the connecting pipe connects the cooling medium loop pipe and the cooling medium flow channel, and the cooling medium flow channel connects the connecting pipe and the cooling medium inlet pipe.

[0015] In some examples of the present invention, the adsorption plate is an arc-shaped structure.

[0016] In some examples of the present invention, the adsorption assembly also includes: a mounting portion, the mounting portion and the adsorption structure are arranged along the axial direction of the cooling medium loop pipe, the cooling medium loop pipe and the cooling medium inlet pipe are both fixed to the mounting portion, and the mounting portion is detachably provided on the cryogenic pump body.

[0017] In some examples of the present invention, the cooling medium inflow pipe includes: a first tube body and a second tube body connected to each other, the first tube body is arranged in the mounting portion along the axial direction of the cooling medium loop pipe, the second tube body is located on the side of the mounting portion away from the adsorption structure, the first tube body connects the second tube body and the cooling medium flow channel, and the second tube body forms a second medium inlet.

[0018] In some examples of the present invention, there are multiple cooling medium flow channels, and the multiple cooling medium flow channels are arranged around the cooling medium loop pipe along the circumference of the cooling medium loop pipe. There are multiple first tube bodies, and the multiple first tube bodies are arranged around the cooling medium loop pipe along the circumference of the cooling medium loop pipe. The multiple first tube bodies and the multiple cooling medium flow channels are connected one-to-one.

[0019] In some examples of the present invention, the cryopump body includes: a cold screen having an annular structure, disposed in the adsorption space, and sleeved on the adsorption assembly and spaced apart from the adsorption assembly.

[0020] In some examples of the present invention, the cryopump body further includes: a radiation baffle, the radiation baffle is disposed in the adsorption space, and the cold shield is disposed on the radiation baffle.

[0021] In some examples of the present invention, the adsorption assembly is located between the radiation barrier and the cold screen.

[0022] In some examples of the present invention, the cryogenic pump body also includes: a heat exchange pipeline, at least part of which is arranged in the adsorption space, the heat exchange pipeline is in contact with both the cold screen and the radiation baffle, and the heat exchange pipeline cooperates with both the cold screen and the radiation baffle in heat exchange.

[0023] A fusion device according to an embodiment of the present invention includes the above-mentioned cryopump for a fusion device.

[0024] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which: Figure 1 is a schematic diagram of a cryopump according to an embodiment of the present invention; Figure 2 is a schematic diagram of a cryopump from another angle according to an embodiment of the present invention; Figure 3 is a cross-sectional view of a cryopump according to an embodiment of the present invention; Figure 4 is a schematic diagram of an adsorption assembly according to an embodiment of the present invention; Figure 5 yes Figure 4 Enlarged view of point A in the middle; Figure 6 is another angled schematic diagram of an adsorption assembly according to an embodiment of the present invention; Figure 7 is a schematic diagram of a cryopump body according to an embodiment of the present invention; Figure 8is a schematic diagram of a cryopump body from another angle according to an embodiment of the present invention; Figure 9 is a cross-sectional view of a cryopump body according to an embodiment of the present invention; Figure 10 FIG. 1 is a cross-sectional view of a cryopump at another position according to an embodiment of the present invention.

[0026] Reference numerals: Cryogenic pump 100; Cryopump body 10; adsorption space 11; first medium inlet 12; Housing 13; mounting hole 131; first end wall 132; second end wall 133; connecting wall 134; Cold shield 14; Radiation shield 15; Heat exchange pipe 16; first pipe 161; second pipe 162; pipe inlet 164; pipe outlet 165; first heat exchange pipe 166; second heat exchange pipe 167; third heat exchange pipe 168; Valve assembly 20; valve 21; drive structure 22; Adsorption component 30; Adsorption structure 31; adsorption plate 311; Cooling medium loop pipe 32; Cooling medium inlet pipe 33; first pipe body 331; second pipe body 332; second medium inlet 333; Connecting pipe 34; mounting portion 35. DETAILED DESCRIPTION

[0027] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0028] Reference below Figures 1-9 A cryopump 100 for a fusion device according to an embodiment of the present invention is described. The cryopump 100 is a low-temperature condensation adsorption pump. The cryopump 100 is used in a fusion device primarily to remove impurity gases during plasma operation. The cryopump 100 operates by relying on the properties of low-temperature condensation and adsorption (activated carbon) to achieve a high-speed exhaust effect on the working gas.

[0029] like Figures 1-4As shown, a cryogenic pump 100 for a fusion device according to an embodiment of the present invention includes: a cryogenic pump body 10, the cryogenic pump body 10 defines an adsorption space 11, and the cryogenic pump body 10 is formed with a first medium inlet 12 connected to the adsorption space 11; a valve assembly 20, the valve assembly 20 is arranged on the cryogenic pump body 10, and the valve assembly 20 is used to open or close the first medium inlet 12; at least one adsorption assembly 30, at least a portion of the adsorption assembly 30 is arranged in the adsorption space 11, the adsorption assembly 30 is used to adsorb the gas in the adsorption space 11, and the adsorption assembly 30 is detachably arranged on the cryogenic pump body 10.

[0030] The cryopump 100 includes: a cryopump body 10, a valve assembly 20 and at least one adsorption assembly 30. This application is described by taking a plurality of adsorption assemblies 30 as an example. The cryopump body 10 defines an adsorption space 11, and the cryopump body 10 is formed with a first medium inlet 12, which is connected to the adsorption space 11, and the working gas flows into the adsorption space 11 through the first medium inlet 12. The cryopump body 10 can also be formed with an outlet, which is connected to the adsorption space 11, and the gas in the adsorption space 11 can flow out of the outlet through the outlet. The outlet can be selectively opened or closed. When the gas in the adsorption space 11 needs to be discharged, the outlet is opened to discharge the gas in the adsorption space 11. When the gas in the adsorption space 11 does not need to be discharged, the outlet is closed. It should be noted that the opening or closing method of the outlet can be reasonably selected and set according to actual conditions, and is not specifically limited here, as long as the outlet can be opened or closed.

[0031] The valve assembly 20 is disposed on the cryopump body 10 and is used to open or close the first medium inlet 12. The valve assembly 20 may include a valve 21 and a drive structure 22. The valve 21 and the drive structure 22 are connected. The valve 21 and the first medium inlet 12 are correspondingly disposed. The drive structure 22 is used to drive the valve 21 to move relative to the cryopump body 10, thereby opening or closing the first medium inlet 12. As an example, the drive structure 22 is a drive cylinder having a telescopic shaft. The telescopic shaft is fixedly connected to the valve 21. The telescopic shaft is extended and retracted along the axial direction of the first medium inlet 12 to drive the valve 21 to open or close the first medium inlet 12. As another example, the drive structure 22 includes a drive screw, a drive nut, and a drive motor. The drive nut is sleeved on the drive screw and fixedly connected to the motor shaft of the drive motor. The drive screw is fixedly connected to the valve 21. When the drive motor is operated, the drive nut rotates. The rotation of the drive nut drives the drive screw to move axially along the first medium inlet 12. During the movement of the drive screw, the valve 21 is driven to open or close the first medium inlet 12. As another example, the valve 21 is rotatably provided on the cryopump body 10, and the driving structure 22 is a driving cylinder. The driving cylinder has a telescopic shaft, and the telescopic shaft is fixedly connected to the valve 21. The telescopic shaft is extended and retracted along the axial direction of the first medium inlet 12 to drive the valve 21 to rotate, so that the valve 21 opens or closes the first medium inlet 12. It should be noted that the driving structure 22 can be connected to the controller for communication, and the controller controls the driving structure 22 to drive the valve 21 to open or close the first medium inlet 12. During the regeneration stage of the cryopump 100, the controller controls the driving structure 22 to drive the valve 21 to close the first medium inlet 12. During the pumping stage of the cryopump 100, the controller controls the driving structure 22 to drive the valve 21 to open to achieve the effect of regulating the pumping speed.

[0032] The adsorption assembly 30 is used to adsorb gas within the adsorption space 11. For example, the adsorption assembly 30 is used to adsorb helium generated by the reaction and unreacted fuel gas at low temperatures. At least a portion of the adsorption assembly 30 is located within the adsorption space 11. In other words, a portion of the adsorption assembly 30 may be located within the adsorption space 11, or the entire adsorption assembly 30 may be located within the adsorption space 11. This application uses the example of a portion of the adsorption assembly 30 being located within the adsorption space 11. The adsorption assembly 30 located within the adsorption space 11 can adsorb the fuel gas generated by the reaction.

[0033] The adsorption assembly 30 is detachably mounted on the cryopump body 10. The adsorption assembly 30 can be detachably mounted on the cryopump body 10 by bolts, or can be detachably mounted on the cryopump body 10 by snap-fitting. Since the adsorption assembly 30 is detachably mounted on the cryopump body 10, when the adsorption assembly 30 needs to be replaced, the adsorption assembly 30 can be replaced alone without replacing the entire cryopump 100. This helps reduce the maintenance cost of the cryopump 100, thereby helping reduce the production cost of fusion energy and thereby improving economic benefits. Moreover, when a certain adsorption assembly 30 needs to be replaced, the valve assembly 20 closes the first medium inlet 12, and the adsorption assembly 30 that needs to be replaced can be replaced without stopping the reactor, thereby achieving the effect of replacing the adsorption assembly 30 without stopping the reactor, which helps improve the working efficiency of the fusion device.

[0034] Therefore, by detachably mounting the adsorption assembly 30 on the cryopump body 10, the adsorption assembly 30 can be replaced individually, which is beneficial to reducing the maintenance cost of the cryopump 100, thereby reducing the production cost of fusion energy, and further improving economic benefits. Moreover, when a certain adsorption assembly 30 is replaced, the valve assembly 20 closes the first medium inlet 12, thereby achieving the effect of replacing the adsorption assembly 30 without stopping the stack.

[0035] In some embodiments of the present invention, Figure 1 and Figure 7 As shown, the cryopump body 10 includes: a shell 13, the shell 13 defines an adsorption space 11, the shell 13 forms a first medium inlet 12, and the shell 13 also forms a mounting hole 131 connected to the adsorption space 11, and the adsorption assembly 30 is inserted into or removed from the adsorption space 11 through the mounting hole 131.

[0036] The cryopump body 10 includes a housing 13. The housing 13 can be made of a metal material. For example, the housing 13 can be made of stainless steel. The housing 13 is the outermost structural support member of the cryopump 100. The housing 13 defines the adsorption space 11. In other words, the adsorption space 11 is defined by the housing 13. The housing 13 is formed with a first medium inlet 12. The housing 13 is also formed with a mounting hole 131 that communicates with the adsorption space 11. When the adsorption assembly 30 needs to be installed on the cryopump body 10, the adsorption assembly 30 is inserted into the adsorption space 11 through the mounting hole 131. After the adsorption assembly 30 is inserted into place, the adsorption assembly 30 is fixed to the housing 13. When the adsorption assembly 30 needs to be removed from the cryopump body 10, the adsorption assembly 30 is removed from the housing 13 and the adsorption assembly 30 is pulled out of the adsorption space 11 through the mounting hole 131. The adsorption assembly 30 can then be replaced. Therefore, by providing the mounting hole 131 on the housing 13 , it is convenient to insert the adsorption assembly 30 into the adsorption space 11 , so that at least a portion of the adsorption assembly 30 is disposed in the adsorption space 11 , thereby facilitating the assembly and disassembly of the adsorption assembly 30 and the cryopump body 10 .

[0037] In some embodiments of the present invention, Figure 1 and Figure 7 As shown, the adsorption components 30 and the mounting holes 131 are arranged in a one-to-one correspondence.

[0038] Among them, one mounting hole 131 is used to assemble an adsorption component 30. By setting the adsorption component 30 and the mounting hole 131 in one-to-one correspondence, and assembling multiple adsorption components 30 relative to one mounting hole 131, it is more convenient to insert the adsorption component 30 into the adsorption space 11, and it is also convenient to pull the adsorption component 30 out of the adsorption space 11, and it is more convenient to disassemble and assemble the adsorption component 30 and the low-temperature pump body 10, thereby facilitating the replacement of the adsorption component 30.

[0039] In some embodiments of the present invention, Figure 1 、 Figure 7-Figure 9 As shown, the housing 13 has a first end wall 132 and a second end wall 133, the first end wall 132 and the second end wall 133 are opposite and spaced apart, the adsorption space 11 is located between the first end wall 132 and the second end wall 133, the first end wall 132 is formed with a first medium inlet 12, and the second end wall 133 is formed with a mounting hole 131.

[0040] The housing 13 has a first end wall 132 and a second end wall 133. The first end wall 132 and the second end wall 133 are disposed opposite each other and spaced apart from each other. The first end wall 132 and the second end wall 133 may be plate-shaped structures and may be disposed in parallel. The housing 13 may also have a connecting wall 134. The connecting wall 134 may be annular and connected between the first end wall 132 and the second end wall 133. Thus, the connecting wall 134, the first end wall 132, and the second end wall 133 collectively define an adsorption space 11. The adsorption space 11 is located between the first end wall 132 and the second end wall 133. A first medium inlet 12 is formed through the first end wall 132, and a mounting hole 131 is formed on the second end wall 133. The adsorption assembly 30 can be disassembled and assembled on the side of the cryopump body 10 away from the first medium inlet 12. When the adsorption assembly 30 is disassembled and assembled, it will not affect the gas entering the adsorption space 11 from the first medium inlet 12, which is conducive to achieving the effect of replacing the adsorption assembly 30 without stopping the fusion reactor.

[0041] In some embodiments of the present invention, Figure 1 and Figure 7 As shown, there are multiple adsorption assemblies 30 , and the multiple adsorption assemblies 30 are arranged in sequence along the circumference of the second end wall 133 .

[0042] Among them, the adsorption components 30 can be set to two, three, four, five, eight, twelve, etc. The number of adsorption components 30 can be reasonably selected according to actual usage. Multiple adsorption components 30 are arranged in sequence along the circumference of the second end wall 133, and multiple adsorption components 30 can be located on the same circumference. For example, each adsorption component 30 has a central axis extending along the axial direction of the mounting hole 131. The multiple central axes of the multiple adsorption components 30 are located on the same circumference. Multiple adsorption components 30 can be evenly arranged in sequence along the circumference of the second end wall 133. By arranging multiple adsorption components 30 in sequence along the circumference of the second end wall 133, it is possible to increase the pumping speed of the gas by the cryopump 100 without interfering with other components in the cryopump 100.

[0043] In some embodiments of the present invention, Figure 1 、 Figure 3-Figure 6 As shown, the adsorption assembly 30 includes: an adsorption structure 31, a cooling medium circuit pipe 32 and a cooling medium inlet pipe 33. The adsorption structure 31 is arranged in the adsorption space 11 and forms a cooling medium flow channel. The cooling medium flow channel penetrates the adsorption structure 31 along the axial direction of the cooling medium circuit pipe 32. The adsorption structure 31 is fixed to the cooling medium circuit pipe 32. The cooling medium flow channel connects the cooling medium circuit pipe 32 and the cooling medium inlet pipe 33.

[0044] Among them, the adsorption component 30 may include: an adsorption structure 31, a cooling medium loop pipe 32 and a cooling medium inlet pipe 33. The adsorption structure 31 is used for adsorption of helium generated by the reaction and unreacted fuel gas at low temperature. The adsorption structure 31 is arranged in the adsorption space 11. The adsorption structure 31 can be made of metal materials. The adsorption structure 31 can be made of metal materials such as stainless steel and iron. The adsorption structure 31 may have activated carbon. The adsorption structure 31 is used for adsorption of helium generated by the reaction and unreacted fuel gas at low temperature. The adsorption structure 31 is formed with at least one cooling medium flow channel. This application takes the adsorption structure 31 as an example to form multiple cooling medium flow channels. The cooling medium flow channel passes through the adsorption structure 31 along the axial direction of the cooling medium loop pipe 32. Figure 4 As shown, the axial direction of the cooling medium circuit pipe 32 is Figure 4 The cooling medium flow channel is used for allowing a coolant to flow through. The coolant can be a liquid coolant or a gas coolant. For example, the coolant can be liquid helium, and the liquid helium is 4K liquid helium.

[0045] The cooling medium loop pipe 32 can be made of a metal material, such as stainless steel or iron. The adsorption structure 31 is fixed to the cooling medium loop pipe 32. The adsorption structure 31 can be welded to the cooling medium loop pipe 32, or the adsorption structure 31 can be fixed to the cooling medium loop pipe 32 by bolts, or the adsorption structure 31 can be fixed to the cooling medium loop pipe 32 by snapping. By fixing the adsorption structure 31 to the cooling medium loop pipe 32, the cooling medium loop pipe 32 can support the adsorption structure 31, reduce the risk of the adsorption structure 31 shaking, and help improve the positional stability of the adsorption structure 31.

[0046] The cooling medium flow channel connects the cooling medium loop pipe 32 and the cooling medium inlet pipe 33. For example, one end of the cooling medium flow channel connects to the cooling medium loop pipe 32, and the other end of the cooling medium flow channel connects to the cooling medium inlet pipe 33. The cooling medium loop pipe 32 and the cooling medium inlet pipe 33 are connected by the cooling medium flow channel, and the coolant flows in through the cooling medium inlet pipe 33. The coolant flows along the cooling medium inlet pipe 33 into the cooling medium flow channel, and then flows along the cooling medium flow channel into the cooling medium loop pipe 32. The coolant in the cooling medium loop pipe 32 flows out of the adsorption assembly 30 through the cooling medium loop pipe 32. When the coolant flows through the cooling medium flow channel, it can exchange heat with the adsorption structure 31. The coolant can cool the adsorption structure 31, reducing the temperature of the adsorption structure 31 to an appropriate temperature, thereby facilitating the adsorption effect of the adsorption structure 31 on the gas.

[0047] In some embodiments of the present invention, Figure 4-Figure 6As shown, the adsorption structure 31 includes a plurality of adsorption plates 311 , which are arranged around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32 , and each adsorption plate 311 is formed with a cooling medium flow channel.

[0048] Among them, the adsorption structure 31 may include a plurality of adsorption plates 311, and the number of adsorption plates 311 may be two, three, four, etc. The number of adsorption plates 311 may be reasonably selected according to actual conditions. The plurality of adsorption plates 311 are fixedly mounted on the cooling medium loop pipe 32, and the plurality of adsorption plates 311 are arranged around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32. For example, the plurality of adsorption plates 311 are evenly arranged around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32. Such an arrangement can facilitate the fixing of the plurality of adsorption plates 311 to the cooling medium loop pipe 32, thereby facilitating the production and manufacturing of the adsorption assembly 30, and is beneficial to improving the production efficiency of the adsorption assembly 30. Each adsorption plate 311 is formed with at least one cooling medium flow channel, and the cooling medium flow channel of each adsorption plate 311 is connected to the cooling medium loop pipe 32 and the cooling medium inlet pipe 33. Such an arrangement enables the coolant to flow through each adsorption plate 311, which is beneficial to reducing the loss of cooling capacity and also allows the adsorption structure 31 to be cooled evenly.

[0049] In some embodiments of the present invention, Figure 4-Figure 6 As shown, the adsorption assembly 30 also includes: a connecting pipe 34, the connecting pipe 34, the adsorption structure 31 and the cooling medium inlet pipe 33 are arranged axially along the cooling medium loop pipe 32, the adsorption structure 31 is located between the connecting pipe 34 and the cooling medium inlet pipe 33, the connecting pipe 34 connects the cooling medium loop pipe 32 and the cooling medium flow channel, and the cooling medium flow channel connects the connecting pipe 34 and the cooling medium inlet pipe 33.

[0050] The adsorption assembly 30 further includes a connecting tube 34. Along the axial direction of the cooling medium loop tube 32, at least a portion of the adsorption structure 31 is located between the connecting tube 34 and the cooling medium inlet tube 33. One end of the connecting tube 34 is connected to the cooling medium loop tube 32, and the other end of the connecting tube 34 is connected to the cooling medium flow channel. This allows the connecting tube 34 to connect the cooling medium loop tube 32 and the cooling medium flow channel, achieving indirect connection between the cooling medium flow channel and the cooling medium loop tube 32 via the connecting tube 34. The cooling medium flow channel connects the connecting tube 34 and the cooling medium inlet tube 33, allowing coolant flowing into the cooling medium inlet tube 33 to flow into the connecting tube 34.

[0051] In some embodiments of the present invention, Figure 4-Figure 6 As shown, the adsorption plate 311 is an arc-shaped structure.

[0052] For example, the adsorption plate 311 can be arranged to protrude toward the cooling medium loop pipe 32. The adsorption plate 311 can be an arc-shaped structure. By setting the adsorption plate 311 as an arc-shaped structure, the surface area of ​​the adsorption plate 311 can be increased. More activated carbon can be set on the outer surface of the adsorption plate 311. Increasing the area where the activated carbon is set can enable the adsorption structure 31 to adsorb more gas, which is beneficial to improving the pumping speed of the cryopump 100. In addition, by setting the adsorption plate 311 with an arc-shaped structure around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32, the angle effect of the installation of the adsorption assembly 30 can be reduced, and the risk of interference between the adsorption assembly 30 and other components in the cryopump 100 during the process of disassembling the adsorption assembly 30 can be reduced, thereby facilitating the disassembly and assembly of the adsorption assembly 30.

[0053] In some embodiments of the present invention, Figure 1 、 Figure 4-Figure 6 As shown, the adsorption assembly 30 also includes: a mounting portion 35, the mounting portion 35 and the adsorption structure 31 are arranged along the axial direction of the cooling medium loop pipe 32, the cooling medium loop pipe 32 and the cooling medium inlet pipe 33 are both fixed to the mounting portion 35, and the mounting portion 35 is detachably provided on the cryopump body 10.

[0054] The adsorption assembly 30 may further include: a mounting portion 35, which may be a flange, a flat plate, and an arrangement of the mounting portion 35 and the adsorption structure 31 along the axial direction of the cooling medium loop pipe 32. The mounting portion 35 and the adsorption structure 31 may be spaced apart. The cooling medium loop pipe 32 and the cooling medium inflow pipe 33 may both be passed through the mounting portion 35, and both the cooling medium loop pipe 32 and the cooling medium inflow pipe 33 may be fixed to the mounting portion 35. The cooling medium loop pipe 32 and the cooling medium inflow pipe 33 may both be welded and fixed to the mounting portion 35, or may be snap-fitted and fixed to the mounting portion 35. The mounting portion 35 may support the cooling medium loop pipe 32 and the cooling medium inflow pipe 33. The mounting portion 35 may be detachably mounted on the cryopump body 10. For example, the mounting portion 35 may be fixedly mounted to the housing 13 of the cryopump body 10 by bolts. For example, the mounting portion 35 may also be snap-fitted and fixed to the housing 13 of the cryopump body 10. When the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131 and is inserted into place, the mounting portion 35 can be located outside the shell 13, the mounting portion 35 can contact the outer surface of the shell 13, and the mounting portion 35 is detachably connected to the shell 13, thereby facilitating the disassembly and assembly of the adsorption component 30 and facilitating the replacement of the adsorption component 30.

[0055] In some embodiments of the present invention, Figure 5 and Figure 6As shown, the cooling medium inlet pipe 33 includes: a first tube body 331 and a second tube body 332 connected to each other, the first tube body 331 is arranged in the mounting portion 35 along the axial direction of the cooling medium loop pipe 32, and the second tube body 332 is located on the side of the mounting portion 35 away from the adsorption structure 31. The first tube body 331 connects the second tube body 332 and the cooling medium flow channel, and the second tube body 332 forms a second medium inlet 333.

[0056] Among them, the cooling medium inlet pipe 33 may include: a first tube body 331 and a second tube body 332, the first tube body 331 and the second tube body 332 are connected, the first tube body 331 and the second tube body 332 can be an integrally formed part, the first tube body 331 is arranged in the mounting portion 35 along the axial direction of the cooling medium loop pipe 32, and the second tube body 332 is located on the side of the mounting portion 35 away from the adsorption structure 31 along the axial direction of the cooling medium loop pipe 32, and the two ends of the first tube body 331 are respectively connected with the second tube body 332 and the cooling medium flow channel, thereby achieving the effect of the first tube body 331 connecting the second tube body 332 and the cooling medium flow channel, and the second tube body 332 is formed with a second medium inlet 333, and the coolant can flow into the cooling medium inlet pipe 33 through the second medium inlet 333, thereby achieving the effect of the coolant flowing into the cooling medium inlet pipe 33. It should be noted that when the adsorption assembly 30 is inserted into the adsorption space 11 through the mounting hole 131 and is inserted into place, the second tube body 332 is located outside the shell 13, which facilitates the second medium inlet 333 to be connected with the device storing the coolant, thereby making the structural setting of the cooling medium inlet pipe 33 reasonable.

[0057] In some embodiments of the present invention, Figure 4-Figure 6 As shown, there are multiple cooling medium flow channels, and the multiple cooling medium flow channels are arranged around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32. There are multiple first tube bodies 331, and the multiple first tube bodies 331 are arranged around the cooling medium loop pipe 32 along the circumference of the cooling medium loop pipe 32. The multiple first tube bodies 331 and the multiple cooling medium flow channels are connected one by one.

[0058] Among them, the second tube body 332 can be an annular structure, and multiple first tube bodies 331 are arranged in sequence along the circumference of the second tube body 332, and multiple first tube bodies 331 are connected to the second tube body 332. The number of cooling medium flow channels is the same as the number of first tube bodies 331. Multiple first tube bodies 331 and multiple cooling medium flow channels are arranged one by one along the axial direction of the cooling medium loop pipe 32, and the first tube body 331 is connected to the corresponding cooling medium flow channels. Such a setting can make the coolant in the second tube body 332 be diverted into multiple flow paths to flow into the corresponding cooling medium flow channels, which is beneficial to make the coolant in the second tube body 332 evenly distributed to flow into multiple cooling medium flow channels, thereby helping to improve the cooling uniformity of the adsorption structure 31.

[0059] In some embodiments of the present invention, Figure 3 and Figure 9 As shown, the cryopump body 10 includes a cold shield 14 . The cold shield 14 is an annular structure. The cold shield 14 is disposed in the adsorption space 11 . The cold shield 14 is sleeved on the adsorption assembly 30 and is spaced apart from the adsorption assembly 30 .

[0060] Among them, the cryogenic pump body 10 can also include: a cold screen 14, the cold screen 14 is a ring structure, the cold screen 14 is arranged in the adsorption space 11, the cold screen 14 defines an assembly space, the assembly space and the mounting hole 131 are relatively arranged along the axial direction of the cooling medium loop pipe 32, and when the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131, at least part of the structure of the adsorption component 30 can be extended into the assembly space, so that the cold screen 14 is sleeved on the adsorption component 30, and the axial direction of the cold screen 14 can be parallel to the axial direction of the cooling medium loop pipe 32. When the adsorption component 30 is inserted into the adsorption space 11, the risk of interference between the adsorption component 30 and the cold screen 14 is reduced.

[0061] The cold shield 14 can be made of metal, such as oxygen-free copper or iron. The outer surface of the cold shield 14 can be bright nickel-plated, while the inner surface can be blackened. This configuration allows the cold shield 14 to absorb most of the radiant heat and act as a heat shield. The cold shield 14 condenses water vapor in the adsorption space 11, converting it into liquid water, thereby separating the water vapor from the gas.

[0062] In some embodiments of the present invention, Figure 3 and Figure 9 As shown, the cryopump body 10 further includes a radiation baffle 15 , which is disposed in the adsorption space 11 , and the cold shield 14 is sleeved on the radiation baffle 15 .

[0063] The cryopump body 10 may further include a radiation baffle 15 , which is disposed within the adsorption space 11 and may be disposed within the assembly space so that the cold shield 14 is mounted on the radiation baffle 15 . The radiation baffle 15 may be made of a metal material, and the cold shield 14 may be made of materials such as oxygen-free copper and iron. The outer surface of the radiation baffle 15 may be plated with bright nickel to provide the radiation baffle 15 with a heat shielding effect. Furthermore, after gas flows into the adsorption space 11 through the first medium inlet 12 , the radiation baffle 15 may pre-cool the gas within the adsorption space 11 and further condense the water vapor within the adsorption space 11 to form liquid water, thereby facilitating the separation of the water vapor from the gas.

[0064] In some embodiments of the present invention, Figure 3 and Figure 9As shown, there are multiple radiation baffles 15, and the multiple radiation baffles 15 are arranged in sequence along the axial direction of the cooling medium loop pipe 32. After the gas flows into the adsorption space 11 through the first medium inlet 12, the multiple radiation baffles 15 can simultaneously pre-cool the gas in the adsorption space 11 and further condense the water vapor in the adsorption space 11, which is more conducive to forming liquid water from the water vapor, thereby being more conducive to separating the water vapor from the gas.

[0065] In some embodiments of the present invention, Figure 3 and Figure 9 As shown, the adsorption assembly 30 is located between the radiation barrier 15 and the cold shield 14 .

[0066] Among them, after the adsorption assembly 30 is inserted into the adsorption space 11 through the mounting hole 131, the adsorption assembly 30 is located between the radiation baffle 15 and the cold screen 14, and multiple adsorption assemblies 30 are arranged around the radiation baffle 15 along the circumference of the radiation baffle 15. Such an arrangement can make the overall structure of the adsorption assembly 30, the radiation baffle 15 and the cold screen 14 compact, which is conducive to the miniaturization of the cryogenic pump 100, thereby helping to reduce the volume of the cryogenic pump 100.

[0067] In some embodiments of the present invention, Figure 7-Figure 9 As shown, the cryopump body 10 further includes: a heat exchange pipeline 16, at least a portion of which is disposed in the adsorption space 11, the heat exchange pipeline 16 is in contact with both the cold shield 14 and the radiation baffle 15, and the heat exchange pipeline 16 cooperates with both the cold shield 14 and the radiation baffle 15 in heat exchange.

[0068] The cryopump body 10 may further include a heat exchange line 16. Partial or complete heat exchange lines 16 may be located within the adsorption space 11. This application uses the example of a case where the heat exchange line 16 is located within the adsorption space 11. The heat exchange line 16 contacts both the cold shield 14 and the radiation baffle 15, performing heat exchange with both. The heat exchange line 16 is used to transport a cooling medium, which may be a liquid or gaseous cooling medium. For example, the cooling medium may be helium, at 80K. As the cooling medium flows within the heat exchange line 16, it exchanges heat with the cold shield 14 and the radiation baffle 15 through the heat exchange line 16, cooling the cold shield 14 and the radiation baffle 15 and reducing their temperatures to a suitable level.

[0069] Furthermore, the heat exchange pipeline 16 is fixedly connected to the cold screen 14 and the radiation baffle 15. The heat exchange pipeline 16 can be welded to the cold screen 14 and the radiation baffle 15. The heat exchange pipeline 16 can also be fixedly connected to the cold screen 14 and the radiation baffle 15 by bolts. By fixing the heat exchange pipeline 16 to the cold screen 14 and the radiation baffle 15, the heat exchange pipeline 16 can be reliably in contact with the cold screen 14 and the radiation baffle 15, which is conducive to maintaining the heat exchange effect between the heat exchange pipeline 16 and the cold screen 14 and the radiation baffle 15.

[0070] In some embodiments of the present invention, Figure 10 As shown, the heat exchange pipeline 16 includes: a first pipeline 161, a second pipeline 162 and a heat exchange pipe portion. The first pipeline 161 and the second pipeline 162 are both located outside the shell 13. The first pipeline 161 and the second pipeline 162 can both be annular structures. The first pipeline 161 is formed with a pipeline inlet 164, and the second pipeline 162 is formed with a pipeline outlet 165. The heat exchange pipe portion is located in the adsorption space 11, and the heat exchange pipe portion is in contact with both the cold screen 14 and the radiation baffle 15. The heat exchange pipe portion connects the first pipeline 161 and the second pipeline 162. The cooling medium flows into the first pipeline 161 from the pipeline inlet 164, and then flows into the heat exchange pipe portion along the first pipeline 161. When the cooling medium flows in the heat exchange pipe portion, the cooling medium can exchange heat with the cold screen 14 and the radiation baffle 15 through the heat exchange pipe portion, thereby achieving a cooling effect on the cold screen 14 and the radiation baffle 15. The cooling medium in the heat exchange pipe portion flows into the second pipeline 162 and then flows out of the heat exchange pipe 16 through the pipeline outlet 165.

[0071] In some embodiments of the present invention, Figure 10 As shown, the heat exchange pipe section includes: a first heat exchange pipe 166, a second heat exchange pipe 167, and a third heat exchange pipe 168. The first heat exchange pipe 166 and the second heat exchange pipe 167 are connected. The first heat exchange pipe 166 connects the second heat exchange pipe 167 and the first pipeline 161. The second heat exchange pipe 167 connects the first heat exchange pipe 166 and the second pipeline 162. The first heat exchange pipe 166 and the second heat exchange pipe 167 both extend along the axial direction of the cooling medium loop pipe 32. The first heat exchange pipe 166 and the second heat exchange pipe 167 both cooperate with the radiation baffle 15 for heat exchange. The third heat exchange pipe 168 is connected to the first pipeline 161. Exemplarily, the third heat exchange pipe 168 is connected to the first pipeline 161 through at least one of the first heat exchange pipe 166 and the second heat exchange pipe 167. The third heat exchange pipe 168 is also connected to the second pipeline 162. The third heat exchange pipe 168 cooperates with the cold shield 14 for heat exchange.

[0072] In some embodiments of the present invention, the cryopump body 10 may further include: an insulating support block (not shown in the figure), which is located between the cold shield 14 and the outer shell 13. The insulating support block can support the cold shield 14. When the cryopump 100 is installed in a horizontal direction, the insulating support block can reliably support the cold shield 14, thereby reducing the risk of leakage of the heat exchange pipeline 16 caused by deformation of the heat exchange pipeline 16 under the action of gravity.

[0073] Specifically, the first medium inlet 12 is connected to the fusion reactor divertor window, and the cryopump 100 is entirely housed in an external container (in a vacuum environment), which is connected to the cold valve box. During the cryopump 100 cooling phase, 80K cryogenic helium enters the cryopump 100 from the cold valve box via a detachable pipeline through the pipeline inlet 164. It flows through the heat exchange tube section to cool the cold shield 14 and radiation baffle 15, and finally exits through the pipeline outlet 165. After a period of time, 4K cryogenic liquid helium enters the cryopump 100 through the second medium inlet 333, flows through the cooling medium inlet pipe 33 to cool the adsorption plate 311, and finally exits through the cooling medium return pipe 32. When the temperature drops to a predetermined level, the valve 21 of the cryopump 100 is opened to pump out the gas. If the cryopump 100's pumping performance degrades and requires maintenance, the valve 21 of the cryopump 100 is closed to regenerate the cryopump 100. Once the temperature returns to normal, the bolts on the mounting portion 35 are remotely removed, and one or more adsorption assemblies 30 are removed for replacement. To maintain the normal pumping speed of the cryopump 100, individual adsorption assemblies 30 can also be replaced periodically. Therefore, the fusion device reduces the cost of replacing the cryopump 100 each time the pumping speed of the cryopump 100 decreases to the cost of replacing a single adsorption assembly 30, greatly improving economic efficiency.

[0074] A fusion device according to an embodiment of the present invention includes the cryopump 100 for a fusion device according to the above-described embodiment. Because the adsorption assembly 30 is detachably mounted on the cryopump body 10, the adsorption assembly 30 can be replaced independently, thereby reducing the maintenance cost of the cryopump 100 and, consequently, reducing the production cost of fusion energy, thereby improving the economic benefits of the fusion device. Furthermore, the adsorption assembly 30 can be replaced without stopping the fusion device, thereby maintaining the operating efficiency of the fusion device.

[0075] Other structures and operations of the cryopump 100 and the fusion device according to the embodiment of the present invention are well known to those skilled in the art and will not be described in detail here.

[0076] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0077] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A cryogenic pump for a fusion device, characterized in that: include: a cryopump body, the cryopump body defining an adsorption space, the cryopump body forming a first medium inlet communicating with the adsorption space; a valve assembly, the valve assembly being provided on the cryopump body and being used to open or close the first medium inlet; At least one adsorption assembly, at least a portion of which is disposed in the adsorption space, the adsorption assembly is used to adsorb gas in the adsorption space, and the adsorption assembly is detachably disposed on the cryopump body.

2. The cryopump for a fusion device according to claim 1, characterized in that: The cryopump body includes a housing defining the adsorption space, the housing forming a first medium inlet, and a mounting hole communicating with the adsorption space, through which the adsorption assembly is inserted into or removed from the adsorption space.

3. The cryopump for a fusion device according to claim 2, characterized in that: The adsorption components and the mounting holes are arranged in a one-to-one correspondence.

4. The cryopump for a fusion device according to claim 2, wherein: The housing has a first end wall and a second end wall, the first end wall and the second end wall are opposite and spaced apart, the adsorption space is located between the first end wall and the second end wall, the first end wall is formed with the first medium inlet, and the second end wall is formed with the mounting hole.

5. The cryopump for a fusion device according to claim 4, characterized in that: There are multiple adsorption components, and the multiple adsorption components are arranged in sequence along the circumference of the second end wall.

6. The cryopump for a fusion device according to any one of claims 1 to 5, characterized in that: The adsorption assembly includes: an adsorption structure, a cooling medium circuit pipe and a cooling medium inlet pipe. The adsorption structure is arranged in the adsorption space and forms a cooling medium flow channel. The cooling medium flow channel penetrates the adsorption structure along the axial direction of the cooling medium circuit pipe. The adsorption structure is fixed to the cooling medium circuit pipe. The cooling medium flow channel connects the cooling medium circuit pipe and the cooling medium inlet pipe.

7. The cryopump for a fusion device according to claim 6, characterized in that: The adsorption structure includes a plurality of adsorption plates, which are arranged around the cooling medium circuit pipe along a circumferential direction of the cooling medium circuit pipe, and each of the adsorption plates is formed with the cooling medium flow channel.

8. The cryopump for a fusion device according to claim 7, characterized in that: The adsorption assembly also includes: a connecting pipe, the connecting pipe, the adsorption structure and the cooling medium inlet pipe are arranged along the axial direction of the cooling medium loop pipe, the adsorption structure is located between the connecting pipe and the cooling medium inlet pipe, the connecting pipe connects the cooling medium loop pipe and the cooling medium flow channel, and the cooling medium flow channel connects the connecting pipe and the cooling medium inlet pipe.

9. The cryopump for a fusion device according to claim 7, characterized in that: The adsorption plate is an arc-shaped structure.

10. The cryopump for a fusion device according to claim 6, wherein: The adsorption assembly further includes: a mounting portion, wherein the mounting portion and the adsorption structure are arranged along the axial direction of the cooling medium loop pipe, the cooling medium loop pipe and the cooling medium inlet pipe are both fixed to the mounting portion, and the mounting portion is detachably provided on the cryopump body.

11. The cryopump for a fusion device according to claim 10, wherein: The cooling medium inflow pipe includes: a first pipe body and a second pipe body connected to each other, the first pipe body is arranged in the mounting portion along the axial direction of the cooling medium loop pipe, the second pipe body is located on the side of the mounting portion away from the adsorption structure, the first pipe body connects the second pipe body and the cooling medium flow channel, and the second pipe body forms a second medium inlet.

12. The cryopump for a fusion device according to claim 11, characterized in that: There are multiple cooling medium flow channels, and the multiple cooling medium flow channels are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. There are multiple first tube bodies, and the multiple first tube bodies are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. The multiple first tube bodies and the multiple cooling medium flow channels are connected one-to-one.

13. The cryopump for a fusion device according to any one of claims 1 to 5, characterized in that: The cryopump body includes a cold shield having an annular structure and disposed in the adsorption space. The cold shield is sleeved on the adsorption assembly and spaced apart from the adsorption assembly.

14. The cryopump for a fusion device according to claim 13, wherein: The cryopump body further includes a radiation baffle, which is arranged in the adsorption space, and the cold shield is sleeved on the radiation baffle.

15. The cryopump for a fusion device according to claim 14, characterized in that: The adsorption assembly is located between the radiation baffle and the cold screen.

16. The cryopump for a fusion device according to claim 14, wherein: The cryopump body further includes: a heat exchange pipeline, at least a portion of which is disposed in the adsorption space, the heat exchange pipeline being in contact with both the cold screen and the radiation baffle, and the heat exchange pipeline being in heat exchange cooperation with both the cold screen and the radiation baffle.

17. A fusion device, characterized in that: The invention comprises a cryogenic pump for a fusion device according to any one of claims 1 to 16.

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