High-pressure-resistant low-power-consumption temperature and pressure sensor of aircraft landing gear buffer

Abstract

The invention discloses a high-pressure-resistant low-power-consumption temperature and pressure sensor of an aircraft landing gear buffer, and particularly relates to the field of aircraft measuring equipment. Comprising a shell internally provided with a first channel, one end of the first channel is provided with an inflation connector, an inflation assembly is arranged in the first channel, and an air inlet of the inflation assembly is located at the inflation connector; the pressure core body is located in the shell, the shell is further provided with a pressure sensing cavity, and the pressure sensing cavity communicates with the air inlet of the pressure core body and the first channel; the adapter is connected with the other end of the shell, and a second channel is formed in the adapter; the near end of the temperature measuring probe is fixed in the shell, and an included angle of 135 degrees is formed between the near end and the far end; and the temperature and pressure acquisition module is fixed on the side wall of the shell and is respectively connected with the pressure core body and the temperature measurement probe. Based on the device, the inflation sub-interface function of the undercarriage strut buffer and the pressure and temperature real-time measurement function of mixed gas can be integrated.

Description

Technical Field

[0001] The present application relates to the field of aircraft measurement equipment, and in particular to a high-pressure-resistant, low-power aircraft landing gear buffer temperature and pressure sensor. Background Art

[0002] Current aircraft design trends toward miniaturization, integration, and intelligence. The integration and balancing of multiple product functions have become key principles in aircraft miniaturization. Dual-chamber landing gear buffers, designed with structural strength in mind, can effectively address the stress and deformation issues inherent in landing gear buffers. These dual-chamber buffers feature high-pressure and low-pressure chambers, which exchange heat between gas and oil through a heat exchange system. Monitoring the oil pressure and temperature during this process is crucial to the buffer's reliability. This functionality also requires ensuring that the gas in the high- and low-pressure chambers maintains its rated pressure. Currently, most aircraft landing gear buffers utilize separate devices for temperature and pressure detection and inflation, primarily through temperature and pressure sensors and inflation valves. The challenge facing miniaturized sensors with integrated temperature and pressure detection and inflation functions lies not in temperature and pressure acquisition and detection, but in ensuring reliability and sealing under long-term high-pressure pulse conditions.

[0003] Existing sensors measure the buffer pressure and oil level using a pressure sensor on the buffer's air chamber inflation valve and a level sensor for the oil level. This allows for pressure monitoring of the landing gear buffer's high and low pressure chambers, and determines the buffer's status based on the voltage signals transmitted by the sensors. This sensor, which monitors buffer pressure using two sensors, has a low level of integration. The buffer still requires three mounting points at the inflation port of the landing gear strut: providing mechanical interfaces for the pressure sensor, level sensor, and inflation valve. This makes it unsuitable for today's highly integrated aircraft. Summary of the Invention

[0004] The main purpose of this application is to provide a high-pressure-resistant, low-power aircraft landing gear buffer temperature and pressure sensor, aiming to solve the problem of low integration of existing sensors.

[0005] To achieve the above objectives, the present application provides a high-pressure-resistant, low-power aircraft landing gear buffer temperature and pressure sensor, comprising: a housing having a first channel defined therein, an inflation interface provided at one end of the first channel, an inflation assembly provided within the first channel, an air inlet of the inflation assembly located at the inflation interface; a pressure core located within the housing and perpendicular to the first channel, a PIN pin of the pressure core extending out of the housing, and a pressure-sensing cavity defined in the housing, the pressure-sensing cavity being connected to the air inlet of the pressure core and the first channel, respectively; an adapter connected to the other end of the housing, a second channel defined therein, the second channel being connected to the first channel; a temperature probe having a proximal end fixed within the housing, the proximal end and the distal end forming an angle of 135°, the distal end extending out of the housing along the first and second channels; a temperature and pressure acquisition module fixed to a side wall of the housing, the temperature and pressure acquisition module being connected to the pressure core and the temperature probe, respectively; the temperature and pressure acquisition module being configured to power the pressure core and the temperature probe, and to convert pressure voltage signals and temperature voltage signals collected by the pressure core and the temperature probe to obtain pressure current signals and temperature current signals.

[0006] Optionally, a protrusion is connected to one side of the shell, and the protrusion is located between the pressure core and the inflation interface. One side of the protrusion forms an inclined surface, and a groove adapted to the socket is opened inward along the inclined surface.

[0007] Optionally, the temperature and pressure acquisition module includes: an acquisition and transmission circuit, the input end of which is connected to the pressure core and the temperature probe, and is used to collect and condition the differential voltage signals collected by the pressure core and the temperature probe, and perform voltage-to-current conversion to obtain a current signal; a power supply processing circuit, the output end of which is connected to the pressure core, the temperature probe and the acquisition and transmission circuit, and is used to filter the power supply of the aircraft and power the acquisition and transmission circuit and the pressure core.

[0008] Optionally, the acquisition and sending circuit includes: a programmable sensor regulator chip, the input end of which is connected to the pressure core and the temperature probe, and is used to collect and condition the differential voltage signals collected by the pressure core and the temperature probe to obtain a voltage signal; a current output chip, the input end of which is connected to the programmable sensor regulator chip, and is used to convert the voltage signal to obtain a current signal.

[0009] Optionally, the model of the programmable sensor regulator chip is HKA2921.

[0010] Optionally, a low-pass filter is connected between the input end of the programmable sensor regulator chip and the output pin of the pressure core.

[0011] Optionally, the power supply processing circuit includes a TVS tube, an anti-reverse connection circuit, a filter recommendation circuit and a DC-DC module connected in sequence; wherein, the input end of the TVS tube is connected to the power supply output end of the aircraft, and the output end of the DC-DC module is respectively connected to the acquisition and transmission circuit and the pressure core.

[0012] Compared with the prior art, the present invention has the following advantages: The temperature and pressure sensor of the low-power aircraft landing gear buffer with high pressure resistance of the present invention is provided with an air duct arranged in the shell, an air filling interface is provided at one end, and the air filling component is placed in the air duct, a pressure core is installed in the shell, and the air duct and the pressure core are connected through the pressure-sensing cavity on the shell to realize pressure measurement. At the same time, a temperature probe is installed in the shell to realize temperature measurement, thereby integrating the air filling sub-interface function of the landing gear strut buffer and the real-time measurement function of the pressure and temperature of the mixed gas, thereby improving integration; temperature and pressure measurement are realized by the armored Pt100 temperature probe and the sputtered film pressure core, and the pressure core is resistant to The pressure is 70MPa and the measuring range is (0-45)MPa, which increases the pressure measurement range of the temperature sensor and has the characteristics of small temperature drift, high precision, and resistance to high-overload pressure shock, thereby increasing the service life; the shape setting of the temperature measuring probe has a remote temperature measurement function and shortens the temperature response time; a DC-DC module is added to the temperature and pressure acquisition module for synchronous step-down, and a DC-DC module with a conversion efficiency of more than 90% is used. In the power consumption distribution, the current loop ratio is set to 85%, and the power consumption of the temperature and pressure acquisition module is controlled to 83% of the required power consumption, thereby reducing the power consumption of the temperature and pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a temperature and pressure sensor for a low-power aircraft landing gear buffer that is resistant to high pressure; Figure 2 for Figure 1 sectional view of Figure 3 for Figure 1 Schematic diagram of the structure of the medium pressure core; Figure 4 This is an overall diagram of a temperature and pressure sensor for a low-power aircraft landing gear buffer that is resistant to high pressure; Figure 5 for Figure 1 Schematic diagram of the structure of the inflatable component; Figure 6 for Figure 1 Schematic diagram of the functional modules of the medium temperature and pressure acquisition module.

[0014] Figure 7 for Figure 1 side view.

[0015] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0016] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0017] The first embodiment of the present invention provides a temperature and pressure sensor for a low power aircraft landing gear buffer with high pressure resistance, such as Figure 1-2 As shown, it includes a shell 1, a pressure core 2, an adapter 3, a temperature measuring probe 4 and a temperature and pressure acquisition module 5; wherein, a first channel is opened in the shell 1, an inflation interface is set at one end of the first channel, an inflation component 6 is set in the first channel, and the air inlet of the inflation component 6 is located at the inflation interface; the pressure core 2 is located in the shell 1 and is perpendicular to the first channel, the PIN needle of the pressure core 2 extends out of the shell 1, and the shell 1 also has a pressure sensing cavity 8, which connects the air inlet of the pressure core 2 and the first channel; the adapter 3 is connected to the other end of the shell 1, and the adapter 3 has an opening A second channel is provided, which is connected to the first channel to form an airway; the proximal end of the temperature probe 4 is fixed in the shell 1, the proximal end and the distal end form an angle of 135°, and the distal end extends out of the shell 1 along the first channel and the second channel; the temperature and pressure acquisition module 5 is fixed on the outer wall of the shell 1, and the temperature and pressure acquisition module 5 is respectively connected to the pressure core 2 and the temperature probe 4; the temperature and pressure acquisition module 5 is used to power the pressure core 2 and the temperature probe 4, and convert the pressure voltage signal and the temperature voltage signal collected by the pressure core 2 and the temperature probe 4 to obtain a pressure current signal and a temperature current signal.

[0018] In this embodiment, the gas is connected to the gas source through the inflation interface to allow gas to enter the inflation component 6, the adapter 3 is connected to the aircraft landing gear buffer, and the gas in the inflation component 6 passes through the first channel and the second channel to serve as the landing gear strut buffer; at the same time, the gas enters the pressure core 2 through the pressure sensing chamber 8 to realize pressure collection; and the temperature probe 4 contacts the aircraft landing gear buffer to realize temperature measurement.

[0019] Exemplarily, the shell 1 is a solid structure, and a mounting groove 9 for the pressure core 2 is opened inward along one side wall of the shell 1. The pressure core 2 is located in the mounting groove 9, and the mounting groove 9 is connected to the pressure sensing cavity 8. The PIN needle extends out of the shell 1 and is connected to the temperature and pressure acquisition module 5 through the output lead; a positioning groove 10 adapted to the proximal end of the temperature probe 4 is opened along the side wall of the first channel, and the proximal end of the temperature probe 4 is located in the positioning groove 10, and the distal end extends out of the shell 1 along the first channel and the second channel, and can directly contact the medium to be measured, thereby avoiding the influence of the adiabatic air field and blind cavity design on the temperature response time.

[0020] like Figure 3 As shown, the pressure core 2 in this embodiment is obtained by replacing the silicon film of the existing pressure core with a sputtered film. The other structures are the same as those of the conventional pressure core 2, and other structures will not be repeated here. The sputtered film pressure core 2 has a pressure resistance of 70MPa and a measurement range of (0-45)MPa, which is much higher than the 25MPa pressure measurement range proposed by the temperature and pressure sensor in the prior art. The pressure core 2 is miniaturized. The maximum outer diameter of the pressure core 2 in this embodiment is 14.5mm and the height is 8.5mm. Within the use range of the pressure resistance of 70MPa, this size is smaller than the pressure core 2 in the prior art. The air pressure in the airway is transmitted to the sensitive chip through the pressure-sensitive diaphragm and a voltage signal in the mV level is output. The pressure core 2 adopts 05Cr 17 Ni4Cu4Nb precipitation hardened stainless steel is laser welded in the mounting groove of the shell 1, with a laser welding penetration of 2mm. The pressure core 2 material and welding requirements mentioned above ensure that the connection structure of the pressure core 2 will not be damaged when subjected to a burst pressure of 113MPa. The proximal end of the temperature probe 4 is connected to the temperature and pressure acquisition module 5 via an output lead. The temperature probe 4 is used to sense the gas temperature at the port of the shell 1, so that the distal end of the temperature probe 4 is in direct contact with the measured medium, avoiding the influence of the adiabatic air field and blind cavity design on the temperature response time. The temperature probe 4 is armored with Pt100, and the structure of the end welding is 05Cr 17 Ni4Cu4Nb precipitation hardened stainless steel, the outer diameter of the temperature probe 4 is 6mm, and the temperature response time is 7s. The armored packaging structure is welded by manual laser beam welding, and the two sections of the packaging shell 1 are encapsulated and polished to achieve a smooth transition.

[0021] A bump 7 is connected to one side of the shell 1. The bump 7 is located between the pressure core 2 and the inflation interface. One side of the bump 7 forms an inclined surface, and a groove 11 adapted to the socket is provided inward along the inclined surface. It can be understood that the socket is suitable for connecting a socket to a mounting panel. After installation, the angle between the mounting panel and the inflation interface of the shell 1 is 30°, which can be used for temperature and pressure detection of the aircraft dual-chamber landing gear buffer, so that the temperature and pressure sensors of the dual-chamber installation of the buffer with a smaller distribution distance do not interfere with each other. The upper end of the shell 1 is a circular ring structure with an inner diameter of 24mm and an outer diameter of 28mm. The circular ring structure is adapted to the connection between the socket and the mounting panel, making it easy to put into the socket. Two symmetrical through holes with a diameter of 1.3mm are set on the circular ring wall as pin mounting holes. Exemplarily, the socket has four pins, with pin 1 connected to the input pin of the power processing circuit, pin 2 to GND, pin 3 to the pressure-regulated output pin of the programmable sensor regulator chip, and pin 4 to the temperature-regulated output pin of the voltage-output programmable sensor regulator chip, providing a 4mA to 20mA pressure and temperature signal to the host computer. Furthermore, the socket also includes a sleeve 12, which fits over the exterior of the housing 1 and is located between the adapter 3 and the bump 7. This sleeve 12 encapsulates the pressure core 2 and temperature and pressure acquisition module 5, providing a secure, sealed, and supported position.

[0022] For example, the air inlet end of the adapter 3 is an M16 threaded structure, and the interior of the adapter 3 includes an air channel with a diameter of 8 mm and a second channel formed by an air channel with a diameter of 19 mm. The shell 1 and the adapter 3 are fixed by laser welding. According to the 113MPa bursting pressure requirement and the 45MPa working pressure requirement, pins are added to the laser welding position of the shell 1 and the adapter 3, and the pins are fixed for a second time by laser welding in the form of spot welding. According to calculations, the pressure at the shell 1 and the adapter 3 is as high as 50KN, and the double fixing form can meet the high-pressure conditions of the landing gear. In addition, if Figure 4 As shown, the air inlet end cover of the adapter 3 is provided with a cap 13. The cap 13 adopts a standard dustproof cap structure, but with an additional anti-lost ring structure. The anti-lost ring is connected to the through hole of the shell 1 via a chain. This prevents the cap 13 from being lost after being removed when the aircraft landing gear strut is inflated. In this embodiment, the shell 1, adapter 3, shell 12 and cap 13 are all made of 05Cr 15 Ni5Cu4Nb precipitation-hardened stainless steel, with excellent high-temperature and corrosion resistance, is compatible with the nitrogen and aviation No. 15 hydraulic fluid within the landing gear strut buffer cavity. Laser welding is used for secure connection. Based on high-pressure requirements, strength calculations, and weld quality requirements, it was determined that a laser weld penetration depth of 2mm can meet a 113MPa blast pressure.

[0023] Further, such as Figure 5As shown, the inflation component 6 adopts a standard cold air high-pressure valve inflation structure, which consists of a straight rod 61, a washer 62, a pin 63, a cone 64, a spring 65, a guide 66 and a nut 67. The straight rod 61 is located at the end of the first channel away from the second channel. When the inflation pressure is greater than the force of the spring 65, the straight rod 61 drives the washer 62 and the cone 64 to move downward, forming an annular gap to realize the inflation function. After the pressure is released, the straight rod automatically returns to its position due to the spring force to form a seal, and the inflation is stopped. The inflation component 6 is locked and stopped by the protective nut 67. It can be used for the inflation of 40MPa high-pressure cold air. This embodiment optimizes the adaptability of the inflation component 6 of the standard structure, improves the spring strength and stiffness, changes the spring material, and changes the 70E group steel wire in the standard to 65MnSiA, so that the number of working times of the spring is increased from 103 times to 105 times. Effectively increase the number of working times of the product. At the same time, the initial compression of the spring proposed in the standard structure is adjusted from 0mm proposed in the standard to 0.5mm to ensure that the temperature and pressure sensor does not leak under low pressure.

[0024] like Figure 6 As shown, the temperature and pressure acquisition module 5 includes an acquisition and transmission circuit and a power supply processing circuit, such as Figure 7 As shown, the acquisition and transmission circuit and the power supply processing circuit are respectively fixed on both sides of the shell 1 through mounting platforms 14, and each side includes two mounting platforms 14. The acquisition and transmission circuit or the power supply processing circuit is fixed through the two mounting platforms 14; the input end of the acquisition and transmission circuit is connected to the pressure core 2 and the temperature probe 4, and is used to collect and condition the differential voltage signals collected by the pressure core 2 and the temperature probe 4, and perform voltage-current conversion to obtain a current signal, that is, to achieve temperature compensation of the pressure core 2 and signal amplification, correction and conversion of the armored Pt100 temperature probe 4; the output end of the power supply processing circuit is connected to the pressure core 2, the temperature probe 4 and the acquisition and transmission circuit, and is used to filter the power supply of the aircraft and power the acquisition and transmission circuit and the pressure core 2.

[0025] The acquisition and transmission circuit includes a programmable sensor regulator chip and a current output chip. The programmable sensor regulator chip model is HKA2921. The input of the programmable sensor regulator chip is connected to the pressure core 2 and the temperature probe 4. It is used to collect and condition the differential voltage signal collected by the pressure core 2 and the temperature probe 4 to obtain a voltage signal. Specifically, the programmable sensor regulator chip collects and conditions the collected differential voltage signal and provides zero calibration, range setting, zero drift, range drift, and digital calibration of sensor linearization error, with an adjustable response speed range. The input of the current output chip is then connected to the programmable sensor regulator chip to convert the voltage signal and output a 4mA to 20mA signal. A low-pass filter is connected between the input of the programmable sensor regulator chip and the output pin of the pressure core 2. The low-pass filter network consists of common-mode and differential-mode components, with the filter cutoff frequencies set to 19.3Hz and 406Hz. This solves the problem of pressure input signal interference from the pressure core 2 in the acquisition and transmission circuit and improves output accuracy.

[0026] The power supply processing circuit includes a TVS tube, an anti-reverse connection circuit, a filter recommendation circuit and a DC-DC module connected in sequence; it is used to filter the 28VDC power supply of the aircraft and realize the power supply to the acquisition and transmission circuit and the core component pressure core 2. Among them, the input end of the TVS tube is connected to the power supply output end of the aircraft, and the output end of the DC-DC module is connected to the acquisition and transmission circuit and the pressure core 2 respectively. The DC-DC module can use a DC-DC module with a conversion efficiency higher than 90%. In terms of power consumption distribution, the current loop ratio is set to 85%, and the power consumption of the temperature and pressure acquisition module 5 is controlled to be 83% of the required power consumption, reserving a design margin for the power supply load characteristic test of the temperature and pressure sensor with a single power supply.

[0027] Specifically, the aircraft's 28V DC power supply passes through a TVS tube and an anti-reverse polarity circuit, undergoes electromagnetic processing through a filtering processing circuit, and then undergoes synchronous voltage reduction through a DC-DC module for power consumption processing. Finally, the processed voltage is input into the acquisition and transmission circuit to provide power for temperature and pressure conditioning. The power supply for pressure conditioning also needs to provide a 2-10V power supply to the pressure core 2, and the pressure signal is obtained through the Wheatstone full bridge within the pressure core 2. The anti-reverse polarity circuit is mainly composed of Schottky diodes. By connecting a Schottky diode in series at the power input end, the power supply is protected against reverse current, preventing reverse current from entering the circuit and protecting the back-end acquisition and transmission circuit. The recommended filtering circuit mainly consists of a common-mode choke and a series-mode choke to prevent external electromagnetic interference with the operation of the temperature and pressure acquisition module 5, while also suppressing the electromagnetic interference generated by the temperature and pressure acquisition module 5 itself.

[0028] The output accuracy of the temperature and pressure sensor of this embodiment was tested, as shown in Table 1.

[0029] Table 1 Pressure and accuracy collected by the pressure core at different temperatures

[0030] In the table above, pressure refers to data directly collected by the pressure core, and output refers to the output current after processing by the temperature acquisition module. In this embodiment, the accuracy of the pressure core 2 over the entire temperature range can reach within ±0.25%FS, and the hysteresis is within ±0.15%FS. As can be seen from Table 1, after compensation and conditioning by the voltage output programmable sensor regulator chip, it can reach ±0.1%FS. Compared to the acquisition accuracy of temperature and pressure sensors in the prior art, the pressure output accuracy of the present invention can meet 0.1%FS. In addition, by constructing an interpolation coefficient table in the chip within the acquisition and transmission circuit, the temperature is divided into 17 segments, and a set of coefficient tables for zero range changes with temperature are constructed to achieve temperature compensation, so that the temperature output accuracy within the (-55-100)°C temperature range is no more than 0.7%FS.

[0031] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature and pressure sensor for a low-power aircraft landing gear buffer with high pressure resistance, characterized in that: include: The housing has a first channel formed therein, an inflation interface being provided at one end of the first channel, an inflation component being provided in the first channel, and an air inlet of the inflation component being located at the inflation interface; A pressure core is located in the housing and is perpendicular to the first channel. A PIN pin of the pressure core extends out of the housing. The housing further defines a pressure-sensing cavity, which is in communication with the air inlet of the pressure core and the first channel, respectively. an adapter connected to the other end of the housing, wherein a second channel is defined in the adapter, the second channel being in communication with the first channel; a temperature measuring probe, the proximal end of which is fixed in the housing, the proximal end and the distal end of which form an angle of 135°, and the distal end of which extends out of the housing along the first channel and the second channel; A temperature and pressure acquisition module is fixed on the side wall of the housing and is connected to the pressure core and the temperature probe respectively; The temperature and pressure acquisition module is used to power the pressure core and the temperature probe, and convert the pressure voltage signal and the temperature voltage signal collected by the pressure core and the temperature probe to obtain a pressure current signal and a temperature current signal.

2. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 1, characterized in that: A convex block is connected to one side of the shell, and the convex block is located between the pressure core and the inflation interface. One side of the convex block forms an inclined surface, and a groove adapted to the socket is opened inwardly along the inclined surface.

3. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 1, characterized in that: The temperature and pressure acquisition module includes: The acquisition and transmission circuit has an input end connected to the pressure core and the temperature probe, and is used to collect and condition the differential voltage signals collected by the pressure core and the temperature probe, and perform voltage-current conversion to obtain a current signal; The power supply processing circuit has an output end connected to the pressure core, the temperature measuring probe and the acquisition and transmission circuit, and is used to filter the power supply of the aircraft and supply power to the acquisition and transmission circuit and the pressure core.

4. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 3, characterized in that: The acquisition and transmission circuit includes: A programmable sensor regulator chip, the input end of which is connected to the pressure core and the temperature probe, is used to collect and condition the differential voltage signals collected by the pressure core and the temperature probe to obtain a voltage signal; The current output chip has an input end connected to the programmable sensor regulator chip and is used to convert the voltage signal to obtain a current signal.

5. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 4, characterized in that: The model of the programmable sensor regulator chip is HKA2921.

6. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 4, characterized in that: A low-pass filter is connected between the input end of the programmable sensor regulator chip and the output pin of the pressure core.

7. The temperature and pressure sensor for a high-pressure-resistant, low-power aircraft landing gear buffer according to claim 3, characterized in that: The power supply processing circuit includes a TVS tube, an anti-reverse connection circuit, a filter recommendation circuit and a DC-DC module connected in sequence; The input end of the TVS tube is connected to the power supply output end of the aircraft, and the output end of the DC-DC module is connected to the collection and transmission circuit and the pressure core respectively.

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