Power-off method and device, server and readable storage medium

Abstract

The invention relates to a power-off method and device, a server and a readable storage medium. The method is applied to a mainboard logic device and comprises the following steps: sending a power-off signal to a module logic device in a target functional module, indicating the module logic device to control a functional chip in the target functional module to be powered off, and controlling the target functional module to be powered off under the condition that the power-off of the functional chip is completed. By adopting the method, in the power-off process of each functional module, the power-off time sequence of each functional module in the server can be controlled to be synchronous with the power-off time sequence of the mainboard, so that the problem that the external power supply is suddenly powered off due to the fact that the internal power-off of each functional module is not completed, and the functional chip in each functional module is damaged is solved; therefore, the service life of each functional chip in each functional module can be prolonged, the service life of each functional module can be further prolonged, and the maintenance cost of each functional module can be reduced.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a power-off method, device, server, and readable storage medium. Background Art

[0002] With the development of computer technology, servers are widely used in various fields. In actual applications, the power supply module in the server will power various functional modules inside or outside the server, and control the power-on and power-off timing of different functional modules through the logic devices on the server's mainboard.

[0003] Taking the power-off sequence of different functional modules as an example, in the related art, the mainboard logic device mainly controls the power-off of different functional modules in sequence according to the fixed power-off intervals of different functional modules.

[0004] However, in the related art, when controlling the power-off of different functional modules, there is a problem that the functional chips in each functional module may be damaged. Summary of the Invention

[0005] Based on this, it is necessary to provide a power-off method, device, server and readable storage medium to address the above technical problems, which can avoid damage to the functional chips in each functional module when controlling the power-off of different functional modules.

[0006] In a first aspect, an embodiment of the present application provides a power-off method, which is applied to a mainboard logic device. The method includes:

[0007] Sending a power-off signal to a module logic device in a target functional module, instructing the module logic device to control the functional chip in the target functional module to power off;

[0008] When the functional chip is powered off, the target functional module is controlled to be powered off.

[0009] The technical solution in the embodiment of the present application sends a power-off signal to the module logic device in the target functional module, instructing the module logic device to control the power-off of the functional chip in the target functional module, and controls the power-off of the target functional module when the power-off of the functional chip is completed; during the power-off process of each functional module, the above method can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, avoiding the problem of sudden external power failure when the internal power-off of each functional module is not completed, which causes damage to the functional chip in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and also reducing the maintenance cost of each functional module.

[0010] In one embodiment, when the functional chip is powered off, controlling the functional module to power off includes:

[0011] In response to the chip power-off completion signal fed back by the module logic device; the chip power-off completion signal is triggered when the functional chip is powered off;

[0012] According to the power-off sequence of at least one module power rail corresponding to the target functional module, the power-off of each module power rail is controlled.

[0013] The technical solution in the embodiment of the present application responds to the chip power-off completion signal fed back by the module logic device and controls the power-off of each module power rail according to the power-off timing of at least one module power rail corresponding to the target functional module, wherein the chip power-off completion signal is triggered when the power-off of the functional chip is completed; the above method can control the power-off of each module power rail corresponding to the functional module when the power-off of the functional chip in the functional module is completed, thereby controlling the synchronization of the power-off timing of each functional module in the server with the power-off timing of the mainboard, and avoiding the problem of damage to each functional chip in each functional module during the power-off process of each functional module.

[0014] In one embodiment, each module power rail is connected to a power supply module; and controlling the power-off of each module power rail according to a power-off timing of at least one module power rail corresponding to a target functional module includes:

[0015] According to the power-off sequence of each power supply module, a module power-off signal is sent to each power supply module respectively, instructing each power supply module to turn off the corresponding module power rail.

[0016] The technical solution in the embodiment of the present application sends a module power-off signal to each power supply module according to the power-off timing of each power supply module, instructing each power supply module to turn off the corresponding module power rail; the above method can control the power-off of each power supply module corresponding to the target functional module to turn off the module power rail corresponding to the target functional module after the functional chip in the functional module is powered off. This controls the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, and can avoid the problem of damage to each functional chip in each functional module during the power-off process of each functional module; at the same time, the above method controls the power-off of each power supply module corresponding to the functional module according to the power-off timing of each power supply module, thereby ensuring that the overall functional module can be powered off normally and avoiding affecting the subsequent power-off of other functional modules.

[0017] In one embodiment, the method further includes:

[0018] Receive the module rail shutdown signal sent by each power supply module to determine whether the target functional module has been powered off; the module rail shutdown signal is triggered when the power off of each module rail is completed.

[0019] The technical solution in the embodiment of the present application receives the module rail shutdown signal sent by each power supply module, determines that the target functional module has been powered off, and the module rail shutdown signal is triggered when the power off of each module rail is completed; after each power supply module that supplies power to the functional module shuts down the corresponding module rail, the above method can receive the module rail shutdown signal sent by each power supply module, determine that the functional module has been powered off, and thus can timely control the power off of other functional modules, speed up the power off speed of the entire server, and shorten the power off time of the server.

[0020] In a second aspect, an embodiment of the present application provides a power-off method, which is applied to a module logic device in a functional module. The method includes:

[0021] Responding to a power-off signal sent by a logic device on the mainboard;

[0022] Power off the functional chips in the control function module;

[0023] When the power-off of the functional chip is completed, a chip power-off completion signal is sent to the mainboard logic device, instructing the mainboard logic device to control the power-off of the functional module.

[0024] The technical solution in the embodiment of the present application controls the power-off of the functional chip in the functional module in response to the power-off signal sent by the mainboard logic device, and sends a chip power-off completion signal to the mainboard logic device when the power-off of the functional chip is completed, instructing the mainboard logic device to control the power-off of the functional module; during the power-off process of each functional module, the above method can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, thereby avoiding the problem of sudden external power failure when the internal power-off of each functional module is not completed, which causes damage to the functional chip in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and also reducing the maintenance cost of each functional module.

[0025] In one embodiment, controlling the power-off of a functional chip in a functional module includes:

[0026] According to the power-off timing of at least one chip power rail corresponding to the functional chip, the power-off of each chip power rail is controlled.

[0027] The technical solution in the embodiment of the present application can control the power-off of each chip power rail according to the power-off timing of at least one chip power rail corresponding to the functional chip, so as to ensure that the functional chip in the functional module can be powered off normally and avoid affecting the overall power-off of the functional module.

[0028] In a third aspect, an embodiment of the present application provides a power-off device, the device comprising:

[0029] A sending module, configured to send a power-off signal to a module logic device in a target functional module, instructing the module logic device to control the functional chip in the target functional module to power off;

[0030] The control module is used to control the target functional module to power off when the functional chip is powered off.

[0031] In a fourth aspect, an embodiment of the present application provides a power-off device, the device comprising:

[0032] A response module, configured to respond to a power-off signal sent by a logic device on the mainboard;

[0033] A control module, used to control the power-off of the functional chips in the functional modules;

[0034] The sending module is used to send a chip power-off completion signal to the mainboard logic device when the functional chip is powered off, instructing the mainboard logic device to control the functional module to power off.

[0035] In a fifth aspect, an embodiment of the present application provides a server, comprising: at least one power supply module and a mainboard logic device, the mainboard logic device being connected to a module logic device in a functional module, each power supply module being communicatively connected to the mainboard logic device, and each power supply module being electrically connected to the functional module;

[0036] Each power supply module is used to supply power to each functional module;

[0037] A mainboard logic device, configured to execute the steps of the method of any one of the embodiments of the first aspect above;

[0038] A modular logic device, used to execute the steps of the method of any embodiment in the second aspect above.

[0039] The server in the embodiment of the present application includes: at least one power supply module and a mainboard logic device, the mainboard logic device is connected to the module logic device in at least one functional module, each power supply module is communicatively connected to the mainboard logic device, and each power supply module is electrically connected to each functional module, wherein each power supply module is used to supply power to each functional module, and the mainboard logic device and each module logic device are used to execute the steps in the above-mentioned power-off method embodiment; during the power-off process of each functional module, the main logic device in the above-mentioned scheme can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, so as to avoid the problem of sudden external power failure before the internal power-off of each functional module is completed, which causes damage to the functional chips in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and reducing the maintenance cost of each functional module.

[0040] In one embodiment, the functional module is disposed outside the server.

[0041] In the technical solution of the embodiment of the present application, the functional module can be set outside the server. When the power supply modules in the server supply power to the peripheral functional modules, the normal operation of the functional modules can be guaranteed, thereby improving the use scenarios of the functional modules.

[0042] In one embodiment, the server further includes: a processor, the processor being communicatively connected to the mainboard logic device;

[0043] The processor is used to send a shutdown signal to the mainboard logic device after receiving the mainboard shutdown instruction, and instruct the mainboard logic device to send a power-off signal to the module logic device.

[0044] According to the technical solution in the embodiment of the present application, the server also includes a processor, which is communicatively connected to the mainboard logic device. The processor is used to send a shutdown signal to the mainboard logic device after receiving the mainboard shutdown command, instructing the mainboard logic device to send a power-off signal to the module logic device; in the above solution, the processor in the server can respond to the mainboard shutdown command in a timely manner to instruct the mainboard logic device to control the module logic device to power off, thereby speeding up the power-off speed of the entire server.

[0045] In a sixth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a mainboard logic device and a module logic device, the steps of the method of any one of the embodiments of the first and second aspects above are implemented.

[0046] In the seventh aspect, an embodiment of the present application further provides a computer program product, which includes a computer program, and when the computer program is executed by the mainboard logic device and the module logic device, it implements the steps of the method of any embodiment of the first and second aspects above.

[0047] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a diagram of an application environment of a power-off method in one embodiment;

[0049] Figure 2 1 is a flow chart of a power-off method in one embodiment;

[0050] Figure 3 is a flowchart of a power-off method in another embodiment;

[0051] Figure 4 is a flowchart of a power-off method in another embodiment;

[0052] Figure 5 This is a structural block diagram of a power-off device in one embodiment;

[0053] Figure 6 is a structural block diagram of a power-off device in another embodiment;

[0054] Figure 7 FIG. 4 is a diagram showing the internal structure of a server in one embodiment. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0056] In the server field, in actual applications, the power supply module in the server will supply power to various functional modules installed inside or plugged in to the server, and control the power-on and power-off timing of different functional modules through the mainboard logic device in the server to power on and off each functional module. Taking the power-off timing of different functional modules as an example, in the related art, the mainboard logic device in the server mainly controls the power-off of different functional modules in sequence according to the fixed power-off intervals of different functional modules. However, in the related art, the power-off of different functional modules is directly controlled, and there is a problem of damage to the functional chips in each functional module. Based on this, the embodiment of the present application provides a power-off method, which can avoid damage to the functional chips in each functional module when controlling the power-off of different functional modules.

[0057] The power-off method provided in the embodiment of the present application can be applied to Figure 1The application environment diagram shown. The application environment includes a server and at least one functional module. The server includes a mainboard logic device and at least one power supply module. Each functional module includes a corresponding functional chip and module logic device. Each functional module can be set inside the server or outside the server. When the functional module is set outside the server, it can be connected to the server in an external plug-in manner. Optionally, the mainboard logic device and each module logic device are all communication-connected, each power supply module and the mainboard logic device are all communication-connected, and at least one power supply module is electrically connected to each functional module. Optionally, the above-mentioned mainboard logic device and module logic device can both be field programmable gate arrays (FPGA), but in the embodiment of the present application, the above-mentioned mainboard logic device and module logic device can both be complex programmable logic devices (CPLD).

[0058] Alternatively, the functional module may be a graphics processing unit (GPU) chip, an FPGA chip, a digital signal processing (DSP) chip, etc. However, in the embodiment of the present application, the functional module may be a deep computing unit (DCU) chip. The following embodiment describes the specific process of the power-off method using the mainboard logic device and the module logic device in any functional module of the server as the execution subjects of the power-off method.

[0059] like Figure 2 FIG. 1 is a flow chart of a power-off method provided in an embodiment of the present application. The method is applied to a mainboard logic device in a server. The method can be implemented by the following steps:

[0060] S101: Send a power-off signal to a module logic device in a target functional module, instructing the module logic device to control the functional chip in the target functional module to power off.

[0061] Specifically, after receiving a shutdown signal from the server's processor (i.e., central processing unit (CPU)), the server's mainboard logic device can begin powering off each functional module within or external to the server, powering off each module sequentially according to their respective power-off sequences to complete the entire server power-off. The target functional module can be any of all functional modules within or external to the server.

[0062] In practical applications, each functional module may include a corresponding functional chip. In the embodiment of the present application, when each functional module is powered off, in order to avoid damage to the functional chips in each functional module, when any functional module is powered off, the power-off sequence of the functional module in the server can be controlled to be synchronized with the power-off sequence of the mainboard, that is, the functional chip in the functional module is powered off first, and then the functional module is powered off. It should be noted that the power-off sequence of the above-mentioned different functional modules can be flexibly set and is not fixed; at the same time, the power-off sequence of different functional modules can be the same or different.

[0063] Correspondingly, during the power-off process of each functional module, when the mainboard logic device starts to control the power-off of the target functional module, the mainboard logic device can first send a power-off signal to the module logic device in the target functional module, instructing the module logic device to control the power-off of the functional chip in the target functional module.

[0064] S102 : When the functional chip is powered off, control the target functional module to be powered off.

[0065] Furthermore, when the functional chip in the target functional module is powered off, the mainboard logic device may start to control the target functional module to be powered off.

[0066] The technical solution in the embodiment of the present application sends a power-off signal to the module logic device in the target functional module, instructing the module logic device to control the power-off of the functional chip in the target functional module, and controls the power-off of the target functional module when the power-off of the functional chip is completed; during the power-off process of each functional module, the above method can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, avoiding the problem of sudden external power failure when the internal power-off of each functional module is not completed, which causes damage to the functional chip in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and also reducing the maintenance cost of each functional module.

[0067] The following describes the process of controlling the power-off of the functional module when the power-off of the functional chip is completed. Figure 3 As shown, the steps in S102 above can be implemented in the following ways:

[0068] S112: responding to a chip power-off completion signal fed back by the module logic device, wherein the chip power-off completion signal is triggered when the functional chip is powered off completely.

[0069] In actual applications, after the functional chip in the target functional module is powered off, the module logic device can immediately send a chip power-off completion signal corresponding to the functional chip to the mainboard logic device to inform the mainboard logic device that the functional chip in the target functional module has been powered off. At this time, the external power supply rail of the target functional module can be controlled to be disconnected.

[0070] Correspondingly, the mainboard logic device can respond to the chip power-off completion signal fed back by the module logic device.

[0071] S122 : Controlling the power-off of each module rail according to the power-off sequence of at least one module rail corresponding to the target functional module.

[0072] Specifically, the mainboard logic device may control the power-off of all module power rails of the target functional module according to a preset power-off timing of at least one module power rail corresponding to the target functional module.

[0073] The module power rail corresponding to the target functional module can be understood as the external power supply rail of the target functional module, such as the 12V voltage rail and the 48V voltage rail provided to the target functional module by different power supply modules in the server.

[0074] It should be noted that the power-off timing of each module rail corresponding to the target functional module can be flexibly set and is not fixed. At the same time, the power-off timing of each module rail corresponding to the target functional module can be the same or different, which is not limited in this embodiment of the application.

[0075] The technical solution in the embodiment of the present application responds to the chip power-off completion signal fed back by the module logic device and controls the power-off of each module power rail according to the power-off timing of at least one module power rail corresponding to the target functional module, wherein the chip power-off completion signal is triggered when the power-off of the functional chip is completed; the above method can control the power-off of each module power rail corresponding to the functional module when the power-off of the functional chip in the functional module is completed, thereby controlling the synchronization of the power-off timing of each functional module in the server with the power-off timing of the mainboard, and avoiding the problem of damage to each functional chip in each functional module during the power-off process of each functional module.

[0076] In one embodiment, each module power rail is connected to a power supply module; the step of controlling the power-off of each module power rail according to the power-off sequence of at least one module power rail corresponding to the target functional module in the above S122 may include: sending a module power-off signal to each power supply module according to the power-off sequence of each power supply module, instructing each power supply module to shut down the corresponding module power rail.

[0077] In the embodiment of the present application, powering off the module power rails of the target functional module can be understood as shutting down the corresponding power supply modules in the server that provide the target functional module with various power supply voltages.

[0078] Specifically, the mainboard logic device may send a module power-off signal to each power supply module according to the power-off sequence of each power supply module corresponding to the target functional module, instructing each power supply module to turn off the corresponding module power rail.

[0079] Among them, for any functional module, the power-off timing of different power supply modules corresponding to the functional module can be flexibly set and is not fixed; at the same time, the power-off timing of different power supply modules corresponding to the functional module can be the same or different, and this embodiment of the application does not limit this.

[0080] The technical solution in the embodiment of the present application sends a module power-off signal to each power supply module according to the power-off timing of each power supply module, instructing each power supply module to turn off the corresponding module power rail; the above method can control the power-off of each power supply module corresponding to the target functional module to turn off the module power rail corresponding to the target functional module after the functional chip in the functional module is powered off. This controls the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, and can avoid the problem of damage to each functional chip in each functional module during the power-off process of each functional module; at the same time, the above method controls the power-off of each power supply module corresponding to the functional module according to the power-off timing of each power supply module, thereby ensuring that the overall functional module can be powered off normally and avoiding affecting the subsequent power-off of other functional modules.

[0081] In some scenarios, after any functional module is powered off, the mainboard logic device can continue to control the power off of other functional modules to ensure that the server is fully powered off. The following describes how the mainboard logic device determines that the current functional module has been fully powered off. In one embodiment, after executing the steps in S102 above, the method may further include: receiving a module power rail shutdown signal sent by each power supply module to determine that the target functional module has been powered off. The module power rail shutdown signal is triggered when the power rails of each module are fully powered off.

[0082] In actual applications, after each power supply module that supplies power to the target functional module turns off the corresponding module power rail, a module power rail shutdown signal can be sent to the mainboard logic device to inform the mainboard logic device that each power supply module that supplies power to the target functional module has been powered off.

[0083] Correspondingly, the mainboard logic device can determine that the target functional module has been powered off after receiving the module power rail shutdown signal sent by all power supply modules that power the target functional module, that is, the power off of the target functional module has been completed, and further, it can execute the control to power off the next other functional module.

[0084] The technical solution in the embodiment of the present application receives the module rail shutdown signal sent by each power supply module, determines that the target functional module has been powered off, and the module rail shutdown signal is triggered when the power off of each module rail is completed; after each power supply module that supplies power to the functional module shuts down the corresponding module rail, the above method can receive the module rail shutdown signal sent by each power supply module, determine that the functional module has been powered off, and thus can timely control the power off of other functional modules, speed up the power off speed of the entire server, and shorten the power off time of the server.

[0085] In one embodiment, the present application also provides a power-off method, which is applied to a mainboard logic device. The method includes the following steps:

[0086] (1) Send a power-off signal to the module logic device in the target functional module, instructing the module logic device to control the functional chip in the target functional module to power off.

[0087] (2) In response to the chip power-off completion signal fed back by the module logic device; the chip power-off completion signal is triggered when the functional chip is powered off.

[0088] (3) According to the power-off sequence of each power supply module, a module power-off signal is sent to each power supply module respectively, instructing each power supply module to turn off the corresponding module power rail; wherein each module power rail is connected to one power supply module.

[0089] (4) Receive the module rail shutdown signal sent by each power supply module to determine whether the target functional module has been powered off; the module rail shutdown signal is triggered when the power off of each module rail is completed.

[0090] The execution process of (1) to (4) above can be specifically referred to the description of the above embodiment. The implementation principles and technical effects are similar and will not be repeated here.

[0091] like Figure 4 FIG. 1 is a flow chart of a power-off method provided in an embodiment of the present application. The method is applied to a module logic device in a functional module. The method can be implemented by the following steps:

[0092] S201 , responding to a power-off signal sent by a logic device on a mainboard.

[0093] Specifically, after the mainboard logic device in the server receives the shutdown signal sent by the processor (i.e., central processing unit CPU) in the server, the mainboard logic device can start to power off each functional module inside or outside the server, and power off each functional module in sequence according to the power-off sequence of each functional module to complete the power-off of the entire server.

[0094] In practical applications, any functional module may include a corresponding functional chip. In the embodiment of the present application, when each functional module is powered off, in order to avoid damage to the functional chips in each functional module, when any functional module is powered off, the power-off sequence of the functional module in the server can be controlled to be synchronized with the power-off sequence of the mainboard, that is, the functional chip in the functional module is powered off first, and then the functional module is powered off. It should be noted that the power-off sequence of the above-mentioned different functional modules can be flexibly set and is not fixed; at the same time, the power-off sequence of different functional modules can be the same or different.

[0095] In the embodiments of the present application, the power-off method is described using the functional chip in any functional module as the execution subject. During the power-off process of each functional module, when the mainboard logic device begins to control the power-off of any functional module, the mainboard logic device may first send a power-off signal to the module logic device in the functional module, instructing the module logic device to control the power-off of the functional chip in the functional module.

[0096] Correspondingly, the module logic device in the functional module can receive and respond to the power-off signal sent by the mainboard logic device.

[0097] S202: Power off the functional chips in the control function module.

[0098] In actual applications, after the module logic device in the functional module responds to the power-off signal sent by the mainboard logic device, the functional chip in the functional module can be controlled to power off.

[0099] S203: When the power-off of the functional chip is completed, a chip power-off completion signal is sent to the mainboard logic device to instruct the mainboard logic device to control the functional module to power off.

[0100] Furthermore, when the functional chip in the target functional module is powered off, the mainboard logic device can start to control the power off of the functional module. At this time, a chip power off completion signal can be sent to the mainboard logic device to instruct the mainboard logic device to start controlling the power off of the functional module.

[0101] The technical solution in the embodiment of the present application controls the power-off of the functional chip in the functional module in response to the power-off signal sent by the mainboard logic device, and sends a chip power-off completion signal to the mainboard logic device when the power-off of the functional chip is completed, instructing the mainboard logic device to control the power-off of the functional module; during the power-off process of each functional module, the above method can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, thereby avoiding the problem of sudden external power failure when the internal power-off of each functional module is not completed, which causes damage to the functional chip in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and also reducing the maintenance cost of each functional module.

[0102] In one embodiment, the step of controlling the functional chip in the functional module to power off in S202 may include: controlling the power off of each chip power rail according to the power off timing of at least one chip power rail corresponding to the functional chip.

[0103] In actual applications, after at least one power supply module in the server inputs power supply voltage to the functional module, the power supply module can convert the received power supply voltages and then input the converted voltages to the functional chip in the functional module to power the functional chip.

[0104] In the embodiment of the present application, the above-mentioned converted voltages can be referred to as the power supply voltages received by the functional chips in the functional modules, i.e., chip rails. Optionally, the number of chip rails corresponding to the functional chips in the functional modules can be greater than or equal to the number of module rails corresponding to the functional modules.

[0105] Specifically, the module logic device may control the power-off of each chip power rail corresponding to the functional chip in the functional module according to a preset power-off timing of at least one chip power rail corresponding to the functional chip.

[0106] Optionally, the power-off timing of the chip rails corresponding to the above functional chips can be flexibly set and is not fixed; at the same time, the power-off timing of the chip rails corresponding to the above functional chips can be the same or different.

[0107] The technical solution in the embodiment of the present application can control the power-off of each chip power rail according to the power-off timing of at least one chip power rail corresponding to the functional chip, so as to ensure that the functional chip in the functional module can be powered off normally and avoid affecting the overall power-off of the functional module.

[0108] In one embodiment, the present application also provides a power-off method, which is applied to a module logic device in a functional module. The method includes the following process:

[0109] (1) In response to the power-off signal sent by the mainboard logic device.

[0110] (2) Controlling the power-off of each chip power rail according to the power-off timing of at least one chip power rail corresponding to the functional chip.

[0111] (3) When the functional chip is powered off, a chip power-off completion signal is sent to the mainboard logic device, instructing the mainboard logic device to control the functional module to power off.

[0112] The execution process of (1) to (3) above can be specifically referred to the description of the above embodiment. The implementation principles and technical effects are similar and will not be repeated here.

[0113] It should be understood that, although the steps in the flowcharts of the above embodiments are shown in sequence as indicated by the arrows, these steps are not necessarily performed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the flowcharts of the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily to be performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0114] Based on the same inventive concept, embodiments of the present application also provide a power-off device for implementing the aforementioned power-off method. The solution provided by this device is similar to the solution described in the aforementioned method. Therefore, the specific limitations of one or more power-off device embodiments provided below can be found in the above-described limitations of the power-off method and will not be further elaborated here.

[0115] In one embodiment, Figure 5 This is a schematic diagram of the structure of a power-off device in one embodiment of the present application. The power-off device provided in the embodiment of the present application can be applied to the motherboard logic device in the server. Figure 5 As shown, the power-off device of the embodiment of the present application may include: a sending module 11 and a control module 12, wherein:

[0116] A sending module 11 is configured to send a power-off signal to a module logic device in a target functional module, instructing the module logic device to control the functional chip in the target functional module to power off;

[0117] The control module 12 is used to control the target functional module to power off when the functional chip is powered off.

[0118] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0119] In one embodiment, the control module 12 includes a response unit and a control unit, wherein:

[0120] A response unit, configured to respond to a chip power-off completion signal fed back by a module logic device; the chip power-off completion signal is triggered when the functional chip is powered off;

[0121] The control unit is configured to control power-off of each module rail according to a power-off sequence of at least one module rail corresponding to a target functional module.

[0122] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0123] In one embodiment, each module rail is connected to a power supply module; the control unit is specifically configured to:

[0124] According to the power-off sequence of each power supply module, a module power-off signal is sent to each power supply module respectively, instructing each power supply module to turn off the corresponding module power rail.

[0125] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0126] In one embodiment, the control module 12 further includes a determination unit, wherein:

[0127] The determination unit is configured to receive a module rail shutdown signal sent by each power supply module and determine that the target functional module has been powered off; the module rail shutdown signal is triggered when the power off of each module rail is completed.

[0128] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0129] In another embodiment, Figure 6 This is a schematic diagram of the structure of a power-off device in one embodiment of the present application. The power-off device provided in the embodiment of the present application can be applied to module logic devices in functional modules. Figure 6 As shown, the power-off device of the embodiment of the present application may include: a response module 21, a control module 22 and a sending module 23, wherein:

[0130] A response module 21 is configured to respond to a power-off signal sent by a logic device on the mainboard;

[0131] A control module 22, used to control the power-off of the functional chips in the functional modules;

[0132] The sending module 23 is used to send a chip power-off completion signal to the mainboard logic device when the power-off of the functional chip is completed, instructing the mainboard logic device to control the power-off of the functional module.

[0133] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0134] In one embodiment, the control module 22 is specifically configured to:

[0135] According to the power-off timing of at least one chip power rail corresponding to the functional chip, the power-off of each chip power rail is controlled.

[0136] The power-off device provided in the embodiment of the present application can be used to execute the technical solution in the above-mentioned power-off method embodiment of the present application. Its implementation principle and technical effects are similar and will not be repeated here.

[0137] The specific definition of the power-off device can be found in the definition of the power-off method above and will not be repeated here. Each module in the power-off device described above may be implemented in whole or in part through software, hardware, or a combination thereof. Each of the modules described above may be embedded in or independent of the server's processor in hardware form, or stored in the server's memory in software form, so that the processor can call and execute the corresponding operations of each module.

[0138] In one embodiment, a server is provided, the internal structure of which can be as follows: Figure 7 As shown. The server includes a motherboard logic device, a processor, a memory and a network interface connected through a system bus. The motherboard logic device of the server is used to provide processing power. The memory of the server includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the server is used to store the power-off timing of each power supply module and the power-off timing of each module power rail corresponding to each functional module. The network interface of the server is used to communicate with an external endpoint through a network connection. When the computer program is executed by the motherboard logic device and the module logic device in the functional module, a power-off method is implemented.

[0139] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the server to which the solution of the present application is applied. The specific server may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0140] In one embodiment, a server is also provided. Figure 1 As shown, the server includes: at least one power supply module and a mainboard logic device, the mainboard logic device is connected to the module logic device in the functional module, each power supply module is communicatively connected to the mainboard logic device, and each power supply module is electrically connected to the functional module;

[0141] Each power supply module is used to supply power to the functional modules;

[0142] A mainboard logic device, used to execute some of the technical solutions in the above-mentioned power-off method embodiment of the present application;

[0143] The module logic device is used to execute other technical solutions in the above-mentioned power-off method embodiment of this application.

[0144] Specifically, the mainboard logic device and the module logic device may both be FPGAs, but in the embodiment of the present application, the mainboard logic device and the module logic device may both be CPLDs.

[0145] Optionally, there may be one or more functional modules. When there are multiple functional modules, the module logic devices in each functional module can control the power-off of the functional chips in each functional module; and when each functional chip is powered off, the functional module containing each functional chip can be controlled to power off. Furthermore, each functional module can be located inside or outside the server. When a functional module is located outside the server, it can be connected to the server using an external plug-in interface.

[0146] In addition, in an embodiment of the present application, the server may further include a memory storing a computer program. In actual applications, when the mainboard logic device executes the computer program, it is used to execute some technical solutions in the above-mentioned power-off method embodiment of the present application.

[0147] The server in the embodiment of the present application includes: at least one power supply module and a mainboard logic device, the mainboard logic device is connected to the module logic device in at least one functional module, each power supply module is communicatively connected to the mainboard logic device, and each power supply module is electrically connected to each functional module, wherein each power supply module is used to supply power to each functional module, and the mainboard logic device and each module logic device are used to execute the steps in the above-mentioned power-off method embodiment; during the power-off process of each functional module, the main logic device in the above-mentioned scheme can control the power-off timing of each functional module in the server to be synchronized with the power-off timing of the mainboard, so as to avoid the problem of sudden external power failure before the internal power-off of each functional module is completed, which causes damage to the functional chips in each functional module, thereby extending the service life of each functional chip in each functional module, further extending the service life of each functional module, and reducing the maintenance cost of each functional module.

[0148] In one embodiment, the functional module is disposed outside the server.

[0149] In the technical solution of the embodiment of the present application, the functional module can be set outside the server. When the power supply modules in the server supply power to the peripheral functional modules, the normal operation of the functional modules can be guaranteed, thereby improving the use scenarios of the functional modules.

[0150] In one embodiment, see Figure 1 ,The server also includes: a processor, a communication connection between the processor and the mainboard logic device;

[0151] The processor is used to send a shutdown signal to the mainboard logic device after receiving the mainboard shutdown instruction, and instruct the mainboard logic device to send a power-off signal to the module logic device.

[0152] in, Figure 1 Only one functional module is shown. This module is connected to the server via an external plug-in. Both power supply modules within the server (12V power supply module 1 and 48V power supply module 2) supply power to the functional module. In actual applications, the server is not limited to including only 12V power supply module 1 and 48V power supply module 2.

[0153] In an embodiment of the present application, after receiving a motherboard shutdown command input by a user via voice, gesture, button, or key, the processor responds to the motherboard shutdown command and sends a shutdown signal to the motherboard logic device, instructing the motherboard logic device to send a power-off signal to the module logic device. Optionally, the motherboard logic device may send the power-off signal to the module logic device by pulling down the power-off sequence enable signal (i.e., the power-off sequence EN signal) of the functional module to a low level signal.

[0154] Correspondingly, the module logic device in the functional module controls the functional chip ( Figure 1After powering off the functional chip (not shown), the module logic device can send a chip power-off completion signal to the mainboard logic device, instructing it to power off the external power rail corresponding to the processing module. Optionally, the module logic device can send the chip power-off completion signal to the mainboard logic device by pulling down the functional module's power-off sequence completion signal (i.e., the power-off sequence GOOD signal) to a low level.

[0155] Optionally, the mainboard logic device powers off each power supply module (i.e., external power supply rail) corresponding to the processing module. This can be understood as the mainboard logic device pulling down the 12V enable signal (i.e., 12V EN signal) sent to the 12V power supply module 1 to a low-level signal, instructing the power supply module 1 to turn off the 12V power supply voltage input to the processing module, and the mainboard logic device pulling down the 48V enable signal (i.e., 48V EN signal) sent to the 48V power supply module 2 to a low-level signal, instructing the power supply module 2 to turn off the 48V power supply voltage input to the processing module.

[0156] Furthermore, after the power supply module 1 turns off the 12V power supply voltage input to the processing module, the power supply module 1 can pull down the power supply completion signal (i.e., the 12V GOOD signal) sent to the mainboard logic device to a low-level signal to inform the mainboard logic device that the 12V power supply voltage of the processing module has been disconnected; at the same time, after the power supply module 2 turns off the 48V power supply voltage input to the processing module, the power supply module 2 can pull down the power supply completion signal (i.e., the 48V GOOD signal) sent to the mainboard logic device to a low-level signal to inform the mainboard logic device that the 48V power supply voltage of the processing module has been disconnected.

[0157] According to the technical solution in the embodiment of the present application, the server also includes a processor, which is communicatively connected to the mainboard logic device. The processor is used to send a shutdown signal to the mainboard logic device after receiving the mainboard shutdown command, instructing the mainboard logic device to send a power-off signal to the module logic device; in the above solution, the processor in the server can respond to the mainboard shutdown command in a timely manner to instruct the mainboard logic device to control the module logic device to power off, thereby speeding up the power-off speed of the entire server.

[0158] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by the mainboard logic device and the module logic device in the functional module, the technical solution of the above-mentioned power-off method of the present application is implemented. The implementation principle and technical effect are similar and will not be repeated here.

[0159] In one embodiment, a computer program product is provided, including a computer program, which, when executed by the mainboard logic device and the module logic device in the functional module, implements the technical solution of the above-mentioned power-off method of the present application. The implementation principle and technical effect are similar and will not be repeated here.

[0160] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by signaling related hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the above-described method embodiments. Any reference to memory, storage, database, or other media used in the embodiments provided herein may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0161] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0162] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A power-off method, characterized in that: Applied to a mainboard logic device, the method includes: Sending a power-off signal to a module logic device in a target functional module to instruct the module logic device to control the functional chip in the target functional module to power off; When the functional chip is powered off, the target functional module is controlled to be powered off.

2. The method according to claim 1, characterized in that When the functional chip is powered off, controlling the functional module to power off includes: responding to a chip power-off completion signal fed back by the module logic device; the chip power-off completion signal is triggered when the functional chip is powered off; According to the power-off timing of at least one module power rail corresponding to the target functional module, the power-off of each module power rail is controlled.

3. The method according to claim 2, characterized in that Each module power rail is connected to a power supply module; and controlling the power-off of each module power rail according to the power-off timing of at least one module power rail corresponding to the target functional module includes: According to the power-off timing of each power supply module, a module power-off signal is sent to each power supply module respectively, instructing each power supply module to turn off the corresponding module power rail; Correspondingly, the method further includes: Receive a module power rail shutdown signal sent by each power supply module to determine that the target functional module has been powered off; the module power rail shutdown signal is triggered when the power off of each module power rail is completed.

4. A power-off method, characterized in that: A module logic device applied to a functional module, the method comprising: Responding to a power-off signal sent by a logic device on the mainboard; Controlling the power-off of the functional chip in the functional module; When the power-off of the functional chip is completed, a chip power-off completion signal is sent to the mainboard logic device to instruct the mainboard logic device to control the power-off of the functional module.

5. The method according to claim 4, characterized in that The controlling the power-off of the functional chip in the functional module includes: According to the power-off timing of at least one chip power rail corresponding to the functional chip, the power-off of each chip power rail is controlled.

6. A power-off device, characterized in that: The device comprises: a sending module, configured to send a power-off signal to a module logic device in a target functional module, instructing the module logic device to control a functional chip in the target functional module to power off; The control module is used to control the target functional module to be powered off when the functional chip is powered off.

7. A power-off device, characterized in that: The device comprises: A response module, configured to respond to a power-off signal sent by a logic device on the mainboard; A control module, used to control the power-off of the functional chips in the functional modules; The sending module is used to send a chip power-off completion signal to the mainboard logic device when the power-off of the functional chip is completed, instructing the mainboard logic device to control the power-off of the functional module.

8. A server, characterized in that: The server includes: at least one power supply module and a mainboard logic device, the mainboard logic device is connected to the module logic device in the functional module, each power supply module is communicatively connected to the mainboard logic device, and each power supply module is electrically connected to the functional module; Each of the power supply modules is used to supply power to each of the functional modules; The mainboard logic device is used to perform the steps of the method according to any one of claims 1 to 3; The modular logic device is used to execute the steps of the method according to any one of claims 4 to 5.

9. The server according to claim 8, wherein: The functional module is arranged outside the server.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by the mainboard logic device and the module logic device, the steps of the method according to any one of claims 1 to 5 are implemented.

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