High-pressure-resistant and high-temperature-resistant composite material

Abstract

The composite material is mainly applied to protection and improvement of electronic devices in a high-temperature environment. (1) a polyimide film layer; because the polyimide film has excellent ductility, high and low temperature resistance, electrical insulation, cohesiveness, radiation resistance and medium resistance, the polyimide film can be used for a long time in a temperature range of-269 DEG C to 280 DEG C, and can reach a high temperature of 400 DEG C in a short time. The polyimide film has excellent high-voltage-resistant insulativity, and the highest withstand voltage of the film with the thickness of 0.1 mm is larger than or equal to 12 kv. The polyimide film can be bent and extended in various ways according to use scenes, and has no influence on material performance (2) the lowest density of the polyimide foam can reach 5.4 kg per cubic meter, and the density is far lower than that of other common materials. The high-toughness high-temperature-resistant steel not only can bear the long-term working temperature as high as 350 DEG C, but also can keep excellent toughness in an environment as low as-269 DEG C. Zero VOC and flame retardance are achieved, and good environment friendliness and chemical stability are achieved. After the two materials are compounded and combined, better heat insulation and temperature resistance can be achieved in the using process, meanwhile, due to the low density of the polyimide foam, better shaping can be achieved after the insulating paint is combined and cured, and better heat conduction and heat dissipation can be achieved on the surface.

Description

Technical Field

[0001] The type of the present invention is mainly used for high and low temperature resistance and high pressure resistance applications in the field of electronic devices. Background Art

[0002] In some usage scenarios of certain electronic devices (products), in many environments, the devices are subjected to long-term aging caused by their own heat and rising ambient temperatures for a long time, which reduces the performance of the devices. In turn, the devices are damaged due to their own performance degradation and damage. Summary of the Invention

[0003] This patented invention optimizes and protects electronic devices from heat generation and high ambient temperature during use. It can also slow down aging caused by continuous high temperatures during use, thereby reducing performance degradation and damage to devices caused by high-temperature aging.

[0004] The technical solutions of this invention patent to solve the problems caused by high temperature are as follows: 1. Polyimide film offers excellent ductility, high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. It can withstand long-term use in temperatures ranging from -269°C to 280°C, and can even reach temperatures of 400°C for short periods. Polyimide film also possesses excellent high-voltage insulation resistance, with a maximum withstand voltage of ≥12kV for a 0.1mm thick film. Polyimide film can be bent and stretched in various ways to suit specific application scenarios without affecting material properties.

[0005] 2. Polyimide foam has a density as low as 5.4 kg per cubic meter, significantly lower than other common materials. It can withstand long-term operating temperatures up to 350°C and maintains excellent toughness in environments as low as -269°C. It is zero-VOC and flame-retardant, offering excellent environmental and chemical stability.

[0006] 3. By combining the two materials together, it can make up for some insulating voltage-resistant materials. During use, due to the heat of the product itself and in a local (limited) environment, the temperature is too high, which causes the insulating material of the device to age, resulting in reduced performance of the insulating material and causing damage.

[0007] 4. Polyimide composite materials can withstand higher temperatures, which can provide better protection for electronic devices during their design and use. This allows the material to have better performance and superior electrical properties when used in high-temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 It is a structural diagram of the present invention.

[0008] Produce technical effects Due to the excellent high-temperature resistance of the composite material, it can be used for long periods in an environment of 280°C without any change in the material's electrical properties. This temperature range significantly exceeds the existing insulation heat resistance requirements (S grade <240°C), providing more stable performance during high-temperature operation of devices, thereby better protecting the devices.

Claims

1. A composite material resistant to high pressure and high temperature, comprising a polyimide transparent film (1) and a polyimide foam (2) as a composite product. The material is mainly used for insulation and heat insulation of electronic devices. It is used for high-voltage insulation and high-temperature heat resistance of electronic components and electronic devices.

2. Polyimide film has excellent ductility, high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. It can be used for long periods of time in temperatures ranging from -269°C to 280°C, and can reach temperatures of up to 400°C for short periods. Polyimide film also has excellent high-voltage insulation resistance, with a maximum withstand voltage of ≥12kV for a 0.1mm thick film.

3. Polyimide film can be bent and stretched in various ways according to the usage scenario.

4. Polyimide foam has a density as low as 5.4 kg per cubic meter, significantly lower than other common materials. It can withstand long-term operating temperatures up to 350°C and maintains excellent toughness in environments as low as -269°C. It is zero-VOC and flame-retardant, offering excellent environmental and chemical stability.

5. The composite material made by combining polyimide transparent film and polyimide foam can be used in devices that need to withstand high pressure and high temperature during product development.

6. Since some device products generate high heat during use and are used in harsh space environments, long-term operation of the device in a high-temperature environment will cause device aging and degradation of device performance. Imide composite materials can better protect the device during long-term use due to their own performance advantages.

7. Polyimide composite materials can better make up for the existing high temperature resistance level in the existing temperature resistance level.

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