Packaging structure of MEMS (Micro Electro Mechanical System) micro galvanometer

Abstract

The packaging structure comprises a shell (1), an installation cavity is formed in the shell (1), an MEMS micro-vibrating mirror (2) and a PCB substrate (3) are fixedly installed in the installation cavity, the center line of the MEMS micro-vibrating mirror (2), the center line of the PCB substrate (3) and the center line of the shell (1) are aligned, an unthreaded hole (4) is formed in the position, corresponding to a mirror face (21) of the MEMS micro-vibrating mirror (2), of the shell (1), and the unthreaded hole (4) is communicated with the installation cavity (1). And the section of the unthreaded hole (4) is in a conical shape with a wide upper part and a narrow lower part. In this way, the optical terminal can be used for extremely-small-sized optical terminal occasions, the mechanical reliability is enhanced, and the thickness is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of optical galvanometers, and in particular to a packaging structure of a MEMS micro-galvanometer. Background Art

[0002] As optical terminals develop towards lightweighting and miniaturization, miniaturization of the core optical galvanometer component is becoming increasingly urgent. MEMS micro-galvanometers are gaining increasing popularity as a solution for miniaturizing optical galvanometers. This, in turn, places higher demands on the miniaturization and packaging of MEMS micro-galvanometers.

[0003] Currently, most manufacturers use a metal shell to encapsulate MEMS devices, with the PCB substrate placed outside the metal shell. The existing shell structure packaging has the following significant disadvantages:

[0004] First, this packaging structure is mainly designed for sensors such as accelerometers. Since it does not contain active moving parts, it has strong impact resistance and is not suitable for moving devices such as MEMS micro-vibration mirrors.

[0005] Secondly, MEMS micro-vibration mirrors usually have a large surface area, and the use of a probe-through structure will increase the thickness. Therefore, this type of packaging has certain limitations in situations where miniaturization requirements are extreme. Summary of the Invention

[0006] The main technical problem solved by the present invention is to provide a packaging structure of a MEMS micro-vibration mirror, which can be used in extremely miniaturized optical terminal occasions, enhance mechanical reliability and reduce thickness.

[0007] A technical solution adopted by the present invention is: a packaging structure of a MEMS micro-vibration mirror, including a shell, a mounting cavity is provided in the shell, a MEMS micro-vibration mirror and a PCB substrate are fixedly installed in the mounting cavity, the center lines of the MEMS micro-vibration mirror, the PCB substrate and the shell are aligned, and the shell is provided with a light hole at the position corresponding to the mirror surface of the MEMS micro-vibration mirror, and the cross-section of the light hole is a cone with a wide top and a narrow bottom.

[0008] The back-facing actuator of the MEMS micro-vibration mirror is electrically connected to the PCB substrate via a gold wire.

[0009] The PCB substrate is provided with an avoidance opening, and the PCB substrate, the avoidance opening and the axis of the light hole are aligned.

[0010] The housing includes a front cover and a bearing base, the front cover and the bearing base are fixedly installed, the installation cavity is arranged on the front cover and / or the bearing base, and the light hole is arranged on the front cover or the bearing base.

[0011] The inner end surface of the front cover is provided with the mounting cavity with a convex cross-section, the light hole is provided in the front cover and communicates with the mounting cavity, the mirror surface of the MEMS micro-vibration mirror is installed in the small cavity of the mounting cavity, and the back-facing actuator of the MEMS micro-vibration mirror and the PCB substrate are installed in the large cavity of the mounting cavity.

[0012] The back-facing actuator of the MEMS micro-vibration mirror and the PCB substrate are respectively fixedly connected to the end faces of the large-sized mounting cavity; the back-facing actuator of the MEMS micro-vibration mirror is fixedly connected to the PCB substrate, and the PCB substrate is fixedly connected to the end face of the large-sized mounting cavity.

[0013] The cross-section of the mounting cavity is convex, the small cavity of the mounting cavity is arranged at the center position of the front cover plate, the large cavity of the mounting cavity is arranged at the center position of the supporting base plate, the MEMS micro-vibration mirror is installed in the small cavity of the mounting cavity, and the back-facing actuator of the MEMS micro-vibration mirror and the PCB substrate are installed in the large cavity of the mounting cavity.

[0014] The back-facing actuator of the MEMS micro-vibration mirror and the PCB substrate are respectively fixedly connected to the end faces of the large-sized mounting cavity; the back-facing actuator of the MEMS micro-vibration mirror is fixedly connected to the PCB substrate, and the PCB substrate is fixedly connected to the end face of the large-sized mounting cavity.

[0015] The front cover plate and the bearing base plate are fixedly connected via a fixing piece.

[0016] The inner end surface of the supporting base plate is provided with a limiting convex strip, and the limiting convex strip is used to limit the position of the MEMS micro-vibration mirror facing away from the actuator, the PCB substrate and the front cover plate.

[0017] The beneficial effects of the packaging structure of a MEMS micro-vibration mirror of the present invention are: BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 1 is a structural diagram of a first embodiment of a packaging structure of a MEMS micro-vibration mirror according to the present invention;

[0019] Figure 2 This is a structural diagram of a second embodiment of a packaging structure of a MEMS micro-vibration mirror according to the present invention;

[0020] Figure 3 This is a structural diagram of a third embodiment of a packaging structure of a MEMS micro-vibration mirror according to the present invention;

[0021] Figure 4 1 is a structural diagram of a fourth embodiment of a packaging structure of a MEMS micro-vibration mirror according to the present invention;

[0022] Figure 5 yes Figure 3 、 Figure 4 External schematic diagram of . DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the present invention more apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the present invention shown in and described with reference to the accompanying drawings are merely exemplary, and the present invention is not limited to these embodiments.

[0024] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, the accompanying drawings only show structures and / or processing steps closely related to the solutions according to the present invention, while other details that are not closely related to the present invention are omitted.

[0025] Furthermore, in the description of the present invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicate positions or relationships based on those shown in the accompanying drawings. These terms are used solely to facilitate and simplify the description of the present invention and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] See also Figure 1 , Example 1:

[0027] The present invention provides a packaging structure of a MEMS micro-vibration mirror, comprising:

[0028] A packaging structure for a MEMS micro-vibration mirror includes a shell 1. A mounting cavity is provided in the shell 1. A MEMS micro-vibration mirror 2 and a PCB substrate 3 are fixedly installed in the mounting cavity. The center lines of the MEMS micro-vibration mirror 2, the PCB substrate 3 and the shell 1 are aligned. The shell 1 is provided with a light hole 4 at a position corresponding to the mirror surface 21 of the MEMS micro-vibration mirror 2. The cross-section of the light hole 4 is a cone that is wide at the top and narrow at the bottom.

[0029] The back-facing actuator 22 of the MEMS micro-vibration mirror 2 is electrically connected to the PCB substrate via a gold wire 5 .

[0030] The PCB substrate 3 is provided with an avoidance opening, and the PCB substrate 3 , the avoidance opening and the axis of the light hole 4 are aligned.

[0031] The housing 1 includes a front cover plate 11 and a bearing base plate 12 , the front cover plate 11 and the bearing base plate 12 are fixedly installed, the mounting cavity is arranged on the front cover plate 11 and / or the bearing base plate 12 , and the light hole 4 is arranged on the front cover plate 11 or the bearing base plate 12 .

[0032] The inner end surface of the front cover plate 11 is provided with the mounting cavity with a convex cross-section, the light hole 4 is provided on the front cover plate 11 and communicates with the mounting cavity, the mirror surface 21 of the MEMS micro-vibration mirror 2 is installed in the small cavity of the mounting cavity, and the back-facing actuator 22 of the MEMS micro-vibration mirror 2 and the PCB substrate 3 are installed in the large cavity of the mounting cavity.

[0033] The back-facing actuator 22 of the MEMS micro-mirror 2 and the PCB substrate 3 are respectively fixedly connected to the end faces of the large-sized mounting cavity; the back-facing actuator 22 of the MEMS micro-mirror 2 is fixedly connected to the PCB substrate 3, and the PCB substrate 3 is fixedly connected to the end face of the large-sized mounting cavity.

[0034] The cross-section of the mounting cavity is convex, the small cavity of the mounting cavity is arranged at the center position of the front cover plate 11, the large cavity of the mounting cavity is arranged at the center position of the supporting base plate 12, the MEMS micro-vibration mirror 2 is installed in the small cavity of the mounting cavity, and the back actuator 22 of the MEMS micro-vibration mirror 2 and the PCB substrate 3 are installed in the large cavity of the mounting cavity.

[0035] The back-facing actuator 22 of the MEMS micro-mirror 2 and the PCB substrate 3 are respectively fixedly connected to the end faces of the large-sized mounting cavity; the back-facing actuator 22 of the MEMS micro-mirror 2 is fixedly connected to the PCB substrate 3, and the PCB substrate 3 is fixedly connected to the end face of the large-sized mounting cavity.

[0036] The front cover 11 and the supporting base 12 are fixedly connected via a fixing member 6 .

[0037] The inner end surface of the supporting base plate 12 is provided with a limiting ridge 7, which is used to limit the position of the MEMS micro-vibration mirror 2 facing away from the actuator 22, the PCB substrate 3 and the front cover 11.

[0038] In addition, it should be noted that, in this specification, "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0039] It should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A packaging structure of a MEMS micro-vibration mirror, characterized in that: The invention comprises a shell (1), wherein a mounting cavity is provided in the shell (1), wherein a MEMS micro-vibration mirror (2) and a PCB substrate (3) are fixedly installed in the mounting cavity, wherein the center lines of the MEMS micro-vibration mirror (2), the PCB substrate (3) and the shell (1) are aligned, and a light hole (4) is provided in the shell (1) at a position corresponding to a mirror surface (21) of the MEMS micro-vibration mirror (2), wherein the cross section of the light hole (4) is a cone shape that is wide at the top and narrow at the bottom.

2. The packaging structure of a MEMS micro-vibration mirror according to claim 1, characterized in that: The back-facing actuator (22) of the MEMS micro-vibration mirror (2) is electrically connected to the PCB substrate via a gold wire (5).

3. The packaging structure of a MEMS micro-vibration mirror according to claim 1, characterized in that: The PCB substrate (3) is provided with a relief opening, and the axis of the PCB substrate (3), the relief opening and the light hole (4) are aligned.

4. The packaging structure of a MEMS micro-vibration mirror according to claim 1, characterized in that: The housing (1) comprises a front cover (11) and a bearing base (12); the front cover (11) and the bearing base (12) are fixedly mounted, and the mounting cavity is arranged on the front cover (11) and / or the bearing base (12); and the light hole (4) is arranged on the front cover (11) or the bearing base (12).

5. The packaging structure of a MEMS micro-vibration mirror according to claim 4, characterized in that: The inner end surface of the front cover plate (11) is provided with the mounting cavity having a convex cross-section, the light hole (4) is provided on the front cover plate (11) and communicates with the mounting cavity, the mirror surface (21) of the MEMS micro-vibration mirror (2) is installed in the small cavity of the mounting cavity, and the back-facing actuator (22) of the MEMS micro-vibration mirror (2) and the PCB substrate (3) are installed in the large cavity of the mounting cavity.

6. The packaging structure of a MEMS micro-vibration mirror according to claim 5, characterized in that: The back-facing actuator (22) of the MEMS micro-vibration mirror (2) and the PCB substrate (3) are respectively fixedly connected to the end surface of the large-sized mounting cavity; the back-facing actuator (22) of the MEMS micro-vibration mirror (2) is fixedly connected to the PCB substrate (3), and the PCB substrate (3) is fixedly connected to the end surface of the large-sized mounting cavity.

7. The packaging structure of a MEMS micro-vibration mirror according to claim 4, characterized in that: The cross section of the installation cavity is convex, the small cavity of the installation cavity is arranged at the center position of the front cover plate (11), the large cavity of the installation cavity is arranged at the center position of the supporting base plate (12), the MEMS micro-vibration mirror (2) is installed in the small cavity of the installation cavity, and the back-facing actuator (22) of the MEMS micro-vibration mirror (2) and the PCB substrate (3) are installed in the large cavity of the installation cavity.

8. The packaging structure of a MEMS micro-vibration mirror according to claim 7, characterized in that: The back-facing actuator (22) of the MEMS micro-vibration mirror (2) and the PCB substrate (3) are respectively fixedly connected to the end surface of the large-sized mounting cavity; the back-facing actuator (22) of the MEMS micro-vibration mirror (2) is fixedly connected to the PCB substrate (3), and the PCB substrate (3) is fixedly connected to the end surface of the large-sized mounting cavity.

9. The packaging structure of a MEMS micro-vibration mirror according to claim 4, characterized in that: The front cover plate (11) and the bearing base plate (12) are fixedly connected via a fixing member (6).

10. The packaging structure of a MEMS micro-vibration mirror according to claim 4, characterized in that: A limiting convex strip (7) is provided on the inner end surface of the bearing base plate (12), and the limiting convex strip (7) is used to limit the position of the MEMS micro-vibration mirror (2) facing away from the actuator (22), the PCB substrate (3) and the front cover plate (11).

Images