Optical module

Abstract

The invention provides an optical module, and relates to the technical field of communication, and the optical module comprises a tube shell, a first circuit board, an optical fiber connector, a light source box, a silicon optical integrated chip, a coupling jumper wire, a glass block and an electric chip group, a second circuit board, a laser light source chip, a collimating lens, an isolator and a focusing lens are arranged in the light source box, the laser light source chip is electrically connected with the second circuit board, the silicon light integrated chip is arranged on the first circuit board and electrically connected with the first circuit board, the coupling jumper wire is arranged in the tube shell, and the glass block is attached to the silicon light integrated chip; the electric chip set comprises a digital signal processing chip, a driving chip and a trans-impedance amplifier chip. The optical module provided by the invention can improve the maintenance efficiency and increase the transmission distance of the data signal.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] As the market evolves, demand for optical modules in AI (artificial intelligence) clusters is showing strong growth. As a crucial component of network equipment, optical modules are constantly innovating and evolving. Silicon photonics-based optical modules, in particular, are seeing a year-on-year increase in market share thanks to their CMOS process compatibility, high integration, low power consumption, and low cost. Consequently, users are demanding increasingly high performance from optical modules.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0004] The present disclosure aims to provide an optical module that can improve maintenance efficiency and increase the transmission distance of data signals.

[0005] According to one aspect of the present disclosure, an optical module is provided, the optical module comprising:

[0006] a tube shell, the tube shell having a receiving space and a first opening and a second opening communicating with the receiving space;

[0007] a first circuit board, wherein the first circuit board is located in the tube shell, and a connection end of the first circuit board is exposed from the first opening;

[0008] an optical fiber connector, the optical fiber connector being located in the tube shell and exposed from the second opening;

[0009] At least one light source box, the light source box is located on the first circuit board, and the light source box is provided with a second circuit board, a laser light source chip, a collimating lens, an isolator and a focusing lens, the laser light source chip is electrically connected to the second circuit board, the second circuit board extends from one end of the light source box and is electrically connected to the first circuit board, and the collimating lens, the isolator and the focusing lens are arranged in sequence;

[0010] a silicon photonic integrated chip, the silicon photonic integrated chip being disposed on the first circuit board and electrically connected to the first circuit board;

[0011] A coupling jumper is disposed in the tube shell, comprising a first connection end, a second connection end connected to the first connection end via a light source optical fiber, and a third connection end connected to the first connection end via an incident light fiber and an outgoing light fiber, the first connection end being docked with the silicon photonic integrated chip, the second connection end being plugged into the light source box, and the third connection end being plugged into the optical fiber connector; wherein the light source optical fiber is a polarization-maintaining optical fiber;

[0012] A glass block, wherein the glass block is attached to the silicon photonic integrated chip;

[0013] An electrical chipset, the electrical chipset comprising a digital signal processing chip, a driver chip, and a transimpedance amplifier chip, the digital signal processing chip being arranged on the first circuit board and electrically connected to the first circuit board, the driver chip being arranged on the first circuit board and electrically connected to the first circuit board and the silicon photonic integrated chip, and the transimpedance amplifier chip being arranged on the silicon photonic integrated chip and electrically connected to the silicon photonic integrated chip.

[0014] In an exemplary embodiment of the present disclosure, the light source box is provided with multiple groups of the laser light source chips, the collimating lenses, the isolators and the focusing lenses, and the laser light source chips in the multiple groups of the laser light source chips, the collimating lenses, the isolators and the focusing lenses are all connected to the second circuit board.

[0015] In an exemplary embodiment of the present disclosure, the optical module further includes:

[0016] a heat sink, the heat sink being disposed above the silicon photonic integrated chip, the transimpedance amplifier chip, and the glass block;

[0017] Among them, a first heat dissipation structure, a second heat dissipation structure and a third heat dissipation structure are provided on the inner wall of the tube shell, the first heat dissipation structure is thermally connected to the digital signal processing chip, the second heat dissipation structure is thermally connected to the heat sink, and the third heat dissipation structure is thermally connected to the light source box.

[0018] In an exemplary embodiment of the present disclosure, the tube case includes a tube case lower cover and a tube case upper cover, the tube case lower cover and the tube case upper cover are buckled together to form the accommodating space, the first circuit board is positioned and connected to the tube case lower cover, and the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are located on the tube case upper cover.

[0019] In an exemplary embodiment of the present disclosure, the second connection end includes a fiber optic ferrule, which includes a metal sleeve and a ceramic ferrule. The ceramic ferrule is provided at one end of the metal sleeve, and the second connection end of the coupling jumper is plugged into the other end of the metal sleeve.

[0020] Among them, the light source box includes a base and a cover plate, the base is bonded to the first circuit board by thermal conductive tape, the optical fiber ferrule is arranged on the base and is positioned and connected to the base in the radial and axial directions of the metal sleeve, and the second circuit board is arranged on the base and is positioned and connected to the base.

[0021] In an exemplary embodiment of the present disclosure, a carrier is provided in the light source box, the carrier is provided on the base, and the laser light source chip is provided on the carrier; a gold-plated surface is provided on the surface of the carrier for setting the laser light source chip, the laser light source chip is soldered to the gold-plated surface through gold-tin eutectic and the laser light source chip is completely located on the gold-plated surface, and the light-emitting end face of the laser light source chip is flush with or protrudes parallel to the edge of the surface of the carrier on which the laser light source chip is set.

[0022] In an exemplary embodiment of the present disclosure, the light source chip optical waveguide of the laser light source chip, the center point of the incident surface of the collimating lens, the center point of the exit surface of the collimating lens and the center point of the incident surface of the isolator are collinear, and the center of the light beam on the exit surface of the isolator, the center point of the incident surface of the focusing lens and the center point of the exit surface of the focusing lens are collinear.

[0023] In an exemplary embodiment of the present disclosure, the vertical distance between the light-emitting end face of the laser light source chip and the center point of the incident surface of the collimating lens is equal to the focal length of the exit surface of the collimating lens;

[0024] The vertical distance between the center point of the incident surface of the focusing lens and the end surface of the ceramic ferrule facing the focusing lens is equal to the focal length of the exit surface of the focusing lens.

[0025] In an exemplary embodiment of the present disclosure, the base is provided with a marking block and a first step, a second step, a third step and a fourth step with decreasing heights in sequence, the second circuit board is located on the first step, the marking block is located on the second step, the carrier and the laser light source chip above are located on the second step and are arranged relative to the marking block, the collimating lens is located on the second step and is arranged relative to the marking block, the isolator is located on the third step and is arranged relative to the marking block, and the focusing lens is located on the fourth step and is arranged relative to the marking block.

[0026] In an exemplary embodiment of the present disclosure, the glass block is L-shaped, and optical glue is provided in the gap between the glass block and the silicon photonic integrated chip, and optical glue is provided in the gap between the edge of the optical port of the silicon photonic integrated chip and the docking end face of the first connecting end, and optical glue is provided in the gap between the edge of the optical port of the glass block and the docking end face of the first connecting end.

[0027] The optical module provided by the present disclosure integrates a second circuit board, a laser light source chip, a collimating lens, an isolator, a focusing lens, and an optical fiber ferrule into a light source box. Since the laser light source chip in the light source box is prone to failure, when the laser light source chip fails, the optical module can be quickly maintained by replacing the light source box, thereby improving maintenance efficiency. Furthermore, the optical path design of the laser light source chip, collimating lens, isolator, and focusing lens in the light source box, as well as the structural design of the first circuit board, electrical chipset, light source box, silicon photonic integrated chip, and coupling jumper, can achieve efficient optical path coupling, increase the transmission distance of data signals, and enhance the performance of the optical module.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0030] Figure 1 A schematic diagram of an optical module provided in accordance with an embodiment of the present disclosure.

[0031] Figure 2 An exploded view of an optical module provided in accordance with an embodiment of the present disclosure.

[0032] Figure 3 A schematic structural diagram of a tube housing upper cover of an optical module provided in one embodiment of the present disclosure.

[0033] Figure 4 A schematic diagram of an optical module provided in an embodiment of the present disclosure with the upper and lower covers of the housing removed.

[0034] Figure 5 A schematic structural diagram of a heat sink in an optical module provided in an embodiment of the present disclosure.

[0035] Figure 6 A schematic diagram of a light source box provided in accordance with an embodiment of the present disclosure.

[0036] Figure 7 An exploded view of a light source box provided in accordance with an embodiment of the present disclosure.

[0037] Figure 8 A schematic diagram of opening the cover of a light source box provided in an embodiment of the present disclosure.

[0038] Figure 9 A schematic diagram of a carrier provided for one embodiment of the present disclosure.

[0039] Figure 10 A schematic diagram of a second circuit board provided in accordance with an embodiment of the present disclosure.

[0040] Figure 11 A schematic structural diagram of a base of a light source box provided in one embodiment of the present disclosure.

[0041] Figure 12 A schematic diagram of an optical path provided for an embodiment of the present disclosure.

[0042] Figure 13 A schematic top view of the structure of a laser light source chip provided in one embodiment of the present disclosure.

[0043] Figure 14 A side view of a collimating lens provided for one embodiment of the present disclosure.

[0044] Figure 15 A schematic structural diagram of an isolator array provided in accordance with an embodiment of the present disclosure.

[0045] Figure 16 A side view of a focusing lens provided for one embodiment of the present disclosure.

[0046] Figure 17 A schematic structural diagram of a first circuit board provided in an embodiment of the present disclosure.

[0047] Figure 18 A top view of an electrode surface of a driver chip provided in accordance with an embodiment of the present disclosure.

[0048] Figure 19 A schematic diagram of the top view of the silicon photonic integrated chip provided in one embodiment of the present disclosure.

[0049] Figure 20 This is a schematic diagram of the structure of a coupling jumper and an MPO adapter before assembly provided by an embodiment of the present disclosure.

[0050] Figure 21 This is a schematic diagram of the assembled structure of a coupling jumper and an MPO adapter provided by an embodiment of the present disclosure.

[0051] Figure 22 A schematic diagram of the end face structure of an FA block provided in an embodiment of the present disclosure.

[0052] Figure 23 The present invention provides a schematic diagram of a top view of a glass block according to an embodiment of the present invention.

[0053] Figure 24A schematic diagram of the structure after coupling of a silicon photonic integrated chip and an FA block provided in an embodiment of the present disclosure.

[0054] Description of reference numerals:

[0055] 10. Tube shell; 11. Tube shell upper cover; 111. First heat dissipation structure; 112. Second heat dissipation structure; 113. Third heat dissipation structure; 12. Tube shell lower cover; 13. First opening; 14. Second opening;

[0056] 20. First circuit board; 210. Silicon photonic integrated chip patch area; 220. Light source box positioning mark frame; 230. Circuit board welding area; 240. Positioning mark circular hole; 250. Gold finger; 260. Digital signal processing chip welding area; 270. Driver chip welding area;

[0057] 30. Fiber optic connector; 310. Hook;

[0058] 40. Light source box; 411. Cover plate; 412. Base; 4121. First step; 4122. Second step; 4123. Third step; 4124. Fourth step; 4125. Marking block; 4126. Circular mounting hole; 4127. Slot wall; 41271. Semicircular slot; 41272. Inner wall of slot wall; 41273. Outer wall of slot wall; 420. Second circuit board; 4210. Bonding area; 4211. First bonding pad; 4212. Second bonding pad; 4213. Third bonding pad; 4214. Fourth bonding pad; 4220, electrode area; 430, laser light source chip; 4310, light source chip optical waveguide; 4320, light emitting end face of light source chip; 4330, positive electrode on the upper surface of light source chip; 450, carrier; 4510, gold-plated surface; 4520, upper surface edge; 460, collimating lens; 4610, collimating lens incident surface; 4620, collimating lens exit surface; 470, isolator; 4710, isolator incident surface; 4720, isolator exit surface; 480, focusing lens; 4810, focusing lens incident surface; 4820, focusing lens exit surface;

[0059] 50. Silicon photonic integrated chip; 510. Optical port edge; 520. Transimpedance amplifier chip patch area; 530. Driver chip patch area; 540. Test electrode area; 550. Connection electrode area; 561. Light source incident waveguide; 562. Emitting light waveguide; 563. Incident light waveguide;

[0060] 60, coupling jumper; 610, first connection end; 611, docking end surface; 612, V-groove substrate; 613, top cover; 620, second connection end; 621, metal sleeve; 622, ceramic ferrule; 6221, high point surface; 6222, grinding line; 6223, 8° angle grinding surface;

[0061] 630, third connection end; 640, light source optical fiber; 650, incident light optical fiber; 660, output light optical fiber;

[0062] 70, glass block; 710, light port edge;

[0063] 80. Electrical chipset; 810. Digital signal processing chip; 820. Driver chip; 8210. Silicon photonic integrated chip electrode area; 8220. Other electrode areas; 830. Transimpedance amplifier chip;

[0064] 90. Heat sink; 910. Heat sink body; 920. First side wing; 930. Second side wing. DETAILED DESCRIPTION

[0065] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent like or similar structures, and thus their detailed description will be omitted.

[0066] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0067] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0068] Currently, in conventional silicon photonics optical modules, an external light source chip needs to be provided for the silicon photonics integrated chip. The light source chip and its coupled optical components are usually mounted directly on a circuit board or heat sink in a discrete manner, resulting in poor maintenance economy and unsatisfactory heat dissipation.

[0069] In order to solve the above technical problems, the present disclosure provides an optical module. Figures 1 to 8 As shown, it includes a tube shell 10, a first circuit board 20, an optical fiber connector 30, at least one light source box 40, a silicon photonic integrated chip 50, a coupling jumper 60, a glass block 70 and an electrical chipset 80. The tube shell 10 has a receiving space and a first opening 13 and a second opening 14 communicating with the receiving space; the first circuit board 20 is located in the tube shell 10, and the connection end of the first circuit board 20 is exposed from the first opening 13; the optical fiber connector 30 is located in the tube shell 10 and is exposed from the second opening 14; the light source box 40 is located on the first circuit board 20, and the light source box 40 is provided with a second circuit board (flexible circuit board) 420, a laser light source chip 430, a collimating lens 460, an isolator 470 and a focusing lens 480, the laser light source chip 430 is electrically connected to the second circuit board 420, the second circuit board 420 extends from one end of the light source box 40 and is electrically connected to the first circuit board 20; the collimating lens 460, the isolator 470 and the focusing lens 480 are arranged in sequence; the silicon photonic integrated chip 50 is arranged on the first circuit board 20 and is electrically connected to the first circuit board 20 Electrical connection; the coupling jumper 60 is arranged in the tube shell 10, and the coupling jumper 60 includes a first connection end 610 and a second connection end 620 connected to the first connection end 610 through the light source optical fiber 640, and a third connection end 630 connected to the first connection end 610 through the incident light optical fiber 650 and the output light optical fiber 660. The first connection end 610 is connected to the silicon photonic integrated chip 50, the second connection end 620 is plugged into the light source box 40, and the third connection end 630 is plugged into the optical fiber connector 30; the glass block 70 is attached to the silicon photonic integrated chip The integrated chip 50 includes a digital signal processing chip (DSP chip) 810, a driver chip 820, and a transimpedance amplifier chip (TIA chip) 830. The digital signal processing chip 810 is disposed on the first circuit board 20 and electrically connected to the first circuit board 20. The driver chip 820 is disposed on the first circuit board 20 and electrically connected to the first circuit board 20 and the silicon photonic integrated chip 50. The transimpedance amplifier chip 830 is disposed on the silicon photonic integrated chip 50 and electrically connected to the silicon photonic integrated chip 50. The silicon photonic integrated chip 50 integrates the detector and modulator functional units.

[0070] The optical module provided by the present disclosure includes a second circuit board 420, a laser light source chip 430, a collimating lens 460, an isolator 470, and a focusing lens 480, which are integrated into a light source box 40. Since the laser light source chip 430 in the light source box 40 is prone to failure, when the laser light source chip 430 fails, the optical module can be quickly maintained by replacing the light source box 40, thereby improving maintenance efficiency. At the same time, the optical path design of the laser light source chip 430, the collimating lens 460, the isolator 470, and the focusing lens 480 in the light source box 40, as well as the structural design of the first circuit board 20, the electrical chipset 80, the light source box 40, the silicon photonic integrated chip 50, and the coupling jumper 60 can achieve optical path coupling efficiency and increase the transmission distance of the data signal.

[0071] Specifically, if Figure 7 and Figure 8 As shown, the light source box 40 is provided with two groups of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480. The laser light source chips 430 in the two groups of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480 are all electrically connected to the second circuit board 420, and the two groups of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480 are exactly the same. Of course, the light source box 40 may also be provided with only one group of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480, or three, four or more groups of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480, and the present disclosure does not limit this.

[0072] It can be understood that when multiple sets of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480 are provided, multiple light source boxes 40 can be provided, that is, multiple sets of laser light source chips 430, collimating lenses 460, isolators 470 and focusing lenses 480 can be respectively provided in multiple light source boxes 40. Among them, the number of sets of laser light source chips, collimating lenses 460, isolators 470 and focusing lenses 480 provided in each light source box 40 can be the same or different.

[0073] Specifically, if Figure 2 As shown, the optical module further includes a heat sink 90, which is disposed above the silicon photonic integrated chip 50, the transimpedance amplifier chip 830, and the glass block 70. The heat sink 90 can be made of copper, aluminum, or tungsten copper.

[0074] Among them, such as Figure 3As shown, a first heat dissipation structure 111, a second heat dissipation structure 112 and a third heat dissipation structure 113 are provided on the inner wall of the tube shell 10. The first heat dissipation structure 111 is thermally connected to the digital signal processing chip 810, the second heat dissipation structure 112 is thermally connected to the heat sink 90, and the third heat dissipation structure 113 is thermally connected to the light source box 40.

[0075] Among them, the first heat dissipation structure 111 can be a heat dissipation boss of the digital signal processing chip, the second heat dissipation structure 112 can be a heat sink heat dissipation boss, and the third heat dissipation structure 113 can be a light source box heat dissipation boss, so that the heat on the digital signal processing chip 810, the heat sink 90 and the light source box 40 can be effectively dissipated through the tube shell 10.

[0076] Among them, such as Figure 6 and Figure 7 As shown, the housing 10 includes an upper housing cover 11 and a lower housing cover 12. The lower housing cover 12 and the upper housing cover 11 are fastened together to form a housing space. A first circuit board 20, an optical fiber connector 30, at least one light source box 40, a silicon photonic integrated chip 50, a coupling jumper 60, a glass block 70, and an electrical chipset 80 are disposed in the housing space formed by the fastening of the lower housing cover 12 and the upper housing cover 11. The first circuit board 20 is positioned and connected to the lower housing cover 12. A first heat dissipation structure 111, a second heat dissipation structure 112, and a third heat dissipation structure 113 are located on the upper housing cover 11. This allows heat from the digital signal processing chip 810, the heat sink 90, and the light source box 40 to dissipate through the upper housing cover 11, achieving rapid cooling and ensuring stable operation of the optical module under high temperature conditions.

[0077] The light source box 40 includes a base 412 and a cover 411. The second circuit board 420, the laser light source chip 430, the collimating lens 460, the isolator 470, and the focusing lens 480 are assembled in the installation space formed between the base 412 and the cover 411. The base 412 and the cover 411 can be fixed by bonding. The base 412 and the cover 411 can be made of Kovar or stainless steel.

[0078] The base 412 of the light source box 40 is connected to the first circuit board 20 via a thermal pad, and the cover 411 of the light source box 40 is connected to the corresponding light source box heat dissipation boss of the tube shell upper cover 11 via thermal adhesive, thereby promptly transferring the heat generated by the laser light source chip 430 to the tube shell 10 to achieve good thermal conductivity. The thermal pad can be a thermal tape.

[0079] Among them, the digital signal processing chip 810 can be connected to the digital signal processing chip heat dissipation boss corresponding to the tube cover 11 through thermal conductive glue, so that the heat generated by the digital signal processing chip 810 can be transferred to the tube cover 10 in a timely manner to achieve good heat conduction; the transimpedance amplifier chip 830 is covered with a heat sink 90, and the heat sink 90 is connected to the heat sink heat dissipation boss corresponding to the tube cover 11 through thermal conductive glue; Figure 5 As shown, a first side wing 920 and a second side wing 930 are provided on both sides of the heat sink body 910 of the heat sink 90. ​​The first side wing 920 and the second side wing 930 are both connected to the side wall of the tube shell 10, so that the heat generated by the transimpedance amplifier chip 830 can be transferred to the tube shell 10 in a timely manner, achieving good thermal conductivity and ensuring that the optical module works stably under high temperature conditions.

[0080] Specifically, if Figures 7 to 9 As shown, a carrier 450 is provided in the light source box 40, the carrier 450 is provided on the base 412, and the laser light source chip 430 is provided on the carrier 450; the carrier 450 is used to set the surface of the laser light source chip 430 and is provided with a gold-plated surface 4510, the laser light source chip 430 is soldered on the gold-plated surface 4510 by gold-tin eutectic and the laser light source chip 430 is completely located on the gold-plated surface 4510, the light-emitting end face of the laser light source chip 430 is flush with or protrudes parallel to the edge of the surface of the carrier 450 where the laser light source chip 430 is set, and the light-emitting end face 4320 of the laser light source chip 430 is flush with or protrudes parallel to the upper surface edge 4520 of the carrier 450.

[0081] Among them, such as Figure 10 As shown, the second circuit board 420 includes an electrode area 4220 and a bonding area 4210. The bonding area 4210 may include a first bonding pad 4211, a second bonding pad 4212, a third bonding pad 4213 and a fourth bonding pad 4214. The electrode area 4220 of the second circuit board 420 and the second circuit board welding area on the first circuit board 20 may be electrically connected by solder heating; the first bonding pad 4211 and the positive electrode 4330 on the upper surface of the laser light source chip 430 are electrically connected by gold wire, the second bonding pad 4212 and the gold-plated surface 4510 on the carrier 450 are electrically connected by gold wire, the third bonding pad 4213 and the positive electrode on the upper surface of another laser light source chip 430 are electrically connected by gold wire, and the fourth bonding pad 4214 and the gold-plated surface 4510 on another carrier 450 are electrically connected by gold wire.

[0082] Among them, such as Figure 7 and Figure 8As shown, the second connection end 620 of the coupling jumper 60 includes a fiber ferrule, which includes a metal sleeve 621 and a ceramic ferrule 622. The ceramic ferrule 622 is disposed at one end of the metal sleeve 621. The fiber ferrule is disposed on the base 412 and is positioned and connected to the base 412 in the radial and axial directions of the metal sleeve 621. The second circuit board 420 is disposed on the base 412 and is positioned and connected to the base 412.

[0083] The end surface of the ceramic ferrule 622 has a high point surface 6221 , a grinding line 6222 and an 8° angle grinding surface 6223 .

[0084] Among them, a circular mounting hole 4126 and a slot wall 4127 are provided on the base 412, and the metal sleeve 621 is located in the circular mounting hole 4126. Glue (such as UV dual-curing glue or epoxy resin glue) can be coated between the metal sleeve 621 and the circular through hole for sealing and fixing; a semicircular slot 41271 is provided on the slot wall 4127, and the ceramic core 622 is stuck in the semicircular slot 41271 on the slot wall 4127, and the grinding line 6222 is perpendicular to the base 412 of the light source box 40, so that the end face grinding line 6222 of the ceramic core 622 is perpendicular to the base 412 of the light source box 40, which can control the polarization state of the light source and increase the coupling efficiency of the light source optical path of the silicon photonic integrated chip 50.

[0085] The length of the ceramic ferrule 622 is equal to the thickness of the slot wall 4127 . The end of the ceramic ferrule 622 away from the metal sleeve 621 is flush with the inner wall 41272 of the slot wall 4127 . The end of the metal sleeve 621 closer to the ceramic ferrule 622 abuts against the outer wall 41273 of the slot wall, thereby positioning the ceramic ferrule 622 against the slot wall 4127 .

[0086] Among them, such as Figure 11 As shown, the base 412 is provided with a marking block 4125 and a first step 4121, a second step 4122, a third step 4123 and a fourth step 4124 with decreasing heights in sequence, the second circuit board 420 is located on the first step 4121, the marking block 4125 is located on the second step 4122, the carrier 450 and the laser light source chip 430 above are located on the second step 4122 and are arranged relative to the marking block 4125, the collimating lens 460 is located on the second step 4122 and is arranged relative to the marking block 4125, the isolator 470 is located on the third step 4123 and is arranged relative to the marking block 4125, and the focusing lens 480 is located on the fourth step 4124 and is arranged relative to the marking block 4125.

[0087] Among them, the wiring area 4210 of the second circuit board 420 can be bonded to the first step 4121 of the base 412 of the light source box 40 by epoxy resin glue, and the two carriers 450 and the laser light source chip 430 above it are respectively on the second step 4122 of the base 412 of the light source box 40 according to the relative positions of the rectangular marking block 4125, and the two collimating lenses 460 are placed on the second step 4122 of the base 412 of the light source box 40 according to the relative position of the rectangular marking block 4125, and the isolator 470 array is placed on the third step 4123 of the base 412 of the light source box 40 according to the relative position of the rectangular marking block 4125; the two focusing lenses 480 are placed on the fourth step 4124 of the base 412 of the light source box 40 according to the relative position of the rectangular marking block 4125.

[0088] The sum of the thickness of the second circuit board 420 and the thickness of the first step 4121 is equal to the sum of the thicknesses of the laser light source chip 430, the carrier 450, and the second step 4122, equal to the sum of the height of the center point of the collimating lens 460 and the thickness of the second step 4122, equal to the sum of the height of the center point of the isolator 470 and the thickness of the third step 4123, equal to the sum of the height of the center point of the focusing lens 480 and the thickness of the fourth step 4124, and equal to the sum of the height from the center point of the ceramic ferrule 622 to the outer radius and the lowest point of the semicircular slot 41271.

[0089] Among them, such as Figures 12 to 16 As shown, by setting the steps, the light source chip optical waveguide 4310 of the laser light source chip 430, the center point of the collimating lens incident surface 4610, the center point of the collimating lens exit surface 4620 and the center point of the isolator incident surface 4710 can be collinear, and the center of the light beam on the isolator exit surface 4720, the center point of the focusing lens incident surface 4810 and the center point of the focusing lens exit surface 4820 can be collinear, and the center points are at the same height, thereby ensuring reliable transmission of the optical path.

[0090] The vertical distance between the light-emitting end face 4320 of the laser light source chip 430 and the center point of the collimating lens incident surface 4610 is equal to the focal length of the collimating lens exit surface 4620. The vertical distance between the center point of the focusing lens incident surface 4810 and the end face of the ceramic ferrule 622 facing the focusing lens 480 is equal to the focal length of the focusing lens exit surface 4820. In other words, the vertical distance between the center point of the focusing lens exit surface 4820 and the inner wall 41272 of the slot of the ceramic ferrule 622 is equal to the focal length of the focusing lens exit surface 4820. It should be noted that the above-mentioned relative positional relationship is position information for initial mounting. In actual operation, the final position is determined by detecting the optical power of the optical fiber (which, like the ceramic ferrule 622, is pre-positioned in the groove) based on the optical power.

[0091] It should be noted that when multiple sets of laser light source chips 430 , collimating lenses 460 , isolators 470 and focusing lenses 480 are provided, they can all be arranged according to the above structure to achieve optical path coupling.

[0092] Specifically, if Figure 17 As shown, the first circuit board 20 is provided with a silicon photonic integrated chip patch area 210, a light source box positioning mark frame 220, a circuit board welding area 230, a positioning mark circular hole 240, a gold finger 250, a digital signal processing chip welding area 260, and a driver chip welding area 270. The light source box 40 is bonded to the light source box positioning mark frame 220 on the first circuit board 20 by thermally conductive tape to form a positioning assembly. The electrode area 4220 of the second circuit board 420 and the circuit board welding area 230 on the first circuit board 20 can be electrically connected by solder heating; the digital signal processing chip 810 can be placed on the pad area of ​​the digital signal processing chip 810 of the first circuit board 20 using the SMT (surface mount) process to achieve electrical connection.

[0093] Among them, such as Figure 18 As shown, driver chip 820 includes a silicon photonic integrated chip electrode region 8210 and other electrode regions 8220. Driver chip 820 is placed on first circuit board 20 according to the relative positions of two positioning mark holes 240 on first circuit board 20 and secured with silver glue. Gold wire is used to electrically connect the other electrode regions 8220 on driver chip 820 to the corresponding electrodes in driver chip soldering areas 270 on first circuit board 20.

[0094] Among them, such as Figure 19 As shown, the connecting electrode area 550 on the silicon photonic integrated chip 50 and the corresponding electrodes of the silicon photonic integrated chip patch area 210 on the first circuit board 20 are electrically connected using gold wires; the driving chip patch area 530 on the silicon photonic integrated chip 50 and the corresponding electrodes of the silicon photonic integrated chip electrode area 8210 on the driving chip 820 are electrically connected using gold wires.

[0095] The transimpedance amplifier chip 830 may be placed above the transimpedance amplifier chip patch area 520 on the silicon photonic integrated chip 50 by using a flip-chip bonding process.

[0096] Specifically, if Figure 20 and Figure 21 As shown, the coupling jumper 60 includes a first connection end 610 and a second connection end 620 connected to the first connection end 610 through a light source optical fiber 640, and a third connection end 630 connected to the first connection end 610 through an incident light optical fiber 650 and an output light optical fiber 660. The first connection end 610 is docked with the silicon photonic integrated chip 50, the second connection end 620 is plugged into the light source box 40, and the third connection end 630 is plugged into the optical fiber connector 30.

[0097] Among them, such as Figure 22 As shown, the first connection end 610 is an FA block, which includes a top cover 613 and a V-groove substrate 612. When the light source box 40 has two optical paths, ten optical fibers can be sandwiched between the top cover 613 and the V-groove substrate 612, namely two light source optical fibers 640, four input light optical fibers 650, and four output light optical fibers 660. Among them, the light source optical fibers 640 are polarization-maintaining optical fibers that can keep the polarization state of the optical signal unchanged.

[0098] The second connection end 620 is a MINI LC connector, and the two light source optical fibers 640 are connected to the two MINI LC connectors.

[0099] The third connection end 630 is an MT connector, connected to four input optical fibers 650 and four output optical fibers 660. The optical fiber connector 30 is an MPO adapter with a hook 310. The hook is tilted upwards to insert the MT connector, securing it in place. Once the MT connector and MPO adapter are plugged in, the hook 310 creates a separation limit, ensuring a stable connection. The two MINI LC connectors and the MT optical connector are connected to the FA block via single-mode optical fibers.

[0100] Among them, such as Figure 19 As shown, the optical port edge 510 of the silicon photonic integrated chip 50 includes ten optical waveguides: two light source incident waveguides 561, four emission optical waveguides 562, and four incident optical waveguides 563. When coupling the silicon photonic integrated chip 50 and the coupling jumper 60, these ten optical waveguides are aligned with the ten optical fibers. When the coupled output optical power is at its maximum, optical path adhesive is applied to the gap between the optical port edge 510 of the silicon photonic integrated chip 50 and the mating end face 611 of the FA block of the coupling jumper 60. A glass block 70 is placed above the silicon photonic integrated chip 50, with its edge as close as possible to the V-grooved substrate 612 of the FA block of the coupling jumper 60. At this point, the adhesive fills the coupling surface with the FA through capillary action.

[0101] Among them, such as Figure 23 and Figure 24 As shown, the glass block 70 is made of L-shaped white glass. This L-shaped block 70 exposes the test electrode while increasing the contact surface with the first connecting end 610 of the coupling optical fiber. It can be attached to the silicon photonic integrated chip 50 using optical adhesive. The addition of the glass block 70 increases the contact surface with the FA block's mating end face 611, ensuring a secure bond. The thickness of the glass block 70 is the same as that of the transimpedance amplifier chip 830, facilitating adhesive application and curing on the chip.

[0102] Specifically, the coupling process of the coupling jumper 60 involves the following steps: snapping the first circuit board 20 onto the lower cover 12 of the housing, inserting the gold fingers 250 on the first circuit board 20 into the test board socket for power supply, then connecting the MINI LC connector and the MINI LC connector of the coupling jumper 60 to a fixed optical power light source via fiber optic patch cables. Simultaneously, the MT connector monitors the output optical power via fan-out fiber optic patch cables. The FA block of the coupling jumper 60 is mounted on a fine-tuning mount, and the relative positions of the FA block and the silicon photonic integrated chip 50 are adjusted, with the mating end face 611 of the FA block positioned closer to the optical port edge 510 of the silicon photonic integrated chip 50. This aligns the light source optical fiber 640 with the light source incident waveguide 561, the incident light optical fiber 650 with the emission optical waveguide 562, and the output light optical fiber 660 with the incident light waveguide 563. The fan-out optical fiber connected to the MT connector monitors the input light fiber 650 and the output light power of the input light fiber 650. When both reach the maximum light power, fix the position of the FA block and place the glass block 70 on the silicon photonic integrated chip 50. Make the direction of the glass block 70 parallel to the direction of the transimpedance amplifier chip 830 and the optical port edge 710 parallel to the docking end face 611 and as close as possible to expose the test electrode area 540. Apply optical glue in the gap between the glass block 70 and the silicon photonic integrated chip 50 and the docking end face 611, and in the gap between the optical port edge 710 and the docking end face 611, so that the refractive index in the gap is slightly greater than and close to the refractive index of air 1.0. After applying the glue, use ultraviolet light to cure it, and then perform high-temperature secondary curing to form the optical glue. Insert the MINI LC connector into the circular mounting hole 4126 on the side wall of the light source box 40. Engage the ceramic ferrule 622 of the MINI LC connector in the semicircular slot 41271 on the slot wall 4127, aligning the grinding line 6222 perpendicular to the base 412 of the light source box 40. Engage the ceramic ferrule 622 of the MINI LC connector in the semicircular slot 41271 on the slot wall 4127. Apply glue between the circular mounting hole 4126 and the metal sleeve 621 of the MINI LC connector to seal and secure. Adhere the top cover of the light source box 40 to the base 412. Finally, insert the MT connector of the coupling jumper 60 into the MPO adapter to secure it.

[0103] Among them, optical glue is provided in the gap between the glass block 70 and the silicon photonic integrated chip 50, optical glue is provided in the gap between the optical port edge 510 of the silicon photonic integrated chip 50 and the docking end face 611 of the first connection end 610, and optical glue is provided in the gap between the optical port edge 710 of the glass block 70 and the docking end face 611 of the first connection end 610.

[0104] The optical module provided by the present disclosure is designed through the optical path of the laser light source chip 430, the collimating lens 460, the isolator 470 and the focusing lens 480, as well as the structural design of the coupling jumper 60 and the heat sink 90, thereby achieving the efficiency of optical path coupling and increasing the transmission distance of the data signal. In addition, the close fit of the carrier 450, the heat sink 90 and the tube shell 10 realizes the heat conduction of the laser light source chip 430 and the silicon photonic integrated chip 50, ensuring that the optical module works stably under high temperature conditions. At the same time, the structure of the heat sink 90 is optimized to minimize the length of the gold wire bonding wire of the silicon-based optical modulator chip, thereby ensuring the high-frequency operation performance of the optical module. In addition, the two MINI LC connectors of the light source box 40 are pluggable. If the light source box 40 is broken, the MINI LC connector can be pulled out and the second circuit board 420 can be soldered open to replace the light source box 40. It is easy to operate and easy to replace.

[0105] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. An optical module, characterized in that: include: a tube shell, the tube shell having a receiving space and a first opening and a second opening communicating with the receiving space; a first circuit board, wherein the first circuit board is located in the tube shell, and a connection end of the first circuit board is exposed from the first opening; an optical fiber connector, the optical fiber connector being located in the tube shell and exposed from the second opening; At least one light source box, the light source box is located on the first circuit board, and the light source box is provided with a second circuit board, a laser light source chip, a collimating lens, an isolator and a focusing lens, the laser light source chip is electrically connected to the second circuit board, the second circuit board extends from one end of the light source box and is electrically connected to the first circuit board, and the collimating lens, the isolator and the focusing lens are arranged in sequence; a silicon photonic integrated chip, the silicon photonic integrated chip being disposed on the first circuit board and electrically connected to the first circuit board; A coupling jumper is disposed in the tube shell, comprising a first connection end, a second connection end connected to the first connection end via a light source optical fiber, and a third connection end connected to the first connection end via an incident light fiber and an outgoing light fiber, the first connection end being docked with the silicon photonic integrated chip, the second connection end being plugged into the light source box, and the third connection end being plugged into the optical fiber connector; wherein the light source optical fiber is a polarization-maintaining optical fiber; A glass block, wherein the glass block is attached to the silicon photonic integrated chip; An electrical chipset, the electrical chipset comprising a digital signal processing chip, a driver chip, and a transimpedance amplifier chip, the digital signal processing chip being arranged on the first circuit board and electrically connected to the first circuit board, the driver chip being arranged on the first circuit board and electrically connected to the first circuit board and the silicon photonic integrated chip, and the transimpedance amplifier chip being arranged on the silicon photonic integrated chip and electrically connected to the silicon photonic integrated chip.

2. The optical module according to claim 1, wherein The light source box is provided with multiple groups of the laser light source chips, the collimating lenses, the isolators and the focusing lenses, and the laser light source chips in the multiple groups of the laser light source chips, the collimating lenses, the isolators and the focusing lenses are all connected to the second circuit board.

3. The optical module according to claim 1, wherein: The optical module further includes: a heat sink, the heat sink being disposed above the silicon photonic integrated chip, the transimpedance amplifier chip, and the glass block; Among them, a first heat dissipation structure, a second heat dissipation structure and a third heat dissipation structure are provided on the inner wall of the tube shell, the first heat dissipation structure is thermally connected to the digital signal processing chip, the second heat dissipation structure is thermally connected to the heat sink, and the third heat dissipation structure is thermally connected to the light source box.

4. The optical module according to claim 3, wherein: The tube shell includes a tube shell lower cover and a tube shell upper cover, the tube shell lower cover and the tube shell upper cover are buckled together to form the accommodating space, the first circuit board is positioned and connected to the tube shell lower cover, and the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are located on the tube shell upper cover.

5. The optical module according to claim 1, wherein: The second connection end includes an optical fiber ferrule, which includes a metal sleeve and a ceramic ferrule. The ceramic ferrule is provided at one end of the metal sleeve, and the second connection end of the coupling jumper is plugged into the other end of the metal sleeve. Among them, the light source box includes a base and a cover plate, the base is bonded to the first circuit board by thermal conductive tape, the optical fiber ferrule is arranged on the base and is positioned and connected to the base in the radial and axial directions of the metal sleeve, and the second circuit board is arranged on the base and is positioned and connected to the base.

6. The optical module according to claim 5, characterized in that A carrier is provided in the light source box, the carrier is provided on the base, and the laser light source chip is provided on the carrier; a gold-plated surface is provided on the surface of the carrier used to set the laser light source chip, the laser light source chip is soldered to the gold-plated surface through gold-tin eutectic and the laser light source chip is completely located on the gold-plated surface, and the light-emitting end face of the laser light source chip is flush with or protrudes parallel to the edge of the surface of the carrier on which the laser light source chip is set.

7. The optical module according to claim 6, wherein: The light source chip optical waveguide of the laser light source chip, the center point of the incident surface of the collimating lens, the center point of the exit surface of the collimating lens and the center point of the incident surface of the isolator are collinear, and the center of the light beam on the exit surface of the isolator, the center point of the incident surface of the focusing lens and the center point of the exit surface of the focusing lens are collinear.

8. The optical module according to claim 7, wherein: The vertical distance between the light emitting end face of the laser light source chip and the center point of the incident surface of the collimating lens is equal to the focal length of the exit surface of the collimating lens; The vertical distance between the center point of the incident surface of the focusing lens and the end surface of the ceramic ferrule facing the focusing lens is equal to the focal length of the exit surface of the focusing lens.

9. The optical module according to claim 7, wherein: The base is provided with a marking block and a first step, a second step, a third step and a fourth step with decreasing heights in sequence; the second circuit board is located on the first step; the marking block is located on the second step; the carrier and the laser light source chip above are located on the second step and are arranged relative to the marking block; the collimating lens is located on the second step and is arranged relative to the marking block; the isolator is located on the third step and is arranged relative to the marking block; and the focusing lens is located on the fourth step and is arranged relative to the marking block.

10. The optical module according to claim 1, wherein: The glass block is L-shaped, and optical glue is provided in the gap between the glass block and the silicon photonic integrated chip. Optical glue is provided in the gap between the edge of the optical port of the silicon photonic integrated chip and the docking end face of the first connecting end. Optical glue is provided in the gap between the edge of the optical port of the glass block and the docking end face of the first connecting end.

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