Layer connection point setting method in multi-layer quantum chip, related device and medium

Abstract

The invention provides a layer connection point setting method in a multi-layer quantum chip, a related device and a medium. The method comprises the following steps: acquiring a first position where a layer connection point needs to be arranged on a target layer; obtaining a first tree, the first tree comprising nodes of a plurality of levels, where each node of the lowest level corresponds to a first graph comprising one device on a target level, each node of the non-lowest level is connected to a first number of nodes of a next level, and each node of the non-lowest level corresponds to a second graph comprising one device on the target level; the second graph comprises a first graph corresponding to a first number of nodes on the target layer; on the first tree, a first path is determined from top to bottom, and each node on the first path and the first position meet a first relation; and setting the layer connection point to the first position based on a second relationship between the lowest layer node on the first path and the first position. According to the embodiment of the invention, the setting efficiency of the layer connection points is improved. The embodiment of the invention can be applied to scenes such as multi-layer quantum chip design, layer layout design and multi-layer quantum chip modeling.

Description

Technical Field

[0001] The present disclosure relates to the field of quantum computing, and in particular to a method for setting layer connection points in a multi-layer quantum chip, related devices, and media. Background Art

[0002] There are multiple layers in a multi-layer quantum chip, and quantum computing-related devices (quantum computing devices and other auxiliary devices) are arranged on each layer. Layer connection points need to be set on each layer to connect to adjacent layers through metal structures (such as indium columns). Layer connection points cannot be set on the device, and cannot be too close to the device, otherwise it will affect the normal operation of the device. When setting layer connection points in the prior art, it is necessary to first determine the position of each layer connection point to be set on the layer, and compare the position with the outer contour of each device. If the position intersects with the outer contour of the device, or does not intersect but the distance between them is less than the predetermined distance, then the layer connection point is hidden and not set, and only those layer connection points that do not intersect with the outer contour of the device and are separated from the outer contour of the device by a distance of not less than the predetermined distance are set.

[0003] Since the prior art requires comparing the layer connection point position with the outer contour of each device one by one, it is very time-consuming and has low setting efficiency. Summary of the Invention

[0004] The embodiments of the present disclosure provide a method, related device, and medium for setting layer connection points in a multi-layer quantum chip, which can improve the efficiency of setting layer connection points in the multi-layer quantum chip.

[0005] According to one aspect of the present disclosure, a method for setting layer connection points in a multi-layer quantum chip is provided, wherein the layer connection points are used to connect a target layer in the multi-layer quantum chip with an adjacent layer in the multi-layer quantum chip, the method comprising:

[0006] Obtaining a first position on the target layer where the layer connection point is to be set;

[0007] Obtaining a first tree, the first tree including nodes at multiple levels, wherein each node at the lowest level corresponds to a first graph including a device on the target layer, and each node at a level other than the lowest level is connected to a first number of nodes at a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes;

[0008] Determine a first path from top to bottom on the first tree, where each node on the first path satisfies a first relationship with the first position;

[0009] The layer connection point is set to the first position based on a second relationship between the lowest-level node on the first path and the first position.

[0010] According to one aspect of the present disclosure, a device for setting layer connection points in a multi-layer quantum chip is provided, wherein the layer connection points are used to connect a target layer in the multi-layer quantum chip with an adjacent layer in the multi-layer quantum chip, the device comprising:

[0011] a first position acquisition unit, configured to acquire a first position on the target layer where the layer connection point is to be set;

[0012] A first tree acquisition unit is configured to acquire a first tree, wherein the first tree includes nodes at multiple levels, wherein each node at the lowest level corresponds to a first graph including a device on the target layer, and each node at a level other than the lowest level is connected to a first number of nodes at a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes;

[0013] a path determining unit, configured to determine a first path from top to bottom on the first tree, wherein each node on the first path satisfies a first relationship with the first position;

[0014] The first setting unit is configured to set the layer connection point to the first position based on a second relationship between the lowest-level node on the first path and the first position.

[0015] Optionally, the first relationship includes: the first position is located in the first graph or the second graph corresponding to the node; and the first setting unit is specifically configured to:

[0016] If the first position is located outside the device corresponding to the lowest-level node and the distance from the device is greater than a first distance, the layer connection point is set to the first position.

[0017] Optionally, the first position is embodied as a region frame in the target layer that accommodates the layer connection point; the apparatus further comprises a distance acquisition unit, the distance acquisition unit being configured to:

[0018] Generate the shortest line segment from a point on the area frame to a point on the edge of the device;

[0019] The length of the shortest line segment is determined as the distance from the device.

[0020] Optionally, the apparatus further includes a first distance determining unit, configured to:

[0021] Obtaining a coverage area of ​​the device on the target layer;

[0022] Obtaining a failure rate of the device;

[0023] The first distance is determined based on the coverage area and the failure rate.

[0024] Optionally, the first path is a plurality of first paths; and the first setting unit is specifically configured to:

[0025] If the first position is located outside the device corresponding to the lowest-level node on each of the first paths and the distance from each of the devices is greater than the first distance, the layer connection point is set to the first position.

[0026] Optionally, the first path is a plurality of first paths; and the first setting unit is specifically configured to:

[0027] For each first path, determining a target first path based on a distance between the device corresponding to the lowest-level node on the first path and the first position;

[0028] The layer connection point is set to the first position based on a second relationship between the lowest-level node on the target first path and the first position.

[0029] Optionally, the first relationship includes: the first position is located within the first graph or the second graph corresponding to the node, or is located outside the first graph or the second graph corresponding to the node but the distance from the first graph or the second graph is less than a second distance; and the first setting unit is specifically configured to:

[0030] If the first position is outside the device corresponding to the lowest level node and the distance from the device is greater than a third distance, the layer connection point is set to the first position, wherein the third distance is greater than the second distance.

[0031] Optionally, the first location acquiring unit is specifically configured to:

[0032] Get the layer connection point matrix;

[0033] Get the position mapping rules of layer connection points;

[0034] For the layer connection point in the layer connection point matrix, the first position is determined based on the position mapping rule.

[0035] Optionally, the first location acquiring unit is specifically configured to:

[0036] Dividing the target layer into a plurality of grids;

[0037] For each of the grids, if the grid does not contain the device, the first position is determined based on the center of the grid.

[0038] Optionally, the first tree acquisition unit is specifically configured to:

[0039] For each of the devices on the target layer, generating a first graph including the device to correspond to a node of the lowest level of the first tree;

[0040] Sort the nodes at the bottom level;

[0041] According to the sorting, the first number of bottom-level nodes are taken out, and the second graph containing the first graph corresponding to the first number of bottom-level nodes is generated, so as to correspond to the upper-level nodes connected upward to the first number of bottom-level nodes until the first tree is generated.

[0042] Optionally, the device further comprises:

[0043] A first graphic generating unit, configured to generate a minimum rectangle including an edge of the device as the first graphic;

[0044] The second graphic generating unit is configured to generate a minimum rectangle of the first graphic corresponding to the first number of bottom-level nodes as the second graphic.

[0045] Optionally, the second graphics generating unit is specifically configured to:

[0046] determining a first number of sides of the second figure based on the first number;

[0047] A minimum regular polygon having the first number of edges and including the first graph corresponding to the first number of bottom-level nodes is generated as the second graph.

[0048] Optionally, the apparatus includes a node sorting unit, and the node sorting unit is configured to:

[0049] Selecting an anchor first graph from the first graphs corresponding to the plurality of nodes at the lowest level;

[0050] Arrange the other first graphics except the anchor first graphic behind the anchor first graphic according to the distance between the other first graphics and the anchor first graphic from small to large, to form a first graphic sorting;

[0051] Determine the lowest-level node order corresponding to the first graph order.

[0052] Optionally, the node sorting unit is specifically configured to:

[0053] Selecting an anchor first graph from the first graphs corresponding to the plurality of nodes at the lowest level;

[0054] determining, among other first graphics other than the anchor first graphic, the other first graphics having the smallest distance from the anchor first graphic, and arranging the other first graphics behind the anchor first graphic;

[0055] Updating the anchor first graph with the other first graph having the smallest distance from the anchor first graph, returning to the step of determining the other first graphs other than the anchor first graph and having the smallest distance from the anchor first graph, and arranging them after the anchor first graph until there are no other first graphs, thereby forming a first graph sorting;

[0056] Determine the lowest-level node order corresponding to the first graph order.

[0057] Optionally, the node sorting unit is specifically configured to:

[0058] Determine a first graph center of the first graph corresponding to each of the bottom-level nodes;

[0059] generating a plurality of candidate polyline segments connecting a plurality of centers of the first graphics;

[0060] Determine a target candidate polyline segment with the shortest length among the plurality of candidate polyline segments;

[0061] The nodes at the lowest level are sorted based on the order in which the target candidate polyline segments pass through the center of the first graph.

[0062] Optionally, the apparatus includes a first number determining unit, configured to:

[0063] Set a first number counter, the initial value of which is 2;

[0064] According to the sorting, taking out the bottom-level nodes of the first number counter, and generating the second graph including the first graph corresponding to the bottom-level nodes of the first number counter;

[0065] According to the above sorting, take out the next lowest level node;

[0066] If the first graph corresponding to the next lowest-level node is not included in the second graph, reading the first number from a first number counter;

[0067] If the first graph corresponding to the next lowest-level node is included in the second graph, the first number counter is incremented by 1, and the process returns to the step of extracting the first number counter lowest-level nodes according to the sorting.

[0068] Optionally, the first path determination unit is specifically configured to:

[0069] Taking the root node of the first tree as the base node;

[0070] Determine, among nodes in a lower layer of the base node, a target node in a lower layer, where the target node satisfies the first relationship with the first position;

[0071] The base node is updated with the target node, and the step of determining the target node of the next lower level among the nodes of the next lower level of the base node is returned until there is no node of the next lower level, and the target nodes of each level constitute the first path.

[0072] According to one aspect of the present disclosure, a multi-layer quantum chip is provided, comprising a plurality of layers, wherein the plurality of layers include a target layer, the target layer includes devices and layer connection points, the layer connection points are used to connect the target layer with adjacent layers in the plurality of layers, and the layer connection points are set according to the above-mentioned layer connection point setting method in the multi-layer quantum chip.

[0073] According to one aspect of the present disclosure, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the layer connection point setting method in the multi-layer quantum chip as described above is implemented.

[0074] According to one aspect of the present disclosure, a computer-readable storage medium is provided, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the above-described method is implemented.

[0075] According to one aspect of the present disclosure, a computer program product is provided, which includes a computer program. The computer program is read and executed by a processor of a computer device, so that the computer device executes the layer connection point setting method in a multi-layer quantum chip as described above.

[0076] In the disclosed embodiment, a first tree is set up. Each device on the target layer is surrounded by a first graphic. Each first graphic corresponds to a bottom-level node on the first tree. Multiple bottom-level nodes are connected below the penultimate node of the first tree, corresponding to second graphics that completely surround the first graphics corresponding to these multiple bottom-level nodes. This process continues upwards, resulting in the root node of the top level of the first tree, forming the entire first tree. When setting layer connection points, it is necessary to determine whether the layer connection points are located outside each device and maintain a predetermined distance from each device. Layer connection points can only be set if these conditions are met. In the prior art, the location of the layer connection points is compared with each device, resulting in low efficiency. Because the disclosed embodiment sets up the first tree, if a layer connection point falls within the first graphic surrounding a device, it will naturally also fall within the second graphic corresponding to the node above the bottom-level node corresponding to the first graphic, and so on, passing upwards until it finally falls within the second graphic corresponding to the root node. Therefore, the disclosed embodiment does not need to compare the layer connection point with each device one by one. Instead, it uses the first tree to compare from top to bottom to find a first path in which each node and the layer connection point meet the first relationship (close enough). The lowest level node of the first path is the node that is close enough to the layer connection point. At this time, based on the second relationship between the first graphic corresponding to the node and the layer connection point (whether the layer connection point does not fall within the device and is separated from the device by a predetermined distance, etc.), it can be determined whether the layer connection point at that location should be set. Compared to the solution of comparing with each device one by one, the method of searching from top to bottom using the first tree can quickly determine the device that is close enough to the layer connection point, thereby improving the efficiency of setting the layer connection point.

[0077] Other features and advantages of the present disclosure will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present disclosure. The purposes and other advantages of the present disclosure can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] The accompanying drawings are used to provide a further understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation to the technical solution of the present disclosure.

[0079] Figure 1 is a system architecture diagram applied by the layer connection point setting method according to an embodiment of the present disclosure;

[0080] Figures 2A to 2B Schematic diagram of the interlayer structure of a multi-layer quantum chip provided by an embodiment of the present disclosure;

[0081] Figure 3is a main flow chart of a layer connection point setting method according to one embodiment of the present disclosure;

[0082] Figure 4 yes Figure 3 A flowchart of step 310 obtaining a first position of a layer connection point to be set on a target layer;

[0083] Figure 5 yes Figure 4 Obtain a schematic diagram of a first position on a target layer where a layer connection point is to be set;

[0084] Figure 6 yes Figure 3 Another flow chart of step 310 obtaining a first position on a target layer to which a layer connection point is to be set;

[0085] Figure 7 yes Figure 6 Obtain a schematic diagram of a first position on a target layer where a layer connection point is to be set;

[0086] Figure 8 yes Figure 3 In step 320, a flow chart of the first tree is obtained;

[0087] Figure 9 yes Figure 8 Obtain a schematic diagram of the first tree;

[0088] Figure 10 yes Figure 8 In step 810, a schematic diagram including a first graphic of the device is generated;

[0089] Figure 11 yes Figure 8 The first flow chart of sorting the bottom level nodes in step 820;

[0090] Figure 12 yes Figure 11 A schematic diagram of sorting the nodes at the lowest level;

[0091] Figure 13 yes Figure 8 The second flow chart of step 820 of sorting the nodes at the bottom level;

[0092] Figure 14 yes Figure 13 A schematic diagram of sorting the nodes at the lowest level;

[0093] Figure 15 yes Figure 8 The third flow chart of step 820 of sorting the nodes at the bottom level;

[0094] Figure 16 yes Figure 15 A schematic diagram of sorting the nodes at the lowest level;

[0095] Figure 17 yes Figure 8 A flowchart of a method for obtaining the first number in step 830;

[0096] Figure 18 yes Figure 17 A schematic diagram of a method for obtaining a first number;

[0097] Figure 19 yes Figure 8 Step 830 generates a flow chart of a second graph including the first graph corresponding to the first number of lowest-level nodes;

[0098] Figure 20 yes Figure 19 generating a schematic diagram of a second graph including the first graph corresponding to a first number of bottom-level nodes;

[0099] Figure 21 yes Figure 3 Step 330 is a flow chart for determining a first path from top to bottom on the first tree;

[0100] Figure 22 yes Figure 3 A flowchart of step 340 setting the layer connection point to the first position based on the second relationship between the lowest level node on the first path and the first position;

[0101] Figure 23 yes Figure 22 a schematic diagram of setting the layer connection point to the first position based on a second relationship between the lowest level node on the first path and the first position;

[0102] Figure 24 yes Figure 22 A flow chart of determining the distance to the device in step 2210;

[0103] Figure 25 yes Figure 24 A schematic diagram for determining the distance from the device;

[0104] Figure 26 yes Figure 22 A flowchart of determining the first distance in step 2210;

[0105] Figure 27 yes Figure 22 A schematic diagram of setting the layer connection point to a first position in step 2210 when there are multiple first paths;

[0106] Figure 28 yes Figure 3In step 340 , a second flow chart is provided in which the layer connection point is set to the first position based on the second relationship between the lowest level node on the first path and the first position;

[0107] Figure 29 yes Figure 28 a schematic diagram of setting the layer connection point to the first position based on a second relationship between the lowest level node on the first path and the first position;

[0108] Figure 30 yes Figure 3 The third flow chart of step 340 setting the layer connection point to the first position based on the second relationship between the lowest level node on the first path and the first position;

[0109] Figure 31 yes Figure 30 a schematic diagram of setting the layer connection point to the first position based on a second relationship between the lowest level node on the first path and the first position;

[0110] Figure 32 is a detailed diagram of an implementation of the layer connection point setting method according to an embodiment of the present disclosure;

[0111] Figure 33 This is a schematic diagram of the effect of setting layer connection points provided by an embodiment of the present disclosure;

[0112] Figure 34 This is a comparison table of the time overhead of the layer connection point setting method disclosed in the present invention and the time overhead of setting layer connection points in the prior art.

[0113] Figure 35 is a module diagram of a layer connection point setting device according to an embodiment of the present disclosure;

[0114] Figure 36 According to the embodiment of the present disclosure Figure 3 The terminal structure diagram of the layer connection point setting method shown;

[0115] Figure 37 According to the embodiment of the present disclosure Figure 3 The server structure diagram of the layer connection point setting method shown. DETAILED DESCRIPTION

[0116] In order to make the purpose, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and are not intended to limit the present disclosure.

[0117] Before further explaining the embodiments of the present disclosure in detail, the nouns and terms involved in the embodiments of the present disclosure are explained. The nouns and terms involved in the embodiments of the present disclosure are subject to the following interpretations:

[0118] Superconducting quantum chip: The central processing unit of a superconducting quantum computer. A quantum computer is a machine that uses the principles of quantum mechanics to perform calculations. Based on the superposition principle and quantum entanglement of quantum mechanics, quantum computers possess strong parallel processing capabilities, enabling them to solve problems that are intractable for classical computers. The zero-resistance nature of superconducting qubits and their similar manufacturing process to integrated circuits make quantum computing systems based on superconducting qubits one of the most promising approaches for practical quantum computing.

[0119] A layout, also known as a circuit diagram, is a design that describes the layout, placement, and connection of components within a circuit. It represents the physical geometry of a circuit in a planar form. The layout design must adhere to constraints such as manufacturing process, timing, area, and power consumption. The layout design file contains information about the shape, area, and location of each hardware unit on the chip.

[0120] Component: A general term for elements and devices, which are electronic parts and components in the circuit, such as resistors, capacitors, inductors, etc.

[0121] Quantum bit unit: A storage unit in quantum hardware resources used to hold quantum bits involved in calculations.

[0122] Indium Bump: A spherical bump made of metallic indium to establish electrical connections between different components or layers in a device.

[0123] At present, there are multiple layers in a multi-layer quantum chip, and quantum computing-related devices (quantum computing devices and other auxiliary devices) are arranged on each layer. Layer connection points need to be set on each layer to connect to adjacent layers through metal structures (such as indium columns). Layer connection points cannot be set on the device, and cannot be too close to the device, otherwise it will affect the normal operation of the device. When setting layer connection points, the existing technology needs to first determine the position of each layer connection point to be set on the layer, and compare the position with the outer contour of each device. If the position intersects with the outer contour of the device, or does not intersect but the distance between them is less than the predetermined distance, the layer connection point is hidden and not set, and only those layer connection points that do not intersect with the outer contour of the device and are separated from the outer contour of the device by a distance of not less than the predetermined distance are set. Since the existing technology needs to compare the position of the layer connection point with the outer contour of each device one by one, it is very time-consuming and the setting efficiency is low.

[0124] System architecture and scenario description of the application of the embodiments of the present disclosure

[0125] Figure 1This is a system architecture diagram for the layer connection point setting method according to an embodiment of the present disclosure. It includes a layer layout design machine, a device placement machine, a layer connection point placement machine, a multi-layer quantum chip, etc.

[0126] The layer layout design machine is a device used to receive information such as the initial layout, device type, number of devices, initial layer connection point matrix, and perform layout design based on this information. The layer layout design machine can receive information such as the initial layout, device type, number of devices, initial layer connection point matrix, etc. from a cloud database, cloud server, server, computer, terminal, etc. through wired or wireless communication. The layer layout design machine can also have its own storage function, which can store and call the information needed for layout design. For a quantum chip with a multi-layer structure, the layout of each layer can be designed by the layer layout design machine to obtain the device layout method, position, layout position of the layer connection points, etc. of each layer. After completing the layout design, the layer layout design machine will output the relevant information to downstream equipment for chip manufacturing.

[0127] The layer layout design machine includes at least but is not limited to a layout reading module, a layer connection point design module, and a layout output module. The layout reading module is used to read the initial layout, the layer connection point design module is used to design the layer connection point setting position based on the initial layout, and the layout output module is used to output the designed layout.

[0128] The device placement machine is used to place devices at corresponding locations on corresponding layers of a chip based on the layout design information. The device placement machine can communicate with the layer layout design machine via wired or wireless communication to obtain the designed layout information from the layer layout design machine.

[0129] The layer connection point placement machine is a device used to place layer connection points at corresponding locations on corresponding layers of a chip based on the layout design information. The layer connection point placement machine can communicate with the layer layout design machine via wired or wireless communication to obtain the designed layout information from the layer layout design machine.

[0130] Through the device placement machine and the layer connection point placement machine, according to the designed layout output by the layer layout design machine, the devices and layer connection points are placed on the corresponding positions of each layer of the substrate of the multi-layer quantum chip to complete the manufacture of the multi-layer quantum chip.

[0131] The embodiments of the present disclosure can be applied in various scenarios, such as Figures 2A to 2B Schematic diagram of the interlayer structure of a multi-layer quantum chip shown.

[0132] like Figure 2A As shown, Figure 2AThe structure between two layers of a multi-layer quantum chip is shown. Multiple devices 230 and multiple superconducting metal pillars 220 are arranged between two substrates 210. The positions of the superconducting metal pillars 220 cannot overlap with the devices 230, and the distance between the superconducting metal pillars 220 and the devices 230 is greater than the minimum distance limit. The minimum distance limit refers to the minimum distance between the superconducting metal pillars 220 and the devices 230 without affecting the normal function of the devices 230.

[0133] like Figure 2B As shown, Figure 2B The layer structure of the multi-layer quantum chip is shown. Figure 2A The diagram shows a plurality of devices 230 and superconducting metal pillars 220 determined by the layer connection point setting method provided by the embodiment of the present disclosure.

[0134] by Figure 2A For example, based on Figure 1 Provided system architecture, Figure 2A Two layers of the multi-layer quantum chip shown are realized by the following steps:

[0135] Will Figure 2A The initial layout of the lower substrate 210 is input into the layout design machine.

[0136] In the layer layout design machine, the layout reading module reads the initial layout information, which includes the size of the substrate 210, the type and number of devices 230 included, and the positions of the devices 230. Multiple first patterns are determined based on the devices 230, with each device 230 corresponding to one first pattern.

[0137] Each first graphic is used as a node at the lowest level to generate a first tree; wherein the first tree includes nodes at multiple levels, each non-lowest level node is connected to a first number of nodes at the next level, and corresponds to a second graphic on the substrate 210 that includes the first graphic corresponding to the first number of devices 230.

[0138] Obtain the first position where each layer connection point is to be set. For each layer connection point, determine the first path from top to bottom on the first tree, where the first position is located within the first graph or second graph corresponding to the node in the first path. If the first position is outside the device corresponding to the lowest-level node and the distance from the device is greater than the first distance, then it is determined that the layer connection point can be set at the first position. In addition, if the first position where the layer connection point is to be set does not confirm a complete first path in the first tree, it means that the layer connection point is not within the range of the first graph corresponding to any of the lowest-level nodes, and the distance between the layer connection point and the device must be greater than the first distance, so it can be determined that the layer connection point can be set at the first position.

[0139] After completing the arrangement of all layer connection points, the final layout is generated, and the layer layout design machine outputs the final layout to the device placement machine and the layer connection point placement machine.

[0140] The device placement machine places the device 230 on the substrate 210 according to the final layout, and the layer connection point placement machine places the layer connection points on the substrate 210 according to the final layout.

[0141] In the same way, complete Figure 2A The layout of the devices and layer connection points of the upper substrate 210.

[0142] A superconducting metal column 220 is provided between every two corresponding layer connection points of the two substrates 210 to achieve connection between the layers.

[0143] In summary, when setting a layer connection point between two substrates 210, the layer connection point does not need to be compared with each device one by one. Instead, a first tree generated from the first graph of device 230 is used to compare from top to bottom, finding a first path in which each node and the layer connection point meet the first relationship (sufficiently close). The lowest-level node in the first path is the node that is sufficiently close to the layer connection point. At this time, based on the second relationship between the first graph corresponding to the node and the layer connection point (whether the layer connection point does not fall within the device and is separated from the device by a predetermined distance, etc.), it can be determined whether the layer connection point should be set at that location. Compared to a solution that compares each device one by one, using the first tree to search from top to bottom can quickly determine the device that is sufficiently close to the layer connection point, improving the efficiency of setting the layer connection point.

[0144] It should be understood that the above content only illustrates some application scenarios of the present disclosure. The business scenarios to which the present disclosure can be applied may include but are not limited to the specific embodiments listed above.

[0145] General description of the embodiments of the present disclosure

[0146] It should be emphasized that the embodiments of the present disclosure can be applied to a variety of application scenarios, such as multi-layer quantum chip design, layer layout design, multi-layer quantum chip modeling and other scenarios. The setting of layer connection points in related technologies is to simply compare each layer connection point to be set with the outer contour of each device to determine whether the setting conditions are met; since each layer connection point needs to be judged one by one with the outer contour of each device, it is very time-consuming and the design efficiency is low. Some embodiments of the present disclosure provide a method for setting layer connection points in a multi-layer quantum chip, related devices and media, which can simplify the comparison process and improve the efficiency of setting layer connection points in a multi-layer quantum chip.

[0147] A method for setting layer connection points in a multilayer quantum chip determines the location of layer connection points in a target layer of the multilayer quantum chip. This method can set layer connection points for each layer of the multilayer quantum chip. This method quickly compares the first location where the layer connection point is to be set with a first tree generated based on the devices in the target layer to determine whether the distance between the layer connection point and each device meets the minimum distance constraint. If so, the layer connection point is determined to be set at the first location.

[0148] The layer connection point setting method of the embodiment of the present disclosure can be executed on the server, or partially on the server and partially on the terminal, or in a similar manner. Figure 1 The layer layout shown is executed in a design machine.

[0149] like Figure 3 As shown, according to one embodiment of the present disclosure, a method for setting layer connection points in a multi-layer quantum chip includes:

[0150] Step 310: Obtain the first position of the layer connection point to be set on the target layer;

[0151] Step 320: Obtain a first tree, the first tree including multiple levels of nodes, wherein each node in the lowest level corresponds to a first graph including a device on the target layer, and each node in a non-lowest level is connected to a first number of nodes in a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes;

[0152] Step 330: Determine a first path from top to bottom on the first tree, where each node on the first path satisfies a first relationship with the first position;

[0153] Step 340: Set the layer connection point to the first position based on the second relationship between the lowest level node on the first path and the first position.

[0154] Steps 310 to 350 are briefly described below.

[0155] In step 310 , a multi-layer quantum chip is generally constructed by vertically stacking multiple layers of substrates, with superconducting metal pillars used between each two adjacent layers of substrates as support and for electrical connection between the layers.

[0156] The layer connection point refers to a point entity used to connect a target layer in a multi-layer quantum chip with an adjacent layer in the multi-layer quantum chip; illustratively, the layer connection point may be an indium pillar.

[0157] The target layer refers to the substrate in a multi-layer quantum chip where layer connection points are currently being set. In this disclosure, the target layer also refers to the layout corresponding to the substrate in the multi-layer quantum chip where layer connection points are currently being set. The layout contains information such as the size, position, and shape of the substrate and the devices on it. An adjacent layer refers to the substrate adjacent to the target layer.

[0158] The first position refers to the position where the layer connection point needs to be set on the target layer. The corresponding layer connection point will only be set at the first position after it is determined through the corresponding methods of steps 320 to 340 that setting the layer connection point will not cause interference to the device.

[0159] In step 320, the first tree is a tree with the first graph corresponding to each device in the target layer as the bottom-level node, the second graph including all first graphs in the target layer as the root node, and the second graphs including several first graphs as the intermediate-level nodes. Devices are quantum computing devices or non-quantum auxiliary devices, such as qubit units, capacitors, and inductors, disposed on the substrate of the multi-layer quantum chip.

[0160] Exemplarily, when the first tree is a binary tree, assuming there are four devices in total, the first tree has three layers in total, and the four bottom-level nodes correspond to the first graphics of the four devices respectively; there are two intermediate nodes one level above the bottom level, and each intermediate node corresponds to the parent node of every two bottom-level nodes, and each intermediate node corresponds to the second graphics of the first graphics containing two child nodes; there is a node one level above, namely the root node, and the root node is the parent node of the two intermediate nodes. The root node corresponds to the graphics of the second graphics including the two intermediate nodes, that is, the root node corresponds to the second graphics including all four bottom-level nodes.

[0161] The first figure refers to the smallest polygon that can contain the entire outer contour of the device. The second figure refers to the smallest polygon that can contain all outer edges of the corresponding first figures.

[0162] In step 330, determining the first path from top to bottom means starting from the root node of the first tree and performing a comparison layer by layer until a node at the lowest level that satisfies the first relationship is found. The first relationship means that the outer contour of the first position is within the first or second graph corresponding to the node, or that the outer contour of the first position partially overlaps with the first or second graph corresponding to the node.

[0163] In step 340 , the second relationship means that the first position and the device corresponding to the lowest-level node on the first path do not overlap, and setting the layer connection point at the first position will not interfere with the normal operation of the device.

[0164] Based on the first path found in step S350, if a complete first path can be found for the first position of a layer connection point, it proves that the first position may overlap with a device or interfere with the normal operation of the device. A special comparison is required with the device corresponding to the lowest layer node of the first path to determine whether the second relationship is satisfied. If so, the layer connection point can be set at the first position. If the second relationship is not satisfied, the layer connection point cannot be set at the first position, otherwise it will conflict with the device.

[0165] If the first position of a connection point of a certain layer cannot find a first path containing the node of the lowest level in the first tree, it means that the first position of the connection point of this layer will not interfere with any device in the first tree, and the connection point of this layer can be directly set at the corresponding first position.

[0166] By comparing the area where the first position of the layer connection point is located with the first tree, only the first positions where the first path can be found need to be compared with the components corresponding to the first path. The remaining first positions where the first path cannot be found can be directly determined as suitable for setting layer connection points. This eliminates the need to compare each layer connection point with the outer contours of each component, reducing the number of comparison processes and enabling faster setting of layer connection points.

[0167] For example, during the process of setting the layer connection points for each layer of a multi-layer quantum chip, each layer may have multiple layer connection points. Steps 310 to 340 are used to determine whether each layer connection point can be set at the corresponding first position, ultimately resulting in a layout for the target layer to complete the layer connection point arrangement design. Based on this layout, the layer connection points can be arranged and set for the substrate entity.

[0168] The embodiment of steps 310 to 340 above uses a first tree approach. Each device on the target layer is surrounded by a first graphic (e.g., a rectangular frame), corresponding to the lowest level node in the first tree. Multiple lowest level nodes are connected below the penultimate level node, corresponding to the second graphic surrounding the first graphic of these multiple lowest level nodes. This continues upward to the root node, forming a first tree. Thus, if a layer connection point falls within the first graphic of a lowest level node, it will inevitably also fall within the second graphic of the node above it, and this continues until it finally falls within the second graphic of the root node, forming a first path. Therefore, the present disclosure utilizes the first tree to search the first path from top to bottom. The lowest level node in the first path is the node that is sufficiently close to the layer connection point. If this node and the layer connection point meet predetermined conditions (the layer connection point does not fall within a device and is at least a predetermined distance away from the device), it is determined that the layer connection point can be set at that location. Using the first tree's top-down search approach reduces search time and improves the efficiency of setting layer connection points, compared to the prior art, which compares each device individually.

[0169] The above is a general description of steps 310 to 350 . The specific implementation process of steps 310 to 350 will be described in detail below.

[0170] Detailed description of step 310

[0171] In step 310 , a first position of a layer connection point to be set on a target layer is obtained.

[0172] In one embodiment, referring to Figure 4 , step 310 includes:

[0173] Step 410: Obtain layer connection point matrix;

[0174] Step 420: Obtain the position mapping rule of the layer connection point;

[0175] Step 430: Determine a first position for the layer connection point in the layer connection point matrix based on a position mapping rule.

[0176] Steps 410 to 430 are described in detail below.

[0177] In step 410, the layer connection point matrix is ​​an M-column by N-row matrix generated based on the number of layer connection points required for the target layer, where M and N are both positive integers. Each element in the layer connection point matrix corresponds to a layer connection point. Each row of the layer connection point matrix has M equally spaced layer connection points, and each column has N equally spaced layer connection points.

[0178] In step 420, the position mapping rule refers to a pre-set algorithm rule for converting the coordinates of each layer connection point in the layer connection point matrix into the position coordinates on the target layer to be set. For example, each layer connection point in the layer connection point matrix can be mapped to the position coordinates actually set on the target layer using a linear function.

[0179] In step 430, based on the position mapping rule, each point in the layer connection point matrix is ​​converted using a preset position mapping algorithm. Determining the first position refers to determining the actual position coordinates of the layer connection point set on the target layer. The position coordinates represent the position of the center point of the layer connection point on the target layer.

[0180] Reference Figure 5 , combined with Figure 5 Explain the process of determining the first position. Figure 5 As shown, matrix A is a layer connection point matrix. Each row of the layer connection point matrix A includes m layer connection points, and each column includes n layer connection points. There are a total of m*n layer connection points, and m and n are both positive integers.

[0181] The preset position mapping rule is x=3m, y=3n, where x is the horizontal coordinate, y is the vertical coordinate, m represents the mth point in the horizontal coordinate direction of the layer connection point matrix A, and n represents the nth point in the horizontal coordinate direction of the layer connection matrix A.

[0182] Each point in the layer connection point matrix A is converted and calculated by x=3m and y=3n. For example, for the second point in the X-axis direction (i.e., the horizontal direction) and the third point in the Y-axis direction (i.e., the vertical direction) of the layer connection point matrix A, m=2, n=3. The horizontal coordinates x=3*2=6 and y=3*3=9 give the layer connection point a. 23 The corresponding coordinates of the first position are (6,9).

[0183] If the first positions of the layer connection points to be set are designed one by one directly on the target layer, the design needs to be repeated for each layer, which is inefficient. The above steps 410 to 430 use the preset position mapping rules to transform the layer connection point matrix, which can quickly obtain the position coordinates corresponding to the first position of each layer connection point to be set on the target layer.

[0184] In one embodiment, referring to Figure 6 , step 310 includes:

[0185] Step 610: Divide the target layer into multiple grids;

[0186] Step 620: For each grid, if the grid does not contain a device, determine a first position based on the center of the grid.

[0187] Steps 610 to 620 are described in detail below.

[0188] In step 610 , the target layer refers to the layout of the target substrate where the layer connection points are to be set. Components are already arranged on the target substrate. The positions and patterns of the target layer and the components arranged on the target layer can be obtained based on the layout.

[0189] A grid refers to a continuous and regularly arranged regular polygon. For example, a grid is usually a continuous and regularly arranged square.

[0190] Dividing the target layer into multiple grids means dividing the graphics corresponding to the target layer into multiple consecutive regular areas based on a preset grid shape. In one example, a grid mask with the same shape as the target layer can be preset, and the outer contour of the grid mask has the same shape as the outer contour of the target layer and is already gridded; by overlapping the grid mask with the graphics of the target layer, the graphics of the target layer after grid division can be directly obtained. In another example, the grid can be directly divided based on the graphics of the target layer to obtain the graphics after network division of the target layer.

[0191] In step 620, the size and arrangement rules of the grid in the embodiment of the present disclosure are set based on the layer connection points to be set. Figure 5 In this embodiment, after obtaining the coordinates of the m*n layer connection points in layer connection point matrix A, the number of grids is also set to m*n. One grid corresponds to one layer connection point. After meshing the target layer, the coordinates of the center point of each grid are the same as those of the corresponding layer connection point. Therefore, the positional relationship between the layer connection point and the device's outer contour can be determined by the positional relationship between the grid center and the device's outer contour.

[0192] A grid that doesn't contain a device means the grid doesn't overlap with the device's outline or is located inside the device's shape. If a grid doesn't contain a device, the corresponding layer connection point won't overlap with the device. Therefore, the center of the grid that doesn't contain a device can be used as the first location for determining whether a layer connection point can be set based on the first tree.

[0193] If a grid partially overlaps with the device's outer contour or is located within the device's graphics, it indicates that the layer connection point corresponding to the grid will interfere with the device or overlap with the device's location. Therefore, the center positions of these grids can be directly excluded without the need to perform the first tree-based judgment in steps 320 to 340.

[0194] Reference Figure 7 , combined with Figure 7 Explain the process of determining the first position. Figure 7 As shown, it is assumed that there are three devices on the target layer (such as Figure 7 Device 1, device 2, and device 3 are shown in the figure). A grid mask with 16*8 identical grids is set, and the shape and size of the grid mask are the same as the outer contour of the target layer. After the grid mask is overlapped with the target layer, the target layer can be divided into 16*8 grids as shown in the figure. It can be seen that for device 1, there are 8 grids that overlap with the graphics of device 1, so it can be determined that the center positions of these 8 grids do not belong to the first position where the layer connection point can be set. For device 2, there are 24 grids that overlap with the graphics of device 2 or are located within the graphics of device 2, so it can be determined that the center positions of these 24 grids do not belong to the first position where the layer connection point can be set. For device 3, there are 12 grids that overlap with the graphics of device 3, so it can be determined that the center positions of these 12 grids do not belong to the first position where the layer connection point can be set. As for the remaining grids that do not overlap with devices 1, 2, and 3, the center positions of these grids can be determined as the first position where the layer connection point may be set. It can be seen that in this example, the pre-judgment based on the grid directly determines that 56 points cannot be used to set the layer connection points, which reduces the number of first positions that need to be judged subsequently.

[0195] If the first position of each layer connection point of the target layer is set directly, each first position must be compared with the first tree to determine whether the layer connection point can be set. However, in the above-described embodiment of steps 610 to 620, the target layer is pre-divided into multiple grids, each grid corresponding to a layer connection point, and the center of the grid corresponding to the first position. The grids are used to quickly eliminate the center points of grids that overlap with the device. Only the center points of grids that do not overlap with the device need to be used as the first position for subsequent comparison and judgment. This embodiment allows for the rapid elimination of locations that are certain to interfere with the device, further reducing the burden of subsequent screening.

[0196] Detailed description of step 320

[0197] In step 320, a first tree is obtained, the first tree including nodes of multiple levels, wherein each bottom-level node corresponds to a first graphic containing a device on the target layer, and each non-bottom-level node is connected to a first number of nodes of a lower level and corresponds to a second graphic containing the first graphic corresponding to the first number of nodes on the target layer.

[0198] In one embodiment, referring to Figure 8 , step 320 includes:

[0199] Step 810: For each device on the target layer, generate a first graph containing the device to correspond to a bottom-level node of the first tree;

[0200] Step 820: sort the nodes at the bottom level;

[0201] Step 830: Take out the first number of bottom-level nodes according to the sorting, generate a second graph including the first graph corresponding to the first number of bottom-level nodes, and connect the upper-level nodes corresponding to the first number of bottom-level nodes upward until a first tree is generated.

[0202] Steps 810 to 830 are described in detail below.

[0203] In step 810, the device refers to all entities placed on the target layer, including qubit units and non-quantum auxiliary components such as capacitors and inductors. Each device has its own outer contour, and the first shape refers to the smallest regular polygon that covers the outer contour of the device.

[0204] The lowest level node refers to the leaf node of the first tree. Each leaf node corresponds to the first graphic of a device. When the system / program reads this leaf node, it can call the shape, coordinates and other information of the corresponding first graphic.

[0205] In step 820, sorting the bottom-level nodes refers to sorting the bottom-level nodes in sequence based on the correlation between the first graphics corresponding to the bottom-level nodes, such as the proximity of the first graphics. This sorting allows the bottom-level nodes selected as needed to be closer to each other, thereby ensuring that the higher-level nodes corresponding to the selected bottom-level nodes are more reasonable. This prevents the second graphics corresponding to the higher-level nodes from covering a large range, thereby covering too many first positions and increasing the number of first positions that need to be determined later.

[0206] For example, Figure 9 As shown in , if we randomly select the lowest level nodes to generate the upper level nodes without sorting, if we select device 1 and device 4, then the second graph of the upper level will be very large, and the second graph will even completely cover device 2 and partially cover device 3. In this case, the second graph composed of devices 1 and 4 will hit a lot of first positions, increasing the number of first positions to be judged later. After sorting and then selecting, as shown in Figure 9 In the example, devices 1 and 3 are regarded as a pair. In this case, the second graphics p1 corresponding to devices 1 and 3 obviously cover a much smaller area than the second graphics of devices 1 and 4, thereby reducing the number of first positions that need to be judged subsequently.

[0207] In step 830, the first number can be determined by the type of the first tree. For example, if the first tree is a binary tree, the first number is fixed at 2. The first number can also be determined based on the degree of association between the first graphs. For example, if the first graphs of three devices are very similar, then the second graphs of any two first graphs will contain the remaining first graph. In this case, the lowest-level nodes corresponding to these three devices can be grouped together and connected to a higher-level node. In this case, the first number corresponds to 3. It should be noted that the method for determining the first number can be set as needed, and will be described in detail in subsequent embodiments.

[0208] Reference Figure 9 , combined with Figure 9 The process of determining the first tree is explained. Figure 9 As shown, it is assumed that there are device 1, device 2, device 3 and device 4 in the target layer. Each device generates its own first graphic. Figure 9 In the example, each device generates a rectangular frame as the first graphic (e.g. Figure 9 Devices 1, 2, 3, and 4 correspond to Figure 9 The bottom level nodes of the first tree are 1, 2, 3, and 4. Sort the bottom level nodes into the order 1, 3, 2, and 4.

[0209] In this example, the first tree is a binary tree, so the first number is set to 2. According to the order of arrangement, the bottom-level nodes 1 and 3 are selected as a pair and connected to the upper-level node p1. The second graph p1 is generated based on the first graph of devices 1 and 3, as shown in the following example. Figure 9 The dashed box shown contains devices 1, 3. The second graph p1 corresponds to the node p1.

[0210] Select the lowest level nodes 2 and 4 as a pair, and connect them to the upper level node p2. Generate the second graph p2 based on the first graph of devices 2 and 3, as shown in Figure 9 The dashed box shown contains the devices 2, 4. The second graph p2 corresponds to the node p2.

[0211] Determine the next higher level node based on nodes p1 and p2. Since there are only two nodes left in the level where nodes p1 and p2 are located, there is no need to sort them. Directly select nodes p1 and p2 as a pair to generate a next higher level node. Since the generated next higher level node has no next higher level node, this next higher level node is the root node. Figure 9 As shown, nodes p1 and p2 are connected to the root node.

[0212] At this time, the second graph p1 and the second graph p2 corresponding to the nodes p1 and p2 can be regarded as the first graph, and a larger root second graph containing the second graph p1 and p2 is generated. The root second graph corresponds to the root node. Figure 9 As shown, the root second pattern, as the largest second pattern, will include all the first patterns of devices 1, 2, 3, and 4.

[0213] The first tree finally generated has three layers, the top layer is the root node, the middle layer is node p1 and node p2, and the bottom layer is node 1, node 3, node 2, and node 4.

[0214] In the related art, in order to ensure that the layer connection point does not interfere with the device, it is usually necessary to set the first position of the layer connection point and compare it with each device respectively. The above-mentioned embodiment of steps 810 to 830 adopts the first tree. Each level of the first tree corresponds to a graph of a different size range. For example, the root node corresponds to the root second graph with the largest range. The first position is compared with the root second graph. If the first position is no longer within the range of the root second graph, it means that the first position will not interfere with the root second graph containing devices 1, 2, 3, and 4. If the first position is in the root second graph, it is compared with the second graph p1 and p2 of the next level of the root second graph respectively. Through the setting of the first tree, each comparison can simultaneously confirm whether multiple devices will be interfered with, which greatly improves the comparison efficiency of the first position. It is no longer necessary to compare with each device, thereby improving the setting efficiency of the layer connection point.

[0215] The above is a general description of step 810 to step 820. The specific implementation process of step 810 to step 830 will be described in detail below.

[0216] In step 810 , for each device on the target layer, a first graph including the devices is generated to correspond to a lowest-level node of the first tree.

[0217] In one embodiment, generating a first graphic including a device includes: generating a minimum rectangle including an edge of the device as the first graphic;

[0218] Generating a second graphic including the first graphic corresponding to the first number of lowest-level nodes includes generating a minimum rectangle including the first graphic corresponding to the first number of lowest-level nodes as the second graphic.

[0219] The minimum rectangle refers to the smallest circumscribed rectangle of the device's outer contour. All vertices of the device's outer contour lie on the edges of the minimum rectangle, and the device's outer contour is completely covered by the minimum rectangle.

[0220] Reference Figure 10 , combined with Figure 10 The generation of the first graph is explained. Figure 10 As shown, it is assumed that there are device 1, device 2, and device 3. For each device, a minimum rectangular box is generated as the first graphic, as shown in FIG. Figure 10 The dotted boxes outside the devices 1, 2, and 3 are the first graphics corresponding to each device.

[0221] If the first graphic is a randomly generated graphic that includes the edge of a device, it may cover a larger area than the device graphic itself. In this case, first positions that do not affect the device may be included in the first graphic. This will cause unnecessary first positions to be included in the selection of the first position. This embodiment uses a minimum rectangle as the first graphic, which can better fit the shape of the device edge and minimize the gap between the rectangle and the device. This allows more accurate selection of first positions when screening first positions based on the first graphic, reduces the number of unnecessary first positions to be compared, and improves setup efficiency.

[0222] In another embodiment, the first pattern may be a minimum circle that includes the edge of the device. When the shape of the edge of the device is relatively complex, the circle can better include the edge of the device and reduce the gap between the edge of the device.

[0223] In step 820, the nodes at the bottom level are sorted.

[0224] In one embodiment, referring to Figure 11 , step 820 includes:

[0225] Step 1110: Select an anchor first graph from the first graphs corresponding to the multiple lowest-level nodes;

[0226] Step 1120: Arrange the other first graphics except the anchor first graphic behind the anchor first graphic in ascending order of distance from the other first graphics to the anchor first graphic, thereby forming a first graphic sorting sequence;

[0227] Step 1130: Determine the lowest-level node order corresponding to the first graph order.

[0228] Steps 1110 to 1130 are described in detail below.

[0229] In step 1110, the anchor first graphic refers to the first graphic used as a reference for subsequent distance comparisons. The anchor first graphic can be randomly selected or selected from a first graphic near a corner. Selecting a first graphic near a corner as the anchor first graphic allows the distances between other first graphics and the anchor first graphic to provide a rough estimate of the approximate arrangement of the other first graphics in the target layer.

[0230] In step 1120, the distance between the anchor first graphic and the other first graphics refers to the minimum distance between the edge of the first graphics and the edge of the anchor first graphic. After the anchor first graphic is determined, the anchor first graphic is used as the first first graphic, the first graphic with the smallest distance from the anchor first graphic is used as the second first graphic, the first graphic with the second smallest distance from the anchor first graphic is used as the third first graphic, and so on, ultimately achieving a ranking of the first graphics.

[0231] In step 1130 , each node in the lowest level corresponds to a first graph. Therefore, after the first graphs are sorted, the order of the nodes in the lowest level can be obtained according to the order of the first graphs.

[0232] Reference Figure 12 , combined with Figure 12 The process of determining the order of the nodes at the bottom level is explained. For intuitive explanation, in this example, the edge shape of the device is used as the first graph of each. Figure 12 As shown, assume there are devices 1, 2, 3, and 4. Device 1 is selected as the anchor point, and the first graph of device 1 is used as the anchor first graph. At this point, the distance between device 3 and the anchor first graph is S1, the distance between device 2 and the anchor first graph is S2, and the distance between device 4 and the anchor first graph is S3. As shown in the figure, distance S1 is smaller than distance S2, which is smaller than distance S3. Sorting from left to right with increasing distance, the order of the first graphs of each device is: device 1, device 3, device 2, device 4. Finally, based on the correspondence between the lowest-level nodes and devices, the lowest-level node order can be determined as node 1, node 3, node 2, node 4.

[0233] Because the process of constructing the first tree requires sequentially selecting a first number of bottom-level nodes from the sorted bottom-level nodes as a group, connecting to the same upper-level node and generating a second graph containing all the first graphs of the bottom-level nodes, the distance between first graphs in the same group will have a significant impact on the size of the second graph. If the distance between first graphs is too far, the corresponding second graph will be too large, and when compared with the first position, it will cover too many irrelevant first positions.

[0234] The embodiment of steps 1110 to 1130 above selects an anchor first graphic and sorts the other first graphics from smallest to largest according to the distance between them and the anchor first graphic. In this way, when dividing the first number of bottom-level nodes, the bottom-level nodes with similar distances can be divided together as much as possible. This can avoid the problem of the second graphic being too large and covering too many irrelevant first positions, resulting in too many actually irrelevant paths being hit when searching for the first path based on the first tree. This improves the efficiency of the first path search, and more accurate first paths are hit more quickly to compare the first position with the device, thereby improving the efficiency of setting the layer connection point.

[0235] In another embodiment, referring to Figure 13 , step 820 includes:

[0236] Step 1310: Select an anchor first graph from the first graphs corresponding to the multiple lowest-level nodes;

[0237] Step 1320: Determine the first graphics other than the anchor first graphic that have the shortest distance from the anchor first graphic, and arrange them behind the anchor first graphic.

[0238] Step 1330: Update the anchor first graphic with the other first graphic that has the smallest distance from the anchor first graphic, and return to the step of determining the other first graphics other than the anchor first graphic that have the smallest distance from the anchor first graphic and arrange them after the anchor first graphic until there are no other first graphics, thereby forming a first graphic sorting.

[0239] Step 1340: Determine the lowest-level node order corresponding to the first graph order.

[0240] Steps 1310 to 1340 are described in detail below.

[0241] In step 1310, the anchor first graph is randomly selected from the first graphs of the multiple lowest-level nodes. The anchor first graph serves as a reference for finding the first graph with the shortest distance to it. In this embodiment, the anchor first graph is updated and does not repeatedly compare distances with multiple first graphs. Therefore, the anchor first graph can be randomly selected from the first graphs.

[0242] In step 1320 , the anchor first graphic is taken as the first first graphic, and after finding the first graphic closest to the anchor first graphic, the first graphic is arranged behind the anchor first graphic to form a temporary intermediate arrangement result.

[0243] In step 1330, the previously selected anchor first graphic is removed from the first graphic. The other first graphics that are closest to the anchor first graphic that were previously selected, that is, the last first graphic in the intermediate arrangement result, are used as new anchor first graphics. Among the remaining other first graphics, the first graphic that is closest to the new anchor first graphic is selected and arranged behind the new anchor first graphic to form a new intermediate arrangement result. At this time, the anchor first graphic that has been matched to the first graphic closest to the new anchor first graphic is removed from the first graphic, and the last first graphic in the new intermediate arrangement result is used as the updated anchor first graphic. The loop is executed until all the first graphics are sorted to obtain the final first graphic sequence. In the first graphic sequence formed in this way, the distance between every two adjacent first graphics is the shortest according to the order of their arrangement.

[0244] In step 1340 , each node in the lowest level corresponds to a first graph. Therefore, after the first graphs are sorted, the order of the nodes in the lowest level can be obtained according to the order of the first graphs.

[0245] Reference Figure 14 , combined with Figure 14 The process of determining the order of the nodes at the bottom level is explained. For intuitive explanation, in this example, the edge shape of the device is used as the first graph of each. Figure 14 As shown in the figure, assume there are devices 1, 2, 3, and 4. First, select the first graphic of device 1 as the anchor first graphic. The distance between devices 1 and 3 is S1, the distance between devices 1 and 2 is S2, and the distance between devices 1 and 4 is S3. Distance S1 is the smallest, so the first graphic that matches the anchor first graphic is device 3's first graphic. Arrange the first graphic of device 3 after the first graphic of device 1, forming the middle arrangement: device 1, device 3.

[0246] Since the first graphic of device 1 has been matched to the first graphic closest to it, the first graphic of device 1 is removed and does not participate in the subsequent selection.

[0247] Next, the first graphic of device 3 is used as the anchor first graphic. At this point, the distance between device 3 and device 4 is S4, and the distance between device 3 and device 2 is S5. S4 is the smallest, so the first graphic that matches the current anchor first graphic (device 3) is device 4's first graphic. Device 4's first graphic is placed after device 3's first graphic, forming the intermediate arrangement: device 1, device 3, device 4.

[0248] Similarly, remove the first graphic of device 3. Set the first graphic of device 4 as the current anchor first graphic. Since only device 2 remains, the first graphic that matches the current anchor first graphic (device 4) is device 2's first graphic. Place the first graphic of device 2 after the first graphic of device 4, forming the following first graphic order: device 1, device 3, device 4, device 2.

[0249] Finally, according to the correspondence between the nodes in the lowest level and the devices, it can be determined that the nodes in the lowest level are sorted as node 1, node 3, node 4, and node 2.

[0250] When the anchor first graphic is fixed, the other first graphics are sorted according to the distance from the fixed anchor first graphic. Figure 14 For example, if device 1 is selected as the fixed anchor first pattern, the second first pattern in the sorting (device 3) is closest to the anchor first pattern. However, since the third first pattern (device 2) is sorted by distance from the anchor first pattern, the closest distance to device 3 should be device 4, not device 2. This shows that when sorting by a fixed anchor first pattern, the distance between two adjacent first patterns may not be the closest.

[0251] In the embodiment of steps 1310 to 1340 above, each time a closest first graphic is found, it is used as the anchor first graphic, and the original anchor first graphic is no longer involved in the matching process. The first graphic closest to the anchor first graphic is continuously used as the new anchor first graphic. This ensures that the distance between each adjacent first graphic in the sorting process is minimized.

[0252] In another embodiment, referring to Figure 15 , step 820 includes:

[0253] Step 1510: Determine the first graph center of the first graph corresponding to each bottom-level node;

[0254] Step 1520: Generate multiple candidate broken line segments connecting multiple first graphic centers;

[0255] Step 1530: Determine the target candidate polyline segment with the shortest length among the multiple candidate polyline segments;

[0256] Step 1540: Sort the nodes at the lowest level based on the order in which the target candidate polyline segments pass through the center of the first graphic.

[0257] Steps 1510 to 1540 are described in detail below.

[0258] In step 1510, the center of the first figure refers to the center position of the first figure. If the distance between two first figures is determined by their edges, many different possibilities will be generated due to the different shapes of the first figures. This will lead to multiple possibilities when subsequently determining candidate polyline segments, and may cause conflicts. Therefore, the center of the first figure is determined as the calibration of the first figure, so that each polyline segment between two first figures is unique.

[0259] In step 1520, a candidate polyline segment is a polyline segment formed by connecting the centers of the first shapes. Since different polyline segments are generated by selecting different first shape centers as the starting point and different next first shape centers as the next connection point, multiple candidate polyline segments are generated.

[0260] Assuming there are N first-figure centers, there are N choices for the starting point of the candidate polyline segment, and N-1 choices for the second point. Therefore, there will be N! / 2 candidate polyline segments connecting all N first-figure centers.

[0261] In step 1530, the target candidate polyline segment is the polyline segment with the shortest total length selected from the N! / 2 candidate polyline segments. Since the length of each polyline segment represents the distance between the centers of two first figures, the total length of the polyline segments represents the overall distance between two adjacent first figures in the order in which the polylines are connected. In other words, the shorter the polyline segment length, the shorter the overall distance between two adjacent first figures.

[0262] In step 1540, any end of the target candidate polyline segment is selected as the starting point. The order of the polyline connection points can be used as the order of the first figure, that is, the order of passing through the center of the first figure. Based on the correspondence between the lowest level nodes and the first figure, the lowest level nodes are sorted according to the order of the first figure.

[0263] Reference Figure 16 , combined with Figure 16 The process of determining the order of the nodes at the bottom level is explained. For intuitive explanation, in this example, the edge shape of the device is used as the first graph of each. Figure 16 As shown, it is assumed that there are existing devices 1, 2, and 4. The center point of the first graph of each device is determined.

[0264] First, select device 1 as the starting point and connect the centers of the first graphs to obtain the following: Figure 9 The candidate broken line segment 124 shown in the top figure and Figure 9 The middle figure shows a candidate polyline segment 142 .

[0265] Then, device 2 is selected as the starting point, and the centers of the first figures are connected to obtain a fold line segment 214 and a fold line segment 241. Since the fold line segment 241 is actually the same as the fold line segment 142, a candidate fold line segment 214 is finally obtained with device 2 as the starting point.

[0266] Then, selecting device 4 as the device and connecting the centers of the first figures, we can obtain fold line segments 412 and 421. Since fold line segment 412 is actually identical to candidate fold line segment 214, and fold line segment 421 is actually identical to candidate fold line segment 124, three candidate fold line segments are ultimately determined: candidate fold line segment 124, candidate fold line segment 142, and candidate fold line segment 214.

[0267] like Figure 9 As shown, among the three candidate fold line segments, candidate fold line segment 124 is the shortest. Therefore, candidate fold line segment 124 is selected as the target fold line segment. As can be seen from the figure, the order of the first graph corresponding to this target fold line segment is device 1, device 2, and device 4. Finally, based on the correspondence between the nodes and devices in the lowest level, the order of the nodes in the lowest level can be determined to be node 1, node 2, and node 4.

[0268] In the above two embodiments, both adopt the method of selecting an anchor first graphic and then determining the first graphic with the shortest distance to the anchor first graphic. This method only considers the comparison between the two first graphics during the comparison, and does not consider the overall situation after the sorting.

[0269] The embodiment of steps 1610 to 1640 above utilizes a method for generating candidate fold line segments, and the lengths of the fold line segments can be used to map the overall distance between adjacent first graphics after sorting. The shortest candidate fold line segment is selected as the target fold line segment. As a result, the distance between the centers of each two first graphics in the target fold line segment is compressed sufficiently close. Such sorting helps minimize the distance between two adjacent first graphics.

[0270] In step 830, the first number of bottom-level nodes are taken out in order, and a second graph including the first graph corresponding to the first number of bottom-level nodes is generated, so as to correspond to the upper-level nodes connected upward to the first number of bottom-level nodes, until a first tree is generated.

[0271] In one embodiment, referring to Figure 17 , the first number is determined as follows:

[0272] Step 1710: Set a first number counter, where the initial value of the first number counter is 2;

[0273] Step 1720: Take out the first number counter's lowest level nodes according to the sorting, and generate a second graph including the first graph corresponding to the first number counter's lowest level nodes;

[0274] Step 1730: Take out the next lowest level node according to the sorting;

[0275] Step 1741: If the first graph corresponding to the next lowest-level node is not included in the second graph, read the first number from the first number counter;

[0276] Step 1742: If the first graph corresponding to the next lowest-level node is included in the second graph, add 1 to the first number counter, and return to the step of extracting the first number counter lowest-level nodes according to the sorting.

[0277] Steps 1710 to 1742 are described in detail below.

[0278] In step 1710 , the first number counter refers to a module for counting the first number of first graphics that need to be selected, and may be composed of a piece of program code.

[0279] In this embodiment, in order to simultaneously filter out multiple first graphics when comparing the first position with nodes at each level of the first tree using the first tree, the nodes above the lowest level node in the first tree must include at least two nodes at the lowest level. Therefore, the initial value of the first number counter is set to 2, so that the nodes in the upper level can contain at least two first graphics.

[0280] In step 1720, the sorting refers to the sorting of the nodes at the lowest level obtained based on the method provided in the previous embodiment.

[0281] The first number counter "a" refers to the number of the first number recorded in the current first number counter. For example, if the current value in the first number counter is 2, the first number counter "a" refers to 2.

[0282] In step 1730, extracting the next lowest-level node means extracting the next lowest-level node corresponding to the last node in the extracted lowest-level node after extracting the lowest-level nodes according to the first number counter. For example, there are currently four lowest-level nodes, and from left to right, the order is node 1, node 3, node 2, and node 4. Assuming that the value in the first number counter is 2, after extracting node 1 and node 3, the node next to node 3 (node ​​2) is extracted.

[0283] In step 1741, the second graph is generated based on the first graph corresponding to the first number counter retrieved in step 1720. If the next lowest-level node is not included in the second graph, the second graph can only accommodate the first graphs corresponding to the first two lowest-level nodes. Including a third first graph would make the second graph too large, resulting in illogical grouping of the lowest-level nodes. The value read from the first number counter is used as the first number. In this case, the first number is the initial value 2.

[0284] In step 1742 , when step 1742 is executed for the first time, the second graph refers to the second graph generated based on the first graph corresponding to the first number counter lowest-level nodes retrieved in step 1720 .

[0285] If the first graphic corresponding to the next lowest-level node is included in the second graphic, it means that the second graphic at this time can still accommodate the third first graphic, so it is necessary to add one to the first number counter. At this time, the value of the first number counter is 3, indicating that the current first to third first graphics should be regarded as a group.

[0286] At this point, a new second graph is generated (containing three first graphs). Based on the new second graph, it is determined whether the fourth first graph can be included. If so, the first number counter is incremented by one, and a new second graph is generated again (containing four first graphs). This process is repeated until the second graph can no longer contain the next first graph. The value of the first number counter at this point is used as the first number to group the first number of consecutive bottom-level nodes into one group.

[0287] Reference Figure 18 , combined with Figure 18 The process of determining the first number is explained. Figure 18 Two examples are shown. Figure 18 In the example above, the lowest level nodes are ordered as follows: Node 1, Node 3, Node 2, Node 4. The value of the first number counter is initialized to 2. Select Node 1 and Node 3 in that order. Node 1 corresponds to the first graph of Device 1, and Node 3 corresponds to the first graph of Device 3 (the dotted box representing the first graph is omitted for clarity). Generate a second graph containing the first graphs of Device 1 and Device 3 (e.g. Figure 18 (shown in the dashed box). The next node after node 3 is node 2, which corresponds to the first graph of device 2 in the figure. It can be seen that device 2 is not included in the second graph. Therefore, the initial value 2 is read from the first number counter as the first number.

[0288] exist Figure 18In the example of the line and surface part, the order of the nodes in the lowest level is: node 1, node 3, node 2, node 4. The value of the first number counter is the initial value 2. Select node 1 and node 3 in order, node 1 corresponds to the first graph of device 1, and node 3 corresponds to the first graph of device 3. Generate a second graph containing the first graphs of device 1 and device 3 (such as Figure 18 (shown in the dashed box). At this point, the next node after node 3 is node 2. Node 2 corresponds to the first graph of device 2 in the diagram. Therefore, device 2 is now included in the second graph. Therefore, a more reasonable grouping would be to group nodes 1, 3, and 2 together to generate the second graph. The first number counter is incremented by 1, and the value of the first number counter is now 3. Therefore, the value 3 is read from the first number counter as the first number.

[0289] If, when determining the first number, a fixed value, such as 2, is directly set, and if the second graphs generated by the first and second first graphs can contain the third first graph, grouping is still performed using the fixed value 2 as the first number. In this case, the second graphs generated by the third and fourth first graphs will overlap with the second graphs generated by the first and second first graphs. In this way, if the first position subsequently overlaps the two second graphs, both first paths will be hit simultaneously, increasing the number of judgments. Clearly, this grouping method is not rational.

[0290] The embodiment of steps 1710 to 1742 above determines whether the adjacent next-bottom-level node can also be included in the second graph. If so, the bottom-level node is included together with the previously selected bottom-level node as a group. The first number determined in this way is more accurate and reasonable, which can reduce overlapping second graphs. This reduces the situation where a first position hits multiple different first paths when searching for the first path, reduces the ineffective comparison process, and thus improves the overall setting efficiency.

[0291] In another embodiment, the same steps 1710 to 1730 as those in the above embodiment are performed. At this time, the first graphic corresponding to the next lowest-level node is also accommodated in the second graphic. The size change between the second graphic after accommodating the first graphic corresponding to the next lowest-level node and the previous second graphic is determined. If the size change is within the range, the first graphic is accommodated in the second graphic, the first number counter is incremented by one, and the second graphic is updated. Based on the updated second graphic, the next lowest-level node is selected, and the above steps are repeated until the change in the second graphic exceeds the range. The value of the first number counter at this time is used as the first number. Exemplarily, the size change range can be that the area of ​​the second graphic changes within 5%, or the length and width of the second graphic change within 5%. In this embodiment, whether to include the next lowest-level node in the group is determined based on the size change range of the second graphic to obtain the first number, which can reduce the number of overlapping second graphics.

[0292] In one example, each time the size variation range of the second graphic is determined, the determination is made based on the initial shape and size of the second graphic. This effectively controls the final value of the first number and avoids grouping too many bottom-level nodes into one group, which would result in an overly large second graphic.

[0293] In another example, each time the size variation range of the second graphic is determined, the determination can be made based on the shape and size of the previous second graphic, which can further reduce the number of overlapping second graphics.

[0294] In one embodiment, referring to Figure 19 , generating a second graph including the first graph corresponding to the first number of bottom-level nodes, including:

[0295] Step 1910: Determine the first number of sides of the second figure based on the first number;

[0296] Step 1920: Generate a minimum regular polygon with a first number of sides of the first graph corresponding to the first number of lowest-level nodes as the second graph.

[0297] Step 1910 and step 1920 are described in detail below.

[0298] In step 1910, the first number refers to the number of nodes at the lowest level that are grouped together. The second graph needs to include the first graph of all nodes at the lowest level of the corresponding group. Therefore, the first number of edges of the second graph is determined based on the first number.

[0299] In one example, a number-edge-number mapping table may be provided. After obtaining the first number, the first edge number corresponding to the first number is obtained by querying the number-edge-number mapping table.

[0300] In another example, a conversion relationship formula can be set, such as B = D + 1, where B is the first number of sides and D is the first number. After obtaining the first number, the first number is substituted into the conversion relationship formula to calculate the first number of sides. For example, when the first number is 2, the first number of sides B = 2 + 1 = 3.

[0301] In step 1920, the minimum regular polygon refers to a special shape among polygons, such as an isosceles right triangle or a regular triangle among triangles, a square among quadrilaterals, a regular pentagon among pentagons, and the like.

[0302] Reference Figure 20 , combined with Figure 20 Explain the generation of the second graph. Figure 20 As shown in the figure, assuming the first number is 2, the order of the nodes in the lowest level is Node 1, Node 3, Node 2, and Node 4. Select the first number of nodes in the lowest level in order, that is, select Node 1 and Node 3 as a group to generate the second graph. The second graph needs to include the first graph of Device 1 and the first graph of Device 3.

[0303] Assume that there is a conversion formula B=D+1, where B is the first side number and D is the first number. Substituting the first number into the formula, the first side number is 3. As shown in the figure, an isosceles right triangle is generated that can contain device 1 and device 3 (such as Figure 20 The bold triangle dotted frame in the figure is used as the second figure.

[0304] If the second graphic is fixed as a rectangular frame, such as Figure 20 From the thinner rectangular dotted frame, it can be seen that the area of ​​the rectangular dotted frame is significantly larger than that of the triangular dotted frame, and the gap between the rectangular dotted frame and devices 1 and 3 is also significantly larger than the gap between the triangular dotted frame and devices 1 and 3.

[0305] When forming a rectangle of the first figure, it contains only one device, so wrapping it with a single rectangle is acceptable. However, the second figure includes multiple first figures, which are uneven. Forcibly wrapping them with a single rectangle may result in large gaps within the rectangle. In the embodiment of steps 1910 to 1920 described above, the number of first sides of the second figure is determined by the first number. As the second figure contains more first figures, a more multi-sided polygon is used as the second figure to wrap these first figures, thereby reducing the gaps between them.

[0306] Detailed description of step 330

[0307] In step 330 , a first path is determined from top to bottom on the first tree, and each node on the first path satisfies a first relationship with the first position.

[0308] In one embodiment, referring to Figure 21 , step 330 includes:

[0309] Step 2110: Use the root node of the first tree as the base node;

[0310] Step 2120: Determine a target node at a lower level among nodes at a lower level of the base node, where the target node satisfies a first relationship with the first position.

[0311] Step 2130: Update the base node with the target node, and return to the step of determining the target node of the next lower level among the nodes of the next lower level of the base node, until there is no node of the next lower level, and the target nodes of each level constitute the first path.

[0312] Steps 2110 to 2130 are described in detail below.

[0313] In step 2110, the first tree is a tree generated using the first graphs of each device as the lowest-level node according to the above embodiment. The root node is the top-level node of the first tree, and the second graph corresponding to the root node is the largest second graph, which contains all the first graphs corresponding to the lowest-level nodes.

[0314] In step 2120, the next-level node of the base node refers to the child node of the base node connected to the base node with the base node as the parent node. The target node and the first position satisfying the first relationship means that there is an overlap between the first position and the first graph / second graph corresponding to the target node.

[0315] In step 2130, the base node is updated with the target node, that is, the current target node is used as the parent node, and the search continues to the child nodes of the next lower level connected to the parent node, and a new target node is determined therefrom. The search continues downward until the lowest level node is searched, and the last target node is selected from the lowest level node connected to the previous target node. The first path refers to the node path formed in which a target node is determined at each level from the root node to the lowest level node. If the target node cannot be found at an intermediate level during the search process, or there is no lowest level node that meets the conditions, then this incomplete path cannot be used as the first path.

[0316] Reference Figure 9 , combined with Figure 9 Explain the determination of the first path. Figure 9 As shown, in Figure 9 In the target layer diagram in FIG, a circle is used to represent the first position of the layer connection point. Starting from the root node, the first position is located in the root second graph of the root node (the largest dotted box in the diagram).

[0317] The root node is considered the base node, and its child nodes one level below it are nodes p1 and p2. As can be seen from the figure, the first position is located in the second graph p1 and does not overlap with the second graph p2, so node p1 can be determined to be the target node.

[0318] Node p1 is used as the new base node, and the child nodes of node p1 to the next level are node 1 and node 3. As can be seen from the figure, the first position is located in the dotted box of device 3, and there is no overlap with the dotted box of device 1, so node 3 can be determined as the target node. Since node 3 is already the lowest level node and has no child nodes below it, it can be determined that a complete first path has been searched. The first path corresponding to the first position is root node-node p1-node 3 (as shown in the figure). Figure 9 (indicated by the dashed arrow).

[0319] like Figure 9 In the target layer shown, if the existing layer connection point setting method is used, the first position needs to be compared with devices 1 to 4 to determine whether the devices will be affected. However, in the embodiment of steps 2110 to 2130 described above, the first path is searched through the first tree. When node p1 is determined to be the target node during the first path determination, devices 2 and 4 connected to node p2 can be directly excluded without separate comparison. After node p1 is determined to be the target node, the first graph corresponding to nodes 1 and 3 is directly used to quickly determine that the device that may be affected by the first position is device 3. Ultimately, the first position only needs to be compared separately with the outer contour of device 3 to determine whether setting the layer connection point at the first position will affect device 3. As can be seen, the original need for separate comparisons with four devices, by searching the first path based on the first tree, only a separate comparison with device 3 is required, greatly reducing the number of comparisons for the first position, thereby improving the efficiency of layer connection point setting.

[0320] Detailed description of step 340

[0321] In step 340 , based on the second relationship between the lowest-level node on the first path and the first position, the layer connection point is set to the first position.

[0322] In one embodiment, the first relationship includes: the first position is located in the first graph or the second graph corresponding to the node. Figure 22 , step 340 includes:

[0323] Step 2210: If the first position is outside the device corresponding to the lowest-level node and the distance from the device is greater than the first distance, the layer connection point is set to the first position.

[0324] Step 2210 is described in detail below.

[0325] In step 2210, the first distance is the minimum distance at which the layer connection point at the first location does not overlap with the device and does not interfere with the device. In one embodiment, the first distance is the distance between the center point of the first location and the center point of the device. In another embodiment, the first distance may be the shortest distance between the edge of the first location and the edge of the device's outer contour.

[0326] Reference Figure 23 , combined with Figure 23 How to set up a layer connection based on the second relationship between the first path and the first position is described in detail. Figure 23 The circle in the figure represents the first position that needs to be determined. First, the first position satisfies the first relationship with the root node, meaning it is located within the second graph corresponding to the root node. Continuing with the determination of nodes p1 and p2, which are connected downward from the root node, the first position is determined to be within the second graph corresponding to node p1. Furthermore, the determination of nodes 1 and 3, which are connected downward from node p1, is determined to be within the first graph corresponding to node 3.

[0327] Finally, a second relationship judgment is performed between the first position and the device 3 corresponding to the node 3. As shown in the figure, the first position is outside the device 3 and the distance from the device 3 is greater than the first distance, so the layer connection point is set at the first position.

[0328] In the above embodiment, by setting the first relationship, the first path is quickly searched within the first tree by determining whether the first position is within the first or second graph corresponding to the node, and the device closest to the first position is determined through the first path. Determining whether the first position is within the first or second graph can be done through a simple coordinate comparison, which is computationally simple and fast, thereby improving the efficiency of searching the first path.

[0329] In one embodiment, the first position is embodied as an area box in the target layer that accommodates the layer connection point. Figure 24 , the distance from the device is determined as follows:

[0330] Step 2410: Generate the shortest line segment from a point on the area frame to a point on the edge of the device;

[0331] Step 2420: Determine the length of the shortest line segment as the distance from the device.

[0332] Step 2410 and step 2420 are described in detail below.

[0333] In step 2410, the area frame refers to the smallest rectangular frame that accommodates the layer connection points. The shortest line segment refers to the straight line segment between the edge of the area frame and the closest point to the edge of the device.

[0334] In step 2420 , the distance from the device refers to the distance between the first location and the device.

[0335] Reference Figure 25 , combined with Figure 25 Determining the distance from the device is described in detail. Figure 25 As shown, the circle represents the layer connection point, the dashed box outside the circle represents the region box, and the triangle represents the device's outer contour. As shown in the figure, the region box is a square, and the vertex located at the lower left of the region box is closest to the device's outer contour. Since the vertex faces one of the device's outer contour edges, the minimum distance between the vertex and the device's outer contour should be the perpendicular line segment between the vertex and this edge. The length of this perpendicular line segment is used as the distance between the first position and the device.

[0336] If the distance between the center of the layer connection point and the center of the device is used as the distance between the first position and the device, the first distance used to determine whether the layer connection point interferes with the device will also need to change continuously due to differences in the shapes and sizes of different devices. This affects the accuracy of the judgment and requires repeated confirmation of different first distances. The above-mentioned embodiments of steps 2410 and 2420 use an area frame to use the shortest line segment from a point on the area frame to a point on the edge of the device as the distance between the first position and the device. Regardless of how the shape of the device changes, the distance at which the layer connection point is close to the edge of the device to a certain extent and will interfere with the device is fixed. Therefore, when the shortest line segment from a point on the area frame to a point on the edge of the device is used for judgment, a fixed first distance can be determined without repeatedly determining the first distance.

[0337] In one embodiment, referring to Figure 26 , the first distance is determined as follows:

[0338] Step 2610: Obtain the coverage area of ​​the device on the target layer;

[0339] Step 2620: Obtain the failure rate of the device;

[0340] Step 2630: Determine a first distance based on the coverage area and the failure rate.

[0341] Steps 2610 to 2630 are described in detail below.

[0342] In step 2610, the coverage area of ​​the device on the target layer refers to the area of ​​the pattern formed by the outer contour of the device when viewed from a top-down angle.

[0343] In step 2620 , the failure rate of a device is the ratio of the number of devices that cannot work normally to the total number of the same devices in the same working state.

[0344] In step 2630, determining the first distance based on the coverage area and the failure rate means using the coverage area and the failure rate as input parameters and obtaining the first distance through a preset algorithm.

[0345] In one embodiment, the first distance can be obtained by the following steps:

[0346] A first score is obtained based on the coverage area. The larger the coverage area, the higher the first score. For example, an area score mapping table can be pre-constructed. In the area score mapping table, there are multiple area ranges, and each area range corresponds to a score; based on the coverage area, the area score mapping table is queried for the area range to which it belongs, thereby obtaining the corresponding first score. For example, a linear function of direct proportion can also be constructed, such as y=ax+b, where y is the first score, x is the coverage area, and a and b are coefficients set based on experience. The coverage area is input into the linear function, and the corresponding first score is obtained by calculation.

[0347] A second score is obtained based on the failure rate. The higher the failure rate, the larger the second score. For example, a mapping table between failure rates and second scores can be constructed, and the second score corresponding to the failure rate of the target device can be obtained by lookup. Alternatively, a conversion equation between the failure rate and the second score can be automatically learned from historical statistical data on failure rates and second scores. The second score is calculated by inputting the failure rate of the target device into the conversion equation.

[0348] The first distance is obtained based on the first score and the second score; wherein the first score and the second score are both proportional to the first distance. For example, the first distance can be obtained based on the sum of the first score and the second score by summing the first score and the second score. Alternatively, the first score and the second score are averaged to obtain an average score; and the first distance is determined based on the average score. In other examples, since components with high failure rates are more likely to be interfered with, a greater distance is required when setting layer connection points near them. Therefore, a greater weight is given to the second score, and a weighted average is taken of the first score and the second score to obtain a weighted average. The first distance is then determined using the weighted average.

[0349] Because different devices are susceptible to interference to varying degrees, a statistically determined first distance may not cover all devices. In the embodiments of steps 2610 to 2630 above, the first distance is determined based on the device failure rate and coverage area. Setting different first distances for different devices increases flexibility and reduces errors in determining whether interference will occur.

[0350] In one embodiment, the first path is a plurality of first paths. Step 2210 includes:

[0351] If the first position is located outside the device corresponding to the lowest-level node on each first path and the distance from each device is greater than the first distance, the layer connection point is set to the first position.

[0352] Reference Figure 27 , combined with Figure 27 The determination of the first position when there are multiple first paths is described in detail. Figure 27 As shown, the circle in the figure represents the first position. As shown in the figure, the first position will search in the first tree to obtain two first paths. One of the first paths is the root node - node p1 - node 3, and the other first path is the root node - node p2 - node 4.

[0353] Through the two first paths, it can be determined that the first position overlaps with the first graphic of device 3 (the dotted box containing device 3 in the figure) and the first graphic of device 4 (the dotted box containing device 4 in the figure).

[0354] The first position is compared with device 3 and device 4. If the first position is outside device 3 and device 4 and the distance between the first position and device 3 and device 4 is greater than the first distance, the layer connection point can be set at the first position.

[0355] In this embodiment, by determining the first path based on the first tree, all devices that may conflict with the first position can be quickly determined. The first position only needs to be compared with the devices corresponding to the first path to determine whether there is a conflict.

[0356] In another embodiment, the first path is a plurality of first paths. Figure 28 , step 340 includes:

[0357] Step 2810: For each first path, determine a target first path based on the distance between the device corresponding to the lowest-level node on the first path and the first position;

[0358] Step 2820: Set the layer connection point to the first position based on the second relationship between the lowest level node on the target first path and the first position.

[0359] Steps 2810 and 2820 are described in detail below.

[0360] In step 2810 , the target first path refers to a first path among the multiple first paths, in which the distance between the device corresponding to the lowest-level node on the first path and the first position is the shortest.

[0361] In step 2820, since the device on the target first path is the shortest distance from the first position, the device on the first target path is most likely to be interfered with by the layer connection point set at the first position. Therefore, if the device on the first position and the device on the first target path both satisfy the second relationship, then the first position and the devices on the other first paths also satisfy the second relationship, and thus the layer connection point can be set at the first position. The second relationship includes the first position being outside the device and being farther from the device edge than the distance that would interfere with the device.

[0362] Reference Figure 29 , combined with Figure 29 The selection of the target first path and the determination of the first position based on the target first path are described in detail. Figure 29 As shown, the circle in the figure represents the first position. At this time, the first position determines two first paths based on the first tree. One of the first paths is the root node - node p1 - node 3, and the other first path is the root node - node p2 - node 4.

[0363] Determine the distances between the first position and the devices corresponding to Node 3 and Node 4, respectively. As shown in the figure, the distance between the first position and the edge of Device 3 is S1, and the distance between the first position and the edge of Device 4 is S2. Because distance S1 is less than distance S2, "root node - node p1 - node 3" is determined as the target first path.

[0364] In the case of multiple first paths, it is necessary to determine whether the second relationship is satisfied between the first position and the device corresponding to each first path. Multiple repeated comparisons are required. The embodiment of the above steps 2810 and 2820 adopts the method of first determining the target first path with the device closest to the first position from multiple first paths. The device corresponding to the lowest level node of the target first path is used to determine whether the second relationship is satisfied with the first position. If the device with the closest distance can satisfy the second relationship with the first position, then the other devices with a farther distance can also satisfy the second relationship with the first position. In this way, there is no need to make a judgment between the first position and the device corresponding to each first path, which saves the judgment process, can more quickly determine whether the first position can set the layer connection point, and improve the efficiency of setting the layer connection point.

[0365] In another embodiment, the first relationship includes: the first position is located in the first graph or the second graph corresponding to the node, or is located outside the first graph or the second graph corresponding to the node but the distance to the first graph or the second graph is less than the second distance. Figure 30 , step 340 includes:

[0366] Step 3010: If the first position is outside the device corresponding to the lowest level node and the distance from the device is greater than a third distance, then set the layer connection point to the first position, wherein the third distance is greater than the second distance.

[0367] Step 3010 is described in detail below.

[0368] In step 3010, the second distance refers to the minimum distance between the first position and the edge of the first or second graph without causing interference. The third distance refers to the limited distance between the first position and the device corresponding to the lowest-level node in the first path. Since the second distance is the distance between the first position and the edge of the first or second graph, and the third distance is the distance between the first position and the edge of the device, and the device is inside the first or second graph, the third distance should be set to be larger than the second distance.

[0369] In some cases, such as when the edge of a first or second figure overlaps with the edge of a device it contains, even if a layer connection point is not located within the first or second figure, if the layer connection point is located on the side of the edge of the first or second figure that overlaps with the device edge, and the distance between the first position and the edge is sufficiently small, it may still cause interference to the device. Therefore, if the distance between the first position and the edge of the first or second figure is less than the second distance, the first or second figure should also be included in the screening range.

[0370] Reference Figure 31 , combined with Figure 31 Selecting the first path according to the first relationship and determining the first position based on the first path are described in detail. Figure 31 As shown, the circle in the figure represents the first position. In this example, there is overlap between the vertex on the right side of device 1, the right edge of the first graph of device 1, and the right edge of the second graph p1. The first position is also located exactly to the right of the first graph of device 1 and the second graph p1. Therefore, when searching for the first path based on the first tree, the first relationship must include that the distance between the first position and the first or second graph is less than the second distance.

[0371] As shown in the figure, since the right edge of the first figure of the device 1 coincides with the right edge of the second figure p1 , the distances between the first position and both the first and second figures p1 of the device 1 are S.

[0372] Since S is smaller than the second distance, even though the first position is not in any graph other than the root second graph corresponding to the root node, the first path can still be determined: root node-node p1-node 1.

[0373] After determining the first path, a first position is determined based on the first path and needs to be determined relative to device 1. If the distance between the first position and the outer edge of device 1 is greater than a third distance, the layer connection point is set at the first position. If the distance between the first position and the outer edge of device 1 is less than the third distance, the first position is skipped.

[0374] Since there is a situation where the first position of the layer connection point is not in the first graph or the second graph, but the distance between the first position and the edge is small enough, it may also cause interference to the device. If the criterion for hitting the node when searching for the first path is based solely on whether the first position is in the first graph or the second graph, it is easy to miss the first position that is not in the first graph or the second graph but may interfere with the device. The embodiment of the above-mentioned step 3010 uses a first relationship containing a second distance to determine the first path, so that a first position that is not in the first graph or the second graph but is close enough to interfere with the device can also determine a first path to determine whether the first position can really set a layer connection point. This can avoid missing the first position that may interfere with the device and improve the accuracy of setting the layer connection point.

[0375] Detailed implementation diagram of the layer connection point setting method of the disclosed embodiment

[0376] Refer to the following Figure 32 , which illustrates in detail the implementation details of the method for setting layer connection points in the multi-layer quantum chip of the embodiment of the present disclosure.

[0377] In step 3210, a target layer is input. The target layer refers to the layout corresponding to the layer where the layer connection points are to be set. The layout includes the target layer and the shape and position information of the devices set on the target layer.

[0378] In step 3220, a graphic list including first graphics of each device in the target layer is obtained, wherein the first graphic is a minimum rectangle including the edge of the device.

[0379] In step 3230, the graph list is constructed into a first tree. The first tree includes multiple levels of nodes, wherein each bottom-level node corresponds to a first graph in the graph list, and each non-bottom-level node is connected to a first number of nodes in a lower level and corresponds to a second graph on the target level that includes the first graph corresponding to the first number of nodes.

[0380] The specific steps of constructing the first tree include steps 3231 to 3233:

[0381] In step 3231, each first graph in the graph list is used as a bottom-level node of the first tree.

[0382] In step 3232, the nodes in the lowest level are sorted. The steps include selecting an anchor first graphic from the first graphics corresponding to the multiple nodes in the lowest level; determining the first graphic with the smallest distance from the anchor first graphic among the first graphics other than the anchor first graphic and arranging it after the anchor first graphic; updating the anchor first graphic with the first graphic with the smallest distance from the anchor first graphic; and returning to the step of determining the first graphic with the smallest distance from the anchor first graphic among the first graphics other than the anchor first graphic and arranging it after the anchor first graphic, until no other first graphics are found, thereby forming a first graphic sorting; and determining the lowest level node sorting corresponding to the first graphic sorting.

[0383] In step 3233, the first number of bottom-level nodes are taken out in order, and a second graph is generated containing the first graph corresponding to the first number of bottom-level nodes, so as to correspond to the upper-level nodes connected upward to the first number of bottom-level nodes, until the first tree is generated.

[0384] In step 3240, the order of rows and columns is arranged to determine whether to set layer connection points, which includes steps 3241 to 3246.

[0385] In step 3241, the first position of each layer connection point to be set is determined according to the position mapping rule using the layer connection point matrix, wherein the layer connection point matrix includes a plurality of layer connection points arranged regularly with equal spacing.

[0386] In step 3242, a region frame of a first position of the layer connection point is constructed, wherein the first position is embodied as a region frame in the target layer that accommodates the layer connection point.

[0387] In step 3243, the area box is judged to intersect with each node of the first tree to obtain a first path list. Among them, the area box is judged to intersect with the first graph or the second graph corresponding to each node. For example, the area box is determined to intersect with the node by the existence of an intersection between the function corresponding to each side of the area box and the function corresponding to each side of the first graph or the second graph corresponding to each node. For another example, based on the edge coordinates of the area box, when there is an edge coordinate located in the first graph or the second graph corresponding to the node, it is determined that the area box intersects with the node. The nodes that intersect with the area box in each level of the first tree are used as target nodes, and at least one first path is obtained based on the target node.

[0388] In step 3244, a determination is made as to whether the distance between the layer connection point and each device in the first path list is greater than a first distance. Each first path in the first path list corresponds to a device. A determination is made as to whether the minimum distance between the edge of the region frame of the layer connection point and the edge of each device is greater than the first distance. The first distance is the minimum distance between the layer connection point and the device without overlapping or interfering with the device.

[0389] If it is less than the first distance, step 3245 is executed to skip the connection point of this layer and not set it.

[0390] If it is greater than the first distance, execute step 3246 to set the layer connection point at the first position.

[0391] Repeat steps 3242 to 3246 until all layer connection points are set.

[0392] In step 3250, local layer connection points are fine-tuned. In step 3240, the settings of all layer connection points are determined, and some of the set layer connection points that may interfere with the device are fine-tuned.

[0393] In step 3260, the target layer is output. Here, the target layer is the target layer layout after the layer connection points are set. The layout includes the target layer, the devices set on the target layer, and the shape and position information of the layer connection points.

[0394] The benefits of step 3210 to step 3260 include, but are not limited to, using the first tree to search from top to bottom, which reduces the search time and improves the efficiency of setting layer connection points compared to the prior art of comparing with each device.

[0395] like Figure 33 As shown, Figure 33 The effect of setting the layer connection point based on the layer connection setting method of steps 3210 to 3260 is shown. Figure 33 The square in the figure represents a layer connection point; the triangle, quadrilateral and rectangle represent three different devices respectively; and the dotted rectangular box represents the first figure.

[0396] The time cost of setting the layer connection points of the existing technical solution is compared under the same experimental conditions, such as Figure 34 As shown in the figure, it can be seen that the layer connection point setting method proposed in this disclosure can greatly reduce the time overhead of automatically laying layer connection points, thereby greatly improving the efficiency of layer connection point setting. It should be noted that due to the different types and complexities of different layout devices, the number of layer connection points and the time overhead are not strictly positively correlated.

[0397] Description of the multi-layer quantum chip of the present disclosure

[0398] The disclosed embodiments provide a multilayer quantum chip. The multilayer quantum chip comprises multiple layers, including a target layer. The target layer comprises devices and layer connection points, which are used to connect the target layer to adjacent layers in the multiple layers. The layer connection points are set according to the layer connection point setting methods for multilayer quantum chips provided in the aforementioned embodiments.

[0399] Description of the apparatus and device of the present disclosure

[0400] It is to be understood that, although the steps in the above-mentioned flowcharts are shown in sequence according to the arrow representations, these steps are not necessarily performed in sequence according to the order represented by the arrows. Unless otherwise specified in the present embodiment, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the above-mentioned flowcharts may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these steps or stages is not necessarily performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the steps or stages in other steps.

[0401] Figure 35 This is a schematic diagram of the structure of the layer connection point setting device 3500 provided in an embodiment of the present disclosure. The layer connection point setting device 3500 includes:

[0402] A first position acquisition unit 3510 is used to acquire a first position on the target layer where the layer connection point is to be set;

[0403] A first tree acquisition unit 3520 is configured to acquire a first tree, the first tree including nodes at multiple levels, wherein each node at the lowest level corresponds to a first graph including a device on a target layer, and each node at a level other than the lowest level is connected to a first number of nodes at a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes;

[0404] A path determining unit 3530 is configured to determine a first path from top to bottom on the first tree, wherein each node on the first path satisfies a first relationship with the first position;

[0405] The first setting unit 3540 is configured to set the layer connection point to the first position based on a second relationship between the lowest level node on the first path and the first position.

[0406] Optionally, the first relationship includes: the first position is located in the first graph or the second graph corresponding to the node; and the first setting unit 3540 is further configured to:

[0407] If the first position is outside the device corresponding to the lowest-level node and the distance from the device is greater than the first distance, the layer connection point is set to the first position.

[0408] Optionally, the first position is a region frame in the target layer that accommodates the layer connection point. The layer connection point setting device 3500 further includes a distance acquisition unit (not shown in the figure), which is configured to:

[0409] Generate the shortest line segment from a point on the area box to a point on the edge of the device;

[0410] The length of the shortest line segment is determined as the distance from the device.

[0411] Optionally, the layer connection point setting device 3500 further includes a first distance determining unit (not shown in the figure), which is configured to:

[0412] Obtain the coverage area of ​​the device on the target layer;

[0413] Obtain the failure rate of the device;

[0414] Based on the coverage area and the failure rate, a first distance is determined.

[0415] Optionally, the first path is a plurality of first paths; and the first setting unit 3540 is further configured to:

[0416] If the first position is located outside the device corresponding to the lowest-level node on each first path and the distance from each device is greater than the first distance, the layer connection point is set to the first position.

[0417] Optionally, the first path is a plurality of first paths; and the first setting unit 3540 is further configured to:

[0418] For each first path, determining a target first path based on a distance between a device corresponding to a lowest-level node on the first path and the first position;

[0419] The layer connection point is set to the first position based on the second relationship between the lowest level node on the target first path and the first position.

[0420] Optionally, the first relationship includes: the first position is located within the first graph or the second graph corresponding to the node, or is located outside the first graph or the second graph corresponding to the node but the distance from the first graph or the second graph is less than a second distance; the first setting unit 3540 is further specifically configured to:

[0421] If the first position is outside the device corresponding to the lowest level node and the distance from the device is greater than a third distance, the layer connection point is set to the first position, wherein the third distance is greater than the second distance.

[0422] Optionally, the first position acquiring unit 3510 is further configured to:

[0423] Get the layer connection point matrix;

[0424] Get the position mapping rules of layer connection points;

[0425] For the layer connection point in the layer connection point matrix, a first position is determined based on a position mapping rule.

[0426] Optionally, the first position acquiring unit 3510 is further configured to:

[0427] Divide the target layer into multiple grids;

[0428] For each grid, if the grid does not contain a device, a first position is determined based on the center of the grid.

[0429] Optionally, the first tree acquiring unit 3520 is further configured to:

[0430] For each device on the target layer, generating a first graph including the device to correspond to a lowest-level node of the first tree;

[0431] Sort the nodes at the bottom level;

[0432] According to the sorting, a first number of bottom-level nodes are taken out, and a second graph including the first graph corresponding to the first number of bottom-level nodes is generated, so as to correspond to the upper-level nodes connected upward to the first number of bottom-level nodes, until a first tree is generated.

[0433] Optionally, the layer connection point setting device 3500 further includes:

[0434] A first graphic generating unit (not shown in the figure) is used to generate a minimum rectangle containing the edge of the device as a first graphic;

[0435] The second graphic generating unit (not shown in the figure) is used to generate a minimum rectangle of the first graphic corresponding to the first number of lowest-level nodes as the second graphic.

[0436] Optionally, the second graphics generating unit is further configured to:

[0437] Determining a first number of sides of the second figure based on the first number;

[0438] A minimum regular polygon having a first number of sides and including the first graph corresponding to the first number of bottom-level nodes is generated as the second graph.

[0439] Optionally, the layer connection point setting device 3500 includes a node sorting unit (not shown in the figure), which is used to:

[0440] Selecting an anchor first graph from the first graphs corresponding to the plurality of bottom-level nodes;

[0441] Arrange the other first graphics except the anchor first graphic behind the anchor first graphic in ascending order of distance from the other first graphics to the anchor first graphic, thereby forming a first graphic sorting;

[0442] Determine the lowest level node order corresponding to the first graph order.

[0443] Optionally, the node sorting unit is further configured to:

[0444] Selecting an anchor first graph from the first graphs corresponding to the plurality of bottom-level nodes;

[0445] Determine other first graphics other than the anchor first graphic, which have the smallest distance from the anchor first graphic, and arrange them behind the anchor first graphic;

[0446] Updating the anchor first graph with the other first graph having the smallest distance from the anchor first graph, returning to the step of determining the other first graphs other than the anchor first graph that have the smallest distance from the anchor first graph and arranging them after the anchor first graph, until there are no other first graphs, thereby forming a first graph sorting;

[0447] Determine the lowest level node order corresponding to the first graph order.

[0448] Optionally, the node sorting unit is further configured to:

[0449] Determine a first graph center of the first graph corresponding to each bottom-level node;

[0450] generating a plurality of candidate polyline segments connecting the centers of the plurality of first graphics;

[0451] Determine a target candidate polyline segment with the smallest length among multiple candidate polyline segments;

[0452] The nodes at the lowest level are sorted based on the order in which the target candidate polyline segments pass through the center of the first graphic.

[0453] Optionally, the layer connection point setting device 3500 includes a first number determining unit (not shown in the figure), which is configured to:

[0454] Set a first number counter, the initial value of the first number counter is 2;

[0455] According to the sorting, the nodes at the lowest level of the first number counter are taken out, and a second graph including the first graph corresponding to the nodes at the lowest level of the first number counter is generated;

[0456] According to the sorting, take out the next lowest level node;

[0457] If the first graph corresponding to the next lowest level node is not included in the second graph, reading the first number from the first number counter;

[0458] If the first graph corresponding to the next lowest-level node is included in the second graph, the first number counter is incremented by 1, and the process returns to the step of extracting the first number counter lowest-level nodes according to the sorting.

[0459] Optionally, the first path determining unit 3530 is further configured to:

[0460] The root node of the first tree is used as the base node;

[0461] Determine, in a lower-level node of the basic node, a target node in a lower-level node, where the target node satisfies a first relationship with the first position;

[0462] The base node is updated with the target node, and the step of determining the target node of the next lower level among the nodes of the next lower level of the base node is returned until there is no node of the next lower level, and the target nodes of each level constitute the first path.

[0463] Reference Figure 36 , Figure 36 This is a block diagram of the structure of a terminal that implements the layer connection point setting method according to an embodiment of the present disclosure. The terminal includes: a radio frequency (RF) circuit 3610, a memory 3615, an input unit 3630, a display unit 3640, a sensor 3650, an audio circuit 3660, a wireless fidelity (WiFi) module 3670, a processor 3680, and a power supply 3690. It will be understood by those skilled in the art that Figure 36 The terminal structure shown does not constitute a limitation on the mobile phone or computer, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0464] The RF circuit 3610 may be used for receiving and sending signals during information transmission or calls. In particular, after receiving downlink information from the base station, it is sent to the processor 3680 for processing; in addition, the designed uplink data is sent to the base station.

[0465] The memory 3615 may be used to store software programs and modules. The processor 3680 executes various functional applications and data processing of the content terminal by running the software programs and modules stored in the memory 3615 .

[0466] The input unit 3630 may be configured to receive input digital or character information and generate key signal input related to the settings and function control of the content terminal. Specifically, the input unit 3630 may include a touch panel 3631 and other input devices 3632.

[0467] The display unit 3640 may be configured to display input information or provided information and various menus of the content terminal. The display unit 3640 may include a display panel 3636.

[0468] The audio circuit 3660 , the speaker 3661 , and the microphone 3662 may provide an audio interface.

[0469] In this embodiment, the processor 3680 included in the terminal can execute the layer connection point setting method of the previous embodiment.

[0470] The terminals of the embodiments of the present disclosure include but are not limited to mobile phones, computers, intelligent voice interaction devices, smart home appliances, vehicle-mounted terminals, aircraft, etc. The embodiments of the present disclosure can be applied to various scenarios, including but not limited to content recommendation, data screening, etc.

[0471] Figure 37 This is a block diagram of the structure of a portion of server 130 that implements the layer connection point setting method according to an embodiment of the present disclosure. Server 130 may vary significantly due to different configurations or performance, and may include one or more central processing units (CPUs) 3722 (e.g., one or more processors), memory 3732, and one or more storage media 3730 (e.g., one or more mass storage devices) that store application programs 3737 or data 3744. Memory 3732 and storage media 3730 may be either transient or persistent storage. The program stored in storage media 3730 may include one or more modules (not shown), each of which may include a series of instruction operations on server 130. Furthermore, CPU 3722 may be configured to communicate with storage media 3730 to execute the series of instruction operations in storage media 3730 on server 130.

[0472] The server 130 may also include one or more power supplies 3726, one or more wired or wireless network interfaces 3750, one or more input and output interfaces 3758, and / or one or more operating systems 3741, such as Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™, etc.

[0473] The central processor 3722 in the server 130 can be used to execute the layer connection point setting method of the embodiment of the present disclosure.

[0474] The embodiment of the present disclosure further provides a computer-readable storage medium, which is used to store program codes, and the program codes are used to execute the layer connection point setting methods of the aforementioned embodiments.

[0475] The present disclosure also provides a computer program product, which includes a computer program. A processor of a computer device reads and executes the computer program, so that the computer device implements the above-mentioned handwritten text prediction.

[0476] The terms "first," "second," "third," "fourth," and the like (if any) in the specification of the present disclosure and the accompanying drawings are used to distinguish between similar contents and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present disclosure described herein, for example, can be implemented in orders other than those illustrated or described herein. In addition, the terms "comprises" and "comprising," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0477] It should be understood that in the present disclosure, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated content, indicating that there can be three relationships. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and following associated content is in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0478] It should be understood that in the description of the embodiments of the present disclosure, the meaning of multiple (or multiple items) is more than two, greater than, less than, exceed, etc. are understood to exclude the number itself, and above, below, within, etc. are understood to include the number itself.

[0479] In the several embodiments provided in the present disclosure, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0480] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0481] In addition, the functional units in the various embodiments of the present disclosure may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0482] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present disclosure is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling a computer device (which can be a personal computer, server 130, or network device, etc.) to execute all or part of the steps of the various embodiments of the present disclosure. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, and other media that can store program code.

[0483] It should also be understood that the various implementations provided in the embodiments of the present disclosure can be combined arbitrarily to achieve different technical effects.

[0484] The above is a specific description of the implementation methods of the present disclosure, but the present disclosure is not limited to the above implementation methods. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present disclosure. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present disclosure.

Claims

1. A method for setting layer connection points in a multi-layer quantum chip, characterized in that: The layer connection point is used to connect a target layer in the multi-layer quantum chip with an adjacent layer in the multi-layer quantum chip, and the method includes: Obtaining a first position on the target layer where the layer connection point is to be set; Obtaining a first tree, the first tree including nodes at multiple levels, wherein each node at the lowest level corresponds to a first graph including a device on the target layer, and each node at a level other than the lowest level is connected to a first number of nodes at a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes; Determine a first path from top to bottom on the first tree, where each node on the first path satisfies a first relationship with the first position; The layer connection point is set to the first position based on a second relationship between the lowest-level node on the first path and the first position.

2. The method according to claim 1, characterized in that The first relationship includes: the first position is located in the first graph or the second graph corresponding to the node; The step of setting the layer connection point to the first position based on the second relationship between the lowest-level node on the first path and the first position includes: If the first position is located outside the device corresponding to the lowest-level node and the distance from the device is greater than a first distance, the layer connection point is set to the first position.

3. The method according to claim 2, characterized in that The first position is embodied as a region frame in the target layer that accommodates the layer connection point; The distance from the device is determined by: Generate the shortest line segment from a point on the area frame to a point on the edge of the device; The length of the shortest line segment is determined as the distance from the device.

4. The method according to claim 2, characterized in that The first path is a plurality of the first paths; If the first position is outside the device corresponding to the lowest-level node and the distance from the device is greater than a first distance, setting the layer connection point to the first position includes: If the first position is located outside the device corresponding to the lowest-level node on each of the first paths and the distance from each of the devices is greater than the first distance, the layer connection point is set to the first position.

5. The method according to claim 1, wherein The first path is a plurality of the first paths; The step of setting the layer connection point to the first position based on the second relationship between the lowest-level node on the first path and the first position includes: For each first path, determining a target first path based on a distance between the device corresponding to the lowest-level node on the first path and the first position; The layer connection point is set to the first position based on a second relationship between the lowest-level node on the target first path and the first position.

6. The method according to claim 1, characterized in that The first relationship includes: the first position is located in the first graph or the second graph corresponding to the node, or is located outside the first graph or the second graph corresponding to the node but the distance to the first graph or the second graph is less than a second distance; The step of setting the layer connection point to the first position based on the second relationship between the lowest-level node on the first path and the first position includes: If the first position is outside the device corresponding to the lowest level node and the distance from the device is greater than a third distance, the layer connection point is set to the first position, wherein the third distance is greater than the second distance.

7. The method according to claim 1, characterized in that The obtaining of a first position on the target layer to which the layer connection point is to be set includes: Get the layer connection point matrix; Get the position mapping rules of layer connection points; For the layer connection point in the layer connection point matrix, the first position is determined based on the position mapping rule.

8. The method according to claim 1, characterized in that The obtaining of a first position on the target layer to which the layer connection point is to be set includes: Dividing the target layer into a plurality of grids; For each of the grids, if the grid does not contain the device, the first position is determined based on the center of the grid.

9. The method according to claim 1, characterized in that The obtaining of the first tree comprises: For each of the devices on the target layer, generating a first graph including the device to correspond to a node of the lowest level of the first tree; Sort the nodes at the bottom level; According to the sorting, the first number of bottom-level nodes are taken out, and the second graph containing the first graph corresponding to the first number of bottom-level nodes is generated, so as to correspond to the upper-level nodes connected upward to the first number of bottom-level nodes until the first tree is generated.

10. The method according to claim 9, characterized in that The generating of the first graphic including the device includes: generating a minimum rectangle including an edge of the device as the first graphic; The generating of the second graphic including the first graphic corresponding to the first number of lowest-level nodes includes generating a minimum rectangle including the first graphic corresponding to the first number of lowest-level nodes as the second graphic.

11. The method according to claim 9, characterized in that The generating the second graph including the first graph corresponding to the first number of bottom-level nodes includes: determining a first number of sides of the second figure based on the first number; A minimum regular polygon having the first number of edges and including the first graph corresponding to the first number of bottom-level nodes is generated as the second graph.

12. The method according to claim 9, characterized in that The step of sorting the nodes at the bottom level includes: Selecting an anchor first graph from the first graphs corresponding to the plurality of nodes at the lowest level; Arrange the other first graphics except the anchor first graphic behind the anchor first graphic according to the distance between the other first graphics and the anchor first graphic from small to large, to form a first graphic sorting; Determine the lowest-level node order corresponding to the first graph order.

13. The method according to claim 9, characterized in that The step of sorting the nodes at the bottom level includes: Selecting an anchor first graph from the first graphs corresponding to the plurality of nodes at the lowest level; determining, among other first graphics other than the anchor first graphic, the other first graphics having the smallest distance from the anchor first graphic, and arranging the other first graphics behind the anchor first graphic; Updating the anchor first graph with the other first graph having the smallest distance from the anchor first graph, returning to the step of determining the other first graphs other than the anchor first graph and having the smallest distance from the anchor first graph, and arranging them after the anchor first graph until there are no other first graphs, thereby forming a first graph sorting; Determine the lowest-level node order corresponding to the first graph order.

14. The method according to claim 9, characterized in that The step of sorting the nodes at the bottom level includes: Determine a first graph center of the first graph corresponding to each of the bottom-level nodes; generating a plurality of candidate polyline segments connecting a plurality of centers of the first graphics; Determine a target candidate polyline segment with the shortest length among the plurality of candidate polyline segments; The nodes at the lowest level are sorted based on the order in which the target candidate polyline segments pass through the center of the first graph.

15. The method according to claim 1, wherein Determining a first path from top to bottom on the first tree includes: Taking the root node of the first tree as the base node; Determine, among nodes in a lower layer of the base node, a target node in a lower layer, where the target node satisfies the first relationship with the first position; The base node is updated with the target node, and the step of determining the target node of the next lower level among the nodes of the next lower level of the base node is returned until there is no node of the next lower level, and the target nodes of each level constitute the first path.

16. A multi-layer quantum chip, characterized in that: The method comprises a plurality of layers, wherein the plurality of layers include a target layer, the target layer includes devices and layer connection points, the layer connection points are used to connect the target layer with adjacent layers in the plurality of layers, and the layer connection points are set according to the method according to any one of claims 1-15.

17. A device for setting layer connection points in a multi-layer quantum chip, characterized in that: The layer connection point is used to connect the target layer in the multi-layer quantum chip with the adjacent layer in the multi-layer quantum chip, and the device includes: a first position acquisition unit, configured to acquire a first position on the target layer where the layer connection point is to be set; A first tree acquisition unit is configured to acquire a first tree, wherein the first tree includes nodes at multiple levels, wherein each node at the lowest level corresponds to a first graph including a device on the target layer, and each node at a level other than the lowest level is connected to a first number of nodes at a lower level and corresponds to a second graph on the target layer including the first graph corresponding to the first number of nodes; a path determining unit, configured to determine a first path from top to bottom on the first tree, wherein each node on the first path satisfies a first relationship with the first position; The first setting unit is configured to set the layer connection point to the first position based on a second relationship between the lowest-level node on the first path and the first position.

18. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the method for setting layer connection points in a multi-layer quantum chip according to any one of claims 1 to 15 is implemented.

19. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for setting layer connection points in a multi-layer quantum chip according to any one of claims 1 to 15 is implemented.

20. A computer program product, comprising a computer program, wherein the computer program is read and executed by a processor of a computer device, so that the computer device executes the method for setting layer connection points in a multi-layer quantum chip according to any one of claims 1 to 15.

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