Superstructure with broadband microwave absorption performance and preparation method thereof
By designing a honeycomb-twisted triangular pyramid structure and utilizing 3D printing technology, the problem of insufficient microwave absorption performance of carbon materials was solved, and a significant improvement in broadband microwave absorption performance was achieved.
Patent Information
- Application Number
- CN202510865118.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-26
- Publication Date
- 2025-09-23
AI Technical Summary
The single structural design of existing carbon materials makes it difficult to achieve broadband microwave absorption, and 3D printing simulation models of complex structures are difficult to manufacture, which limits the performance improvement of microwave absorbing materials.
A honeycomb-twisted triangular pyramid structure was designed, the design parameters were optimized through simulation software, and 3D printing technology was used to prepare a superstructure with broadband microwave absorption performance using polyetheretherketone-chopped carbon fiber as the wire.
The microwave absorption performance has been significantly improved, broadband absorption in the 2-18GHz band has been achieved, and the electromagnetic wave absorption effect and bandwidth coverage have been improved.
Smart Images
Figure CN120691132A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of microwave absorbing superstructures, and in particular to a superstructure with broadband microwave absorbing performance and a preparation method thereof. Background Art
[0002] The widespread application of electromagnetic wave technology has exacerbated the impact of electromagnetic radiation pollution on human health, the operating conditions of electronic equipment, and the natural environment, placing higher demands on electromagnetic protection. Utilizing the dielectric loss and magnetic loss capabilities of electromagnetic wave absorbing materials to convert electromagnetic energy into heat and other forms of energy and dissipate them is one of the feasible strategies for eliminating electromagnetic pollution. In the field of military science and technology, equipment stealth performance has become a key tactical indicator in the development of new combat systems such as sixth-generation fighters and hypersonic weapons. Its technological realization is highly dependent on breakthroughs in advanced electromagnetic wave control materials. In the application of microwave absorbing materials, broadband microwave absorption performance refers to the property of microwave absorbing materials that can effectively absorb microwave energy over a wide frequency range. Broadband microwave absorption performance is a very important indicator.
[0003] Among various microwave-absorbing materials, carbon materials have attracted widespread attention due to their low density and high dielectric loss. Carbon materials possess certain advantages in intrinsic electromagnetic parameters. However, the intrinsic properties of a single carbon material are limited, and the cost of materials like graphene when using carbon nanotubes restricts their widespread application. To further enhance the microwave absorption performance of carbon materials, structural design can be used to improve their microwave absorption performance.
[0004] When it comes to structural design, performance simulation using simulation software is the primary approach. However, the complex structures simulated in simulation software cannot be manufactured using traditional methods. The emergence of 3D printing technology has made it possible to manufacture complex structures. Through performance-oriented design, more complex structures can be designed. 3D printing technology allows for rapid manufacturing and iteration, effectively improving the efficiency of structural design optimization and significantly enhancing the structure's broadband microwave absorption performance. Summary of the Invention
[0005] In order to overcome the above-mentioned defects, the present application provides a superstructure with broadband microwave absorption performance and a preparation method thereof.
[0006] In a first aspect, the present application provides a superstructure with broadband microwave absorption performance, comprising a plurality of periodically arranged honeycomb-twisted triangular pyramid structures; the honeycomb-twisted triangular pyramid structure comprises a honeycomb structure and a twisted triangular pyramid structure arranged within the honeycomb structure; the bottom of the twisted triangular pyramid structure is a triangle, and the three vertices are inscribed in the inner wall of the honeycomb structure; the top of the twisted triangular pyramid structure is a triangle, which is obtained by rotating, scaling and stretching the bottom.
[0007] Furthermore, the honeycomb structure is a regular hexagon.
[0008] Furthermore, the outer wall side length of the honeycomb structure is 20 mm, and the inner wall side length is 18 mm.
[0009] Furthermore, the height of the honeycomb structure is 10 mm and the wall thickness is 2 mm.
[0010] Furthermore, the bottom of the twisted triangular pyramid structure is a regular triangle with a side length of 27 mm.
[0011] Furthermore, the three vertices of the bottom triangle of the twisted triangular pyramid structure are inscribed in the midpoint of the bottom edge of the inner wall of the honeycomb structure.
[0012] Furthermore, the top of the twisted triangular pyramid structure is a regular triangle with a side length of 7 mm.
[0013] Furthermore, the height of the twisted triangular pyramid structure is 10 mm, and the rotation angle of the top relative to the bottom is 10 to 30 degrees.
[0014] In a second aspect, the present application provides a method for preparing the superstructure having broadband microwave absorption performance as described above, comprising: Design a honeycomb-twisted triangular pyramid structure model, import the designed structure model into the simulation software for simulation performance optimization, and select design parameters with optimized performance; The optimized structural model is imported into slicing software for slicing. After slicing, polyetheretherketone-chopped carbon fiber is used as the wire material, and the superstructure is prepared by 3D printing.
[0015] Furthermore, the printing parameters of the 3D printing are: The temperature at the nozzle of the printer is 390℃~420℃, the filament width is 1.75mm±0.1mm, and the temperature of the printer chamber is 110℃~150℃.
[0016] The above technical solution of this application has the following advantages: The first aspect of the present application provides a superstructure with broadband microwave absorption performance. The twisted triangular pyramid structure is arranged in a honeycomb structure. The bottom of the twisted triangular pyramid structure is a triangle, and the three vertices are inscribed in the inner wall of the honeycomb structure. The top of the twisted triangular pyramid structure is a triangle, which is obtained by rotating, scaling and stretching the bottom. The addition of the twisted triangular pyramid improves the multiple reflections after the electromagnetic wave is incident, which is beneficial to improving the electromagnetic wave absorption performance. The designed superstructure has broadband microwave absorption performance, and has the effect of improving the microwave absorption performance compared with the metamaterial design without the honeycomb structure.
[0017] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0019] Figure 1 This is a plan view of the honeycomb-twisted triangular pyramid structure of this application; Figure 2 This is a 3D stereogram of the honeycomb-twisted triangular pyramid structure of this application; Figure 3 Axonometric drawing of the honeycomb-twisted triangular pyramid structure array for this application; Figure 4 This is a diagram of microwave absorption performance of a honeycomb structure without twisted triangular pyramid structure; Figure 5 Microwave absorption performance diagram of the honeycomb-twisted triangular pyramid absorbing structure for this application. DETAILED DESCRIPTION
[0020] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.
[0021] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.
[0022] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0024] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized.
[0025] Traditional superstructure designs are relatively simple, with limited structural freedom, making it difficult to achieve broadband microwave absorption in the 2-18 GHz band. This application aims to optimize the microwave absorption performance of superstructures, designing a superstructure with broadband microwave absorption capabilities, and using 3D printing technology to effectively enhance the broadband microwave absorption performance of the superstructure.
[0026] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0027] like Figures 1 to 3As shown, an embodiment of the present application provides a superstructure with broadband microwave absorption performance, including a plurality of periodically arranged honeycomb-twisted triangular pyramid structures; the honeycomb-twisted triangular pyramid structure includes a honeycomb structure and a twisted triangular pyramid structure arranged in the honeycomb structure; the bottom of the twisted triangular pyramid structure is a triangle, and the three vertices are inscribed in the inner wall of the honeycomb structure; the top of the twisted triangular pyramid structure is a triangle, which is obtained by rotating, scaling and stretching the bottom.
[0028] In some embodiments, the honeycomb structure is a regular hexagon.
[0029] In some embodiments, the outer wall side length of the honeycomb structure is 20 mm, and the inner wall side length is 18 mm.
[0030] In some embodiments, the honeycomb structure has a height of 10 mm and a wall thickness of 2 mm.
[0031] In some embodiments, the twisted triangular pyramid structure has a bottom in the shape of a regular triangle with a side length of 27 mm.
[0032] In some embodiments, the three vertices of the bottom triangle of the twisted triangular pyramid structure are inscribed in the midpoint of the bottom edge of the inner wall of the honeycomb structure.
[0033] In some embodiments, the top of the twisted triangular pyramid structure is a regular triangle with a side length of 7 mm.
[0034] In some embodiments, the twisted triangular pyramid structure has a height of 10 mm, and a rotation angle of the top relative to the bottom is 10-30 degrees.
[0035] An embodiment of the present application also provides a method for preparing a superstructure with broadband microwave absorption performance as described above, comprising: designing a honeycomb-twisted triangular pyramid structure model, importing the designed structure model into simulation software for simulation performance optimization, and selecting design parameters with optimized performance; importing the optimized structure model into slicing software for slicing, and after slicing, using polyetheretherketone-chopped carbon fiber as wire material, and preparing the superstructure by 3D printing.
[0036] In some embodiments, the printing parameters of the 3D printing are: the temperature at the nozzle of the printer is 390° C. to 420° C., the filament width is 1.75 mm ± 0.1 mm, and the temperature of the printer chamber is 110° C. to 150° C.
[0037] First, the structural design was performed. The designed structure was imported into simulation software for simulation performance optimization, optimizing the design parameters and selecting the design parameters with optimal performance. Then, the designed parametric model was imported into slicing software for slicing. After slicing, the final structure was prepared using 3D printing. The filament used was polyetheretherketone-chopped carbon fiber.
[0038] The honeycomb-twisted triangular pyramid structure provided in this application is designed as follows: the honeycomb structure has a height of 10 mm, a wall thickness of 2 mm, and an outer side length of 20 mm. The twisted triangular pyramid has a base that is an equilateral triangle with three vertices inscribed in the honeycomb inner wall, and a side length of 27 mm. The top is an equilateral triangle with a side length of 7 mm. The twisted triangular pyramid has a height of 10 mm, and the twist angle at the top is 10 to 30 degrees.
[0039] The manufacturing method of this structure is the melt deposition modeling method. The dried polyetheretherketone-carbon fiber filament is placed in the machine, and the temperature parameters of the printer are set. The temperature at the nozzle of the printer is set to 390℃~420℃, the filament width is 1.75mm±0.1mm, and the temperature of the printer chamber is 110℃~150℃. After printing is completed, wait for the printed part to cool to room temperature and then take it out.
[0040] The following describes the invention through specific embodiments.
[0041] Example This embodiment provides a superstructure with broadband microwave absorption performance, specifically: The designed structure is a periodic array structure. First, two concentric regular hexagons are built on the plane. The side length of the outer regular hexagon is 20mm, and the side length of the inner regular hexagon is 18mm. Figure 1 Middle 1 area; take the midpoint of every other side of the inner regular hexagon and connect them to form a regular triangle with a side length of 27mm. Figure 1 The resulting plan is as follows Figure 1 As shown. For the adjacent areas of two regular hexagons, stretching is performed with a stretching height of 10mm. For the regular triangle area, rotation and scaling stretching is performed with a stretching height of 10mm. After stretching to the top, the side length of the triangle is 7mm and the rotation angle is 30 degrees. Figure 2 The periodic unit structure shown.
[0042] The optimized structural design was imported into the slicing software, and the printing parameters were set for slicing. Polyetheretherketone-chopped carbon fiber (PEEK-CF) was selected as the printing filament. The filament was dried in a vacuum oven at 60°C for 12 hours. Printing was performed using a fused deposition modeling process with the following printing parameters: nozzle temperature: 420°C; filament diameter: 1.75mm; print chamber temperature: 130°C; layer height: 0.15mm. The dried PEEK-CF filament was loaded into the 3D printer and printed according to the slicing file. After printing, the print chamber was kept closed and the printed part was allowed to cool naturally to room temperature before removal. The microwave absorption performance of the printed structure was tested using the bow method.
[0043] Compared with the pure honeycomb structure without twisted triangular pyramid structure, it has a great improvement in the field of broadband microwave absorption, such as Figure 4 As shown in the figure, the simulated microwave absorption performance of the pure honeycomb structure is poor in broadband microwave absorption. The effective microwave absorption bandwidth of the honeycomb structure design is 9.90 GHz, the average microwave absorption intensity is -11.04 dB, and the maximum absorption peak is -22.95 dB, which occurs at 18 GHz. The broadband microwave absorption performance of the overall structure is not strong enough, and the effective absorption bandwidth does not cover the most important X-band (8-12 GHz).
[0044] The performance of the honeycomb-twisted triangular pyramid composite structure obtained in this embodiment is as follows: Figure 5 As shown, its average microwave absorption performance is -17.15dB, the effective absorption bandwidth is 18GHz, the maximum absorption peak is -30.44dB, which occurs at 10.99GHz. The effective absorption bandwidth covers the 2-18GHz band, and the overall broadband microwave absorption performance is significantly improved.
[0045] The addition of a twisted triangular pyramid to the superstructure with broadband microwave absorption performance provided in the embodiments of the present application enhances multiple reflections after incident electromagnetic waves, which is beneficial to improving electromagnetic wave absorption performance. The designed superstructure has broadband microwave absorption performance, which has the effect of improving microwave absorption performance compared to metamaterial designs without honeycomb structures.
[0046] Those skilled in the art will clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the purpose of distinguishing each other and are not used to limit the scope of protection of this application.
[0047] It should be noted that the various embodiments in this specification are described in a progressive manner. Reference can be made to the same or similar parts between the various embodiments. Each embodiment focuses on the differences from other embodiments. This application is not limited to the specific structures described above and shown in the figures. Furthermore, for the sake of brevity, detailed descriptions of known methods and technologies are omitted here.
[0048] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.
Claims
1. A superstructure with broadband microwave absorption performance, characterized in that: It comprises a plurality of periodically arranged honeycomb-twisted triangular pyramid structures; the honeycomb-twisted triangular pyramid structure comprises a honeycomb structure and a twisted triangular pyramid structure arranged within the honeycomb structure; the bottom of the twisted triangular pyramid structure is a triangle, and the three vertices are inscribed in the inner wall of the honeycomb structure; the top of the twisted triangular pyramid structure is a triangle, which is obtained by rotating, scaling and stretching the bottom.
2. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The honeycomb structure is a regular hexagon.
3. The superstructure with broadband microwave absorption performance according to claim 2, wherein: The outer wall side length of the honeycomb structure is 20 mm, and the inner wall side length is 18 mm.
4. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The height of the honeycomb structure is 10 mm and the wall thickness is 2 mm.
5. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The bottom of the twisted triangular pyramid structure is a regular triangle with a side length of 27 mm.
6. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The three vertices of the bottom triangle of the twisted triangular pyramid structure are inscribed in the midpoint of the bottom edge of the inner wall of the honeycomb structure.
7. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The top of the twisted triangular pyramid structure is a regular triangle with a side length of 7 mm.
8. The superstructure with broadband microwave absorption performance according to claim 1, wherein: The height of the twisted triangular pyramid structure is 10 mm, and the rotation angle of the top relative to the bottom is 10 to 30 degrees.
9. The method for preparing a superstructure having broadband microwave absorption performance according to any one of claims 1 to 8, characterized in that: include: Design a honeycomb-twisted triangular pyramid structure model, import the designed structure model into the simulation software for simulation performance optimization, and select design parameters with optimized performance; The optimized structural model is imported into slicing software for slicing. After slicing, polyetheretherketone-chopped carbon fiber is used as the wire material, and the superstructure is prepared by 3D printing.
10. The method for preparing a superstructure with broadband microwave absorption performance according to claim 9, wherein: The printing parameters of the 3D printing are: The temperature at the nozzle of the printer is 390℃~420℃, the filament width is 1.75mm±0.1mm, and the temperature of the printer chamber is 110℃~150℃.