Symmetrically oscillating electromagnetic transducer for symmetrically oscillating device

Abstract

A symmetrically oscillating electromagnetic transducer (17) for a symmetrically oscillating device (1) is provided. The electromagnetic transducer (17) comprises: a first electromagnetic transducer portion having a first electromagnetic transducer portion mass center (CM17a); and a second electromagnetic transducer portion, the second electromagnetic transducer portion having a second electromagnetic transducer portion center of mass (CM17b). The first electromagnetic transducer portion and the second electromagnetic transducer portion are symmetrically balanced.

Description

Technical Field

[0001] The embodiments described below relate to electromagnetic transducers, and more particularly, to electromagnetic transducers for symmetrical oscillation of symmetrical oscillation devices. Background Art

[0002] Devices sometimes employ symmetrical oscillations, or more specifically, symmetrical counter-oscillations, to perform measurements, provide balancing vibrations, perform impact work, and / or the like. Such symmetrical oscillations may require that the two parts of the symmetrical oscillating device move toward and away from each other in opposite directions. This may be referred to as out-of-phase vibrations or oscillations, or more specifically, vibrations that are 180 degrees out of phase. By way of illustration, a vibrating meter may be considered a symmetrical vibrating device.

[0003] Vibrating meters, such as Coriolis mass flow meters, liquid densitometers, gas densitometers, liquid viscometers, gas / liquid specific gravity meters, gas / liquid relative density meters, and gas molecular weight meters, are generally known and used to measure fluid parameters. Typically, a vibrating meter includes a sensor assembly and meter electronics. The material within the sensor assembly can be flowing or stationary. The vibrating meter can be used to measure one or more fluid parameters, such as mass flow rate, density, or other properties of the material within the sensor assembly.

[0004] A sensor assembly may rely on ideal or assumed symmetrical oscillation of two vibrating members, such as a catheter, spike, or the like, to accurately measure a fluid parameter. An electromagnetic transducer may be attached to the two vibrating members to measure a parameter of the material being sensed by the sensor assembly. The electromagnetic transducer may be a displacement sensor, an actuator, or the like. However, the electromagnetic transducer may not be symmetrically balanced. Consequently, the oscillations of the two vibrating members may not be symmetrical. Therefore, there is a need for an electromagnetic transducer for symmetrical oscillation of a symmetrical oscillating device. Summary of the Invention

[0005] An electromagnetic transducer for symmetrical oscillation of a symmetrical oscillation device is provided. According to an embodiment, the electromagnetic transducer for symmetrical oscillation of the symmetrical oscillation device includes: a first electromagnetic transducer portion having a first electromagnetic transducer portion mass center; and a second electromagnetic transducer portion having a second electromagnetic transducer portion mass center. The first electromagnetic transducer portion and the second electromagnetic transducer portion are symmetrically balanced.

[0006] A symmetrical oscillation device configured for symmetrical oscillation is provided. According to an embodiment, the symmetrical oscillation device comprises a first oscillating part and a second oscillating part configured to oscillate symmetrically relative to each other and an electromagnetic transducer according to one of the preceding claims, the electromagnetic transducer being mechanically coupled to the first oscillating part and the second oscillating part.

[0007] A method for forming a symmetrically oscillating electromagnetic transducer for a symmetrically oscillating device is provided. According to an embodiment, the method includes providing a first electromagnetic transducer portion having a mass center of the first electromagnetic transducer portion, providing a second electromagnetic transducer portion having a mass center of the second electromagnetic transducer portion, and symmetrically balancing the first electromagnetic transducer portion and the second electromagnetic transducer portion.

[0008] A method for forming a symmetrically oscillating electromagnetic transducer for a symmetrically oscillating device is provided. According to an embodiment, the method includes forming a magnet assembly; forming a coil assembly, wherein forming the coil assembly includes providing an insert and providing a bobbin, selecting an adhesive to minimize elastic deformation of the adhesive within a predetermined operating temperature range of the coil assembly, and attaching the insert to the bobbin using the adhesive.

[0009] An electromagnetic transducer for converting symmetrical oscillations is provided. According to an embodiment, the electromagnetic transducer comprises an electromagnetic transducer formed according to one of the preceding.

[0010] A symmetrical oscillation device configured for symmetrical oscillation is provided. According to an embodiment, the symmetrical oscillation device comprises first and second oscillating parts configured to oscillate symmetrically relative to each other and an electromagnetic transducer according to above, the electromagnetic transducer being mechanically coupled to the first and second oscillating parts.

[0011] All aspects

[0012] According to one aspect, an electromagnetic transducer for symmetrical oscillation of a symmetrical oscillation device includes: a first electromagnetic transducer portion having a first electromagnetic transducer portion mass center; and a second electromagnetic transducer portion having a second electromagnetic transducer portion mass center. The first electromagnetic transducer portion and the second electromagnetic transducer portion are symmetrically balanced.

[0013] Preferably, the first electromagnetic transducer portion is configured to be mechanically coupled to a first oscillating portion of the symmetrical oscillating device, and the second electromagnetic transducer portion is configured to be mechanically coupled to a second oscillating portion of the symmetrical oscillating device.

[0014] Preferably, the symmetrical balance of the first electromagnetic transducer part and the second electromagnetic transducer part includes that the mass center of the first electromagnetic transducer part and the mass center of the second electromagnetic transducer part are equidistant from the device center plane of the symmetrical oscillation device and are located on the transducer mass center line.

[0015] Preferably, a central plane of the symmetrical oscillatory device is defined by and located at points equidistant between the first oscillatory portion and the second oscillatory portion.

[0016] Preferably, the transducer mass centerline is orthogonal to the device center plane of the symmetrical oscillating device.

[0017] Preferably, the first electromagnetic transducer portion and the second electromagnetic transducer portion have the same moment of inertia value.

[0018] Preferably, the symmetrical oscillating device is a vibrating meter configured to measure a property of a material.

[0019] Preferably, the first oscillating part and the second oscillating part are conduits of a vibrating meter.

[0020] Preferably, the first electromagnetic transducer portion comprises a magnet assembly and the second electromagnetic transducer portion comprises a coil assembly.

[0021] Preferably, the magnet assembly comprises a magnet and a magnet holder attached to the magnet, and the coil assembly comprises a bobbin and an insert attached to the bobbin.

[0022] Preferably, the insert is selected to provide symmetrical balance of the magnet assembly and coil assembly.

[0023] According to an aspect, a symmetrical oscillation device configured for symmetrical oscillation comprises a first oscillating part and a second oscillating part configured to oscillate symmetrically relative to each other and an electromagnetic transducer according to one of the preceding claims, which is mechanically coupled to the first oscillating part and the second oscillating part.

[0024] According to one aspect, a method for forming a symmetrically oscillating electromagnetic transducer for a symmetrical oscillation device includes: providing a first electromagnetic transducer portion having a mass center of the first electromagnetic transducer portion, providing a second electromagnetic transducer portion having a mass center of the second electromagnetic transducer portion, and symmetrically balancing the first electromagnetic transducer portion and the second electromagnetic transducer portion.

[0025] Preferably, providing the first electromagnetic transducer portion comprises configuring the first electromagnetic transducer portion to be mechanically coupled to a first oscillating portion of the symmetrical oscillating device, and providing the second electromagnetic transducer portion comprises configuring the first electromagnetic transducer portion to be mechanically coupled to a second oscillating portion of the symmetrical oscillating device.

[0026] Preferably, symmetrically balancing the first and second electromagnetic transducer parts includes positioning the mass centers of the first and second electromagnetic transducer parts equidistant from a device center plane of the symmetrical oscillation device and on a transducer mass center line.

[0027] Preferably, the method further comprises defining and positioning a centre plane of the symmetrical oscillatory device at a point equidistant between the oscillatory portion and the second oscillatory portion.

[0028] Preferably, the method further comprises orienting the transducer mass centre line to be normal to a device centre plane of the symmetrical oscillating device.

[0029] Preferably, the method further comprises configuring the first electromagnetic transducer portion and the second electromagnetic transducer portion to have the same moment of inertia value.

[0030] Preferably, the symmetrical oscillating device is a vibrating meter configured to measure a property of a material.

[0031] Preferably, the first oscillating part and the second oscillating part are conduits of a vibrating meter.

[0032] Preferably, providing the first electromagnetic transducer portion comprises providing a magnet assembly, and providing the second electromagnetic transducer portion comprises providing a coil assembly.

[0033] Preferably, providing the magnet assembly includes providing a magnet and a magnet holder attached to the magnet, and providing the coil assembly includes providing a bobbin and an insert attached to the bobbin.

[0034] Preferably, the insert is selected to provide symmetrical balance of the magnet assembly and coil assembly.

[0035] According to one aspect, a method of forming a symmetrically oscillating electromagnetic transducer for a symmetrically oscillating device includes: forming a magnet assembly; forming a coil assembly, wherein forming the coil assembly includes: providing an insert and providing a bobbin, selecting an adhesive to minimize elastic deformation of the adhesive within a predetermined operating temperature range of the coil assembly, and attaching the insert to the bobbin using the adhesive.

[0036] Preferably, the method further comprises forming a non-interference interface between the magnet assembly and the coil assembly.

[0037] Preferably, selecting the adhesive to minimize elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly includes selecting the adhesive to elastically deform within the predetermined operating temperature range of the coil assembly and to plastically deform within an alternative predetermined operating temperature range greater than the predetermined operating temperature range of the coil assembly.

[0038] Preferably, the method further comprises verifying that one or more sensor parameters remain within a predetermined sensor parameter range within a predetermined operating temperature range.

[0039] Preferably, the one or more sensor parameters include at least one of a physical property of the sensor and a transducing property of the sensor.

[0040] Preferably, selecting the adhesive to minimize elastic deformation of the adhesive within a predetermined operating temperature range of the coil assembly includes selecting an amount of adhesive to minimize a gap between the bobbin and the insert.

[0041] Preferably, selecting the adhesive to minimize elastic deformation of the adhesive within a predetermined operating temperature range of the coil assembly includes minimizing a difference between a coefficient of thermal expansion of the insert and a coefficient of thermal expansion of the adhesive.

[0042] Preferably, wherein attaching the insert to the spool with an adhesive comprises applying adhesive to at least one of the insert and the spool, and pressing the insert and the spool together in a predetermined spaced relationship.

[0043] Preferably, the adhesive comprises one of an epoxy resin and a silicone-based adhesive.

[0044] According to an aspect, an electromagnetic transducer for converting symmetrical oscillations comprises an electromagnetic transducer formed according to one of the preceding.

[0045] According to one aspect, a symmetrical oscillation device configured for symmetrical oscillation includes first and second oscillating parts configured to oscillate symmetrically relative to each other and an electromagnetic transducer according to above mechanically coupled to the first and second oscillating parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Like reference numerals represent like elements throughout the drawings.It should be understood that the drawings are not necessarily drawn to scale.

[0047] Figure 1 A symmetrical oscillating device 1 is shown.

[0048] Figure 2 A vibrating meter 5 is shown which is designed for symmetrical oscillations.

[0049] Figure 3 A catheter-sensor assembly 300 is shown, which includes an electromagnetic transducer assembly 370, which is coupled to a reference Figure 2 Pick-off sensors of the catheters 130, 130' are depicted.

[0050] Figure 4A first alternative catheter-sensor assembly 400 is shown that includes a sensor coupled to a reference Figure 2 The electromagnetic transducer assembly 470 of the catheter 130, 130' is depicted.

[0051] Figure 5 and Figure 6 A second alternative catheter-sensor assembly 500 is shown that includes a catheter coupled to a reference Figure 2 An electromagnetic transducer assembly 570 of a catheter 130, 130' is depicted.

[0052] Figure 7 An electromagnetic transducer 770s is shown, which may be configured to couple to a reference Figure 2 The described catheters 130, 130' ( Figure 7 A third alternative electromagnetic transducer (not shown).

[0053] Figure 8 An electromagnetic transducer 870s is shown, which may be configured to couple to a reference Figure 2 A fourth alternative electromagnetic transducer for catheter 130, 130' is described.

[0054] Figure 9 A first method 900 of forming an electromagnetic transducer for symmetrical oscillation is shown.

[0055] Figure 10 A second method 1000 of forming an electromagnetic transducer for symmetrical oscillation is shown. DETAILED DESCRIPTION

[0056] Figures 1 to 10 The following description depicts specific examples to teach those skilled in the art how to make and use the best mode of implementation of the symmetrical oscillation electromagnetic transducer for symmetrical oscillation devices. For the purpose of teaching the principles of the invention, some conventional aspects have been simplified or omitted. Those skilled in the art will understand variations from these examples that fall within the scope of this specification. Those skilled in the art will understand that the features described below can be combined in various ways to form multiple variations of the symmetrical oscillation electromagnetic transducer for symmetrical oscillation devices. Therefore, the embodiments described below are not limited to the specific examples described below, but are limited only by the claims and their equivalents.

[0057] Figure 1 A symmetrical oscillating device 1 is shown. Figure 1 As shown in FIG, the symmetrical oscillating device 1 comprises a first oscillating portion 13 and a second oscillating portion 13' configured to oscillate relative to each other in an at least substantially linear manner. Such oscillations may be caused by an electromechanical force transducer, which for the sake of clarity, Figure 1The electromechanical force transducer is not shown in the figure, but any suitable means for inducing such oscillations may be used. The first oscillating portion mass centre CM 13 and the center of mass CM of the second oscillating part 13’ Indicated by the center of mass symbol. Figure 1 The electromagnetic transducer 17 is also shown. The electromagnetic transducer 17 includes a magnet assembly 17a and a coil assembly 17b, which can be referred to as transducer components. The magnet assembly 17a and the coil assembly 17b are respectively coupled to the first oscillating portion 13 and the second oscillating portion 13' via a bracket. Although the bracket is shown, for the sake of discussion, the electromagnetic transducer 17 includes a magnet assembly 17a and a coil assembly 17b. Figure 1 The bracket is not labeled and is assumed to be massless. The magnet assembly 17a and the coil assembly 17b are shown as abutting at the sensor interface 17i. The magnet assembly 17a and the coil assembly 17b are shown with the first electromagnetic transducer portion mass center CM 17a and the mass center CM of the second electromagnetic transducer part 17b The mass center CM of the first electromagnetic transducer part 17a and the mass center CM of the second electromagnetic transducer part 17b It is represented by the mass center symbol. Also shown are the device center plane CP1 of the symmetrical oscillating device 1 and the oscillating part mass center line CML 13 and the transducer mass centerline CML 17 .

[0058] The device center plane CP1 is a plane equidistant from the first oscillating portion 13 and the second oscillating portion 13' and located between the first oscillating portion 13 and the second oscillating portion 13'. Figure 1 17a and coil assembly 17b.

[0059] The first oscillating portion 13 and the second oscillating portion 13' are symmetrically balanced. That is, the first oscillating portion 13 and the second oscillating portion 13' have the same shape, equal mass value, and the same mass center line CML perpendicular to the center plane CP1 of the device.13 The mass center CM of the first oscillating part is equidistant from the center plane CP1 of the device 13 and the center of mass CM of the second oscillating part 13’ . Because the first oscillating part 13 and the second oscillating part 13' have the same shape, the first oscillating part 13 and the second oscillating part 13' have the same moment of inertia. However, alternative oscillating parts may not necessarily need to have the same shape and / or the same moment of inertia to be symmetrically balanced. Similarly, the magnet assembly 17a and the coil assembly 17b are symmetrically balanced about the device center plane CP1. Therefore, the electromagnetic transducer 17 can be called a symmetrically balanced electromagnetic transducer. In addition, the symmetrical oscillation device 1 can therefore be configured to oscillate symmetrically.

[0060] For example, the first oscillating portion 13 and the second oscillating portion 13' can be coupled to a track, a hinge, a pivot point, etc., which allows the first oscillating portion 13 and the second oscillating portion 13' to move approximately along the Figure 1 oscillates in the direction of the arrow shown in the Figure 1 As can be appreciated, where the first oscillating portion 13 and the second oscillating portion 13' are coupled to a hinge or pivot point, the magnitude of the displacement of the first oscillating portion 13 and the second oscillating portion 13' can be small relative to the distance between the first oscillating portion 13 and the hinge, pivot point, etc. and / or the distance between the second oscillating portion 13' and the hinge, pivot point, etc. Thus, the oscillation can be substantially linear and Figure 1 In the direction of the arrow shown in .

[0061] The oscillations of the first oscillating portion 13 and the second oscillating portion 13' may be substantially out of phase. For example, the first oscillating portion 13 and the second oscillating portion 13' may perform sinusoidal oscillations that are 180 degrees out of phase with each other. Additionally or alternatively, non-sinusoidal oscillations may be employed, such as triangular oscillations, square oscillations, pulse oscillations, and / or the like. Symmetrical oscillations may be out of phase. Symmetrical oscillations may be such that the mass center CM of the first oscillating portion is symmetrically spaced. 13 and the center of mass CM of the second oscillating part 13’ At least approximately along the oscillating portion mass center line CML 13 Thus, the first oscillating portion 13 and the second oscillating portion 13 ′ can move towards and away from each other in a symmetrically balanced manner in time and space.

[0062] The symmetrical oscillation device 1 can use this symmetrical oscillation to perform some functions, such as measuring, generating electricity, vibrating other objects, etc. Therefore, the first oscillating part 13 and the second oscillating part 13' can be the oscillating parts of a measuring device, a generator, a vibration actuator, an impact tool, etc., but any suitable symmetrical oscillation device can be used. Figure 1As shown in FIG, the electromagnetic transducer 17 can measure the oscillations of the first oscillating portion 13 and the second oscillating portion 13 ′.

[0063] By way of illustration, the electromagnetic transducer 17 may include a magnet and, for example, a coil disposed around the magnet. Thus, the magnet assembly 17a and the coil assembly 17b may be a magnet assembly and a coil assembly, respectively. For example, the magnet assembly 17a may include a magnet attached to a magnet holder, which may also be referred to as a pole piece, and the coil assembly 17b may include a coil disposed around a coil bobbin, which in turn may be disposed around an insert. Similar to the first oscillating portion 13 and the second oscillating portion 13', the magnet assembly 17a and the coil assembly 17b may be disposed in a substantially parallel manner. Figure 1 It is shown as being symmetrically balanced about the device center plane CP1.

[0064] Symmetrical balancing can ensure that the oscillations of the first oscillating portion 13 and the second oscillating portion 13', as well as the magnet assembly 17a and the coil assembly 17b, will not include asymmetric effects on the measurements made by the electromagnetic transducer 17. For example, if the magnet assembly 17a and the coil assembly 17b are not symmetrically balanced about the device center plane CP1, then even if the electromagnetic force transducer applies completely symmetrical oscillating forces to the first oscillating portion 13 and the second oscillating portion 13', the oscillations of the first oscillating portion 13 and the second oscillating portion 13' may not achieve counter-balance. This may result in inaccurate measurements made by the electromagnetic transducer 17.

[0065] As will be appreciated, symmetrical balancing of the symmetrical oscillating device 1 can also be achieved when the electromagnetic transducer 17 is replaced by an electromechanical actuator that applies force to the first and second oscillating parts 13 and 13'. In other words, symmetrically balancing the first and second parts of a force transducer mechanically coupled to the first and second oscillating parts 13 and 13' can result in oppositely balanced oscillations of the first and second oscillating parts 13 and 13'. Therefore, the electromagnetic transducer 17 can represent an electromechanical actuator, which can be referred to as a force transducer and / or a sensor, which can be referred to as a displacement transducer. In either case, the electromagnetic transducer 17 can be used to achieve symmetrical oscillations of the first and second oscillating parts 13 and 13'.

[0066] As described above, the symmetrical oscillating device 1 can be found in a variety of exemplary devices. By way of illustration, the symmetrical oscillating device 1 can be a vibrating meter that includes vibrating elements that oscillate in opposite or out-of-phase to measure a property of a fluid. An exemplary vibrating meter is described below.

[0067] Figure 2 A vibrating meter 5 configured for symmetrical oscillation is shown. Figure 2As shown in FIG, a vibrating meter 5 includes a sensor assembly 10 and meter electronics 20. The sensor assembly 10 is responsive to the mass flow rate and density of the process material. The meter electronics 20 is connected to the sensor assembly 10 via leads 100 to provide density, mass flow rate, and temperature information, among other information, at a port 26.

[0068] The sensor assembly 10 includes a pair of manifolds 150 and 150', flanges 103 and 103' having flanged necks 110 and 110', a pair of parallel conduits 130 and 130' (including a first conduit 130 and a second conduit 130'), a driver 180, a resistance temperature detector (RTD) 190, and a pair of pickoff sensors 170l and 170r. The conduits 130 and 130' have two substantially straight inlet legs 131 and 131' and outlet legs 134 and 134' that converge toward each other at conduit mounting blocks 120 and 120'. The conduits 130 and 130' are curved at two symmetrical locations along their lengths and are substantially parallel throughout their lengths. Struts 140 and 140' define axes W and W' about which each conduit 130 and 130' oscillates. The legs 131 , 131 ′ and 134 , 134 ′ of the conduits 130 , 130 ′ are fixedly attached to the conduit mounting blocks 120 and 120 ′, and these blocks are in turn fixedly attached to the manifolds 150 and 150 ′. This provides a continuous closed material path through the sensor assembly 10 .

[0069] When flanges 103 and 103' having holes 102 and 102' are connected via inlet end 104 and outlet end 104' to a process line (not shown) carrying the process material being measured, the material enters the inlet end 104 of the vibrating meter through orifice 101 in flange 103 and is directed through manifold 150 to conduit mounting block 120 having surface 121. Within manifold 150, the material is separated and directed through conduits 130, 130'. Upon exiting conduits 130, 130', the process material recombines into a single stream within block 120' having surface 121' and manifold 150' and is thereafter directed to outlet end 104', which is connected to a process line (not shown) via flange 103' having hole 102'.

[0070] The conduits 130, 130' are selected and appropriately mounted to the conduit mounting blocks 120, 120' so as to have substantially the same mass distribution, moment of inertia, and Young's modulus about the bending axes W--W and W'--W', respectively. These bending axes pass through the struts 140, 140'. Since the Young's modulus of a conduit varies with temperature, and this variation affects the calculation of flow and density, an RTD 190 is mounted to the second conduit 130' to continuously measure the temperature of the second conduit 130'. The temperature of the conduit 130' and therefore the voltage appearing across the RTD 190 for a given current passing through the RTD 190 is controlled by the temperature of the material passing through the second conduit 130'. The temperature-dependent voltage appearing across the RTD 190 is used by the meter electronics 20 in a known manner to compensate for changes in the elastic modulus of the conduits 130, 130' due to any changes in the conduit temperature. The RTD 190 is connected to the meter electronics 20 via leads 195 .

[0071] Both conduits 130, 130' are driven by a driver 180 in opposite directions about their respective bending axes W and W', and in what is known as the first out-of-phase bending mode of the vibrating meter. The driver 180 can include any of a number of well-known devices, such as a magnet mounted to the second conduit 130' and an opposing coil mounted to the first conduit 130, through which an alternating current is passed to vibrate both conduits 130, 130'. A suitable drive signal 185 is applied to the driver 180 via leads by the meter electronics 20. Thus, the vibrating meter 5, or more specifically, the sensor assembly 10, can be considered a symmetrical oscillating device, such as the symmetrical oscillating device 1 described above.

[0072] Meter electronics 20 receives the RTD temperature signal on lead 195 and sensor signal 165 present on lead 100, carrying left and right sensor signals 165l, 165r, respectively. Meter electronics 20 generates drive signal 185, which appears on leads to driver 180 and causes conduits 130, 130' to vibrate. Meter electronics 20 processes left and right sensor signals 165l, 165r, and lead 195 carrying the RTD signal, to calculate the mass flow rate and density of the material passing through sensor assembly 10. This information, along with other information, is applied as a signal by meter electronics 20 on port 26.

[0073] As described above, the sensor assembly 10 includes a pair of pickoff sensors 1701 and 170r mechanically coupled to the conduits 130, 130'. The conduits 130, 130' and the pair of pickoff sensors 1701 and 170r may be the same as those described above with reference to FIG. Figure 1The depicted examples of first and second oscillatory portions 13, 13' and electromagnetic transducer 17. Thus, the catheters 130, 130' and the pair of pickoff sensors 1701, 170r may be symmetrically balanced about the device center plane CP1, as described in more detail below.

[0074] Symmetrically balanced electromagnetic transducer

[0075] Figure 3 A catheter-sensor assembly 300 is shown, which includes an electromagnetic transducer assembly 370, which is coupled to a reference Figure 2 The pick-off sensor of the described conduit 130, 130'. The conduit 130, 130' may be a reference to Figure 1 The electromagnetic transducer assembly 370 may be an example of a first oscillating portion 13 and a second oscillating portion 13' as described. Figure 1 The electromagnetic transducer 17 described and referenced Figure 2 Examples of pick-off sensors 1701, 170r are depicted. Electromagnetic transducer assembly 370 is mechanically coupled to conduit 130, 130'. Figure 3 Also shown is the sensor assembly center plane CP, which is equidistant between the conduits 130, 130'. 300 The electromagnetic transducer assembly 370 includes a first bracket 370b and a second bracket 370b' and an electromagnetic transducer 370s. The transducer mass center line CML is also shown. 370s The electromagnetic transducer 370s is mechanically coupled to the catheters 130, 130' via a first bracket 370b and a second bracket 370b'. More specifically, the coil assembly 370sc is mechanically coupled to the first bracket 370b, which is mechanically coupled to the first catheter, and the magnet assembly 370sm is mechanically coupled to the second bracket 370b', which is mechanically coupled to the second catheter 130'. The coil assembly mass center CM 370sc and the magnet assembly mass center CM 370sm is shown as being located at the transducer mass centerline CML 370s superior.

[0076] As from Figure 3 It is understood that the conduits 130, 130' and the first bracket 370b and the second bracket 370b' have the same shape. The conduits 130, 130' and the first bracket 370b and the second bracket 370b' are also made of the same material. Therefore, the conduits 130, 130' and the first bracket 370b have equal mass and moment of inertia values. In addition, the conduits 130, 130' and the first bracket 370b and the second bracket 370b' are symmetrically aligned with the sensor assembly center plane CP. 300Therefore, the catheters 130, 130' and the first bracket 370b and the second bracket 370b' are respectively about the center plane CP of the sensor assembly. 300 Symmetrical Balance. Since the first bracket 370b and the second bracket 370b' are attached to the conduits 130 and 130', respectively, the total mass of the first conduit 130 and the first bracket 370b and the total mass of the second conduit 130' and the second bracket 370b' are also symmetrically balanced.

[0077] Sensor component center plane CP 300 It is also at least approximately located at the midpoint of the electromagnetic transducer assembly 370, which may be the center of mass of the electromagnetic transducer assembly 370. Figure 3 As shown in FIG, the electromagnetic transducer assembly 370 includes an electromagnetic transducer 370s and a first bracket 370b and a second bracket 370b'. The electromagnetic transducer 370s is mechanically coupled to the first bracket 370b and the second bracket 370b', and the first bracket 370b and the second bracket 370b' are mechanically coupled to the conduits 130 and 130'. The first bracket 370b and the second bracket 370b' can be mechanically coupled to the conduits 130 and 130' by brazing, welding, single-piece forging and / or any other suitable means. Figure 3 As shown in FIG, first bracket 370b and second bracket 370b' are attached to conduits 130, 130' by brazing. Electromagnetic transducer 370s is shown as being mechanically coupled to first bracket 370b and second bracket 370b' using screws as fasteners. However, the same and / or alternative transducer components may be attached to alternative brackets by any suitable means, such as brazing, welding, fastening, adhesives, and / or the like.

[0078] The electromagnetic transducer 370s may be a displacement sensor comprised of two relatively positioned parts that enable the electromagnetic transducer 370s to determine the relative displacement between the two parts. As used herein, the term "displacement" includes any distance and any value that can be derived from the distance, such as velocity, acceleration, etc. Figure 3 As shown in FIG, the two parts of the electromagnetic transducer 370s are the coil assembly 370sc and the magnet assembly 370sm.

[0079] The coil assembly 370sc and the magnet assembly 370sm are shown disposed in the sensor assembly center plane CP. 300370sm, coil assembly 370sc and magnet assembly 370sm are arranged on opposite sides of the coil assembly 370sc. However, due to the complementary non-interference interface, there is some overlap. More specifically, coil assembly 370sc has a cylindrical interface portion, which has a smaller diameter than the cylindrical interface portion of magnet assembly 370sm. In addition, coil assembly 370sc and magnet assembly 370sm have a similar shape that is close to and coaxial, and are therefore complementary. Therefore, coil assembly 370sc extends into magnet assembly 370sm, and magnet assembly 370sm surrounds coil assembly 370sc. In addition, coil assembly 370sc and magnet assembly 370sm do not contact each other, but can interact electromagnetically, and are therefore non-interference interfaces.

[0080] The coil assembly 370sc is shown to include a coil bobbin 372sc and an insert 374sc that are mechanically coupled to each other. More specifically, the coil bobbin 372sc is attached to the insert 374sc. Figure 3 As shown in FIG, the coil bobbin 372sc is overmolded onto the insert 374sc. That is, the coil bobbin 372sc can be composed of a non-conductive substance such as a polymer, ceramic, etc. that is overmolded onto the insert 374sc. Although Figure 3 370sm, the electromagnetic transducer 370s comprises a coil wound around a coil bobbin 372sc. The coil can carry an electric current due to the magnetic field of the magnet assembly 370sm.

[0081] Magnetic assembly 370sm is shown to include magnet 372sm and magnet holder 374sm. Magnet 372sm and magnet holder 374sm are mechanically coupled to each other. More specifically, magnet 372sm is attached to magnet holder 374sm. Magnet 372sm and magnet holder 374sm can use any suitable manner, such as adhesive, press fit, locking features, fasteners and / or the like to be mechanically attached to each other. Magnet 372sm can provide a magnetic field shaped and gathered by magnet holder 374sm. Therefore, magnet holder 374sm can be made of ferromagnetic material, although any suitable material that can shape and / or gather the magnetic field provided by magnet 372sm can be adopted.

[0082] In one embodiment, the coil assembly 370sc and the magnet assembly 370sm as transducer components are shown as comprising two different parts, but other alternative coil assemblies and / or magnet assemblies can include more or less parts respectively.For example, an alternative coil assembly (without coil wire) can be made of a single integral material piece that is forged, machined, etc. Alternatively, other alternative coil assemblies can include three or more parts. By way of illustration, an alternative insert can include several parts, which can for example allow the more accurate symmetrical balance of transducer components. Similarly, other alternative magnet assemblies can include for example spacers, adjustment features, etc., which allow magnets to be positioned more to help more accurately balance transducer components.

[0083] The coil assembly 370sc and the magnet assembly 370sm move with the catheters 130, 130', respectively. Thus, the coil assembly 370sc and the magnet assembly 370sm move along the transducer mass centerline CML. 370s The conduits 130 and 130' move back and forth in parallel directions. When the conduits 130 and 130' oscillate in the opposite direction, the coil assembly 370sc and the magnet assembly 370sm will also oscillate in the opposite direction. Therefore, the opposite oscillation of the coil assembly 370sc and the magnet assembly 370sm can cause the magnetic field of the magnet assembly 370sm to change in the coil of the coil assembly 370sc. Therefore, the coil of the coil assembly 370sc can provide a voltage proportional to the relative speed of the coil assembly 370sc and the magnet assembly 370sm. The voltage can be received by a meter electronics device, such as the meter electronics device 20 described above, to determine the measurement value.

[0084] The electromagnetic transducer 370s can be about the sensor assembly center plane CP 300 Symmetrical balance. More specifically, the coil assembly 370sc and the magnet assembly 370sm have equal mass values ​​and are aligned with the sensor assembly center plane CP. 300 Because the insert 374sc is selected to symmetrically balance the coil assembly 370sc and the magnet assembly 370sm, the coil assembly 370sc and the magnet assembly 370sm have equal mass values. That is, the shape and density of the insert 374sc are selected to make the coil assembly 370sc have equal mass values ​​and have a distance from the sensor assembly center plane CP to the coil assembly 370sc. 300 Positioned equidistant from the magnet assembly 370sm.

[0085] The shape and density of the insert 374sc and the arrangement of the components can be selected during design, prototyping, manufacturing, etc., although the shape and density of the insert 374sc can be selected in any suitable manner. The insert 374sc is shown as having a cylindrical shape with an internally threaded portion that engages with the bolt. The bolt provides a compressive force to the insert 374sc and the first bracket 370b. Thus, the insert 374sc and the first bracket 370b are pressed together. Figure 3 As shown in FIG, the insert 374sc includes a retaining groove that engages with the retaining tongue of the coil bobbin 372sc. The retaining groove and the retaining tongue are close to the coil assembly 370sc. Therefore, the coil bobbin 372sc is also compressed toward the first bracket 370b, and as shown in FIG. Figure 3 As shown in FIG, the coil bobbin 372sc does not abut the first bracket 370b.

[0086] Insertion piece 374sc can be made of relatively heavy material, such as metal etc.That is to say, the mass value of insertion piece 374sc can be significantly greater than the mass value of coil bobbin 372sc.Therefore, the position of coil assembly 370sc can be mainly determined by insertion piece 374sc.Therefore, can come with enough precision and determine the position of coil assembly 370sc by only insertion piece 374sc being abutted to first support 370b.Alternatively, alternative coil bobbin and / or insertion piece both can abut first support 370b, to more accurately determine the position of coil assembly 370sc.

[0087] As can be appreciated, alternative electromagnetic transducers can be formed using different features that perform the same or similar functions. For example, an adhesive can be used instead of a tongue and groove to retain an alternative balancing insert in the spool. Additionally or alternatively, the alternative insert and / or spool can be constructed from more than one piece. The electromagnetic transducer 370s can also be positioned differently, with different sizes and shapes, alternative positioning features, etc. Some exemplary alternatives are discussed below.

[0088] Figure 4 A first alternative catheter-sensor assembly 400 is shown that includes a sensor coupled to a reference Figure 2 The electromagnetic transducer assembly 470 of the catheter 130, 130' is described. The catheter 130, 130' may be a reference Figure 1 The electromagnetic transducer assembly 470 may be an example of a first oscillating portion 13 and a second oscillating portion 13' as described. Figure 1 The electromagnetic transducer 17 described and referenced Figure 2 An example of a pick-off sensor 1701, 170r is depicted. The electromagnetic transducer assembly 470 is mechanically coupled to the conduit 130, 130'. Figure 4Also shown is the sensor assembly center plane CP equidistant between the first conduit 130 and the second conduit 130'. 400 The electromagnetic transducer assembly 470 includes a first bracket 470b and a second bracket 470b' and an electromagnetic transducer 470s. The transducer mass center line CML is also shown. 470s The electromagnetic transducer 470s is mechanically coupled to the catheters 130, 130' via a first bracket 470b and a second bracket 470b'. More specifically, the coil assembly 470sc is mechanically coupled to the first bracket 470b, which is mechanically coupled to the first catheter 130, and the magnet assembly 470sm is mechanically coupled to the second bracket 470b', which is mechanically coupled to the second catheter 130'. The coil assembly mass center CM 470sc and the magnet assembly mass center CM 470sm is shown as being located at the transducer mass centerline CML 470s superior.

[0089] As from Figure 4 It is understood that the conduits 130, 130' and the first bracket 470b and the second bracket 470b' have the same shape. The conduits 130, 130' and the first bracket 470b and the second bracket 470b' are also made of the same material. Therefore, the conduits 130, 130' and the first bracket 470b have equal mass and moment of inertia values. In addition, the conduits 130, 130' and the first bracket 470b and the second bracket 470b' are symmetrically aligned with the sensor assembly center plane CP. 400 Therefore, the catheters 130, 130' and the first bracket 470b and the second bracket 470b' are respectively about the center plane CP of the sensor assembly. 400 Symmetrical Balance. Therefore, since the first bracket 470b and the second bracket 470b' are attached to the conduits 130, 130', respectively, the total mass of the first conduit 130 and the first bracket 470b and the total mass of the second conduit 130' and the second bracket 470b' are also symmetrically balanced.

[0090] Sensor component center plane CP 400 It is also at least approximately and roughly located at the midpoint of the electromagnetic transducer assembly 470, which may be the center of mass of the electromagnetic transducer assembly 470. Figure 4As shown in FIG, the electromagnetic transducer assembly 470 includes an electromagnetic transducer 470s and a first bracket 470b and a second bracket 470b'. The electromagnetic transducer 470s is mechanically coupled to the first bracket 470b and the second bracket 470b', and the first bracket 470b and the second bracket 470b' are mechanically coupled to the conduits 130 and 130'. The first bracket 470b and the second bracket 470b' can be mechanically coupled to the conduits 130 and 130' by brazing, welding, single-piece forging and / or any other suitable means. Figure 4 As shown in FIG, first and second brackets 470b and 470b' are attached to conduits 130, 130' by brazing. Electromagnetic transducer 470s is shown as being mechanically coupled to first and second brackets 470b and 470b' using screws as fasteners. However, the same or alternative transducer components may be attached to alternative brackets by any suitable means, such as brazing, welding, fastening, adhesives, and / or the like.

[0091] The electromagnetic transducer 470s may be a displacement sensor comprised of two relatively positioned parts that enable the electromagnetic transducer 470s to determine the relative displacement between the two parts. As used herein, the term "displacement" includes any distance and any value that can be derived from the distance, such as velocity, acceleration, etc. Figure 4 As shown in FIG, the two parts of the electromagnetic transducer 470s are the coil assembly 470sc and the magnet assembly 470sm.

[0092] Coil assembly 470sc and magnet assembly 470sm are shown disposed in sensor assembly center plane CP. 400 470sm, but with some overlap due to complementary and non-interfering interfaces. More specifically, coil assembly 470sc has a cylindrical interface portion that has a smaller diameter than the cylindrical interface portion of magnet assembly 470sm. Thus, coil assembly 470sc extends into magnet assembly 470sm, while magnet assembly 470sm surrounds coil assembly 470sc.

[0093] The coil assembly 470sc is shown to include a coil bobbin 472sc and an insert 474sc that are mechanically coupled to each other. More specifically, the coil bobbin 472sc is attached to the insert 474sc. Figure 4 As shown in FIG, the coil bobbin 472sc is overmolded onto the insert 474sc. That is, the coil bobbin 472sc can be composed of a non-conductive substance such as a polymer, ceramic, etc. that is overmolded onto the insert 474sc. Although Figure 4 470sm, the electromagnetic transducer 470s comprises a coil wound around a coil bobbin 472sc. The coil can carry an electric current due to the magnetic field of the magnet assembly 470sm.

[0094] Magnet assembly 470sm is shown to include magnet 472sm and magnet holder 474sm. Magnet 472sm and magnet holder 474sm are mechanically coupled to each other. More specifically, magnet 472sm is attached to magnet holder 474sm. Magnet 472sm and magnet holder 474sm can be mechanically attached to each other using any suitable means, such as adhesive, press fit, fastening features, etc. Magnet 472sm can provide a magnetic field shaped and gathered by magnet holder 474sm. Therefore, magnet holder 474sm can be made of ferromagnetic material, although any suitable material that can shape and / or gather the magnetic field provided by magnet 472sm can be adopted.

[0095] 470sm and 470sc are shown as comprising two different parts, other alternative coil assemblies and magnet assembly can comprise more or less parts respectively.For example, alternative coil assembly can be made of single integral material piece that is forged, machined etc.Alternatively, other alternative coil assemblies can comprise three or more parts.By way of explanation, alternative insert can comprise several parts, and these parts can for example allow the more accurate symmetrical balance of transducer component.Similarly, alternative magnet assembly can comprise for example shim, adjustment feature etc., and it allows magnet 472sm to be positioned to help more accurately balance transducer component more.

[0096] The coil assembly 470sc and the magnet assembly 470sm move with the catheters 130, 130', respectively. Thus, the coil assembly 470sc and the magnet assembly 470sm move along the transducer mass centerline CML. 470s The conduits 130 and 130' move back and forth in parallel directions. When the conduits 130 and 130' oscillate in the opposite direction, the coil assembly 470sc and the magnet assembly 470sm will also oscillate in the opposite direction. Therefore, the opposite oscillation of the coil assembly 470sc and the magnet assembly 470sm can cause the magnetic field of the magnet assembly 470sm to change in the coil of the coil assembly 470sc. Therefore, the coil of the coil assembly 470sc can provide a voltage proportional to the relative speed of the coil assembly 470sc and the magnet assembly 470sm. The voltage can be received by a meter electronics device, such as the aforementioned meter electronics device 20, to determine the measurement value.

[0097] The electromagnetic transducer 470s can be about the sensor assembly center plane CP 400 Symmetrical balance. More specifically, the coil assembly mass center CM 470sc and the magnet assembly mass center CM 470sm Have equal mass value and are aligned with the center plane CP of the sensor assembly 400Because the insert 474sc is selected to balance the coil assembly 470sc and the magnet assembly 470sm symmetrically, the coil assembly mass center CM 470sc and the magnet assembly mass center CM 470sm That is, the shape and density of the insert 474sc are selected so that the coil assembly mass center CM 470sc The mass center CM of the magnet assembly is 470sm Equal mass value and with a distance from the center plane CP of the sensor assembly 400 and the center of mass CM of the magnet assembly 470sm Isometric location.

[0098] The shape and density of the insert 474sc can be selected during design, prototyping, manufacturing, etc., although the shape and density of the insert 474sc can be selected in any suitable manner. The insert 474sc is shown as having a cylindrical shape with an internally threaded portion that engages with the bolt. The bolt provides a compressive force to the insert 474sc and the first bracket 470b. Thus, the insert 474sc and the first bracket 470b are compressed together. Figure 4 As shown in FIG, the insert 474sc includes a retaining groove that engages with the retaining tongue of the coil bobbin 472sc. Therefore, the coil bobbin 472sc is also compressed toward the first bracket 470b, as shown in FIG. Figure 4 , and the coil bobbin 472sc does not abut the first bracket 470b.

[0099] The insert 474sc can be made of a relatively heavy material, such as metal. That is, the mass of the insert 474sc can be significantly greater than the mass of the coil bobbin 472sc. Therefore, the coil assembly mass center CM 470sc The position of the coil assembly can be determined primarily by the insert 474sc. Therefore, the coil assembly mass center CM can be determined with sufficient accuracy by simply abutting the insert 474sc against the first bracket 470b. 470sc Alternatively, both the alternative bobbin and the insert may abut the first bracket 470b to more accurately determine the coil assembly mass center CM 470sc location.

[0100] Figure 5 and Figure 6 A second alternative catheter-sensor assembly 500 is shown that includes a catheter coupled to a reference Figure 2 The electromagnetic transducer assembly 570 of the catheter 130, 130' is described. More specifically, Figure 5 A second alternative catheter-sensor assembly 500 is shown, and Figure 6A portion of the electromagnetic transducer assembly 570 is shown without the conduits 130, 130' for clarity. The conduits 130, 130' may be referenced to Figure 1 The electromagnetic transducer assembly 570 may be an example of a first oscillating portion 13 and a second oscillating portion 13' as described. Figure 1 The electromagnetic transducer 17 described and referenced Figure 2 An example of a pick-off sensor 1701, 170r is depicted. The electromagnetic transducer assembly 570 is mechanically coupled to the conduit 130, 130'. Figure 5 Also shown is the sensor assembly center plane CP equidistant between the first conduit 130 and the second conduit 130'. 500 The electromagnetic transducer assembly 570 includes a first bracket 570b, a second bracket 570b' and an electromagnetic transducer 570s. Figure 5 The transducer mass centerline CML is also shown. 570s The electromagnetic transducer 570s is mechanically coupled to the catheters 130, 130' via the first bracket 570b and the second bracket 570b'. More specifically, the coil assembly 570sc is mechanically coupled to the first bracket 570b, which is mechanically coupled to the first catheter 130, and the magnet assembly 570sm is mechanically coupled to the second bracket 570b', which is mechanically coupled to the second catheter 130'. The coil assembly mass center CM 570sc and the magnet assembly mass center CM 570sm is shown as being located at the transducer mass centerline CML 570s superior.

[0101] As from Figure 5 It is understood that the conduits 130, 130' and the first bracket 570b and the second bracket 570b' have the same shape. The conduits 130, 130' and the first bracket 570b and the second bracket 570b' are also made of the same material. Therefore, the conduits 130, 130' and the first bracket 570b and the second bracket 570b' have equal mass and moment of inertia values. In addition, the conduits 130, 130' and the first bracket 570b and the second bracket 570b' are symmetrically aligned with the sensor assembly center plane CP. 500 Therefore, the catheters 130, 130' and the first bracket 570b and the second bracket 570b' are respectively about the center plane CP of the sensor assembly. 500 Symmetrical Balance. Since the first bracket 570b and the second bracket 570b' are attached to the conduits 130 and 130', respectively, the total mass of the first conduit 130 and the first bracket 570b and the total mass of the second conduit 130' and the second bracket 570b' are also symmetrically balanced.

[0102] Sensor component center plane CP 500 It is also at least approximately located at the midpoint of the electromagnetic transducer assembly 570, which may be the center of mass of the electromagnetic transducer assembly 570. Figure 5 and Figure 6 As shown in FIG, the electromagnetic transducer 570s is mechanically coupled to the first bracket 570b and the second bracket 570b', which are mechanically coupled to the conduits 130, 130'. The first bracket 570b and the second bracket 570b' may be mechanically coupled to the conduits 130, 130' by brazing, welding, single-piece forging, and / or any other suitable means. Figure 5 As shown in FIG1 , first and second brackets 570 b and 570 b ′ are attached to conduits 130 and 130 ′ by brazing. Electromagnetic transducer 570 s is shown as being mechanically coupled to first and second brackets 570 b and 570 b ′ using screws as fasteners. However, alternative transducer components may be attached to alternative brackets by any suitable means, such as brazing, welding, fastening, adhesives, and / or the like.

[0103] like Figure 5 and Figure 6 As shown in FIG, the two parts of the electromagnetic transducer 570s are the coil assembly 570sc and the magnet assembly 570sm. Figure 5 , the coil assembly 570sc and the magnet assembly 570sm are shown as being disposed in the sensor assembly center plane CP 500 570sm, but with some overlap due to complementary and non-interfering interfaces. More specifically, coil assembly 570sc has a cylindrical interface portion that has a smaller diameter than the cylindrical interface portion of magnet assembly 570sm. Thus, coil assembly 570sc extends into magnet assembly 570sm, while magnet assembly 570sm surrounds coil assembly 570sc.

[0104] The coil assembly 570sc is shown to include a coil bobbin 572sc and an insert 574sc that are mechanically coupled to each other. More specifically, the coil bobbin 572sc is attached to the insert 574sc. Figure 6 As shown in FIG, the coil bobbin 572sc is adhered to the insert 574sc using an adhesive 576sc. That is, the coil bobbin 572sc can be composed of a non-conductive material such as a polymer, ceramic, etc. that is adhered to the insert 574sc. The adhesive can be an epoxy, a thread lock adhesive, a polyurethane adhesive, a room temperature vulcanized silicone, and / or the like. Although for clarity in FIG. Figure 5 and Figure 6570sm, the electromagnetic transducer 570s comprises a coil wound around a coil bobbin 572sc. The coil can carry an electric current due to the magnetic field of the magnet assembly 570sm.

[0105] Magnetic assembly 570sm is shown to include magnet 572sm and magnet holder 574sm. Magnet 572sm and magnet holder 574sm are mechanically coupled to each other. More specifically, magnet 572sm is attached to magnet holder 574sm. Magnet 572sm and magnet holder 574sm can be mechanically attached to each other using any suitable means, such as adhesive, press fit, fastening features, etc. Magnet 572sm can provide a magnetic field shaped and gathered by magnet holder 574sm. Therefore, magnet holder 574sm can be made of ferromagnetic material, although any suitable material that can shape and / or gather the magnetic field provided by magnet 572sm can be adopted.

[0106] 2 and 3. Although coil assembly 570sc and magnet assembly 570sm are shown as comprising two different parts respectively, other coil assemblies and magnet assembly can comprise more or less parts respectively.For example, alternative coil assembly can be made of single integral material piece that is forged, machined etc.Alternatively, other coil assemblies can comprise three or more parts.By way of explanation, alternative insert can comprise several parts, and these parts can for example allow the more accurate symmetrical balance of transducer component.Similarly, alternative magnet assembly can comprise for example shim, adjustment feature etc., and it allows magnet to be positioned to help more accurately balance transducer component more.

[0107] Reference Figure 5 The coil assembly 570sc and the magnet assembly 570sm move with the catheters 130 and 130', respectively. Therefore, the coil assembly 570sc and the magnet assembly 570sm move along the transducer mass centerline CML. 570s The conduits 130 and 130' move back and forth in parallel directions. When the conduits 130 and 130' oscillate in the opposite direction, the coil assembly 570sc and the magnet assembly 570sm will also oscillate in the opposite direction. Therefore, the opposite oscillation of the coil assembly 570sc and the magnet assembly 570sm can cause the magnetic field of the magnet assembly 570sm to change in the coil of the coil assembly 570sc. Therefore, the coil of the coil assembly 570sc can provide a voltage proportional to the relative speed of the coil assembly 570sc and the magnet assembly 570sm. The voltage can be received by a meter electronics device, such as the meter electronics device 20 described above, to determine the measurement value.

[0108] The electromagnetic transducer 570s can be about the sensor assembly center plane CP 500 Symmetrical balance. More specifically, refer to Figure 5 , coil assembly mass center CM570sc and the magnet assembly mass center CM 570sm Have equal mass value and are aligned with the center plane CP of the sensor assembly 500 Because the insert 574sc is selected to balance the coil assembly 570sc and the magnet assembly 570sm symmetrically, the coil assembly mass center CM 570sc and the magnet assembly mass center CM 570sm That is, the shape and density of the insert 574sc are selected so that the coil assembly mass center CM 570sc The mass center CM of the magnet assembly is 570sm Equal mass value and with a distance from the center plane CP of the sensor assembly 500 and the center of mass CM of the magnet assembly 570sm Isometric location.

[0109] The shape and density of the insert 574sc can be selected during design, prototyping, manufacturing, etc., although the shape and density of the insert 574sc can be selected in any suitable manner. The insert 574sc is shown as having a cylindrical shape with an internally threaded portion that engages with the bolt. The bolt provides a compressive force to the insert 574sc and the first bracket 570b. Thus, the insert 574sc and the first bracket 570b are compressed together. Figure 5 As shown in FIG, the insert 574sc includes an engaging chamfer that engages with the engaging taper of the coil bobbin 572sc. Therefore, the coil bobbin 572sc is also compressed toward the first bracket 570b, as shown in FIG. Figure 5 , and the coil bobbin 572sc does not abut the first bracket 570b.

[0110] The insert 574sc can be made of a relatively heavy material, such as metal. That is, the mass of the insert 574sc can be significantly greater than the mass of the coil bobbin 572sc. Therefore, the coil assembly mass center CM 570sc The position of the coil assembly can be determined primarily by the insert 574sc. Therefore, the coil assembly mass center CM can be determined with sufficient accuracy by simply abutting the insert 574sc against the first bracket 570b. 570sc Alternatively, for example, both the alternative coil bobbin and the insert may abut the first bracket 570b to more accurately determine the coil assembly mass center CM 570sc location.

[0111] As can be appreciated, the engaging chamfers of the insert 574sc and the engaging tapers of the coil bobbin 572sc position the coil bobbin 572sc relative to the insert 574sc. As can be appreciated, this can be suitable for less precise applications that do not require precise measurements. Other applications may require more precise positioning, which can be achieved by utilizing other positioning features, examples of which are described below with reference to Figure 7 Have a discussion.

[0112] Figure 7 An electromagnetic transducer 770s is shown, which may be configured to couple to a reference Figure 2 The described catheters 130, 130' ( Figure 7 The electromagnetic transducer 770s may be a reference to a third alternative electromagnetic transducer (not shown). Figure 1 The electromagnetic transducer 17 described and referenced Figure 2 Examples of pickup sensors 1701, 170r are described.

[0113] like Figure 7 As shown in FIG, electromagnetic transducer 770s is configured to be mechanically coupled to a sensor holder, which can be mechanically coupled to catheter 130, 130'. Electromagnetic transducer 770s can be mechanically coupled to the sensor holder using screws as fasteners. Additionally or alternatively, the same or other transducer components can be attached to the sensor holder by any suitable means, such as brazing, welding, fastening, and / or the like.

[0114] like Figure 7 As shown in FIG, the two parts of the electromagnetic transducer 770s are the coil assembly 770sc and the magnet assembly 770sm. Figure 7 In the embodiment of the present invention, coil assembly 770sc and magnet assembly 770sm have some overlap due to complementary and non-interfering interfaces. More specifically, coil assembly 770sc has a cylindrical interface portion that has a smaller diameter than the cylindrical interface portion of magnet assembly 770sm. Therefore, coil assembly 770sc extends into magnet assembly 770sm, while magnet assembly 770sm surrounds coil assembly 770sc.

[0115] The coil assembly 770sc is shown to include a coil bobbin 772sc and an insert 774sc that are mechanically coupled to each other. More specifically, the coil bobbin 772sc is attached to the insert 774sc. Figure 7 As shown in FIG, the coil bobbin 772sc is adhered to the insert 774sc using an adhesive 776sc. That is, the coil bobbin 772sc can be composed of a non-conductive material such as a polymer, ceramic, etc. that is adhered to the insert 774sc. The adhesive can be an epoxy resin, a thread lock adhesive, a polyurethane adhesive, and / or the like. Figure 7As shown in FIG, electromagnetic transducer 770s includes a coil 771sc wound around a coil bobbin 772sc. Coil 771sc can carry an electric current due to the magnetic field of magnet assembly 770sm.

[0116] Magnet assembly 770sm is shown to include magnet 772sm and magnet holder 774sm. Magnet 772sm and magnet holder 774sm are mechanically coupled to each other. More specifically, magnet 772sm is attached to magnet holder 774sm. Magnet 772sm and magnet holder 774sm can be mechanically attached to each other using any suitable means, such as adhesive, press fit, fastening features, etc. Magnet 772sm can provide a magnetic field shaped and gathered by magnet holder 774sm. Therefore, magnet holder 774sm can be made of ferromagnetic material, although any suitable material that can shape and / or gather the magnetic field provided by magnet 772sm can be adopted.

[0117] 70sm.Although coil assembly 770sc and magnet assembly 770sm are shown as comprising two different parts respectively, other alternative coil assemblies and magnet assembly can comprise more or less parts respectively.For example, alternative coil assembly can be made of single integral material piece that is forged, machined etc.Alternatively, other coil assemblies can comprise three or more parts.By way of illustration, alternative insert can comprise several parts, and these parts can for example allow the more accurate symmetrical balance of transducer component.Similarly, alternative magnet assembly can comprise for example shim, adjustment feature etc., and it allows magnet 772sm to be positioned to help more accurately balance electromagnetic transducer 770s.

[0118] Coil assembly 770sc and magnet assembly 770sm can move together with catheter 130, 130', respectively. Therefore, coil assembly 770sc and magnet assembly 770sm move back and forth with each other in a direction parallel to the center plane of the device. When catheter 130, 130' oscillates in the opposite direction, coil assembly 770sc and magnet assembly 770sm will also oscillate in the opposite direction. Therefore, the opposite oscillation of coil assembly 770sc and magnet assembly 770sm can cause the magnetic field of magnet assembly 770sm to change in coil 771sc of coil assembly 770sc. Therefore, coil 771sc of coil assembly 770sc can provide a voltage proportional to the relative speed of coil assembly 770sc and magnet assembly 770sm. The voltage can be received by meter electronics, such as the aforementioned meter electronics 20, to determine the measured value.

[0119] Electromagnetic transducer 770s can be symmetrically balanced about the center plane of the device. More specifically, the mass centers of coil assembly 770sc and magnet assembly 770sm have equal mass values ​​and can be arranged equidistant from the center plane of the device. Because insert 774sc is selected to make coil assembly 770sc and magnet assembly 770sm symmetrically balanced, the mass centers of coil assembly 770sc and magnet assembly 770sm can have equal mass values. In other words, the shape and density of insert 774sc are selected so that the mass center of coil assembly 770sc has the same mass value as the mass center of magnet assembly 770sm, and has a position equidistant from the center plane of the device and the mass center of magnet assembly 770sm.

[0120] The shape and density of the insert 774sc can be selected during design, prototyping, manufacturing, etc., although the shape and density of the insert 774sc can be selected in any suitable manner. The insert 774sc is shown as having a cylindrical shape with an internally threaded portion that can be engaged by a bolt. The bolt can provide a compressive force to the insert 774sc and the sensor bracket. Therefore, the insert 774sc and the sensor bracket can be compressed together. Figure 7 As shown in , the insert 774sc includes an engagement chamfer that engages with the engagement tapered member of the coil bobbin 772sc. Therefore, the coil bobbin 772sc can also be compressed toward the sensor bracket so that the coil bobbin 772sc and the insert 774sc abut the sensor bracket. More specifically, the insert 774sc includes an insert shoulder 774scs that engages with the coil bobbin groove 772scg of the coil bobbin 772sc. As can be understood, the coil bobbin groove 772scg can accurately position the insert 774sc relative to the coil bobbin 772sc.

[0121] Multi-piece inserts

[0122] Figure 8 An electromagnetic transducer 870s is shown, which may be configured to couple to a reference Figure 2 A fourth alternative electromagnetic transducer for the catheter 130, 130' is described. For clarity, Figure 8 The catheters 130, 130' are not shown. The electromagnetic transducer 870s may be a reference Figure 1 The electromagnetic transducer 17 described and referenced Figure 2 Examples of pickup sensors 1701, 170r are described.

[0123] like Figure 8As shown in FIG, electromagnetic transducer 870s is configured to be mechanically coupled to a sensor holder, which can be mechanically coupled to catheter 130, 130'. Electromagnetic transducer 870s can be mechanically coupled to the sensor holder using screws as fasteners (not shown). Additionally or alternatively, other transducer components can be attached to the sensor holder by any suitable means, such as brazing, welding, fastening, and / or the like.

[0124] like Figure 8 As shown in FIG, the electromagnetic transducer 870s includes a coil assembly 870sc and a magnet assembly 870sm. Figure 8 In the embodiment of the present invention, coil assembly 870sc and magnet assembly 870sm have some overlap due to complementary and non-interfering interfaces. More specifically, coil assembly 870sc has a cylindrical interface portion that has a smaller diameter than the cylindrical interface portion of magnet assembly 870sm. Therefore, coil assembly 870sc extends into magnet assembly 870sm, while magnet assembly 870sm surrounds coil assembly 870sc.

[0125] Coil assembly 870sc is shown as comprising coil bobbin 872sc and insert 874sc that are mechanically coupled to each other.Wherein more specifically, insert 874sc comprises interior insert 874sca and exterior insert 874scb, and interior insert 874sca and exterior insert 874scb are respectively arranged on the inside and outside of coil bobbin 872sc.Interior insert 874sca is shown as comprising interior insert groove 874scag that engages with the retaining tongue 872sct of coil bobbin 872sc.In addition, exterior insert 874scb comprises exterior insert flange 874scbf that engages with the coil bobbin groove 872scg of coil bobbin 872sc.As can be understood, coil bobbin groove 872scg can accurately position exterior insert 874scb relative to coil bobbin 872sc and interior insert 874sca.

[0126] The coil bobbin 872sc is attached to the insert 874sc. Figure 8 As shown in the , the coil bobbin 872sc is overmolded onto the inner insert 874sca. However, any suitable means may be used, such as, for example, using an adhesive such as glue or compression due to being attached to the bracket. A bolt (not shown) may engage the threaded portion 872scat to compress the inner insert 874sca into the coil bobbin 872sc, which in turn may be compressed into the outer insert 874scb. The coil bobbin 872sc may be constructed of a non-conductive substance such as a polymer, ceramic, etc. adhered to the insert 874sc. Although in Figure 8870sc, but the coil assembly 870sc includes a coil wound around a coil bobbin 872sc. The coil can carry an electric current due to the magnetic field of the magnet assembly 870sm.

[0127] Magnet assembly 870sm is shown to include magnet 872sm and magnet holder 874sm. Magnet 872sm and magnet holder 874sm are mechanically coupled to each other. More specifically, magnet 872sm is attached to magnet holder 874sm. Magnet 872sm and magnet holder 874sm can be mechanically attached to each other using any suitable means, such as adhesive, press fit, fastening features, etc. Magnet 872sm can provide a magnetic field shaped and gathered by magnet holder 874sm. Therefore, magnet holder 874sm can be made of ferromagnetic material, although any suitable material that can shape and / or gather the magnetic field provided by magnet 872sm can be adopted.

[0128] 870sm are shown as comprising two different parts respectively, other alternative coil assemblies and magnet assembly can comprise more or less parts respectively.For example, alternative coil assembly can be made of single integral material piece that is forged, machined etc.Alternatively, other coil assemblies can comprise three or more parts.By way of explanation, alternative insert can comprise several parts, and these parts can for example allow the more accurate symmetrical balance of transducer component.Similarly, alternative magnet assembly can comprise for example shim, adjustment feature etc., and it allows magnet to be positioned to help more accurately balance transducer component more.

[0129] Coil assembly 870sc and magnet assembly 870sm can move together with conduit 130, 130' respectively. Therefore, coil assembly 870sc and magnet assembly 870sm move back and forth with each other in a direction parallel to the center plane of the device. When conduit 130, 130' oscillates in the opposite direction, coil assembly 870sc and magnet assembly 870sm will also oscillate in the opposite direction. Therefore, the opposite oscillation of coil assembly 870sc and magnet assembly 870sm can cause the magnetic field of magnet assembly 870sm to change in the coil of coil assembly 870sc. Therefore, the coil of coil assembly 870sc can provide a voltage proportional to the relative speed of coil assembly 870sc and magnet assembly 870sm. The voltage can be received by meter electronics, such as the above-mentioned meter electronics 20, to determine the measured value.

[0130] Electromagnetic transducer 870s can be symmetrically balanced about the center plane of the device. More specifically, the mass centers of coil assembly 870sc and magnet assembly 870sm have equal mass values ​​and can be arranged equidistantly from the center plane of the device. Because insert 874sc is selected to make coil assembly 870sc and magnet assembly 870sm symmetrically balanced, the mass centers of coil assembly 870sc and magnet assembly 870sm can have equal mass values. In other words, the shape and density of insert 874sc are selected to make the mass center of coil assembly 870sc have the mass value equal to the mass center of magnet assembly 870sm respectively, and have a position equidistant from the center plane of the device and the mass center of magnet assembly 870sm.

[0131] The shape and density of the insert 874sc can be selected during design, prototyping, manufacturing, etc., although the shape and density of the insert 874sc can be selected in any suitable manner. The inner insert 874sca is shown as having a cylindrical shape with a threaded portion 872scat that can be engaged by a bolt. The bolt can provide a compressive force to the insert 874sc and the sensor bracket. Therefore, the insert 874sc and the sensor bracket can be compressed together. Figure 8 As shown in , the insert 874sc includes an inner insert groove 874scag that engages with the retaining tongue 872sct of the coil bobbin 872sc. Therefore, the inner insert 874sca can also be compressed toward the sensor bracket so that the outer insert 874scb abuts the sensor bracket.

[0132] Insertion piece 874sc can be made of relatively heavy material, such as metal etc.In other words, the mass value of insertion piece 874sc can be significantly greater than the mass value of coil bobbin 872sc.Therefore, the position of the mass center of coil assembly 870sc can be mainly determined by insertion piece 874sc.Therefore, the position of the mass center of coil assembly 870sc can be determined with enough accuracy by coil bobbin 872sc and insertion piece 874sc both being abutted to sensor support.

[0133] Coefficient of thermal expansion

[0134] The aforementioned electromagnetic transducers 370s, 470s, 570s, 770s, and 870s can be subjected to varying ranges of temperature variations. For example, some applications may be consistently high temperature, while other applications may be consistently low temperature. Other applications may have more significant temperature variations, including relatively low temperatures and relatively high temperatures. As can be appreciated, significant temperature variations can cause thermally incompatible components to expand and contract by different amounts relative to the same temperature variation. Consequently, assemblies including thermally incompatible components may fail. To avoid such failures, the electromagnetic transducers 370s, 470s, 570s, 770s, and 870s may be constructed from thermally compatible components and materials.

[0135] Thermal Expansion Compatibility Components and / or materials can be constructed of materials having approximately equal coefficients of thermal expansion ("CTEs"). The CTEs can be approximately equal if the components and / or materials expand and contract in a generally uniform manner such that the components and / or materials meet the design functionality. As can be appreciated, components and / or materials can be thermally expansion compatible even if their respective CTEs are not exactly equal. By way of illustration, an insert that is press-fitted into a substrate can be thermally expansion compatible with the substrate if the CTE of the insert is slightly greater than the CTE of the substrate. As can be appreciated, the insert and substrate may not be thermally expansion compatible if the CTE of the insert is less than the CTE of the substrate. That is, if the CTE of the insert is greater than the CTE of the substrate, the design functionality of the press fit is still met.

[0136] Additionally, the specified or expected temperature range can also determine whether the components and / or materials are thermally expansion compatible. For example, if the application is considered to be a high-temperature application only, then the insert and substrate discussed above may be thermally expansion compatible if the insert is press-fitted into the substrate at room temperature. That is, a subsequent increase in temperature will result in greater expansion of the insert relative to the expansion of the substrate, thereby increasing the retention force of the press fit. Conversely, if the specified temperature range is very low, then the insert and substrate assembled at room temperature may not be thermally expansion compatible because the insert will contract more than the substrate. As a result, the retention force of the press fit will be reduced.

[0137] Thermal expansion compatibility can also take into account reliability-related issues. For example, some materials may be more brittle than other materials. Therefore, if the substrate is more brittle than the insert, the insert may cause the substrate to crack (e.g., microfracture). As can be understood, cracks are formed when the temperature changes. Therefore, the cracks formed in a single temperature cycle from room temperature to a very high but also very narrow temperature range may not be enough to reduce the retention force of the press fit. In other words, the narrow temperature range may not be enough to cause additional cracks to form. However, if the very high temperature range is also very large, and the insert and substrate are subjected to repeated cycles within a very high and very narrow temperature range, additional cracks may form with each temperature cycle, resulting in reliability-related issues, such as a reduction in the retention force of the insert. As illustrated below, other components and / or materials, such as adhesives, may have similar problems.

[0138] As previously discussed, electromagnetic transducers 570s and 770s include adhesives 576sc, 776sc for attaching inserts 574sc, 774sc to coil bobbins 572sc, 772sc. Figure 6 and Figure 7 As can be seen in the figure, the inserts 574sc, 774sc are disposed within the coil bobbins 572sc, 772sc and have a different cross-sectional shape than the coil bobbins 572sc, 772sc. Therefore, temperature changes of the electromagnetic transducers 570s, 770s can cause relative displacement between the coil bobbin 572sc and the insert 574sc, as well as between the coil bobbin 772sc and the insert 774sc. The magnitude of the relative displacement can be proportional to the temperature change and the difference between the CTE of the coil bobbin 572sc and the CTE of the insert 574sc, as well as between the CTE of the coil bobbin 772sc and the CTE of the insert 774sc.

[0139] Due to relative displacement, adhesive 576sc, 776sc is subjected to stress. For example, adhesive 576sc, 776sc can be subjected to such as compressive shear stress. Therefore, when subjected to the given number of cycles specified in a given temperature range, relatively brittle adhesive may fail, and the adhesive of relative ductility will not fail. Can be based on the CTE of coil bobbin 572sc, 772sc and the CTE of insert 574sc, 774sc, such as the difference between the CTE, the operating temperature range, the number of times of temperature cycle and / or the like select to be used for adhesive 576sc, 776sc. Can use the simulation of empirical data, solid model and / or the like to carry out this assessment.

[0140] Another consideration may be the functional specifications of the electromagnetic transducers 570s and 770s. More specifically, flexible adhesives such as silicone-based adhesives may allow the electromagnetic transducers 570s and 770s to operate over a wide temperature range. However, this flexibility may also inhibit the reverse oscillations between the coil assembly 570sc and the magnet assembly 570sm, and between the coil assembly 770sc and the magnet assembly 770sm. Due to the effect of damping on the phase of the relative oscillation, damping may result in less accurate measurements. A more rigid adhesive may reduce or eliminate this damping, but may not be suitable for a wide temperature range due to possible mechanical failure in the adhesives 576sc and 776sc. Therefore, the material used for the adhesives 576sc and 776sc may be selected for a specific temperature range.

[0141] As an exemplary option, epoxy adhesives may be acceptable for attaching the spool to the insert, but may have a high loss factor similar to damping. For example, Xian Wang et al. found in Damping properties of flexible epoxy resin (Journal of Wuhan University of Technology - Materials Science Edition, Vol. 23, pp. 411-414, 2008) that epoxy resin adhesives can have a loss factor as high as 1.57. As discussed above, damping can affect the phase measurement of the vibrating meter 5 and therefore affect the accuracy of the measured mass flow rate value. As also mentioned above, assuming that all other adhesive selection criteria are irrelevant, low damping materials are preferred. In addition, Rhodes' U.S. Patent Publication No. 2017 / 0218239 teaches that silicone-based adhesives can have a lower damping / loss factor of about 0.1. Therefore, silicone-based adhesives may be superior to epoxy-based adhesives.

[0142] As can be appreciated, various methods can form a reference Figure 1 The symmetrical oscillating device 1 and the electromagnetic transducer 17 are described. The following diagram illustrates a method of forming an electromagnetic transducer, such as the electromagnetic transducer 17. Figure 3 and Figure 4 The electromagnetic transducers 370s, 470s described and referenced Figures 5 to 8 Described electromagnetic transducers 570s, 770s.

[0143] Method for forming an electromagnetic transducer

[0144] Figure 9 A first method 900 of forming an electromagnetic transducer for symmetrical oscillation is shown. Figure 9 As shown in FIG, method 900 may provide a first electromagnetic transducer portion in step 910, which may be the first electromagnetic transducer portion as described above with reference to FIG. Figure 1The first electromagnetic transducer portion has a mass center CM 17a In step 920, the method 900 may provide a second electromagnetic transducer portion, which may be the same as that described above with reference to FIG. Figure 1 The second electromagnetic transducer portion has a mass center CM 17b In step 930, the method 900 further includes symmetrically balancing the first electromagnetic transducer portion and the second electromagnetic transducer portion.

[0145] The step 910 of providing a first electromagnetic transducer portion may include configuring the first electromagnetic transducer portion to be mechanically coupled to a first oscillating portion of a symmetrical oscillating device. Similarly, in step 920, providing a second electromagnetic transducer portion may include configuring the first electromagnetic transducer portion to be mechanically coupled to a second oscillating portion of the symmetrical oscillating device. The first oscillating oscillator portion and the second oscillating oscillator portion of method 900 may be referenced to Figure 1 A first oscillating portion 13 and a second oscillating portion 13' are described, although any suitable oscillating portion may be employed.

[0146] In step 930, symmetrically balancing the first electromagnetic transducer portion and the second electromagnetic transducer portion may include positioning the mass center of the first electromagnetic transducer portion and the mass center of the second electromagnetic transducer portion equidistant from the device center plane of the symmetrical oscillation device and positioned on the transducer mass center line. As can be appreciated, the symmetrical oscillation device of method 900 may be a reference to Figure 1 Symmetrical oscillating device described.

[0147] The method 900 may further include defining and positioning a center plane of the symmetrical oscillating device at a point equidistant between the oscillating portion and the second oscillating portion. The method 900 may further include orienting the transducer mass centerline to be orthogonal to the device center plane of the symmetrical oscillating device. Additionally or alternatively, the method 900 may further include configuring the first electromagnetic transducer portion and the second electromagnetic transducer portion to have the same moment of inertia value.

[0148] Providing the first electromagnetic transducer portion may include providing a magnet assembly, and providing the second electromagnetic transducer portion may include providing a coil assembly. For example, the coil assembly and the magnet assembly of method 900 may be respectively referred to as Figures 3 to 8The coil assemblies 370sc, 470sc, 570sc-870sc and magnet assemblies 370sm, 470sm, 570sm-870sm are described, although any suitable coil assembly and magnet assembly may be employed. Additionally or alternatively, providing the magnet assembly may include providing a magnet and a magnet holder attached to the magnet, and providing the coil assembly may include providing a bobbin and an insert attached to the bobbin. Method 900 may select the insert to balance the magnet assembly and the coil assembly symmetrically.

[0149] As referenced Figures 2 to 8 As will be appreciated from the foregoing discussion, the symmetrical oscillating device may be a vibrating meter configured to measure a property of a material, although any symmetrical oscillating device may be formed. For example, the first oscillating portion and the second oscillating portion of the method 900 may be conduits of the vibrating meter 5 described above. Thus, the first oscillating portion and the second oscillating portion of the method 900 may each include reference Figures 2 to 5 Conduits 130, 130' are depicted, although any suitable oscillating portion may be employed, such as the vibrating teeth of a densitometer.

[0150] Figure 10 A second method 1000 of forming an electromagnetic transducer for symmetrical oscillation is shown. Figure 10 As shown in FIG, method 1000 begins at step 1010 by forming a magnet assembly, which, by way of illustration, may be the magnet assembly described above with reference to FIG. Figures 5 to 7 The magnet assembly 570sm, 770sm described herein can be any suitable magnet assembly, although any suitable magnet assembly can be formed. In step 1020, method 1000 forms a coil assembly. Step 1020 can include providing an insert, providing a bobbin, selecting an adhesive to minimize the elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly. The coil assembly of method 1000 can be the coil assembly 570sc, 770sc described above. In step 1030, the method utilizes an adhesive to attach the insert to the bobbin. Method 1000 can also include forming a non-interference interface between the magnet assembly and the coil assembly. The non-interference interface can be complementary.

[0151] The step 1010 of forming a magnet assembly can include forming, for example, the above-mentioned magnet assemblies 570sm, 770sm, although any suitable magnet assembly can be adopted. The magnet assembly of forming method 1000 can include forming a cylindrical magnet holder having a semi-enclosed end and an open end. The magnet holder can have an axial cross-section similar to a bowl or cup (that is, a plane including the axis of the cylindrical shape of the magnet holder). The magnet can have a cylindrical body attached to the semi-enclosed end. The axis of the magnet can be coaxial with the axis of the magnet holder. The magnet can be attached to the inner part of the closed end of the magnet holder, and therefore can be located inside the magnet holder.

[0152] The step 1020 of forming the coil assembly by providing an insert and a bobbin can be, for example, by providing the above-mentioned coil bobbins 572sc, 772sc and inserts 574sc, 774sc to form the coil assembly 570sc, 770sc, although any suitable coil bobbins and inserts can be used. Step 1020 can also include other additional steps, such as providing a coil, winding the coil around the bobbin, emulsifying the coil with an insulator, baking the coil and insulator assembly, and / or similar steps. The insert can be selected to balance the coil assembly and the magnet assembly symmetrically, although any suitable insert can be used.

[0153] Additionally, selecting the adhesive to minimize elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly at step 1020 may include selecting the adhesive to elastically deform within the predetermined operating temperature range of the coil assembly and to plastically deform within an alternative predetermined operating temperature range that is greater than the predetermined operating temperature range of the coil assembly. Table 1 below illustrates a selection matrix for adhesives.

[0154] Table 1. Exemplary Selection Matrix for Adhesives

[0155]

[0156] Method 1000 can also verify that one or more sensor parameters remain within a predetermined sensor parameter range within a predetermined operating temperature range. For example, the one or more sensor parameters include at least one of a physical property of the sensor and a transducer performance of the sensor. An example of a physical property of the sensor can be the damping of the sensor. The damping of the sensor can be defined as the energy dissipated by the adhesive associated with the displacement of the bobbin relative to the insert. This dissipation can occur when the sensor oscillates. In other words, the relative displacement of the bobbin relative to the insert can be due to the compliance of the adhesive. Generally, the greater the relative displacement of the bobbin and the insert, the greater the impact of the damping on the sensor's measurements.

[0157] In order to solve this problem, the step of selecting adhesive to minimize the elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly can also include: the amount of adhesive is selected to minimize the gap between the bobbin and the insert. In other words, the amount required to fill the gap of the predetermined width can be selected. Other fluid properties of the adhesive can also be selected, such as viscosity, adhesion and / or similar properties, to minimize the gap of the adhesive.

[0158] The elastic deformation of the adhesive within the predetermined temperature range may also be affected by other issues, such as whether the adhesive deforms at the same rate relative to temperature changes as the bobbin and / or insert. Accordingly, selecting the adhesive to minimize the elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly may include minimizing the difference between the thermal expansion coefficient of the insert and the thermal expansion coefficient of the adhesive.

[0159] Attaching the insert to the spool with an adhesive 1030 may include applying an adhesive to at least one of the insert and the spool, and pressing the insert and the spool together in a predetermined spaced relationship. The adhesive may include one of an epoxy and a silicone-based adhesive, although any suitable adhesive may be used.

[0160] Various pickup sensors have been described above as exemplary electromagnetic transducers for symmetrical oscillation of symmetrical oscillating devices. That is, the electromagnetic transducer converts symmetrical mechanical oscillations into electrical oscillations that are provided as signals. Alternatively, the exemplary electromagnetic transducer for symmetrical oscillations may be, for example, a driver, such as that described above with reference to Figure 2 The described drive 180. That is, an electromechanical transducer for symmetrical oscillations can be used to convert electrical oscillations into symmetrical mechanical oscillations.

[0161] The electromagnetic transducer 17 and the above-described methods 900 and 1000 can be used to ensure that the symmetrical oscillation device 1 has symmetrical mechanical oscillations. By having symmetrical oscillations, measurements that rely on symmetrical oscillations can be more accurate. For example, the electromagnetic transducer 17 may not cause phase and amplitude variations that could cause imbalances in the signal provided by the electromagnetic transducer 17. Similarly, the signal provided to the electromagnetic transducer 17 can induce symmetrical oscillations in the symmetrical oscillation device 1. Symmetrical oscillations can ensure that, for example, a pick-off sensor using the electromagnetic transducer 17 will translate the symmetrical oscillations of the symmetrical oscillation device 1.

[0162] The detailed description of the above embodiments is not an exhaustive description of all embodiments contemplated by the inventors to fall within the scope of this specification. Indeed, those skilled in the art will recognize that certain elements of the above embodiments may be variously combined or removed to create other embodiments, and that such other embodiments fall within the scope and teachings of this specification. It will also be apparent to those skilled in the art that the above embodiments may be combined in whole or in part to create additional embodiments within the scope and teachings of this specification.

[0163] Therefore, although specific embodiments are described herein for illustrative purposes, various equivalent modifications are possible within the scope of this specification, as those skilled in the relevant art will recognize. The teachings provided herein can be applied to other electromagnetic transducers for symmetrical oscillation of symmetrical oscillation devices. Therefore, the scope of the above-described embodiments should be determined by the appended claims.

Claims

1. An electromagnetic transducer (17) for symmetrical oscillation of a symmetrical oscillation device (1), the electromagnetic transducer (17) comprising: A first electromagnetic transducer portion having a first electromagnetic transducer portion mass center (CM 17a ); as well as A second electromagnetic transducer portion having a second electromagnetic transducer portion mass center (CM 17b ); Wherein, the first electromagnetic transducer part and the second electromagnetic transducer part are symmetrically balanced.

2. The electromagnetic transducer (17) according to claim 1, wherein: The first electromagnetic transducer portion is configured to be mechanically coupled to a first oscillating portion (13) of the symmetrical oscillating device (1); and The second electromagnetic transducer part is configured to be mechanically coupled to a second oscillating part (13') of the symmetrical oscillating device (1).

3. The electromagnetic transducer (17) according to claim 1 or claim 2, wherein The first electromagnetic transducer portion and the second electromagnetic transducer portion are symmetrically balanced, including the mass center (CM) of the first electromagnetic transducer portion. 17a ) and the mass center of the second electromagnetic transducer part (CM 17b ) is equidistant from the device center plane (CP1) of the symmetrical oscillating device (1) and is located at the transducer mass center line (CML 17 )superior.

4. The electromagnetic transducer (17) according to claim 3, wherein: The center plane (CP1) of the symmetrical oscillating device (1) is defined by and located at points equidistant between the first oscillating portion (13) and the second oscillating portion (13').

5. The electromagnetic transducer (17) according to claim 3, wherein: The transducer mass center line (CML 17 ) is orthogonal to the device center plane (CP1) of the symmetrical oscillation device (1).

6. The electromagnetic transducer (17) according to claim 3, wherein: The first electromagnetic transducer portion and the second electromagnetic transducer portion have the same moment of inertia value.

7. The electromagnetic transducer (17) according to any one of the preceding claims 1 to 6, wherein The symmetrical oscillating device (1) is a vibrating meter (5) configured to measure properties of a material.

8. The electromagnetic transducer (17) according to claim 7, wherein: The first oscillating portion (13) and the second oscillating portion (13') are conduits (130, 130') of the vibrating meter (5).

9. The electromagnetic transducer (17) according to any one of the preceding claims 1 to 8, wherein The first electromagnetic transducer portion includes a magnet assembly (17a), and the second electromagnetic transducer portion includes a coil assembly (17b).

10. The electromagnetic transducer (17) according to claim 9, wherein The magnet assembly (17a) includes a magnet and a magnet holder attached to the magnet, and the coil assembly (17b) includes a bobbin and an insert attached to the bobbin.

11. The electromagnetic transducer (17) according to claim 10, wherein: The insert is selected to provide symmetrical balance between the magnet assembly (17a) and the coil assembly (17b).

12. A symmetrical oscillation device (1) configured for symmetrical oscillation, the symmetrical oscillation device (1) comprising: a first oscillating portion (13) and a second oscillating portion (13'), wherein the first oscillating portion (13) and the second oscillating portion (13') are configured to oscillate symmetrically relative to each other; as well as 14. The electromagnetic transducer (17) according to claim 1, being mechanically coupled to the first oscillating part (13) and the second oscillating part (13').

13. A method of forming a symmetrically oscillating electromagnetic transducer for a symmetrically oscillating device, the method comprising: providing a first electromagnetic transducer portion having a first electromagnetic transducer portion center of mass; providing a second electromagnetic transducer portion having a second electromagnetic transducer portion center of mass; as well as The first electromagnetic transducer portion and the second electromagnetic transducer portion are symmetrically balanced.

14. The method according to claim 13, wherein: Providing the first electromagnetic transducer portion includes configuring the first electromagnetic transducer portion to be mechanically coupled to a first oscillating portion of the symmetrical oscillating device; and Providing the second electromagnetic transducer portion includes configuring the first electromagnetic transducer portion to be mechanically coupled to a second oscillating portion of the symmetrical oscillating device.

15. The method according to claim 13 or claim 14, wherein Symmetrically balancing the first and second electromagnetic transducer portions includes positioning the first and second electromagnetic transducer portion mass centers equidistant from a device center plane of the symmetrical oscillation device and on a transducer mass centerline.

16. The method of claim 15, further comprising defining and positioning the center plane of the symmetrical oscillatory device at a point equidistant between the first oscillatory portion and the second oscillatory portion.

17. The method of claim 15, further comprising orienting the transducer mass centerline to be normal to the device center plane of the symmetrical oscillating device.

18. The method of claim 15, further comprising configuring the first electromagnetic transducer portion and the second electromagnetic transducer portion to have the same moment of inertia value.

19. The method according to any one of the preceding claims 13 to 18, wherein The symmetrical oscillating device is a vibrating meter configured to measure a property of a material.

20. The method according to claim 19, wherein The first oscillating portion and the second oscillating portion are conduits of the vibrating meter.

21. The method according to any one of the preceding claims 13 to 20, wherein Providing the first electromagnetic transducer portion includes providing a magnet assembly, and providing the second electromagnetic transducer portion includes providing a coil assembly.

22. The method according to claim 21, wherein Providing the magnet assembly includes providing a magnet and a magnet holder attached to the magnet, and providing the coil assembly includes providing a bobbin and an insert attached to the bobbin.

23. The method according to claim 22, wherein The insert is selected to symmetrically balance the magnet assembly and the coil assembly.

24. A method of forming a symmetrically oscillating electromagnetic transducer for a symmetrically oscillating device, the method comprising: forming a magnet assembly; A coil assembly is formed, comprising: Provide inserts; Provide spools of thread; selecting an adhesive to minimize elastic deformation of the adhesive within a predetermined operating temperature range of the coil assembly; and The insert is attached to the spool using the adhesive.

25. The method of claim 24, further comprising forming a non-interference interface between the magnet assembly and the coil assembly.

26. The method according to claim 24 or claim 25, wherein Selecting the adhesive to minimize elastic deformation of the adhesive within the predetermined operating temperature of the coil assembly includes selecting the adhesive to elastically deform within the predetermined operating temperature range of the coil assembly and to plastically deform within an alternative predetermined operating temperature range greater than the predetermined operating temperature range of the coil assembly.

27. The method of any preceding claim 24 to 26, further comprising verifying that one or more sensor parameters remain within a predetermined sensor parameter range within the predetermined operating temperature range.

28. The method according to claim 27, wherein The one or more sensor parameters include at least one of a physical property of the sensor and a transduction property of the sensor.

29. The method according to any one of the preceding claims 24 to 28, wherein Selecting the adhesive to minimize elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly includes selecting an amount of the adhesive to minimize a gap between the bobbin and the insert.

30. The method according to any one of the preceding claims 24 to 29, wherein Selecting the adhesive to minimize elastic deformation of the adhesive within the predetermined operating temperature range of the coil assembly includes minimizing a difference between a coefficient of thermal expansion of the insert and a coefficient of thermal expansion of the adhesive.

31. The method according to any one of the preceding claims 24 to 30, wherein: Attaching the insert to the bobbin with the adhesive includes applying the adhesive to at least one of the insert and the bobbin and pressing the insert and the bobbin together in a predetermined spaced relationship.

32. The method according to any one of the preceding claims 24 to 31, wherein The adhesive includes one of an epoxy resin and a silicone-based adhesive.

33. An electromagnetic transducer (570s, 770s) for converting symmetrical oscillations, the electromagnetic transducer (570s, 770s) being formed according to one of the preceding claims 24 to 32.

34. A symmetrical oscillation device (1) configured for symmetrical oscillation, the symmetrical oscillation device (1) comprising: a first oscillating portion (13) and a second oscillating portion (13'), wherein the first oscillating portion (13) and the second oscillating portion (13') are configured to oscillate symmetrically relative to each other; as well as The electromagnetic transducer (17) according to claim 33, the electromagnetic transducer (17) being mechanically coupled to the first oscillating part (13) and the second oscillating part (13').

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