Silicon wafer edge polishing system

Abstract

The invention discloses a silicon wafer edge polishing system, which relates to the technical field of silicon wafer polishing and is used for polishing the side part of a silicon wafer, the side part of the silicon wafer comprises an inclined surface A, an inclined surface B and a vertical edge side surface M connecting the surface A and the surface B, and the side part of the silicon wafer is provided with a V-shaped notch. The silicon wafer edge polishing system comprises a conveying module, a deviation rectifying and centering module, a silicon wafer edge polishing module, two groups of silicon wafer inclined surface polishing modules, an overturning module, a silicon wafer V-shaped notch polishing module and a cleaning module which are connected in sequence, and the deviation rectifying and centering module establishes a process reference by dynamically adjusting the center of a silicon wafer. The edge polishing module adopts a covering type polishing drum assembly to drive a first polishing tile to press and touch the edge of the silicon wafer for friction polishing, the V-shaped notch polishing module adjusts the notch inclination angle through a swing plate, the V-shaped notch polishing module is matched with a polishing wheel assembly for radial feeding polishing, and the polishing efficiency and the yield of the large-size silicon wafer are remarkably improved through the arrangement.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer polishing, and in particular to a silicon wafer edge polishing system. Background Art

[0002] Currently, the field of large-size silicon wafer edge polishing faces serious technical bottlenecks. Domestic companies have long relied on imported equipment or directly purchased polished products. Existing equipment mainly uses fixed-track mechanical grinding to process silicon wafer edges, which is difficult to adapt to the complex curvature changes of 8-12 inch silicon wafer edges, especially unable to simultaneously meet the differentiated polishing accuracy requirements of the TOP surface, A / B surface and V-notch. In traditional processes, silicon wafer positioning relies on static mechanical limits. Positioning errors lead to uneven contact pressure between the polishing drum and the silicon wafer edge, resulting in inconsistent polishing depth. V-notch polishing requires manual repeated adjustment of the silicon wafer angle, which is inefficient and prone to edge collapse defects.

[0003] The above-mentioned technical defects further lead to difficulties in the coordination of multiple processes. Due to the lack of high-precision dynamic positioning capabilities, the position reference of the silicon wafer between the edge polishing and notch polishing processes cannot be unified, forcing each link to be calibrated independently, greatly reducing production efficiency. At the same time, the lack of an adaptive polishing mechanism for special-shaped edges makes it difficult for the polishing drum to fit the curved surface contour of the silicon wafer, resulting in a polishing blind spot. The separate design of the V-notch directional polishing module further increases the complexity of the equipment.

[0004] Faced with challenges such as variable edge curvature of large silicon wafers and stress sensitivity of V-notch, the market urgently needs an integrated device that integrates dynamic positioning, centrifugal adaptive pressure and notch directional polishing. Summary of the Invention

[0005] The main purpose of the present invention is to provide a silicon wafer edge polishing system, aiming to solve the problem of difficulty in polishing the side of a large silicon wafer.

[0006] To achieve the above objectives, the present invention provides a silicon wafer edge polishing system for polishing the side of a silicon wafer, wherein the side of the silicon wafer includes an inclined surface A, an inclined surface B, and a vertical edge side surface M connecting surface A and surface B, and the side of the silicon wafer is provided with a V-shaped notch. The polishing system comprises: Conveying module, connecting each module in sequence and transporting silicon wafers; A deflection correction and centering module, comprising a deflection correction component and a centering component mounted thereon, wherein the centering component drives the silicon wafer to rise and fall and rotate in the Z direction, and cooperates with the deflection correction component to establish a process reference coordinate system; A silicon wafer edge polishing module, comprising a mounting assembly, a polishing drum assembly, and a first polishing pad. The polishing drum assembly is covered by the mounting assembly, the mounting assembly secures the silicon wafer, and the inner wall of the polishing drum assembly secures the first polishing pad to contact the side M surface of the silicon wafer. The polishing drum assembly rotates to drive the first polishing pad to press against the side M surface of the silicon wafer edge for friction polishing. Two sets of silicon wafer inclined surface polishing modules, each comprising a counter-rotating carrier platform and a polishing rotary assembly, the polishing rotary assembly being located above the carrier platform and vertically pressing against the silicon wafer inclined surface and rotating in the forward direction; A flip module is provided between the two sets of silicon wafer inclined surface polishing modules to flip the silicon wafer to a preset angle; A silicon wafer V-notch polishing module includes a polishing wheel assembly and a swinging plate. The swinging plate carries the silicon wafer and adjusts the angle of the V-notch of the silicon wafer by swinging, so as to cooperate with the polishing wheel assembly to radially feed and polish the V-notch. The cleaning module cleans and dries the polished silicon wafer.

[0007] The beneficial effects of the present invention are: the present invention establishes a unified process reference coordinate system through the correction and centering module, ensuring that the center of the silicon wafer and the rotation axis are accurately aligned, eliminating uneven polishing caused by positioning deviation, and the silicon wafer edge polishing module adopts a centrifugal pressure polishing drum assembly to make the first polishing pad adaptively press into the silicon wafer edge surface, thereby improving the edge polishing integrity and efficiency. As for the double silicon wafer inclined surface polishing module, it cooperates with the flipping module to realize automatic polishing of the double inclined surfaces of the silicon wafer, avoiding surface damage caused by manual flipping. The V-notch polishing module uses the dynamic posture adjustment of the swing plate combined with radial feed polishing to accurately control the notch polishing angle and force, thereby reducing the risk of edge collapse. Finally, each module is connected through the conveying module to form a full-process automated polishing flow path, which greatly reduces manual intervention and simultaneously improves production capacity and yield. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0008] Figure 1 Schematic diagram of the three-dimensional structure of the silicon wafer edge polishing system of the present invention; Figure 2 Schematic diagram of the structure of the silicon wafer edge polishing system of the present invention; Figure 3Schematic diagram of the three-dimensional structure of the deviation correction and centering module in the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of the deviation correction and centering module in the present invention from another angle; Figure 5 Schematic diagram of the three-dimensional structure of the silicon wafer edge polishing module of the present invention (excluding the mounting components); Figure 6 A cross-sectional view of the silicon wafer edge polishing module of the present invention (excluding mounting components); Figure 7 Schematic diagram of the three-dimensional structure of the inclined surface polishing module of the silicon wafer in the present invention (excluding the polishing bearing assembly); Figure 8 This is a cross-sectional view of the silicon wafer inclined surface polishing module of the present invention (excluding the polishing support assembly); Figure 9 Schematic diagram of the three-dimensional structure of the flip module in the present invention; Figure 10 is a cross-sectional view of the flip module of the present invention; Figure 11 Schematic diagram of the three-dimensional structure of the silicon wafer V-notch polishing module in the present invention; Figure 12 This is a schematic diagram of the three-dimensional structure of the silicon wafer V-notch polishing module of the present invention from another angle; Figure 13 Schematic diagram of the three-dimensional structure of the cleaning module in the present invention; Figure 14 Schematic diagram of the structure of the silicon wafer edge polishing system of the present invention; Figure 15 Schematic diagram of the three-dimensional structure of the window module in the present invention; Figure 16 Schematic diagram of the three-dimensional structure of the material taking module in the present invention; Figure 17 2 is a cross-sectional view of the silicon wafer in the present invention.

[0009] Reference numerals: 100, polishing box; 200, loading basket; 1. Conveying module; 11. Retrieving module; 111. Robot; 112. Control box; 113. Second slide rail; 12. First slide rail; 13. Transport module; 2. Correction and centering module; 21. Correction assembly; 211. Mounting plate; 2111. First guide rail; 2112. First screw rod; 2113. Notch; 212. First driving element; 213. Moving plate; 2131. First nut; 2132. First slider; 22. Centering assembly; 221. Support plate; 2211. Limit bracket; 22111. Limit opening; 222. Rotating axis; 223. Tray; 2231. Adsorption hole; 2232. Limit block; 224. Second driving element; 225. Third driving element; 3. Wafer edge polishing module; 31. Mounting assembly; 311. Mounting platform; 312. First waterproof cover; 32. Polishing drum assembly; 321. Polishing drum upper plate; 3211. Slideway; 322. Polishing drum lower plate; 323. Centrifugal push element; 3231. Telescopic block; 32311. Movable groove; 3232. Center of gravity ball; 3233. Connecting rod; 32331. Connecting channel; 3234. First movable shaft; 3235. Second movable shaft; 324. Connecting shaft; 325. Enclosure; 33. First polishing shoe; 34. Fourth drive element; 35. First drive spindle; 4. Wafer inclined surface polishing module; 41. Carrying platform; 42. Polishing rotary assembly; 421. Fifth drive element; 422. Second drive spindle; 423. Rotating disk; 4231. Second polishing tile; 43. Second waterproof cover; 5. Flip module; 51. Guide rail assembly; 511. Second guide rail; 512. Eighth drive element; 513. Second screw rod; 514. Second nut; 52. Sixth drive element; 53. Clamping mounting plate; 54. Clamping mechanism; 541. Seventh drive element; 542. Removal clamping plate; 5421. First section; 5422. Second section; 5423. Third section; 543. Swinging air gripper; 6. Silicon wafer V-notch polishing module; 61. Swing plate; 611. Notch groove; 62. Polishing wheel assembly; 621. Notch polishing wheel; 622. Ninth drive element; 63. V-shaped polishing base plate; 631. Third guide rail; 632. Tenth drive element; 64. Waterproof cover; 65. Support seat; 66. Eleventh drive element; 7. Cleaning module; 71. Cleaning table; 72. Third waterproof cover; 73. Water spray block; 8. Window opening module; 81. Door opening mounting plate; 82. Window opening finger; 83. Twelfth driving element; 84. Thirteenth driving element; 85. Fourth guide rail.

[0010] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0011] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0012] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0013] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0014] The present invention provides a silicon wafer edge polishing system for polishing the side of a silicon wafer, wherein the side of the silicon wafer includes an inclined surface A, an inclined surface B, and a vertical edge side surface M connecting the A surface and the B surface, and a V-shaped notch is provided on the side of the silicon wafer. Figures 1-17The polishing system includes a conveying module 1, which connects each module in sequence and transports silicon wafers, a deflection correction and centering module 2, which includes a deflection correction component 21 and a centering component 22 arranged thereon, the centering component 22 drives the silicon wafer to rise and fall and rotate in the Z direction, and cooperates with the deflection correction component 21 to establish a process reference coordinate system, a silicon wafer edge polishing module 3, and the silicon wafer edge polishing module 3 includes a mounting component 31, a polishing drum component 32 and a first polishing tile 33. The polishing drum component 32 cover is arranged on the outside of the mounting component 31, the mounting component 31 fixes the silicon wafer, and the inner wall of the polishing drum component 32 fixes the first polishing tile 33 to contact the side M surface of the silicon wafer. The polishing drum component 32 rotates to drive the first polishing tile 33 to press the side M surface of the silicon wafer edge for friction polishing, two groups of silicon wafer inclined surface polishing modules 4, each group of silicon wafer inclined surface polishing modules The bevel polishing module 4 includes a supporting platform 41 that can rotate in the opposite direction and a polishing rotating assembly 42. The polishing rotating assembly 42 is located above the supporting platform 41. The polishing rotating assembly 42 vertically presses the inclined surface of the silicon wafer and rotates forward. As for the flipping module 5, it is arranged between the two groups of silicon wafer inclined surface polishing modules 4 to flip the silicon wafer to a preset angle. The silicon wafer V-notch polishing module 6 includes a polishing wheel assembly 62 and a swinging plate 61. The swinging plate 61 carries the silicon wafer and adjusts the V-notch angle of the silicon wafer by swinging to cooperate with the polishing wheel assembly 62 to radially feed and polish the V-notch. Finally, the cleaning module 7 cleans and dries the polished silicon wafer. This equipment fully automates the polishing of the side of large silicon wafers through the cooperation of multiple modules, greatly reducing manual intervention and simultaneously improving production capacity and yield.

[0015] It should be noted that, in this embodiment, the size of the large silicon wafer to be polished is 8-12 inches, wherein the directions of X, Y and Z are as follows: Figure 2 As for the inclined surface A and inclined surface B on the side of the silicon wafer and the vertical edge side surface M connecting surface A and surface B, please refer to Figure 17 .

[0016] In this embodiment, please refer to Figure 2-Figure 4 The correction and centering module 2 also includes a light curtain sensor (not shown), which is electrically connected to the correction component 21. The light curtain sensor obtains the center position of the silicon wafer in the rotating state to trigger the correction component 21 to correct the deviation. Among them, the correction component 21 includes a mounting plate 211, a first driving element 212 and a movable plate 213. The mounting plate 211 is provided with a first Y-direction guide rail 2111 and a first Y-direction screw rod 2112. The driving end of the first driving element 212 is connected to the first screw rod 2112. A first nut 2131 is provided at the bottom of the movable plate 213 to engage with the first screw rod 2112, and a first slider 2132 is provided at the top to slide with the first guide rail 2111. When the first driving element 212 drives the first screw rod 2112 to rotate, the first nut 2131 will move accordingly on the first screw rod 2112, thereby driving the movable plate 213 to move along the Y-direction of the first guide rail 2111. The above settings are mainly used to adjust the position of the silicon wafer, so that the silicon wafer positioning in the subsequent process is accurate and better uniform polishing is achieved.

[0017] As for the centering component 22, the centering component 22 includes a support plate 221, a rotating shaft 222, a tray 223, a second driving element 224 and a third driving element 225. The support plate 221 is fixedly connected to the top of the movable plate 213, the rotating shaft 222 is arranged through the support plate 221, and the bottom of the rotating shaft 222 is connected to the driving end of the second driving element 224, and the top is fixed to the tray 223 with a vacuum hole. The hollow cavity inside the rotating shaft 222 is provided with an adsorption element, and the adsorption element is connected to the adsorption hole 2231 on the surface of the tray 223. The adsorption element is mainly used to adsorb the silicon wafers placed on the tray 223, so as to fix the silicon wafers on the tray 223 without damaging the silicon wafers. At the same time, it is also convenient for reducing the silicon wafers from being thrown out when the tray 223 rotates later, thereby avoiding material waste and safety accidents.

[0018] In fact, in order to further enhance the stability of the silicon wafer on the tray 223, the tray 223 is also provided with a number of upwardly inclined limit blocks 2232, and a number of limit brackets 2211 are provided on the top of the support plate 221, wherein a number of limit blocks 2232 are evenly distributed on the edge of the tray 223, and a number of limit brackets 2211 are evenly distributed on the edge of the support plate 221. A limit opening 22111 is provided on the side of the limit bracket 2211 facing the axis of the rotating shaft 222. When the silicon wafer is subjected to centrifugal action and is about to deviate from the predetermined position, under the dual action of the limit block 2232 and the limit bracket 2211, the silicon wafer is prevented from deviating from the predetermined position due to obstruction. It should be noted that during the rotation of the tray 223, its limit block 2232 can pass through the limit opening 22111.

[0019] In this embodiment, the second driving element 224 drives the rotating shaft 222 to rise and fall along the Z direction so that the tray 223 can receive or detach the silicon wafer. As for the third driving element 225, it drives the rotating shaft 222 to rotate, driving the tray 223 to rotate the silicon wafer and cooperate with the light curtain sensor to scan the center of the silicon wafer. In order to ensure that the centering component 22 can move smoothly with the movable plate 213, the mounting plate 211 is also provided with a slot 2113 for the centering component 22 to move.

[0020] Regarding the working principle of the deviation correction and centering module 2, the conveying module 1 places the polished silicon wafer on the tray 223. During this process, the second driving element 224 drives the rotating shaft 222 to rise to receive the silicon wafer. At this time, the adsorption component starts to run, and the silicon wafer is adsorbed by the adsorption hole 2231. The second driving element 224 then drives the rotating shaft 222 to descend to a predetermined position. The third driving element 225 drives the rotating shaft 222 to rotate. The silicon wafer is driven to rotate by the rotation of the tray 223. It should be noted that the light curtain sensor is set on the mounting plate 211. When the silicon wafer rotates, During the process, the light curtain sensor emits a parallel laser beam to cover the edge of the rotating silicon wafer, collects the edge point coordinate sequence in real time, and calculates the offset between the actual center of the silicon wafer and the theoretical rotation center of the equipment. After receiving the data, the correction component 21 performs corresponding operation, and the first drive element 212 screw rotates, causing the movable plate 213 to slide on the first guide rail 2111, realizing the dynamic coincidence of the geometric center of the silicon wafer and the axis of the rotating shaft 222, ensuring a constant gap between the edge polishing drum and the silicon wafer, uniform pressure distribution of the flat polishing wheel, and precise matching of the V-notch polishing trajectory.

[0021] In other words, the light curtain sensor combined with the dynamic correction mechanism corrects the center offset of the silicon wafer in real time to ensure the accuracy of the process benchmark; the tray 223 is adsorbed and cooperates with the limit block 2232 and the bracket for double protection to prevent the silicon wafer from shifting or flying off during high-speed rotation, thereby improving positioning stability and safety and laying the foundation for subsequent uniform polishing.

[0022] In this embodiment, please refer to Figure 2 、 Figure 5-Figure 6 The silicon wafer edge polishing module 3 also includes a fourth driving element 34 and a first driving spindle 35 connected to the driving end of the fourth driving element 34. The polishing drum assembly 32 includes a polishing drum upper plate 321, a polishing drum lower plate 322 and a plurality of centrifugal pushing elements 323, wherein the polishing drum upper plate 321 is connected to the first driving spindle 35, and the polishing drum upper plate 321 and the polishing drum lower plate 322 are fixedly connected by a plurality of connecting shafts 324. The two ends of the centrifugal pushing element 323 are slidingly connected to the polishing drum upper plate 321 and the polishing drum lower plate 322, and the centrifugal pushing element 323 is located between adjacent connecting shafts 324. When the fourth driving element 34 drives the first driving spindle 35 to rotate, the polishing drum assembly 32 will rotate accordingly, thereby causing the centrifugal pushing element 323 to slide toward the axial direction of the first driving spindle 35, thereby pushing the first polishing tile 33 to squeeze the side M surface of the silicon wafer.

[0023] Following the above, the centrifugal pushing element 323 includes a telescopic block 3231 and a center of gravity ball 3232 adapted to the number of the telescopic block 3231. The polishing drum upper plate 321 and the polishing drum lower plate 322 are both provided with a slide groove 3211. The two ends of the telescopic block 3231 are respectively slidably inserted into the corresponding slide groove 3211. This setting is used for the telescopic block 3231 to slide between the polishing drum upper plate 321 and the polishing drum lower plate 322. A panel 325 is provided between the edge side portions of the polishing drum upper plate 321 and the polishing drum lower plate 322. The panel 325 is arranged opposite to the telescopic block 3231. The panel 325 is rotatably provided with a connecting rod 3233. One end of the connecting rod 3233 It is connected to the center of gravity ball 3232, and the other end passes through the enclosure 325 and abuts against the telescopic block 3231. The telescopic block 3231 is connected to the first polishing tile 33. Specifically, the telescopic block 3231 has a movable groove 32311 recessed on the side facing the enclosure 325, and a first movable shaft 3234 is installed in the movable groove 32311. The connecting rod 3233 is located at one end of the movable groove 32311 and is provided with a connecting groove 32331. The connecting rod 3233 is rotatably connected to the first movable shaft 3234 through the connecting groove 32331. As for the enclosure 325, a second movable shaft 3235 is provided on the outside thereof, and the connecting rod 3233 is rotatably connected to the second movable shaft 3235.

[0024] When the polishing drum assembly 32 rotates at a high speed, the center of gravity ball 3232 on the centrifugal pushing element 323 is displaced radially outward by the centrifugal force, and the telescopic block 3231 is pushed by the connecting rod 3233 to slide along the slide groove 3211 of the polishing drum upper plate 321 and the lower plate toward the silicon wafer. One end of the connecting rod 3233 is hinged to the surrounding plate 325 via the second movable shaft 3235, and the other end is hinged to the movable groove 32311 of the telescopic block 3231 via the first movable shaft 3234. This dual movable shaft structure converts the radial movement of the center of gravity ball 3232 into linear displacement of the telescopic block 3231, driving the first polishing pad 33 fixed to the telescopic block 3231 to press the edge of the silicon wafer. Obviously, when the polishing drum speed increases, the centrifugal force increases, and the pressure of the first polishing pad 33 increases accordingly, realizing adaptive pressure polishing. When the speed decreases, the center of gravity ball 3232 is reset, and the telescopic block 3231 retracts to release the pressure, forming a dynamic pressure control closed loop.

[0025] In order to achieve silicon wafer polishing, the silicon wafer edge polishing module 3 needs to be connected to an external polishing liquid. Specifically, the polishing drum lower plate 322 is an annular plate. In other words, the polishing drum upper plate 321, the first polishing tile 33 and the polishing drum lower plate 322 constitute a hollow cavity, and the hollow cavity is connected to an external polishing liquid inlet. In this embodiment, the polishing liquid is poured from the end of the first drive spindle 35 located in the hollow cavity.

[0026] To enhance the wafer edge polishing effect, the wafer edge polishing module 3 further includes a first ultrasonic component (not shown). In this embodiment, the first ultrasonic component is integrated into the first drive spindle 35, and transmits high-frequency vibrations directly to the polishing interface through coaxial rigid conduction, thereby forming a composite polishing mechanism of "dynamic pressure + high-frequency micro-impact" with the polishing liquid and the centrifugal pushing element 323, effectively solving the problem of brittle cracking at the edges of large silicon wafers.

[0027] In this embodiment, the mounting assembly 31 includes a mounting platform 311 that can be lifted and rotated and a first waterproof cover 312. The first waterproof cover 312 is arranged around the mounting platform 311. The first waterproof cover 312 is arranged to prevent the polishing liquid from splashing and contaminating other modules. It can also collect broken silicon wafers caused by operational errors. As for the setting of the mounting platform 311, the mounting platform 311 can be lifted and rotated through a lifting element (not shown) and a rotating element (not shown). This setting is mainly to facilitate the reception of silicon wafers and cooperate with the polishing drum assembly 32 to polish the side M surface of the silicon wafer. Among them, the lifting element and the rotating element belong to the existing technology, which should be known to people in this field and will not be elaborated here.

[0028] Regarding the working principle of the silicon wafer edge polishing module 3, after the mounting platform 311 receives the silicon wafer through the conveying module 1, it is lifted and lowered by the lifting element, so that the mounting platform 311 rises, so that the silicon wafer is located in the hollow cavity of the polishing drum assembly 32, and the inner wall of its first polishing tile 33 is in contact with the side M surface of the silicon wafer, and then the rotating element and the fourth driving element 34 are started at the same time, so that the mounting platform 311 and the polishing drum assembly 32 both rotate, and the mounting platform 311 and the polishing drum assembly 32 rotate in opposite directions. During the rotation of the polishing drum assembly 32, the first ultrasonic crushing assembly also runs at the same time. With the cooperation of the polishing drum assembly 32 and the first ultrasonic crushing assembly, the side M surface of the silicon wafer can be polished quickly.

[0029] In this embodiment, please refer to Figure 2 、 Figure 7-Figure 8 Each group of silicon wafer inclined surface polishing modules 4 also includes a second waterproof cover 43, and the polishing rotating assembly 42 in each group of silicon wafer inclined surface polishing modules 4 includes a fifth driving element 421, a second driving spindle 422 and a rotating disk 423, wherein the second waterproof cover 43 is arranged around the supporting platform 41, and the second waterproof cover 43 is also arranged to prevent the polishing liquid from splashing out to avoid contaminating other modules, and can also collect broken silicon wafers caused by operational errors. As for the second driving spindle 422, one end of the second driving spindle 422 is connected to the driving end of the fifth driving element 421, and the other end is connected to the rotating disk 423. The rotating disk 423 is located directly above the supporting platform 41, and the rotating disk 423 is provided with a second polishing tile 4231 that is in contact with the inclined surface of the silicon wafer. The second polishing tile 4231 is used to polish the inclined surface A or B of the silicon wafer placed on the supporting platform 41 by rotation.

[0030] Following the above, in order to achieve the polishing of the inclined surface of the silicon wafer, the silicon wafer inclined surface polishing module 4 also needs an external polishing liquid. Specifically, the rotating disk 423 also has a hollow cavity, and the hollow cavity is externally connected to the polishing liquid inlet. In this embodiment, the polishing liquid is poured from the end of the second driving spindle 422 located in the hollow cavity.

[0031] In order to enhance the polishing effect of the silicon wafer edge, the silicon wafer inclined surface polishing module 4 also includes a second ultrasonic component (not shown). In this embodiment, the second ultrasonic component is integrated into the second drive spindle 422, and similarly transmits high-frequency vibration directly to the polishing interface through coaxial rigid conduction, thereby forming a composite polishing mechanism of "dynamic pressure + high-frequency micro-impact" together with the polishing liquid and the polishing rotating component 42, further improving the polishing efficiency.

[0032] As for the rotating support platform 41, the support platform 41 can be rotated by another rotating element. This setting is mainly for receiving silicon wafers and cooperating with the polishing rotating component 42 to polish the inclined surface of the silicon wafer. Among them, the lifting element also belongs to the existing technology, which should be known to people in this field and will not be elaborated here.

[0033] Regarding the working principle of the first group of silicon wafer inclined surface polishing modules 4, after the silicon wafer is placed on the carrier 41 and fixed, the fifth driving element 421 drives the second driving spindle 422, driving the rotating disk 423 at the bottom thereof to descend and rotate, so that the second polishing tile 4231 installed at the bottom of the rotating disk 423 is in contact with the inclined surface A of the silicon wafer, and the second polishing tile 4231 applies polishing pressure to the inclined surface A in the direction perpendicular to the inclined surface A. At this time, the carrier 41 and the rotating disk 423 rotate synchronously, but in opposite directions. The polishing liquid passes through the hollow cavity of the rotating disk 423 from the second driving spindle 422 The end is injected and flows to the polishing interface of the silicon wafer. At this time, the second ultrasonic component integrated in the second driving spindle 422 is also started synchronously, and the high-frequency vibration is directly transmitted to the polishing area through the coaxial rigid conduction of the spindle. At this time, the rotation of the supporting platform 41, the rotating disk 423 drives the rotation and pressurization of the second polishing tile 4231, the continuously injected polishing liquid and the high-frequency micro-impact vibration work together to polish the inclined surface A of the silicon wafer. During the entire polishing process, the second waterproof cover 43 surrounding the supporting platform 41 is always working to prevent the polishing liquid from splashing and contaminating other modules and collect possible broken silicon wafers.

[0034] Obviously, the above design utilizes the counter-rotation of the supporting platform 41 and the rotating disk 423 to enhance the surface shear force, and cooperates with ultrasonic vibration and continuous injection of polishing liquid to achieve efficient and low-damage inclined surface polishing. Furthermore, the second waterproof cover 43 takes into account both splash protection and debris collection functions, which can maintain system reliability.

[0035] For further information, please refer to Figure 2 、 Figure 9-10 The flipping module 5 includes a guide rail assembly 51, a sixth driving element 52, a Z-axis clamping mounting plate 53 and a clamping mechanism 54. The clamping mounting plate 53 moves between the two groups of silicon wafer inclined surface polishing modules 4 through the guide rail assembly 51. The sixth driving element 52 drives the clamping mechanism 54 to move up and down on the clamping mounting plate 53. The clamping mechanism 54 includes a seventh driving element 541 and a clamping element. The seventh driving element 541 drives the clamping element that clamps the silicon wafer to flip to a preset angle. In this embodiment, the preset angle is 180 degrees. The above setting is mainly used to exchange the top and bottom of the silicon wafer. In other words, the silicon wafer is flipped so that the inclined surface B of the silicon wafer is polished by the second group of silicon wafer inclined surface polishing modules 4, thereby ensuring that the inclined surface A and the inclined surface B of the silicon wafer are both polished.

[0036] Following the above, two groups of silicon wafer inclined surface polishing modules 4 are arranged side by side, and the guide rail assembly 51 is located between the sides of the two groups of silicon wafer inclined surface polishing modules 4. The guide rail assembly 51 includes a second guide rail 511, an eighth driving element 512, a second screw rod 513 and a second nut 514. The bottom of the clamping mounting plate 53 is connected to the second nut 514, and the second nut 514 engages the second screw rod 513. A second slider is provided on the top of the clamping mounting plate 53 to slide with the second guide rail 511. When the eighth driving element 512 drives the second screw rod 513 to rotate, the second nut 514 will move accordingly on the second screw rod 513, thereby driving the clamping mounting plate 53 to move on the second guide rail 511. The above arrangement is mainly used to transport silicon wafers to the second group of silicon wafer inclined surface polishing modules 4.

[0037] During the transportation of silicon wafers, the silicon wafers need to be flipped. In this embodiment, the seventh driving element 541 includes a swinging air claw 543, and the clamping element includes two material picking clamps 542. The swinging air claw 543 is connected to the two material picking clamps 542 to realize the opening, clamping and overall rotation of the two material picking clamps 542. The material picking clamps 542 include a continuous first section 5421, a second section 5422 and a third section 5423. The first section 5421 is a straight rod. At least two clamps are provided at the top and bottom of the straight rod. The clamps on the two material picking clamps 542 correspond to each other, so that the silicon wafer can be clamped. The clamping is then controlled by the swinging air claw 543, so that the silicon wafer is stably clamped by the clamping element. To prevent the silicon wafer from being damaged by the material picking clamp 542, the second section 5422 is an arc rod that conforms to the edge of the silicon wafer. As for the third section 5423, it is also a straight rod for connecting with the swinging air claw 543.

[0038] Furthermore, after the clamping element stably clamps the silicon wafer, the clamping element, in cooperation with the sixth driving element 52 , slides on the clamping mounting plate 53 until it reaches a position where the clamping element can be flipped.

[0039] Regarding the working principle of the flipping module 5, after the silicon wafer completes the processing of the first group of silicon wafer inclined surface polishing modules 4, the eighth driving element 512 in the guide rail assembly 51 drives the second screw rod 513 to rotate, so that the second nut 514 engaged on the screw rod drives the clamping mounting plate 53 to move along the second guide rail 511 to the silicon wafer position. At this time, the two material picking clamps 542 of the clamping element are opened under the control of the swinging air claw 543, and the corresponding clamps on the first section 5421 straight rod accurately clamp the silicon wafer, and the second section 5422 curved rod fits the edge of the silicon wafer to avoid damage. Then the clamping mounting plate 53 continues to slide on the second guide rail 511. After sliding to the corresponding position, the sixth driving element 52 pushes the clamping element to slide on the clamping mounting plate 53 to the flipping station, and then the swinging air claw 543 controls the two groups of material picking clamps 542 to flip, realizing the silicon wafer face changing requirement, and finally transporting it to the second group of silicon wafer inclined surface polishing modules 4 for polishing. The above design avoids contamination or damage caused by manual intervention and improves yield and production capacity.

[0040] In this embodiment, please refer to Figure 2 、 Figure 11-12 The silicon wafer V-notch polishing module 6 includes a V-shaped polishing base plate 63 and a water-blocking cover 64, wherein a support seat 65 for supporting the swing plate 61 to swing is provided on the top of the V-shaped polishing base plate 63, and the water-blocking cover 64 is provided on the top of the V-shaped polishing base plate 63 and surrounds the swing plate 61. The polishing wheel assembly 62 is slidably provided on the top of the V-shaped polishing base plate 63 and is located on the side of the V-notch of the silicon wafer. Specifically, the polishing wheel assembly 62 includes a notch polishing wheel 621 and a ninth driving element 622. The ninth driving element 622 is used to drive the notch polishing wheel 621 to operate. Secondly, a third guide rail 631 and a tenth driving element 632 are provided on the V-shaped polishing base plate 63. The tenth driving element 632 drives the polishing wheel assembly 62 to slide on the second guide rail 511, thereby adjusting the distance between the notched polishing wheel 621 and the swing plate 61 in the polishing wheel assembly 62. As for the rotation setting of the support plate 221, an eleventh driving element 66 is provided on the support seat 65. The eleventh driving element 66 drives the swing plate 61 to swing around the axis of the notched polishing wheel 621, and the support plate 221 is provided with a notch groove 611 for positioning the V-notch of the silicon wafer.

[0041] Regarding the working principle of the silicon wafer V-notch polishing module 6, the silicon wafer is placed on the swing plate 61 through the conveying module 1. At this time, the V-notch of the silicon wafer is located above the notch groove 611. The eleventh driving element 66 drives the swing plate 61 to swing, and then adjusts the inclination angle of the V-notch to facilitate the notch polishing wheel 621 to radially polish the V-notch. When the inclination angle of the V-notch is adjusted, the notch polishing wheel 621 polishes the V-notch by sliding on the V-notch polishing bottom plate 63.

[0042] For further information, please refer to Figure 1-Figure 2 、 Figure 14-16The conveying module 1 includes a material taking module 11, a first slide rail 12 and a plurality of transport modules 13. The first slide rail 12 is arranged on the side of each module. The plurality of transport modules 13 slide along different sections of the first slide rail 12 to transport silicon wafers. In this embodiment, the transport module 13 is similar in structure to the flip module. The only difference is that the two material taking clamps in the transport module 13 clamp and release the silicon wafers along the Y direction, and the clamping elements in the transport module 13 cannot be flipped.

[0043] In this embodiment, the polishing system also includes a polishing box 100, and each module is accommodated in the polishing box 100. Several loading baskets 200 are provided on one side of the polishing box 100. The polishing box 100 is provided with a window module 8 for opening and closing the corresponding basket door. The window module 8 mainly cooperates with the material taking module 11. When the material taking module 11 does not take materials, the window module 8 is in a static state. At this time, the loading basket 200 is in a closed state to prevent the silicon wafers stored inside from being affected by external factors. When the material taking module 11 needs to take the silicon wafers to be polished, the window module 8 opens the basket door, and the material taking module 11 can take materials from the corresponding loading basket 200.

[0044] As for the window opening module 8, the window opening module 8 includes a door opening mounting plate 81, a window opening finger 82, a twelfth driving element 83, a thirteenth driving element 84 and a fourth guide rail 85. The twelfth driving element 83 drives the door opening mounting plate 81 to extend and retract along the X direction, and the thirteenth driving element 84 drives the window opening finger 82 installed on the door opening mounting plate 81 to rotate, so that the window opening finger 82 is connected to the flower basket door. When the door opening mounting plate 81, the window opening finger 82, the twelfth driving element 83 and the thirteenth driving element 84 cooperate to grab the flower basket door, the above-mentioned overall structure slides along the Z direction on the fourth guide rail 85, so that the loading flower basket 200 is in a material-retrieving state. The above-mentioned window opening module 8 is fully automated and does not require manual operation. During operation, the window opening module 8 will not collide with the silicon wafers, and will not damage the silicon wafers during the process of grabbing and transferring the flower basket door. It has extremely strong protection and convenience.

[0045] As for the material taking module 11, the material taking module 11 includes a manipulator 111, a control box 112 and a second Y-axis slide rail 113. The control box 112 slides along the second slide rail 113 and controls the manipulator 111 to clamp and transport the silicon wafers to the correction and centering module 2. It should be noted that in this embodiment, there are four loading baskets 200. When the manipulator 111 takes materials, only when all the silicon wafers in one loading basket 200 are taken out, the manipulator 111 slides to the next loading basket 200 through the second slide rail 113 to take materials. As for the specific structure of the manipulator 111, the manipulator 111 belongs to the existing technology and should be known to those skilled in the art.

[0046] In this embodiment, please refer to Figure 2 and Figure 13 The cleaning module includes a cleaning table 71 that can be lifted and rotated, a water spray block 73 and a third waterproof cover 72. The third waterproof cover 72 is arranged around the cleaning table 71. The water spray block 73 is used to spray water on the silicon wafer placed on the cleaning table 71 to clean the silicon wafer.

[0047] Specifically, in this embodiment, each driving element can be a cylinder or a motor, as long as it can meet the corresponding structural driving state.

[0048] About the operation process of this silicon wafer edge polishing system: the material is taken out from the loading basket 200 by the material taking module 11, and sent to the tray 223 of the correction and centering module 2 through the transportation module 13. After the adsorption component fixes the silicon wafer, the light curtain sensor scans the edge of the rotating silicon wafer, triggering the correction component 21 to dynamically adjust the center of the silicon wafer to coincide with the rotating axis 222, and establish a process benchmark. Then the silicon wafer enters the edge polishing module, and the mounting table 311 lifts the silicon wafer to the hollow cavity in the polishing drum. The counter-rotating polishing drum assembly 32 drives the first polishing pad 33 to press the side surface M of the silicon wafer edge through the centrifugal pushing mechanism, and cooperates with the first ultrasonic component and the injected polishing liquid to complete the efficient polishing of the side surface M of the silicon wafer edge. The polished silicon wafer is transported to The first group of silicon wafer inclined surface polishing modules 4, the supporting platform 41 and the counter-rotating rotating disk 423 cooperate to apply pressure, the second ultrasonic component and the polishing liquid cooperate to polish the inclined surface A of the silicon wafer, the clamping mechanism 54 of the flip module 5 accurately grabs the silicon wafer, moves along the guide rail to the flip station and rotates 180°, and then sends the silicon wafer to the second group of silicon wafer inclined surface polishing modules 4 to complete the polishing of the silicon wafer inclined surface B, and then the silicon wafer enters the silicon wafer V-notch polishing module 6, the swing plate 61 carries the silicon wafer and adjusts the inclination angle of the V-notch, the polishing wheel assembly 62 radially feeds to precisely polish the V-notch. At this time, the edge and side of the silicon wafer are polished. Finally, the cleaning module 7 cleans and dries the silicon wafer to complete the full process automation.

[0049] The above are only optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A silicon wafer edge polishing system for polishing the side of a silicon wafer, wherein the side of the silicon wafer comprises an inclined surface A, an inclined surface B, and a vertical edge side surface M connecting surface A and surface B, and the side of the silicon wafer is provided with a V-shaped notch, characterized in that: The polishing system comprises: Conveying module, connecting each module in sequence and transporting silicon wafers; A deflection correction and centering module, comprising a deflection correction component and a centering component mounted thereon, wherein the centering component drives the silicon wafer to rise and fall and rotate in the Z direction, and cooperates with the deflection correction component to establish a process reference coordinate system; A silicon wafer edge polishing module, comprising a mounting assembly, a polishing drum assembly, and a first polishing pad. The polishing drum assembly is covered by the mounting assembly, the mounting assembly secures the silicon wafer, and the inner wall of the polishing drum assembly secures the first polishing pad to contact the side M surface of the silicon wafer. The polishing drum assembly rotates to drive the first polishing pad to press against the side M surface of the silicon wafer edge for friction polishing. Two sets of silicon wafer inclined surface polishing modules, each comprising a counter-rotating carrier platform and a polishing rotary assembly, the polishing rotary assembly being located above the carrier platform and vertically pressing against the silicon wafer inclined surface and rotating in the forward direction; A flip module is provided between the two sets of silicon wafer inclined surface polishing modules to flip the silicon wafer to a preset angle; A silicon wafer V-notch polishing module includes a polishing wheel assembly and a swinging plate. The swinging plate carries the silicon wafer and adjusts the angle of the V-notch of the silicon wafer by swinging, so as to cooperate with the polishing wheel assembly to radially feed and polish the V-notch. The cleaning module cleans and dries the polished silicon wafer.

2. The silicon wafer edge polishing system according to claim 1, characterized in that: The correction and centering module also includes a light curtain sensor, which is electrically connected to the correction component. The light curtain sensor obtains the center position of the silicon wafer in the rotating state to trigger the correction component to correct the deviation.

3. The silicon wafer edge polishing system according to claim 2, wherein: The correction assembly includes a mounting plate, a first driving element, and a movable plate. The mounting plate is provided with a first Y-direction guide rail and a first Y-direction screw rod. The driving end of the first driving element is connected to the first screw rod. A first nut is provided at the bottom of the movable plate to engage with the first screw rod, and a first slider is provided at the top to slide with the first guide rail. The first driving element drives the first screw rod to rotate so that the first nut drives the movable plate to move along the first guide rail in the Y direction. The centering assembly includes a support plate, a rotating shaft, a tray, a second driving element and a third driving element. The support plate is fixedly connected to the top of the movable plate, the rotating shaft passes through the support plate, and the bottom of the rotating shaft is connected to the driving end of the second driving element, and the top is fixed to the tray with a vacuum hole. The hollow cavity inside the rotating shaft is provided with an adsorption element, and the adsorption element is connected to the adsorption hole on the surface of the tray; the second driving element drives the rotating shaft to rise and fall along the Z direction so that the tray can accept or detach the silicon wafer, and the third driving element drives the rotating shaft to rotate, driving the tray to rotate the silicon wafer to cooperate with the light curtain sensor to scan the center of the silicon wafer.

4. The silicon wafer edge polishing system according to claim 1, wherein: The silicon wafer edge polishing module further includes a fourth driving element and a first driving spindle connected to a driving end of the fourth driving element; The polishing drum assembly includes a polishing drum upper plate, a polishing drum lower plate, and a plurality of centrifugal pushing elements. The polishing drum upper plate is connected to the first driving spindle. The polishing drum upper plate and the polishing drum lower plate are fixedly connected via a plurality of connecting shafts. The two ends of the centrifugal pushing elements are slidably connected to the polishing drum upper plate and the polishing drum lower plate, and the centrifugal pushing elements are located between adjacent connecting shafts. The mounting assembly includes a mounting platform capable of being lifted, lowered, and rotated, and a first waterproof cover, wherein the first waterproof cover is arranged around the mounting platform.

5. The silicon wafer edge polishing system according to claim 4, characterized in that: The centrifugal pushing element includes a telescopic block and a center of gravity ball adapted to the number of the telescopic blocks. The polishing drum upper plate and the polishing drum lower plate are both provided with a slide groove, and the two ends of the telescopic block are respectively slidably inserted into the corresponding slide groove; A panel is provided between the edge side of the polishing drum upper plate and the polishing drum lower plate. The panel is arranged opposite to the telescopic block. A connecting rod is provided for rotation on the panel. One end of the connecting rod is connected to the center of gravity ball, and the other end passes through the panel and abuts against the telescopic block. The telescopic block is connected to the first polishing tile.

6. The silicon wafer edge polishing system according to claim 1, wherein: The silicon wafer inclined surface polishing module also includes a second waterproof cover, and the polishing rotating assembly includes a fifth driving element, a second driving spindle and a rotating disk. The second waterproof cover is arranged around the supporting platform, one end of the second driving spindle is connected to the driving end of the fifth driving element, and the other end is connected to the rotating disk. The rotating disk is located directly above the supporting platform, and the rotating disk is provided with a second polishing tile that is in contact with the inclined surface of the silicon wafer.

7. The silicon wafer edge polishing system according to claim 1, wherein: The flip module includes a guide rail assembly, a sixth driving element, a Z-direction clamping mounting plate, and a clamping mechanism. The clamping mounting plate moves between the two sets of the silicon wafer inclined surface polishing modules through the cooperation of the guide rail assembly. The sixth driving element drives the clamping mechanism to move up and down on the clamping mounting plate. The clamping mechanism includes a seventh driving element and a clamping element. The seventh driving element drives the clamping element clamping the silicon wafer to flip, so as to exchange the top and bottom of the silicon wafer.

8. The silicon wafer edge polishing system according to claim 1, wherein: The silicon wafer V-notch polishing module includes a V-shaped polishing base plate and a water-proof cover; A support seat is provided on the top of the V-shaped polishing base plate to support the swinging of the swinging plate. The water shield is provided on the top of the V-shaped polishing base plate and surrounds the swinging plate. The polishing wheel assembly is slidably provided on the top of the V-shaped polishing base plate and is located on the side of the V-shaped notch of the silicon wafer.

9. The silicon wafer edge polishing system according to claim 1, wherein: The conveying module includes a material taking module, a first slide rail and a plurality of transport modules. The slide rail is arranged on the side of each module, and the plurality of transport modules slide along different sections of the slide rail to transport the silicon wafers. The material taking module includes a robot, a control box and a second Y-axis slide rail. The control box slides along the second slide rail and controls the robot to clamp and transport the silicon wafer to the deviation correction and centering module.

10. The silicon wafer edge polishing system according to claim 1, wherein: The polishing system also includes a polishing box, each module is accommodated in the polishing box, a plurality of loading baskets are provided on one side of the polishing box, and the polishing box is provided with a window module for opening and closing the corresponding basket doors.

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