LED display device

Abstract

The invention discloses an LED display device. The LED display device comprises a display assembly and a driving assembly. The display assembly comprises a first dielectric layer and a first bonding electrode, and a first pixel switching electrode of the first bonding electrode is arranged on the first dielectric layer; the driving assembly comprises a second dielectric layer and a second bonding electrode, the second bonding electrode comprises a second pixel switching electrode, the second pixel switching electrode is arranged on the second dielectric layer, the first dielectric layer and the second dielectric layer, and the first pixel switching electrode and the second pixel switching electrode are bonded with each other; the first bonding electrode and / or the second bonding electrode comprise / comprises a pseudo electrode, the pseudo electrode in the first bonding electrode is arranged on the first dielectric layer and is exposed towards one side of the second dielectric layer, and / or the pseudo electrode in the second bonding electrode is arranged on the second dielectric layer and is exposed towards one side of the first dielectric layer. Through the method, the bonding structure of the LED display equipment can be more stable, and the reliability and the yield of the LED display equipment are improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to LED display devices. Background Art

[0002] LED, short for Light Emitting Diode, is a semiconductor component that can convert electrical energy into visible light. It is a modern lighting source widely used in indication, display, decoration, backlight, general lighting and city night scenes.

[0003] The primary light-emitting structure in an LED is the light-emitting chip. LED chips are typically formed by stacking and bonding a display substrate and a driver circuit substrate. However, because LED chips contain other functional units in addition to the display unit, the bonding electrodes at the LED chip's bonding interface are unevenly distributed. This can lead to unstable bonding structures, affecting the connection between the display substrate and the driver circuit substrate, and reducing product reliability and yield. Summary of the Invention

[0004] The embodiments of the present application provide an LED display device, which can make the bonding structure between the display substrate and the driving substrate more stable, thereby improving the reliability and yield of the LED display device.

[0005] An embodiment of the present application provides an LED display device, which is provided with a display area and a peripheral area located outside the display area. The LED display device includes a display component and a driving component.

[0006] The display component includes a display substrate, a first dielectric layer, and a first bonding electrode. The display substrate includes multiple display pixels for forming a display area. The first dielectric layer is arranged on one side of the display substrate. The first bonding electrode includes multiple first pixel switching electrodes. The multiple first pixel switching electrodes are arranged in the area of ​​the first dielectric layer corresponding to the display area and are electrically connected to the corresponding display pixels.

[0007] The driving component and the display component are stacked and bonded to each other. The driving component includes a driving substrate, a second dielectric layer, and a second bonding electrode. The second dielectric layer is disposed on one side of the driving substrate. The second bonding electrode includes a plurality of second pixel switching electrodes. The plurality of second pixel switching electrodes are disposed in an area corresponding to the second dielectric layer and the display area. The first dielectric layer and the second dielectric layer, and the first pixel switching electrode and the corresponding second pixel switching electrode are bonded to each other respectively.

[0008] In which, the first bonding electrode and / or the second bonding electrode also includes a dummy electrode, the dummy electrode in the first bonding electrode is arranged in the area corresponding to the first dielectric layer and the peripheral area, and is exposed from the first dielectric layer toward the side of the second dielectric layer, and / or the dummy electrode in the second bonding electrode is arranged in the area corresponding to the second dielectric layer and the peripheral area, and is exposed from the second dielectric layer toward the side of the first dielectric layer.

[0009] The beneficial effect of the present application is as follows: different from the prior art, the present application sets a dummy electrode in the first dielectric layer and / or the second dielectric layer of the display component and the driving component, the dummy electrode is set in the area corresponding to the peripheral area located outside the display area, and the dummy electrode and the multiple first pixel switching electrodes in the first dielectric layer and / or the second pixel switching electrodes in the second dielectric layer together constitute a bonding electrode. The setting of the dummy electrode can increase the density of the bonding electrode at the bonding interface, so that the display area in the LED display device and the peripheral area outside the display area have electrodes that can be bonded, so that the distribution of the bonding electrodes at the bonding interface can be more uniform, so as to improve the undulating morphology of the dense electrode area and the sparse electrode area before bonding, and also enable the display component and the driving component to achieve a more stable physical connection structure and a more efficient interconnection density, so that the surface of the LED display device is smoother, and can further avoid the failure risk caused by the unbonded area (bonding void) of the bonding interface, thereby improving the product yield and reliability of the LED display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a structural diagram of an implementation scheme of the LED display device embodiment of the present application;

[0011] Figure 2 It is a structural schematic diagram of another embodiment of an LED display device;

[0012] Figure 3 yes Figure 1 The structure diagram of the LED display device embodiment shown is a cross-section diagram along the cutting line DD;

[0013] Figure 4 This is a structural diagram of another embodiment of the LED display device of the present application;

[0014] Figure 5 This is a structural diagram of another embodiment of the LED display device of the present application;

[0015] Figure 6 It is a structural diagram of another embodiment of the LED display device in the present application. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0017] The inventors of the present application have found that LED chips are usually formed by stacking and bonding a display substrate and a drive circuit substrate. However, since the LED chip has other functional units arranged in addition to the display unit, and the electrodes bonded at the bonding interface are usually only distributed in the bonding interface corresponding to the display area, the bonding electrodes at the bonding interface of the LED chip are not evenly distributed. The bonding interface corresponding to the display area usually has relatively dense bonding electrodes, while the bonding interface corresponding to the non-display area has sparse bonding electrodes. Therefore, the dense bonding electrode area and the sparse bonding electrode area will cause the surface of the display substrate and / or the drive circuit substrate to present an undulating morphology before bonding. This will cause the LED chip to have an unbonded area (bonding void) at the bonding interface after bonding, thereby generating an unstable bonding structure, which will affect the electrical connection between the display substrate and the drive circuit substrate, and reduce the reliability and yield rate of the product. In order to solve the above problems, the present application proposes the following embodiments.

[0018] The following is an exemplary description of the LED display device according to the embodiment of the present application.

[0019] The LED display device 10 is a device that generates light by forming multiple display pixels internally. The generated light can be emitted from one side of the LED display device 10 to illuminate or display various information such as text and images. For example, the LED display device 10 can be an LED display chip, an LED digital car light chip, a digital light strip chip, an AR / VR / MR chip, or other devices.

[0020] See Figure 1 The LED display device 10 may include a display area and a peripheral area located outside the display area. The display area refers to the area of ​​the LED display device 10 used to convert electrical energy into light energy, while the peripheral area located outside the display area is used to set other functional units such as connection circuits.

[0021] like Figure 1As shown, the LED display device 10 may include a display component 100 and a driver component 200. The driver component 200 is used to provide a driving current to the display component 100, and the display component 100 is used to receive the driving current from the driver component 200 and convert electrical energy into light energy to display light. The driver component 200 and the display component 100 may be stacked and bonded to each other to achieve a more stable and efficient electrical connection.

[0022] Further, if Figure 1 As shown, the display assembly 100 may include a display substrate 110 , a first dielectric layer 120 and a first bonding electrode 130 .

[0023] The display substrate 110 may include a plurality of display pixels for forming a display area. A plurality of display pixels are arranged in an array in the display substrate 110. Optionally, the display substrate 110 may be provided with a P electrode, an N electrode, and a light-emitting epitaxial layer, wherein both the P electrode and the N electrode are in contact with the light-emitting epitaxial layer. The display substrate 110 may be provided with a connection line so that the P electrode and the N electrode are connected to the driving component 200, so that the driving component 200 can supply power to the light-emitting epitaxial layer through the P electrode and the N electrode. The light-emitting epitaxial layer is used to receive a driving current and, under the action of the driving current, recombine electrons and holes to achieve light emission.

[0024] like Figure 1 As shown, the first dielectric layer 120 can be disposed on one side of the display substrate 110. Light generated by the display substrate 110 is emitted from the side of the display substrate 110 facing away from the first dielectric layer 120. The first bonding electrode 130 can be disposed within the first dielectric layer 120. The first dielectric layer 120 is used to secure the first bonding electrode 130 and can also serve as a masking film and protective layer, thereby preventing other impurities from entering the display substrate 110 and affecting the light-emitting effect of the display substrate 110.

[0025] The first dielectric layer 120 may be an intermetallic barrier made of silicon dioxide, silicon nitride or other insulating materials, and the first bonding electrode 130 may be an electrode made of titanium, copper or other conductive materials.

[0026] like Figure 1 As shown, the first bonding electrode 130 may include multiple first pixel transfer electrodes 131. These multiple first pixel transfer electrodes 131 are disposed within the area of ​​the first dielectric layer 120 corresponding to the display area and are electrically connected to the corresponding multiple display pixels. These multiple first pixel transfer electrodes 131 may be electrically connected to the corresponding P electrodes in the display substrate 110. Furthermore, these multiple first pixel transfer electrodes 131 may be electrically connected to the driver assembly 200 to transmit the driver current of the driver assembly 200 to the P electrodes.

[0027] like Figure 1As shown, the driver assembly 200 may include a driver substrate 210, a second dielectric layer 220, and a second bonding electrode 230. The driver substrate 210 internally contains small components and circuits corresponding to multiple display pixels, which are used to provide driving current to each corresponding display pixel. The second bonding electrode 230 is disposed on one side of the driver substrate 210. The second dielectric layer 220 is also disposed on one side of the driver substrate 210. Similarly, the second dielectric layer 220 is used to secure the second bonding electrode 230 and can also serve as a masking film and protective layer to prevent impurity diffusion, thereby protecting the driver substrate 210.

[0028] The second dielectric layer 220 may also be an intermetallic barrier made of silicon dioxide, silicon nitride or other insulating materials, and the second bonding electrode 230 may also be an electrode made of titanium, copper or other conductive materials.

[0029] like Figure 1 As shown, the second bonding electrode 230 may include a plurality of second pixel transfer electrodes 231. The plurality of second pixel transfer electrodes 231 may be disposed in an area of ​​the second dielectric layer 220 corresponding to the display area. The plurality of second pixel transfer electrodes 231 are disposed corresponding to the plurality of first pixel transfer electrodes 131 and the plurality of display pixels. The drive substrate 210 supplies power to the display substrate 110 via the plurality of second pixel transfer electrodes 231 and the plurality of first pixel transfer electrodes 131.

[0030] The first dielectric layer 120 and the second dielectric layer 220, and the first pixel transfer electrode 131 and the corresponding second pixel transfer electrode 231 are bonded to each other. Specifically, the first dielectric layer 120 and the second dielectric layer 220 are fused to each other to achieve interconnection, and the first pixel transfer electrode 131 and the corresponding second pixel transfer electrode 231 are fused to each other to achieve interconnection, thereby connecting the display substrate 110 and the drive substrate 210.

[0031] Optionally, the first dielectric layer 120 and the second dielectric layer 220, and the first bonding electrode 130 and the second bonding electrode 230 can be bonded by hot pressing, or by room temperature bonding, or by adding surface activation treatment before bonding, so that the first dielectric layer 120 and the second dielectric layer 220, and the first bonding electrode 130 and the second bonding electrode 230 can be connected and fused with each other, thereby achieving a high-strength connection between the driving component 200 and the display component 100.

[0032] For example, the bonding between the driving component 200 and the display component 100 can be achieved by heat pressing. Specifically, after the first dielectric layer 120 and the second dielectric layer 220 are aligned, and the first bonding electrode 130 and the second bonding electrode 230 are aligned, the two components are heated and pressurized so that the first dielectric layer 120 and the second dielectric layer 220, and the first bonding electrode 130 and the corresponding second bonding electrode 230 expand due to the heat, thereby achieving mutual connection and fusion.

[0033] Since the thermal expansion coefficient of metal is greater than that of dielectric material, the expansion degree of the first bonding electrode 130 and the second bonding electrode 230 is greater than that of the first dielectric layer 120 and the second dielectric layer 220. Therefore, during the bonding process, the bonding interface between the display component 100 and the driving component 200 is prone to have an undulating topography, which may cause misalignment between the display component 100 and the driving component 200 or the appearance of unbonded areas (bonding voids).

[0034] Therefore, in some embodiments, before the display component 100 and the driving component 200 are bonded, the side of the first dielectric layer 120 facing the second dielectric layer 220 may be ground so that the first bonding electrode 130 is recessed relative to the first dielectric layer 120 .

[0035] Optionally, the side of the second dielectric layer 220 facing the first dielectric layer 120 may also be ground, so that the second bonding electrode 230 is recessed relative to the second dielectric layer 220 .

[0036] Such an arrangement allows the first bonding electrode 130 to be slightly recessed in the surface of the first dielectric layer 120, and the second bonding electrode 230 to be slightly recessed in the surface of the second dielectric layer 220. This makes it less likely that the first bonding electrode 130 and the second bonding electrode 230 will affect the fusion of the first dielectric layer 120 and the second dielectric layer 220 when they expand and fuse due to heat, thereby making the bonding interface between the display component 100 and the driving component 200 smoother.

[0037] In some embodiments, the recess depth of the first bonding electrode 130 relative to the first dielectric layer 120 can be greater than 1 nm. If the recess depth of the first bonding electrode 130 is less than 1 nm, the first bonding electrode 130 may easily expand above the surface of the first dielectric layer 120 when heated, resulting in an uneven topography at the bonding interface. Therefore, setting the recess depth of the first bonding electrode 130 relative to the first dielectric layer 120 to be greater than or equal to 1 nm can further ensure the flatness of the bonding interface after bonding. For example, the recess depth of the first bonding electrode 130 relative to the first dielectric layer 120 can be 1.5 nm, 2 nm, 2.5 nm, etc.

[0038] Likewise, the recess depth of the second bonding electrode 230 relative to the second dielectric layer 220 may also be greater than 1 nm, for example, 1.5 nm, 2 nm, 2.5 nm, etc.

[0039] The first bonding electrode 130 and / or the second bonding electrode 230 may further include a dummy electrode. The dummy electrode in the first bonding electrode 130 is disposed within the region of the first dielectric layer 120 corresponding to the peripheral region, and is exposed from the first dielectric layer 120 toward the second dielectric layer 220. Furthermore, / or the dummy electrode in the second bonding electrode 230 is disposed within the region of the second dielectric layer 220 corresponding to the peripheral region, and is exposed from the second dielectric layer 220 toward the first dielectric layer 120. This configuration allows the dummy electrodes of the first bonding electrode 130 and / or the second bonding electrode 230 to be exposed at the bonding interface.

[0040] Since the bonding interface corresponding to the display area in the LED display device 10 has a densely arrayed first pixel transfer electrode 131 and a corresponding second pixel transfer electrode 231, and the peripheral circuit corresponding to the peripheral area outside the display area has fewer electrodes, and the bonding electrodes exposed to the bonding interface are even sparser, the bonding interface will have an undulating surface before bonding. Therefore, when the display component 100 and the driving component 200 are bonded, there may be some unbonded areas (bonding voids) in the bonding interface.

[0041] If there are unattached areas in the LED display device 10, please refer to Figure 2 , the first pixel transfer electrode 131 and the second pixel transfer electrode 231 corresponding to the display area may not be properly connected. This will not only affect the electrical connection between the display component 100 and the driving component 200, causing some corresponding display pixels in the display area to fail and unable to display light, but also affect the structural stability of the LED display device 10, thereby reducing the yield rate of the LED display device 10.

[0042] Providing a dummy electrode in the first bonding electrode 130 and / or the second bonding electrode 230 can increase the density of the bonding electrodes in the bonding interface corresponding to the peripheral area, so that the electrodes in the bonding interface are distributed more evenly, thereby improving the undulating morphology of the dense electrode area and the sparse electrode area before bonding, and can also enable the display component 100 and the driving component 200 to achieve a more stable physical connection structure and a more efficient interconnection density, making the surface of the LED display device 10 smoother, and can further avoid the failure risk caused by the non-bonded area (bonding void) of the bonding interface, thereby improving the product yield and reliability of the LED display device 10.

[0043] In some embodiments, in a reference cross section perpendicular to the stacking direction of the display component 100 and the driving component 200 , the cross section of the dummy electrode and the cross section of the first pixel switching electrode 131 and / or the second pixel switching electrode 231 may have the same or similar shape and size.

[0044] For example, the stacking direction of the display component 100 and the driving component 200 is as follows: Figure 1 As shown by the arrow A, Figure 3 The reference cross section DD perpendicular to the stacking direction A is shown. This reference cross section is the bonding interface of the display component 100 and the driving component 200. On this cross section, the cross section of the dummy electrode and the cross section of the first pixel transfer electrode 131 are set to the same or similar shape and size, which can reduce the electrical difference between the bonding interface corresponding to the peripheral area and the bonding interface corresponding to the display area, thereby making the structural morphology exposed to the bonding interface more uniform, so that the bonding structures corresponding to the display area and the peripheral area can achieve a more stable physical connection structure and a more efficient interconnection density. The cross section of the second pixel transfer electrode 231 in the bonding interface of the driving substrate 210 can also be referenced. Figure 3 , this embodiment will not be described in detail here.

[0045] In some embodiments, the thickness of the dummy electrode of the first bonding electrode 130 along the stacking direction of the display component 100 and the driving component 200 is less than the thickness of the first dielectric layer 120. Figure 1 The thickness of the first dielectric layer 120 is as follows: Figure 1 As shown in B, the thickness of the dummy electrode of the first bonding electrode 130 is as follows Figure 1 As shown in C, B is greater than C.

[0046] The dummy electrode of the first bonding electrode 130 is disposed in the first dielectric layer 120 and exposed toward the second dielectric layer 220. Therefore, the dummy electrode of the first bonding electrode 130 faces away from the display substrate 110. By setting the thickness of the dummy electrode of the first bonding electrode 130 to be smaller than the thickness of the first dielectric layer 120, the dummy electrode of the first bonding electrode 130 is separated from the display substrate 110 by the first dielectric layer 120. This prevents the dummy electrode of the first bonding electrode 130 from contacting the display substrate 110 and from being electrically connected to the display substrate 110. This prevents the dummy electrode of the first bonding electrode 130 from affecting the display function of the display substrate 110, minimizing leakage in the LED display device 10 and thereby improving the reliability of the LED display device 10.

[0047] In some embodiments, the thickness of the dummy electrode of the second bonding electrode 230 along the stacking direction of the display component 100 and the driving component 200 may also be less than the thickness of the second dielectric layer 220. Similarly, the dummy electrode of the second bonding electrode 230 is disposed in the second dielectric layer 220 and exposed toward the first dielectric layer 120, so that the dummy electrode of the second bonding electrode 230 faces away from the driving substrate 210. Setting the thickness of the dummy electrode of the second bonding electrode 230 to be less than the thickness of the second dielectric layer 220 allows the dummy electrode of the second bonding electrode 230 to be separated from the driving substrate 210 by the second dielectric layer 220. This prevents the dummy electrode of the second bonding electrode 230 from contacting the display substrate 110 and from being electrically connected to the driving substrate 210. This reduces the dummy electrode of the second bonding electrode 230 from affecting the internal circuits of the driving substrate 210, thereby improving the reliability of the LED display device 10.

[0048] In some embodiments, as Figure 1 As shown, the first dielectric layer 120 may include a first sub-dielectric layer 121 and a second sub-dielectric layer 122 stacked together. The second sub-dielectric layer 122 may be located on a side of the first sub-dielectric layer 121 facing away from the display substrate 110. A plurality of first pixel transfer electrodes 131 may be disposed on the first sub-dielectric layer 121 and the second sub-dielectric layer 122. Furthermore, the plurality of first pixel transfer electrodes 131 may penetrate the first sub-dielectric layer 121 and the second sub-dielectric layer 122 to enable contact and conduction with the display substrate 110 and to be bonded to the plurality of second pixel transfer electrodes 231.

[0049] The dummy electrode of the first bonding electrode 130 may be disposed only in the second sub-dielectric layer 122 , so that the dummy electrode on the display component 100 and the display substrate 110 are separated by the first sub-dielectric layer 121 , thereby achieving electrical isolation between the dummy electrode and the display substrate 110 .

[0050] Such an arrangement can also reduce the difficulty of manufacturing the LED display device 10. For example, when manufacturing the display assembly 100, a first sub-dielectric layer 121 and a second sub-dielectric layer 122 can be first covered on one side of the display substrate 110. The second sub-dielectric layer 122 corresponding to the peripheral area is then etched to add dummy electrodes. The first sub-dielectric layer 121 and the second sub-dielectric layer 122 are then etched corresponding to the display pixel locations to expose the display substrate 110 and further add multiple first pixel switching electrodes 131. The first sub-dielectric layer 121 and the second sub-dielectric layer 122 can be made of different materials to facilitate etching of the first sub-dielectric layer 121 and the second sub-dielectric layer 122.

[0051] In some embodiments, as Figure 1As shown, the second dielectric layer 220 may include a third sub-dielectric layer 221 and a fourth sub-dielectric layer 222 arranged in a stacked manner. The fourth sub-dielectric layer 222 is located on a side of the third sub-dielectric layer 221 that may face the display substrate 110. A plurality of second pixel transfer electrodes 231 may be disposed in the third sub-dielectric layer 221 and the fourth sub-dielectric layer 222. The dummy electrodes of the second bonding electrodes 230 are disposed only within the fourth sub-dielectric layer 222. Similarly, such an arrangement allows the dummy electrodes on the driving assembly 200 to be separated from the driving substrate 210 by the fourth sub-dielectric layer 222, thereby achieving electrical isolation between the dummy electrodes and the driving substrate 210 and reducing the difficulty of manufacturing the LED display device 10.

[0052] Based on the above structural description, the specific structure of the LED display device 10 can include three different implementations, that is, the pseudo electrode can be set in the display component 100, or can be set in the driving component 200, or pseudo electrodes can be set in both the display component 100 and the driving component 200.

[0053] For example, the dummy electrodes may be provided only in the display assembly 100. The LED display device 10 of this structure may be as shown in the following first embodiment:

[0054] In some embodiments, as Figure 4 As shown, the first bonding electrode 130 may include multiple first dummy electrodes 132, and the second bonding electrode 230 may further include multiple circuit transfer electrodes 232. The circuit transfer electrodes 232 may be disposed in the area of ​​the second dielectric layer 220 corresponding to the peripheral region and electrically connected to the internal circuit of the driving substrate 210. The first dummy electrodes 132 and the corresponding circuit transfer electrodes 232 are bonded to each other. By providing multiple first dummy electrodes 132 and bonding multiple circuit transfer electrodes 232 in a corresponding manner, the interconnection strength between the display component 100 and the driving component 200 in the peripheral region can be enhanced, and the difference in the number of electrodes at the bonding interface between the display component 100 and the driving component 200 can be reduced, thereby ensuring the stability and reliability of the bonding between the display component 100 and the driving component 200.

[0055] Alternatively, based on the structure of the first embodiment above, a dummy electrode may be added to the second bonding electrode 230, and the resulting structure of the LED display device 10 may be as shown in the following second embodiment:

[0056] like Figure 1As shown, the first bonding electrode 130 may further include a plurality of second dummy electrodes 133, and the second bonding electrode 230 may include a plurality of third dummy electrodes 233, wherein the second dummy electrodes 133 and the corresponding third dummy electrodes 233 are bonded to each other. By providing the plurality of second dummy electrodes 133 and the plurality of third dummy electrodes 233, dummy electrodes are provided on both sides of the display component 100 and the driving component 200, thereby increasing the density of dummy electrodes within the display component 100 and the driving component 200 corresponding to the peripheral area, thereby further improving the undulating morphology of the dense electrode area and the sparse electrode area before bonding, and also enabling the display component 100 and the driving component 200 to achieve a more stable physical connection structure and a more efficient interconnection density.

[0057] Optionally, in the above two embodiments, reference may be made to Figure 1 as well as Figure 3 The arrangement density of the first dummy electrodes 132 and the second dummy electrodes 133 may be substantially the same as the arrangement density of the first pixel switching electrodes 131. In other words, the arrangement density of the first dummy electrodes 132 and the second dummy electrodes 133 may be completely the same as the arrangement density of the first pixel switching electrodes 131.

[0058] Alternatively, the difference between the arrangement density of the first dummy electrodes 132 and the second dummy electrodes 133 and the arrangement density of the first pixel switching electrodes 131 is not greater than 20%. For example, the difference between the arrangement density of the first dummy electrodes 132 and the second dummy electrodes 133 and the arrangement density of the first pixel switching electrodes 131 can be 10%, 8%, or 5%.

[0059] Such a setting can reduce the difference in arrangement density between the bonding electrodes in the peripheral area and the bonding electrodes in the display area, so that the display area and the peripheral area have the same bonding interface or are close to the same bonding interface, thereby improving the undulating morphology of the bonding interface and avoiding the occurrence of unbonded areas on the bonding interface as much as possible.

[0060] Alternatively, the second dummy electrode 133 may be located between the first dummy electrode 132 and the first pixel switching electrode 131. The arrangement density of the plurality of first pixel switching electrodes 131 may be greater than the arrangement density of the plurality of first dummy electrodes 132, and the arrangement density of the plurality of second dummy electrodes 133 may be between the arrangement density of the plurality of first pixel switching electrodes 131 and the arrangement density of the plurality of first dummy electrodes 132.

[0061] Moreover, the arrangement density of the bonding electrodes corresponding to the peripheral area is the combination of the arrangement density of multiple second pseudo electrodes 133 and the arrangement density of multiple first pseudo electrodes 132. Therefore, the setting of the above-mentioned electrode arrangement density can reduce the gap between the electrode density corresponding to the display area and the electrode density corresponding to the peripheral area on the bonding interface, thereby making the bonding electrodes of the bonding interface more uniform, improving the flatness of the bonding interface, and thus improving the stability and reliability of the bonding structure of the LED display device 10.

[0062] Correspondingly, the driving component 200 can also set the arrangement density of the multiple second pixel conversion electrodes 231 to be greater than the arrangement density of the multiple circuit conversion electrodes 232, and the arrangement density of the multiple third dummy electrodes 233 can be between the arrangement density of the multiple second pixel conversion electrodes 231 and the arrangement density of the multiple circuit conversion electrodes 232.

[0063] In other embodiments, in the peripheral region, the electrode assembly on the driving substrate 210 may be connected via the first dummy electrode 132 . Two connection structures are exemplarily described below:

[0064] In one embodiment, if Figure 5 As shown, when viewed from the side of the display component 100 facing away from the driver component 200, the edge of the first dielectric layer 120 may extend beyond the edge of the display substrate 110. The first dummy electrode 132 may be disposed on the portion of the first dielectric layer 120 that extends beyond the display substrate 110. One end of the first dummy electrode 132 that faces away from the circuit transfer electrode 232 is exposed from the first dielectric layer 120. The circuit transfer electrode 232 may connect to a portion of the circuit on the driver substrate 210 to provide conductive communication with the driver substrate 210. Since the circuit transfer electrode 232 is bonded to the first dummy electrode 132, the first dummy electrode 132 can communicate with the driver substrate 210 via the circuit transfer electrode 232.

[0065] Because the end of the first dummy electrode 132 facing away from the circuit connection electrode 232 is exposed from the first dielectric layer 120, external circuits can connect to the first dummy electrode 132 on the surface of the first dielectric layer 120 beyond the edge of the display substrate 110, and further connect to the driver substrate 210 through the first dummy electrode 132 and the circuit connection electrode 232. This arrangement can facilitate the subsequent connection process to the driver substrate 210, improve the feasibility of the LED display device 10, and expand the product's application range.

[0066] In another embodiment, Figure 6 As shown, the display component 100 may further include a plurality of extraction electrodes 300 penetrating the display substrate 110 along the stacking direction of the display component 100 and the driving component 200 , and the extraction electrodes 300 are respectively electrically connected to one end of the corresponding first dummy electrode 132 away from the circuit switching electrode 232 .

[0067] Optionally, a perforation technique can be used to perforate the area corresponding to the peripheral region of the display component 100 to expose the plurality of first dummy electrodes 132, thereby further adding a plurality of extraction electrodes 300. This allows the plurality of extraction electrodes 300 to penetrate the display substrate 110 and the first dielectric layer 120 and be conductively connected to the first dummy electrodes 132. The other side of the plurality of extraction electrodes 300, facing away from the first dummy electrodes 132, can be exposed on the surface of the display substrate 110, thereby facilitating the addition of other components on the surface of the display substrate 110.

[0068] By providing extraction electrodes 300 through perforations, the surface flatness of the display substrate 110 facing away from the driver substrate 210 can be improved, facilitating the subsequent stacking of more components on the surface of the display substrate 110. Furthermore, this structure offers certain advantages, enabling the use of packaging technologies with higher flatness requirements during the packaging of the LED display device 10, reducing process complexity, improving product feasibility, and expanding the product's range of applications.

[0069] In summary, the present application sets a dummy electrode in the first dielectric layer 120 and / or the second dielectric layer 220 to which the display component 100 and the driving component 200 are bonded. The dummy electrode is set in the area corresponding to the first dielectric layer 120 and / or the second dielectric layer 220 and the peripheral area located outside the display area, and together with the multiple first pixel switching electrodes 131 in the first dielectric layer 120 and / or the second pixel switching electrodes 231 in the second dielectric layer 220 constitute a bonding electrode. Therefore, the setting of the pseudo-electrode can increase the density of the electrodes at the bonding interface, so that the display area inside the LED display device 10 and the outer ring area outside the display area have electrodes that can be bonded, so that the bonding electrodes at the bonding interface can be distributed more evenly, so as to improve the ups and downs of the morphology of the dense electrode area and the sparse electrode area before bonding, and also enable the display component 100 and the driving component 200 to achieve a more stable physical connection structure and a more efficient interconnection density, making the surface of the LED display device 10 smoother, and can further avoid the failure risk caused by the non-bonded area (bonding void) of the bonding interface, thereby improving the product yield and reliability of the LED display device 10.

[0070] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An LED display device, characterized in that: The LED display device is provided with a display area and a peripheral area located outside the display area, and the LED display device includes: A display assembly includes a display substrate, a first dielectric layer, and a first bonding electrode, wherein the display substrate includes a plurality of display pixels for forming the display area, the first dielectric layer is disposed on one side of the display substrate, and the first bonding electrode includes a plurality of first pixel switching electrodes, the plurality of first pixel switching electrodes being disposed in a region of the first dielectric layer corresponding to the display area and electrically connected to the corresponding display pixels; a driving component, the driving component and the display component being stacked and bonded to each other, the driving component comprising a driving substrate, a second dielectric layer, and a second bonding electrode, the second dielectric layer being disposed on one side of the driving substrate, the second bonding electrode comprising a plurality of second pixel switching electrodes, the plurality of second pixel switching electrodes being disposed in an area of ​​the second dielectric layer corresponding to the display area, the first dielectric layer and the second dielectric layer, and the first pixel switching electrode and the corresponding second pixel switching electrode being bonded to each other; In which, the first bonding electrode and / or the second bonding electrode further includes a dummy electrode, the dummy electrode in the first bonding electrode is arranged in the area corresponding to the first dielectric layer and the peripheral area, and is exposed from the first dielectric layer toward the side of the second dielectric layer, and / or the dummy electrode in the second bonding electrode is arranged in the area corresponding to the second dielectric layer and the peripheral area, and is exposed from the second dielectric layer toward the side of the first dielectric layer.

2. The LED display device according to claim 1, characterized in that: The first bonding electrode includes a plurality of first dummy electrodes, and the second bonding electrode further includes a plurality of circuit transfer electrodes. The circuit transfer electrodes are arranged in an area of ​​the second dielectric layer corresponding to the peripheral area and are electrically connected to the internal circuit of the driving substrate. The first dummy electrode and the corresponding circuit transfer electrodes are bonded to each other.

3. The LED display device according to claim 2, characterized in that: The first bonding electrode includes a plurality of second dummy electrodes, the second bonding electrode includes a plurality of third dummy electrodes, and the second dummy electrodes and the corresponding third dummy electrodes are bonded to each other.

4. The LED display device according to claim 3, characterized in that: The arrangement density of the first dummy electrode and the second dummy electrode is basically consistent with the arrangement density of the first pixel switching electrode, or the second dummy electrode is located between the first dummy electrode and the first pixel switching electrode, the arrangement density of the multiple first pixel switching electrodes is greater than the arrangement density of the multiple first dummy electrodes, and the arrangement density of the multiple second dummy electrodes is between the arrangement density of the multiple first pixel switching electrodes and the arrangement density of the multiple first dummy electrodes.

5. The LED display device according to any one of claims 2 to 4, characterized in that: When observed from the side of the display component facing away from the driving component, the edge of the first dielectric layer extends beyond the edge of the display substrate, the first dummy electrode is arranged on the portion of the first dielectric layer that extends beyond the display substrate, and one end of the first dummy electrode facing away from the circuit transfer electrode is exposed from the first dielectric layer.

6. The LED display device according to any one of claims 2 to 4, characterized in that: The display component further includes a plurality of extraction electrodes penetrating the display substrate along a stacking direction of the display component and the driving component. The extraction electrodes are respectively electrically connected to one end of the corresponding first dummy electrode facing away from the circuit switching electrode.

7. The LED display device according to claim 1, characterized in that: The thickness of the dummy electrode of the first bonding electrode along the stacking direction of the display component and the driving component is less than the thickness of the first dielectric layer, and / or The thickness of the dummy electrode of the first bonding electrode along the stacking direction of the display component and the driving component is smaller than the thickness of the second dielectric layer.

8. The LED display device according to claim 7, characterized in that: The first dielectric layer includes a first sub-dielectric layer and a second sub-dielectric layer stacked together, the second sub-dielectric layer is located on a side of the first sub-dielectric layer away from the display substrate, the plurality of first pixel switching electrodes are arranged in the first sub-dielectric layer and the second sub-dielectric layer, the dummy electrode of the first bonding electrode is only arranged in the second sub-dielectric layer, and / or The second dielectric layer includes a third sub-dielectric layer and a fourth sub-dielectric layer that are stacked, the fourth sub-dielectric layer is located on a side of the third sub-dielectric layer facing the display substrate, the multiple second pixel switching electrodes are arranged in the third sub-dielectric layer and the fourth sub-dielectric layer, and the dummy electrode of the second bonding electrode is only arranged in the fourth sub-dielectric layer.

9. The LED display device according to claim 1, characterized in that: In a reference cross section perpendicular to the stacking direction of the display component and the driving component, the cross section of the dummy electrode has the same or similar shape and size as the cross section of the first pixel switching electrode and / or the second pixel switching electrode.

10. The LED display device according to claim 1, characterized in that: Before the display component and the driving component are bonded, the first dielectric layer is ground on a side facing the second dielectric layer so that the first bonding electrode is recessed relative to the first dielectric layer, and / or The second dielectric layer is ground on a side facing the first dielectric layer, so that the second bonding electrode is recessed relative to the second dielectric layer.

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