A packaging method of a stacked package structure

Abstract

The application provides a packaging method of a laminated packaging structure, and relates to the technical field of chip packaging, and comprises the following steps: taking a first packaging body, a plurality of solder layers are arranged on one side of the first packaging body; a transition connecting layer is prepared on the outer periphery of the solder layers; taking a second packaging body, the first packaging body is connected with the second packaging body through the solder layers, and a packaging gap is formed between the first packaging body and the second packaging body; an intermediate plastic packaging layer is formed at the packaging gap, one side of the intermediate plastic packaging layer is connected with the first packaging body, and the other side of the intermediate plastic packaging layer is connected with the second packaging body. In the application, the intermediate plastic packaging layer is formed at the packaging gap, the packaging gap can be eliminated, the invasion path of external pollutants can be effectively blocked, the corrosion and oxidation of the solder layers can be prevented, the service life of the solder layers is prolonged, and the reliability and stability of the laminated packaging structure are improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a packaging method for a stacked packaging structure. Background Technology

[0002] Stacked packaging is an advanced packaging technology that achieves high integration by vertically stacking multiple chips or packages. It is mainly used in consumer electronics, automotive electronics, and high-performance computing. The core of stacked packaging is to stack multiple functional modules in the vertical direction and achieve electrical connections through high-density interconnect technologies (such as solder balls, through-silicon vias, and hybrid bonding).

[0003] For example, Chinese Patent Application No. 202211289993.X discloses a stacked packaging method. This method includes: providing a first substrate, the first substrate including a first front side and a first back side disposed opposite to each other; forming a plurality of metal pillars on one side of the first front side, the metal pillars being electrically connected to the first substrate; forming a solder layer on at least the top surface of the metal pillars on the side away from the first substrate; wherein the solder layer uniformly covers the top surface of the metal pillars on the side away from the first substrate, and the height of the solder layer is within a preset range; forming a first molding compound on one side of the first front side of the first substrate, the first molding compound covering the metal pillars, at least a portion of the solder layer being exposed from the first molding compound; disposing a second substrate on the side of the metal pillars away from the first substrate, the metal pillars being electrically connected to the second substrate through the solder layer; and using a reflow method to fix the second substrate to the metal pillars through the solder layer. This method can reduce packaging costs and improve the yield of packaged devices.

[0004] In the above-mentioned stacked packaging method, the second substrate is connected to the metal pillar through the solder layer exposed from the first molding layer. Therefore, there will be a gap between the first molding layer and the second substrate. This gap makes it easy for external contaminants to enter, causing corrosion and oxidation of the solder layer, resulting in increased contact resistance and electrical connection failure, which seriously affects the reliability and stability of the packaging structure. Summary of the Invention

[0005] This invention provides a packaging method for a stacked packaging structure to solve the technical problem that the gap between the first molding layer and the second substrate is prone to allow external moisture and contaminants to enter, causing corrosion and oxidation of the solder layer, resulting in increased contact resistance and electrical connection failure.

[0006] To address the aforementioned technical problems, this invention discloses a packaging method for a stacked packaging structure, comprising the following steps:

[0007] Take a first package body, and provide several solder layers on one side of the first package body;

[0008] A transition connection layer is prepared around the solder layer;

[0009] Take the second package and connect the first package and the second package through a solder layer, forming a package gap between the first package and the second package;

[0010] An intermediate molding layer is formed at the encapsulation gap. One side of the intermediate molding layer is connected to the first package, and the other side of the intermediate molding layer is connected to the second package.

[0011] Preferably, the first package includes a first substrate, the first substrate includes a first front side and a second front side disposed opposite to each other, the first front side of the first substrate is provided with a first chip and a plurality of metal conductive pillars, one end of the metal conductive pillars is electrically connected to the first substrate, the other end of the metal conductive pillars is provided with a solder layer, a first molding compound is provided on the first substrate, and the first molding compound covers the metal conductive pillars and the first chip.

[0012] Preferably, the second package includes a second substrate, a second chip is disposed on the side of the second substrate away from the first substrate, the side of the second substrate close to the first substrate is electrically connected to a metal conductive pillar through a solder layer, and a second molding compound is disposed on the second substrate, the second molding compound covering the second chip.

[0013] Preferably, the height of the transition connection layer is less than the height of the solder layer.

[0014] Preferably, the preparation of a transition connection layer on the outer periphery of the solder layer includes:

[0015] The first molding layer undergoes surface pretreatment;

[0016] A thermosetting resin is coated on the surface of the first molding layer.

[0017] Preferably, the surface pretreatment of the first molding layer includes: cleaning the surface of the first molding layer and roughening the surface of the first molding layer.

[0018] Preferably, the surface roughening treatment includes plasma etching.

[0019] Preferably, forming an intermediate molding layer at the encapsulation gap includes injecting molding compound into the encapsulation gap using an encapsulation device.

[0020] Preferably, the packaging device includes a packaging base plate, a lower mold is set on the packaging base plate, a sealing sleeve is set on the outside of the lower mold, the inner wall of the sealing sleeve is rotatably connected to the outer wall of the lower mold, a toothed ring is set on the outer wall of the sealing sleeve, two connecting holes are symmetrically set inside the sealing sleeve, a lower cavity is set inside the lower mold, a plurality of feeding holes are set on the upper surface of the lower mold, one end of the feeding hole is connected to the inside of the lower cavity, and the other end of the feeding hole penetrates through the outer wall of the lower mold, an upper mold is set above the lower mold, an upper cavity is set on the side of the upper mold near the lower mold, the upper mold is set at the output end of an electric push rod, the electric push rod is set on a mounting frame, the mounting frame is set on the packaging base plate, an injection molding machine body is set on the upper side of the mounting frame, an injection molding tube is set at the output end of the injection molding machine body, an injection molding manifold is rotatably set at the upper end of the injection molding tube, and the two ends of the injection molding manifold are respectively connected to the two connecting holes.

[0021] Preferably, a drive motor is provided on the packaging base plate, and an incomplete gear is provided at the output end of the drive motor, which intermittently meshes with the outer ring of the gear ring.

[0022] The technical solution of this invention has the following advantages: This invention provides a packaging method for a stacked packaging structure, relating to the field of chip packaging technology, including the following steps: taking a first package body, and providing a plurality of solder layers on one side of the first package body; preparing a transition connection layer on the outer periphery of the solder layers; taking a second package body, and connecting the first package body and the second package body through the solder layers, forming a packaging gap between the first package body and the second package body; forming an intermediate molding compound layer at the packaging gap, with one side of the intermediate molding compound layer connected to the first package body and the other side of the intermediate molding compound layer connected to the second package body. In this invention, by forming an intermediate molding compound layer at the packaging gap, the packaging gap can be eliminated, effectively blocking the intrusion path of external contaminants, preventing corrosion and oxidation of the solder layer, extending the service life of the solder layer, and improving the reliability and stability of the stacked packaging structure.

[0023] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the means particularly pointed out in the written description and the accompanying drawings.

[0024] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a flowchart of a packaging method for a stacked packaging structure according to the present invention;

[0027] Figure 2 This is a schematic diagram of the stacked packaging structure of the present invention;

[0028] Figure 3 For the present invention Figure 2 Enlarged view of the structure at point A in the middle;

[0029] Figure 4 This is a schematic diagram of the packaging device structure in this invention;

[0030] Figure 5 For the present invention Figure 4 A partial sectional view of the structure at point BB;

[0031] Figure 6 This is a schematic diagram showing the connection between the feed hole and the injection hole inside the lower mold in this invention;

[0032] Figure 7 For the present invention Figure 6 Enlarged view of the structure at point C;

[0033] Figure 8 For the present invention Figure 7 Enlarged view of the structure at point D;

[0034] Figure 9 This is a schematic diagram showing that the feed hole and injection hole inside the lower mold are not connected in this invention;

[0035] Figure 10 For the present invention Figure 9 Enlarged view of the structure at point E in the middle;

[0036] Figure 11 For the present invention Figure 10 Enlarged view of the structure at point F.

[0037] In the diagram: 1. Solder layer; 2. Transition connection layer; 3. Encapsulation gap; 4. Intermediate molding layer; 5. First substrate; 6. First chip; 7. Metal conductive pillar; 8. First molding layer; 9. Second substrate; 10. Second chip; 11. Second molding layer; 12. Encapsulation base plate; 13. Lower mold; 14. Sealing sleeve; 15. Gear ring; 16. Connecting hole; 17. Feed hole; 18. Upper mold; 19. Electric push rod; 2 0. Mounting bracket; 21. Injection molding machine body; 22. Injection tube; 23. Injection manifold; 24. Incomplete gear; 25. Insertion hole; 26. Insertion rod; 27. Discharge hole; 28. Injection head; 29. ​​Injection hole; 30. Fixing ring; 31. Sliding cavity; 32. Sliding block; 33. Sliding rod; 34. First spring; 35. Block; 36. Connecting plate; 37. Storage hole; 38. Sealing plate; 39. Second spring. Detailed Implementation

[0038] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0039] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0040] Example 1:

[0041] This invention provides a packaging method for a stacked packaging structure, such as... Figures 1-3 As shown, it includes the following steps:

[0042] Take a first package body, and provide several solder layers 1 on one side of the first package body;

[0043] A transition connection layer 2 is prepared around the outer periphery of solder layer 1;

[0044] Take the second package body, and connect the first package body and the second package body through the solder layer 1, forming a package gap 3 between the first package body and the second package body;

[0045] An intermediate molding layer 4 is formed at the encapsulation gap 3. One side of the intermediate molding layer 4 is connected to the first package body, and the other side of the intermediate molding layer 4 is connected to the second package body.

[0046] The first package includes a first substrate 5, which includes a first front side and a second front side disposed opposite to each other. The first front side of the first substrate 5 is provided with a first chip 6 and a plurality of metal conductive pillars 7. One end of the metal conductive pillars 7 is electrically connected to the first substrate 5, and the other end of the metal conductive pillars 7 is provided with a solder layer 1. A first molding compound 8 is provided on the first substrate 5, and the first molding compound 8 covers the metal conductive pillars 7 and the first chip 6.

[0047] The second package includes a second substrate 9, on the side of the second substrate 9 away from the first substrate 5, a second chip 10 is disposed, on the side of the second substrate 9 close to the first substrate 5, the second substrate 9 is electrically connected to the metal conductive pillar 7 through a solder layer 1, and a second molding compound 11 is disposed on the second substrate 9, the second molding compound 11 covering the second chip 10.

[0048] The working principle and beneficial effects of the above technical solution are as follows: Both the first package and the second package are prepared using existing packaging methods. The first package includes a first substrate 5, on which a first chip 6 is mounted. Multiple metal conductive pillars 7 are disposed on the outer side of the first chip 6. A first molding compound 8 is used to encapsulate the first chip 6 and the metal conductive pillars 7. A solder layer 1 is disposed at the end of the metal conductive pillars 7 away from the first substrate 5, with a portion of the solder layer 1 exposed outside the first molding compound 8. Before mounting the second package, a transition connection layer 2 is first prepared around the solder layer 1, and then connected to the second substrate 9 through the solder layer 1. A connection is formed between the second substrate 9 and the first molding compound 8. Because external contaminants (such as external moisture, corrosive gases, etc.) can penetrate into the solder layer 1 through the encapsulation gap 3, causing corrosion and oxidation of the solder layer 1, resulting in increased contact resistance, and in severe cases, electrical connection failure, affecting the service life of the stacked package structure. To avoid the above problems, an intermediate molding layer 4 is formed at the encapsulation gap 3. One side of the intermediate molding layer 4 is connected to the first molding layer 8 of the first package, and the other side is connected to the second substrate 9, thereby eliminating the encapsulation gap 3, effectively blocking the intrusion path of external contaminants, preventing corrosion and oxidation of the solder layer 1, extending the service life of the solder layer 1, and improving the reliability and stability of the stacked package structure.

[0049] Example 2:

[0050] Based on the above embodiment 1, as follows Figure 3 As shown, the height of the transition connection layer 2 is less than the height of the solder layer 1.

[0051] The working principle and beneficial effects of the above technical solution are as follows: the transition connection layer 2 is located on the outer periphery of the solder layer 1, which can prevent the solder layer 1 from flowing to the surface of the first molding compound 8. Since the height of the transition connection layer 2 is less than the height of the solder layer 1, it can ensure that the solder layer 1 is effectively connected to the second substrate 9.

[0052] Example 3:

[0053] Based on Example 1 or 2, the preparation of a transition connection layer 2 on the outer periphery of solder layer 1 includes:

[0054] The first molding layer 8 is subjected to surface pretreatment, including cleaning the surface of the first molding layer 8 and roughening the surface of the first molding layer 8, including plasma etching.

[0055] A thermosetting resin is coated on the surface of the first molding layer 8.

[0056] The working principle and beneficial effects of the above technical solution are as follows: When preparing the transition connection layer 2, the surface of the first molding compound layer 8 is first cleaned to prevent impurities from entering the transition connection layer 2. Then, the surface of the first molding compound layer 8 is roughened. The surface roughening treatment can be carried out by plasma etching to form a micron-level rough structure on the surface of the first molding compound layer 8, thereby improving the surface roughness of the first molding compound layer 8. Then, a thermosetting resin is coated on the surface of the first molding compound layer 8. The thermosetting resin can be epoxy resin. After the coating is completed, the transition connection layer 2 wraps around the solder layer 1 and forms a boss structure on the surface of the first molding compound layer 8. After the intermediate molding compound layer 4 fills the encapsulation gap 3, a mechanical interlock is formed, which enhances the reliability of the intermediate encapsulation layer.

[0057] Example 4:

[0058] Based on any one of Examples 1-3, such as Figures 4-11 As shown, forming an intermediate molding layer 4 at the encapsulation gap 3 includes injecting molding compound into the encapsulation gap 3 using an encapsulation device;

[0059] The packaging device includes a packaging base plate 12, a lower mold 13 mounted on the packaging base plate 12, a sealing sleeve 14 disposed outside the lower mold 13, the inner wall of the sealing sleeve 14 being rotatably connected to the outer wall of the lower mold 13, a toothed ring 15 disposed on the outer wall of the sealing sleeve 14, two symmetrically arranged connecting holes 16 disposed inside the sealing sleeve 14, a lower cavity disposed inside the lower mold 13, and a plurality of feeding holes 17 disposed on the upper surface of the lower mold 13, one end of the feeding hole 17 communicating with the interior of the lower cavity, and the other end of the feeding hole 17 penetrating through the outer wall of the lower mold 13. An upper mold 18 is provided above the lower mold 13. An upper cavity is provided on the side of the upper mold 18 near the lower mold 13. The upper mold 18 is located at the output end of the electric push rod 19. The electric push rod 19 is located on the mounting frame 20. The mounting frame 20 is located on the encapsulation base plate 12. An injection molding machine body 21 is provided on the upper side of the mounting frame 20. An injection molding tube 22 is provided at the output end of the injection molding machine body 21. An injection molding diversion tube 23 is rotatably provided at the upper end of the injection molding tube 22. The two ends of the injection molding diversion tube 23 are respectively connected to two connecting holes 16.

[0060] A drive motor is mounted on the base plate 12, and an incomplete gear 24 is mounted on the output end of the drive motor. The incomplete gear 24 intermittently meshes with the outer ring of the gear ring 15.

[0061] The working principle and beneficial effects of the above technical solution are as follows: After the first package and the second package are connected by the solder layer 1, the first package is placed face down into the lower cavity of the lower mold 13. Then, the electric push rod 19 is activated, and the electric push rod 19 extends to drive the upper mold 18 to move downward until the upper mold 18 contacts the lower mold 13. The second package is located in the upper cavity, and the feed hole 17 in the lower mold 13 is flush with the packaging gap 3. Then, the injection molding machine 21 is activated, and the injection molding machine 21 outputs the molding compound into the injection tube 22. The molding compound can be epoxy resin, and then it is distributed through the injection distribution tube 23. The material flows to two connecting holes 16. When the connecting hole 16 connects with the feed hole 17, the molding compound enters the encapsulation gap 3 through the feed hole 17 and fills the encapsulation gap 3. After the molding compound cures, the intermediate molding layer 4 is formed. There are at least ten feed holes 17, and the ten feed holes 17 are arranged in a ring array about the center of the lower mold 13. The lower mold 13 is cylindrical, and the lower cavity is adapted to the shape of the first encapsulation body. A sealing sleeve 14 is rotatably installed on the outer wall of the lower mold 13. The inner wall of the sealing sleeve 14 can seal the feed hole 17. Starting the drive motor can drive the incomplete gear 24 to rotate. When engaged with the gear ring 15, it can drive the gear ring 15 to rotate. The rotation of the gear ring 15 can drive the sealing sleeve 14 to rotate outside the lower mold 13. The sealing sleeve 14 drives the injection molding manifold 23 to rotate synchronously, ensuring that the molding compound can flow into the two connecting holes 16 through the injection molding manifold 23 respectively. As the sealing sleeve 14 rotates, the connecting holes 16 can connect with different feed holes 17, so that the molding compound flows into the encapsulation gap 3 through different feed holes 17 and at different angles. Different angles of flow path can make the molding compound fill the encapsulation gap 3 evenly, avoiding local air stagnation when filling at a single angle. The heat accumulation caused by the retention and the multi-angle flow of molding compound can balance the filling pressure in all directions within the encapsulation gap 3, reduce the thickness deviation of the molding compound during the flow process, reduce stress concentration problems caused by local thinning or thickening, ensure that the solder layer 1 is uniformly covered, and the molding compound is uniformly filled within the encapsulation gap 3 to form a void-free intermediate molding layer 4, effectively blocking the intrusion path of external contaminants, preventing corrosion and oxidation of the solder layer, extending the service life of the solder layer, and by setting two connecting holes 16, the molding compound can be injected into the encapsulation gap 3 from relative angles, improving production efficiency.

[0062] Example 5:

[0063] Based on Example 4, such as Figure 4 , Figure 6 As shown, the lower mold 13 is provided with several insertion holes 25, and the bottom wall of the upper mold 18 is provided with several insertion rods 26 corresponding to the insertion holes 25.

[0064] The working principle and beneficial effects of the above technical solution are as follows: When the electric push rod 19 extends, the upper mold 18 moves towards the lower mold 13, and the plug rod 26 is aligned with the plug hole 25 and inserted into the plug hole 25, so as to avoid the upper mold 18 from shifting during the movement, so that the upper cavity is aligned with the upper side of the second package body, and the upper mold 18 is prevented from damaging the second package body, thereby improving the accuracy and reliability of the connection between the upper mold 18 and the lower mold 13.

[0065] Example 6:

[0066] Based on Example 4 or 5, such as Figure 5 As shown, the upper mold 18 is provided with a number of discharge holes 27, and the number of discharge holes 27 corresponds one-to-one with the number of feed holes 17. The lower end of the discharge hole 27 is connected to the feed hole 17, and the upper end of the discharge hole 27 is connected to the outside of the upper mold 18.

[0067] The working principle and beneficial effects of the above technical solution are as follows: During the process of injecting molding compound into the encapsulation gap 3, the gas in the encapsulation gap 3 can be discharged through the discharge port 27, avoiding the formation of air holes in the intermediate molding layer 4 and improving the preparation quality of the intermediate molding layer 4. If the molding compound flows into the encapsulation gap 3 from a single angle, the gas in the encapsulation gap 3 is prone to remain at the end of the encapsulation gap 3, forming an "air trap". Therefore, multiple discharge ports 27 are provided, and each discharge port 27 corresponds to a feed port 17. When the molding compound is injected, the gas... The encapsulant first flows along the bottom wall of the inlet 17. Gas within the encapsulation gap 3 can flow into the outlet 27 through the inlet 17 (where no encapsulant has flowed in), and then exit from the outlet 27. As the sealing sleeve 14 rotates, the encapsulant flows into the encapsulation gap 3 at multiple angles through different inlet 17s. The thrust of the encapsulant flow forces the gas out of the different outlet 27s, preventing gas residue within the encapsulation gap 3, reducing air bubbles in the intermediate encapsulation layer 4, eliminating filling dead zones, improving the encapsulant filling rate, and avoiding… The absence of voids during the filling process not only enhances the overall structural strength of the intermediate molding layer 4 and improves its reliability, but also reduces its thermal resistance and thermal conductivity due to the reduction of air bubbles, thus extending the overall service life and reliability of the stacked encapsulation structure. Finally, when all the outlet holes 27 have discharged molding material, it indicates that the molding material has filled the encapsulation gap 3. At this point, the injection molding machine 21 can be closed. After the molding material has solidified, the electric push rod 19 is retracted upwards, driving the upper mold 18 to move upwards. The upper mold 18 separates from the lower mold 13, and the stacked encapsulation structure is removed. A first molding column adapted to the inlet hole 17 is formed on the outer periphery of the stacked encapsulation structure, and a second molding column adapted to the outlet hole 27 is formed on the first molding column. At this point, the first molding column and the second molding column can be separated by cutting the connection between the first molding column and the intermediate molding layer 4, further improving the manufacturing efficiency.

[0068] Example 7:

[0069] Based on any one of Examples 4-6, such as Figures 6-11 As shown, an injection head 28 is slidably disposed at one end of the connecting hole 16 near the lower mold 13. The end of the injection head 28 near the lower mold 13 is hemispherical. An injection hole 29 is disposed inside the injection head 28. A fixing ring 30 is disposed inside the connecting hole 16. The outer wall of the fixing ring 30 is fixedly connected to the inner wall of the connecting hole 16. Several sliding cavities 31 are disposed inside the fixing ring 30. Sliding blocks 32 are slidably disposed inside the sliding cavities 31. A sliding rod 33 is disposed at one end of the sliding block 32 near the injection head 28. The end of the sliding rod 33 near the injection head 28 extends to the outside of the sliding cavity 31 and is connected to the injection head 28. The side of the sliding block 32 away from the sliding rod 33 is connected to the inner wall of the sliding cavity 31 through a first spring 34. A blocking block 35 is disposed at the center of the fixing ring 30. The outer wall of the blocking block 35 is connected to the inner wall of the fixing ring 30 through several connecting plates 36. The end of the blocking block 35 near the injection hole 29 has a conical structure.

[0070] The working principle and beneficial effects of the above technical solution are as follows: An injection head 28 is installed in the connecting hole 16. Initially, the connecting hole 16 is connected to one of the feed holes 17. The diameter of the end of the injection head 28 is larger than the diameter of the end of the feed hole 17. Under the action of the first spring 34, the end of the injection head 28 can be stuck at the inlet of the feed hole 17. The injection hole 29 is connected to the feed hole 17. The molding compound in the connecting hole 16 flows steadily into the feed hole 17 through the injection hole 29 and forms a thin stream through the injection hole 29, without filling the feed hole 17. When the incomplete gear 24 meshes with the gear ring 15, the gear ring 15 drives the sealing sleeve 14 to rotate, and the sealing sleeve 14 drives the connecting hole 16 to rotate. The injection head 28 gradually slides out of the feed hole 17. The injection head 28 drives the sliding rod 33 to slide away from the lower mold 13. The sliding rod 33 drives the sliding block 32 to slide away from the lower mold 13 in the sliding cavity 31. The first spring 34 is compressed, and the injection hole 29 gradually contacts the end of the plug 35 near the plug 35 during the meshing process of the incomplete gear 24 and the gear ring 15. The injection head 28 slides along the outer wall of the lower mold 13. At this time, the injection hole 29 and the feed hole 17 are not connected, and the encapsulating material in the connecting hole 16 cannot flow into the feed hole 17. The injection hole 29 is blocked by the plug 35 to prevent the encapsulating material from flowing out between the sealing sleeve 14 and the lower mold 13, thus improving the sealing performance. After the incomplete gear 24 and the gear ring 15 finish meshing, the injection head 28 is inserted into the next feed hole 17, and the encapsulating material is injected into the encapsulation gap 3 again through the feed hole 17, flowing in at different angles and symmetrically arranged. The injection head 28 allows the two streams of molding compound to flow and collide with each other, and then spread outwards after the collision, so that the molding compound is evenly distributed in the encapsulation gap 3, reducing the pores in the intermediate molding layer 4 and improving the preparation quality of the intermediate molding layer 4. Furthermore, during the process of the injection head 28 being inserted into the feed hole 17, under the elastic force of the first spring 34, the sealing sleeve 14 and the lower mold 13 can maintain relative stability, improving the reliability of the connection between the injection hole 29 and the feed hole 17, and ensuring that the molding compound is stably injected into the encapsulation gap 3.

[0071] Example 8:

[0072] Based on Example 7, such as Figure 7 , Figure 10 As shown, several storage holes 37 are provided on the inner wall of the connecting hole 16. The storage holes 37 are located on the side of the fixing ring 30 away from the injection head 28. A sealing plate 38 is slidably arranged in the storage hole 37. The sealing plate 38 is connected to the inner wall of the storage hole 37 by a second spring 39.

[0073] The working principle and beneficial effects of the above technical solution are as follows: When the plug 35 blocks the injection hole 29, the pressure in the connecting hole 16 gradually increases, and the molding compound pushes the sealing plate 38 to slide along the storage hole 37. Some of the molding compound flows into the storage hole 37. An air hole can be provided at the end of the storage hole 37. The air hole is connected to the outside of the sealing sleeve 14, which can allow the gas between the sealing plate 38 and the storage hole 37 to be discharged, which facilitates the inflow of the molding compound. After the plug 35 separates from the injection hole 29, the injection hole 29 is connected to the feed hole 17. The molding compound in the connecting hole 16 flows into the feed hole 17 through the injection hole 29. Under the elastic force of the second spring 39, the sealing plate 38 pushes the molding compound in the storage hole 37 into the connecting hole 16, so that the molding compound flows faster in the injection hole 29. The rapid impact prevents the injection hole 29 from being blocked and accelerates the flow of the molding compound in the encapsulation gap 3, so that the molding compound reaches the center position of the encapsulation gap 3 faster, which improves the preparation efficiency of the intermediate molding layer 4.

[0074] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0075] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0076] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A packaging method of a stacked package structure, characterized by, Includes the following steps: Take the first package body, and provide several solder layers on one side of the first package body (1); A transition connection layer (2) is prepared on the outer periphery of the solder layer (1); Take the second package body and connect the first package body and the second package body through the solder layer (1), forming a package gap (3) between the first package body and the second package body. An intermediate molding layer (4) is formed at the encapsulation gap (3). One side of the intermediate molding layer (4) is connected to the first package body, and the other side of the intermediate molding layer (4) is connected to the second package body. Forming an intermediate molding layer (4) at the encapsulation gap (3) includes injecting molding compound into the encapsulation gap (3) using an encapsulation device; The packaging device includes a packaging base plate (12), a lower mold (13) is set on the packaging base plate (12), a sealing sleeve (14) is set on the outside of the lower mold (13), the inner wall of the sealing sleeve (14) is rotatably connected to the outer wall of the lower mold (13), a toothed ring (15) is set on the outer wall of the sealing sleeve (14), two connecting holes (16) are symmetrically arranged inside the sealing sleeve (14), a lower cavity is set inside the lower mold (13), and several feeding holes (17) are set on the upper surface of the lower mold (13). One end of the feeding hole (17) is connected to the inside of the lower cavity, and the other end of the feeding hole (17) penetrates through the outer wall of the lower mold (13). An upper mold (18) is set above the mold (13). An upper cavity is set on the side of the upper mold (18) near the lower mold (13). The upper mold (18) is set at the output end of the electric push rod (19). The electric push rod (19) is set on the mounting frame (20). The mounting frame (20) is set on the encapsulation base plate (12). An injection molding machine body (21) is set on the upper side of the mounting frame (20). An injection molding tube (22) is set at the output end of the injection molding machine body (21). An injection molding manifold (23) is rotatably set at the upper end of the injection molding tube (22). The two ends of the injection molding manifold (23) are connected to two connecting holes (16) respectively. A drive motor is provided on the packaging base plate (12), and an incomplete gear (24) is provided at the output end of the drive motor. The incomplete gear (24) intermittently meshes with the outer ring of the gear ring (15).

2. The packaging method of a stacked package structure according to claim 1, wherein, The first package includes a first substrate (5), the first substrate (5) includes a first front side and a second front side disposed opposite to each other, the first front side of the first substrate (5) is provided with a first chip (6) and a plurality of metal conductive pillars (7), one end of the metal conductive pillars (7) is electrically connected to the first substrate (5), the other end of the metal conductive pillars (7) is provided with a solder layer (1), a first molding compound (8) is provided on the first substrate (5), and the first molding compound (8) covers the metal conductive pillars (7) and the first chip (6).

3. The packaging method of a stacked package structure according to claim 2, wherein The second package includes a second substrate (9), a second chip (10) is disposed on the side of the second substrate (9) away from the first substrate (5), the side of the second substrate (9) close to the first substrate (5) is electrically connected to the metal conductive pillar (7) through a solder layer (1), a second molding layer (11) is disposed on the second substrate (9), and the second molding layer (11) covers the second chip (10).

4. The packaging method for a stacked packaging structure according to claim 1, characterized in that, The height of the transition connection layer (2) is less than the height of the solder layer (1).

5. The packaging method of a stacked package structure according to claim 2, wherein The preparation of a transition connection layer (2) on the outer periphery of the solder layer (1) includes: The first molding layer (8) undergoes surface pretreatment; A thermosetting resin is coated on the surface of the first molding layer (8).

6. The packaging method of a stacked package structure according to claim 5, wherein, The surface pretreatment of the first molding layer (8) includes cleaning the surface of the first molding layer (8) and roughening the surface of the first molding layer (8).

7. The packaging method of a stacked package structure according to claim 6, wherein Surface roughening treatment includes plasma etching.

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