A plate-like array structure, a cylindrical array ultrasonic transducer and a manufacturing method thereof

Abstract

The application provides a plate array structure, a cylindrical array ultrasonic transducer and a manufacturing method thereof. The method comprises the following steps: providing a laminated structure; the laminated structure comprises a piezoelectric layer and a matching layer which are stacked along a first direction; forming a plurality of first grooves, second grooves and array elements which extend along a second direction in the laminated structure to obtain a plate array structure; a plurality of the first grooves and a plurality of the array elements are alternately arranged along a third direction, the second grooves are located at the outermost sides of the array elements at both ends along the third direction, and the first grooves and the second grooves penetrate through the piezoelectric layer along the first direction and extend to the matching layer, the size of the second grooves along the third direction is equal to half of the size of the first grooves along the third direction; wherein the second direction is perpendicular to the third direction, and the first direction is perpendicular to the second direction and the third direction. The application reduces the process complexity, reduces the cost and improves the product yield.

Description

Technical Field

[0001] This application relates to ultrasound diagnostic equipment, specifically to a plate array structure, a cylindrical array ultrasound transducer, and a method for manufacturing the same. Background Technology

[0002] Medical ultrasound transducers, as a core type of sensor that enables the conversion between electrical signals and ultrasound signals, are widely used in the field of medical ultrasound diagnosis.

[0003] Traditional medical ultrasound transducers typically need to be in close contact with the skin to work, transmitting sound signals to internal organs through lenses and receiving reflected signals. However, this type of surface examination is limited by the depth of sound wave penetration and the imaging angle, making it difficult to achieve high-resolution imaging of the entire circumference of luminal organs such as blood vessels, digestive tract, and trachea.

[0004] To meet the demand for precise diagnosis of the interior of tubular organs, there is an urgent need to develop miniaturized probes capable of penetrating deep into these organs. Therefore, cylindrical array ultrasound transducers stand out due to their unique geometry: their cylindrical array structure supports 360° beam scanning and dynamic focusing capabilities, making them a key technological approach for achieving three-dimensional imaging of tubular organs. However, how to manufacture cylindrical array transducers remains a critical technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a plate array structure, a cylindrical array ultrasonic transducer, and a method for manufacturing the same, which reduces process complexity, lowers costs, and improves product yield.

[0006] In a first aspect, this application provides a method for manufacturing a cylindrical array ultrasonic transducer, comprising the following steps:

[0007] A stacked structure is provided; the stacked structure includes a piezoelectric layer and a matching layer stacked along a first direction;

[0008] In the stacked structure, a plurality of first grooves, second grooves and array elements extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves and the plurality of array elements are alternately arranged along a third direction, the second groove is located at the outermost of the array elements at both ends along the third direction, and the first groove and the second groove penetrate the piezoelectric layer and extend to the matching layer in the first direction, and the size of the second groove in the third direction is equal to half the size of the first groove in the third direction;

[0009] Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

[0010] In some embodiments, the dimension of the first groove in the third direction is equal to half the dimension of the second groove in the third direction.

[0011] In some embodiments, both the first groove and the second groove are cuts of equal width at the top and bottom.

[0012] In some embodiments, both the first groove and the second groove are cut grooves that are wider at the top and narrower at the bottom.

[0013] In some embodiments, both the first groove and the second groove are multi-layered stepped grooves that are wider at the top and narrower at the bottom.

[0014] Secondly, this application also provides a method for manufacturing a cylindrical array ultrasonic transducer, comprising the following steps:

[0015] A stacked structure is provided; the stacked structure includes a piezoelectric layer and a matching layer stacked along a first direction;

[0016] In the stacked structure, a plurality of first grooves, second grooves and array elements extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves and the plurality of array elements are alternately arranged along a third direction, the second groove is located at the outermost of the array elements at both ends along the third direction, and the first groove and the second groove penetrate the piezoelectric layer and extend to the matching layer in a first direction, and the size of the second groove in the third direction is equal to half the size of the first groove in the third direction.

[0017] The plate-shaped array structure is attached to the outer wall of the supporting cylindrical tube to obtain a cylindrical array ultrasonic transducer.

[0018] Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

[0019] In some embodiments, the step of forming a cylindrical array ultrasonic transducer by surrounding the plate-like array structure with the outer wall of the supporting cylindrical tube includes:

[0020] The plate-shaped array structure is rolled into a cylindrical shape, so that the second grooves at both ends of the plate-shaped array structure are connected to each other;

[0021] The piezoelectric layer of the plate-like array structure, rolled into a cylindrical shape, is attached around a support tube coated with adhesive, and after curing, it forms the cylindrical array ultrasonic transducer.

[0022] In some embodiments, the adhesive is epoxy resin.

[0023] In some embodiments, the curing method includes heat curing or room temperature curing.

[0024] Thirdly, this application also provides a plate-shaped array structure, which is manufactured using the manufacturing method of the plate-shaped array structure as described in the first aspect.

[0025] Fourthly, this application also provides a cylindrical array ultrasonic transducer, which is manufactured using the manufacturing method of the cylindrical array ultrasonic transducer as described in the second aspect.

[0026] This application provides a plate-like array structure, a cylindrical array ultrasonic transducer, and a method for manufacturing the same. A stacked structure is provided, comprising a piezoelectric layer and a matching layer stacked along a first direction. Multiple first grooves, second grooves, and array elements extending along a second direction are formed in the stacked structure to obtain the plate-like array structure. The multiple first grooves and multiple array elements are alternately arranged along a third direction. The second groove is located at the outermost ends of the array elements along the third direction, and the first groove and the second groove penetrate the piezoelectric layer and extend to the matching layer in the first direction. The size of the second groove in the third direction is half the size of the first groove in the third direction. The second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction. This application reduces process complexity, lowers costs, and improves product yield. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic flowchart of a method for manufacturing a plate array structure provided in an embodiment of this application.

[0029] Figures 2 to 7 This is a schematic diagram of the manufacturing method of the plate array structure provided in the embodiments of this application.

[0030] Figures 8 to 11 This is a schematic diagram of the manufacturing method of the cylindrical array ultrasonic transducer provided in the embodiments of this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] To enable any person skilled in the art to implement and use this application, the following description is provided. In this description, details are set forth for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be implemented without using these specific details. In other instances, well-known processes will not be described in detail to avoid obscuring the description of the embodiments of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in the embodiments of this application.

[0034] The manufacturing process of cylindrical array ultrasonic transducers typically involves dividing a rectangular plate-shaped laminated structure into several array elements, and then using a molding process to bend and arrange these elements around a central axis to ultimately form the desired cylindrical structure. This laminated structure usually includes piezoelectric layers and matching layers. The molding process is the key technical step in realizing the cylindrical array and also the main challenge in the entire manufacturing process.

[0035] Currently, the element seams are formed by cutting along the matching layer towards the piezoelectric layer. This cutting method results in a specific structure for the formed cylindrical array: on the inner side (proximal end) near the central axis of the cylinder, adjacent elements are usually connected and not completely cut off; while on the outer side (distal end) away from the central axis, adjacent elements are completely separated and disconnected. Thus, the forming process of this cylindrical array ultrasonic transducer has revealed several inherent defects in practice: for example, the physical seam gaps between adjacent elements on the formed cylinder (especially at the outer disconnection point) differ significantly from the acoustic or electrical isolation gaps required by the design. The gap width between different elements is difficult to control precisely, leading to inconsistent gap sizes along the circumference or axial direction of the cylinder, affecting the uniformity of array performance. Because the elements are disconnected from each other on the outer layer (distal end) of the cylinder, an additional insulating protective layer must be added to the outer surface of the formed cylinder to ensure electrical safety and prevent short circuits, increasing process complexity and cost. When array elements are electrically connected to flexible printed circuit boards (FPCs) or other external circuits, especially in the connection area or gaps near the center of the array element, the stability and reliability of the connection are difficult to guarantee. Therefore, these defects severely restrict the performance consistency, manufacturing yield, and long-term reliability of cylindrical array ultrasonic transducers.

[0036] The following description, in conjunction with the accompanying drawings, illustrates the plate array structure, cylindrical array ultrasonic transducer, and their manufacturing method of this application in order to address the aforementioned problems.

[0037] Reference Figures 1 to 7 As shown, Figure 1 This is a schematic flowchart of a method for manufacturing a plate-shaped array structure provided in an embodiment of this application. Figures 2 to 7 This is a schematic diagram of a manufacturing method for a plate-shaped array structure provided in an embodiment of this application, such as... Figure 1 As shown, the manufacturing method of the plate-shaped array structure includes the following steps:

[0038] S100, Provide a stacked structure; the stacked structure includes a piezoelectric layer 1 and a matching layer 2 stacked along a first direction;

[0039] S200, In the stacked structure, a plurality of first grooves K1, second grooves K2 and array elements 11 extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves K1 and the plurality of array elements 11 are alternately arranged along a third direction, the second groove K2 is located at the outermost of the array elements 11 at both ends along the third direction, and the first grooves K1 and the second grooves K2 penetrate the piezoelectric layer 1 and extend to the matching layer 2 in the first direction, and the size of the second groove K2 in the third direction is equal to half the size of the first groove K1 in the third direction;

[0040] Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

[0041] In specific examples of this application, there is an angle between the first direction and the second direction, and an angle between the third direction and the plane containing the first and second directions, wherein the angle is less than or equal to 90 degrees. For example, in some embodiments of this application, the first direction is set as the Z-axis direction, the second direction as the Y-axis direction, and the third direction as the X-axis direction.

[0042] The laminated structure includes a piezoelectric layer 1 and a matching layer 2. The piezoelectric layer 1 may be made of materials with excellent piezoelectric properties, such as piezoelectric ceramics, piezoelectric composites, piezoelectric single crystals, polymer piezoelectric sheets, or polymer-piezoelectric ceramic composites. The piezoelectric layer 1 has a first surface (lower surface) and a second surface (upper surface) disposed opposite to each other along a first direction.

[0043] Matching layer 2 is a dielectric layer. The material of matching layer 2 can be, for example, an epoxy resin composite doped with nano-metal oxides (such as strontium titanate). That is, matching layer 2 can be an epoxy resin layer or an epoxy resin composite layer doped with nano-metal oxides. Matching layer 2 has a first surface (lower surface) and a second surface (upper surface) disposed opposite to each other along a first direction.

[0044] On a substrate (not shown in the figure), a piezoelectric layer 1 and a matching layer 2 are sequentially deposited along a first direction, with the matching layer 2 directly deposited on the upper surface (the side away from the substrate) of the piezoelectric layer 1. Therefore, the stacked structure, from bottom to top along the first direction, is: substrate, piezoelectric layer 1, and matching layer 2. Figure 2 and Figure 3 As shown, for example, using precision machining processes (e.g., photolithography combined with reactive ion etching, laser cutting, or precision diamond scribing), a series of parallel grooves are cut along the second direction from the upper surface of the piezoelectric layer 1 to the matching layer 2 on the above-mentioned stacked structure, resulting in grooves. These grooves include multiple first grooves K1 with a dimension (i.e., width) a along the third direction, and two second grooves K2 with a dimension (i.e., width or groove width) a / 2 along the third direction, with the second grooves K2 located on the outermost side of the arrangement along the third direction. All grooves (first grooves K1 and second grooves K2) completely penetrate the piezoelectric layer 1 along the first direction (Z-axis direction) and extend into the matching layer 2 above it to a certain depth. Thus, multiple independent, strip-shaped array elements 11 are formed in the third direction (X-axis direction), and these array elements 11 are separated by the first grooves K1. The cut plate-like array structure is as follows: Figures 4 to 7As shown, the spacing between the middle array elements 11, i.e., the groove width of the first groove K1, is a. The outer sides of the two array elements 11 are left with a matching layer 2 of length a / 2, forming a second groove K2 with a groove width of a / 2, for mutual support during cylindrical array formation. Both the first groove K1 and the second groove K2 penetrate the piezoelectric layer 1 but not the matching layer 2. This allows the matching layer 2 to bend at these points when the plate-like array structure is bent into a cylindrical shape, guided by the first groove K1 and the second groove K2.

[0045] Specifically, multiple first grooves K1 and multiple array elements 11 are arranged alternately along the third direction (X-axis direction). For example: array element 111 - first groove K11 - array element 112 - first groove K12 - array element 113 - ... - first groove K1(N-1) - array element 11N. At both ends of the array arranged along the third direction, that is, at the outermost edge (negative X-direction side) of the first array element 11 (array element 111) and the outermost edge (positive X-direction side) of the last array element 11 (array element 11N). Therefore, the complete plate-shaped array structure is arranged in the third direction as follows: second groove K21 - array element 111 - first groove K11 - array element 112 - ... - first groove K1(N-1) - array element 11N - second groove K22.

[0046] This application forms a second groove K2, half the width of the first groove K1, by etching the outermost edge of the edge array element 11. This provides a controllable, partially isolated boundary for the outer side of the edge array element 11. The second groove K2 retained at both ends of the array element 11 is used to simulate the first groove K1 of the middle array element 11, making the cylindrical joint gap formed by the two ends of the array element 11 consistent with the gap of the middle array element 11, i.e., the first groove K1. This significantly improves the performance difference problem caused by the asymmetric boundary conditions of the edge array element 11 in traditional designs. This application makes the acoustic characteristics of the edge array element 11 closer to those of the center array element 11, thereby improving the uniformity, symmetry, and beamforming quality of the entire array sound field, ultimately resulting in superior and more consistent ultrasonic imaging performance. In addition, both the first groove K1 and the second groove K2 penetrate the piezoelectric layer 1 and extend into the matching layer 2, providing good acoustic and mechanical isolation between the array elements 11. This helps suppress stray vibrations caused by boundary asymmetry, reduces crosstalk, and helps reduce acoustic reflection at the interface between the piezoelectric layer 1 and the matching layer 2 at the groove location, improving the overall bandwidth and sensitivity of the transducer.

[0047] In some embodiments, such as Figure 4As shown, both the first groove K1 and the second groove K2 are grooves of equal width at the top and bottom. Specifically, a straight-edged diamond saw blade or laser cutting head with a specific width (e.g., corresponding to the required width of the first groove K1) can be used to cut along the second direction to form multiple parallel first grooves K1 and second grooves K2. The cut penetrates the piezoelectric layer 1 and extends into the underlying matching layer 2 to a certain depth. The multiple first grooves K1 and the multiple array elements 11 are arranged alternately along the third direction (X-axis direction). That is, after cutting, the piezoelectric / matching layer 2 material block between adjacent grooves constitutes one array element 11. Furthermore, the width of the saw blade or laser beam used to cut the second groove K2 is set to half the width used to cut the first groove K1, such that the dimension (groove width) of the second groove K2 in the third direction is equal to half the dimension of the first groove K1 in the third direction, as shown below. Figure 4 As shown, the dimension of the first groove K1 in the third direction is a, and the dimension of the second groove K2 in the third direction is a / 2. After cutting, the resulting structure is the required plate-shaped array structure: the array element 11 is composed of a piezoelectric layer 1 and a partially matched layer 2, separated by the first groove K1 and the second groove K2 in the third direction.

[0048] This application can be completed using standard straight-blade cutting tools (such as diamond saw blades), the process is mature, the equipment cost is relatively low, the cutting speed is fast, and it is easy to achieve mass production. In addition, using straight-blade cutting can ensure that the groove wall is vertical, and the groove width is precisely controlled by the tool size, which can obtain good consistency and repeatability, and is conducive to ensuring the uniformity of the size of the array element 11. The first groove K1 and the second groove K2 formed by this application have a relatively uniform mechanical stress distribution (compared to the narrower groove), and are less likely to generate stress concentration points at the bottom or wall of the groove, which would lead to structural damage.

[0049] In some embodiments, such as Figure 5 As shown, both the first groove K1 and the second groove K2 are tapered grooves, wider at the top and narrower at the bottom. Specifically, a diamond saw blade (V-shaped blade) with a specific taper angle is used, or the focusing / scanning path of the laser beam is controlled (e.g., using a tapered laser beam or tilting scan), or a wet / dry etching process with lateral etching capability is employed. Multiple parallel, tapered (e.g., V-shaped or trapezoidal) first grooves K1 and second grooves K2 are formed by cutting along the second direction. The groove opening is widest at the upper surface of the piezoelectric layer 1 and gradually narrows downwards (towards the matching layer 2). The cut penetrates the piezoelectric layer 1 and extends into the matching layer 2. The cutting tool or process parameters are controlled such that the opening width of the second groove K2, measured at the upper surface of the piezoelectric layer 1, is equal to half the opening width of the first groove K1. Since both the first groove K1 and the second groove K2 are tapered grooves, wider at the top and narrower at the bottom, the width of the groove bottom (near the matching layer 2) is smaller than the width of the groove top, but the taper angle or narrowing ratio of each first groove K1 and each second groove K2 is the same.

[0050] The first groove K1 and the second groove K2 in this application are both tapered grooves, wider at the top and narrower at the bottom. This provides a "dovetail" effect for the acoustic damping material (such as backing material or a specific polymer) subsequently filled into the grooves, significantly improving the mechanical locking force between the filling material and the groove walls (especially the piezoelectric material sidewalls), effectively preventing the filling material from falling out of the grooves during subsequent processing or use. Furthermore, it ensures more adequate electrical isolation for the array element 11 at the top (near the electrode surface), reducing crosstalk between adjacent array elements 11. Avoiding right-angle corners more effectively disperses stress concentration generated at the groove root (near the junction of piezoelectric layer 1 and matching layer 2) during cutting or operation, reducing the risk of structural cracking and improving the mechanical reliability of the device. Moreover, the tapered shape of the grooves is beneficial for guiding sound waves or optimizing the sound field. The wide top groove ensures good electrical isolation, while the narrow bottom groove retains more matching layer 2 material, which helps maintain the integrity and strength of the bottom structure.

[0051] In some embodiments, such as Figure 6 and Figure 7 As shown, both the first groove K1 and the second groove K2 are multi-layered stepped grooves that are wider at the top and narrower at the bottom. Specifically, multi-step cutting or etching is performed on the stacked structure to form multi-layered stepped grooves that are wider at the top and narrower at the bottom. Straight blades or laser beams of different widths can be used to perform multiple cuts along the second direction. For example, a shallower top-layer stepped groove is first cut with a wider blade, then a deeper next-layer stepped groove is cut with a narrower blade, and so on, ultimately forming a stepped groove with multiple decreasing width steps.

[0052] Alternatively, photoresist can be coated onto the surface of piezoelectric layer 1, and then exposed and developed using a photomask to form a pattern with stepped openings. Then, anisotropic etching (such as reactive ion etching, RIE) or controlled-depth wet etching can be used to form multi-layered stepped grooves penetrating piezoelectric layer 1 in steps or in a single operation. This method offers high precision and is particularly suitable for microarrays.

[0053] This application controls the width of each cut or the pattern size of the photolithography / etching to ensure that the opening width of the top layer of the second groove K2, measured on the upper surface of the piezoelectric layer 1, is equal to half the opening width of the top layer of the first groove K1. The stepped grooves cause the widths of the first groove K1 and the second groove K2 to decrease in a stepped manner as the depth (the distance along the first direction towards the matching layer 2) increases.

[0054] The first groove K1 and the second groove K2 in this application are both stepped grooves, wider at the top and narrower at the bottom. This provides a larger "locking" surface area and more complex geometric interlocking than conical grooves, optimizing the anchoring effect of the filler material (especially high-viscosity or particulate-filled backing materials), greatly preventing filler material detachment and improving long-term reliability. Furthermore, the multi-layered stepped grooves effectively disperse stress across multiple step transition points, avoiding severe stress concentration at a single depth, significantly improving the crack resistance and fatigue life of the structure (especially the piezoelectric layer 1). The multi-layered stepped grooves also allow for more precise control of the reflection and scattering characteristics of sound waves at the edge of the array element 11, providing additional design freedom for optimizing the transducer's acoustic field (such as sidelobe suppression and impulse response).

[0055] Reference Figures 2 to 11 As shown, Figures 2 to 11 This is a schematic diagram of a manufacturing method for a plate-shaped array structure provided in an embodiment of this application. The manufacturing method includes the following steps:

[0056] S100, Provide a stacked structure; the stacked structure includes a piezoelectric layer 1 and a matching layer 2 stacked along a first direction;

[0057] S200, In the stacked structure, a plurality of first grooves K1, second grooves K2 and array elements 11 extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves K1 and the plurality of array elements 11 are alternately arranged along a third direction, the second groove K2 is located at the outermost of the array elements 11 at both ends along the third direction, and the first grooves K1 and the second grooves K2 penetrate the piezoelectric layer 1 and extend to the matching layer 2 in the first direction, and the size of the second groove K2 in the third direction is equal to half the size of the first groove K1 in the third direction;

[0058] Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

[0059] S300. The plate array structure is attached to the outer wall of the supporting cylindrical tube 3 to obtain a cylindrical array ultrasonic transducer.

[0060] Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

[0061] Specifically, continuing from the above Figures 1 to 7 In the corresponding embodiments, this application will Figures 1 to 7The corresponding embodiment manufactures a plate-shaped array structure, which is then bent and attached to the outer wall of the supporting cylindrical tube 3, and fixed to obtain a cylindrical array ultrasonic transducer. The supporting cylindrical tube 3 can be made of materials such as titanium alloy, 316L stainless steel, or zirconia ceramic, with titanium alloy being preferred. After bending, each array element 11 is arc-shaped, with its axial midpoint tangentially contacting the inner supporting cylindrical tube 3, while the two ends of the array element 11 are relatively suspended, so that all array elements 11 form a regular polygon around the supporting cylindrical tube 3, and the gaps between the array elements 11 are of uniform size and evenly distributed.

[0062] This application cuts a first groove K1 and a second groove K2 at the centerline of the reserved area between two adjacent array elements 11 to ensure that the matching layer 2 in the reserved area is not completely cut through. In this way, during the subsequent bending of the plate-like array structure into a cylindrical shape, the first groove K1 and the second groove K2 can guide the matching layer 2 to bend and deform preferentially and accurately at this location. After bending, each array element 11 presents an arc shape, with its axial midpoint tangentially contacting the internal supporting cylindrical tube 3, while the two ends of the array element 11 are relatively suspended. The continuous matching layer 2 left uncut can cover the gaps between all array elements 11, allowing all array elements 11 to be closely arranged around the supporting cylindrical tube 3, ultimately forming a regular polygonal outline (approximately circular). This ensures that the gap width between adjacent array elements 11 remains highly consistent and evenly distributed throughout the circumference. Since the matching layer 2 material itself is insulating, after bending, the remaining continuous matching layer 2 naturally forms a continuous insulating shell. This eliminates the need for an additional insulating layer coating process, saving manufacturing costs for the cylindrical array ultrasonic transducer. Furthermore, when the plate-like array structure is rolled into a cylinder, the outer matching layer 2 is stretched, generating inward contraction stress. Moreover, due to the elastic film properties of the incomplete matching layer 2, it forms a pre-stressed contraction state after bending. Thus, the radial pressure generated by the deformation of the continuous matching layer 2 during bending can tightly press the array element 11 against the internal supporting cylindrical tube 3, increasing the pressure at the contact surface between the electrodes of the array element 11 and the flexible circuit, significantly improving the reliability of electrical conduction. In summary, this application reuses the incomplete, continuous matching layer 2 as an insulating layer after bending and shaping, and utilizes the mechanical binding effect generated by its bending deformation to reduce the manufacturing process of the cylindrical array ultrasonic transducer, saving costs and improving production efficiency while simultaneously enhancing the reliability of electrical conduction.

[0063] like Figure 4 and Figure 8 As shown, after cutting, it will be as follows Figure 4The plate-like array structure shown is placed in a molding device, and then adhesive, including but not limited to epoxy, is applied to the outside or outer wall of the supporting circular tube 3. The adhesive-coated supporting circular tube 3 is inserted into the center of the plate-like array structure forming a ring, aligning the upper and lower edges. The diameter of the plate-like array structure forming the ring is reduced using the molding device until the bent plate-like array structure is tightly clamped onto the supporting circular tube 3. After the epoxy adhesive cures by heating or at room temperature, it forms a structure resembling... Figure 8 The cylindrical array ultrasonic transducer shown.

[0064] like Figure 5 and Figure 9 As shown, after cutting, it will be as follows Figure 5 The plate-like array structure shown is placed in a molding device, and then adhesive, including but not limited to epoxy, is applied to the outside or outer wall of the supporting circular tube 3. The adhesive-coated supporting circular tube 3 is inserted into the center of the plate-like array structure forming a ring, aligning the upper and lower edges. The diameter of the plate-like array structure forming the ring is reduced using the molding device until the bent plate-like array structure is tightly clamped onto the supporting circular tube 3. After the epoxy adhesive cures by heating or at room temperature, it forms a structure resembling... Figure 9 The cylindrical array ultrasonic transducer shown.

[0065] like Figure 6 and Figure 10 As shown (or as shown) Figure 7 and Figure 11 As shown in the image), after cutting, it will look like this. Figure 6 or Figure 7 The plate-like array structure shown is placed in a molding device, and adhesive, including but not limited to epoxy adhesive, is applied to the outside of the supporting circular tube 3. The adhesive-coated supporting circular tube 3 is inserted into the center of the plate-like array structure forming a ring, aligning the upper and lower edges. The diameter of the plate-like array structure forming the ring is reduced using the molding device until the bent plate-like array structure is tightly clamped onto the supporting circular tube 3. After the epoxy adhesive has cured by heating or at room temperature, the molding device is removed, forming a structure as shown. Figure 10 (or Figure 11 The cylindrical array ultrasonic transducer shown in the figure.

[0066] In some embodiments, the process of forming a cylindrical array ultrasonic transducer by surrounding and adhering the plate-shaped array structure to the outer wall of the supporting circular tube 3 includes:

[0067] The plate-shaped array structure is rolled into a cylindrical shape, so that the second grooves K2 at both ends of the plate-shaped array structure are connected to each other;

[0068] The piezoelectric layer 1, which is rolled into a cylindrical plate array structure, is attached around a support tube 3 coated with adhesive, and after curing, it forms the cylindrical array ultrasonic transducer.

[0069] Specifically, after the layered structure is cut to form a plate array, an adhesive is uniformly coated on the outer wall of the supporting cylindrical tube 3. Then, the plate array structure is rolled into a cylindrical shape so that the edges of adjacent grooves (the first groove K1 and the second groove K2) are precisely aligned. The piezoelectric layer 1 is tightly attached to the outer wall of the adhesive-coated supporting cylindrical tube 3. After curing, a cylindrical array ultrasonic transducer is obtained.

[0070] In some embodiments, the adhesive is epoxy resin. Specifically, the epoxy resin has strong adhesion to the supporting circular tube 3 and the piezoelectric layer 1, ensuring that the array element 11 does not detach under curling stress. Moreover, the epoxy resin can resist the corrosion of coupling agents (such as silicone oil) in ultrasonic testing, avoiding adhesive layer failure after long-term use.

[0071] In some embodiments, the curing method includes heat curing or room temperature curing. Specifically, it can be placed in an 80°C oven for 2 hours to accelerate the crosslinking of the epoxy adhesive. This application uses heat curing to shorten the production cycle (12 times faster than room temperature curing), making it suitable for mass production. Alternatively, it can be left to stand at 25°C for 24 hours for natural curing. This application uses natural curing to avoid high-temperature damage to heat-sensitive materials (such as certain polymer matching layers 2) and reduce energy consumption.

[0072] This application also provides a plate-shaped array structure, which is used in, for example... Figures 1 to 7 The aforementioned plate-shaped array structure is manufactured using a specific method.

[0073] This application also provides a cylindrical array ultrasonic transducer, which is used in applications such as... Figures 11 to 12 The cylindrical array ultrasonic transducer is manufactured using the aforementioned method.

[0074] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts not described in detail in a particular embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process and beneficial effects of the data acquisition system and its corresponding units described above can be found in the description of the manufacturing method of the cylindrical array ultrasonic transducer in the above embodiments, and will not be repeated here.

[0075] The foregoing has provided a detailed description of a plate array structure, a cylindrical array ultrasonic transducer, and a method for manufacturing the same, as provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, those skilled in the art will recognize that there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a plate-shaped array structure, characterized in that, Including the following steps: A stacked structure is provided; the stacked structure includes a piezoelectric layer and a matching layer stacked along a first direction; In the stacked structure, a plurality of first grooves, second grooves and array elements extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves and the plurality of array elements are alternately arranged along a third direction, the second groove is located at the outermost of the array elements at both ends along the third direction, and the first groove and the second groove penetrate the piezoelectric layer and extend to the matching layer in the first direction, and the size of the second groove in the third direction is equal to half the size of the first groove in the third direction; Wherein, the first groove and the second groove are both cut grooves that are wider at the top and narrower at the bottom; the second direction is perpendicular to the third direction, and the first direction is perpendicular to the second direction and the third direction; when the plate array structure is bent into a cylindrical shape, the matching layer is guided to bend through the first groove and the second groove, and the second groove of the two end array elements is used to simulate the first groove of the middle array element, so that the cylindrical joint gap formed by the two end array elements is consistent with the gap of the middle array element.

2. The method for manufacturing the plate-shaped array structure according to claim 1, characterized in that, Both the first groove and the second groove are V-shaped cuts that are wider at the top and narrower at the bottom.

3. The method for manufacturing the plate-shaped array structure according to claim 1, characterized in that, Both the first groove and the second groove are trapezoidal grooves that are wider at the top and narrower at the bottom.

4. The method for manufacturing the plate-shaped array structure according to claim 1, characterized in that, Both the first groove and the second groove are multi-layered stepped grooves that are wider at the top and narrower at the bottom.

5. A method for manufacturing a cylindrical array ultrasonic transducer, characterized in that, Including the following steps: A stacked structure is provided; the stacked structure includes a piezoelectric layer and a matching layer stacked along a first direction; In the stacked structure, a plurality of first grooves, second grooves and array elements extending along a second direction are formed to obtain a plate-shaped array structure; the plurality of first grooves and the plurality of array elements are alternately arranged along a third direction, the second groove is located at the outermost of the array elements at both ends along the third direction, and the first groove and the second groove penetrate the piezoelectric layer and extend to the matching layer in the first direction, and the size of the second groove in the third direction is equal to half the size of the first groove in the third direction; Wherein, the first groove and the second groove are both cut grooves that are wider at the top and narrower at the bottom; when the plate array structure is bent into a cylindrical shape, the matching layer is guided to bend through the first groove and the second groove, and the second groove of the two end array elements is used to simulate the first groove of the middle array element, so that the cylindrical joint gap formed by the two end array elements is consistent with the gap of the middle array element. The plate-shaped array structure is attached to the outer wall of the supporting cylindrical tube to obtain a cylindrical array ultrasonic transducer. Wherein, the second direction is perpendicular to the third direction, and the first direction is perpendicular to both the second direction and the third direction.

6. The method for manufacturing a cylindrical array ultrasonic transducer according to claim 5, characterized in that, The method of forming a cylindrical array ultrasonic transducer by surrounding and adhering the plate-shaped array structure to the outer wall of the supporting cylindrical tube includes: The plate-shaped array structure is rolled into a cylindrical shape, so that the second grooves at both ends of the plate-shaped array structure are connected to each other; The piezoelectric layer of the plate-like array structure, rolled into a cylindrical shape, is attached around a support tube coated with adhesive, and after curing, it forms the cylindrical array ultrasonic transducer.

7. The method for manufacturing a cylindrical array ultrasonic transducer according to claim 6, characterized in that, The adhesive is epoxy resin.

8. The method for manufacturing a cylindrical array ultrasonic transducer according to claim 6, characterized in that, The curing method includes heat curing or room temperature curing.

9. A plate-shaped array structure, characterized in that, The plate array structure is manufactured using the manufacturing method of the plate array structure as described in any one of claims 1-4.

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