Key structure of keyboard and manufacturing method thereof

Abstract

The application relates to the technical field of key structures of keyboards, and provides a key structure of a keyboard and a manufacturing method thereof. The key structure comprises a key cap body with a groove, a plurality of solder pads are embedded in the groove, at least one LED chip is arranged in the groove, the LED chip has a light emitting surface and a plurality of side light emitting surfaces, and the LED chip is electrically connected to the solder pads through solder wires; a first encapsulation body covers the LED chip, and the thickness of the first encapsulation body is not less than the wire arc height of the solder wires; a second encapsulation body covers the first encapsulation body and fills the groove; a first light shielding sheet is pressed against the surface of the second encapsulation body and does not protrude out of the groove; a second light shielding sheet is provided with a plurality of hollow through holes, is pressed against the surface of the first light shielding sheet, and the size of the second light shielding sheet is not less than that of the first light shielding sheet. Therefore, the encapsulation stability of the LED light emitting chip and the integration of the key module can be improved, the light export path can be effectively controlled, light dissipation can be avoided, and the key backlight quality can be improved.

Description

Technical Field

[0001] This invention relates to the field of keyboard key structure technology, and in particular to a keyboard key structure and its manufacturing method. Background Technology

[0002] Current keyboards, especially gaming keyboards or mechanical keyboards, widely adopt a backlit structure located at the bottom of the keyboard to improve the convenience and aesthetics of nighttime operation. For example... Figure 1 As shown, a common practice is to install a backlight module 20 below the keyboard module 10, and use a transparent material or light guide mechanism under the keys to transmit light to the key surface. More specifically, as... Figure 2 As shown, the backlight module 20 is typically integrated on a printed circuit board and may include a light guide layer 21 and a reflective layer 22 to guide the LED chip (solid-state semiconductor device) 30 located below to form a backlight source, and is embedded between the keyboard cover 12 and the keyboard base 13 of the keyboard module 10. The light emitted by the LED chip 30, in addition to being guided by the light guide layer 21 and the reflective layer 22, also needs to pass through or penetrate the keyboard cover 12 located below the keycaps 11. Therefore, this type of structural design typically has the following problems:

[0003] Firstly, because the LED light source is far from the keycap character area, the light needs to be transmitted through multiple structural layers, including support pillars, light guide layers, and even reflective layers, resulting in a complex light path. Some light energy is lost in the intermediate medium, making it difficult to achieve a uniform brightness and clear contrast lighting effect.

[0004] Secondly, in order to achieve RGB (color standard) multi-color light source, the traditional bottom light-emitting structure needs to be paired with a complex light guide plate or lens design, which increases the structural thickness, reduces the button response sensitivity, and is not conducive to thin design. At the same time, in actual use, uneven light diffusion may cause uneven brightness in the button area, affecting the visual experience.

[0005] Third, mechanical keyboards generally use a replaceable keycap structure, but when the LED is set at the bottom, the material and shape of different keycaps have a significant impact on the light effect. Especially with high keycaps or non-homogeneous keycaps, light-emitting dead corners or light leakage are more likely to occur, reducing the overall light quality.

[0006] Therefore, simplifying the light source path structure, reducing light loss, and improving light emission consistency and packaging reliability have become important issues in the design of keyboard backlight structures. Summary of the Invention

[0007] The purpose of this invention is to overcome the problems of complex optical paths, significant light effect attenuation, large structural thickness, and poor light emission uniformity in existing keyboard backlight structures, and to provide a keyboard key structure and its manufacturing method that is compact, has uniform light effect, stable packaging, and precise light shielding, which is suitable for various backlit keyboard application scenarios such as mechanical keyboards and gaming keyboards.

[0008] To achieve the above objectives, this invention proposes a key structure for a keyboard, the technical solution of which includes:

[0009] The keycap body has grooves, and multiple solder pads are embedded in the grooves;

[0010] At least one LED chip is disposed in the groove. The LED chip includes a light-emitting surface and multiple side-light-emitting surfaces, and multiple bonding wires extend from the light-emitting surface and are electrically connected to the bonding pad.

[0011] The first package encapsulates the LED chip, and its thickness is not less than the arc height of the bonding wire to prevent the bonding wire from being exposed and damaged.

[0012] The second package covers the first package and fills the entire recess, providing additional mechanical strength and optical stability;

[0013] The first light-shielding sheet is pressed onto the surface of the second package and does not protrude beyond the groove, forming a flat keycap structure; and

[0014] The second light-shielding sheet is pressed onto the surface of the first light-shielding sheet. The surface of the second light-shielding sheet has multiple hollow through holes, the positions of which correspond to the light-emitting paths of the LEDs. The size of the second light-shielding sheet is not smaller than the size of the first light-shielding sheet.

[0015] It is understandable that this application uses a keycap as a chip package, so the overall assembly does not need to consider the packaging thickness of the LED chip, making the structure more flexible and controllable and reducing the structural thickness.

[0016] Preferably, the light transmittance of the light shield is designed differently to optimize the light output direction and brightness distribution; the first package may contain photoluminescent material to enhance the diffusion of residual light and maintain brightness; the second light shield may also be provided with multiple positioning structures to improve the assembly accuracy and consistency between the second light shield and the keycap body.

[0017] Furthermore, the present invention also provides a method for manufacturing a key structure, specifically including: providing a keycap body with a groove, embedding multiple solder pads; setting at least one LED chip in the groove, the LED chip including a light-emitting surface and multiple side-light-emitting surfaces; forming multiple bonding wires from the light-emitting surface, such that the bonding wires are electrically connected to the solder pads; forming a first package, such that the thickness of the first package is not less than the arc height of the bonding wires, to cover the LED chip; forming a second package, covering the first package and filling the groove; pressing a first light-shielding sheet onto the second package, ensuring that the first light-shielding sheet does not protrude outside the groove; and pressing a second light-shielding sheet having multiple hollow through holes onto the surface of the first light-shielding sheet, wherein its size is not less than the size of the first light-shielding sheet; thus forming the key structure of the keyboard described above. In other words, by setting an LED chip in the groove of the keycap body and connecting it with bonding wires, forming a layered package structure through multiple packaging steps, and finally pressing the first and second light-shielding sheets sequentially, a backlit key structure with precise control of the light-emitting area is formed.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. Improved light efficiency: By directly placing the LED chip in the keycap groove, the light-emitting surface and side light-emitting surface of the LED chip face directly towards the top of the keycap, reducing the light guide structure and achieving upward light emission, which shortens the light path and improves light efficiency and uniformity.

[0020] 2. Strong encapsulation protection: The layered encapsulation structure can effectively protect the bonding wires and chip structure, enhancing the lifespan and reliability of the buttons;

[0021] 3. Precise light blocking: The double-layer light blocking structure combined with the through-hole design enables precise local light emission and clear boundary control, avoiding light pollution;

[0022] 4. Compact structure and mass production capability: The manufacturing process is clear and assembly is simple, making it suitable for various types of backlit keyboard products.

[0023] In summary, the keyboard key structure and its manufacturing method provided by this invention balance structural stability, light emission quality, and manufacturing efficiency, and have good prospects for industrial application. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] in:

[0026] Figure 1 This is a 3D schematic diagram of the key module and backlight module of a traditional keyboard;

[0027] Figure 2 yes Figure 1 A partial cross-sectional view of the keyboard after the key module and backlight module are combined;

[0028] Figure 3 This is a cross-sectional view of the key structure of the keyboard provided in this embodiment of the technical solution;

[0029] Figure 4 This is a cross-sectional view of the first light-shielding sheet provided in a preferred embodiment;

[0030] Figure 5 yes Figure 3 A top view of the second light-shielding plate and its perforated hole;

[0031] Figure 6 This is a partially enlarged view of the combination of the second light-shielding sheet and the keycap body provided in another preferred embodiment;

[0032] Figure 7 This is a cross-sectional view of the keycap body provided in this embodiment of the technical solution;

[0033] Figure 8 yes Figure 7 A top view of the keycap body and its groove;

[0034] Figure 9 This is a top view of the keycap body and its groove provided as a variation example;

[0035] Figure 10 Is Figure 9 A cross-sectional view of the keycap body containing LED chips;

[0036] Figure 11 Is Figure 10 A cross-sectional view showing the LED chip's light-emitting surface forming bonding wires and electrically connecting to the bonding pads;

[0037] Figure 12 This is a cross-sectional view of the first package formed in this embodiment of the technical solution;

[0038] Figure 13 This is a cross-sectional view of the first package formed in a variation example;

[0039] Figure 14 Is Figure 12 A cross-sectional view of the first package covering the second package;

[0040] Figure 15 It is Figure 14 A cross-sectional view of the first light-shielding sheet being pressed onto the second package;

[0041] Figure 16 It is Figure 15 A cross-sectional view of a second light-shielding sheet pressed onto a first light-shielding sheet.

[0042] Explanation of main component symbols

[0043] Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Please see Figure 3 This embodiment of the technical solution provides a keyboard key structure 100. The key structure 100 mainly includes: a keycap body 110, at least one LED chip 130, multiple packages (first package 140, second package 150), and multiple light-shielding sheets (first light-shielding sheet 160, second light-shielding sheet 170), and can be customized and installed on a keyboard base 180 according to user needs. Specifically, the keycap body 110 has a groove 111, and multiple solder pads 112 are embedded within the keycap body 110. The keycap body 110 can be integrally molded from plastic, composite resin, or other materials suitable for keyboard keycap molding, and the groove 111 can be located in the central area or at the polarizing axis position of the keycap body 110, with a certain depth to accommodate the LED chip 130. Preferably, the solder pads 112 are metal conductive pads, formed by processes such as printing, etching, electroplating, or insert injection molding, and pre-connected to flexible circuits or electrode leads. Each solder pad 112 can be used to receive wire bonding connections from the LED chip 130, achieving electrical conductivity. The layout of the solder pads 112 can be designed to be symmetrical or asymmetrical according to the actual needs of the LED chip 130, to match the light-emitting surface 131 of the LED chip 130 and the welding direction. In this embodiment, to improve the thermal stability and electrical reliability of the overall structure, the solder pads 112 can be made of metal materials such as copper, nickel, and gold, and can be selectively covered with a protective layer (such as a solder resist film or passivation layer) to prevent performance degradation caused by overheating or oxidation during the welding process.

[0046] The LED chip 130 is disposed within the groove 111. The LED chip 130 includes a light-emitting surface 131 and multiple side-emitting surfaces 132. The light-emitting surface 131 faces upward, and the side-emitting surfaces 132 radiate outwards. In this embodiment, the LED chip 130 adopts a front-mounted structure, and is bonded to the bottom of the groove 111 or an area without the solder pads 112 (without covering or obscuring the solder pads 112) with its back side using adhesive 120. This ensures that the light-emitting surface 131 of the LED chip 130 faces upward, and multiple bonding wires 133 extend from the light-emitting surface 131 and are electrically connected to the solder pads 112. Furthermore, the light-emitting surface 131 can emit main-direction light vertically towards the top of the keycap, which can penetrate the upper encapsulation material and light-shielding structure to illuminate the key character area. The side-emitting surfaces 132 are distributed on the outer sidewalls of the LED chip 130 to emit lateral or oblique auxiliary light, helping to improve the overall light uniformity and coverage. The bonding wire 133 is typically made of gold wire or alloy fine wire, and can be formed by hot pressing or ultrasonic bonding to create a certain arc and arc height. Generally, the LED chip 130 can be a monochrome, high-brightness chip, or a multi-color chip with an RGB structure can be selected as needed to achieve extended applications of multi-area backlighting or gradient lighting effects. Its wavelength, size, and electrode layout can be designed to match the actual light-emitting requirements and the space of the groove 111.

[0047] The first package 140 encapsulates the LED chip 130, and the thickness of the first package 140 is not less than the arc height of the bonding wire 133, ensuring that the first package 140 can completely cover the bonding wire 133. In this embodiment, the encapsulation material of the first package 140 can be a thermoplastic resin or a thermosetting resin, which has good light transmittance and molding stability. During the encapsulation process, the thickness of the first package 140 is controlled so that it can form a uniform coverage above the LED chip 130 and the bonding wire 133, and its top thickness is not less than the arc height of the bonding wire 133, thereby ensuring that the bonding wire 133 is completely encapsulated, avoiding short circuits, oxidation, or breakage due to external force exposure. Furthermore, to enhance the uniformity of light emission and backlight effect, photoluminescent materials, such as rare-earth-doped phosphors, phosphorescent powders, or polymeric light-emitting particles with blue light excitation response, can be further added to the first package 140. When the LED chip 130 is working, the photoluminescent material inside the first package 140 can absorb some light energy and release auxiliary light again. By absorbing and releasing light again, the duration of light emission is effectively extended and the visual softness of the key structure illumination is improved. Furthermore, the doping concentration, particle size distribution, and dispersion mode of the photoluminescent material can be finely designed according to the required brightness adjustment, color temperature control, and light diffusion angle to meet the personalized requirements of different keyboard models for lighting effects. Specifically, the doping concentration of the photoluminescent material can be adjusted according to different lighting needs. For example, when the keyboard needs to achieve high brightness output, based on the total molar amount of the resin matrix in the first package, a doping concentration of rare earth ions (such as Eu²⁺, Tb³⁺, or Ce³⁺) of 5–8 mol% can be selected to increase the light-emitting center density, thereby obtaining higher photoluminescence efficiency. To achieve a cool white light effect, the doping concentration of Eu²⁺ can be controlled at 1–3 mol%; conversely, to achieve a warm white or yellowish light, the doping concentration of Mn²⁺ can be appropriately increased to 4–6 mol%. In one variation, the particle size distribution of the photoluminescent material can also be designed differently. When the particle size is controlled at 50–100 nm, light scattering loss can be reduced and light transmittance can be improved, making it suitable for thin keycap structures; when the particle size is controlled at 3–5 μm, the light diffusion effect can be enhanced, making the light emission angle more uniform, suitable for larger keys (such as spacebar and enter key); furthermore, a mixed particle size distribution of 100 nm and 2 μm can also be used to balance high brightness and light field uniformity, avoiding local bright spots or dark areas. In another variation, the dispersion mode of the photoluminescent material can also be adjusted according to design requirements. For example, photoluminescent materials can be dispersed in an epoxy resin or silicone matrix, and silane coupling agents can be used to improve the compatibility between the particles and the matrix, preventing aggregation. Targeted dispersion can also be employed, increasing the concentration of luminescent particles in localized areas while maintaining a lower concentration in other areas, thereby enhancing the recognition and visibility of specific buttons.Optionally, the first package 140 fills only a local area within the groove 111 so that the first package 140 can cover the LED chip and bonding wires.

[0048] The second encapsulation body 150 covers the first encapsulation body 140 and fills the groove 111. The first encapsulation body 140 and the second encapsulation body 150 may contain thermoplastic resin or thermosetting resin, and the second encapsulation body 150 does not contain photoluminescent material. The second encapsulation body 150 covers the exterior of the first encapsulation body 140 and further fills the void area of ​​the groove 111, thereby substantially filling the groove 111 and effectively improving the overall structural strength and sealing performance. In a preferred embodiment, the second encapsulation body 150 can be formed by secondary injection, potting, or transfer printing, preferably using transparent or translucent thermoplastic or thermosetting resins, such as optical-grade silicone, PU (polyurethane) material, acrylic resin, epoxy encapsulation materials, etc., which have good mechanical strength, light transmittance, and environmental adaptability. In particular, unlike the first package 140, the second package 150 does not contain photoluminescent materials. This design ensures that the main light source can be controlled to be excited between the first package 140 and the LED chip 130, avoiding light color shift or stray light emission.

[0049] The first light-shielding sheet 160 is pressed onto the second package 150 and does not protrude beyond the groove 111. That is, the upper surface of the first light-shielding sheet 160 is substantially flush with or slightly lower than the edge of the groove 111, thereby maintaining the flatness of the keycap body 110 surface visually and tactilely, preventing accidental touches or affecting the keycap assembly height due to protrusion. The first light-shielding sheet 160 is preferably made of a low-transmittance material, such as a surface-treated black PET film, polyimide sheet, black epoxy sheet, or other light-shielding materials with UV resistance and heat resistance. Its main function is to regulate the light emitted from the LED chip 130, preventing light from scattering to non-target areas, thereby enhancing the recognizability and contrast of key patterns or characters. In a preferred embodiment, such as... Figure 4As shown, since the side profile of the first light-shielding sheet 160 is smaller than the inner wall profile of the groove 111, after fitting, a tiny gap 113 is formed between its side surface and the side wall of the groove 111. The gap 113 can play the following roles: (1) Prevent stress concentration during the press-fitting process and avoid warping and deformation caused by thermal expansion and contraction or material warping; (2) Improve packaging compatibility and allow smooth installation of light-shielding sheets of different batches within the tolerance range; (3) Allow light to leak from the gap 113 to form different light paths. If necessary, light-transmitting materials of different colors can also be filled in the gap 113 to further adjust the light color. Specifically, most of the light emitted by the LED chip 130 will be blocked by the first light-shielding sheet 160 during transmission, and only part of the light can pass through the gap 113 and emit. Through the structural design of the gap 113, on the one hand, it can effectively reduce the overall brightness of the emitted light and avoid excessive glare; on the other hand, with the geometric limitation of the gap 113, the transmitted light can form a specific light-emitting profile. For example: when the gap 113 is arranged in a rectangular surround, the light-transmitting light will present a light-emitting pattern similar to a "square" shape, thus achieving a unique visual effect and recognition.

[0050] The second light-shielding sheet 170 having a plurality of hollow through-holes 171 is press-fitted on the surface of the first light-shielding sheet 160. Preferably, the contour size of the second light-shielding sheet 170 is not less than that of the first light-shielding sheet 160, so that the second light-shielding sheet 170 can completely cover the first light-shielding sheet 160, avoiding edge light transmission or misalignment, and ensuring a unified appearance and functional performance of the entire key light-emitting area. Specifically, the second light-shielding sheet 170 is a sheet-like structure, and its material can be selected from black films with low light transmittance, matte polyimide, polyester sheets coated with ink layers, or other laminated materials with light-shielding and heat-resistant properties. Its main function is to further block or limit the light direction and precisely control the light-emitting path through the hollow through-holes 171. As Figure 5 shown, the positions of the hollow through-holes 171 correspond to the light-emitting areas of the LED chips below. The hollow through-holes 171 can be designed in the form of letters, for example: the letter O, and specifically can be a grid structure to present the required light-emitting pattern or character effect. In this embodiment, the overall light transmittance of the second light-shielding sheet 170 can be controlled between 1% and 5% to ensure that the area other than the hollow through-holes 171 is basically light-impermeable, thereby blocking the light path. When the light transmittance is less than 5%, the character contrast is increased by 40%. And the light transmittance of the hollow through-holes 171 can be further controlled between 0% and 1%, so that a small amount of light can pass through the gaps of the hollow through-holes 171, and most of the light will be blocked by the solid parts of the hollow through-holes 171 where no gaps are formed, thereby producing a locally high-contrast light-emitting effect. The light transmittance of the second light-shielding sheet 170 is not greater than that of the first light-shielding sheet 160. In a preferred embodiment, as Figure 6 As shown, to improve the positioning accuracy and assembly stability of the second light-shielding plate 170, multiple positioning pins 172 can be provided on the second light-shielding plate 170. The number, shape, and distribution of the positioning pins 172 can be designed and matched according to the preset mating holes 114 in the keycap body 110. Specifically, the positioning pins 172 can be inserted into the mating holes 114 using a snap-fit ​​or interference fit structure to form a stable connection and prevent the light-shielding plate from shifting or warping due to thermal expansion and contraction or long-term use. Optionally, the positioning pins 172 are cylindrical protrusions, and the positioning pins 172 are inserted into the mating holes 114 through mating. In addition, with this structural design, users can replace or repair the second light-shielding plate 170 at any time according to their own needs, thereby adjusting its pattern or characters. With the configuration of a double-layer light-shielding sheet structure, and the second light-shielding sheet 170 providing the definition of the light-emitting window, enhancing the light-shielding control and positioning fixation, the optical performance, structural consistency and assembly efficiency of the entire button structure are effectively improved. It is suitable for modular application scenarios of high-brightness, multi-color or patterned backlit buttons.

[0051] This technical solution embodiment provides a method for manufacturing a keyboard key structure 100, including the following steps:

[0052] First, please refer to Figure 7 A keycap body 110 with grooves 111 is provided, and multiple solder pads 112 are embedded therein. In this embodiment, a metal support (not shown in the figure) is embedded in the keycap body 110, and the keycap body 110 directly serves as the encapsulation material for the metal support, protecting the metal support and exposing the solder pads 112, providing a window for external electrical connection. The metal support may be located at the center of the keycap body 110, and the metal support is electrically connected to the solder pads 112. Furthermore, as... Figure 8 As shown, the groove 111 is pre-formed in the central region of the keycap body 110 and is rectangular. Alternatively, as... Figure 9 As shown, the groove 111 is formed by laser ablation, so that the groove 111 is hemispherical.

[0053] Please see Figure 10At least one LED chip 130 is disposed within the groove 111. The LED chip 130 includes a light-emitting surface 131 and multiple side-emitting surfaces 132. In this step, an appropriate amount of adhesive 120 is applied to a predetermined mounting area at the bottom of the groove 111 using a dispensing method. The LED chip 130 is then precisely placed in this predetermined mounting area, ensuring that the LED chip 130 is stably adhered to the groove 111, while ensuring that the light-emitting surface 131 faces upwards and is aligned with the surface direction of the keycap. If multiple LED chips 130 are used, they can also be arranged sequentially in corresponding positions within the groove 111 according to a layout plan to ensure uniform light distribution.

[0054] Next, please refer to Figure 11 Multiple bonding wires 133 are formed from the light-emitting surface 131. One end of each bonding wire 133 is electrically connected to the LED chip 130, and the other end is electrically connected to the bonding pad 112. In this embodiment, the bonding wires 133 are preferably made of gold wire or alloy fine wire, with a wire diameter between 15 micrometers and 35 micrometers, possessing good conductivity and flexibility. The bonding wires 133 can be connected by thermosonic bonding, ultrasonic bonding, or a thermosonic + friction composite method to ensure a strong solder joint and controllable arc height of the bonding wires 133. Preferably, the arc of the highest point of the bonding wire 133 will serve as the design basis for the subsequent encapsulation thickness to ensure that the bonding wires 133 can be completely encapsulated in the encapsulation material, achieving the purpose of electrical and mechanical protection.

[0055] Please see Figure 12 A first package 140 is formed, with its thickness not less than the arc height of the bonding wires 133, to cover the LED chip 130. Generally, the arc height of the bonding wires 133 is determined based on factors such as the size of the LED chip 130 and the material of the bonding wires 133. The purpose of this step is to provide structural protection, optical adjustment, and electrical insulation. Preferably, the first package 140 can be formed by applying transparent or translucent encapsulation material to the wire-bonded area in the groove 111 through dispensing, injection molding, or molding, allowing it to flow naturally and cover the LED chip 130 and the bonding wires 133. Specifically, the first package 140 can be optical silicone, epoxy resin, acrylic resin, or other thermosetting or thermoplastic polymer materials with good light transmittance and adhesion. Furthermore, it ensures that all bonding wires 133 are effectively covered, preventing exposure that could lead to mechanical damage or electrical short circuits. In the actual molding process, the amount of adhesive and the contour control path can be set through automatic dispensing equipment to achieve precise local filling and uniform coverage. In a variation example, such as Figure 13As shown, the surface of the first package 140 after molding can be slightly arched or flat, depending on the material flowability and curing method. In this step, the curing of the first package 140 can be carried out by thermosetting reaction or ultraviolet irradiation to form a stable and transparent solid structure, which completely covers the LED chip 130 and the bonding wire 133 and forms a tight seal with the sidewall of the groove 111, constituting the first layer of encapsulation structure.

[0056] Please see Figure 14 After the first encapsulation 140 is formed and cured, the second encapsulation 150 is formed. In this step, the second encapsulation 150 is formed, covering the upper surface of the first encapsulation 140 and further filling the remaining space in the groove 111. The main function of the second encapsulation 150 is to fill the gaps in the groove 111, enhance structural stability, and provide a flat support interface for the subsequent bonding of the light-shielding sheet. The second encapsulation 150 can be made of optical-grade transparent or translucent encapsulation material, such as silicone, polyurethane, acrylic resin, or epoxy resin. Its material formulation should have good flowability and curing mode control capabilities. During the injection process, by setting appropriate injection pressure and volume, the encapsulation material fills the entire space of the groove 111 along the edge of the first encapsulation 140, while simultaneously covering the top surface of the first encapsulation 140, forming a continuous, uniform, and bubble-free second-layer encapsulation structure. Preferably, the surface height of the second package 150 should be substantially flush with or slightly lower than the edge of the opening of the groove 111, so as to form a tight contact during subsequent pressing of the light-shielding sheet. In this embodiment, the second package 150 and the first package 140 have different material compositions. The second package 150 does not contain photoluminescent materials. Furthermore, the optical transparency of the second package 150 helps to ensure stable light transmission and confines the light-emitting profile within the range of the subsequent light-shielding sheet's through-hole. After curing, the second package 150 will be tightly bonded to the keycap body 110, enhancing the packaging stability and tensile strength of the entire key module, and providing a cross-sectional area for subsequent pressing of the light-shielding sheet, thus providing a good packaging foundation for achieving structural integration and automated mass production.

[0057] Please refer to the following: Figure 15After the second package 150 is formed, the first light-shielding sheet 160 is installed. In this step, the first light-shielding sheet 160 is pressed onto the upper surface of the second package 150, ensuring that its edges do not protrude beyond the groove 111. The first light-shielding sheet 160 is preferably a sheet structure, the size of which matches the opening area of ​​the groove 111. The material can be a low-transmittance polymer sheet, such as black PET, polyimide film, or a flexible light-shielding material with surface coating. It is mainly used to block light leakage from non-target areas and further define the luminous pattern and brightness distribution of the button. During the pressing process, the lower surface of the first light-shielding sheet 160 can be directly pressed into close contact with the upper surface of the second package 150 by the adhesiveness of the second package 150 itself. Alternatively, to ensure adhesion strength and optical consistency, hot pressing, UV (ultraviolet curing) adhesive dots, or other processes can be used for fixing. Preferably, the upper surface of the first light-shielding sheet 160 should be flush with or slightly lower than the edge of the groove 111 of the keycap body 110 to ensure that the key surface structure does not bulge due to the light-shielding sheet, thereby maintaining the flatness of the keycap surface, the consistency of touch, and the assembly compatibility.

[0058] Please see Figure 16After the first light-shielding sheet 160 is pressed together, the installation of the second light-shielding sheet 170 continues. In this step, the second light-shielding sheet 170, which has multiple hollowed-out through holes 171, is pressed onto the surface of the first light-shielding sheet 160, ensuring that its overall size is not smaller than that of the first light-shielding sheet 160 to achieve complete coverage and alignment protection. The second light-shielding sheet 170 can be a sheet structure, and its material can be a low-transmittance or opaque black film, polyimide coated with a matte layer, or other composite materials with light-shielding function. The hollowed-out through holes 171 are pre-formed and can be circular, rectangular, grid-shaped, or patterned, corresponding to the light-emitting area of ​​the LED chip 130 below, to achieve accurate display of luminous characters, patterns, or light-guiding contours. Preferably, the second light-shielding sheet 170 can be fixed to the first light-shielding sheet 160 by hot pressing, UV adhesive dots, or a local positioning structure. Its bonding surface should be as flat as possible to avoid air bubbles or displacement. Since the area of ​​the second light-shielding sheet 170 is greater than or equal to that of the first light-shielding sheet 160, full-coverage shielding can be achieved, enhancing the structural hierarchy and optical constraint capabilities. Furthermore, the light transmittance of the area where the hollowed-out through-hole 171 is formed on the second light-shielding sheet 170 can be controlled between 0% and 1%, while the overall light transmittance of the area without the hollowed-out through-hole 171 is controlled between 1% and 5%, thus creating a significant separation between the high-contrast light-emitting area and the light-shielding area, which helps improve the clarity of the illuminated characters on the key. In a preferred embodiment, the second light-shielding sheet 170 can also be provided with multiple positioning pins 172, corresponding to multiple mating holes 114 on the keycap body 110, and fixed in a predetermined position by snap-fit ​​or interference fit, further improving assembly accuracy and durability. After this step, the optical definition and surface light-shielding structure of the key illuminated area are completed, ensuring the stability of the modular structure in terms of appearance consistency, light effect distribution, and mass production assembly. At this point, the keycap body 110, which encapsulates the LED chip 130 and has an illuminated function, is essentially complete. Finally, the encapsulated keycap body 110 is assembled onto the corresponding keyboard base 180 according to user requirements, thus completing the key structure 100 of the keyboard of this invention. Using the above method, the light-emitting components can be entirely encapsulated within the keycap, offering advantages such as modularity, one-piece molding, anti-interference, and high light uniformity. It is suitable for gaming keyboards, mechanical keyboards, or typing devices requiring high-brightness backlighting, and also facilitates subsequent module integration or mass production applications.

[0059] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A key structure for a keyboard, characterized in that, include: The keycap body has grooves and multiple solder pads embedded inside; At least one LED chip is disposed in the groove. The LED chip includes a light-emitting surface and multiple side light-emitting surfaces. Multiple bonding wires extend from the light-emitting surface and are electrically connected to the bonding pad. The light-emitting surface faces upward and the side light-emitting surfaces radiate outward. The LED chip adopts a front-mounted structure and its back is bonded to the bottom of the groove or an area where the bonding pad is not provided. A first package covers the LED chip, and the thickness of the first package is not less than the arc height of the bonding wire; The second package covers the first package and fills the groove; The first light-shielding sheet is pressed against the second package and does not protrude beyond the groove; as well as A second light-shielding sheet with multiple perforated holes is pressed onto the surface of the first light-shielding sheet, and its size is not smaller than that of the first light-shielding sheet.

2. The key structure of the keyboard as described in claim 1, characterized in that, The light transmittance of the second light-shielding sheet is between 1% and 5%, and is not greater than that of the first light-shielding sheet.

3. The key structure of the keyboard as described in claim 2, characterized in that, The perforated holes are in the form of a grid, and the light transmittance of the grid is between 0% and 1%.

4. The key structure of the keyboard as described in claim 1, characterized in that, The first package contains a photoluminescent material.

5. The key structure of the keyboard as described in claim 4, characterized in that, The first encapsulation and the second encapsulation contain thermoplastic resin or thermosetting resin, and the second encapsulation does not contain photoluminescent material.

6. The key structure of the keyboard as described in claim 1, characterized in that, There is a gap between the side of the first light-shielding sheet and the side wall of the groove.

7. The key structure of the keyboard as described in claim 1, characterized in that, The first package only fills a local area within the groove.

8. The key structure of the keyboard as described in claim 1, characterized in that, The second light-shielding plate has multiple positioning pins, each positioning pin corresponding to the connecting hole of the keycap body, and each positioning pin is connected to the corresponding connecting hole by a snap-fit ​​or interference fit.

9. A method for manufacturing a button structure, characterized in that, Includes the following steps: Provides a keycap body with grooves and multiple solder pads embedded inside; At least one LED chip is disposed in the groove, the LED chip including a light-emitting surface and multiple side light-emitting surfaces; Multiple bonding lines are formed from the light-emitting surface to electrically connect the bonding lines to the bonding pad, wherein the light-emitting surface faces upward and the side light-emitting surface radiates in all directions, and the LED chip adopts a front-mounted structure, with its back side bonded to the bottom of the groove or an area where the bonding pad is not provided. A first package is formed, wherein the thickness of the first package is not less than the arc height of the bonding wire, so as to cover the LED chip; A second package is formed, which covers the first package and fills the groove; Press the first light-shielding sheet onto the second package body, ensuring that the first light-shielding sheet does not protrude beyond the groove; as well as A second light-shielding sheet with multiple hollowed-out through holes is pressed onto the surface of the first light-shielding sheet, and its size is not smaller than that of the first light-shielding sheet; To form the key structure of the keyboard as described in claim 1.

10. The method for manufacturing the button structure as described in claim 9, characterized in that, The first package only fills a local area within the groove.

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